JP2023510207A - transfer manipulator - Google Patents

Abstract

The present application relates to the technical field of semiconductor processing, the transfer manipulator includes a substrate, a power source, an electrostatic generator, and a direction switching member, the substrate includes a support for supporting a wafer, and the power source has positive and negative ends. wherein the static electricity generator is connected to a power source and includes a positive charge end and an electronic end, the positive charge end and the electronic end are both provided on the support, and the direction switching member is between the power source and the static electricity generator. when the direction-switching member is in the first state the positive charge end is connected to the positive end, the electronic end is connected to the negative end and when the direction-switching member is in the second state the positive charge end is connected to the It is connected to the negative end and the electronic end is connected to the positive end. The transfer manipulator according to the present application can adsorb a wafer by coulomb force, realize transfer of wafers of various specifications, can remove residual coulomb force by a direction switching member, reduce manufacturing costs, and reduce wafer Damage can be reduced. [Selection drawing] Fig. 3

Description

cross reference

This application claims the priority of the Chinese patent application entitled "Conveyor Manipulator" with application number 202011029264.1 filed on September 27, 2020, which is incorporated herein by reference in its entirety. be

The present application relates to the technical field of semiconductor processing, and more particularly to transfer manipulators.

A semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. There are many types of semiconductor products, and the processes are complicated. Wafers are silicon wafers used for manufacturing silicon semiconductor integrated circuits. Wafer thickness varies widely from manufacturer to manufacturer, and the contact area of the wafer contactor in contact with the wafer should be as small as possible to avoid defects and exposure problems. Wafers have different thicknesses, and in the related art, in transfer manipulators for transferring wafers, one specification transfer manipulator is suitable for one specification wafer. At present, there is no transfer manipulator capable of transferring wafers with different specifications, so wafer transfer costs are high and equipment investment is large.

The present application aims to solve at least one of the problems existing in the prior art. For this reason, according to the present invention, the coulomb force is used to adsorb the wafer, and the multi-specification wafer transfer can be realized, and the direction switching member can remove the residual coulomb force. To provide a transport manipulator capable of reducing damage to.

The transport manipulator according to the embodiment of the first form of the present application comprises:
a substrate including a support for supporting the wafer;
a power source including a positive end and a negative end;
an electrostatic generator connected to a power source and comprising a positive charge end and an electronic end, wherein the positive charge end and the electronic end are both provided on the support;
A direction-switching member provided between the power source and the static electricity generator, wherein when the direction-switching member is in a first state, the positive charge end is connected to the positive end, and the electronic end is connected to the a direction-switching member connected to a negative end, wherein the positive charge end is connected to the negative end and the electronic end is connected to the positive end when the direction-switching member is in a second state.

According to an embodiment of the present application, the power supply is installed in a set, the positive end is connected with a first wire, the negative end is connected with a second wire, and the direction switching member is a direction switching a switch, wherein the first wire and the second wire are respectively connected to both ends of the direction changeover switch, and when the direction changeover switch is turned off, the positive charge end is connected to the positive end; , the electronic end is connected to the negative end, and when the direction switch is turned on, the positive charge end is connected to the negative end and the electronic end is connected to the positive end;

According to one embodiment of the present application, the power supply includes a first DC power generator and a second DC power generator arranged in parallel, and the positive end of the first DC power generator is: Opposite to the positive end of the second DC power generator, the direction switching member includes a first switch and a second switch, the first switch being positioned when the first DC power generator is positioned. the second switch is connected to the branch in which the second DC power generator is located, when the first switch is turned on and the second switch is turned off, The positive charge end is connected to the positive end of the first DC power generator, the electronic end is connected to the negative end of the first DC power generator, the first switch is turned off and the When the second switch is turned on, the positive charge end is connected to the negative end of the second DC power generator and the electronic end is connected to the positive end of the second DC power generator. .

According to one embodiment of the present application, the support is provided with a wafer contactor, the wafer contactor protrudes from the surface of the support, and the bottom of the wafer contactor is provided with a pressure sensor.

According to an embodiment of the present application, further comprising a central processing unit, wherein the power source and the pressure sensor are both connected to the central processing unit, and the central processing unit includes an input voltage of the static electricity generating device and the A relationship model of the output voltage of the pressure sensor is stored, and when the power supply stops supplying power to the static electricity generator, the input voltage of the static electricity generator is changed based on the relationship model and the output voltage of the pressure sensor. and switching the state of the direction switching member so that the power supply supplies the input voltage to the electrostatic generator.

According to an embodiment of the present application, the wafer contactors and the positive charge ends are alternated and/or the wafer contactors and the electron ends are alternated.

According to one embodiment of the present application, a first tuning resistor is connected to the first wire and a second tuning resistor is connected to the second wire.

According to one embodiment of the present application, said substrate is an insulating material.

According to an embodiment of the present application, said positive charge ends and said electronic ends are arranged alternately.

According to one embodiment of the present application, wiring grooves are formed in the substrate, and a first wire connecting the power source and the positive charge end and a second wire connecting the power source and the electron end are: Both are provided in the wiring groove.

According to one embodiment of the present application, a wiring distributor is connected on the substrate, and the wiring distributor is provided at an end of the wiring trench near the power source.

The one or more technical solutions in the embodiments of the present application have at least one of the following technical effects.

