WO2022097422A1 - Ｒｆｉｄモジュールを備えた容器 - Google Patents

Ｒｆｉｄモジュールを備えた容器 Download PDF

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Publication number
WO2022097422A1
WO2022097422A1 PCT/JP2021/037397 JP2021037397W WO2022097422A1 WO 2022097422 A1 WO2022097422 A1 WO 2022097422A1 JP 2021037397 W JP2021037397 W JP 2021037397W WO 2022097422 A1 WO2022097422 A1 WO 2022097422A1
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WO
WIPO (PCT)
Prior art keywords
container
metal film
rfid module
slit
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/037397
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
亮平 大森
登 加藤
浩和 矢▲崎▼
幹子 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2022514607A priority Critical patent/JP7074275B1/ja
Priority to DE212021000250.1U priority patent/DE212021000250U1/de
Priority to CN202190000200.0U priority patent/CN217404880U/zh
Priority to US17/728,279 priority patent/US11797815B2/en
Publication of WO2022097422A1 publication Critical patent/WO2022097422A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D5/00—Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
    • B65D5/42—Details of containers or of foldable or erectable container blanks
    • B65D5/44—Integral, inserted or attached portions forming internal or external fittings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D5/00—Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
    • B65D5/42—Details of containers or of foldable or erectable container blanks
    • B65D5/62—External coverings or coatings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/0779—Antenna details the antenna being foldable or folded
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07792—Antenna details the antenna adapted for extending in three dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/20—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/22—Longitudinal slot in boundary wall of waveguide or transmission line

Definitions

  • the present invention relates to a container equipped with an RFID module, particularly a container equipped with an RFID module using RFID (Radio Frequency Identification) technology for non-contact data communication by an induced electromagnetic field or radio waves.
  • RFID Radio Frequency Identification
  • RFID tags which are a wireless communication device
  • RFIC Radio-Frequency Integrated Circuit
  • metal materials such as antenna patterns are formed on insulating substrates such as paper materials and resin materials.
  • a metal film is formed on the outer surface of the container, the RFID tag is affected and communication becomes impossible.
  • Patent Document 1 proposes a configuration in which an RFID tag compatible with a metal formed in a part of the container is provided so as not to impair the design.
  • the RFID tag disclosed in Patent Document 1 has an RFID chip and an antenna pattern, and a metal film cannot be formed on the container in these regions. Therefore, there is a demand for a container having an RFID module that suppresses a reduction in the degree of freedom in design.
  • An object of the present invention is to provide a container having an RFID module in which a reduction in design is suppressed in a container on which a metal film is formed.
  • the container according to one aspect of the present invention is a container provided with an RFID module, wherein an insulating base material forming the outer shape of the base material, a metal film formed on the first main surface of the base material, and the above-mentioned
  • the RFID module is provided with a slit formed in a metal film, and the RFID module is connected to the RFID element, a filter circuit for transmitting a current generated by an electromagnetic wave having a unique resonance frequency which is a communication frequency, to the RFID element, and the filter circuit.
  • a first electrode and a second electrode are provided, and the metal film is formed so as to orbit the outer periphery of the container in a direction intersecting the slit, and the first electrode and the second electrode of the RFID module are formed. Is electrically connected to the metal film with the slit in between.
  • the present invention it is possible to provide a container having an RFID module in which a reduction in design is suppressed in a container on which a metal film is formed.
  • FIG. 6a is a plan view of the conductor pattern formed on the upper surface of the substrate of the RFID module
  • FIG. 6b is a plan view of the conductor pattern formed on the lower surface of the substrate.
  • Perspective plan seen from above Sectional view of arrow VII in FIG. RFID module schematic Explanatory drawing which shows the manufacturing process of the container of Embodiment 1.
  • Development view of the container in the modified example of the first embodiment Overall perspective view of the container having the RFID module of the second embodiment.
  • One aspect of the container according to the present invention is a container provided with an RFID module, which comprises an insulating base material forming the outer shape of the container, a metal film formed on the first main surface of the base material, and the like.
  • the RFID module is provided with a slit formed in the metal film, and the RFID module is connected to an RFID element, a filter circuit for transmitting a current generated by an electromagnetic wave having a unique resonance frequency which is a communication frequency, to the RFID element, and the filter circuit.
  • the metal film is formed so as to orbit the outer periphery of the container in a direction intersecting the slit, and the first electrode and the second electrode of the RFID module are provided. Each of the electrodes is electrically connected to the metal film with the slit in between.
  • the container of this embodiment uses the metal film formed on the first main surface of the base material of the container as a loop antenna, the RFID is suppressed from reducing the degree of freedom in design in the container on which the metal film is formed.
  • the module can be attached to the container.
