WO2022071235A1 - Module de circuit - Google Patents

Module de circuit Download PDF

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Publication number
WO2022071235A1
WO2022071235A1 PCT/JP2021/035422 JP2021035422W WO2022071235A1 WO 2022071235 A1 WO2022071235 A1 WO 2022071235A1 JP 2021035422 W JP2021035422 W JP 2021035422W WO 2022071235 A1 WO2022071235 A1 WO 2022071235A1
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WO
WIPO (PCT)
Prior art keywords
component
wires
wire
substrate
terminal
Prior art date
Application number
PCT/JP2021/035422
Other languages
English (en)
Japanese (ja)
Inventor
喜人 大坪
壮央 竹内
毅 高倉
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN202190000772.9U priority Critical patent/CN220233160U/zh
Publication of WO2022071235A1 publication Critical patent/WO2022071235A1/fr
Priority to US18/189,500 priority patent/US20230230951A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
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    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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Definitions

  • the present invention relates to a circuit module in which at least one of the electronic components mounted on a board is electrically connected to the board by a wire.
  • a circuit module including a board and electronic components such as inductors and integrated circuits, in which the electrodes of the electronic components mounted on the board and the electrodes of the board are connected via wires by wire bonding or the like. It has been known.
  • the shield reduces the entry of electromagnetic waves into electronic components from the outside.
  • the shield reduces the leakage of electromagnetic waves generated in electronic components to the outside.
  • Patent Document 1 discloses a module package including a plurality of wires covering an electronic component.
  • each wire covering the electronic component is connected to the substrate at two points, one end and the other end.
  • Pads need to be formed at the points of connection with the wires on the substrate. That is, two pads need to be formed on the substrate for each wire. That is, a large number of pads need to be formed on the substrate in order for all the wires to be connected to the substrate. Therefore, many of the areas on the substrate are occupied by these pads. As a result, the area on the board for mounting the electronic component may be reduced.
  • an object of the present invention is to solve the above-mentioned problems, and even when a wire for shielding an electronic component is connected to a substrate, the area for mounting the electronic component on the substrate is reduced.
  • the purpose is to provide a circuit module capable of suppressing the above.
  • the circuit module is With the board The first component mounted on the board and having a ground terminal on the upper surface, A first wire connecting the ground terminal and the substrate, The second component mounted on the board is provided. In a plan view, the second component overlaps with the first wire.
  • the present invention even when a wire for shielding an electronic component is connected to a substrate, it is possible to suppress a decrease in the area for mounting the electronic component on the substrate.
  • FIG. 1 is a cross-sectional view taken along the line AA in FIG.
  • BB sectional view in FIG. The plan view of the circuit module which concerns on 6th Embodiment of this invention.
  • the circuit module according to one aspect of the present invention is With the board The first component mounted on the board and having a ground terminal on the upper surface, With multiple first wires, A second component mounted on the substrate and overlapping with at least one of the plurality of first wires in a plan view. Each of the plurality of first wires is a circuit module connecting the ground terminal of the first component and the board.
  • the second component overlaps with the first wire in a plan view.
  • the second component can be shielded by the first wire.
  • the first wire is connected to the ground terminal of the first component and the board. That is, the first wire is connected to the substrate at one place. Therefore, the number of pads formed on the substrate can be reduced as compared with the configuration in which the wires are connected to the substrate at two points. As a result, it is possible to suppress a decrease in the area for mounting components such as the first component and the second component on the substrate.
  • the ground potentials of the plurality of first wires can be set to the same potential. That is, it is possible to reduce the variation in the ground potential in the plurality of first wires.
  • the circuit module includes a plurality of the first components, and at least one first wire may be connected to each of the ground terminals of the plurality of the first components.
  • the second component can be shielded by a large number of first wires. This makes it possible to enhance the shielding effect on the second component.
  • each of the plurality of first components is mounted at different positions. Therefore, the second component can be shielded at high density by the first wire extending from various positions.
  • the first wires connected to different first parts may intersect each other.
  • the density of the plurality of first wires can be increased by the intersection of the plurality of first wires. This makes it possible to enhance the shielding effect on the second component.
  • the first component may be an inductor.
  • a large number of inductors are arranged around an LNA (Low Noise Amplifier), which is a kind of component mounted on a board.
  • LNA Low Noise Amplifier
  • these inductors those connected to the ground can be used as the first component.
  • the second component may be an element constituting a matching circuit.
  • a large number of elements constituting the matching circuit of the LNA are arranged around an LNA (Low Noise Amplifier), which is a kind of component mounted on a substrate. These elements can be shielded by the first wire.
  • LNA Low Noise Amplifier
  • the circuit module according to one aspect of the present invention is mounted on the substrate and includes a third component having a ground terminal on the upper surface thereof, and the first wire is connected to the ground terminal of the third component. It may be connected to the board via three components. According to this configuration, the first wire is connected to the first component and the third component. That is, the first wire is not directly connected to the substrate. Therefore, it is not necessary to form a pad for connecting the first wire on the substrate.
  • the ground terminal of the first component may be electrically connected to an electrode arranged on the substrate via a through hole penetrating the first component. According to this configuration, even a component having terminals only on the lower surface can function as the first component by providing a through hole and providing terminals on the upper surface.
