WO2022085516A1 - コンデンサの製造方法 - Google Patents

コンデンサの製造方法 Download PDF

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Publication number
WO2022085516A1
WO2022085516A1 PCT/JP2021/037710 JP2021037710W WO2022085516A1 WO 2022085516 A1 WO2022085516 A1 WO 2022085516A1 JP 2021037710 W JP2021037710 W JP 2021037710W WO 2022085516 A1 WO2022085516 A1 WO 2022085516A1
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WIPO (PCT)
Prior art keywords
bus bar
mold
electrode
capacitor
capacitor element
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Application number
PCT/JP2021/037710
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English (en)
French (fr)
Japanese (ja)
Inventor
雄太 野々垣
崇史 奥戸
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2022557001A priority Critical patent/JP7710200B2/ja
Publication of WO2022085516A1 publication Critical patent/WO2022085516A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

Definitions

  • the present disclosure relates to a method for manufacturing a capacitor in general, and more particularly to a method for manufacturing a capacitor using a capacitor element and a mold.
  • Patent Document 1 discloses a dry metallised film capacitor.
  • This dry metallized film capacitor is formed by accommodating a capacitor element in a resin case, filling it with a thermosetting resin, and curing it.
  • the above-mentioned capacitor element is formed by stacking and winding a single metallized film, spraying metallicon metal on both end faces to form an electrode lead-out portion, and joining an external lead-out wire to the electrode lead-out portion. There is.
  • the external leader wire has a key shape that bends toward the capacitor element, and a support plate is inserted into the L-shaped portion of the external leader wire, and the external leader wire is housed and fixed in the resin case. ing. As a result, the lead pitch is unified regardless of the size of the element width of the capacitor element.
  • An object of the present disclosure is to provide a method for manufacturing a capacitor, which can easily make the pitch between bus bars constant even if the dimensions between electrodes of the capacitor element vary.
  • the method for manufacturing a capacitor uses a capacitor element and a mold.
  • the capacitor element includes a first electrode, a second electrode provided on the opposite side of the first electrode, a first bus bar connected to the first electrode, and a second bus bar connected to the second electrode. And have.
  • the mold is provided in a cavity accommodating the capacitor element, a first fitting hole provided on the inner surface of the cavity and into which the first bus bar is fitted, and a second bus bar provided on the inner surface of the cavity. Has a second fitting hole into which the is fitted. The first bus bar is fitted into the first fitting hole, the second bus bar is fitted into the second fitting hole, and the capacitor element is held away from the inner surface of the cavity. Resin is injected and filled in the space between the capacitor element and the inner surface of the cavity.
  • the pitch between the bus bars can be easily made constant.
  • FIG. 1 is a perspective view (partially perspective view) showing one step of the capacitor manufacturing method according to the embodiment of the present disclosure.
  • FIG. 2A is a perspective view showing a capacitor element.
  • FIG. 2B is a perspective view showing a capacitor.
  • FIG. 3 is a perspective view showing one step of the above-mentioned capacitor manufacturing method.
  • FIG. 4 is a perspective view showing one step of the above-mentioned capacitor manufacturing method.
  • FIG. 5 is a perspective view showing one step of the above-mentioned capacitor manufacturing method.
  • FIG. 6A is a schematic cross-sectional view showing a main part of the capacitor element.
  • FIG. 6B is a schematic cross-sectional view showing a main part of the capacitor element held by the holding metal fitting.
  • the capacitor element 2 has a first electrode 41, a second electrode 42, a first bus bar 51, and a second bus bar 52.
  • the mold 3 has a cavity 6, a first fitting hole 71, and a second fitting hole 72.
  • the cavity 6 accommodates the capacitor element 2.
  • the first fitting hole 71 and the second fitting hole 72 are provided on the inner surface of the cavity 6.
  • the first bus bar 51 of the capacitor element 2 is fitted into the first fitting hole 71 of the mold 3.
  • the second bus bar 52 of the capacitor element 2 is fitted into the second fitting hole 72 of the mold 3.
  • the capacitor element 2 is held away from the inner surface of the cavity 6.
  • the resin is injected and filled in the space between the capacitor element 2 and the inner surface of the cavity 6 from the injection port 325.
  • a capacitor 1 in which the capacitor element 2 is sealed by the sealing portion 10 is obtained (see FIG. 2B).
  • the first bus bar 51 is fitted into the first fitting hole 71
  • the second bus bar 52 is fitted into the second fitting hole 72.
  • the distance between the first fitting hole 71 and the second fitting hole 72 is equal to the bus bar-to-busbar pitch BP required for the capacitor 1 (see FIG. 6B). Therefore, even if there is a variation in the pitch bp between the bus bars of the capacitor element 2 before sealing (see FIG. 6A), this variation allows the first bus bar 51 to be fitted into the first fitting hole 71 and the second bus bar 52. Is reduced by fitting in the second fitting hole 72. That is, the pitch bp between the bus bars can be corrected by the first fitting hole 71 and the second fitting hole 72.
  • the connecting portion between the first bus bar 51 and the first electrode 41 and the connecting portion between the second bus bar 52 and the second electrode 42 are solidified by the sealing portion 10 (see FIG. 2B).
