WO2022077528A1 - Flexible electronic element suction table - Google Patents
Flexible electronic element suction table Download PDFInfo
- Publication number
- WO2022077528A1 WO2022077528A1 PCT/CN2020/121727 CN2020121727W WO2022077528A1 WO 2022077528 A1 WO2022077528 A1 WO 2022077528A1 CN 2020121727 W CN2020121727 W CN 2020121727W WO 2022077528 A1 WO2022077528 A1 WO 2022077528A1
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- WO
- WIPO (PCT)
- Prior art keywords
- flexible electronic
- guide rail
- horizontal guide
- moving block
- support chassis
- Prior art date
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
- G01R31/2858—Measuring of material aspects, e.g. electro-migration [EM], hot carrier injection
Abstract
A flexible electronic element suction table having a support chassis (1). A horizontal guide rail (2) is mounted on the support chassis (1), and the two ends of the horizontal guide rail (2) are fixed between two protrusion blocks of the support chassis (1). A moving block (3) is mounted on the horizontal guide rail (2), and the moving block (3) is slidably connected to the horizontal guide rail (2). A fixing framework (4) is mounted on the moving block (3), and holes (7) are uniformly distributed on the fixing framework (4). The fixing framework (4) is provided with a tip protrusion, and a push member (6) is arranged below the tip protrusion. After a flexible electronic element is laid flat on top of the fixing framework (4), air extraction is carried out by means of an air pump, and the flexible electronic element is tightly attached onto the fixing framework (4) by using an air pressure intensity difference, thereby realizing the automation of product detection, reducing the error caused by the flexibility of the electronic element, and achieving a more accurate detection result.
Description
本发明涉及一种吸附台,尤其涉及一种柔性电子元件吸附台。The invention relates to an adsorption table, in particular to a flexible electronic component adsorption table.
印刷电路技术是通过印刷方式将电子材料制造成电子器件,结合柔性电子技术可将此类电子器件制作在柔性基板上,使电子器件具有延展性好、轻薄通透的特征,柔性电子元件在柔性显示、薄膜太阳能、生物医学等领域具有广泛的应用。良好的柔性和电学性能是柔性电子元件最重要的特征,其中柔性主要由柔性材料实现,导电性能则主要取决于基板上薄膜的材料特性和图案制作精度。基于导电性能、制作工艺和制作成本等影响因素,电路中使用最多的是铜、铝和银三种材料。这三类材料在传统的硅基集成电路中,都会发生电迁移现象。Printed circuit technology is to manufacture electronic materials into electronic devices by printing. Combined with flexible electronic technology, such electronic devices can be fabricated on flexible substrates, so that electronic devices have the characteristics of good ductility, lightness, thinness and transparency. It has a wide range of applications in display, thin film solar energy, biomedicine and other fields. Good flexibility and electrical properties are the most important features of flexible electronic components. The flexibility is mainly achieved by flexible materials, and the electrical conductivity mainly depends on the material properties of the film on the substrate and the pattern fabrication accuracy. Based on influencing factors such as electrical conductivity, manufacturing process and manufacturing cost, the three most commonly used materials in circuits are copper, aluminum and silver. These three types of materials all experience electromigration in traditional silicon-based integrated circuits.
在柔性电子印刷电路中,目前主要采用铜和银材料进行制作。除了机械损伤、腐蚀和高温等因素导致电路失效外,电迁移失效现象仍然不可忽视。此时电迁移的现象比其在硬质电路基板中更加复杂,目前柔性电路的电迁移测试通常由人工手动完成通电过程,然后使用扫描电子显微镜进行观察分析失效状态,存在工艺困难大、检测过程无法实现自动化的缺陷,已经不能满足人们的要求。In flexible electronic printed circuits, copper and silver materials are currently mainly used for production. In addition to circuit failure caused by mechanical damage, corrosion, and high temperature, the electromigration failure phenomenon still cannot be ignored. At this time, the phenomenon of electromigration is more complicated than that in rigid circuit substrates. At present, the electromigration test of flexible circuits is usually performed manually by manually completing the power-on process, and then using a scanning electron microscope to observe and analyze the failure state. Defects that cannot be automated can no longer meet people's requirements.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种柔性电子元件吸附台,解决现有技术存在的缺憾。The purpose of the present invention is to provide a flexible electronic component adsorption table to solve the shortcomings of the prior art.