  • the circuit module according to one aspect of the present invention is mounted on the substrate and includes a support component that supports the first component, and the first component is supported by the support component and is supported via the support component. It may be mounted on the substrate. According to this configuration, since the first component is supported by the support component, the first wire extending from the first component can be positioned at a high position. This makes it possible to reduce the possibility that the first wire will come into contact with the second component.
  • the circuit module includes a second wire connecting the second component and the substrate, and the second component has a terminal to which the second wire is connected on the upper surface.
  • the second wire does not have to intersect the first wire at a position overlapping the second component in a plan view.
  • the second wire when the second wire is connected to the ground, the second wire has a function of shielding the second component as well as the first wire.
  • the first wire covering the second component and the second wire extending from the second component do not intersect directly above the second component.
  • the shielding effect on the second component can be enhanced.
  • the circuit module includes a second wire connecting the second component and the substrate, and the second component has a terminal to which the second wire is connected on the upper surface.
  • the second wire may extend from the terminal so as to be away from the first wire at a position overlapping the second component in a plan view.
  • the ground terminal of the first component may be separated from the mounting surface of the second component in a direction orthogonal to the mounting surface of the board on which the first component and the second component are mounted. According to this configuration, it is possible to prevent the first wire connected to the ground terminal of the first component from interfering with the second component.
  • FIG. 1 is a plan view of a circuit module according to the first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • circuit module 1 various electronic components are mounted on the surface of the substrate, and an insulating resin layer is formed on the surface of the substrate so as to wrap the electronic components.
  • the circuit module 1 is used in, for example, wireless devices such as mobile phones and car phones, and various other communication devices.
  • the circuit module 1 includes a substrate 20, electronic components 31 to 35, a wire 40, a sealing resin 50, and a shield film 60.
  • the upper film 61 and the sealing resin 50 of the shield film 60 are not shown.
  • the circuit module 1 has a rectangular parallelepiped shape as a whole.
  • the directions of each side of the circuit module 1 having a rectangular parallelepiped shape are defined as the longitudinal direction 2, the lateral direction 3, and the height direction 4, respectively.
  • the side on which the upper film 61 (see FIG. 2) of the shield film 60 is located is defined as above the height direction 4.
  • the shape of the circuit module 1 is not limited to the rectangular parallelepiped shape.
  • the substrate 20 is made of a resin such as glass epoxy, Teflon (registered trademark), paper phenol, ceramic such as alumina, and the like.
  • the substrate 20 is a four-layer substrate in which four substrates 21, 22, 23, and 24 are laminated in this order from the bottom.
  • the substrate 20 may be a multilayer substrate having a number of layers other than four, or may be a single-layer substrate.
  • the via conductor 25 is formed on the substrate 20.
  • a plurality of via conductors 25 are formed on the substrate 20.
  • the via conductor 25 is formed on the substrates 21 and 24.
  • the via conductor 25 may or may not be formed on the substrates 22 and 23, or may not be formed on the substrates 21 and 24.
  • the via conductor 25 is formed by plating a conductive metal made of copper or the like in through holes (vias) penetrating the substrates 21, 22, 23, 24 up and down, or ceramic.
  • a conductive paste and co-fired with ceramic In the case of a substrate, it is filled with a conductive paste and co-fired with ceramic.
  • the wiring electrode 26 is formed on the substrate 20.
  • a plurality of wiring electrodes 26 are formed on the substrate 20.
  • the wiring electrode 26 is sandwiched between the front surface 20A of the substrate 20 (upper surface of the substrate 24), the back surface 20B of the substrate 20 (lower surface of the substrate 21), and two adjacent substrates of the substrates 21, 22, 23, and 24. It is formed on the inner surface 20C.
  • the wiring electrode 26 is not formed on the inner surface 20C located in the center of the height direction 4 of the three inner surfaces 20C.
  • FIG. 1 (and FIGS. 3, 5, 7, and 8 described later)
  • the wiring electrode 26 formed on the surface 20A of the substrate 20 is shown as a circle.
  • the wiring electrode 26 is a pad having the same size as that shown in the cross-sectional view of FIG. 2 (and FIGS. 4 and 6 described later).
  • the pad is, for example, rectangular in a plan view, but may have other shapes.
  • the wiring electrode 26 is obtained by printing a conductive paste on a pad formed on each surface (front surface 20A, back surface 20B, inner surface 20C) of the substrate 20 and co-firing with the ceramic substrate.
  • the conductive paste is composed of, for example, copper.
  • the wiring electrode 26 is formed on a pad on each surface of the substrate 20 by a known means such as etching a metal foil.
  • Each wiring electrode 26 is electrically connected to another wiring electrode 26 via a via conductor 25.
  • At least a part of the wiring electrode 26 formed on the back surface 20B of the substrate 20 is a terminal electrode.
  • the terminal electrode is connected to a wiring electrode formed on the board or the like.
  • 19 electronic components 31 to 35 are mounted on the surface 20A of the substrate 20.
  • the 19 electronic components 31 to 35 have two integrated circuits 31 (for example, LNA or PA (Power Amplifier)), four filter components 32, six capacitors 33, and one antenna.