  • the first bus bar 51 and the second bus bar 52 are held at appropriate positions even after the capacitor 1 is formed. That is, the bus-bar-to-busbar pitch bp is within the allowable range of the bus-bar-to-busbar pitch BP.
  • the length of the shoulder of the external leader wire must be adjusted for each capacitor element, or a support plate in which the hole pitch is set for each capacitor element must be prepared. There is no need for complicated work such as not becoming.
  • the pitch bp between the bus bars is easily constant (pitch BP between the bus bars). Can be.
  • a capacitor element 2 and a mold 3 are used.
  • the capacitor element 2 will be described first.
  • the capacitor 1 obtained by using the capacitor element 2 will be described.
  • the mold 3 used for manufacturing the capacitor 1 will be described. After that, a method of manufacturing the capacitor 1 using the capacitor element 2 and the mold 3 will be described.
  • FIG. 2A shows the capacitor element 2.
  • the capacitor element 2 is formed by stacking two metallized films on which a metal such as aluminum is vapor-deposited on a dielectric film, winding the metallized film thus laminated, and pressing them in a flat shape (in FIG. 2A, in the front-rear direction). It is formed by pressing).
  • the shape of the cross section (cross section seen from the left-right direction) of the capacitor element 2 is a rectangle with rounded corners.
  • the capacitor element 2 has a pillar shape extending in the left-right direction.
  • the capacitor element 2 has a first electrode 41, a second electrode 42, a first bus bar 51, and a second bus bar 52.
  • the capacitor element 2 further includes an elastic conductor member 9.
  • the first electrode 41 is provided in a layer on the left end surface of the capacitor element 2.
  • the first electrode 41 is made of a metal such as zinc by, for example, a metallikon (metal spraying method).
  • the second electrode 42 is provided on the opposite side of the first electrode 41. That is, the second electrode 42 is provided in a layer on the right end surface of the capacitor element 2. The second electrode 42 is also formed in the same manner as the first electrode 41.
  • the inter-electrode dimension L is defined by the length between the surface facing the left side of the first electrode 41 and the surface facing the right side of the second electrode 42 in the left-right direction. ..
  • the inter-electrode dimension L of these capacitor elements 2 may vary.
  • the first bus bar 51 is connected to the first electrode 41.
  • the first bus bar 51 is connected to the first electrode 41 via the elastic conductor member 9.
  • the first bus bar 51 projects upward from the capacitor element 2.
  • the first bus bar 51 is a conductor member.
  • the material of the first bus bar 51 is not particularly limited as long as it is a conductive material, and includes, for example, copper and a copper alloy.
  • the first bus bar 51 has a main body portion 511 and a protruding portion 512.
  • the main body portion 511 is connected to the elastic conductor member 9.
  • the main body portion 511 is a plate-shaped member extending in the vertical direction.
  • the main body portion 511 is arranged substantially parallel to the surface of the first electrode 41 facing the left side.
  • the protruding portion 512 protrudes to the right from the front side of the upper part of the main body portion 511.
  • the protruding portion 512 has a flat plate shape orthogonal to the main body portion 511.
  • the elastic conductor member 9 is interposed between the first electrode 41 and the first bus bar 51.
  • the elastic conductor member 9 is not particularly limited, and examples thereof include a leaf spring (thin leaf spring) and the like.
  • the elastic conductor member 9 can be formed, for example, by bending one elongated thin plate.
  • the elastic conductor member 9 has a first plane portion 91, a second plane portion 92, and an inclined surface portion 93.
  • the first flat surface portion 91 is a plate-shaped member that is one size smaller than the main body portion 511 of the first bus bar 51 and extends in the vertical direction.
  • the first plane portion 91 is connected to the first bus bar 51.
  • the upper end portion of the first flat surface portion 91 and the lower end portion of the main body portion 511 of the first bus bar 51 are connected to each other.
  • the connection between the first flat surface portion 91 and the first bus bar 51 is performed by welding or the like.
  • the welding includes, for example, laser welding and ultrasonic welding.
  • the second flat surface portion 92 has almost the same shape as the first flat surface portion 91.
  • the second plane portion 92 is located below and to the right of the first plane portion 91, and is arranged in parallel with the first plane portion 91.
  • the second plane portion 92 is directly connected to the first electrode 41.
  • the connection between the second flat surface portion 92 and the first electrode 41 is also performed by welding or the like.
  • the inclined surface portion 93 is a portion connecting the first flat surface portion 91 and the second flat surface portion 92.
  • the inclined surface portion 93 is inclined from the lower end of the first flat surface portion 91 toward the lower right, and reaches the upper end of the second flat surface portion 92.
  • the elastic conductor member 9 is a conductor member that can be elastically deformed in the direction (left-right direction) connecting the first electrode 41 and the second electrode 42.
  • the elastic conductor member 9 is elastically deformed, so that the first bus bar 51 moves to the right from the original position.
  • the elastic conductor member 9 is elastically deformed, so that the first bus bar 51 moves to the left from the original position.
  • the elastic conductor member 9 since the elastic conductor member 9 has conductivity, the first electrode 41 and the first bus bar 51 are electrically connected via the elastic conductor member 9.
