WO2022099982A1

WO2022099982A1 - Circuit board soaking apparatus and circuit board processing equipment

Info

Publication number: WO2022099982A1
Application number: PCT/CN2021/084943
Authority: WO
Inventors: 许校彬
Original assignee: 淮安特创科技有限公司
Priority date: 2020-11-16
Filing date: 2021-04-01
Publication date: 2022-05-19
Also published as: CN112533398A; CN112533398B

Abstract

Provided in the present application are a circuit board soaking apparatus and circuit board processing equipment. The circuit board soaking apparatus comprises a soaking tank, a rotating mechanism, a clamping mechanism, and a vibrating mechanism. The soaking tank is provided with a soaking cavity. The rotating mechanism comprises a rotating part and a rotating electric motor. The rotating part is provided in the soaking cavity. The rotating electric motor is connected to the rotating part so as to allow the rotating part to rotate. The clamping mechanism comprises multiple clamping parts. The multiple clamping parts are connected to the rotating parts. The vibrating mechanism comprises a vibrating part and a vibrating electric motor. The vibrating part is provided in the soaking tank. The vibrating electric motor is connected to the vibrating part. Because a circuit board is moved relative to an electroplating solution in the soaking tank so that the electroplating solution can continuously flush the circuit board, metal cations and an electroplating accelerator in the electroplating solution are continuously flushed into blind holes of the circuit board, and the blind holes of the circuit board are fully soaked so as to increase the concentration of the metal cations and that of the electroplating accelerator in the blind holes of the circuit board, and the filling effect of subsequent electroplating of the blind holes is thus increased.

Description

Circuit board soaking device and circuit board processing equipment

technical field

The invention relates to the technical field of circuit board manufacturing and processing, in particular to a circuit board soaking device and circuit board processing equipment.

Background technique

With the continuous improvement of the demand for electronic consumer goods, forcing the continuous innovation of PCB production technology and process, the second-order, third-order and higher-order high-density interconnection boards appear one after another. At present, the multi-level interconnected circuit board mainly adopts the blind hole stacking design, and the blind holes are plated and filled, which not only increases the conductivity and heat dissipation, but also simplifies the process.

Before the electroplating process of electroplating and filling blind holes, the circuit board needs to be soaked, that is, the circuit board is immersed in an immersion solution with plating cations and electroplating accelerators to increase the concentration of cations and accelerators in the blind holes, thereby improving the blind holes. The growth rate of the inner coating has the effect of improving the filling quality of blind holes. However, due to the small pore size of the blind holes of the circuit board, it is difficult for the coating cations and the electroplating accelerator to enter the blind holes during the soaking process, so it is difficult to make the coating cation concentration and the electroplating accelerator concentration in the blind holes reach the preset values. It cannot achieve the effect of improving the quality of blind hole filling.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the deficiencies in the prior art, and to provide a circuit board soaking device that can fully soak the circuit board, increase the concentration of the pre-dip liquid in the blind hole of the circuit board, and improve the filling quality of the blind hole. And circuit board processing equipment.

The purpose of this invention is to realize through the following technical solutions:

A circuit board soaking device, comprising:

a soaking tank, the soaking tank is provided with a soaking cavity;

a rotating mechanism, the rotating mechanism includes a rotating part and a rotating motor, the rotating part is arranged in the soaking cavity, and the rotating motor is connected with the rotating part to make the rotating part rotate;

a clamping mechanism, the clamping mechanism includes a plurality of clamping parts, and the plurality of clamping parts are all connected with the rotating part;

A vibrating mechanism includes a vibrating part and a vibrating motor, the vibrating part is arranged in the soaking cavity, and the vibrating motor is connected with the vibrating part to vibrate the vibrating part.

In one embodiment, the inner wall of the soaking cavity is cylindrical.

In one embodiment, the rotating part includes a rotating disk and a rotating shaft, the center of the rotating disk is connected with the rotating shaft, the rotating shaft is connected with the rotating motor, and the center of the rotating disk is connected with the center of the soaking cavity coincide.

In one embodiment, the clamping mechanism further includes a clamping chassis and a clamping block, the clamping chassis is connected to the clamping block, the rotating part is provided with a clamping slot, and the clamping block The part of the clamping chassis is arranged in the clamping slot, so that the clamping chassis is clamped with the rotating part, and the side surface of the clamping chassis away from the clamping block is connected with a plurality of the clamping parts.

In one embodiment, a plurality of the clamping parts are arranged in a circular array at the center point of the clamping chassis.

In one embodiment, the clamping mechanism further includes a lifting ring, and the lifting ring is connected to the clamping chassis.

In one embodiment, the vibration part includes a vibration ring and a plurality of vibration rods, the vibration motor is connected to the vibration ring to vibrate the vibration ring, and the plurality of vibration rods are connected to the vibration ring. A plurality of said vibrating rods are arranged in parallel, and a part of each said vibrating rod is located in the soaking cavity.

In one embodiment, the center point of the vibration ring coincides with the center of the soaking cavity, and a plurality of the vibration rods are arranged in a circular array at the center of the vibration ring.

In one embodiment, the soaking tank is provided with a liquid inlet and a liquid outlet, and both the liquid inlet and the liquid outlet communicate with the soaking cavity.