  • the metal film has a first metal region to which the first electrode of the RFID module is connected and a second metal region to which the second electrode of the RFID module is connected, and the first metal region.
  • the second metal region may be electrically connected via a capacitive coupling in the outer peripheral direction of the container.
  • the container provided with the RFID module is an assembly-type box, and the base material is a first surface and a second surface having a first main surface, which are side surfaces of the box, and the first surface and the above. It has a flap continuous with the first surface for connecting the second surface with an adhesive layer, and the flap is formed with the first metal region of the metal film, and the second surface is formed.
  • the second metal region of the metal film may be formed on the metal film.
  • the slit may be formed in the flap, and the RFID module may be arranged in the flap.
  • the RFID module arranged on the flap continuous with the first surface is attached to the inner surface of the second surface, so that it does not appear on the outer surface of the container. Therefore, it is possible to prevent the design of the container from being reduced.
  • the filter circuit may be an LC parallel resonant circuit. As a result, a current having a frequency matching the RFIC can be passed through the RFIC.
  • the sheet resistance of the metal film may be 0.5 ⁇ / ⁇ or more. Even with this configuration, since the RFID module has a filter circuit, the eddy current generated in the metal film can be used to flow through the RFID.
  • the thickness of the metal film may be 1 nm or more and 500 nm or less. Even with this configuration, since the RFID module has a filter circuit, the eddy current generated in the metal film can be used to flow through the RFID.
  • the electrical length of the antenna pattern and the conductor pattern is longer than the physical length.
  • the electrical length is a length considering the shortening or extension of the wavelength due to the relative permittivity and the parasitic reactance component.
  • FIG. 1 is an overall perspective view of a container 1 having an RFID module 5 according to the first embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the container 1 in FIG. 1
  • FIG. 3 is a developed view of the container 1 in FIG. Note that FIG. 2 is a schematic cross-sectional view of the container 1 in FIG. 1 cut in a direction orthogonal to the side surface of the container 1 at the position where the RFID module 5 is arranged.
  • the portion of reference numeral 3g indicated by the alternate long and short dash line in FIG. 3 indicates a portion where the first flap 3g and the back side of the second surface 3b are connected.
  • the container 1 of the first embodiment is formed on the base material 3, the RFID module 5 attached to the base material 3, the metal film 7 formed on the first main surface 3s of the base material 3, and the metal film 7. It is provided with a slit 9.
  • the container 1 is formed into a three-dimensional shape by assembling a flat base material 3 as shown in FIG. 3, for example.
  • the container 1 has a rectangular parallelepiped shape, for example, and the base material 3 is made of an insulating material, for example, made of paper, resin, or plastic.
  • the base material 3 includes a first surface 3a, a second surface 3b, a third surface 3c, a fourth surface 3d, a fifth surface 3e, a sixth surface 3f, and a first flap 3g, a second flap 3h, and a third flap. Equipped with 3k.
  • the first surface 3a to the fourth surface 3d become a side surface when assembled
  • the fifth surface 3e becomes an upper surface when assembled
  • the sixth surface 3f becomes a lower surface when assembled.
  • the first main surface 3s of the base material 3 is a surface to be the outer surface (front surface) of the container 1
  • the second main surface 3t of the base material 3 is a surface to be the inner surface (back surface) of the container 1.
  • the first main surface 3s of the first flap 3g is attached to the second main surface 3t of the second surface 3b via the adhesive layer 11 when assembled.
  • the first main surface 3s of the second flap 3h is attached to the second main surface 3t of the first surface 3a via the adhesive layer 11 when assembled.
  • the first main surface 3s of the third flap 3k is attached to the second main surface 3t of the first surface 3a via the adhesive layer 11 when assembled.
  • the metal film 7 is formed so as to orbit the outer periphery of the container 1 in the direction intersecting the slit 9.
  • the metal film 7 functions as a loop antenna.
  • the metal film 7 is formed on the entire surface of the first main surface 3s of the base material 3 except for the slit 9.
  • the metal film 7 is made of a film body of a conductive material such as aluminum foil or copper foil, and is formed by, for example, attaching a metal sheet. By using a metal having a small resistance value such as aluminum or copper as the metal film 7, the communication distance can be increased.
  • the thickness of the metal film 7 is, for example, larger than 5 ⁇ m and 40 ⁇ m or less.
  • the metal film 7 may not be formed on the entire surface of the base material 3, and may be partially formed on, for example, the first flap 3g and other surfaces.
  • the metal film 7 has a first metal region 7a and a second metal region 7b.