  • the second bus bar 52 is connected to the second electrode 42.
  • the second electrode 42 and the second bus bar 52 are directly connected to each other.
  • the second bus bar 52 is also a conductor member like the first bus bar 51.
  • the second electrode 42 and the second bus bar 52 are electrically connected to each other.
  • the second bus bar 52 projects in the same direction (upward) as the first bus bar 51.
  • the second bus bar 52 has a main body portion 521 and a protruding portion 522.
  • the main body portion 521 is directly connected to the second electrode 42.
  • the main body portion 521 is a plate-shaped member extending in the vertical direction.
  • the main body portion 521 is arranged substantially parallel to the surface of the second electrode 42 facing the right side.
  • the protruding portion 522 protrudes to the left from the front side of the upper part of the main body portion 521.
  • the protruding portion 522 has a flat plate shape orthogonal to the main body portion 521.
  • the main body 511 of the first bus bar 51 and the main body 521 of the second bus bar 52 face each other.
  • the main body portion 511 of the first bus bar 51 and the main body portion 521 of the second bus bar 52 are arranged substantially in parallel.
  • the protruding portion 512 of the first bus bar 51 and the protruding portion 522 of the second bus bar 52 are arranged in the same plane extending in the vertical direction and the horizontal direction. In the vertical direction, the position of the protruding portion 512 of the first bus bar 51 and the position of the protruding portion 522 of the second bus bar 52 are the same. In particular, the positions of the lower end edges of the protrusions 512 and 522 are the same.
  • the pitch bp between the bus bars is the center of the thickness of the main body portion 511 of the first bus bar 51 and the center of the thickness of the main body portion 521 of the second bus bar 52 in the left-right direction. Specified by the length between.
  • the pitch bp between bus bars required for the capacitor 1 is referred to as "pitch BP between bus bars”. That is, the pitch BP between bus bars is a reference value.
  • the pitch BP between bus bars is a reference value.
  • the inter-busbar pitch bp is required to be within the permissible range of the inter-busbar pitch BP, but in general, the inter-busbar pitch bp may be out of the permissible range of the inter-busbar pitch BP. As will be described later, according to the present embodiment, it is possible to easily keep the bus-bar-to-busbar pitch bp within the permissible range of the bus-bar-to-busbar pitch BP. Tolerances are set appropriately.
  • FIG. 2B shows the capacitor 1.
  • the capacitor 1 is obtained by using the above-mentioned capacitor element 2.
  • the capacitor 1 is a so-called caseless capacitor. That is, the capacitor 1 does not require a case such as the resin case described in Patent Document 1. Therefore, it is possible to reduce the weight by at least the absence of the case.
  • the sealing portion 10 is a cured product of a resin such as a thermosetting resin.
  • the outer shape of the sealing portion 10 has a rectangular parallelepiped shape.
  • the first bus bar 51 (a part of the main body portion 511 and the protruding portion 512) and the second bus bar 52 (a part of the main body portion 521 and the protruding portion 522) project in the same direction (upward) from the sealing portion 10.
  • the mold 3 used for manufacturing the capacitor 1 will be described.
  • 1 and 5 show the mold 3.
  • the mold 3 has a cavity 6 (see FIG. 1).
  • the cavity 6 is formed at the time of mold clamping.
  • the cavity 6 is a space for accommodating the capacitor element 2.
  • the shape of the cavity 6 is the same as the outer shape of the sealing portion 10 of the capacitor 1. That is, in the present embodiment, the cavity 6 is a space having a rectangular parallelepiped shape.
  • the cavity 6 In a state where the capacitor element 2 is housed in the cavity 6, there is a gap between the outer surface of the capacitor element 2 and the inner surface of the cavity 6. Since the resin is injected into this gap, the entire capacitor element 2 is covered with the resin and sealed.
  • the mold 3 has a mold main body 30 and a holding mold 34. At the time of mold clamping, the mold 3 has a rectangular parallelepiped shape (see FIG. 1). At the time of mold clamping, the mold main body 30 is located outside, and the holding mold 34 is located inside the mold main body 30.
  • the mold main body 30 includes a first mold 31, a second mold 32, and a third mold 33.
  • the first mold 31 is a mold located in front of the upper part at the time of mold tightening (see FIG. 1).
  • the outer shape of the first mold 31 has a rectangular parallelepiped shape.
  • the first mold 31 includes a first recess 311 and a second recess 312, a plurality of (two in the present embodiment) bus bar accommodating portions 313, and a plurality (in the present embodiment). It has two) bolt holes 314 and.
  • the first recess 311 is a rectangular parallelepiped space extending in the left-right direction.
  • the first recess 311 is open below and behind the first mold 31.
  • the second recess 312 is one size smaller than the first recess 311 and is a rectangular parallelepiped space. That is, the length of the second recess 312 in the anteroposterior direction is shorter than the length of the first recess 311 in the anteroposterior direction.
  • the left-right length of the second recess 312 is shorter than the left-right length of the first recess 311. In the left-right direction, the second recess 312 is located in the center of the first recess 311.
  • the second recess 312 is located above the first recess 311.
  • the second recess 312 is continuous with the first recess 311.
