WO2022111132A1 - 传感器封装结构及差压传感器 - Google Patents

传感器封装结构及差压传感器 Download PDF

Info

Publication number
WO2022111132A1
WO2022111132A1 PCT/CN2021/124544 CN2021124544W WO2022111132A1 WO 2022111132 A1 WO2022111132 A1 WO 2022111132A1 CN 2021124544 W CN2021124544 W CN 2021124544W WO 2022111132 A1 WO2022111132 A1 WO 2022111132A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
signal processing
chip
ventilation hole
substrate
Prior art date
Application number
PCT/CN2021/124544
Other languages
English (en)
French (fr)
Inventor
闫文明
Original Assignee
潍坊歌尔微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2022111132A1 publication Critical patent/WO2022111132A1/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
    • G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits

Definitions

  • the present application relates to the technical field of sensors, and in particular, to a sensor packaging structure and a differential pressure sensor.
  • the packaging structure of differential pressure sensors mostly adopts the transistor outline (TO) type packaging, the packaging process is complex, the product volume is large, and the waterproof characteristics are poor, and there is only one gauge pressure MEMS in the package.
  • Temperature linear compensation function For the differential pressure sensor that needs to perform temperature compensation, it is usually necessary to perform temperature linear compensation by combining the differential pressure sensor in the primary package with an application specific integrated circuit (ASIC) chip and then perform the secondary package to achieve temperature linear compensation, which is inconvenient to apply.
  • ASIC application specific integrated circuit
  • the existing differential pressure sensor occupies a large volume due to the limitation of the packaging structure, which is not conducive to the miniaturization design of the product.
  • the main purpose of the present application is to provide a sensor package structure and a differential pressure sensor, which are intended to solve the technical problems of poor waterproof performance of the differential pressure sensor, inconvenient application and unfavorable miniaturization design of products.
  • the sensor package structure provided by this application includes:
  • the shell is provided with a first ventilation hole
  • the casing is arranged on the base plate and forms a receiving space with the base plate, the base plate is provided with a second ventilation hole, and the first ventilation hole and the second ventilation hole are both connected with the accommodation space connected;
  • a sensor chip and a signal processing chip are accommodated in the accommodating space, the sensor chip is electrically connected to the signal processing chip and stacked on the substrate, and the sensor chip is located on the signal processing chip away from the one side of the substrate; the sensor chip has a vibration cavity, the signal processing chip is provided with a third ventilation hole, and the vibration cavity communicates with the second ventilation hole through the third ventilation hole;
  • the waterproof glue is filled in the receiving space and covers the sensor chip and the signal processing chip.
  • the sensor chip is adhered to a side of the signal processing chip away from the substrate through a first sealant layer, and the first sealant layer is annularly surrounded on the third pass. the periphery of the stomata.
  • the signal processing chip is bonded to the substrate through a second sealant layer, and the second sealant layer is annularly arranged on the outer periphery of the second air hole.
  • the shell includes a shell body and a mounting portion, one end of the shell body is bonded to the substrate through a conductive adhesive layer, and the other end of the shell body is connected to the mounting portion; the The mounting portion is cylindrical, and the first vent hole is formed at one end of the mounting portion away from the housing body, and the waterproof glue is filled in the housing body and extends into the mounting portion.
  • a sealing groove is formed on the outer circumference of the mounting portion, and the sealing groove is annularly arranged and recessed from the outside to the inside.
  • the sensor chip is electrically connected to the signal processing chip through metal wires.
  • the first ventilation hole, the second ventilation hole and the third ventilation hole are all disposed facing the vibration cavity.
  • a plurality of pads are provided on a side of the substrate away from the receiving space, and the plurality of pads are arranged at intervals.
  • At least one of the pads is a ring pad, and the rest of the pads are rectangular pads, and the ring pad is surrounded by the second vent hole.
  • the rectangular pads are arranged close to the edge of the substrate.
  • the present application also proposes a differential pressure sensor, including the sensor package structure as described above.
  • the sensitive film of the sensor chip is deformed according to the pressure difference formed by the waterproof glue and the second vent hole, which causes the resistance value on the sensitive film to change, and converts the physical quantity representing the pressure difference into pressure according to the deformation.
  • the signal is transmitted to the signal processing chip, the signal processing chip performs signal processing on the pressure signal, and performs temperature compensation on the pressure signal according to the pre-stored temperature coefficient, and finally outputs the compensated pressure signal to realize the temperature linear compensation function, so that the differential pressure sensor Integrated temperature linear compensation function, easy to apply.
  • the waterproof glue covers the sensor chip and the signal processing chip, which plays the role of air pressure transmission, waterproof and anti-corrosion, good sealing and waterproof effect, and improves the waterproof characteristics of the differential pressure sensor.
  • the sensor chip and the signal processing chip of the present application adopt a laminated design, the sensor chip and the signal processing chip are stacked, and the stacked sensor chip and the signal processing chip save the occupied volume, reduce the package size, and have a more compact structure , Small and small, which is conducive to the miniaturized design of the product.
