WO2022088605A1 - 水离子发射端和水离子发射装置 - Google Patents
水离子发射端和水离子发射装置 Download PDFInfo
- Publication number
- WO2022088605A1 WO2022088605A1 PCT/CN2021/083627 CN2021083627W WO2022088605A1 WO 2022088605 A1 WO2022088605 A1 WO 2022088605A1 CN 2021083627 W CN2021083627 W CN 2021083627W WO 2022088605 A1 WO2022088605 A1 WO 2022088605A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling
- refrigeration
- sheet
- circuit board
- water ion
- Prior art date
Links
- RECVMTHOQWMYFX-UHFFFAOYSA-N oxygen(1+) dihydride Chemical compound [OH2+] RECVMTHOQWMYFX-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 238000005057 refrigeration Methods 0.000 claims abstract description 135
- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims description 293
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 238000003466 welding Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004071 biological effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T23/00—Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere
Definitions
- the present application relates to the technical field of water ion emission devices, and in particular, to a water ion emission end and a water ion emission device using the water ion emission end.
- the water ion emitting end in the related art generally includes a circuit board, a cooling assembly, a conductive copper sheet and a discharge electrode; wherein, the cooling end of the cooling assembly is electrically connected to a surface of the circuit board, and the conductive copper sheet is electrically connected to the cooling element. At the refrigeration end of the component, the discharge electrode is electrically connected to the surface of the conductive copper sheet away from the refrigeration component.
- the water ion emitter needs to be installed on the circuit board first, then the conductive copper sheet is installed on the cooling assembly, and finally the discharge electrode is installed on the conductive copper sheet. More complicated assembly can be completed; at the same time, the volume of the refrigeration component and the discharge electrode is relatively small, which makes it inconvenient to install. Therefore, the assembly process of this type of water ion emitter is relatively complicated, which reduces the production efficiency of the water ion emitter.
- the main purpose of the present application is to provide a water ion emitter, which aims to simplify the assembly process of the water ion emitter and improve the production efficiency of the water ion emitter.
- the water ion emission terminal proposed by this application includes:
- circuit board defining that the circuit board has a mounting surface
- a refrigeration assembly the refrigeration assembly is installed on the mounting surface, the refrigeration assembly includes a first refrigeration fin and a second refrigeration fin, and the first refrigeration fin and the second refrigeration fin both have oppositely disposed heat dissipation ends and The cooling end, the cooling end of the first cooling sheet and the cooling end of the second cooling sheet are both electrically connected to the circuit board, and the cooling end of the first cooling sheet is close to the cooling end of the second cooling sheet cooling end, and the direction from the cooling end of the first cooling sheet to the cooling end of the first cooling sheet and the direction from the cooling end of the second cooling sheet to the cooling end of the second cooling sheet are both parallel to the mounting surface; and
- Discharge electrodes which are arranged close to the refrigeration end of the first refrigeration piece and the refrigeration end of the second refrigeration piece, and are electrically connected to the refrigeration end of the first refrigeration piece and the second refrigeration piece the cooling end.
- the cooling end of the first cooling chip and the cooling end of the second cooling chip are disposed opposite to each other, and the discharge electrode is electrically connected to the first cooling chip and the second cooling chip.
- One end of the second cooling sheet is located between the cooling end of the first cooling sheet and the cooling end of the second cooling sheet.
- the discharge electrode includes:
- connecting segment body is electrically connected to the cooling end of the first refrigerating piece and the refrigerating end of the second refrigerating piece;
- a discharge segment body, the discharge segment body is connected to the connection segment body, and the cross-sectional area of the discharge segment body is smaller than the cross-sectional area of the connection segment body.
- the circuit board has an upper surface and a lower surface that are disposed opposite to each other, and the upper surface of the circuit board or the lower surface of the circuit board is formed as the mounting surface;
- the first cooling chip, the second cooling chip, the connecting segment body and the discharge segment body are all located on the upper surface of the circuit board ;
- the first cooling chip, the second cooling chip and the connecting segment body are located on the lower surface of the circuit board, and the discharge segment body penetrates on the upper surface of the circuit board through the circuit board.
- the connecting segment body is fixed by welding with the cooling end of the first cooling chip and the cooling end of the second cooling chip;
- the heat dissipation end of the first cooling sheet and the heat dissipation end of the second cooling sheet are fixed to the circuit board by welding.
- the application also proposes a water ion emission device, comprising a water ion emission end and a high-voltage electrode, and the water ion emission end includes:
- circuit board defining that the circuit board has a mounting surface
- a refrigeration assembly the refrigeration assembly is installed on the mounting surface, the refrigeration assembly includes a first refrigeration fin and a second refrigeration fin, and the first refrigeration fin and the second refrigeration fin both have oppositely disposed heat dissipation ends and
- the cooling end, the cooling end of the first cooling sheet and the cooling end of the second cooling sheet are both electrically connected to the circuit board, the cooling end of the first cooling sheet and the cooling end of the second cooling sheet are electrically connected to the circuit board.
- cooling end, and the direction from the cooling end of the first cooling sheet to the cooling end of the first cooling sheet and the direction from the cooling end of the second cooling sheet to the cooling end of the second cooling sheet are both parallel to the mounting surface;
- Discharge electrodes which are arranged close to the refrigeration end of the first refrigeration piece and the refrigeration end of the second refrigeration piece, and are electrically connected to the refrigeration end of the first refrigeration piece and the second refrigeration piece refrigerating end;
- the high voltage electrode and one end of the discharge electrode away from the first refrigeration sheet and the second refrigeration sheet are arranged opposite to each other.
- the water ion emission device further includes a box body
- the circuit board and the refrigeration assembly are both arranged in the box body,
- One end of the discharge electrode away from the first refrigerating sheet and the second refrigerating sheet passes through the box body and is exposed on the outside of the box body;
- the high voltage electrode is arranged on the outer surface of the box body.
- a water groove is provided on the outer surface of the box body provided with the high-voltage electrode to accommodate part of the condensed water condensed by the discharge electrode.
- an inner surface of the box body facing the installation surface is protruded with a surrounding plate, and an end of the surrounding plate away from the box body abuts on the installation surface, and the surrounding plate is in contact with the installation surface.
- a plate is disposed around the refrigeration assembly and the discharge electrode.
- the box body includes:
- the box body is provided with an accommodating groove
- a box cover which is detachably connected to the box body and covers the notch of the accommodating groove
- circuit board and the refrigeration assembly are arranged in the accommodating groove
- the high voltage electrode is arranged on the surface of the box cover facing away from the box body.
- the circuit board can control the conduction of the first refrigeration piece and the second refrigeration piece of the refrigeration assembly, so that the first refrigeration piece and the second refrigeration piece can dissipate heat through their respective radiating ends. And refrigerate through their respective cooling ends.
