Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P50/00—Etching of wafers, substrates or parts of devices
  • H10P50/60—Wet etching
  • H10P50/66—Wet etching of conductive or resistive materials
  • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
  • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/10—Etching compositions
  • C23F1/14—Aqueous compositions
  • C23F1/32—Alkaline compositions
  • C23F1/38—Alkaline compositions for etching refractory metals
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/10—Etching compositions
  • C23F1/14—Aqueous compositions
  • C23F1/32—Alkaline compositions
  • C23F1/40—Alkaline compositions for etching other metallic material
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
  • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
  • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
  • C23F11/14—Nitrogen-containing compounds
  • C23F11/141—Amines; Quaternary ammonium compounds
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P70/00—Cleaning of wafers, substrates or parts of devices
  • H10P70/20—Cleaning during device manufacture
  • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P70/00—Cleaning of wafers, substrates or parts of devices
  • H10P70/20—Cleaning during device manufacture
  • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
  • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
  • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
  • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Definitions

• the present invention relates to a method for processing a semiconductor containing a transition metal, a method for manufacturing a semiconductor device including a step of etching a transition metal, and a processing liquid for a semiconductor for etching a transition metal.
• Transition metals are widely used in electronic devices such as semiconductor devices, and are used, for example, in contact materials that connect transistor electrodes and metal wiring, and 3D-NAND gate materials.
• the wiring is formed by dry or wet etching or CMP polishing as in the conventional wiring material. Since the time required for these processes directly affects the semiconductor manufacturing cost, a technique capable of shortening the processing time is required.
• the flatness of each transition metal layer is indispensable, and the flatness of the transition metal surface after etching is also desired.
• dry etching for processing a metal film using gas or wet etching for processing a metal film with a chemical solution is used as a method for performing such high-precision etching.
• Patent Document 1 describes a method of etching a transition metal film containing a transition metal element such as Co or Ru using a complexing gas as a method of etching with high accuracy while suppressing and reducing the surface roughness of the transition metal film. Proposed.
• the etching method described in Patent Document 1 is divided into an oxidation step and an etching step using a complexing gas, and the etching amount is controlled by repeating this cycle with the oxidation step and the etching step as one cycle. ..
• the transition metal film is a polycrystal composed of a large number of minute single crystals, and the orientation of the crystal plane exposed on the surface of the transition metal film varies. According to the studies by the present inventors, it has been clarified that when the transition metal film is etched, it exhibits anisotropic etching in which the etching rate differs depending on the crystal plane of the transition metal. Then, it was found that unevenness was generated due to the difference in etching rate for each crystal plane, and this was the cause of deteriorating the flatness of the transition metal surface after etching.
• an object of the present invention is to prevent surface roughness caused by anisotropic etching in which the etching rates of the transition metal for each crystal plane are different when the transition metal film having crystal planes of various directions exposed on the surface is etched. It is an object of the present invention to provide a method for treating a semiconductor having a transition metal so that the surface is flat, and a method for producing a semiconductor having a transition metal having a flat surface.
• the present inventors have conducted diligent studies to solve the above problems. Then, by etching the transition metal with an etching amount ratio of one crystal plane other than the crystal plane of 0.1 or more and 10 or less with respect to any one crystal plane of the transition metal, the transition metal surface after the etching treatment is performed. It was found that it is possible to maintain the flatness of the. Further, after the etching treatment, the transition metal is etched with a treatment liquid containing an amphoteric surfactant or an amine and the amphoteric surfactant is betaine, imidazoline, glycine, or an amine oxide. We have found that it is possible to maintain the flatness of the transition metal surface, and have completed the present invention.
• the configuration of the present invention is as follows.
• Item 1 Treatment of a semiconductor containing a transition metal, which comprises a step of etching the transition metal with an etching amount ratio of one crystal plane other than the crystal plane to one crystal plane of the transition metal of 0.1 or more and 10 or less.
• Method. Item 2. The treatment method according to Item 1, further comprising a step of performing the etching and a step of washing with a solution containing a solvent, a surfactant, or a ligand coordinating with a transition metal.
• Item 3. The method for processing a semiconductor according to Item 1 or 2, wherein the transition metal is ruthenium.
• the step of performing the etching is ruthenium (002), ruthenium (100), ruthenium (101), ruthenium (110), ruthenium (102), ruthenium (103), ruthenium (200), ruthenium (112), or This is a step of etching ruthenium with an etching amount ratio of one crystal plane other than the above-selected crystal plane to any one crystal plane selected from ruthenium (201) of 0.1 or more and 10 or less.
• Item 3. The processing method according to Item 3.
• Item 5 Treatment of ruthenium semiconductors, including a step of etching ruthenium with an etching amount ratio of ruthenium (002) to any one crystal plane of ruthenium excluding ruthenium (002) of 0.1 or more and 10 or less.
• Method. Any one of Items 3 to 5, wherein in the step of performing the etching, the etching rate of any one of the crystal planes of ruthenium excluding ruthenium (002) is 1 nm / min or more and 100 nm / min or less.
• any one of the crystal faces of ruthenium excluding the ruthenium (002) is ruthenium (101) or ruthenium (100).
• Item 8 The processing method according to any one of Items 1 to 7, wherein the step of performing the etching is performed by wet etching using an etching solution.
• Item 9. The treatment method according to Item 8, wherein the etching solution contains onium ions.
• Item 10. The treatment method according to Item 9, wherein the onium ion is an ammonium ion.
• Item 11 The treatment method according to any one of Items 8 to 10, wherein the etching solution contains an oxidizing agent.
• the treatment method according to Item 11 wherein the concentration of the oxidizing agent in the etching solution is 0.001 mol / L or more and 1 mol / L or less.
• the oxidizing agent is halogen oxygen acid, halogen oxygen acid ion, halogen acid salt, permanganate, permanganate ion, permanganate, cerium (IV) salt, ferricyan salt, hydrogen peroxide, or ozone.
• Item 14 The treatment method according to Item 13, wherein the halogen oxygen acid ion is hypobromous acid ion, and the pH of the etching solution at 25 ° C. is 8 or more and 12 or less.
• the etching solution contains at least one hypohalogenate ion and Contains at least one anion species selected from halogenate, subhalogenate, and halide ions.
• Item 6. The treatment method according to any one of Items 8 to 14, wherein the content of at least one anion species of the anion species is 0.30 to 6.00 mol / L.
• Item 16. The processing method according to Item 1, which comprises a step of removing the transition metal oxide generated by the step of performing the etching.
• Item 17 The treatment method according to Item 16, wherein the step of removing the transition metal oxide is a step of washing with a solution containing a solvent, a surfactant, or a ligand coordinating with the metal.
• Item 16 or 17, wherein the metal is ruthenium.
• Item 19 A method for treating a semiconductor containing a transition metal, comprising a step of etching a transition metal and a step of measuring the etching amount ratio of one crystal plane other than the crystal plane to one crystal plane of the transition metal.
• Item 20 The processing method according to Item 19, wherein the step of measuring the etching amount ratio of one crystal plane other than the crystal plane to one crystal plane of the transition metal is a step using X-ray diffraction measurement.
• Item 21 A method for producing a semiconductor containing a transition metal, which comprises the processing method according to any one of Items 1 to 20.
• Item 22 A treatment liquid for a semiconductor containing an amphoteric surfactant or an amine, wherein the amphoteric surfactant is betaine, imidazoline, glycine, or an amine oxide.
• Item 23 The treatment liquid according to Item 22, wherein the treatment liquid contains an oxidizing agent.
• the oxidizing agent is halogen oxygen acid, halogen oxygen acid ion, halogen acid salt, permanganate, permanganate ion, permanganate, cerium (IV) salt, ferricyan salt, hydrogen peroxide, or ozone.
• Item 23. The treatment liquid according to Item 23.
• Item 25 The treatment liquid according to Item 23 or 24, wherein the treatment liquid etches ruthenium, tungsten, molybdenum, cobalt, or chromium.
• the etching amount ratio of one crystal plane other than the crystal plane to any one crystal plane of the transition metal is 0.1 or more and 10 or less.
• the transition metal film contained in the semiconductor wafer can be isotropically etched.
• a transition generated when etching is performed by treating a semiconductor treatment liquid containing an amphoteric surfactant or an amine with a treatment liquid in which the amphoteric surfactant is betaine, imidazoline, glycine, or an amine oxide.
• the metal oxide can be removed and the transition metal film contained in the semiconductor wafer can be isotropically etched.
• the semiconductor containing a transition metal is a semiconductor containing a transition metal used for a wiring layer, a barrier layer, a liner layer, a cap layer, a plug layer, etc., which are formed on a semiconductor wafer.
• transition metals in the present invention are ruthenium, cobalt, copper, molybdenum, chromium, tungsten, aluminum, nickel, manganese and the like.
• the processing method of the present invention is particularly effective for the ruthenium, tungsten, molybdenum, cobalt, and chromium etching processing steps used in the fine wiring process that requires flatness after etching, and is most effective for the ruthenium etching processing process. Is.
• the transition metal contained in the semiconductor wafer may be formed by any method.
• the film formation of the transition metal widely known methods in the semiconductor manufacturing process, for example, CVD, ALD, PVD, sputtering, plating and the like can be used.
• transition metals may be oxides, nitrides, silicides, carbides, intermetallic compounds, ionic compounds, and complexes. Further, the transition metal may be exposed on the surface of the wafer, or may be partially covered with another metal, a metal oxide film, an insulating film, a resist, or the like. In the present invention, these transition metals are polycrystals containing at least two or more crystal planes.
• the transition metal is ruthenium.
• a semiconductor containing ruthenium is referred to as a ruthenium semiconductor.
• ruthenium is a polycrystal containing at least two or more crystal planes.
• the ruthenium contained in the semiconductor wafer may be formed by any method.
• methods widely known in the semiconductor manufacturing process for example, CVD, ALD, PVD, sputtering, plating and the like can be used.
• the ruthenium is ruthenium (002), ruthenium (100), ruthenium (101), ruthenium (110), ruthenium (102), ruthenium (103), ruthenium (200), ruthenium (112), or ruthenium (201).
• ruthenium metal containing a part of ruthenium, oxides, nitrides (RuN) and the like are contained. May be good.
• the notation such as ruthenium (002) means the ruthenium 002 surface.
• a ruthenium alloy containing ruthenium and a metal other than ruthenium having a concentration higher than the concentration inevitably contained may be contained.