A transport manipulator according to an embodiment of the present application includes a substrate, a power source, a static electricity generator, and a direction switching member, the static electricity generator includes a positive charge end and an electronic end connected to the power source, and the positive charge end and the electronic end are In either case, a Coulomb force is generated between the wafer and the wafer, and the wafer can be fixed by suction, and can be applied to the transfer of wafers of various specifications, and the manufacturing cost can be reduced. When the power supply stops supplying power to the electrostatic generator, there is a risk that Coulomb force will remain between the positive charge end and the electron end and the wafer. It is difficult to be released, and the direction switching member is adjusted so that the power supply is reverse fed to the static electricity generator, that is, the positive charge end is connected to the negative end of the power supply, and the electronic end is connected to the positive end of the power supply, so that the reverse coulomb By removing the residual Coulomb force by force, the wafer can be smoothly released from the transfer manipulator, solving the problems of wafer hanging and wafer damage during wafer transfer, helping to save social resources and having great economic value. There is

Additional aspects and advantages of the present application will be set forth in part in the description that follows, and in part will be apparent from the description, or may be learned by practice of the application.

In order to more clearly describe the technical solutions in the embodiments of the present application or the related art, the drawings necessary for describing the embodiments or the related art will be briefly described below. Of course, the drawings described below are just some embodiments of the present application, and those skilled in the art can further obtain other drawings based on these drawings on the premise that no creative effort is required.
FIG. 1 is a schematic diagram of a top structure of a transport manipulator according to an embodiment of the present application. FIG. 2 is a schematic diagram of the side structure of the transfer manipulator according to the embodiment of the present application. FIG. 3 is a schematic diagram of the structure of the first embodiment of the direction switching member of the transfer manipulator according to the embodiment of the present application. FIG. 4 is a schematic diagram of the structure of the second embodiment of the direction switching member of the transfer manipulator according to the embodiment of the present application. FIG. 5 is a schematic diagram of the control logic of a transport manipulator in accordance with an embodiment of the present application; FIG. 6 is a schematic diagram of a relationship model between the input voltage of the static electricity generating device of the transfer manipulator and the output voltage of the pressure sensor according to the embodiment of the present application. FIG. 7 is a diagram showing the relationship between the output voltage of the pressure sensor of the transfer manipulator and the static frictional force on the surface of the wafer contactor according to the embodiment of the present application. FIG. 8 is a schematic diagram of the distribution scheme structure of the positive charge end and the electron end of the transfer manipulator according to an embodiment of the present application.

Embodiments of the present application will be described in more detail below with reference to the drawings and embodiments. The following embodiments are intended to illustrate the present application and do not limit the scope of the present application.

In describing the embodiments of the present application, the terms "center", "longitudinal", "horizontal", "top", "bottom", "front", "back", "left", "right", " Azimuths or positional relationships represented by "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the azimuths or positional relationships shown in the drawings, and the embodiments of the present application may be used conveniently. is used for purposes of explanation or simplicity and does not indicate or imply that the device or elements shown are in any particular orientation, or that they are constructed or operated in any particular orientation; It is not to be understood as limiting. It should be noted that the terms "first", "second" and "third" are for descriptive purposes only and are not to be understood as indicating or implying any relative importance.

In the description of the embodiments of the present application, the meanings of the terms "connected to each other", "connected", etc. should be broadly understood unless clearly specified and limited. For example, a fixed connection, a detachable connection or an integral connection is possible. A mechanical connection, an electrical connection, or a direct connection or an indirect connection via an intermediate medium is also possible. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present application according to the specific situation.

In the embodiments of this application, unless expressly specified and limited, a first feature being "above" or "below" a second feature means that the first feature and the second feature are in direct contact. or it may be that the first feature and the second feature are in indirect contact through an intermediate medium. In addition, the fact that the first feature is "above", "above" and "above" the second feature means that the first feature is directly above or diagonally above the second feature. Well, or simply means that the horizontal height of the first feature is higher than the second feature. A first feature being "below", "below" and "below" a second feature may be that the first feature is directly below or diagonally below the second feature, Or simply that the first feature has a lower horizontal height than the second feature.

In the description herein, descriptions that refer to terms such as “one embodiment,” “some embodiments,” “example,” “specific example,” or “some examples” refer to that implementation. A specific feature, structure, material, or feature described with reference to a form or example is meant to be included in at least one embodiment or example of the embodiments of the present application. As used herein, schematic representations of the terms above are not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials, or features described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, those skilled in the art can combine and combine different embodiments or examples, and features of different embodiments or examples, described herein without contradicting each other.

One embodiment of the present application provides a transport manipulator that includes a substrate 1, a power source 8, an electrostatic generator 2, and a direction switching member, as shown in Figures 1-8. The power supply 8 supplies electric power to the static electricity generator 2, the direction switching member is for switching the connection relationship between both ends of the static electricity generator 2 and the power supply 8, and the base 1 is for mounting the static electricity generator 2. . The substrate 1 includes a support portion 11 for supporting the wafer, the power supply 8 includes a positive terminal and a negative terminal, the first wire 5 is connected to the positive terminal, and the second wire 6 is connected to the negative terminal. The static electricity generating device 2 is connected to a power supply 8 and includes a positive charge end 21 and an electronic end 22, both of which are provided on the support 11, and a direction switching member is connected to the power supply. 8 and the electrostatic generator 2, when the direction switching member is in the first state, the positive charge end 21 is connected to the positive end, the electronic end 22 is connected to the negative end, and the direction switching member is When in the second state, the positive charge end 21 is connected to the negative end and the electronic end 22 is connected to the positive end.