  • the first metal region 7a and the second metal region 7b are physically separated and electrically connected via a capacitive coupling in the outer peripheral direction of the container 1. Further, in the portion of the metal film 7 where the slit 9 is formed, the first metal region 7a and the second metal region 7b are electrically insulated from each other. The first metal region 7a and the second metal region 7b are electrically connected via a capacitive coupling at a portion of the metal film 7 where the slit 9 is not formed.
  • the potential difference between the first metal region 7a and the second metal region 7b disappears, and the metal film 7 functions as a loop antenna. ..
  • the first metal region 7a extends outward from the container 1 in a direction intersecting with the slit 9.
  • the second metal region 7b extends outward from the container 1 in a direction intersecting the slit 9 and in a direction opposite to the first metal region 7a.
  • the first metal region 7a is formed in the region on the left side of the slit 9.
  • the first metal region 7a includes a first surface 3a, a part of the third surface 3c, a fourth surface 3d, a part of the fifth surface 3e, a part of the sixth surface 3f, and a first flap 3g. , A part of the second flap 3h, and a part of the third flap 3k.
  • the second metal region 7b is formed in a region on the right side of the slit 9. Specifically, the second metal region 7b is formed on a second surface 3b, a part of the third surface 3c, a part of the second flap 3h, and a part of the third flap 3k.
  • the first metal region 7a is formed in the first flap 3g.
  • the second metal region 7b is formed on the second surface 3b.
  • the first metal region 7a is connected to the second metal region 7b via the adhesive layer 11 and the base material 3.
  • the combined thickness of the adhesive layer 11 and the base material 3 is designed to be such that the first metal region 7a and the second metal region 7b can be capacitively coupled.
  • the metal film 7 has a first metal region 7a and a second metal region 7b, and the first metal region 7a and the second metal region 7b are electrically connected via a capacitive coupling.
  • the examples described are described, but the present invention is not limited to this.
  • the first metal region 7a and the second metal region 7b may be electrically connected by being directly connected.
  • the first metal region 7a and the second metal region 7b may be electrically connected by a conductor.
  • the metal film 7 is not limited to the two metal regions, and may have three or more metal regions that are electrically connected.
  • a current Ir flowing in a direction intersecting the slit 9 in the metal film 7 is generated.
  • the current Ir flows through the metal film 7 so as to orbit along the outer circumference of the container 1.
  • the current Ir flows so as to orbit the RFID module 5, the first metal region 7a and the second metal region 7b along the outer circumference of the container 1.
  • the slit 9 is a groove formed in the metal film 7.
  • the slit 9 forms a portion that is electrically insulated by exposing the base material 3 from the metal film 7.
  • the width W of the slit 9 is, for example, 1 mm.
  • the slit 9 may be formed by forming a metal film 7 on the entire first main surface 3s of the base material 3 and then scraping the metal film 7, or two metal sheets may be formed with a width W of the slit 9. It may be formed by sticking it on the first main surface 3s of the base material 3.
  • the length of the slit 9 in the longitudinal direction is designed so that the current Ir flows in the metal film 7 in the direction intersecting the slit 9.
  • the slit 9 is formed on the third surface 3c, the fifth surface 3e, the sixth surface 3f, the second flap 3h, and the third flap 3k. Specifically, the slit 9 continuously extends from the end of the second flap 3h through the fifth surface 3e, the third surface 3c, and the sixth surface 3f to the end of the third flap 3k.
  • the RFID module 5 of the first embodiment is a wireless communication device configured to perform wireless communication (transmission / reception) with a high frequency signal having a communication frequency (carrier frequency).
  • the RFID module 5 is configured to perform wireless communication with, for example, a high frequency signal having a frequency for communication in the UHF band.
  • the UHF band is a frequency band from 860 MHz to 960 MHz.
  • FIG. 4 is a perspective plan view of the RFID module 5
  • FIG. 5 is a cross-sectional view taken along the line V in FIG. 6A and 6B show a plan view of a conductor pattern formed on the substrate 21 of the RFID module 5
  • FIG. 6a is a plan view of the conductor pattern formed on the upper surface of the substrate 21 of the RFID module 5
  • FIG. 6b is a plan view of the conductor pattern formed on the substrate 21 of the RFID module 5.
  • It is a perspective plan view seen from the top of the conductor pattern formed on the lower surface of.
  • FIG. 7 is a cross-sectional view taken along the line VII in FIG.
  • the XYZ coordinate system facilitates the understanding of the invention and does not limit the invention.
  • the X-axis direction indicates the longitudinal direction of the RFID module 5
  • the Y-axis direction indicates the depth (width) direction
  • the Z-axis direction indicates the thickness direction.
  • the X, Y, and Z directions are orthogonal to each other.