• the ruthenium alloy may contain any metal other than ruthenium, but examples of the metals contained in the ruthenium alloy include tantalum, silicon, copper, hafnium, zirconium, aluminum, vanadium, cobalt, nickel, etc. Examples thereof include manganese, gold, ruthenium, palladium, titanium, tungsten, molybdenum, platinum, and iridium, and these oxides, nitrides, carbides, and silicides may be contained.
• rutheniums may be intermetallic compounds, ionic compounds, or complexes. Further, ruthenium may be exposed on the surface of the wafer, or may be partially covered with another metal, a metal oxide film, an insulating film, a resist, or the like.
• the etching amount ratio represents the ratio of the rate of change of the crystal plane different from the above crystal plane to the rate of change of one crystal plane of the transition metal due to the etching treatment.
• the rate of change is a value obtained by dividing the amount of crystal planes etched by the etching treatment by the amount of the crystal planes before the etching treatment to obtain a percentage. That is, it is a value obtained by dividing the rate of change of one crystal plane by the rate of change of the other crystal plane when two arbitrary crystal planes of the transition metal are selected.
• the etching amount ratio when the etching amount ratio is 1, it means that the rate of change of the two selected crystal planes is the same, and the abundance ratio of the two crystal planes is the same even after the etching treatment (there is no change). ) Means that.
• the etching amount ratio is not 1, it means that the rate of change of one of the two crystal planes is larger than that of the other.
• a plurality of etching amount ratios can be defined, but at least one etching amount ratio may be 0.1 or more and 10 or less.
• the method for obtaining the etching amount ratio is not particularly limited, and for example, a method for calculating the rate of change in the diffraction peak areas of the two crystal planes from the X-ray diffraction (XRD) measurement of the transition metal and calculating the etching amount ratio can be exemplified. ..
• the transition metal is etched with the etching amount ratio of one crystal plane other than the crystal plane to 0.1 or more and 10 or less with respect to any one crystal plane.
• the difference in etching rate between the crystal plane and the crystal plane other than the crystal plane becomes small, and as a result, the unevenness of the transition metal surface caused by the difference in etching rate becomes small. Therefore, the etching amount ratio of one crystal plane other than the crystal plane to any one crystal plane is 1 in the best state, indicating that the flatness is maintained even after the etching treatment.
• the degree of flatness allowed depends on the process in which the transition metal is used, but especially in the process in which the flatness of the transition metal surface after etching is required, the above-mentioned is applied to any one crystal plane.
• the etching amount ratio of one crystal plane other than the crystal plane is preferably 0.1 or more and 10 or less, more preferably 0.2 or more and 5 or less, and 0.3 or more and 3 or less. Is more preferable, etching is more preferably 0.5 or more and 2 or less, and most preferably 0.8 or more and 1.2 or less.
• the transition metal is ruthenium, which is ruthenium (002), ruthenium (100), ruthenium (101), ruthenium (110), ruthenium (102), ruthenium (103), ruthenium (200), ruthenium (112), or ruthenium (112).
• the case where the crystal plane of 201) is included will be illustrated below. In this case, select from ruthenium (002), ruthenium (100), ruthenium (101), ruthenium (110), ruthenium (102), ruthenium (103), ruthenium (200), ruthenium (112), or ruthenium (201).
• Ruthenium (002) ruthenium (100), ruthenium (101), ruthenium by approaching 1 in the etching amount ratio of one crystal plane other than the crystal plane selected above with respect to any one of the crystal planes. Any one crystal plane selected from (110), ruthenium (102), ruthenium (103), ruthenium (200), ruthenium (112), or ruthenium (201) and one other than the crystal plane selected above.
• the difference in etching rate between the two crystal planes becomes small, and as a result, the unevenness of the ruthenium surface caused by the difference in etching rate becomes small, and the flatness becomes high.
• ruthenium (002) selects from ruthenium (002), ruthenium (100), ruthenium (101), ruthenium (110), ruthenium (102), ruthenium (103), ruthenium (200), ruthenium (112), or ruthenium (201).
• the etching amount ratio of one crystal plane other than the crystal plane selected above to any one of the crystal planes is 1 is the best state.
• the degree of flatness allowed depends on the process in which ruthenium is used, but especially in processes where the flatness of the ruthenium surface after etching is required, ruthenium (002), ruthenium (100), ruthenium.
• the etching amount ratio of one crystal plane other than the plane is preferably 0.1 or more and 10 or less, more preferably 0.2 or more and 5 or less, and 0.3 or more and 3 or less. It is more preferably 0.5 or more and 2 or less, and more preferably 0.8 or more and 1.2 or less.
• flatness means surface roughness
• high flatness or less surface roughness means less surface unevenness. Maintaining flatness means that the flatness does not change before and after the chemical treatment. Flatness can be evaluated, for example, by observation with an electron microscope or measurement using an atomic force microscope or the like.
• the transition metal is ruthenium, ruthenium (002), ruthenium (100), ruthenium (101), ruthenium (110), ruthenium (102), ruthenium (103), ruthenium (200) used in calculating the etching amount ratio.
• Ruthenium (112) or ruthenium (201) is not particularly limited, but the crystal plane having the highest X-ray diffraction intensity is preferable.
• ruthenium (002), ruthenium (100), and ruthenium (101) are preferable, and ruthenium (002) is more preferable because the relative intensity of X-ray diffraction is high and crystal growth is easy.
• the one crystal plane other than the crystal plane selected above is not particularly limited, but a crystal plane having the second highest X-ray diffraction intensity is preferable.
• the transition metal is molybdenum and contains a crystal plane of molybdenum (110), molybdenum (211), molybdenum (200), or molybdenum (220)
• etching of one crystal plane other than the crystal plane selected above with respect to any one crystal plane selected from molybdenum (110), molybdenum (211), molybdenum (200), or molybdenum (220).
• the quantity ratio approaches 1
• the difference in etching rate between the two crystal planes becomes small, and as a result, the unevenness of the molybdenum surface caused by the difference in etching rate becomes small, and the flatness becomes high. Therefore, the amount of etching of one crystal plane other than the above-selected crystal plane with respect to any one crystal plane selected from molybdenum (110), molybdenum (211), molybdenum (200), or molybdenum (220). A ratio of 1 is the best condition.
• the degree of flatness allowed depends on the process in which molybdenum is used, but especially in processes where the flatness of the molybdenum surface after etching is required, molybdenum (110), molybdenum (211), molybdenum It is preferable to etch the etching amount ratio of one crystal plane other than the above-selected crystal plane to any one crystal plane selected from (200) or molybdenum (220) at 0.1 or more and 10 or less. , 0.2 or more and 5 or less, more preferably 0.3 or more and 3 or less, further preferably 0.5 or more and 2 or less, and 0.8 or more and 1.2. It is most preferable to etch below.
• the crystal plane of any one selected from molybdenum (110), molybdenum (211), molybdenum (200), or molybdenum (220) used in calculating the etching amount ratio is Although not particularly limited, it is preferably a crystal plane having the highest X-ray diffraction intensity. Of the crystal planes, molybdenum (110) and molybdenum (211) are preferable, and molybdenum (110) is more preferable because the relative intensity of X-ray diffraction is high and crystal growth is easy.
• the one crystal plane other than the crystal plane selected above is not particularly limited, but a crystal plane having the second highest X-ray diffraction intensity is preferable.
• the etching rate of transition metals is large, such as film forming method, film thickness, crystallinity (crystal system, lattice constant, etc.), crystal particle size, lattice defects, impurity content, oxidation state, and presence / absence of surface oxide film. Affected by the factors of. It also depends on the plane orientation of the crystal plane in contact with the etching solution. The crystal plane dependence of transition metal etching differs depending on the transition metal, but when a plurality of crystal planes come into contact with the etching solution, the etching rate often differs depending on the crystal plane. In such a case, the difference in etching rate depending on the crystal plane appears as unevenness on the surface of the transition metal.
• the etching process scrapes more crystal planes having a high etching rate, while the amount of etching on the crystal planes having a low etching rate is small.
• the flatness of the transition metal film surface after the etching process is not maintained, and the surface unevenness increases. Therefore, in order to maintain the flatness of the transition metal surface after the etching treatment, it is preferable to make the rate of change between the crystal planes uniform.
• the dependence of the etching plane orientation differs depending on the transition metal to be etched, but in order to make the rate of change between the crystal planes uniform, the etching conditions such as the etching solution composition and pH should be the same so that the etching rates between the crystal planes are the same. Should be controlled.
• the concentration of the oxidant is increased, the etching rate becomes high, but the etching of the crystal plane that is easily etched is promoted, so that the surface roughness depending on the difference in the etching rate becomes large.
• increasing the pH slows down the etching rate. That is, the etching rate of the crystal plane that is easily etched is suppressed, and the surface roughness depending on the difference in etching rate is suppressed. In this way, it is possible to suppress surface roughness by controlling the oxidant concentration and pH within an appropriate range using the etching rate ratio of each crystal plane as an index.
• the etching rate of the crystal plane that is easily etched can be suppressed, and the additive is appropriately added using the etching rate ratio of each crystal plane as an index. By adding it, it is possible to control the etching rate of each crystal plane and suppress surface roughness.
• the speed at which the transition metal is etched may be appropriately determined in consideration of the type of transition metal, the etching amount, the etching time, etc., and the etching speed of any one of the crystal planes of the transition metal is the other.
• the etching rate of the crystal plane may be 0.1 times or more and 10.0 times or less. Such an etching rate is preferably 0.1 nm / min or more and 1000 nm / min or less, and more preferably 1 nm / min or more and 100 nm / min or less.
• the etching rate of the crystal plane of ruthenium excluding ruthenium (002) is slower than the etching rate of ruthenium (002), and it is difficult to etch. Therefore, in the ruthenium film containing ruthenium (002) and the crystal plane of ruthenium excluding ruthenium (002), there is a difference in the etching amount depending on the crystal plane of ruthenium. As a result, the etching amount ratio deviates from the above-mentioned suitable range, so that the flatness tends to be low.
• the difference from the etching rate of ruthenium (002) can be reduced, and the etching amount ratio depending on the crystal face of ruthenium can be brought closer to 1.
• This is one of the preferred embodiments of the present invention. For example, by setting the etching rate of any one of the crystal faces of ruthenium excluding ruthenium (002) to 1 nm / min or more and 100 nm / min or less, the difference in etching rate from ruthenium (002) becomes small, and as a result, It is possible to suppress a decrease in flatness.