  • the element 34 and the six inductors 35 are two integrated circuits 31 (for example, LNA or PA (Power Amplifier)), four filter components 32, six capacitors 33, and one antenna.
  • the element 34 and the six inductors 35 are two integrated circuits 31 (for example, LNA or PA (Power Amplifier)
  • LNA Low Noise Amplifier
  • the arrangement position of the electronic component mounted on the substrate 20 is not limited to the arrangement position shown in FIG. Further, the number of electronic components mounted on the substrate 20 is not limited to 19.
  • the number of the integrated circuit 31, the filter component 32, the capacitor 33, the antenna element 34, and the inductor 35 mounted on the substrate 20 is not limited to the above-mentioned number.
  • the types of the electronic components 30 are not limited to those described above (integrated circuit 31, filter component 32, capacitor 33, antenna element 34, and inductor 35), and various known electronic components can be mounted on the substrate 20.
  • the electronic component 30 may be mounted on the back surface 20B of the substrate 20.
  • the electronic component 30 is mounted on the substrate 20 by various known mounting methods.
  • one inductor 35A is mounted on the substrate 20 by wire bonding. That is, the inductor 35A is connected to the wiring electrode 26 via the wire 40.
  • the inductor 35A is an example of the first component.
  • the electronic components 30 other than the inductor 35A are mounted on the substrate 20 by a mounting method that does not use the wire 40, for example, a flip chip.
  • the electronic component 30 other than the inductor 35A may be mounted on the substrate 20 by wire bonding.
  • the wiring of the wire 40 will be described in detail later.
  • the sealing resin 50 is provided on the surface 20A of the substrate 20.
  • the sealing resin 50 is made of an electrically insulated resin such as an epoxy resin.
  • the sealing resin 50 covers the electronic components 31 to 35.
  • the electronic components 31 to 35 are completely embedded in the sealing resin 50.
  • the sealing resin 50 may cover only a part of each electronic component 30.
  • a small electronic component may be completely embedded in the sealing resin 50, while a portion of the large electronic component other than the upper surface thereof may be embedded in the sealing resin 50.
  • the shield film 60 is provided so as to cover the substrate 20 and the sealing resin 50 from above. As shown in FIG. 1, the shield film 60 surrounds a plurality of electronic components 31 to 35 mounted on the substrate 20 in a plan view.
  • the shield film 60 is made of a conductive member such as copper.
  • the shield film 60 includes an upper film 61 and a side film 62.
  • the side membrane 62 extends downward from the peripheral edge of the superior membrane 61. That is, the shield film 60 has a box shape that is open downward.
  • the upper film 61 is in contact with the upper surface of the sealing resin 50. That is, the upper film 61 covers the upper part of the sealing resin 50.
  • the side film 62 is in contact with the side surface of the sealing resin 50 and the side surface of the substrate 20. That is, the side film 62 covers the side of the sealing resin 50 and the side of the substrate 20. From the above, the shield film 60 covers the side of the substrate 20 and the side and the upper side of the sealing resin 50.
  • the shield film 60 is grounded by being directly or indirectly connected to the housing of the device including the circuit module 1. That is, the potential of the shield film 60 is the ground potential.
  • the shield film 60 may cover at least a part of the sealing resin 50.
  • the shield film 60 does not have to include the side film 62.
  • the shield film 60 covers the upper side of the sealing resin 50, but does not cover the sides of the sealing resin 50.
  • the wiring of the wire 40 will be described below.
  • the circuit module 1 includes six wires 40 as shown in FIG.
  • the six wires 40 are composed of one wire 401 and five wires 402 to 406.
  • the inductor 35A includes two terminals 35Aa and 35Ab.
  • the terminals 35Aa and 35Ab are formed on the upper surface 35Ac of the inductor 35A.
  • the terminals 35Aa and 35Ab are located above the inductors 35B, 35C and 35D.
  • the terminals 35Aa and 35Ab are separated from the surface 20A of the substrate 20 by the inductors 35B, 35C and 35D.
  • the surface 20A of the substrate 20 is an example of a mounting surface.
  • the height direction 4 is orthogonal to the surface 20A.
  • the wire 401 connects the terminal 35Aa and the substrate 20 (specifically, the wiring electrode 26A formed on the substrate 20).
  • the wiring electrode 26A is one of a plurality of wiring electrodes 26.
  • the wiring electrode 26A is electrically connected to a device other than the ground (for example, another electronic component 30 or a power source). That is, the terminal 35Aa is connected to the circuit (other than the ground) via the wire 401.
  • the wires 402 to 406 connect the terminal 35Ab and the substrate 20 (specifically, the wiring electrode 26B formed on the substrate 20).
  • the wiring electrode 26B is a part of the plurality of wiring electrodes 26 and is connected to the ground electrode of the substrate 20. Further, as another form, the wiring electrode 26B may be electrically connected to the ground by being connected to the shield film 60 or the like. That is, the terminal 35Ab is connected to the ground via the wires 402 to 406. That is, the inductor 35A is connected to the ground.
  • Wires 402 to 406 are examples of the first wire.
  • the terminal 35Ab is an example of a ground terminal. In FIG. 1 (and FIGS.
