JP7434570B2 - Conveyance manipulator - Google Patents

Description

cross reference

This application claims priority to a Chinese patent application filed on September 27, 2020 with application number 202011029264.1 and whose invention is titled "Transport Manipulator", the entirety of which is incorporated herein by reference. It will be done.

TECHNICAL FIELD The present application relates to the technical field of semiconductor processing, and particularly relates to a transport manipulator.

Semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. There are many types of semiconductor products and the processes are complicated, and the wafers are silicon wafers used for manufacturing silicon semiconductor integrated circuits. Wafer thickness varies widely depending on the manufacturer, and the contact area of the wafer contactor that makes contact with the wafer needs to be as small as possible to avoid defects and exposure problems. In a transfer manipulator for transferring wafers with different thicknesses of wafers, in the related art, a transfer manipulator of one specification is suitable for wafers of one specification. Currently, there are no transport manipulators that can transport wafers with different specifications, resulting in high wafer transport costs and large equipment investments.

The present application aims to solve at least one of the problems existing in the prior art. To this end, the present application can adsorb wafers using Coulomb force and realize the transportation of wafers with multiple specifications.Furthermore, the residual Coulomb force can be removed by the direction switching member, reducing manufacturing costs and wafer transfer. To provide a transport manipulator that can reduce damage to.

The conveyance manipulator according to the embodiment of the first form of the present application is
a base including a support for supporting a wafer;
a power supply including a positive terminal and a negative terminal;
a static electricity generating device that is connected to a power source and includes a positive charge end and an electronic end, both of the positive charge end and the electronic end being provided on the support portion;
A direction switching member provided between the power source and the static electricity generator, wherein when the direction switching member is in a first state, the positive charge end is connected to the positive end, and the electronic end is connected to the positive end. a direction switching member connected to a negative end, and having the positive charge end connected to the negative end and the electronic end connected to the positive end when the direction switching member is in a second state.

According to an embodiment of the present application, one set of the power sources is installed, a first wire is connected to the positive end, a second wire is connected to the negative end, and the direction switching member is configured to switch the direction. a switch, the first wire and the second wire are connected to both ends of the direction changeover switch, respectively, and when the direction changeover switch is turned off, the positive charge end is connected to the positive end. , the electronic end is connected to the negative end, and when the direction changeover switch is turned on, the positive charge end is connected to the negative end, and the electronic end is connected to the positive end.

According to an embodiment of the present application, the power source includes a first DC power generator and a second DC power generator arranged in parallel, and the positive end of the first DC power generator is opposite to the positive end of the second DC power generator, the direction switching member includes a first switch and a second switch, the first switch being in the position of the first DC power generator; the second switch is connected to the branch where the second DC power generator is located, and when the first switch is turned on and the second switch is turned off; The positive charge end is connected to the positive end of the first DC power generator, the electronic end is connected to the negative end of the first DC power generator, and the first switch is turned off and the When the second switch is turned on, the positive charge end is connected to the negative end of the second DC power generator, and the electronic end is connected to the positive end of the second DC power generator. .

According to an embodiment of the present application, the support part is provided with a wafer contactor, the wafer contactor protrudes from the surface of the support part, and the bottom part of the wafer contactor is provided with a pressure sensor.

According to an embodiment of the present application, the invention further includes a central processing unit, the power source and the pressure sensor are both connected to the central processing unit, and the central processing unit includes the input voltage of the static electricity generator and the A relationship model with the output voltage of the pressure sensor is stored, and when the power supply stops supplying power to the static electricity generator, the input voltage of the static electricity generator is determined based on the relationship model and the output voltage of the pressure sensor. and switching the state of the direction switching member so that the power supply supplies the input voltage to the static electricity generator.

According to an embodiment of the present application, the wafer contactors and the positive charge ends are arranged alternately, and/or the wafer contactors and the electronic ends are arranged alternately.

According to an embodiment of the present application, a first adjustment resistor is connected to the first wire, and a second adjustment resistor is connected to the second wire.

According to one embodiment of the present application, the substrate is an insulating material.

According to one embodiment of the present application, the positive charge ends and the electronic ends are arranged alternately.

According to an embodiment of the present application, a wiring groove is formed in the base, and a first wire connecting the power source and the positive charge end, and a second wire connecting the power source and the electronic end, Both are provided within the wiring groove.

According to an embodiment of the present application, a wiring distributor is connected to the base, and the wiring distributor is provided at an end of the wiring trench near the power source.

The one or more technical solutions described above in the embodiments of the present application have at least one of the following technical effects.

A conveyance manipulator according to an embodiment of the present application includes a base body, a power source, a static electricity generating device, and a direction switching member, the static electricity generating device includes a positive charge end and an electronic end connected to the power source, and the positive charge end and the electronic end are connected to the power source. In either case, a Coulomb force is generated between the wafer and the wafer, and the wafer can be fixed by suction, and the wafer can be applied to transport wafers of various specifications, and manufacturing costs can be reduced. When the power supply stops supplying power to the static electricity generator, there is a possibility that Coulomb force remains between the positive charge end and the electronic end and the wafer, and in this case, the wafer overcomes the static friction force and is removed from the transfer manipulator. Adjust the direction switching member to reverse the power source to the electrostatic generator, that is, connect the positive charge end to the negative end of the power source, and communicate the electronic end to the positive end of the power source, and reverse Coulomb. By removing the residual Coulomb force by force, the wafer can be smoothly released from the transfer manipulator, solving the problem of wafer catching and wafer damage during wafer transfer, helping to save social resources, and providing great economic value. There is.