• the etching rate of any one of the crystal faces of ruthenium excluding ruthenium (002) should be 1 nm / min or more and 100 nm / min or less. It is preferably 3 nm / min or more and 50 nm / min or less, more preferably 4 nm / min or more and 20 nm / min or less, and most preferably 5 nm / min or more and 10 nm / min or less.
• the etching rate of ruthenium is increased by at least one of increasing the oxidant concentration, lowering the pH, and increasing the treatment temperature.
• the etching rate of ruthenium is slowed down by at least one of lowering the oxidant concentration, raising the pH, lowering the treatment temperature, and adding an additive that adsorbs to ruthenium and inhibits etching.
• the oxidant concentration, pH, temperature and additive concentration By appropriately controlling at least one of the oxidant concentration, pH, temperature and additive concentration, it is possible to prepare an etching solution having a desired etching rate.
• the present invention may include cleaning the wafer before and / or after the etching process. If the transition metal oxide dissolved in the etching solution by the etching process continues to exist near the transition metal surface, the transition metal oxide adheres to the transition metal surface or reacts with the transition metal surface to another transition metal. It may become an oxide and precipitate. Further, when the solid transition metal oxide generated by etching stays on the surface of the wafer or in the vicinity of the surface, it may adhere as particles on the transition metal. Adhesion or precipitation of the transition metal oxide on the transition metal surface is not preferable because it causes the flatness of the transition metal surface to be impaired.
• the time that the transition metal oxide generated by the etching exists in the etching solution near the transition metal surface can be shortened, so that the transition metal surface can be used. It is easy to prevent the adhesion and precipitation of the transition metal oxide and maintain the flatness of the transition metal surface.
• the transition metal oxide generated in the etching solution may precipitate on the transition metal surface during etching.
• cleaning is performed after etching under the condition that the transition metal oxide does not precipitate on the transition metal surface or the amount of the transition metal oxide deposited on the transition metal surface is within the allowable range. It is preferable to perform the etching again. By including the cleaning step, even a transition metal oxide having poor diffusivity can be easily kept away from the transition metal surface, and precipitation of the transition metal oxide can be prevented.
• the step of cleaning before performing the etching process the wettability of the transition metal to be etched can be controlled, and the etching solution can be more evenly distributed on the surface of the transition metal. By uniformly spreading the etching solution on the transition metal surface, the position dependence (location unevenness) of etching is eliminated, and the flatness of the surface can be easily maintained. Further, when a solution containing a ligand, a surfactant, or a ligand coordinating with the transition metal is used as the cleaning liquid described later, these solvent molecules, the surfactant, or the ligand are combined with the transition metal. It is possible to create a state existing on the transition metal surface by coordination bonds and electrostatic interactions.
• the conditions for cleaning the wafer are not particularly limited, and widely known cleaning methods and conditions used for semiconductor production can be used, and the type, chemical state or structure of the transition metal to be etched, and the transition metal oxide can be used. It may be appropriately determined in consideration of the concentration or diffusivity in the etching solution, the amount of etching, the ease of precipitation, and the like. That is, the cleaning method, time, temperature, and the like may be appropriately selected. Further, it may be single-wafer cleaning, immersed in a cleaning liquid, ultrasonic waves or jet flow may be applied, scrub cleaning may be performed, or manual cleaning or automatic cleaning may be performed. You may.
• the order of the etching and cleaning steps is not particularly limited, and each can be independently performed any number of times.
• the number of times may be appropriately determined in consideration of the type of transition metal to be etched, the chemical state or structure, the concentration or diffusivity of the transition metal oxide in the etching solution, the amount of etching, the ease of precipitation, and the like. That is, the step of cleaning the wafer may be once or may be performed twice or more.
• the cleaning liquids used for cleaning may be the same or different.
• the cleaning liquid used in the cleaning step may be any solvent or solution that interacts with the transition metal surface to be etched, or any solvent or solution that can eliminate the transition metal oxide from the transition metal or the vicinity of the wafer surface. There may be.
• the solvent or solution that interacts with the transition metal surface to be etched is, for example, a solvent having the ability to interact with the transition metal surface to form a layer of solvent molecules on the transition metal surface, or adsorbed or adsorbed on the transition metal surface.
• a solution containing a metal or ion such as a coordinating surfactant or ligand.
• the solvent or solution capable of eliminating the transition metal oxide on the transition metal or near the surface of the wafer is, for example, a solvent or solution capable of dissolving the transition metal oxide, preventing reattachment, or washing away. Is.
• the transition metal oxide is rapidly dissolved and diluted to reduce the concentration of the transition metal oxide in the vicinity of the transition metal surface or the wafer surface. be able to. This makes it difficult for oxides to precipitate or adhere to the surface of the transition metal, so that the flatness of the transition metal film is maintained.
• a solvent or solution that can prevent the reattachment of a transition metal oxide is a solvent that has the ability to interact with the surface of the transition metal oxide to form a layer of solvent molecules on the surface of the transition metal oxide, or oxidation of the transition metal.
• a solution containing a molecule or ion such as a surfactant or ligand that adsorbs or coordinates on the surface of an object.
• the transition metal oxide generated during the transition metal etching can be kept away from the vicinity of the transition metal surface or the vicinity of the wafer surface by the flow of the liquid. This makes it difficult for oxides to precipitate or adhere to the surface of the transition metal, so that the flatness of the transition metal film is maintained.
• the pH of the cleaning liquid is not particularly limited, and may be, for example, the same pH as the etching liquid or a different pH. Further, an acid or an alkali can be used to control the pH, and a pH buffering agent can be contained to suppress the pH fluctuation.
• the cleaning liquid contains an alkali, it does not contain metal ions, which is a problem in semiconductor production. Therefore, it is preferably an organic alkali, specifically an alkylammonium hydroxide, and more preferably a tetraalkylammonium hydroxide. preferable.
• the cleaning liquid contains an acid, acetic acid, hydrochloric acid, sulfuric acid, nitric acid, formic acid, phosphoric acid, carbonic acid, boric acid and the like can be used.
• the solvent used in the cleaning liquid is water or an organic solvent, and these can be used alone or in combination of two or more. Examples include, but are not limited to, water, alcohols, ethers, ketones, nitriles, amines, amides, carboxylic acids, aldehydes and the like.
• a solvent molecule from the viewpoint of having a high ability to interact with a transition metal or a transition metal oxide to form a layer of a solvent molecule on the surface of the transition metal or the transition metal oxide and inhibit the adsorption and precipitation of the transition metal oxide.
• solvents examples include methanol, ethanol, propanol, butanol, tetrahydrofuran, 1,4-dioxane, acetone, 4-methyl-2-pentanone, acetylacetone, acetonitrile, propyronitrile, butyronitrile, isobutyronitrile, Benzonitrile, ethylenediamine, pyridine, formamide, N-methylformamide, N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide, N-methylpropionamide, dimethylsulfoxide, sulfolane, dimethylthioformamide, N- Methylthiopyrrolidone, nitromethane, nitrobenzene, ethyl acetate, methyl acetate, formic acid, acetic acid, acetic acid, formic acid, lactic acid, glycolic acid, 2,2-bis (hydroxymethyl) propionic acid, gluconic acid,
• transition metals or solvents containing oxygen atoms, nitrogen atoms, sulfur atoms, or phosphorus atoms, or solvents containing double bonds or aromatic rings are more preferable.
• a solvent include, for example, piperidine, pyridine, pyridazine, pyrimidine, pyrazine, pyrrolidine, pyrroline, pyrroline, pyrazolidine, thiazole, oxazole, thiazole and the like, in addition to the above solvents. , Not limited to these solvents.
• the interaction between the solvent and the transition metal or transition metal oxide varies depending on the combination of the transition metal species / transition metal oxide species and the solvent, temperature, solute concentration, etc., but the transition metal etching conditions and the transition metal generated by the etching. It may be appropriately selected in consideration of the physical properties and solubility of the oxide.
• a solution containing a surfactant can also be used as the cleaning liquid.
• the surfactant plays a role of preventing the transition metal oxide from adhering or precipitating on the surface of the transition metal by adsorbing on the surface of the transition metal or the transition metal oxide. This makes it difficult for oxides to precipitate or adhere to the surface of the transition metal, so that the flatness of the transition metal film is maintained.
• Cleaning with a solution containing a surfactant may be performed before the etching treatment, after the etching treatment, or before and after the etching treatment.
• the wettability of the transition metal surface is improved, and more uniform transition metal etching becomes possible.
• the surface adsorption of the transition metal oxide during etching is inhibited by the effect of the surfactant adsorbed on the surface of the transition metal, and the surface flatness after etching is maintained.
• the surfactant is adsorbed on the transition metal oxide in the cleaning liquid existing on the surface of the transition metal or near the surface of the wafer.
• any surfactant may be used as long as it is a transition metal to be etched or a surfactant that adsorbs to the transition metal oxide generated by the etching treatment, and is an ionic surfactant. It may be a nonionic surfactant or it may be a nonionic surfactant.
• the surfactant is preferably an ionic surfactant from the viewpoint of excellent solubility in a solvent and easy concentration adjustment.
• ionic surfactants include anionic surfactants such as carboxylic acid type, sulfonic acid type, sulfuric acid ester type, and phosphoric acid ester type, or alkylamine type, quaternary ammonium salt type, and the like. It is a cationic surfactant or an amphoteric surfactant such as a carboxybetaine type, an imidazoline derivative type, a glycine type, and an amine oxide type.
• amphoteric surfactant is a carboxylic acid type such as an aliphatic monocarboxylate, a polyoxyethylene alkyl ether carboxylate, an N-acylsulfosin salt, an N-acylglutamate salt, and an alpha sulfo fatty acid ester salt.
• carboxylic acid type such as an aliphatic monocarboxylate, a polyoxyethylene alkyl ether carboxylate, an N-acylsulfosin salt, an N-acylglutamate salt, and an alpha sulfo fatty acid ester salt.
• Sulfate-type surfactants such as sulfonic acid-type surfactants, alkyl sulfates, polyoxyethylene alkyl ether sulfates, sulfuric acid ester-type surfactants such as oil and fat sulfates, alkyl phosphates, polyoxyethylene alkyl ether phosphates, polyoxy Phosphoric acid ester-type surfactants such as ethylene alkylphenyl ether phosphate, alkylamine salt-type surfactants such as monoalkylamine salts, dialkylamine salts, and trialkylamine salts, alkylalky
• Tertiary ammonium salt-type surfactants such as ammonium and alkyl benzalconium halides, carboxybetaine-type surfactants such as alkyl betaine and fatty acid amide alkyl betaine, 2-alkyl-N-carboxymethyl-N-hydroxyethyl imidazole Imidazoline derivative type surfactants such as linium betaine, glycine type surfactants such as alkyldiethylenetriaminoacetic acid and dialkyldiethylenetriaminoacetic acid, and amine oxide type surfactants such as alkylamine oxides.
