WO2022107505A1 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
- Publication number
- WO2022107505A1 WO2022107505A1 PCT/JP2021/037858 JP2021037858W WO2022107505A1 WO 2022107505 A1 WO2022107505 A1 WO 2022107505A1 JP 2021037858 W JP2021037858 W JP 2021037858W WO 2022107505 A1 WO2022107505 A1 WO 2022107505A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- water
- type phenol
- resin
- mass
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 64
- 239000005011 phenolic resin Substances 0.000 claims abstract description 53
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 38
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 33
- 239000007787 solid Substances 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000007864 aqueous solution Substances 0.000 claims abstract description 12
- CQRYARSYNCAZFO-UHFFFAOYSA-N salicyl alcohol Chemical compound OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 claims description 7
- 229920003987 resole Polymers 0.000 claims description 5
- 238000007127 saponification reaction Methods 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 20
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 150000002989 phenols Chemical class 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 150000001299 aldehydes Chemical class 0.000 description 10
- 239000002585 base Substances 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 10
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000002783 friction material Substances 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- -1 fluorophenols Chemical class 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical class CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XOUAQPDUNFWPEM-UHFFFAOYSA-N 2,3,4-tris(hydroxymethyl)phenol Chemical compound OCC1=CC=C(O)C(CO)=C1CO XOUAQPDUNFWPEM-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- VGVRPFIJEJYOFN-UHFFFAOYSA-N 2,3,4,6-tetrachlorophenol Chemical class OC1=C(Cl)C=C(Cl)C(Cl)=C1Cl VGVRPFIJEJYOFN-UHFFFAOYSA-N 0.000 description 1
- ZBSGNEYIENETRW-UHFFFAOYSA-N 2,3-bis(hydroxymethyl)phenol Chemical class OCC1=CC=CC(O)=C1CO ZBSGNEYIENETRW-UHFFFAOYSA-N 0.000 description 1
- MHKBMNACOMRIAW-UHFFFAOYSA-N 2,3-dinitrophenol Chemical class OC1=CC=CC([N+]([O-])=O)=C1[N+]([O-])=O MHKBMNACOMRIAW-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical class NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical class OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- KQDJTBPASNJQFQ-UHFFFAOYSA-N 2-iodophenol Chemical class OC1=CC=CC=C1I KQDJTBPASNJQFQ-UHFFFAOYSA-N 0.000 description 1
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- NTDQQZYCCIDJRK-UHFFFAOYSA-N 4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C=C1 NTDQQZYCCIDJRK-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical class C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical group OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- RBXVOQPAMPBADW-UHFFFAOYSA-N nitrous acid;phenol Chemical class ON=O.OC1=CC=CC=C1 RBXVOQPAMPBADW-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- BTFQKIATRPGRBS-UHFFFAOYSA-N o-tolualdehyde Chemical compound CC1=CC=CC=C1C=O BTFQKIATRPGRBS-UHFFFAOYSA-N 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- BVJSUAQZOZWCKN-UHFFFAOYSA-N p-hydroxybenzyl alcohol Chemical class OCC1=CC=C(O)C=C1 BVJSUAQZOZWCKN-UHFFFAOYSA-N 0.000 description 1
- NRZWYNLTFLDQQX-UHFFFAOYSA-N p-tert-Amylphenol Chemical compound CCC(C)(C)C1=CC=C(O)C=C1 NRZWYNLTFLDQQX-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 239000000375 suspending agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/02—Homopolymers or copolymers of unsaturated alcohols
- C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
Definitions
- the present invention relates to a resin composition containing a water-soluble resol type phenol resin.
- Phenol resins used for impregnating honeycomb cores or as adhesives for wet friction materials have been used as solvent-based phenol resins using alcohol or the like because of their impregnation properties and good properties of the coated surface (for example, patents).
- Document 1 In recent years, it has been required to reduce flammable solvents from the viewpoint of safety and to reduce volatile solvents from the viewpoint of preventing environmental pollution. Therefore, the composition of these solvent types is gradually changed to dispersion type or aqueous emulsion type. It is being replaced by products, and water-soluble phenolic resins are being actively studied.
