WO2022137363A1 - Appareil de montage de composant et procédé de montage de composant - Google Patents

Appareil de montage de composant et procédé de montage de composant Download PDF

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Publication number
WO2022137363A1
WO2022137363A1 PCT/JP2020/048044 JP2020048044W WO2022137363A1 WO 2022137363 A1 WO2022137363 A1 WO 2022137363A1 JP 2020048044 W JP2020048044 W JP 2020048044W WO 2022137363 A1 WO2022137363 A1 WO 2022137363A1
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WO
WIPO (PCT)
Prior art keywords
mounting
position recognition
component
substrate
image pickup
Prior art date
Application number
PCT/JP2020/048044
Other languages
English (en)
Japanese (ja)
Inventor
大介 春日
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to KR1020237020895A priority Critical patent/KR20230110330A/ko
Priority to DE112020007760.8T priority patent/DE112020007760T5/de
Priority to JP2022570834A priority patent/JPWO2022137363A1/ja
Priority to CN202080107951.2A priority patent/CN116636321A/zh
Priority to PCT/JP2020/048044 priority patent/WO2022137363A1/fr
Publication of WO2022137363A1 publication Critical patent/WO2022137363A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components

Definitions

  • the present invention relates to a component mounting device and a component mounting method, and more particularly to a component mounting device and a component mounting method for imaging a position recognition mark provided on a board.
  • a mounting head for mounting an electronic component on a printed circuit board and a substrate recognition for imaging an individual board recognition mark (position recognition mark) provided near the mounting position of the electronic component on the printed circuit board.
  • An electronic component mounting device (component mounting device) including a camera is disclosed. This electronic component mounting device is configured to capture an individual substrate recognition mark with a substrate recognition camera and correct the mounting position based on the image pickup result of the individual substrate recognition mark by the substrate recognition camera. Further, this electronic component mounting device is configured to capture the individual substrate recognition marks having predetermined position coordinates when the substrate recognition camera captures the individual substrate recognition marks.
  • the present invention has been made to solve the above-mentioned problems, and one object of the present invention is that the position recognition mark is hidden by the parts mounted on the substrate, so that the mounting position is hidden. It is an object of the present invention to provide a component mounting device and a component mounting method capable of suppressing the failure to mount a component on a substrate without being able to perform correction.
  • the component mounting device includes a mounting head for mounting the component on the substrate, an image pickup unit for capturing a position recognition mark provided on the substrate, and a component mounting operation on the substrate during the mounting operation of the component on the substrate.
  • a control unit that determines the position recognition mark that is not hidden by the mounted components as the image pickup target by the image pickup unit and corrects the mounting position based on the image pickup result of the position recognition mark determined as the image pickup unit by the image pickup unit. , Equipped with.
  • the position recognition mark that is not hidden by the component mounted on the substrate is determined as the image pickup target by the imaging unit.
  • a control unit for correcting the mounting position is provided based on the image pickup result of the position recognition mark determined as the image pickup target by the image pickup unit.
  • the position recognition mark that is not hidden by the component mounted on the board is determined as the image pickup target by the imaging unit, so that the position can be hidden by the component mounted on the board. Since the recognition mark can be arranged, the degree of freedom in arranging the position recognition mark can be increased.
  • the substrate includes a plurality of individual substrates each provided with a position recognition mark
  • the control unit is a non-mounting point during the mounting operation of the component on the substrate. It is configured to control to determine the position recognition mark of the image pickup target from among the position recognition marks corresponding to the individual substrate including the above.
  • the position recognition mark is likely to be hidden by the components mounted on the board (that is, the board including a plurality of individual boards each provided with the position recognition mark) is not mounted. Since the position recognition mark corresponding to the individual board including the points is determined, the mounting position cannot be corrected due to the fact that the position recognition mark is hidden by the component mounted on the board, and the component board cannot be corrected.
  • the image pickup unit captures the position recognition marks that are not hidden by the parts mounted on the board. It can be easily determined as a target.
  • the control unit is not hidden by the components mounted on the board during the retry mounting operation in which the remounting operation is performed to the unmounted point due to an error.
  • the position recognition mark is likely to be hidden by the parts mounted on the board.
  • the position recognition mark is hidden by the parts mounted on the board. It is possible to prevent the component from being unable to be mounted on the substrate because the position cannot be corrected.
  • the control unit controls to determine the position recognition mark that is not hidden by the components mounted on the substrate as the image pickup target by the image pickup unit not only during the retry mounting operation but also during the normal mounting operation. It is configured in. With this configuration, the same position recognition mark recognition operation can be performed both during the normal mounting operation and during the retry mounting operation. Therefore, the positions differ from each other during the normal mounting operation and the retry mounting operation. It is possible to suppress the complexity of the recognition operation of the position recognition mark as compared with the case of performing the recognition operation of the recognition mark.
  • the control unit determines two position recognition marks as imaging targets by the image pickup unit from among a plurality of position recognition marks corresponding to a plurality of unmounted points. Is configured to do. With this configuration, two position recognition marks are determined as the image pickup targets by the image pickup unit from among the plurality of position recognition marks corresponding to the plurality of unmounted points, so that they are hidden by the components mounted on the substrate. It is possible to easily determine the minimum necessary position recognition mark as an image pickup target by the image pickup unit.
  • the control unit is configured to control to determine the two farthest position recognition marks as the image pickup targets by the image pickup unit from the plurality of position recognition marks corresponding to the plurality of unmounted points.
  • the mounting position can be corrected based on the imaging results of the two farthest position recognition marks, so that the unmounted points between the two farthest position recognition marks can be corrected.
  • the mounting position can be corrected by the extrapolation correction that obtains the numerical value inside the data range, which is more accurate than the extrapolation correction, instead of the extrapolation correction that obtains the numerical value outside the data range.
  • the mounting position can be corrected more accurately than in the case where the position recognition mark other than the two farthest position recognition marks is determined as the image pickup target by the imaging unit.
  • the control unit captures a position recognition mark that is not hidden by the components mounted on the board in a designated area set to include a plurality of mounting positions. It is configured to correct the mounting position in the designated area based on the image pickup result by the image pickup unit of the position recognition mark determined as the image pickup target.
  • the position recognition marks of the imaging target can be determined in a relatively narrow range within the designated area, so that it is possible to prevent the position recognition marks that are excessively distant from each other from being determined as the imaging target. be able to.
  • the mounting position can be corrected with high accuracy based on the image pickup result of the position recognition mark relatively close to the mounting position.
  • control unit is configured to control to set a designated area so that the most unmounted points are included during the mounting operation of the component on the board.
  • many unmounted points can be included in the designated area. Therefore, even when the designated area is provided, it is possible to suppress an increase in the number of image pickup operations of the position recognition mark by the image pickup unit. Can be done.
  • the component mounting method according to the second aspect of the present invention is mounted on the board during the step of mounting the component on the board, the step of imaging the position recognition mark provided on the board, and the mounting operation of the component on the board. It is provided with a step of determining a position recognition mark that is not hidden by the components as an image pickup target and correcting the mounting position based on the image pickup result of the position recognition mark determined as the image pickup target.
