CN207775383U - A kind of promotion circuit board electroplating depth mechanism - Google Patents
A kind of promotion circuit board electroplating depth mechanism Download PDFInfo
- Publication number
- CN207775383U CN207775383U CN201820034691.0U CN201820034691U CN207775383U CN 207775383 U CN207775383 U CN 207775383U CN 201820034691 U CN201820034691 U CN 201820034691U CN 207775383 U CN207775383 U CN 207775383U
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- China
- Prior art keywords
- rotating machine
- electric rotating
- cylinder
- plating
- circuit board
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- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 24
- 230000007246 mechanism Effects 0.000 title claims abstract description 20
- 238000007747 plating Methods 0.000 claims abstract description 64
- 238000007789 sealing Methods 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 230000009514 concussion Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 230000003628 erosive effect Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 8
- 230000001737 promoting effect Effects 0.000 abstract 1
- 206010010254 Concussion Diseases 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of promotion circuit board electroplating depth mechanisms, including cylinder is electroplated, sealing cover, electric rotating machine and DC power supply, sealing cover is fixed on the top of plating cylinder, plating cylinder is located at the top of electric rotating machine, the lower surface of plating cylinder is provided with connecting pole, the lower end of connecting pole and the power output end of electric rotating machine connect, it is additionally provided with multiple vibrating springs between the lower surface and electric rotating machine of plating cylinder, plating cylinder inside bottom is provided with anode posts, it is electroplated on the madial wall of cylinder and is provided with multiple heating rods, plate folder is held in the lower surface setting of sealing cover, pressurizer is provided on sealing cover, DC power supply is located at electric rotating machine side, DC power supply is electrically connected with anode posts.Temperature that can be with lifting device in plating by the heating rod of setting, so that the temperature of electroplate liquid increases, while the pressurizer on sealing cover can increase the pressure in plating cylinder, and comprehensive by the pressurization that heats up coordinates, the plating depth for promoting circuit board, reaches the requirement of industrial application.
Description
Technical field
The utility model is related to electroplanting device fields, more particularly to a kind of promotion circuit board electroplating depth mechanism.
Background technology
As the products such as smart mobile phone, tablet computer and wearable device develop height to miniaturization, multifunction direction
Density interconnected printed circuit board technology is constantly promoted, HDI conductor widths, spacing, the diameter and hole centre distance of micropore disk, and
The thickness of conductor layer and insulating layer all declines constantly so that and it is not increased in HDI sizes, weight and volume, it is promoted
The number of plies of HDI, this is also to the depth of intensification electroplated layer, it is proposed that higher requirement.
American-European countries is by solution plus the method for special solvent increases plating depth at present, but these solvents are all
Confidential state is taken to China, therefore independent development promotes plating depth at there is an urgent need to the directions of effort.
Utility model content
In order to overcome the defects of the prior art, the technical problem to be solved by the utility model is to propose a kind of promotion
Circuit board electroplating depth mechanism, temperature when can be electroplated by being promoted and increasing are promoted to promote the process of plating
The whole plating depth of circuit board.
For this purpose, the utility model uses following technical scheme：
The utility model discloses a kind of promotion circuit board electroplating depth mechanisms, including plating cylinder, sealing cover, electric rotating machine
And DC power supply, the sealing cover are fixed on the top of the plating cylinder, the plating cylinder is located at the upper of the electric rotating machine
The lower surface of side, the plating cylinder is provided with connecting pole, the power output end of the lower end of the connecting pole and the electric rotating machine
Connection is additionally provided with multiple vibrating springs, the plating cylinder inside between the lower surface and the electric rotating machine of the plating cylinder
Bottom is provided with anode posts, and multiple heating rods, the lower surface setting of the sealing cover are provided on the madial wall of the plating cylinder
There are multiple plates of holding to press from both sides, the plate folder of holding is located at the inside that cylinder is electroplated, and pressurizer, the direct current are provided on the sealing cover
Power supply is located at the side of the electric rotating machine, and the DC power supply is electrically connected with the anode posts.
In the utility model preferably technical solution, relief valve is provided on the sealing cover.
In the utility model preferably technical solution, it is provided on the side wall of the plating cylinder for observing situation in cylinder
Form, the form is made of corrosion-resistant glass.
In the utility model preferably technical solution, the promotion circuit board electroplating depth mechanism further includes multiple concussions
Column, multiple concussion columns are respectively arranged between the end and the electric rotating machine of the lower surface of the plating cylinder.
In the utility model preferably technical solution, the promotion circuit board electroplating depth mechanism further includes microcontroller,
The microcontroller is configured to STC microcontrollers, and the microcontroller is electrically connected with the electric rotating machine.
In the utility model preferably technical solution, erosion shield is coated on the madial wall of the plating cylinder.
