WO2022061947A1

WO2022061947A1 - Transmission manipulator

Info

Publication number: WO2022061947A1
Application number: PCT/CN2020/118900
Authority: WO
Inventors: 周亮
Original assignee: 北京京仪自动化装备技术有限公司
Priority date: 2020-09-27
Filing date: 2020-09-29
Publication date: 2022-03-31
Also published as: CN111933564B; JP7434570B2; CN111933564A; JP2023510207A

Abstract

The present application relates to the technical field of semiconductor processing, and provides a transmission manipulator, comprising: a substrate, a power supply, an electrostatic generation device, and a reversing component. The substrate comprises a support portion used for supporting a wafer; the power supply comprises a positive terminal and a negative terminal; the electrostatic generation device is connected to the power supply and comprises a positive charge end and an electronic end; the positive charge end and the electronic end are both provided on the support portion; the reversing component is provided between the power supply and the electrostatic generation device; when the reversing component is in a first state, the positive charge end is connected to the positive terminal, and the electronic end is connected to the negative terminal; and when the reversing component is in a second state, the positive charge end is connected to the negative terminal, and the electronic end is connected to the positive terminal. According to the transmission manipulator provided in the present application, Coulomb force is used to suction wafers, the conveying of the wafers of various specifications can be realized, the residual Coulomb force can be eliminated by means of the reversing component, the production costs can be reduced, and the damage to the wafers can be reduced.

Description

Teleport Manipulator

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of the Chinese patent application with the application number 202011029264.1 filed on September 27, 2020, and the invention title is "Transmission Robot", which is fully incorporated herein by reference.

technical field

The present application relates to the technical field of semiconductor processing, and in particular, to a transfer robot.

Background technique

A semiconductor refers to a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. There are many semiconductor products and complex processes. Wafers are silicon wafers used in the production of silicon semiconductor integrated circuits. Wafer thicknesses vary widely from fab to fab, and the wafer contactor contact area to the wafer is required to be as small as possible to avoid defects and exposure problems. The thickness of the wafers is different. In the related art, in the transfer robot used for transferring wafers, one specification of the transfer robot is suitable for one specification of wafers. The round transmission cost is high, and the equipment investment is large.

SUMMARY OF THE INVENTION

The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a transfer manipulator, which uses Coulomb force to adsorb wafers, which can realize the transfer of wafers of various specifications, and can also eliminate residual Coulomb force through reversing components, which can reduce production costs and reduce damage to the wafer.

The conveying manipulator according to the embodiment of the first aspect of the present application includes:

a base body, including a support portion for supporting the wafer;

Power supply, including positive and negative terminals;

A static electricity generating device, connected to a power supply, includes a positive charge terminal and an electronic terminal, and the positive charge terminal and the electronic terminal are both arranged on the support portion;

A reversing component is arranged between the power supply and the static electricity generating device, the reversing component is in a first state, the positive charge terminal is connected to the positive terminal, and the electronic terminal is connected to the negative terminal ; The reversing component is in the second state, the positive charge terminal is connected to the negative terminal, and the electronic terminal is connected to the positive terminal.

According to an embodiment of the present application, a group of the power supply is provided, the positive terminal is connected with a first wire, the negative terminal is connected with a second wire, the reversing component is a reversing switch, and the reversing switch The two ends of the first wire and the second wire are respectively, the reversing switch is turned off, the positive charge terminal is connected to the positive terminal, and the electronic terminal is connected to the negative terminal; the reversing switch The switch is open, the positive charge terminal is connected to the negative terminal, and the electronic terminal is connected to the positive terminal.

According to an embodiment of the present application, the power supply includes a first DC power generator and a second DC power generator arranged in parallel, and the positive terminal of the first DC power generator and the second DC power source generate The positive terminal of the generator is reversed, the reversing component includes a first switch and a second switch, the first switch is connected to the branch where the first DC power generator is located, and the second switch is connected to the The branch where the second DC power generator is located; the first switch is turned on and the second switch is turned off, the positive charge terminal is connected to the positive terminal of the first DC power generator, and the electronic terminal is connected to The negative terminal of the first DC power generator; the first switch is turned off and the second switch is turned on, the positive charge terminal is connected to the negative terminal of the second DC power generator, the electronic terminal The head is connected to the positive terminal of the second DC power generator.

According to an embodiment of the present application, the support portion is provided with a wafer contactor, the wafer contactor protrudes from the surface of the support portion, and a pressure sensor is provided at the bottom of the wafer contactor.

According to an embodiment of the present application, it further includes a central processing unit, the power supply and the pressure sensor are both connected to the central processing unit, and the central processing unit stores the input voltage of the static electricity generating device and the The relationship model between the output voltage of the pressure sensor, the power supply stops supplying power to the static electricity generating device, the input voltage of the static electricity generating device is obtained according to the relationship model and the output voltage of the pressure sensor, and the The state of the commutation member is adjusted so that the power supply supplies the input voltage to the static electricity generating device.

According to an embodiment of the present application, the wafer contactors are alternately arranged with the positively charged terminals, and/or the wafer contactors are arranged alternately with the electronic terminals.

According to an embodiment of the present application, a first adjustment resistor is connected to the first wire, and a second adjustment resistor is connected to the second wire.

According to an embodiment of the present application, the base body is an insulating material.

According to an embodiment of the present application, the positive charge terminals and the electronic terminals are alternately arranged.

According to an embodiment of the present application, the base body is configured with a wiring groove, and a first wire connecting the power supply and the positive charge terminal and a second wire connecting the power supply and the electronic terminal are both disposed in the inside the wireway.