  • the second recess 312 is open below and behind the first mold 31.
  • the two bus bar accommodating portions 313 are spaces in which the first bus bar 51 and the second bus bar 52 are accommodated at the time of mold clamping.
  • the bus bar accommodating portion 313 is a space that is one size smaller than the first recess 311 and has a rectangular parallelepiped shape.
  • the bus bar accommodating portion 313 is located above the first recess 311.
  • the bus bar accommodating portion 313 is continuous with the first recess 311.
  • the bus bar accommodating portion 313 is open below the first mold 31.
  • the two bus bar accommodating portions 313 are arranged side by side in the left-right direction.
  • the two bus bar accommodating portions 313 are located in front of the second recess 312.
  • the two bolt holes 314 are used when attaching the holding mold 34 to the first mold 31.
  • the two bolt holes 314 are provided on the rear facing surface in the second recess 312.
  • the two bolt holes 314 are arranged in the left-right direction.
  • the two bolt holes 314 are provided in the front-rear direction.
  • the two bolt holes 314 are non-through holes.
  • the second mold 32 is a mold located in front of the lower part at the time of mold tightening (see FIG. 1).
  • the outer shape of the second mold 32 has a rectangular parallelepiped shape.
  • the second mold 32 has a front wall portion 321, a left wall portion 322, a right wall portion 323, a lower wall portion 324, and an injection port 325.
  • the front wall portion 321 is located in front of the second mold 32.
  • the front wall portion 321 is a wall having a rectangular plate shape extending in the vertical direction and the horizontal direction.
  • the front wall portion 321 has a front molding surface 66.
  • the front molded surface 66 is a surface facing the rear of the front wall portion 321.
  • the preformed surface 66 becomes a part of the inner surface of the cavity 6. That is, the preformed surface 66 is a surface for forming the front surface of the sealing portion 10 of the capacitor 1.
  • the left wall portion 322 is located on the left side of the second mold 32.
  • the left wall portion 322 is a wall having a rectangular plate shape extending in the vertical direction and the front-back direction.
  • the front end portion of the left wall portion 322 is connected to the left end portion of the front wall portion 321.
  • the left wall portion 322 has a left molded surface 64.
  • the left molded surface 64 is a surface facing the right side of the left wall portion 322.
  • the left molded surface 64 becomes a part of the inner surface of the cavity 6. That is, the left molding surface 64 is a surface for molding the left surface of the sealing portion 10 of the capacitor 1.
  • the right wall portion 323 faces the left wall portion 322.
  • the right wall portion 323 is located on the right side of the second mold 32.
  • the right wall portion 323 is a wall having a rectangular plate shape extending in the vertical direction and the front-back direction.
  • the front end portion of the right wall portion 323 is connected to the right end portion of the front wall portion 321.
  • the right wall portion 323 has a right molded surface 65.
  • the right molded surface 65 is a surface facing the left side of the right wall portion 323.
  • the right molded surface 65 becomes a part of the inner surface of the cavity 6. That is, the right molding surface 65 is a surface for molding the right surface of the sealing portion 10 of the capacitor 1.
  • the right molding surface 65 faces the left molding surface 64.
  • the lower wall portion 324 is located below the second mold 32.
  • the lower wall portion 324 is a wall having a rectangular plate shape extending in the left-right direction and the front-back direction.
  • the front end portion of the lower wall portion 324 is connected to the lower end portion of the front wall portion 321.
  • the left end portion of the lower wall portion 324 is connected to the lower end portion of the left wall portion 322.
  • the right end of the lower wall 324 is connected to the lower end of the right wall 323.
  • the lower wall portion 324 has a lower molded surface 63.
  • the lower molded surface 63 is a surface facing upward of the lower wall portion 324.
  • the lower molded surface 63 becomes a part of the inner surface of the cavity 6. That is, the lower molding surface 63 is a surface for molding the lower surface of the sealing portion 10 of the capacitor 1.
  • the upper end surfaces of the front wall portion 321 and the left wall portion 322 and the right wall portion 323 are flush with each other.
  • the rear end faces of the left wall portion 322, the right wall portion 323, and the lower wall portion 324 are flush with each other.
  • the injection port 325 is an opening for injecting resin into the cavity 6 from the outside of the mold 3 at the time of mold clamping.
  • the injection port 325 communicates the outside of the mold 3 with the inside of the cavity 6 at the time of mold clamping.
  • the injection port 325 is provided on the front wall portion 321. Specifically, the injection port 325 is provided by cutting out a part of the upper end surface of the front wall portion 321 in a semicircular shape.
  • the third mold 33 is a mold located rearward at the time of mold tightening (see FIG. 1).
  • the third mold 33 includes the rear surface of the first mold 31, the rear surface of the holding mold 34, the rear surface of the left wall portion 322 of the second mold 32, the rear surface of the right wall portion 323, and the lower wall. It comes into contact with the rear surface of the portion 324.
  • the third mold 33 has a rectangular plate shape extending in the vertical direction and the horizontal direction.
  • the third mold 33 has a post-molded surface 67.
  • the post-molded surface 67 is a surface facing the front of the third mold 33.