In the utility model preferably technical solution, the bottom of the electric rotating machine is provided with rubber leg.
The beneficial effects of the utility model are：
A kind of promotion circuit board electroplating depth mechanism provided by the utility model, dress can be promoted by the heating rod of setting
Set the temperature in plating so that the temperature of electroplate liquid increases, while the pressurizer on sealing cover can increase in plating cylinder
Pressure, increasing pressure can promote plating to become more fully, and comprehensive by the pressurization that heats up coordinates, and promotes the plating of circuit board
Depth reaches the requirement of industrial application.
Description of the drawings
Fig. 1 is the structural schematic diagram for the promotion circuit board electroplating depth mechanism that specific embodiment of the present invention provides；
Fig. 2 is the front view for the promotion circuit board electroplating depth mechanism that specific embodiment of the present invention provides.
In figure：
1, it is electroplated cylinder, 2, sealing cover, 3, electric rotating machine, 4, concussion column, 5, microcontroller, 6, DC power supply, 7, form, 11,
Connecting pole, 12, vibrating spring, 13, anode posts, 14. heating rods, 21, hold plate folder, 22, pressurizer, 23, relief valve, 31, rubber
Support leg.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
As shown in Figure 1, a kind of promotion circuit board electroplating depth mechanism is provided in embodiment, including plating cylinder 1, sealing cover
2, electric rotating machine 3 and DC power supply 6, sealing cover 2 are fixed on the top of plating cylinder 1, and plating cylinder 1 is located at the upper of electric rotating machine 3
The lower surface of side, plating cylinder 1 is provided with connecting pole 11, and the lower end of connecting pole 11 is connect with the power output end of electric rotating machine 3, electricity
Multiple vibrations springs 12 are additionally provided between the lower surface and electric rotating machine 3 of plating cylinder 1, plating 1 inside bottom of cylinder is provided with anode
Column 13 is electroplated on the madial wall of cylinder 1 and is provided with multiple heating rods 14, and the lower surface of sealing cover 2 is provided with multiple plates of holding and presss from both sides 21, holds
Plate folder 21 is located at the inside of plating cylinder 1, and pressurizer 22 is provided on sealing cover 2, and DC power supply 6 is located at the side of electric rotating machine 3,
And DC power supply 6 is electrically connected with anode posts 13.Before starting plating, electroplate liquid can be injected by being electroplated in cylinder 1, on sealing cover 2
Hold plate folder and 21 hold circuit board to be electroplated, close in plating cylinder 1, at this time device begin to start DC power supply 6 be
The anode posts 13 being electroplated in cylinder 1 are powered, and start to start to be electroplated for circuit board.In order to promote plating depth, heating rod 14 can also be held
Beginning work, heating rod 14 can heat electroplate liquid, promote the temperature of electroplate liquid, while the pressurizer 22 on sealing cover 2 can also start
Work, the pressurization in plating cylinder 1, improves pressure, by the cooperation to heat up with pressurization, improves the depth of plating.Finally it is being electroplated
The electric rotating machine 3 of 1 bottom of cylinder starts, and plating cylinder 1 is driven to rotate.When the rotation of cylinder 1 is electroplated, the electroplate liquid in cylinder can also rotate
Come, acceleration is hit circuit board by the metal ion in electroplate liquid at this time, accelerates the accumulation of plating, promotes plating rate.
In order to easily open sealing cover 2 after plating, further, relief valve 23 is provided on sealing cover 2.By
In in plating, can pressurize in cylinder, it is fast to leading to sealing cover 2 since in-cylinder pressure is excessive if directly opening sealing cover 2
It flies up fastly, but provided with after relief valve 23, pressure release can be carried out by relief valve 23 before opening sealing cover 2, avoided
Sealing cover 2 flies up.
As shown in Fig. 2, observing situation in cylinder in electroplating process for the convenience of the users, further, the side of cylinder 1 is electroplated
The form 7 for observing situation in cylinder is provided on wall, form 7 is made of corrosion-resistant glass.In electroplating process, due in cylinder
Pressure it is higher, when opening, is intended to first pressure release, therefore cannot open plating cylinder 1 at any time to observe circuit board situation, therefore is arranged
After form 7, so that it may to observe the situation in cylinder by form 7 at any time, since electrolyte has certain corrosivity, even
Glass can be eroded, therefore the glass that form 7 uses herein is internal corrosion glass.
It is deep further to promote circuit board electroplating for exposure level when in order to promote plating between electrolyte and circuit board
Degree device further includes multiple concussion columns 4, and multiple concussion columns 4 are respectively arranged at end and the electric rotating machine 3 of the lower surface of plating cylinder 1
Between.Concussion column 4 is constantly occurring vibrations, and plating cylinder 1 is driven to shake, and promotes the plating vibration of liquid flowing in cylinder, enhances to electricity
The impact of road plate adds enhancing electroplating effect.