A circuit board processing equipment includes the circuit board soaking device described in any of the above embodiments.

Compared with the prior art, the present invention has at least the following advantages:

1. Since the rotating part drives the circuit board to move in the soaking tank, the circuit board and the soaking liquid in the soaking tank move relative to each other, so that the soaking liquid can continuously wash the circuit board. During the process of washing the circuit board, the soaking liquid in the soaking liquid The metal cations and electroplating accelerators will continue to rush into the blind holes of the circuit board, and the blind holes of the circuit board are fully infiltrated, so that the concentration of metal cations and electroplating accelerators in the blind holes of the circuit board increases, thereby increasing The subsequent filling effect of the blind hole electroplating, in addition, because the soaking liquid continues to wash the circuit board, it can effectively wash away impurities or dust on the circuit board, improve the surface cleanliness of the circuit board, and then make the circuit processing of the subsequent circuit board. The coating is more dense, and the signal transmission effect of the circuit board is better.

2. Because the vibration part vibrates in the soaking tank and vibrates the soaking liquid in the soaking tank, the soaking liquid in the soaking tank vibrates continuously. Due to the continuous vibration of the soaking liquid, the soaking liquid bubbles on the circuit board are squeezed one after another. out, so that the soaking liquid can be more fully contacted with the circuit board, thereby improving the cleaning effect of the circuit board. At the same time, the soaking liquid that vibrates continuously has greater internal energy, so that the soaking liquid inside and outside the blind hole of the circuit board flows or The exchange is more frequent, thereby increasing the concentration of metal cations and electroplating acceleration solution attached to the blind hole, and achieving a better soaking effect.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of a circuit board soaking device in an embodiment;

Fig. 2 is the structural schematic diagram of another perspective of the circuit board soaking device in Fig. 1;

3 is a flowchart of a circuit board processing method for a circuit board by a circuit board processing device according to an embodiment;

FIG. 4 is a schematic structural diagram when the circuit board processing method shown in FIG. 3 is used for electroplating and filling holes.

Detailed ways

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only and do not represent the only embodiment.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in FIG. 1 and FIG. 2 , a circuit board soaking device 10 according to an embodiment includes a soaking tank 100 , a rotating mechanism 200 , a clamping mechanism 300 , and a vibration mechanism 400 . The soaking tank 100 is provided with a soaking cavity 110 ; the rotating mechanism 200 includes a rotating part 210 and a rotating motor 220 , the rotating part 210 is disposed in the soaking cavity 110 , and the rotating motor 220 is connected to the rotating motor 220 . The rotating part 210 is connected to the rotating part 210; the clamping mechanism 300 includes a plurality of clamping parts 310, and the plurality of clamping parts 310 are connected with the rotating part 210; the vibration mechanism 400 includes A vibration part 410 and a vibration motor 420 , the vibration part 410 is disposed in the soaking cavity 110 , and the vibration motor 420 is connected with the vibration part 410 to make the vibration part 410 vibrate.

In this embodiment, the soaking tank 100 is used for containing soaking liquid. The rotating mechanism 200 includes a rotating part 210 and a rotating motor 220. The rotating part 210 is located in the soaking tank 100 and is located on the bottom tank wall of the soaking tank 100. The rotating motor 220 is used to drive the rotating part 210 to rotate, so that the rotating part 210 can rotate in the soaking tank 100 turns. The clamping mechanism 300 includes a plurality of clamping parts 310 , the clamping parts 310 are connected to the rotating part 210 , and the clamping parts 310 are circuit board clips for clamping the circuit board, so that the circuit board can be stably arranged on the rotating part 210 superior. The vibration mechanism 400 includes a vibration part 410 and a vibration motor 420 . The vibration part 410 is connected to the vibration motor 420 , and the vibration motor 420 is used to drive the vibration part 410 to vibrate, so that the vibration part 410 can oscillate the soaking liquid in the soaking tank 100 .

Further, the process of soaking circuit boards by using the circuit board soaking device 10 is as follows. The plurality of circuit boards are respectively clamped by the plurality of clamping portions 310 of the clamping mechanism 300, so that the plurality of circuit boards are respectively fixed on the rotating portion 210. Pour the soaking liquid into the soaking tank 100, so that a plurality of circuit boards are immersed in the soaking liquid; turn on the rotating motor 220, the rotating motor 220 drives the rotating part 210 to rotate in the soaking tank 100, and the rotating part 210 drives the circuit boards together. Move in the soaking tank 100; turn on the vibration motor 420, the vibration motor 420 drives the vibration part 410 to vibrate, the vibration part 410 vibrates in the soaking tank 100 and vibrates the soaking liquid in the soaking tank 100; continue to turn on the rotating motor 220 and the vibration motor 420 until The soaking time of the circuit board is over.