Since the wafer is fixedly supported by the support section 11 and can be moved in synchronization with the support section 11, the transfer of the wafer is realized. Here, the wafer and the support 11 are given a fixed acting force by the static electricity generator 2, and after the static electricity generator 2 is energized, a positive charge is generated at the positive charge end 21, and the positive charge end 21 attracts electrons in the wafer, generates electrons in the electron end 22, and the electron end 22 attracts positive charges in the wafer, so as to achieve electrostatic adsorption fixation between the wafer and the transfer manipulator.

When the wafer is transported to the target position, the power supply 8 stops supplying power to the electrostatic generator 2, and there is still some charge remaining on the positive charge end 21 and the electronic end 22, at this time the direction switching The positive end of the power source 8 is connected to the electronic end 22 by a member, the negative end of the power source 8 is connected to the positive charge end 21 , and the power source 8 supplies positive charges to the electronic end 22 and electrons to the positive charge end 21 . to remove the residual positive charges and electrons at the positive charge end 21 and the electron end 22, and reduce the forces between the positive charge end 21 and the wafer and between the electron end 22 and the wafer to zero. and the wafer can be smoothly removed from the substrate 1, solving the problems of wafer hanging and wafer damage that can occur in the wafer due to residual Coulomb force.

In this embodiment, the double electric electrostatic generator 2 is used to generate a Coulomb force to attract the wafer, thereby generating a positive pressure between the wafer and the supporting part 11, and during the wafer transfer. to ensure the static friction force of After the wafer has moved to the target position, the direction switching member switches the charge supplied by the power supply 8 to the positive charge end 21 and the electron end 22 to remove the residual Coulomb force on the positive charge end 21 and the electron end 22. can also The transfer manipulator of the present embodiment is suitable for wafers with different thicknesses manufactured by different processes, and can ensure static friction between the wafer and the support 11 to realize transfer of the wafer without slipping. It is possible to realize the fully adaptive transfer of various wafers, solve the problem of high wafer transfer costs in related technologies, solve the problem of wafer hanging and wafer damage during wafer transfer, and save social resources. Helps save money and has great economic value.

There are two embodiments of the direction switching part.
In one embodiment, as shown in FIG. 3, a pair of power sources 8 are installed, with a first wire 5 connected to the positive end of the power source 8 and a second wire 6 connected to the negative end of the power source 8. A direction switching member is a direction switching switch 91. A first wire 5 and a second wire 6 are connected to both ends of the direction switching switch 91. When the direction switching switch 91 is turned off, The positive charge end 21 is connected to the positive end, the electronic end 22 is connected to the negative end, and when the direction switch 91 is turned on, the positive charge end 21 is connected to the negative end, and the electronic end 22 is connected to the positive end. Connected. By adjusting the energization direction of the power source 8 to the static electricity generator 2, the residual coulomb force between the wafer and the static electricity generator 2 is removed, the wafer is prevented from being damaged by the transport manipulator, and the wafer transport is safe. Improve.

Here, the power supply 8 provides DC power, and the power supply 8 may be a DC power generator. The first wire 5 includes a first section and a second section, the second wire 6 includes a third section and a fourth section, and one end of the directional switch 91 connects the first section and the second section. The second section is connected to the butted position, and the other end of the directional switch 91 is connected to the position where the third and fourth sections are butted. When the direction switch 91 is turned off, the first section communicates with the second section, the third section communicates with the fourth section, the positive end communicates with the positive charge end 21, and the negative end communicates. communicates with the electronic end 22 . When the direction switch 91 is turned on, the first section communicates with the fourth section, the third section communicates with the second section, the positive end communicates with the electronic end 22, and the negative end communicates with the It communicates with the positive charge end 21 . As a result, the residual Coulomb force can be removed by reverse energization, and the wafer can be separated from the substrate 1 without being damaged.

In one embodiment, the first wire 5 is connected to a first tuning resistor and the second wire 6 is connected to a second tuning resistor. The first adjusting resistor is for adjusting the voltage on the positive charge terminal 21 and the second adjusting resistor is for adjusting the voltage on the electron terminal 22 . This allows the static electricity generating device 2 to provide different degrees of adsorption force according to wafer specifications. Both the resistance values of the first adjustment resistor and the second adjustment resistor can be adjusted.

The first adjustment resistor includes a first resistor 51 and a second resistor 52, the first resistor 51 is connected to the first section, the second resistor 52 is connected to the second section, and each portion are independently adjustable. The second adjustment resistor includes a third resistor 61 and a fourth resistor 62, the third resistor 61 is connected to the third section, the fourth resistor 62 is connected to the fourth section, each section voltage is also independently adjustable.

Furthermore, a first capacitor 53 is connected to the first wire 5 and a second capacitor 63 is connected to the second wire 6, thereby stabilizing the voltage more.

In one embodiment, as shown in FIG. 4, the differences from the embodiment shown in FIG. 3 are as follows. That is, the power supply includes a first DC power generator 81 and a second DC power generator 82 arranged in parallel, and the positive end of the first DC power generator 81 is connected to the second DC power generator. The negative end of the first DC power generator 81 is also opposite the negative end of the second DC power generator 82 while being opposite the positive end of 82 . The direction switching member includes a first switch 92 and a second switch 93, the first switch 92 being connected to the branch where the first DC power generator 81 is located, the second switch 93 being the second DC When the power generator 82 is connected to the branch in which it is located and the first switch 92 is turned on and the second switch 93 is turned off, the positive charge end 21 is the positive end of the first DC power generator 81 . , the electronic end 22 is connected to the negative end of the first DC power generator 81, and the positive charge end 21 when the first switch 92 is turned off and the second switch 93 is turned on. is connected to the negative terminal of the second DC power generator 82 , and the electronic terminal 22 is connected to the positive terminal of the second DC power generator 82 . In this embodiment, two sets of power supplies 8 are installed oppositely arranged, and the power supply to the static electricity generator 2 is supplied by switching on/off the first DC power generator 81 and the second DC power generator 82. switch direction. This allows the residual Coulomb force to be removed and the wafer to be separated from the substrate 1 without damage.

