CN117500178B - Copper deposition device and copper deposition method for printed circuit board - Google Patents
Copper deposition device and copper deposition method for printed circuit board Download PDFInfo
- Publication number
- CN117500178B CN117500178B CN202311436027.0A CN202311436027A CN117500178B CN 117500178 B CN117500178 B CN 117500178B CN 202311436027 A CN202311436027 A CN 202311436027A CN 117500178 B CN117500178 B CN 117500178B
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- Prior art keywords
- copper deposition
- circuit board
- printed circuit
- copper
- plate
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 172
- 239000010949 copper Substances 0.000 title claims abstract description 172
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 171
- 238000000151 deposition Methods 0.000 title claims abstract description 122
- 230000008021 deposition Effects 0.000 title claims abstract description 103
- 239000007788 liquid Substances 0.000 claims description 76
- 238000004804 winding Methods 0.000 claims description 35
- 238000003860 storage Methods 0.000 claims description 29
- 238000007747 plating Methods 0.000 claims description 22
- 238000003756 stirring Methods 0.000 claims description 21
- 238000001556 precipitation Methods 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 3
- 210000003781 tooth socket Anatomy 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a copper deposition device of a printed circuit board and a copper deposition method thereof, comprising a copper deposition machine body, wherein the outer part of the copper deposition machine body is movably connected with an outer fluted disc through a bearing, one side of the outer fluted disc is provided with a copper deposition frame, one side of the copper deposition machine body is movably connected with a positioning shaft through a bearing, one side of the outer part of the positioning shaft is fixedly provided with a swinging plate, both sides of the outer part of the swinging plate are provided with swinging plates through bolts, the outer wall of the outer fluted disc and the bottom of the swinging plate are provided with tooth grooves, one side of the swinging plate is fixedly provided with a driving sloping plate, and the outer wall of the driving sloping plate is provided with a socket.
Description
Technical Field
The invention relates to the technical field of circuit board copper deposition, in particular to a copper deposition device and a copper deposition method of a printed circuit board.
Background
The printed circuit board, also called printed circuit board, is an important electronic component, is a support for electronic components, is a carrier for electrical connection of electronic components, and aims to deposit a layer of copper on the hole wall by utilizing a chemical reaction principle, so that the originally insulated hole wall has conductivity and is convenient for the smooth implementation of subsequent plate surface electroplating.
The copper immersion device comprises two mounting plates arranged at left and right intervals and an adjustable immersion device, wherein the adjustable immersion device is arranged between the two mounting plates and comprises a telescopic structure and a limiting structure.
The printed circuit board is subjected to chemical reaction treatment of the hole wall through the copper deposition device, but the hole wall of the printed circuit board is different in position, and during copper deposition, a chemical reaction solution can only be soaked on the surface of the printed circuit board and cannot penetrate into the hole wall of the circuit board, so that the copper deposition effect is poor, and therefore, a copper deposition device and a copper deposition method of the printed circuit board are needed to be designed to solve the problems.
Disclosure of Invention
The invention aims to provide a copper deposition device and a copper deposition method for a printed circuit board, which solve the defects in the prior art.
In order to achieve the above object, the present invention provides the following technical solutions:
The utility model provides a copper deposition device of printed circuit board, includes copper deposition organism, copper deposition organism's outside has the external tooth dish through bearing swing joint, one side of external tooth dish is provided with copper deposition frame, one side of copper deposition organism has the locating shaft through bearing swing joint, outside one side fixed mounting of locating shaft has the swing plate, and the outside both sides of swing plate all install the swing piece through the bolt, tooth's socket has all been seted up to the outer wall of external tooth dish and the bottom of swing plate, one side fixed mounting of swing plate has the drive swash plate, and the socket has been seted up to the outer wall of drive swash plate, copper deposition organism's one side outer wall welding has the mounting bracket, and the top of mounting bracket is through the bolt installation driving motor, driving motor's output is provided with the piece of stirring, and stir one end fixed mounting of piece has the fixture block, one side of copper deposition organism is provided with the liquid reserve tank, electric putter is installed through the bolt to the inside of liquid reserve tank, electric putter's top fixed mounting has the stifled liquid head.