Further, since the rotating part 210 drives the circuit board to move in the soaking tank 100, the circuit board and the soaking liquid in the soaking tank 100 move relative to each other, so that the soaking liquid can continuously wash the circuit board, and the soaking liquid is in the process of washing the circuit board. , the metal cations and electroplating accelerators in the soaking solution will continue to rush into the blind holes of the circuit board, and the blind holes of the circuit board are fully infiltrated, so that the concentration of metal cations and electroplating accelerators in the blind holes of the circuit board rising, thereby improving the subsequent filling effect of blind hole electroplating. In addition, due to the continuous scouring of the circuit board by the soaking liquid, impurities or dust on the circuit board can be effectively washed away, and the surface cleanliness of the circuit board can be improved. The plating layer obtained by the circuit processing is more dense, and the signal transmission effect of the circuit board is better.

Further, because the vibrating portion 410 vibrates in the soaking tank 100 and vibrates the soaking liquid in the soaking tank 100, the soaking liquid in the soaking tank 100 vibrates continuously, and the soaking liquid on the circuit board vibrates continuously due to the continuous vibration of the soaking liquid. The liquid bubbles are squeezed out one after another, so that the soaking liquid can be more fully contacted with the circuit board, thereby improving the cleaning effect of the circuit board. The immersion solution flows or exchanges more frequently, thereby increasing the concentration of metal cations and electroplating acceleration solution attached to the blind hole, and achieving a better immersion effect.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the inner wall of the soaking cavity 110 is cylindrical. When the rotating part 210 rotates, the rotating part 210, the clamping part 310 connected to the rotating part 210 and the circuit board will guide the soaking liquid in the soaking tank 100, so that the soaking liquid rotates in the soaking cavity 110, in order to The rotating part 210 can be rotated more smoothly in the soaking tank 100. In this embodiment, the inner wall of the cavity of the soaking tank 100 is cylindrical, and the soaking liquid rotates in the soaking cavity 110 having a cylindrical inner wall. The resistance of the body 110 to the movement of the soaking liquid is smaller, so the movement of the soaking liquid can be made smoother, thereby reducing the resistance during rotation; , the movement is more orderly, which can make the distribution of metal cations and electroplating accelerators in the soaking solution more uniform, thereby improving the wetting effect of the blind holes of the circuit board.

As shown in FIGS. 1 and 2 , in one embodiment, the rotating part 210 includes a rotating plate 211 and a rotating shaft 212 , the center of the rotating plate 211 is connected to the rotating shaft 212 , and the rotating shaft 212 is connected to the rotating motor 220 is connected, and the center of the turntable 211 coincides with the center of the soaking cavity 110 . The rotating motor 220 is used to drive the rotating part 210 to rotate, so that the rotating part 210 can rotate in the soaking tank 100. In this embodiment, the rotating part 210 includes a rotating plate 211 and a rotating shaft 212, and the output shaft of the rotating motor 220 is connected to the rotating part, while The rotating shaft 212 is connected to the center of the turntable 211 , so when the rotating motor 220 is started, the output shaft of the output motor will drive the rotating shaft 212 and the turntable 211 to rotate in turn. , the rotation of the turntable 211 can drive the clamping part 310 to move, so that the circuit board and the pre-soak liquid move relative to each other, so as to achieve the purpose of improving the soaking effect.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the clamping mechanism 300 further includes a clamping chassis 320 and a clamping block, the clamping chassis 320 is connected with the clamping block, and the rotating The clamping part 210 is provided with a clamping slot, and a part of the clamping block is arranged in the clamping slot, so that the clamping chassis 320 is clamped with the rotating part 210, and the clamping chassis 320 is away from all the parts. The side surfaces of the locking block are connected with a plurality of the clamping portions 310 . Before soaking the circuit board, the circuit board needs to be fixed on the clamping part 310 of the soaking tank 100, and because the clamping part 310 is connected with the rotating part 210, that is, the clamping part 310 is located in the soaking tank 100, the circuit board is clamped. It will be very inconvenient. In order to simplify the clamping work of the circuit board and improve the clamping efficiency of the circuit board, in this embodiment, the clamping mechanism 300 further includes a clamping chassis 320, and the plurality of clamping parts 310 are connected to the clamping chassis 320. Connection, the bottom of the clamping chassis 320 is connected with a clamping block, the top surface of the turntable 211 is provided with a clamping slot, the clamping chassis 320 is located on the turntable 211, and the clamping block at the bottom of the clamping chassis 320 is inserted on the top of the turntable 211 Then, the clamping chassis 320 can move synchronously with the turntable 211. During soaking, the turntable 211 drives the clamping chassis 320, the clamping portion 310 and the circuit board to rotate in turn, so as to achieve the occurrence of the circuit board and the pre-soak liquid. The effect of relative movement; when clamping the circuit board, the clamping chassis 320 can be directly taken out from the turntable 211, and the circuit board can be clamped on the removed clamping chassis 320, and then the clamped circuit board can be clamped. The clamping chassis 320 is installed on the turntable 211, that is, the clamping work of the circuit board is completed. Since there is no need to clamp the circuit board in the soaking tank 100, the clamping operation is simpler and the clamping efficiency is correspondingly improved.

