CN108517546A - The silver-plated method of expanded microporous polytetra fluoroethylene-EPTEE film - Google Patents
The silver-plated method of expanded microporous polytetra fluoroethylene-EPTEE film Download PDFInfo
- Publication number
- CN108517546A CN108517546A CN201810377058.6A CN201810377058A CN108517546A CN 108517546 A CN108517546 A CN 108517546A CN 201810377058 A CN201810377058 A CN 201810377058A CN 108517546 A CN108517546 A CN 108517546A
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- China
- Prior art keywords
- polytetra fluoroethylene
- expanded microporous
- microporous polytetra
- eptee
- eptee film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a kind of method that expanded microporous polytetra fluoroethylene-EPTEE film is silver-plated, method includes：1) expanded microporous polytetra fluoroethylene-EPTEE film surface is handled：Expanded microporous polytetra fluoroethylene-EPTEE film surface is vertically bombarded using high speed plasma air-flow, treated expanded microporous polytetra fluoroethylene-EPTEE film is made；2) cleaning of expanded microporous polytetra fluoroethylene-EPTEE film：By treated in step 1), expanded microporous polytetra fluoroethylene-EPTEE film cleans；3) silver-plated：Expanded microporous polytetra fluoroethylene-EPTEE film after cleaning is placed in plate silver plating solution and is electroplated.The present invention carries out roughening treatment to expanded microporous polytetra fluoroethylene-EPTEE film surface, increase its surface adhesion force, then cleaned, further increase its surface cleanliness, it improves adhesive force and silver layer is equably further plated with plating mode on its surface, while improving its adhesive force, uniformity, continuity of silver coating etc. are also improved.Mode through the invention is realized with the performances such as better compactness, and the effect that adhesive force is good.
Description
Technical field
The present invention relates to expanded microporous polytetra fluoroethylene-EPTEE film surface electric plating methods, and in particular, to expanded microporous polytetra fluoroethylene-EPTEE
The silver-plated method of film.
Background technology
Expanded microporous polytetra fluoroethylene-EPTEE film as a kind of flexible and flexible poromerics, can be used for sterilizing filter membrane,
The ultra-clean filter membrane etc. of electrolyte membrane, gas dialysis membrane and various solvents.And because it is a kind of thin polymer film, surface is often
It is relatively smooth so that the problems such as it is poor that it is susceptible to adhesion property after plating, and antioxygenic property is poor.
Therefore it provides a kind of electroplate layer adhesion is good, and with the preferable performances such as anti-oxidant, silver layer compactness compared with
The problem of silver-plated method of good expanded microporous polytetra fluoroethylene-EPTEE film is urgent need to resolve of the present invention.
Invention content
For the above-mentioned prior art, it is an object of the invention to overcome expanded microporous polytetra fluoroethylene-EPTEE film surface in the prior art
It is poor that adhesion property is susceptible to after plating coating, and the problems such as antioxygenic property is poor, to provide a kind of electroplate
Layer adhesion is good, and silver-plated with preferably anti-oxidant etc. performances, the preferable expanded microporous polytetra fluoroethylene-EPTEE film of silver layer compactness
Method.
To achieve the goals above, the present invention provides a kind of methods that expanded microporous polytetra fluoroethylene-EPTEE film is silver-plated, wherein institute
The method of stating includes：
1) expanded microporous polytetra fluoroethylene-EPTEE film surface is handled：Expanded microporous polytetra fluoroethylene-EPTEE film surface is used into high speed plasma (orifice) gas
The vertical bombardment of stream, the expanded microporous polytetra fluoroethylene-EPTEE film that is made that treated；
2) cleaning of expanded microporous polytetra fluoroethylene-EPTEE film：By treated in step 1), expanded microporous polytetra fluoroethylene-EPTEE film carries out clearly
It washes；
3) silver-plated：Expanded microporous polytetra fluoroethylene-EPTEE film after cleaning is placed in plate silver plating solution and is electroplated.