  • the RFID module 5 is electrically connected to the metal film 7 across the slit 9. Specifically, the RFID module 5 is attached to the upper surfaces of the first metal region 7a and the second metal region 7b of the metal film 7 via an adhesive layer 11 such as double-sided tape or synthetic resin.
  • the RFID module 5 includes a substrate 21 and an RFID 23 mounted on the substrate 21.
  • the substrate 21 is a flexible substrate such as polyimide.
  • a protective film 25 is formed on the upper surface of the substrate 21 on which the RFIC 23 is mounted.
  • the protective film 25 is, for example, an elastomer such as polyurethane or a hot melt agent such as ethylene vinyl acetate (EVA).
  • a protective film 27 is also attached to the lower surface of the substrate 21.
  • the protective film 27 is, for example, a coverlay film such as a polyimide film (Kapton tape).
  • a third electrode 33, a fourth electrode 35, a conductor pattern L1a of the main portion of the first inductance element L1 and a conductor pattern L2a of the main portion of the second inductance element L2 are formed on the upper surface of the substrate 21, a third electrode 33, a fourth electrode 35, a conductor pattern L1a of the main portion of the first inductance element L1 and a conductor pattern L2a of the main portion of the second inductance element L2 are formed.
  • the third electrode 33 is connected to one end of the conductor pattern L1a
  • the fourth electrode 35 is connected to one end of the conductor pattern L2a.
  • These conductor patterns are, for example, a copper foil patterned by photolithography.
  • the first electrode 29 and the second electrode 31 are capacitively coupled to the first metal region 7a and the second metal region 7b of the metal film 7, respectively.
  • the first electrode 29 and the second electrode 31 are electrically connected to the metal film 7 with the slit 9 interposed therebetween.
  • a part of the conductor pattern L1b of the first inductance element L1 and the conductor patterns L3a, L3b (conductor pattern surrounded by the alternate long and short dash line) and L3c of the third inductance element L3 are formed.
  • These conductor patterns are also, for example, a copper foil patterned by photolithography.
  • One end of a part of the conductor pattern L1b of the first inductance element L1 and one end of the conductor pattern L3a of the third inductance element L3 are connected to the first electrode 29.
  • one end of the conductor pattern L2b of the second inductance element L2 and one end of the conductor pattern L3c of the third inductance element L3 are connected to the second electrode 31.
  • a conductor pattern L3b is connected between the other end of the conductor pattern L3a of the third inductance element L3 and the other end of the conductor pattern L3c.
  • the other end of the conductor pattern L1b of the first inductance element L1 and the other end of the conductor pattern L1a of the first inductance element L1 are connected via the via conductor V1.
  • the other end of the conductor pattern L2b of the second inductance element L2 and the other end of the conductor pattern L2a of the second inductance element L2 are connected via the via conductor V2.
  • the RFIC 23 is mounted on the third electrode 33 and the fourth electrode 35 formed on the upper surface of the substrate 21. That is, the terminal 23a of the RFIC 23 is connected to the third electrode 33, and the terminal 23b of the RFIC 23 is connected to the fourth electrode 35.
  • the conductor patterns L3a of the first inductance element L1 and the third inductance element L3 are formed in different layers of the substrate 21, and are arranged so that their coil openings overlap each other.
  • the conductor patterns L3c of the second inductance element L2 and the third inductance element L3 are formed in different layers of the substrate 21, and the coil openings are arranged so as to overlap each other.
  • the RFIC 23 is positioned on the surface of the substrate 21 between the conductor pattern L3c of the second inductance element L2 and the third inductance element L3 and the conductor pattern L3a of the first inductance element L1 and the third inductance element L3. do.
  • a first current path CP1 passing through the upper surface and the lower surface of the substrate 21 and a second current path CP2 passing through the lower surface of the substrate 21 are formed.
  • the first current path CP1 reaches the second electrode 31 from the first electrode 29 through the branch point N1, the conductor pattern L1b, the conductor pattern L1a, RFIC23, the conductor pattern L2a, the conductor pattern L2b, and the branch point N2.
  • the second current path CP2 reaches the second electrode 31 from the first electrode 29 through the branch point N1, the conductor pattern L3a, the conductor pattern L3b, the conductor pattern L3c, and the branch point N2.
  • first inductance element L1 composed of a conductor pattern L1b connected via a conductor pattern L1a and a via conductor V1, and a conductor pattern L2b connected via a conductor pattern L2a and a via conductor V2.
  • the winding directions of the current flowing through the second inductance element L2 are opposite to each other, and the magnetic field generated by the first inductance element L1 and the magnetic field generated by the second inductance element L2 cancel each other out.
  • the first current path CP1 and the second current path CP2 are formed in parallel with each other between the first electrode 29 and the second electrode 31, respectively.
  • FIG. 8 is a circuit diagram of the RFID module 5.