• carboxybetaine-type surfactants such as alkyl betaine and fatty acid amide alkyl betaine
• 2-alkyl-N-carboxymethyl-N-hydroxyethyl imidazole Imidazoline derivative type surfactants such as linium betaine
• glycine type surfactants such as alkyldiethylenetriaminoacetic acid and dialkyld
• the surfactant contained in the cleaning liquid is used.
• Carboxybetaine-type surfactants such as alkylbetaine and fatty acid amide alkylbetaine, imidazoline derivative-type surfactants such as 2-alkyl-N-carboxymethyl-N-hydroxyethyl imidazolinium betaine, alkyldiethylenetriaminoacetic acid, dialkyldiethylenetriamino
• a glycine-type surfactant such as acetic acid and an amine oxide-type surfactant such as an alkylamine oxide are more preferable.
• the number of carbon atoms of the alkyl chain contained in these amphoteric surfactants is preferably 1 to 25, more preferably 3 to 20, and most preferably 5 to 18.
• the solvent used for the solution containing the surfactant the water and the organic solvent mentioned in the above (solvent) description can be preferably used.
• the concentration of the surfactant in the solution containing the surfactant can be determined in consideration of the ease of adsorption to the transition metal and / or the transition metal oxide, the cleaning conditions, etc., but one example is given. For example, it is preferably 0.1% by mass to 10% by mass, and more preferably 1% by mass to 5% by mass.
• the pH of the solution containing the surfactant is not particularly limited, and may be, for example, the same pH as the etching solution or a different pH.
• a solution containing a ligand can also be used as the cleaning solution.
• the ligand serves to prevent the transition metal oxide from adhering or precipitating on the surface of the transition metal by coordinating with the surface of the transition metal or the transition metal oxide. This makes it difficult for oxides to precipitate or adhere to the surface of the transition metal, so that the flatness of the transition metal film is maintained.
• Cleaning with a solution containing a ligand may be performed before the etching treatment, after the etching treatment, or before and after the etching treatment. By washing the wafer containing the transition metal with a solution containing the ligand before the etching treatment, a protective layer in which the ligand is coordinated is formed on the surface of the transition metal.
• this protective layer prevents the transition metal oxide from approaching the transition metal surface in the etching solution generated by the etching of the transition metal. As a result, the adhesion or precipitation of the transition metal oxide on the transition metal surface is suppressed, and the flatness of the transition metal film is maintained. Further, by cleaning the wafer containing the transition metal with a solution containing a ligand before the etching treatment, the ligand is coordinated with the transition metal oxide, and improvement in solubility in the cleaning liquid can be expected. The stable presence of the chemical species consisting of the transition metal oxide and the ligand in the cleaning liquid suppresses the adhesion or precipitation of the transition metal oxide on the transition metal surface, so that the stability of the transition metal surface is improved. Be maintained.
• any transition metal to be etched or a ligand that adsorbs to the transition metal oxide generated by the etching treatment may be used, but the transition metal or the transition metal oxidation may be used.
• a ligand containing a hetero atom that is, an oxygen atom, a nitrogen atom, a sulfur atom, or a phosphorus atom is preferable.
• Examples of such a ligand include, but are not limited to, a ligand having an amino group, a phosphino group, a carboxyl group, a carbonyl group, and a thiol group, and a heterocyclic compound containing nitrogen.
• examples of such ligands are preferably amines such as triethanolamine, nitrilotriacetic acid, ethylenediaminetetraacetic acid and glycine, thiols such as cysteine and methionine, tributylphosphine and tetramethylenebis.
• Phosphins such as (diphenylphosphine), acetic acid, formic acid, lactic acid, glycolic acid, 2,2-bis (hydroxymethyl) propionic acid, gluconic acid, ⁇ -glucoheptonic acid, heptic acid, phenylacetic acid, phenylglycolic acid
• Monocarboxylic acids such as benzylic acid, galvanic acid, caric acid, naphthoic acid, anis acid, salicylic acid, cresotic acid, acrylic acid, benzoic acid or their esters, malic acid, adipic acid, succinic acid, maleic acid, tartrate acid.
• Dicarboxylic acids such as oxalic acid, dimethyl oxalate, glutaric acid, malonic acid, 1,3-adamantandicarboxylic acid, diglycolic acid, phthalic acid or their esters, tricarboxylic acid represented by citric acid or its esters, Tetracarboxylic acid represented by butane-1,2,3,4-tetracarboxylic acid or its esters, hexacarboxylic acid represented by 1,2,3,4,5,6-cyclohexanehexacarboxylic acid or its thereof. Examples thereof include esters, carbonyl compounds such as ethyl acetoacetate and dimethylmalonic acid, and the like.
• acetic acid formic acid, lactic acid, glycolic acid, 2,2-bis (hydroxymethyl) propionic acid, gluconic acid, ⁇ -glucoheptonic acid, heptinic acid, phenylacetic acid, phenylglycolic acid, benzylic acid, galvanic acid.
• Monocarboxylic acids such as acids, caric acid, naphthoic acid, anis acid, salicylic acid, cresotinic acid, acrylic acid, benzoic acid or their esters, malic acid, adipic acid, succinic acid, maleic acid, tartrate acid, oxalic acid, shu Dicarboxylic acids such as dimethyl acid, glutarate, malonic acid, 1,3-adamantandicarboxylic acid, diglycolic acid or their esters, tricarboxylic acids such as citric acid or their esters, butane-1,2,3 Tetracarboxylic acid represented by 4-tetracarboxylic acid or its esters, hexacarboxylic acid represented by 1,2,3,4,5,6-cyclohexanehexacarboxylic acid or its esters, ethyl acetoacetate, dimethyl Carbonyl compounds such as malonic acid can be mentioned.
• acetic acid 2,2-bis (hydroxymethyl) propionic acid, succinic acid, oxalic acid, dimethyl oxalate, glutaric acid, malonic acid, 1,3-adamantandicarboxylic acid, diglycolic acid, citric acid, butane. -1,2,3,4-tetracarboxylic acid, 1,2,3,4,5,6-cyclohexanehexacarboxylic acid, dimethylmalonic acid, etc. can be mentioned.
• the nitrogen-containing heterocyclic compound refers to a compound having a heterocycle containing one or more nitrogen, preferably a piperidin compound, a pyridine compound, a piperazine compound, a pyridazine compound, a pyrimidine compound, a pyrazine compound, 1, 2 and 2.
• 4-triazine compound 1,3,5-triazine compound, oxazine compound, thiazine compound, cytosine compound, timine compound, uracil compound, pyrrolidine compound, pyrrolin compound, pyrrole compound, pyrazolidine compound, imidazolidine compound, imidazoline compound, pyrazole Compounds, imidazole compounds, triazole compounds, tetrazole compounds, oxazole compounds, thiazole compounds, oxadiazole compounds, thiazidol compounds, thiazolidinedione compounds, succinimide compounds, oxazolidone compounds, hydantin compounds, indolin compounds, indol compounds, indolidine compounds, indazole compounds.
• Imidazole compound Imidazole compound, azaindazole compound, indole compound, purine compound, benzoisoxazole compound, benzoisothiazole compound, benzoxazole compound, benzothiazole compound, adenine compound, guanine compound, carbazole compound, quinoline compound, quinolidine compound, quinoxalin compound, Phthalazine compound, quinazoline compound, cinnoline compound, naphthylidine compound, pyrimidine compound, pyrazine compound, pteridine compound, oxazine compound, quinolinone compound, aclydin compound, phenazine compound, phenoxazine compound, phenothiazine compound, phenoxatiin compound, quinuclidine compound, azaadamantan Compounds, azepine compounds, diazepine compounds, etc.
• heterocyclic compound containing nitrogen when an isomer is present, it can be used as a ligand used in the present invention without distinction.
• the heterocyclic compound containing nitrogen when an isomer is present, it can be used as a ligand used in the present invention without distinction.
• the heterocyclic compound containing nitrogen when an isomer is present, it can be used as a ligand used in the present invention without distinction.
• the heterocyclic compound containing nitrogen when the heterocyclic compound containing nitrogen is an indole compound, it may be 1H-indole, 2H-indole, 3H-indole, or a mixture thereof. There may be.
• heterocyclic compound containing nitrogen may be modified with an arbitrary functional group, or may have a structure in which a plurality of rings are condensed.
• the heterocyclic compound containing nitrogen may be used alone or in combination of two or more.
• a heterocyclic compound containing nitrogen and a ligand other than the heterocyclic compound containing nitrogen can be used in combination.
• the formation of a protective layer on the surface of the transition metal and the improvement of the solubility of the transition metal oxide are achieved.
• the transition metal oxide generated during etching can be effectively removed by the effect of the ligand contained in the cleaning liquid.
• An example of such a transition metal is ruthenium, and an example of a transition metal oxide is ruthenium dioxide (RuO 2 ).
• RuO 2 ruthenium dioxide
• the present invention is not limited thereto.
• lactic acid has a D-form and an L-form, but the ligand is not limited by such a difference in isomers.
• the solvent used for the solution containing the ligand the water and the organic solvent mentioned in the above description (solvent) can be preferably used.
• the concentration of the ligand in the solution containing the ligand can be determined in consideration of the ease of coordination to the metal and / or the metal oxide, the cleaning conditions, and the like. For example, it is preferably 0.1 mmol / L to 1 mol / L, and more preferably 1 mmol / L to 0.5 mol / L.
• the pH of the solution containing the surfactant is not particularly limited, and may be, for example, the same pH as the etching solution or a different pH.
• the cleaning liquid used in the present invention may contain other additives conventionally used in the processing liquid for semiconductor manufacturing, as long as it does not impair the object of the present invention.
• other additives include acids, metal anticorrosive agents, water-soluble organic solvents, fluorine compounds, oxidizing agents, reducing agents, complexing agents, chelating agents, surfactants, defoamers, pH regulators, stabilizers. Etc. can be added. These additives may be added alone or in combination of two or more.
• etching method used in the present invention known transition metal etching methods can be used as long as the object of the present invention is not impaired.
• dry etching using gas or wet etching using an etching solution may be used, but wet etching having high throughput and low equipment cost as compared with dry etching is preferable.
• each etching method will be described.
• Dry etching is a method of etching a material to be etched with a reactive gas, ion, radical or the like.
