WO2022062306A1 - 环氧基和活泼氢摩尔量不匹配的环氧树脂组合物 - Google Patents
环氧基和活泼氢摩尔量不匹配的环氧树脂组合物 Download PDFInfo
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- WO2022062306A1 WO2022062306A1 PCT/CN2021/075993 CN2021075993W WO2022062306A1 WO 2022062306 A1 WO2022062306 A1 WO 2022062306A1 CN 2021075993 W CN2021075993 W CN 2021075993W WO 2022062306 A1 WO2022062306 A1 WO 2022062306A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- epoxy
- active hydrogen
- ether
- resin composition
- Prior art date
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 90
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 90
- 239000000203 mixture Substances 0.000 title claims abstract description 61
- 229910052739 hydrogen Inorganic materials 0.000 title claims abstract description 39
- 239000001257 hydrogen Substances 0.000 title claims abstract description 39
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 125000003700 epoxy group Chemical group 0.000 title claims abstract description 31
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 38
- 238000002156 mixing Methods 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims description 47
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 34
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 18
- -1 alkyl glycidyl ether Chemical compound 0.000 claims description 16
- 239000003085 diluting agent Substances 0.000 claims description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 9
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 150000003335 secondary amines Chemical class 0.000 claims description 7
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims description 5
- 238000006683 Mannich reaction Methods 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 5
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims description 4
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 claims description 4
- 150000002989 phenols Chemical class 0.000 claims description 4
- 150000003141 primary amines Chemical class 0.000 claims description 4
- 150000003512 tertiary amines Chemical group 0.000 claims description 4
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 claims description 3
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical compound OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 claims description 3
- 229920000768 polyamine Polymers 0.000 claims description 3
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 2
- YQMXOIAIYXXXEE-UHFFFAOYSA-N 1-benzylpyrrolidin-3-ol Chemical compound C1C(O)CCN1CC1=CC=CC=C1 YQMXOIAIYXXXEE-UHFFFAOYSA-N 0.000 claims description 2
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 claims description 2
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 claims description 2
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 2
- NPKKFQUHBHQTSH-UHFFFAOYSA-N 2-(decoxymethyl)oxirane Chemical compound CCCCCCCCCCOCC1CO1 NPKKFQUHBHQTSH-UHFFFAOYSA-N 0.000 claims description 2
- HRWYHCYGVIJOEC-UHFFFAOYSA-N 2-(octoxymethyl)oxirane Chemical compound CCCCCCCCOCC1CO1 HRWYHCYGVIJOEC-UHFFFAOYSA-N 0.000 claims description 2
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims description 2
- NWLUZGJDEZBBRH-UHFFFAOYSA-N 2-(propan-2-yloxymethyl)oxirane Chemical compound CC(C)OCC1CO1 NWLUZGJDEZBBRH-UHFFFAOYSA-N 0.000 claims description 2
- KFUSXMDYOPXKKT-UHFFFAOYSA-N 2-[(2-methylphenoxy)methyl]oxirane Chemical compound CC1=CC=CC=C1OCC1OC1 KFUSXMDYOPXKKT-UHFFFAOYSA-N 0.000 claims description 2
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 claims description 2
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 claims description 2
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 claims description 2
- LUSCNZBJFBNVDT-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxy)cyclohexyl]oxymethyl]oxirane Chemical compound C1OC1COC1(OCC2OC2)CCCCC1 LUSCNZBJFBNVDT-UHFFFAOYSA-N 0.000 claims description 2
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 claims description 2
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 claims description 2
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 claims description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims 1
- 125000005587 carbonate group Chemical group 0.000 claims 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000002474 experimental method Methods 0.000 abstract description 3
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000009755 vacuum infusion Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000009745 resin transfer moulding Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 150000004985 diamines Chemical group 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- PXSXRABJBXYMFT-UHFFFAOYSA-N n-hexylhexan-1-amine Chemical compound CCCCCCNCCCCCC PXSXRABJBXYMFT-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- WTFAGPBUAGFMQX-UHFFFAOYSA-N 1-[2-[2-(2-aminopropoxy)propoxy]propoxy]propan-2-amine Chemical compound CC(N)COCC(C)OCC(C)OCC(C)N WTFAGPBUAGFMQX-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- 239000009261 D 400 Substances 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- OZCWUNHGNVXCCO-UHFFFAOYSA-N oxiran-2-ylmethyl hydrogen carbonate Chemical group OC(=O)OCC1CO1 OZCWUNHGNVXCCO-UHFFFAOYSA-N 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/50—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing nitrogen, e.g. polyetheramines or Jeffamines(r)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Definitions
- the invention belongs to the technical field of polymer materials, and relates to an epoxy resin composition with mismatched molar weights of epoxy groups and active hydrogen.
