WO2022113738A1 - Condensateur à film, condensateur combiné, onduleur et véhicule électrique - Google Patents

Condensateur à film, condensateur combiné, onduleur et véhicule électrique Download PDF

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Publication number
WO2022113738A1
WO2022113738A1 PCT/JP2021/041303 JP2021041303W WO2022113738A1 WO 2022113738 A1 WO2022113738 A1 WO 2022113738A1 JP 2021041303 W JP2021041303 W JP 2021041303W WO 2022113738 A1 WO2022113738 A1 WO 2022113738A1
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WO
WIPO (PCT)
Prior art keywords
film
film capacitor
inverter
capacitor
laminated
Prior art date
Application number
PCT/JP2021/041303
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English (en)
Japanese (ja)
Inventor
裕貴 妹尾
信裕 小林
一輝 今川
直樹 菊池
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京セラ株式会社
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Publication of WO2022113738A1 publication Critical patent/WO2022113738A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

Definitions

  • This disclosure relates to film capacitors, articulated capacitors, inverters and electric vehicles.
  • Patent Document 1 An example of the prior art is described in Patent Document 1.
  • the film capacitor of the present disclosure is a film capacitor having a main body portion in which a plurality of laminated bodies are laminated.
  • Each laminate is A film capacitor element in which a plurality of metallized films having a dielectric film and a metal layer located on one surface of the dielectric film are laminated. It has a moisture absorbing film located on the upper surface and the lower surface of the film capacitor element.
  • the articulated capacitor of the present disclosure includes a plurality of film capacitors and a bus bar for connecting the plurality of film capacitors.
  • the film capacitor includes the film capacitor according to any one of claims 1 to 3.
  • the inverter of the present disclosure includes a bridge circuit configured by a switching element and a capacitance section connected to the bridge circuit, and the capacitance section includes the film capacitor.
  • the electric vehicle of the present disclosure includes a power supply, an inverter connected to the power supply, a motor connected to the inverter, and wheels driven by the motor, and the inverter is the inverter.
  • FIG. 1 It is sectional drawing of the film capacitor which concerns on 1st Embodiment of this disclosure. It is a top view of the film capacitor shown in FIG. 1 as seen from the arrow A. It is a schematic diagram for demonstrating the manufacturing procedure of a film capacitor. It is a schematic diagram for demonstrating the manufacturing procedure of a film capacitor. It is a schematic diagram for demonstrating the manufacturing procedure of a film capacitor. It is a schematic diagram for demonstrating the manufacturing procedure of a film capacitor. It is a figure which shows the oxidation state of the Al film electrode after a high temperature bias test. It is sectional drawing of the film capacitor which concerns on 2nd Embodiment. It is a perspective view which shows one of the examples of a concatenated capacitor schematically. It is a schematic block diagram for demonstrating one of the examples of an inverter. It is a schematic block diagram of an electric vehicle.
  • a rubber-like silicon resin is formed around a film capacitor element formed by laminating or winding a metallized film having a metal layer on one surface of a dielectric film.
  • a structure is known in which a coating layer mainly composed of a polymer material contained therein is formed.
  • Patent Document 1 describes a caseless structure in which a metallized film capacitor having excellent moisture permeability resistance is covered with a low moisture permeability film from a metallicon to a part of the exterior film of the metallized film column.
  • Metallised film capacitors are disclosed.
  • the moisture permeability of the low moisture permeability film of the metallized film capacitor disclosed in Patent Document 1 is not zero, and in a high temperature environment, moisture may infiltrate into the film capacitor element. Moisture that has penetrated into the film capacitor element may not be released to the outside because the film has low moisture permeability, and may stay in the film capacitor element. When the metal layer contains aluminum, the anodizing of the metallized film may proceed due to the water retained in the film capacitor element.
  • An object of the present disclosure is to provide a film capacitor capable of reducing water retention in a film capacitor element.
  • FIG. 1 is a cross-sectional view of a film capacitor according to the first embodiment of the present disclosure.
  • FIG. 2 is a plan view of the film capacitor shown in FIG. 1 as viewed from the arrow A.
  • FIG. 3 is a schematic diagram for explaining a procedure for manufacturing a film capacitor.
  • the film capacitor 1 is a film capacitor 1 having a main body 8 in which a plurality of laminated bodies 2 are laminated.