• a reactive gas ion, radical or the like.
• known dry etching can be used.
• a reactive gas a method of applying a high voltage to a mixed gas of chlorine gas, oxygen gas and argon gas to generate plasma, and etching the transition metal using chlorine / oxygen / argon plasma. Is.
• Wet etching is a method of etching by bringing an etching solution having a property of corroding and dissolving a material to be etched into contact with the material to be etched.
• a known etching solution of the transition metal can be used.
• wet etching can be performed using an etching solution containing an oxidizing agent and a solvent.
• the etching solution used for the wet etching is an etching solution characterized in that the transition metal can be etched while maintaining the flatness of the transition metal surface after etching. Therefore, it is suitably used in a process that requires etching of a transition metal in a semiconductor manufacturing process, particularly a process that requires flatness after etching.
• the transition metal can be wet-etched by the oxidizing agent contained in the etching solution oxidizing the transition metal and changing it into a chemical species soluble in the solvent.
• the transition metal is ruthenium
• the oxidizing agent contained in the etching solution oxidizes ruthenium to generate ruO 4 , RuO 4- or RuO 4-2 2- soluble in the solvent, and the ruthenium is etched.
• halogen oxygen acid for example, halogen oxygen acid, halogen oxygen acid ion, halogen acid salt, permanganate, permanganate ion, permanganate, cerium (IV) salt, ferricyan salt, hydrogen peroxide, or Ozone and the like can be mentioned, but the present invention is not limited to these.
• the halogen oxygen acid is hypochlorous acid, chloronic acid, chloric acid, periodic acid, hypobromic acid, bromine acid, bromine acid, periodic acid, hypoioic acid, periodic acid, iodine. Refers to acid, metaperiodic acid, orthoperiodic acid.
• Halogen oxygen acid ions include hypochlorite ion, chlorite ion, chlorate ion, perchlorate ion, hypobromine acid ion, bromine acid ion, bromine acid ion, perbromate ion, and periodic acid.
• ions sub-periodic acid ions, iodate ions, meta-periodic acid ions, and ortho-periodic acid ions.
• halogen oxygen acid, its ions, and hydrogen peroxide are suitable as the oxidizing agent because they can be stably used in a wide pH range and the concentration range can be widely selected.
• Subbromic acid, permanganic acid, periodic acid (ortho periodic acid and / or metaperiodic acid), or ions thereof, are more preferred, hypochloric acid, hypobromine acid, periodic acid (ortho).
• Perioic acid and / or metaperiodic acid), or ions thereof, are more preferred, with hypobromic acid, or hypobromine acid ion being most preferred.
• the counter ion (cation) in the halogen oxynate and permanganate is an alkali metal ion, an alkaline earth metal ion, and an organic cation.
• alkali metal ions and alkaline earth metal ions remain on the semiconductor wafer, they have an adverse effect on the semiconductor wafer (adverse effects such as a decrease in the yield of the semiconductor wafer). It is better not to be included infinitely. Therefore, organic cations are preferred as counterions.
• the organic cation is preferably at least one ammonium ion selected from any of tetramethylammonium ion, tetraethylammonium ion, tetrapropylammonium ion, and tetrabutylammonium ion in consideration of industrial production.
• tetramethylammonium ion is preferable. Therefore, by selecting tetramethylammonium ion as the counter ion, sodium ion and calcium ion in the etching solution can be reduced, so that it is preferable that the etching solution contains tetramethylammonium ion.
• the organic cation functions as an onium ion described later.
• the concentration of the etching solution containing the oxidizing agent may be determined in consideration of the type of oxidizing agent, the film thickness of the transition metal, the etching conditions (treatment temperature, treatment time, pH), etc., but is preferably 0.001 mol /. It is L or more and 2 mol / L or less, more preferably 0.01 mol / L or more and 1.5 mol / L or less, and further preferably 0.01 mol / L or more and 1 mol / L or less. Within this range, the transition metal can be suitably dissolved and washed.
• the solvent used for the etching solution is water or an organic solvent, and these can be used alone or in combination of two or more.
• the water is preferably water from which metal ions, organic impurities, particle particles, etc. have been removed by distillation, ion exchange treatment, filter treatment, various adsorption treatments, etc., and particularly pure water and ultrapure water.
• Such water can be obtained by a known method widely used in semiconductor manufacturing.
• Any organic solvent may be used as long as the function of the etching solution is not impaired.
• examples thereof include sulfolane, acetonitrile, carbon tetrachloride, 1,4-dioxane and the like, but of course, the organic solvent is not limited to these.
• an additive conventionally used in a semiconductor processing liquid may be added to the etching solution used in the present invention as long as the object of the present invention is not impaired.
• acids, alkalis, metal anticorrosive agents, fluorine compounds, oxidizing agents, reducing agents, chelating agents, anionic surfactants, cationic surfactants, nonionic surfactants, defoaming agents and the like are added as additives. be able to.
• the treatment temperature of the etching solution used in the present invention is preferably 10 ° C. or higher and 90 ° C. or lower, more preferably 40 ° C. or higher and 90 ° C. or lower, and further preferably 40 ° C. or higher and 80 ° C. or lower.
• the etching solution used in the present invention may further contain onium ions.
• onium ions By including onium ions, the difference in etching rate of one crystal plane other than the crystal plane with respect to any one crystal plane in the X-ray diffraction of the transition metal becomes small, and it is calculated from the X-ray diffraction of the metal.
• the etching amount ratio of one crystal plane other than the crystal plane to any one crystal plane can be brought close to 1.
• Onium ions are quaternary onium ions, tertiary onium ions, secondary onium ions, and hydrogen-substituted onium ions.
• the onium ion includes ammonium ion, phosphonium ion, fluoronium ion, chloronium ion, bromonium ion, iodinenium ion, oxonium ion, sulfonium ion, selenonium ion, telluronium ion, alsonim ion, stibonium ion, and so on.
• a cation such as a bismutonium ion, and an ammonium ion, a phosphonium ion, or a sulfonium ion is preferable. Further, as the onium ion, ammonium ion is more preferable.
• onium ions it may be added as an onium salt. Onium salts are formed from onium ions and anions.
• the anion is a negatively charged ion, and is not particularly limited, but is not limited to, but is limited to fluoride ion, chloride ion, bromide ion, iodide ion, hydroxide ion, nitrate ion, phosphate ion, sulfate ion, hydrogen sulfate ion, and the like.
• ammonium ion As the ammonium ion, a quaternary ammonium ion that is stable in a liquid and easily available industrially is preferable.
• the quaternary ammonium ion is represented by the following formula (1).
• R 1 , R 2 , R 3 , and R 4 are independently an alkyl group having 1 to 25 carbon atoms, an allyl group, an aralkyl group having an alkyl group having 1 to 25 carbon atoms, or an aryl. However, when R 1 , R 2 , R 3 , and R 4 are alkyl groups, at least one of R 1 , R 2 , R 3 , and R 4 has 2 or more carbon atoms.
• At least one hydrogen in the aryl group and the ring of the aryl group in the aralkyl group is fluorine, chlorine, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an alkoxy having 1 to 9 carbon atoms. It may be replaced with a group or an alkenyloxy group having 2 to 9 carbon atoms, in which at least one hydrogen may be replaced with fluorine or chlorine, which is a suitable quaternary ammonium ion.
• Specific examples include ethyltrimethylammonium ion, tetraethylammonium ion, tetrapropylammonium ion, tetrabutylammonium ion, tetrapentylammonium ion, tetrahexylammonium ion, triethylmethylammonium ion, tributylmethylammonium ion, and tri-n-octyl.
• the etching solution used in the present invention may further contain anionic species for the purpose of suppressing a decrease in flatness after etching.
• anion species include halogenate ions such as ClO 3- , BrO 3- , and IO 3- ; and subhalogen ions such as ClO 2- , BrO 2- , and IO 2- ; Cl- , Br. Examples thereof include halide ions such as ⁇ and I ⁇ .
• One of these anion species may be contained in the etching solution, or two or more kinds of anion species may be contained.
• the concentration of one of the anion species contained in the etching solution is preferably 0.30 mol / L to 6.00 mol / L, and more preferably 0.30 mol / L to 3.00 mol / L. , 0.30 mol / L to 1.00 mol / L, most preferably.
• concentration of one of the anion species contained in the etching solution is preferably 0.30 mol / L to 6.00 mol / L, and more preferably 0.30 mol / L to 3.00 mol / L. , 0.30 mol / L to 1.00 mol / L, most preferably.
• the pH of the etching solution used in the present invention at 25 ° C. is preferably 8 or more and 14 or less. Controlling the pH of the etching solution within this range causes the etching amount ratio of one crystal plane other than the crystal plane to any one crystal plane in X-ray diffraction of the transition metal to be 0.1 or more and 10 or less. It is preferable to make it in the range of.
• Acid or alkali can be added to the etching solution to adjust the pH of the etching solution.
• the acid may be either an inorganic acid or an organic acid, and examples thereof include hydrofluoric acid, hydrochloric acid, hydrobromic acid, nitric acid, acetic acid, sulfuric acid, peroxodisulfate, and formic acid.
• a widely known acid used in an etching solution for semiconductors can be used without any limitation.
• the alkali it is preferable to use an organic alkali because it does not contain metal ions that cause a decrease in yield in semiconductor manufacturing.
• tetraalkylammonium hydroxide which is easily industrially available and can stably coexist with the oxidizing agent contained in the etching solution, is preferable.
• examples of such tetraalkylammonium hydroxide include tetramethylammonium hydroxide, ethyltrimethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, choline and the like.
• the organic alkali is more preferably tetramethylammonium hydroxide or ethyltrimethylammonium hydroxide because the number of hydroxide ions per unit weight is large and a high-purity product is easily available.
• the pH of the etching solution containing hypochlorous acid at 25 ° C. is preferably 8 or more and 14 or less, and more preferably 9 or more and 13 or less. Controlling the pH of the etching solution within this range causes the etching amount ratio of one crystal plane other than the crystal plane to any one crystal plane in X-ray diffraction of the transition metal to be 0.1 or more and 10 or less. It is preferable to make it in the range of.
• the pH of the etching solution containing hypobromous acid at 25 ° C. is preferably 8 or more and 14 or less, more preferably 8 or more and 13.5 or less, further preferably 8 or more and 13 or less, and 9 It is particularly preferable that it is 12.5 or less. Controlling the pH of the etching solution within this range causes the etching amount ratio of one crystal plane other than the crystal plane to any one crystal plane in X-ray diffraction of the transition metal to be 0.1 or more and 10 or less. It is preferable to make it in the range of.