In order to enable the rotation of rotary electric machine is controllable, further, it further includes monolithic to promote circuit board electroplating depth mechanism
Machine 5, microcontroller 5 are configured to STC microcontrollers, and microcontroller 5 is electrically connected with electric rotating machine 3.Microcontroller 5 generates fixed frequency, makes
It obtains rotating speed and is located at controllable state.
Plating cylinder 1 is etched in order to prevent, further, is electroplated on the madial wall of cylinder 1 and is coated with erosion shield.Due to electricity
Plating solution have very strong corrosivity, therefore plating cylinder 1 madial wall coat erosion shield can be effectively prevented plating cylinder 1
It is etched, improves the whole service life of device.
Device vibrations are excessive in order to prevent, and further, the bottom of electric rotating machine 3 is provided with rubber leg 31.Setting
It can be shaken with the overwhelming majority that buffer unit generate during plating rotation concussion after rubber leg 31.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality
In the case of with novel spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality
It is not limited to the particular embodiment disclosed with novel, other embodiments fallen into claims hereof all belong to
In the range of the utility model protection.
Claims (7)
1. a kind of promotion circuit board electroplating depth mechanism, including plating cylinder (1), sealing cover (2), electric rotating machine (3), the sealing
Lid (2) is fixed on the top of the plating cylinder (1), and the plating cylinder (1) is located at the top of the electric rotating machine (3), feature
It is：The lower surface of the plating cylinder (1) is provided with connecting pole (11), lower end and the electric rotating machine of the connecting pole (11)
(3) power output end connection, multiple shake is additionally provided between the lower surface and the electric rotating machine (3) of the plating cylinder (1)
It moves spring (12), plating cylinder (1) inside bottom is provided with anode posts (13), is arranged on the madial wall of the plating cylinder (1)
There are multiple heating rods (14), the lower surface of the sealing cover (2) to be provided with multiple plates of holding and press from both sides (21), the plate folder (21) of holding is located at
The inside of the plating cylinder (1), is provided with pressurizer (22) on the sealing cover (2), further includes DC power supply (6), described straight
Galvanic electricity source (6) is located at the side of the electric rotating machine (3), and the DC power supply (6) is electrically connected with the anode posts (13).
2. a kind of promotion circuit board electroplating depth mechanism according to claim 1, it is characterised in that：
It is provided with relief valve (23) on the sealing cover (2).
3. a kind of promotion circuit board electroplating depth mechanism according to claim 1, it is characterised in that：
The form (7) for observing situation in cylinder is provided on the side wall of the plating cylinder (1)；
The form (7) is made of corrosion-resistant glass.
4. a kind of promotion circuit board electroplating depth mechanism according to claim 1, it is characterised in that：
Further include multiple concussion columns (4)；
Multiple concussion columns (4) be respectively arranged at the lower surface of the plating cylinder (1) end and the electric rotating machine (3) it
Between.
5. a kind of promotion circuit board electroplating depth mechanism according to claim 1, it is characterised in that：
Further include microcontroller (5),
The microcontroller (5) is configured to STC microcontrollers；
The microcontroller (5) is electrically connected with the electric rotating machine (3).
6. a kind of promotion circuit board electroplating depth mechanism according to claim 1, it is characterised in that：The plating cylinder (1)
Madial wall on be coated with erosion shield.
7. a kind of promotion circuit board electroplating depth mechanism according to claim 1, it is characterised in that：The electric rotating machine
(3) bottom is provided with rubber leg (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820034691.0U CN207775383U (en) | 2018-01-09 | 2018-01-09 | A kind of promotion circuit board electroplating depth mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820034691.0U CN207775383U (en) | 2018-01-09 | 2018-01-09 | A kind of promotion circuit board electroplating depth mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207775383U true CN207775383U (en) | 2018-08-28 |
Family
ID=63222967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820034691.0U Expired - Fee Related CN207775383U (en) | 2018-01-09 | 2018-01-09 | A kind of promotion circuit board electroplating depth mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207775383U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533398A (en) * | 2020-11-16 | 2021-03-19 | 淮安特创科技有限公司 | Circuit board soaking device and circuit board processing equipment |
-
2018
- 2018-01-09 CN CN201820034691.0U patent/CN207775383U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533398A (en) * | 2020-11-16 | 2021-03-19 | 淮安特创科技有限公司 | Circuit board soaking device and circuit board processing equipment |
| WO2022099982A1 (en) * | 2020-11-16 | 2022-05-19 | 淮安特创科技有限公司 | Circuit board soaking apparatus and circuit board processing equipment |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 |