WO2022080130A1 - Module de capteur et procédé pour sa fabrication - Google Patents

Module de capteur et procédé pour sa fabrication Download PDF

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Publication number
WO2022080130A1
WO2022080130A1 PCT/JP2021/035591 JP2021035591W WO2022080130A1 WO 2022080130 A1 WO2022080130 A1 WO 2022080130A1 JP 2021035591 W JP2021035591 W JP 2021035591W WO 2022080130 A1 WO2022080130 A1 WO 2022080130A1
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Prior art keywords
electronic component
sensor module
sensor
electrode
package
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PCT/JP2021/035591
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English (en)
Japanese (ja)
Inventor
誠 平田
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ローム株式会社
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Priority to JP2022557342A priority Critical patent/JPWO2022080130A1/ja
Publication of WO2022080130A1 publication Critical patent/WO2022080130A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • This disclosure relates to a sensor module equipped with a pressure sensor.
  • the present disclosure also relates to a method of manufacturing such a sensor module.
  • MEMS MicroElectro Mechanical System
  • Patent Document 1 discloses a sensor module in which a pressure sensor is mounted on a mounting surface at the bottom of a case. In the sensor module, the electrodes of the pressure sensor and the lead frame arranged on the mounting surface of the case are connected by bonding wires.
  • a bonding wire is bonded to a lead frame arranged on the mounting surface. Therefore, it is necessary to increase the mounting surface so that the capillary for wire bonding does not come into contact with the case or the pressure sensor, and it is difficult to miniaturize the sensor module. Further, when an electronic component that processes a detection signal detected by the pressure sensor is also arranged in the case, it is conceivable to mount the pressure sensor on the electronic component and mount the electronic component on the mounting surface at the bottom of the case. .. In this case, since the electrodes of the electronic component and the lead frame are connected by the bonding wire, it is necessary to further increase the mounting surface.
  • one of the challenges of this disclosure is to provide a sensor module that can be miniaturized.
  • the sensor module processes a package made of ceramic and having an internal space, a pressure sensor for detecting the pressure of a fluid in the internal space of the package, and a detection signal output by the pressure sensor. Equipped with electronic parts to perform.
  • the electronic component includes an electronic component main surface and an electronic component back surface facing opposite sides in the thickness direction, and an electronic component electrode arranged on the electronic component back surface.
  • the pressure sensor is mounted on the main surface of the electronic component.
  • the package includes a bottom plate portion having a mounting surface facing the internal space side and a mounting surface opposite to the mounting surface. The electronic component is mounted on the mounting surface with the back surface of the electronic component facing the bottom plate portion.
  • the sensor module can be miniaturized.
  • FIG. 3 is a cross-sectional view taken along the line III-III of FIG. It is a partially enlarged view of FIG. It is an enlarged plan view which shows the structure of a joint part.
  • FIG. 7 is a cross-sectional view taken along the line VIII-VIII of FIG. It is sectional drawing which follows the IX-IX line of FIG.
  • something A is formed on a certain thing B
  • something A is formed on a certain thing B
  • something B means "there is a certain thing A” unless otherwise specified. It includes “being formed directly on the object B” and “being formed on the object B by the object A while interposing another object between the object A and the object B”.
  • something A is placed on something B” and “something A is placed on something B” means "something A is placed on something B” unless otherwise specified. It includes "being placed directly on B” and “being placed on a certain thing B while having another thing intervening between a certain thing A and a certain thing B".
  • a certain thing A is located on a certain thing B means "a certain thing A is in contact with a certain thing B and a certain thing A is located on a certain thing B" unless otherwise specified. "What you are doing” and "The thing A is located on the thing B while another thing is intervening between the thing A and the thing B".
  • something A overlaps with a certain thing B when viewed in a certain direction means “overlaps a certain thing A with all of a certain thing B” and "a certain thing A overlaps with all of a certain thing B” unless otherwise specified. "Overlapping a part of a certain object B" is included.
  • the sensor module A1 detects atmospheric pressure, and is mounted on a circuit board of various home appliances such as vacuum cleaners and rice cookers and various electronic devices such as mobile terminals.
  • the use of the sensor module A1 is not limited.
  • the sensor module A1 includes a package 1, an electronic component 2, a pressure sensor 3, a plurality of bonding wires 4, a protective member 5, a lid 6, and a plurality of joints 7.
  • FIG. 1 is a perspective view showing the sensor module A1.
  • FIG. 2 is a plan view showing the sensor module A1.
  • FIG. 3 is a cross-sectional view taken along the line III-III of FIG.
  • FIG. 4 is a partially enlarged view of FIG.
  • FIG. 5 is an enlarged plan view showing the structure of the joint portion 7. In FIG. 5, for convenience of understanding, only the joint portion 7 and the electrode pad 14 described later are shown.
  • FIG. 6 is a block diagram of the sensor module A1.
  • FIG. 7 is a plan view of the pressure sensor 3 and shows an example of a wiring pattern.
  • FIG. 8 is a cross-sectional view taken along the line VIII-VIII of FIG. FIG.
  • the thickness direction (planar view direction) of the sensor module A1 is the z direction (z1-z2 direction), and the direction along one side of the sensor module A1 orthogonal to the z direction is the x direction (x1-x2).
  • Direction the direction orthogonal to the z direction and the x direction will be described as the y direction (y1-y2 direction) (the same applies to the following figures).
  • the sensor module A1 has dimensions in the x-direction and y-direction of, for example, about 2 mm, and dimensions in the z-direction are about 0.8 to 1 mm.
  • the dimensions of the sensor module A1 are not limited.
  • the package 1 has a substantially rectangular shape in the z-direction, and has a box shape having an internal space 19. Further, the package 1 is made of ceramic. In the present embodiment, the package 1 is a laminated ceramic substrate formed by laminating and firing a plurality of green sheets. The package 1 is a member for accommodating the electronic component 2 and the pressure sensor 3 in the internal space 19 and mounting the sensor module A1 on the circuit boards of various devices. Package 1 includes a bottom plate portion 11 and a side wall portion 12.
  • the bottom plate portion 11 constitutes the bottom plate portion of the box-shaped package 1, and includes a mounting surface 11a and a mounting surface 11b.
  • the mounting surface 11a and the mounting surface 11b face each other in the z direction.
  • the mounting surface 11a is a surface facing the z1 direction, and is a surface on which the electronic component 2 is mounted.
  • the mounting surface 11b is a surface facing the z2 direction, and is a surface used when the sensor module A1 is mounted on a circuit board of various devices.
  • a plurality of electrode pads 14 and a plurality of wirings are arranged on the mounting surface 11a of the package 1.