• Another aspect of the present invention is a method for manufacturing a semiconductor containing a transition metal, which comprises a method for treating the semiconductor containing the transition metal.
• the manufacturing method of this embodiment is used for a semiconductor manufacturing method such as a wafer manufacturing step, an oxide film forming step, a transistor forming step, a wiring forming step, and one or more steps selected from a CMP step, in addition to the above-mentioned processing method. It may include a known step.
• the amphoteric tenside agent is a carboxybetaine type, an imidazoline derivative type, a glycine type, or an amine oxide type amphoteric tenside agent. More specifically, carboxybetaine-type surfactants such as alkylbetaine and fatty acid amide alkylbetaine, imidazoline derivative-type surfactants such as 2-alkyl-N-carboxymethyl-N-hydroxyethyl imidazolinium betaine, and alkyldiethylenetria. Glycine-type surfactants such as minoacetic acid and dialkyldiethylenetriaminoacetic acid, amine oxide-type surfactants such as alkylamine oxides, and the like.
• the amine may be any of a tertiary amine, a secondary amine and a primary amine, and for example, trimethylamine, dimethylamine, monomethylamine, triethylamine, diethylmethylamine, ethyldimethylamine and tripropyl.
• Aliphatic amines such as amines, tributylamines, ethylenediamines, triethanolamines, N, N-diisopropylethylamines, tetramethylethylenediamines, hexamethylenediamines, aromatic amines such as aniline and catecholamines, pyrrolidine, piperidine, piperazin, morpholin.
• Hexylated amines such as quinuclidine, pyrrol, pyrazole, imidazole, pyridine, pyridazine, pyrimidine, pyrazine, oxazole, thiazole, and amine derivatives such as etheramines and amino acids.
• chemical species containing a nitrogen atom can also be suitably used as the amine contained in the treatment liquid of this embodiment, but of course, these Not limited to.
• the hydrogen or carbon atom bonded to the nitrogen atom may be substituted with another atom or functional group.
• the treatment liquid of this embodiment contains an amphoteric surfactant or an amine
• the transition metal oxide adheres to or adheres to the transition metal surface by the mechanism shown in the description of the surfactant or the ligand contained in the cleaning liquid.
• the effect of suppressing precipitation is exhibited.
• the surface of the transition metal treated with the treatment liquid of this embodiment is less likely to be affected by the transition metal oxide, and the deterioration of the flatness of the transition metal surface due to the chemical treatment can be suppressed. Therefore, the treatment liquid of this embodiment is a treatment liquid that can be suitably used in a process in which the flatness of a transition metal is required in the manufacture of a semiconductor device.
• the treatment liquid of this embodiment can be used alone or in combination with other treatment liquids.
• the amphoteric surfactant or amine can be coordinated on the surface of the transition metal contained in the wafer by applying the treatment liquid of this embodiment to the wafer or immersing the wafer in the treatment liquid of this embodiment. At this time, the amphoteric surfactant or amine coordinated on the surface of the transition metal acts as a protective layer for the transition metal, and at the same time, the transition metal oxide, organic matter, or other precipitates are deposited on the surface of the transition metal.
• the treatment liquid of this embodiment is used before processing the transition metal contained in the wafer by using another treatment liquid, but as will be described later, the treatment liquid of this embodiment contains an oxidizing agent or the like. If it is contained, it becomes a treatment liquid capable of simultaneously protecting the transition metal with an amphoteric surfactant or an amine and processing the transition metal with an oxidizing agent or the like.
• the treatment solution of this embodiment is preferably used before and / or after the treatment with the oxidizing agent. Can be done.
• the amount of the amphoteric surfactant or amine coordinated to the surface of the transition metal is controlled, and the treatment with the oxidizing agent is performed multiple times. Can be done in the same way.
• the effect of the oxidant is not changed, so that the effect of the chemical solution treatment can be controlled by the number of wet treatments.
• the wet treatment is etching with an oxidizing agent
• the etching amount after a plurality of treatments can be controlled by the product of the etching amount by one etching and the number of treatments, and precise processing becomes possible.
• the flatness of the transition metal surface is maintained by using the treatment liquid of this embodiment, even if the wet treatment is performed a plurality of times, the subsequent treatment is not hindered by the roughening of the transition metal surface.
• the above-mentioned concentration of the amphoteric surfactant or amine contained in the treatment liquid, the pH of the treatment liquid, the solvent of the treatment liquid, and other additives which may be contained in the treatment liquid are the surfactants contained in the above-mentioned cleaning liquid.
• the range and conditions shown in the description of the ligand can be preferably used.
• the treatment liquid of this embodiment may further contain an oxidizing agent.
• the redox potential (ORP) of the treatment liquid is stabilized, and the chemical state (oxidation state) of the transition metal oxide is stabilized.
• the oxidation state of the transition metal oxide is lowered so that adhesion or precipitation is less likely to occur on the transition metal surface, and it is possible to obtain a transition metal surface having a small influence of the transition metal oxide and excellent flatness. Will be.
• the transition metal surface can be protected by an amphoteric tenside or an amine and the transition metal can be etched at the same time, the transition metal can be processed with excellent flatness and high production efficiency.
• the oxidizing agent mentioned in the above description can be preferably used, and halogen oxygen acid, halogen oxygen acid ion, halogen oxygen salt, permanganic acid, and permanganic acid can be used.
• halogen oxygen acid, halogen oxygen acid ion, halogen oxygen salt, permanganic acid, and permanganic acid can be used.
• examples thereof include ions, permanganates, cerium (IV) salts, ferricyan salts, hydrogen peroxides, ozone and the like.
• hypobromous acid, its ions, and hydrogen peroxide are suitable as oxidizing agents because they can be used stably in a wide pH range and a wide range of concentrations can be selected.
• hypobromous acid, hypobromous acid, Permanganic acid, perioic acid (orthoperioic acid and / or metaperiodic acid), or ions thereof are more preferred and are hypochlorous acid, hypobromous acid, periodic acid (orthoperiodic acid and). / Or metaperiodic acid), or these ions are more preferred, hypobromous acid, or hypobromous acid ion is the most preferred.
• the concentration thereof, the pH of the treatment liquid, etc. are described as the description of the oxidizing agent contained in the above (etching liquid).
• the decomposition product of the amphoteric surfactant or amine can be produced in the treatment liquid by utilizing the decomposition of the amphoteric surfactant or amine by the oxidizing agent.
• a treatment liquid containing a secondary amine and / or a primary amine can be obtained by reacting a tertiary amine with an oxidizing agent, and the treatment liquid can also be used.
• the treatment liquid of this embodiment may contain the above-mentioned surfactant, ligand, onium ion, ammonium ion, anion species, and other additives, and conditions when these additives are used. Can suitably use the contents described in the description of each additive without any limitation.
• the solvent of the treatment liquid of this embodiment is not particularly limited, and may be water or an organic solvent. If the amphoteric surfactant or amine contained in the treatment liquid has poor solubility, it may precipitate as particles on the surface of the wafer containing the transition metal. In semiconductor manufacturing, particles are not preferable because they cause a decrease in yield. From the viewpoint of increasing the solubility of the amphoteric surfactant or amine and reducing the possibility of particles precipitating on the surface of the transition metal, water is preferable as the solvent used in the treatment liquid of this embodiment, and distillation and ions are used.
• Water from which metal ions, organic impurities, particle particles and the like have been removed by exchange treatment, filter treatment, various adsorption treatments and the like is preferable, and pure water or ultra-pure water is particularly preferable.
• the water contained in the treatment liquid of this embodiment is preferably water from which metal ions, organic impurities, particle particles, etc. have been removed by distillation, ion exchange treatment, filter treatment, various adsorption treatments, etc., particularly pure water and ultrapure water. Is preferable.
• Such water can be obtained by a known method widely used in semiconductor manufacturing. Further, water and an organic solvent may be used in combination as the solvent.
• the oxidation of the transition metal proceeds relatively gently, so that the oxidation of the wiring of the circuit forming portion and the like can be suppressed.
• the mass ratio of water and the organic solvent may be about 60/40 to 99.9 / 0.1.
• the method for producing the treatment liquid of this embodiment is not particularly limited, and can be produced, for example, by dissolving an amphoteric surfactant or an amine in the above solvent. If there is a risk of particles being generated in the treatment solution due to the dissolution or dispersion of the amphoteric surfactant or amine, add the amphoteric surfactant or amine to the solvent and then stir and heat the solution or dispersion. It may be circulated to promote the dissolution of the amphoteric detergent or amine, or it may be filtered with a suitable filter to remove the particles.
• the treatment liquid of this embodiment is a treatment liquid containing an amphoteric surfactant or an amine, and the amphoteric surfactant or the amine is coordinated on the surface of the transition metal to form a protective layer, and when the transition metal is etched. It is a treatment liquid that can suppress surface roughness and maintain the flatness of the transition metal surface even after etching.
• the transition metal to which the treatment liquid of this embodiment can be suitably applied is not particularly limited, and for example, Ru, Rh, Ti, Ta, Co, Cr, Hf, Os, Pt, Ni, Mn, Cu, Zr, La. , Mo, W and the like can be suitably processed.
• the treatment liquid of this embodiment is a treatment liquid capable of etching ruthenium, tungsten, molybdenum, and chromium contained in the wafer while maintaining its flatness.
• the transition metal films used in the examples and comparative examples were formed as follows. An oxide film was formed on a silicon wafer using a batch thermal oxidation furnace, and a transition metal film was formed on the oxide film by a sputtering method. When the transition metal was ruthenium, 1200 ⁇ ( ⁇ 10%) of ruthenium was formed. When the transition metal was molybdenum, 1000 ⁇ ( ⁇ 10%) of molybdenum was formed.
• the sheet resistance was measured by a four-probe resistance measuring device (Lorester GP, manufactured by Mitsubishi Chemical Analytech Co., Ltd.) and converted into a film thickness, which was used as the transition metal film thickness before the etching process. After the etching treatment, the sheet resistance was similarly measured with a four-probe resistance measuring device and converted into a film thickness to obtain the transition metal film thickness after the etching treatment. The difference between the transition metal film thickness after the etching treatment and the transition metal film thickness before the etching treatment was taken as the amount of change in the film thickness before and after the etching treatment.