  • FIG. 1 is a schematic cross-sectional view of a sensor package structure according to an embodiment of the present application.
  • FIG. 2 is a schematic bottom view of a sensor package structure according to an embodiment of the present application.
  • the present application proposes a sensor package structure.
  • the sensor packaging structure 100 of this embodiment includes a casing 10 , a substrate 20 , a sensor chip 30 , a signal processing chip 40 and a waterproof glue 60 , wherein the casing 10 is provided with a first ventilation hole 11 , and the casing 10 is arranged on the substrate 20 and forms a receiving space 50 with the substrate 20, the substrate 20 is provided with a second ventilation hole 21, the first ventilation hole 11 and the second ventilation hole 21 are both communicated with the receiving space 50; the sensor chip 30 and the signal processing The chips 40 are all accommodated in the accommodating space 50 , the sensor chip 30 is electrically connected to the signal processing chip 40 and is stacked on the substrate 20 , and the sensor chip 30 is located on the side of the signal processing chip 40 away from the substrate 20 ; the sensor chip 30 has vibration In the cavity 31 , the signal processing chip 40 is provided with a third ventilation hole 41 , and the vibration cavity 31 communicates with the second ventilation hole 21 through the third ventilation hole 41 .
  • the waterproof glue 60 is filled in the receiving
  • the housing 10 is covered above the substrate 20 , and forms a receiving space 50 with the substrate 20 , so as to accommodate the sensor chip 30 and the signal processing chip 40 , and has a compact structure.
  • the sensor chip 30 and the signal processing chip 40 in this embodiment adopt a laminated design, the sensor chip 30 and the signal processing chip 40 are stacked on top of each other, and the stacked sensor chip 30 and the signal processing chip 40 save the occupied volume and reduce the Small package size, more compact and small structure, which is conducive to the miniaturized design of products.
  • the waterproof glue 60 in this embodiment is filled in the receiving space 50 and covers the sensor chip 30 and the signal processing chip 40 in all directions.
  • the casing 10 is provided with a first vent hole 11 .
  • the first vent hole 11 is located above the sensor chip 30 and the waterproof glue 60 .
  • the first vent hole 11 can be used as the upper sensing end of the sensor chip 30 and is transmitted to the sensor through the waterproof glue 60 .
  • the chip 30 performs top air pressure detection, and the substrate 20 is provided with a second vent hole 21 , the second vent hole 21 is located below the sensor chip 30 , and the shell of the second vent hole 21 can be used as the lower sensing end of the sensor chip 30 . Perform a bottom air pressure test.
  • the signal processing chip 40 is provided with a third ventilation hole 41 to communicate the second ventilation hole 21 and the vibration cavity 31 .
  • the sensitive film of the sensor chip 30 is deformed according to the pressure difference formed by the upper sensing end and the lower sensing end, thereby causing the resistance value on the sensitive film to change, and the pressure will be expressed according to the deformation.
  • the physical quantity of the difference is converted into a pressure signal and transmitted to the signal processing chip 40.
  • the signal processing chip 40 performs signal processing on the pressure signal, and performs temperature compensation on the pressure signal according to the pre-stored temperature coefficient, and finally outputs the compensated pressure signal to realize the temperature
  • the linear compensation function makes the differential pressure sensor integrated with the temperature linear compensation function, which is convenient for application.
  • the waterproof glue 60 in this embodiment can use the silicone gel in the prior art.
  • the silicone gel has the physical properties of waterproof, anti-corrosion, low modulus and high elasticity.
  • the pressure change is converted into a deformation amount and transmitted to the sensor chip 30 .
  • the waterproof glue 60 covers the sensor chip 30 and the signal processing chip 40, plays the role of air pressure transmission, waterproof and anti-corrosion, has good sealing and waterproof effect, and improves the waterproof performance of the differential pressure sensor.
  • the sensor chip 30 is bonded to the side of the signal processing chip 40 away from the substrate 20 through the first sealant layer 70 , and the first sealant layer 70 is annularly disposed on the outer periphery of the third air hole 41 .
  • the bottom of the sensor chip 30 is bonded to the upper side of the signal processing chip 40 through the first sealant layer 70 , and the first sealant layer 70 is in a ring-shaped closed structure, surrounded by the third vent hole 41 .
  • the outer periphery further surrounds the third vent hole 41, which plays a sealing role, prevents pressure leakage from the third vent hole 41, and improves the detection sensitivity and accuracy of the differential pressure sensor.
  • the first sealant layer 70 in this embodiment can be made of silica gel in the prior art, and the sensor chip 30 is bonded to the signal processing chip 40 through the silica gel, which is convenient and simple to assemble.
  • the signal processing chip 40 is bonded to the substrate 20 through the second sealant layer 80 , and the second sealant layer 80 is annularly arranged on the outer periphery of the second air hole 21 .
  • the lower side of the signal processing chip 40 is bonded to the substrate 20 through the second sealant layer 80 , and the second sealant layer 80 is in an annular closed structure and surrounds the outer periphery of the second vent hole 21 .
  • the second vent hole 21 is surrounded to play a sealing role, preventing pressure leakage from the second vent hole 21, and improving the detection sensitivity and accuracy of the differential pressure sensor.
  • the second sealant layer 80 in this embodiment can be made of silica gel in the prior art, and the signal processing chip 40 is bonded to the substrate 20 through the silica gel, which is simple and convenient to assemble.
  • the casing 10 of this embodiment includes a casing body 12 and a mounting portion 13.
  • One end of the casing body 12 is bonded to the substrate 20 through the conductive adhesive layer 90, and the other end of the casing body 12 is connected to the mounting portion 13;