According to an embodiment of the present application, a wiring distributor is connected to the base body, and the wiring distributor is arranged at one end of the wiring groove close to the power supply.

The above-mentioned one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

An embodiment of the present application provides a conveying manipulator, including a base body, a power source, a static electricity generating device, and a reversing component. The static electricity generating device includes a positive charge terminal and an electronic terminal connected to the power source, and both the positive charge terminal and the electronic terminal are Coulomb force can be generated between the wafer and the wafer to realize the adsorption and fixation of the wafer. It can be applied to the transfer of wafers of various specifications and can reduce the production cost; when the power supply stops supplying power to the static electricity generating device, the positive charge terminal There may be residual Coulomb force between the head and the electronic end and the wafer. At this time, it is difficult for the wafer to overcome the static friction force and get out of the transfer robot. The head is connected to the negative terminal of the power supply and the electronic terminal is connected to the positive terminal of the power supply, so that the residual Coulomb force can be eliminated by the reverse Coulomb force, so that the wafer can smoothly leave the transfer robot and solve the problem of tape in the wafer transfer process. And the problem of fragmentation is helpful to save social resources and has great economic value.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

1 is a schematic top-view structural diagram of a conveying manipulator provided in an embodiment of the present application;

FIG. 2 is a schematic side view of the structure of a conveying manipulator provided by an embodiment of the present application;

3 is a schematic structural diagram of the first embodiment of the reversing component of the conveying manipulator provided in the embodiment of the present application;

4 is a schematic structural diagram of the second embodiment of the reversing component of the conveying manipulator provided in the embodiment of the present application;

5 is a schematic diagram of the control logic of the conveying manipulator provided by the embodiment of the present application;

6 is a schematic diagram of a relationship model between the input voltage of the static electricity generating device of the conveying manipulator and the output voltage of the pressure sensor provided by the embodiment of the present application;

7 is a graph showing the relationship between the output voltage of the pressure sensor of the transfer robot and the static friction force on the surface of the wafer contactor provided by the embodiment of the present application;

FIG. 8 is a schematic structural diagram of a distribution manner of positive charge terminals and electronic terminals of a transmission manipulator provided in an embodiment of the present application.

Reference number:

1: Base body; 11: Support part; 12: Connection part; 13: Wiring slot;

2: Static electricity generating device; 21: Positive charge terminal; 22: Electronic terminal;

3: wafer contactor; 4: pressure sensor;

5: the first wire; 51: the first resistor; 52: the second resistor; 53: the first capacitor;

6: the second wire; 61: the third resistor; 62: the fourth resistor; 63: the second capacitor;

7: Wiring distributor;

8: Power supply; 81: First DC power generator; 82: Second DC power generator;

91: reversing switch; 92: first switch; 93: second switch.

detailed description

The embodiments of the present application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the application, but not to limit the scope of the application.

In the description of the embodiments of the present application, it should be noted that the terms "center", "portrait", "horizontal", "top", "bottom", "front", "rear", "left" and "right" , "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing this The application examples and simplified descriptions are not intended to indicate or imply that the indicated devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application. Furthermore, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection, Or integral connection; it can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present application in specific situations.

In the embodiments of the present application, unless otherwise expressly specified and limited, the first feature "on" or "under" the second feature may be in direct contact with the first and second features, or the first and second features pass through the middle indirect contact with the media. Also, the first feature being "above", "over" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structures, materials, or features are included in at least one example or example of the embodiments of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.

An embodiment of the present application, as shown in FIG. 1 to FIG. 8 , provides a conveying manipulator including: a base body 1 , a power source 8 , a static electricity generating device 2 and a reversing component. The power supply 8 supplies power to the static electricity generating device 2 , the reversing component is used to switch the connection relationship between the static electricity generating device 2 and the two ends of the power supply 8 , and the base body 1 is used to install the static electricity generating device 2 . The base body 1 includes a support portion 11 for supporting the wafer; the power source 8 includes a positive terminal and a negative terminal, the positive terminal is connected with a first wire 5, and the negative terminal is connected with a second wire 6; the static electricity generating device 2 is connected to the power source 8, and the static electricity The generating device 2 includes a positive charge terminal 21 and an electronic terminal 22. The positive charge terminal 21 and the electronic terminal 22 are both arranged on the support portion 11; In the first state, the positive charge terminal 21 is connected to the positive terminal, and the electronic terminal 22 is connected to the negative terminal; the reversing component is in the second state, the positive charge terminal 21 is connected to the negative terminal, and the electronic terminal 22 is connected to the positive terminal.

The wafer can be fixedly supported by the support portion 11 and move synchronously with the support portion 11, so as to realize the transfer of the wafer. The wafer and the supporting part 11 are provided with a fixed force by the electrostatic generating device 2. After the electrostatic generating device 2 is energized, the positive charge terminal 21 generates a positive charge, and the positive charge terminal 21 attracts electrons in the wafer, and the electronic terminal 22 Electrons are generated, and the electronic terminal 22 attracts the positive charges in the wafer to realize electrostatic adsorption and fixation between the wafer and the transfer robot.

When the wafer is transported to the target position, the power supply 8 stops supplying power to the static electricity generating device 2, and the positive charge terminal 21 and the electronic terminal 22 still have some residual charges. At this time, the positive terminal of the power supply 8 is connected through the reversing part The electron terminal 22 and the negative terminal of the power supply 8 are connected to the positive charge terminal 21 so that the power source 8 supplies positive charge to the electron terminal 22 and electrons to the positive charge terminal 21 to eliminate the positive charge terminal 21 and the electron terminal 22 The residual positive charges and electrons make the force between the positive charge terminal 21 and the wafer, and between the electronic terminal 22 and the wafer zero, so that the wafer can be removed from the base 1 smoothly, solving the problem of residual wafer residues. Banding and fragmentation problems that may arise from Coulomb force.