Preferably, scale marks are arranged on the outer wall of the liquid storage tank, a lower through hole is arranged at the bottom of the copper deposition frame, and the clamping block is clamped in the socket.
Preferably, one side of the liquid storage tank is fixedly inserted with a liquid inlet pipe, and one end of the liquid inlet pipe is communicated with the inside of the copper deposition machine body.
Preferably, the two sides of the inner wall of the bottom of the copper deposition machine body are welded with a baffle, and one side of the baffle is provided with a sliding opening.
Preferably, the inside of sliding port inserts and is equipped with the butt casting die, the top one side welding of butt casting die has the pull ring, the top and the both sides of baffle all are provided with the fixed pulley.
Preferably, the winding motor is installed through the bolt to the inside both sides of copper organism that sinks, and the tip of winding motor is connected with through key and keyway and draws the reel, draw the outside of reel to roll up and be equipped with and draw the reel rope, and draw the one end and the pull ring of reel rope to be connected.
Preferably, the special-shaped opening is formed in the inner wall of one side of the copper depositing machine body, a liquid outlet pipe is inserted into the copper depositing machine body, and a liquid outlet plug is sleeved at one end of the liquid outlet pipe in a threaded manner.
The copper deposition method of the printed circuit board comprises the following steps of:
S1, filling liquid storage into: a printed circuit board is placed in the copper precipitation frame, the electroless copper precipitation solution is poured into the liquid storage tank, the electric push rod pulls the liquid blocking head, and the electroless copper precipitation solution is filled between the two partition boards;
S2, stirring and immersing: the output end of the driving motor drives the stirring piece, the clamping block can move in the socket, the swinging plate is driven by the driving sloping plate to drive the swinging plate, the swinging plate can stir the electroless copper plating solution, and the solution can be fully stirred and immersed into the printed circuit board;
S3, copper deposition reaction: the swinging plate enables the external gear plate to push after moving, so that the copper precipitation rack swings to enable the printed circuit board and the electroless copper plating solution to fully react, and the solution in the liquid storage tank is continuously supplied;
s4, liquid outlet: after the liquid outlet plug is rotated, the solution used for reaction flows out from the liquid outlet pipe;
s5, obtaining after copper deposition: after copper deposition, the winding motor is operated, the winding wheel can pull the winding rope, and the pull ring enables the pressing piece to be pulled upwards, namely the printed circuit board is ejected out, and copper deposition of the printed circuit board is finished.
Preferably, in the step S2, the driving motor is a bi-directional motor, and the rotation speed of the driving motor is 30-60 rpm.
Preferably, in the step S2, the swing angle of the driving sloping plate is 0-90 degrees, and in the step S5, the rotating speed of the winding motor is 35-80 revolutions per minute.
According to the copper deposition device and the copper deposition method of the printed circuit board, provided by the invention, the copper deposition frame, the swinging piece and the driving sloping plate are arranged, the stirring piece can move in the driving sloping plate after rotating along with the driving motor, so that the swinging plate rotates and stirs the chemical copper deposition solution with the swinging piece, the solution is stirred and immersed into the hole wall of the circuit board, meanwhile, the swinging plate pushes the external gear disc, the copper deposition frame swings, and the solution and the circuit board are fully contacted only through the operation of the driving motor to perform liquid feeding copper deposition; through the liquid storage tank and the liquid inlet pipe, the electric push rod runs in the liquid storage tank, the liquid blocking head can move downwards, so that the electroless copper plating solution is conveniently led into the electroless copper plating machine body from the liquid inlet pipe, the timely replenishment of the electroless copper plating solution is facilitated, and the consumed part is replenished; through baffle and the butt piece that sets up, the rolling motor makes and draws the reel round rotation, draws the pull ring pulling on the butt piece of winding rope, and then the butt piece can reciprocate, makes the printed circuit board in the copper frame of sinking take out fast, speeds up copper sinking processing.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
Fig. 1 is a schematic diagram of a three-dimensional structure of a copper deposition apparatus and a copper deposition method for a printed circuit board according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of a copper deposition apparatus and a method for depositing copper on a printed circuit board according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a copper deposition frame and a swing plate structure provided by an embodiment of a copper deposition apparatus and a copper deposition method for a printed circuit board according to the present invention.