Additional aspects and advantages of the present application will be set forth in part in the description that follows, and in part will be obvious from the description, or can be learned by practice of the application.

In order to more clearly explain the technical solutions of the embodiments of the present application or the prior art, drawings necessary for explaining the embodiments or the prior art will be briefly described below. Of course, the drawings described below are some embodiments of the present application, and those skilled in the art can further derive other drawings based on these drawings without any creative effort.
FIG. 1 is a schematic diagram of a top structure of a transport manipulator according to an embodiment of the present application. FIG. 2 is a schematic diagram of a side structure of the transport manipulator according to the embodiment of the present application. FIG. 3 is a schematic diagram of the structure of the first embodiment of the direction switching member of the transport manipulator according to the embodiment of the present application. FIG. 4 is a schematic diagram of a structure of a second embodiment of a direction switching member of a conveyance manipulator according to an embodiment of the present application. FIG. 5 is a schematic diagram of control logic of a transport manipulator according to an embodiment of the present application. FIG. 6 is a schematic diagram of a relationship model between the input voltage of the electrostatic generator of the conveyance manipulator and the output voltage of the pressure sensor according to the embodiment of the present application. FIG. 7 is a diagram showing the relationship between the output voltage of the pressure sensor of the transfer manipulator and the static friction force on the surface of the wafer contactor according to the embodiment of the present application. FIG. 8 is a schematic diagram of the structure of the distribution method of the positive charge end and the electron end of the transport manipulator according to the embodiment of the present application.

Embodiments of the present application will be described in more detail below with reference to the drawings and embodiments. The following embodiments are for illustrating the present application and are not intended to limit the scope of the present application.

In the description of the embodiments of the present application, the terms "center", "vertical direction", "horizontal direction", "upper", "lower", "front", "rear", "left", "right", " Directions or positional relationships expressed as "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positional relationships shown in the drawings, and the embodiments of the present application may be used for convenience. and are used for illustrative purposes only, and are not intended to indicate or imply that the illustrated devices or components are arranged in a particular orientation, constructed or operated in a particular orientation, and are not intended to indicate or imply that the apparatus or elements depicted are to be arranged or constructed or operated in a particular orientation. It should not be understood as a limitation. Note that the terms "first," "second," and "third" are for illustrative purposes only and are not to be understood as indicating or implying relative importance.

In the description of the embodiments of the present application, the meanings of the terms "interconnected", "connected", etc. should be broadly understood unless there is a clear definition and limitation. For example, a fixed connection, a removable connection or an integral connection is possible. A mechanical connection or an electrical connection is also possible, or it is also possible to connect each other directly or indirectly via an intermediate medium. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application depending on the specific situation.

In embodiments of this application, unless expressly specified and limited, a first feature being "above" or "below" a second feature does not mean that the first feature and the second feature are in direct contact. Alternatively, the first feature and the second feature may be in indirect contact via an intermediate medium. Furthermore, the first feature being "above", "above", and "above" the second feature means that the first feature is located directly above or diagonally above the second feature. often or simply means that the horizontal height of the first feature is higher than the second feature. The first feature being “below”, “below” and “below” the second feature may mean that the first feature is directly below or diagonally below the second feature; Or it simply means that the horizontal height of the first feature is lower than the second feature.

In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples" refer to the implementation of the implementation. A specific feature, structure, material, or characteristic described with reference to a form or example is meant to be included in at least one embodiment or example of the embodiments of the present application. As used herein, the schematic representations of the terms above are not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials, or features described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art can combine and combine different embodiments or examples, as well as features of different embodiments or examples, described herein without contradicting each other.

One embodiment of the present application provides a transport manipulator that includes a base 1, a power source 8, an electrostatic generator 2, and a direction switching member, as shown in FIGS. 1 to 8. The power source 8 supplies power to the static electricity generator 2, the direction switching member is for switching the connection relationship between the static electricity generator 2 and the power source 8, and the base 1 is for attaching the static electricity generator 2. . The base body 1 includes a support part 11 for supporting a wafer, the power supply 8 includes a positive end and a negative end, the first wire 5 is connected to the positive end, and the second wire 6 is connected to the negative end. The static electricity generator 2 is connected to a power source 8 and includes a positive charge end 21 and an electronic end 22, both of the positive charge end 21 and the electronic end 22 are provided on the support portion 11, and the direction switching member is connected to the power source 8. 8 and the static electricity generator 2, and when the direction switching member is in the first state, the positive charge end 21 is connected to the positive end, the electronic end 22 is connected to the negative end, and the direction switching member is connected to the positive end. In the second state, the positive charge end 21 is connected to the negative end, and the electronic end 22 is connected to the positive end.

The wafer is fixedly supported by the support part 11 and can be moved in synchronization with the support part 11, so that the wafer can be transported. Here, a fixed acting force is applied to the wafer and the support part 11 by the static electricity generation device 2, and after the static electricity generation device 2 is energized, a positive charge is generated at the positive charge end 21, and the positive charge end 21 attracts electrons within the wafer, generates electrons at the electronic end 22, and the electronic end 22 attracts positive charges within the wafer to achieve electrostatic adsorption fixation of the wafer and the transport manipulator.

When the wafer is transported to the target position, the power source 8 stops supplying power to the electrostatic generator 2, and some charge still remains at the positive charge end 21 and the electronic end 22, and at this time, the direction switching is performed. The positive end of the power source 8 is connected to the electronic end 22 by the member, and the negative end of the power source 8 is connected to the positive charge end 21, so that the power source 8 supplies a positive charge to the electronic end 22 and an electron to the positive charge end 21. This removes the positive charges and electrons remaining on the positive charge end 21 and the electronic end 22, and zeroes the acting force between the positive charge end 21 and the wafer and between the electronic end 22 and the wafer. Then, the wafer can be smoothly removed from the substrate 1, and the problems of wafer sticking and wafer damage that may occur due to residual Coulomb force in the wafer are solved.