  • the wiring electrodes 26B are individually formed for each wire 402 to 406, but are commonly formed for a plurality of wires 40. It is also good. For example, instead of the five wiring electrodes 26B shown in FIG. 1, one wiring electrode is formed over the entire region where the five wiring electrodes 26B are formed, and the five wires 402 to the one wiring electrode are formed. 406 may be connected.
  • One end of the wires 402 to 406 is connected to the terminal 35Ab. That is, five wires 402 to 406 are connected to the terminal 35Ab.
  • Each of the wires 402 to 406 extends from the terminal 35Ab in different directions.
  • the other ends of the wires 402 to 406 are connected to wiring electrodes 26B at different positions on the surface 20A of the substrate 20, respectively.
  • the wires 402 to 406 extend from the terminal 35Ab to the wiring electrode 26B through directly above the shielded component of the electronic component 30.
  • the shield target component is three inductors 35B, 35C, 35D.
  • the inductors 35B, 35C, and 35D are elements constituting the matching circuit of the integrated circuit 31 arranged nearby, and are not connected to the ground.
  • the inductors 35B, 35C and 35D are examples of the second component.
  • the inductor 35A is a wire bonding type inductor
  • the inductors 35B, 35C, 35D are inductors for joining the electrode on the bottom surface of the component and the wiring electrode 26 by soldering.
  • the wires 402, 403, 404, 405 overlap with the inductor 35B. Further, in a plan view, the wire 406 overlaps with the inductor 35C. Further, in a plan view, the wires 404 and 405 overlap with the inductor 35D. As a result, the upper part of the inductors 35B, 35C, 35D is shielded by at least one of the wires 402 to 406. Therefore, in FIG. 1, the wires 402 to 405 also cover the integrated circuit 31 (LNA) other than the inductors 35B, 35C, 35D, but the wires 402 to 406 are the upper portions of the inductors 35B, 35C, 35D. You may cover only.
  • LNA integrated circuit 31
  • the sides of the inductors 35B, 35C, and 35D can be shielded by at least one of the wires 402 to 406.
  • wires 402 are located on both sides of the inductor 35B in the longitudinal direction 2. In this case, both sides of the inductor 35B in the longitudinal direction 2 are shielded by the wires 402.
  • the inductors 35B to 35D overlap with at least one of the wires 402 to 406 in a plan view. Thereby, the inductors 35B to 35D can be shielded by at least one of the wires 402 to 406.
  • the wires 402 to 406 are connected to the terminal 35Ab of the inductor 35A and the substrate 20. That is, the wires 402 to 406 are connected to the substrate 20 at one place. Therefore, the number of pads formed on the substrate 20 can be reduced as compared with the embodiment in which the wires are connected to the substrate 20 at two points. As a result, it is possible to suppress a decrease in the area for mounting the electronic component 30 on the substrate 20.
  • a plurality of wires 402 to 406 are connected to the terminal 35Ab of one inductor 35A. Therefore, the number of pads formed on the substrate 20 can be reduced.
  • the ground potentials of the plurality of wires 402 to 406 can be set to the same potential. That is, it is possible to reduce the variation in the ground potential of the plurality of wires 402 to 406.
  • the wires 402 to 406 can be connected to the one connected to the ground (for example, the inductor 35A).
  • a large number of elements constituting the matching circuit of the LNA are arranged around the LNA (Low Noise Amplifier) which is a kind of the component 31 mounted on the substrate 20.
  • These elements eg, inductors 35B-35D
  • the terminals 35Aa and 35Ab are located above the inductors 35B, 35C and 35D. Therefore, it is possible to prevent the wires 402 to 406 connected to the terminals 35Aa and 35Ab from interfering with the inductors 35B, 35C and 35D.
  • the number of wires 40 extending from the terminal 35Aa of the electronic component (inductor 35A) mounted on the substrate 20 by wire bonding is one (wire 401), and the number of wires 40 extending from the terminal 35Ab is five (wires). It was 402 to 406).
  • the number of wires 40 extending from the terminal 35Aa is not limited to one, and the number of wires 40 extending from the terminal 35Ab is not limited to five.
  • the inductor 35A is mounted on the substrate 20 by wire bonding. That is, the inductor 35A corresponded to the first component.
  • what is mounted on the substrate 20 by wire bonding may be an inductor 35 other than the inductor 35A, or an electronic component other than the inductor 35 such as a capacitor 33. That is, an electronic component other than the inductor 35A may correspond to the first component.
  • the shield target parts are inductors 35B to 35D. That is, the inductors 35B to 35D corresponded to the second component.
  • the shield target component may be an inductor 35 other than the inductors 35B to 35D, or may be an electronic component other than the inductor 35 such as a capacitor 33. That is, electronic components other than the inductors 35B to 35D may correspond to the second component.
  • FIG. 3 is a plan view of the circuit module according to the second embodiment of the present invention.
  • the circuit module 1A according to the second embodiment is different from the circuit module 1 according to the first embodiment in that the circuit module 1A according to the second embodiment includes a plurality of inductors 35A.
  • the circuit module 1A includes two inductors 35A.
  • the circuit module 1A may include three or more inductors 35A.