As shown in FIG. 1 and FIG. 2 , in one embodiment, a plurality of the clamping parts 310 are arranged in a circular array at the center point of the clamping chassis 320 . In order to make the soaking effect of the plurality of circuit boards on the clamping chassis 320 more even, in this embodiment, the plurality of clamping parts 310 are arranged in a circular array with the center point of the clamping chassis 320 , that is, each clamping part 310 is arranged in a circular array after clamping. The distance between the circuit board and the center point of the clamping chassis 320 is the same, and the distance between the two adjacent circuit boards is the same. During the soaking process, because the clamping chassis 320 rotates in the soaking liquid, and the farther away the clamping chassis 320 is The position of the center point of the clamping chassis 320 and the relative speed of the soaking liquid are larger, and since the distance between each clamped circuit board and the center point of the clamping chassis 320 is equal, the relative speed of the soaking liquid and each circuit board is equal. The same, and the scouring effect of the soaking liquid on each circuit board is the same, so the soaking effect of the blind holes in the circuit board can be more balanced, thereby making the filling quality of the blind holes more consistent.

As shown in FIGS. 1 and 2 , in one embodiment, the clamping mechanism 300 further includes a pulling ring 330 , and the pulling ring 330 is connected to the clamping chassis 320 . Since the clamping chassis 320 is connected to the turntable 211 during soaking, and the turntable 211 is located in the soaking tank 100, the clamping chassis 320 needs to be taken out when the circuit board is clamped, so it is inconvenient. In order to simplify the operation of taking out the clamping chassis 320 In this embodiment, the clamping chassis 320 is connected with a lifting ring 330. When the clamping chassis 320 is taken out and installed, it can be connected to the lifting ring 330 of the clamping chassis 320 through an external pulling mechanism and the clamping can be moved. The chassis 320 is removed, and the clamping chassis 320 is then taken out from the turntable 211 or installed on the turntable 211 , so that the removal and installation operations of the clamping chassis 320 are more convenient.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the vibration part 410 includes a vibration ring 411 and a plurality of vibration rods 412 , and the vibration motor 420 is connected with the vibration ring 411 to make the vibration The ring 411 vibrates, a plurality of the vibrating rods 412 are connected to the vibrating ring 411 , the plurality of the vibrating rods 412 are arranged in parallel, and a part of each of the vibrating rods 412 is located in the soaking cavity 110 . The vibration part 410 is connected to the vibration motor 420, and the vibration motor 420 is used to drive the vibration part 410 to vibrate, so that the vibration part 410 can vibrate the soaking liquid of the soaking tank 100. In this embodiment, the vibration part 410 includes a vibration ring 411 and a plurality of Vibration rod 412, a plurality of vibrating rods 412 are arranged in parallel with each other and are connected with the vibration ring 411, and the vibration ring 411 is connected with the vibration motor 420, and the vibration motor 420 drives the vibration ring 411 to vibrate, thereby driving the vibration rod 412 to vibrate, and the plurality of vibration rods 412 all extend into the soaking tank 100 to vibrate the soaking liquid to achieve the effect of vibrating the soaking liquid.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the center point of the vibration ring 411 coincides with the center of the soaking cavity 110 , and the vibration rods 412 are located at the center of the vibration ring 411 . Set up in a circular array. In order to increase the vibration uniformity of the soaking liquid in the soaking tank 100, in this embodiment, the center point of the vibration ring 411 coincides with the center of the soaking cavity 110, and the plurality of vibration rods 412 are formed by the vibration ring The center of 411 is arranged in a circular array. Through the above structure, the vibration degree of the soaking liquid in the soaking tank 100 can be made more consistent, the bubbles in the soaking liquid can be discharged more thoroughly, and the vibration degree of the soaking liquid is more consistent everywhere. , so that the exchange frequency of the soaking liquid inside and outside the blind holes of each circuit board is more consistent, so as to achieve the purpose of balancing the soaking effect of the blind holes of each circuit board.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the soaking tank 100 is provided with a liquid inlet 120 and a liquid outlet 130 , and both the liquid inlet 120 and the liquid outlet 130 are connected to the soaking cavity. Body 110 communicates. In order to quickly discharge and input the soaking liquid in the soaking tank 100, in this embodiment, the soaking tank 100 is provided with a liquid inlet 120 and a liquid outlet 130, and the liquid inlet 120 and the liquid outlet 130 are both connected with The soaking cavity 110 is connected, and the liquid inlet 120 and the liquid outlet 130 are both connected with the external pipeline, so that the soaking liquid in the soaking tank 100 can be quickly input and discharged through the liquid inlet 120 and the liquid outlet 130, thereby facilitating the The soaking liquid in soaking tank 100 is replaced.

The present application also provides a circuit board processing equipment, which includes the circuit board soaking device 10 described in any of the above embodiments. As shown in FIGS. 1 and 2 , the circuit board soaking device 10 includes a soaking tank 100 , a rotating mechanism 200 , a clamping mechanism 300 , and a vibration mechanism 400 . The soaking tank 100 is provided with a soaking cavity 110; the rotating mechanism 200 includes a rotating part 210 and a rotating motor 220, the rotating part 210 is arranged in the soaking cavity 110, and the rotating motor 220 is connected to the rotating part 210. The rotating part 210 is connected to the rotating part 210; the clamping mechanism 300 includes a plurality of clamping parts 310, and the plurality of clamping parts 310 are connected to the rotating part 210; the vibration mechanism 400 includes A vibration part 410 and a vibration motor 420 , the vibration part 410 is disposed in the soaking cavity 110 , and the vibration motor 420 is connected with the vibration part 410 to make the vibration part 410 vibrate.