  • the position recognition mark that is not hidden by the component mounted on the substrate is determined as the image pickup target, and the position recognition mark determined as the image pickup target is imaged. Based on the result, a step for correcting the mounting position is provided.
  • the position recognition mark is hidden by the component mounted on the board, so that the mounting position cannot be corrected and the component is mounted on the board. It is possible to provide a component mounting method capable of suppressing the inability to perform.
  • the board includes a plurality of individual boards provided with position recognition marks
  • the step of correcting the mounting position is during the mounting operation of the component on the board.
  • the position recognition mark is likely to be hidden by the components mounted on the board (that is, the board including a plurality of individual boards each provided with the position recognition mark) is not mounted. Since the position recognition mark corresponding to the individual board including the points is determined, the mounting position cannot be corrected due to the fact that the position recognition mark is hidden by the component mounted on the board, and the component board cannot be corrected.
  • the position recognition mark to be imaged can be easily used as the image pickup target. Can be decided.
  • the mounting position cannot be corrected and the component cannot be mounted on the board. It is possible to provide a component mounting device and a component mounting method that can be suppressed.
  • FIG. 1 It is a schematic diagram which shows the component mounting apparatus by 1st Embodiment.
  • A is a schematic plan view showing a substrate before mounting of parts according to the first embodiment.
  • B is a schematic plan view showing a substrate after mounting the components according to the first embodiment. It is a schematic diagram for demonstrating the local fiducial by 1st Embodiment. It is a schematic diagram for demonstrating the point fiducial by 1st Embodiment. It is a schematic diagram for demonstrating the mounting operation of a component on a substrate including the determination of the position recognition mark by the component mounting apparatus according to the first embodiment.
  • A is a schematic diagram for explaining the determination of the position recognition mark in the normal mounting operation by the component mounting device according to the first embodiment.
  • (B) is a schematic diagram for explaining the determination of the position recognition mark at the time of the retry mounting operation by the component mounting device according to the first embodiment. It is a flowchart for demonstrating the component mounting process by the component mounting apparatus according to 1st Embodiment. It is a flowchart for demonstrating the mark recognition process of FIG. It is a detailed flowchart of the mark recognition process of FIG. 7. It is a schematic diagram for demonstrating the mounting operation of a component on a substrate including the determination of the position recognition mark by the component mounting apparatus according to the second embodiment. It is a schematic diagram for demonstrating the determination of the designated area by the component mounting apparatus by 2nd Embodiment. It is a flowchart for demonstrating the designated area setting process by the component mounting apparatus by 2nd Embodiment. It is a schematic plan view for demonstrating the substrate by the modification of 2nd Embodiment.
  • the component mounting device 100 is a so-called flip-chip bonder in which a component (semiconductor chip) C is taken out from the diced wafer W and mounted on the substrate B.
  • the substrate B is, for example, a printed circuit board and a lead frame.
  • the component mounting device 100 includes a base 1, a conveyor 2, a mounting unit 3, a moving mechanism unit 4, a substrate imaging unit 5, a wafer holding table 6, and an extraction unit 7. It includes a component recognition image pickup unit 8, a fixed image pickup unit 9, a flux supply unit 10, a wafer storage unit 11, and a control unit 12.
  • the substrate imaging unit 5 is an example of the "imaging unit" in the claims.
  • the conveyor 2 is configured to carry the board B into a predetermined mounting work position and carry out the board B from the predetermined mounting work position. Further, the conveyor 2 includes a pair of conveyor rails extending in the X direction and a positioning mechanism (not shown) for positioning the substrate B at a predetermined position. As a result, the conveyor 2 conveys the substrate B in the X direction, and positions and fixes the substrate B at a predetermined mounting work position.
  • the mounting unit 3 is configured to perform the work of mounting the component C of the wafer W on the substrate B. Specifically, the mounting unit 3 is supported by the moving mechanism unit 4 so as to be movable above the conveyor 2 (board B) in the horizontal direction (XY direction).
  • the mounting unit 3 includes a plurality of (10) mounting heads 3a arranged along the X direction.
  • the mounting head 3a has a suction nozzle (not shown) for sucking the component C at the tip thereof.
  • the mounting unit 3 is configured to attract the component C taken out from the wafer W by the taking-out unit 7 by the mounting head 3a and mount it on the substrate B.
  • the moving mechanism unit 4 is configured to move the mounting unit 3.
  • the moving mechanism unit 4 has an X-axis moving mechanism unit 4a for moving the mounting unit 3 in the X direction and a Y-axis moving mechanism unit 4b for moving the X-axis moving mechanism unit 4a in the Y direction.
  • the X-axis movement mechanism unit 4a and the Y-axis movement mechanism unit 4b for example, a linear motion mechanism using a linear motor, a linear motion mechanism using a ball screw axis, or the like can be adopted.
  • the X-axis movement mechanism unit 4a has an X-axis motor (not shown) as a drive source for moving the mounting unit 3 in the X direction.
  • the Y-axis movement mechanism unit 4b has a Y-axis motor (not shown) as a drive source for moving the X-axis movement mechanism unit 4a in the Y direction.
  • the mounting unit 3 is configured to be movable in the horizontal direction (XY direction) above the conveyor 2 (board B) by the X-axis movement mechanism unit 4a and the Y-axis movement mechanism unit 4b of the movement mechanism unit 4.
  • the substrate imaging unit 5 includes a camera and is configured to image a position recognition mark (fiducial mark) F (see FIG. 2) provided on the substrate B prior to mounting the component C on the substrate B. ing.
  • the control unit 12 is configured to correct the mounting position based on the image pickup result of the position recognition mark F by the substrate image pickup unit 5.
  • the substrate imaging unit 5 is provided on a frame common to the mounting unit 3. Therefore, the substrate imaging unit 5, together with the mounting unit 3, is moved above the conveyor 2 (board B) in the horizontal direction (XY direction) by the X-axis moving mechanism unit 4a and the Y-axis moving mechanism unit 4b of the moving mechanism unit 4. It is configured to be movable.
  • the substrate B includes a plurality of individual substrate B1 (40 in FIG. 2A).
  • a pair of position recognition marks F are provided on each of the plurality of individual substrate B1s.
  • each of the plurality of individual piece substrates B1 is configured so that one component C is mounted.
  • the position recognition mark F is provided at a position hidden by the component C mounted on the individual substrate B1 after the component C is mounted on the individual substrate B1. That is, the position recognition mark F is provided at a position overlapping the component C mounted on the individual piece substrate B1 in a plan view.
  • the wafer holding table 6 is configured to support the wafer W drawn out from the wafer accommodating portion 11 by a loading / unloading mechanism (not shown) at a predetermined position.
  • the take-out unit 7 is configured to take out the component C from the wafer W supported by the wafer holding table 6 and deliver it to the mounting unit 3. Further, the take-out unit 7 is configured to be moved in the horizontal direction (XY direction) at a position above the wafer holding table 6 by a predetermined driving means. Further, the take-out unit 7 includes a plurality of wafer heads 7a.