  • Each inductor 35A includes two terminals 35Aa and 35Ab as in the first embodiment.
  • a wire 401 extends from the terminal 35Aa of each inductor 35A.
  • Each wire 401 is electrically connected to the wiring electrode 26A.
  • At least one wire extends from the terminal 35Ab of each inductor 35A.
  • five wires 402 to 406 extend from one terminal 35Ab of the two inductors 35A, and two wires 407 and 408 extend from the other terminal 35Ab of the two inductors 35A. There is.
  • Each wire 402 to 408 extending from the terminal 35Ab is electrically connected to the wiring electrode 26B.
  • the wires 404 to 406 and the wires 407 and 408 intersect. That is, in a plan view, the wires 404 to 406 connected to one of the two inductors 35A and the wires 407 and 408 connected to the other of the two inductors 35A intersect. That is, in a plan view, the wires connected to different inductors 35A intersect each other. It should be noted that the intersection is not limited to the wires 404 to 406 and the wires 407 and 408.
  • the wire extends from each of the plurality of inductors 35A.
  • the inductors 35B to 35D can be shielded by a large number of wires 402 to 408.
  • the shielding effect for the inductors 35B to 35D can be enhanced.
  • each of the plurality of inductors 35A is mounted at different positions. Therefore, the inductors 35B to 35D can be shielded at high density by the wires 402 to 408 extending from various positions.
  • the density of the plurality of wires 404 to 408 can be increased by the intersection of the wires 404 to 406 and the wires 407 and 408. Thereby, the shielding effect for the inductors 35B to 35D can be enhanced.
  • the circuit module according to the third embodiment is different from the circuit module 1 according to the first embodiment in that the other end of the wire 403 is not connected to the wiring electrode 26B.
  • the circuit module according to the third embodiment includes the filter component 36 as shown by the broken line in FIG. 1 in addition to the electronic components 31 to 35 included in the circuit module 1 according to the first embodiment.
  • the filter component 36 has the same configuration as the filter component 32, and is mounted on the surface 20A of the substrate 20.
  • the filter component 36 is an example of a third component.
  • the third component is not limited to the filter component, and may be another type of electronic component such as an inductor or a capacitor.
  • the filter component 36 includes two terminals 36a and 36b.
  • the terminals 36a and 36b are formed from the upper surface 36c of the filter component 36 to the lower surface.
  • the terminal 36a is electrically connected to the wiring electrode 26A on the lower surface of the filter component 36.
  • the terminal 36b is electrically connected to the wiring electrode 26B electrically connected to the ground on the lower surface of the filter component 36. That is, the terminal 36b functions as a ground terminal.
  • the wire 403 is connected to the inductor 35A and the filter component 36. That is, the wire 403 is not directly connected to the substrate 20. Therefore, it is not necessary to form a pad for connecting the wire 403 on the substrate.
  • the circuit module includes one filter component 36 as an electronic component having a terminal to which the other end of the wire 40 is connected.
  • the circuit module may include a plurality of filter components 36 as electronic components having terminals to which the other end of the wire 40 is connected.
  • one wire 40 is connected to the terminal 36b of the filter component 36.
  • a plurality of wires 40 may be connected to the terminal 36b of the filter component 36.
  • FIG. 4 is a plan view of the circuit module according to the fourth embodiment of the present invention.
  • the circuit module 1B according to the fourth embodiment is different from the circuit module 1 according to the first embodiment in that the integrated circuit 38 as the first component is not mounted on the substrate 20 by wire bonding.
  • the integrated circuit 38 included in the circuit module 1B according to the fourth embodiment is connected to at least one wiring electrode 26 formed on the surface 20A of the substrate 20. That is, the integrated circuit 38 is mounted on the substrate 20 by a mounting method such as a flip chip that does not use a wire.
  • the integrated circuit 38 is TSV (Through-Silicon Via) processed. That is, in the fourth embodiment, the terminal 38Ad is formed on the upper surface 38Ac of the integrated circuit 38. Further, a through hole 38Ae is formed in the integrated circuit 38. The through hole 38Ae is filled with a conductor. One end of the through hole 38Ae communicates with the terminal 38Ad. The other end of the through hole 38Ae communicates with the wiring electrode 26. That is, the terminal 38Ad is electrically connected to the wiring electrode 26 via the through hole 38Ae.
  • the wires 402 to 406 connect the terminal 38Ad and the substrate 20 (specifically, the wiring electrode 26B formed on the substrate 20). Note that, in FIG. 4, only the wire 402 is shown among the wires 402 to 406.
  • the terminal 38Ad is connected to the wiring electrode 26B via wires 402 to 406.
  • the wiring electrode 26B is electrically connected to the ground. That is, the terminal 38Ad functions as a ground terminal.
  • the wiring electrode 26 electrically connected to the terminal 38Ad via the through hole 38Ae may be the wiring electrode 26B electrically connected to the ground.
  • the other end of the wires 402 to 406 may not be connected to the wiring electrode 26B. This is because one end of the wires 402 to 406 is connected to the wiring electrode 26B via the terminal 38Ad and the through hole 38Ae.