- the discharge electrodes are arranged close to the cooling ends of the first and second cooling sheets, so that the discharge electrodes can be cooled to a relatively low temperature, and at this time, the water vapor in the air condenses on the discharge electrodes to form condensed water. Then, when a high-voltage electric field is applied to the discharge electrode, the discharge electrode can be driven to discharge, and the condensed water condensed on the discharge electrode can be ionized into water ions, thereby realizing the generation of water ions.
- the direction from the cooling end of the first cooling fin of the water ion emitting end to the cooling end of the first cooling fin and the direction from the cooling end of the second cooling fin to the cooling end of the second cooling fin are both parallel to the direction of the circuit board.
- the installation surface, that is, the first cooling piece and the second cooling piece are installed horizontally.
- the installation method of the first refrigeration piece and the second refrigeration piece in the present application increases the contact between the first refrigeration piece and the second refrigeration piece and the circuit board.
- the area of the first cooling chip and the second cooling chip can be stably placed on the circuit board.
- the heat dissipation end and the cooling end of the first cooling chip are respectively fixed with the circuit board and the discharge electrode, so as to facilitate the installation of the first cooling chip and the second cooling chip.
- the discharge electrode of the water ion emitting end in this solution is directly connected to the refrigeration ends of the first refrigeration sheet and the second refrigeration sheet.
- the cooling end is indirectly connected, and the water ion emitting end in this solution can reduce the assembly steps and make the assembly of the discharge electrode simpler. Therefore, the structural arrangement of the water ion emitting end in this solution simplifies the assembly process of the water ion emitting end, thereby improving the production efficiency of the water ion emitting end.
- FIG. 1 is a schematic diagram of the assembly structure of an embodiment of the water ion emission device of the present application
- Fig. 2 is a perspective schematic diagram of the explosion structure of the water ion emission device in Fig. 1;
- Fig. 3 is another perspective schematic diagram of the explosion structure of the water ion emission device in Fig. 1;
- FIG. 4 is a schematic cross-sectional view of the water ion emission device in FIG. 1;
- FIG. 5 is a schematic view of a perspective view of an embodiment of a water ion emitter of the present application.
- Fig. 6 is another perspective schematic diagram of the water ion emitter in Fig. 5;
- FIG. 7 is a schematic diagram of the partial structure of the water ion emitter in FIG. 5 .
- the terms “connected”, “fixed” and the like should be understood in a broad sense, for example, “fixed” may be a fixed connection, a detachable connection, or an integrated; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be an internal communication between two elements or an interaction relationship between the two elements, unless otherwise explicitly defined.
- “fixed” may be a fixed connection, a detachable connection, or an integrated; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be an internal communication between two elements or an interaction relationship between the two elements, unless otherwise explicitly defined.
- FIG. 1 , FIG. 2 , FIG. 3 , FIG. 4 and FIG. 5 proposes a water ion emitting end 11 .
- the water ion emitting end 11 includes a circuit board 111 , a cooling component 113 and a discharge electrode 115 ; wherein, the circuit board 111 is defined to have a mounting surface 1111 ; the cooling component 113 is mounted on the mounting surface 1111 , and the cooling component 113 includes a first cooling fin 1131 and a second cooling fin 1133, the first cooling fin 1131 and the second cooling fin 1133 have oppositely disposed cooling ends 1135 and 1137, and the cooling ends 1135 and the second cooling end 1135 of the first cooling fin 1131
- the cooling end 1135 of the cooling sheet 1133 is electrically connected to the circuit board 111 , the cooling end 1137 of the first cooling sheet 1131 is close to the cooling end 1137 of the second cooling sheet 1133 , and the cooling end 1135 of the first cooling sheet 1131 reaches the first cooling end 1135 of the first cooling sheet 1131
- the circuit board 111 may be mainly used to conduct and control the operation of the first cooling sheet 1131 and the second cooling sheet 1133 in the cooling assembly 113 .
- the projection of the circuit board 111 on the horizontal plane may be substantially square or rectangular, so that the shape of the circuit board 111 is relatively regular and convenient for molding and manufacturing.
- the projection of the circuit board 111 on the horizontal plane may also be a circle or other shapes, which are not limited in this application, as long as the refrigeration assembly 113 can be installed and supported.
- the material of the circuit board 111 can be ceramic, aluminum or copper, etc., and a corresponding circuit can be provided on the circuit board 111 .
- the first refrigerating sheet 1131 and the second refrigerating sheet 1133 of the refrigeration assembly 113 can be mainly used for cooling after being powered on, so as to cool the discharge electrode 115 .
- the first refrigerating sheet 1131 and the second refrigerating sheet 1133 are P-type Peltier elements and N-type Peltier elements respectively. Since the P-type Peltier elements and the N-type Peltier elements are energized, the cooling principle is There is technology, so it will not be described in detail here. Of course, the present application is not limited to this.
- the first cooling sheet 1131 and the second cooling sheet 1133 may also be P crystal grains and N crystal grains, respectively.
- one set of the refrigeration assembly 113 may be provided.
- one end of the discharge electrode 115 may be electrically connected to the refrigeration ends 1137 of the first refrigeration sheet 1131 and the second refrigeration sheet 1133 in the refrigeration assembly 113 .
- the refrigeration components 113 may also be provided with two or more groups. In this case, the two or more refrigeration components 113 are connected in parallel, and one end of the discharge electrode 115 is connected to the first refrigeration component in each group of refrigeration components 113 .
- the sheet 1131 and the cooling end 1137 of the second cooling sheet 1133 may be electrically connected to each other.
- the discharge electrode 115 can be mainly used to condense the water vapor in the air into condensed water, and then discharge and ionize the condensed water to form water ions.
- the discharge electrode 115 Since the principle that the discharge electrode 115 ionizes the condensed water to form water ions is in the prior art, it will not be described in detail here.
- the discharge electrode 115 may be substantially needle-shaped, so that it is easier to discharge at the needle-shaped tip.
- the circuit board 111 can control the conduction of the first cooling chip 1131 and the second cooling chip 1133 of the cooling assembly 113, so that the first cooling chip 1131 and the second cooling chip 1133 dissipates heat through respective cooling ends 1135 and cools through respective cooling ends 1137 .
- the discharge electrode 115 is disposed close to the cooling end 1137 of the first cooling sheet 1131 and the second cooling sheet 1133 , so that the discharge electrode 115 can be cooled to a relatively low temperature, and the water vapor in the air condenses on the discharge electrode 115 at this time. water.
- the discharge electrode 115 can be driven to discharge, and the condensed water condensed on the discharge electrode 115 can be ionized into water ions, thereby realizing the generation of water ions.
- the direction from the heat dissipation end 1135 of the first cooling fin 1131 of the water ion emitting end 11 to the cooling end 1137 of the first cooling fin 1131 and the direction from the heat dissipation end 1135 of the second cooling fin 1133 to the second cooling fin 1133 The directions of the cooling ends 1137 of the two are parallel to the mounting surface 1111 of the circuit board 111, that is, the first cooling chip 1131 and the second cooling chip 1133 are installed horizontally.