  • the first current path CP1 is a part of the parallel resonant circuit RC1 which is an LC parallel resonant circuit, and matches the radio wave of the communication frequency. Therefore, the radio wave of the communication frequency is transmitted to the metal film 7. Is received, a current flows through the RFIC 23.
  • the RFID module 5 is formed with a parallel resonant circuit RC1.
  • the parallel resonant circuit RC1 is a loop circuit composed of a first inductance element L1, an RFIC23, a second inductance element L2, and a third inductance element L3.
  • the parallel resonant circuit RC1 functions as a filter circuit.
  • the capacitance C1 is composed of a first metal region 7a, a first electrode 29, an adhesive layer 11, and a protective film 27.
  • the capacitance C2 is composed of a second metal region 7b, a second electrode 31, an adhesive layer 11, and a protective film 27.
  • the fourth inductance element L4 is an inductance component of the first metal region 7a of the metal film 7
  • the fifth inductance element L5 is an inductance component of the second metal region 7b of the metal film 7. Further, in FIG. 8, the first metal region 7a and the second metal region 7b are capacitively coupled to form a loop circuit.
  • the parallel resonance circuit RC1 is designed to perform LC parallel resonance by impedance matching with radio waves at the communication frequency. As a result, the RFID module is matched with the RFID in the communication frequency, and the communication distance of the RFID module 5 in the communication frequency can be secured.
  • the container 1 of the first embodiment has a metal film 7 formed on the entire surface of the first main surface 3s of the unfolded container 1 before assembly, with respect to a plurality of containers 1 before assembly.
  • the slit 9 can be formed at once.
  • the container 1 of the first embodiment includes the base material 3, the metal film 7, the slit 9, and the RFID module 5.
  • the base material 3 has an insulating property and forms the outer shape of the container.
  • the metal film 7 is formed on the first main surface 3s of the base material 3.
  • the slit 9 is formed in the metal film 7.
  • the RFID module 5 includes an RFIC element 23, a filter circuit (parallel resonance circuit RC1) that transmits a current generated by an electromagnetic wave having a unique resonance frequency, which is a communication frequency, to the RFIC element 23, and first and second electrodes connected to the filter circuit. 29, 31 and so on.
  • the metal film 7 is formed so as to orbit the outer periphery of the container 1 in a direction intersecting with the slit 9.
  • the first electrode 29 and the second electrode 31 of the RFID module 5 are electrically connected to the metal film 7 with the slit 9 interposed therebetween.
  • the metal film 7 that orbits the outer periphery of the container 1 in the direction intersecting the slit 9 can be used as an antenna electrode, and a current can be passed through the RFIC 23 by series resonance. Therefore, even if the container 1 is formed with the metal film 7, wireless communication is possible, and it is possible to provide the container 1 having the RFID module 5 in which the reduction in design is suppressed.
  • the container 1 of the embodiment can be provided at a lower cost than the container to which the conventional metal-compatible RFID module is attached.
  • the conventional flag type RFID module pops out of the container and breaks, the communication characteristics will deteriorate.
  • the RFID module since the RFID module must be ejected from the container, the degree of freedom in design is reduced, but in the case of the container 1 of the embodiment, the RFID module does not have to be ejected from the container, so that the degree of freedom in design is reduced. Can be suppressed.
  • the metal film 7 has a first metal region 7a to which the first electrode 29 of the RFID module 5 is connected, and a second metal region 7b to which the second electrode 31 of the RFID module 5 is connected.
  • the first metal region 7a and the second metal region 7b are electrically connected via a capacitive coupling in the outer peripheral direction of the container 1.
  • the metal film 7 is divided into a first metal region 7a and a second metal region 7b, and the first metal region 7a and the second metal region 7b are capacitively coupled to be continuous along the outer periphery of the container 1.
  • the degree of freedom in design can be improved.
  • Container 1 is an assembly-type box.
  • the base material 3 is for connecting the first surface 3a and the second surface 3b having the first main surface 3s, which are the side surfaces of the box, and the first surface 3a and the second surface 3b by the adhesive layer 11. It has a continuous flap 3g on the first surface 3a.
  • a first metal region 7a of the metal film 7 is formed on the flap 3g.
  • a second metal region 7b of the metal film 7 is formed on the second surface 3b.
  • the slit 9 is formed in the flap 3g, and the RFID module 5 is arranged in the flap 3g.
  • the RFID module 5 arranged on the first flap 3g continuous with the first surface 3a is attached to the inner surface of the second surface 3b, so that it does not appear on the outer surface of the container 1. Therefore, it is possible to prevent the design of the container 1 from being reduced.
  • FIG. 10 is a developed view of the container 1A in the first modification of the first embodiment.