  • the wafer head 7a is configured to be rotatable around the X axis and to be able to move (up and down) in the vertical direction. Further, the wafer head 7a is configured to be capable of adsorbing the component C. That is, the take-out unit 7 sucks and takes out the component C pushed up by the protrusion (not shown) by the wafer head 7a, reverses (flip) the component C, and at a predetermined delivery position, the mounting unit 3 (mounting). It is configured to deliver the component C to the head 3a).
  • the component recognition imaging unit 8 includes a camera and is configured to image the component C to be ejected prior to ejecting the component C from the wafer W. Further, the component recognition imaging unit 8 is provided in a frame common to the extraction unit 7. Further, the component recognition imaging unit 8 is configured to be moved in the horizontal direction (XY direction) at a position above the wafer holding table 6 by a predetermined driving means.
  • the fixed image pickup unit 9 is installed on the base 1 and in the movable area of the mounting unit 3.
  • the fixed imaging unit 9 includes a camera and is configured to image the component C attracted by the mounting head 3a of the mounting unit 3 from below.
  • the flux supply unit 10 is provided for transferring (applying) the flux to the bump electrode of the component C.
  • the flux supply unit 10 is configured to spread and supply the flux thinly on the plate. Then, the bump electrode of the component C adsorbed on the mounting head 3a of the mounting portion 3 is brought into contact with the spread flux. As a result, the flux is transferred to the bump electrode of the component C. The flux is applied to the bump electrode of the component C so that the solder for joining is well wetted.
  • the wafer storage unit 11 is configured to be capable of accommodating a plurality of diced wafers W.
  • the component C of the wafer W is a chip component for mounting a flip chip on which a plurality of bump electrodes are formed.
  • the component C is attached and held on the film-shaped wafer sheet so that the bump electrode forming surface (mounting surface) faces upward.
  • the control unit 12 is configured to comprehensively control the operation of each unit of the component mounting device 100.
  • the control unit 12 includes a conveyor 2, a mounting unit 3, a moving mechanism unit 4, a substrate imaging unit 5, a wafer holding table 6, an extraction unit 7, a component recognition imaging unit 8, a fixed imaging unit 9, and a flux supply unit. It is configured to control the operation of the 10 and the wafer accommodating portion 11.
  • the control unit 12 controls the operation of each unit based on an output signal from a position detection means such as an encoder built in the drive motor of each unit. Further, the control unit 12 has a function of performing image pickup control and image recognition of various image pickup units (board image pickup unit 5, component recognition image pickup unit 8, and fixed image pickup unit 9).
  • the control unit 12 includes a processor including a CPU (central processing unit) and a memory.
  • the position recognition mark F may be set as a local fiducial.
  • the position coordinates of the position recognition mark F are set in the coordinate system from the origin of the substrate B.
  • a common position recognition mark F is set for a plurality of mounting positions of the substrate B.
  • the position recognition mark F is set as a local fiducial by the implementation data and the fiducial data.
  • the implementation data includes information of "No.”, "coordinate X”, “coordinate Y”, and "Fid number”.
  • “No.” represents the mounting number (order) of the component C.
  • the "coordinate X” represents the X coordinate of the mounting position of the substrate B.
  • the “coordinate Y” represents the Y coordinate of the mounting position of the substrate B.
  • the "Fid number” represents a data number in the fiducial data.
  • the X coordinate and the Y coordinate of the mounting position of the component C of 1 are 10 and the Y coordinate is 10. It is shown that the position recognition mark F corresponding to the Fid number 1 is recognized (imaged) when the component C of 1 is mounted.
  • the fiducial data includes information of "Fid number”, “type”, “coordinate X1", “coordinate Y1”, “coordinate X2”, and “coordinate Y2".
  • the "Fid number” represents a data number in the fiducial data.
  • "Type” represents the type of data structure (local or point).
  • the "coordinate X1” represents the X coordinate of the position of the first position recognition mark F.
  • the “coordinate Y1” represents the Y coordinate of the position of the first position recognition mark F.
  • the "coordinate X2” represents the X coordinate of the position of the second position recognition mark F on the substrate B.
  • the "coordinate Y2" represents the Y coordinate of the position of the second position recognition mark F.
  • the "coordinates X1", “coordinates Y1", “coordinates X2”, and “coordinates Y2" are represented by the coordinate system from the origin of the substrate B when the type is local.
  • the data structure of the data of Fid number 1 is local, and the position recognition mark F corresponding to Fid number 1 has an X coordinate of 5 and a Y coordinate of 15. It is represented that two position recognition marks F, F and a position recognition mark F having an X coordinate of 105 and a Y coordinate of 5, are recognized (imaged).
  • the mounting positions of the 10 components C from 1 to 10 are associated with the position recognition mark F of the Fid number 1.
  • the position recognition mark F having an X coordinate of 5 and a Y coordinate of 15 and a position recognition mark F having an X coordinate of 105 and a Y coordinate of 5 for 10 mounting positions.
  • the two position recognition marks F and the position recognition mark F of the above are recognized (imaged) as a common position recognition mark F.
  • the position recognition mark F having the X coordinate of 5 and the Y coordinate of 15, and the position recognition mark F having the X coordinate of 105 and the Y coordinate of 5. Since it is possible to correct 10 mounting positions, if the position recognition mark F is set as a local fiducial, the tact time can be shortened. On the other hand, when the position recognition mark F is set as a local fiducial, when the position recognition mark F is hidden by the component C mounted on the board B, the mounting position cannot be corrected and the board B of the component C cannot be corrected. It may not be possible to attach it to.
  • the position recognition mark F may be set as a point fiducial.
  • the position coordinates of the position recognition mark F are set in a coordinate system (relative coordinate system from the mounting position) with the mounting position as the origin.
  • an individual position recognition mark F is set for each mounting position of the substrate B.
  • the position recognition mark F is set as a point fiducial by the implementation data and the fiducial data, as in the case of the local fiducial.
  • the "type” is set to the point in the fiducial data, and the "coordinates X1", “coordinates Y1", and “coordinates X2" are set.
  • "coordinates Y2" are represented by a coordinate system with the mounting position as the origin.
  • the fiducial data for example, the data structure of the data of Fid number 1 is a point, and the position recognition mark F corresponding to Fid number 1 has an X coordinate of -5 and a Y coordinate of 5. It is shown that two position recognition marks F, that is, the mark F and the position recognition mark F having an X coordinate of 5 and a Y coordinate of -5 are recognized (imaging).
  • the mounting positions of all the components C are associated with the position recognition mark F of Fid number 1.
  • the position recognition mark F for example, No.
  • the recognition mark F is recognized (imaged) as the position recognition mark F.
  • No. At the time of mounting operation of the component C on the substrate B of No. 2, No.