- the installation method of the first cooling chip 1131 and the second cooling chip 1133 in the present application increases the first cooling chip 1131 and the second cooling chip.
- the contact area between the 1133 and the circuit board 111 enables the first cooling sheet 1131 and the second cooling sheet 1133 to be stably placed on the circuit board 111. At this time, it is convenient to connect the heat dissipation end 1135 and the cooling end 1137 of the first cooling sheet 1131 with the cooling end 1137 respectively.
- the fixing of the circuit board 111 and the discharge electrode 115, and the fixing of the heat dissipation end 1135 and the cooling end 1137 of the second cooling sheet 1133 to the circuit board 111 and the discharge electrode 115, respectively, are convenient for the cooling of the first cooling sheet 1131 and the second cooling sheet 1131. Mounting of sheet 1133.
- the discharge electrode 115 of the water ion emitting end 11 in this solution is directly connected to the cooling end 1137 of the first cooling sheet 1131 and the second cooling sheet 1133, compared with the discharge electrode of the water ion emitting end 11 in the prior art
- the 115 is indirectly connected to the cooling end 1137 of the cooling assembly 113 through a conductive copper sheet.
- the water ion emitting end 11 in this solution can reduce assembly steps and make the assembly of the discharge electrode 115 easier. Therefore, the structural arrangement of the water ion emitting end 11 in this solution simplifies the assembly process of the water ion emitting end 11 , thereby improving the production efficiency of the water ion emitting end 11 .
- the cooling end 1137 of the first cooling sheet 1131 and the cooling end 1137 of the second cooling sheet 1133 are disposed opposite to each other, and the discharge electrode 115 is electrically connected to the first cooling sheet 1131 and one end of the second cooling sheet 1133 is located between the cooling end 1137 of the first cooling sheet 1131 and the cooling end 1137 of the second cooling sheet 1133 .
- the cooling end 1137 of the first cooling sheet 1131 and the cooling end 1137 of the second cooling sheet 1133 are disposed opposite to each other, that is, the distribution of the first cooling sheet 1131 and the second cooling sheet 1133 on the mounting surface 1111 is roughly "one"
- the shape of the first refrigerating piece 1131 and the second refrigerating piece 1133 makes only the refrigerating end 1137 of the first piece 1131 and the second piece 1133 closer together and the other parts are scattered.
- the first refrigerating piece 1131 and the second piece 1133 and the circuit can be fixed more conveniently.
- the board 111 can also be convenient to set a corresponding circuit on the circuit board 111 to conduct the first cooling chip 1131 and the second cooling chip 1133 .
- this arrangement can also make the heat dissipation end 1135 of the first cooling sheet 1131 and the heat dissipation end 1135 of the second cooling sheet 1133 evenly distributed around the center of the circuit board 111, so that the heat dissipation end 1135 of the first cooling sheet 1131 and the second cooling sheet 1135 are evenly distributed.
- the heat generated by the heat dissipation end 1135 of the sheet 1133 on the circuit board 111 is relatively uniform, which reduces the possibility of damage to the circuit board 111 due to local overheating.
- one end of the discharge electrode 115 electrically connected to the first refrigeration piece 1131 and the second refrigeration piece 1133 is located between the refrigeration end 1137 of the first refrigeration piece 1131 and the refrigeration end 1137 of the second refrigeration piece 1133, so that the discharge electrode 115 It is relatively close to the cooling end 1137 of the first cooling sheet 1131 and the cooling end 1137 of the second cooling sheet 1133, which improves the cooling effect of the first cooling sheet 1131 and the second cooling sheet 1133 on the discharge electrode 115, and also facilitates the setting of the connection structure.
- the present application is not limited to this.
- the cooling end 1137 of the first cooling sheet 1131 and the second cooling sheet 1133 may also be arranged in parallel or at a certain angle, which can ensure the first The cooling end 1137 of the first cooling sheet 1131 and the second cooling sheet 1133 may be relatively close to each other and the cooling end 1135 may be relatively far away.
- the discharge electrode 115 includes a connection segment body 1151 and a discharge segment body 1153 , and the connection segment body 1151 is electrically connected to the cooling end 1137 of the first cooling sheet 1131 and the The cooling end 1137 of the second cooling chip 1133 ; the discharge segment body 1153 is connected to the connecting segment body 1151 , and the cross-sectional area of the discharge segment body 1153 is smaller than that of the connecting segment body 1151 .
- the discharge electrode 115 is connected to the cooling end 1137 of the first cooling chip 1131 and the cooling end 1137 of the second cooling chip 1133 through the connecting segment body 1151 with a relatively large cross-sectional area, which can facilitate the setting of a connecting structure to Therefore, in one embodiment, the convenience of assembling the discharge electrode 115 is improved.
- the discharge electrode 115 condenses and ionizes the water vapor in the air into condensed water through the discharge segment body 1153 with a relatively small cross-sectional area, which can ensure a better tip discharge effect.
- the projection of the connecting segment body 1151 and the discharge segment body 1153 on the mounting surface 1111 may be in a circular shape, so as to ensure uniformity of the ionization effect throughout the side peripheral surfaces thereof.
- the discharge electrode 115 may also be a cylindrical shape with the same cross-sectional area everywhere.
- the circuit board 111 has an upper surface and a lower surface that are disposed opposite to each other, and the upper surface of the circuit board 111 or the lower surface of the circuit board 111 is formed as Mounting surface 1111; when the upper surface of the circuit board 111 is formed as the mounting surface 1111, the first cooling chip 1131, the second cooling chip 1133, the connecting segment body 1151 and the discharge segment body 1153 are all located on the upper surface of the circuit board 111; when the circuit When the lower surface of the board 111 is formed as the mounting surface 1111, the first cooling piece 1131, the second cooling piece 1133 and the connecting segment body 1151 are located on the lower surface of the circuit board 111, and the discharge segment body 1153 passes through the circuit board 111 and is located on the circuit board 111 the upper surface.
- the first cooling chip 1131 , the second cooling chip 1133 , the connecting segment body 1151 and the discharge segment body 1153 are located on the same side of the circuit board 111 . It can be quickly fixed between several.
- the connection segment body 1151 and the discharge segment body 1153 of the discharge electrode 115 are located on different sides of the circuit board 111, and the connection segment body 1151 abuts against the lower surface of the circuit board 111.
- the discharge electrode 115 has a certain position limit function, so that the stability of the installation of the discharge electrode 115 can be improved.
- the circuit board 111 is provided with a pass-through hole 1113 for the discharge segment body 1153 to pass through, and the diameter of the pass-through hole 1113 may be slightly smaller than the cross-section of the connection segment body 1151 and slightly larger than the cross-section of the connection segment body 1151 , so that the connecting segment body 1151 and the lower surface of the circuit board 111 abut to limit the position.