  • the plurality of electrode pads 14 are used as electrodes conductively connected to the electronic component 2 mounted on the mounting surface 11a.
  • Each electrode pad 14 is made of a single type or a plurality of types of metals such as Cu, Ti, Ni, Pd, and Au, and is formed by plating, for example.
  • the outermost layer of the electrode pad 14 is made of Au.
  • a plurality of electrode pads 15 are arranged on the mounting surface 11b of the package 1.
  • the plurality of electrode pads 15 are used as electrodes that are electrically connected to the wiring pattern of the circuit board when the sensor module A1 is mounted on the circuit board.
  • Each electrode pad 15 is made of a single type or a plurality of types of metals such as Cu, Ti, Ni, Pd, and Au, and is formed by plating, for example.
  • Each electrode pad 15 is electrically connected to the wiring of the mounting surface 11a and the electrode pad 14 via, for example, a through hole (not shown) penetrating the bottom plate portion 11.
  • the side wall portion 12 constitutes a rectangular tubular side wall portion of the box-shaped package 1, and includes an inner wall surface 123, a lid arranging surface 121, and a pad arranging surface 122.
  • the inner wall surface 123 is an inner peripheral surface including four surfaces facing the inside of the side wall portion 12.
  • the space surrounded by the inner wall surface 123 of the side wall portion 12 and the mounting surface 11a of the bottom plate portion 11 is the internal space 19, which houses the electronic component 2 and the pressure sensor 3 and is filled with the protective member 5.
  • the lid arrangement surface 121 is an end surface of the side wall portion 12 opposite to the bottom plate portion 11, and faces the same side as the mounting surface 11a of the bottom plate portion 11 in the z direction.
  • the lid arrangement surface 121 has a rectangular ring shape and is a flat surface in the z-direction view.
  • a lid joint portion 16 is arranged on the lid arrangement surface 121.
  • the lid joint 16 is made of, for example, an alloy of Fe, Co, Ni or the like, and is formed by plating, for example.
  • the material of the lid joint 16 is not limited.
  • the lid joint portion 16 has a rectangular ring shape in the z-direction view.
  • the lid 6 is joined to the lid joint portion 16 by, for example, welding.
  • the pad arranging surface 122 is the bottom surface of a recess in which a part of the side wall portion 12 located on the inner wall surface 123 side is recessed in the z direction from the lid arranging surface 121, and the bottom plate portion 11 is formed in the z direction. It faces the same side as the mounting surface 11a.
  • the pad arrangement surface 122 is a rectangular and flat surface in the z-direction view.
  • the pad arranging surface 122 is arranged between the mounting surface 11a and the lid arranging surface 121 in the z direction.
  • a plurality of electrode pads 13 are arranged on the pad arrangement surface 122. The plurality of electrode pads 13 are used as electrodes conductively connected to the pressure sensor 3.
  • the electrode pad 13 is made of a single type or a plurality of types of metals such as Cu, Ti, Ni, Pd, and Au, and is formed by plating, for example. In this embodiment, as shown in FIG. 2, four electrode pads 13 are arranged side by side at equal intervals in the x direction. The number of electrode pads 13 is not limited. Further, each electrode pad 13 is electrically connected to the electrode pad 14 via, for example, wiring (not shown) arranged on the pad arrangement surface 122, the inner wall surface 123, and the mounting surface 11a.
  • Package 1 is not limited to the laminated ceramic substrate, and may have the above-mentioned structure. Further, the material of the package 1 is not limited to ceramics, and may be other materials such as synthetic resin.
  • the electronic component 2 processes the detection signal detected by the pressure sensor 3, and is configured as a so-called ASIC (Application Specific Integrated Circuit) element.
  • the electronic component 2 includes the temperature sensor 22, and processes the detection signal detected by the temperature sensor 22 and the detection signal detected by the pressure sensor 3. ..
  • the electronic component 2 multiplexes the detection signal detected by the temperature sensor 22 and the detection signal detected by the pressure sensor 3 by the multiplexer 23, and converts the detection signal into a digital signal by the analog / digital conversion circuit 24.
  • the signal processing unit 25 performs processing such as amplification, filtering, and logical operation based on the clock signal of the clock 26 while using the storage area of the storage unit 27.
  • the signal after signal processing is output via the interface 28.
  • the sensor module A1 can output the signal for detecting the pressure and the temperature after performing appropriate signal processing.
  • the internal configuration of the electronic component 2 is not limited.
  • the electronic component 2 is an electronic component for control in which various elements are mounted on a substrate and packaged.
  • the electronic component 2 has a rectangular plate shape in a plan view, and includes a main surface 2a and a back surface 2b.
  • the main surface 2a and the back surface 2b face each other in the z direction.
  • the main surface 2a is a surface facing the z1 direction and is a surface on which the pressure sensor 3 is mounted.
  • the back surface 2b is a surface facing the z2 direction, and is a surface used when the electronic component 2 is mounted on the package 1.
  • the dimensions of the electronic component 2 in the z direction are about 100 ⁇ m
  • the dimensions in the x direction and the y direction are about 1 to 1.2 mm, respectively.
  • Each dimension of the electronic component 2 is not limited.
  • a plurality of electrodes 21 are arranged on the back surface 2b of the electronic component 2.
  • Each of the plurality of electrodes 21 is used as an electrode conductively connected to any one of the plurality of electrode pads 14 of the package 1, and is arranged at a position facing each electrode pad 14.
  • the electrode 21 is made of a metal such as Al or an aluminum alloy, and is formed by plating, for example.
  • the electrode 21 is electrically connected to a circuit formed inside the electronic component 2 via a conduction path inside the electronic component 2.
  • the number and arrangement of the electrodes 21 are not limited.
  • the electronic component 2 is flip-chip mounted on the package 1, and is mounted substantially in the center of the mounting surface 11a of the package 1 with the back surface 2b facing the bottom plate portion 11.
  • Each electrode 21 on the back surface 2b of the electronic component 2 is electrically connected to each electrode pad 14 via the joint portion 7.
  • the plurality of joints 7 are interposed between any of the plurality of electrodes 21 of the electronic component 2 and any of the plurality of electrode pads 14 of the package 1 to conduct the electrodes 21 and the electrode pads 14.
  • Each joint portion 7 has a circular shape or an elliptical shape in the z-direction view, and in the present embodiment, both have a circular shape as shown in FIG. Further, as shown in FIG. 4, each joint portion 7 has an elliptical shape in which both ends in the z direction are flat in the x-direction view, and the flat portion on the z1 side is longer than the flat portion on the z2 side. The same applies to the y-direction view.