  • the electronic component corresponding to the first component may have a terminal functioning as a ground terminal on its upper surface. That is, the mounting method of the electronic component corresponding to the first component is not limited to wire bonding.
  • a component having a terminal only on the lower surface functions as a component that shields another component (for example, an inductor 35B) by providing a through hole 35Ae and a terminal 35Ad on the upper surface.
  • another component for example, an inductor 35B
  • FIG. 5 is a plan view of the circuit module according to the fifth embodiment of the present invention.
  • FIG. 6 is a cross-sectional view taken along the line BB in FIG.
  • the circuit module 1C according to the fifth embodiment is different from the circuit module 1 according to the first embodiment in that the electronic component 37 corresponding to the first component is supported by another electronic component.
  • the electronic component 37 is supported by the upper surface 31Aa of the integrated circuit 31A mounted on the right end portion of the substrate 20 on the paper surface of FIG. 5 in the integrated circuit 31. That is, the electronic component 37 is mounted on the substrate 20 via the integrated circuit 31A.
  • the electronic component 37 is an inductor.
  • the electronic component 37 is not limited to the inductor, but may be another type of electronic component such as a resistor, a capacitor, or an integrated circuit.
  • the electronic component 37 is an example of the first component.
  • the integrated circuit 31A is an example of a support component.
  • the electronic component 37 may be supported by a component other than the integrated circuit 31A.
  • the electronic component 37 may be supported by an integrated circuit 31B mounted on the upper left end of the substrate 20 on the paper surface of FIG. In this case, the integrated circuit 31B corresponds to the support component.
  • the wiring of the wire 40 will be described below.
  • the circuit module 1C includes seven wires 40.
  • the seven wires 40 are composed of three wires 409 and four wires 410 to 413.
  • the electronic component 37 includes two terminals 37a and 37b.
  • the terminals 37a and 37b are formed on the upper surface 37c of the electronic component 37.
  • Each of the three wires 409 connects the terminal 37a and the substrate 20 (specifically, the wiring electrode 26A formed on the substrate 20). That is, the terminal 37a is electrically connected to a device other than the ground (for example, another electronic component 30 or a power source) via the wire 409.
  • Each of the four wires 410 to 413 connects the terminal 37b and the substrate 20 (specifically, the wiring electrode 26B formed on the substrate 20). That is, the terminal 37b is connected to the ground via the wires 410 to 413. Wires 410 to 413 are examples of the first wire.
  • the terminal 37b is an example of a ground terminal.
  • One end of the wires 410 to 413 is connected to the terminal 37b. That is, four wires 410 to 413 are connected to the terminal 37b.
  • Each of the wires 410 to 413 extends from the terminal 37b in different directions.
  • the other ends of the wires 410 to 413 are connected to wiring electrodes 26B at different positions on the surface 20A of the substrate 20, respectively.
  • the wiring electrode 26B is a ground terminal of the substrate 20.
  • the wires 410 to 413 extend from the terminal 37b to the wiring electrode 26B through directly above the shielded component of the electronic component 30.
  • the shield target component is five inductors 35A, 35B, 35C, 35E, 35F.
  • the inductors 35A, 35B, 35C, 35E, and 35F are examples of the second component.
  • the wires 410 and 411 overlap with the inductors 35A and 35B. Further, in a plan view, the wire 412 overlaps with the inductor 35E. Further, in a plan view, the wire 413 overlaps with the inductors 35C and 35F. As a result, the upper part of the inductors 35A, 35B, 35C, 35E, 35F is shielded by at least one of the wires 410 to 413. Further, the sides of the inductors 35A, 35B, 35C, 35E, 35F may be shielded by at least one of the wires 410 to 413. For example, as shown in FIG.
  • the wires 410 and 411 are located on both sides of the inductors 35A and 35B in the longitudinal direction 2. Note that only the wire 410 is shown in FIG. In this case, both sides of the inductors 35A and 35B in the longitudinal direction 2 are shielded by the wires 410 and 411.
  • the wires 410 to 413 extending from the electronic component 37 can be positioned at a high position. As a result, the possibility that the wires 410 to 413 come into contact with the inductors 35A, 35B, 35C, 35E, and 35F can be reduced.
  • the number of wires 40 extending from the terminal 37a of the electronic component 37 mounted on the substrate 20 by wire bonding is three (wire 409), and the number of wires 40 extending from the terminal 37b is four (wires 410 to 413). )Met.
  • the number of wires 40 extending from the terminal 37a is not limited to three, and the number of wires 40 extending from the terminal 37b is not limited to four.
  • FIG. 7 is a plan view of the circuit module according to the sixth embodiment of the present invention.
  • the circuit module 1D according to the sixth embodiment is different from the circuit module 1C according to the fifth embodiment in two points.
  • the first point is that the shielded component is mounted on the substrate 20 by a mounting method via a wire.
  • the second point is that the wire to be shielded and the wire connected to the shield target component do not intersect directly above the shield target component.
  • the circuit module 1D according to the sixth embodiment includes nine inductors 35. Of the nine inductors 35, five inductors 35G to 35K are shield target parts. Of the five inductors 35G to 35K that are the shield target components, three inductors 35G, 35H, and 35K are mounted on the substrate 20 by wire bonding. On the other hand, the remaining six inductors 35 are mounted on the substrate 20 by a mounting method that does not use wires.
