WO2022124834A1 - 센서 구동 장치 - Google Patents
센서 구동 장치 Download PDFInfo
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- WO2022124834A1 WO2022124834A1 PCT/KR2021/018684 KR2021018684W WO2022124834A1 WO 2022124834 A1 WO2022124834 A1 WO 2022124834A1 KR 2021018684 W KR2021018684 W KR 2021018684W WO 2022124834 A1 WO2022124834 A1 WO 2022124834A1
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- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
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- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
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- G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
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- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
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- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0053—Driving means for the movement of one or more optical element
- G03B2205/0076—Driving means for the movement of one or more optical element using shape memory alloys
Definitions
- the embodiment relates to a sensor driving device, and more particularly, to a sensor driving device capable of relative movement with respect to a lens barrel.
- a camera device is mounted on a mobile device such as a mobile communication terminal and an MP3 player, as well as an electronic device such as an automobile, an endoscope, and a CCTV.
- a mobile device such as a mobile communication terminal and an MP3 player
- an electronic device such as an automobile, an endoscope, and a CCTV.
- Such camera devices are gradually being developed centered on high pixels, and miniaturization and thinning are in progress.
- the current camera device is being changed so that various additional functions can be implemented at a low manufacturing cost.
- the camera device as described above includes a lens barrel for accommodating a lens, a lens holder coupled to the lens barrel, an image sensor disposed in the lens holder, and a driving substrate on which the image sensor is mounted.
- the lens transmits the image signal of the subject to the image sensor.
- the image sensor converts the image signal into an electrical signal.
- the accuracy of the image signal in the camera device is determined according to a focal length defined as a distance between the lens and the image sensor.
- the camera device provides focus compensation or shake compensation by moving the lens barrel relative to the image sensor. That is, the camera device moves the lens barrel accommodating the lens relative to the image sensor in the X-axis, Y-axis, and Z-axis.
- the camera device required at least six elastic members such as springs to relatively move the lens barrel.
- each of the elastic members was coupled to the lens barrel by the same method as bonding.
- the camera device includes an upper spring plate disposed on the upper portion of the lens barrel, a lower spring plate disposed on the lower portion of the lens barrel, and an elastic wire for fixing the Z-axis as the lens barrel moves relative to each other. It is composed of a structure such as (elastic wire), and accordingly, there is a problem in that the module structure of the camera device is complicated.
- the camera device requires a plurality of elastic members to move the lens barrel, and there is a problem in that the number of times for assembling the plurality of elastic members increases.
- the embodiment provides a sensor driving device capable of not only moving the X-axis, the Y-axis and the Z-axis, but also performing tilt correction.
- a substrate capable of simplifying a spring structure for providing an auto-focus function or a camera shake compensation function, a sensor driving device, and a camera module including the same.
- a sensor driving apparatus includes: a fixing unit including a first lead pattern unit and a first substrate on which a first pad is formed; a moving unit spaced apart from the fixed unit and including a sensor; and a wire part disposed between the moving part and the fixed part, wherein the wire part has both ends connected to the first pad, and a first wire part of a shape memory alloy for moving the moving part with respect to the fixed part; and a second wire unit having one end connected to the first lead pattern unit and the other end connected to the moving unit to elastically support the moving unit.
- the moving part includes a second substrate on which the sensor is disposed, and the second substrate includes a hinge part to which the first wire part is coupled.
- first wire portion is configured in plurality
- hinge portion is configured in plurality to correspond to the number of the first wire portion
- the upper surface of the second substrate includes a plurality of first regions corresponding to corner regions and a plurality of second regions between the plurality of first regions, and the hinge portion is a first region disposed in the first region. It includes a first hinge part and a second hinge part disposed in the second area.
- the first wire unit may include a first group of first wire units coupled to the first hinge unit and a second group of second wire units coupled with the second hinge unit.
- first wire part of the first group rotates the second substrate on which the sensor is disposed about an optical axis
- second wire part of the second group connects the second substrate on which the sensor is disposed with the optical axis. move in the vertical direction.
- the moving unit includes a third substrate connected to the second substrate, and the third substrate includes an opening in which the second substrate is disposed.
- the third substrate includes a second lead pattern portion, and the other end of the second wire portion is connected to one end of the second lead pattern portion.
- the second substrate includes a second pad, and the other end of the second lead pattern part is connected to the second pad.
- the second wire part electrically connects the first substrate and the second substrate.
- the second wire unit transmits the image signal acquired through the sensor unit to the first substrate.
- the second lead pattern part includes a body part, a coupling part coupled to the other end of the second wire part, and a connection part connecting the body part and the coupling part.
- the first lead pattern part includes a plurality of first lead patterns
- the second lead pattern part includes a plurality of second lead patterns
- the second wire part includes a plurality of second wires
- the plurality of The number of second wires is equal to or less than the number of the plurality of first lead patterns and the number of each of the plurality of second lead patterns.
- the third substrate includes an insulating layer on which the second lead pattern part is disposed, and the second lead pattern part has one end connected to the second wire unit and the other end connected to the second pad for the insulation.
- the layer does not overlap in the optical axis direction.
- the connecting portion of the second lead pattern portion includes a bent region.
- the sensor driving device includes a holder disposed between the second substrate and the third substrate, and the holder has a hole through which the second wire part passes.
- the image sensor in order to implement the OIS and AF functions of the camera module, is relatively moved in the X-axis, Y-axis, and Z-axis directions with respect to the lens barrel instead of moving the conventional lens barrel. Accordingly, the camera module according to the embodiment may remove a complicated spring structure for implementing the OIS and AF functions, and thus the structure may be simplified. In addition, by moving the image sensor according to the embodiment relative to the lens barrel, it is possible to form a stable structure compared to the conventional one.
- the second substrate to which the image sensor is attached is relatively moved with respect to the first substrate by using a wire made of a shape memory alloy. According to this, in the embodiment, it is possible to remove parts such as a magnet or a coil required for the OIS operation, thereby reducing the product cost. In addition, according to the embodiment, the overall thickness of the camera module may be slimmed by removing the above components. In addition, according to an embodiment, a shape memory alloy wire is used for the driving part for the OIS operation, and thus magnetic field interference with the AF module can be completely resolved.
- the terminal part electrically connected to the image sensor has a spring structure, and floats and is disposed in a position that does not overlap in the vertical direction with the insulating layer. Accordingly, the camera module may move the image sensor with respect to the lens barrel while stably elastically supporting the image sensor.
- the X-axis direction shift, Y-axis direction shift, and Z-axis rotation corresponding to hand shake may be performed with respect to the image sensor.
- For hand-shake correction may be performed together, and through this, a more improved hand-shake correction function may be provided.
- FIG. 1 is a view showing a camera module according to a comparative example.
- FIG 2 is a perspective view of a camera device according to the present embodiment.
- FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2 .
- FIG 4 is an exploded perspective view of the camera device according to the present embodiment.
- FIG. 5 is an exploded perspective view of the first actuator shown in FIG. 4 .
- FIG. 6A is a plan view of the base of FIG. 5 .
- FIG. 6B is a plan view of the first actuator of FIG. 5 .
- FIG. 6C is a bottom view of the first actuator of FIG. 5 .
- FIG. 7 is an exploded perspective view of a second actuator according to an embodiment.
- FIG. 8 is an exploded perspective view of a fixing part according to an embodiment.
- FIG. 9 is a plan view of the first substrate of FIG. 8 .
- FIG. 10 is a view illustrating a coupling of a first substrate and a first wire portion of a shape memory alloy according to an embodiment of the present invention.
- FIG. 11 is a view showing the upper surface of the first substrate in more detail.
- FIG. 12 is an exploded perspective view of a moving part according to an embodiment.
- FIG. 13 is a plan view of the second substrate of FIG. 12 .
- FIG. 14 is a diagram illustrating a coupling between a second substrate and a shape memory alloy wire in the embodiment.
- 15 is a bottom view of a second substrate in the embodiment.
- FIG. 16 is an exploded perspective view of a third substrate according to the embodiment.
- 17 is a plan view of a third substrate according to an embodiment.
- FIG. 18 is an enlarged view of a specific area of FIG. 17 .
- 19 is a coupling view of a second substrate and a third substrate
- 20 is a perspective view of an optical device according to the present embodiment.
- FIG. 21 is a block diagram of the optical device shown in FIG. 20 .
- the technical spirit of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of the components may be selected between the embodiments. It can be used by combining or substituted with .
- the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "at least one (or more than one) of A and (and) B, C", it can be combined with A, B, and C. It may contain one or more of all possible combinations.
- terms such as first, second, A, B, (a), (b), etc. may be used.
- top (above) or under (below) is one as well as when two components are in direct contact with each other. Also includes a case in which another component as described above is formed or disposed between two components.
- upper (upper) or lower (lower) when expressed as "upper (upper) or lower (lower)", the meaning of not only an upper direction but also a lower direction based on one component may be included.
- FIG. 1 is a view showing a camera module according to a comparative example.
- a camera module having an OIS (Optical Image Stabilizer) function and an AF (Auto Focusing) function requires at least two spring plates.
- the camera module according to the comparative example may have two spring plates.
- the camera module according to the comparative example requires an elastic member such as at least six springs in the spring plate.
- a camera module according to a comparative example includes an optical system including a lens assembly, an infrared filter unit at the other end, and a sensor unit. That is, the camera module according to the comparison includes the lens barrel 10 , the lens assembly 20 , the first elastic member 31 , the second elastic member 32 , the first housing 41 , the second housing 42 , It includes an infrared cut filter unit 50 , a sensor unit 60 , a circuit board 80 , and driving units 71 , 72 , 73 , and 74 .
- the lens barrel 10 is connected to the first housing 41 . That is, the lens barrel 10 is connected to the first housing 41 through the first elastic member 31 . That is, the lens barrel 10 is movably connected to the first housing 41 by the first elastic member 31 .
- the first elastic member 31 includes a plurality of springs (not shown).
- the first elastic member 31 connects between the lens barrel 10 and the first housing 41 at a plurality of points of the lens barrel 10 .
- the second elastic member 32 is connected to the first housing 41 and a second housing 42 accommodating the first housing 41 .
- the second elastic member 32 movably fixes the first housing 41 to the second housing 42 .
- the second elastic member 32 includes a plurality of springs.
- the second elastic member 32 includes a plate spring.
- the first elastic member 31 supports the lens barrel 10 and relatively moves the lens barrel 10 in a vertical direction (Z-axis direction) with respect to the sensor unit 60 .
- the first elastic member 31 includes at least four or more springs.