In this embodiment, the soaking tank 100 is used for containing soaking liquid. The rotating mechanism 200 includes a rotating part 210 and a rotating motor 220. The rotating part 210 is located in the soaking tank 100 and is located on the bottom tank wall of the soaking tank 100. The rotating motor 220 is used to drive the rotating part 210 to rotate, so that the rotating part 210 can rotate in the soaking tank 100 turns. The clamping mechanism 300 includes a plurality of clamping parts 310 , the clamping parts 310 are connected to the rotating part 210 , and the clamping parts 310 are circuit board clips for clamping the circuit board, so that the circuit board can be stably arranged on the rotating part 210 superior. The vibration mechanism 400 includes a vibration part 410 and a vibration motor 420 . The vibration part 410 is connected to the vibration motor 420 , and the vibration motor 420 is used to drive the vibration part 410 to vibrate, so that the vibration part 410 can vibrate the soaking liquid in the soaking tank 100 .

In one embodiment, the circuit board processing equipment uses a circuit board processing method to process the circuit board, as shown in FIG. 3 and FIG. 4 , the circuit board processing method includes the following steps:

S100, the circuit board 100 is immersed in a predip solution, so that the predip solution is attached to the inner wall of the blind hole 120, and the predip solution includes an electroplating accelerator. In this embodiment, the circuit board 100 is immersed in the pre-dipping solution, and the pre-dipping solution can clean off the dust and impurities adhering to the circuit board 100 , so that the impurities in the plating layer of the circuit board 100 are reduced, thereby improving the transmission effect of the circuit board 100 , the pre-dip solution includes electroplating accelerator, and the circuit board 100 is immersed in the pre-dip solution before electroplating, so that the blind hole 120 has more electroplating accelerator inside, thereby improving the filling quality of the blind hole 120 .

S200 , the circuit board 100 is immersed in the electroplating solution, and the electroplating solution around the circuit board 100 is guided to flow, and the flow direction of the electroplating solution is parallel to the axial direction of the through hole 110 of the circuit board 100 . In this embodiment, the circuit board 100 is placed in an electroplating tank body filled with electroplating solution, so that the circuit board 100 is immersed in the electroplating solution, and a circulating liquid discharging device is arranged in the electroplating tank. The liquid outlet of the tank wall of the electroplating tank, and the multiple liquid outlets of the circulating liquid outlet device continuously spray the electroplating liquid to guide the flow of the electroplating liquid in the electroplating tank, and the liquid discharge direction of the multiple liquid outlets is the same as that of the circuit board. The plate surfaces of 100 are opposite to each other, so that the flow direction of the electroplating solution ejected from the liquid outlet is perpendicular to the plate surface of the circuit board 100 , that is, the flow direction of the electroplating solution is parallel to the axial direction of the through holes 110 of the circuit board 100 .

S300, electroplating the circuit board 100, so that the blind holes 120 are filled with metal. In this embodiment, the electroplating equipment is energized to start electroplating the circuit board 100 , the circulating liquid outlet device continues to operate, and the electroplating solution is continuously guided to flow toward the surface of the circuit board 100 , and the circuit board 100 is completed in the flowing electroplating solution. Electroplating so that the blind holes 120 are filled with metal.

Further, the electroplating solution used for electroplating the blind holes 120 of the circuit board also has electroplating accelerators, electroplating inhibitors and electroplating leveling agents compared with the traditional industrial copper plating electroplating solutions, wherein the electroplating accelerators contain thiol. Substances are mainly small-molecule-like substances. During the electroplating process of the circuit board 100, the electroplating accelerator is mainly concentrated in the low current density area, that is, the bottom of the blind hole 120 of the circuit board 100, and its diffusion rate is fast, so the accelerator at the bottom of the hole is concentrated. The concentration gradually increases, and the role of the accelerator is to promote the deposition of copper, refine the crystal grains, and then speed up the formation of the copper plating layer at the bottom of the blind hole 120 hole. The electroplating leveling agent is a nitrogen-containing group substance, with strong polarity, and it is easily adsorbed in the high current density area with positive charge, that is, the high potential area of the blind hole 120 of the circuit board 100, and the diffusion rate of the electroplating leveling agent is Compared with the electroplating accelerator, the concentration of electroplating leveling agent gradually decreases from the orifice to the bottom of the hole. The electroplating leveling agent can reduce the growth rate of the orifice coating, so that the growth rate of the orifice coating is lower than that of the bottom of the hole. Growth rate to prevent voids in the hole. The electroplating inhibitor is mainly a polyether substance. The electroplating inhibitor is adsorbed on the board surface of the circuit board 100 under the cooperation of chloride ions, which reduces the growth rate of the copper coating on the board surface, so that the coating on the board surface and the bottom of the blind hole 120 increases. The speed can be relatively average.

