CN111933564A - Conveying manipulator - Google Patents
Conveying manipulator Download PDFInfo
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- CN111933564A CN111933564A CN202011029264.1A CN202011029264A CN111933564A CN 111933564 A CN111933564 A CN 111933564A CN 202011029264 A CN202011029264 A CN 202011029264A CN 111933564 A CN111933564 A CN 111933564A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention relates to the technical field of semiconductor processing, and provides a conveying manipulator which comprises: the substrate comprises a supporting part for supporting a wafer; the power supply comprises a positive terminal and a negative terminal; the static electricity generating device is connected with the power supply and comprises a positive charge end and an electronic end which are both arranged on the supporting part; the reversing component is arranged between the power supply and the static electricity generating device, the reversing component is in a first state, the positive charge end is connected with the positive electrode end, and the electronic end is connected with the negative electrode end; the reversing component is in a second state, the positive charge end is connected with the negative end, and the electronic end is connected with the positive end. The conveying manipulator provided by the invention can be used for adsorbing the wafers by utilizing the coulomb force, can realize the conveying of the wafers with various specifications, can eliminate the residual coulomb force by the reversing component, can reduce the production cost and reduce the damage to the wafers.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a conveying manipulator.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductor products are numerous and the manufacturing process is complex, and wafers are silicon wafers used for manufacturing silicon semiconductor integrated circuits. Wafer thicknesses vary greatly from fab to fab, and the contact area of the wafer contactor with the wafer is required to be as small as possible to avoid defects and exposure problems. In the related art, among the transfer robots for transferring wafers, a transfer robot of one specification is suitable for wafers of one specification, and at present, no transfer robot can transfer wafers of different specifications, so that the transfer cost of wafers is high, and the equipment investment is large.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a conveying manipulator which can realize the conveying of wafers with various specifications by utilizing the coulomb force to adsorb the wafers, can eliminate the residual coulomb force through a reversing component, can reduce the production cost and reduce the damage to the wafers.
According to an embodiment of the first aspect of the present invention, a transfer robot includes:
a base body including a support portion for supporting a wafer;
a power supply comprising a positive terminal and a negative terminal;
the static electricity generating device is connected with a power supply and comprises a positive charge end and an electronic end, and the positive charge end and the electronic end are both arranged on the supporting part;
the reversing component is arranged between the power supply and the static electricity generating device and is in a first state, the positive charge end is connected with the positive electrode end, and the electronic end is connected with the negative electrode end; the reversing component is in a second state, the positive charge end is connected with the negative electrode end, and the electronic end is connected with the positive electrode end.
According to one embodiment of the invention, the power supply is provided in one group, the positive terminal is connected with a first wire, the negative terminal is connected with a second wire, the reversing component is a reversing switch, two ends of the reversing switch are respectively connected with the first wire and the second wire, the reversing switch is closed, the positive charge terminal is connected with the positive terminal, and the electronic terminal is connected with the negative terminal; the reversing switch is turned on, the positive charge end is connected with the negative electrode end, and the electronic end is connected with the positive electrode end.
According to one embodiment of the invention, the power supply comprises a first direct current power supply generator and a second direct current power supply generator which are arranged in parallel, the positive terminal of the first direct current power supply generator is opposite to the positive terminal of the second direct current power supply generator, the reversing component comprises a first switch and a second switch, the first switch is connected to the branch where the first direct current power supply generator is located, and the second switch is connected to the branch where the second direct current power supply generator is located; the first switch is turned on, the second switch is turned off, the positive charge end is connected with the positive electrode end of the first direct current power supply generator, and the electronic end is connected with the negative electrode end of the first direct current power supply generator; the first switch is turned off, the second switch is turned on, the positive charge end is connected with the negative end of the second direct current power supply generator, and the electronic end is connected with the positive end of the second direct current power supply generator.
According to one embodiment of the invention, the supporting part is provided with a wafer contactor, the wafer contactor protrudes out of the surface of the supporting part, and the bottom of the wafer contactor is provided with a pressure sensor.
According to an embodiment of the present invention, the electrostatic protection device further includes a central processing unit, the power supply and the pressure sensor are both connected to the central processing unit, a relationship model between an input voltage of the electrostatic generating device and an output voltage of the pressure sensor is stored in the central processing unit, the power supply stops supplying power to the electrostatic generating device, the input voltage of the electrostatic generating device is obtained according to the relationship model and the output voltage of the pressure sensor, and a state of the reversing component is switched so that the power supply supplies the input voltage to the electrostatic generating device.
According to one embodiment of the invention, the wafer contactors are arranged alternately with the positive charge terminals and/or the wafer contactors are arranged alternately with the electron terminals.
According to an embodiment of the present invention, a first adjusting resistor is connected to the first conducting wire, and a second adjusting resistor is connected to the second conducting wire.
According to one embodiment of the invention, the substrate is an insulating material.
According to one embodiment of the invention, the positively charged terminals alternate with the electron terminals.
According to an embodiment of the present invention, the substrate forms a wiring channel, and a first wire connecting the power source and the positive charge terminal and a second wire connecting the power source and the electronic terminal are disposed in the wiring channel.
According to one embodiment of the invention, a wiring distributor is connected to the base body and is arranged at one end of the wiring trough close to the power supply.
