WO2022088219A1 - 4d打印电响应折叠展开复合材料、制造及其形状记忆行为的调控方法 - Google Patents
4d打印电响应折叠展开复合材料、制造及其形状记忆行为的调控方法 Download PDFInfo
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Definitions
- Step 2 Spraying of the electric heating layer:
- the 4D printing electric response shape memory folding unfolded composite material of the present invention is composed of a base layer, an electric heating layer and a wire, the electric heating layer is n layers, and the base layer is n+1 layers, wherein, n is a positive value greater than or equal to 2 Integer.
- the thickness of the single-layer electrothermal layer is 30-50 ⁇ m, and the single-layer thickness of the base layer is 3-5 mm.
- the base layer material is one of epoxy shape memory polymer, polyurethane shape memory polymer, styrene shape memory polymer or polyimide shape memory polymer.
- the metal nanowire dispersion liquid is a mixture of one or more of silver nanowires, aluminum oxide nanowires, and zinc oxide nanowires.
- the electrothermal layers can also be arranged in other layouts to meet more complex deformation and deformation rate requirements, that is, the electrothermal layers located on the same layer can be patterned and distributed uniformly in multiple regions, or can be distributed in different patterns. Layer thickness distribution, and at the same time it is necessary to ensure the connectivity of the conductive layers in each region in the same layer.
- the conductive layers of different layers are stacked and distributed in multiple planes, and the conductive layers are separated from each other. .
