WO2022057218A1 - 一种磨粒有序排布的杯状砂轮的制备装置及制备方法 - Google Patents

一种磨粒有序排布的杯状砂轮的制备装置及制备方法 Download PDF

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Publication number
WO2022057218A1
WO2022057218A1 PCT/CN2021/079483 CN2021079483W WO2022057218A1 WO 2022057218 A1 WO2022057218 A1 WO 2022057218A1 CN 2021079483 W CN2021079483 W CN 2021079483W WO 2022057218 A1 WO2022057218 A1 WO 2022057218A1
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WIPO (PCT)
Prior art keywords
grinding wheel
abrasive
cup
base
casing
Prior art date
Application number
PCT/CN2021/079483
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English (en)
French (fr)
Inventor
张华�
王润宇
张明恩
武秋宇
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南通大学
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Publication of WO2022057218A1 publication Critical patent/WO2022057218A1/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/02Wheels in one piece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/18Wheels of special form
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00Products made by additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00Tool surfaces formed with a pattern

Definitions

  • the invention relates to the technical field of abrasive tool preparation, in particular to a preparation device and preparation method of a cup-shaped grinding wheel with abrasive grains arranged in an orderly manner.
  • the traditional grinding wheel with randomly arranged abrasive grains has a small holding force on the abrasive grains, and the abrasive grains are easy to fall off, resulting in an increase in the surface roughness of the workpiece and a reduction in the life of the grinding wheel. At the same time, it is not conducive to the discharge of chips and the entry of grinding fluid , it is easy to cause burns of the workpiece.
  • the patent with publication number CN105058255A discloses a device for preparing a grinding wheel with magnetic abrasive grains arranged in an orderly manner, which utilizes the action of a magnetic field to arrange the abrasive grains in an orderly manner. Granules are effective and have a limited form of arrangement.
  • the patent with publication number CN105415216A proposes a method for preparing a diamond grinding wheel with an orderly arrangement of abrasive grains using 3D printing technology.
  • the arrangement of abrasive grains is not limited, but it is only a regular arrangement of abrasive grain groups.
  • the orderly arrangement of a single abrasive grain or a small amount of abrasive grains cannot be achieved.
  • the patent with publication number CN204450260U discloses a device for the orderly arrangement of abrasives in multiple layers, which absorbs abrasive grains through orderly arranged fine straws and then implants them into the matrix to realize the orderly arrangement of abrasive grains, but by To manufacture the grinding wheel in this way, it is necessary to specially manufacture the corresponding group of fine straws, and the small diameter of the thin straws is difficult to manufacture, so there are many inconveniences in practice.
  • the present invention provides a preparation device and preparation method of a cup-shaped grinding wheel with abrasive grains arranged in an orderly manner. Combined with the position adjustment mechanism of the worktable, the abrasives are arranged in an orderly and regular manner on the end face of the grinding wheel base body. At the same time, the laser sintering device sinters the abrasives on the end face of the grinding wheel base body. Cup wheel.
  • a preparation device for a cup-shaped grinding wheel with abrasive grains arranged in an orderly manner comprising: a frame; position, the grinding wheel base is placed on the worktable for processing; an abrasive dispersing device is arranged on the frame, and the abrasive dispersing device is used for spraying the abrasive on the grinding wheel base; and a laser sintering device is arranged on the The frame is used for real-time sintering of the abrasives scattered on the grinding wheel base.
  • the abrasive dispersing device includes: a first casing, disposed on the frame through a first base, the first casing and the first base form a storage bin; a side cover, disposed on the frame On the first casing;
  • the material suction and spray mechanism includes a first transmission mechanism, an eccentric driven wheel, a plunger and a material moving disc, and the first transmission mechanism outputs to the eccentric driven wheel;
  • the eccentric driven wheel and the The plunger is connected by a pin;
  • the material transfer plate is arranged on the first casing through a bearing, the first casing and the first base form the storage bin, and the side cover
  • a moving bin is formed with the first shell, the lower part of the moving bin is an arc-shaped slide rail, and a slide groove is provided on the transfer tray to slide along the slide rail;
  • the discharge port of the bin is arranged on the first casing through the partition between the storage bin and the moving bin;
  • the moving tray is provided with a moving cylinder, and the plunger extends into one
  • the first transmission mechanism includes: a first motor, the first motor is arranged on the first casing; a first driving wheel, the first motor is output to the first driving wheel; a first driving wheel
  • the driven wheel is connected with the first driving wheel through a belt, the eccentric driven wheel and the first driven wheel are located on both sides of the main side wall of the first casing, and the first driven wheel is output through a bearing to the eccentric driven wheel.
  • a sealing gasket is provided at the connection between the side cover and the first casing, and a sealing ring is provided at the contact portion between the plunger and the material moving cylinder.
  • the worktable position adjustment mechanism includes: a second transmission mechanism, including a second motor, a second driving wheel and a second driven wheel, the second motor is output to the second driving wheel, the second driving wheel
  • the driving wheel is connected with the second driven wheel through a belt; one end of the screw rod is connected with the second driven wheel through the frame, and the other end is rotatably arranged on the frame through the worktable,
  • the worktable can move along the screw rod during the rotation of the screw rod; and a limit rod is arranged on the frame through the worktable, and the worktable can move along the limit rod.