  • the laminated body 2 is a film capacitor element 3 in which a plurality of metallized films 13 having a dielectric film 13a and a metal layer 13b located on one surface of the dielectric film 13a are laminated, and an upper surface of the film capacitor element 3. It has a moisture absorbing film 6 located on the lower surface 5 and the lower surface 5.
  • the film capacitor 1 is provided with a low moisture permeability film 14 on the upper surface 11 and the lower surface 12 of the main body 8.
  • the procedure for manufacturing the laminated film capacitor 1 will be described with reference to FIG.
  • the film capacitor 1 is obtained as follows.
  • the dielectric film 13a For the dielectric film 13a, for example, a resin solution in which an insulating resin is dissolved in a solvent is prepared, and the resin solution is formed into a sheet on the surface of a base film made of, for example, polyethylene terephthalate (PET) and dried. Obtained by volatilizing the solvent.
  • a well-known film forming method such as a doctor blade method, a die coater method and a knife coater method can be appropriately selected.
  • Examples of the solvent used for molding include methanol, isopropanol, n-butanol, ethylene glycol, ethylene glycol monopropyl ether, methyl ethyl ketone, methyl isobutyl ketone, xylene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, dimethyl acetamide, and cyclohexane. , Or an organic solvent containing a mixture of two or more selected from these may be used. Further, the resin film produced by the melt extrusion method may be stretched.
  • the dielectric film 13a may be composed of only the above-mentioned insulating resin, or may contain other materials.
  • the components other than the resin contained in the dielectric film 13a are, for example, the above-mentioned organic solvent and inorganic filler.
  • the inorganic filler for example, inorganic oxides such as alumina, titanium oxide and silicon dioxide, inorganic nitrides such as silicon nitride, and glass can be used.
  • the inorganic filler may be subjected to surface treatment such as silane coupling treatment and titanate coupling treatment. By surface-treating the inorganic filler, the compatibility between the inorganic filler and the resin can be enhanced.
  • the dielectric film 13a may be a composite film containing less than 50% by mass of the inorganic filler and 50% by mass or more of the resin as described above. By using the dielectric film 13a as a composite film, it is possible to obtain effects such as improvement of the relative permittivity by the inorganic filler while maintaining the flexibility of the resin.
  • the size of the inorganic filler may be, for example, an average particle size of 4 to 1000 nm.
  • a metal component such as aluminum (Al) is vapor-deposited on one surface of the dielectric film 13a to form a metal film, whereby a metal layer 13b is obtained. ..
  • a plurality of film capacitor elements 3 in which a plurality of metallized films 13 having a dielectric film 13a and a metal layer 13b provided on one surface of the dielectric film 13a are laminated are manufactured. For example, 2 to 100 film capacitor elements 3 are manufactured.
  • a moisture absorbing film 6 is attached to the upper surface 7 and the lower surface 5 of each of the produced film capacitor elements 3, to produce a plurality of laminated bodies 2.
  • the main body 8 is manufactured by laminating a plurality of laminated bodies 2.
  • a low moisture permeability film 14 is attached to the upper surface 11 and the lower surface 12 of the main body 8 to manufacture a film capacitor 1.
  • Examples of the material of the dielectric film 13a include polypropylene (PP), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), polyarylate (PAR), polyphenylene ether (PPE), and polyetherimide (PEI). ), Cycloolefin polymer (COP) and the like.
  • Polypropylene (PP) polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), polyarylate (PAR), polyphenylene ether (PPE), and polyetherimide (PEI).
  • COP Cycloolefin polymer
  • Polyarylate (PAR) in particular has a high breakdown voltage.
  • the thickness of the dielectric film 13a may be, for example, 0.7 ⁇ m or more on average, or 4 ⁇ m or less. By setting the average thickness of the dielectric film 13a to 0.7 ⁇ m or more, it is possible to achieve both slipperiness with the metal layer 13b and a breakdown voltage. By setting the average thickness of the dielectric film 13a to 4 ⁇ m or less, the capacitance can be increased.
  • the metal layer 13b for example, one containing aluminum (Al), zinc (Zn), copper (Cu) or titanium (Ti) as a main component may be used.
  • the thickness of the metal film 2 may be, for example, 14 to 70 nm on average.
  • the thickness (average thickness) of the metal layer 13b By setting the thickness (average thickness) of the metal layer 13b to a thin layer of 14 to 70 nm, the metal layer 13b adheres to the dielectric film 13a and is less likely to be torn even when tension is applied to the metal layer 13b. Therefore, a sufficient effective area that contributes to the capacitance can be obtained. Further, by setting the average thickness of the metal layer 13b to 14 nm or more, the capacity decrease at the time of dielectric breakdown is reduced and the dielectric breakdown voltage is improved.