  • each mounting position can be corrected based on the imaging result of the individual position recognition mark F. Therefore, if the position recognition mark F is set as a point fiducial, it is mounted on the substrate B. Since the position recognition mark F is hidden by the component C, the mounting position cannot be corrected and the component C cannot be mounted on the substrate B. On the other hand, when the position recognition mark F is set as a point fiducial, it is necessary to perform the recognition operation (imaging operation) of the position recognition mark F for each mounting position, so that the tact time tends to increase.
  • the component mounting device 100 sets the position recognition mark F as a point fiducial in which the individual position recognition mark F is set for each mounting position of the board B, while setting the position recognition mark F.
  • the position recognition mark F is configured to function as a local fiduciary in which a common position recognition mark F is set for a plurality of mounting positions of the board B. ..
  • the control unit 12 has a position recognition mark that is not hidden by the component C mounted on the board B during the mounting operation of the component C on the board B.
  • F is determined as an image pickup target by the substrate imaging unit 5, and the mounting position is corrected based on the image pickup result of the position recognition mark F determined as the image pickup target by the substrate image pickup unit 5.
  • the control unit 12 sets the position recognition mark F to be imaged from the position recognition marks F corresponding to the individual board B1 including the unmounted points during the mounting operation of the component C on the board B. It is configured to give control to determine.
  • control unit 12 is configured to control for each suction group to determine the position recognition mark F to be imaged from among the position recognition marks F corresponding to the individual substrate B1 including the unmounted points. ing.
  • the position recognition mark F determined as the imaging target is shown by enclosing it in a circle.
  • the control unit 12 mounts the component C mounted on the board B at least during the retry mounting operation (during the second and subsequent mounting operations) in which the remounting operation is performed to the unmounted point due to an error. It is configured to control the position recognition mark F which is not hidden by the substrate image pickup unit 5 to determine the image pickup target. Specifically, the control unit 12 displays the position recognition mark F that is not hidden by the component C mounted on the board B not only during the retry mounting operation but also during the normal mounting operation (during the first mounting operation). It is configured to control the substrate image pickup unit 5 to determine the image pickup target. The control unit 12 is configured to sequentially determine the position recognition mark F, which is not hidden by the component C mounted on the substrate B, as an image pickup target by the substrate image pickup unit 5 during the normal mounting operation and the retry mounting operation. Has been done.
  • the control unit 12 recognizes two positions from the plurality of position recognition marks F corresponding to the plurality of unmounted points. It is configured to control the mark F to be determined as an image pickup target by the substrate image pickup unit 5. Specifically, the control unit 12 controls to determine the two farthest position recognition marks F from the plurality of position recognition marks F corresponding to the plurality of unmounted points as the image pickup target by the substrate image pickup unit 5. It is configured to do. Further, the control unit 12 sets the two farthest position recognition marks F from the plurality of position recognition marks F corresponding to the plurality of unmounted points in the substrate imaging unit 5 during the normal mounting operation and the retry mounting operation. It is configured to perform control to determine the image pickup target by.
  • the component is attached to the 10 mounting positions (individual substrate B1) in the first stage.
  • the mounting operation of C on the substrate B is performed.
  • the two farthest position recognition marks F are out of the 20 position recognition marks F corresponding to the 10 mounting positions (individual piece substrate B1) in the first stage where the component C is to be mounted.
  • the position recognition mark F of the image pickup target is imaged by the substrate imaging unit 5.
  • the 10 mounting positions of the first stage are corrected, and the 10 mounting positions of the first stage (individual piece substrate B1) are corrected. ) Is mounted with component C.
  • the component C cannot be mounted at the two mounting positions (the third and seventh mounting positions from the left in the first stage in FIG. 5) due to an error such as a suction error.
  • the component C is mounted on the substrate B with respect to the 10 mounting positions (individual piece substrate B1) of the second stage.
  • the operation is performed.
  • the two farthest position recognition marks F are out of the 20 position recognition marks F corresponding to the 10 mounting positions (individual piece substrate B1) in the second stage where the component C is to be mounted.
  • the position recognition mark F of the image pickup target is imaged by the substrate imaging unit 5.
  • the 10 mounting positions of the second stage are corrected, and the 10 mounting positions of the second stage (individual piece substrate B1) are corrected. ) Is mounted with component C.
  • the component C is mounted on the substrate B with respect to the 10 mounting positions (individual piece substrate B1) of the third stage.
  • the operation is performed.
  • the two farthest position recognition marks F are out of the 20 position recognition marks F corresponding to the 10 mounting positions (individual piece substrate B1) in the third stage where the component C is to be mounted.
  • the position recognition mark F of the image pickup target is imaged by the substrate imaging unit 5.
  • the 10 mounting positions of the third stage are corrected, and the 10 mounting positions of the third stage (individual piece substrate B1) are corrected. ) Is mounted with component C.
  • the component C is mounted on the substrate B with respect to the 10 mounting positions (individual piece substrate B1) in the fourth stage.
  • the operation is performed.
  • the two farthest position recognition marks F are out of the 20 position recognition marks F corresponding to the 10 mounting positions (individual piece substrate B1) in the fourth stage where the component C is to be mounted.
  • the position recognition mark F of the image pickup target is imaged by the substrate imaging unit 5.
  • the 10 mounting positions of the 4th stage are corrected, and the 10 mounting positions of the 4th stage (individual piece substrate B1) are corrected. ) Is mounted with component C.
  • the component C cannot be mounted at one mounting position (the ninth mounting position from the left in the fourth stage in FIG. 5) due to an error such as a suction error.
  • the mounting operation of the component C in the fifth suction group on the substrate B (retry mounting operation)
  • the component C was not mounted due to an error during the mounting operation of the component C in the first suction group on the substrate B.
  • the mounting operation of the component C on the board B is performed at the two mounting positions (individual board B1) of the first stage, which are the third and the seventh from the left.
  • the farthest 2 from the four position recognition marks F corresponding to the two mounting positions (individual piece substrate B1) of the third and seventh from the left in the first stage where the component C is to be mounted.
  • One position recognition mark F is determined as the position recognition mark F of the image pickup target by the substrate imaging unit 5.
  • the position recognition mark F determined as the image pickup target is imaged by the substrate imaging unit 5. Then, based on the imaging results of the two position recognition marks F by the substrate imaging unit 5, the two mounting positions of the first stage from the left, the third and the seventh, are corrected, and the first stage is 3 from the left.
  • the component C is mounted on the second and seventh mounting positions (individual board B1).
  • the mounting operation of the component C of the sixth suction group on the substrate B (retry mounting operation)
  • the component C was not mounted due to an error during the mounting operation of the component C of the fourth suction group on the substrate B.
  • the mounting operation of the component C on the board B is performed at the 9th mounting position (individual piece board B1) from the left in the 4th stage.
  • the two position recognition marks F corresponding to one mounting position (individual piece substrate B1), which is the ninth from the left in the fourth stage where the component C is to be mounted are the positions to be imaged by the substrate imaging unit 5. It is determined as the recognition mark F.
  • the position recognition mark F determined as the image pickup target is imaged by the substrate imaging unit 5.
  • the mounting position (individual substrate B1) is corrected while the 9th mounting position from the left of the 4th stage is corrected.