Preferably, in step 1), during bombardment, the plasma air-flow of the expanded microporous polytetra fluoroethylene-EPTEE film and bombardment
Keep relative motion.
Preferably, the expanded microporous polytetra fluoroethylene-EPTEE film realizes uniform motion by air current spray nozzle.
Preferably, cleaning process is to be placed in soaking and washing in deionized water in step 2).
Preferably, further include vibrating expanded microporous polytetra fluoroethylene-EPTEE film, and time of vibration is 10- in cleaning process
20min。
Preferably, it vibrates to be vibrated using ultrasonic vibration installation.
Preferably, in the plate silver plating solution at least further include antioxidant, brilliant thin agent and silver nitrate.
Preferably, relative to the silver nitrate of 10 parts by weight, the content of the antioxidant is 3-10 parts by weight, described
The content of brilliant thin agent is 8-15 parts by weight.
Preferably, in step 3), the current density in electroplating process is 15-30A/cm2。
Preferably, the temperature of electroplate liquid is 25-35 DEG C in electroplating process, electroplating time 20-30min.
Through the above technical solutions, the present invention first carries out roughening treatment to expanded microporous polytetra fluoroethylene-EPTEE film surface, increase
Its surface adhesion force, is then cleaned, its surface cleanliness is further increased, and adhesive force is improved, further, at it
Surface equably plates silver layer with plating mode, while improving its adhesive force, also improves the uniformity, continuous of silver coating
Property etc..Mode through the invention is realized with the performances such as better compactness, and the effect that adhesive force is good.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below.It should be understood that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
The endpoint of disclosed range and any value are not limited to the accurate range or value herein, these ranges or
Value should be understood as comprising the value close to these ranges or value.For numberical range, between the endpoint value of each range, respectively
It can be combined with each other between the endpoint value of a range and individual point value, and individually between point value and obtain one or more
New numberical range, these numberical ranges should be considered as specific open herein.
The present invention provides a kind of methods that expanded microporous polytetra fluoroethylene-EPTEE film is silver-plated, wherein the method includes：
1) expanded microporous polytetra fluoroethylene-EPTEE film surface is handled：Expanded microporous polytetra fluoroethylene-EPTEE film surface is used into high speed plasma (orifice) gas
The vertical bombardment of stream, the expanded microporous polytetra fluoroethylene-EPTEE film that is made that treated；
2) cleaning of expanded microporous polytetra fluoroethylene-EPTEE film：By treated in step 1), expanded microporous polytetra fluoroethylene-EPTEE film carries out clearly
It washes；
3) silver-plated：Expanded microporous polytetra fluoroethylene-EPTEE film after cleaning is placed in plate silver plating solution and is electroplated.
The present invention first carries out roughening treatment to expanded microporous polytetra fluoroethylene-EPTEE film surface, increases its surface adhesion force, then
It is cleaned, further increases its surface cleanliness, improve adhesive force, it is further, equal with plating mode on its surface
Silver layer is plated evenly, while improving its adhesive force, also improves uniformity, continuity of silver coating etc..Through the invention
Mode, realize with the performances such as better compactness, and the effect that adhesive force is good.
In order to make the roughening treatment of expanded microporous polytetra fluoroethylene-EPTEE film surface be more uniformly distributed, in a kind of preferred reality of the present invention
It applies in mode, in step 1), during bombardment, the expanded microporous polytetra fluoroethylene-EPTEE film and the plasma air-flow of bombardment keep phase
To movement.Here relative motion refers to small in the work area of expanded microporous polytetra fluoroethylene-EPTEE film surface because of plasma air-flow
In the surface area of expanded microporous polytetra fluoroethylene-EPTEE film, thus, selection is realized by the uniform velocity moving for expanded microporous polytetra fluoroethylene-EPTEE film
Each position is equably bombarded by plasma air-flow.Thus, relative motion here can be those skilled in the art's energy
The mode enough understood is operated.