  • the circuit module 1D includes eight wires 40, which is one more than the fifth embodiment.
  • the eight wires 40 are the three wires 409 of the fifth embodiment, the four wires 410 to 413, and the added wire 414.
  • the wire 414 connects the terminal 37b and the substrate 20 (specifically, the wiring electrode 26B formed on the substrate 20) in the same manner as the wires 410 to 413. That is, the terminal 37b is connected to the ground via the wires 410 to 414. Wires 410 to 414 are examples of the first wire.
  • the terminal 37b is an example of a ground terminal.
  • One end of the wires 410 to 414 is connected to the terminal 37b.
  • Each of the wires 410 to 414 extends from the terminal 37b in different directions.
  • the other ends of the wires 410 to 414 are connected to wiring electrodes 26B at different positions on the surface 20A of the substrate 20, respectively.
  • the wires 410 to 414 extend from the terminal 37b to the wiring electrode 26B through directly above the shielded component of the electronic component 30.
  • the shield target component is five inductors 35G to 35K as described above.
  • the inductors 35G to 35K are examples of the second component.
  • the wires 410 and 411 overlap with the inductor 35G.
  • the wire 412 overlaps with the inductor 35H.
  • the wire 413 overlaps with the inductors 35I and 35J.
  • the wire 414 overlaps with the inductor 35K.
  • the upper part of the inductors 35G to 35K is shielded by at least one of the wires 410 to 414.
  • the sides of the inductors 35G to 35K can also be shielded by at least one of the wires 410 to 414.
  • the circuit module 1D includes six wires 70 (wires 701 to 706) in addition to the wires 40.
  • the number of wires 70 included in the circuit module 1D is not limited to six.
  • the wire 70 is an example of the second wire.
  • Two terminals 35a are formed on the upper surface 35c of each of the inductors 35G, 35H, and 35K.
  • the wire 70 electrically connects the terminal 35a and the substrate 20 (specifically, the wiring electrode 26 formed on the substrate 20).
  • the wiring electrode 26 to which the wire 70 is connected may be the wiring electrode 26A or the wiring electrode 26B.
  • Each wire 70 extends from each terminal 35a. In other words, one end of each wire 70 is connected to each terminal 35a.
  • Wires 701 and 702 extend from each terminal 35a of the inductor 35G.
  • Wires 703 and 704 extend from each terminal 35a of the inductor 35H.
  • Wires 705 and 706 extend from each terminal 35a of the inductor 35K. The other end of each wire 70 is connected to each wiring electrode 26.
  • the wires 701 and 702 do not intersect the wires 40 (wires 410 and 411) directly above the inductor 35G. In other words, in plan view, the wires 701 and 702 do not intersect the wires 40 (wires 410 and 411) at positions overlapping the inductor 35G.
  • the wire 703 does not intersect the wire 40 (wire 412) directly above the inductor 35H. In other words, in plan view, the wire 703 does not intersect the wire 40 (wire 412) at a position overlapping the inductor 35H.
  • the wire 704 intersects the wire 40 (wire 412) directly above the inductor 35H. Further, the wires 705 and 706 intersect with the wires 40 (wires 413 and 414) directly above the inductor 35K.
  • the wire 70 when the wire 70 is connected to the ground, the wire 70 has a function of shielding the inductors 35G to 35K in the same manner as the wires 410 to 414.
  • the wires 410 and 411 covering the inductor 35G and the wires 701 and 702 extending from the inductor 35G do not intersect directly above the inductor 35G.
  • the wire 412 covering the inductor 35H and the wire 703 extending from the inductor 35H do not intersect directly above the inductor 35H.
  • the wires 410, 414 and the wires 701 and 702 so as to be substantially parallel to each other directly above the inductor 35G, and the wires 412 and the wires 703 are substantially above the inductor 35H. It is easy to arrange them side by side in parallel. As a result, a region close to the surface can be formed by a plurality of wires arranged substantially in parallel, so that the shielding effect on the inductors 35G and 35H can be enhanced.
  • the wires 701 to 703 that do not intersect the wire 40 at the position overlapping with the shield target component in the plan view.
  • it is not limited to the wires 701 to 703 that do not intersect the wire 40 at a position overlapping the shielded component in a plan view.
  • FIG. 8 is a plan view of the circuit module according to the seventh embodiment of the present invention.
  • the circuit module 1E according to the seventh embodiment is different from the circuit module 1C according to the fifth embodiment in two points.
  • the first point is that the shielded component is mounted on the substrate 20 by a mounting method via a wire.
  • the second point is that, in a plan view, the wire extending from the terminal of the shield target component is located directly above the shield target component and extends away from the wire that shields the shield target component. ..
  • the circuit module 1E according to the seventh embodiment includes six inductors 35 (inductors 35A to 35F). All of the six inductors 35A to 35F are shielded parts. Of the six inductors 35A to 35F, which are shield target components, three inductors 35B, 35C, and 35D are mounted on the substrate 20 by wire bonding. On the other hand, the remaining three inductors 35A, 35E, and 35F are mounted on the substrate 20 by a mounting method that does not use wires.