  • the plurality of laminated bodies 2 are laminated to form a main body portion 8 incorporating a moisture absorbing film 6 inside.
  • an external electrode 18 is attached to the facing side surface 17 of the main body 8 by a metallikon or the like, and the upper surface 11 and the lower surface 12 of the main body 8 have low moisture permeability as shown in FIG. 3D.
  • the film 14 is attached.
  • FIG. 4 is a diagram showing an oxidation state of the Al film electrode after the high temperature bias test.
  • the high temperature bias test was carried out under unprecedented high temperature load conditions (temperature: 125 ° C., applied voltage: 420 V, voltage applied time: 1000 hours).
  • the formula showing the oxidation reaction of the Al film electrode by water is shown below. 2Al + 3H 2 O ⁇ Al 2 O 3 + 6H + + 6e -
  • anodic oxidation due to moisture is remarkable on the uppermost surface 1 which is the uppermost surface of the first layer of the film capacitor element 3 and the lowermost surface 20 which is the lowermost surface of the 20th layer of the film capacitor element 3.
  • the oxidation progress of the vapor-deposited aluminum electrode is large and the whitening (transparency) area of the electrode due to oxide formation is large as compared with the other layers.
  • the central portion in the lateral direction (outer electrode direction) of the photograph shown in FIG. 4 is preferentially oxidized.
  • FIG. 4 suggests that water is supplied from the uppermost surface 1 and the lowermost surface 20 of the film capacitor element 3. Therefore, in the present embodiment, the moisture absorbing film 6 is provided on the upper surface and the lower surface of the film capacitor element 3.
  • the position where the moisture absorbing film is arranged is not limited to this, and may include a region other than the upper surface and the lower surface of the film capacitor 3.
  • the moisture absorbing film 6 is located on the upper surface 7 and the lower surface 5 of the film capacitor element 3, and the low moisture permeable film 14 is located on the upper surface 11 and the lower surface 12 of the main body 8. ing.
  • the thickness of the moisture absorbing film 6 is preferably 10 ⁇ m to 100 ⁇ m.
  • the shape and size of the moisture absorbing film 6 in a plan view are the same as the shape and size of the upper surface 7 and the lower surface 5 of the film capacitor element 3 as shown in FIG. 2, which is the A arrow view of the film capacitor 1.
  • a film having a hydrophilic group such as silicon rubber containing a molecular sieve is used.
  • the molecular sieve is contained in an amount of 1 to 20% by weight based on the weight of the rubber resin.
  • 5A POWDER (trade name) manufactured by Union Showa Co., Ltd. can be used.
  • the shape and size of the low moisture permeability film 14 in a plan view are the same as the shape and size of the upper surface 11 and the lower surface 12 of the main body 8.
  • the low moisture permeable film 14 polyethylene terephthalate, polyphenylene sulfide, polycarbonate, epoxy resin and the like are used.
  • the low moisture permeability film 14 is not limited to being located on the upper surface 11 and the lower surface 12 of the main body 8, but is located in a region including a region other than the upper surface 11 and the lower surface 12 of the main body 8, for example. You may have.
  • the thickness of the low moisture permeable film is 10 ⁇ m to 100 ⁇ m.
  • the low moisture permeability film can be used by only one sheet, or several sheets can be stacked and used.
  • the moisture permeability of the low moisture permeability film is preferably 5 g / m 2.24 hr or less, and for example, polyethylene terephthalate having a thickness of 25 ⁇ m corresponds to this.
  • the moisture absorbing film 6 is a film having a uniform thickness, and is adhered in parallel to the upper surface and the lower surface of the film capacitor element 3 without gaps.
  • the low moisture permeability film 14 is a film having a uniform thickness, and is adhered in parallel to the upper surface and the lower surface of the main body 8 without gaps.
  • the moisture absorbing film 6 is located on the upper surface 7 and the lower surface 5 of the film capacitor element 3, whereby the moisture absorbing film 6 is incorporated in the film capacitor 1. Moisture supplied from the outside into the film capacitor 1 can be absorbed by the moisture absorbing film 6. Further, in a high temperature environment, the moisture absorbing film 6 can absorb the moisture generated in the film capacitor 1.
  • the low moisture permeability film 14 can reduce the amount of water supplied to the film capacitor 1 from the outside from being supplied into the film capacitor 1.