Certainly, the uniform motion of expanded microporous polytetra fluoroethylene-EPTEE film can for those skilled in the art it will be appreciated that mode
It is operated, for example, in a kind of more preferably embodiment, the expanded microporous polytetra fluoroethylene-EPTEE film is realized by air current spray nozzle
Uniform motion.
Cleaning process can be selected according to actual needs in step 2), for example, in a kind of preferred reality of the present invention
It applies in mode, cleaning process is to be placed in soaking and washing in deionized water in step 2).Certainly, soaking and washing mode here can be with
For skilled artisans appreciate that mode of operation carry out.
Further include that expanded microporous polytetra fluoroethylene-EPTEE film shakes in cleaning process in one kind more preferably embodiment
It is dynamic, and time of vibration is 10-20min.
Here the operation of vibration can select any appropriate mode to carry out, for example, in a kind of preferred embodiment,
Vibration is to be vibrated using ultrasonic vibration installation.
The plate silver plating solution can be plate silver plating solution type commonly used in the art, certainly, the one of the present invention
At least further include antioxidant, brilliant thin agent and silver nitrate in the plate silver plating solution in kind more preferably embodiment.Antioxygen
Agent type can be according to actual selection, for example, can be silver-plated antioxidant.Certainly, the class of silver-plated antioxidant here
Type can select according to actual needs, can select conventional silver-plated antioxidant.Further, here the type of the thin agent of crystalline substance
It can be selected according to actual needs, conventional use of brilliant thin agent can be used herein, seldom repeat herein.
The content of above-mentioned raw materials can select in a wide range, for example, in a kind of more preferably embodiment, relatively
It is 3-10 parts by weight in the content of the silver nitrate of 10 parts by weight, the antioxidant, the content of the brilliant thin agent is 8-15
Parts by weight.By the specific restriction of addition and content to above-mentioned raw materials, the inoxidizability of silver coating is further improved, is increased
The compactness of silver coating, continuity and uniformity, while improving production efficiency.
The parameters of electroplating process can select in a wide range, certainly, the present invention it is a kind of more preferably
In embodiment, in order to enable the compactness of silver coating, continuity and uniformity etc. are more preferable, in step 3), in electroplating process
Current density is 15-30A/cm2.Pass through this setting so that electroplating velocity gets a promotion, and electroplating quality is stablized.
In further preferred embodiment, the temperature of electroplate liquid is 25-35 DEG C in electroplating process, electroplating time 20-
30min。
The preferred embodiment of the present invention has been described above in detail, still, during present invention is not limited to the embodiments described above
Detail can carry out a variety of simple variants to technical scheme of the present invention within the scope of the technical concept of the present invention, this
A little simple variants all belong to the scope of protection of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (10)
1. a kind of method that expanded microporous polytetra fluoroethylene-EPTEE film is silver-plated, which is characterized in that the method includes：
1) expanded microporous polytetra fluoroethylene-EPTEE film surface is handled：Expanded microporous polytetra fluoroethylene-EPTEE film surface is hung down using high speed plasma air-flow
Straight bombardment, the expanded microporous polytetra fluoroethylene-EPTEE film that is made that treated；
2) cleaning of expanded microporous polytetra fluoroethylene-EPTEE film：By treated in step 1), expanded microporous polytetra fluoroethylene-EPTEE film cleans；
3) silver-plated：Expanded microporous polytetra fluoroethylene-EPTEE film after cleaning is placed in plate silver plating solution and is electroplated.
2. according to the method described in claim 1, wherein, in step 1), during bombardment, the expanded microporous polytetra fluoroethylene-EPTEE is thin
Film and the plasma air-flow of bombardment keep relative motion.
3. according to the method described in claim 2, wherein, the expanded microporous polytetra fluoroethylene-EPTEE film is realized at the uniform velocity by air current spray nozzle
Movement.