In this embodiment, a double electric electrostatic generator 2 is used to generate a Coulomb force and adsorb the wafer, thereby generating positive pressure between the wafer and the support part 11 during wafer transfer. Ensure static friction force. After the wafer moves to the target position, the direction switching member switches the electric charge supplied to the positive charge end 21 and the electronic end 22 by the power source 8 to remove the Coulomb force remaining on the positive charge end 21 and the electronic end 22. You can also do that. The transfer manipulator of this embodiment is suitable for wafers of different thickness manufactured by different processes, and can ensure static friction between the wafer and the support portion 11 to realize slip-free transfer of the wafer. It is possible to realize completely adaptive transport of various wafers, solve the problem of high wafer transport cost in related technology, solve the problems of wafer hanging and wafer damage during wafer transport, and save social resources. Helps save money and has great economic value.

There are two embodiments of the direction switching unit.
In one embodiment, as shown in FIG. 3, one set of power supplies 8 is installed, a first wire 5 is connected to the positive end of the power supply 8, and a second wire 6 is connected to the negative end of the power supply 8. The direction changeover member is a direction changeover switch 91, the first wire 5 and the second wire 6 are respectively connected to both ends of the direction changeover switch 91, and when the direction changeover switch 91 is turned off, The positive charge end 21 is connected to the positive end, the electronic end 22 is connected to the negative end, and when the direction changeover switch 91 is turned on, the positive charge end 21 is connected to the negative end, and the electronic end 22 is connected to the positive end. Connected. By adjusting the current direction of the power supply 8 to the static electricity generating device 2, residual Coulomb force between the wafer and the static electricity generating device 2 is removed, damage to the wafer by the transport manipulator is prevented, and wafer transport safety is improved. Improve.

Here, the power source 8 provides DC power, and the power source 8 may be a DC power generator. The first wire 5 includes a first section and a second section, the second wire 6 includes a third section and a fourth section, and one end of the direction changeover switch 91 is connected to the first section. It is connected at a position where the second section is butted against each other, and the other end of the direction changeover switch 91 is connected at a position where the third section and the fourth section are butted against each other. When the direction changeover switch 91 is turned off, the first section communicates with the second section, the third section communicates with the fourth section, the positive end communicates with the positive charge end 21, and the negative end communicates with the electronic terminal 22. When the direction changeover switch 91 is turned on, the first section communicates with the fourth section, the third section communicates with the second section, the positive end communicates with the electronic end 22, and the negative end communicates with the electronic end 22. It communicates with the positive charge end 21. Thereby, the residual Coulomb force can be removed by reverse energization, and the wafer can be separated from the substrate 1 without being damaged.

In one embodiment, the first wire 5 is connected to a first adjustment resistor and the second wire 6 is connected to a second adjustment resistor. The first adjustment resistor is for adjusting the voltage at the positive charge end 21, and the second adjustment resistor is for adjusting the voltage at the electronic end 22. Thereby, the static electricity generator 2 can provide different degrees of adsorption force depending on the wafer specifications. The resistance values of both the first adjustment resistor and the second adjustment resistor can be adjusted.

The first adjustment resistor includes a first resistor 51 and a second resistor 52, the first resistor 51 is connected to the first section, the second resistor 52 is connected to the second section, and each part The voltage is independently adjustable. The second adjustment resistor includes a third resistor 61 and a fourth resistor 62, the third resistor 61 is connected to the third section, the fourth resistor 62 is connected to the fourth section, and each portion The voltage can also be adjusted independently.

Furthermore, a first capacitor 53 is connected to the first wire 5, and a second capacitor 63 is connected to the second wire 6, thereby making the voltage more stable.

In one embodiment, as shown in FIG. 4, the differences from the embodiment shown in FIG. 3 are as follows. That is, the power source includes a first DC power generator 81 and a second DC power generator 82 arranged in parallel, and the positive end of the first DC power generator 81 is connected to the second DC power generator. At the same time, the negative end of the first DC power generator 81 is located opposite to the negative end of the second DC power generator 82 . The direction switching member includes a first switch 92 and a second switch 93, the first switch 92 is connected to the branch where the first DC power generator 81 is located, and the second switch 93 is connected to the branch where the first DC power generator 81 is located. When connected to the branch where the power generator 82 is located, the first switch 92 is turned on and the second switch 93 is turned off, the positive charge end 21 is connected to the positive end of the first DC power generator 81 , the electronic end 22 is connected to the negative end of the first DC power generator 81 , and when the first switch 92 is turned off and the second switch 93 is turned on, the positive charge end 21 is connected to the negative end of the second DC power generator 82, and the electronic end 22 is connected to the positive end of the second DC power generator 82. In this embodiment, two sets of power supplies 8 arranged oppositely are installed, and the power to the static electricity generator 2 is supplied by switching on/off the first DC power generator 81 and the second DC power generator 82. Switch direction. This allows the residual Coulomb force to be removed and the wafer to be separated from the substrate 1 without being damaged.

In this embodiment, a resistor and a capacitor may be connected to the wire between the power source 8 and the static electricity generator 2 to ensure the stability of the circuit structure.