- the water-soluble phenolic resin may have problems in its use, such as inferior heat resistance and handleability.
- some studies and practical applications of emulsified phenolic resins have been carried out, but when emulsified phenolic resins are used, the surface properties are poor, and emulsion stabilizers and suspending agents deteriorate the performance of the phenolic resins. It has the drawback of making it.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide a phenol resin composition which can be provided as an aqueous solution, thus does not cause a problem of volatilization of an organic solvent, and has improved heat resistance. And.
- a resin composition containing water and The resin composition is in the form of an aqueous solution in which the water-soluble resol-type phenol resin and the polyvinyl alcohol are dissolved in water.
- the polyvinyl alcohol is provided in a resin composition having an amount of more than 0% by mass and 30% by mass or less with respect to the total solid content of the resin composition.
- the resin composition of the present embodiment contains a water-soluble resole-type phenol resin, polyvinyl alcohol, and water.
- the resin composition of the present embodiment is provided in the form of an aqueous solution in which these water-soluble resol-type phenol resins and polyvinyl alcohol are dissolved in water.
- the content of polyvinyl alcohol is more than 0% by mass and 30% by mass or less with respect to the total solid content of the resin composition.
- the resin composition of the present embodiment takes the form of an aqueous solution in which a water-soluble resol-type phenol resin and polyvinyl alcohol are dissolved in water. Since the resin composition of the present embodiment does not contain an organic solvent, the organic solvent does not volatilize, and therefore, there is almost or no load on the environment and a load on the human body during work or use.
- the resin composition of the present embodiment contains a water-soluble resole-type phenol resin and polyvinyl alcohol, and the amount of the polyvinyl alcohol is more than 0% by mass and 30% by mass or less with respect to the total solid content of the resin composition. It is preferably 1% by mass or more and 25% by mass or less, more preferably 2% by mass or more and 20% by mass or less, and more preferably 4% by mass or more and 15% by mass or less.
- the resin composition of the present embodiment has flexibility suitable for use while maintaining the heat resistance of the water-soluble resol type phenol resin.
- the resin composition has high adhesive strength, and thus can be suitably used as an adhesive for, for example, a friction material. Further, by containing polyvinyl alcohol, the resin composition has flexibility, and therefore, when used as a binder resin material for impregnating a base material, for example, a molded product having flexibility and excellent mechanical strength can be obtained. Obtainable.
- the water-soluble resol-type phenol resin used in the adhesive composition of the present embodiment is obtained by reacting phenols and aldehydes in a reaction solvent under a basic catalyst under the predetermined conditions described below. It is a resin that can be used.
- phenols used for the synthesis of the water-soluble resol-type phenol resin used in the present embodiment include phenols; cresols such as o-cresol, m-cresol, p-cresol; o-ethylphenol, m-. Ethylphenols such as ethylphenol and p-ethylphenol; butylphenols such as isopropylphenol, butylphenol and p-tert-butylphenol; p-tert-amylphenol, p-octylphenol, p-nonylphenol, p-cumylphenol and the like.
- Alkylphenols Halogened phenols such as fluorophenols, chlorophenols, bromophenols, iodophenols; monohydric phenol substituents such as p-phenylphenols, aminophenols, nitrophenols, dinitrophenols, trinitrophenols: and 1- Monovalent phenols such as naphthol and 2-naphthol; polyhydric phenols such as resorcin, alkylresorcin, pyrogallol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, fluoroglucolcin, bisphenol A, bisphenol F, bisphenol S, dihydroxynaphthalin, etc. Can be mentioned. These may be used alone or in admixture of two or more.
- aldehydes used for the synthesis of the water-soluble resol type phenol resin used in the present embodiment include formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural and glioxal. , N-butylaldehyde, caproaldehyde, allylaldehyde, benzaldehyde, crotonaldehyde, achlorine, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde and the like.
- water of an alkali metal such as sodium hydroxide, potassium hydroxide, calcium hydroxide or an alkaline earth metal is used.
- Water is generally used as the reaction solvent used for the synthesis of the water-soluble resole-type phenol resin used in the present embodiment, but an organic solvent may be used.
- organic solvent include alcohols, ketones, aromatics and the like.