  • the component C is mounted.
  • the mounting operation may be performed within one adsorption group.
  • 6 corresponding to the three mounting positions of the third and seventh mounting positions from the left of the first stage (individual board B1) and the one mounting position of the ninth from the left of the fourth stage.
  • the two farthest position recognition marks F are determined as the position recognition marks F to be imaged by the substrate imaging unit 5.
  • the retry mounting operation is not performed after all the normal mounting operations are completed, but may be performed in the suction group next to the suction group in which the component C is not mounted due to an error during the normal mounting operation.
  • step S1 the substrate B is carried in.
  • step S2 the adsorption group is determined.
  • step S3 the component C in the suction group is sucked by the suction nozzle of the mounting head 3a.
  • step S4 the component C sucked by the suction nozzle of the mounting head 3a is imaged by the fixed imaging unit 9. Further, in step S4, the state of the component C sucked by the suction nozzle of the mounting head 3a is recognized based on the image pickup result of the component C by the fixed imaging unit 9.
  • step S5 the mark recognition process is performed.
  • the processes of steps S11 to S15 shown in FIG. 8 are performed.
  • step S11 the two farthest unmounted mounting positions (unmounted points) in the adsorption group are extracted (detected).
  • the two farthest unmounted mounting positions (unmounted points) in the adsorption group are extracted (detected).
  • the first and tenth unmounted mounting positions from the left (unmounted points). Unmounted points) are extracted (detected).
  • step S12 of the two farthest position recognition marks F corresponding to the two farthest unmounted mounting positions in the adsorption group, the two farthest position recognition marks F are extracted (detected).
  • the two farthest position recognition marks F out of the four position recognition marks F corresponding to the two unmounted positions of the first and tenth from the left. Is extracted (detected).
  • one unmounted mounting position is used instead of the processes of steps S11 and S12.
  • the process of extracting (detecting) the two position recognition marks F corresponding to the positions may be performed.
  • step S13 the first position recognition mark F is imaged by the substrate imaging unit 5. Further, in step S13, the position recognition mark F is recognized based on the image pickup result of the first position recognition mark F by the substrate imaging unit 5.
  • step S14 the second position recognition mark F is imaged by the substrate imaging unit 5. Further, in step S14, the position recognition mark F is recognized based on the image pickup result of the second position recognition mark F by the substrate imaging unit 5.
  • step S15 the correction amount of the mounting position is acquired based on the recognition results of the two position recognition marks F, and the mounting position is corrected by the acquired correction amount. Then, the mark recognition process is completed, and the process proceeds to step S6 shown in FIG. 7.
  • step S7 it is determined whether or not all the components C have been mounted on the substrate B. If it is determined that the mounting of all the components C on the board B has not been completed, the process proceeds to step S2. Then, the processes of steps S2 to S6 are repeated. As a result, the normal mounting operation and the retry mounting operation are performed. If there is no unimplemented due to an error, the retry mounting operation is not performed. If it is determined that the mounting of all the components C on the substrate B is completed, the process proceeds to step S8.
  • step S8 the substrate B on which the component C is mounted is carried out. Then, the component mounting process is completed.
  • step S21 the mounting head 3a (mounting head 3a holding the component C) in the suction group is extracted (detected).
  • the mounting head 3a mounting head 3a holding the component C
  • the suction group is extracted (detected).
  • ten mounting heads 3a are extracted (detected) as the mounting heads 3a in the suction group.
  • step S22 the coordinates are initialized.
  • the left end registered coordinates are set to + ⁇ and the right end registered coordinates are set to ⁇ , so that the coordinates are initialized.
  • step S23 the head loop processing is started.
  • the processing in the head loop is repeated for the number of mounting heads 3a extracted in step S21. For example, if the number of mounting heads 3a extracted in step S21 is 10, the processing in the head loop is repeated 10 times.
  • step S24 it is determined whether or not the mounting coordinates by the mounting head 3a are smaller than the leftmost registered coordinates. If it is determined that the mounting coordinates by the mounting head 3a are smaller than the leftmost registered coordinates, the process proceeds to step S25.
  • step S25 the leftmost registered coordinates are updated to the compared mounting coordinates, and the process proceeds to step S26.
  • step S24 If it is determined in step S24 that the mounting coordinates by the mounting head 3a are not smaller than the leftmost registered coordinates, the leftmost registered coordinates are not updated and the process proceeds to step S26.
  • step S26 it is determined whether or not the mounting coordinates by the mounting head 3a are larger than the rightmost registered coordinates. If it is determined that the mounting coordinates by the mounting head 3a are larger than the rightmost registered coordinates, the process proceeds to step S27.
  • step S27 the rightmost registered coordinates are updated to the compared mounting coordinates, and the process proceeds to the next loop or step S28.
  • step S26 If it is determined in step S26 that the mounting coordinates by the mounting head 3a are not larger than the rightmost registered coordinates, the rightmost registered coordinates are not updated and the process proceeds to the next loop or step S28.
  • step S21 if the processing in the head loop is not repeated by the number of mounting heads 3a extracted in step S21, the process proceeds to the next loop. If the processing in the head loop is repeated for the number of mounting heads 3a extracted in step S21, the process proceeds to step S28.
  • the leftmost mounting coordinate in the adsorption group is registered in the left end registration coordinate
  • the rightmost mounting coordinate in the adsorption group is registered in the right end registration coordinate.
  • step S28 the position of the position recognition mark F of the left end coordinates corresponding to the left end registered coordinates is acquired.
  • step S29 the position recognition mark F at the left end coordinate is imaged by the substrate imaging unit 5. Further, in step S29, the position recognition mark F is recognized based on the image pickup result of the position recognition mark F at the left end coordinate by the substrate imaging unit 5.
  • step S30 the position of the position recognition mark F of the right end coordinates corresponding to the right end registered coordinates is acquired.
  • the process of step S30 may be performed before the process of step S29.
  • step S31 the position recognition mark F at the right end coordinate is imaged by the substrate imaging unit 5. Further, in step S31, the position recognition mark F is recognized based on the image pickup result of the position recognition mark F of the right end coordinates by the substrate imaging unit 5.
  • step S32 the correction amount of the mounting position is acquired based on the recognition result of the two position recognition marks F of the left end coordinate and the right end coordinate, and the mounting position is corrected by the acquired correction amount. Then, the mark recognition process is completed, and the process proceeds to step S6 shown in FIG. 7. Subsequent processing is as described above.
  • FIG. 9 shows an example in which the position recognition mark F is determined based on the left end registration coordinates and the right end registration coordinates (that is, the distance in the left-right direction), but the upper end registration coordinates and the lower end registration coordinates (that is, the vertical direction) are shown.
  • the position recognition mark F may be determined based on the distance). Further, the position recognition mark F may be determined based on the distance in the diagonal direction.
  • the position recognition mark F not hidden by the component C mounted on the substrate B is determined as an image pickup target by the substrate imaging unit 5.
  • a control unit 12 that corrects the mounting position is provided based on the image pickup result of the substrate image pickup unit 5 of the position recognition mark F determined as the image pickup target.