  • the moisture supplied into the film capacitor 1 is adsorbed by the moisture absorbing film 6 taken into the film capacitor 1.
  • the solvent in the film capacitor 1 can be adsorbed by the moisture absorbing film 6, the generation of BDE (dielectric breakdown electric field) due to the solvent can be reduced. Further, since the evaporated molecules at the time of self-healing can be adsorbed by the moisture absorbing film 6, the occurrence of short-circuit fracture can be reduced. Further, when a rubber resin such as silicon rubber is used as the moisture absorbing film 6, the elasticity of the rubber resin can reduce mechanical stress.
  • Examples of the solvent used for molding include methanol, isopropanol, n-butanol, ethylene glycol, ethylene glycol monopropyl ether, methyl ethyl ketone, methyl isobutyl ketone, xylene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, dimethyl acetamide, and cyclohexane. , Or an organic solvent containing a mixture of two or more selected from these may be used.
  • the main body 8 is formed by laminating a plurality of laminated bodies 2, the dielectric film 13a of the first laminated body 2 and the second laminated body 2 of the two laminated bodies 2 that are laminated side by side are formed.
  • the moisture absorbing film 6 can be positioned between the metal layer 13b and the metal layer 13b. With this moisture absorbing film 6, the moisture absorbing layer 19 can be formed between the dielectric film 13a and the metal layer 13b, and the moisture in the main body 8 can be effectively absorbed.
  • FIG. 5 is a cross-sectional view of the film capacitor 101 according to the second embodiment.
  • the film capacitor 101 according to the second embodiment will be described. The description overlapping with the first embodiment is omitted, and the same reference numerals are used.
  • the adjacent laminated bodies 2 are alternately laminated upside down.
  • the capacitance of the film capacitor 101 is reduced, but no voltage is applied between the adjacent moisture-absorbing films 6 and no voltage is applied between the adjacent moisture-absorbing films 6 of the laminated body 2. It is possible to reduce the decrease in the insulation resistance IR and the increase in the leakage current.
  • FIG. 6 is a perspective view schematically showing one of the examples of the connected capacitor.
  • the description of the exterior resin covering the case and the surface of the capacitor is omitted.
  • the connected capacitor C a plurality of laminated film capacitors are connected in parallel by a pair of bus bars 21 and 23.
  • the bus bars 21 and 23 have terminal portions 21a and 23a for external connection and drawer terminal portions 21b and 23b.
  • the extraction terminal portions 21b and 23b are connected to the external electrodes 4a and 4b of the film capacitor, respectively.
  • the film capacitor of the articulated capacitor C includes the film capacitor 1 in which the moisture absorbing film is located on the upper surface and the lower surface of the film capacitor element, the articulated capacitor C which is hard to be anodized can be obtained.
  • the articulated capacitor C may have at least one film capacitor 1 or may have two or more film capacitors 1.
  • the articulated capacitor C is obtained by attaching bus bars 21 and 23 to the external electrodes at both ends of the main body 8 via a joining material in a state where a plurality of film capacitors, for example, four film capacitors are arranged side by side as shown in FIG. ..
  • the film capacitors may be arranged in a plane as shown in FIG. 6, or the film capacitors may be arranged in a stacked manner. Further, the film capacitor may be arranged so that the direction in which the external electrode 4 is located is along the vertical direction.
  • FIG. 7 is a schematic configuration diagram for explaining one of the examples of the inverter.
  • FIG. 7 shows an inverter D that produces alternating current from direct current.
  • the inverter D includes a bridge circuit 31 and a capacitance unit 33.
  • the bridge circuit 31 is composed of a switching element such as an IGBT (Insulated Gate Bipolar Transistor) and a diode.
  • the capacitance unit 33 is arranged between the input terminals of the bridge circuit 31 to stabilize the voltage.
  • the inverter D includes the above-mentioned film capacitor 1 as the capacitance unit 33.
  • the inverter D is connected to a booster circuit 35 that boosts the voltage of the DC power supply.
  • the bridge circuit 31 is connected to the motor generator M which is a drive source.
  • FIG. 8 is a schematic configuration diagram of an electric vehicle.
  • FIG. 7 shows a hybrid electric vehicle (HEV) as one of the examples of the electric vehicle.
  • HEV hybrid electric vehicle
  • the electric vehicle E includes a driving motor 41, an engine 43, a transmission 45, an inverter 47, a power supply or a battery 49, front wheels 51a, and rear wheels 51b.
  • the electric vehicle E has the output of the motor 41, the engine 43, or both as a drive source.