One or more technical solutions in the embodiments of the present invention have at least one of the following technical effects:
the embodiment of the invention provides a conveying manipulator which comprises a base body, a power supply, an electrostatic generating device and a reversing component, wherein the electrostatic generating device comprises a positive charge end and an electronic end which are connected with the power supply, coulomb force can be generated between the positive charge end and the electronic end and a wafer, so that the wafer is adsorbed and fixed, the conveying manipulator is suitable for conveying wafers of various specifications, and the production cost can be reduced; when the power supply stops supplying power to the static electricity generating device, coulomb force possibly remains between the positive charge end and the electronic end and the wafer, the wafer is difficult to overcome static friction force and is separated from the transmission manipulator, the power supply supplies power to the static electricity generating device reversely by adjusting the reversing component, namely the positive charge end is communicated with the negative end of the power supply, and the electronic end is communicated with the positive end of the power supply, so that the residual coulomb force is eliminated through the reverse coulomb force, the wafer is smoothly separated from the transmission manipulator, the problems of sheet carrying and breaking in the wafer transmission process are solved, social resources are saved, and the economic value is high.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic top view of a transfer robot according to an embodiment of the present invention;
FIG. 2 is a schematic side view of a transfer robot according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first implementation of a reversing component of a transfer robot provided by an embodiment of the invention;
fig. 4 is a schematic structural diagram of a second implementation of a reversing component of a transfer robot provided by an embodiment of the invention;
FIG. 5 is a schematic diagram of the control logic for a transfer robot provided in accordance with an embodiment of the present invention;
fig. 6 is a schematic diagram of a relationship model between an input voltage of the static electricity generation device of the transfer robot and an output voltage of the pressure sensor according to the embodiment of the present invention;
FIG. 7 is a graph of output voltage of a pressure sensor of a transfer robot versus stiction of a surface of a wafer contactor in accordance with an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a distribution of positive charge tips and electron tips of a transfer robot according to an embodiment of the present invention.
Reference numerals:
1: a substrate; 11: a support portion; 12: a connecting portion; 13: a wiring groove;
2: a static electricity generating device; 21: a positive charge terminal; 22: an electronic terminal;
3: a wafer contactor; 4: a pressure sensor;
5: a first conductive line; 51: a first resistor; 52: a second resistor; 53: a first capacitor;
6: a second conductive line; 61: a third resistor; 62: a fourth resistor; 63: a second capacitor;
7: a wire distributor;
8: a power source; 81: a first direct current power supply generator; 82: a second direct current power supply generator;
91: a reversing switch; 92: a first switch; 93: a second switch.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
An embodiment of the present invention, as shown in fig. 1 to 8, provides a transfer robot including: the electrostatic discharge device comprises a base body 1, a power supply 8, an electrostatic generating device 2 and a reversing component. The power supply 8 supplies power to the static electricity generating device 2, the reversing component is used for switching the connection relation between the static electricity generating device 2 and the two ends of the power supply 8, and the base body 1 is used for installing the static electricity generating device 2. The base body 1 includes a support portion 11 for supporting a wafer; the power supply 8 comprises a positive end and a negative end, the positive end is connected with a first lead 5, and the negative end is connected with a second lead 6; the static electricity generating device 2 is connected with the power supply 8, the static electricity generating device 2 comprises a positive charge end 21 and an electronic end 22, and the positive charge end 21 and the electronic end 22 are arranged on the supporting part 11; the reversing component is arranged between the power supply 8 and the static electricity generating device 2, the reversing component is in a first state, the positive charge end 21 is connected with the positive electrode end, and the electronic end 22 is connected with the negative electrode end; the reversing element is in the second state with the positive terminal 21 connected to the negative terminal and the electronic terminal 22 connected to the positive terminal.
The wafer can be fixed and supported by the supporting portion 11 and move synchronously with the supporting portion 11, so that the wafer is transferred. The wafer and the supporting part 11 provide a fixing acting force through the static electricity generating device 2, after the static electricity generating device 2 is electrified, the positive charge end 21 generates positive charges, the positive charge end 21 attracts electrons in the wafer, the electronic end 22 generates electrons, and the electronic end 22 attracts the positive charges in the wafer, so that the static electricity adsorption and fixation of the wafer and the conveying manipulator are realized.
When the wafer is conveyed to a target position, the power supply 8 stops supplying power to the static electricity generating device 2, the positive charge end 21 and the electronic end 22 still have some residual charges, at the moment, the positive electrode end of the power supply 8 is connected with the electronic end 22 through the reversing component, the negative electrode end of the power supply 8 is connected with the positive charge end 21, so that the power supply 8 supplies positive charges to the electronic end 22 and supplies electrons to the positive charge end 21, the residual positive charges and electrons of the positive charge end 21 and the electronic end 22 are eliminated, acting forces between the positive charge end 21 and the wafer and between the electronic end 22 and the wafer are zero, the wafer can be smoothly moved away from the substrate 1, and the problems of sheet carrying and sheet breaking of the wafer possibly caused by residual coulomb force are solved.
In the embodiment, the electrostatic generating device 2 with double electric properties is used for generating coulomb force to adsorb the wafer, so that positive pressure is generated between the wafer and the supporting part 11, and the static friction force in the wafer transferring process is ensured; after the wafer moves to the target position, the charges supplied to the positive charge end 21 and the electron end 22 by the power supply 8 can be switched through the reversing component, so that the residual coulomb force of the positive charge end 21 and the electron end 22 is eliminated. The transmission manipulator of the embodiment is suitable for wafers with different thicknesses produced under different processes, can ensure the static friction between the wafer and the supporting part 11, realizes the non-sliding transmission of the wafer, can realize the fully-adaptive transmission of various wafers, solves the problem of high wafer transmission cost in the related technology, also solves the problems of sheet carrying and breaking in the wafer transmission process, is favorable for saving social resources, and has high economic value.