Further, in order to avoid the occurrence of voids in the blind hole 120, a method of reducing the current density is usually used to reduce the growth rate of the plating layer, so that the copper ions have enough time to enter the blind hole 120, and then the copper ions can be more uniformly attached. On the hole wall and the board surface, the effect of uniform growth of the plating layer on the board surface and the hole wall is achieved. However, this method greatly prolongs the electroplating time and reduces the processing efficiency of the circuit board 100 . In addition, before the circuit board 100 is electroplated, it will go through the processing steps of drilling, pressing, etc. Therefore, a lot of dust and impurities are easily adhered to the circuit board 100. If the circuit board 100 is directly placed in the electroplating solution for electroplating, The dust and impurities on the circuit board 100 will be incorporated into the electroplating solution, so that the plating layer of the circuit board 100 contains impurities, which affects the transmission effect of the circuit board 100 . In this embodiment, the circuit board 100 is immersed in a pre-dip solution containing a plating accelerator, so that the blind holes 120 of the circuit board 100 are filled with the pre-dip solution, thereby increasing the concentration of the plating accelerator at the bottom of the hole and the wall of the hole. During the electroplating process, since the electroplating accelerator attached to the board surface and the orifice is easily displaced by the electroplating inhibitor and electroplating leveling agent, and the blind hole 120 has a semi-closed structural feature relative to the board surface, electroplating in the blind hole 120 is necessary. The accelerator can maintain a high concentration state, and the high concentration electroplating accelerator can effectively improve the formation speed of the copper coating in the blind hole 120, so that the formation speed of the blind hole 120 and the copper coating on the board surface is relatively uniform, avoiding the board surface and the hole. The formation speed of the hole plating layer is too fast, which leads to the occurrence of voids in the holes, that is, the purpose of preventing voids in the blind holes 120 can be achieved without reducing the current density, and there is no need to prolong the plating time, so that the processing efficiency of the circuit board 100 can be guaranteed. .

Further, since the aperture of the blind via 120 of the circuit board 100 is relatively small, copper ions are mostly located on the board surface of the circuit board 100 and the orifice of the blind via 120 , and it is not easy to enter the blind via 120 . The adhesion speed around the hole is much higher than that in the hole, that is, the growth rate of the coating on the surface of the circuit board 100 is much higher than that of the wall of the blind hole 120, which eventually leads to voids in the hole and the transmission effect of the circuit board 100 is seriously affected. In this embodiment, the circuit board 100 is provided with through holes 110 and blind holes 120. During the electroplating process, the circulating liquid outlet device guides the electroplating solution to continuously flow toward the surface of the circuit board 100. Since the through holes 110 penetrate through the circuit board 100, Therefore, the electroplating solution will penetrate the current board from the through hole 110 on one side of the circuit board 100 , then flow out from the other side of the circuit board 100 , and flow from the edge of the circuit board 100 to the other side of the circuit board 100 . In the case where the flow rate of the electroplating solution at the through hole 110 and the edge of the circuit board 100 is larger, it can be known from Bernoulli's principle that the higher the flow rate, the smaller the pressure, that is, the pressure at the through hole 110 and the edge of the board is relative to the board. The pressure on the surface is smaller, and the fluid will flow from the place where the pressure is stronger to the place where the pressure is lower. Therefore, the electroplating solution on the board surface of the circuit board 100 will have a tendency to flow to the through hole 110 and the edge of the board, that is, the electroplating above the blind hole 120. The liquid will flow to the through hole 110 or the edge of the board, and due to the difference in the flow rate of the electroplating liquid above the blind hole 120 and inside the blind hole 120, the electroplating liquid inside the blind hole 120 has a tendency to flow out of the hole, so that the blind hole is improved. The exchange efficiency of the electroplating solution in the blind hole 120 can make more copper ions flow into the blind holes 120, so that there are enough copper ions in the blind holes 120 to improve the plating growth rate of the blind holes 120, thereby ensuring that the blind holes 120 are filled with sufficient copper ions. In addition, as the diameter of the through hole 110 increases, the filling of the blind hole 120 is more favorable.

Further, due to the different copper ion concentrations of the blind holes 120 in different places, the growth rate of the hole wall plating layer is uneven during the electroplating process, and often some of the blind holes 120 are not filled enough, and there is a depression, or some of the blind holes 120 are filled. If it is too full, a bump is formed, which affects the quality of the circuit board 100 . In this embodiment, during the electroplating process, the electroplating solution is guided to continuously flow toward the board surface of the circuit board 100 by the circulating liquid outlet device, which can effectively improve the exchange efficiency of the electroplating solution inside and outside the blind holes 120 , so that the copper of each blind hole 120 can be exchanged effectively. The ions can be kept in a relatively high concentration range, so that the growth rate of the plating layer of each blind hole 120 is relatively uniform. At the same time, after the blind hole 120 is filled, the flowing electrolyte can make the copper ions evenly distributed by controlling the reading time. The ion concentration at the filling place of the blind hole 120 and the board surface is averaged, and the formation of bulges is effectively prevented under the premise of ensuring full filling, and the quality of the circuit board 100 is improved.