  • the mounting portion 13 is cylindrical , and the first vent hole 11 is formed at the end of the mounting portion 13 away from the housing body 12 , and the waterproof glue 60 is filled in the housing body 12 and extends into the mounting portion 13 .
  • the housing body 12 and the mounting portion 13 of the housing 10 are integrally formed, wherein the upper portion of the housing body 12 is connected to the mounting portion 13 , the lower portion of the housing body 12 is connected to the base plate 20 , and the mounting portion 13 is cylindrical
  • the mounting portion 13 , the housing body 12 and the base plate 20 enclose the receiving space 50 .
  • the housing 10 can protect the sensor chip 30 and the signal processing chip 40 accommodated in the accommodating space 50 .
  • the casing 10 in this embodiment is a metal casing 10 , which can be made of flavonoids, has good strength, and can be nickel-plated or gold-plated on the surface to prevent corrosion.
  • the base plate 20 is a PCB board, and the lower end of the casing body 12 in the casing 10 is bonded to the base plate 20 through the conductive adhesive layer 90 . While the casing 10 and the base plate 20 are assembled, the casing 10 and the PCB board are connected to each other, which plays a role in signal shielding. It can improve the detection sensitivity and accuracy of the differential pressure sensor.
  • the mounting portion 13 is provided in a cylindrical shape, which can form an air intake channel connecting the first vent hole 11 with the receiving space 50 , and the waterproof glue 60 is filled in the housing body 12 to connect the sensor chip 30 and the signal
  • the processing chip 40 is covered, so as to seal the sensor chip 30 and the signal processing chip 40, and play a waterproof role.
  • the waterproof glue 60 may extend upward into the mounting portion 13 .
  • a sealing groove 131 is formed on the outer circumference of the mounting portion 13 , and the sealing groove 131 is arranged in an annular shape and is recessed from the outside to the inside.
  • a sealing groove 131 having a closed annular structure is formed on the outer periphery of the cylindrical mounting portion 13 , and the sealing groove 131 is recessed from the outside to the inside for installing an O-ring.
  • the housing can be sealed with the application terminal through the sealing groove 131 and the O-ring.
  • the purpose of installing the O-ring in the sealing groove 131 is to seal the connection between the housing 10 and the application terminal, and in a special environment, prevent water from entering the differential pressure sensor, and play the role of sealing and waterproofing.
  • the sensor chip 30 is electrically connected to the signal processing chip 40 through the metal wire 101 .
  • the metal wire 101 can use the existing gold wire, aluminum wire or copper wire, etc., to realize the signal transmission between the sensor chip 30 and the signal processing chip 40 . Further, in order to improve the reliability, corrosion resistance and electrical conductivity of signal transmission, the metal wire 101 in this embodiment is preferably a gold wire. Understandably, the signal processing chip 40 may be electrically connected to the substrate 20 through the metal wire 101 to facilitate signal transmission.
  • the first ventilation hole 11 , the second ventilation hole 21 and the third ventilation hole 41 are all disposed facing the vibration chamber 31 .
  • the first air hole 11 is located directly above the sensor chip 30 and is disposed opposite to the vibration cavity 31 , so that the gas entering from the first air hole 11 can directly act on the sensor chip 30 , and the sensor chip 30 can directly Sensing the upper sensing end pressure.
  • the second vent hole 21 and the third vent hole 41 are located directly below the sensor chip 30, and are disposed opposite the vibration cavity 31, so that the gas entering from the second vent hole 21 directly acts on the sensor chip 30, and the sensor can be By directly sensing the pressure at the lower sensing end, the sensing effect of the sensor package structure 100 is improved, and the detection sensitivity and accuracy of the differential pressure sensor are further improved.
  • the signal processing chip 40 is an ASIC (Application Specific Integrated Circuit) chip, and the sensor chip 30 is a MEMS chip.
  • the ASIC chip provides external bias for the MEMS chip. Effective biasing will allow the MEMS chip to maintain stable acoustic and electrical parameters over the entire operating temperature range. It also supports the design of MEMS chips with different sensitivities.
  • a plurality of pads 22 are provided on the side of the substrate 20 away from the receiving space 50 , and the plurality of pads 22 are arranged at intervals.
  • the lower side of the substrate 20 is provided with a plurality of pads 22 , and the plurality of pads 22 are arranged at intervals to facilitate the signal connection between the substrate 20 and the external motherboard.
  • at least one pad 22 is an annular pad 22a, and the remaining pads 22 are rectangular pads 22b. Located close to the edge of the substrate 20 . As shown in FIG.
  • the substrate 20 in this embodiment is a rectangular substrate 20
  • five pads 22 are provided on the lower side of the substrate 20 , one of which is a ring pad 22 a
  • the other four are rectangular pads 22 b
  • the ring pad 22 a It is located at the geometric center position of the rectangular substrate 20, and surrounds the outer periphery of the second vent hole 21 in a ring-shaped closed structure, and then surrounds the second vent hole 21, which plays a sealing role while connecting with the external motherboard signal and increases the pressure.
  • the detection sensitivity and accuracy of the difference sensor The remaining four rectangular pads 22b are respectively arranged at the four corners of the substrate 20, and the structure design is reasonable.
  • the annular pad 22a in this embodiment can be formed by reflow soldering of solder paste, which is simple and convenient.
  • the thickness of the pad 22 is very thin and can be embedded on the substrate 20 so that the lower surface of the pad 22 is flush with the bottom surface of the substrate 20 , and the structure is compact.
  • the present application also proposes a differential pressure sensor, including the sensor package structure 100 described above. Since the differential pressure sensor adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