Two embodiments of the commutation component:
in one embodiment, referring to fig. 3, the power supply 8 is provided in a set, a positive terminal of the power supply 8 is connected to the first wire 5, and a negative terminal of the power supply 8 is connected to the second wire 6; the reversing component is a reversing switch 91, two ends of the reversing switch 91 are respectively provided with a first lead 5 and a second lead 6, the reversing switch 91 is closed, the positive charge end 21 is connected with the positive electrode end, and the electronic end 22 is connected with the negative electrode end; the reversing switch 91 is turned on, the positive charge terminal 21 is connected to the negative terminal, and the electronic terminal 22 is connected to the positive terminal. By adjusting the electrifying direction of the power supply 8 to the static electricity generating device 2, the residual coulomb force between the wafer and the static electricity generating device 2 is eliminated, the wafer is prevented from being damaged by a conveying manipulator, and the safety of wafer conveying is improved.
Wherein the power supply 8 provides a direct current and the power supply 8 may be a direct current power supply generator. The first lead 5 comprises a first section and a second section, the second lead 6 comprises a third section and a fourth section, one end of the reversing switch 91 is connected to the butt joint position of the first section and the second section, and the other end of the reversing switch 91 is connected to the butt joint position of the third section and the fourth section. When the reversing switch 91 is closed, the first section is communicated with the second section, the third section is communicated with the fourth section, the positive electrode end is communicated with the positive charge end 21, and the negative electrode end is communicated with the electronic end 22; when the reversing switch 91 is turned on, the first section is communicated with the fourth section, the third section is communicated with the second section, the positive electrode end is communicated with the electronic terminal 22, and the negative electrode end is communicated with the positive charge terminal 21, so that residual coulomb force is eliminated in a reverse electrifying mode, the wafer can be separated from the substrate 1, and the wafer is not damaged.
In one embodiment, a first adjusting resistor is connected to the first conducting wire 5, and a second adjusting resistor is connected to the second conducting wire 6. The first adjusting resistor is used for adjusting the voltage of the positive charge terminal 21, and the second adjusting resistor is used for adjusting the voltage of the electronic terminal 22, so that the electrostatic generating device 2 can provide different adsorption forces according to different wafer specifications. The resistance values of the first adjusting resistor and the second adjusting resistor can be adjusted.
The first adjusting resistor comprises a first resistor 51 and a second resistor 52, the first resistor 51 is connected to the first segment, the second resistor 52 is connected to the second segment, and the voltages of all parts can be adjusted independently. The second adjusting resistor comprises a third resistor 61 and a fourth resistor 62, the third resistor 61 is connected to the third segment, the fourth resistor 62 is connected to the fourth segment, and the voltages of all parts can be adjusted independently.
Furthermore, a first capacitor 53 is connected to the first conducting wire 5, and a second capacitor 63 is connected to the second conducting wire 6, so that the voltage is more stable.
In one embodiment, referring to fig. 4, the difference from the embodiment shown in fig. 3 is that the power supply includes a first direct current power generator 81 and a second direct current power generator 82 arranged in parallel and the positive terminal of the first direct current power generator 81 is arranged opposite to the positive terminal of the second direct current power generator 82, and at the same time, the negative terminal of the first direct current power generator 81 is arranged opposite to the negative terminal of the second direct current power generator 82. The reversing component comprises a first switch 92 and a second switch 93, the first switch 92 is connected to the branch where the first direct-current power supply generator 81 is located, the second switch 93 is connected to the branch where the second direct-current power supply generator 82 is located, the first switch 92 is opened, the second switch 93 is closed, the positive charge end 21 is connected with the positive electrode end of the first direct-current power supply generator 81, and the electronic end 22 is connected with the negative electrode end of the first direct-current power supply generator 81; the first switch 92 is closed and the second switch 93 is open, the positive terminal 21 is connected to the negative terminal of the second dc power supply generator 82, and the electronic terminal 22 is connected to the positive terminal of the second dc power supply generator 82. In this embodiment, two sets of power supplies 8 are provided in opposite directions, and the power supply direction to the electrostatic generator 2 is switched by switching the first dc power supply generator 81 and the second dc power supply generator 82 to eliminate the residual coulomb force, so that the wafer can be separated from the substrate 1 without damaging the wafer.
In this embodiment, a resistor and a capacitor are also connected to a wire between the power supply 8 and the static electricity generating device 2 to ensure stability of the circuit structure.
In one embodiment, the supporting portion 11 is provided with a wafer contactor 3, the wafer contactor 3 protrudes from the surface of the supporting portion 11, the surface of the wafer contactor 3 is used for contacting with the wafer, the contact area between the wafer and the substrate 1 is reduced, and the static friction force between the wafer and the surface of the wafer contactor 3 is used for preventing the wafer from moving relative to the substrate 1, so that the conveying stability of the wafer is ensured.
In one embodiment, the bottom of the wafer contactor 3 is provided with a pressure sensor 4, the pressure sensor 4 is used for measuring the pressure applied to the wafer contactor 3 by the wafer, and the static friction force between the wafer and the surface of the wafer contactor 3 can be calculated by the friction coefficient between the pressure and the surface of the wafer contactor 3, as shown in fig. 7. Wherein, the pressure of the wafer acting on the wafer contactor 3 is the sum of the gravity of the wafer and the attraction force of the static electricity generating device 2 to the wafer. The gravity of the wafer is not changed, and according to different set static friction forces, a user can adjust the attraction force of the static electricity generating device 2 to the wafer according to the pressure measured by the pressure sensor 4, namely adjust the voltage of the static electricity generating device 2. And when the wafer is conveyed to the target position, the power supply 8 stops supplying power to the static electricity generating device 2, the pressure measured by the pressure sensor 4 is the sum of the gravity of the wafer and the residual coulomb force, the residual coulomb force can be obtained, and according to the residual coulomb force, the power supply 8 can supply power reversely to enable the static electricity generating device 2 to generate reverse acting force with the same magnitude so as to eliminate the residual coulomb force, and the wafer can smoothly leave the conveying manipulator.