In one embodiment, the flow rate of the electroplating solution is 4 cm/s-6 cm/s. The flow rate of the electroplating solution is an important factor determining the copper ion exchange efficiency inside and outside the blind hole. When the flow rate of the electroplating solution is insufficient, a sufficient pressure difference cannot be formed, that is, a sufficient flow rate difference cannot be formed, resulting in the exchange of copper ions inside and outside the blind hole. The efficiency is low, and the growth rate of the plating layer is slow due to insufficient copper ions in the blind hole. When the flow rate of the electroplating solution is too fast, the plating accelerator attached to the bottom of the blind hole is easy to be flushed out, resulting in the growth of the plating layer at the bottom of the blind hole. Reduced speed and voids in blind vias. In this embodiment, the flow rate of the electroplating solution is 4cm/s-6cm/s. Within this range, the copper ion exchange efficiency inside and outside the blind hole and the concentration of the electroplating accelerator in the blind hole are both high, which is helpful to make The plating growth rate in the blind hole is maximized.

In one embodiment, the concentration of the electroplating accelerator is 25%-30%. The concentration of the electroplating accelerator in the predip solution is an important factor that determines the growth rate of the copper coating in the blind hole. When the concentration of the electroplating accelerator is insufficient, the concentration of the electroplating accelerator in the blind hole of the circuit board soaked in the predip solution is insufficient. In addition, the dilution effect of the electroplating solution on the electroplating acceleration solution in the blind hole will not achieve the effect of significantly increasing the growth rate of the plating layer in the blind hole, resulting in the growth rate of the plating layer on the board surface being greater than the growth rate of the plating layer in the blind hole, and the formation of voids in the blind hole. However, when the concentration of the electroplating accelerator in the pre-dip solution is too high, limited by the concentration of copper ions, the blind holes of the circuit board will not be able to use the high concentration electroplating accelerator for the formation of the copper coating, that is, the marginal benefit is diminishing. Therefore, the economy is insufficient, which is not conducive to creating good benefits. In this embodiment, the concentration of the electroplating accelerator in the pre-dip solution is 25%-30%. Within this concentration range, the effect of increasing the growth rate of the plating layer in the blind hole can be obviously achieved, and the economy is relatively good, which is more conducive to production efficiency.

In one embodiment, when the circuit board is immersed in the pre-soak, the pre-soak is in a vibrating state. In order to improve the soaking effect of the circuit board and increase the liquid exchange degree inside and outside the blind hole, so that the electroplating accelerator in the predip solution can completely enter the blind hole, in this embodiment, the tank body containing the predip solution is set There is a high-frequency vibrator, and the pre-soak is vibrated by the high-frequency vibrator, so that the pre-soak is in a vibrating state. The electroplating accelerator in the pre-dip solution completely enters the blind hole, which increases the concentration of the electroplating accelerator inside the blind hole, thereby accelerating the growth rate of the copper coating inside the blind hole. At the same time, the pre-dip solution under vibration can shake off the circuit board. To remove dust or impurities, strengthen the cleaning effect of the circuit board, reduce the impurities in the plating layer during electroplating, and then improve the transmission effect of the circuit board.

In one of the embodiments, the temperature of the predip solution is 25°C-30°C, and the circuit board is immersed in the predip solution for 4h-5h. The temperature of the pre-soak will affect the viscosity of the pre-soak. Too high or too low viscosity is not conducive to the full soaking of the circuit board. The soaking time is an important factor in determining the soaking effect of the circuit board. The circuit board needs to be soaked. It takes enough time to make the blind hole with sufficient concentration of predip solution. In this embodiment, the temperature of the predip solution is 25°C-30°C. In this temperature range, the physical state of the predip solution is optimal. It can improve the soaking efficiency of the circuit board, make the blind holes of the circuit board fully adhere to the electroplating accelerator, and help to reduce the soaking time and improve the production efficiency. The time for the circuit board to be immersed in the predip solution is 4h-5h. After 4h-5h of immersion, the blind holes of the circuit board can fully adhere to the predip solution to achieve the effect of accelerating the growth rate of the plating layer in the blind hole, and the circuit board is immersed for 4h After -5h, continue to increase the soaking time. Due to the diminishing marginal benefit, the increase of soaking time does not significantly improve the effect of accelerating the growth rate of the coating in the blind hole, and also reduces the processing efficiency, which is not conducive to producing good economic benefits.

In one embodiment, the electroplating process of the circuit board includes a first electroplating process and a second electroplating process, the current density of the first electroplating process is 0.7ASD-0.8ASD, the electroplating time is 15min-20min, and the current of the second electroplating process is The density is 1.4ASD-1.6ASD, and the plating time is 60min-90min. In order to increase the density of the plating layer for blind hole electroplating filling, improve the filling effect, and further improve the transmission performance of the circuit board, in this embodiment, the electroplating process of the circuit board includes a first electroplating process and a second electroplating process. The first electroplating process The current density of the electroplating process is 0.7ASD-0.8ASD, the electroplating time is 15min-20min, the current density of the second electroplating process is 1.4ASD-1.6ASD, and the electroplating time is 60min-90min. It can be seen that the current of the first electroplating process The values of density and electroplating time are smaller than those of the second electroplating process. In the first electroplating process, which belongs to the initial stage of circuit board electroplating, the lower current density increases the speed of the coating inside the blind hole and on the circuit board surface. The copper ions in the electroplating solution have enough time to enter the blind holes, so that the bottom of the blind holes has sufficient copper ion concentration in the initial stage of electroplating to form a dense plating layer, and the bottom of the blind holes is layered with the circuit board. A dense plating layer is formed at the bottom of the blind hole, which can make the connection between the metal material formed in the blind hole and another layered circuit more stable, the connection position is not easy to break, and the transmission performance of the circuit board is also stronger. The current density and electroplating time values of the process are larger than those of the first electroplating process. The bottom of the blind hole is the most difficult position for the electrolyte to enter. During the first electroplating process, a dense copper coating has been formed at the bottom of the blind hole. , In order to speed up the electroplating speed and increase the processing efficiency of the circuit board, the current density and electroplating time value of the second electroplating process are correspondingly increased, so that the blind hole and the plating layer on the board surface grow faster, so as to reduce the electroplating time and speed up the electroplating. effect of efficiency.