  • the workbench includes: a second base, the screw rod and the limit rod are arranged on the frame through the second base, and an accommodating groove is arranged on the second base; a motor provided in the accommodating groove, and the rotary motor output to the grinding wheel rotary seat; and a grinding wheel rotary seat, provided with a rotating part, the rotating part is provided in the accommodating groove, and the rotating part
  • the grinding wheel base body is arranged in the grinding wheel accommodating groove of the grinding wheel rotating seat and is connected to the rotating motor through a rotating shaft located above the rotating motor.
  • the present invention also provides a preparation method for preparing a cup-shaped grinding wheel based on the preparation device for a cup-shaped grinding wheel in which the abrasive grains are arranged in an orderly manner according to any one of the above, comprising the steps of: S10 loading abrasives, placing the abrasives on the Inside the abrasive dispersing device; S20 place the grinding wheel base, place the grinding wheel base on the worktable, and then place the worktable under the laser sintering device; S30 spray abrasive, start the abrasive dispersing device to the Abrasives are sprayed on the grinding wheel base; and S40 sintering, starting the laser sintering device to sinter the abrasives on the grinding wheel base in real time.
  • the rotational speed of the eccentric driven wheel is 1000-2000 r/min; the rotational speed of the grinding wheel rotating seat is 0.1-5 r/min; the moving speed of the worktable is 5-15 mm/s.
  • the abrasive includes abrasive grains and a metal bond, and the grain size of the abrasive grains is 60-200 meshes.
  • the laser pulse frequency of the laser sintering device is 0.3-1 kHz
  • the power is 30-100 W
  • the relative scanning speed is 1-5 mm/s.
  • a preparation device and preparation method of a cup-shaped grinding wheel in which abrasive grains are arranged in an orderly manner of the present invention through the reciprocating motion of the eccentric driven wheel, the temporary storage bin realizes quantitative negative pressure suction and positive pressure spraying, and works in combination with
  • the table position adjustment mechanism realizes the orderly and regular arrangement of the abrasive on the end face of the grinding wheel base, and the laser sintering device sinters the abrasive on the end face of the grinding wheel base. Grinding wheel.
  • a preparation device and preparation method of a cup-shaped grinding wheel with orderly arranged abrasive grains of the present invention are suitable for cup-shaped grinding wheels prepared from abrasives of various materials. It is beneficial to improve the manufacturing efficiency of abrasive tools.
  • FIG. 1 is a structural diagram of a preparation device for a cup-shaped grinding wheel with abrasive grains arranged in an orderly manner according to an embodiment of the present invention
  • FIG. 2 is a structural diagram of the abrasive dispersing device according to an embodiment of the present invention after the side cover is removed;
  • FIG. 3 is a partial cross-sectional structural view of a first casing of an abrasive dispersing device according to an embodiment of the present invention
  • FIG. 4 is a cross-sectional view of the structure of the abrasive dispersing device in the suction state (upper limit position 1) according to an embodiment of the present invention
  • FIG. 5 is a cross-sectional view of the structure of the abrasive dispersing device in the spraying state (lower limit position 2) according to an embodiment of the present invention
  • FIG. 6 is a partial cross-sectional view of a transfer tray according to an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a workbench according to an embodiment of the present invention.
  • FIG. 8 is a flowchart showing a method for preparing a cup-shaped grinding wheel with abrasive grains arranged in an orderly manner according to an embodiment of the present invention
  • FIG. 9 is a structural diagram of a cup-shaped grinding wheel with abrasives arranged in concentric circles according to an embodiment of the present invention.
  • FIG. 10 is a structural diagram of a cup-shaped grinding wheel with abrasives arranged in a fan-shaped circumference according to an embodiment of the present invention
  • FIG. 11 is a structural diagram of a cup-shaped grinding wheel with abrasives arranged in a spiral line according to an embodiment of the present invention.
  • This embodiment provides a preparation device for a cup-shaped grinding wheel with abrasive grains arranged in an orderly manner, as shown in FIG. Table position adjustment mechanism.
  • the grinding wheel base 6 is placed on the worktable 2 for processing, and the abrasive dispersing device 3 is used to spray the abrasive on the grinding wheel base 6 .
  • the laser sintering device 4 is used for real-time sintering of the abrasives scattered on the grinding wheel base 6 .
  • the worktable position adjustment mechanism is used to adjust the position of the worktable.
  • the inner diameter of the grinding wheel base body 6 is 30-50 mm, and the outer diameter is 100-150 mm.
  • the abrasive dispersing device 3 includes a first casing 31 , a material suction and spray mechanism, a material spray port 37 and a side cover 39 , and the abrasive dispersing device 3 is disposed on the on rack 1.
  • the first casing 31 and the first base 32 form the storage bin 33 .
  • the bottom of the storage bin 33 is provided with a slope of 45° to 60°, which is convenient for the The abrasive flows into the outlet 331 under the action of gravity.
  • the side cover 39 and the first housing 31 enclose a material moving bin 36, the lower part of the moving material bin 36 is a circular arc-shaped slide rail, and the moving plate 346 is provided with a sliding groove to move along the The slide rail slides.
  • the side cover 39 is disposed on the first casing 31 , and a sealing gasket is provided at the connection between the side cover 39 and the first casing 31 .
  • the suction and ejection mechanism includes a first transmission mechanism, an eccentric driven wheel 344, a plunger 345, and the material transfer plate 346.
  • the first transmission mechanism outputs to the eccentric driven wheel 344, which is connected to the eccentric driven wheel 344.
  • the plunger 345 is connected by a pin.
  • the transfer plate 346 is disposed on the first casing 31 through a bearing.
  • the discharge port 331 of the storage bin 33 is disposed on the first casing 31 through the partition 35 between the storage bin 33 and the moving bin 36 . As shown in FIG.