Fig. 4 is a schematic cross-sectional view of a driving bevel board provided by an embodiment of a copper deposition apparatus and a copper deposition method for a printed circuit board according to the present invention.
Fig. 5 is a schematic diagram of a partial side view of a copper deposition apparatus and a method for depositing copper on a printed circuit board according to an embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view of a tank provided by an embodiment of a copper deposition apparatus and a copper deposition method for a printed circuit board according to the present invention.
Fig. 7 is a schematic diagram of a copper deposition apparatus and a separator structure provided by an embodiment of a copper deposition method of a printed circuit board according to the present invention.
Reference numerals illustrate:
The copper sinking machine comprises a copper sinking machine body, a copper sinking frame, a swinging plate 3, a swinging plate 4, a driving inclined plate 5, an outer fluted disc 6, a driving motor 7, a stirring piece 8, a clamping block 9, a tooth socket 10, a socket 11, a positioning shaft 12, a mounting frame 13, a special-shaped port 14, a partition plate 15, a winding motor 16, a drawing roller 17, a drawing and winding rope 18, a fixed pulley 19, a pressing piece 20, a sliding port 21, a liquid inlet pipe 22, a liquid outlet pipe 23, a liquid outlet plug 24, a lower through port 25, a pull ring 26, a liquid storage tank 27, a scale mark 28, a liquid blocking head 29 and an electric push rod 30.
Detailed Description
In order to make the technical scheme of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-7, the copper deposition device of the printed circuit board provided by the embodiment of the invention comprises a copper deposition machine body 1, wherein an external gear plate 6 is movably connected to the external portion of the copper deposition machine body 1 through a bearing, a copper deposition frame 2 is arranged on one side of the external gear plate 6, a positioning shaft 12 is movably connected to one side of the copper deposition machine body 1 through a bearing, a swinging plate 3 is fixedly arranged on one side of the external portion of the positioning shaft 12, swinging plates 4 are respectively arranged on two sides of the external portion of the swinging plate 3 through bolts, tooth sockets 10 are respectively arranged on the outer wall of the external gear plate 6 and the bottom of the swinging plate 3, a driving inclined plate 5 is fixedly arranged on one side of the swinging plate 3, a socket 11 is arranged on the outer wall of the driving inclined plate 5, a mounting frame 13 is welded on the outer wall of one side of the copper deposition machine body 1, a driving motor 7 is arranged on the top of the mounting frame 13 through bolts, a toggle piece 8 is arranged at the output end of the driving motor 7, a clamping block 9 is fixedly arranged on one end of the toggle piece 8, a liquid storage box 27 is arranged on one side of the copper deposition machine body, an electric push rod 30 is fixedly arranged on the inner side of the liquid storage box 27 through bolts, and a liquid blocking head 29 is fixedly arranged on the top of the electric push rod 30.