  • the material of each joint 7 is, for example, Au.
  • each joint portion 7 a substantially spherical bump made of, for example, Au is formed on the electrode 21 of the electronic component 2, and when the electronic component 2 is mounted on the package 1, the bump is pressed against the electrode pad 14. Is formed by.
  • Each joint 7 includes a first contact surface 71 and a second contact surface 72, as shown in FIGS. 4 and 5.
  • the first contact surface 71 is a surface that comes into contact with the electrode 21 of the electronic component 2, and is formed when the joint portion 7 is formed on the electrode 21.
  • the second contact surface 72 is a surface that comes into contact with the electrode pad 14 of the package 1, and is formed by the joint portion 7 coming into contact with the electrode pad 14 when the electronic component 2 is mounted on the package 1. Since the joint portion 7 is formed in contact with the electrode 21 first, the area of the first contact surface 71 is larger than the area of the second contact surface 72. Further, in the z-direction view, the second contact surface 72 is included in the first contact surface 71.
  • the pressure sensor 3 is a sensor for detecting pressure.
  • the pressure sensor 3 detects the pressure and outputs the detection result as a detection signal to the electronic component 2.
  • the pressure sensor 3 is housed in the internal space 19 of the package 1 and detects the pressure of the fluid in the internal space 19.
  • the pressure sensor 3 is a barometric pressure sensor that detects the pressure of air in the internal space 19 of the package 1.
  • the pressure sensor 3 has a rectangular parallelepiped shape and includes a main surface 3a and a back surface 3b.
  • the main surface 3a and the back surface 3b face each other in the z direction.
  • the main surface 3a is a surface facing the z1 direction, and the electrode 34 is arranged.
  • the back surface 3b is a surface facing the z2 direction, and is a surface used when the pressure sensor 3 is mounted on the electronic component 2. Both the main surface 3a and the back surface 3b have a rectangular shape.
  • the size of the pressure sensor 3 in the z direction is about 250 ⁇ m, and the dimensions in the x direction and the y direction are about 1 to 1.2 mm, respectively.
  • the x-direction and y-direction dimensions of the pressure sensor 3 match the x-direction and y-direction dimensions of the electronic component 2, and the gap between the pressure sensor 3 and the electronic component 2 in the z-direction view. There is no overlap.
  • Each dimension of the electronic component 2 is not limited.
  • the pressure sensor 3 includes a silicon substrate 31, a glass substrate 32, and a cavity 33.
  • the silicon substrate 31 has a box shape in which silicon is laminated, and includes a diaphragm 311 and a support layer 312 that supports the outer edges of the diaphragm 311.
  • the silicon substrate 31 is formed by etching a laminated silicon substrate via a predetermined etching mask. The portion that has been etched into a thin film becomes the diaphragm 311.
  • the thin film shape means that the thickness is at least thinner than the thickness of the support layer 312 (dimension in the z direction) and is deformable by the difference between the air pressure inside the cavity 33 and the air pressure outside the cavity 33. ..
  • the method for forming the silicon substrate 31 is not limited, and it is sufficient that the thin film diaphragm 311 can be formed. In the present embodiment, the thickness (dimension in the z direction) of the diaphragm 311 is about 7 ⁇ m.
  • the surface of the silicon substrate 31 on the z1 side is the main surface 3a of the pressure sensor 3.
  • the glass substrate 32 is fixed to the support layer 312 so as to close the opening formed in the silicon substrate 31.
  • the glass substrate 32 and the silicon substrate 31 are joined by, for example, anode joining.
  • the glass substrate 32 and the silicon substrate 31 may be joined by another joining method (for example, bonding with an adhesive).
  • the surface of the glass substrate 32 on the z2 side is the back surface 3b of the pressure sensor 3.
  • the cavity 33 is a hollow portion surrounded by a diaphragm 311, a support layer 312, and a glass substrate 32 and sealed.
  • the pressure of the cavity 33 is kept constant, and in the present embodiment, the vacuum is close to an absolute vacuum. Further, in the present embodiment, the cavity 33 is a rectangular parallelepiped space. In FIGS. 2 and 7, the outer shape of the cavity 33, which is not actually visible, is shown by a dotted chain line.
  • the diaphragm 311 is a portion that overlaps the cavity 33 in the z-direction view, and the z-direction view shape of the diaphragm 311 is rectangular.
  • the shapes of the diaphragm 311 and the cavity 33 are not limited.
  • the cavity 33 may have a cylindrical shape. in this case.
  • the diaphragm 311 has a circular shape in a plan view.
  • the diaphragm 311 is deformed by the difference between the air pressure inside the cavity 33 and the air pressure outside the cavity 33.
  • the pressure sensor 3 generates an electric signal according to the shape (distortion degree) of the diaphragm 311 and outputs it to the electronic component 2.
  • the silicon substrate 31 is formed by etching a silicon substrate laminated by arranging an oxide layer 31b between the silicon layer 31a and the silicon layer 31c from the z2 direction to the oxide layer 31b. Has been done. The remaining silicon layer 31a becomes the diaphragm 311. Further, a diffusion resistance 37 is formed on the surface of the silicon layer 31a on the z1 side by diffusion of impurities, and a diffusion wiring 36 is formed by diffusion of impurities. The diffusion resistance 37 is a gauge resistance formed in the diaphragm 311 and whose resistance value changes according to the deformation of the diaphragm 311.
  • a metal wiring 35 is formed on the surface of the silicon layer 31a on the z1 side (main surface 3a of the pressure sensor 3) by sputtering, and an electrode 34 is formed at a predetermined position of the metal wiring 35 (FIG. 9). reference).
  • the diffusion resistance 37 and the diffusion wiring 36 are shown by broken lines.
  • four diffusion resistances 37a, 37b, 37c, and 37d are arranged in the diaphragm 311 of the pressure sensor 3.
  • the four diffusion resistors 37a, 37b, 37c, 37d are connected by the metal wiring 35 and the diffusion wiring 36 to form a bridge circuit.
  • four electrodes 34a, 34b, 34c, 34d are arranged on the support layer 312 around the diaphragm 311 of the pressure sensor 3.
  • the four electrodes 34a, 34b, 34c, and 34d are all arranged on the y1 side of the diaphragm 311.
  • all the four electrodes 34a, 34b, 34c, 34d are arranged between the first side 38 on the y1 side of the main surface 3a and the diaphragm 311.
  • the electrode 34a is connected to the metal wiring 35 connecting the diffusion resistance 37a and the diffusion resistance 37c.
  • the electrode 34b is connected to a metal wiring 35 connecting the diffusion resistance 37a and the diffusion resistance 37b.