  • the position recognition mark F which is not hidden by the component C mounted on the substrate B is determined as an image pickup target by the substrate imaging unit 5, so that the component C can be mounted on the substrate B. Since the position recognition mark F can be placed even at a position hidden by the implementation of, the degree of freedom in the placement of the position recognition mark F can be increased.
  • the substrate B includes a plurality of individual substrate B1s each provided with the position recognition mark F
  • the control unit 12 is in the process of mounting the component C on the substrate B.
  • the position recognition mark F corresponding to the individual substrate B1 including the non-mounting point is controlled to determine the position recognition mark F to be imaged.
  • the mounting position is corrected because the position recognition mark F is hidden by the component C mounted on the board B. It is possible to prevent the component C from being unable to be mounted on the substrate B without being able to do so. Further, by determining the position recognition mark F to be imaged from the position recognition marks F corresponding to the individual substrate B1 including the unmounted points, the position recognition marks not hidden by the component C mounted on the board B. F can be easily determined as an image pickup target by the substrate image pickup unit 5.
  • the control unit 12 is at least in a position not hidden by the component C mounted on the board B during the retry mounting operation in which the remounting operation is performed to the unmounted point due to an error. It is configured to control the recognition mark F to be determined as an image pickup target by the substrate imaging unit 5. As a result, the position recognition mark F is hidden by the component C mounted on the board B during the retry mounting operation in which the position recognition mark F is likely to be hidden by the component C mounted on the board B. It is possible to prevent the component C from being unable to be mounted on the substrate B because the mounting position cannot be corrected.
  • the control unit 12 carries the position recognition mark F which is not hidden by the component C mounted on the board B not only during the retry mounting operation but also during the normal mounting operation. It is configured to control the image pickup unit 5 to determine the image pickup target. As a result, the same position recognition mark F can be recognized both during the normal mounting operation and the retry mounting operation. Therefore, the position recognition mark F different from each other during the normal mounting operation and the retry mounting operation can be performed. It is possible to suppress the complicated recognition operation of the position recognition mark F as compared with the case of performing the recognition operation of.
  • the control unit 12 captures two position recognition marks F from the plurality of position recognition marks F corresponding to the plurality of unmounted points by the substrate imaging unit 5. It is configured to perform control to determine as. As a result, from among the plurality of position recognition marks F corresponding to the plurality of unmounted points, the two position recognition marks F are determined as the image pickup targets by the board image pickup unit 5, so that the component C mounted on the board B can be used. The minimum necessary position recognition mark F that is not hidden can be easily determined as an image pickup target by the substrate imaging unit 5.
  • the control unit 12 sets the two farthest position recognition marks F from the plurality of position recognition marks F corresponding to the plurality of unmounted points to the substrate imaging unit 5. It is configured to perform control to determine the image pickup target by.
  • the mounting position can be corrected based on the imaging results of the two farthest position recognition marks F, so that data can be obtained for the unmounted point between the two farthest position recognition marks F.
  • the mounting position can be corrected by the extrapolation correction that obtains the numerical value inside the data range, which is more accurate than the extrapolation correction, instead of the extrapolation correction that obtains the numerical value outside the range of. As a result, the mounting position can be corrected more accurately than in the case where the position recognition mark F other than the two farthest position recognition marks F is determined as the image pickup target by the substrate imaging unit 5.
  • the component mounting device 200 according to the second embodiment of the present invention is different from the component mounting device 100 according to the first embodiment in that it includes a control unit 112.
  • the control unit 112 is mounted on the substrate B in the designated area A set to include a plurality of mounting positions (individual piece substrate B1).
  • the position recognition mark F that is not hidden by the component C is determined as an image pickup target by the substrate imaging unit 5, and is in the designated area A based on the image pickup result of the position recognition mark F determined as the image pickup target by the substrate image pickup unit 5. It is configured to correct the mounting position.
  • the designated area A indicates an area (correction limiting area) that can be corrected by the same position recognition mark F.
  • the size of the designated area A is determined in advance, for example, by the user's designation.
  • the component is attached to the 10 mounting positions (individual piece substrate B1) of the first stage.
  • the mounting operation of C on the substrate B is performed.
  • a designated area A (designated area A on the left side) including 10 mounting positions (individual piece board B1) with the first to fifth mounting positions (individual piece board B1) is set.
  • the designated area A on the left side does not include the five mounting positions (individual board B1) from the left to the sixth to tenth from the left in the first stage where the component C is to be mounted
  • the designated area A on the left side is designated.
  • a designated area A different from the area A is further set. That is, the five mounting positions (individual piece substrate B1) from the left of the first stage where the component C is to be mounted and the second stage from the left where the component C is not yet mounted are six.
  • a designated area A (designated area A on the right side) including 10 mounting positions (individual piece board B1) with the 5th to 10th mounting positions (individual piece board B1) is set.
  • the two farthest position recognition marks F are the substrate imaging unit 5. It is determined as the position recognition mark F of the image pickup target by. Further, out of the 20 position recognition marks F corresponding to the 10 mounting positions (individual piece substrate B1) in the designated area A on the right side, the two farthest position recognition marks F are the substrate imaging unit 5. It is determined as the position recognition mark F of the image pickup target. Then, the position recognition mark F determined as the image pickup target is imaged by the substrate imaging unit 5.
  • the five mounting positions from the left of the first stage in the designated area A on the left side are set. While the correction is performed, the component C is mounted on the five mounting positions (individual piece substrate B1) of the first stage from the left in the designated area A on the left side. Further, based on the imaging results of the two position recognition marks F in the designated area A on the right side by the substrate imaging unit 5, the five mounting positions of the first stage in the designated area A on the right side from the left to the sixth to tenth. While the correction is performed, the component C is mounted on the five mounting positions (individual piece substrate B1) of the first stage from the left in the designated area A on the right side. At this time, the component C is not mounted at the first to tenth mounting positions from the left in the second stage.
  • the component C is mounted on the substrate B with respect to the 10 mounting positions (individual piece substrate B1) of the second stage.
  • the operation is performed.
  • the position recognition mark F is recognized (imaging) during the mounting operation of the component C of the first suction group on the substrate B, the position recognition mark F is not recognized (imaging).
  • the substrate image pickup unit 5 acquired during the mounting operation of the component C of the first suction group on the substrate B, the inside of the left designated area A.
  • the 5 mounting positions from the 1st to the 5th from the left in the 2nd stage are corrected, the 5 mounting positions (individual pieces) from the 1st to the 5th from the left in the 2nd stage in the designated area A on the left side are corrected.
  • the component C is mounted on the board B1). Further, based on the imaging results of the two position recognition marks F in the designated area A on the right side acquired by the substrate imaging unit 5 during the mounting operation of the component C of the first suction group on the substrate B, the designated area A on the right side is formed. The 5th mounting position (6th to 10th from the left) in the designated area A on the right side is corrected while the 5th mounting position from the left of the 2nd stage is corrected.
  • the component C is mounted on the board B1).