  • the post-molded surface 67 becomes a part of the inner surface of the cavity 6. That is, the rear molding surface 67 is a surface for molding the rear surface of the sealing portion 10 of the capacitor 1.
  • the rear forming surface 67 faces the front forming surface 66.
  • FIG. 4 shows the holding mold 34.
  • the holding mold 34 is a mold for holding the capacitor element 2.
  • the holding mold 34 is attached to the first mold 31 at the time of mold clamping (see FIGS. 1 and 5).
  • the holding mold 34 can be removed from the first mold 31 when the mold is opened (see FIG. 4). In this way, the holding mold 34 holds the capacitor element 2 and is detachable from the mold main body 30 (the first mold 31 in this embodiment).
  • the holding mold 34 includes a first holding member 341 and a second holding member 342.
  • the first holding member 341 is a rectangular parallelepiped member extending in the left-right direction.
  • the vertical and horizontal lengths of the first holding member 341 are equal to the vertical and horizontal lengths of the first recess 311 of the first mold 31, respectively.
  • the first holding member 341 has an upper forming surface 61, a first fitting hole 71, a second fitting hole 72, and a plurality of (two in this embodiment) bolt holes 343.
  • the upper molding surface 61 is the lower surface of the first holding member 341.
  • the upper molded surface 61 becomes a part of the inner surface of the cavity 6. That is, the upper molding surface 61 is a surface for molding a part of the upper surface of the sealing portion 10 of the capacitor 1.
  • the first fitting hole 71 is a hole for fitting the first bus bar 51.
  • the first fitting hole 71 is formed in a slit shape.
  • the first fitting hole 71 penetrates the first holding member 341 in the vertical direction. That is, the first fitting hole 71 is provided on the inner surface of the cavity 6 (upper molded surface 61 in this embodiment). Further, the first fitting hole 71 is open on the rear surface of the first holding member 341. The opening on the rear surface is closed when the second holding member 342 is attached to the first holding member 341.
  • the length of the first fitting hole 71 in the front-rear direction is equal to the width (length in the front-rear direction) of the main body portion 511 of the first bus bar 51.
  • the width (length in the left-right direction) of the first fitting hole 71 is equal to the thickness (length in the left-right direction) of the main body portion 511 of the first bus bar 51.
  • the second fitting hole 72 is a hole for fitting the second bus bar 52.
  • the second fitting hole 72 is formed in the same manner as the first fitting hole 71. That is, the second fitting hole 72 is also provided on the inner surface of the cavity 6 (upper molded surface 61 in this embodiment).
  • the length of the second fitting hole 72 in the front-rear direction is equal to the width (length in the front-rear direction) of the main body portion 521 of the second bus bar 52.
  • the width (length in the left-right direction) of the second fitting hole 72 is equal to the thickness (length in the left-right direction) of the main body portion 521 of the second bus bar 52.
  • the inter-hole pitch HP is defined by the length between the center of the first fitting hole 71 and the center of the second fitting hole 72 in the left-right direction.
  • the hole-to-hole pitch HP is a predetermined interval. That is, the inter-hole pitch HP is equal to the inter-bus bar pitch BP required for the capacitor 1.
  • the two bolt holes 343 are used when attaching the second holding member 342 to the first holding member 341.
  • the two bolt holes 343 are provided on the rear surface of the first holding member 341.
  • the two bolt holes 343 are located between the first fitting hole 71 and the second fitting hole 72 in the left-right direction.
  • the two bolt holes 343 are arranged in the left-right direction.
  • the two bolt holes 343 are provided in the front-rear direction.
  • the two bolt holes 343 are non-through holes.
  • the second holding member 342 is removable from the first holding member 341. When the second holding member 342 is attached to the first holding member 341, the second holding member 342 is located behind the first holding member 341.
  • the second holding member 342 includes a main body portion 344, a convex portion 345, a plurality of (two in the present embodiment) first bolt insertion holes 346, and a plurality of (two in the present embodiment) second bolt insertion holes. 347 and.
  • the main body portion 344 is a rectangular parallelepiped member extending in the left-right direction.
  • the vertical and horizontal lengths of the main body 344 are equal to the vertical and horizontal lengths of the first recess 311 of the first mold 31, respectively.
  • the front surface of the main body 344 may come into contact with the rear surface of the first holding member 341 with almost no gap. As a result, the first fitting hole 71 and the second fitting hole 72 can be made into a hole that penetrates in the vertical direction.
  • the total length of the first holding member 341 in the front-rear direction and the length of the main body portion 344 of the second holding member 342 in the front-rear direction is the length in the front-rear direction of the first recess 311 of the first mold 31. equal. Therefore, the main body portion 344 of the first holding member 341 and the second holding member 342 can be fitted into the first recess 311 of the first mold 31.
  • the main body portion 344 has an upper molded surface 62.
  • the upper molded surface 62 is the lower surface of the main body portion 344 of the second holding member 342.
  • the upper molded surface 62 becomes a part of the inner surface of the cavity 6. That is, the upper molding surface 62 is a surface for molding a part of the upper surface of the sealing portion 10 of the capacitor 1.
  • the upper molded surface 61 of the first holding member 341 and the upper molded surface 62 of the second holding member 342 become flush with each other.