- Epoxy resins are widely used because of their excellent adhesion, corrosion resistance, heat resistance and mechanical properties, typically in coatings, adhesives and composites.
- Curable epoxy resin systems generally consist of two components, one of which is an epoxy resin and the other a curing agent. When curing at medium and low temperature, the curing agent component is generally an amine compound.
- the epoxy resin has a lower room temperature viscosity. Due to the high viscosity of commonly used epoxy resins, it is difficult to use directly.
- reactive diluents are added to general-purpose epoxy resins, and then mixed with low-viscosity curing agents to reduce the mixed viscosity of epoxy resin systems.
- the addition of reactive diluents often reduces the performance of epoxy resins, especially the heat resistance, which requires the use of some curing agents with better temperature resistance to make up.
- the resin mixture has a long gel time at room temperature to ensure that the resin can penetrate the reinforcing fibers; at the same time, it is hoped that the epoxy resin can be quickly cured after proper heating; It is a pair of conflicting needs.
- the curing agents with good temperature resistance mentioned above are generally alicyclic amines or aromatic amines, which have low reactivity with epoxy resins, which will reduce the later curing speed and degree of epoxy resins.
- the epoxy resin component is selected from bisphenol A epoxy resin, and a certain amount of 1,4-butanediol is added. Diglycidyl ether, 1,6-hexanediol diglycidyl ether and other diluents to reduce the viscosity of epoxy resin components.
- the curing agent component is polyetheramine with longer gel time, and a certain amount of isophorone diamine (IPDA) is added to make up for the heat loss caused by adding diluent.
- IPDA isophorone diamine
- IPDA isophorone diamine
- US Patent 4,269,742 discloses the preparation of Mannich base compounds and their use as epoxy curing agents, which can cure epoxy resins at low temperature and quickly.
- U.S. Patent 8,735,512 discloses the preparation and use of Mannich base compounds based on N,N'-dimethyl secondary diamine polymers. It can be seen from the above that the Mannich base is mainly used as a fast curing agent or accelerator in the epoxy resin system, which generally shortens the gel time at room temperature and promotes the curing reaction at the same time. It is used for slow-gel epoxy resins. system has not yet been reported.
- the common Mannich base type curing agent is synthesized with diamine or polyamine, and its viscosity is usually high, which is difficult to use in vacuum infusion and RTM process to produce composite materials.
- the problem to be solved by the present invention is to provide an epoxy resin composition with mismatched molar amounts of epoxy groups and active hydrogens, under the premise of ensuring that the resin system has lower initial mixing viscosity, certain heat resistance and mechanical properties , with a long gel time in the early stage, and fast and complete curing in the later stage.
- An epoxy resin composition with mismatched molar amounts of epoxy groups and active hydrogen comprising epoxy resin component and curing agent component, and the mixing ratio of epoxy resin and curing agent component does not use epoxy equivalent and active hydrogen
- the epoxy resin components include:
- Bisphenol A type epoxy resin the content is 50-100%wt;
- the curing agent components include:
- Polyetheramine the content is 60-98%wt
- the epoxy resin composition has a longer gel time at a temperature of 25°C, and the gel time of 100g of the composition in air is greater than 6 hours; at a temperature of 60°C, the gel time is shorter, and the 50g and 20g compositions have a shorter gel time.