本发明采用如下技术方案实现:The present invention adopts the following technical scheme to realize:
一种柔性电子元件吸附台,其特征在于,该吸附台具有一个支座底盘,在所述支座底盘上安装有一个水平导轨,所述水平导轨的两端固定 在支座底盘的两个突块之间,在所述水平导轨上安装有移动块,所述移动块与水平导轨滑动连接,在移动块上安装有一个固定框架,所述固定框架具有一个尖端突起,在所述尖端突起的下方设置有一个推动件。A flexible electronic component adsorption table, characterized in that the adsorption table has a support chassis, a horizontal guide rail is installed on the support chassis, and both ends of the horizontal guide rail are fixed on two protrusions of the support chassis. Between the blocks, a moving block is installed on the horizontal guide rail, the moving block is slidably connected with the horizontal guide rail, and a fixed frame is installed on the moving block, the fixed frame has a tip protrusion, and the tip protrusion is A pusher is provided below.
进一步的,在所述固定框架上设置有孔洞。Further, holes are provided on the fixing frame.
进一步的,在所述支座底盘的下边安装有气缸和抽空气机。Further, a cylinder and an air extractor are installed under the support chassis.
进一步的,所述固定框架与所述移动块的连接关系为铰接。Further, the connection relationship between the fixed frame and the moving block is hinged.
本发明具备的有益技术效果是:在固定框架上设置有均匀分布的孔洞,将柔性电子元件平铺在固定框架的上方后,通过抽空气机进行抽气,利用气压强度的不同将柔性电子元件紧紧地贴在固定框架上,实现了检测产品的自动化,减少了因电子元件的柔性而造成的误差,使得检测结果更加准确。The beneficial technical effects of the present invention are: uniformly distributed holes are arranged on the fixed frame, after the flexible electronic components are laid flat on the fixed frame, the air is pumped by an air suction machine, and the flexible electronic components are evacuated by different air pressure strengths. It is tightly attached to the fixed frame, which realizes the automation of testing products, reduces the errors caused by the flexibility of electronic components, and makes the testing results more accurate.
[根据细则91更正 23.12.2020]
图1是本发明柔性电子元件吸附台的结构示意图。
图2是固定框架的结构示意图。
图3是孔洞的结构示意图。[Correction 23.12.2020 under Rule 91]
FIG. 1 is a schematic structural diagram of a flexible electronic component adsorption stage of the present invention.
FIG. 2 is a schematic view of the structure of the fixed frame.
FIG. 3 is a schematic view of the structure of the hole.
图1是本发明柔性电子元件吸附台的结构示意图。
图2是固定框架的结构示意图。
图3是孔洞的结构示意图。[Correction 23.12.2020 under Rule 91]
FIG. 1 is a schematic structural diagram of a flexible electronic component adsorption stage of the present invention.
FIG. 2 is a schematic view of the structure of the fixed frame.
FIG. 3 is a schematic view of the structure of the hole.
通过下面对实施例的描述,将更加有助于公众理解本发明,但不能也不应当将申请人所给出的具体的实施例视为对本发明技术方案的限制,任何对部件或技术特征的定义进行改变和/或对整体结构作形式的而非实质的变换都应视为本发明的技术方案所限定的保护范围。The following description of the embodiments will be more helpful for the public to understand the present invention, but the specific embodiments given by the applicant cannot and should not be regarded as limitations on the technical solutions of the present invention. Changes in the definition of the present invention and/or formal but not substantial changes to the overall structure shall be regarded as the protection scope limited by the technical solutions of the present invention.