In one embodiment, the support 11 is provided with a wafer contactor 3 , which protrudes from the surface of the support 11 , the surface of the wafer contactor 3 is in contact with the wafer, and the contact between the wafer and the substrate 1 is maintained. The purpose is to reduce the contact area, and the static friction force between the wafer and the surface of the wafer contactor 3 is to prevent the wafer from moving relative to the base 1 and ensure stability in wafer transport. be.

In one embodiment, the bottom of the wafer contactor 3 is provided with a pressure sensor 4 for measuring the pressure exerted by the wafer on the wafer contactor 3, as shown in FIG. The static friction force between the wafer and the surface of the wafer contactor 3 can be calculated from the coefficient of friction of the surface of the wafer contactor 3 and the coefficient of friction of the surface of the wafer contactor 3. Here, the pressure applied to the wafer contactor 3 by the wafer is the sum of the gravitational force of the wafer and the attraction force of the electrostatic generator 2 to the wafer. Since the gravity of the wafer does not change, the user adjusts the magnitude of the adsorption force of the static electricity generator 2 to the wafer based on the magnitude of the pressure measured by the pressure sensor 4 according to the set static friction force. In other words, the voltage of the static electricity generator 2 can be adjusted. Furthermore, when the wafer is transported to the target position, the power supply 8 stops supplying power to the static electricity generator 2, and at this time, the pressure measured by the pressure sensor 4 is a combination of the wafer's gravity and the remaining Coulomb force. According to the magnitude of the residual Coulomb force, the power source 8 supplies power in the opposite direction to give the same magnitude of acting force to the static electricity generator 2. can be generated to remove the residual Coulomb force, thereby allowing the wafer to move away from the transfer manipulator smoothly.

In one embodiment, the transfer manipulator further includes a central processing unit, the power source 8 and the pressure sensor 4 are both connected to the central processing unit, and within the central processing unit, the input voltage of the electrostatic generator 2 and the pressure sensor 4 are connected to the central processing unit. A relationship model with the output voltage of is stored, the power supply 8 stops power supply to the static electricity generator 2, and acquires the input voltage of the static electricity generator 2 based on the relationship model and the output voltage of the pressure sensor 4, By switching the state of the direction switching member, the power source 8 supplies an input voltage in the opposite direction to the static electricity generator 2.

Here, the relational model is a curved relationship between the input voltage of the static electricity generator 2 and the output voltage of the pressure sensor 4, which was previously measured in the laboratory according to the wafer specifications. As shown in FIG. 6, FIG. 6 shows a relationship model between the input voltage of the wafer static electricity generator 2 and the output voltage of the pressure sensor 4. The central processing unit stores relational models of wafers with various specifications, and can call up the relational model corresponding to the wafer to be transported as needed.

Furthermore, for relational models pre-measured in the laboratory, the central processing unit can also modify the relational models according to real-time data to make adjustments more accurate.

As shown in FIG. 5, the central processing unit transmits the input voltage necessary for the static electricity generator 2 to the static electricity generator controller, and the static electricity generator controller adjusts and controls the output voltage of the static electricity generator 2. , the pressure sensor 4 measures the pressure of the wafer against the wafer contactor 3 and feeds it back to the central processing unit. This is a logical transfer relationship between voltage signals and solves the problem of wafer sticking and wafer damage that can occur due to residual Coulomb forces at the wafer.

In this embodiment, a dual electric electrostatic generator 2 capable of generating Coulomb force is used to generate positive pressure and ensure static friction force during wafer transfer. The positive pressure can be converted into an electrical signal by a pressure sensor 4 at the bottom of the wafer contactor 3, and the central processing unit receives the electrical signal. Since the relationship model between the input voltage of the static electricity generator 2 and the induced electric signal of the pressure sensor 4 is written in the central processing unit, the central processing unit controls the voltage of the static electricity generator 2 according to preset parameters. can do. This makes it possible to transport wafers of different thicknesses manufactured by different processes without slippage. At the same time, when the input voltage of the static electricity generating device 2 is zero, it senses whether static electricity remains according to the output voltage of the pressure sensor 4, and then when the direction switching member is turned on, the pressure sensor 4 The induced voltage output from the When the induced voltage reaches a safe voltage range, the transport manipulator can perform an unloading operation.

In one embodiment, a plurality of wafer contactors 3 are uniformly distributed on the support 11 and a pressure sensor 4 is provided at the bottom of each wafer contactor 3 . The multiple wafer contactors 3 provide multiple support points for the wafer, so the support of the wafer is more stable. At the same time, the plurality of pressure sensors 4 can measure a plurality of sets of data, and according to the pressure at each position, the input voltage of the positive charge end 21 or the electronic end 22 at that position can be adjusted. Furthermore, the average value of the input voltage of the static electricity generator 2 is obtained based on the average value of the plurality of sets of data, and the input voltages of the plurality of sets of positive charge terminals 21 and the plurality of sets of electronic terminals 22 are synchronously adjusted. I can do it. Of course, the method of adjusting the input voltage of the positive charge terminal 21 and the input voltage of the electronic terminal 22 is not limited to the above method, and may be adjusted by other methods.

In one embodiment, pressure sensor 4 is a piezoceramic sensor. Piezoelectric ceramic sensors have high sensitivity, high reliability, high stability, and are excellent in high and low temperature resistance and moisture resistance.

Of course, the pressure sensor 4 is not limited to a piezoelectric ceramic sensor, but other sensors that can deform under pressure and convert pressure into an electrical signal can be used.

In one embodiment, the substrate 1 is distributed with a plurality of positively charged edges 21 and the substrate 1 is also distributed with a plurality of electron edges 22, so that forces are applied to the wafer at a plurality of locations, causing the wafer and Static frictional force between the wafer contactor 3 and the wafer contactor 3 is ensured.