  • a material-moving cylinder 347 is arranged in the material-moving tray 346 , the plunger 345 extends into one end of the material-moving cylinder 347 , and the other end of the material-moving cylinder 347 is provided with a temporary material storage
  • the bin 348 is provided with a material moving outlet 349 on the first casing 31 .
  • the material injection port 37 is connected to the material moving outlet 349 through a material injection channel 38 , the material injection channel 38 and the material injection port 37 are provided on the first casing 31 , and the material injection channel 38 ,
  • the diameters of the material spraying port 37 , the material moving outlet 349 and the material discharging port 331 are preferably 0.15-0.45 mm.
  • the eccentric driven wheel 344 drives the plunger 345 to make a crank motion, and the material transfer plate 346 is always in contact with the slide rail during the entire motion.
  • the plunger 345 makes a negative pressure environment in the moving cylinder 347 during the upward movement, and the discharge port 331 The abrasive is drawn into the temporary storage bin 348. As the eccentric driven wheel 344 continues to rotate, the plunger 345 moves downward, and a positive pressure environment is formed in the material moving cylinder 347. When the temporary material storage bin 348 moves to the material moving outlet 349 At this time, under the action of positive pressure, the abrasive in the temporary storage bin 348 is output to the material injection port 37 through the material injection channel 38, and then sprayed on the grinding wheel base 6, and the material injection port 37 is a distance from the material injection port 37.
  • the distance between the upper surface of the grinding wheel base body 6 is about 5 mm to ensure the spraying effect.
  • a sealing ring 8 is provided at the part where the plunger 345 abuts the material-moving cylinder 347 .
  • a material limiter 7 is set at the connection part between the temporary storage bin 348 and the material moving cylinder 347 . By controlling the shape of the material limiter 7 , the amount of material sucked and sprayed each time can be controlled, thereby controlling the grinding wheel base 6 The shape of the dispersed abrasive.
  • the first transmission mechanism includes a first motor 341 , a first driving wheel 342 and a first driven wheel 343 , the first motor 341 is arranged on the first casing 31 , and the first motor 341 outputs to the The first driving wheel 342 , the first driven wheel 343 is connected with the first driving wheel 342 through a belt, and the eccentric driven wheel 344 and the first driven wheel 343 are located on the main side of the first casing 31 On both sides of the wall, the first driven wheel 343 is output to the eccentric driven wheel 344 through a bearing.
  • the rotational speed of the eccentric driven wheel 344 is preferably 1000-2000 r/min.
  • the worktable position adjustment mechanism includes a second transmission mechanism 5, a screw rod 54 and a limit rod 55.
  • the second transmission mechanism 5 includes a second motor, a second driving wheel 52 and a second driven wheel 53. Two motors are arranged on the frame, the second motor outputs to the second driving wheel 52 , and the second driving wheel 52 is connected with the second driven wheel 53 through a belt.
  • One end of the screw rod 54 is connected to the second driven wheel 53 through the frame 1 , and the other end of the screw rod 54 is rotatably arranged on the frame 1 through the worktable 2 ,
  • the table 2 can move along the screw rod 54 during the rotation of the screw rod 54 .
  • the limit rod 55 is disposed on the frame 1 through the worktable 2 , and the worktable 2 can slide along the limit rod 55 .
  • the second motor realizes the axial movement of the worktable 2 along the screw rod 54 through forward and reverse rotation, and the limit rod 55 is used to limit the worktable 2 to ensure that the worktable 2 slides
  • the stability of the table 2 prevents the table 2 from shifting during the sliding process and affecting the preparation effect.
  • the second motor controls the moving speed of the table 2 to be 5-15 mm/s.
  • the laser pulse frequency of the laser sintering device 4 is 0.3-1 kHz, the power is 30-100 W, and the relative scanning speed is 1-5 mm/s.
  • the laser sintering device 4 includes a laser, and the laser is a YAG solid-state laser.
  • the laser head of the laser is provided with a polarizer, and the laser beam can be scanned in the horizontal plane by the polarizer to control the sintering range.
  • the worktable 2 includes a second base 21 , a rotating motor 22 and a grinding wheel rotating base 23 , and the screw rod 54 and the limit rod 55 are disposed on the second base 21 through the second base 21 .
  • an accommodating slot is provided on the second base 21 .
  • the rotary motor 22 is disposed in the accommodating groove, and the rotary motor 22 outputs to the grinding wheel rotary base 23 .
  • the grinding wheel rotating seat 23 is provided with a rotating part 231, the rotating part 231 is arranged in the accommodating groove, the rotating part 231 is located above the rotating motor 22 and is connected to the rotating motor 22 through a rotating shaft, so
  • the grinding wheel base body 6 is arranged in the grinding wheel accommodating groove of the grinding wheel rotating seat 23 .
  • the control system controls the first motor 341, the second motor and the rotating motor 22 to cooperate with each other, so as to control the shape of the surface of the grinding wheel substrate 6 while spraying, and obtain
  • the preset spray shape can easily manufacture a cup-shaped grinding wheel with regular and orderly arrangement of abrasive grains such as concentric circles, spirals, and sectors.
  • the rotation speed of the grinding wheel rotating seat 23 under the control of the rotating motor 22 is preferably 0.1-5 r/min.
  • the grinding wheel rotating seat 23 is connected with the output shaft of the rotating electrical machine 22 through a thrust ball bearing, which avoids the wear between components and improves the service life of the equipment.