- the second elastic member 32 while supporting the lens barrel 10 , the second elastic member 32 relatively moves the lens barrel 10 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the sensor unit 60 .
- the second elastic member 32 includes at least two or more springs.
- the camera module according to the comparative example requires at least six elastic members such as springs.
- the camera module according to the comparative example requires two spring plates for supporting the elastic member as described above.
- the camera module according to the comparative example requires an additional member such as an elastic wire for fixing the Z-axis of the lens barrel 10 . Therefore, the camera module according to the comparative example has a complicated spring structure for moving the lens barrel in the X-axis, Y-axis, and Z-axis.
- the camera module according to the comparative example in order to couple the elastic member to the lens barrel 10 , it is necessary to manually bond each elastic member. Accordingly, the camera module according to the comparative example has a complicated manufacturing process and takes a lot of manufacturing time.
- the camera module according to the comparative example provides the tilt function of the lens barrel 10, it is difficult to actually correct the tilt of the image. That is, even if the lens barrel 10 rotates with respect to the sensor unit 60, since there is no change in the image incident on the sensor unit 60, it is difficult to correct the tilt of the image, and furthermore, the tilt function itself is unnecessary. .
- An 'optical axis direction' used below is defined as an optical axis direction of a lens and/or an image sensor coupled to the lens driving device.
- the 'vertical direction' used below may be a direction parallel to the optical axis direction.
- the vertical direction may correspond to the 'z-axis direction'.
- the 'horizontal direction' used below may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Accordingly, the horizontal direction may include an 'x-axis direction' and a 'y-axis direction'.
- the 'autofocus function' used below is to automatically focus on the subject by adjusting the distance from the image sensor by moving the lens in the optical axis direction according to the distance of the subject so that a clear image of the subject can be obtained on the image sensor. defined as a function. Meanwhile, 'auto focus' may correspond to 'AF (Auto Focus)'.
- the 'hand shake correction function' used below is defined as a function of moving a lens and/or an image sensor to offset vibration (movement) generated in the image sensor by an external force. Meanwhile, 'hand shake correction' may correspond to 'OIS (Optical Image Stabilization)'.
- FIG. 2 is a perspective view of the camera device according to the present embodiment
- FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2
- FIG. 4 is an exploded perspective view of the camera device according to the present embodiment.
- a camera device may include a camera module.
- the camera device may include a lens driving device.
- the lens driving device may be a voice coil motor (VCM, Voice Coil Motor).
- VCM voice Coil Motor
- the lens driving device may be a lens driving motor.
- the lens driving device may be a lens driving actuator.
- the lens driving device may include an AF module.
- the lens driving device may include an OIS module.
- the camera device may include the lens module 100 .
- the lens module 100 may include a lens and a lens barrel.
- the lens module 100 may include one or more lenses and a lens barrel capable of accommodating one or more lenses.
- one configuration of the lens module 100 is not limited to the lens barrel, and any holder structure capable of supporting one or more lenses may be used.
- the lens module 100 is coupled to the first actuator 200 to move.
- the lens module 100 may be coupled to the inside of the first actuator 200 as an example. Accordingly, the lens module 100 may move inside the first actuator 200 in response to the movement of the first actuator 200 .
- the lens module 100 may be screw-coupled to the first actuator 200 .
- the lens module 100 may be coupled to the first actuator 200 by an adhesive (not shown). Meanwhile, the light passing through the lens module 100 may be irradiated to the image sensor. Meanwhile, the lens module 100 may include, for example, five lenses.
- the camera device may include an actuator.
- the camera device may include the first actuator 200 for shifting the lens module 100 .
- the first actuator 200 may be an AF module.
- the first actuator 200 may move the lens module 100 in an up-down direction (clearly, an optical axis direction). That is, the first actuator 200 may perform an autofocus function by moving the lens module 100 in the optical axis direction.
- the second actuator 400 may drive the image sensor 422 .
- the second actuator 400 may tilt or rotate the image sensor 422 .
- the second actuator 400 may move the image sensor 422 .
- the second actuator 400 may move the image sensor 422 in a first direction perpendicular to the optical axis, move the image sensor 422 in a second direction perpendicular to the optical axis and the first direction, and rotate the image sensor 422 based on the optical axis.
- the first direction may be an x-axis direction
- the second direction may be a y-axis direction
- the optical axis may be a z-axis direction.
- the first actuator 200 and the second actuator 400 may include a driving unit to respectively move the lens module 100 and the image sensor 422 . That is, the first actuator 200 may include a first driving unit (to be described later). Also, the second actuator 400 may include a second driving unit (to be described later).
- the first and second driving units may have different configurations.
- the first driving unit may include a coil and a magnet.
- the second driving unit may include a shape memory alloy wire.
- the first driving unit may drive the lens module 100 by generating an electromagnetic force between the coil and the magnet.
- the second driving unit may drive the image sensor 422 by using the characteristics of the shape memory alloy wire.
- the camera device may include a case.
- the case may include a first case 300 and a second case 500 .
- the first case 300 may be an upper case that covers an upper area of the camera device.
- the first case 300 may be a shield can.
- the first case 300 may be disposed to surround side portions of the first actuator 200 and the second actuator 400 constituting the camera device.
- the first case 300 may have a first open region 310 formed on its upper surface.
- the first open area 310 of the first case 300 may be a hollow hole.
- the lens module 100 coupled to the first actuator 200 may be disposed in the first open area 310 of the first case 300 .
- the first open area 310 of the first case 300 may have a larger diameter than that of the lens module 100 .
- the first case 300 may include a top plate and a plurality of side plates that are curved or bent from the edge of the top plate and extend downward.
- the upper plate of the first case 300 may have a rectangular shape, and thus may include four side plates extending downward from four edges of the upper plate.
- the first case 300 may have a rectangular parallelepiped shape in which the first open region 310 into which the lens module 100 is inserted is formed on the upper surface, the lower surface is opened, and the corners are rounded.
- a second open region 320 may be formed on any one of the four side plates of the first case 300 .
- the second open area 320 may be an exposure hole for exposing a part of the first actuator 200 disposed in the first case 300 to the outside.
- the second open region 320 of the first case 300 may expose the terminal 262 of the flexible printed circuit board 260 of the first actuator 200 .
- the second open region 320 may be an opening for soldering performed for coupling the terminal of the flexible circuit board 260 and the first board of a second actuator to be described later.
- the second case 500 may be a lower case that covers a lower area of the camera device.
- the second case 500 may close the open lower region of the first case 300 .
- the first actuator 200 and the second actuator 400 constituting the camera device may be disposed in an accommodation space formed by the first case 300 and the second case 500 .
- the image sensor 422 may be coupled to a second substrate (described later) constituting the second actuator 400 .
- the second actuator 400 may include a fixed part 410 and a moving part 420 .
- the moving part of the second actuator 400 may be connected to the fixing part 410 through the first wire part 430 and the second wire part 440 .
- the first wire part 430 is a shape memory alloy wire as described above.
- the first wire part 430 may be a driving wire of the image sensor 422 . That is, the first wire part 430 may be a wire for tilting the image sensor 422 .
- the second wire unit 440 may be a signal transmission wire.
- the second wire part 440 may be a connection wire electrically connected to the image sensor 422 . More preferably, the second wire part 440 has one end connected to the substrate included in the fixing part 410 while elastically supporting the moving part 420 with respect to the fixing part 410 , and is moved. A substrate included in the unit 420 and the other end may be connected. Also, the second wire unit 440 may transmit a signal to the image sensor 422 constituting the moving unit 420 . Also, the second wire unit 440 may transmit a signal obtained from the image sensor 422 to a substrate constituting the fixing unit 410 . This will be described in more detail below.
- the moving part 420 of the second actuator 400 may move relative to the fixed part by a driving force provided through the first wire part 430 .
- the movement of the moving unit 420 may include all of the movement in the first direction, the movement in the second direction, and movement or rotation of the fixing unit 410 in the optical axis direction.
- the image sensor 422 may be any one of a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, and a CID.
- CCD charge coupled device
- MOS metal oxide semi-conductor
- CPD CPD
- CID CID
- the image sensor 422 may be rotated about the x-axis, the y-axis, and the z-axis.
- the image sensor 422 may move about an x-axis, a y-axis, and a z-axis.
- the image sensor 422 may be tilted about an x-axis, a y-axis, and a z-axis.
- the image sensor 422 is coupled to the moving part 420 of the second actuator 400, and when the moving part of the second actuator 400 moves relative to the fixed part of the second actuator 400, It may move relative to the fixed part of the second actuator 400 together with the moving part of the second actuator 400 . As a result, the hand-shake correction function may be performed.
- the camera device performs a handshake correction function and/or an autofocus function by moving the image sensor module 400 relative to the lens module 100 .
- the image resolution is increasing, and accordingly, the size of the image sensor 422 is also increasing.
- the size of the lens module 100 and the parts of the actuator for shifting the lens module 100 also increase.
- the weight of other actuator components for shifting the lens module 100 increases as well as the own weight of the lens module 100, it is difficult to stably shift the lens module 100 using the existing VCM technology. It is unreasonable and there are many problems in terms of reliability.
- AF is performed using the first actuator 200 implementing the lens shift method
- OIS is performed using the second actuator 400 implementing the image sensor shift method.
- 5-axis hand shake in the hand shake in the camera device.
- 5-axis hand shake there are two hand shakes that vibrate at an angle, two hand shakes that shake with shift, and one hand shake that shakes with rotation.
- 4-axis handshake correction is possible with the lens shift method, and it is impossible to correct hand shake shaking due to rotation.
- hand shake caused by rotation must be corrected by rotation of the optical module. Even if the lens module 100 is rotated, the incident optical path is maintained, and accordingly, 5-axis hand shake correction is impossible with the lens shift method. . Therefore, in the present embodiment, the sensor shift method is applied to enable 5-axis handshake correction, and the reliability problem of the lens shift method according to the camera technology development as described above can be solved.
- Figure 5 is an exploded perspective view of the first actuator shown in Figure 4
- Figure 6 (a) is a plan view of the base of Figure 5
- Figure 6 (b) is a plan view of the first actuator of Figure 5
- Figure 6 (c) is a bottom view of the first actuator of FIG. 5 .
- the first actuator 200 includes a base 210 , a bobbin 220 , a first elastic member 230 , a second elastic member 240 , and a first driving unit 250 . can do.
- the bobbin 220 is elastically supported on the base 210 through the first elastic member 230 and the second elastic member 240 in the vertical direction, and on the bobbin 220 .