- the connecting segment body 1151 is fixed by welding with the cooling end 1137 of the first cooling sheet 1131 and the cooling end 1137 of the second cooling sheet 1133 .
- the connecting segment body 1151 is fixed by welding with the first cooling sheet 1131 and the second cooling sheet 1133, which can realize the mechanical connection between the discharge electrode 115 and the first cooling sheet 1131 and the second cooling sheet 1133, and realize the discharge electrode. 115 and the first cooling chip 1131 and the second cooling chip 1133 are electrically connected.
- welding and fixing also has the advantage of being stable and reliable, so as to ensure the stability of the connection between the connecting segment body 1151 and the first cooling sheet 1131 and the second cooling sheet 1133 .
- connecting segment body 1151 and the cooling end 1137 of the first cooling chip 1131 and the cooling end 1137 of the second cooling chip 1133 may also be fixed by conductive adhesive, or fixed by plugging (i.e. through the fit of the bumps and grooves).
- the heat dissipation end 1135 of the first cooling sheet 1131 and the heat dissipation end 1135 of the second cooling sheet 1133 are fixed to the circuit board 111 by welding.
- the heat dissipation end 1135 of the first cooling chip 1131 and the heat dissipation end 1135 of the second cooling chip 1133 are fixed to the circuit board 111 by welding, so that the first cooling chip 1131 and the second cooling chip 1133 can be connected to the circuit board 111 in the same way.
- the mechanical connection can also realize the electrical conduction between the first cooling chip 1131 and the second cooling chip 1133 and the circuit board 111 . This simplifies the realization of the connection structure between the first cooling sheet 1131 and the second cooling sheet 1133 and the circuit board 111 , thereby reducing the manufacturing cost of the water ion emitting end 11 in one embodiment.
- the welding and fixing also has the advantage of being stable and reliable, so as to ensure the stability of the connection between the first cooling chip 1131 and the second cooling chip 1133 and the circuit board 111 .
- the present application is not limited to this.
- the first cooling sheet 1131 and the second cooling sheet 1133 and the circuit board 111 may also be fixed by conductive adhesive, or fixed by plugging (that is, by means of bumps and grooves). Cooperate).
- the present application further proposes a water ion emission device 10 , the water ion emission device 10 includes a water ion emission end 11 and a high voltage electrode 13 , the water ion emission end 11
- the water ion emission device 10 adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.
- the high voltage electrode 13 and the end of the discharge electrode 115 away from the first refrigeration sheet 1131 and the second refrigeration sheet 1133 are disposed opposite to each other.
- the high voltage electrode 13 may be electrically connected to the circuit board 111 to control the conduction of the high voltage electrode 13 through the circuit board 111 .
- the shape of the high voltage electrode 13 may be approximately in the shape of a ring.
- the water ion emission device 10 further includes a box body 15 ; the circuit board 111 and the refrigeration assembly 113 are both disposed in the box body 15 , and the discharge electrode 115 is far away from the first refrigeration sheet 1131 and the second refrigeration sheet 1133 One end of the electrode passes through the box body 15 and is exposed on the outside of the box body 15 ; the high voltage electrode 13 is arranged on the outer surface of the box body 15 .
- the arrangement of the box body 15 can provide certain protection to the circuit board 111 and the refrigeration assembly 113 , reducing the possibility of being damaged by foreign objects, thereby helping to prolong the service life of the circuit board 111 and the refrigeration assembly 113 .
- a water groove 1531 is provided on the outer surface of the box body 15 with the high voltage electrode 13 to accommodate part of the condensed water condensed by the discharge electrode 115 .
- the condensed water on the discharge electrode 115 when it reaches a certain amount, it can flow into the water tank 1531 for storage, so as to ensure that the water bubble formed by the ionization of the condensed water and the high-voltage electrode 13 have a certain distance, so as to avoid the distance between the two being too small. Negative products are generated during ionization, so that the ionization effect of the discharge electrode 115 on the condensed water can be improved.
- the water tank 1531 may include a plurality of first sub-tanks 1533, each of the first sub-tanks 1533 is extended from the center to the edge of the box body 15.
- a sub-tank 1533 is evenly distributed around the center of the box body 15 .
- the water tank 1531 may further include a plurality of second sub-water tanks 1535, and the plurality of second sub-water tanks 1535 are arranged in a ring shape around the center of the box body 15, and the diameters are sequentially from the center of the box body 15 to the edge. The directions of the s are increasing sequentially, and the second sub-tank 1535 is communicated with the first sub-tank 1533 . In this way, the excessive condensed water on the discharge electrode 115 can be guided by the first sub-tank 1533 and the second sub-tank 1535 to flow on the surface of the box body 15 to have a larger evaporation area.
- the inner surface of the box body 15 facing the mounting surface 1111 is protruded with a surrounding plate 1513 , and the end of the surrounding plate 1513 away from the box body 15 abuts on the inner surface of the box body 15 .
- the mounting surface 1111 and the enclosure plate 1513 are arranged around the refrigeration assembly 113 and the discharge electrode 115 .
- the setting of the enclosure plate 1513 can enclose the part of the refrigeration assembly 113 and the discharge electrode 115, that is, the refrigeration area and the heat dissipation area are separated, so as to prevent the air flow in the refrigeration area and the heat dissipation area from forming convection, thereby ensuring refrigeration. cooling effect in the area.
- the box body 15 includes a box body 151 and a box cover 153.
- the box body 151 is provided with a accommodating groove 1511;
- the notch of the groove 1511; the circuit board 111 and the refrigeration assembly 113 are arranged in the accommodating groove 1511;
- the end of the discharge electrode 115 away from the first refrigeration sheet 1131 and the second refrigeration sheet 1133 passes through the box cover 153;
- the high voltage electrode 13 is provided in
- the box cover 153 faces away from the surface of the box body 151 .
- the box cover 153 is detachably connected to the box body 151, so that when the refrigeration assembly 113 or the discharge electrode 115 located in the accommodating groove 1511 is damaged, the box cover 153 can be detached from the box body 151, Therefore, maintenance and replacement of the refrigeration assembly 113 or the discharge electrode 115 is facilitated.
- the box cover 153 may be fixed to the box body 151 by screws, snaps or magnetic attraction, so as to simplify the disassembly and assembly process of the box cover 153 .
- the enclosure plate 1513 can be a bottom wall of the accommodating groove 1511 , and can be integrated with the box body 151 .
- the circuit board 111 can be clamped and fixed by the box body 151 and the box cover 153 , so that no additional connecting structure is required to limit and fix the circuit board 111 , and this arrangement can also simplify the assembly process between them.
- the bottom wall and/or the side wall of the box body 151 may be provided with an air flow port 1515 communicating with the accommodating groove 1511 .
- the high-voltage electrode 13 may be supported and fixed by a support column 1537 protruding from the surface of the box cover 153 facing away from the box body 151 .