  • the present invention also provides a method for preparing a cup-shaped grinding wheel based on a preparation device for a cup-shaped grinding wheel with the above abrasive grains arranged in an orderly manner, comprising the following steps: S10 loading abrasives, placing the abrasives on the Inside the abrasive dispersing device 3 . S20 Place the grinding wheel base 6 , place the grinding wheel base 6 on the worktable 2 , and then place the worktable 2 under the laser sintering device 4 . S30 Spray abrasive, start the abrasive dispersing device 3 to spray abrasive onto the grinding wheel base 6 . and S40 sintering, starting the laser sintering device 4 to sinter the abrasive on the grinding wheel base 6 in real time.
  • the abrasive includes abrasive grains and a metal bond, and the grain size of the abrasive grains is 60-200 meshes.
  • S10 takes a cup-shaped grinding wheel in which the inner diameter of the substrate is 30 mm, the outer diameter is 100 mm, the grinding wheel particle size is 100 (that is, the circumferential spacing of the abrasive particles is 0.255 mm, and the axial spacing of the abrasive particles is 0.255 mm), and the abrasive particles are regularly arranged in concentric circles. shown in Figure 9.
  • an abrasive that is well mixed with SiC abrasive grains and a bronze bond is added.
  • the grinding wheel base 6 does not translate, but only rotates. At the end of each circle, the grinding wheel base 6 translates to start a new circle. It can be seen that in an ideal situation Then, the time for the grinding wheel base 6 to complete the translation is exactly the time interval ⁇ t of the abrasive falling, then:
  • a is the circumferential spacing of abrasive particles
  • b is the radial spacing of abrasive particles (helix pitch)
  • ⁇ 1 is the angular velocity of the substrate rotation
  • ⁇ 2 is the rotational angular velocity of the eccentric shaft
  • v is the translation velocity of the substrate
  • n is the abrasive particle arrangement circle number
  • R 2 is the inner hole radius of the grinding wheel
  • R 1 is the outer circle radius of the grinding wheel
  • p is the screw pitch
  • ⁇ 3 is the screw angular velocity
  • c is the equal fraction of the sector circumference.
  • each motion parameter can be calculated from equations (9), (10) and (11).
  • the laser beam emitted by the laser sintering device 4 is scanned in the horizontal plane direction after passing through the polarizer, and the arranged abrasives are sintered in real time.
  • the second layer can be sintered or the worktable 3 can be moved to the right side of the laser sintering device 4, and the grinding wheel can be removed to complete the preparation.
  • the inner diameter of the substrate is 30mm
  • the outer diameter is 100mm
  • the particle size of the grinding wheel is 100 (that is, the circumferential spacing of the abrasive particles is 0.255mm, and the axial spacing of the abrasive particles is 0.255mm)
  • the equal fraction of the sector circumference is 8
  • the abrasive particles are arranged in a cup shape with a sector circumference.
  • a grinding wheel is a specific example, as shown in Figure 10.
  • an abrasive that is well mixed with SiC abrasive grains and a bronze bond is added.
  • c is an even number. This mechanism realizes that there is no abrasive in some areas through the rapid rotation of the grinding wheel base within a certain period of time. The ideal situation is that the grinding wheel base rotates within a time interval when the abrasive falls. radian.
  • the grinding wheel base 6 moves counterclockwise (planning) at a speed of 180r/min for 0.04s, so that the The material ejection port 37 reaches the starting point of the next arc, and after another 18.4s, the grinding wheel base 6 moves counterclockwise (planning) at a speed of 180r/min for 0.04s, and this is repeated twice to complete the first circle of abrasive discharge. cloth.
  • each motion parameter can be calculated from equations (9), (10), (11), and (12).
  • the laser beam emitted by the laser sintering device 4 is scanned in the horizontal plane direction after passing through the polarizer, and the arranged abrasives are sintered in real time.
  • the second layer can be sintered or the worktable 3 can be moved to the right side of the laser sintering device 4, and the grinding wheel can be removed to complete the preparation.
  • S10 takes a cup-shaped grinding wheel with a matrix inner diameter of 30 mm, an outer diameter of 100 mm, a grinding wheel particle size of 100 (that is, the circumferential spacing of abrasive particles is 0.255 mm, and the axial spacing of abrasive particles is 0.255 mm), and the abrasive particles are spirally arranged as a specific example, as shown in the figure. 11 shown.
  • an abrasive that is well mixed with SiC abrasive grains and a bronze bond is added.
  • the eccentric shaft In order to achieve approximately equal intervals between abrasive grains, the eccentric shaft needs to be accelerated and rotated. Set at time T and time T+ ⁇ t to calculate the distance between the two abrasive piles. Since ⁇ t is small, this The distance is regarded as an arc whose radius is the phase at time T, then,
  • T is the time to start processing.
  • the speed of the substrate is:
  • the eccentric shaft is accelerated and rotated according to the law of formula (17).
  • One, negative pressure is formed in the material-moving cylinder 347 of the material-removing plate 346 to absorb the abrasive; when the material-removing plate 346 reaches the material-removing outlet 349, the plunger 345 reaches another limit position, and the abrasive is due to the positive pressure. It is ejected from the ejection port 37 .
  • the laser beam emitted by the laser sintering device 4 is scanned in the X-axis and Y-axis directions after passing through the polarizer, and the arranged abrasives are sintered in real time.