  • the container 1A in the first modification of the first embodiment has a configuration in which the slit 9 of the container 1 of the first embodiment is shifted to the left. Further, the metal film 7 is not formed on the fifth surface 3e, the sixth surface 3f, the second flap 3h, and the third flap 3k.
  • the other configurations are substantially the same as the container 1 of the first embodiment.
  • the slit 9 is formed on the first surface 3a of the base material 3. Specifically, the slit 9 extends from one end to the other end of the first surface 3a in a direction orthogonal to the direction adjacent to the fourth surface 3d and the first flap 3g. Therefore, the first metal region 7a of the metal film 7 is formed on a part of the first surface 3a and the first flap 3g. The second metal region 7b of the metal film 7 is formed on a part of the first surface 3a, the second surface 3b, the third surface 3c, and the fourth surface 3d. Even in such a configuration, the metal film 7 that orbits the outer periphery of the container 1 in the direction intersecting the slit 9 can be used as the antenna electrode. Therefore, even if the container 1A is formed with the metal film 7, wireless communication is possible, and it is possible to provide the container 1A having the RFID module 5 that suppresses the reduction in design.
  • the difference between the container of the second embodiment and the container of the first embodiment is that the slit 9 is formed in the flap 3g and the RFID module 5 is arranged in the flap 3g. This difference will be mainly described below. In the description of the second embodiment, the description may be omitted for the elements having the same configuration, operation, and function as those of the first embodiment, in order to avoid duplicate description.
  • the container of the second embodiment has the same configuration as the RFID module 5 of the first embodiment except for the points described below.
  • FIG. 11 is an overall perspective view of the container 1B having the RFID module 5 of the second embodiment according to the present invention.
  • 12 is a schematic cross-sectional view of the container 1B in FIG. 11, and
  • FIG. 13 is a developed view of the container 1B in FIG.
  • the portion of reference numeral 3g indicated by the alternate long and short dash line in FIG. 13 indicates a portion where the first flap 3g and the back side of the second surface 3b are connected.
  • the slit 9 is formed in the first flap 3 g.
  • the slit 9 extends from one end to the other end of the first flap 3g in a direction intersecting the direction adjacent to the first surface 3a.
  • the first metal region 7a of the metal film 7 is formed in a part of the first flap 3g, that is, a portion of the first flap 3g on the side opposite to the side adjacent to the first surface 3a from the slit 9.
  • the second metal region 7b of the metal film 7 is a portion of the first flap 3g on the side adjacent to the first surface 3a from the slit 9, the first surface 3a, the second surface 3b, the third surface 3c, the fourth surface 3d, and the like. It is formed on the second flap 3h and the third flap 3k.
  • the RFID module 5 is arranged on the metal film 7 so as to straddle the slit 9 in the first flap 3g.
  • the first flap 3g is connected to the second main surface 3t of the second surface 3b by the adhesive layer 11.
  • the first metal region 7a formed on the first flap 3g and the second metal region 7b formed on the second surface 3b are electrically connected via a capacitive coupling.
  • the potential difference between the first metal region 7a and the second metal region 7b disappears, and the metal film 7 functions as a loop antenna.
  • the slit 9 is formed in the flap 3g, and the RFID module 5 is arranged in the flap 3g.
  • the RFID module 5 arranged on the flap 3g continuous with the first surface 3a is attached to the inner surface (second main surface 3t) of the second surface 3b, so that the container 1B can be attached. Does not appear on the outside. Therefore, it is possible to prevent the design of the container 1B from being reduced.
  • FIG. 14 is a developed view of the container 1C in the second modification of the second embodiment.
  • the container 1C in the second modification is formed by bending the slit 9 of the container 1B of the second embodiment, and extends the boundary between the first flap 3g and the first surface 3a.
  • the other configurations are substantially the same as the container 1B of the second embodiment.
  • the container 1C in the second modification is formed by bending the slit 9, and extends the boundary between the first flap 3g and the first surface 3a.
  • the boundary between the first flap 3g and the first surface 3a is the portion corresponding to the corner in the container 1C. Even in such a configuration, since the RFID module 5 does not appear on the outer surface of the container 1C, it is possible to prevent the design of the container 1B from being reduced. Further, by forming the slit 9 at the boundary between the first flap 3g and the first surface 3a, the area of the first metal region 7a formed in the first flap 3g can be increased. As a result, the area of the portion where the first metal region 7a and the second metal region 7b are capacitively coupled can be increased, and the capacitive coupling can be performed more stably.
  • FIG. 15 is a developed view of the container 1D in the modified example 3 of the second embodiment.