一种传感器封装结构(100)及差压传感器，传感器封装结构(100)包括：外壳(10)；基板(20)，外壳(10)设置于基板(20)上并与基板(20)围成收容空间(50)，外壳(10)的第一通气孔(11)和基板(20)的第二通气孔(21)均与收容空间(50)连通；收容于收容空间(50)内、电连接并层叠设置于基板(20)上的传感器芯片(30)和信号处理芯片(40)，且传感器芯片(30)位于信号处理芯片(40)上背离基板(20)的一侧；传感器芯片(30)具有振动腔(31)，信号处理芯片(40)开设有第三通气孔(41)，振动腔(31)通过第三通气孔(41)与第二通气孔(21)连通；防水胶(60)，填充于收容空间(50)内并覆盖传感器芯片(30)和信号处理芯片(40)。

Description

传感器封装结构及差压传感器
本申请要求于2020年11月30日申请的、申请号为202022828036.2的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及传感器技术领域，特别涉及一种传感器封装结构及差压传感器。
 背景技术
目前在一级封装市场，差压传感器的封装结构多采用晶体管轮廓(TO)类封装，封装工艺复杂，产品体积大，防水特性差，并且封装体内只有一个表压微机电系统(MEMS)，无温度线性补偿功能。对于需要进行温度补偿功能的差压传感器通常还需要通过将一级封装的差压传感器与专用集成电路(ASIC)芯片配合后再做二级封装实现温度线性补偿，应用不方便。另外，现有的差压传感器由于封装结构的限制，占用体积较大，不利于产品的小型化设计。
 技术问题
本申请的主要目的是提供一种传感器封装结构及差压传感器，旨在解决差压传感器防水特性差、应用不方便及不利于产品的小型化设计的技术问题。
 技术解决方案
为现上述目的，本申请提供的传感器封装结构，包括：
外壳，开设有第一通气孔；
基板，所述外壳设置于所述基板上并与所述基板围成收容空间，所述基板开设有第二通气孔，所述第一通气孔和所述第二通气孔均与所述收容空间连通；
传感器芯片和信号处理芯片，收容于所述收容空间内，所述传感器芯片与所述信号处理芯片电连接并层叠设置于所述基板上，且所述传感器芯片位于所述信号处理芯片上背离所述基板的一侧；所述传感器芯片具有振动腔，所述信号处理芯片开设有第三通气孔，所述振动腔通过所述第三通气孔与所述第二通气孔连通；
防水胶，填充于所述收容空间内并覆盖所述传感器芯片和所述信号处理芯片。
在一实施例中，所述传感器芯片通过第一密封胶层粘接于所述信号处理芯片上背离所述基板的一侧，所述第一密封胶层呈环形围设于所述第三通气孔的外周。
在一实施例中，所述信号处理芯片通过第二密封胶层粘接于所述基板，所述第二密封胶层呈环形围设于所述第二通气孔的外周。
在一实施例中，所述外壳包括壳本体和安装部，所述壳本体的一端通过导电胶层粘接于所述基板上，所述壳本体的另一端与所述安装部连接；所述安装部呈筒状，且所述安装部远离所述壳本体的一端形成所述第一通气孔，所述防水胶填充于所述壳本体内并向所述安装部内延伸。
在一实施例中，所述安装部的外周形成密封凹槽，所述密封凹槽呈环形设置并由外向内凹陷。
在一实施例中，所述传感器芯片通过金属线与所述信号处理芯片电连接。
在一实施例中，所述第一通气孔、所述第二通气孔以及所述第三通气孔均正对所述振动腔设置。
在一实施例中，所述基板上背离所述收容空间的一侧设置有多个焊盘，多个所述焊盘间隔布置。
在一实施例中，多个所述焊盘中，至少一个所述焊盘为环形焊盘，其余所述焊盘为矩形焊盘，所述环形焊盘围设于所述第二通气孔的外周，所述矩形焊盘靠近所述基板的边缘设置。
本申请还提出一种差压传感器，包括如上所述的传感器封装结构。
 有益效果
本申请传感器在使用时，传感器芯片的敏感膜根据防水胶和第二通气孔形成的压力差产生形变，从而导致敏感膜上的电阻值发生变化，并根据形变将表示压差的物理量转换成压力信号，并传输至信号处理芯片，由信号处理芯片对压力信号进行信号处理，并根据预存储的温度系数对压力信号进行温度补偿，最终输出补偿压力信号，实现温度线性补偿功能，使得压差传感器集成有温度线性补偿功能，应用方便。防水胶将传感器芯片和信号处理芯片覆盖，起到气压传递和防水防腐蚀的作用，密封性和防水效果好，提高差压传感器的防水特性。另外，本申请的传感器芯片和信号处理芯片采用叠片式设计，传感器芯片与信号处理芯片层叠设置，层叠设置的传感器芯片和信号处理芯片则节省了占用体积，减小封装尺寸，结构更为紧凑、小巧，利于产品的小型化设计。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请一实施例传感器封装结构的截面示意图；