  • the output of the drive source is transmitted to the pair of left and right front wheels 51a via the transmission 45.
  • the power supply 49 is connected to the inverter 47, and the inverter 47 is connected to the motor 41.
  • the electric vehicle E shown in FIG. 8 includes a vehicle ECU 53 and an engine ECU 57.
  • the vehicle ECU 53 controls the entire electric vehicle E in an integrated manner.
  • the engine ECU 57 controls the rotation speed of the engine 43 to drive the electric vehicle E.
  • the electric vehicle E further includes an ignition device 55 operated by a driver or the like, and a driving device such as an accelerator pedal and a brake (not shown).
  • a drive signal corresponding to the operation of the driving device by the driver or the like is input to the vehicle ECU 53.
  • the vehicle ECU 53 outputs an instruction signal to the engine ECU 57, the power supply 49, and the inverter 47 as a load based on the drive signal.
  • the engine ECU 57 controls the rotation speed of the engine 43 in response to an instruction signal to drive the electric vehicle E.
  • the inverter D that is, the inverter D including the film capacitor 1 in the capacitance portion 33 is used.
  • the film capacitor 1 is difficult to anodize, the anodization of the film capacitor 1 can be suppressed to a small value for a long period of time even in a harsh environment such as an engine control unit.
  • the current control of the control device such as the ECU can be made more stable.
  • the inverter D of the present embodiment can be applied not only to the above-mentioned hybrid vehicle (HEV) but also to various power conversion application products such as an electric vehicle (EV), a fuel cell vehicle, an electric bicycle, a generator, or a solar cell. ..
  • the film capacitor of the present disclosure is a film capacitor having a main body portion in which a plurality of laminated bodies are laminated.
  • Each laminate is A film capacitor element in which a plurality of metallized films having a dielectric film and a metal layer located on one surface of the dielectric film are laminated. It has a moisture absorbing film located on the upper surface and the lower surface of the film capacitor element.
  • the articulated capacitor of the present disclosure includes a plurality of film capacitors and a bus bar for connecting the plurality of film capacitors.
  • the film capacitor includes the film capacitor according to any one of claims 1 to 3.
  • the inverter of the present disclosure includes a bridge circuit configured by a switching element and a capacitance section connected to the bridge circuit, and the capacitance section includes the film capacitor.
  • the electric vehicle of the present disclosure includes a power supply, an inverter connected to the power supply, a motor connected to the inverter, and wheels driven by the motor, and the inverter is the inverter.
  • the water content accumulated in the film capacitor element can be reduced, and thereby the anodizing of the metal layer can be reduced.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Ce condensateur à film est formé par stratification d'une pluralité d'unités de stratification, chacune comprenant : un élément de condensateur à film obtenu par stratification d'une pluralité de films métallisés, chacun ayant un film diélectrique et une couche métallique positionnée sur une surface du film diélectrique ; et des films d'absorption d'humidité qui sont positionnés sur la surface supérieure et la surface inférieure de l'élément de condensateur à film.
PCT/JP2021/041303 2020-11-30 2021-11-10 Condensateur à film, condensateur combiné, onduleur et véhicule électrique WO2022113738A1 (fr)

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JP2020-199155 2020-11-30
JP2020199155 2020-11-30

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WO2022113738A1 true WO2022113738A1 (fr) 2022-06-02

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229323A (ja) * 2002-02-01 2003-08-15 Matsushita Electric Ind Co Ltd フィルムコンデンサ
JP2012099552A (ja) * 2010-10-29 2012-05-24 Toyota Motor Corp 金属化フィルムコンデンサ
JP2013162027A (ja) * 2012-02-07 2013-08-19 Toyota Motor Corp 金属化フィルムコンデンサ
WO2019188684A1 (fr) * 2018-03-29 2019-10-03 京セラ株式会社 Condensateur à film, condensateur connecté, onduleur et véhicule électrique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229323A (ja) * 2002-02-01 2003-08-15 Matsushita Electric Ind Co Ltd フィルムコンデンサ
JP2012099552A (ja) * 2010-10-29 2012-05-24 Toyota Motor Corp 金属化フィルムコンデンサ
JP2013162027A (ja) * 2012-02-07 2013-08-19 Toyota Motor Corp 金属化フィルムコンデンサ
WO2019188684A1 (fr) * 2018-03-29 2019-10-03 京セラ株式会社 Condensateur à film, condensateur connecté, onduleur et véhicule électrique

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