In one embodiment, the transfer robot further includes a central processing unit, the power supply 8 and the pressure sensor 4 are both connected to the central processing unit, a relation model between the input voltage of the static electricity generating device 2 and the output voltage of the pressure sensor 4 is stored in the central processing unit, the power supply 8 stops supplying power to the static electricity generating device 2, the input voltage of the static electricity generating device 2 is obtained according to the relation model and the output voltage of the pressure sensor 4, the state of the reversing component is switched, and the power supply 8 supplies the reverse input voltage to the static electricity generating device 2.
The relation model is a curve relation between the input voltage of the static electricity generating device 2 and the output voltage of the pressure sensor 4, which is measured in advance in a laboratory according to the specification of the wafer. Referring to fig. 6, fig. 6 illustrates a relationship model between the input voltage of the electrostatic generator 2 and the output voltage of the pressure sensor 4 of the wafer. The central processing unit can store the relation models of wafers with various specifications, and can call the relation models corresponding to the wafers to be transmitted according to the requirements.
Furthermore, through a relation model measured in advance in a laboratory, the central processing unit can correct the relation model according to real-time data, so that the adjustment is more accurate.
Referring to fig. 5, the cpu transmits an input voltage required by the electrostatic generator 2 to the electrostatic generator controller, the electrostatic generator controller regulates and controls an output voltage of the electrostatic generator 2, and the pressure sensor 4 measures a pressure of the wafer against the wafer contactor 3 and feeds the measured pressure back to the cpu, which is a logical transmission relationship between voltage signals, and can solve the problem of wafer sticking and wafer breakage that may occur due to residual coulomb force.
In this embodiment, the electrostatic generator 2 capable of generating coulomb force is used to generate positive pressure to ensure the static friction force during the wafer transfer process. The positive pressure can be converted into an electric signal by the pressure sensor 4 at the bottom of the wafer contactor 3, the central processing unit receives the electric signal, and as a relation model between the input voltage of the static electricity generating device 2 and the induced electric signal of the pressure sensor 4 is written in the central processing unit, the central processing unit can control the voltage of the static electricity generating device 2 according to preset parameters, thereby realizing the non-slip transmission of wafers with different thicknesses produced under different processes. Meanwhile, when the input voltage of the static electricity generating device 2 is zero, whether static electricity is residual or not can be sensed according to the output voltage of the pressure sensor 4, then the reversing component is started, meanwhile, the induction voltage output by the pressure sensor 4 is reduced, and when the induction voltage reaches a safe voltage range, the conveying manipulator can perform sheet placing action.
In one embodiment, the wafer contactors 3 are uniformly distributed on the supporting part 11, and the bottom of each wafer contactor 3 is provided with a pressure sensor 4. The plurality of wafer contactors 3 provide a plurality of supporting points for the wafer, so that the wafer is more stably supported. Meanwhile, a plurality of sets of data can be measured by the plurality of pressure sensors 4, and the input voltage of the positive charge terminal 21 or the electronic terminal 22 at each position can be adjusted according to the pressure at the position; the average value of the input voltage of the static electricity generating device 2 can be obtained according to the average value of the multiple groups of data, and the input voltages of the multiple groups of positive charge terminals 21 and the multiple groups of electronic terminals 22 are synchronously adjusted; of course, the adjustment method of the input voltage of positive charge terminal 21 and the input voltage of electronic terminal 22 is not limited to the above, and may be adjusted in other manners.
In one embodiment, the pressure sensor 4 is a piezo-ceramic sensor. The piezoelectric ceramic sensor has high sensitivity, high reliability, high stability, high and low temperature resistance and good moisture resistance.
Of course, the pressure sensor 4 is not limited to a piezoelectric ceramic sensor, and other sensors that deform under pressure and convert the pressure into an electrical signal may be used.
In one embodiment, a plurality of positive charge terminals 21 are distributed on the substrate 1, and a plurality of electron terminals 22 are also distributed on the substrate 1, so that the wafer can be stressed at a plurality of positions, and the static friction force between the wafer and the wafer contactor 3 is ensured.
Referring to fig. 1, two positive charge terminals 21 are provided on the base 1, two electron terminals 22 are provided, and the positive charge terminals 21 are provided symmetrically to the electron terminals 22.
In one embodiment, the wafer contactor 3 and the positive charge terminal 21 are alternately arranged, the positive charge terminal 21 provides an acting force for attracting the wafer, and the wafer contactor 3 provides a supporting force for the wafer, wherein the attracting force and the supporting force are alternately distributed to help the wafer to be uniformly stressed.
Similarly, the alternating arrangement of the wafer contactors 3 and the electrical terminals 22 also helps to evenly stress the wafer.
As shown in fig. 1, the wafer contactor 3 and the positive charge terminal 21 are alternately arranged, and the wafer contactor 3 and the electronic terminal 22 are alternately arranged, so that the wafer is stressed more uniformly. In one embodiment, the positive charge terminals 21 and the electron terminals 22 are alternately arranged, and the positive charge terminals 21, the electron terminals 22, the positive charge terminals 21, the electron terminals 22 … … are arranged in sequence in a clockwise or counterclockwise direction, and so on, so as to facilitate uniform distribution of the electric field.
In one embodiment, referring to fig. 8, the support 11 is provided with a predetermined path, and the positive charge terminals 21 and the electron terminals 22 are alternately arranged on the same predetermined path. On the same preset path, the positive charge terminals 21 and the electronic terminals 22 are alternately arranged, so that an electric field is uniformly distributed, uniform stress on the wafer is facilitated, stable wafer transmission is ensured, and damage to the wafer is reduced. The positive charge terminals 21 alternate with the electron terminals 22, and it is understood that the positive charge terminals 21, the electron terminals 22, the positive charge terminals 21, the electron terminals 22 … …, and so on are arranged in a clockwise or counterclockwise direction.