- the 4D printed electrically responsive shape memory foldable unfolded composite material can be fabricated by photocuring printing, fused deposition printing or inkjet printing. Specifically, it includes the following steps:
- Step 3 Laser irradiation nano fusion welding method to treat the electrothermal layer
- Step 4 Encapsulate the Wires 7
- Step 2 Spraying of the first electrothermal layer 6
- Step 4 Encapsulate the Wires 7
- the shape recovery degree of the precise control structure is 80% and the recovery is stopped.
- the recovery speed of the structure gradually increases. After reaching the medium speed, the speed remains unchanged.
- deceleration braking is performed.
Abstract
一种4D打印电响应折叠展开复合材料、制造及其形状记忆行为的调控方法。在逐层打印过程中,通过喷涂、激光辐照纳米熔焊法处理的方式将导电层嵌入预先设计的形状记忆聚合物基体内,制造可实现电响应形状记忆行为的折叠展开结构。同时,通过对通电电热层数目以及通电电压大小的调整,控制电响应形状记忆折叠展开结构内热影响区的分布及范围,结构回复力F 回与阻碍回复的力F 阻之间的竞争关系,从而实现对结构形状回复速度以及形状回复程度的调控。该复合材料具有在大弯曲变形下,电热层电致生热性能稳定,且结构形状回复速度可调,形状回复程度可精确控制等突出特点。
Description
本发明属于4D打印技术领域,尤其涉及到一种4D打印电响应折叠展开复合材料、制造及其形状记忆行为的调控方法。
4D打印是通过智能材料和智能结构的增材制造技术,实现构件的形状、性能或功能在时间和空间维度上的可控,满足变形、变性和变功能的应用需求,实现材料—结构—功能一体化制造的新技术。然而,目前的4D打印研究都集中在了热响应形状记忆材料的打印上,由于打印出的结构在环境中整体受热,很难实现形状记忆行为的可控(比如形状回复程度、速度的调控),还达不到变性和变功能的应用需求。
电响应形状记忆材料以嵌入体内的电热层产生的焦耳热为激励源,具有可低电压响应、可远程驱动、易于改变体内热场分布的特点,在实现4D打印结构与变性、变功能方面具有巨大的应用潜力。
如中国发明专利申请CN110962161A提出了一种4D打印可编程化控制电致加热、能按预定的变形顺序和变形路线变形的阶段变形执行装置,为实现顺序变形智能材料/结构的4D打印提供了可以借鉴的方法。该发明专利申请虽然解决了4D打印电响应形状记忆材料领域的一些技术问题,但对于形状记忆行为的调控问题并没有提出解决方法,如形状回复程度、形状回复速度;而形状记忆行为的可控对于4D打印实现功能应用具有重要的意义,比如精确控制4D打印结构形状回复程度至特定百分比时结构停止回复,又比如结构在形状回复过程中可以实现变速回复。
同时,4D打印电响应形状记忆结构还存在着电热层与形状记聚合物基体层之间粘附性差的问题,结构弯曲时,电热层易断裂、脱落,严重影响电热性能,进而影响到结构的电响应形状记忆性能。中国发明专利申请CN109228302A提出了一种基于3D打印的电驱动形状记忆聚合物片层及其制备方法,并通过预拉伸基体材料,使打印的电热层在屈曲行为的作用下呈S形,解决了电热层易脱落 的问题,但该方法存在制造工艺繁琐,且需根据加热基点的形状调整拉伸方案的问题,不利于结构的快速便捷制造。
发明内容