图2为本申请一实施例传感器封装结构的仰视示意图。
附图标号说明：
标号 名称 标号 名称
100 传感器封装结构 30 传感器芯片
10 外壳 31 振动腔
11 第一通气孔 40 信号处理芯片
12 壳本体 41 第三通气孔
13 安装部 50 收容空间
131 密封凹槽 60 防水胶
20 基板 70 第一密封胶层
21 第二通气孔 80 第二密封胶层
22 焊盘 90 导电胶层
22a 环形焊盘 101 金属线
22b 矩形焊盘    
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本申请中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种传感器封装结构。
如图1和图2所示，本实施例的传感器封装结构100包括外壳10、基板20、传感器芯片30、信号处理芯片40以及防水胶60，其中，外壳10开设有第一通气孔11，外壳10设置于基板20上并与基板20围成收容空间50，基板20开设有第二通气孔21，第一通气孔11和第二通气孔21均与收容空间50连通；传感器芯片30和信号处理芯片40均收容于收容空间50内，传感器芯片30与信号处理芯片40电连接并层叠设置于基板20上，且传感器芯片30位于信号处理芯片40上背离基板20的一侧；传感器芯片30具有振动腔31，信号处理芯片40开设有第三通气孔41，振动腔31通过第三通气孔41与第二通气孔21连通。防水胶60则填充于收容空间50内并覆盖传感器芯片30和信号处理芯片40。
具体地，如图1和图2所示，外壳10罩设于基板20的上方，并与基板20围成收容空间50，以便将传感器芯片30和信号处理芯片40收容于内，结构紧凑。另外，本实施例的传感器芯片30和信号处理芯片40采用叠片式设计，传感器芯片30与信号处理芯片40上下层叠设置，层叠设置的传感器芯片30和信号处理芯片40则节省了占用体积，减小封装尺寸，结构更为紧凑、小巧，利于产品的小型化设计。
并且，本实施例防水胶60填充于收容空间50内，且将传感器芯片30和信号处理芯片40全方位覆盖。外壳10开设有第一通气孔11，第一通气孔11位于传感器芯片30及防水胶60的上方，第一通气孔11可用作传感器芯片30的上感应端，并通过防水胶60传递至传感器芯片30，进行顶部气压检测，而基板20上开设有第二通气孔21，第二通气孔21位于传感器芯片30的下方，第二通气孔21壳可用作传感器芯片30的下感应端，可进行底部气压检测。为了实现第二通气孔21向传感器芯片30的振动腔31内进气，信号处理芯片40开设有第三通气孔41，以将第二通气孔21和振动腔31连通。
本实施例的传感器封装结构100在使用时，传感器芯片30的敏感膜根据上感应端和下感应端形成的压力差产生形变，从而导致敏感膜上的电阻值发生变化，并根据形变将表示压差的物理量转换成压力信号，并传输至信号处理芯片40，由信号处理芯片40对压力信号进行信号处理，并根据预存储的温度系数对压力信号进行温度补偿，最终输出补偿压力信号，实现温度线性补偿功能，使得压差传感器集成有温度线性补偿功能，应用方便。本实施例的防水胶60可采用现有技术中的硅凝胶，硅凝胶具有防水防腐蚀、低模量高弹性的物理特性，硅凝胶作为上感压端，感受压力变化，并将压力变化转化为形变量传递至传感器芯片30。防水胶60将传感器芯片30和信号处理芯片40覆盖，起到气压传递和防水防腐蚀的作用，密封性和防水效果好，提高差压传感器的防水特性。
本实施例中，传感器芯片30通过第一密封胶层70粘接于信号处理芯片40上背离基板20的一侧，第一密封胶层70呈环形围设于第三通气孔41的外周。如图1所示，传感器芯片30的底部通过第一密封胶层70粘接于信号处理芯片40的上侧，并且，第一密封胶层70呈环形闭合结构，围在第三通气孔41的外周，进而将第三通气孔41包围，起到密封作用，防止从第三通气孔41进入的压力泄露，提高压差传感器的检测灵敏性和精度。本实施例的第一密封胶层70可采用现有技术中的硅胶制成，传感器芯片30通过硅胶粘接于信号处理芯片40上，装配方便、简单。
进一步地，信号处理芯片40通过第二密封胶层80粘接于基板20，第二密封胶层80呈环形围设于第二通气孔21的外周。如图1所示，信号处理芯片40的下侧通过第二密封胶层80粘接于基板20上，并且，第二密封胶层80呈环形闭合结构，围在第二通气孔21的外周，进而将第二通气孔21包围，起到密封作用，防止从第二通气孔21进入的压力泄露，提高压差传感器的检测灵敏性和精度。本实施例的第二密封胶层80可采用现有技术中的硅胶制成，信号处理芯片40通过硅胶粘接于基板20上，装配简单、方便。