When one preset path is arranged, the wafer on the preset path is ensured to be uniformly stressed; when the positive charge terminals 21 and the electronic terminals 22 are uniformly arranged in plurality in the circumferential direction of the supporting portion 11, the positive charge terminals 21 and the electronic terminals 22 are alternately arranged on the same circumference. When the preset paths are provided with a plurality of paths, the electric field on each preset path is ensured to be uniformly distributed.
Referring to fig. 8, a plurality of predetermined paths are provided on the supporting portion 11, and the positive charge terminals 21 correspond to the electronic terminals 22 on adjacent predetermined paths one by one. When two preset paths are arranged, two adjacent ends on the two preset paths are a positive charge end 21 and an electronic end 22 respectively; when three or more than three preset paths are arranged, two adjacent ends on any two preset paths are respectively the positive charge end 21 and the electronic end 22, so that all the positive charge ends 21 and the electronic ends 22 are ensured to be alternately arranged, and the electric field on the whole supporting part 11 is uniformly distributed.
Referring to fig. 1, the supporting portion 11 has a circular ring shape, and an electric terminal 22 and a positive charge terminal 21 are disposed on one side of the circular ring shape in a clockwise direction, so that electric fields on both sides are uniformly distributed.
In one embodiment, the base 1 defines a wiring channel 13, and the first and second wires 5, 6 are disposed within the wiring channel 13. The wiring groove 13 is convenient for limiting the wiring path, the assembly is simpler and more convenient, and the wires are arranged in the wiring groove 13, so that the wiring is more tidy.
In one embodiment, referring to FIG. 2, the cabling channel 13 is a hollow chamber within the base 1, the upper and lower surfaces of the cabling channel 13 are closed, and the end of the cabling channel 13 is open to allow wires to be introduced into the cabling channel 13. The upper and lower surfaces of the wiring groove 13 are sealed to provide a relatively sealed environment for the positive charge terminal 21 and the electron terminal 22, so that the influence of the external environment on the positive charge terminal 21 and the electron terminal 22 is reduced, and the stability of coulomb force is improved.
The base body 1 can comprise an upper shell and a lower shell, the wiring groove 13 is limited between the upper shell and the lower shell, processing of the wiring groove 13 is facilitated, and installation of wires is facilitated.
It should be noted that the wiring groove 13 is not limited to a hollow chamber structure, and may be a groove recessed downward from the surface of the base 1.
In one embodiment, the cabling channel 13 extends in a straight line, a circular arc or a serpentine, i.e. the predetermined path extends in a straight line, a circular arc or a serpentine. Referring to fig. 8, the predetermined path is a circular arc, a plurality of circular arc-shaped wiring grooves 13 are formed in the circumferential direction of the support portion 11, and a plurality of positive charge terminals 21 and a plurality of electron terminals 22 are formed in each wiring groove 13, so that coulomb force is uniformly distributed. Of course, the predetermined path may be a linear path or a serpentine path, and when the predetermined path is a linear path, the contour of the support portion 11 may also be a linear path; when the predetermined path is a serpentine shape, the serpentine shape can also be understood as an S-shape, and the serpentine shape can increase the length of the predetermined path on the supporting portion 11, so that the electric field is more uniform.
In one embodiment, when the supporting portion 11 is provided with the wafer contactor 3, the bottom of the wafer contactor 3 is provided with the pressure sensor 4, and the pressure sensor 4 is disposed in the wiring groove 13. The pressure sensor 4 is also arranged in a relatively closed environment, so that the measurement accuracy of the pressure sensor 4 is ensured, and the influence of the environment on the measurement result is reduced.
In one embodiment, a wire distributor 7 is attached to the base 1, the wire distributor 7 being located at an end of the raceway arrangement 13 adjacent the power source 8. The wiring distributor 7 is used for connecting a lead, the pressure sensor 4 is connected with the power supply 8 through the wiring distributor 7, the leads of the positive charge terminal 21 and the electronic terminal 22 are also connected with the power supply 8 through the wiring distributor 7, and the pressure sensor 4 and the static electricity generating device 2 can be simultaneously supplied with power through one power supply 8, so that the structure is simplified.
Wherein, the wiring distributor 7 on one side of the substrate 1 can be connected to the positive terminal and the negative terminal of the power supply 8 at the same time, so that the positive charge terminal 21 and the electron terminal 22 can be arranged on one side of the supporting part 11 at the same time, which contributes to the uniform distribution of the electric field.
In one embodiment, the material of the base 1 is an insulating material, which may be ceramic, plastic, rubber, or the like. The base body 1 further comprises a connecting portion 12, and the connecting portion 12 is used for being connected with a driving component such as a motor and a cylinder. The supporting part 11 is a hollow circular ring-shaped structure, the wafer is supported by the circular ring-shaped supporting part 11, the stress on the wafer is uniform, and other operations can be performed on the wafer through the hollow part. The connecting portion 12 is located at one side of the supporting portion 11, and the connecting portion 12 and the supporting portion 11 can be integrally formed or assembled together, and can be selected according to requirements.
In one embodiment, the transfer robot comprises a power supply 8, a substrate 1, a static electricity generating device 2, a reversing component, a wafer contactor 3 and a piezoceramic sensor, wherein the wafer falls on the wafer contactor 3 of the supporting part 11, and a positive charge end 21 and an electron end 22 of the static electricity generating device 2 are applied with voltage under the action of a static electricity generating device controller to generate coulomb force, so that static friction force between the wafer contactor 3 and the wafer is generated. Meanwhile, under the action of coulomb force, the piezoelectric ceramic sensor can sense the coulomb force actually generated and feed back the coulomb force to the central processing unit, the central processing unit regulates the input voltage of the static electricity generating device 2 according to a prefabricated relation model, the wafer is ensured to be always on the supporting part 11, and the wafer is carried by the transmission manipulator to the appointed position of the system. After the wafer reaches the designated position, the piezoceramics sensor can sense the power supply 8 and stop supplying power to the static generating device 2 according to the induced voltage of pressurized, whether static has the residue, judges whether opens the switching-over part, and when opening the switching-over part, the induced voltage of piezoceramics sensor pressurized diminishes, and when this induced voltage reached safe voltage scope, the piece action can be put to the conveying manipulator, and the wafer can be safely and completely placed to the designated position.