In this embodiment, the double-electricity electrostatic generating device 2 is used to generate a Coulomb force to adsorb the wafer, so that a positive pressure is generated between the wafer and the support portion 11 to ensure the static friction during the wafer transfer process; the wafer moves to the target position Afterwards, the charge supplied by the power source 8 to the positive charge terminal 21 and the electronic terminal 22 can also be switched through the reversing component, so as to eliminate the residual Coulomb force of the positive charge terminal 21 and the electronic terminal 22 . The transfer manipulator of this embodiment is suitable for wafers of different thicknesses produced under different processes, which can ensure the static friction between the wafer and the support portion 11, realize the non-slip transmission of the wafer, and can realize the transfer of various wafers. Fully adaptable transfer solves the problem of high wafer transfer cost in related technologies, and also solves the problem of tapes and fragments during wafer transfer, which helps save social resources and has great economic value.

Two implementations of the reversing element:

In one embodiment, as shown in FIG. 3, a group of power sources 8 is provided, the positive terminal of the power source 8 is connected to the first wire 5, and the negative terminal of the power source 8 is connected to the second wire 6; the reversing component is a reversing switch 91, The two ends of the reversing switch 91 are the first wire 5 and the second wire 6 respectively. The reversing switch 91 is closed, the positive charge terminal 21 is connected to the positive terminal, and the electronic terminal 22 is connected to the negative terminal; the reversing switch 91 is opened, and the positive charge terminal is connected. The head 21 is connected to the negative terminal, and the electronic terminal 22 is connected to the positive terminal. By adjusting the energization direction of the power supply 8 to the static electricity generating device 2, the residual Coulomb force between the wafer and the static electricity generating device 2 is eliminated, the wafer is prevented from being damaged by the transfer robot, and the safety of wafer transfer is improved.

The power source 8 provides direct current, and the power source 8 can be a direct current generator. The first wire 5 includes a first section and a second section, and the second wire 6 includes a third section and a fourth section. One end of the reversing switch 91 is connected to the position where the first section and the second section are butted. The other end is connected to the position where the third segment and the fourth segment are butted. When the reversing switch 91 is closed, the first segment is connected to the second segment, the third segment is connected to the fourth segment, the positive terminal is connected to the positive charge terminal 21, and the negative terminal is connected to the electronic terminal 22; when the reversing switch 91 is turned on , the first section is connected with the fourth section, the third section is connected with the second section, the positive terminal is connected with the electronic terminal 22, and the negative terminal is connected with the positive charge terminal 21, so as to eliminate the residual Coulomb force by reverse energization, The wafer can be separated from the base 1 without damage to the wafer.

In one embodiment, a first adjustment resistor is connected to the first wire 5 , and a second adjustment resistor is connected to the second wire 6 . The first adjusting resistor is used to adjust the voltage of the positive charge terminal 21 , and the second adjusting resistor is used to adjust the voltage of the electronic terminal 22 , so that the static electricity generating device 2 can provide different adsorption forces according to different wafer specifications. The resistance values of the first adjusting resistor and the second adjusting resistor can be adjusted.

The first adjusting resistor includes a first resistor 51 and a second resistor 52, the first resistor 51 is connected to the first section, and the second resistor 52 is connected to the second section, and the voltages of each part can be adjusted independently. The second adjustment resistor includes a third resistor 61 and a fourth resistor 62. The third resistor 61 is connected to the third stage, and the fourth resistor 62 is connected to the fourth stage. The voltage of each part can also be adjusted independently.

Further, a first capacitor 53 is connected to the first wire 5, and a second capacitor 63 is connected to the second wire 6, so that the voltage is more stable.

In one embodiment, referring to FIG. 4 , the difference from the embodiment shown in FIG. 3 is that the power supply includes a first DC power generator 81 and a second DC power generator 82 arranged in parallel, and the first DC power supply The positive terminal of the generator 81 and the positive terminal of the second DC power generator 82 are arranged oppositely, and the negative terminal of the first DC power generator 81 and the negative terminal of the second DC power generator 82 are also arranged oppositely. The commutation component includes a first switch 92 and a second switch 93, the first switch 92 is connected to the branch where the first DC power generator 81 is located, the second switch 93 is connected to the branch where the second DC power generator 82 is located, and the first switch 92 is connected to the branch where the second DC power generator 82 is located. A switch 92 is turned on and the second switch 93 is turned off, the positive charge terminal 21 is connected to the positive terminal of the first DC power generator 81, and the electronic terminal 22 is connected to the negative terminal of the first DC power generator 81; the first switch 92 When turned off and the second switch 93 is turned on, the positive charge terminal 21 is connected to the negative terminal of the second DC power generator 82 , and the electronic terminal 22 is connected to the positive terminal of the second DC power generator 82 . In this embodiment, two sets of power sources 8 arranged in opposite directions are provided, and the power supply direction to the static electricity generating device 2 is switched by switching the on-off of the first DC power generator 81 and the second DC power generator 82, so as to eliminate the residual Coulomb force , so that the wafer can be separated from the base 1 without damage to the wafer.

In this embodiment, the wires between the power source 8 and the static electricity generating device 2 are also connected with resistors and capacitors to ensure the stability of the circuit structure.