本实施例的外壳10包括壳本体12和安装部13，壳本体12的一端通过导电胶层90粘接于基板20上，壳本体12的另一端与安装部13连接；安装部13呈筒状，且安装部13远离壳本体12的一端形成第一通气孔11，防水胶60填充于壳本体12内并向安装部13内延伸。如图1所示，外壳10的壳本体12和安装部13呈一体成型结构，其中，壳本体12的上方与安装部13连接，壳本体12的下方与基板20连接，且安装部13呈筒状，以通过安装部13、壳本体12以及基板20围成收容空间50。外壳10可对收容于收容空间50内的传感器芯片30和信号处理芯片40起到保护作用。本实施例的外壳10为金属外壳10，具体可采用黄酮制成，具有较好的强度，表面可进行镀镍或镀金处理，防止锈蚀。基板20为PCB板，外壳10中壳本体12的下端与基板20通过导电胶层90粘接，在实现外壳10与基板20装配的同时，使得外壳10和PCB板导通，起到信号屏蔽的作用，提高压差传感器的检测灵敏性和精度。
本实施例的外壳10中，安装部13呈筒状设置，可形成将第一通气孔11与收容空间50连通的进气通道，防水胶60填充于壳本体12内，将传感器芯片30和信号处理芯片40覆盖，从而将传感器芯片30和信号处理芯片40密封，起到防水作用。为了提高防水效果的可靠性，防水胶60可向上延伸至安装部13内。
进一步地，安装部13的外周形成密封凹槽131，密封凹槽131呈环形设置并由外向内凹陷。如图1所示，筒状安装部13的外周形成闭合环形结构的密封凹槽131，密封凹槽131由外向内凹陷，用于安装O型密封圈。壳体通过密封凹槽131、O型圈可与应用终端密封连接。在密封凹槽131中安装O型圈的目的是为了使得外壳10与应用终端连接时密封连接，在特殊环境下，防止水进入到压差传感器中，起到密封、防水作用。
传感器芯片30通过金属线101与信号处理芯片40电连接。金属线101可采用现有的金线、铝线或铜线等，实现传感器芯片30和信号处理芯片40之间的信号传输。进一步地，为提高信号传输的可靠性、耐腐蚀性和导电率，本实施例的金属线101优选采用金线。可以理解地，信号处理芯片40可通过金属线101与基板20电连接，方便信号传输。
本实施例中，第一通气孔11、第二通气孔21以及第三通气孔41均正对振动腔31设置。如图1所示，第一通气孔11位于传感器芯片30的正上方，与振动腔31正对设置，方便从第一通气孔11进入的气体直接作用于传感器芯片30上，传感器芯片30可直接感知上感应端压力。同时，第二通气孔21以及第三通气孔41则位于传感器芯片30的正下方，与振动腔31正对设置，方便从第二通气孔21进入的气体直接作用于传感器芯片30上，传感器可直接感知下感应端压力，提高传感器封装结构100的传感效果，进一步提高压差传感器的检测灵敏性和精度。
信号处理芯片40为ASIC（Application Specific Integrated Circuit）芯片，传感器芯片30为MEMS芯片。ASIC芯片为MEMS芯片提供外部偏置，有效的偏置将使MEMS芯片在整个操作温度范围内都可保持稳定的声学和电气参数，还支持具有不同敏感性的MEMS芯片设计。
如图2所示，本实施例中，基板20上背离收容空间50的一侧设置有多个焊盘22，多个焊盘22间隔布置。如图1和图2所示，基板20的下侧设置由多个焊盘22，多个焊盘22间隔布置，方便基板20与外部主板的信号连接。进一步地，多个焊盘22中，至少一个焊盘22为环形焊盘22a，其余焊盘22为矩形焊盘22b，环形焊盘22a围设于第二通气孔21的外周，矩形焊盘22b靠近基板20的边缘设置。如图2所示，本实施例基板20为矩形基板20，基板20的下侧设置有五个焊盘22，其中一个为环形焊盘22a，其余四个为矩形焊盘22b，环形焊盘22a位于矩形基板20的几何中心位置，并呈环形闭合结构围在第二通气孔21的外周，进而将第二通气孔21包围，在起到与外部主板信号连接的同时起到密封作用，提高压差传感器的检测灵敏性和精度。其余四个矩形焊盘22b分设于基板20的四个拐角处，结构设计合理。本实施例的环形焊盘22a可通过锡膏的回流焊接形成，简单方便。焊盘22的厚度很薄，可嵌设于基板20上，以使焊盘22的下表面与基板20的底面平齐，结构紧凑。
本申请还提出一种差压传感器，包括上述的传感器封装结构100。由于本差压传感器采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
以上所述仅为本申请的优选实施例，并非因此限制本申请的专利范围，凡是在本申请的构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (10)