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
一种水离子发射端（11）和水离子发射装置（10），水离子发射端（11）包括电路板（111），定义电路板（111）具有安装面；安装于安装面的制冷组件（113），制冷组件（113）包括第一制冷片（1131）和第二制冷片（1133），第一制冷片（1131）的散热端（1135）和第二制冷片（1133）的散热端（1135）均电性连接于电路板（111），第一制冷片（1131）的制冷端（1137）靠近于第二制冷片（1133）的制冷端（1137），且第一制冷片（1131）的散热端（1135）至第一制冷片（1131）的制冷端（1137）的方向和第二制冷片（1133）的散热端（1135）至第二制冷片（1133）的制冷端（1137）的方向均平行于安装面；以及放电电极（115），放电电极（115）靠近第一制冷片（1131）的制冷端（1137）和第二制冷片（1133）的制冷端（1137）设置，并电性连接于第一制冷片（1131）的制冷端（1137）和第二制冷片（1133）的制冷端（1137）。
Description
本申请要求于2020年10月30日提交中国专利局、申请号为202011199551.7、申请名称为“水离子发射端和水离子发射装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本申请涉及水离子发射装置技术领域，特别涉及一种水离子发射端和应用该水离子发射端的水离子发射装置。
由于水离子具有生物活性、粒径小、性能稳定、呈弱酸性、可灭菌除异味等诸多优点，使得水离子技术越来越被人们关注，并被逐步应用于空气净化器、空调以及吹风机等产品中。相关技术中的水离子发射端一般包括有电路板、制冷组件、导电铜片以及放电电极；其中，该制冷组件的散热端电性连接于电路板的一表面，导电铜片电性连接于制冷组件的制冷端，放电电极电性连接于导电铜片背离制冷组件的表面。由于该类水离子发射端的零部件相对较多，使得水离子发射端在组装时需要先将制冷组件安装于电路板，之后将导电铜片安装于制冷组件，最后将放电电极安装于导电铜片方可完成较为繁琐的组装；同时制冷组件和放电电极的本身体积又相对较小而使其不便安装。因此，该类水离子发射端的组装过程相对较为复杂，导致降低了水离子发射端的生产效率。
本申请的主要目的是提供一种水离子发射端，旨在简化水离子发射端的组装过程，提高水离子发射端的生产效率。
为实现上述目的，本申请提出的水离子发射端包括：
电路板，定义所述电路板具有安装面；
制冷组件，所述制冷组件安装于所述安装面，所述制冷组件包括第一制冷片和第二制冷片，所述第一制冷片和所述第二制冷片均具有相对设置的散热端和制冷端，所述第一制冷片的散热端和所述第二制冷片的散热端均电性连接于所述电路板，所述第一制冷片的制冷端靠近于所述第二制冷片的制冷端，且所述第一制冷片的散热端至所述第一制冷片的制冷端的方向和所述第二制冷片的散热端至所述第二制冷片的制冷端的方向均平行于所述安装面；以及
放电电极，所述放电电极靠近所述第一制冷片的制冷端和所述第二制冷片的制冷端设置，并电性连接于所述第一制冷片的制冷端和所述第二制冷片的制冷端。
在本申请的一实施例中，所述第一制冷片的制冷端和所述第二制冷片的制冷端呈相对设置，所述放电电极电性连接于所述第一制冷片和所述第二制冷片的一端位于第一制冷片的制冷端和所述第二制冷片的制冷端之间。
在本申请的一实施例中，所述放电电极包括：
连接段体，所述连接段体电性连接于所述第一制冷片的制冷端和所述第二制冷片的制冷端；和
放电段体，所述放电段体连接于所述连接段体，且所述放电段体之横截面的面积小于所述连接段体之横截面的面积。
在本申请的一实施例中，所述电路板具有呈相对设置的上表面和下表面，所述电路板的上表面或者所述电路板的下表面形成为所述安装面；
当所述电路板的上表面形成为所述安装面时，所述第一制冷片、所述第二制冷片、所述连接段体以及所述放电段体均位于所述电路板的上表面；
当所述电路板的下表面形成为所述安装面时，所述第一制冷片、所述第二制冷片以及所述连接段体位于所述电路板的下表面，所述放电段体穿过所述电路板而位于所述电路板的上表面。
在本申请的一实施例中，连接段体与所述第一制冷片的制冷端和所述第二制冷片的制冷端为焊接固定；
和/或，所述第一制冷片的散热端和所述第二制冷片的散热端与所述电路板为焊接固定。
本申请还提出一种水离子发射装置，包括水离子发射端和高压电极，所述水离子发射端包括:
电路板，定义所述电路板具有安装面；
制冷组件，所述制冷组件安装于所述安装面，所述制冷组件包括第一制冷片和第二制冷片，所述第一制冷片和所述第二制冷片均具有相对设置的散热端和制冷端，所述第一制冷片的散热端靠近于所述第二制冷片的散热端均电性连接于所述电路板，所述第一制冷片的制冷端和所述第二制冷片的制冷端，且所述第一制冷片的散热端至所述第一制冷片的制冷端的方向和所述第二制冷片的散热端至所述第二制冷片的制冷端的方向均平行于所述安装面；以及
放电电极，所述放电电极靠近所述第一制冷片的制冷端和所述第二制冷片的制冷端设置，并电性连接于所述第一制冷片的制冷端和所述第二制冷片的制冷端；
所述高压电极与所述放电电极远离所述第一制冷片和所述第二制冷片的一端呈相对设置。
在本申请的一实施例中，所述水离子发射装置还包括盒体；
所述电路板和所述制冷组件均设于所述盒体内，
所述放电电极远离所述第一制冷片和所述第二制冷片的一端穿过所述盒体而显露于盒体的外侧；
所述高压电极设于所述盒体的外表面。
在本申请的一实施例中，所述盒体设有所述高压电极的外表面设有水槽，以容纳所述放电电极冷凝的部分冷凝水。
在本申请的一实施例中，所述盒体面向所述安装面的内表面凸设有围板，所述围板远离所述盒体的一端抵接于所述安装面，且所述围板环绕所述制冷组件和所述放电电极设置。
在本申请的一实施例中，所述盒体包括：
盒本体，所述盒本体设有容置槽；和
盒面盖，所述盒面盖可拆卸地连接于所述盒本体，并封盖所述容置槽的槽口；
所述电路板和所述制冷组件设于所述容置槽内；
所述放电电极远离所述第一制冷片和所述第二制冷片的一端穿过所述盒面盖；
所述高压电极设于所述盒面盖背离所述盒本体的表面。
本申请的技术方案的水离子发射端在工作时，通过电路板可以控制导通制冷组件的第一制冷片和第二制冷片，使得第一制冷片和第二制冷片通过各自的散热端散热并通过各自的制冷端制冷。而放电电极靠近第一制冷片和第二制冷片的制冷端设置，使得该放电电极能够被冷却至相对较低温度，此时空气中的水汽在放电电极上凝结出冷凝水。之后在对该放电电极施加高压电场时可以驱动放电电极进行放电，并将该放电电极上凝结的冷凝水电离成水离子，从而实现了水离子的产生。