In one embodiment, the support portion 11 is provided with a wafer contactor 3 , the wafer contactor 3 protrudes from the surface of the support portion 11 , and the surface of the wafer contactor 3 is used for contacting the wafer, reducing the contact between the wafer and the wafer. The contact area of the base body 1 and the static friction force between the wafer and the surface of the wafer contactor 3 are used to prevent the wafer from moving relative to the base body 1 to ensure the transfer stability of the wafer.

In one embodiment, the bottom of the wafer contactor 3 is provided with a pressure sensor 4, and the pressure sensor 4 is used to measure the pressure exerted by the wafer on the wafer contactor 3, and the friction coefficient between the pressure and the surface of the wafer contactor 3 is measured. The static friction force between the wafer and the surface of the wafer contactor 3 can be calculated, as shown in FIG. 7 . The pressure exerted by the wafer on the wafer contactor 3 is the sum of the gravity of the wafer and the attractive force of the electrostatic generating device 2 to the wafer. The gravity of the wafer remains unchanged. According to the set static friction force, the user can adjust the attractive force of the electrostatic generating device 2 to the wafer according to the pressure measured by the pressure sensor 4, that is, adjust the voltage to the electrostatic generating device 2. . In addition, when the wafer is transferred to the target position, the power supply 8 stops supplying power to the static electricity generating device 2, and the pressure measured by the pressure sensor 4 is the sum of the gravity of the wafer and the residual Coulomb force, and the magnitude of the residual Coulomb force can be obtained. , according to the residual Coulomb force, the power supply 8 can reversely supply power to make the static electricity generating device 2 generate a reverse force of the same magnitude to eliminate the residual Coulomb force, so that the wafer can smoothly leave the transfer robot.

In one embodiment, the conveying manipulator further includes a central processing unit, the power supply 8 and the pressure sensor 4 are both connected to the central processing unit, and the central processing unit stores a voltage between the input voltage of the static electricity generating device 2 and the output voltage of the pressure sensor 4 . The relationship model, the power supply 8 stops supplying power to the static electricity generating device 2, according to the relationship model and the output voltage of the pressure sensor 4, the input voltage of the static electricity generating device 2 is obtained, and the state of the commutation component is switched, and the power supply 8 is supplied to the static electricity generating device 2. Supply the reverse input voltage.

The relationship model is a curve relationship between the input voltage of the static electricity generating device 2 and the output voltage of the pressure sensor 4 measured in the laboratory in advance according to the specifications of the wafer. Referring to FIG. 6 , FIG. 6 illustrates a relationship model between the input voltage of the static electricity generating device 2 of the wafer and the output voltage of the pressure sensor 4 . The central processing unit can store the relationship models of wafers of various specifications, and can retrieve the relationship models corresponding to the wafers to be transferred as needed.

Further, through the relationship model pre-measured in the laboratory, the central processing unit can also correct the relationship model according to the real-time data, so as to make the adjustment more accurate.

Referring to FIG. 5, the central processing unit transmits the input voltage required by the electrostatic generating device 2 to the electrostatic generating device controller, and the electrostatic generating device controller regulates the output voltage of the electrostatic generating device 2. At this time, the pressure sensor 4 measures the wafer pair. The pressure of the wafer contactor 3 is fed back to the central processing unit, which is the logical transmission relationship between the voltage signals, which can solve the problem of tape and fragmentation of the wafer that may be caused by the residual Coulomb force.

In this embodiment, a double-electricity electrostatic generating device 2 that can generate Coulomb force is used to generate positive pressure to ensure static friction during wafer transfer. The positive pressure can be converted into an electrical signal by the pressure sensor 4 at the bottom of the wafer contactor 3, and the central processing unit receives the electrical signal. Because the relationship model between the input voltage of the static electricity generating device 2 and the induced electrical signal of the pressure sensor 4 has been written in In the central processing unit, the central processing unit can control the voltage of the static electricity generating device 2 according to predetermined parameters, so as to realize the non-slip transfer of wafers of different thicknesses produced under various different processes. At the same time, when the input voltage of the static electricity generating device 2 is zero, it can sense whether there is residual static electricity according to the output voltage of the pressure sensor 4, and then turn on the reversing component, and the induced voltage output by the pressure sensor 4 becomes smaller. When the induced voltage reaches a safe level When the voltage is within the range, the transfer manipulator can perform the unwinding action.

In one embodiment, a plurality of wafer contactors 3 are evenly distributed on the support portion 11 , and the bottom of each wafer contactor 3 is provided with a pressure sensor 4 . The multiple wafer contactors 3 provide multiple support points for the wafer, so that the support of the wafer is more stable. At the same time, multiple pressure sensors 4 can measure multiple sets of data, and the input voltage of the positive charge terminal 21 or electronic terminal 22 at this position can be adjusted according to the pressure at each position; the static electricity can also be obtained according to the average value of multiple sets of data. The average value of the input voltage of the generating device 2 is used to adjust the input voltages of multiple groups of positive charge terminals 21 and multiple groups of electronic terminals 22 synchronously; of course, the input voltage of the positive charge terminals 21 and the input voltage of the electronic terminals 22 The adjustment method is not limited to the above, and can also be adjusted in other ways.

In one embodiment, the pressure sensor 4 is a piezoelectric ceramic sensor. The piezoelectric ceramic sensor has high sensitivity, high reliability, high stability, high temperature and low temperature resistance and good humidity resistance.