- alcohols include methanol, ethanol, propyl alcohol, ethylene glycol, diethylene glycol, triethylene glycol, glycerin and the like.
- ketones include acetone, methyl ethyl ketone and the like.
- aromatics include toluene, xylene and the like.
- Examples of the form of the resole-type phenol resin include solids, aqueous solutions, solvent solutions, and aqueous dispersions.
- an organic solvent is used as the reaction solvent for the synthesis of the water-soluble resole-type phenol resin, the organic solvent is removed from the reaction solution containing the reaction product by a known means such as extraction and drying.
- the resol-type phenol resin used in the present embodiment contains phenols (P) and aldehydes (F) in a compounding molar ratio (F / P) of 0.8 or more, preferably 0.8 or more and 3.0.
- the above-mentioned basicity as a polymerization catalyst is further preferably charged in a reaction vessel at a ratio of 1.0 or more and 2.8 or less, and even more preferably 1.2 or more and 2.5 or less. It is obtained by adding a catalyst and performing reflux for an appropriate time (for example, 3 to 6 hours).
- the reaction temperature is, for example, 40 ° C to 120 ° C, preferably 60 ° C to 100 ° C.
- the weight average molecular weight of the water-soluble resole-type phenol resin is preferably 250 to 3000, and more preferably 300 to 2000.
- the resol-type phenol resin having a molecular weight in the above range has water solubility and high heat resistance.
- the content of the trimethylolphenol contained in the resole-type phenol resin is, for example, more than 0% by mass and 20% by mass or less.
- the adhesive composition of the present embodiment contains a resol-type phenol resin having a methylol phenol content in the above range, so that the heat resistance is further improved while maintaining an appropriate adhesiveness.
- the methylolphenol contained in the resole-type phenol resin is a methylolated mononuclear body of phenols produced as a by-product in the synthesis of the resole-type phenol resin in which phenols and aldehydes are reacted under a basic catalyst. Point to.
- the methylolated mononuclear of this phenol contains monomethylolphenols; dimethylolphenols; trimethylolphenols, and mixtures thereof.
- the methylol phenol present in the resole-type phenol resin is obtained by reacting phenols and aldehydes under an acidic catalyst to synthesize a novolak-type phenol resin, and then the novolak-type phenol resin and aldehydes are combined under a basic catalyst. By reacting, it can be reduced or eliminated.
- Polyvinyl alcohol examples of the polyvinyl alcohol used in the adhesive composition of the present embodiment include polyvinyl alcohol (PVA), cation-modified polyvinyl alcohol (cation-modified PVA), and anion-modified polyvinyl alcohol (anion-modified PVA).
- Polyvinyl alcohol (PVA) is an unmodified homopolymer type.
- Commercially available PVA products include the Gosenol series (GL-03, EG-05, EG-30, EG-40, etc.) manufactured by Nippon Synthetic Chemistry Co., Ltd. and the Poval (PVA) series (403,) manufactured by Kuraray Co., Ltd. 405, 420, 420H, 424H, 203, 205, 210, 217, 220, 224, 235, 217E, 220E, 224E, etc.) and the like.
- the saponification degree of polyvinyl alcohol (PVA) is preferably 85% or more, more preferably 90% or more, and even more preferably 95% or more.
- the handleability of the obtained resin composition can be improved.
- the resin composition of the present embodiment may contain other additives such as flame retardants, coupling agents, antioxidants, and colorants as long as the effects of the present invention are not impaired.
- the phenolic resin composition of the present embodiment can be produced by mixing the above components with water by a known means and dissolving them in water to form an aqueous solution.
- the resin composition of the present embodiment is provided as an aqueous solution having a solid content of 10% by mass or more and 80% by mass or less.
- the solid content of the resin composition of the present embodiment can be adjusted according to the use of the resin composition by adjusting the amount of water as a solvent.
- the solid content is preferably 50 to 80% by mass.
- the viscosity of the obtained resin composition becomes appropriate for application to the friction base material, and sufficient bonding strength can be obtained for use as a friction material.
- the solid content is preferably 10 to 70% by mass. As a result, a resin composition having excellent handleability and excellent impregnation property can be obtained, and thus a high-strength / high-quality molded product can be produced with excellent production efficiency.
