JPS5911678B2 - Manufacturing method of porous copper thin film - Google Patents
Manufacturing method of porous copper thin filmInfo
- Publication number
- JPS5911678B2 JPS5911678B2 JP15853579A JP15853579A JPS5911678B2 JP S5911678 B2 JPS5911678 B2 JP S5911678B2 JP 15853579 A JP15853579 A JP 15853579A JP 15853579 A JP15853579 A JP 15853579A JP S5911678 B2 JPS5911678 B2 JP S5911678B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- copper
- copper thin
- porous copper
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は、例えば各種フィルタ、電解用隔膜などに用
いられる多孔質銅薄膜の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a porous copper thin film used for, for example, various filters, electrolytic diaphragms, and the like.
従来、多孔質の銅箔を得るためには、銅箔を化学的あ
るいは物理的に処理を行い、孔を作製していた。しかし
この方法ではコストが高く、かつその処理に時間を要す
る欠点があつた。また箔の厚さは銅箔により決まり、手
軽に厚さを変えることができなかうた。 本発明は、従
来の銅箔に孔を作る方法ではなく、アルミニウム基板上
に多孔質の銅薄膜を析出させ、これを基板から剥離する
ことにより、多孔質の銅箔として取り出す方法である。Conventionally, in order to obtain porous copper foil, holes were created by chemically or physically treating the copper foil. However, this method has the drawbacks of high cost and time-consuming processing. In addition, the thickness of the foil was determined by the copper foil, and the thickness could not be easily changed. The present invention is not a conventional method of making holes in copper foil, but a method of depositing a porous copper thin film on an aluminum substrate and peeling it off from the substrate to take out the porous copper foil.
本発明によれば、低コストで安易に銅箔を作ることが
できる。According to the present invention, copper foil can be easily produced at low cost.
また銅箔の多孔度および厚さは、アルミニウム基板上に
銅を析出させる時の電流密度および時間などの電解条件
を調整することにより変えることができる。 以下、本
発明をその実施例により説明する。Moreover, the porosity and thickness of the copper foil can be changed by adjusting electrolytic conditions such as current density and time when depositing copper on an aluminum substrate. Hereinafter, the present invention will be explained with reference to examples thereof.
アルミニウム基板を各種の方法で前処理した後、シア
ン調温または硫酸銅浴中において前記基板を陰極として
電解した。基板上に析出した銅薄膜の厚さ、均一性、基
板からの剥離のしやすさなどを次表に示す。なお、前処
理の溶媒脱脂はトリクレンを用いた超音波洗浄、アルカ
リ脱脂は１０％水酸化ナトリウム水溶液による洗浄、酸
洗は３５％硝酸水溶液による洗浄である。After the aluminum substrate was pretreated by various methods, electrolysis was performed using the substrate as a cathode in a cyan temperature controlled bath or a copper sulfate bath. The following table shows the thickness, uniformity, and ease of peeling off the copper thin film deposited on the substrate. Note that the pretreatment solvent degreasing is ultrasonic cleaning using trichlene, alkaline degreasing is cleaning with a 10% aqueous sodium hydroxide solution, and pickling is cleaning with a 35% nitric acid aqueous solution.
ジンケート処理はＮａＯＨ５ＯＯ９／１，Ｚｎ０１００
ｇ／１１ロッセル塩１０９／ｌおよびＦｅｃｔ，２９／
ｌを含む水溶液による処理を表し、※印は水洗後再び同
じ処理をしたことを示す。またこれらの処理を複数組合
せた場合、その順序は溶媒脱脂、アルカリ脱脂、酸洗、
ジンケート処理の順である。電解処理の条件は以下のと
おりである。Zincate treatment is NaOH5OO9/1, Zn0100
g/11 Rosselle salt 109/l and Fect, 29/l
The mark ※ indicates that the same treatment was performed again after washing with water. In addition, when multiple of these treatments are combined, the order is solvent degreasing, alkaline degreasing, pickling,
This is the order of zincate treatment. The conditions for electrolytic treatment are as follows.
シアン銅浴
析出した銅薄膜の状態は、均一（０）、一部不均一（Δ
）、不均一（Ｘ）を表し、剥離のしやすさは、極めて容
易（◎）、容易（０）、やや困難（Δ）、困難（Ｘ）を
表す。The state of the copper thin film deposited in the cyan copper bath is uniform (0), partially non-uniform (Δ
), non-uniformity (X), and the ease of peeling is extremely easy (◎), easy (0), somewhat difficult (Δ), and difficult (X).