Of course, the pressure sensor 4 is not limited to the use of piezoelectric ceramic sensors, and other sensors that deform under pressure and convert pressure into electrical signals may be used.

In one embodiment, a plurality of positive charge terminals 21 are distributed on the base body 1, and a plurality of electronic terminals 22 are also distributed on the base body 1, so that the wafer can be stressed at multiple positions to ensure that the wafer is in contact with the wafer The static friction between the devices 3.

Referring to FIG. 1 , two positive charge terminals 21 are provided on the base body 1 , two electronic terminals 22 are also provided, and the positive charge terminals 21 and the electronic terminals 22 are symmetrically arranged.

In one embodiment, the wafer contactors 3 and the positively charged terminals 21 are alternately arranged, the positively charged terminals 21 provide a force for adsorbing the wafer, and the wafer contactor 3 provides a supporting force for the wafer, the adsorption force and the supporting force Alternate distribution helps the wafer to be uniformly stressed.

Similarly, the alternate arrangement of the wafer contactors 3 and the electronic terminals 22 also helps the wafer to be uniformly stressed.

Referring to FIG. 1 , the wafer contactors 3 and the positive charge terminals 21 are alternately arranged, and the wafer contactors 3 and the electronic terminals 22 are arranged alternately, so that the wafer is subjected to more uniform force. In one embodiment, the positive charge terminals 21 and the electronic terminals 22 are alternately arranged, and the positive charge terminals 21 , the electronic terminals 22 , the positive charge terminals 21 , the electronic terminals 22 . . . are sequentially arranged in a clockwise or counterclockwise direction. ...and so on, which is conducive to the uniform distribution of the electric field.

In one embodiment, as shown in FIG. 8 , the support portion 11 is provided with a preset path, and the positive charge terminals 21 and the electronic terminals 22 are alternately arranged on the same preset path. On the same preset path, the positive charge terminals 21 and the electronic terminals 22 are alternately arranged, so that the electric field is evenly distributed, which helps the wafer to be uniformly stressed, ensures the stable transfer of the wafer, and also helps to reduce the impact on the wafer. damage. The positive charge terminal 21 and the electronic terminal 22 are alternately arranged, which can be understood as the positive charge terminal 21, the electronic terminal 22, the positive charge terminal 21, the electronic terminal 22 and so on in a clockwise or counterclockwise direction. .

When one preset path is set, the wafers on the preset path are guaranteed to be uniformly stressed; when multiple positive charge terminals 21 and electronic terminals 22 are arranged evenly in the circumferential direction of the support portion 11 , the positive charge terminals 21 and the electronic The ends 22 are alternately arranged on the same circumference. When multiple preset paths are set, it is ensured that the electric field on each preset path is evenly distributed.

Referring to FIG. 8 , a plurality of preset paths are set on the support portion 11 , and on adjacent preset paths, the positive charge terminals 21 and the electronic terminals 22 are in one-to-one correspondence. When two preset paths are set, the two adjacent terminals on the two preset paths are the positive charge terminal 21 and the electronic terminal 22 respectively; when three or more preset paths are set, any two preset paths are The two adjacent terminals are the positive charge terminal 21 and the electronic terminal 22 respectively, which ensures that all the positive charge terminals 21 and the electronic terminals 22 are alternately arranged, so that the electric field on the entire support portion 11 is evenly distributed.

Referring to FIG. 1 , the support portion 11 is a circular ring, and the electronic terminal 22 and the positive charge terminal 21 are arranged on one side of the circular ring in a clockwise direction, so that the electric field on both sides is evenly distributed.

In one embodiment, the base body 1 is configured with a wire routing slot 13 , and the first wire 5 and the second wire 6 are both arranged in the wire routing slot 13 . The arrangement of the wiring slot 13 is convenient to define the wiring path, and the assembly is simpler, and the wires are arranged in the wiring slot 13, which can make the wiring more tidy.

In one embodiment, as shown in FIG. 2 , the wiring slot 13 is a hollow cavity in the base body 1 , the upper and lower surfaces of the wiring slot 13 are closed, and the end of the wiring slot 13 is open so that the wires can be introduced into the wiring in slot 13. The upper and lower surfaces of the wiring slot 13 are closed to provide a relatively closed environment for the positive charge terminal 21 and the electronic terminal 22, so as to reduce the influence of the external environment on the positive charge terminal 21 and the electronic terminal 22, and improve the stability of the Coulomb force .

The base body 1 may include an upper casing and a lower casing, and the wire groove 13 is restricted between the upper casing and the lower casing, which facilitates the processing of the wire groove 13 and facilitates the installation of wires.

It should be noted that, the wiring groove 13 is not limited to the structure of the hollow chamber, and may also be a groove recessed downward from the surface of the base body 1 .

In one embodiment, the wiring slot 13 extends along a straight line, a circular arc or a serpentine shape, that is, the preset path extends along a straight line, a circular arc or a serpentine shape. Referring to FIG. 8 , the preset path is arc-shaped, and a plurality of arc-shaped wiring slots 13 are arranged in the circumferential direction of the support portion 11 , and each wiring slot 13 is provided with a plurality of positive charge terminals 21 and a plurality of The electronic terminal 22 makes the Coulomb force evenly distributed. Of course, the preset path can be straight or serpentine. When the preset path is straight, the contour shape of the support portion 11 can also be straight; The serpentine shape can increase the length of the preset path on the support portion 11 , so that the electric field is more uniform.