Embodiments of a second aspect of the present invention provide a wafer chucking force adjustment system for a transfer robot, comprising: the system comprises N pressure sensors 4, N wafer contactors 3, a central processing unit, a static electricity generating device controller and a static electricity generating device 2, wherein N is a positive integer not less than 3; the static electricity generating device 2 is connected with a voltage output end of the static electricity generating device controller and is used for generating static charges to generate induced charges with the wafer; the N pressure sensors 4 are respectively connected with the N wafer contactors 3 and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors 3; the central processing unit is connected with the output ends of the N pressure sensors 4 and is used for determining a corresponding current target voltage value according to the pressure value and a preset relation model and driving the static electricity generating device controller to output a current actual voltage value by using the current target voltage value so as to enable the static electricity generating device 2 to generate corresponding static electricity; the preset relation model is provided with a corresponding relation between the pressure value and the target voltage value.
Specifically, N pressure sensors 4, that is, the 1 st pressure sensor and the 2 nd pressure sensor … … nth pressure sensor are arranged at the bottom of the wafer contactor 3 in a one-to-one correspondence manner, so that when a wafer is placed on the wafer contactor 3, the wafer can generate pressure on the pressure sensors 4, and the pressure sensors 4 acquire pressure values caused by the wafer.
Further, as shown in fig. 6 and 7, it can be known that different types of wafers require different static friction forces, and the static friction force corresponds to the output voltage of the pressure sensor 4, and the output voltage of the pressure sensor 4 corresponds to the input voltage of the static electricity generating device 2, so that the corresponding relationship between the static friction force and the input voltage of the static electricity generating device 2 can be found, and the input voltage of the static electricity generating device 2 is the target voltage value to be generated by the static electricity generating device 2. Therefore, different target voltage values can be input to different types of wafers, and corresponding static friction force is generated.
Specifically, the preset relation model may be set in the form of a preset static control voltage table, so that when the pressure sensor 4 transmits a voltage signal, that is, a signal of a pressure value, a corresponding target voltage value may be searched in the preset static control voltage table according to the pressure value; the preset static control voltmeter is provided with a pressure value range and a corresponding target voltage value.
Of course, the relationship expression between the pressure value and the target voltage value may also be performed in a functional manner, so as to obtain a more accurate target voltage value, that is, the preset relationship model is a functional relationship between the pressure value and the target voltage value. And after the pressure value is obtained, calculating by using the functional relation to obtain a target voltage value.
It should be noted that the method of the present embodiment is applicable to the transfer robot in the above embodiments, and the positive charge head 21 and the electron head 22 of the static electricity generating device 2 are both disposed on the transfer robot; power supply 8 is used to supply power to positive charge terminal 21 and electronic terminal 22.
On the basis of any one of the above embodiments, the embodiment of the invention is also provided with an alarm module connected with the central processing unit; the central processing unit is also used for acquiring a current target voltage value and a current actual voltage value, and judging whether the difference value of the current target voltage value and the current actual voltage value exceeds a preset threshold value or not; and if the current threshold value is exceeded, triggering an alarm module.
Further, the central processing unit is further configured to obtain a current target voltage value and a current actual voltage value, and determine whether a difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; and if the current target voltage value does not exceed the preset threshold value, correcting the preset relation model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.
Specifically, when the preset relation model is corrected, the central processor is specifically configured to reduce the target voltage value in the preset relation model if the current target voltage value is smaller than the current actual voltage value; and if the current target voltage value is larger than the current actual voltage value, increasing the target voltage value in the preset relation model.
On the basis of the above embodiment, in this embodiment, in order to know whether there is a deviation in the wafer placement position, the cpu is further configured to issue a wafer placement error alarm when the deviation between any one of the N pressure values corresponding to the N pressure sensors 4 and the other pressure value exceeds a threshold value. That is, if the wafer is placed at the correct position, the pressure values of the N pressure sensors 4 should be the same, but if one of the pressure sensors is abnormal, it indicates that the abnormal pressure sensor 4 is subjected to too much or too little pressure, and the wafer is placed at an incorrect position.
The following describes a wafer suction force adjusting method for a transfer robot according to an embodiment of the present invention, and the wafer suction force adjusting method for a transfer robot described below and the wafer suction force adjusting system for a transfer robot described above may be referred to in correspondence with each other.
According to the wafer adsorption force adjusting system and method for the conveying manipulator, the static charges generated by the static electricity generating device 2 are controlled to be different by utilizing different weights of wafers with different specifications, the adsorption force is generated by the static electricity induction of the wafer to generate different positive pressures, the static friction force in the wafer transferring process is guaranteed, the positive pressures can be converted into the pressure value of an electric signal by the pressure sensor 4 below the wafer contactor 3, and therefore the non-sliding transmission of the wafers with different thicknesses under different processes is achieved.
An embodiment of the present invention further provides a wafer suction force adjusting method for a transfer robot, which is applied to any one of the wafer suction force adjusting systems, and is specifically executed by a central processing unit, where the method specifically includes:
step S61: when the wafer is placed on the wafer contactor 3, acquiring a pressure value of the wafer;
step S62: determining a corresponding current target voltage value according to the pressure value and a preset relation model;
step S63: driving the static electricity generating device controller to output the current actual voltage value by using the current target voltage value so as to enable the static electricity generating device 2 to generate corresponding static electricity;
the preset relation model is provided with a corresponding relation between the pressure value and the target voltage value.