- the gel time in air is less than 1 hour.
- the epoxy resin component further includes bisphenol F type epoxy resin, and the content is 0-50%wt.
- the epoxy resin component further includes an epoxy reactive diluent in an amount of 0-50%wt.
- the epoxy reactive diluent refers to epoxy compounds with lower viscosity, including but not limited to allyl glycidyl ether, butyl glycidyl ether, octyl glycidyl ether, isopropyl glycidyl ether , phenyl glycidyl ether, o-tolyl glycidyl ether, methacrylate glycidyl ether, benzyl glycidyl ether, p-tert-butylphenyl glycidyl ether, decyl glycidyl ether, cardanol glycidyl ether, carbon 8 -18 alkyl glycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1,4-but
- the epoxy resin component further includes glycidyl ester, glycidyl amine, alicyclic epoxy, and novolac epoxy resin, and the content is 0-10%wt.
- the curing agent component further includes a monobasic, dibasic or polyamine compound containing primary amine, secondary amine or tertiary amine functional group, and the content is 0-10%wt.
- the polyetheramine refers to a type of polymer whose main chain is a polyether structure and the terminal active functional group is an amine group.
- Typical trade names include Huntsman's JEFFAMINE D-230, D-400, T403, and BASF's Baxxodur EC301, EC302, EC303, etc.
- the low-viscosity Mannich base refers to a product that has a viscosity of less than 400 mPa.s at 25° C. and is synthesized from phenolic compounds, amine compounds, and aldehyde compounds through Mannich reaction.
- the ratio of monohydric phenol to phenolic raw materials in the raw materials of the above Mannich reaction is more than 80%wt
- the ratio of monohydric secondary amine to amine raw materials is more than 80%wt
- the ratio of formaldehyde to aldehydes is more than 80%wt , in order to obtain low viscosity characteristics.
- the viscosity value of the above-mentioned Mannich base is measured by using a Brookfield DV2TLV rotational viscometer, using a 62# rotor and rotating at 60 RPM.
- the ratio of epoxy resin and curing agent is generally calculated according to the epoxy equivalent of epoxy resin and the active hydrogen equivalent of curing agent; The number of moles is equal or there is a slight excess of active hydrogen. Excessive epoxy groups generally reduce the thermal and mechanical properties of the epoxy resin system.
- the epoxy equivalent of commonly used liquid bisphenol A epoxy resin is 180-190
- the active hydrogen equivalent of Baxxodur EC301 polyetheramine of BASF company is 61.
- the amount of EC301 that should be added is as follows Formula calculation:
- the amount of EC301 that should be added is between 32-34.
- the amine curing agent will be slightly excessive, and take 34 parts.
- the addition amount of curing agent is reduced on the basis of theoretical calculation, and the epoxy group is excessive. Determined by measuring the highest Tg value of the cured product.
- the epoxy groups are excessive, the crosslinking density of the cured product will be reduced, and thus the heat resistance and mechanical properties of the cured product will be reduced.
- the residual epoxy groups will be further reacted, thereby increasing the crosslinking density and thus the resin. Heat resistance and mechanical properties of the system.
- Common Mannich base epoxy curing agents are usually synthesized from phenol, formaldehyde, and diethylamine (dihexylamine, diethylenetriamine, triethylenetetramine). Due to their high functionality, the viscosity of the product is relatively high. High, containing more primary and secondary amine groups, more active hydrogen. When this type of curing agent cures epoxy, it mainly depends on the reaction between the active hydrogen on the primary and secondary amine groups and the epoxy resin, so its proportion should follow the principle of matching the epoxy equivalent and the active hydrogen equivalent.
- the low-viscosity Mannich base used in the present invention is synthesized from phenolic compounds, amine compounds and aldehyde compounds by Mannich reaction.
- phenolic compounds mainly use monohydric phenols such as phenol, (p-, m-, o-)cresol and p-tert-butylphenol;
- amine compounds mainly use monohydric secondary amines such as dimethylamine and diethylamine.