In this embodiment, the wires between the power supply 8 and the static electricity generator 2 may be connected with resistors and capacitors so as to ensure the stability of the circuit structure.

In one embodiment, the support 11 is provided with a wafer contactor 3 protruding from the surface of the support 11 , the surface of the wafer contactor 3 contacting the wafer to provide contact between the wafer and the substrate 1 . The purpose is to reduce the contact area, and the static frictional force between the wafer and the surface of the wafer contactor 3 prevents the wafer from moving with respect to the substrate 1 and ensures the stability of wafer transfer. be.

In one embodiment, the bottom of the wafer contactor 3 is provided with a pressure sensor 4 for measuring the pressure exerted by the wafer on the wafer contactor 3, as shown in FIG. and the coefficient of friction of the surface of the wafer contactor 3, the static frictional force between the wafer and the surface of the wafer contactor 3 can be calculated. Here, the pressure applied to the wafer contactor 3 by the wafer is the sum of the gravity of the wafer and the adsorption force of the electrostatic generator 2 to the wafer. Since the gravity of the wafer does not change, according to the set static friction force, the user adjusts the magnitude of the adsorption force of the static electricity generator 2 to the wafer based on the magnitude of the pressure measured by the pressure sensor 4. , ie adjusted to the voltage of the electrostatic generator 2 . When the wafer is transported to the target position, the power supply 8 stops supplying power to the static electricity generator 2. At this time, the pressure measured by the pressure sensor 4 is determined by the weight of the wafer and the residual Coulomb force. It is the total, and the magnitude of the residual Coulomb force can be obtained. According to the magnitude of the residual Coulomb force, the power supply 8 supplies power in the opposite direction, so that the static electricity generator 2 has the same acting force can be generated to remove the residual Coulomb force, allowing the wafer to smoothly release from the transfer manipulator.

In one embodiment, the transfer manipulator further includes a central processing unit, the power supply 8 and the pressure sensor 4 are both connected to the central processing unit, and the input voltage of the electrostatic generator 2 and the pressure sensor 4 are in the central processing unit. is stored, the power supply 8 stops supplying power to the static electricity generator 2, acquires the input voltage of the static electricity generator 2 based on the relationship model and the output voltage of the pressure sensor 4, Switching the state of the direction switching member, the power supply 8 supplies the reverse input voltage to the electrostatic generator 2 .

Here, the relationship model is the curve relationship between the input voltage of the electrostatic generator 2 and the output voltage of the pressure sensor 4 pre-measured in the laboratory according to wafer specifications. As shown in FIG. 6, FIG. 6 shows the relationship model between the input voltage of the electrostatic generator 2 of the wafer and the output voltage of the pressure sensor 4. As shown in FIG. The central processing unit stores relational models of wafers of various specifications, and can call out the relational models corresponding to the wafers to be transferred as needed.

In addition, for the relational model pre-measured in the laboratory, the central processing unit can also modify the relational model according to real-time data to make the adjustment more accurate.

As shown in FIG. 5, the central processing unit transmits the input voltage required for the static electricity generator 2 to the static electricity generator controller, and the static electricity generator controller adjusts and controls the output voltage of the static electricity generator 2, at this time , the pressure sensor 4 measures the pressure of the wafer against the wafer contactor 3 and provides feedback to the central processing unit. This is a logical transfer relationship between the voltage signals and solves the problems of wafer hanging and wafer damage that can be caused by residual Coulomb force on the wafer.

In this embodiment, a dual electric electrostatic generator 2 capable of generating Coulomb force is used to generate positive pressure to ensure static friction during wafer transfer. The positive pressure can be converted into an electrical signal by a pressure sensor 4 at the bottom of the wafer contactor 3 and the central processing unit receives the electrical signal. The relationship model between the input voltage of the electrostatic generator 2 and the induced electric signal of the pressure sensor 4 is written in the central processing unit, so that the central processing unit controls the voltage of the electrostatic generator 2 according to the preset parameters. can do. This allows slip-free transport of wafers of different thicknesses produced by different processes. At the same time, when the input voltage of the static electricity generating device 2 is zero, the output voltage of the pressure sensor 4 is used to detect whether static electricity remains, and then the direction switching member is turned on, and the pressure sensor 4 The induced voltage output from is smaller. When the induced voltage reaches the safe voltage range, the transfer manipulator can perform unloading operation.

In one embodiment, a plurality of wafer contactors 3 are evenly distributed on the support 11 and a pressure sensor 4 is provided at the bottom of each wafer contactor 3 . The multiple wafer contactors 3 provide multiple support points for the wafer, so that the wafer support is more stable. At the same time, multiple pressure sensors 4 can measure multiple sets of data, and adjust the input voltage of the positive charge end 21 or the electronic end 22 of that position according to the pressure for each position. Further, the average value of the input voltage of the electrostatic generator 2 is obtained based on the average value of the plurality of sets of data, and the input voltages of the plurality of sets of positive charge terminals 21 and the plurality of sets of electron terminals 22 are synchronously adjusted. can be done. Of course, the method of adjusting the input voltage of the positive charge terminal 21 and the input voltage of the electron terminal 22 is not limited to the above method, and other methods can be used.