As shown in FIG. 1, two positive charge ends 21 are provided on the base 1, and two electronic ends 22 are also provided, and the positive charge ends 21 and the electronic ends 22 are arranged symmetrically.

In one embodiment, the wafer contactor 3 and the positively charged end 21 are arranged alternately, with the positively charged end 21 providing the acting force to attract the wafer, and the wafer contactor 3 providing the supporting force to the wafer, and the attracting force and Since the supporting forces are alternately distributed, the force is applied uniformly to the wafer.

Similarly, the alternating arrangement of the wafer contactors 3 and the electronic ends 22 also helps to ensure that the wafer is uniformly applied with force.

As shown in FIG. 1, the wafer contactors 3 and the positive charge ends 21 are arranged alternately, and the wafer contactors 3 and the electronic ends 22 are arranged alternately, so that force is applied to the wafer more uniformly. In one embodiment, the positively charged ends 21 and the electronic ends 22 are arranged alternately, and the positively charged ends 21, the electronic ends 22, the positively charged ends 21, the electronic ends 22... are arranged in order clockwise or counterclockwise. , which favors uniform distribution of the electric field.

In one embodiment, as shown in FIG. 8, the support 11 is provided with a preset path, and the positive charge ends 21 and the electronic ends 22 are alternately arranged on the same preset path. The positive charge end 21 and the electronic end 22 are arranged alternately in the same preset path, which helps the electric field to be evenly distributed and the force applied to the wafer uniformly, ensuring stable wafer transport. , also helps reduce damage to the wafer. The positive charge ends 21 and the electronic ends 22 are arranged alternately, which means that the positive charge ends 21, the electronic ends 22, the positive charge ends 21, the electronic ends 22... are arranged in order clockwise or counterclockwise. I can understand.

If one preset path is provided, it is ensured that the wafer in this preset path is uniformly applied with force. When a plurality of positive charge ends 21 and electronic ends 22 are both uniformly installed in the circumferential direction of the support portion 11, the positive charge ends 21 and the electronic ends 22 are alternately arranged on the same circumference. When a plurality of preset paths are installed, it is ensured that the electric field in each preset path is uniformly distributed.

As shown in FIG. 8, a plurality of paths are installed in the support portion 11, and in adjacent preset paths, the positive charge ends 21 and the electron ends 22 correspond one to one. When two preset paths are installed, the two adjacent ends of the two preset paths are the positive charge end 21 and the electronic end 22, respectively, and when three or more preset paths are installed, any two ends The two adjacent ends of the preset path are the positive charge ends 21 and the electron ends 22, respectively, so that all the positive charge ends 21 and the electron ends 22 are arranged alternately, and an electric field is applied to the entire support part 11. It is ensured that the

As shown in FIG. 1, the support part 11 is annular, and an electronic end 22 and a positive charge end 21 are arranged clockwise on one side of the annular shape, so that the electric field on both sides is uniformly distributed.

In one embodiment, a wiring groove 13 is formed in the base 1, and both the first wire 5 and the second wire 6 are provided in the wiring groove 13. The installation of the wiring groove 13 is convenient to limit the wiring route, and the assembly is easier, and the wire is placed in the wiring groove 13, so the wiring is more orderly.

In one embodiment, as shown in FIG. 2, the wiring groove 13 is a hollow cavity within the substrate 1, and both the upper and lower surfaces of the wiring groove 13 are sealed so that a wire can be introduced into the wiring groove 13. , the ends of the wiring groove 13 are open. In order to reduce the influence of the external environment on the positive charge end 21 and the electronic end 22 and improve the stability of Coulomb force, the upper and lower surfaces of the wiring groove 13 are sealed so that the positive charge end 21 and the electronic end 22 are relatively isolated. Provide a sealed environment.

Here, the base body 1 includes two parts, an upper casing and a lower casing, and the wiring groove 13 is formed in a limited manner between the upper casing and the lower casing, so that processing of the wiring groove 13 is facilitated. This also makes it easier to attach the wires.

Note that the wiring groove 13 is not limited to the hollow cavity structure, but may be a groove recessed downward from the surface of the base 1.

In one embodiment, the wiring groove 13 extends along a straight line, an arcuate shape, or a serpentine shape, that is, the preset path extends along a straight line, an arcuate shape, or a serpentine shape. As shown in FIG. 8, the preset path is arc-shaped, and a plurality of arc-shaped wiring grooves 13 are installed in the circumferential direction of the support part 11, and each wiring groove 13 has a plurality of positive charge terminals. 21 and a plurality of electronic ends 22 are installed to uniformly distribute the Coulomb force. Of course, the preset path may be linear or serpentine; if the preset path is linear, the contour shape of the support portion 11 may also be linear; if the preset path is serpentine, The shape can also be understood as an S-shape, the snake shape increasing the length of the preset path in the support 11 and making the electric field more uniform.

In one embodiment, when the wafer contactor 3 is provided on the support 11 , a pressure sensor 4 is provided at the bottom of the wafer contactor 3 and the pressure sensor 4 is provided in the wiring groove 13 . In order to ensure the measurement accuracy of the pressure sensor 4 and to reduce the influence of the environment on the measurement results, the pressure sensor 4 is also installed in a relatively closed environment.

In one embodiment, a wiring distributor 7 is connected to the base 1 , and the wiring distributor 7 is provided at an end of the wiring groove 13 near the power source 8 . The wiring distributor 7 is for connecting wires, the pressure sensor 4 is connected to the power supply 8 via the wiring distributor 7, and the wires of the positive charge end 21 and the electronic end 22 are also connected through the wiring distributor 7. By being connected to the power source 8, power can be simultaneously supplied to the pressure sensor 4 and the static electricity generating device 2 via one power source 8, so that the structure is simplified.