Specifically, in this embodiment, the copper plating machine comprises a copper plating machine body 1, an external tooth disk 6 is movably connected to the outside of the copper plating machine body 1 through a bearing, a socket 11 is formed in the outer wall of the external tooth disk 6, a mounting frame 13 is welded on the outer wall of one side of the copper plating machine body 1, a driving motor 7 is mounted on the top of the mounting frame 13 through a bolt, a positioning shaft 12 is movably connected to one side of the copper plating machine body 1 through the bearing, a swinging plate 3 is fixedly mounted on one side of the outside of the positioning shaft 12, the swinging plate 3 can swing through the positioning shaft 12 as a fulcrum, swinging plates 4 are mounted on two sides of the outside of the swinging plate 3 through bolts, tooth sockets 10 are formed in the outer wall of the external tooth disk 6 and the bottom of the swinging plate 3, a driving inclined plate 5 is fixedly mounted on one side of the swinging plate 3, a socket 11 is formed in the outer wall of the copper plating machine body 1, a mounting frame 13 is mounted on the top of the outer wall of the mounting frame 13 through a bolt, a toggle piece 8 is arranged at the output end of the driving motor 7, a clamping block 9 is fixedly mounted on one end of the toggle piece 8, after the driving motor 7 is started, the end of the driving motor 7 can drive the toggle piece 8 to rotate a certain angle, the toggle piece 8 is enabled, a solution storage plate 3 is enabled to rotate, a solution can be pushed by the toggle plate 9 is also enabled to be meshed with the copper plating solution 3 in the copper plating box 6 from the outer wall 6 through the outer wall of the copper plating plate 3, and the copper plating box 2, and the copper plating box 3 can be meshed with the copper plating plate 3, and the copper plating box 2 is enabled to be moved into the outer wall 3 through the external tooth plate 3 through the driving plate 3, the electric push rod 30 is arranged in the liquid storage tank 27 through a bolt, the liquid blocking head 29 is fixedly arranged at the top end of the electric push rod 30, the electroless copper plating solution enters the liquid storage tank 27, and after the liquid blocking head 29 is pulled by the electric push rod 30, the electroless copper plating solution can enter the lower end of the liquid storage tank 27 and pass out.
According to the copper precipitation device for the printed circuit board, the copper precipitation frame 2, the swinging piece 4 and the driving inclined plate 5 are arranged, after the stirring piece 8 rotates along with the driving motor 7, the clamping block 9 can move in the driving inclined plate 5, so that the swinging plate 3 rotates and stirs the swinging piece 4 into the electroless copper precipitation solution, the solution is stirred and immersed into the hole wall of the circuit board, meanwhile, the swinging plate 3 pushes the external gear 6 to swing the copper precipitation frame 2, and the solution is fully contacted with the circuit board to enter liquid for copper precipitation.
In another embodiment provided by the invention, as shown in fig. 1,4 and 6, scale marks 28 are arranged on the outer wall of the liquid storage tank 27, the scale marks 28 enable the solution amount of the liquid storage tank 27 to be measured, a lower through hole 25 is arranged at the bottom of the copper precipitation frame 2, electroless copper precipitation solution can enter the copper precipitation frame 2 from the lower through hole 25, the electroless copper precipitation solution reacts with a circuit board to precipitate copper, a clamping block 9 is clamped in the socket 11, and the clamping block 9 is convenient for driving the sloping plate 5 to move.
In another embodiment provided by the invention, as shown in fig. 1 and 6, one side of the liquid storage tank 27 is fixedly inserted with a liquid inlet pipe 22, one end of the liquid inlet pipe 22 is communicated with the inside of the copper deposition machine body 1, and the liquid storage tank 27 enables the electroless copper deposition solution to enter the copper deposition machine body 1 through the liquid inlet pipe 22.
In another embodiment provided by the invention, as shown in fig. 1,2 and 7, two sides of the inner wall of the bottom of the copper deposition machine body 1 are welded with the partition boards 15, the electroless copper deposition solution enters between the partition boards 15, the circuit board is subjected to copper deposition treatment, and one side of the partition boards 15 is provided with a sliding port 21.
In another embodiment provided by the invention, as shown in fig. 1,2 and 7, a pressing piece 20 is inserted into the sliding opening 21, the pressing piece 20 moves in the sliding opening 21, a pull ring 26 is welded on one side of the top of the pressing piece 20, the pressing piece 20 moves upwards through the dragging of the pull ring 26 to take out the printed circuit board in the copper sinking frame 2, fixed pulleys 19 are arranged on the top and two sides of the partition plate 15, and the fixed pulleys 19 facilitate the dragging of the pull-winding rope 18.
In another embodiment provided by the invention, as shown in fig. 1,2 and 7, a winding motor 16 is mounted on two sides of the interior of the copper deposition machine body 1 through bolts, the winding motor 16 runs in the copper deposition machine body 1, the end part of the winding motor 16 is connected with a winding wheel 17 through a key and a key slot, the output end of the winding motor 16 can enable the winding wheel 17 to rotate, a winding rope 18 is wound on the exterior of the winding wheel 17, the winding rope 18 can be pulled on the exterior of the winding wheel 17, and one end of the winding rope 18 is connected with a pull ring 26.