  • the electrode 34c is connected to the metal wiring 35 connecting the diffusion resistance 37c and the diffusion resistance 37d.
  • the electrode 34d is connected to the metal wiring 35 connecting the diffusion resistance 37b and the diffusion resistance 37d.
  • a reference voltage of, for example, 5 V is applied between the electrodes 34a and 34d, and the voltage between the electrodes 34b and 34c is output to the electronic component 2 as a detection signal.
  • the diffusion resistance 37b and the diffusion resistance 37c extend in the direction in which the current flows (the longitudinal direction and the x direction in FIG. 7) due to the distortion of the diaphragm 311, the resistance values become large.
  • the diffusion resistance 37a and the diffusion resistance 37d extend in a direction orthogonal to the direction in which the current flows (the short direction in FIG. 7 and the y direction) due to the distortion of the diaphragm 311, so that the resistance values become small.
  • the voltage between the electrodes 34b and 34c changes according to the degree of distortion of the diaphragm 311. Note that FIG.
  • the arrangement position and connection method of the electrodes 34a, 34b, 34c, 34d, the diffusion resistance 37a, 37b, 37c, 37d, the diffusion wiring 36 and the metal wiring 35 are not limited. Further, the number of electrodes 34 is not limited to four, and an inspection electrode 34 may be further arranged.
  • the pressure sensor 3 is mounted on the main surface 2a of the electronic component 2 with the back surface 3b facing the electronic component 2 side.
  • the pressure sensor 3 and the electronic component 2 are joined by a joining layer 75 such as a silicone resin.
  • the electrodes 34 (34a, 34b, 34c, 34d) of the pressure sensor 3 are electrically connected to the electrode pads 13 arranged on the pad arrangement surface 122 of the package 1 via the bonding wire 4.
  • the electrode 34 is made of a metal such as Al or an aluminum alloy.
  • Each electrode 34 is electrically connected to the electrode 21 of the electronic component 2 via the bonding wire 4, the electrode pad 13 of the package 1, each wiring, the electrode pad 14, and the joint portion 7.
  • the plurality of bonding wires 4 are bonded to any one of the plurality of electrode pads 13 of the package 1 and any of the plurality of electrodes 34 of the pressure sensor 3 to electrically connect the two.
  • Each bonding wire 4 is made of a metal such as Au.
  • the material of each bonding wire 4 is not limited, and may be, for example, Al, Cu, or the like.
  • Each bonding wire 4 includes a first bonding unit 41 and a second bonding unit 42.
  • the first bonding portion 41 is a portion previously joined, and in the present embodiment, the first bonding portion 41 is joined to the electrode pad 13.
  • the second bonding portion 42 is a portion bonded later, and in this embodiment, it is bonded to the electrode 34.
  • the distance D1 from the mounting surface 11a to the pad arrangement surface 122 on which the electrode pads 13 are arranged is about the same as the distance D3 from the mounting surface 11a to the main surface 3a of the pressure sensor 3. It is desirable that the distance D1 is larger than the distance D2 from the mounting surface 11a to the main surface 2a of the electronic component 2. Further, it is desirable that the distance D1 is 0.9 times or more and 1.1 times or less the distance D3, and most preferably equal to the distance D3.
  • the protective member 5 is filled in the internal space 19 surrounded by the inner wall surface 123 of the side wall portion 12 of the package 1 and the mounting surface 11a of the bottom plate portion 11 to cover the electronic component 2, the pressure sensor 3, and the plurality of bonding wires 4. It is formed like this. All of the plurality of bonding wires 4 are entirely covered with the protective member 5. In the present embodiment, the main surface 3a of the pressure sensor 3 is entirely covered with the protective member 5. Further, the pad arrangement surface 122 and the electrode pad 13 are also entirely covered with the protective member 5.
  • the protective member 5 is an insulating resin, and in this embodiment, it is a silicone gel.
  • the protective member 5 is formed by filling the internal space 19 of the package 1 with a liquid silicone gel material and curing it by heating to form a gel.
  • the material of the protective member 5 is not limited.
  • the Young's modulus of the protective member 5 is about 0.04 GPa.
  • the Young's modulus of the protective member 5 is preferably 0.1 GPa or less and 0.01 GPa or more. Since the protective member 5 has a relatively low Young's modulus, it hardly inhibits the deformation of the diaphragm 311. Therefore, even if the diaphragm 311 of the pressure sensor 3 is covered with the protective member 5, the pressure sensor 3 can appropriately detect the pressure without being affected by the protective member 5.
  • the lid 6 is a metal plate-shaped member having a substantially rectangular shape in the z-direction.
  • the lid 6 is joined to the lid joining portion 16 and is arranged on the lid arranging surface 121 of the package 1 to block the opening of the package 1.
  • the lid 6 is joined to the lid joint portion 16 by welding.
  • the material and joining method of the lid 6 are not limited.
  • the sensor module A1 does not have to include the lid joint portion 16.
  • the lid 6 is provided with an opening 61 for taking in outside air inside. Since the opening 61 is provided in the lid 6 and the internal space 19 of the package 1 is hollow, the pressure sensor 3 can detect the pressure around the sensor module A1 (for example, atmospheric pressure).
  • the temperature sensor 22 of the electronic component 2 can detect the ambient air temperature of the sensor module A1.
  • only one opening 61 is arranged at a position closer to the end on the x1 side of the lid 6 and closer to the end on the y2 side.
  • the position and number of openings 61 are not limited.
  • FIGS. 10 to 14 are cross-sectional views showing a process related to the manufacturing method of the sensor module A1.
  • the package material 91, the electronic component 2, and the pressure sensor 3 are prepared.
  • a substantially spherical bump 92 made of, for example, Au is formed on each electrode 21 arranged on the back surface 2b of the electronic component 2 (see FIG. 11).
  • the package material 91 is a ceramic substrate formed by laminating and firing green sheets 911, 912, 913.
  • the green sheet 911 includes a front surface 911a and a back surface 911b facing opposite sides, and a through hole 911c penetrating from the front surface 911a to the back surface 911b.
  • the green sheet 912 includes a front surface 912a and a back surface 912b facing opposite to each other, and a through hole 912c penetrating from the front surface 912a to the back surface 912b.
  • the green sheet 913 has a front surface 913a and a back surface 913b facing opposite to each other.
  • each of the green sheets 911, 912, 913 is formed on each of the green sheets 911, 912, 913, if necessary, by, for example, screen printing. Further, a through hole (not shown) may be formed to form a through hole. Further, each of the green sheets 911, 912, 913 may be a stack of a plurality of green sheets.