In one embodiment, when the support portion 11 is provided with the wafer contactor 3 , the bottom of the wafer contactor 3 is provided with a pressure sensor 4 , and the pressure sensor 4 is arranged in the wiring groove 13 . The pressure sensor 4 is also set in a relatively closed environment to ensure the measurement accuracy of the pressure sensor 4 and reduce the influence of the environment on the measurement result.

In one embodiment, a wiring distributor 7 is connected to the base body 1 , and the wiring distributor 7 is arranged at one end of the wiring slot 13 close to the power supply 8 . The wiring distributor 7 is used to connect the wires. The pressure sensor 4 is connected to the power supply 8 through the wiring distributor 7. The wires of the positive charge terminal 21 and the electronic terminal 22 are also connected to the power supply 8 through the wiring distributor 7. At the same time, power is supplied to the pressure sensor 4 and the static electricity generating device 2, which simplifies the structure.

Wherein, the wiring distributor 7 on one side of the base body 1 can be connected to the positive terminal and the negative terminal of the power supply 8 at the same time, so that the positive charge terminal 21 and the electronic terminal 22 can be provided on one side of the support part 11 at the same time, which is helpful for The electric field is evenly distributed.

In one embodiment, the material of the base body 1 is an insulating material, and the insulating material may be ceramic, plastic, rubber, or the like. The base body 1 further includes a connecting portion 12, and the connecting portion 12 is used for connecting with driving components such as a motor and an air cylinder. The support portion 11 is a hollow annular structure, the wafer is supported by the annular support portion 11, the wafer is uniformly stressed, and other operations can also be performed on the wafer through the hollow portion. The connecting portion 12 is located on one side of the supporting portion 11 , and the connecting portion 12 and the supporting portion 11 can be integrally formed or spliced and installed, which can be selected as required.

In one embodiment, the transfer robot includes a power source 8, a base body 1, a static electricity generating device 2, a reversing component, a wafer contactor 3 and a piezoelectric ceramic sensor, and the wafer falls on the wafer contactor 3 of the support portion 11, The positive charge terminal 21 and the electronic terminal 22 of the static electricity generating device 2 are loaded with voltage under the action of the static electricity generating device controller to generate a Coulomb force, thereby generating a static friction force between the wafer contactor 3 and the wafer. At the same time, under the action of the Coulomb force, the piezoelectric ceramic sensor can sense the actual Coulomb force and feedback it to the central processing unit. On the support part 11, the transfer robot carries the wafer to the designated position of the system. After reaching the designated position, the piezoelectric ceramic sensor can sense whether the static electricity remains after the power supply 8 stops supplying power to the static electricity generating device 2 according to the induced voltage under pressure, and judge whether the reversing part is turned on. When the reversing part is turned on, the piezoelectric ceramic The induced voltage under pressure on the sensor becomes smaller. When the induced voltage reaches the safe voltage range, the transfer robot can perform the unloading action, and the wafer can be safely and completely placed in the designated position.

An embodiment of the second aspect of the present application provides a wafer suction force adjustment system for a transfer robot, including: N pressure sensors 4, N wafer contactors 3, a central processing unit, a static electricity generating device controller, and The static electricity generating device 2, N is a positive integer not less than 3; the static electricity generating device 2 is connected to the voltage output terminal of the static electricity generating device controller, and is used for generating static charge to generate induced charge with the wafer; the N pressure sensors 4 are respectively connected with The N wafer contactors 3 are connected to obtain the pressure value of the wafer after it is determined that the wafer is placed on the wafer contactor 3; value and the preset relationship model to determine the corresponding current target voltage value, and use the current target voltage value to drive the static electricity generating device controller to output the current actual voltage value to make the static electricity generating device 2 generate corresponding static charge; wherein, the preset relationship The model has a corresponding relationship between the pressure value and the target voltage value.

Specifically, N pressure sensors 4 are arranged at the bottom of the wafer contactor 3 in a one-to-one correspondence, that is, the first pressure sensor, the second pressure sensor... the Nth pressure sensor, so that when the wafer contactor 3 is placed on the When a wafer is used, the wafer can generate pressure on the pressure sensor 4, and the pressure sensor 4 acquires the pressure value caused by the wafer.

Further, as shown in FIG. 6 and FIG. 7 , it can be known that different types of wafers require different sizes of static friction, and there is a corresponding relationship between the static friction and the output voltage of the pressure sensor 4, and the output voltage of the pressure sensor 4 is related to the electrostatic force. The input voltage of the generator 2 has a corresponding relationship, so that the corresponding relationship between the static friction force and the input voltage of the static generator 2 can be found. The input voltage of the static generator 2 is the target voltage value to be generated by the static generator 2 . Therefore, different target voltage values can be input for different types of wafers, thereby generating corresponding static friction forces.

Specifically, the preset relationship model can be set in the form of a preset electrostatic control voltmeter, so that when the pressure sensor 4 transmits a voltage signal, that is, a pressure value signal, the preset electrostatic control voltage can be adjusted according to the pressure value. Find the corresponding target voltage value in the table; the preset electrostatic control voltmeter has a pressure value range and a corresponding target voltage value.

Of course, the relationship between the pressure value and the target voltage value can also be expressed by a function, so as to obtain a more accurate target voltage value. That is, the preset relationship model is a functional relationship between the pressure value and the target voltage value. After obtaining the pressure value, use the functional relationship to calculate the target voltage value.

It is worth noting that the method of this embodiment is applicable to the transmission manipulator in the above-mentioned embodiment, and the positive charge terminal 21 and the electronic terminal 22 of the static electricity generating device 2 are both provided in the transmission manipulator; the power source 8 is used to supply the positive charge terminal 21 and electronic terminal 22 supply power.