- a small amount of mono-primary or di-amine such as methylamine, ethylamine, propylamine, diethylamine, dihexylamine can be added; formaldehyde is generally used for aldehyde compounds; the viscosity of the product is low, generally lower than 400mPa.s (25°C) ;
- the active functional groups contained in it are mainly tertiary amines and phenolic hydroxyl groups, and contain less active hydrogen.
- Using the low-viscosity Mannich base and polyetheramine compound curing agent of the present invention does not need to follow the principle of matching the epoxy equivalent and the active hydrogen equivalent. Due to the particularity of the polymer chemical reaction, the reaction mechanism is not clear.
- the theoretical ratio of E1 and C1, C2, C3, C4, C5 should be 100:35, 100:36, 100:37, 100:34, 100:40, respectively.
- the ratio is 100:22; when E1 and C3 are mixed, when the Tg is the highest (103.4°C), the ratio of E1 and C3 is 100:22; when E1 and C4 are mixed, when the Tg is the highest (89.9°C), the ratio of E1 and C4 is 100: 28; When E1 and C5 are mixed, when the Tg is the highest (105.3°C), the ratio of E1 and C5 is 100:22; the optimal ratio is obviously deviated from the theoretical value calculated based on epoxy equivalent and active hydrogen equivalent, curing agent The dosage is less than the theoretical value.
- the theoretical ratio of E2, E3, E4 and C1 should be 100:36, 100:36 and 100:36 respectively.
- the theoretical ratio of E5, E6, E7 and C1 should be 100:35, 100:36 and 100:37 respectively.
- H1 Mix E2 and C1 uniformly at a ratio of 100:25, and denote it as H1.
- the molar ratio of epoxy groups and active hydrogen is equal to 1.4;
- the initial viscosity of H1 at 25°C is 250mPa.s;
- H2 Mix E3 and C1 uniformly at a ratio of 100:25, and denote it as H2.
- the molar ratio of epoxy groups and active hydrogen is equal to 1.4;
- the initial viscosity of H2 at 25°C is 250mPa.s;
- H3 Mix E4 and C1 evenly at a ratio of 100:25, and denote it as H3.
- the molar ratio of epoxy groups and active hydrogen is equal to 1.4;
- the initial viscosity of H3 at 25°C is 330mPa.s;
- H4 Mix E1 and C3 uniformly in a ratio of 100:22, and denote it as H4.
- the molar ratio of epoxy groups and active hydrogen is equal to 1.7; the initial viscosity of H4 at 25°C is 830mPa.s.
- the gel time of the epoxy resin composition prepared by the above example is more than 6 hours in 100g composition air at a temperature of 25°C;
- the glue time is less than 1 hour.
- D1 weigh 100 parts of E1 and 34 parts of Baxxodur EC301 of BASF company, mix well, and denote it as D1.
- D1 the molar ratio of epoxy groups and active hydrogens is equal to 0.99.
- the initial viscosity of D1 was 720 mPa.s when tested at a temperature of 25°C.
- the epoxy resin system with mismatched molar amount of epoxy groups and active hydrogen according to the present invention has little influence on the gel time at room temperature, and the curing speed after heating is fast, which can increase the Tg of the cured product and reduce the product characteristics of viscosity.
- the raw materials used in the low-viscosity Mannich base of the present invention are readily available and the production process is simple, it has higher economic benefits.