  • the back surface 911b of the green sheet 911 and the front surface 912a of the green sheet 912 are in contact with each other, and the back surface 912b of the green sheet 912 and the front surface 913a of the green sheet 913 are laminated and fired to form the package material 91. (See FIG. 11).
  • the portion of the surface 912a of the green sheet 912 exposed from the through hole 911c becomes the pad arrangement surface 122.
  • a portion of the surface 913a of the green sheet 913 exposed from the through hole 912c becomes the mounting surface 11a.
  • the through hole 911c of the green sheet 911 and the through hole 912c of the green sheet 912 become the inner wall surface 123.
  • the space surrounded by the surface 913a of the green sheet 913, the through hole 911c of the green sheet 911, and the through hole 912c of the green sheet 912 becomes the internal space 19.
  • the package material 91 includes a front surface 91a and a back surface 91b.
  • the front surface 911a of the green sheet 911 is the front surface 91a
  • the back surface 913b of the green sheet 913 is the back surface 91b.
  • the package material 91 is cut into the package 1 in the final process. Further, the back surface 91b of the package material 91 becomes the mounting surface 11b, and the front surface 91a of the package material 91 becomes the lid arrangement surface 121.
  • a lid joint 16 is formed on the surface 91a of the package material 91, for example, by plating.
  • the electrode pad 13 is formed on the pad arrangement surface 122 of the package material 91, for example, by plating. Further, an electrode pad 14 is formed on the mounting surface 11a of the package material 91, for example, by plating. Further, an electrode pad 15 is formed on the back surface 91b of the package material 91, for example, by plating.
  • the electronic component 2 is mounted in each internal space 19 of the package material 91.
  • the electronic component 2 is flip-chip mounted on the mounting surface 11a with the back surface 2b facing the mounting surface 11a of the package material 91.
  • the bumps 92 formed on the plurality of electrodes 21 of the electronic component 2 are bonded to the plurality of electrode pads 14 of the package material 91 by ultrasonic waves and pressure, respectively, to form the bonded portion 7 (see FIG. 12). ).
  • Each electrode 21 of the electronic component 2 is electrically connected to each electrode pad 14 via the joint portion 7.
  • the pressure sensor 3 is mounted on the electronic component 2.
  • the material of the bonding layer 75 is applied to the main surface 2a of the electronic component 2, the back surface 3b of the pressure sensor 3 is directed toward the electronic component 2, and the pressure sensor 3 is mounted on the electronic component 2.
  • each electrode 34 of the pressure sensor 3 and each electrode pad 13 of the package material 91 are connected by a bonding wire 4.
  • the bonding wire 4 is first bonded to the electrode pad 13 and then to the electrode 34.
  • each internal space 19 is filled with the liquid silicone gel material 93.
  • the silicone gel material 93 is sequentially injected into a plurality of locations in the internal space 19 by, for example, a dispenser. At this time, the silicone gel material 93 is filled so as to cover the entire main surface 3a of the pressure sensor 3 and the entire bonding wire 4. Then, by heating, the silicone gel material 93 is cured and becomes a protective member 5.
  • the package material 91 is cut into pieces corresponding to the sensor module A1. After that, the lid 6 is joined to the lid joint portion 16 of each piece by welding. By going through the above steps, the sensor module A1 is manufactured.
  • the electronic component 2 is flip-chip mounted on the mounting surface 11a of the package 1. Therefore, it is not necessary to connect the electrode 21 of the electronic component 2 and the electrode pad 14 of the package 1 with the bonding wire 4. Since it is not necessary to increase the mounting surface 11a in preparation for contact with a capillary or the like for wire bonding, the sensor module A1 can be miniaturized.
  • the joint portion 7 is formed by pressing the bump 92 formed on the electrode 21 of the electronic component 2 against the electrode pad 14 of the mounting surface 11a. Since the joint portion 7 is made of Au, for example, joining with the electrode 21 which is Al is more difficult than joining with the electrode pad 14 whose outermost layer is made of Au.
  • the joint portion 7 By forming the joint portion 7 on the electrode 21 first, the joint with the electrode 21 can be further strengthened. Further, the damage to the electronic component 2 due to the joining is small. Further, the joint portion 7 is formed first on the electrode 21 which is finer than the electrode pad 14. Therefore, as compared with the case where the joint portion 7 is first formed on the electrode pad 14, it is possible to suppress the occurrence of defective products due to misalignment when the electronic component 2 is mounted on the package 1.
  • the package 1 includes a pad arrangement surface 122 arranged in the z1 direction from the mounting surface 11a, and the electrode 34 of the pressure sensor 3 has a bonding wire 4 on the electrode pad 13 arranged on the pad arrangement surface 122. It is electrically connected via. Therefore, as compared with the case where the electrode pad 13 is arranged on the mounting surface 11a, it is possible to prevent the capillary from coming into contact with the package 1 and the pressure sensor 3 during wire bonding. As a result, it is not necessary to increase the mounting surface 11a in preparation for contact with the capillary, so that the sensor module A1 can be miniaturized.
  • the distance D1 from the mounting surface 11a to the pad arrangement surface 122 is about the same as the distance D3 from the mounting surface 11a to the main surface 3a of the pressure sensor 3. Therefore, the formation of the bonding wire 4 is easier. Further, as compared with the case where the electrode pad 13 is arranged on the mounting surface 11a, there is an advantage that the electrode pad 13, the main surface 3a of the pressure sensor 3, and the bonding wire 4 can be easily covered by the protective member 5. In addition, the amount of material used for the protective member 5 can be suppressed.
  • the pad arrangement surface 122 is arranged in the z2 direction from the lid arrangement surface 121. Therefore, it is possible to prevent the bonding wire 4 from coming into contact with the lid 6 as compared with the case where the pad arrangement surface 122 and the lid arrangement surface 121 are at the same position in the z direction.
  • the four electrodes 34a, 34b, 34c, 34d arranged on the main surface 3a of the pressure sensor 3 are all arranged on the y1 side of the diaphragm 311.
  • Each electrode 34 is electrically connected to each electrode pad 13 of the pad arrangement surface 122 arranged on the y1 side of the pressure sensor 3 via a bonding wire 4.
  • the package 1 can bring each electrode 34 and each electrode pad 13 close to each other without providing the pad arrangement surface 122 other than the y1 side of the pressure sensor 3. Therefore, the sensor module A1 can be miniaturized while keeping each electrode 34 and each electrode pad 13 close to each other.