• thermometer protection tube manufactured by Cosmos Bead Co., Ltd., bottom-sealed type
• thermometer protection tube manufactured by Cosmos Bead Co., Ltd., bottom-sealed type
• thermometer protection tube manufactured by Cosmos Bead Co., Ltd., bottom-sealed type
• thermometer protection tube manufactured by Cosmos Bead Co., Ltd., bottom-sealed type
• thermometer protection tube manufactured by Cosmos Bead Co., Ltd., bottom-sealed type
• thermometer protection tube manufactured by Cosmos Bead Co., Ltd., bottom-sealed type
• thermometer manufactured by Cosmos Bead Co., Ltd., bottom-sealed type
• the tip of a PFA tube F-8011-02 manufactured by Flon Industries, Ltd.
• the remaining one opening is 5% by mass of sodium hydroxide.
• a magnetic stirrer (C-MAG HS10 manufactured by AsOne) was installed in the lower part of the three-necked flask, and while rotating at 300 rpm, the outer periphery of the three-necked flask was cooled with ice water and chlorine gas (manufactured by Fujiox, specification purity 99. 4%) was supplied at 200 ccm (25 ° C.) for 180 minutes to obtain a mixed solution of 0.28 mol / L tetramethylammonium hypochlorite and 0.01 mol / L tetramethylammonium hydroxide. At this time, the liquid temperature during the reaction was 11 ° C.
• Method of calculating the etching amount ratio of ruthenium (002) to any one of the crystal planes of ruthenium excluding ruthenium (002) Using an X-ray diffractometer (D2 PHASER, manufactured by BRUKER), determine the peak area of any one of the crystal planes of ruthenium (002) and ruthenium (002) in the ruthenium film before and after the etching treatment. rice field.
• the measurement conditions are as follows.
• ⁇ X-ray source Cu / K ⁇ ray ⁇ Tube voltage / current: 30kV / 10mA -Scanning speed: 11 deg / min Scanning range: 10 to 90 °
• the value obtained by subtracting the peak area of ruthenium (002) after etching from the peak area of ruthenium (002) before etching was taken as the amount of change in the peak area of ruthenium (002).
• the amount of change in the peak area of ruthenium (002) was divided by the peak area of ruthenium (002) before the etching treatment, and the value obtained as a percentage was taken as the rate of change in ruthenium (002).
• the rate of change of ruthenium excluding ruthenium (002) with respect to any one of the crystal faces was also calculated by the same method as the rate of change of ruthenium (002).
• the value obtained by dividing the rate of change in the peak area of ruthenium (002) by the rate of change in the peak area of any one of the crystal faces of ruthenium excluding ruthenium (002) is divided by the rate of change in the crystal face of ruthenium excluding ruthenium (002).
• the ruthenium (002) etching amount ratio with respect to any one of the above was used.
• the etching amount ratio and the etching rate ratio are equal, and when the etching rate ratio approaches 1, the etching rate difference becomes small, and as a result, the decrease in flatness is suppressed.
• the value obtained by multiplying the film thickness before the etching treatment by the rate of change of ruthenium (101) was taken as the amount of change in the film thickness of ruthenium (101), and the value obtained by dividing this by the immersion time was taken as the etching rate of ruthenium (101).
• the amount of change in the peak area of molybdenum (110) was divided by the peak area of molybdenum (110) before the etching treatment, and the value obtained as a percentage was taken as the rate of change in molybdenum (110).
• the rate of change of molybdenum excluding molybdenum (110) with respect to any one of the crystal faces was also calculated by the same method as the rate of change of molybdenum (110).
• the value obtained by dividing the rate of change in the peak area of molybdenum (110) by the rate of change in the peak area of any one of the crystal faces of molybdenum excluding molybdenum (110) is divided by the rate of change in the crystal face of molybdenum excluding molybdenum (110).
• the etching amount ratio of molybdenum (110) to any one of the above was used.
• the etching amount ratio and the etching rate ratio are equal, and when the etching rate ratio approaches 1, the etching rate difference becomes small, and as a result, the decrease in flatness is suppressed.
• the value obtained by multiplying the film thickness before the etching treatment by the rate of change of molybdenum (211) was taken as the amount of change in the film thickness of molybdenum (211), and the value obtained by dividing this by the immersion time was taken as the etching rate of molybdenum (211).
• the transition metal surface before and after etching was observed with a field emission scanning electron microscope (JSM-7800F Prime, manufactured by JEOL Ltd.), and the flatness was confirmed and evaluated according to the following criteria.
• the grades are A to D in ascending order of surface roughness, and evaluations A to C are allowable levels and evaluation D is an impossible level.
• PH measurement The pH of 10 mL of the measurement sample solution prepared in Examples and Comparative Examples was measured using a tabletop pH meter (LAQUA F-73, manufactured by HORIBA, Ltd.). The pH measurement was carried out after the etching solution was prepared and stabilized at 25 ° C.
• Example 1 Manufacturing of etching solution
• a 1 mol / L NaOH aqueous solution and ultrapure water were added to sodium hypochlorite pentahydrate to prepare an aqueous solution having a pH of 13.0 and containing 1.0 mol / L hypochlorite ion.
• a 1 mol / L NaOH aqueous solution and ultrapure water were added to sodium bromide to prepare an aqueous solution having a pH of 13.0 and containing 1.0 mol / L bromide ion.
• An aqueous solution containing hypochlorite ion and an aqueous solution containing bromide ion were mixed at a volume ratio of 1: 1 to prepare an etching solution containing hypobromous acid ion described as Example 1 in Table 1.
• a ruthenium film and a molybdenum film were formed by the method described in (Transition metal film formation and film thickness change amount), and sample pieces cut into 10 ⁇ 20 mm were used for evaluation.
• Example 2 the pH of the aqueous solution containing hypochlorite ion and the aqueous solution containing bromide ion was set to 12.5 and the concentration was set to 0.2 mol / L so as to have the composition shown in Table 1.
• An etching solution was prepared in the same manner as in Example 1, and evaluation was performed using the ruthenium film and molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Example 3 is 0.28 mol / L tetramethylammonium hypochlorite obtained by the above (preparation of a mixed solution of tetramethylammonium hypochlorite ((CH 3 ) 4 NaClO) and tetramethylammonium hydroxide). 15 wt% HCl and ultrapure water are added to a mixed solution of an aqueous solution and 0.01 mol / L tetramethylammonium hydroxide, and the pH is 9.0, and 0.012 mol / L hypochlorite ion and tetramethylammonium are added.
• aqueous solution A An aqueous solution containing ions (hereinafter referred to as aqueous solution A) was prepared.
• a 25% aqueous solution of tetramethylammonium hydroxide and ultrapure water are added to tetramethylammonium bromide, and an aqueous solution containing 0.012 mL / L of bromide ion and tetramethylammonium ion at pH 9.0 (hereinafter referred to as aqueous solution B). ) was prepared.
• Aqueous solution A and aqueous solution B were mixed at a volume ratio of 1: 1 to prepare the etching solution described as Example 3 in Table 1. Evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Example 4 the pH of the aqueous solution A and the aqueous solution B was 8.0, the hypochlorite ion concentration of the aqueous solution A and the bromide ion concentration of the aqueous solution B were 0.02 mol / L so as to have the composition shown in Table 1.
• An etching solution was prepared in the same manner as in Example 3 and evaluated using the ruthenium film (sample piece) prepared in the same manner as in Example 1.
• Examples 5 to 8 an etching solution was prepared in the same manner as in Example 3 except that the pH and concentration of the aqueous solution A and the aqueous solution B were changed so as to have the composition shown in Table 1. The evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as above.
• Example 9 to 10 an etching solution was prepared by adding 25 wt% tetramethylammonium hydroxide aqueous solution and ultrapure water to orthoperiodic acid so as to have the composition shown in Table 1. Evaluation was performed using the ruthenium film and molybdenum film (sample pieces) prepared in the same manner.
• Example 11 uses the same method as in Example 3 and has a pH of 11.0 and contains an aqueous solution containing 0.012 mL / L of hypochlorite ion and tetramethylammonium ion (hereinafter referred to as aqueous solution A1). ) was prepared. Tetrapropylammonium chloride is added to tetramethylammonium bromide so as to be 0.006 mL / L, and by adding ultrapure water and a 25 wt% tetramethylammonium hydroxide aqueous solution, the pH is 11.0 and 0.006 mL / L.
• aqueous solution B1 An aqueous solution containing L tetrapropylammonium chloride, 0.012 mL / L bromide ion, and tetramethylammonium ion (hereinafter referred to as aqueous solution B1) was prepared.
• Aqueous solution A1 and aqueous solution B1 were mixed at a volume ratio of 1: 1 to prepare an etching solution containing hypobromous acid ion and 0.003 mol / L tetrapropylammonium ion shown in Table 1. Evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Example 12 an aqueous solution containing 1.0 mol / L hypochlorite ion (hereinafter referred to as aqueous solution A2) having a pH of 12.5 was prepared by using the same method as in Example 1. Add octyltrimethylammonium chloride to sodium bromide to 0.004 mL / L, and add ultrapure water and 1 mL / L NaOH aqueous solution to make octyltrimethyl at pH 12.5 and 0.004 mL / L. An aqueous solution containing ammonium chloride and 1.0 mol / L bromide ion (hereinafter referred to as aqueous solution B2) was prepared.
• aqueous solution B2 An aqueous solution containing ammonium chloride and 1.0 mol / L bromide ion
• Aqueous solution A2 and aqueous solution B2 were mixed at a volume ratio of 1: 1 to prepare an etching solution containing hypobromous acid ion and 0.002 mL / L octyltrimethylammonium ion shown in Table 1. Evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Example 13 uses the same method as in Example 3 and has an pH of 10.0 and is an aqueous solution containing 0.02 mL / L of hypochlorite ion and tetramethylammonium ion (hereinafter referred to as aqueous solution A3). ) was prepared. Octadecyltrimethylammonium chloride is added to tetramethylammonium bromide so as to be 0.002 mL / L, and by adding ultrapure water and a 25 wt% tetramethylammonium hydroxide aqueous solution, the pH is 10.0 and 0.002 mL / L.
• aqueous solution B3 An aqueous solution containing L of octadecyltrimethylammonium chloride, 0.02 mL / L bromide ion, and tetramethylammonium ion (hereinafter referred to as aqueous solution B3) was prepared.
• Aqueous solution A3 and aqueous solution B3 were mixed at a volume ratio of 1: 1 to prepare an etching solution containing hypobromous acid ion and 0.001 mL / L octadecyltrimethylammonium ion shown in Table 1. Evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Example 14 In Example 14, the pH of the aqueous solution A3 was 11.0, the hypochlorite ion concentration was 0.06 mL / L, and the pH of the aqueous solution B3 was 11.0 so as to have the pH and composition shown in Table 1.