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Abstract
Description
序号 | E1 | C1 | C2 | C3 | C4 | C5 | Tg(℃) |
1 | 100 | 20 | 93.9 | ||||
2 | 100 | 22 | 94.8 | ||||
3 | 100 | 25 | 95.9 | ||||
4 | 100 | 28 | 95.8 | ||||
5 | 100 | 30 | 93.0 | ||||
6 | 100 | 20 | 98.2 | ||||
7 | 100 | 22 | 98.4 | ||||
8 | 100 | 25 | 98.0 | ||||
9 | 100 | 28 | 96.1 | ||||
10 | 100 | 30 | 93.7 | ||||
11 | 100 | 20 | 101.3 | ||||
12 | 100 | 22 | 103.4 | ||||
13 | 100 | 25 | 100.0 | ||||
14 | 100 | 28 | 96.5 | ||||
15 | 100 | 30 | 94.1 | ||||
16 | 100 | 20 | 85.9 | ||||
17 | 100 | 22 | 87.4 | ||||
18 | 100 | 25 | 88.6 | ||||
19 | 100 | 28 | 89.9 | ||||
20 | 100 | 30 | 88.5 | ||||
21 | 100 | 20 | 103.5 | ||||
22 | 100 | 22 | 105.3 | ||||
23 | 100 | 25 | 102.1 | ||||
24 | 100 | 28 | 98.2 | ||||
25 | 100 | 30 | 96.5 |
序号 | E2 | E3 | E4 | C1 | Tg(℃) |
1 | 100 | 24 | 86.0 | ||
2 | 100 | 25 | 88.1 | ||
3 | 100 | 26 | 87.7 | ||
4 | 100 | 27 | 86.0 | ||
5 | 100 | 28 | 84.8 | ||
6 | 100 | 24 | 84.2 | ||
7 | 100 | 25 | 85.9 | ||
8 | 100 | 26 | 84.7 | ||
9 | 100 | 27 | 83.9 | ||
10 | 100 | 28 | 83.0 | ||
11 | 100 | 24 | 85.5 | ||
12 | 100 | 25 | 86.5 | ||
13 | 100 | 26 | 85.2 | ||
14 | 100 | 27 | 85.1 | ||
15 | 100 | 28 | 84.3 |
序号 | E5 | E6 | E7 | C1 | Tg(℃) |
1 | 100 | 22 | 86.1 | ||
2 | 100 | 24 | 88.2 | ||
3 | 100 | 26 | 87.1 | ||
4 | 100 | 28 | 85.4 | ||
5 | 100 | 30 | 84.6 | ||
6 | 100 | 22 | 86.0 | ||
7 | 100 | 24 | 88.8 | ||
8 | 100 | 26 | 86.8 | ||
9 | 100 | 28 | 84.6 | ||
10 | 100 | 30 | 82.7 |
11 | 100 | 22 | 84.7 | ||
12 | 100 | 24 | 87.1 | ||
13 | 100 | 26 | 89.5 | ||
14 | 100 | 28 | 88.0 | ||
15 | 100 | 30 | 86.0 |
序号 | E1 | C3 | Tg(℃) |
1 | 100 | 17 | 111.4 |
2 | 100 | 18 | 111.5 |
3 | 100 | 19 | 111.3 |
4 | 100 | 20 | 112.8 |
5 | 100 | 21 | 108.8 |
6 | 100 | 22 | 106.7 |
7 | 100 | 23 | 105.6 |
8 | 100 | 24 | 104.6 |
9 | 100 | 25 | 102.1 |
10 | 100 | 26 | 100.4 |
序号 | 固化条件 | Tg(℃) |
1 | 60℃2h+70℃1h | 74.9 |
2 | 60℃2h+70℃2h | 79.0 |
3 | 60℃2h+80℃1h | 82.9 |
4 | 60℃2h+80℃2h | 86.2 |
序号 | 样品 | 重量(g) | 温度(℃) | 凝胶时间(h) |
1 | H1 | 100 | 25 | >8 |
2 | H2 | 100 | 25 | >8 |
3 | H3 | 100 | 25 | >8 |
4 | H4 | 100 | 25 | 7.5 |
序号 | 样品 | 重量(g) | 温度(℃) | 凝胶时间(h) |