针对现有技术中存在的问题与不足,本发明提出一种4D打印电响应形状记忆折叠展开材料、制造方法,以解决金属电热层与形状记忆聚合物基体之间结合性能差的问题,实现电热层在基体中的嵌入式分布,并提高结构在高弯曲程度下的电致生热性能的稳定性;同时提出该4D打印电响应折叠展开复合材料形状记忆行为的调控方法,以调控形状回复程度与形状回复速度,通过调节通电电热层数目、同层电热层中不同区域的厚度以及通电电压大小等参数,可实现结构在通电条件下形状回复的精确停止与再回复以及形状回复过程中速度的调节。
为了达到上述目的,本发明采用如下技术方案:
一种4D打印电响应折叠展开复合材料,其特征在于:包括多层具有形状记忆效应的基体层及具有电致生热能力的电热层,所述基体层与电热层间隔层叠设置、且位于最外层的两层均为基体层,电热层镶嵌在基体层一面的凹槽内、且与外部导线相连,相邻两层基体层之间通过均匀分布于凹槽内的凸台连接,所述凸台与基体层同一材质、且连接为一体。
进一步地,位于同一层的电热层可以在多个区域呈图案化均匀分布,也可以呈不同层厚分布,且需要保证同层中各区域导电层的连通性。不同层的导电层在多个平面内层叠分布,且各导电层间彼此分离。
进一步地,电热层中金属纳米线之间通过激光熔焊粘连在一起,且电热层与基体层之间也通过激光辐照来提高结合性能。
进一步地,单层电热层的层厚为10~50μm,单层基体层的层厚为1~5mm。
进一步地,所述基体层的材质为环氧类形状记忆聚合物、聚氨酯类形状记忆聚合物、苯乙烯类形状记忆聚合物或聚酰亚胺类形状记忆聚合物。
进一步地,凸台在凹槽中呈阵列分布,其总面积占比为凹槽面积的10~20%。
所述4D打印电响应折叠展开复合材料的制造方法,其特征在于:包括以下步骤:
步骤一:基体层的打印成形:
通过3D技术在打印平台上打印基体层,所述基体层上表面打印有凹槽与导线槽,所述凹槽内具有上表面与基体层上表面共平面的凸台;
步骤二:电热层的喷涂:
将贴膜贴合在基体层的上表面,与凸台的表面上,遮挡基体层和凸台的表面、露出凹槽;然后向凹槽中喷涂金属纳米线分散液,当待到自然干燥的金属纳米线能够填满凹槽时停止喷涂,撕下贴膜,干燥的金属纳米线在底层上部形成电热层;
步骤三:激光辐照纳米熔焊法处理电热层:
使用激光光束对电热层进行照射,通过纳米熔焊使电热层中的金属纳米线之间熔焊在一起;
步骤四:封装导线:
将正负极导线放入导线槽,用导电胶将导线与电热层连接;
步骤五:打印下一层基体层:
将步骤四处理过的基体层与电热层的结合体连同打印平台一同放置在3D打印机上,直接在基体层、电热层上表面打印中间基体层,刚打印的中间基体层与基体层的上表面、凸台结合、并将电热层包裹在两层之间;
步骤六:重复步骤二、步骤三、步骤四、步骤五,打印、制造后续的基体层与电热层,顶层基体层的上表面为平面。
进一步地,打印方式为光固化打印、熔融沉积打印或喷墨打印。
进一步地,所述金属纳米线分散液为银纳米线分散液、氧化铝纳米线分散液或氧化锌纳米线分散液。
进一步地,步骤三中采用的激光能量密度为30~60mJ/cm
2J/cm
2,照射区域光束停留时间为5~10ms,光斑直径为4mm。
进一步地,同一基体层中凹槽的深度根据喷涂在其中的电热层厚度确定。
所述4D打印电响应折叠展开复合材料形状记忆行为的调控方法,其特征在于:根据基体内的多层电热层将结构分为多个热影响区,每层电热层在通电后都会产生各自的热影响区,通过对通电电热层数目、同层电热层中不同区域的厚度以及通电电压大小的控制,实现电响应形状记忆折叠展开结构内热影响区分布以及范围的控制,根据形状回复力F回、阻碍形状回复的力F阻的相对大小关系调控变形速度和形状回复的程度;或者通过实时、分时间段的调控电热层的通电 层数及通电电压的大小,实现一个完整变形过程中不同时间段内以不同的变形速度完成变形。
本发明具有如下优点:
1.采用金属纳米线作为电热层,能保证结构在大变形弯曲的情况下,纳米线之间仍能保持良好的接触,确保电热层电致生热性能的稳定性。