• An etching solution was prepared in the same manner as in Example 13 except that 0.004 mL / L of octyltrimethylammonium chloride was used instead of octadecyltrimethylammonium chloride and the bromide ion concentration was 0.06 mL / L.
• the evaluation was performed using the prepared ruthenium film and molybdenum film (sample piece) in the same manner as above.
• Example 15 In Example 15, the pH of the aqueous solution A2 and the aqueous solution B2 was 13.5, the hypobromous acid ion concentration of the aqueous solution A2 and the bromide ion concentration of the aqueous solution B2 were 2.0 mL / L so as to have the pH and composition shown in Table 1.
• An etching solution containing hypobromous acid ion was prepared by the same method as in Example 12, and evaluation was performed using the ruthenium film and molybdenum film (sample piece) prepared in the same manner as in Example 1. At this time, the onium ion concentration was adjusted so that the octyltrimethylammonium ion was 0.002 mol / L.
• Example 16 hypochlorous acid shown in Table 1 was prepared by adding 15 wt% HCl and ultrapure water to a mixed solution of tetramethylammonium hypochlorite aqueous solution and tetramethylammonium hydroxide obtained by the above operation. An etching solution containing ions was prepared. At this time, tetramethylammonium chloride was added so that the chloride ion concentration in the etching solution was 0.5 mol / L. Evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Example 17 an etching solution was prepared in the same manner as in Example 1 except that 20% ethyltrimethylammonium hydroxide was used as the alkali used for pH adjustment, and the ruthenium film prepared in the same manner as in Example 1 and the ruthenium film and Evaluation was performed using a molybdenum film (sample piece).
• Example 18 is 0.28 mol / L tetramethylammonium hypochlorite obtained by the above (preparation of a mixed solution of tetramethylammonium hypochlorite ((CH 3 ) 4 NCO) and tetramethylammonium hydroxide). 25% tetramethylammonium hydroxide and ultrapure water are added to a mixed solution of an aqueous solution and 0.01 mol / L tetramethylammonium hydroxide, and the pH is 13.0, and 0.2 mol / L hypochlorite ion.
• aqueous solution A4 an aqueous solution containing tetramethylammonium ion (hereinafter referred to as aqueous solution A4) was prepared.
• aqueous solution B4 An aqueous solution containing bromide ion and tetramethylammonium ion (hereinafter referred to as aqueous solution B4) was prepared.
• Aqueous solution A4 and aqueous solution B4 were mixed at a volume ratio of 1: 1 to prepare the etching solution described as Example 17 in Table 1. Evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Example 19 uses the same method as in Example 16 and has an pH of 10.0 and is an aqueous solution containing 0.2 mL / L of hypochlorite ion and tetramethylammonium ion (hereinafter referred to as aqueous solution A5). ) was prepared. Further, a 0.2 mL / L orthoperiodic acid aqueous solution (hereinafter referred to as aqueous solution B5) having a pH of 10.0 was prepared using the same method as in Example 9. Aqueous solution A5 and aqueous solution B5 were mixed at a volume ratio of 1: 1 to prepare the etching solution described as Example 19 in Table 1. Evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Example 20 In Example 20, using the same method as in Example 18, an aqueous solution A4 having a pH of 13.0 and containing 0.2 mL / L of hypochlorite ion and tetramethylammonium ion was prepared. Further, using the same method as in Example 9, a 0.2 mL / L orthoperiodic acid aqueous solution (hereinafter referred to as aqueous solution B6) having a pH of 13.0 was prepared. Aqueous solution A4 and aqueous solution B6 were mixed at a volume ratio of 1: 1 to prepare the etching solution described as Example 20 in Table 1. Evaluation was performed using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Comparative Example 2 was hypobromous acid ion in the same manner as in Example 1 except that 15 wt% HCl was used instead of 1 mol / L NaOH aqueous solution at the time of pH adjustment so as to have the composition shown in Table 1.
• An etching solution containing the above was prepared and evaluated using the ruthenium film and the molybdenum film (sample piece) prepared in the same manner as in Example 1.
• Comparative Example 3 An aqueous solution containing 1.0 mol / L hypochlorite ion at pH 14.0 was prepared using the same method as in Example 1. Gidodecyldimethylammonium chloride, sodium bromide, 1 mL / L NaOH aqueous solution and ultrapure water are added, and the pH is 14.0, 0.00001 mL / L gidodecyldimethylammonium ion and 1.0 mL / L bromide ion. An aqueous solution containing the above was prepared.
• aqueous solution containing hypobromous acid ion and an aqueous solution containing didodecyldimethylammonium ion and bromide ion are mixed at a volume ratio of 1: 1 and an etching solution containing hypobromous acid ion described as Comparative Example 3 in Table 1 is used.
• etching solution containing hypobromous acid ion described as Comparative Example 3 in Table 1 is used.
• the transition metal is etched with the etching amount ratio of one crystal plane other than the crystal plane to one crystal plane of 0.1 or more and 10 or less. It is possible to reduce the difference in etching rate between one crystal plane and one crystal plane other than the crystal plane, and it is possible to suppress a decrease in flatness (surface roughness) of the transition metal surface due to etching.
• Example 21 (Etching process including cleaning process) 60 mL of the etching solution prepared in Example 1 was prepared in a fluororesin container with a lid (manufactured by AsOne, PFA container 94.0 mL). Further, as a cleaning liquid, 60 mL of ultrapure water was prepared in a fluororesin container with a lid (manufactured by AsOne, PFA container 94.0 mL). Each sample piece having a size of 10 ⁇ 20 mm was immersed in an etching solution at a treatment temperature of 10 ° C. for 1 minute. After 1 minute, the sample piece was taken out from the treatment liquid and immersed in the cleaning liquid at a treatment temperature of 25 ° C. for 1 minute.
• the sample piece was taken out from the cleaning solution and immersed in the etching solution at a treatment temperature of 10 ° C. for 1 minute. After performing two-cycle treatment with the etching and subsequent cleaning steps as one cycle, the sample pieces were washed (rinsed) with ultrapure water and dried by nitrogen blow. X-ray diffraction measurements were performed before the first etching and after drying with nitrogen, respectively, and ruthenium (002) was etched on any one of the crystal planes of ruthenium excluding ruthenium (002).
• the etching amount ratio was calculated by (method for calculating the amount ratio), and the etching rate was calculated by (method for calculating the etching rate of any one of the crystal faces of ruthenium excluding ruthenium (002)). Furthermore, the flatness of the ruthenium surface was evaluated.
• Example 22 The same etching solution (treatment temperature: 25 ° C.) as in Example 2 was used, and acetonitrile was used as the cleaning solution. Other than that, the etching treatment including the cleaning step and the evaluation were performed in the same manner as in Example 21.
• Example 23 Etching treatment including a cleaning step in the same manner as in Example 21 except that the same etching solution (treatment temperature: 25 ° C.) as in Example 2 was used and a 0.001 mL / L octyltrimethylammonium chloride aqueous solution was used as a cleaning solution. And evaluated.
• Example 24 Etching including a cleaning step in the same manner as in Example 21 except that the same etching solution (treatment temperature: 25 ° C.) as in Example 2 was used and a 0.0005 mL / L octadecyltrimethylammonium bromide aqueous solution was used as the cleaning solution. Processed and evaluated.
• Example 25 Manufacturing of treatment liquid containing amphoteric tenside
• a 31% lauryldimethylaminoacetic acid betaine solution (manufactured by Kao; product name Anchtor 20BS) is dissolved in ultrapure water to prepare an aqueous solution containing 10% by mass ppm lauryldimethylaminoacetic acid betaine, and then tetramethylammonium hydroxide is used.
• the pH was adjusted to 12.5.
• Example 2 The same etching solution as in Example 2 (treatment temperature: 25 ° C.) was used, and the semiconductor treatment solution containing the above amphoteric tenside (10 mass ppm lauryldimethylaminoacetic acid betaine) was used as a cleaning solution. Similarly, etching treatment including cleaning step and evaluation were performed.
• Example 26 The same etching treatment as in Example 2 (treatment temperature: 25 ° C.) was used, and the etching treatment including the cleaning step and the same as in Example 21 except that 0.005 mL / L dimethyl oxalate aqueous solution was used as the cleaning liquid. Evaluation was performed.
• Example 27 Etching treatment and evaluation including a cleaning step were carried out in the same manner as in Example 21 except that the same etching solution (treatment temperature: 25 ° C.) as in Example 2 was used and a 0.001 mL / L imidazole aqueous solution was used as the cleaning solution. gone.
• Example 28> Manufacturing of treatment liquid containing amine
• Glycine manufactured by Tokyo Chemical Industry Co., Ltd., purity> 99.0%
• the pH is adjusted to 12.5 using tetramethylammonium hydroxide. did.
• it was filtered through a PTFE filter having a pore diameter of 20 nm to obtain a treatment liquid for semiconductors containing an amine.
• Example 29> Manufacturing of treatment liquid containing amphoteric tenside agent and oxidizing agent
• 1 L of a treatment liquid having a pH of 12.5 containing 10 mass ppm of betaine lauryldimethylaminoacetic acid (a treatment liquid containing an amphoteric tenside agent) was produced.
• a 0.2 mol / L tetramethylammonium hypobromous acid aqueous solution (pH 12.5) was produced by adjusting the amounts of tetramethylammonium hypochlorite and tetramethylammonium bromide. did.
• Example 30 Using the same etching solution and cleaning solution as in Example 24, the mixture was immersed in the cleaning solution at a treatment temperature of 25 ° C. for 1 minute before the etching treatment. The sample piece was taken out from the cleaning solution and immersed in the etching solution at a treatment temperature of 25 ° C. for 1 minute. The sample piece was washed (rinsed) with ultrapure water, dried by a nitrogen blow, and then evaluated in the same manner as in Example 1.
• Table 3 shows the composition of each example, and Table 4 shows the results.
• the Ru etching amount ratio approaches 1 and the surface is flat after etching. It can be seen that the sex is further improved.
• Example 29 it was found that the surface flatness after etching is improved by etching ruthenium with a treatment liquid containing an amphoteric tenside agent and an oxidizing agent. rice field. Further, as shown in the results of Example 30 shown in Table 4, it was found that the surface flatness after etching is improved by performing the cleaning treatment before the etching treatment.

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• 2021
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  • 2021-12-24 TW TW110148611A patent/TW202232586A/zh unknown

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