- the bobbin 220 may move in the vertical direction by the electromagnetic interaction of the disposed first driving unit 250 . Accordingly, the lens module 100 coupled to the bobbin 220 may move in the optical axis direction. And, as the lens module 100 moves in the optical axis direction, an auto focus (AF) function may be performed.
- AF auto focus
- the base 210 may be a fixing member of the first actuator 200 .
- the base 210 may be disposed inside the first case 300 and coupled to the first case 300 .
- the base 210 may include a body 211 having a first opening 213 formed in the center thereof.
- the shape of the body 211 may have a shape corresponding to the first case 300 .
- the shape of the body 211 of the base 210 may have a rectangular parallelepiped shape or a rectangular cross-sectional shape corresponding to the shape of the first case 300 .
- a plurality of first protrusions 212 are formed on the upper surface of the body 211 of the base 210 .
- the plurality of first protrusions 212 may be formed to protrude upward from the upper surface of the body 211 .
- a plurality of lower protrusions (not shown) that are formed to protrude in the lower direction may also be formed on the lower surface of the body 211 in response thereto.
- the plurality of first protrusions 212 may be fixing protrusions for fixing the first elastic member 230 disposed on the base 210 .
- the plurality of first protrusions 212 may be respectively disposed in four corner regions of the upper surface of the body 211 of the base 210 .
- a first opening 213 is formed in the body 211 of the base 210 .
- the first opening 213 may have a shape corresponding to the shape of the bobbin 220 .
- the bobbin 220 may have a rectangular plate shape, and accordingly, the first opening 213 may also have a rectangular shape.
- the present invention is not limited thereto, and the bobbin 220 may have a cylindrical shape, and accordingly, the first opening 213 may also have a circular shape.
- the size of the first opening 213 may be larger than the size of the bobbin 220 . For example, in a state in which the bobbin 220 is inserted into the first opening 213 , a certain gap may exist between the inner surface of the body 211 of the base 210 and the outer surface of the bobbin 220 . have.
- a stepped 215 may be formed on the inner surface of the body 211 of the base 210 .
- the step 215 may restrict the movement of the bobbin 220 while selectively supporting the bobbin 220 disposed in the first opening 213 .
- the step 215 may function as a stopper for limiting movement of the bobbin 220 in the downward direction. That is, when the bobbin 220 in a normal state does not come into contact with the step 215 in a state disposed within the first opening 213 , and the bobbin 220 moves to the limiting range of movement in the downward direction to the step 215 may be in contact.
- a first recess 217 recessed in an outward direction may be formed on an inner surface of the body 211 of the base 210 .
- the first recess 217 may include a 1-1 recess 217a and a 1-2 recess 217b respectively formed on two inner surfaces facing each other among the inner surfaces of the body 211 . have.
- At least a portion of the bobbin 220 may be disposed in the 1-1 recess 217a and 1-2 recess 217b.
- a sensor magnet mounting part (not shown) formed on the bobbin 220 may be disposed in the 1-1 recess 217a and the 1-2 recess 217b.
- the 1-1 recesses 217a and 1-2 recesses 217b are attached to the sensor magnets 253 and 254 mounted on the sensor magnet mounting part of the bobbin 220 and the flexible circuit board 260 . It may be formed to minimize the gap between driver ICs (not shown).
- a first driving magnet mounting groove 216 is formed on a lower surface of the body 211 of the base 210 in a region facing each other with respect to the first opening 213. That is, the body 211 of the base 210 is formed. ), a 1-1 driving magnet mounting groove 216a is formed in a first region of the lower surface of the base 210.
- the first actuator 200 in the embodiment is a bobbin 220 using two driving magnets 252a and 252b disposed to face each other.
- the first driving magnets 252a and 252b are elongated in the longitudinal direction.
- the first driving magnets 252a and 252b are formed to minimize the overlap area with the second driving magnet (to be described later) of the second actuator 400 in the optical axis direction, the body
- the first driving magnets 252a and 252b may have magnetic field interference with the second driving magnet of the second actuator 400 .
- the first driving magnets 252a and 252b are disposed in a state of being fixed to the body 211 of the base 210.
- the second driving magnet of the second actuator 400 is not a moving part.
- the first driving magnets 252a and 252b and the second driving magnet are respectively arranged at fixed positions, that is, in the embodiment, they move according to the lens shift and the image sensor shift. so that the coil is placed on the part, Accordingly, the driving magnets are continuously located in a fixed place to minimize the mutual magnetic field interference.
- the body 211 of the base 210 includes a substrate groove 214 into which the flexible circuit board 260 is inserted.
- the flexible circuit board 260 may be inserted into the substrate groove 214 in a vertically erected state.
- the substrate groove 214 may have a bent shape that is bent at least once. That is, the flexible circuit board 260 is inserted into the substrate groove 214 .
- the flexible circuit board 260 includes a driver IC disposed on one surface.
- the driver IC may be a Hall sensor built-in driver. Accordingly, the driver IC detects the position of the lens module 100 by sensing a change in the strength of the electric field that changes according to the positions of the sensor magnets 253 and 254, and may control the output signal accordingly.
- the driver IC is disposed to face the sensor magnets 253 and 254 .
- the flexible circuit board 260 includes a terminal 262 electrically connected to a first board (described later) of the second actuator 400 . At this time, for electrical connection between the terminal 262 and the first substrate, a process such as soldering should be performed. Accordingly, the terminal 262 should be located close to the outer surface of the base 210 .
- the flexible circuit board 260 includes a first substrate region 261 in which the terminal 262 is disposed and a second substrate region 262 in which the driver IC is disposed.
- the first substrate region 261 is adjacent to the outer surface of the base 210
- the second substrate region 263 is adjacent to the inner surface of the base 210 . and, for this purpose, a bending region may be included between the first and second substrate regions.
- a bobbin 220 is disposed in the first opening 213 of the base 210 .
- a second opening 221 may be formed in the center of the bobbin 220 .
- the second opening 221 may have a shape corresponding to the lens module 100 .
- the second opening 221 may have a circular shape corresponding to the shape of the lens module 100 , but is not limited thereto.
- the bobbin 220 may be coupled to the lens module 100 .
- the lens module 100 may be inserted into the second opening 221 of the bobbin 220 to be coupled to the bobbin 220 .
- a plurality of second protrusions 223 in contact with the first elastic member 230 may be formed on the upper surface of the bobbin 220 .
- the plurality of second protrusions 223 may be stoppers for limiting the upward movement range of the bobbin 220 while allowing the bobbin 220 to be elastically supported by the first elastic member 223 .
- the second protrusion 223 comes into contact with the inner surface of the upper surface of the first case 300 positioned above the bobbin 220 and , the movement of the bobbin 220 may be restricted.
- a coil winding unit 222 on which the first coil unit 251 is wound may be formed on an outer surface of the bobbin 220 .
- the coil winding part 222 in the form of a recess recessed in an inward direction may be formed on the outer surface of the bobbin 220 .
- the first coil unit 251 may be wound around the coil winding unit 222 .
- the first coil unit 251 may have a “coil block” shape.
- the first coil unit 251 may be an “electromagnet”.
- the first coil unit 251 is disposed to face the first driving magnets 252a and 252b, and thus electromagnetically interacts with the first driving magnets 252a and 252b to generate electromagnetic force. .
- the first coil unit 251 may be electrically connected to the second elastic member 240 . Accordingly, the first coil unit 251 may receive current from the second elastic member 240 to generate electromagnetic force. As a result, the bobbin 220 may move in the optical axis direction to perform the AF function.
- a sensor magnet mounting unit (not shown) in which may be disposed may be formed.
- the sensor magnets 253 and 254 may be mounted on the sensor magnet mounting unit and positioned in the first-first recess 217a and the first-second recess 217b of the base 210 . The sensor magnets 253 and 254 move together with the bobbin 220 as the bobbin 220 moves.
- the magnitude of the magnetic field sensed by the driver IC disposed on the flexible circuit board 260 changes according to the positions of the sensor magnets 253 and 254, and the driver IC is based on the change in the magnitude of the changing magnetic field.
- the sensor magnets 253 and 254 , furthermore, the position of the bobbin 220 , and furthermore the position of the lens module 100 may be detected.
- the first elastic member 230 is disposed above the base 210 and the bobbin 220 .
- the second elastic member 240 is disposed below the base 210 and the bobbin 220 . Accordingly, the bobbin 220 may be elastically supported in the vertical direction by the first elastic member 230 and the second elastic member 240 within the first opening of the base 210 .
- the first elastic member 230 may be a plate spring.
- the first elastic member 230 may be made of metal.
- the first elastic member 230 may be non-magnetic. Accordingly, the first elastic member 230 may not be affected by the magnetic force of the first driving magnets 252a and 252b and the electromagnetic force of the first coil unit 251 .
- the first elastic member 230 may be disposed on the base 210 . Also, the first elastic member 230 may be disposed on the bobbin 220 . The first elastic member 230 may be coupled to the base 210 and the bobbin 220 . That is, the first elastic member 230 includes a 1-1 elastic part 231 coupled to the base 210 and a 1-1-1 elastic part 231 coupled to the bobbin 220 extending from the 1-1 elastic part 231 . 2 may include an elastic part 233 .
- the 1-1 elastic part 232 may have a coupling groove 232 inserted into the plurality of first protrusions 212 disposed on the upper surface of the body 211 of the base 210 .
- the first elastic member 230 may elastically support the upper side of the bobbin 220 while the coupling groove 232 is coupled to the first protrusion 212 .
- the first elastic member 230 may include an opening 234 in the center of which the lens module 100 is inserted.
- the second elastic member 240 may be disposed under the base 210 . Also, the second elastic member 240 may be disposed under the bobbin 220 .
- the second elastic member 240 may be coupled to the base 210 and the bobbin 220 . That is, the second elastic member 240 may include a 2-1 elastic part 241 coupled to the base 210 and a 2-2 elastic part 242 coupled to the bobbin 220 . Accordingly, the second elastic member 240 may elastically support the lower side of the bobbin 220 while being coupled to the base 210 .
- the second elastic member 240 may include an opening 243 in the center into which the lens module 100 is inserted.
- the second elastic member 240 may be electrically connected to the first coil unit 251 .
- the second elastic member 240 may be electrically connected to the flexible circuit board 260 .
- the second elastic member 240 may electrically connect the first coil unit 251 and the flexible circuit board 260 . Accordingly, current may be supplied from the flexible circuit board 260 to the first coil unit 251 through the second elastic member 240 . In this case, the direction, wavelength, intensity, etc. of the current supplied to the first coil unit 251 may be controlled.