2.采用激光辐照纳米熔焊法处理电热层,使金属纳米线结点熔融,改善了金属纳米线之间接触性能,提高了电热层导电性能以及电致生热性能,同时在金属纳米线与底层基体层之间的界面处提供加热、烧结,提高了电热层与底层基体层的结合性能。
3.基体层中部区域通过凸台连接,一方面能够钉扎金属纳米线,使电热层得以嵌入基体;另一方面能够防止基体层之间、基体层与电热层之间的分离和脱附。
4.通过调整电热层通电层数及可实现4D打印电响应折叠展开结构在通电条件下形状回复速度的三档调速以及在每个档位内速度的微调。
5.采用先增速再减速或先增速再匀速后减速两种策略,实现了对结构形状回复程度的精确控制。
图1是电响应折叠展开结构4D打印制造流程图。
图2是基体层单层(顶层基体层除外)的轴测图。
图3是对底层基体层上部喷涂完金属纳米线分散液后的局部放大图。
图4是电响应折叠展开结构制造完毕后的三维透视图。
图5是4D打印电响应折叠展开结构形状记忆行为的调控原理图。
其中:1-底层基体层,2-打印平台,3-喷枪,4-金属纳米线分散液,5-激光束,6-第一电热层,7-导线,8-第二基体层,9-第三基体层,10-顶层基体层,11-图案化凹槽,12-凸台,13-基体层上表面,14-导线槽,15-贴膜,16-直流稳压可调电源,17-第二电热层,18-第三电热层。
下面结合附图与实施例进一步说明本发明的技术方案。
本发明所述的4D打印电响应形状记忆折叠展开复合材料,其由基体层、电热层和导线构成,电热层为n层,基体层为n+1层,其中,n为大于等于2的正 整数。单层电热层层厚为30~50μm,基体层单层层厚为3~5mm。基体层材料为环氧类形状记忆聚合物、聚氨酯类形状记忆聚合物、苯乙烯类形状记忆聚合物或聚酰亚胺类形状记忆聚合物中的一种。金属纳米线分散液为银纳米线、氧化铝纳米线、氧化锌纳米线中的一种或多种的混合物。
所述基体层与电热层间隔层叠设置、且位于最外层的两层均为基体层。电热层镶嵌在基体层一面的凹槽内、且与外部导线相连,相邻两层基体层之间通过均匀分布于凹槽内的凸台12连接,所述凸台12与基体层同一材质、且连接为一体。
在该结构中,底层基体层1、第一基体层8、第二基体层9的结构相同,其上表面13具有有凹槽11与导线槽14,所述凹槽11内具有上表面与基体层上表面共平面的凸台12。
凸台12与底层基体层1、第一基体层8、第二基体层9为同一实体,经过3D打印一步成形,且凸台12表面与基体层上表面13共面,凸台12在凹槽11中阵列分布,其总面积占比约为凹槽11面积的10~20%,前一基体层的凸台12起到连接、钉扎后一基体层的作用,使得电热层6、17、18得以嵌入基体。并且,第二基体层8、第三基体层9具有与底层基体层1相同的尺寸、结构,第一电热层19、第二电热层18、第三电热层17三者具有相同的尺寸、结构,顶层基体层10上表面为平面,不具有凹槽11、导线槽14、凸台12。
另外,所述电热层还可以以其他的布局方式设置,以适应更复杂的变形及形变速率速率的要求,即位于同一层的电热层可以在多个区域呈图案化均匀分布,也可以呈不同层厚分布,同时需要保证同层中各区域导电层的连通性。不同层的导电层在多个平面内层叠分布,且各导电层间彼此分离。。
所述的4D打印电响应形状记忆折叠展开复合材料可以通过光固化打印、熔融沉积打印或喷墨打印的方式制成。具体的包括以下步骤:
步骤一:底层基体层1的打印成形
在打印平台2上打印底层基体层1,所述底层基体层1上表面13打印有图案化凹槽11与导线槽14,所述凹槽11内具有上表面与底部基体层1上表面共平面的凸台12。
步骤二:电热层的喷涂
底层基体层1打印完毕后,打印暂停,将底层基体层1连同打印平台2一同 取出,擦拭完表面残留的材料后,将贴膜15贴合在底层基体层上表面13与凸台12的表面上,起到遮挡表面、露出凹槽11的作用。然后对底层上部使用喷枪3喷涂金属纳米线分散液4,待到自然干燥的金属纳米线填满凹槽11时停止喷涂,撕下贴膜15,干燥的金属纳米线在底层上部形成电热层。
步骤三:激光辐照纳米熔焊法处理电热层