上記の結果からアルミニウム基板の前処理としては、ア
ルカリ脱脂を行わず、有機溶剤のみによる脱脂を行い、
自然の酸化皮膜の有る状態で銅の薄膜を作製することに
より、容易に銅箔としてアルミニウム基板上より剥離す
ることが可能である。Based on the above results, we decided to pre-treat the aluminum substrate by degreasing only with an organic solvent without alkaline degreasing.
By producing a copper thin film in the presence of a natural oxide film, it can be easily peeled off as a copper foil from an aluminum substrate.
また人工的に薄い酸化膜を作つた場合も剥離を容易にす
ることができる。一方ジンケート処理を行うことにより
、箔としての強度が増し、剥離する場合に銅の皮膜が破
損することが少なくなる。電解浴としては酸性硫酸銅浴
では剥離が容易に行える。シアン銅浴の場合剥離が困難
になる。多孔度に関しては電解時の電流密度を増すこと
により多孔度が増加し、電流密度を少なくすることによ
り、緻密な銅箔になる。Also, when an artificially thin oxide film is created, peeling can be facilitated. On the other hand, by performing the zincate treatment, the strength of the foil increases and the copper film is less likely to be damaged when peeled off. As an electrolytic bath, an acidic copper sulfate bath can be used to easily remove the film. In the case of a cyanide copper bath, peeling becomes difficult. Regarding porosity, increasing the current density during electrolysis increases the porosity, and decreasing the current density results in a dense copper foil.
膚５の場合、多孔度は約３０％であつた。また、銅箔の
厚さは電気量（電流密度×電解時間）に比例して増加す
る。In the case of Skin 5, the porosity was approximately 30%. Further, the thickness of the copper foil increases in proportion to the amount of electricity (current density x electrolysis time).
一方アルミニウム基板上に作製した銅被膜の剥離には特
別な装置、治具等を必要としない。On the other hand, special equipment, jigs, etc. are not required for peeling off a copper film produced on an aluminum substrate.
アルミニウム基板上の銅被膜の一端に基板に達する傷を
つけ、その部分から被膜だけを剥離することができる。
とくにアルミニウム基材を有機溶媒で脱脂後、ジンケー
ト処理し、酸性硫酸銅浴中で電解処理したものは剥離が
極めて容易であり、かつ得られる多孔質銅箔は均一でし
かも強度も大きいことがわかつた。以上のように、本発
明の方法によれば、任意の多孔質度、厚さの多孔質銅薄
膜を安易にかつ短時間に得ることができる。By making a scratch that reaches the substrate at one end of the copper coating on the aluminum substrate, it is possible to peel off only the coating from that part.
In particular, it was found that aluminum base materials degreased with an organic solvent, zincate treated, and electrolytically treated in an acidic copper sulfate bath are extremely easy to peel off, and the porous copper foil obtained is uniform and has high strength. Ta. As described above, according to the method of the present invention, a porous copper thin film having any degree of porosity and thickness can be easily obtained in a short time.
Claims (1)
られた銅薄膜をアルミニウム基板から剥離することを特
徴とする多孔質銅薄膜の製造法。1. A method for producing a porous copper thin film, which comprises depositing copper on an aluminum substrate by electrolysis and peeling the obtained copper thin film from the aluminum substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15853579A JPS5911678B2 (en) | 1979-12-06 | 1979-12-06 | Manufacturing method of porous copper thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15853579A JPS5911678B2 (en) | 1979-12-06 | 1979-12-06 | Manufacturing method of porous copper thin film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5681694A JPS5681694A (en) | 1981-07-03 |
| JPS5911678B2 true JPS5911678B2 (en) | 1984-03-16 |
Family
ID=15673838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15853579A Expired JPS5911678B2 (en) | 1979-12-06 | 1979-12-06 | Manufacturing method of porous copper thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5911678B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3198066B2 (en) | 1997-02-21 | 2001-08-13 | 荏原ユージライト株式会社 | Microporous copper film and electroless copper plating solution for obtaining the same |
| CN1184359C (en) * | 1998-09-14 | 2005-01-12 | 三井金属鉱业株式会社 | Porous copper foil, use thereof, and method for producing same |
| JP5970861B2 (en) * | 2012-02-29 | 2016-08-17 | 日立金属株式会社 | Method for producing metal foil by electrolytic method |
| KR101809985B1 (en) * | 2017-03-30 | 2017-12-18 | 와이엠티 주식회사 | Manufacturing method of porous copper film and porous copper film using the same |
| CN109440140B (en) * | 2018-11-22 | 2020-08-11 | 浙江大学 | Method for manufacturing electrolytic copper foil |
| CN113416986B (en) * | 2021-07-08 | 2022-10-11 | 江西柔顺科技有限公司 | Method for producing electrolytic copper foil |
-
1979
- 1979-12-06 JP JP15853579A patent/JPS5911678B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5681694A (en) | 1981-07-03 |
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