  1. 一种传感器封装结构，其中，所述传感器封装结构包括：
    外壳，开设有第一通气孔；
    基板，所述外壳设置于所述基板上并与所述基板围成收容空间，所述基板开设有第二通气孔，所述第一通气孔和所述第二通气孔均与所述收容空间连通；
    传感器芯片和信号处理芯片，收容于所述收容空间内，所述传感器芯片与所述信号处理芯片电连接并层叠设置于所述基板上，且所述传感器芯片位于所述信号处理芯片上背离所述基板的一侧；所述传感器芯片具有振动腔，所述信号处理芯片开设有第三通气孔，所述振动腔通过所述第三通气孔与所述第二通气孔连通；
    防水胶，填充于所述收容空间内并覆盖所述传感器芯片和所述信号处理芯片。
  2. 如权利要求1所述的传感器封装结构，其中，所述传感器芯片通过第一密封胶层粘接于所述信号处理芯片上背离所述基板的一侧，所述第一密封胶层呈环形围设于所述第三通气孔的外周。
  3. 如权利要求2所述的传感器封装结构，其中，所述信号处理芯片通过第二密封胶层粘接于所述基板，所述第二密封胶层呈环形围设于所述第二通气孔的外周。
  4. 如权利要求1所述的传感器封装结构，其中，所述外壳包括壳本体和安装部，所述壳本体的一端通过导电胶层粘接于所述基板上，所述壳本体的另一端与所述安装部连接；所述安装部呈筒状，且所述安装部远离所述壳本体的一端形成所述第一通气孔，所述防水胶填充于所述壳本体内并向所述安装部内延伸。
  5. 如权利要求4所述的传感器封装结构，其中，所述安装部的外周形成密封凹槽，所述密封凹槽呈环形设置并由外向内凹陷。
  6. 如权利要求1-5中任一项所述的传感器封装结构，其中，所述传感器芯片通过金属线与所述信号处理芯片电连接。
  7. 如权利要求1-5中任一项所述的传感器封装结构，其中，所述第一通气孔、所述第二通气孔以及所述第三通气孔均正对所述振动腔设置。
  8. 如权利要求1-5中任一项所述的传感器封装结构，其中，所述基板上背离所述收容空间的一侧设置有多个焊盘，多个所述焊盘间隔布置。
  9. 如权利要求8所述的传感器封装结构，其中，多个所述焊盘中，至少一个所述焊盘为环形焊盘，其余所述焊盘为矩形焊盘，所述环形焊盘围设于所述第二通气孔的外周，所述矩形焊盘靠近所述基板的边缘设置。
  10. 一种差压传感器，其中，所述差压传感器包括如权利要求1-9中任一项所述的传感器封装结构。
PCT/CN2021/124544 2020-11-30 2021-10-19 传感器封装结构及差压传感器 WO2022111132A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202022828036.2U CN213688772U (zh) 2020-11-30 2020-11-30 传感器封装结构及差压传感器
CN202022828036.2 2020-11-30