Further, specifically executed by the central processing unit, the method specifically further includes:
step S71: acquiring a current target voltage value and a current actual voltage value;
step S72: judging whether the difference value between the current target voltage value and the current actual voltage value exceeds a preset threshold value or not;
step S73: and if the current target voltage value does not exceed the preset threshold value, correcting the preset relation model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.
In accordance with an embodiment of the third aspect of the present invention, there is provided a wafer inspection system for a transfer robot, comprising: the system comprises N pressure sensors 4, N wafer contactors 3 and a central processing unit, wherein N is a positive integer not less than 3; the N pressure sensors 4 are respectively connected with the N wafer contactors 3 and used for acquiring the pressure value of the wafer after the wafer is placed on the wafer contactor 3, wherein the pressure value is the sum of the output values of the N pressure sensors 4; the central processing unit is connected with the output ends of the N pressure sensors 4 and is used for judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type.
Specifically, as shown in fig. 1, pressure sensors 4 are arranged at the bottom of each wafer contactor 3 in a one-to-one correspondence manner, when a wafer is placed on the wafer contactor 3, the wafer can generate pressure on the pressure sensors 4, and the pressure sensors 4 acquire pressure values caused by the wafer. The pressure value is the sum of the output values of the N pressure sensors 4, that is, the pressure value measured by each pressure sensor 4 needs to be summed, if the position of the wafer is correctly placed and is at the midpoint, the pressure value measured by each pressure sensor 4 is the same, but if the position of the wafer is not at the midpoint, the pressure value measured by each pressure sensor 4 may not be the same, but even if not the same, the sum of the output values of the sensors is the total pressure value generated by the wafer.
Specifically, when the central processor determines by using the pressure generated by the pressure sensor 4, the central processor may be specifically configured to search a pressure value range corresponding to the pressure value in a preset pressure value table; if the corresponding pressure value range exists in the pressure value table, determining the wafer type corresponding to the pressure value range; and if the corresponding pressure value range does not exist in the pressure value table, sending an abnormal alarm signal. For example, the pressure value is 5, and there are: the range of the first pressure value is 1-2, the range of the second pressure value is 2-3, and the range of the third pressure value is 3-4; if only the three pressure ranges exist, the current wafer is an abnormal wafer, and an abnormal alarm signal should be sent out. And if the fourth pressure value range 4-5 exists in the preset pressure value table, the current wafer belongs to the fourth pressure value range, and therefore the type of the current wafer can be judged. Of course, the preset pressure value table also contains the wafer types corresponding to the pressure value ranges such as the first pressure value range, the second pressure value range … …, and the like. In particular, the wafer type may be a process type or may be a different customer type from the wafer.
It should be noted that, in order to determine whether the wafer is placed on the transfer robot, a camera device may be further disposed in the wafer detection system, and the camera device is configured to capture a real-time image of the transfer robot; the central processing unit is further configured to receive the real-time image, determine whether the wafer is placed on the wafer contactor 3 according to the real-time image, and start the pressure sensor 4 when the wafer is placed on the wafer contactor 3. That is, the wafer is determined whether it is in place by image recognition. Of course, a neural network is required to be set in the central processing unit, and the neural network is trained on the image sample with the identification number wafer in place.
An embodiment of the present invention further provides a wafer inspection method for a transfer robot, which is applied to the wafer inspection system in any of the above embodiments, and includes:
step S41: when the wafer is placed on the wafer contactor 3, acquiring a pressure value of the wafer;
step S42: judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type.
Further, the determining the type of the wafer according to the pressure value and the preset pressure value table includes the following steps
The method comprises the following steps:
step S51: searching a pressure value range corresponding to the pressure value in a preset pressure value table;
step S52: if the corresponding pressure value range exists in the pressure value table, determining the wafer type corresponding to the pressure value range;
step S53: and if the corresponding pressure value range does not exist in the pressure value table, sending an abnormal alarm signal.
According to the wafer detection system and method for the conveying manipulator provided by the embodiment of the invention, the pressure sensor 4 is added, the type and the abnormality of the wafer can be judged according to the pressure value of the wafer acquired by the pressure sensor 4, different wafer specifications can be effectively distinguished, and the abnormal condition of the wafer can be found.
The above embodiments are merely illustrative of the present invention and are not to be construed as limiting the invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and the technical solution of the present invention is covered by the claims of the present invention.
Claims (10)
1. A transfer robot, comprising:
a base body including a support portion for supporting a wafer;
a power supply comprising a positive terminal and a negative terminal;
the static electricity generating device is connected with a power supply and comprises a positive charge end and an electronic end, and the positive charge end and the electronic end are both arranged on the supporting part;
the reversing component is arranged between the power supply and the static electricity generating device and is in a first state, the positive charge end is connected with the positive electrode end, and the electronic end is connected with the negative electrode end; the reversing component is in a second state, the positive charge end is connected with the negative electrode end, and the electronic end is connected with the positive electrode end.
2. The transfer robot of claim 1, wherein the power source is provided in a group, the positive terminal is connected to a first wire, the negative terminal is connected to a second wire, the reversing component is a reversing switch, two terminals of the reversing switch are respectively the first wire and the second wire, the reversing switch is turned off, the positive terminal is connected to the positive terminal, and the electronic terminal is connected to the negative terminal; the reversing switch is turned on, the positive charge end is connected with the negative electrode end, and the electronic end is connected with the positive electrode end.