- the resin composition of the present embodiment can be used as an adhesive for a friction material in the form of an aqueous solution or a varnish.
- the resin composition of the present embodiment is used for impregnating an inorganic fiber base material such as a honeycomb core to produce an inorganic fiber composite.
- the resin composition of the present embodiment may be provided or stored in the form of a solid product obtained by drying and removing an aqueous solvent.
- a solid product obtained by drying and removing an aqueous solvent.
- Examples of the form of the solid matter include a block shape, a flat plate shape, a sheet shape, a film shape, and the like.
- the content of methylolphenol in the resole-type phenol resin is, for example, 3.0% by mass or less, preferably 2.0% by mass or less. More preferably, it is 1.0% by mass or less.
- the lower limit of the content of the resole-type phenol resin is not particularly limited, but is, for example, 0.01% by mass or more.
- the liquid resin composition can be molded into a desired shape.
- the resin composition of the present embodiment can be molded into a sheet having a thickness of 5 ⁇ m or more and 200 ⁇ m or less and a width of 10 mm or more and 200 cm or less.
- the resin composition of the present embodiment is easily stored and transported by being molded into the form of a solid material such as a sheet-like material.
- the step of molding the resin composition into a solid form is performed by applying a liquid resin composition to a sheet-shaped base material, heating and drying to remove water, and forming a resin layer.
- the heat-drying condition may be any condition as long as the solvent water volatilizes, and is performed, for example, at a temperature of 180 ° C. to 150 ° C. for a time of 1 minute to 90 minutes.
- the resin layer obtained as described above may be in a semi-cured (B stage) state by further heat-treating.
- a condition of a temperature of 100 to 200 ° C. and a time of 1 minute to 60 minutes can be used.
- the sheet-like substrate is not particularly limited as long as it can withstand the above-mentioned heat-drying conditions, and is, for example, a polyester-based film, a polypropylene-based film, a polyimide-based film, a polyamide-based film, a polysulfone-based film, or a polyetherketone-based film. Film or the like is used.
- the surface of these sheet-like substrates may be treated with a mold release agent.
- the base sheet may be removed after the resin layer is formed. Further, the resin sheet thus obtained may be provided with a protective sheet on the surface opposite to the surface facing the base material sheet.
- the protective sheet the same one as the base material sheet can be used.
- Example 2 The same operation as in Example 1 was carried out except that the amount of polyvinyl alcohol added was 85 parts and the amount of water added was 680 parts to obtain a resin composition having a non-volatile content of 45% and a polyvinyl alcohol content of 6% in the solid content. rice field. The content of methylolated phenol in the reaction mixture was 13.9% by mass.
- Example 3 Same as Example 1 except that 1000 parts of phenol in Example 1 was changed to a novolak type phenol resin containing less than 1% of free phenol (PR-53195 manufactured by Sumitomo Bakelite Co., Ltd.) and 300 parts of a 37% formalin aqueous solution was changed. A resol-type phenol resin having a methylolated phenol content of 0.3% was obtained. By dissolving polyvinyl alcohol using this reaction mixture in the same manner as in Example 1, a resin composition having a non-volatile content of 40% and a solid content of 12% polyvinyl alcohol was obtained.
- Example 1 The same operation as in Example 1 was carried out except that the amount of water added was 500 parts without adding polyvinyl butyral, to obtain a resin composition having a non-volatile content of 45% and a polyvinyl alcohol content of 0% in the solid content. ..
- (Tackiness) A resin composition was applied to the surface of an iron plate as a base material so that the film thickness at the time of drying was about 10 ⁇ m, and the resin composition was heated at 80 ° C. for 30 minutes to form a resin layer on the surface of the base material.
- the tackiness of this resin layer was evaluated according to the following criteria. Yes: After stacking the iron plate on the resin layer and letting it stand for 1 hour, when the upper iron plate is lifted, the lower iron plate also adheres and is lifted. None: After stacking the iron plate on the resin layer and letting it stand for 1 hour, when the upper iron plate is lifted, the lower iron plate does not adhere and only the upper iron plate is lifted.