1 | H1 | 50 | 50 | 1.13 |
2 | H1 | 50 | 60 | 0.70 |
3 | H1 | 20 | 50 | 2.33 |
4 | H1 | 20 | 60 | 0.9 |
序号 | 样品 | 重量(g) | 温度(℃) | 凝胶时间(h) | Tg(℃) |
1 | D1 | 100 | 25 | >8 | 83.9 |
2 | D2 | 100 | 25 | 7 | 83.4 |
3 | D3 | 100 | 25 | 7 | 71.6 |
4 | D4 | 100 | 25 | 8 | 74.1 |
5 | D5 | 100 | 25 | >8 | 66.5 |
Claims (9)
- 一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,包括环氧树脂组分和固化剂组分,环氧树脂和固化剂组分的混合比例不使用环氧当量和活泼氢当量计算得到的理论值,而是采用实验测定不同比例混合固化物的Tg,以Tg最高的比例为准;按照占组分总重量的重量百分比计,所述环氧树脂组分包括:双酚A型环氧树脂,含量为50-100%wt;按照占组分总重量的重量百分比计,所述固化剂组分包括:聚醚胺,含量为60-98%wt;低粘度的曼尼希碱,含量为2-20%wt。
- 根据权利要求1所述的一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,其特征在于,所述环氧树脂组分还包括双酚F型环氧树脂,含量为0-50%wt。
- 根据权利要求1或2所述的一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,其特征在于,所述环氧树脂组分还包括环氧活性稀释剂,含量为0-50%wt。
- 根据权利要求3所述的一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,其特征在于,所述环氧活性稀释剂是指粘度较低的环氧化合物,包括但不限于烯丙基缩水甘油醚、丁基缩水甘油醚、辛基缩水甘油醚、异丙基缩水甘油醚、苯基缩水甘油醚、邻甲苯基缩水甘油醚、甲基丙烯酸缩水甘油醚、苄基缩水甘油醚、对叔丁苯基缩水甘油醚、癸基缩水甘油醚、腰果酚缩水甘油醚、碳8-18烷基缩水甘油醚、乙二醇二缩水甘油醚、丙二醇二缩水甘油醚、聚乙二醇二缩水甘油醚、聚丙二醇二缩水甘油醚、1,4-丁二醇二缩水甘油醚、1,6-己二醇二缩水甘油醚、新戊二醇二缩水甘油醚、1,4-环己二甲醇二缩水甘油醚、环己二醇二缩水甘油醚、间(邻、对)苯二酚二缩水甘油醚、丙三醇三缩水甘油醚、三羟甲基丙烷三缩水甘油醚、叔碳酸缩水甘油酯及其组合。
- 根据权利要求1或2或3所述的一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,其特征在于,所述环氧树脂组分还包括缩水甘油酯、缩水甘油胺、脂环环氧、酚醛环氧树脂,含量为0-10%wt。
- 根据权利要求1或2或3或5所述的一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,其特征在于,所述固化剂组分还包括含有伯胺、仲胺或叔胺官能团的一元、二元或多元胺类化合物,含量为0-10%wt。
- 根据权利要求1所述的一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,其特征在于,所述低粘度的曼尼希碱是指25℃粘度小于400mPa.s,由酚类化合物、胺类化合物、醛类化合物以曼尼希反应合成的产物。
- 根据权利要求7所述的一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,其特征在于,所述曼尼希反应的原料中一元酚占酚类原料的比例大于80%wt,一元仲胺占胺类原料的比例大于80%wt,甲醛占醛类物质的比例大于80%wt,以便获得低粘度特性。
- 根据权利要求7所述的一种环氧基和活泼氢摩尔量不匹配的环氧树脂组合物,其特征在于,所述低粘度的曼尼希碱的粘度值,采用博勒飞DV2TLV型旋转粘度计,使用62#转子,60RPM转速测得。
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US5120817A (en) * | 1991-02-27 | 1992-06-09 | Texaco Chemical Company | Epoxy resin compositions |
CN102123983A (zh) * | 2008-07-22 | 2011-07-13 | 巴斯夫欧洲公司 | 使用胺与胍衍生物的混合物制备模制品的方法 |
CN106380785A (zh) * | 2016-08-29 | 2017-02-08 | 道生天合材料科技(上海)有限公司 | 一种风电叶片用真空灌注环氧树脂系统 |
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