  • the sintering of the first layer of abrasive grains is completed, the sintering of the second layer can be performed or the worktable 2 can be moved to the right side of the laser sintering device 4, and the grinding wheel can be removed to complete the preparation.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

本发明提供了一种磨粒有序排布的杯状砂轮的制备装置及制备方法,包括:机架;工作台,所述工作台通过工作台位置调整机构调整在所述机架上的位置,砂轮基体放置在所述工作台上进行加工;磨料散布装置,所述磨料散布装置用于将磨料喷射在所述砂轮基体上;以及激光烧结装置,用于对散布在所述砂轮基体上的磨料进行实时烧结。本发明的一种磨粒有序排布的杯状砂轮的制备装置及制备方法,通过偏心从动轮的往复运动实现临时储料仓定量负压吸料及正压喷料,并结合工作台位置调整机构实现磨料在砂轮基体端面形成有序规律排布,同时激光烧结装置对所述砂轮基体端面的磨料进行烧结,磨料的排布精准灵活,获得磨粒规律有序排布的杯状砂轮。

Description

一种磨粒有序排布的杯状砂轮的制备装置及制备方法 技术领域
本发明涉及磨具制备技术领域,具体涉及一种磨粒有序排布的杯状砂轮的制备装置及制备方法。
背景技术
随着现代制造业的迅猛发展,对于各类材料的加工精度和质量的要求越来越高,像不锈钢、硬质合金等难加工材料虽然有着优良的机械性能,但它们的加工性能较差,尤其在进行磨削加工时,存在着磨削力大,磨削温度高、效率低等问题,其加工表面易烧伤和产生硬化层,造成零件报废和资源浪费。
传统磨粒随机排布的砂轮,因其对磨粒的把持力小,磨粒易脱落,造成工件表面粗糙度增大,砂轮寿命减小,同时也不利于切屑的排出和磨削液的进入,易造成工件的烧伤。
公开号为CN105058255A的专利,公开了一种用于制备磁性磨粒有序排布砂轮的装置,其利用磁场的作用使磨粒有序排布,由于依靠磁场,所以仅针对有磁性的金属磨粒有效,且排布形式有限。
公开号为CN105415216A的专利,提出了一种利用3D打印技术制备磨粒有序排布的金刚石砂轮的方法,其磨粒排布方式不受限制,但其仅为磨粒群的规律排布,无法做到单个磨粒或少量磨粒的有序排布。
公开号为CN204450260U的专利,公开了一种磨料多层有序排布的装置,其通过有序排布的细吸管吸取磨粒后植入基体中,实现磨粒的有序排布,但通过该种方式制造砂轮需专门制造相应的细吸管群,且细吸管孔径小,制造困难,故在实践方面存在较多不便。
发明内容
为了解决上述问题,本发明提供一种磨粒有序排布的杯状砂轮的制备装置及制备方法,通过偏心从动轮的往复运动实现临时储料仓定量负压吸料及正压喷料,并结合工作台位置调整机构实现磨料在砂轮基体端面形成有序规律排布,同时激光烧结装置对所述砂轮基体端面的磨料进行烧结,磨料的排布精准灵活,获得磨粒规律有序排布的杯状砂轮。
为了实现以上目的,本发明采取的一种技术方案是:
一种磨粒有序排布的杯状砂轮的制备装置,包括:机架;工作台,设置在所述机架上,所述工作台通过工作台位置调整机构调整在所述机架上的位置,砂轮基体放置在所述工作台上进行加工;磨料散布装置,设置在所述机架上,所述磨料散布装置用于将磨料喷射在所述砂轮基体上;以及激光烧结装置,设置在所述机架上,用于对散布在所述砂轮基体上的磨料进行实时烧结。
进一步地,所述磨料散布装置包括:第一机壳,通过第一底座设置在所述机架上,所述第一机壳与所述第一底座形成了储料仓;侧盖,设置在所述第一机壳上;吸喷料机构,包括第一传动机构、偏心从动轮、柱塞以及移料盘,所述第一传动机构输出至所述偏心从动轮;所述偏心从动轮与所述柱塞通过销轴连接;所述移料盘通过轴承设置在所述第一机壳 上,所述第一机壳与所述第一底座形成了所述储料仓,所述侧盖与所述第一壳体围成了移料仓,所述移料仓下部为圆弧形的滑轨,所述移料盘上设有滑槽可沿所述滑轨滑动;所述储料仓的出料口穿过所述储料仓与所述移料仓之间的隔板设置在所述第一机壳上;所述移料盘内设有移料筒,所述柱塞伸入所述移料筒的一端,所述移料筒的另一端设置有临时储料仓;所述第一机壳上设置移料出口;以及所述喷料口,通过喷料通道与所述移料出口连接,所述喷料通道与所述喷料口设于所述第一机壳上。
进一步地,所述第一传动机构包括:第一电机,所述第一电机设置所述第一机壳上;第一主动轮,所述第一电机输出至所述第一主动轮;第一从动轮,通过皮带与所述第一主动轮连接,所述偏心从动轮与所述第一从动轮位于所述第一机壳的主侧壁的两侧,所述第一从动轮通过轴承输出至所述偏心从动轮。
进一步地,所述侧盖与所述第一机壳连接处设置密封垫,所述柱塞与所述移料筒接触部位设置密封环。