On the basis of any of the above embodiments, the embodiment of the present application is also provided with an alarm module connected to the central processing unit; the central processing unit is also used to obtain the current target voltage value and the current actual voltage value, and determine the current target voltage value and Whether the difference between the current actual voltage value exceeds the preset threshold; if it exceeds the current threshold, the alarm module will be triggered.

Further, the central processing unit is also used to obtain the current target voltage value and the current actual voltage value, and determine whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; if it does not exceed the preset threshold, use the current The target voltage value and the current actual voltage value are modified to a preset relationship model to obtain a modified voltage model.

Specifically, when revising the preset relationship model, the central processing unit is specifically configured to adjust the target voltage value in the preset relationship model to a smaller value if the current target voltage value is less than the current actual voltage value; if the current target voltage value is greater than For the current actual voltage value, increase the target voltage value in the preset relational model.

On the basis of the above-mentioned embodiment, in this embodiment, in order to know whether there is a deviation in the placement position of the wafer, the central processing unit is also used for when any one of the N pressure values corresponding to the N pressure sensors 4 is different from other pressures A wafer placement error alert is issued when the deviation of the values exceeds a threshold. That is to say, if the wafer is placed in the correct position, the pressure values of the N pressure sensors 4 should be the same, but if one of them is abnormal, it means that the abnormal pressure sensor 4 has been subjected to too much or too little pressure. pressure, the wafer is placed in the wrong position.

The following describes the wafer adsorption force adjustment method for the transfer robot provided by the embodiments of the present application, the wafer adsorption force adjustment method for the transfer robot described below and the wafer adsorption force adjustment for the transfer robot described above. The systems can refer to each other correspondingly.

An embodiment of the present application provides a wafer adsorption force adjustment system and method for a conveying robot. By utilizing the different weights of wafers with different specifications, the electrostatic charges generated by the electrostatic generating device 2 are controlled to be different, so as to be different from the electrostatic induction of the wafers. The adsorption force is generated to generate different positive pressures to ensure the static friction force during the wafer transfer process. The positive pressure can be converted into the pressure value of the electrical signal by the pressure sensor 4 under the wafer contactor 3, so as to realize various processes. Next, slip-free transport of wafers of different thicknesses.

The embodiment of the present application also provides a method for adjusting the wafer adsorption force for a conveying robot, which is applied to any of the above wafer adsorption force adjustment systems, and is specifically executed by a central processing unit. The method specifically includes:

Step S61: After determining that the wafer is placed on the wafer contactor 3, obtain the pressure value of the wafer;

Step S62: determining the corresponding current target voltage value according to the pressure value and a preset relationship model;

Step S63: using the current target voltage value to drive the static electricity generating device controller to output the current actual voltage value so that the static electricity generating device 2 generates corresponding static charge;

Wherein, the preset relationship model has a corresponding relationship between the pressure value and the target voltage value.

Further, specifically executed by the central processing unit, the method specifically further includes:

Step S71: obtaining the current target voltage value and the current actual voltage value;

Step S72: judging whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold;

Step S73: If the preset threshold value is not exceeded, modify the preset relationship model by using the current target voltage value and the current actual voltage value to obtain a modified voltage model.

An embodiment of the third aspect of the present application provides a wafer inspection system for a transfer robot, comprising: N pressure sensors 4, N wafer contactors 3 and a central processing unit, where N is a positive integer not less than 3 The N pressure sensors 4 are respectively connected with the N wafer contactors 3 for obtaining the pressure value of the wafer after the wafer is determined to be placed on the wafer contactor 3, and the pressure value is the output of the N pressure sensors 4 The central processing unit is connected to the output ends of the N pressure sensors 4, and is used to judge the type of the wafer according to the pressure value and the preset pressure value table, and obtain the judgment result; wherein, the preset pressure value table has a pressure value range and corresponding wafer type.

Specifically, as shown in FIG. 1 , pressure sensors 4 are arranged at the bottom of each wafer contactor 3 in a one-to-one correspondence. When a wafer is placed on the wafer contactor 3 , the wafer can generate pressure on the pressure sensors 4 , the pressure sensor 4 obtains the pressure value caused by the wafer. The pressure value is the sum of the output values of N pressure sensors 4, that is to say, the pressure values measured by each pressure sensor 4 need to be summed. If the wafer is placed correctly and is in the center, then each pressure sensor 4 The measured pressure values are the same, but if the position of the wafer is not in the center, the pressure values of each pressure sensor 4 may be different, but even if they are not the same, the sum of the output values of the sensors corresponds to the position of the wafer. The resulting total pressure value.

Specifically, when the central processing unit uses the pressure generated by the pressure sensor 4 to make judgments, the central processing unit can specifically use the central processing unit to find the pressure value range corresponding to the pressure value in the preset pressure value table; if there is a corresponding pressure value in the pressure value table If the pressure value range is selected, the wafer type corresponding to the pressure value range is determined; if the corresponding pressure value range does not exist in the pressure value table, an abnormal alarm signal is issued. For example, the pressure value is 5, and the preset pressure value table exists: the first pressure value range is 1~2, the second pressure value range is 2~3, and the third pressure value range is 3~4; if only these three If a pressure range is reached, it means that the current wafer is an abnormal wafer, and an abnormal alarm signal should be issued at this time. However, if there is a fourth pressure value range 4 to 5 in the preset pressure value table, then the current wafer belongs to the fourth pressure value range, and therefore, the type of the current wafer can be determined. Of course, in the preset pressure value table, there are also wafer types corresponding to the pressure value ranges such as the first pressure value range, the second pressure value range, etc. Specifically, the wafer type can be a processing type or a different customer type from.