- the second actuator 400 may be positioned under the first actuator 200 and may operate independently of the first actuator 200 to shift the image sensor 422 .
- the second actuator 400 includes a fixed portion 410 having a fixed position, and a moving portion 420 whose position is moved by the driving force of the first wire portion 430 in a state coupled to the fixed portion.
- a fixed portion 410 having a fixed position
- a moving portion 420 whose position is moved by the driving force of the first wire portion 430 in a state coupled to the fixed portion.
- FIG. 7 is an exploded perspective view of a second actuator according to an embodiment
- FIG. 8 is an exploded perspective view of a fixing part according to an embodiment
- FIG. 9 is a plan view of the first substrate of FIG. 8
- FIG. 10 is FIG. 9 is an embodiment is a coupling view of the first substrate and the first wire part of the shape memory alloy according to FIG. 11 is a view showing the upper surface of the first substrate in more detail
- FIG. 12 is an exploded perspective view of the moving part according to the embodiment
- FIG. 13 is 12 is a plan view of the second substrate
- FIG. 14 is a coupling diagram of the second substrate and the shape memory alloy wire in the embodiment
- FIG. 15 is a bottom view of the second substrate in the embodiment
- FIG. 16 is the embodiment An exploded perspective view of a third substrate of an example
- FIG. 17 is a plan view of a third substrate according to an embodiment
- FIG. 18 is an enlarged view of a specific area of FIG. 17
- FIG. 19 is a combination of the second substrate and the third substrate It is also
- the second actuator 400 may include a fixing part 410 , a moving part 420 , a first wire part 430 , and a second wire part 440 .
- the second actuator 400 may further include a housing (not shown).
- the fixing part 410 and the moving part 420 are electrically connected to each other by the second wire part 440 .
- the length of the second wire part 440 may be greater than the sum of the thickness of the fixed part 410 and the thickness of the moving part 420 . Accordingly, the moving part 420 disposed under the fixing part 410 may be placed at a position spaced apart from the fixing part 410 by a predetermined interval.
- the moving part 420 is suspended from the fixing part 410 by the second wire part 440 (flyed state), and is in response to the driving force generated by the first wire part 430 to be described later. Thus, it can move relative to the fixing part 410 .
- the second wire unit 440 may electrically connect the substrate constituting the fixed unit 410 and the substrate constituting the moving unit 420 .
- the second wire part 440 may have elasticity.
- the second wire part 440 may be an elastic member.
- the second wire part 440 may be a wire spring. In a state where the second wire unit 440 is spaced apart from the fixed unit 410 and the moving unit 420 by a predetermined interval, the circuit pattern of the substrate of the fixed unit 410 and the substrate of the moving unit 420 are can be electrically connected between the circuit patterns of
- the second wire part 440 may be formed of metal.
- the second wire part 440 may elastically support the moving part 420 with respect to the fixing part 410 .
- the second wire unit 440 may include a plurality of second wires.
- the number of the plurality of second wires included in the second wire unit 440 may correspond to the number of channels of signals exchanged between the fixing unit 410 and the moving unit 420 .
- the second wire unit 440 may include a total of 36 second wires, each of which is 9 on each side between adjacent corners among the four corners of the fixed unit 410 and the moving unit 420 .
- the second wire unit 430 may electrically connect the first substrate constituting the fixed unit 410 and the third substrate 600 constituting the moving unit 420 .
- the second wire part 440 connects the fixed part 410 and the moving part 420 .
- the second wire unit 440 includes nine 2-1 wires 441 disposed on a first side of each of the fixing unit 410 and the moving unit 420 , and nine second wires 441 disposed on the second side. It may include a -2 wire 442 , nine 2-3 wires 443 disposed on the third side, and nine 2-4 wires 444 disposed on the fourth side.
- the second wire part 440 may be evenly distributed on each of the four sides between the fixed part 410 and the moving part 420 . That is, the second wire 440 may form a vertical symmetric structure with sides facing each other from four sides. At this time, the second wire part 440 must elastically support the moving part 420 with respect to the fixed part 410 while transmitting a signal.
- the moving part 420 does not perform a normal shift operation, and accordingly, the portion where the second wire part 440 is disposed and the A difference may occur in the amount of movement between the other parts, and thus a problem may occur in operation reliability. Therefore, in the embodiment, the second wire part 440 is uniformly disposed in each area in a circular shape to improve the reliability of the image sensor shift operation.
- the fixing part 410 may be the first substrate 410 . Accordingly, hereinafter, the fixing unit 410 and the first substrate 410 will be described with the same reference numerals.
- the fixing unit 410 may optionally further include a first holder 410 - 1 disposed under the first substrate 410 .
- a first open region 413 may be formed in the center of the first substrate 410 .
- the first holder 410 - 1 may include a second open region 410 - 1a formed in a region overlapping the first open region 413 in the optical axis direction.
- the first open area 413 and the second open area 410 - 1a may have the same size or different sizes.
- the first open area 413 and the second open area 410 - 1a may have the same shape or different shapes.
- the first open area 413 and the second open area 410 - 1a may overlap each other in the optical axis direction.
- the first open area 413 and the second open area 410 - 1a may overlap the image sensor 422 in the optical axis direction.
- the first open area 413 and the second open area 410 - 1a overlap the image sensor 422 in the optical axis direction, so that light passing through the lens module is transmitted to the image sensor 422 . can do.
- the first holder 410 - 1 may be disposed under the first substrate 410 .
- the first holder 410 - 1 may be disposed under the first substrate 410 to maintain a minimum separation distance between the first substrate 410 and the moving part 420 .
- the first holder 410 - 1 may be disposed under the first substrate 410 to provide rigidity to the first substrate 410 .
- the first holder 410 - 1 may allow the first substrate 410 to maintain flatness.
- the first holder 410 - 1 is not an essential component in the second actuator 400 of the embodiment, and may be optionally omitted.
- the first substrate 410 includes a first substrate region 411 having a first opening 413 formed in the center and extending from the first substrate region 411 to the outside. and a second substrate region 412 on which a connector for connecting to the device is disposed.
- the first substrate 410 may include a first lead pattern portion 414 disposed in the first substrate region 411 .
- the first substrate 410 may be coupled to the second wire part 440 in the first lead pattern part 414 . That is, one end of the second wire part 440 may be coupled to the first lead pattern part 414 of the first substrate 410 .
- the first lead pattern part 414 and the second wire part 440 may be coupled through soldering.
- the first lead pattern part 414 may be a part in which a solder resist is opened for electrical connection with the second wire part 440 .
- the first lead pattern part 414 includes a first hole 414 - 2 and a first lead pattern 414 - 1 disposed around the first hole 414 - 2 . That is, the first lead pattern part 414 may be a pad including a first hole 414 - 2 through which the second wire part 440 passes. Accordingly, the second wire part 440 is soldered while passing through the first hole 414 - 2 , and the first lead pattern 414 - disposed around the first hole 414 - 2 . 1) can be electrically connected to.
- the first lead pattern part 414 is configured in plurality. That is, the first lead pattern unit 414 includes a plurality of first lead patterns. In addition, the plurality of first lead patterns are connected to the second wire unit 440 . In this case, the number of the first lead patterns may be equal to or less than the number of the second wire units 440 . When the number of first lead patterns is the same as the number of the second wire units 440 , all of the first lead patterns may be coupled to the connection wire. In addition, when the number of first lead patterns is smaller than the number of the second wire units 440 , at least one of the first lead patterns may not be coupled to the connection wire.
- a connector may be disposed in the second substrate region 412 connected to the first substrate region 411 .
- the connector may be a port for electrically connecting to an external device.
- the first substrate region 411 may be disposed inside the camera device, and the second substrate region 412 may extend from the first substrate region 411 to be exposed to the outside of the camera device.
- first board area 411 may be disposed inside the first case 300
- second board area 412 may include a connector disposed outside the first case 300 and connected to an external device. have.
- the first substrate 410 may transmit a signal to the moving unit 420 or receive a signal transmitted from the moving unit 420 . That is, the first substrate 410 is electrically connected to the moving unit 420 through the second wire unit 440 , and thus power is supplied to the moving unit 420 through the second wire unit 440 .
- a signal or a communication signal may be transmitted, and information including an image signal obtained by the mobile unit 420 may be received.
- the first substrate 410 may include a first pad portion 415 disposed on an edge region of the first substrate region 411 .
- the first pad unit 415 may be electrically connected to the flexible circuit board 260 included in the first actuator 200 .
- At least one first coupling hole 416 is formed in a corner region of the first substrate region 411 of the first substrate 410 .
- the first coupling hole 416 may be formed to fix the first substrate 410 on the first holder 410 - 1 . Accordingly, on the upper surface of the first holder 410 - 1 , a first coupling protrusion 410 - 1b may be formed at a position overlapping the first coupling hole 416 in the optical axis direction.
- the first substrate 410 may be seated on the first holder 410-1 in a state in which the first coupling hole 416 is inserted into the first coupling protrusion 410-1b.
- the first substrate 410 may include a gyro sensor (not shown) disposed on an upper surface or a lower surface of the first substrate region 411 . That is, in the present embodiment, the gyro sensor (not shown) may be disposed on the first substrate 410 and accommodated in the first case 300 of the camera device.
- a gyro sensor for implementing a hand-shake prevention function is embedded in a state mounted on the upper or lower surface of the first substrate 410 , and the moving unit 420 detects angular velocity/linear velocity due to hand-shake. You can provide feedback. Accordingly, in the embodiment, by disposing the gyro sensor in the space between the first substrate 410 and the moving unit 420 , there is an effect that it is not necessary to provide an additional space for disposing the gyro sensor.
- a second pad may be disposed on a lower surface of the first substrate 410 .
- the second pad may be a pad to which the first wire unit 430 is connected. That is, the number of pads corresponding to the number constituting the first wire unit 430 may be formed on the lower surface of the first substrate 410 .
- the second pad disposed on the lower surface of the first substrate 410 may be respectively connected to one end and the other end of the first wire unit 430 . Accordingly, the number of second pads disposed on the lower surface of the first substrate 410 may be twice the number of the first wire units 430 .
- the first wire part 430 may be a shape memory alloy (SMA).
- both ends of the first wire part 430 may be connected to the second pad of the first substrate 410 . Accordingly, the length of the first wire part 430 may change according to a current applied through the second pad of the first substrate 410 .
- the first wire part 430 is a shape memory alloy whose length is changed based on the applied current.
- the first wire unit 430 may include a plurality of first wires.
- the first wire unit 430 may include eight first wires, but is not limited thereto.