进一步地,所述工作台位置调节机构包括:第二传动机构,包括第二电机、第二主动轮以及第二从动轮,所述第二电机输出至所述第二主动轮,所述第二主动轮通过皮带与所述第二从动轮连接;丝杆,一端穿过所述机架与所述第二从动轮连接,另一端穿过所述工作台可转动设置在所述机架上,所述工作台可在所述丝杆的转动的过程中沿所述丝杆移动;以及限位杆,穿过所述工作台设置在所述机架上,所述工作台可沿所述限位杆滑动。
进一步地,所述工作台包括:第二底座,所述丝杆以及所述限位杆穿过所述第二底座设置在所述机架上,所述第二底座上设置容置槽;旋转电机,设置在所述容置槽内,所述旋转电机输出至所述砂轮旋转座;以及砂轮旋转座,设有旋转部,所述旋转部设置在所述容置槽内,所述旋转部位于所述旋转电机的上方通过转轴与所述旋转电机相连,所述砂轮基体设置在所述砂轮旋转座的砂轮容置槽内。
本发明还提供了一种基于以上任意一项所述的磨粒有序排布的杯状砂轮的制备装置制备杯状砂轮的制备方法,包括如下步骤:S10装磨料,将磨料放置在所述磨料散布装置内;S20放置砂轮基体,将砂轮基体放置在所述工作台上,后将所述工作台置于所述激光烧结装置的下方;S30喷磨料,启动所述磨料散布装置向所述砂轮基体上喷磨料;以及S40烧结,启动所述激光烧结装置对所述砂轮基体上的所述磨料进行实时烧结。
进一步地,所述偏心从动轮的转速为1000~2000r/min;所述砂轮旋转座的旋转速度为0.1~5r/min;所述工作台的移动速度为5~15mm/s。
进一步地,所述磨料包括磨粒以及金属结合剂,所述磨粒的粒度为60~200目。
进一步地,所述激光烧结装置的激光脉冲频率为0.3~1kHz,功率为30~100W,相对扫描速度1~5mm/s。
本发明的上述技术方案相比现有技术具有以下优点:
(1)本发明的一种磨粒有序排布的杯状砂轮的制备装置及制备方法,通过偏心从动轮的往复运动实现临时储料仓定量负压吸料及正压喷料,并结合工作台位置调整机构实现磨料在砂轮基体端面形成有序规律排布,同时激光烧结装置对所述砂轮基体端面的磨料进行烧结,磨料的排布精准灵活,获得磨粒规律有序排布的杯状砂轮。
(2)本发明的一种磨粒有序排布的杯状砂轮的制备装置及制备方法,适用于各种材质的磨料制备的杯状砂轮,本发明的制备装置结构简单,操作简便,有利于提高磨具的制 造效率。
附图说明
下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其有益效果显而易见。
图1所示为本发明一实施例的一种磨粒有序排布的杯状砂轮的制备装置结构图;
图2所示为本发明一实施例的磨料散布装置去除侧盖后的结构图;
图3所示为本发明一实施例的磨料散布装置的第一机壳部分剖视结构图;
图4所示为本发明一实施例的磨料散布装置吸料状态下(上极限位置一)的结构剖视图;
图5所示为本发明一实施例的磨料散布装置喷料状态下(下极限位置二)的结构剖视图;
图6所示为本发明一实施例的移料盘部分剖视图;
图7所示为本发明一实施例的工作台的剖视图;
图8所示为本发明一实施例的磨粒有序排布的杯状砂轮的制备方法流程图;
图9所示为本发明一实施例的磨料呈同心圆排布的杯状砂轮的结构图;
图10所示为本发明一实施例的磨料呈扇形圆周排布的杯状砂轮的结构图;
图11所示为本发明一实施例的磨料呈螺旋线排布的杯状砂轮的结构图。
图中附图标记:
1机架、2工作台、21第二底座、22旋转电机、23砂轮旋转座、231旋转部、3磨料散布装置、31第一机壳、32第一底座、33储料仓、331出料口、341第一电机、342第一主动轮、343第一从动轮、344偏心从动轮、345柱塞、346移料盘、347移料筒、348临时储料仓、349移料出口、35隔板、36移料仓、37喷料口、38喷料通道、39侧盖、4激光烧结装置、51第二主动轮、52第二从动轮、53丝杆、54限位杆、6砂轮基体、7限料部、8密封环。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本实施例提供了一种磨粒有序排布的杯状砂轮的制备装置,如图1所示,包括设置在机架1上的工作台2、磨料散布装置3、激光烧结装置4以及工作台位置调节机构。砂轮基体6放置在所述工作台2上进行加工,所述磨料散布装置3用于将磨料喷射在所述砂轮基体6上。所述激光烧结装置4用于对散布在所述砂轮基体6上的磨料进行实时烧结。所述工作台位置调节机构用于调整所述工作台的位置。一般所述砂轮基体6的内径30~50mm,外径100~150mm。
如图2~5所示,所述磨料散布装置3包括第一机壳31、吸喷料机构、喷料口37以及侧盖39,所述磨料散布装置3通过第一底座32设置在所述机架1上。所述第一机壳31与所述第一底座32形成了所述储料仓33,所述储料仓33的底部设有45°~60°的斜坡,便于所述储 料仓33内的磨料在重力的作用下流入所述出料口331。所述侧盖39与所述第一壳体31围成了移料仓36,所述移料仓36下部为圆弧形的滑轨,所述移料盘346上设有滑槽可沿所述滑轨滑动。所述侧盖39设置在所述第一机壳31上,所述侧盖39与所述第一机壳31连接处设置密封垫。