  • the container 1D in the third modification has a configuration in which the slit 9 extends laterally to the first flap 3g, the first surface 3a, the fourth surface 3d, the third surface 3c, and the second surface 3b in the container 1B of the second embodiment. be.
  • Other configurations are substantially the same as the container 1B of the second embodiment.
  • one end side of the slit 9 extends to the end portion of the first flap 3g.
  • the other end side of the slit 9 does not extend to the end of the second surface 3b and stops in the middle of the second surface 3b.
  • the slit 9 is preferably formed so as to straddle three or more surfaces of the container 1D.
  • the other end side of the slit 9 is formed up to, for example, a region where the first flap 3g and the second surface 3b are capacitively coupled. Therefore, in the portion of the second surface 3b where the first flap 3g and the second surface 3b are capacitively coupled, the first metal region 7a and the second metal region 7b are not separated by the slit 9 and are physically connected. ing.
  • the length of the slit 9 in the longitudinal direction is determined so that the current flowing through the metal film 7 flows in a direction intersecting the longitudinal direction of the slit 9 so as to orbit the outer periphery of the container 1D. Even with such a configuration, the metal film 7 can function as a loop antenna. Further, since the RFID module 5 does not appear on the outer surface of the container 1D, it is possible to prevent the design of the container 1B from being reduced.
  • the difference between the container 1 of the third embodiment and the container 1 of the first embodiment is the difference in the sheet resistance of the metal film 7. This difference will be mainly described below.
  • the description may be omitted for the elements having the same configuration, operation, and function as those of the first embodiment, in order to avoid duplicate description.
  • the container 1 of the third embodiment has the same configuration as the RFID module 5 of the first embodiment except for the points described below.
  • the sheet resistance of the metal film 7 of the container 1 of the third embodiment is larger than the sheet resistance of the metal film 7 of the container 1 of the first embodiment.
  • the sheet resistance of the metal film 7 is large, the following problems that did not occur in the container 1 of the first embodiment occur.
  • a resonance phenomenon occurred in the entire metal film 7 as an antenna electrode, and electromagnetic waves were radiated.
  • the thickness of the metal film 7 in the first embodiment is, for example, larger than 5 ⁇ m and 40 ⁇ m or less, and the sheet resistance of the metal film 7 is 0.05 ⁇ / ⁇ or less.
  • the metal film of the container is usually formed to prevent food oxidation and improve the design, but even if the thickness of the metal film is a single digit value in ⁇ m units such as 5 ⁇ m, the metal film is further formed.
  • the printing thickness becomes about 1 ⁇ m. In this case, a step is generated in the printed matter due to the thickness of the metal film as the antenna foil, which causes printing misalignment (blurring or bleeding). For this reason, it was not possible to print directly as a design on a container with a conventional antenna foil attached.
  • the resistance value of the matching circuit section between the RFIC and the antenna will be the same thickness as the metal film, the resistance value of the matching circuit section will increase, the matching loss will increase, and the RFID module will not operate.
  • an antenna electrode made of a thin metal film cannot generate electromagnetic wave radiation due to the (series) resonance phenomenon, but when an electromagnetic wave is received by the metal film, a current flows through the metal film so as to cancel the electromagnetic wave. To shield.
  • This current is also called an eddy current.
  • an eddy current flows, the current component flowing through the metal film is not due to the resonance phenomenon of the antenna electrode, so that it can correspond to all frequency components regardless of the electrode pattern shape.
  • This eddy current is known as an effect of the metal shield, but it is not usually used as an antenna.
  • the RFID module 5 Since the RFID module 5 has a parallel resonant circuit RC1 as a filter circuit that transmits only a current having a unique resonance frequency to the RFID 23, the eddy current is frequency-selected and the current flows through the RFID 23 to transmit energy. Only a specific frequency is selected between the metal film 7 as an antenna electrode and the RFID module 5, impedance matching is performed, and energy transfer between the RFID 23 and the metal film 7 becomes possible. In this way, it is considered that communication with the RFIC 23 becomes possible.
  • the state where the sheet resistance of the metal film 7 is high occurs not only by the thickness of the metal film 7 but also by the manufacturing method of the metal film 7.
  • the sheet resistance may be 0.5 ⁇ / ⁇ or more. Even in such a case, wireless communication can be performed if the container 1 of the third embodiment is used.
  • FIG. 16-19 shows an overall perspective view of the container in other embodiments.
  • the corners may be chamfered and a slit 9 may be formed in the chamfered corners.
  • a corner portion connecting the second surface 3b and the third surface 3c of the container 1E is chamfered, and a slit 9 is formed on the chamfered surface.
  • the metal film 7 is not formed on the fifth surface 3e and the sixth surface 3f.
  • the two slits 9 may be formed so as to intersect each other. Specifically, the two slits 9 are formed so as to intersect each other on the third surface 3c of the container 1F.