  • the component C is mounted on the substrate B with respect to the 10 mounting positions (individual piece substrate B1) of the third stage.
  • the operation is performed.
  • a designated area A (designated area A on the left side) including 10 mounting positions (individual piece board B1) with the first to fifth mounting positions (individual piece board B1) is set.
  • a designated area A (designated area A on the right side) including 10 mounting positions (individual piece board B1) with the 5th to 10th mounting positions (individual piece board B1) is set.
  • the two farthest position recognition marks F are the substrate imaging unit 5. It is determined as the position recognition mark F of the image pickup target by. Further, out of the 20 position recognition marks F corresponding to the 10 mounting positions (individual piece substrate B1) in the designated area A on the right side, the two farthest position recognition marks F are the substrate imaging unit 5. It is determined as the position recognition mark F of the image pickup target. Then, the position recognition mark F determined as the image pickup target is imaged by the substrate imaging unit 5.
  • the component C is mounted on the five mounting positions (individual piece substrate B1) of the third stage from the left in the designated area A on the right side. At this time, the component C is not mounted at the first to tenth mounting positions from the left in the fourth stage. Further, at this time, it is assumed that the component C cannot be mounted at the two mounting positions (the third and tenth mounting positions from the left in the third stage in FIG. 10) due to an error such as a suction error.
  • the mounting operation normal mounting operation
  • the component C is mounted on the substrate B with respect to the 10 mounting positions (individual piece substrate B1) in the fourth stage.
  • the operation is performed.
  • the position recognition mark F is recognized (imaging) during the mounting operation of the component C of the third suction group on the substrate B, the position recognition mark F is not recognized (imaging).
  • the left designated area A While the 5 mounting positions from the left of the 4th stage are corrected, the 5 mounting positions (individual pieces) of the 1st to 5th from the left of the 4th stage in the designated area A on the left side are corrected.
  • the component C is mounted on the board B1). Further, based on the imaging results of the two position recognition marks F in the designated area A on the right side acquired by the substrate imaging unit 5 during the mounting operation of the component C of the third suction group on the substrate B, the designated area A on the right side is formed.
  • the component C is mounted on the board B1). At this time, it is assumed that the component C cannot be mounted at the two mounting positions (the second and eighth mounting positions from the left in the fourth stage in FIG. 10) due to an error such as a suction error.
  • the component C is not mounted due to an error during the mounting operation of the component C in the 3rd and 4th suction groups on the substrate B.
  • the mounting operation of the component C on the board B is performed for the four mounting positions (individual board B1). In this case, the third mounting position from the left (individual piece board B1) in the third stage where the component C is to be mounted and the second mounting position from the left in the fourth stage (individual piece board B1).
  • the designated area A (designated area A on the left side) including the two mounting positions (individual board B1) are set. Further, in the designated area A on the left side, one mounting position (individual piece substrate B1), which is the tenth from the left in the third stage where the component C is to be mounted, and one, which is the eighth from the left in the fourth stage. Since the two mounting positions (individual piece board B1) and the mounting position (individual piece board B1) are not included, a designated area A different from the designated area A on the left side is further set. That is, the tenth mounting position from the left (individual piece board B1) in the third stage where the component C is to be mounted and the eighth mounting position (individual piece board B1) from the left in the fourth stage. A designated area A (designated area A on the right side) including the two mounting positions (individual board B1) is set.
  • the two farthest position recognition marks F are imaged by the substrate image pickup unit 5. It is determined as the position recognition mark F of the target. Further, of the four position recognition marks F corresponding to the two mounting positions (individual piece substrate B1) in the designated area A on the right side, the two farthest position recognition marks F are the imaging targets by the substrate imaging unit 5. It is determined as the position recognition mark F of. Then, the position recognition mark F determined as the image pickup target is imaged by the substrate imaging unit 5.
  • the mounting position of the third stage from the left in the designated area A on the left side and one mounting position is the third from the left in the third stage.
  • the component C is mounted at two mounting positions (individual piece board B1), that is, the board B1) and one mounting position (individual piece board B1) that is the second from the left in the fourth stage.
  • the component C is mounted on two mounting positions (individual board B1), one on the board B1) and the eighth mounting position from the left on the fourth stage (individual board B1).
  • the designated area A is set during the mounting operation of the component C on the board B.
  • the method for setting the designated area A is not particularly limited, but for example, as shown in FIG. 11, the control unit 112 includes the largest number of unmounted points during the mounting operation of the component C on the board B. Is configured to control the setting of the designated area A.
  • control unit 112 is configured to perform control to extract (detect) unmounted points in the adsorption group. Then, the control unit 112 is configured to control to detect the position of the designated area A including the largest number of unmounted points by applying the rectangular designated area A to each of the extracted unmounted points. Has been done. Specifically, the control unit 112 arranges the unmounted points in each of the four corners of the designated area A of the rectangle for each of the extracted unmounted points, so that the most unmounted points are obtained. It is configured to control to detect the position of the included designated area A.
  • the rectangular designated area A is applied to the unmounted point of A.
  • the unmounted points in the rectangular designated area A in the state where the unmounted points of A are arranged at each of the four corners of the lower right, lower left, upper right, and upper left of the rectangular designated area A.
  • the number is detected.
  • the unmounted points of A when the unmounted points of A are arranged in the lower right corner of the designated area A of the rectangle, the number of unmounted points in the designated area A of the rectangle is three, which is the maximum.
  • the fitting process of the designated area A of the rectangle is similarly performed for each of the unmounted points B to E. As a result, in the example shown in FIG.
  • step S41 an unmounted mounting position (unmounted point) is extracted (detected) in the adsorption group.
  • step S42 it is determined whether or not there is an unassigned point of the correction group among the extracted unimplemented points. That is, in step S42, it is determined whether or not there is a point in which the designated area A is not set among the extracted unmounted points. If it is determined that there is an unallocated point in the correction group, the process proceeds to step S43.
  • step S43 the designated area A is set so that the most unmounted points are included in the correction group unallocated points. Then, the process proceeds to step S42. After that, the processes of steps S42 and 43 are repeated until there are no correction group unassigned points in the extracted unmounted points.
  • step S42 when it is determined that there is no unallocated point of the correction group, the designated area setting process is terminated.
  • the control unit 112 provides the position recognition mark F which is not hidden by the component C mounted on the board B in the designated area A set to include a plurality of mounting positions. It is configured to be determined as an image pickup target by the substrate image pickup unit 5 and to correct the mounting position in the designated area A based on the image pickup result of the position recognition mark F determined as the image pickup target by the substrate image pickup unit 5. There is. As a result, the position recognition marks F of the imaging target can be determined in a relatively narrow range within the designated area A, so that it is possible to suppress the determination of the position recognition marks F that are excessively distant from each other as the imaging target. Can be done. As a result, the mounting position can be corrected with high accuracy based on the image pickup result of the position recognition mark F relatively close to the mounting position.