In one embodiment, pressure sensor 4 is a piezoceramic sensor. Piezoelectric ceramic sensors have high sensitivity, high reliability, high stability, and are excellent in high and low temperature resistance and moisture resistance.

Of course, the pressure sensor 4 is not limited to a piezoceramic sensor, but any other sensor that deforms under pressure and can convert the pressure into an electrical signal can be used.

In one embodiment, the substrate 1 is distributed with a plurality of positive charge ends 21, and the substrate 1 is also distributed with a plurality of electron ends 22, such that forces are applied to the wafer at multiple locations, causing the wafer and A static frictional force with the wafer contactor 3 is ensured.

As shown in FIG. 1, two positive charge ends 21 are provided on the substrate 1, two electron ends 22 are also provided, and the positive charge ends 21 and the electron ends 22 are arranged symmetrically.

In one embodiment, the wafer contactor 3 and the positive charge end 21 are alternately arranged, the positive charge end 21 providing the force to attract the wafer, and the wafer contactor 3 providing support force to the wafer, Since the supporting forces are alternately distributed, the wafers are evenly stressed.

Similarly, the alternating arrangement of the wafer contactors 3 and the electron ends 22 also helps to uniformly apply force to the wafer.

As shown in FIG. 1, the wafer contactors 3 and positive charge ends 21 are interleaved, and the wafer contactors 3 and electron ends 22 are interleaved to provide a more uniform force on the wafer. In one embodiment, the positive charge ends 21 and the electronic ends 22 are arranged alternately, and the positive charge ends 21, the electronic ends 22, the positive charge ends 21, the electronic ends 22... are arranged in clockwise or counterclockwise order. , which favors a uniform distribution of the electric field.

In one embodiment, support 11 is provided with preset paths, and positive charge ends 21 and electron ends 22 are alternately arranged on the same preset path, as shown in FIG. The positive charge end 21 and the electron end 22 are alternately arranged in the same preset path, so that the electric field is evenly distributed, which helps to uniformly apply the force to the wafer and ensures stable transfer of the wafer. , also helps reduce damage to the wafer. The positive charge end 21 and the electron end 22 are arranged alternately means that the positive charge end 21, the electron end 22, the positive charge end 21, the electron end 22, . I can understand.

If one preset path is installed, it is ensured that the wafer in this preset path is evenly stressed. When both the positive charge ends 21 and the electron ends 22 are uniformly arranged in the circumferential direction of the supporting portion 11, the positive charge ends 21 and the electron ends 22 are alternately arranged on the same circumference. When a plurality of preset paths are installed, it is ensured that the electric field in each preset path is uniformly distributed.

As shown in FIG. 8, a plurality of paths are provided on the support portion 11, and in the adjacent preset paths, the positive charge end 21 and the electron end 22 are in one-to-one correspondence. When two preset paths are installed, the two adjacent ends of the two preset paths are the positive charge end 21 and the electronic end 22, respectively, and when three or more preset paths are installed, any two are positive charge ends 21 and electronic ends 22 respectively, so that all the positive charge ends 21 and the electronic ends 22 are both alternately arranged so that the electric field across the support 11 is is uniformly distributed.

As shown in FIG. 1, the supporting part 11 has a ring shape, and the electron end 22 and the positive charge end 21 are arranged clockwise on one side of the ring so that the electric fields on both sides are uniformly distributed.

In one embodiment, a wiring groove 13 is formed in the substrate 1 and both the first wire 5 and the second wire 6 are provided in the wiring groove 13 . The installation of the wiring groove 13 is convenient for limiting the wiring path, the assembly is simpler, and the wires are arranged in the wiring groove 13, so that the wiring is more orderly.

In one embodiment, as shown in FIG. 2, the wiring groove 13 is a hollow cavity within the substrate 1, and both the top and bottom surfaces of the wiring groove 13 are sealed so that the wire can be introduced into the wiring groove 13. , the ends of the wiring grooves 13 are open. The upper and lower surfaces of the wiring groove 13 are hermetically sealed to reduce the influence of the external environment on the positive charge end 21 and the electron end 22 and improve the stability of the Coulomb force. provide a closed environment for

Here, the base body 1 includes two parts, an upper casing and a lower casing, and the wiring groove 13 is limitedly formed between the upper casing and the lower casing, thereby facilitating the processing of the wiring groove 13. , wire installation is also easier.

The wiring groove 13 is not limited to a hollow cavity structure, and may be a groove recessed downward from the surface of the substrate 1 .

In one embodiment, the wiring trench 13 extends along a linear, arcuate or serpentine shape, ie the preset path extends along a linear, arcuate or serpentine shape. As shown in FIG. 8, the preset path is arc-shaped, and a plurality of arc-shaped wiring grooves 13 are provided in the circumferential direction of the supporting portion 11. Each wiring groove 13 has a plurality of positive charge ends. 21 and a plurality of electronic ends 22 are provided to evenly distribute the Coulomb force. Of course, the preset path may be linear or serpentine, and if the preset path is linear, the contour shape of the support 11 may also be linear; The shape can also be understood as an S-shape, the serpentine shape increasing the length of the preset path in the support 11 and making the electric field more uniform.

In one embodiment, when the support portion 11 is provided with the wafer contactor 3 , the pressure sensor 4 is provided at the bottom of the wafer contactor 3 and the pressure sensor 4 is provided within the wiring groove 13 . In order to ensure the measurement accuracy of the pressure sensor 4 and reduce the influence of the environment on the measurement results, the pressure sensor 4 is also installed in a relatively closed environment.