  • the RFID module 5 is arranged at the intersection of the two slits 9.
  • the metal film 7 is not formed on the fifth surface 3e and the sixth surface 3f.
  • the slit 9 may be formed on the fifth surface 3e, and the RFID module 5 may be arranged on the fifth surface 3e.
  • the slit 9 extends laterally from the end on the second surface 3b side to the end on the fourth surface 3d side.
  • the first metal region 7a is formed from the slit 9 on the second flap 3h side
  • the second metal region 7b is formed on the third surface 3c side from the slit 9.
  • the first metal region 7a is formed on a part of the fifth surface 3e on the second flap 3h side from the slit 9 and on the second flap 3h.
  • the second metal region 7b is formed on a part of the fifth surface 3e on the third surface 3c side from the slit 9, the third surface 3c, the sixth surface 3f, and the first surface 3a.
  • the first metal region 7a and the second metal region 7b are electrically connected via capacitive coupling.
  • the container 1H is a container having no flaps 3g, 3h, and 3k.
  • the first surface 3a and the second surface 3b are physically connected.
  • a metal film 7 is formed on the entire surface of the base material 3 except for the slit 9. Therefore, the first surface 3a and the second surface 3b are directly electrically connected, not capacitively coupled.
  • an electromagnetic wave having a communication frequency is applied to the container 1H, the container 1H is formed on the third surface 3c, the fourth surface 3d, the first surface 3a, and the second surface 3b of the container 1H in the direction intersecting the slit 9. An electric current flows through the metal film 7.
  • the container 1 is an assembly type, but the present invention is not limited to this.
  • the container 1 may be a bottle or a PET bottle.
  • the communication frequency band is the UHF band, but the frequency band is not limited to this. It may be configured to perform wireless communication with a high frequency signal having a frequency (carrier frequency) for communication in the HF band.
  • the total length of the metal film 7 orthogonal to the slit 9 is designed to receive a high frequency signal in the HF band.
  • the HF band is a frequency band of 13 MHz or more and 15 MHz or less.
  • the RFID module 5 is attached to the first metal region 7a and the second metal region 7b, but the present invention is not limited to this.
  • the RFIC 23 may be electrically connected to the first metal region 7a and the second metal region 7b via an inductor.
  • the inductor is formed on the antenna pattern side.
  • the metal film 7 may have a low sheet resistance by attaching a metal foil as in the first embodiment.
  • a paint may be applied on a region other than the portion where the RFID module 5 is attached to form a pattern to enhance the design of the container 1. .. Further, the metal film 7 and the slit 9 may be formed on the second main surface 3t instead of the first main surface 3s of the base material 3. That is, the metal film 7 and the slit 9 may be formed inside the container 1.

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  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Aerials (AREA)
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  • Waveguide Aerials (AREA)
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PCT/JP2021/037397 2020-11-09 2021-10-08 Ｒｆｉｄモジュールを備えた容器 Ceased WO2022097422A1 (ja)

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JP2022514607A JP7074275B1 (ja) 2020-11-09 2021-10-08 Ｒｆｉｄモジュールを備えた容器
DE212021000250.1U DE212021000250U1 (de) 2020-11-09 2021-10-08 Behälter, der ein RFID-Modul umfasst
CN202190000200.0U CN217404880U (zh) 2020-11-09 2021-10-08 具备rfid模块的容器
US17/728,279 US11797815B2 (en) 2020-11-09 2022-04-25 Container including RFID module

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JP2020-186686 2020-11-09

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WO2022075263A1 (ja) * 2020-10-05 2022-04-14 株式会社村田製作所 Ｒｆｉｄモジュールを備えた容器
JP7201137B2 (ja) * 2020-11-09 2023-01-10 株式会社村田製作所 Ｒｆｉｄモジュールを備えた容器
JP7197065B2 (ja) * 2021-01-22 2022-12-27 株式会社村田製作所 Ｒｆｉｄモジュールを備えた容器
USD1044756S1 (en) * 2021-07-20 2024-10-01 Crestron Electronics, Inc. RFID reader
WO2023022065A1 (ja) * 2021-08-19 2023-02-23 株式会社村田製作所 容器

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WO2018056363A1 (ja) * 2016-09-26 2018-03-29 株式会社村田製作所 Ｒｆｉｄタグ付き金属製キャップおよびそれを備える容器
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JP2009031893A (ja) * 2007-07-25 2009-02-12 Hitachi Ltd Ｒｆｉｄタグ実装パッケージおよびその製造方法
JP2020021389A (ja) * 2018-08-03 2020-02-06 大日本印刷株式会社 Ｒｆタグ付き包装体

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