使用激光光束5对电热层进行照射,使金属纳米线结点熔融,改善金属纳米线之间的接触性能以提高电热层的导电性能,同时在金属纳米线与底层基体层1之间的界面处提供加热、烧结,提高电热层与底层基体层1的结合性能。其中,激光能量为30~60mJ/cm
2,照射区域光束停留时间为5~10ms,光斑直径为4mm。
步骤四:封装导线7
将正负极导线7放入导线槽14,用导电胶将导线7与电热层连接,导电胶干燥后再进行下一步。
步骤五:继续打印中间基体层
将经过喷涂和激光辐照纳米熔焊处理的底层基体层1与电热层的结合体连同打印平台2一同放置在打印机原来的打印位置上,中间基体层将直接在底层基体层上表面13与凸台12表面上继续打印。
步骤六:重复步骤二、步骤三、步骤四、步骤五,打印、制造第三基体层9与电热层,结构的最后一层为顶层基体层10。
所述4D打印电响应折叠展开复合材料的形状记忆行为的调控原理与方法如下:
根据基体内的三层电热层将结构分为三个热影响区,每层电热层在通电后都会产生各自的热影响区,通过对通电电热层数目以及通电电压大小的控制,实现电响应折叠展开结构内热影响区分布以及范围的控制。热影响区范围内的材料因为达到了玻璃化转变温度或熔融温度从而产生形状回复,具有形状回复力F
回,不在热影响区或在热影响区内但未达到玻璃化转变温度或熔融温度的部分则不会产生形状回复,具有阻碍形状回复的力F
阻。利用对结构内热影响区分布以及范围的控制实现结构中F
回与F
阻竞争关系的调整,从而实现对结构形状回复速度以及形状回复程度的控制。
结构的形状回复速度可分为三档,三档分别为低速档、中速档和全速档。当 仅有一层电热层通电时,结构产生的回复力F
回略大于F
阻,结构形状缓慢回复,此时速度为低速;当有两层电热层通电时,F
回进一步增大,而F
阻进一步减小,此时结构形状回复速度为中速;当三层电热层全部通电时,结构整体都处于热影响区内,F
回达到最大,而F
阻可以忽略不计,此时结构形状回复速度为全速。处在某个档位的形状回复速度,还可以通过改变通电电压的大小进行微调。对结构形状回复程度的精确控制需要制定、采取合理的形状回复速度控制策略,一般采用先增速再减速或先增速再匀速后减速两种策略,先增速再减速适用于需要的形状回复程度<50%的情况,先增速再匀速后减速适用于需要的形状回复程度≥50%的情况。
实施例一
本实施例中,基体材料采用聚氨酯类形状记忆聚合物光固化树脂,金属纳米线分散液采用银纳米线分散液,浓度为5mg/ml,分散剂为异丙醇;打印方式采用光固化打印,电热层单层层厚为30μm,基体层单层层厚为3mm,数字模型的单层切片层厚为30μm,结构整体为块状结构,外形尺寸为150mm×15mm×12mm,打印制造步骤如下:
步骤一:底层基体层1的打印成形
底层基体层1在打印平台2上打印成形,且底层上表面13打印有图案化凹槽11、导线槽14与凸台12,凸台12表面与基体层上表面13共面,且凸台12在凹槽11中阵列分布,其总面积占比为凹槽11面积的15%,凹槽的深度均为50μm
步骤二:第一电热层6的喷涂
底层基体层1打印完毕后,打印暂停,将底层基体层1连同打印平台2一同取出,擦拭完表面残留的光固化树脂后,将贴膜15贴合在底层基体层上表面13与凸台12的表面上,起到遮挡表面、露出凹槽11的作用。然后对底层上部使用喷枪3喷涂银纳米线分散液4,待到自然干燥的银纳米线填满凹槽11时停止喷涂,撕下贴膜15,干燥的银纳米线在底层上部形成第一电热层6。
步骤三:激光辐照纳米熔焊法处理第一电热层6
使用大功率激光光束5对电热层进行照射,使银纳米线结点熔融,改善银纳米线之间接触性能以提高第一电热层6的导电性能,同时在银纳米线与底层基体 层1之间的界面处提供加热、烧结,提高第一电热层6与底层基体层1的粘附性。其中,激光能量为30mJ/cm
2,照射区域光束停留时间为10ms,光斑直径4mm。
步骤四:封装导线7
将正负极导线7放入导线槽14,用导电胶将导线7与第一电热层6连接,待导电胶干燥后再进行下一步。
步骤五:继续打印第二基体层8