In another embodiment provided by the invention, as shown in fig. 1 and 2, a special-shaped opening 14 is formed in the inner wall of one side of the copper deposition machine body 1, a liquid outlet pipe 23 is inserted into the copper deposition machine body 1, a liquid outlet plug 24 is sleeved at one end of the liquid outlet pipe 23 in a threaded manner, and after the liquid outlet plug 24 is opened, used solution can be discharged from the liquid outlet pipe 23.
A copper deposition method of a printed circuit board comprises a copper deposition device of the printed circuit board, and the method comprises the following steps:
s1, filling liquid storage into: a printed circuit board is placed in the copper deposition frame 2, electroless copper deposition solution is poured into the liquid storage tank 27, the electric push rod 30 pulls the liquid blocking head 29, and the electroless copper deposition solution is filled between the two partition boards 15;
S2, stirring and immersing: the output end of the driving motor 7 drives the stirring piece 8, the clamping block 9 can move in the socket 11, the swinging plate 3 is driven by the driving sloping plate 5, the swinging plate 4 can stir the electroless copper plating solution, and the solution can be fully stirred and immersed in the printed circuit board;
S3, copper deposition reaction: after the swinging plate 3 moves, the external gear plate 6 is pushed, the copper deposition frame 2 swings to enable the printed circuit board and the electroless copper deposition solution to fully react, and the solution in the liquid storage tank 27 is continuously supplied;
S4, liquid outlet: after the liquid outlet plug 24 is rotated, the solution used for reaction flows out from the liquid outlet pipe 23;
S5, obtaining after copper deposition: after copper deposition, the winding motor 16 is operated, the winding wheel 17 can pull the winding rope 18, the pull ring 26 enables the pressing piece 20 to be pulled upwards, namely the printed circuit board is ejected out, and copper deposition of the printed circuit board is finished.
Preferably, in S2, the driving motor 7 is a bi-directional motor, and the rotation speed of the driving motor 7 is 30-60 rpm.
Preferably, in S2, the swing angle of the driving swash plate 5 is 0 to 90 degrees, and in S5, the rotational speed of the winding motor 16 is 35 to 80 rotations per minute.
Working principle: the operator puts the printed circuit board on the copper deposition frame 2, the chemical copper deposition solution pours into the inside of advance liquid reserve tank 27, electric putter 30 starts the back, electric putter 30's tip will block up liquid head 29 pulling downwards, make chemical copper deposition solution let in between two baffles 15 from feed liquor pipe 22, the chemical copper deposition solution irritates the below of swinging plate 4, personnel start driving motor 7, driving motor 7's tip will stir 8 drive, stir the fixture block 9 of piece 8 messenger's tip and move in the inside of socket 11, fixture block 9 moves about after, fixture block 9 can drive driving swash plate 5 and take locating shaft 12 to swing, then driving swash plate 5 can make swinging plate 3 drive, swinging plate 4 on the swinging plate 3 will chemical copper deposition solution stir, make chemical copper deposition solution fully stir and soak on the printed circuit board, and make external tooth dish 6 promote after swinging plate 3 moves, make the printed circuit board and chemical copper deposition solution reaction on copper deposition frame 2, personnel rotate liquid drain 24, after stirring down plug 24 makes fixture block 9 activity in the inside of socket 11, fixture block 9 moves about and swings with locating shaft 12 as the fulcrum, then driving swash plate 5 can make the swinging plate 3 pull out to take out rope reel 16, make the top of the rope take out to roll-up pulley 18, can make the reel 16 pull out to take out to the rope reel 20, make the top of printed circuit board, can make the reel 20 pull out, take up to the top of the rope, take up, the top of the rope is rolled up, can take down, and the top, the rope, and the top, can use, and the copper.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (10)
1. The copper deposition device of the printed circuit board comprises a copper deposition machine body (1), and is characterized in that an external gear plate (6) is movably connected to the external gear plate (1) through a bearing, a copper deposition frame (2) is arranged on one side of the external gear plate (6), a positioning shaft (12) is movably connected to one side of the copper deposition machine body (1) through a bearing, a swinging plate (3) is fixedly arranged on one side of the positioning shaft (12), swinging plates (4) are arranged on two sides of the external portion of the swinging plate (3) through bolts, tooth grooves (10) are formed in the outer wall of the external gear plate (6) and the bottom of the swinging plate (3), a driving inclined plate (5) is fixedly arranged on one side of the swinging plate (3), a socket (11) is formed in the outer wall of the driving inclined plate (5), a mounting frame (13) is welded on one side of the outer wall of the copper deposition machine body (1), a driving motor (7) is arranged on the top of the mounting frame through bolts, a liquid storage part (8) is fixedly arranged at the output end of the driving motor (7), a liquid storage part (9) is fixedly arranged on one end of the swinging plate (8), a copper storage block (27) is fixedly arranged on one side of the copper deposition box (27), the top end of the electric push rod (30) is fixedly provided with a liquid blocking head (29).