In one embodiment, a wiring distributor 7 is connected to the substrate 1 , and the wiring distributor 7 is provided at the end of the wiring groove 13 near the power source 8 . The wiring distributor 7 is for connecting wires, the pressure sensor 4 is connected to the power supply 8 through the wiring distributor 7, and the wires of the positive charge end 21 and the electronic end 22 are also connected through the wiring distributor 7. By being connected to the power supply 8, power can be supplied simultaneously to the pressure sensor 4 and the static electricity generator 2 through one power supply 8, thereby simplifying the structure.

Here, the wiring distributor 7 on one side of the substrate 1 can be connected to the positive terminal and the negative terminal of the power source 8 at the same time, so that one side of the support 11 has the positive charge terminal 21 and the electronic terminal 22 at the same time. can be provided and helps to evenly distribute the electric field.

In one embodiment, the material of substrate 1 is an insulating material, which may be ceramic, plastic, rubber, or the like. The base 1 further includes a connection portion 12, which is used for connection with a driving member such as a motor, cylinder or the like. The support part 11 is a hollow annular structure, the wafer is supported by the annular support part 11, the force is uniformly applied to the wafer, and other operations can be performed on the wafer through the hollow part. can be done. The connection part 12 is located on one side of the support part 11, and the connection part 12 and the support part 11 can be integrally formed or can be jointed and attached, and can be selected according to needs.

In one embodiment, the transfer manipulator includes a power supply 8, a substrate 1, an electrostatic generator 2, a direction switching member, a wafer contactor 3 and a piezoelectric ceramic sensor, the wafer landing on the wafer contactor 3 of the support 11 and generating static electricity. The positive charge end 21 and the electronic end 22 of the generator 2 apply a voltage under the action of the electrostatic generator controller to generate a Coulomb force, thereby generating a static friction force between the wafer contactor 3 and the wafer. At the same time, under the action of the Coulombic force, the piezoelectric ceramic sensor can sense the magnitude of the Coulombic force actually generated and feed it back to the central processing unit. The central processing unit adjusts the input voltage of the electrostatic generator 2 according to the relationship model prepared in advance to ensure that the wafer is always on the support 11 and the transport manipulator transports the wafer to the specified position in the system. do. After reaching the designated position, the piezoceramic sensor senses whether there is residual static electricity after the power supply 8 stops supplying power to the static electricity generator 2 by the pressure-induced voltage, and turns on the direction switching member. can decide whether to When the direction switching member is turned on, the induced voltage due to the pressure of the electroceramic sensor becomes smaller, and when the induced voltage reaches the safe voltage range, the transfer manipulator can perform the unloading operation, and the wafer can be safely and completely removed. Can be placed at a specified position.

The embodiment of the second aspect of the present application provides a wafer adsorption force adjustment system for transporting a manipulator, the system includes N pressure sensors 4, N wafer contactors 3, a central processing unit, an electrostatic generator. It includes a controller and static electricity generator 2, and N is a positive integer of 3 or more. The electrostatic generator 2 is connected to the voltage output of the electrostatic generator controller and is for generating electrostatic charges to generate inductive charges with the wafer. The N pressure sensors 4 are respectively connected to the N wafer contactors 3 and are for obtaining the pressure value of the wafer after it is determined that the wafer is placed on the wafer contactor 3 . The central processing unit is connected to the output end of the N pressure sensors 4, determines the corresponding current target voltage value according to the pressure value and the preset relationship model, and uses the current target voltage value to drive the static electricity generating device controller to output the current actual voltage value and cause the static electricity generating device 2 to generate corresponding static charges. Here, the relationship model set in advance sets the corresponding relationship between the pressure value and the target voltage value.

Specifically, at the bottom of the wafer contactor 3, N pressure sensors 4, that is, a first pressure sensor, a second pressure sensor, . Thus, when a wafer is placed on the wafer contactor 3, the wafer can generate pressure against the pressure sensor 4, and the pressure sensor 4 acquires a pressure value due to the wafer.

In addition, as shown in FIGS. 6 and 7, different types of wafers require different degrees of static friction force, there is a corresponding relationship between the static friction force and the output voltage of the pressure sensor 4, and the output voltage of the pressure sensor 4 , and the input voltage of the static electricity generator 2 have a corresponding relationship, so it is possible to find the corresponding relationship between the static frictional force and the input voltage of the static electricity generator 2 . The input voltage of static electricity generator 2 is the target voltage value generated by static electricity generator 2 . This allows different target voltage values to be input to different types of wafers to generate corresponding static friction forces.

Specifically, a preset relationship model can be set in the form of a preset electrostatic control voltage table, so that after the pressure sensor 4 transmits a voltage signal, that is, a pressure value signal, the preset static voltage is generated according to the pressure value. The corresponding target voltage value can be searched in the electrostatic control voltage table, and the preset electrostatic control voltage table is set with the pressure value range and the corresponding target voltage value.

Of course, a more accurate target voltage value can be obtained by expressing the relationship between the pressure value and the target voltage value in the form of a function. That is, the preset relational model is a functional relational expression between the pressure value and the target voltage value. After obtaining the pressure values, a functional relationship can be used to calculate the target voltage values.

However, the method of this embodiment is applied to the transport manipulator in the above embodiment, both the positive charge end 21 and the electronic end 22 of the static electricity generating device 2 are provided on the transport manipulator, and the power source 8 has the positive charge end 21 and the electronic end 22 for powering.