Here, since the wiring distributor 7 on one side of the base 1 can be connected to the positive end and the negative end of the power source 8 at the same time, the positive charge end 21 and the electronic end 22 are connected to one side of the support part 11 at the same time. can be provided to help uniformly distribute the electric field.

In one embodiment, the material of the base body 1 is an insulating material, which may be ceramic, plastic, rubber, etc. The base body 1 further includes a connecting part 12, and the connecting part 12 is used for connecting with a driving member such as a motor or a cylinder. The support part 11 is a hollow annular structure, and the wafer is supported by the annular support part 11, force is applied uniformly to the wafer, and other operations can be performed on the wafer through the hollow part. I can do it. The connecting part 12 is located on one side of the supporting part 11, and the connecting part 12 and the supporting part 11 can be formed integrally or can be joined and attached, which can be selected according to needs.

In one embodiment, the transport manipulator includes a power source 8, a substrate 1, a static electricity generator 2, a direction switching member, a wafer contactor 3 and a piezoelectric ceramic sensor, and the wafer lands on the wafer contactor 3 of the support 11, and the static electricity The positive charge end 21 and the electronic end 22 of the generator 2 apply voltage under the action of the electrostatic generator controller to generate a Coulomb force, thereby generating a static friction force between the wafer contactor 3 and the wafer. At the same time, under the action of the Coulomb force, the piezoelectric ceramic sensor can sense the magnitude of the actually generated Coulomb force and feed it back to the central processing unit. The central processing unit adjusts the input voltage of the electrostatic generator 2 according to a pre-prepared relationship model to ensure that the wafer is always located on the support 11 and that the transport manipulator transports the wafer to the designated position of the system. do. After reaching the designated position, the piezoelectric ceramic sensor senses whether static electricity remains after the power supply 8 stops supplying power to the static electricity generator 2 due to the induced voltage caused by pressure, and turns on the direction switching member. You can decide whether or not to do so. When the direction switching member is turned on, the induced voltage due to the pressure of the electroceramic sensor becomes small, and when the induced voltage reaches the safe voltage range, the transfer manipulator can perform the unloading operation to safely and completely remove the wafer. It can be placed at a specified position.

The embodiment of the second aspect of the present application provides a wafer adsorption force adjustment system for conveying a manipulator, and the system includes N pressure sensors 4, N wafer contactors 3, a central processing unit, and a static electricity generator. It includes a controller and a static electricity generator 2, and N is a positive integer of 3 or more. The static electricity generator 2 is connected to the voltage output terminal of the static electricity generator controller, and is used to generate static charges so as to generate induced charges with the wafer. The N pressure sensors 4 are connected to the N wafer contactors 3, respectively, and are used to obtain the pressure value of the wafer after it is determined that the wafer is placed on the wafer contactor 3. The central processing unit is connected to the output terminals of the N pressure sensors 4, determines the corresponding current target voltage value based on the pressure value and a preset relationship model, and uses the current target voltage value. The electrostatic generator controller is driven to output the current actual voltage value, and the electrostatic generator 2 generates a corresponding electrostatic charge. Here, in the preset relationship model, a correspondence relationship between a pressure value and a target voltage value is set.

Specifically, at the bottom of the wafer contactor 3, N pressure sensors 4, that is, a first pressure sensor, a second pressure sensor, . . . an Nth pressure sensor are installed in a one-to-one correspondence. Thus, when a wafer is placed on the wafer contactor 3, the wafer can generate pressure against the pressure sensor 4, and the pressure sensor 4 acquires a pressure value due to the wafer.

Furthermore, as shown in FIGS. 6 and 7, different types of wafers require different degrees of static friction force, and there is a correspondence between the static friction force and the output voltage of the pressure sensor 4, and the output voltage of the pressure sensor 4 Since there is a correspondence relationship between the static friction force and the input voltage of the static electricity generation device 2, it is possible to find a correspondence relationship between the static friction force and the input voltage of the static electricity generation device 2. The input voltage of the static electricity generator 2 is a target voltage value generated by the static electricity generator 2. This allows different target voltage values to be input for different types of wafers, and corresponding static friction forces to be generated.

Specifically, a preset relationship model can be set in the form of a preset electrostatic control voltage table, so that after the pressure sensor 4 transmits a voltage signal, that is, a pressure value signal, the preset electrostatic control voltage table is set according to the pressure value. The corresponding target voltage value can be searched in the electrostatic control voltage table, and the pressure value range and the corresponding target voltage value are set in the preset electrostatic control voltage table.

Of course, a more accurate target voltage value can be obtained by expressing the relationship between the pressure value and the target voltage value in the form of a function. In other words, the preset relationship model is a functional relationship between the pressure value and the target voltage value. After obtaining the pressure value, a functional relationship can be used to calculate the target voltage value.

However, the method of this embodiment is applied to the transport manipulator in the above embodiment, the positive charge end 21 and the electronic end 22 of the static electricity generating device 2 are both provided in the transport manipulator, and the power source 8 is connected to the positive charge end 21 and the electronic end. This is for supplying power to 22.

Based on any of the above embodiments, embodiments of the present application are provided with an alarm module connected to the central processing unit, the central processing unit obtains the current target voltage value and the current actual voltage value, and obtains the current target voltage value and the current actual voltage value. It is also used to determine whether the difference between the target voltage value and the current actual voltage value exceeds a preset threshold, and if the current threshold is exceeded, an alarm module is triggered.