- the first wire unit 430 may include at least six or more first wires.
- the first wire unit 430 includes a 1-1 wire 431 , a 1-2 wire 432 , a 1-3 wire 433 , a 1-4 wire 434 , and a first It may include a -5 wire 435 , a 1-6 th wire 436 , a 1-7 th wire 437 , and a 1-8 th wire 438 .
- the first wire unit 430 may include a 1-1 wire 431 for moving the moving unit 420 in the +x axis.
- the first wire unit 430 may include a 1-2-th wire 432 for moving the moving unit 420 in the -x axis.
- the first wire unit 430 may include a 1-3 wire 433 for moving the moving unit 420 in the +y axis.
- the first wire unit 430 may include a 1-4th wire 434 for moving the moving unit 420 in the +y axis.
- the first wire unit 430 for moving the moving unit 420 in a first rotational direction eg, clockwise about the optical axis, 1-5 wires 435 and 1-7) It may include a wire 437.
- first wire part 430 is 1-6 wires for rotating the moving part 420 in a second rotation direction (eg, counterclockwise) ( 436) and the 1-8th wire 438.
- first wire for rotating the moving part 420 in a first rotational direction or a second rotational direction may be formed as a single piece.
- the second pad may include eight second pads to be respectively connected to the eight first wire units 430 .
- the second pad may include a 2-1 pad 411-3.
- the second-first pad 411-3 may be disposed on the first side (eg, the +x-axis) with respect to the first open area 413 .
- the 2-1-th pad 411-3 is a first sub-2-1 pad 411-3a and a second second pad 411-3a spaced apart from each other in the y-axis direction on the first side of the first open region 413 . It may include a sub-second-first pad 411-3b.
- the first sub-2-1 pad 411-3a and the second sub-2-1 pad 411-3b extend extending in the x-axis direction from the center C of the first open area 413 . Based on the point, it may be spaced apart from each other at the same distance from the extension point.
- the 1-1 wire 431 is connected to the first sub 2-1 pad 411-3a, and the 1-1 wire 431 is connected to the second sub 2-1 pad 411-3b. 431) may be connected.
- the 1-1 wire 431 is connected to the first sub 2-1 pad 411-3a and the second sub 2-1 pad 411-3b, and is connected to the central part (moving part ( Clearly, a portion coupled to the hinge portion) may meet the center C in the +x-axis direction. Accordingly, in the embodiment, the moving part 420 can be accurately moved in the +x-axis direction using the 1-1 wire 431 .
- the 1-1 wire 431 may have a first length in a state in which no current is applied.
- the 1-1 wire 431 may have a second length longer than the first length in a state in which a current is applied. Accordingly, when a specific current value is applied to the 1-1 wire 431, the length of the 1-1 wire 431 may be shortened, and accordingly, the moving unit 420 connected thereto is moved along the +x axis. can be moved to
- the second pad may include a 2-2 pad 411-4.
- the 2-2nd pad 411-4 may be disposed on the second side (eg, -x-axis) with respect to the first open area 413 .
- the 2-2nd pad 411-4 includes a first sub-second-2 pad 411-4a and a second sub-secondary pad 411-4a spaced apart from each other in the y-axis direction on the second side of the first open region 413 . It may include a sub-second-second pad 411-4b.
- the first sub 2-2 pad 411-4a and the second sub 2-2 pad 411-4b extend extending in the x-axis direction from the center C of the first open area 413 .
- the moving part 420 may be accurately moved in the -x-axis direction using the 1-2-th wire 432 . That is, as a current is applied to the 1-2 th wire 432 , the moving part 420 connected to the 1-2 th wire 432 may move along the -x axis.
- the second pad may include a 2-3 th pad 411 - 5 .
- the 2-3rd pad 411 - 5 may be disposed on a third side (eg, +y-axis) with respect to the first open area 413 .
- the 2-3-th pad 411-5 includes the first sub-second-3 pad 411-5a and the second sub-second-3 pad 411-5a spaced apart from each other in the x-axis direction on the third side of the first open area 413 . It may include a sub-third pad 411-5b.
- the first sub-second-3 pad 411-5a and the second sub-second-3 pad 411-5b extend in the +y-axis direction with the center C of the first open region 413 .
- the extension point With respect to the extension point, it may be spaced apart from each other at the same distance from the extension point.
- One end of the 1-3 wire 433 is connected to the first sub 2-3 pad 411-5a, and the 1-3 wire ( 433) may be connected.
- the 1-3 th wire 433 is connected to the first sub-second-3 pad 411-5a and the second sub-second-3 pad 411-5b while being connected to the central portion (moving part ( Clearly, a portion coupled with the hinge part) may meet the center C in the +y-axis direction. Accordingly, in the embodiment, the moving part 420 can be accurately moved in the +y-axis direction using the 1-3 wire 433 . That is, as a current is applied to the 1-3 wire 433 , the moving part 420 connected to the 1-3 wire 433 may move in the +y-axis.
- the second pad may include a 2-4 pad 411 - 6 .
- the 2-4th pad 411-6 may be disposed on a fourth side (eg, -y-axis) with respect to the first open area 413 .
- the 2-4 th pad 411 - 6 includes the first sub 2-4 pad 411 - 6a and the second sub 2-4 pad 411 - 6a spaced apart from each other in the x-axis direction on the fourth side of the first open area 413 .
- It may include a sub-second-4 pad 411-6b.
- the first sub-second-4 pad 411-6a and the second sub-second-4 pad 411-6b extend in the -y-axis direction from the center C of the first open region 413 .
- the extension point may be spaced apart from each other at the same distance in the x-axis direction.
- One end of the 1-4th wire 434 is connected to the first sub-second-4 pad 411-6a, and the 1-4-th wire ( 434) may be connected.
- the 1-4th wire 434 is connected to the first sub-second-4 pad 411-6a and the second sub-second-4 pad 411-6b, and the central portion (moving part ( Clearly, a portion coupled with the hinge portion) may meet the center C in the -y-axis direction. Accordingly, in the embodiment, the moving part 420 can be accurately moved in the -y-axis direction using the 1-4th wire 434 . That is, as the current is applied to the 1-4 th wire 434 , the moving part 420 connected to the 1-4 th wire 434 may move in the -y-axis.
- the second pad may include a 2-5th pad 411 - 7 .
- the 2-5th pad 411 - 7 may be disposed on a first diagonal side (eg, a corner side where the first side and the fourth side meet) with respect to the first open area 413 .
- the 2-5th pad 411-7 includes a first sub-second-5 pad 411-7a and a second sub-second spaced apart from each other on a first diagonal side of the first open area 413 .
- -5 pads 411-7b may be included.
- One end of the 1-5 wire 435 is connected to the first sub 2-5 pad 411-7a, and the 1-5 wire ( 435) may be connected.
- the moving unit 420 may be rotated in a first rotational direction (eg, clockwise) using the 1-5th wire 435 . That is, as a current is applied to the 1-5 wire 435 , the moving part 420 connected to the 1-5 wire 435 may rotate in the first rotation direction.
- a first rotational direction eg, clockwise
- the second pad may include a 2-6th pad 411 - 8 .
- the 2-6th pad 411 - 8 may be disposed on a second diagonal side (eg, a corner side where the second side and the fourth side meet) with respect to the first open area 413 .
- the 2-6th pad 411-8 includes a first sub-second-6 pad 411-8a and a second sub-second spaced apart from each other on a second diagonal side of the first open area 413 .
- -6 pads 411-8b may be included.
- One end of the 1-6 wire 436 is connected to the first sub 2-6 pad 411-8a, and the 1-6 wire ( 436) may be connected.
- the moving unit 420 may be rotated in a second rotational direction (eg, counterclockwise) using the 1-6th wire 436 . That is, as a current is applied to the 1-6 wire 436 , the moving part 420 connected to the 1-6 wire 436 may rotate in the second rotation direction.
- the second pad may include a 2-7th pad 411 - 9 .
- the 2-7th pad 411 - 9 may be disposed on a third diagonal side (eg, a corner side where the second side and the third side meet) with respect to the first open area 413 .
- the 2-7th pad 411-9 includes a first sub-second-7 pad 411-9a and a second sub-second spaced apart from each other on the third diagonal side of the first open region 413 .
- -7 pads 411-9b may be included.
- One end of the 1-7 wire 437 is connected to the first sub 2-7 pad 411-9a, and the 1-7 wire ( 437) may be connected.
- the moving part 420 may be rotated in a first rotational direction (eg, clockwise) using the 1-7th wire 437 . That is, as the current is applied to the 1-7 wire 437 , the moving part 420 connected to the 1-7 wire 437 may rotate in the first rotation direction.
- a first rotational direction eg, clockwise
- the second pad may include a 2-8th pad 411 - 10 .
- the 2-8th pads 411 - 10 may be disposed on a fourth diagonal side (eg, a corner side where the first side and the third side meet) with respect to the first open area 413 .
- the 2-8th pad 411-10 includes a first sub-second-8 pad 411-10a and a second sub-second spaced apart from each other on a fourth diagonal side of the first open region 413 .
- -8 pads 411-10b may be included.
- One end of the 1-8 wire 438 is connected to the first sub 2-8 pad 411-10a, and the 1-8 wire ( 438) may be connected.
- the moving part 420 may be rotated in a second rotational direction (eg, counterclockwise) using the 1-8th wire 438 . That is, as current is applied to the 1-8 th wire 438 , the moving part 420 connected to the 1-8 th wire 438 may rotate in the second rotation direction.
- a second rotational direction eg, counterclockwise
- the first wire part 430 of the shape memory alloy is formed using the second wire part 440 in a state in which the moving part 420 is elastically supported with respect to the fixed part 410 .
- the moving part 420 can be moved with respect to the fixed part 410 by using it.
- one end of the second wire part 440 is coupled to the first lead pattern part 414 of the first substrate 410 , and the first hole 414 - 2 constituting the first lead pattern part 414 . ) and may extend to a lower portion of the first substrate 410 .
- a gyro sensor for obtaining sensing information necessary for performing handshake correction is disposed on one surface of the first substrate 410 , and a signal obtained through the gyro sensor is transmitted through the second wire unit 440 to the moving unit 420 . ) can be transferred to the constituting substrate.
- the moving unit 420 is electrically connected to the fixing unit 410 (specifically, the first substrate 410 ) through the second wire unit 440 , and through the first wire unit 430 . By the provided driving force, it can move relative to the fixing part 410 .
- the moving unit 420 may include a second substrate 421 , an image sensor 422 , a second holder 423 , and a third substrate 600 .