并且，由于本方案中的水离子发射端的第一制冷片的散热端至第一制冷片的制冷端的方向和第二制冷片的散热端至第二制冷片的制冷端的方向均平行于电路板的安装面，也即第一制冷片和第二制冷片呈水平安装。相较于现有技术中的制冷组件竖直安装于电路板，本申请中第一制冷片和第二制冷片的安装方式的增大了第一制冷片和第二制冷片与电路板的接触面积，使得第一制冷片和第二制冷片能够较为稳定的安置于电路板，此时方便将第一制冷片的散热端和制冷端分别与电路板和放电电极的固定，以及将第二制冷片的散热端和制冷端分别与电路板和放电电极的固定，从而便于对该第一制冷片和第二制冷片的安装。同时，本方案中的水离子发射端的放电电极与第一制冷片和第二制冷片的制冷端直接连接，相较于现有技术中的水离子发射端的放电电极通过导电铜片与制冷组件的制冷端间接连接，本方案中的水离子发射端能够减少组装步骤而使得放电电极组装也较为简易。因此，本方案中的水离子发射端的结构设置简化了水离子发射端的组装过程，从而提高了该水离子发射端的生产效率。
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请水离子发射装置一实施例的组装结构示意图；
图2为图1中水离子发射装置的爆炸结构的一视角示意图；
图3为图1中水离子发射装置的爆炸结构的另一视角示意图；
图4为图1中水离子发射装置的一剖面示意图；
图5为本申请水离子发射端一实施例的一视角示意图；
图6为图5中水离子发射端的另一视角示意图；
图7为图5中水离子发射端的局部结构示意图。
附图标号说明：
| 标号 | 名称 | 标号 | 名称 |
| 10 | 水离子发射装置 | 1153 | 放电段体 |
| 11 | 水离子发射端 | 13 | 高压电极 |
| 111 | 电路板 | 15 | 盒体 |
| 1111 | 安装面 | 151 | 盒本体 |
| 1113 | 过让孔 | 1511 | 容置槽 |
| 113 | 制冷组件 | 1513 | 围板 |
| 1131 | 第一制冷片 | 1515 | 气流过口 |
| 1133 | 第二制冷片 | 153 | 盒盖 |
| 1135 | 散热端 | 1531 | 水槽 |
| 1137 | 制冷端 | 1533 | 第一子水槽 |
| 115 | 放电电极 | 1535 | 第二子水槽 |
| 1151 | 连接段体 | 1537 | 支撑柱 |
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在本申请中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
另外，在本申请中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
请结合参考图1、图2、图3、图4以及图5，请本申请提出一种水离子发射端11。
在本申请的一实施例中，该水离子发射端11包括电路板111、制冷组件113以及放电电极115；其中，定义电路板111具有安装面1111；制冷组件113安装于安装面1111，制冷组件113包括第一制冷片1131和第二制冷片1133，第一制冷片1131和第二制冷片1133均具有相对设置的散热端1135和制冷端1137，第一制冷片1131的散热端1135和第二制冷片1133的散热端1135均电性连接于电路板111，第一制冷片1131的制冷端1137靠近于第二制冷片1133的制冷端1137，且第一制冷片1131的散热端1135至第一制冷片1131的制冷端1137的方向和第二制冷片1133的散热端1135至第二制冷片1133的制冷端1137的方向均平行于安装面1111；放电电极115靠近第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137设置，并电性连接于第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137。
在本申请的一实施例中，电路板111主要可以用于导通和控制制冷组件113中的第一制冷片1131和第二制冷片1133工作。其中，该电路板111于水平面上的投影可以大致为正方形或者长方形状，以使得该电路板111的形状较为规则而便于成型制造。当然，于其他实施例中，该电路板111于水平面上的投影也可以为圆形或者其他形状等，本申请对此不作限定，能够实现对制冷组件113进行安装和承载即可。而电路板111的材质可以为陶瓷、铝或者铜等，能够于该电路板111上设置相应的电路即可。制冷组件113的第一制冷片1131和第二制冷片1133主要可以用于在通电后可以制冷，以对放电电极115进行冷却。其中，第一制冷片1131和第二制冷片1133分别为P型帕尔贴元件和N型帕尔贴元件，由于P型帕尔贴元件和N型帕尔贴元件的通电之后制冷原理为现有技术，故在此对其不作详述。当然，本申请不限于此，于其他实施例中，第一制冷片1131和第二制冷片1133也可以分别为P结晶粒和N结晶粒。另外，制冷组件113可以设有一组，此时，放电电极115的一端与制冷组件113内的第一制冷片1131和第二制冷片1133的制冷端1137相电性连接即可。当然，该制冷组件113也可以设有两组或者更多组，此时，两组或者更多组的制冷组件113相并联，放电电极115的一端与每一组制冷组件113内的第一制冷片1131和第二制冷片1133的制冷端1137相电性连接即可。放电电极115主要可以用于将空气中的水汽凝结成冷凝水，之后对该冷凝水进行放电电离形成水离子。由于放电电极115对冷凝水电离形成水离子的原理为现有技术，故在此对其不作详述。另外，该放电电极115可以大致设置为针状，以便更加容易在针状尖端放电。
本申请的技术方案的水离子发射端11在工作时，通过电路板111可以控制导通制冷组件113的第一制冷片1131和第二制冷片1133，使得第一制冷片1131和第二制冷片1133通过各自的散热端1135散热并通过各自的制冷端1137制冷。而放电电极115靠近第一制冷片1131和第二制冷片1133的制冷端1137设置，使得该放电电极115能够被冷却至相对较低温度，此时空气中的水汽在放电电极115上凝结出冷凝水。之后在对该放电电极115施加高压电场时可以驱动放电电极115进行放电，并将该放电电极115上凝结的冷凝水电离成水离子，从而实现了水离子的产生。
并且，由于本方案中的水离子发射端11的第一制冷片1131的散热端1135至第一制冷片1131的制冷端1137的方向和第二制冷片1133的散热端1135至第二制冷片1133的制冷端1137的方向均平行于电路板111的安装面1111，也即第一制冷片1131和第二制冷片1133呈水平安装。相较于现有技术中的制冷组件113竖直安装于电路板111，本申请中第一制冷片1131和第二制冷片1133的安装方式的增大了第一制冷片1131和第二制冷片1133与电路板111的接触面积，使得第一制冷片1131和第二制冷片1133能够较为稳定的安置于电路板111，此时方便将第一制冷片1131的散热端1135和制冷端1137分别与电路板111和放电电极115的固定，以及将第二制冷片1133的散热端1135和制冷端1137分别与电路板111和放电电极115的固定，从而便于对该第一制冷片1131和第二制冷片1133的安装。同时，本方案中的水离子发射端11的放电电极115与第一制冷片1131和第二制冷片1133的制冷端1137直接连接，相较于现有技术中的水离子发射端11的放电电极115通过导电铜片与制冷组件113的制冷端1137间接连接，本方案中的水离子发射端11能够减少组装步骤而使得放电电极115组装也较为简易。因此，本方案中的水离子发射端11的结构设置简化了水离子发射端11的组装过程，从而提高了该水离子发射端11的生产效率。