Further, the central processing unit obtains the current target voltage value and the current actual voltage value, and determines whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold value. If the voltage does not exceed a preset threshold, the preset relationship model is modified using the current target voltage value and the current actual voltage value to obtain a modified voltage model.

Specifically, when modifying the preset relational model, the central processing unit specifically corrects the target voltage in the preset relational model if the current target voltage value is smaller than the current actual voltage value. If the value is adjusted smaller and the current target voltage value is larger than the current actual voltage value, it is also used to adjust the target voltage value in the preset relationship model to a larger value.

Based on the above embodiment, in this embodiment, in order to know whether there is a deviation in the wafer placement position, the central processing unit selects one of the N pressure values corresponding to the N pressure sensors 4. It is also used to issue a wafer placement error alarm if the deviation between one pressure value and the other exceeds a threshold. In other words, if the wafer is placed in the correct position, the pressure values of the N pressure sensors 4 should be the same. However, if one of them is abnormal, the pressure received by the abnormal pressure sensor 4 is Too large or too small, meaning the wafer was placed in the wrong position.

The wafer suction force adjustment method for a transfer manipulator according to an embodiment of the present application will be described below, and the wafer suction force adjustment method for a transfer manipulator described below and the wafer suction force adjustment system for a transfer manipulator described above will be explained. Corresponding reference can be made.

In the wafer adsorption force adjustment system and method for a transfer manipulator according to the embodiment of the present application, the electrostatic charge generated by the electrostatic generation device 2 is controlled to be different depending on the weight of wafers with different specifications, and the wafer and adsorption force are controlled to be different. By generating adhesion force through electrostatic induction, different positive pressures are generated to ensure static friction force during wafer transfer. The positive pressure can be changed into an electrical signal pressure value by a pressure sensor 4 below the wafer contactor 3, thereby achieving slip-free transport of wafers of different thicknesses under various processes.

Embodiments of the present application further provide a wafer suction force adjustment method for a transfer manipulator that is applied to any of the above-described wafer suction force adjustment systems, and specifically, the method is executed by a central processing unit, and the method is performed by a central processing unit. ,
After determining that the wafer is placed in the wafer contactor 3, a step S61 of acquiring the pressure value of the wafer;
step S62 of determining a corresponding current target voltage value based on the pressure value and a preset relationship model;
driving the electrostatic generator controller using the current target voltage value to output the current actual voltage value and cause the electrostatic generator 2 to generate a corresponding electrostatic charge;
Here, the correspondence between the pressure value and the target voltage value is set in the preset relationship model.

Further, in particular, the method is executed by a central processing unit, and the method specifically includes:
Step S71 of acquiring the current target voltage value and the current actual voltage value;
Step S72 of determining whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold;
If the current threshold value is not exceeded, the method further includes step S73 of modifying the preset relationship model using the current target voltage value and the current actual voltage value to obtain a modified voltage model.

A third exemplary embodiment of the present application provides a wafer inspection system for a transfer manipulator, the system including N pressure sensors 4, N wafer contactors 3, and a central processing unit, where N is 3. is a positive integer greater than or equal to The N pressure sensors 4 are each connected to the N wafer contactors 3, and are used to obtain the pressure value of the wafer after it is determined that the wafer is placed on the wafer contactor 3, and the pressure value is This is the sum of the output values of N pressure sensors 4. The central processing unit is connected to the output terminals of the N pressure sensors 4, and is used to determine the type of wafer based on the pressure value and the preset pressure value table, and to obtain the determination result. Here, a pressure value range and a corresponding wafer type are set in the preset pressure value table.

Specifically, as shown in FIG. 1, pressure sensors 4 are installed at the bottom of each wafer contactor 3 in a one-to-one correspondence, and when a wafer is placed on the wafer contactor 3, the wafer is attached to the pressure sensor 4. A pressure can be generated against the wafer, and the pressure sensor 4 acquires the pressure value due to the wafer. The pressure value is the sum of the output values of the N pressure sensors 4, that is, it is necessary to sum the pressure values measured by each pressure sensor 4. If the wafer is correctly placed and centered, the pressure values measured by each pressure sensor 4 will be the same, but if the wafer is not centered, the pressure values of each pressure sensor 4 may be different. Although different, the sum of the sensor output values corresponds to the total pressure value produced by the wafer.

Specifically, when the central processing unit makes a determination using the pressure generated by the pressure sensor 4, the central processing unit specifically searches for the pressure value and the corresponding pressure value range in the preset pressure value table. , to determine the wafer type corresponding to the pressure value range if the corresponding pressure value range exists in the pressure value table, and to issue an abnormal alarm signal if the corresponding pressure value range does not exist in the pressure value table. It is. For example, the pressure value is 5, and the preset pressure value table includes a first pressure value range 1-2, a second pressure value range 2-3, and a third pressure value range 3-4. If only these three pressure ranges exist, it means that the current wafer is an abnormal wafer, and it is necessary to issue an abnormality alarm signal at this time. However, if the fourth pressure value range 4 to 5 exists in the preset pressure value table, the current wafer belongs to the fourth pressure value range, so the type of the current wafer can be determined. Of course, the preset pressure value table also includes wafer types corresponding to pressure value ranges such as a first pressure value range, a second pressure value range, and so on. Specifically, the wafer type may be a processing type or may be a type from various customers.