  • the upper surface of the sealing portion 10 of the capacitor 1 is formed by both the upper forming surface 61 and the upper forming surface 62.
  • the thickness T (length in the vertical direction) of the main body portion 344 of the first holding member 341 and the second holding member 342 is the lower end edge and the lower end edge of the protruding portion 512 of the first bus bar 51. It is shorter than the length H in the vertical direction between the lower end edge of the protruding portion 522 of the second bus bar 52 and the uppermost portion of the capacitor element 2 (T ⁇ H). As a result, a gap can be secured between the upper forming surface 61 and the upper forming surface 62 of the holding die 34 and the uppermost portion of the capacitor element 2. Therefore, the resin can be filled in this gap.
  • the convex portion 345 projects upward from the upper surface of the main body portion 344.
  • the convex portion 345 is one size smaller than the main body portion 344 and is a rectangular parallelepiped portion. In the left-right direction, the convex portion 345 is located at the center of the main body portion 344.
  • the lengths of the convex portion 345 in the vertical direction, the horizontal direction, and the front-rear direction are equal to the lengths in the vertical direction, the left-right direction, and the front-rear direction of the second recess 312 of the first mold 31, respectively. Therefore, the convex portion 345 can be fitted to the second concave portion 312 of the first mold 31.
  • the two first bolt insertion holes 346 are used when the second holding member 342 is attached to the first holding member 341.
  • the two first bolt insertion holes 346 are through holes. Specifically, the two first bolt insertion holes 346 penetrate the main body portion 344 of the second holding member 342 in the front-rear direction.
  • the two first bolt insertion holes 346 are arranged in the left-right direction.
  • the two second bolt insertion holes 347 are used when the holding mold 34 is attached to the first mold 31.
  • the two second bolt insertion holes 347 are through holes. Specifically, the two second bolt insertion holes 347 penetrate the convex portion 345 of the second holding member 342 in the front-rear direction.
  • the two second bolt insertion holes 347 are arranged in the left-right direction.
  • the first bus bar 51 is fitted into the first fitting hole 71
  • the second bus bar 52 is fitted into the second fitting hole 72.
  • the main body 511 of the first bus bar 51 of the capacitor element 2 is inserted into the first fitting hole 71 of the first holding member 341 from behind the first holding member 341, and the second bus bar of the capacitor element 2 is inserted.
  • the main body portion 521 of the 52 is inserted into the second fitting hole 72 of the first holding member 341.
  • the protrusion 512 of the first bus bar 51 and the protrusion 522 of the second bus bar 52 are arranged above the first holding member 341.
  • the inter-bus bar pitch bp is smaller than the inter-hole pitch HP, an outward force is applied to the first bus bar 51 and the second bus bar 52 to widen the inter-bus bar pitch bp until it becomes equal to the inter-hole pitch HP. Since the elastic conductor member 9 is interposed between the first bus bar 51 and the first electrode 41, a leftward force may be applied to the first bus bar 51 to widen the pitch bp between the bus bars. In this state, the main body portion 511 of the first bus bar 51 is inserted into the first fitting hole 71, and the main body portion 521 of the second bus bar 52 is inserted into the second fitting hole 72.
  • the front surface of the main body portion 344 of the second holding member 342 is brought into contact with the rear surface of the first holding member 341.
  • the two first bolts 81 are screwed in order from the rear to the front into the two first bolt insertion holes 346 of the second holding member 342 and the two bolt holes 343 of the first holding member 341.
  • the first holding member 341 and the second holding member 342 are integrated into the holding mold 34. In this way, the holding mold 34 can hold the capacitor element 2 (see FIG. 4).
  • the protruding portion 512 of the first bus bar 51 and the protruding portion 522 of the second bus bar 52 are arranged above the first holding member 341, even if the capacitor element 2 is pulled downward, the protruding portion 512 and the protruding portion 522 The protrusion 522 is caught on the upper surface of the holding die 34 (the first holding member 341 in this embodiment) and functions as a stopper, so that the holding of the capacitor element 2 by the holding die 34 is not released. That is, the protruding portion 512 and the protruding portion 522 prevent the capacitor element 2 from coming off from the holding mold 34.
  • the holding mold 34 holding the capacitor element 2 is attached to the mold main body 30 (first mold 31 in this embodiment). Specifically, the first mold 31 and the holding mold 34 are brought close to each other along the vertical direction, and both are fitted together. At this time, the first bus bar 51 and the second bus bar 52 protruding upward from the holding mold 34 are housed in the two bus bar accommodating portions 313 of the first mold 31, respectively. Specifically, the portion including the protruding portion 512 of the first bus bar 51 and the portion including the protruding portion 522 of the second bus bar 52 are housed in the two bus bar accommodating portions 313. The main body portion 344 of the first holding member 341 and the second holding member 342 is fitted into the first recess 311 of the first mold 31.
  • the convex portion 345 of the second holding member 342 is fitted to the second concave portion 312 of the first mold 31.
  • the two second bolts 82 are screwed in order from the rear to the front into the two second bolt insertion holes 347 of the second holding member 342 and the two bolt holes 314 of the first mold 31.
  • the holding mold 34 can be attached to the first mold 31 (see FIG. 5).