- the first substrate 410 may be a first substrate part constituting the fixed part
- the second substrate 421 and the third substrate 600 may be a second substrate part constituting the moving part 420 .
- the second substrate 421 may be an image sensor substrate. That is, the second substrate 421 may be a substrate on which the image sensor 422 is mounted. An image sensor 422 may be mounted on the upper surface of the second substrate 421 . Preferably, the image sensor 422 may be disposed on a region overlapping the first open region 413 of the first substrate 410 and the optical axis of the upper surface of the second substrate 421 .
- a hinge portion may be disposed on the upper surface of the second substrate 421 .
- the hinge part may be a wire fixing part to which the first wire part 430 electrically connected to the first substrate 410 is coupled and fixed.
- the hinge part may include a plurality.
- the upper surface of the second substrate 421 includes a plurality of first regions corresponding to corner regions and a second region between the plurality of first regions.
- the hinge part includes a first hinge part disposed in a first region of the upper surface of the second substrate 421 and a second hinge part disposed in a second region of the upper surface of the second substrate 421 .
- the first wire unit 430 may include a first group of first wire units connected to the first hinge unit and a second group of second wire units connected with the second hinge unit.
- the first wire portion of the first group may be a first wire for rotating the second substrate 421 and the wire sensor 422 disposed on the second substrate 421 about an optical axis.
- the first wire part of the second group is a first for moving the second substrate 421 and the wire sensor 422 disposed on the second substrate 421 in the x-axis direction or the y-axis direction. It may be a wire.
- the hinge part may include a first hinge 421-1.
- a 1-1 wire 431 may be coupled and fixed to the first hinge 421-1.
- the first hinge 421-1 may be disposed on the first side (+x-axis direction) of the image sensor 422 .
- a central portion between one end and the other end of the 1-1 wire 431 may be coupled to the first hinge 421-1.
- the first hinge 421-1 may not overlap an area between the plurality of 2-1 pads 411-3 and the plurality of 2-1 pads 411-3 in the optical axis direction. have. That is, when the first hinge 421-1 overlaps the 2-1-th pad 411-3, the second substrate 421 is moved along the +x axis by the 1-1 wire 431. It can only move in the z-axis, not in the . Accordingly, the first hinge 421-1 and the 2-1 pad 411-3 may be disposed to be shifted from each other in the optical axis direction.
- the hinge part may include a second hinge 421 - 2 .
- a 1-2 th wire 432 may be coupled and fixed to the second hinge 421 - 2 .
- the second hinge 421 - 2 may be disposed on the second side (-x-axis direction) of the image sensor 422 .
- a central portion between one end and the other end of the 1-2 first wire 432 may be coupled to the second hinge 421 - 2 .
- the second hinge 421 - 2 may not overlap the area between the plurality of 2 - 2 pads 411-4 and the plurality of 2 - 2 pads 411-4 in the optical axis direction. have.
- the second hinge 421 - 2 overlaps the 2 - 2 pad 411-4 , the second substrate 421 is moved along the -x axis by the 1-2 wire 431 . It can only move in the z-axis, not in the . Accordingly, the second hinge 421 - 2 and the 2 - 2 pad 411-4 may be displaced from each other in the optical axis direction.
- the hinge part may include a third hinge 421-3.
- a 1-3 wire 433 may be coupled and fixed to the third hinge 421-3.
- the third hinge 421-3 may be disposed on the third side (+y-axis direction) of the image sensor 422 .
- a central portion between one end and the other end of the 1-3 wire 433 may be coupled to the third hinge 421-3.
- the third hinge 421-3 may not overlap an area between the plurality of 2-3 pads 411-5 and the plurality of 2-3 pads 411-5 in the optical axis direction. have.
- the hinge part may include a fourth hinge 421-4.
- a 1-4th wire 434 may be coupled and fixed to the fourth hinge 421-4.
- the fourth hinge 421-4 may be disposed on a fourth side (-y-axis direction) of the image sensor 422 .
- a central portion between one end and the other end of the 1-4th wire 434 may be coupled to the fourth hinge 421-4.
- the fourth hinge 421-4 may not overlap the area between the plurality of 2-4 pads 411-6 and the plurality of 2-4 pads 411-6 in the optical axis direction. have.
- the hinge part may include a fifth hinge 421 - 5 .
- a 1-5 th wire 435 may be coupled and fixed to the fifth hinge 421 - 5 .
- the fifth hinge 421 - 5 may be disposed on the first diagonal side of the image sensor 422 .
- a central portion between one end and the other end of the 1-5 wire 435 may be coupled to the fifth hinge 421 - 5 .
- the fifth hinge 421 - 5 may not overlap an area between the plurality of 2-5 pads 411 - 7 and the plurality of 2 - 5 pads 411 - 7 in the optical axis direction. have.
- the hinge part may include a sixth hinge 421 - 6 .
- a 1-6 wire 436 may be coupled and fixed to the sixth hinge 421 - 6 .
- the sixth hinge 421 - 6 may be disposed on a second diagonal side of the image sensor 422 .
- a central portion between one end and the other end of the 1-6 th wire 436 may be coupled to the sixth hinge 421 - 6 .
- the sixth hinge 421 - 6 may not overlap the area between the plurality of 2 - 6 pads 411 - 8 and the plurality of 2 - 6 pads 411 - 8 in the optical axis direction. have.
- the hinge part may include a seventh hinge 421 - 7 .
- a 1-7 wire 437 may be coupled and fixed to the seventh hinge 421 - 7 .
- the seventh hinge 421 - 7 may be disposed on a third diagonal side of the image sensor 422 .
- a central portion between one end and the other end of the 1-7 wire 437 may be coupled to the seventh hinge 421 - 7 .
- the seventh hinge 421 - 7 may not overlap an area between the plurality of 2 - 7 th pads 411 - 9 and the plurality of 2 - 7 th pads 411 - 9 in the optical axis direction. have.
- the hinge unit may include an eighth hinge 421 - 8 .
- the first eighth wire 438 may be coupled and fixed to the eighth hinge 421 - 8 .
- the eighth hinge 421 - 8 may be disposed on a fourth diagonal side of the image sensor 422 .
- a central portion between one end and the other end of the 1-8 wire 438 may be coupled to the eighth hinge 421 - 8 .
- the eighth hinge 421 - 8 may not overlap the area between the plurality of 2 - 8 pads 411 - 10 and the plurality of 2 - 8 pads 411 - 10 in the optical axis direction. have.
- a hinge portion to which the first wire portion 430 is coupled is disposed on the upper surface of the second substrate 421 .
- the hinge connected to the first wire part to which the current is applied moves in the direction in which the first substrate 410 is located.
- a pad 421a may be formed on a lower surface of the second substrate 421 .
- the pad 421a may be formed in an edge region of a lower surface of the second substrate 421 .
- the pad 421a of the second substrate 421 may be a pad connected to the third substrate 600 .
- the pad 421a includes a first sub pad 421a1 formed in a first edge area of the lower surface of the second substrate 421 , a second sub pad 421a2 formed in a second edge area, and a third edge of the second substrate 421 . It may include a third sub pad 421a3 formed in the region and a fourth sub pad 421a4 formed in the fourth edge region.
- the second substrate 421 may be disposed on the second holder 423 .
- the second holder 423 may have a guide protrusion (not shown) extending upward in an edge region.
- the second substrate 421 may be seated on the second holder 423 through the guide protrusion, thereby guiding an assembly position of the second substrate 421 .
- An open region OR2 may be formed in a central region of the second holder 423 .
- a through hole 423 - 1 may be formed in an edge region of the second holder 423 .
- the through hole 423 - 1 may be aligned with the first hole 414 - 2 formed in the first substrate 410 in the optical axis direction.
- the through hole 423 - 1 may be a wire through hole through which the second wire unit 440 coupled to the first substrate 410 passes.
- the third substrate 600 may be disposed between the first substrate 410 and the second substrate 421 .
- the third substrate 600 may relay electrical connection (or communication) between the first substrate 410 and the second substrate 421 .
- the third substrate 600 enables the shift of the image sensor 422 and enables signal exchange between the first substrate 410 and the second substrate 421 .
- the third substrate 600 may include an insulating layer 610 and a pattern portion 620 disposed on the insulating layer 610 .
- the insulating layer 610 may include an opening 612 .
- the opening 612 may be aligned with the opening of the first substrate 410 , the second substrate 421 , and the image sensor 422 in the optical axis direction.
- a pattern part 620 is disposed on the insulating layer 610 .
- the pattern unit 620 includes a second lead pattern unit 621 having one end connected to the pad 421a of the second substrate 421 and the other end connected to the second wire unit 440 .
- the pattern part 620 includes a reinforcing pattern 622 disposed on a corner region of the insulating layer 610 .
- the second lead pattern part 621 is a signal transmission/reception pattern electrically connected to the pad 421a of the second substrate 421 and the second wire part 440 .
- the reinforcing pattern 622 is disposed on the corner region of the insulating layer 610 to reinforce the rigidity of the third substrate 600 .
- the reinforcing pattern 622 is not electrically connected to other components, and is only disposed in a corner area of the upper surface of the insulating layer 610 where the second lead pattern part 621 is not disposed, so that the third The rigidity of the substrate 600 is improved.
- the reinforcing pattern 622 may be formed of the same metal material as the second lead pattern portion 621 , and may be formed simultaneously with the second lead pattern portion 621 in the same process.
- a plurality of second lead pattern units 621 may be formed.
- the second lead pattern part 621 may include 36 terminal parts in the same manner as the second wire part 440 .
- the second lead pattern part 621 includes the 2-1 lead pattern part 621a disposed in the first region of the insulating layer 610 and the second region facing the first region of the insulating layer 610 .
- the 2-3th lead pattern part 621c disposed in A 2-4 th lead pattern part 621d disposed in a fourth region facing the third region of 610 may be included.
- the second lead pattern unit 621 may include a plurality of second lead patterns respectively disposed in different regions.
- the number of the second lead patterns may be the same as the number of the second wire units 440 .
- the number of the second lead patterns may be less than the number of the connection wires. In this case, when the number of second lead patterns is less than the number of the connection wires, at least one of the second lead patterns may not be coupled to the connection wire.
- the reinforcing pattern 622 includes a first reinforcing pattern 622-1a disposed in a first corner area between the first and third areas of the insulating layer 610 and a third area of the insulating layer 610 .
- the second reinforcing pattern 622-1b is disposed in a second corner area between the second area and the second area, and a third reinforcing pattern is disposed in a third corner area between the second area and the fourth area of the insulating layer 610 .