Publications (1)

Publication Number Publication Date
WO2022111132A1 true WO2022111132A1 (zh) 2022-06-02

Family

ID=76737579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/124544 WO2022111132A1 (zh) 2020-11-30 2021-10-19 传感器封装结构及差压传感器

Country Status (2)

Country Link
CN (1) CN213688772U (zh)
WO (1) WO2022111132A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213688772U (zh) * 2020-11-30 2021-07-13 潍坊歌尔微电子有限公司 传感器封装结构及差压传感器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07311111A (ja) * 1994-05-19 1995-11-28 Hitachi Constr Mach Co Ltd 差圧センサ
CN205754730U (zh) * 2016-05-17 2016-11-30 歌尔股份有限公司 一种麦克风的封装结构
CN208704948U (zh) * 2018-09-19 2019-04-05 青岛歌尔微电子研究院有限公司 一种集成温度补偿的差压传感器
CN208847393U (zh) * 2018-07-31 2019-05-10 苏州纳芯微电子股份有限公司 一种压力传感器的封装结构
CN209400128U (zh) * 2018-12-25 2019-09-17 歌尔科技有限公司 防水压差传感器
CN111362227A (zh) * 2018-12-25 2020-07-03 无锡华润矽科微电子有限公司 Mems传感器封装结构
CN210953183U (zh) * 2019-10-28 2020-07-07 歌尔微电子有限公司 防水压力传感器
CN213688772U (zh) * 2020-11-30 2021-07-13 潍坊歌尔微电子有限公司 传感器封装结构及差压传感器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07311111A (ja) * 1994-05-19 1995-11-28 Hitachi Constr Mach Co Ltd 差圧センサ
CN205754730U (zh) * 2016-05-17 2016-11-30 歌尔股份有限公司 一种麦克风的封装结构
CN208847393U (zh) * 2018-07-31 2019-05-10 苏州纳芯微电子股份有限公司 一种压力传感器的封装结构
CN208704948U (zh) * 2018-09-19 2019-04-05 青岛歌尔微电子研究院有限公司 一种集成温度补偿的差压传感器
CN209400128U (zh) * 2018-12-25 2019-09-17 歌尔科技有限公司 防水压差传感器
CN111362227A (zh) * 2018-12-25 2020-07-03 无锡华润矽科微电子有限公司 Mems传感器封装结构
CN210953183U (zh) * 2019-10-28 2020-07-07 歌尔微电子有限公司 防水压力传感器
CN213688772U (zh) * 2020-11-30 2021-07-13 潍坊歌尔微电子有限公司 传感器封装结构及差压传感器

Also Published As

Publication number Publication date
CN213688772U (zh) 2021-07-13

Similar Documents

Publication Publication Date Title
US5859759A (en) Semiconductor pressure sensor module
US7024937B2 (en) Isolated pressure transducer
US8322225B2 (en) Sensor package assembly having an unconstrained sense die
JP2847074B2 (ja) 集積回路を有する圧力センサ装置
CN213186551U (zh) Mems麦克风的封装结构和电子设备
WO2017012251A1 (zh) 一种环境传感器
WO2022188524A1 (zh) 封装模组、封装工艺及电子设备
WO2022111132A1 (zh) 传感器封装结构及差压传感器
JP2003287472A (ja) 圧力センサ
US6313514B1 (en) Pressure sensor component
CN213688773U (zh) 差压传感器和电子设备
CN213455953U (zh) 传感器封装结构及差压传感器
JP4863571B2 (ja) 圧力センサ
CN109748234B (zh) 压力测量模块及其封装方法
JP5815624B2 (ja) 防水型圧力センサ
JP4859016B2 (ja) 半導体パッケージ
WO2022166587A1 (zh) 红外温度传感器以及电子设备
CN112954559B (zh) 麦克风结构和电子设备
WO2021095404A1 (ja) 圧力センサ装置
JP2017142169A (ja) 圧力センサ及びその製造方法
CN112897451A (zh) 传感器封装结构及其制作方法和电子设备
CN216925890U (zh) 防水气压计
JPH06207870A (ja) 半導体圧力センサ
CN215178267U (zh) 压力传感器
CN215984997U (zh) 介质隔离式压力传感器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21896634

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21896634

Country of ref document: EP

Kind code of ref document: A1