4. according to the method described in any one of claim 1-3, wherein cleaning process is to be placed in deionized water in step 2)
Middle soaking and washing.
5. according to the method described in claim 4, further including carrying out expanded microporous polytetra fluoroethylene-EPTEE film in cleaning process wherein
Vibration, and time of vibration is 10-20min.
6. according to the method described in claim 5, wherein, vibrating to be vibrated using ultrasonic vibration installation.
7. according to the method described in any one of claim 1-3, wherein at least further include antioxygen in the plate silver plating solution
Agent, brilliant thin agent and silver nitrate.
8. according to the method described in claim 7, wherein, relative to the silver nitrate of 10 parts by weight, the antioxidant
Content is 3-10 parts by weight, and the content of the brilliant thin agent is 8-15 parts by weight.
9. according to the method described in any one of claim 1-3, wherein in step 3), the current density in electroplating process
For 15-30A/cm2。
10. according to the method described in claim 9, wherein, the temperature of electroplate liquid is 25-35 DEG C in electroplating process, electroplating time
For 20-30min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377058.6A CN108517546A (en) | 2018-04-25 | 2018-04-25 | The silver-plated method of expanded microporous polytetra fluoroethylene-EPTEE film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377058.6A CN108517546A (en) | 2018-04-25 | 2018-04-25 | The silver-plated method of expanded microporous polytetra fluoroethylene-EPTEE film |
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| Publication Number | Publication Date |
|---|---|
| CN108517546A true CN108517546A (en) | 2018-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810377058.6A Pending CN108517546A (en) | 2018-04-25 | 2018-04-25 | The silver-plated method of expanded microporous polytetra fluoroethylene-EPTEE film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110838385A (en) * | 2019-12-04 | 2020-02-25 | 芜湖航天特种电缆厂股份有限公司 | Composite film for insulated wire and cable and preparation method thereof |
| CN113774502A (en) * | 2021-09-08 | 2021-12-10 | 深圳市明鑫高分子技术有限公司 | High-frequency phase-stable PTFE (polytetrafluoroethylene) film material and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1324412A (en) * | 1998-10-02 | 2001-11-28 | Nkt研究中心有限公司 | Method for metallizing surface of a solid polymer substrate and the product obtd. |
| CN104681907A (en) * | 2015-02-09 | 2015-06-03 | 中国电子科技集团公司第二十三研究所 | Radio frequency cable with integrated polytetrafluoroethylene insulating surface silver-plating outer conductor, and machining method for radio frequency cable |
| CN106098196A (en) * | 2016-07-06 | 2016-11-09 | 芜湖航天特种电缆厂股份有限公司 | Low loss coaxial radio frequency cable and preparation method thereof |
-
2018
- 2018-04-25 CN CN201810377058.6A patent/CN108517546A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1324412A (en) * | 1998-10-02 | 2001-11-28 | Nkt研究中心有限公司 | Method for metallizing surface of a solid polymer substrate and the product obtd. |
| CN104681907A (en) * | 2015-02-09 | 2015-06-03 | 中国电子科技集团公司第二十三研究所 | Radio frequency cable with integrated polytetrafluoroethylene insulating surface silver-plating outer conductor, and machining method for radio frequency cable |
| CN106098196A (en) * | 2016-07-06 | 2016-11-09 | 芜湖航天特种电缆厂股份有限公司 | Low loss coaxial radio frequency cable and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110838385A (en) * | 2019-12-04 | 2020-02-25 | 芜湖航天特种电缆厂股份有限公司 | Composite film for insulated wire and cable and preparation method thereof |
| CN113774502A (en) * | 2021-09-08 | 2021-12-10 | 深圳市明鑫高分子技术有限公司 | High-frequency phase-stable PTFE (polytetrafluoroethylene) film material and manufacturing method thereof |
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Application publication date: 20180911 |
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