3. The conveying robot according to claim 1, wherein the power supply includes a first direct-current power supply generator and a second direct-current power supply generator arranged in parallel and a positive terminal of the first direct-current power supply generator is opposite to a positive terminal of the second direct-current power supply generator, and the reversing means includes a first switch connected to a branch in which the first direct-current power supply generator is located and a second switch connected to a branch in which the second direct-current power supply generator is located; the first switch is turned on, the second switch is turned off, the positive charge end is connected with the positive electrode end of the first direct current power supply generator, and the electronic end is connected with the negative electrode end of the first direct current power supply generator; the first switch is turned off, the second switch is turned on, the positive charge end is connected with the negative end of the second direct current power supply generator, and the electronic end is connected with the positive end of the second direct current power supply generator.
4. The transfer robot of claim 1, wherein the support portion has a wafer contactor protruding from a surface of the support portion, and a pressure sensor is disposed at a bottom of the wafer contactor.
5. The transfer robot according to claim 4, further comprising a cpu, wherein the power supply and the pressure sensor are connected to the cpu, a relationship model between an input voltage of the static electricity generating device and an output voltage of the pressure sensor is stored in the cpu, the power supply stops supplying power to the static electricity generating device, the input voltage of the static electricity generating device is obtained from the relationship model and the output voltage of the pressure sensor, and a state of the reversing member is switched so that the power supply supplies the input voltage to the static electricity generating device.
6. The transfer robot of claim 4, wherein the wafer contactors alternate with the positive charge tips and/or the wafer contactors alternate with the electronic tips.
7. The transfer robot of claim 2, wherein a first adjustment resistor is connected to the first wire and a second adjustment resistor is connected to the second wire.
8. The transfer robot of claim 1, wherein the substrate is an insulating material.
9. The transfer robot of any one of claims 1-8, wherein the base defines a cabling channel, and wherein a first wire connecting the power source to the positive charge terminal and a second wire connecting the power source to the electronic terminal are disposed within the cabling channel.
10. The transfer robot of claim 9, wherein a wire distributor is coupled to the base and is disposed at an end of the cabling channel proximate the power source.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011029264.1A CN111933564B (en) | 2020-09-27 | 2020-09-27 | Conveying manipulator |
| PCT/CN2020/118900 WO2022061947A1 (en) | 2020-09-27 | 2020-09-29 | Transmission manipulator |
| JP2022540833A JP7434570B2 (en) | 2020-09-27 | 2020-09-29 | Conveyance manipulator |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011029264.1A CN111933564B (en) | 2020-09-27 | 2020-09-27 | Conveying manipulator |
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| CN111933564B CN111933564B (en) | 2021-01-05 |
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| JP (1) | JP7434570B2 (en) |
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| CN105097625A (en) * | 2014-05-19 | 2015-11-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Transmission apparatus and semiconductor processing device |
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| CN209056470U (en) * | 2018-12-05 | 2019-07-02 | 武汉新芯集成电路制造有限公司 | A kind of mechanical arm |
| CN210837701U (en) * | 2019-11-19 | 2020-06-23 | 长鑫存储技术有限公司 | Wafer transfer device and semiconductor processing equipment |
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| JP2867526B2 (en) * | 1990-01-16 | 1999-03-08 | 富士通株式会社 | Semiconductor manufacturing equipment |
| JP2506219B2 (en) * | 1990-06-19 | 1996-06-12 | 富士通株式会社 | Electrostatic adsorption method |
| JPH0513556A (en) * | 1991-07-01 | 1993-01-22 | Toshiba Corp | Electrostatic chuck |
| JPH11233601A (en) * | 1998-02-10 | 1999-08-27 | Hitachi Ltd | Electrostatic chucking apparatus and apparatus for processing sample using the same |
| JP2002222850A (en) | 2001-01-25 | 2002-08-09 | Mitsubishi Electric Corp | Method for detaching attracted object in electrostatic chuck |
| JP2009302415A (en) | 2008-06-17 | 2009-12-24 | Hitachi High-Technologies Corp | Charged-particle beam device, test piece holding system, method for holding test piece, and method for detaching test piece |
| JP2010141352A (en) | 2010-02-26 | 2010-06-24 | Ulvac Japan Ltd | Vacuum processing method |
| JP6068118B2 (en) | 2012-12-05 | 2017-01-25 | 日本特殊陶業株式会社 | Conveying device and conveying member |
| US10804821B2 (en) * | 2016-11-04 | 2020-10-13 | Advanced Ion Beam Technology, Inc. | Apparatus and method for monitoring the relative relationship between the wafer and the chuck |
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- 2020-09-27 CN CN202011029264.1A patent/CN111933564B/en active Active
- 2020-09-29 JP JP2022540833A patent/JP7434570B2/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105097625A (en) * | 2014-05-19 | 2015-11-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Transmission apparatus and semiconductor processing device |
| CN207320081U (en) * | 2017-09-13 | 2018-05-04 | 上海陛通半导体能源科技股份有限公司 | A kind of wafer end actuator with pressure sensor |
| CN209056470U (en) * | 2018-12-05 | 2019-07-02 | 武汉新芯集成电路制造有限公司 | A kind of mechanical arm |
| CN210837701U (en) * | 2019-11-19 | 2020-06-23 | 长鑫存储技术有限公司 | Wafer transfer device and semiconductor processing equipment |
Also Published As
| Publication number | Publication date |
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| WO2022061947A1 (en) | 2022-03-31 |
| JP7434570B2 (en) | 2024-02-20 |
| JP2023510207A (en) | 2023-03-13 |
| CN111933564B (en) | 2021-01-05 |
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Address after: 100176 block a, 14th floor, yard 8, Liangshuihe 2nd Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi automation equipment Technology Co.,Ltd. Address before: 100176 block a, 14 / F, courtyard 8, Liangshuihe 2nd Street, Daxing Economic and Technological Development Zone, Beijing Patentee before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. |