- 62-1c and a fourth reinforcing pattern 622-1d disposed in a fourth corner region between the first region and the fourth region of the insulating layer 610 .
- the insulating layer 610 includes a first insulating region 611 having an opening 612 in the center and in contact with the second lead pattern part 621 and the reinforcing pattern 622 , and the first insulating region 611 . and a second insulating region 613 protruding outward from the outer surface of the .
- the second insulating region 613 may be formed to further improve the rigidity of the third substrate 600 by increasing a contact area with the reinforcing pattern 622 .
- the second lead pattern portion 621 includes a first portion 621-1 disposed on the insulating layer 610 and a third portion 621-3 coupled to the second wire portion 440, A second portion 621 - 2 connecting between the first portion 621-1 and the third portion 621-3 , and an inner direction of the insulating layer 610 from the first portion 621-1 and a fourth portion 621-4 extending to and coupled to the pad 421a of the second substrate 421 .
- the first part 621-1 may be referred to as a body part of the second lead pattern part 621 . That is, the first portion 621-1 may be a body portion of the second lead pattern portion 621 disposed on the insulating layer to support another portion thereof. Also, the third portion 621-3 may be referred to as a coupling portion coupled to the second wire portion 440 . Also, the second part 621 - 2 may be a connection part connecting the first part 621-1 and the third part 621-3 . In addition, the fourth portion 621-4 may be referred to as a coupling portion coupled to the pad 421a of the second substrate 421 , or alternatively may be referred to as a pad portion.
- a hole through which the second wire part 440 passes may be formed in the third part 621-3.
- the third part 621-3 may be coupled to the second wire part 440 by soldering.
- the second part 621 - 2 may include a bent part.
- the second portion 621 - 2 may be bent a plurality of times in one direction.
- the second part 621 - 2 may have elasticity. Accordingly, the second lead pattern part 621 may have elasticity.
- the second wire part 440 may move together when the image sensor 422 moves to cause bending, and Breaking may occur depending on the degree of occurrence.
- the second part 621 - 2 since the second part 621 - 2 includes a bent part, it can serve as a suspender when the image sensor module 400 moves, and thus the second wire part By giving elasticity to the 440 , the rigidity of the second wire part 440 may be increased.
- the fourth portion 621-4 may be electrically connected to the pad 421a of the second substrate 421 .
- the insulating layer 610 is disposed only under the first part 621-1 of the second lead pattern part 621 , and the insulating layer 610 is not disposed on the other part of the second lead pattern part 621 .
- the third part 621-3 may be a bonding pad electrically connected to the second wire part 440 . That is, the third portion 621-3 may be a soldering pad that is soldered to the second wire portion 440 . To this end, the third part 621-3 may include a hole through which the second wire part 440 passes. The hole of the third part 621-3 may be aligned with a hole through or through which the second wire part 440 described above passes in the optical axis direction. To this end, the second part 621 - 2 may include a plurality of bent bent parts.
- each of the second lead pattern portions 621a, 621b, 621c, and 621d may be bent in the same direction.
- each of the second lead pattern portions 621a, 621b, 621c, and 621d may include a bent portion in which the second portion 621 - 2 rotates in a clockwise direction. That is, the second part 621 - 2 may be bent in a direction corresponding to the rotation direction in the z-axis direction of the image sensor module. Accordingly, the second part 621 - 2 can minimize damage applied to the second lead pattern part 621 when the second part 621 - 2 rotates in the z-axis direction, and thus the second lead pattern part 621 .
- an adhesive member (not shown) may be disposed between the insulating layer 610 and the second lead pattern part 621 .
- the adhesive member may be interposed between the insulating layer 610 and the second lead pattern part 621 to prevent the second lead pattern part 621 from being separated from the insulating layer 610 .
- the adhesive member may include an adhesive for curing.
- the adhesive member may be electrolytically plated to increase adhesion with the second lead pattern part 621 , and thus roughness may be imparted to the surface.
- the second lead pattern part 621 is a wire that transmits an electrical signal, and may be formed of a metal material having high electrical conductivity.
- the second lead pattern part 621 is selected from among gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). It may be formed of at least one metallic material.
- the second lead pattern part 621 is formed from among gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) having excellent bonding strength. It may be formed of a paste or solder paste including at least one selected metal material.
- the second lead pattern part 621 may be formed of a metal material having an elastic force that can move the image sensor 422 in the X-axis, Y-axis, and Z-axis directions while serving as a wiring for transmitting an electrical signal.
- the second lead pattern part 621 may be formed of a metal material having a tensile strength of 1000 MPa or more.
- the second lead pattern part 621 may be a binary alloy or a ternary alloy including copper.
- the second lead pattern part 621 may be a binary alloy of copper (Cu)-nickel (Ni).
- the second lead pattern part 621 may be a binary alloy of copper (Cu)-tin (Sn).
- the second lead pattern part 621 may be a binary alloy of copper (Cu)-beryllium (Be).
- the second lead pattern part 621 may be a binary alloy of copper (Cu)-cobalt (Co).
- the second lead pattern part 621 may be a ternary alloy of copper (Cu)-nickel (Ni)-tin (Sn).
- the second lead pattern part 621 may be a ternary alloy of copper (Cu)-beryllium (Be)-cobalt (Co).
- the second lead pattern part 621 may be formed of an alloy such as iron (Fe), nickel (Ni), zinc, etc., which has good electrical properties while having an elastic force that can serve as a spring.
- the second lead pattern part 621 may be surface-treated with a plating layer including a metal material such as gold (Au), silver (Ag), palladium (Pd), and the like, thereby improving electrical conductivity.
- the second lead pattern unit 621 includes an additive process, a subtractive process, a modified semi-additive process (MSAP), and a semi-additive process (SAP), which are typical printed circuit board manufacturing processes. ) is possible with the method.
- the second lead pattern part 621 may have different line widths for each part.
- the first portion 621-1 may have a wider width than other portions to increase adhesion with the insulating layer 610 .
- the second portion 621 - 2 may have a narrower line width than the first portion 621-1 in order to have an elastic force.
- the second portion 621 - 2 may have a line width of 20 to 1000 ⁇ m.
- the line width of the second part 621 - 2 is less than 20 ⁇ m, the overall rigidity of the second lead pattern part 621 may decrease, and thus the reliability of the second lead pattern part 621 may be reduced.
- the line width of the second part 621 - 2 is greater than 1000 ⁇ m, the elastic force of the second lead pattern part 621 may be lowered, and thus a problem may occur in shifting of the image sensor 422 .
- the second part 621 - 2 may include a buffer pattern part for a buffer role in the region A connected to the first part 621-1 .
- the buffer pattern portion may have a shape in which the width gradually decreases from the first portion 621-1 to the second portion 621-2. In this case, the decrease in the width has a non-linear characteristic rather than a linear, and thus the outer surface of the buffer pattern part may have a rounded shape.
- the buffer pattern part can solve problems such as pattern breakage caused by the pattern width difference between the first part 621-1 and the second part 621-2, and stably the first part 621-1 ) and the third part 621-3 may be connected.
- the buffer pattern portion may not overlap the insulating layer in a vertical direction.
- the fourth part 621-4 also has a line width smaller than that of the first part 621-1, so that a gap between the fourth part 621-4 and the first part 621-1 is formed.
- a buffer pattern portion having a rounded outer surface may be disposed in the region (B) as well.
- the second part 621 - 2 may be bent at least once as set above. Accordingly, the second part 621-2 includes a 2-1 part 621-2a extending in one direction, and a second part 621-2a extending in a direction different from the one direction in the 2-1 part 621-2a. 2-2 part 621-2b.
- the side surface of the second-second portion 621-2b may have a rounded shape rather than a straight line. That is, when the side surface of the second second portion 621 - 2b has a linear shape, stress may be concentrated in this portion, and accordingly, the second lead pattern portion 621 may be broken. Accordingly, the side surfaces of the 2-2nd portion 621 - 2b may have a rounded shape to prevent stress from being concentrated in the 2nd - 2nd portion 621 - 2b . In this case, the value of the curvature R of the side surface of the second-second portion 621-2b is set to be between 30 and 100.
- the 2-2 part 621 - 2b may include an inner surface and an outer surface according to the bending direction.
- the value of the curvature R of the inner surface of the 2-2 second portion 621-2b is different from the curvature R of the outer surface of the second second portion 621-2b to serve as a stress relief. to maximize it.
- the 2-2nd portion 621 - 2b may be different from the line width of the 2-1th portion 621 - 2a .
- the second-second portion 621-2b may have a line width greater than that of the second-first portion 621-2a. In this case, stress may be concentrated in the second-second portion 621-2b, and accordingly, the second-second portion 621-2b has a larger line width than that of the second-first portion 621-2a. to allow this to be formed.
- the pad 421a of the second substrate 421 is positioned on the fourth part 621-4.
- the fourth portion 621-4 and the pad 421a of the second substrate 421 may be coupled to each other through soldering.
- the second part 621 - 2 of the second lead pattern part 621 has a rectangular shape with rounded corners
- the present invention is not limited thereto.
- the second part 621 - 2 of the second lead pattern part 621 may have a circular shape or a polygonal shape and may be bent.
- FIG. 20 is a perspective view of the optical device according to the present embodiment
- FIG. 21 is a configuration diagram of the optical device shown in FIG. 20 .
- the optical device is any one of a cell phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player), and a navigation device can be
- the type of optical device is not limited thereto, and any device for taking an image or photo may be included in the optical device.
- the optical device may include a body 1250 .
- the body 1250 may have a bar shape.
- the main body 1250 may have various structures such as a slide type, a folder type, a swing type, a swivel type, in which two or more sub-bodies are coupled to be movable relative to each other.
- the body 1250 may include a case (casing, housing, and cover) forming an exterior.
- the body 1250 may include a front case 1251 and a rear case 1252 .
- Various electronic components of an optical device may be embedded in a space formed between the front case 1251 and the rear case 1252 .
- a display 1151 may be disposed on one surface of the body 1250 .
- a camera 1121 may be disposed on one or more surfaces of one surface of the body 1250 and the other surface disposed opposite to the one surface.
- the optical device may include a wireless communication unit 1110 .
- the wireless communication unit 1110 may include one or more modules that enable wireless communication between the optical device and the wireless communication system or between the optical device and the network in which the optical device is located.
- the wireless communication unit 1110 includes any one or more of a broadcast reception module 1111 , a mobile communication module 1112 , a wireless Internet module 1113 , a short-range communication module 1114 , and a location information module 1115 . can do.