  • the protective member 5 is filled so as to cover each bonding wire 4. , The thickness of the protective member 5 in the region of the main surface 3a of the pressure sensor 3 located between the bonding wires 4 becomes thicker. Since the package 1 does not have the pad arrangement surface 122 other than the y1 side of the pressure sensor 3, the thickness of the protective member 5 formed on the main surface 3a can be suppressed.
  • the protective member 5 covers each electrode pad 13, each electrode 34, and each bonding wire 4. Therefore, even when particles such as water infiltrate through the opening 61 of the lid 6 together with air, the protective member 5 can prevent corrosion of each electrode pad 13, each electrode 34, and each bonding wire 4. Further, the protective member 5 can prevent the occurrence of a short circuit. Further, according to the present embodiment, the protective member 5 covers the entire main surface 3a of the pressure sensor 3. Therefore, it is easier to form the protective member 5 as compared with the case where the protective member 5 covers only a part of the main surface 3a.
  • the pressure sensor 3 can appropriately detect the pressure as compared with the case where the protective member 5 covers only a part of the diaphragm 311. Further, according to the present embodiment, since the protective member 5 has a relatively low Young's modulus, it hardly inhibits the deformation of the diaphragm 311. Therefore, even if the diaphragm 311 of the pressure sensor 3 is covered with the protective member 5, the pressure sensor 3 can appropriately detect the pressure without being affected by the protective member 5.
  • the package 1 is made of ceramic. Therefore, the package 1 is suppressed from being heated in the manufacturing process of the sensor module A1 and deformed due to an environmental load when the sensor module A1 is used. As a result, deterioration of the measurement accuracy of the pressure sensor 3 mounted on the package 1 is suppressed. Further, the package 1 is a laminated ceramic substrate. Therefore, it is easy to form a structure having an internal space 19 and a pad arrangement surface 122.
  • each bonding wire 4 is first bonded to the electrode pad 13 and then to the electrode 34. Since the capillary moves in the y2 direction when the bonding wire 4 is formed, contact with the side wall portion 12 of the package 1 due to the movement of the capillary is prevented. It also contributes to lowering the height of the bonding wire 4.
  • FIG. 15 is a plan view showing the sensor module A2 according to the second embodiment of the present disclosure, and corresponds to FIG. 2.
  • the lid 6 and the protective member 5 are transmitted through.
  • the sensor module A2 differs from the sensor module A1 in the arrangement positions of the four electrodes 34 of the pressure sensor 3.
  • the two electrodes 34 are arranged on the y1 side of the diaphragm 311 and the other two electrodes 34 are arranged on the x1 side of the diaphragm 311.
  • the pad arranging surface 122 according to the present embodiment has an L-shape that straddles a portion of the side wall portion 12 located in the y1 direction and a portion located in the x1 direction.
  • the pad arrangement surface 122 is arranged at a portion where the two electrode pads 13 are located in the y1 direction, and the other two electrode pads 13 are arranged at a portion where the other two electrode pads 13 are located in the x1 direction.
  • the sensor module A2 can be miniaturized. Further, since the joint portion 7 is formed on the electrode 21 first, the joint between the electrode 21 and the joint portion 7 can be further strengthened, and the generation of defective products due to misalignment can be suppressed. Further, since the electrode pad 13 is arranged on the pad arrangement surface 122, the sensor module A2 can be miniaturized. Further, since the package 1 is a laminated ceramic substrate, it is easy to form a structure having an internal space 19 and a pad arrangement surface 122, and deterioration of the measurement accuracy of the pressure sensor 3 can be suppressed. Further, the sensor module A2 has the same effect as the sensor module A1 by adopting the same configuration as the sensor module A1.
  • FIG. 16 is a plan view showing the sensor module A3 according to the third embodiment of the present disclosure, and corresponds to FIG. In FIG. 16, for convenience of understanding, the lid 6 and the protective member 5 are transmitted through.
  • the sensor module A3 differs from the sensor module A1 in the arrangement positions of the four electrodes 34 of the pressure sensor 3.
  • the two electrodes 34 are arranged on the y1 side of the diaphragm 311 and the other two electrodes 34 are arranged on the y2 side of the diaphragm 311.
  • the package 1 according to the present embodiment further includes a pad arrangement surface 122'.
  • the pad arrangement surface 122' is the bottom surface of a recess in which a part of the side wall portion 12 located on the inner wall surface 123 side is recessed in the z direction from the lid arrangement surface 121, and the bottom plate portion 11 in the z direction. It faces the same side as the mounting surface 11a.
  • the pad arrangement surface 122' is a rectangular and flat surface in the z-direction view.
  • the pad arranging surface 122' is arranged between the mounting surface 11a and the lid arranging surface 121 in the z direction.
  • Two electrode pads 13 are arranged on the pad arrangement surface 122, and the other two electrode pads 13 are arranged on the pad arrangement surface 122'.
  • the sensor module A3 can be miniaturized. Further, since the joint portion 7 is formed on the electrode 21 first, the joint between the electrode 21 and the joint portion 7 can be further strengthened, and the generation of defective products due to misalignment can be suppressed. Further, since the electrode pads 13 are arranged on the pad arrangement surfaces 122 and 122', the sensor module A3 can be miniaturized. Further, since the package 1 is a laminated ceramic substrate, it is easy to form a structure having an internal space 19 and a pad arrangement surface 122, and deterioration of the measurement accuracy of the pressure sensor 3 can be suppressed. Further, the sensor module A3 has the same effect as the sensor module A1 by adopting the same configuration as the sensor module A1.
  • FIG. 17 is a cross-sectional view showing the sensor module A4 according to the fourth embodiment of the present disclosure, and corresponds to FIG.
  • the sensor module A4 differs from the sensor module A1 in that it does not include the protective member 5.
  • the sensor module A4 according to this embodiment is not provided with the protective member 5 because it is used for applications that do not require waterproofing and moisture proofing.
  • the sensor module A4 can be miniaturized. Further, since the joint portion 7 is formed on the electrode 21 first, the joint between the electrode 21 and the joint portion 7 can be further strengthened, and the generation of defective products due to misalignment can be suppressed. Further, since the electrode pad 13 is arranged on the pad arrangement surface 122, the sensor module A4 can be miniaturized. Further, the plurality of electrodes 34 arranged on the main surface 3a of the pressure sensor 3 are all arranged on the y1 side of the diaphragm 311, and the pad arrangement surface 122 included in the package 1 is arranged only on the y1 side of the pressure sensor 3. ing.
  • the sensor module A4 can be miniaturized while keeping each electrode 34 and each electrode pad 13 close to each other. Further, since the package 1 is a laminated ceramic substrate, it is easy to form a structure having an internal space 19 and a pad arrangement surface 122, and deterioration of the measurement accuracy of the pressure sensor 3 can be suppressed. Further, the sensor module A4 has the same effect as the sensor module A1 by adopting the same configuration as the sensor module A1.