Based on any of the above embodiments, an embodiment of the present application is provided with an alarm module connected to the central processing unit, the central processing unit obtains the current target voltage value and the current actual voltage value, It is also used to judge whether the difference between the target voltage value and the current actual voltage value exceeds the preset threshold, and when the current threshold is exceeded, the alarm module is triggered.

Further, the central processing unit obtains the current target voltage value and the current actual voltage value, and determines whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold. If the preset threshold is not exceeded, the preset relationship model is modified using the current target voltage value and the current actual voltage value to obtain a modified voltage model.

Specifically, when modifying the preset relationship model, the central processing unit specifically determines that if the current target voltage value is less than the current actual voltage value, the target voltage in the preset relationship model It is also used to adjust the target voltage value in the preset relationship model to be larger when the current target voltage value is greater than the current actual voltage value.

Based on the above embodiment, in this embodiment, in order to know whether there is any deviation in the placement position of the wafer, the central processing unit determines which of the N pressure values corresponding to the N pressure sensors 4 It is also used to issue a wafer placement error alarm if the deviation between one and the other pressure value exceeds a threshold value. That is, when the wafer is placed in the correct position, the pressure values of the N pressure sensors 4 should be the same, but if one of them is abnormal, the pressure received by the abnormal pressure sensor 4 is Too big or too little, meaning the wafer was placed in the wrong position.

Hereinafter, a method for adjusting a wafer suction force for a transfer manipulator according to an embodiment of the present application will be described. can be referenced accordingly.

In the wafer attraction force adjustment system and method for a transfer manipulator according to the embodiment of the present application, the electrostatic charges generated by the static electricity generator 2 are controlled to differ according to the weights of the wafers with different specifications. electrostatic induction to generate the adsorption force to generate different positive pressure to ensure the static friction force during wafer transfer. The positive pressure can be converted into an electrical signal pressure value by means of a pressure sensor 4 below the wafer contactor 3 so that slip-free transport of wafers of different thicknesses under various processes is realized.

Embodiments of the present application further provide a wafer suction force adjustment method for a transfer manipulator, which is applied to any of the wafer suction force adjustment systems described above, and is specifically performed by a central processing unit, the method comprising: ,
After determining that the wafer is placed on the wafer contactor 3, obtaining a pressure value of the wafer S61;
a step S62 of determining a corresponding current target voltage value based on the pressure value and a preset relationship model;
using the current target voltage value to drive the electrostatic generator controller to output the current actual voltage value to cause the electrostatic generator 2 to generate a corresponding electrostatic charge;
Here, a correspondence relationship between the pressure value and the target voltage value is set in the preset relationship model.

Further, specifically performed by a central processing unit, the method specifically includes:
step S71 of acquiring the current target voltage value and the current actual voltage value;
Step S72 of determining whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold;
If the current threshold is not exceeded, a step S73 of modifying the preset relationship model using the current target voltage value and the current actual voltage value to obtain a modified voltage model.

A third embodied embodiment of the present application provides a wafer inspection system for a transfer manipulator, which system includes N pressure sensors 4, N wafer contactors 3, and a central processing unit, where N is 3. is a positive integer greater than or equal to . The N pressure sensors 4 are respectively connected to the N wafer contactors 3 and are for obtaining the pressure value of the wafer after it is determined that the wafer is placed on the wafer contactor 3, and the pressure value is It is the sum of the output values of the N pressure sensors 4 . The central processing unit is connected to the output terminals of the N pressure sensors 4 and is used to determine the type of wafer based on the pressure value and the preset pressure value table and obtain the determination result. Here, pressure value ranges and corresponding wafer types are set in the preset pressure value table.

Specifically, as shown in FIG. 1, pressure sensors 4 are installed at the bottom of each wafer contactor 3 in one-to-one correspondence. , and the pressure sensor 4 acquires the pressure value due to the wafer. The pressure value is the sum of the output values of N pressure sensors 4, ie the pressure values measured by each pressure sensor 4 must be summed. If the wafer is correctly positioned and centered, the pressure value measured by each pressure sensor 4 will be the same, but if the wafer is not centered, the pressure value for each pressure sensor 4 can be different. Yes, although different, the sum of the sensor output values corresponds to the total pressure value produced by the wafer.

Specifically, when the central processing unit uses the pressure generated by the pressure sensor 4 to make a determination, the central processing unit specifically searches the pressure value and the corresponding pressure value range in the preset pressure value table. , when the pressure value range corresponding to the pressure value table exists, the wafer type corresponding to the pressure value range is determined, and when the pressure value range corresponding to the pressure value table does not exist, an abnormal alarm signal is issued. is. For example, the pressure value is 5, and the preset pressure value table has a first pressure value range 1-2, a second pressure value range 2-3, and a third pressure value range 3-4. If there are only these three pressure ranges, it means that the current wafer is an abnormal wafer, and an abnormal alarm signal should be issued at this time. However, if the preset pressure value table includes the fourth pressure value range 4 to 5, the current wafer belongs to the fourth pressure value range, so the type of the current wafer can be determined. Of course, the preset pressure value table also has wafer types corresponding to pressure value ranges such as the first pressure value range, the second pressure value range, and so on. Specifically, the wafer type may be a processing type, and may be types from various customers.

However, an imaging device can also be further installed in the wafer inspection system to check whether the wafer is placed on the transfer manipulator, the imaging device is for taking real-time images of the transfer manipulator, The processing equipment further receives the real-time image, determines whether the wafer is placed on the wafer contactor 3 based on the real-time image, and activates the pressure sensor 4 if the wafer is placed on the wafer contactor 3. It is also used to determine whether the wafer is positioned at a preset position by image recognition of the wafer. Of course, a neural network is set up in the central processing unit, and the neural network is trained with pictorial samples that identify the positions of the wafers at the preset positions.