所述吸喷料机构包括第一传动机构、偏心从动轮344、柱塞345以及所述移料盘346,所述第一传动机构输出至所述偏心从动轮344,所述偏心从动轮344与所述柱塞345通过销轴连接。所述移料盘346通过轴承设置在所述第一机壳31上。所述储料仓33的出料口331穿过所述储料仓33与所述移料仓36之间的隔板35设置在所述第一机壳31上。如图6所示,所述移料盘346内设有移料筒347,所述柱塞345伸入所述移料筒347的一端,所述移料筒347的另一端设置有临时储料仓348,所述第一机壳31上设置移料出口349。所述喷料口37通过喷料通道38与所述移料出口349连接,所述喷料通道38以及所述喷料口37设于所述第一机壳31上,所述喷料通道38、所述喷料口37、所述移料出口349以及所述出料口331的孔径优选0.15~0.45mm。在所述第一传动机构的带动下所述偏心从动轮344带动所述柱塞345做曲柄运动,在整个运动的过程中所述移料盘346始终与所述滑轨抵接。设置所述柱塞345的初始位置、所述出料口331以及所述移料出口349的位置,使得当所述临时储料仓348移动到所述出料口331处时所述柱塞345达到上极限位置一,确保此时所述移料筒347内形成负压环境;所述临时储料仓348移动到所述移料出口349时,所述柱塞345达到下极限位置二,所述移料筒347内形成正压环境。当所述临时储料仓348移动到所述出料口331处时,所述柱塞345在向上运动的过程中使得所述移料筒347内形成负压环境,所述出料口331处的磨料被吸入所述临时储料仓348。随着所述偏心从动轮344的继续转动,所述柱塞345向下运动,所述移料筒347内形成正压环境,当所述临时储料仓348移动到所述移料出口349处时,在正压作用下所述临时储料仓348内的磨料通过所述喷料通道38输出至所述喷料口37,进而喷射在所述砂轮基体6上,所述喷料口37距离所述砂轮基体6上表面的距离为5mm左右,确保喷料效果。为了确保所述移料筒347能形成负压环境,所述柱塞345与所述移料筒347抵接的部位设置密封环8。所述临时储料仓348与所述移料筒347连接部位设置限料部7,通过控制所述限料部7的形状可以控制每次吸料及喷料的量,进而控制所述砂轮基体6上散布磨料的形状。
所述第一传动机构包括第一电机341、第一主动轮342以及第一从动轮343,所述第一电机341设置所述第一机壳31上,所述第一电机341输出至所述第一主动轮342,所述第一从动轮343通过皮带与所述第一主动轮342连接,所述偏心从动轮344与所述第一从动轮343位于所述第一机壳31的主侧壁的两侧,所述第一从动轮343通过轴承输出至所述偏心从动轮344。所述偏心从动轮344的转速优先1000~2000r/min。
所述工作台位置调节机构包括第二传动机构5、丝杆54以及限位杆55,所述第二传动机构5包括第二电机、第二主动轮52以及第二从动轮53,所述第二电机设置在所述机架上,所述第二电机输出至所述第二主动轮52,所述第二主动轮52通过皮带与所述第二从动轮53连接。所述丝杆54的一端穿过所述机架1与所述第二从动轮53连接,所述丝杆54的另一端穿过所述工作台2可转动设置在所述机架1上,所述工作台2可在所述丝杆54的转动的过程中沿所述丝杆54移动。所述限位杆55穿过所述工作台2设置在所述机架1上,所述工作台2可沿所述限位杆55滑动。所述第二电机通过正反转实现所述工作台2沿所述丝杆54的轴向 移动,所述限位杆55用于对所述工作台2进行限位确保所述工作台2滑动的稳定性,防止所述工作台2在滑动的过程中偏移影响制备效果。所述第二电机控制所述工作台2的移动速度为5~15mm/s。
所述激光烧结装置4的激光脉冲频率为0.3~1kHz,功率为30~100W,相对扫描速度1~5mm/s。所述激光烧结装置4包括激光器,所述激光器为YAG固体激光器。所述激光器的激光头内设有偏振镜,激光束可通过偏振镜在水平面内内的扫描,控制烧结范围。
如图7所示,所述工作台2包括第二底座21、旋转电机22以及砂轮旋转座23,所述丝杆54以及所述限位杆55穿过所述第二底座21设置在所述机架1上,所述第二底座21上设置容置槽。所述旋转电机22设置在所述容置槽内,所述旋转电机22输出至所述砂轮旋转座23。所述砂轮旋转座23设有旋转部231,所述旋转部231设置在所述容置槽内,所述旋转部231位于所述旋转电机22的上方通过转轴与所述旋转电机22相连,所述砂轮基体6设置在所述砂轮旋转座23的砂轮容置槽内。在杯状砂轮制备的过程中,控制系统控制所述第一电机341、所述第二电机以及所述旋转电机22相互配合,实现边喷涂边控制喷涂在所述砂轮基体6表面的形状,获得预设喷涂形状,可方便的制造出磨粒呈同心圆、螺旋、扇形等规律有序排布的杯状砂轮。所述砂轮旋转座23在所述旋转电机22控制下的旋转速度优选0.1~5r/min。所述砂轮旋转座23通过推力球轴承与所述旋转电机22的输出轴连接,避免了部件间的磨损,提高了设备的寿命。
如图8所示,本发明还提供了一种基于以上磨粒有序排布的杯状砂轮的制备装置制备杯状砂轮的制备方法,包括如下步骤:S10装磨料,将磨料放置在所述磨料散布装置3内。S20放置砂轮基体6,将砂轮基体6放置在所述工作台2上,后将所述工作台2置于所述激光烧结装置4的下方。S30喷磨料,启动所述磨料散布装置3向所述砂轮基体6上喷磨料。以及S40烧结,启动所述激光烧结装置4对所述砂轮基体6上的所述磨料进行实时烧结。