  • FIG. 18 is a cross-sectional view showing the sensor module A5 according to the fifth embodiment of the present disclosure, and corresponds to FIG.
  • the size of the pressure sensor 3 in the z-direction of the sensor module A5 is different from that of the sensor module A1.
  • the dimension in the x direction is smaller than the dimension in the x direction of the electronic component 2
  • the dimension in the y direction is smaller than the dimension in the y direction of the electronic component 2.
  • the pressure sensor 3 is included in the electronic component 2 in the z-direction view.
  • the sensor module A5 can be miniaturized. Further, since the joint portion 7 is formed on the electrode 21 first, the joint between the electrode 21 and the joint portion 7 can be further strengthened, and the generation of defective products due to misalignment can be suppressed. Further, since the electrode pad 13 is arranged on the pad arrangement surface 122, the sensor module A5 can be miniaturized. Further, the plurality of electrodes 34 arranged on the main surface 3a of the pressure sensor 3 are all arranged on the y1 side of the diaphragm 311, and the pad arrangement surface 122 included in the package 1 is arranged only on the y1 side of the pressure sensor 3. ing.
  • the sensor module A5 can be miniaturized while keeping each electrode 34 and each electrode pad 13 close to each other. Further, since the package 1 is a laminated ceramic substrate, it is easy to form a structure having an internal space 19 and a pad arrangement surface 122, and deterioration of the measurement accuracy of the pressure sensor 3 can be suppressed. Further, the sensor module A5 has the same effect as the sensor module A1 by adopting the same configuration as the sensor module A1.
  • FIG. 19 and 20 show the sensor module A6 according to the sixth embodiment of the present disclosure.
  • FIG. 19 is a cross-sectional view showing the sensor module A6 and corresponds to FIG.
  • FIG. 20 is a plan view showing the sensor module A6 and corresponds to FIG. 2.
  • the lid 6 is transparent.
  • the sensor module A6 differs from the sensor module A1 in that the diaphragm 311 is not covered by the protective member 5.
  • the protective member 5 covers only a part of the main surface 3a of the pressure sensor 3.
  • the protective member 5 is provided with an opening 5a, and the entire diaphragm 311 is exposed from the opening 5a. That is, in the sensor module A6, the protective member 5 does not cover the diaphragm 311.
  • the sensor module A6 can be miniaturized. Further, since the joint portion 7 is formed on the electrode 21 first, the joint between the electrode 21 and the joint portion 7 can be further strengthened, and the generation of defective products due to misalignment can be suppressed. Further, since the electrode pad 13 is arranged on the pad arrangement surface 122, the sensor module A6 can be miniaturized. Further, the plurality of electrodes 34 arranged on the main surface 3a of the pressure sensor 3 are all arranged on the y1 side of the diaphragm 311, and the pad arrangement surface 122 included in the package 1 is arranged only on the y1 side of the pressure sensor 3. ing.
  • the sensor module A6 can be miniaturized while keeping each electrode 34 and each electrode pad 13 close to each other. Further, since the package 1 is a laminated ceramic substrate, it is easy to form a structure having an internal space 19 and a pad arrangement surface 122, and deterioration of the measurement accuracy of the pressure sensor 3 can be suppressed. Further, the sensor module A6 has the same effect as the sensor module A1 by adopting the same configuration as the sensor module A1. Further, according to the present embodiment, since the diaphragm 311 is not covered with the protective member 5, the Young's modulus of the protective member 5 is high, or the protective member 5 formed on the main surface 3a of the pressure sensor 3 is thick. However, the protective member 5 does not hinder the deformation of the diaphragm 311. Therefore, the pressure sensor 3 can appropriately detect the pressure without being affected by the protective member 5.
  • FIG. 21 is a cross-sectional view showing the sensor module A7 according to the seventh embodiment of the present disclosure, and corresponds to FIG.
  • the sensor module A7 has a different bonding order of the bonding wires 4 from the sensor module A1.
  • the first bonding portion 41 is bonded to the electrode 34 of the pressure sensor 3, and the second bonding portion 42 is bonded to the electrode pad 13 of the package 1.
  • the sensor module A7 can be miniaturized. Further, since the joint portion 7 is formed on the electrode 21 first, the joint between the electrode 21 and the joint portion 7 can be further strengthened, and the generation of defective products due to misalignment can be suppressed. Further, since the electrode pad 13 is arranged on the pad arrangement surface 122, the sensor module A4 can be miniaturized. Further, the plurality of electrodes 34 arranged on the main surface 3a of the pressure sensor 3 are all arranged on the y1 side of the diaphragm 311, and the pad arrangement surface 122 included in the package 1 is arranged only on the y1 side of the pressure sensor 3. ing.
  • the sensor module A7 can be miniaturized while keeping each electrode 34 and each electrode pad 13 close to each other. Further, since the package 1 is a laminated ceramic substrate, it is easy to form a structure having an internal space 19 and a pad arrangement surface 122, and deterioration of the measurement accuracy of the pressure sensor 3 can be suppressed. Further, the sensor module A7 has the same effect as the sensor module A1 by adopting the same configuration as the sensor module A1.
  • FIG. 22 is a partially enlarged cross-sectional view showing the sensor module A8 according to the eighth embodiment of the present disclosure, and corresponds to FIG.
  • the sensor module A8 differs from the sensor module A1 in that the joint portion 7 is first formed on the electrode pad 14.
  • the bump 92 when the bump 92 is first formed on the electrode pad 14 of the package 1 and the electronic component 2 is mounted on the package 1, the bump 92 is pressed against the electrode 21 of the electronic component 2. It is formed by being done.
  • the second contact surface 72 is formed, and when the electronic component 2 is mounted on the package 1, the joint portion 7 comes into contact with the electrode 21 to form the first contact surface 71. .. Since the joint portion 7 is formed first in contact with the electrode pad 14, the area of the second contact surface 72 is larger than the area of the first contact surface 71. Further, in the z-direction view, the first contact surface 71 is included in the second contact surface 72.
  • the sensor module A4 can be miniaturized.
  • the electrode pad 13 is arranged on the pad arrangement surface 122, the sensor module A8 can be miniaturized.
  • the plurality of electrodes 34 arranged on the main surface 3a of the pressure sensor 3 are all arranged on the y1 side of the diaphragm 311, and the pad arrangement surface 122 included in the package 1 is arranged only on the y1 side of the pressure sensor 3. ing. Therefore, the sensor module A8 can be miniaturized while keeping each electrode 34 and each electrode pad 13 close to each other.