请结合参考图5，在本申请的一实施例中，第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137呈相对设置，放电电极115电性连接于第一制冷片1131和第二制冷片1133的一端位于第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137之间。
可以理解，第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137呈相对设置，也即第一制冷片1131和第二制冷片1133于安装面1111上分布大致呈“一”字形状，使得第一制冷片1131和第二制冷片1133两者仅制冷端1137相较为靠近而其他部分较为分散，此时可以更加方便的固定第一制冷片1131和第二制冷片1133与电路板111，同时也可以便于在电路板111设置相应的电路以导通第一制冷片1131和第二制冷片1133。而且，如此设置也可以使得第一制冷片1131的散热端1135和第二制冷片1133的散热端1135围绕电路板111的中心均匀分布，从而使得第一制冷片1131的散热端1135和第二制冷片1133的散热端1135于电路板111上产生的热量较为均匀，降低电路板111局部受热过高而发生损坏的可能。而放电电极115电性连接于第一制冷片1131和第二制冷片1133的一端位于第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137之间，则可以使得放电电极115与第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137均较为靠近，提高第一制冷片1131和第二制冷片1133对放电电极115的冷却效果，同时也便于设置连接结构以导通放电电极115与第一制冷片1131和第二制冷片1133。当然，需要说明的是，本申请不限于此，于其他实施例中，第一制冷片1131的制冷端1137和第二制冷片1133也可以是呈平行设置或者具有一定夹角设置，能够保证第一制冷片1131和第二制冷片1133的制冷端1137相对较为靠近而散热端1135相对较为远离即可。
请结合参考图5和图7，在本申请的一实施例中，放电电极115包括连接段体1151和放电段体1153，连接段体1151电性连接于第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137；放电段体1153连接于连接段体1151，且放电段体1153之横截面的面积小于连接段体1151之横截面的面积。
可以理解，放电电极115通过横截面的面积相对较大的连接段体1151与第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137相连接，能够便于设置连接结构以对几者之间进行固定，从而在一实施例中提高放电电极115组装的便利性。而放电电极115通过横截面的面积相对较小的放电段体1153对空气中的水汽凝结成冷凝水并电离，能够保证具有较好的尖端放电效果。其中，连接段体1151和放电段体1153于安装面1111上的投影可以为圆形状，以使其侧周面各处具有一致性而保证电离效果的均匀性。另外，需要说明的是，本申请不限于此，于其他实施例中，放电电极115也可以为各处横截面的面积一致的圆柱状。
请结合参考图5、图6以及图7，在本申请的一实施例中，电路板111具有呈相对设置的上表面和下表面，电路板111的上表面或者电路板111的下表面形成为安装面1111；当电路板111的上表面形成为安装面1111时，第一制冷片1131、第二制冷片1133、连接段体1151以及放电段体1153均位于电路板111的上表面；当电路板111的下表面形成为安装面1111时，第一制冷片1131、第二制冷片1133以及连接段体1151位于电路板111的下表面，放电段体1153穿过电路板111而位于电路板111的上表面。
可以理解，当电路板111的上表面形成为安装面1111时，第一制冷片1131、第二制冷片1133、连接段体1151以及放电段体1153几者之间位于电路板111的同一侧而能够快捷的对几者之间进行固定。当电路板111的下表面形成为安装面1111时，放电电极115的连接段体1151和放电段体1153位于电路板111的不同侧，通过连接段体1151和电路板111的下表面相抵接对放电电极115具有一定的限位作用，从而能够提高放电电极115安装的稳定性。此时，电路板111设有过让孔1113以供放电段体1153穿过，且该过让孔1113的孔径可以略小于连接段体1151的横截面，而略大于连接段体1151的横截面，以便连接段体1151和电路板111的下表面相抵接限位。
在本申请的一实施例中，连接段体1151与第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137为焊接固定。
可以理解，连接段体1151与第一制冷片1131和第二制冷片1133为焊接固定，即可以实现放电电极115和第一制冷片1131和第二制冷片1133的机械连接，又可以实现放电电极115和第一制冷片1131和第二制冷片1133的电性导通。如此简化了连接段体1151与第一制冷片1131和第二制冷片1133之间的连接结构，从而能够降低水离子发射端11的制造成本。同时，焊接固定也具有稳固可靠的优点，从而能够保证连接段体1151与第一制冷片1131和第二制冷片1133连接的稳定性。当然，本申请不限于此，于其他实施例中，连接段体1151与第一制冷片1131的制冷端1137和第二制冷片1133的制冷端1137也可以是通过导电胶粘剂固定，或者插接固定（即通过凸块和凹槽的配合）。
在本申请的一实施例中，第一制冷片1131的散热端1135和第二制冷片1133的散热端1135与电路板111为焊接固定。
可以理解，第一制冷片1131的散热端1135和第二制冷片1133的散热端1135与电路板111为焊接固定，同样即可以实现第一制冷片1131和第二制冷片1133与电路板111的机械连接，又可以实现第一制冷片1131和第二制冷片1133与电路板111的电性导通。如此简化了实现第一制冷片1131和第二制冷片1133与电路板111之间的连接结构，从而能够在一实施例中降低水离子发射端11的制造成本。同时，焊接固定也具有稳固可靠的优点，从而能够保证第一制冷片1131和第二制冷片1133与电路板111连接的稳定性。当然，本申请不限于此，于其他实施例中，第一制冷片1131和第二制冷片1133与电路板111也可以是通过导电胶粘剂固定，或者插接固定（即通过凸块和凹槽的配合）。
请结合参考图1、图2、图3以及图4，本申请还提出一种水离子发射装置10，该水离子发射装置10包括水离子发射端11和高压电极13，该水离子发射端11的具体结构参照上述实施例，由于本水离子发射装置10采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。其中，高压电极13与放电电极115远离第一制冷片1131和第二制冷片1133的一端呈相对设置。也即可以通过对高压电极13施加高压，稳定地驱动放电电极115进行放电。其中，该高压电极13可以电性连接于电路板111，以通过该电路板111对高压电极13进行导通控制。而高压电极13的形状可以大致呈环形状。