Embodiments of the present application further provide a wafer inspection method for a transfer manipulator applied to the wafer inspection system of any one of the above embodiments, the method comprising:
After determining that the wafer is placed in the wafer contactor 3, obtaining a pressure value of the wafer S41;
determining the wafer type based on the pressure value and the preset pressure value table to obtain a determination result, wherein the preset pressure value table is set with the pressure value range and the corresponding wafer type (step S42); .

Further, the step of determining the wafer type based on the pressure value and the preset pressure value table and obtaining the determination result specifically includes:
a step S51 of searching a pressure value and a corresponding pressure value range in a preset pressure value table;
If there is a corresponding pressure value range in the pressure value table, a step S52 of determining a wafer type corresponding to the pressure value range;
and a step S53 of issuing an anomaly alarm signal if the corresponding pressure value range does not exist in the pressure value table.

A wafer inspection system and method for a transfer manipulator according to the embodiment of the present application is additionally provided with a pressure sensor 4, and based on the pressure value of the wafer obtained by the pressure sensor 4, the type of the wafer and the presence or absence of abnormality are determined. Therefore, various wafer specifications can be effectively identified, and wafer anomalies can be discovered.

The above embodiments are merely illustrative of the present application and are not intended to be limiting. Although the present application has been described in detail with reference to the embodiments, those skilled in the art will appreciate that various combinations, modifications, or equivalent replacements made to the technical solutions of the present application are within the spirit and scope of the present application. It should be understood that both are to be covered within the scope of the claims of this application without departing from the scope of the claims.

1--substrate, 11--support, 12--connection, 13--wiring groove, 2--electrostatic generator, 21--positive charge end, 22--electron end, 3--wafer contactor, 4--pressure sensor, 5--first 51 - first resistor, 52 - second resistor, 53 - first capacitor, 6 - second wire, 61 - third resistor, 62 - fourth resistor, 63 - second Capacitor 7—Wiring distributor 8—Power supply 81—First DC power generator 82—Second DC power generator 91—Direction selector switch 92—First switch 93—Second switch.

Claims (10)

a substrate including a support for supporting the wafer;
a power source including a positive end and a negative end;
an electrostatic generator connected to a power source and comprising a positive charge end and an electronic end, wherein the positive charge end and the electronic end are both provided on the support;
A direction-switching member provided between the power source and the static electricity generator, wherein when the direction-switching member is in a first state, the positive charge end is connected to the positive end, and the electronic end is connected to the a direction-switching member connected to a negative end, wherein the positive charge end is connected to the negative end and the electronic end is connected to the positive end when the direction-switching member is in a second state. A transport manipulator characterized by: A first wire is connected to the positive terminal, a second wire is connected to the negative terminal, the direction switching member is a direction switching switch, and the direction switching member is a direction switching switch. The first wire and the second wire are respectively connected to both ends, and when the direction switch is turned off, the positive charge end is connected to the positive end and the electronic end is connected to the negative end. 2. The transfer manipulator according to claim 1, wherein when the direction switch is turned on, the positive charge terminal is connected to the negative terminal and the electronic terminal is connected to the positive terminal. . The power supply includes a first DC power generator and a second DC power generator arranged in parallel, and the positive terminal of the first DC power generator is connected to that of the second DC power generator. Opposite to the positive end, the direction switching member includes a first switch and a second switch, the first switch being connected to the branch where the first DC power generator is located, and the second is connected to the branch in which the second DC power generator is located, and when the first switch is turned on and the second switch is turned off, the positive charge end is connected to the first connected to the positive end of a DC power generator, the electronic end is connected to the negative end of the first DC power generator, the first switch is turned off and the second switch is turned on; and said positive charge terminal is connected to the negative terminal of said second DC power generator, and said electronic terminal is connected to the positive terminal of said second DC power generator. A transport manipulator as described. 2. The transfer manipulator according to claim 1, wherein a wafer contactor is provided on said support, said wafer contactor protrudes from the surface of said support, and a pressure sensor is provided on the bottom of said wafer contactor. . Further comprising a central processing unit, the power supply and the pressure sensor are both connected to the central processing unit, and the central processing unit includes a relationship model between the input voltage of the static electricity generating device and the output voltage of the pressure sensor. is stored, and when the power supply stops supplying power to the static electricity generating device, the input voltage of the static electricity generating device is obtained according to the relationship model and the output voltage of the pressure sensor, and the state of the direction switching member is determined. 5. The transfer manipulator according to claim 4, wherein said power supply supplies said input voltage to said static electricity generating device by switching between. 5. The transfer manipulator of claim 4, wherein the wafer contactors and the positive charge edges alternate and/or the wafer contactors and the electron edges alternate. 3. The transfer manipulator according to claim 2, wherein a first adjustment resistor is connected to said first wire, and a second adjustment resistor is connected to said second wire. 2. The transfer manipulator of claim 1, wherein said substrate is an insulating material. A wiring groove is formed in the substrate, and a first wire connecting the power supply and the positive charge terminal and a second wire connecting the power supply and the electron terminal are both provided in the wiring groove. The transfer manipulator according to any one of claims 1 to 8, characterized in that: 10. The transport manipulator according to claim 9, wherein a wiring distributor is connected to the base, and the wiring distributor is provided at an end of the wiring groove near the power source.

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