It is worth noting that, in order to confirm whether the wafer is placed on the transfer robot, a camera device can also be set in the wafer inspection system. The camera device is used to capture the real-time image of the transfer robot; the central processing unit is also used to receive the real-time image, and Whether the wafer is placed on the wafer contactor 3 is judged according to the real-time image, and the pressure sensor 4 is activated when the wafer is placed on the wafer contactor 3 . That is to say, whether the wafer is in place is judged by means of image recognition of the wafer. Of course, a neural network needs to be set up in the central processing unit, and the neural network needs to be trained on image samples that identify the wafer in place.

Embodiments of the present application further provide a wafer inspection method for a conveying robot, which is applied to the wafer inspection system in any of the above embodiments, including:

Step S41: after determining that the wafer is placed on the wafer contactor 3, obtain the pressure value of the wafer;

Step S42 : judging the type of the wafer according to the pressure value and a preset pressure value table, and obtaining a judgment result; wherein the preset pressure value table has a pressure value range and a corresponding wafer type.

Further, the type of wafer is judged according to the pressure value and the preset pressure value table, and the obtained judgment result specifically includes the following:

step:

Step S51 : looking up the pressure value range corresponding to the pressure value in the preset pressure value table;

Step S52: If there is a corresponding pressure value range in the pressure value table, determine the wafer type corresponding to the pressure value range;

Step S53: If the corresponding pressure value range does not exist in the pressure value table, an abnormal alarm signal is issued.

The wafer detection system and method for conveying a manipulator provided in the embodiment of the present application adds a pressure sensor 4, which can determine the type of the wafer and whether an abnormality occurs according to the pressure value of the wafer obtained by the pressure sensor 4. Effectively identify different wafer specifications and find wafer anomalies.

The above embodiments are only used to illustrate the present application, but not to limit the present application. Although the present application has been described in detail with reference to the embodiments, those of ordinary skill in the art should understand that various combinations, modifications or equivalent replacements are made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application, and should cover within the scope of the claims of this application.

Claims

A conveying manipulator, characterized in that it includes:

a base body, including a support portion for supporting the wafer;

Power supply, including positive and negative terminals;

A static electricity generating device, connected to a power supply, includes a positive charge terminal and an electronic terminal, and the positive charge terminal and the electronic terminal are both arranged on the support portion;

A reversing component is arranged between the power supply and the static electricity generating device, the reversing component is in a first state, the positive charge terminal is connected to the positive terminal, and the electronic terminal is connected to the negative terminal ; the reversing component is in the second state, the positive charge terminal is connected to the negative terminal, and the electronic terminal is connected to the positive terminal.
The conveying manipulator according to claim 1, wherein the power supply is provided with one group, the positive terminal is connected with a first wire, the negative terminal is connected with a second wire, and the reversing component is a reversing switch , the two ends of the reversing switch are the first wire and the second wire respectively, the reversing switch is turned off, the positive charge terminal is connected to the positive terminal, and the electronic terminal is connected to the negative terminal terminal; the reversing switch is turned on, the positive charge terminal is connected to the negative terminal, and the electronic terminal is connected to the positive terminal.
The conveying manipulator according to claim 1, wherein the power source comprises a first DC power generator and a second DC power generator arranged in parallel, and the positive terminal of the first DC power generator is connected to the The positive pole of the second DC power generator is reversed, and the reversing component includes a first switch and a second switch, the first switch is connected to the branch where the first DC power generator is located, and the first switch is connected to the branch where the first DC power generator is located. Two switches are connected to the branch where the second DC power generator is located; the first switch is turned on and the second switch is turned off, and the positive charge terminal is connected to the positive terminal of the first DC power generator, The electronic terminal is connected to the negative terminal of the first DC power generator; the first switch is turned off and the second switch is turned on, and the positive charge terminal is connected to the negative terminal of the second DC power generator. At the end, the electronic terminal is connected to the positive end of the second DC power generator.
The transfer robot according to claim 1, wherein the support portion is provided with a wafer contactor, the wafer contactor protrudes from the surface of the support portion, and the bottom of the wafer contactor is provided with a wafer contactor. There are pressure sensors.
The conveying manipulator according to claim 4, further comprising a central processing unit, the power supply and the pressure sensor are both connected to the central processing unit, and the central processing unit stores the static electricity generating device The relationship model between the input voltage of the pressure sensor and the output voltage of the pressure sensor, the power supply stops supplying power to the static electricity generating device, and the output voltage of the static electricity generating device is obtained according to the relationship model and the output voltage of the pressure sensor. The input voltage is input, and the state of the commutation member is switched, so that the power supply supplies the input voltage to the static electricity generating device.
The transfer robot according to claim 4, wherein the wafer contactors and the positive charge terminals are alternately arranged, and/or the wafer contactors and the electronic terminals are arranged alternately.
The transmission manipulator according to claim 2, wherein a first adjustment resistor is connected to the first wire, and a second adjustment resistor is connected to the second wire.
The conveying robot according to claim 1, wherein the base body is an insulating material.
The conveying manipulator according to any one of claims 1 to 8, wherein the base body is configured with a wire slot, a first wire connecting the power supply and the positive charge terminal, and connecting the power supply and the The second wires of the electronic terminal are all arranged in the wiring groove.
The conveying manipulator according to claim 9, wherein a wiring distributor is connected to the base body, and the wiring distributor is arranged at one end of the wiring groove close to the power supply.