2. The copper deposition device of the printed circuit board according to claim 1, wherein the outer wall of the liquid storage tank (27) is provided with scale marks (28), the bottom of the copper deposition frame (2) is provided with a lower through hole (25), and the clamping block (9) is clamped in the socket (11).
3. The copper deposition device of the printed circuit board according to claim 1, wherein one side of the liquid storage tank (27) is fixedly inserted with a liquid inlet pipe (22), and one end of the liquid inlet pipe (22) is communicated with the interior of the copper deposition machine body (1).
4. The copper deposition device of the printed circuit board according to claim 1, wherein two sides of the inner wall of the bottom of the copper deposition machine body (1) are welded with a baffle plate (15), and one side of the baffle plate (15) is provided with a sliding opening (21).
5. Copper deposition device for printed circuit boards according to claim 4, characterized in that the sliding opening (21) is internally inserted with a pressing piece (20), one side of the top of the pressing piece (20) is welded with a pull ring (26), and the top and two sides of the partition plate (15) are provided with fixed pulleys (19).
6. The copper deposition device of the printed circuit board according to claim 5, wherein a winding motor (16) is mounted on two sides of the interior of the copper deposition machine body (1) through bolts, the end portion of the winding motor (16) is connected with a pull winding wheel (17) through a key and a key slot, a pull winding rope (18) is wound on the exterior of the pull winding wheel (17), and one end of the pull winding rope (18) is connected with a pull ring (26).
7. The copper deposition device of the printed circuit board according to claim 1, wherein a special-shaped opening (14) is formed in the inner wall of one side of the copper deposition machine body (1), a liquid outlet pipe (23) is inserted into the copper deposition machine body (1), and a liquid outlet plug (24) is sleeved at one end of the liquid outlet pipe (23) in a threaded manner.
8. A method of copper deposition of a printed circuit board, comprising a copper deposition apparatus of a printed circuit board according to any one of claims 1 to 7, characterized by comprising the steps of:
S1, filling liquid storage into: a printed circuit board is placed in the copper precipitation frame (2), the electroless copper precipitation solution is poured into the liquid storage tank (27), the electric push rod (30) pulls the liquid blocking head (29), and the electroless copper precipitation solution is filled between the two partition boards (15);
s2, stirring and immersing: the output end of the driving motor (7) drives the stirring piece (8), the clamping block (9) can move in the socket (11), the swinging plate (3) is driven by the driving sloping plate (5), the swinging plate (4) can stir the electroless copper plating solution, and the solution can be fully stirred and immersed in the printed circuit board;
S3, copper deposition reaction: the swinging plate (3) pushes the external gear (6) after moving, so that the copper deposition frame (2) swings to enable the printed circuit board and the electroless copper deposition solution to fully react, and the solution in the liquid storage tank (27) is continuously supplied;
S4, liquid outlet: after the liquid outlet plug (24) is rotated, the solution used for reaction flows out from the liquid outlet pipe (23);
S5, obtaining after copper deposition: after copper deposition, the winding motor (16) is operated, the winding wheel (17) can pull the winding rope (18), the pull ring (26) enables the pressing piece (20) to be pulled upwards, namely the printed circuit board is ejected out, and copper deposition of the printed circuit board is finished.