  • the rear surface of the first mold 31 and the rear surface of the holding mold 34 (second holding member 342 in this embodiment) are flush with each other.
  • FIG. 1 shows a mold 3 after mold clamping.
  • Cavity 6 is formed inside the mold 3 by mold clamping.
  • the cavity 6 is a space surrounded by an upper molding surface 61, an upper molding surface 62, a lower molding surface 63, a left molding surface 64, a right molding surface 65, a front molding surface 66, and a rear molding surface 67.
  • the inner surface of the cavity 6 is an upper molding surface 61, an upper molding surface 62, a lower molding surface 63, a left molding surface 64, a right molding surface 65, a front molding surface 66, and a rear molding surface 67 (FIGS. 1 and FIG. 1 and FIG. 5).
  • the capacitor element 2 is held away from the inner surface of the cavity 6. That is, a space is formed between the outer surface of the capacitor element 2 and the inner surface of the cavity 6.
  • resin is injected and filled in the space between the capacitor element 2 and the inner surface of the cavity 6. That is, the resin is injected into the inside of the mold 3 from the injection port 325 of the mold 3.
  • the main body portion 511 of the first bus bar 51 is fitted in the first fitting hole 71 with almost no gap
  • the main body portion 521 of the second bus bar 52 is fitted in the second fitting hole 72 with almost no gap. ing. Therefore, when the resin is injected into the cavity 6, it is suppressed that the resin passes through the first fitting hole 71 and the second fitting hole 72 and infiltrates into the upper part of the holding mold 34.
  • Resin has electrical insulation.
  • the resin is not particularly limited as long as it is an electrically insulating material, and includes, for example, an epoxy resin.
  • the first bus bar 51 is fitted into the first fitting hole 71, and the second bus bar 52 is fitted into the second fitting hole 72.
  • the distance between the first fitting hole 71 and the second fitting hole 72 is equal to the bus bar-to-busbar pitch BP required for the capacitor 1 (see FIG. 6B). Therefore, even if there is a variation in the pitch bp between the bus bars of the capacitor element 2 before sealing, this variation allows the first bus bar 51 to be fitted into the first fitting hole 71 and the second bus bar 52 to be second fitted. It is reduced by fitting in the hole 72.
  • the pitch bp between the bus bars is narrower if it is narrower than the pitch BP between bus bars, and conversely it is narrower if it is wider. Can be corrected.
  • the connection portion between the first bus bar 51 and the first electrode 41, and the second bus bar 52 and the second electrode 42 Since the connecting portion of the above is solidified by the sealing portion 10, the first bus bar 51 and the second bus bar 52 are held at appropriate positions even after the capacitor 1 is formed. That is, the bus-bar-to-busbar pitch bp is within the allowable range of the bus-bar-to-busbar pitch BP.
  • first fitting hole 71 and the second fitting hole 72 for correcting the pitch bp between the bus bars are provided in the mold 3 (holding mold 34 in this embodiment), as in Patent Document 1.
  • There is no need for complicated work such as adjusting the length of the shoulder of the external leader wire for each capacitor element and preparing a support plate in which the hole pitch is set for each capacitor element. That is, in the present embodiment, it is possible to manufacture a plurality of capacitors 1 having the same pitch BP between bus bars with basically one mold 3.
  • the pitch bp between the bus bars is easily kept constant (pitch BP between the bus bars). be able to.
  • the holding mold 34 is detachable from the mold main body 30 (first mold 31), a capacitor is attached to the holding mold 34 with the holding mold 34 removed from the mold main body 30.
  • the element 2 can be held. Therefore, the work of holding the capacitor element 2 in the holding mold 34 becomes easy.
  • the elastic conductor member 9 is interposed between the first electrode 41 and the first bus bar 51, the first electrode 41 and the first bus bar 51 are located as compared with the case where the elastic conductor member 9 is not interposed. It becomes difficult for stress to concentrate on the connection part of. Further, the elastic conductor member 9 is elastically deformed in the left-right direction, so that the first bus bar 51 can be easily moved to a position separated from the position of the second bus bar 52 by the pitch BP between the bus bars. Therefore, it becomes easier to make the pitch bp between bus bars more constant (pitch BP between bus bars).
  • the second bus bar 52 can be moved even if the elastic conductor member 9 does not intervene between the second electrode 42 and the second bus bar 52. It becomes difficult for stress to concentrate on the connection portion between the two electrodes 42 and the second bus bar 52. Therefore, disconnection between the first electrode 41 and the first bus bar 51 and between the second electrode 42 and the second bus bar 52 can be suppressed. From the above, the elastic conductor member 9 may be interposed between the first electrode 41 and the first bus bar 51, and at least between the second electrode 42 and the second bus bar 52.
  • the elastic conductor member 9 is interposed between the first electrode 41 and the first bus bar 51, but may be interposed between the second electrode 42 and the second bus bar 52. That is, preferably, the elastic conductor member 9 is interposed between the first electrode 41 and the first bus bar 51, and between the second electrode 42 and the second bus bar 52.