在本申请的一实施例中，水离子发射装置10还包括盒体15；电路板111和制冷组件113均设于盒体15内，放电电极115远离第一制冷片1131和第二制冷片1133的一端穿过盒体15而显露于盒体15的外侧；高压电极13设于盒体15的外表面。
可以理解，该盒体15的设置能够对电路板111和制冷组件113给予一定的保护作用，降低其被外物损坏的可能，从而有利于延长该电路板111和制冷组件113的使用年限。
请结合参考图1和图2，在本申请的一实施例中，盒体15设有高压电极13的外表面设有水槽1531，以容纳放电电极115冷凝的部分冷凝水。
可以理解，在放电电极115上冷凝水达到一定量时，可以流入到水槽1531内进行容纳，保证冷凝水被电离形成的水泡和高压电极13具有一定的距离，避免两者之间距离过小而在电离时产生负产物，从而能够提高放电电极115对冷凝水的电离效果。为了提高对流入水槽1531内的冷凝水的蒸发作用，水槽1531可以包括有多条第一子水槽1533，每条第一子水槽1533由盒体15的中心至边缘的方向延伸设置，多条第一子水槽1533围绕盒体15的中心均匀分布。在一实施例中，水槽1531还可以包括有多条第二子水槽1535，多条第二子水槽1535均围绕盒体15的中心呈环形状设置，且直径依次由盒体15的中心至边缘的方向依次递增，第二子水槽1535和第一子水槽1533相连通。如此可以将放电电极115上过多的冷凝水通过第一子水槽1533和第二子水槽1535的引导作用，于盒体15表面上流开而具有较大的蒸发面积。
请结合参考图2、图3以及图4，在本申请的一实施例中，盒体15面向安装面1111的内表面凸设有围板1513，围板1513远离盒体15的一端抵接于安装面1111，且围板1513环绕制冷组件113和放电电极115设置。
可以理解，围板1513的设置可以将制冷组件113和放电电极115的部分围合起来，也即将该处制冷区和散热区隔离开，避免制冷区和散热区的气流形成对流，从而保证了制冷区的制冷效果。
在本申请的一实施例中，盒体15包括盒本体151和盒面盖153，盒本体151设有容置槽1511；盒面盖153可拆卸地连接于盒本体151，并封盖容置槽1511的槽口；电路板111和制冷组件113设于容置槽1511内；放电电极115远离第一制冷片1131和第二制冷片1133的一端穿过盒面盖153；高压电极13设于盒面盖153背离盒本体151的表面。
可以理解，盒面盖153可拆卸地连接于盒本体151，使得位于容置槽1511内的制冷组件113或者放电电极115在发生损坏时，可以将盒面盖153从盒本体151上拆卸下来，从而便于对制冷组件113或者放电电极115进行维修更换。其中，盒面盖153可以是通过螺钉、卡扣或者磁吸固定于盒本体151，以简化盒面盖153的拆装过程。围板1513可以是设于容置槽1511的槽底壁，并可以和盒本体151为一体结构。电路板111可以是被盒本体151和盒面盖153相配合夹持固定，使得无需另设连接结构对该电路板111进行限位固定，同时如此设置也可以简化几者之间的组装过程。在一实施例中，为了提高对位于容置槽1511内的电路板111的散热效果，盒本体151的底壁和/或侧壁可以设有连通容置槽1511的气流过口1515。另外，高压电极13可以是通过凸设于盒面盖153背离盒本体151的表面的支撑柱1537进行支撑固定。
以上所述仅为本申请的优选实施例，并非因此限制本申请的专利范围，凡是在本申请的申请构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。
Claims (10)
- 一种水离子发射端，其中，包括：电路板，定义所述电路板具有安装面；制冷组件，所述制冷组件安装于所述安装面，所述制冷组件包括第一制冷片和第二制冷片，所述第一制冷片和所述第二制冷片均具有相对设置的散热端和制冷端，所述第一制冷片的散热端和所述第二制冷片的散热端均电性连接于所述电路板，所述第一制冷片的制冷端靠近于所述第二制冷片的制冷端，且所述第一制冷片的散热端至所述第一制冷片的制冷端的方向和所述第二制冷片的散热端至所述第二制冷片的制冷端的方向均平行于所述安装面；以及放电电极，所述放电电极靠近所述第一制冷片的制冷端和所述第二制冷片的制冷端设置，并电性连接于所述第一制冷片的制冷端和所述第二制冷片的制冷端。
- 如权利要求1所述的水离子发射端，其中，所述第一制冷片的制冷端和所述第二制冷片的制冷端呈相对设置，所述放电电极电性连接于所述第一制冷片和所述第二制冷片的一端位于第一制冷片的制冷端和所述第二制冷片的制冷端之间。
- 如权利要求2所述的水离子发射端，其中，所述放电电极包括：连接段体，所述连接段体电性连接于所述第一制冷片的制冷端和所述第二制冷片的制冷端；和放电段体，所述放电段体连接于所述连接段体，且所述放电段体之横截面的面积小于所述连接段体之横截面的面积。
- 如权利要求3所述的水离子发射端，其中，所述电路板具有呈相对设置的上表面和下表面，所述电路板的上表面或者所述电路板的下表面形成为所述安装面；当所述电路板的上表面形成为所述安装面时，所述第一制冷片、所述第二制冷片、所述连接段体以及所述放电段体均位于所述电路板的上表面；当所述电路板的下表面形成为所述安装面时，所述第一制冷片、所述第二制冷片以及所述连接段体位于所述电路板的下表面，所述放电段体穿过所述电路板而位于所述电路板的上表面。
- 如权利要求3所述的水离子发射端，其中，连接段体与所述第一制冷片的制冷端和所述第二制冷片的制冷端为焊接固定；和/或，所述第一制冷片的散热端和所述第二制冷片的散热端与所述电路板为焊接固定。
- 一种水离子发射装置，其中，包括：水离子发射端，所述水离子发射端为如权利要求1至5中任意一项所述的水离子发射端；和高压电极，所述高压电极与所述放电电极远离所述第一制冷片和所述第二制冷片的一端呈相对设置。
- 如权利要求6所述的水离子发射装置，其中，所述水离子发射装置还包括盒体；所述电路板和所述制冷组件均设于所述盒体内，所述放电电极远离所述第一制冷片和所述第二制冷片的一端穿过所述盒体而显露于盒体的外侧；所述高压电极设于所述盒体的外表面。
- 如权利要求7所述的水离子发射装置，其中，所述盒体设有所述高压电极的外表面设有水槽，以容纳所述放电电极冷凝的部分冷凝水。
- 如权利要求7所述的水离子发射装置，其中，所述盒体面向所述安装面的内表面凸设有围板，所述围板远离所述盒体的一端抵接于所述安装面，且所述围板环绕所述制冷组件和所述放电电极设置。
- 如权利要求7所述的水离子发射装置，其中，所述盒体包括：盒本体，所述盒本体设有容置槽；和盒面盖，所述盒面盖可拆卸地连接于所述盒本体，并封盖所述容置槽的槽口；所述电路板和所述制冷组件设于所述容置槽内；所述放电电极远离所述第一制冷片和所述第二制冷片的一端穿过所述盒面盖；所述高压电极设于所述盒面盖背离所述盒本体的表面。
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