附图标记说明:支座底盘1、水平导轨2、移动块3、固定框架4、气缸5、推动件6、孔洞7Description of reference numerals: support chassis 1, horizontal guide rail 2, moving block 3, fixed frame 4, cylinder 5, pusher 6, hole 7
如图1至图3所示的柔性电子元件吸附台,该吸附台具有一个支座底盘1,在支座底盘1上安装有一个水平导轨2,水平导轨2的两端固定在支座底盘1的两个突块之间,在水平导轨2上安装有移动块3,移动块3与水平导轨1之间的连接关系是滑动连接,在移动块3上安装有 一个固定框架4,固定框架4与移动块3的连接关系为铰接,固定框架4上设置有孔洞7,孔洞7的作用是通过抽空气机(图中未示出)将大气空气抽出,利用大气压强将柔性电子器件紧紧地贴在固定框架4的表面,使得柔性电子元件与吸附台的连接度更加紧密。固定框架4具有一个尖端突起,尖端突起的存在使得固定框架4在整体上为正立的三角形,在尖端突起的下方设置有一个推动件6,在支座底盘上安装有气缸5和抽空气机。固定框架4的上表面为支撑面,通过在气缸5的作用下相互转动,使柔性电子元件在检测过程中通过达到各种不同的角度,保证柔性电子元件处于固定框架的中心位置,确保检测的精度。As shown in FIG. 1 to FIG. 3, the adsorption table for flexible electronic components has a support chassis 1, a horizontal guide rail 2 is installed on the support chassis 1, and both ends of the horizontal guide rail 2 are fixed on the support chassis 1. Between the two protrusions, a moving block 3 is installed on the horizontal guide rail 2, and the connection relationship between the moving block 3 and the horizontal guide rail 1 is a sliding connection, and a fixed frame 4 is installed on the moving block 3, and the fixed frame 4 The connection relationship with the moving block 3 is hinged, and the fixed frame 4 is provided with a hole 7. The function of the hole 7 is to extract the atmospheric air through an air extractor (not shown in the figure), and use the atmospheric pressure to tightly tighten the flexible electronic device. It is attached to the surface of the fixed frame 4 to make the connection between the flexible electronic components and the adsorption table more closely. The fixed frame 4 has a pointed protrusion, the existence of the pointed protrusion makes the fixed frame 4 an upright triangle as a whole, a pusher 6 is arranged under the pointed protrusion, and a cylinder 5 and an air extractor are installed on the support chassis . The upper surface of the fixed frame 4 is a supporting surface, and by rotating each other under the action of the cylinder 5, the flexible electronic components can reach various angles during the detection process, so as to ensure that the flexible electronic components are in the center of the fixed frame and ensure the detection accuracy. precision.
本实施例通过在固定框架上设置均匀分布的孔洞7,将柔性电子元件平铺在固定框架的上方后,通过抽空气机进行抽气,利用气压强度的不同将柔性电子元件紧紧地贴在固定框架上,实现了检测产品的自动化,减少了因电子元件的柔性而造成的误差,使得检测结果更加准确。In this embodiment, uniformly distributed holes 7 are arranged on the fixed frame, and after the flexible electronic components are laid flat on the top of the fixed frame, the air is pumped by an air suction machine, and the flexible electronic components are tightly adhered to the different air pressure strengths. On the fixed frame, the automation of the detection product is realized, the error caused by the flexibility of the electronic components is reduced, and the detection result is more accurate.
当然,本发明还可以有其他多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员可以根据本发明做出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Of course, the present invention can also have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the protection scope of the appended claims of the present invention.
Claims (4)
- 一种柔性电子元件吸附台,其特征在于,该吸附台具有一个支座底盘,在所述支座底盘上安装有一个水平导轨,所述水平导轨的两端固定在支座底盘的两个突块之间,在所述水平导轨上安装有移动块,所述移动块与水平导轨滑动连接,在移动块上安装有一个固定框架,所述固定框架具有一个尖端突起,在所述尖端突起的下方设置有一个推动件。A flexible electronic component adsorption table, characterized in that the adsorption table has a support chassis, a horizontal guide rail is installed on the support chassis, and both ends of the horizontal guide rail are fixed on two protrusions of the support chassis. Between the blocks, a moving block is installed on the horizontal guide rail, the moving block is slidably connected with the horizontal guide rail, and a fixed frame is installed on the moving block, the fixed frame has a tip protrusion, and the tip protrusion is A pusher is provided below.
- 根据权利要求1所述的柔性电子元件吸附台,其特征在于,在所述固定框架上设置有孔洞。The flexible electronic component adsorption table according to claim 1, wherein a hole is provided on the fixed frame.
- 根据权利要求1所述的柔性电子元件吸附台,其特征在于,在所述支座底盘的下边安装有气缸和抽空气机。The flexible electronic component adsorption table according to claim 1, wherein a cylinder and an air extractor are installed on the lower side of the support chassis.
- 根据权利要求3所述的柔性电子元件吸附台,其特征在于,所述固定框架与所述移动块的连接关系为铰接。The flexible electronic component adsorption table according to claim 3, wherein the connection relationship between the fixed frame and the moving block is hinged.
Applications Claiming Priority (2)
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CN202011088083.6A CN112379241A (en) | 2020-10-13 | 2020-10-13 | Flexible electronic component adsorbs platform |
CN202011088083.6 | 2020-10-13 |
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CN113453534B (en) * | 2021-07-01 | 2022-01-28 | 哈尔滨学院 | Mounting equipment for flexible electronic device |
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