  • the circuit module 1E includes eight wires 40, which is one more than in the fifth embodiment.
  • the eight wires 40 are the three wires 409 of the fifth embodiment, the four wires 410 to 413, and the added wire 414.
  • the wire 414 connects the terminal 37b and the substrate 20 (specifically, the wiring electrode 26B formed on the substrate 20) in the same manner as the wires 410 to 413. That is, the terminal 37b is connected to the ground via the wires 410 to 414. Wires 410 to 414 are examples of the first wire.
  • the terminal 37b is an example of a ground terminal.
  • One end of the wires 410 to 414 is connected to the terminal 37b.
  • Each of the wires 410 to 414 extends from the terminal 37b in different directions.
  • the other ends of the wires 410 to 414 are connected to wiring electrodes 26B at different positions on the surface 20A of the substrate 20, respectively.
  • the wires 410 to 414 extend from the terminal 37b to the wiring electrode 26B through directly above the shielded component of the electronic component 30.
  • the shield target parts are six inductors 35A to 35F as described above.
  • the inductors 35A to 35F are examples of the second component.
  • the wires 410 and 411 overlap with the inductors 35A and 35B. Further, in a plan view, the wire 412 overlaps with the inductor 35E. Further, in a plan view, the wire 413 overlaps with the inductors 35C and 35F. Further, in a plan view, the wire 414 overlaps with the inductor 35D. As a result, the upper part of the inductors 35A to 35F is shielded by at least one of the wires 410 to 414. Although not shown, the sides of the inductors 35A to 35F can also be shielded by at least one of the wires 410 to 414.
  • the circuit module 1E includes six wires 70 (wires 707 to 712) in addition to the wires 40.
  • the number of wires 70 included in the circuit module 1E is not limited to six.
  • the wire 70 is an example of the second wire.
  • Two terminals 35a are formed on the upper surface 35c of each of the inductors 35B, 35C, and 35D.
  • the wire 70 electrically connects the terminal 35a and the substrate 20 (specifically, the wiring electrode 26 formed on the substrate 20).
  • the wiring electrode 26 to which the wire 70 is connected may be the wiring electrode 26A or the wiring electrode 26B.
  • Each wire 70 extends from each terminal 35a. In other words, one end of each wire 70 is connected to each terminal 35a.
  • Wires 707 and 708 extend from each terminal 35a of the inductor 35B.
  • Wires 709 and 710 extend from each terminal 35a of the inductor 35C.
  • Wires 711 and 712 extend from each terminal 35a of the inductor 35D. The other end of each wire 70 is connected to each wiring electrode 26.
  • Each of the wires 707 and 708 extends from the terminal 35a of the inductor 35B so as to be away from the portion of the wires 410 and 411 that overlaps with the inductor 35B in the plan view.
  • Each of the wires 709 and 710 extends from the terminal 35a of the inductor 35C so as to be separated from the portion of the wire 413 that overlaps with the inductor 35C in a plan view.
  • Each of the wires 711 and 712 extends from the terminal 35a of the inductor 35D so as to be away from the portion of the wire 414 that overlaps with the inductor 35D in plan view.
  • the seventh embodiment in the process of connecting the wire 40 to the electronic component 37 and the substrate 20, it is possible to reduce that the connection is obstructed by the wire 70 extending from the inductors 35A to 35F. Further, in the process of connecting the wire 70 to the inductors 35A to 35F and the substrate 20, it is possible to reduce that the connection is obstructed by the wire 40 extending from the electronic component 37.
  • all of the six wires 707 to 712 are located directly above the shielded component and extend away from the wire that shields the shielded component. However, it may be a part of 6 wires 707 to 712.
  • Circuit module 20 Board 31A Electronic components (support components) 35A inductor (first component) 35a terminal 35c top surface 35Ab terminal 35Ac top surface 35B inductor (second component) 35C inductor (second component) 35D inductor (second component) 36 Filter parts (3rd parts) 40 wire 402 wire (first wire) 403 wire (first wire) 404 wire (first wire) 405 wire (first wire) 406 wire (first wire) 70 wire (second wire)

Abstract

L'invention concerne un module de circuit dans lequel une réduction de la surface de montage de composants électroniques sur un substrat peut être supprimée même lorsque des fils pour blinder les composants électroniques sont connectés au substrat. Ce module de circuit 1 comprend : un substrat 20 ; un inducteur 35A qui est monté sur le substrat 20 et qui a une surface supérieure 35Ac avec une borne 35Ab disposée sur celle-ci ; des fils 402-406 qui connectent la borne 35Ab de l'inducteur 35A et le substrat 20 ; et des inducteurs 35B-35D qui sont montés sur le substrat 20. Dans une vue en plan, les inducteurs 35B-35D chevauchent les fils 402-406.
PCT/JP2021/035422 2020-10-02 2021-09-27 Module de circuit WO2022071235A1 (fr)

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US18/189,500 US20230230951A1 (en) 2020-10-02 2023-03-24 Circuit module

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JP2020167857 2020-10-02

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JP2020108069A (ja) * 2018-12-28 2020-07-09 株式会社村田製作所 高周波モジュールおよび通信装置

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