- the resin composition of the example had excellent heat resistance and high heat resistance.
- the sheet made of the resin composition of Example 3 had no surface tackiness and was excellent in handleability during storage.
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Abstract
Description
水溶性レゾール型フェノール樹脂と、
ポリビニルアルコールと、
水と、を含む樹脂組成物であって、
当該樹脂組成物は、前記水溶性レゾール型フェノール樹脂および前記ポリビニルアルコールが前記水に溶解した水溶液の形態であり、
前記ポリビニルアルコールは、当該樹脂組成物の固形分全体に対して、0質量%を超え、30質量%以下の量である、樹脂組成物が提供される。
本実施形態の樹脂組成物は、水溶性レゾール型フェノール樹脂と、ポリビニルアルコールと、水とを含む。本実施形態の樹脂組成物は、これらの水溶性レゾール型フェノール樹脂とポリビニルアルコールとが水に溶解した、水溶液の形態で提供される。本実施形態の樹脂組成物において、ポリビニルアルコールの含有量は、樹脂組成物の固形分全体に対して、0質量%を超え、30質量%以下の量である。
本実施形態の接着剤組成物に用いられる水溶性レゾール型フェノール樹脂は、塩基性触媒下、フェノール類と、アルデヒド類とを、反応溶媒中で、以下で説明する所定の条件で反応させて得られる樹脂である。
本実施形態の接着剤組成物に用いられるポリビニルアルコールは、ポリビニルアルコール(PVA)、カチオン変性ポリビニルアルコール(カチオン変性PVA)、アニオン変性ポリビニルアルコール(アニオン変性PVA)等が挙げられる。ポリビニルアルコール(PVA)は変性していないホモポリマータイプである。PVAの市販品としては、日本合成化学株式会社製のゴーセノールシリーズ(GL-03、EG-05、EG-30、EG-40等)、株式会社クラレ製のポバール(PVA)シリーズ(403、405、420、420H、424H、203、205、210、217、220、224、235、217E、220E、224E等)等が挙げられる。
本実施形態の樹脂組成物は、上記成分に加え、本発明の効果を損なわない範囲で、難燃剤、カップリング剤、酸化防止剤、着色剤等の他の添加剤を含んでもよい。
本実施形態のフェノール樹脂組成物は、上記成分を、公知の手段で水と混合し、水に溶解させて水溶液とすることにより製造することができる。
本実施形態の樹脂組成物は、水溶液またはワニスの形態で、摩擦材用の接着剤として使用することができる。または、本実施形態の樹脂組成物は、ハニカムコアのような無機繊維基材に含浸して、無機繊維複合体を製造するために使用される。
撹拌装置、還流冷却器及び温度計を備えた反応装置に、フェノール1000重量部、37%ホルマリン水溶液1638重量部(F/Pモル比=1.9)、水酸化ナトリウム30重量部を添加し、90℃で70分間反応させた。GPC測定により算出した、得られた反応混合物中のメチロール化フェノールの含有量は、15.2質量%であった。この反応混合物に水780重量部を加えた後、80℃で、けん化度99%のポリビニルアルコール180重量部を加えて溶解させ、不揮発分45%、固形分中のポリビニルアルコール量12%の樹脂組成物を得た。
ポリビニルアルコールの添加量を85部、水の添加量を680部とした以外は実施例1と同様の操作を行い、不揮発分45%、固形分中のポリビニルアルコール量6%の樹脂組成物を得た。反応混合物中のメチロール化フェノールの含有量は、13.9質量%であった。
実施例1におけるフェノール1000部を、遊離フェノール1%未満を含むノボラック型フェノール樹脂(住友ベークライト株式会社製PR-53195)に、37%ホルマリン水溶液を300部に変更した以外は、実施例1と同様の操作を行い、メチロール化フェノールの含有量が0.3%のレゾール型フェノール樹脂を得た。この反応混合物を用いて実施例1と同様にポリビニルアルコールを溶解させることで、不揮発分40%、固形分中のポリビニルアルコール量12%の樹脂組成物を得た。
ポリビニルブチラールを添加せずに、水の添加量を500部とした以外は実施例1と同様の操作を行い、不揮発分45%、固形分中のポリビニルアルコール量0%の樹脂組成物を得た。
上記で得られた樹脂組成物について、以下の項目の物性について評価した。
(接着強度)