  • the package 1 is a laminated ceramic substrate, it is easy to form a structure having an internal space 19 and a pad arrangement surface 122, and deterioration of the measurement accuracy of the pressure sensor 3 can be suppressed.
  • the sensor module A8 has the same effect as the sensor module A1 by adopting the same configuration as the sensor module A1.
  • the pressure sensor 3 may detect the pressure of the liquid in the internal space 19 of the package 1.
  • the sensor module and the manufacturing method thereof according to the present disclosure are not limited to the above-described embodiment.
  • the specific configuration of each part of the sensor module and its manufacturing method according to the present disclosure can be freely changed in design.
  • Appendix 1 A package made of ceramic and having an internal space, A pressure sensor that detects the pressure of the fluid in the internal space of the package, Electronic components that process the detection signal output by the pressure sensor, Equipped with The electronic component includes an electronic component main surface and an electronic component back surface facing opposite sides in the thickness direction, and an electronic component electrode arranged on the electronic component back surface.
  • the pressure sensor is mounted on the main surface of the electronic component, and is mounted on the main surface of the electronic component.
  • the package includes a bottom plate portion having a mounting surface facing the internal space side and a mounting surface opposite to the mounting surface.
  • the electronic component is a sensor module mounted on the mounting surface with the back surface of the electronic component facing the bottom plate portion. Appendix 2.
  • the sensor module according to Appendix 1 wherein the area of the first contact surface is larger than the area of the second contact surface.
  • Appendix 3. The sensor module according to Appendix 2, wherein the second contact surface is included in the first contact surface in the thickness direction.
  • the sensor module according to Supplementary Note 2 or 3 wherein the electronic component electrode contains Al, and the electrode pad and the joint portion contain Au.
  • Appendix 7. The sensor module according to Appendix 5 or 6, wherein the Young's modulus of the protective member is 0.1 GPa or less and 0.01 GPa or more.
  • Appendix 8. The pressure sensor includes a sensor main surface, a sensor back surface opposite to the sensor main surface, and a plurality of sensor electrodes arranged on the sensor main surface.
  • the pressure sensor further comprises a hollow portion and a diaphragm including the sensor main surface and overlapping the hollow portion in the thickness direction.
  • the sensor module according to Appendix 8 wherein the plurality of sensor electrodes are arranged at positions that do not overlap the diaphragm.
  • the main surface of the sensor has a rectangular shape having a first side, and has a rectangular shape.
  • the sensor module according to Appendix 9, wherein the plurality of sensor electrodes are arranged between the first side and the diaphragm.
  • Appendix 11. The sensor module according to Appendix 9 or 10, wherein the diaphragm is exposed from the protective member.
  • Appendix 12 The sensor module according to any one of Supplementary note 8 to 10, wherein the protective member covers the entire main surface of the sensor. Appendix 13.
  • the package further comprises a pad placement surface that is separated from the mounting surface in the thickness direction and in which the second electrode pad is located.
  • the sensor module according to any one of Supplementary note 8 to 12, wherein the first distance from the mounting surface to the pad arrangement surface is larger than the second distance from the mounting surface to the main surface of the electronic component.
  • Appendix 14 The sensor module according to Appendix 13, wherein the first distance is 0.9 times or more and 1.1 times or less the third distance from the mounting surface to the sensor main surface.
  • Appendix 15. Further comprising a bonding wire bonded to the second electrode pad and any of the plurality of sensor electrodes.
  • the sensor module according to Appendix 13 or 14, wherein the bonding wire is entirely covered with the protective member. Appendix 16.
  • the bonding wire includes a first bonding portion and a second bonding portion.
  • the first bonding portion is bonded to the second electrode pad.
  • Appendix 17. Further provided with a lid that at least partially closes the opening of the package.
  • the package further comprises a lid placement surface that is separated from the mounting surface from the pad placement surface in the thickness direction.
  • the sensor module according to any one of Supplementary note 13 to 16, wherein the lid is arranged on the lid arrangement surface.
  • Appendix 18 Preparing an electronic component having an electronic component electrode arranged on the main surface of the electronic component, the back surface of the electronic component, and the back surface of the electronic component, a pressure sensor, and a ceramic package material having a mounting surface.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Ceramic Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention concerne un module de capteur qui est muni : d'un boîtier qui est constitué de céramique et qui possède un espace interne ; d'un capteur de pression qui détecte la pression d'un fluide à l'intérieur de l'espace interne dans le boîtier ; et d'un composant électronique qui traite un signal de détection délivré en sortie par le capteur de pression. Le composant électronique est muni : d'une surface principale de composant électronique et d'une surface arrière de composant électronique faisant face à des côtés mutuellement opposés dans la direction d'épaisseur ; et d'une électrode de composant électronique disposée sur la surface arrière de composant électronique. Le capteur de pression est installé sur la surface principale de composant électronique. Le boîtier comprend une partie de plaque inférieure ayant une surface d'installation faisant face à l'espace interne et une surface de montage sur le côté opposé à la surface d'installation. Le composant électronique est installé sur la surface d'installation avec la surface arrière de composant électronique faisant face à la partie de plaque inférieure.
PCT/JP2021/035591 2020-10-15 2021-09-28 Module de capteur et procédé pour sa fabrication WO2022080130A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022557342A JPWO2022080130A1 (fr) 2020-10-15 2021-09-28

Applications Claiming Priority (2)

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JP2014112038A (ja) * 2012-12-05 2014-06-19 Alps Electric Co Ltd 物理量センサと物理量センサ装置
US20160061677A1 (en) * 2014-09-02 2016-03-03 Apple Inc. Various stress free sensor packages using wafer level supporting die and air gap technique
JP2016070670A (ja) * 2014-09-26 2016-05-09 京セラ株式会社 センサ装置
JP2018100950A (ja) * 2016-12-20 2018-06-28 株式会社デンソー 半導体装置およびその製造方法

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JP2002151551A (ja) * 2000-11-10 2002-05-24 Hitachi Ltd フリップチップ実装構造、その実装構造を有する半導体装置及び実装方法
JP2014112038A (ja) * 2012-12-05 2014-06-19 Alps Electric Co Ltd 物理量センサと物理量センサ装置
US20160061677A1 (en) * 2014-09-02 2016-03-03 Apple Inc. Various stress free sensor packages using wafer level supporting die and air gap technique
JP2016070670A (ja) * 2014-09-26 2016-05-09 京セラ株式会社 センサ装置
JP2018100950A (ja) * 2016-12-20 2018-06-28 株式会社デンソー 半導体装置およびその製造方法

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