  • the outer shape of the sealing portion 10 of the capacitor 1 has a rectangular parallelepiped shape, but if the entire capacitor element 2 is sealed, a shape other than the rectangular parallelepiped may be formed. Therefore, the shape of the cavity 6 of the mold 3 is not particularly limited.
  • the sealing portion 10 of the capacitor element 2 may be covered with an appropriate gas barrier film. As a result, it is possible to further suppress the infiltration of moisture and the like into the inside of the capacitor element 2.
  • the outer shape of the mold 3 when the mold 3 is closed, has a rectangular parallelepiped shape, but a shape other than the rectangular parallelepiped may be formed.
  • the number of divisions of mold 3 is not particularly limited. That is, the number of divisions of the mold main body 30 and the number of divisions of the holding mold 34 are not limited.
  • the holding mold 34 does not have to be detachable from the mold body 30. That is, the holding mold 34 may be integrated with the mold main body 30.
  • the position of the injection port 325 in the mold 3 is not particularly limited.
  • An air vent (gas vent) is appropriately provided in the mold 3.
  • the first aspect is a method for manufacturing a capacitor (1), in which a capacitor element (2) and a mold (3) are used.
  • the capacitor element (2) is connected to a first electrode (41), a second electrode (42) provided on the opposite side of the first electrode (41), and a first electrode (41). It has one bus bar (51) and a second bus bar (52) connected to the second electrode (42).
  • the mold (3) is provided on the inner surface of the cavity (6) for accommodating the capacitor element (2) and the cavity (6), and the first fitting is fitted with the first bus bar (51). It has a hole (71) and a second fitting hole (72) provided on the inner surface of the cavity (6) into which the second bus bar (52) is fitted.
  • the first bus bar (51) is fitted into the first fitting hole (71)
  • the second bus bar (52) is fitted into the second fitting hole (72)
  • the capacitor element (2) is fitted. Is separated from the inner surface of the cavity (6) and held, and the space between the capacitor element (2) and the inner surface of the cavity (6) is filled with resin.
  • the pitch between the bus bars can be easily made constant.
  • the second aspect is the method for manufacturing the capacitor (1) based on the first aspect.
  • the mold (3) holds the mold main body (30) and the capacitor element (2), and the holding mold (34) detachable from the mold main body (30). , Have.
  • the holding mold (34) has the first fitting hole (71) and the second fitting hole (72).
  • the work of holding the capacitor element (2) in the holding mold (34) becomes easy.
  • the third aspect is the method for manufacturing the capacitor (1) based on the first or second aspect.
  • the capacitor element (2) further has an elastic conductor member (9) that can be elastically deformed in a direction connecting the first electrode (41) and the second electrode (42).
  • the elastic conductor member (9) is at least one between the first electrode (41) and the first bus bar (51), and between the second electrode (42) and the second bus bar (52). Intervene in the crab.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2021/037710 2020-10-23 2021-10-12 コンデンサの製造方法 WO2022085516A1 (ja)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4511878Y1 (enrdf_load_stackoverflow) * 1967-06-22 1970-05-26
JPS58128716A (ja) * 1982-01-27 1983-08-01 Toko Inc 電子部品の製造方法
JPS6094721A (ja) * 1983-10-28 1985-05-27 日立コンデンサ株式会社 モ−ルドコンデンサの製造装置
JPS60130628U (ja) * 1984-02-10 1985-09-02 日立電子エンジニアリング株式会社 コンデンサの端子位置決め装置
JPS62149838U (enrdf_load_stackoverflow) * 1986-03-14 1987-09-22
JP2004335877A (ja) * 2003-05-09 2004-11-25 Nissin Electric Co Ltd 樹脂モールド型積層セラミックコンデンサ
WO2010004704A1 (ja) * 2008-07-10 2010-01-14 パナソニック株式会社 モールド型コンデンサとその製造方法
JP2019036656A (ja) * 2017-08-18 2019-03-07 ニチコン株式会社 ケースレスフィルムコンデンサおよびその製造方法
JP2020068353A (ja) * 2018-10-26 2020-04-30 ニチコン株式会社 金属化フィルムコンデンサ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4511878Y1 (enrdf_load_stackoverflow) * 1967-06-22 1970-05-26
JPS58128716A (ja) * 1982-01-27 1983-08-01 Toko Inc 電子部品の製造方法
JPS6094721A (ja) * 1983-10-28 1985-05-27 日立コンデンサ株式会社 モ−ルドコンデンサの製造装置
JPS60130628U (ja) * 1984-02-10 1985-09-02 日立電子エンジニアリング株式会社 コンデンサの端子位置決め装置
JPS62149838U (enrdf_load_stackoverflow) * 1986-03-14 1987-09-22
JP2004335877A (ja) * 2003-05-09 2004-11-25 Nissin Electric Co Ltd 樹脂モールド型積層セラミックコンデンサ
WO2010004704A1 (ja) * 2008-07-10 2010-01-14 パナソニック株式会社 モールド型コンデンサとその製造方法
JP2019036656A (ja) * 2017-08-18 2019-03-07 ニチコン株式会社 ケースレスフィルムコンデンサおよびその製造方法
JP2020068353A (ja) * 2018-10-26 2020-04-30 ニチコン株式会社 金属化フィルムコンデンサ

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