将经过喷涂和激光辐照纳米熔焊处理的底层基体层1与第一电热层6的结合体连同打印平台2一同放置在打印机原来的打印位置上,第二基体层8将直接在底层基体层上表面13与凸台12表面上继续打印,其中,凸台12起到连接、钉扎后一基体层的作用,使电热层6得以嵌入基体。
步骤六:重复步骤二、步骤三、步骤四、步骤五的打印方式,打印、制造后续的第二电热层17、第三基体层9与第三电热层18,结构的最后一层为顶层基体层10。第二基体层8、第三基体层9具有与底层基体层1相同的尺寸、结构,第一电热层19、第二电热层18、第三电热层17三者具有相同的尺寸、结构,顶层基体层10为方块结构,不具有凹槽11、导线槽14、凸台12。
结构形状回复速度的控制方法如下:
首先,将直流稳压可调电源的三组接口分别接入第一电热层6、第二电热层17、第三电热层18的导线7,三组接口的输入电压均为3V,结构整体处于熔融温度以上,对结构进行外力赋型,赋型呈“U”形后断电,保持外力作用5分钟,当结构整体降低到熔融温度以下时,撤去外力,结构固定呈“U”形不变。
然后,进行低速形状回复。将一组接口接入第三电热层18的导线7,输入电压为3V,第三电热层产生的焦耳热影响区覆盖了顶层基体层10和第三基体层9,其中达到熔融温度的部分开始产生形状回复力F
回,而未处于第三电热层18产生的焦耳热影响区范围内以及处于但未达到熔融温度以上的部分则保持着弯曲形状不变,故对形状回复具有阻碍作用力F
阻。输入电压为3V时,F
回略大于F
阻,结构整体进行低速形状回复,调整输入电压的大小,可对结构的形状回复速度进行微调;
进行中速形状回复。将两组接口分别接入第二电热层17、第三电热层18的导线7,输入电压均为3V,第二电热层17、第三电热层18产生的焦耳热影响 区覆盖了顶层基体层10、第三基体层9和第二基体层8,其中达到熔融温度的部分开始产生形状回复力F
回,而未处于第二电热层17、第三电热层18产生的焦耳热影响区范围内以及处于但未达到熔融温度以上的部分则保持着弯曲形状不变,对形状回复具有阻碍作用力F
阻。输入电压均为3V时,F
回大于F
阻,结构整体进行中速形状回复,调整输入电压的大小,可对结构的形状回复速度进行微调;
进行全速形状回复。将三组接口分别接入第一电热层6、第二电热层17和第三电热层18的导线7,输入电压均为3V,第一电热层6、第二电热层17和第三电热层18产生的焦耳热影响区覆盖了整个结构,结构整体产生形状回复力F
回,未达到熔融温度以上部分所具有的F
阻可以忽略不计。输入电压均为3V时,结构整体进行全速形状回复,调整输入电压的大小,可对结构的形状回复速度进行微调。
结构形状回复程度的精确控制方法如下:
精确控制结构的形状回复程度为40%时停止回复。采取先增速后减速的速度控制策略,将直流稳压可调电源上的一组接口接入第三电热层18的导线7,输入电压从0V开始缓慢增加,第三电热层18产生的焦耳热缓慢对顶层基体层10和第三基体层9进行加热,结构产生的F
回也逐渐追赶并超过F
阻,形状回复速度在增加,当输入电压达到3V时,回复速度达到最大,随即减小电压,回复速度逐渐降低,控制电压减小的速率,确保结构的形状回复程度为40%时,F
阻≥F
回,形状回复速度为零,结构固定,不再回复;
精确控制结构的形状回复程度为80%时停止回复。采取先增速再匀速后减速的速度控制策略,将直流稳压可调电源上的两组接口分别接入第二电热层17和第三电热层18的导线7,两组接口的输入电压均同时由0V增加到3V,结构回复速度逐渐增加,达到中速档后保持速度不变,当回复程度超过60%时,进行减速制动,首先将第二电热层17的输入电压迅速减小到0V,结构回复速度降低至低速档,然后逐渐减小第三电热层18的输入电压,控制电压减小的速率,确保结构的形状回复程度为80%时,F
阻≥F
回,形状回复速度为零,结构固定,不再回复。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明 的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (9)