9. The method for copper deposition of printed circuit board according to claim 8, wherein in S2, the driving motor (7) is a bi-directional motor, and the rotation speed of the driving motor (7) is 30-60 rpm.
10. The copper deposition method of the printed circuit board according to claim 8, wherein in S2, the swing angle of the driving sloping plate (5) is 0-90 degrees, and in S5, the rotational speed of the winding motor (16) is 35-80 rotations per minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311436027.0A CN117500178B (en) | 2023-10-31 | 2023-10-31 | Copper deposition device and copper deposition method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311436027.0A CN117500178B (en) | 2023-10-31 | 2023-10-31 | Copper deposition device and copper deposition method for printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN117500178A CN117500178A (en) | 2024-02-02 |
| CN117500178B true CN117500178B (en) | 2024-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311436027.0A Active CN117500178B (en) | 2023-10-31 | 2023-10-31 | Copper deposition device and copper deposition method for printed circuit board |
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|---|---|---|---|---|
| JPH06326463A (en) * | 1993-05-14 | 1994-11-25 | Matsushita Electric Works Ltd | Through-hole plating apparatus of printed wiring board |
| JP2009013440A (en) * | 2007-06-29 | 2009-01-22 | Hitachi Maxell Ltd | Electroplating device and electroplating method |
| CN112165784A (en) * | 2020-10-15 | 2021-01-01 | 广德东风电子有限公司 | Full-automatic circuit board level heavy copper line VCP electroplates device |
| WO2022099982A1 (en) * | 2020-11-16 | 2022-05-19 | 淮安特创科技有限公司 | Circuit board soaking apparatus and circuit board processing equipment |
| CN114775021A (en) * | 2022-04-21 | 2022-07-22 | 深圳市溢诚电子科技有限公司 | Uniform chemical copper deposition equipment for circuit board |
| CN217052399U (en) * | 2022-04-14 | 2022-07-26 | 黄石伟胜环保科技有限公司 | Copper deposition rack equipment capable of simultaneously depositing copper on multiple circuit boards |
| CN218071984U (en) * | 2022-04-30 | 2022-12-16 | 信丰汇芯线路科技有限公司 | Copper device sinks to rotation formula PCB board |
| CN116133282A (en) * | 2023-03-03 | 2023-05-16 | 广德众泰科技有限公司 | Circuit board automation control copper deposition processing system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2746433B1 (en) * | 2012-12-20 | 2016-07-20 | ATOTECH Deutschland GmbH | Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device |
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| JPH06326463A (en) * | 1993-05-14 | 1994-11-25 | Matsushita Electric Works Ltd | Through-hole plating apparatus of printed wiring board |
| JP2009013440A (en) * | 2007-06-29 | 2009-01-22 | Hitachi Maxell Ltd | Electroplating device and electroplating method |
| CN112165784A (en) * | 2020-10-15 | 2021-01-01 | 广德东风电子有限公司 | Full-automatic circuit board level heavy copper line VCP electroplates device |
| WO2022099982A1 (en) * | 2020-11-16 | 2022-05-19 | 淮安特创科技有限公司 | Circuit board soaking apparatus and circuit board processing equipment |
| CN217052399U (en) * | 2022-04-14 | 2022-07-26 | 黄石伟胜环保科技有限公司 | Copper deposition rack equipment capable of simultaneously depositing copper on multiple circuit boards |
| CN114775021A (en) * | 2022-04-21 | 2022-07-22 | 深圳市溢诚电子科技有限公司 | Uniform chemical copper deposition equipment for circuit board |
| CN218071984U (en) * | 2022-04-30 | 2022-12-16 | 信丰汇芯线路科技有限公司 | Copper device sinks to rotation formula PCB board |
| CN116133282A (en) * | 2023-03-03 | 2023-05-16 | 广德众泰科技有限公司 | Circuit board automation control copper deposition processing system |
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| CN117500178A (en) | 2024-02-02 |
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