However, in order to check whether the wafer is placed in the transport manipulator, an imaging device can also be further installed in the wafer inspection system, and the imaging device is for taking real-time images of the transport manipulator, and the central The processing device further receives the real-time image, determines whether the wafer is placed on the wafer contactor 3 based on the real-time image, and activates the pressure sensor 4 if the wafer is placed on the wafer contactor 3. It is also used to determine whether the wafer is located at a preset position by image recognition of the wafer. Of course, a neural network is set up in the central processing unit and trained on iconographic samples that identify when the wafer is located at a preset position.

Embodiments of the present application further provide a wafer inspection method for a transfer manipulator applied to the wafer inspection system of any one of the above embodiments, the method comprising:
After determining that the wafer is placed in the wafer contactor 3, a step S41 of acquiring the pressure value of the wafer;
determining the type of wafer based on the pressure value and a preset pressure value table and obtaining a determination result; step S42 in which a pressure value range and a corresponding wafer type are set in the preset pressure value table; .

Further, the step of determining the wafer type based on the pressure value and the preset pressure value table and obtaining the determination result specifically includes:
step S51 of searching the preset pressure value table for a pressure value range corresponding to the pressure value;
If a corresponding pressure value range exists in the pressure value table, a step S52 of determining a wafer type corresponding to the pressure value range;
The step S53 includes issuing an abnormality alarm signal if the corresponding pressure value range does not exist in the pressure value table.

A pressure sensor 4 is added to the wafer inspection system and method for a transfer manipulator according to an embodiment of the present application, and based on the pressure value of the wafer obtained by the pressure sensor 4, the type of the wafer and the presence or absence of an abnormality are determined. Therefore, various wafer specifications can be effectively identified, and wafer abnormalities can be discovered.

The above embodiments are merely illustrative and not limiting of the present application. Although the present application has been described in detail with reference to embodiments, those skilled in the art will understand that various combinations, modifications or equivalent substitutions made to the technical solutions of the present application are within the spirit and scope of the present application. It is understood that all such matters are to be covered within the scope of the claims of the present application without departing from the above.

1-Base body, 11-Support part, 12-Connection part, 13-Wiring groove, 2-Static electricity generator, 21-Positive charge end, 22-Electronic end, 3-Wafer contactor, 4-Pressure sensor, 5-First wire, 51-first resistor, 52-second resistor, 53-first capacitor, 6-second wire, 61-third resistor, 62-fourth resistor, 63-second resistor Capacitor, 7 - Wiring distributor, 8 - Power supply, 81 - First DC power generator, 82 - Second DC power generator, 91 - Direction changeover switch, 92 - First switch, 93 - Second switch.

Claims (8)

A base body including a support part for supporting a wafer, wherein the support part is provided with a wafer contactor, the wafer contactor protrudes from a surface of the support part, and a pressure sensor is provided at the bottom of the wafer contactor. a base provided ;
a power supply including a positive terminal and a negative terminal;
a static electricity generating device that is connected to a power source and includes a positive charge end and an electronic end, both of the positive charge end and the electronic end being provided on the support portion;
A direction switching member provided between the power source and the static electricity generator, wherein when the direction switching member is in a first state, the positive charge end is connected to the positive end, and the electronic end is connected to the positive end. a direction switching member connected to a negative end, and when the direction switching member is in a second state, the positive charge end is connected to the negative end and the electronic end is connected to the positive end;
A central processing unit, wherein both the power source and the pressure sensor are connected to the central processing unit, and the central processing unit includes a relationship model between the input voltage of the static electricity generator and the output voltage of the pressure sensor. is stored, and when the power source stops supplying power to the static electricity generator, it acquires the input voltage of the static electricity generator based on the relationship model and the output voltage of the pressure sensor, and determines the state of the direction switching member. and a central processing unit configured to switch the power source to supply the input voltage to the static electricity generator . One set of the power sources is installed, a first wire is connected to the positive end, a second wire is connected to the negative end, the direction switching member is a direction changeover switch, and the direction changeover member is a direction changeover switch. The first wire and the second wire are connected to both ends, respectively, and when the direction changeover switch is turned off, the positive charge end is connected to the positive end, and the electronic end is connected to the negative end. The conveying manipulator according to claim 1, wherein when the directional switch is connected and the direction changeover switch is turned on, the positive charge end is connected to the negative end, and the electronic end is connected to the positive end. . The power source includes a first DC power generator and a second DC power generator arranged in parallel, and the positive end of the first DC power generator is connected to the positive end of the second DC power generator. opposite to the positive end, the directional switching member includes a first switch and a second switch, the first switch being connected to the branch in which the first DC power generator is located; is connected to the branch where the second DC power generator is located, and when the first switch is turned on and the second switch is turned off, the positive charge end is connected to a positive end of a DC power generator, the electronic end is connected to a negative end of the first DC power generator, the first switch is turned off and the second switch is turned on; and the positive charge end is connected to the negative end of the second DC power generator, and the electronic end is connected to the positive end of the second DC power generator. The conveyance manipulator described. The transfer manipulator according to claim 1 , wherein the wafer contactors and the positive charge ends are alternately arranged, and/or the wafer contactors and the electronic ends are alternately arranged. The conveyance manipulator according to claim 2, wherein a first adjustment resistor is connected to the first wire, and a second adjustment resistor is connected to the second wire. The conveyance manipulator according to claim 1, wherein the base body is an insulating material. A wiring groove is formed in the base, and a first wire connecting the power source and the positive charge end and a second wire connecting the power source and the electronic end are both provided in the wiring groove. The conveyance manipulator according to any one of claims 1 to 6 , characterized in that: 8. The conveyance manipulator according to claim 7 , wherein a wiring distributor is connected to the base, and the wiring distributor is provided at an end of the wiring groove near the power source.

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