- 一种4D打印电响应折叠展开复合材料,其特征在于:包括多层具有形状记忆效应的基体层及具有电致生热能力的电热层,所述基体层与电热层间隔层叠设置、且位于最外层的两层均为基体层,电热层镶嵌在基体层一面的凹槽内、且与外部导线相连,相邻两层基体层之间通过均匀分布于凹槽内的凸台(12)连接,所述凸台(12)与基体层同一材质、且连接为一体;所述电热层中金属纳米线之间通过激光熔焊粘连在一起,且电热层与基体层之间也通过激光辐照来提高结合性能。
- 根据权利要求1所述的复合材料,其特征在于:位于同一层的电热层在多个区域分离开来分布,和/或,不同层的电热层的在多个区域分离且错列或层叠分布。
- 根据权利要求2所述的复合材料,其特征在于:单层电热层的层厚为10~50μm,单层基体层的层厚为1~5mm。
- 如权利要求2所述的复合材料,其特征在于:同一层不同区域的或不同层的电热层厚度不同。
- 根据权利要求1或2所述的复合材料,其特征在于:所述基体层的材质为环氧类形状记忆聚合物、聚氨酯类形状记忆聚合物、苯乙烯类形状记忆聚合物或聚酰亚胺类形状记忆聚合物;所述金属纳米线为银纳米线、氧化铝纳米线、氧化锌纳米线中的一种或多种的混合物。
- 根据权利要求1或2所述的复合材料,其特征在于:凸台(12)在凹槽(11)中呈阵列分布,其总面积占比为凹槽面积的10~20%。
- 权利要求1-6任一项所述4D打印电响应折叠展开复合材料的制造方法,其特征在于:包括以下步骤:步骤一:底层基体层(1)的打印成形:通过3D技术在打印平台(2)上打印底层基体层(1),所述底层基体层(1)上表面(13)打印有凹槽(11)与导线槽(14),所述凹槽(11)内具有上表面与底部基体层(1)上表面共平面的凸台(12);步骤二:电热层(6)的喷涂:将贴膜(15)贴合在底层基体层(1)的上表面(13),与凸台(12)的表面上,遮挡底层基体层(1)和凸台(12)的表面、露出凹槽(11);然后向凹槽(11)中喷涂金属纳米线分散液(4),当待到自然干燥的金属纳米线能够填满凹槽(11)时停止喷涂,撕下贴膜(15),干燥的金属纳米线在底层上部形成电热层;步骤三:激光辐照纳米熔焊法处理电热层:使用激光光束(5)对电热层进行照射,通过纳米熔焊使电热层中的金属纳米线之间熔焊在一起;步骤四:封装导线(7):将正负极导线(7)放入导线槽(14),用导电胶将导线(7)与电热层连接;步骤五:打印中间基体层(8、9):将步骤四处理过的基体层(1)与电热层(6)的结合体连同打印平台(2)一同放置在3D打印机上,直接在底层基体层(1)、电热层(6)上表面打印中间基体层(8、9),刚打印的中间基体层(8、9)与底层基体层(1)或中间基体层(8、9)的上表面(13)、凸台(12)结合、并将电热层包裹在两层之间;中间基体层(8、9)的结构与底层基体层(1)的结构相同;步骤六:重复步骤二、步骤三、步骤四、步骤五,打印、制造后续的基体层与电热层,顶层基体层(10)的上表面为平面。
- 如权利要求7所述的制造方法,其特征在于:打印方式为光固化打印、熔融沉积打印或喷墨打印;步骤三中采用的激光能量密度为30~60mJ/cm 2,照射区域光束停留时间为5~10ms,光斑直径为4mm。
- 权利要求1-6任一项所述4D打印电响应折叠展开复合材料的形状记忆行为的调控方法,其特征在于:根据基体内的多层电热层将结构分为多个热影响区,每层电热层在通电后都会产生各自的热影响区,通过对通电电热层数目、同层电热层中不同区域的厚度以及通电电压大小的控制,实现电响应形状记忆折叠展开结构内热影响区分布以及范围的控制,根据形状回复力F 回、阻碍形状回复的力F 阻的相对大小关系调控变形速度和形状回复的程度;或者通过实时、分时间段的调控电热层的通电层数及通电电压的大小,实现一个完整变形过程中不同时间段内以不同的变形速度完成变形。
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