- the optical device may include an A/V input unit 1120 .
- the A/V (Audio/Video) input unit 1120 is for inputting an audio signal or a video signal, and may include any one or more of a camera 1121 and a microphone 1122 .
- the camera 1121 may include the camera device according to the present embodiment.
- the optical device may include a sensing unit 1140 .
- the sensing unit 1140 is for controlling the operation of the optical device by sensing the current state of the optical device, such as the opening/closing state of the optical device, the position of the optical device, the presence or absence of user contact, the orientation of the optical device, and acceleration/deceleration of the optical device.
- a sensing signal can be generated.
- the optical device is in the form of a slide phone, it is possible to sense whether the slide phone is opened or closed.
- it may be responsible for sensing functions related to whether the power supply unit 1190 supplies power, whether the interface unit 1170 is coupled to an external device, and the like.
- the optical device may include an input/output unit 1150 .
- the input/output unit 1150 may be configured to generate an input or output related to visual, auditory, or tactile sense.
- the input/output unit 1150 may generate input data for controlling the operation of the optical device, and may output information processed by the optical device.
- the input/output unit 1150 may include any one or more of a keypad unit 1130 , a display 1151 , a sound output module 1152 , and a touch screen panel 1153 .
- the keypad unit 1130 may generate input data in response to a keypad input.
- the display 1151 may output an image captured by the camera 1121 .
- the display 1151 may include a plurality of pixels whose color changes according to an electrical signal.
- the display 1151 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, or a three-dimensional display. (3D display) may include at least one of.
- the sound output module 1152 outputs audio data received from the wireless communication unit 1110 in a call signal reception, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or stored in the memory unit 1160 . Audio data can be output.
- the touch screen panel 1153 may convert a change in capacitance generated due to a user's touch on a specific area of the touch screen into an electrical input signal.
- the optical device may include a memory unit 1160 .
- a program for processing and control of the controller 1180 may be stored in the memory unit 1160 .
- the memory unit 1160 may store input/output data, for example, any one or more of a phone book, a message, an audio, a still image, a photo, and a moving image.
- the memory unit 1160 may store an image captured by the camera 1121 , for example, a photo or a video.
- the optical device may include an interface unit 1170 .
- the interface unit 1170 serves as a passage for connecting to an external device connected to the optical device.
- the interface unit 1170 may receive data from an external device, receive power and transmit it to each component inside the optical device, or transmit data inside the optical device to the external device.
- the interface unit 1170 includes a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port for connecting a device having an identification module, and an audio I/O (Input/Output) It may include any one or more of a port, a video input/output (I/O) port, and an earphone port.
- the optical device may include a controller 1180 .
- the controller 1180 may control the overall operation of the optical device.
- the controller 1180 may perform related control and processing for voice call, data communication, video call, and the like.
- the controller 1180 may include a multimedia module 1181 for playing multimedia.
- the multimedia module 1181 may be provided within the controller 1180 or may be provided separately from the controller 1180 .
- the controller 1180 may perform a pattern recognition process capable of recognizing a handwriting input or a drawing input performed on the touch screen as characters and images, respectively.
- the optical device may include a power supply unit 1190 .
- the power supply unit 1190 may receive external power or internal power under the control of the controller 1180 to supply power required for operation of each component.
- the image sensor in order to implement the OIS and AF functions of the camera module, is moved relative to the lens barrel in the X-axis, Y-axis, and Z-axis directions instead of moving the conventional lens barrel. Accordingly, the camera module according to the embodiment may remove a complicated spring structure for implementing the OIS and AF functions, and thus the structure may be simplified. In addition, by moving the image sensor according to the embodiment relative to the lens barrel, it is possible to form a stable structure compared to the conventional one.
- the second substrate to which the image sensor is attached is relatively moved with respect to the first substrate by using a wire made of a shape memory alloy.
- a wire made of a shape memory alloy it is possible to remove parts such as a magnet or a coil required for the OIS operation, thereby reducing the product cost.
- the overall thickness of the camera module may be slimmed by removing the above components.
- a shape memory alloy wire is used for the driving unit for the OIS operation, and thus magnetic field interference with the AF module can be completely resolved.
- the terminal part electrically connected to the image sensor has a spring structure and is floated and disposed in a position that does not overlap in the vertical direction with the insulating layer. Accordingly, the camera module may move the image sensor with respect to the lens barrel while stably elastically supporting the image sensor.
- the X-axis direction shift, Y-axis direction shift, and Z-axis rotation corresponding to hand shake may be performed with respect to the image sensor.
- For hand-shake correction may be performed together, and through this, a more improved hand-shake correction function may be provided.
- the reliability of the camera device can be improved.
- the first actuator and the second actuator are operated using a gyro sensor supporting a 6-axis (eg, 3-axis accelerometer and 3-axis gyroscope) dual interface.
- the first actuator and the second actuator must receive gyro data from the gyro sensor in order to implement the autofocus function and the handshake correction function.
- the gyro data obtained from one gyro sensor supporting the dual interface is provided to the first and second actuators.
- the mutual compensation operations of the autofocus function and the handshake correction function can be synchronized. reliability can be improved.
- the accuracy of the autofocus function and the handshake correction function may be improved.
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Adjustment Of Camera Lenses (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Abstract
Description
Claims (10)
- 제1 리드 패턴부 및 제1 패드가 형성된 제1 기판을 포함하는 고정부;상기 고정부와 이격되고, 센서를 포함하는 이동부; 및상기 이동부와 상기 고정부 사이에 배치되는 와이어부를 포함하고,상기 와이어부는,양단이 상기 제1 패드에 연결되고, 상기 고정부에 대해 상기 이동부를 이동시키는 형상기억 합금의 제1 와이어부; 및일단이 상기 제1 리드 패턴부에 연결되고, 타단이 상기 이동부에 연결되어 상기 이동부를 탄성 지지하는 제2 와이어부를 포함하는,센서 구동 장치.
- 제1항에 있어서,상기 이동부는 상기 센서가 배치되는 제2 기판을 포함하고,상기 제2 기판은,상기 제1 와이어부가 결합되는 힌지부를 포함하는,센서 구동 장치.
- 제2항에 있어서,상기 제1 와이어부는 복수 개로 구성되고,상기 힌지부는 상기 제1 와이어부의 수에 대응되게 복수 개로 구성되는,센서 구동 장치.
- 제2항에 있어서,상기 이동부는,상기 제2 기판과 연결되는 제3 기판을 포함하고,상기 제3 기판은 상기 제2 기판이 배치되는 개구를 포함하는,센서 구동 장치.
- 제4항에 있어서,상기 제3 기판은, 제2 리드 패턴부를 포함하고,상기 제2 와이어부의 타단은 상기 제2 리드 패턴부의 일단과 연결되는,센서 구동 장치.
- 제5항에 있어서,상기 제2 기판은 제2 패드를 포함하고,상기 제2 리드 패턴부의 타단은 상기 제2 패드와 연결되는,센서 구동 장치.
- 제5항에 있어서,상기 제2 리드 패턴부는,몸체부와,상기 제2 와이어부의 타단과 결합되는 결합부와,상기 몸체부와 상기 결합부를 연결하는 연결부를 포함하는,센서 구동 장치.
- 제5항에 있어서,상기 제1 리드 패턴부는 복수의 제1 리드 패턴을 포함하고,상기 제2 리드 패턴부는 복수의 제2 리드 패턴을 포함하며,상기 제2 와이어부는 복수의 제2 와이어를 포함하고,상기 복수의 제2 와이어의 개수는, 상기 복수의 제1 리드 패턴의 개수 및 상기 복수의 제2 리드 패턴의 각각의 개수와 같거나 적은,센서 구동 장치.
- 제6항에 있어서,상기 제3 기판은 상기 제2 리드 패턴부가 배치되는 절연층을 포함하고,상기 제2 리드 패턴부는 상기 제2 와이어부와 연결되는 일단부 및 상기 제2 패드와 연결되는 타단부가 상기 절연층과 광축 방향으로 중첩되지 않는,센서 구동 장치.
- 제7항에 있어서,상기 제2 리드 패턴부의 연결부는 절곡된 영역을 포함하는,센서 구동 장치.
Priority Applications (4)
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JP2023535531A JP2023553154A (ja) | 2020-12-09 | 2021-12-09 | カメラモジュール |
EP21903879.1A EP4262187A4 (en) | 2020-12-09 | 2021-12-09 | SENSOR DRIVE DEVICE |
US18/256,690 US20240040256A1 (en) | 2020-12-09 | 2021-12-09 | Sensor driving device |
CN202180089558.XA CN116686297A (zh) | 2020-12-09 | 2021-12-09 | 传感器驱动装置 |
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KR10-2020-0171220 | 2020-12-09 | ||
KR1020200171220A KR20220081580A (ko) | 2020-12-09 | 2020-12-09 | 센서 구동 장치 |
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WO2022124834A1 true WO2022124834A1 (ko) | 2022-06-16 |
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US (1) | US20240040256A1 (ko) |
EP (1) | EP4262187A4 (ko) |
JP (1) | JP2023553154A (ko) |
KR (1) | KR20220081580A (ko) |
CN (1) | CN116686297A (ko) |
TW (1) | TW202239187A (ko) |
WO (1) | WO2022124834A1 (ko) |
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- 2020-12-09 KR KR1020200171220A patent/KR20220081580A/ko active Search and Examination
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2021
- 2021-12-09 JP JP2023535531A patent/JP2023553154A/ja active Pending
- 2021-12-09 US US18/256,690 patent/US20240040256A1/en active Pending
- 2021-12-09 EP EP21903879.1A patent/EP4262187A4/en active Pending
- 2021-12-09 CN CN202180089558.XA patent/CN116686297A/zh active Pending
- 2021-12-09 WO PCT/KR2021/018684 patent/WO2022124834A1/ko active Application Filing
- 2021-12-09 TW TW110146148A patent/TW202239187A/zh unknown
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JP2015121818A (ja) * | 2009-08-21 | 2015-07-02 | ミツミ電機株式会社 | レンズ駆動装置、カメラモジュール及びカメラ |
KR20150022637A (ko) * | 2013-08-23 | 2015-03-04 | 삼성전기주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
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KR20220081580A (ko) | 2022-06-16 |
CN116686297A (zh) | 2023-09-01 |
JP2023553154A (ja) | 2023-12-20 |
EP4262187A4 (en) | 2024-05-01 |
TW202239187A (zh) | 2022-10-01 |
EP4262187A1 (en) | 2023-10-18 |
US20240040256A1 (en) | 2024-02-01 |
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