  • control unit 112 controls to set the designated area A so that the most unmounted points are included in the mounting operation of the component C on the substrate B. It is configured as follows. As a result, many unmounted points can be included in the designated area A, so that even when the designated area A is provided, it is possible to suppress an increase in the number of imaging operations of the position recognition mark F by the substrate imaging unit 5. be able to.
  • the present invention is not limited to this.
  • the present invention may be applied to a component mounting device other than a flip chip bonder.
  • the present invention may be applied to a component mounting device (so-called surface mounter) for mounting a chip component for surface mounting on a substrate.
  • control for determining the position recognition mark that is not hidden by the components mounted on the substrate as the image pickup target by the imaging unit is performed not only during the retry mounting operation but also during the normal mounting operation.
  • control may be performed to determine the position recognition mark that is not hidden by the components mounted on the substrate as the image pickup target by the image pickup unit only during the retry mounting operation.
  • first and second embodiments an example is shown in which two position recognition marks are determined as imaging targets by the imaging unit from among a plurality of position recognition marks corresponding to a plurality of unmounted points.
  • the invention is not limited to this.
  • one or three or more position recognition marks may be determined as the image pickup target by the imaging unit from among the plurality of position recognition marks corresponding to the plurality of unmounted points.
  • the two farthest position recognition marks are determined as the image pickup target by the image pickup unit from the plurality of position recognition marks corresponding to the plurality of unmounted points.
  • the present invention is not limited to this.
  • the position recognition marks other than the two farthest position recognition marks may be determined as the image pickup target by the imaging unit.
  • the substrate is a substrate including a plurality of individual pieces, but the present invention is not limited to this.
  • the substrate may be a substrate on which a plurality of the same components are repeatedly mounted, such as an LED substrate.
  • the electric circuit pattern of each of the plurality of components provided on the substrate is used as the position recognition mark.
  • the electric circuit pattern as the position recognition mark not hidden by the component mounted on the board is determined as the image pickup target by the imaging unit, and the position recognition determined as the image pickup target is determined. It is possible to correct the mounting position based on the image pickup result by the image pickup unit of the electric circuit pattern as a mark.
  • the electric circuit pattern may be used as a position recognition mark.
  • the shape of the lead frame may be used as a position recognition mark.
  • the substrate B is a lead frame in which a plurality of (three) individual substrate B2s are connected to each other by a connecting portion B21 in which perforated slits are formed and can be divided. ..
  • Each of the plurality of individual substrate B2 includes a plurality of mounting positions.
  • a position recognition mark (electric circuit pattern, etc.) that is not hidden by the components mounted on the board B is generated by the board image pickup unit. It is determined as an image pickup target, and the mounting position in the designated area A1 is corrected based on the image pickup result by the substrate imaging unit of the position recognition mark determined as the image pickup target. That is, the position recognition mark beyond the connecting portion B21 in which the perforated slit is formed is not used for the correction, and the position recognition mark in the designated area A1 not exceeding the connecting portion B21 is used for the correction.
  • control processing has been described using a flow-driven flow in which the control processing is sequentially performed along the processing flow, but the present invention is not limited to this.
  • the control process may be performed by an event-driven type (event-driven type) process in which the process is executed in event units. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un appareil de montage de composant (100) comprenant : une tête de montage (3a) pour le montage d'un composant (C) sur un substrat (B) ; une unité d'imagerie (5) pour l'imagerie d'une marque de reconnaissance de position (F) sur le substrat ; et une unité de commande (12) permetttant, au cours d'une opération de montage du composant sur le substrat, de déterminer un repère de reconnaissance de position non caché par le composant monté sur le substrat en tant qu'objet pour imagerie par l'unité d'imagerie, et corrige une position de montage sur la base d'un résultat d'imagerie par l'unité d'imagerie du repère de reconnaissance de position déterminé en tant qu'objet pour l'imagerie.
PCT/JP2020/048044 2020-12-22 2020-12-22 Appareil de montage de composant et procédé de montage de composant WO2022137363A1 (fr)

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KR1020237020895A KR20230110330A (ko) 2020-12-22 2020-12-22 부품 실장 장치 및 부품 실장 방법
DE112020007760.8T DE112020007760T5 (de) 2020-12-22 2020-12-22 Bauelementmontagevorrichtung und Bauelementmontageverfahren
JP2022570834A JPWO2022137363A1 (fr) 2020-12-22 2020-12-22
CN202080107951.2A CN116636321A (zh) 2020-12-22 2020-12-22 部件安装装置及部件安装方法
PCT/JP2020/048044 WO2022137363A1 (fr) 2020-12-22 2020-12-22 Appareil de montage de composant et procédé de montage de composant

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WO2022137363A1 true WO2022137363A1 (fr) 2022-06-30

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04340799A (ja) * 1991-05-17 1992-11-27 Mitsubishi Electric Corp プリント基板及びその位置補正装置
JP2004071625A (ja) * 2002-08-01 2004-03-04 Matsushita Electric Ind Co Ltd 部品装着用認識マーク認識装置及び方法
JP2009170516A (ja) * 2008-01-11 2009-07-30 Yamaha Motor Co Ltd 表面実装機、及び電子部品実装方法
JP2011029254A (ja) * 2009-07-22 2011-02-10 Panasonic Corp 電子部品実装方法
JP2013058605A (ja) * 2011-09-08 2013-03-28 Fuji Mach Mfg Co Ltd 電子部品実装機および電子部品実装方法
JP2016025266A (ja) * 2014-07-23 2016-02-08 富士機械製造株式会社 実装装置及び実装方法
JP2016134426A (ja) * 2015-01-16 2016-07-25 富士機械製造株式会社 部品実装機の部品装着方法
WO2017081773A1 (fr) * 2015-11-11 2017-05-18 富士機械製造株式会社 Dispositif de traitement d'image et procédé de traitement d'image pour plaque de base

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4220288B2 (ja) 2003-04-01 2009-02-04 株式会社日立ハイテクインスツルメンツ 電子部品装着方法及び電子部品装着装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04340799A (ja) * 1991-05-17 1992-11-27 Mitsubishi Electric Corp プリント基板及びその位置補正装置
JP2004071625A (ja) * 2002-08-01 2004-03-04 Matsushita Electric Ind Co Ltd 部品装着用認識マーク認識装置及び方法
JP2009170516A (ja) * 2008-01-11 2009-07-30 Yamaha Motor Co Ltd 表面実装機、及び電子部品実装方法
JP2011029254A (ja) * 2009-07-22 2011-02-10 Panasonic Corp 電子部品実装方法
JP2013058605A (ja) * 2011-09-08 2013-03-28 Fuji Mach Mfg Co Ltd 電子部品実装機および電子部品実装方法
JP2016025266A (ja) * 2014-07-23 2016-02-08 富士機械製造株式会社 実装装置及び実装方法
JP2016134426A (ja) * 2015-01-16 2016-07-25 富士機械製造株式会社 部品実装機の部品装着方法
WO2017081773A1 (fr) * 2015-11-11 2017-05-18 富士機械製造株式会社 Dispositif de traitement d'image et procédé de traitement d'image pour plaque de base

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