硬化条件は180℃で30分間として、JIS K 6850に従い、被着材を鉄板として接着せん断強度の測定を行った。結果を以下の表1に示す。
(耐熱強度)
接着せん断試験のテストピースを作製後、250℃で30分間熱処理を行った後、JISK 6850に従い、被着材を鉄板として接着せん断強度の測定を行った。結果を以下の表1に示す。
基材としての鉄板の表面に、乾燥時の膜厚が約10μmとなるように樹脂組成物を塗布し、80℃で30分間加熱することによって、基材の表面に樹脂層を形成した。この樹脂層のタック性を、以下の基準で評価した。
あり:樹脂層の上に鉄板を重ねて1時間静置後、上の鉄板を持ち上げると下の鉄板も付着して持ち上がる。
なし:樹脂層の上に鉄板を重ねて1時間静置後、上の鉄板を持ち上げると下の鉄板が付着せずに、上の鉄板のみ持ち上がる。
Claims (5)
- 水溶性レゾール型フェノール樹脂と、
ポリビニルアルコールと、
水と、を含む樹脂組成物であって、
当該樹脂組成物は、前記水溶性レゾール型フェノール樹脂および前記ポリビニルアルコールが前記水に溶解した水溶液の形態であり、
前記ポリビニルアルコールは、当該樹脂組成物の固形分全体に対して、0質量%を超え、30質量%以下の量である、樹脂組成物。 - 前記水溶性レゾール型フェノール樹脂のメチロールフェノール含有率が、前記水溶性レゾール型フェノール樹脂に対し、20質量%以下である、請求項1に記載の樹脂組成物。
- 前記水溶性レゾール型フェノール樹脂のメチロールフェノール含有率が、前記水溶性レゾール型フェノール樹脂に対し、3.0質量%以下である、請求項1または2に記載の樹脂組成物。
- 前記ポリビニルアルコールのけん化度が、85%以上である、請求項1乃至3のいずれか一項に記載の樹脂組成物。
- 固形分量が、10質量%以上80質量%以下である、請求項1から4のいずれか一項に記載の樹脂組成物。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07503272A (ja) * | 1992-01-30 | 1995-04-06 | ロード コーポレーション | 安定化フェノール樹脂含有の水性接着剤組成物 |
WO1997001604A1 (fr) * | 1995-06-27 | 1997-01-16 | Tsuyoshi Kono | Liant |
WO2004072201A1 (ja) * | 2003-02-12 | 2004-08-26 | Nok Corporation | 水性加硫接着剤組成物 |
JP2014024881A (ja) * | 2012-07-24 | 2014-02-06 | Dic Corp | 接着剤組成物及び湿式摩擦板 |
JP2020172582A (ja) * | 2019-04-10 | 2020-10-22 | 住友ベークライト株式会社 | 湿式摩擦材用接着剤組成物および湿式摩擦板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US4124554A (en) * | 1977-02-03 | 1978-11-07 | Union Carbide Corporation | Post-formed aqueous phenolic resin dispersions |
DE10062266A1 (de) * | 2000-12-14 | 2002-07-04 | Henkel Kgaa | Wässrige Einschicht-Gummi-Metall-Bindemittel |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07503272A (ja) * | 1992-01-30 | 1995-04-06 | ロード コーポレーション | 安定化フェノール樹脂含有の水性接着剤組成物 |
WO1997001604A1 (fr) * | 1995-06-27 | 1997-01-16 | Tsuyoshi Kono | Liant |
WO2004072201A1 (ja) * | 2003-02-12 | 2004-08-26 | Nok Corporation | 水性加硫接着剤組成物 |
JP2014024881A (ja) * | 2012-07-24 | 2014-02-06 | Dic Corp | 接着剤組成物及び湿式摩擦板 |
JP2020172582A (ja) * | 2019-04-10 | 2020-10-22 | 住友ベークライト株式会社 | 湿式摩擦材用接着剤組成物および湿式摩擦板 |
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