In one embodiment, the electroplating solution includes copper sulfate solution, electroplating accelerator, electroplating inhibitor and electroplating leveler. Copper sulfate solution is easily a common electroplating solution for industrial copper plating. In this embodiment, the electroplating solution used for electroplating blind holes of circuit boards is compared with traditional industrial copper plating electroplating solutions. The electroplating solution also includes electroplating accelerators, Electroplating inhibitors and electroplating leveling agents, electroplating accelerators are mainly thiol-containing small molecular substances. During the electroplating process of circuit boards, electroplating accelerators are mainly concentrated in low current density areas, that is, blind holes of circuit boards. The bottom of the hole, and its diffusion rate is fast, so the concentration of the accelerator at the bottom of the hole gradually increases. The role of the accelerator is to reduce the polarization, promote the deposition of copper, refine the grains, and then speed up the formation of copper plating at the bottom of the blind hole. The electroplating leveling agent is a nitrogen-containing group material with strong polarity, and it is easily adsorbed in the high current density area with positive charge, that is, the high potential area of the blind hole orifice of the circuit board, and the diffusion rate of the electroplating leveling agent is relative to The electroplating accelerator is slow, so the concentration of electroplating leveling agent gradually decreases from the orifice to the bottom of the hole. The electroplating leveling agent can reduce the growth rate of the orifice coating, so that the growth rate of the orifice coating is lower than that of the bottom of the hole. , to prevent voids in the hole. The electroplating inhibitors are mainly polyether substances. The electroplating inhibitors are adsorbed on the board surface of the circuit board under the synergy of chloride ions, which reduces the growth rate of the copper coating on the board surface, so that the growth rate of the coating on the board surface and the bottom of the blind hole can be improved. relatively average.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

A circuit board soaking device, comprising:

a soaking tank, the soaking tank is provided with a soaking cavity;

a rotating mechanism, the rotating mechanism includes a rotating part and a rotating motor, the rotating part is arranged in the soaking cavity, and the rotating motor is connected with the rotating part to rotate the rotating part;

a clamping mechanism, the clamping mechanism includes a plurality of clamping parts, and the plurality of clamping parts are all connected with the rotating part;

A vibrating mechanism includes a vibrating part and a vibrating motor, the vibrating part is arranged in the soaking cavity, and the vibrating motor is connected with the vibrating part to vibrate the vibrating part.
The circuit board soaking device according to claim 1, wherein the inner wall of the soaking cavity is cylindrical.
The circuit board soaking device according to claim 2, wherein the rotating part comprises a rotating disk and a rotating shaft, the center of the rotating disk is connected with the rotating shaft, the rotating shaft is connected with the rotating motor, and the rotating disk is connected to the rotating shaft. The center coincides with the center of the soaking cavity.
The circuit board soaking device according to claim 1, wherein the clamping mechanism further comprises a clamping chassis and a clamping block, the clamping chassis is connected to the clamping block, and the rotating part is provided with A clamping slot, a part of the clamping block is arranged in the clamping slot, so that the clamping chassis is clamped with the rotating part, and the side of the clamping chassis away from the clamping block is connected to the clamping base. A plurality of the clamping parts are connected.
The circuit board soaking device according to claim 4, wherein a plurality of the clamping parts are arranged in a circular array at the center point of the clamping chassis.
The circuit board soaking device according to claim 4, wherein the clamping mechanism further comprises a lifting ring, and the lifting ring is connected to the clamping chassis.
The circuit board soaking device according to claim 1, wherein the vibrating part comprises a vibrating ring and a plurality of vibrating rods, and the vibrating motor is connected to the vibrating ring, so that the vibrating ring vibrates, and the plurality of vibrating rods are connected. The vibrating rods are all connected with the vibrating ring, a plurality of the vibrating rods are arranged in parallel, and a part of each of the vibrating rods is located in the soaking cavity.
The circuit board soaking device according to claim 7, wherein the center point of the vibration ring coincides with the center of the soaking cavity, and a plurality of the vibration rods are arranged in a circular array around the center of the vibration ring .
The circuit board soaking device according to claim 1, wherein the soaking tank is provided with a liquid inlet and a liquid outlet, and both the liquid inlet and the liquid outlet communicate with the soaking cavity.
A circuit board processing equipment, characterized in that it comprises the circuit board soaking device according to any one of claims 1 to 9.