所述磨料包括磨粒以及金属结合剂,所述磨粒的粒度为60~200目。
以此三种磨料排布方式的砂轮对本发明的制备方法进行说明:
实施例1
S10以基体内径30mm,外径100mm,砂轮粒度100(即磨粒圆周间距为0.255mm,磨粒径向间距为0.255mm),磨粒呈同心圆规律排布的杯状砂轮为具体实例,如图9所示。在所述储料仓33内加入SiC磨粒和青铜结合剂充分混合的磨料。
当磨料呈同心圆排布
Figure PCTCN2021079483-appb-000001
且n∈Z,   (1)
则第n圈的工作半径为:
R 2+(n-1)·b,   (2)
磨料下落时间间隔,
Figure PCTCN2021079483-appb-000002
若以弧长计算,
Figure PCTCN2021079483-appb-000003
在进行每一圈的喷料时,所述砂轮基体6不进行平移,而只进行旋转,在每一圈的末尾,所述砂轮基体6进行平移,以开始新的一圈,可知在理想情况下,所述砂轮基体6完成平移的时间恰为磨料下落时间间隔Δt,则:
Figure PCTCN2021079483-appb-000004
同时在每一圈所述砂轮基体6平移运动需暂停时间,
Figure PCTCN2021079483-appb-000005
由:
Figure PCTCN2021079483-appb-000006
得:
Figure PCTCN2021079483-appb-000007
在实际应用中为控制方便与稳定性,取a、b、ω 2、R 2、R 1、p为已知参数,
则由(1)、(4)、(8)可得:
Figure PCTCN2021079483-appb-000008
其中:
Figure PCTCN2021079483-appb-000009
且n∈Z,   (10)
且每到新的一圈,所述砂轮基体6需暂停平移时间:
Figure PCTCN2021079483-appb-000010
其中,a为磨粒圆周间距,b为磨粒径向间距(螺旋线螺距),ω 1为基体自转角速度,ω 2为偏心轴转动角速度,v为基体平移速度,n为磨粒排布圈数,R 2为砂轮内孔半径,R 1为砂轮外圆半径,p为丝杠螺距,ω 3为丝杠角速度,c为扇形圆周等分数。
S20将所述工作台2移至激光烧结装置4的右侧,安放所述砂轮基体6。开启电源,所述第二传动机构带动所述丝杆35运动,从而使工作台2移动置于所述激光烧结装置4的下方,所述砂轮基体6内圆柱面边缘移动至所述喷料口37的正下方。
S30喷磨料,当所述砂轮基体6到位后,此时磨料因重力已聚集于所述出料口331附近,所述第一传动机构带动所述偏心从动轮344以1440r/min的速度顺时针(右视)运转,在所述偏心从动轮344转动的每一圈内,当所述移料盘346到达所述出料口331处时,所述柱塞345到达其极限位置之一,移料盘346的移料筒347内形成负压,吸取磨料;当移料盘346到达所述移料出口349处时,所述柱塞345到达另一极限位置,磨料因正压从所述喷料口37中喷出。通过上述负压吸料和正压输送,在限料部7的作用下,每次获得定量磨料,约0.01mm 3,以约0.04秒的时间间隔从喷料口37喷出。同时,所述砂轮基体6以约0.408r/min的速度缓慢逆时针(俯视)转动,约2.45min后第一圈磨料排布完成。
所述工作台2以约6.12mm/s的速度向所述限位杆54的轴向平移0.04s,使所述喷料口37对准第二圈的起点处,所述砂轮基体6以约0.407r/min的速度缓慢逆时针(俯视)转动,约2.46min后第二圈磨料排布完成。以此类推,各运动参数可由式(9)、(10)、(11)计算得到。
S40烧结,在磨粒有序排布的同时,所述激光烧结装置4发出的激光束通过偏振器后作水平面方向的扫描,对排布的磨料进行实时烧结。待第一层磨粒烧结完毕,可进行的二层的烧结或将工作台3移至所述激光烧结装置4的右侧,可取下砂轮,完成制备。
实施例2:
S10以基体内径30mm,外径100mm,砂轮粒度100(即磨粒圆周间距为0.255mm,磨粒径向间距为0.255mm),扇形圆周等分数为8,磨粒呈扇形圆周排布的杯状砂轮为具体实例,如图10所示。在所述储料仓33内加入SiC磨粒和青铜结合剂充分混合的磨料。
当磨料呈扇形圆周排布,
为使有磨料区域与无磨料区域相间隔,则c为偶数。本机构通过砂轮基体在特定时间内的快速旋转,实现部分区域内无磨料,其理想情况也是在磨料下落的一个时间间隔内砂轮基体转动
Figure PCTCN2021079483-appb-000011
弧度。
则在快速旋转阶段:
Figure PCTCN2021079483-appb-000012
其他运动参数与当磨料呈同心圆排布时相同。
S20将工作台2移至激光烧结装置4的右侧,安放所述砂轮基体6。开启电源,所述第二传动机构带动所述丝杆35运动,从而使工作台2移动置于所述激光烧结装置4的下方,所述砂轮基体6内圆柱面边缘移动至所述喷料口37的正下方。
S30喷磨料,当所述砂轮基体6到位后,此时磨料因重力已聚集于所述出料口331附近,所述第一传动机构带动所述偏心从动轮344以1440r/min的速度顺时针(右视)运转,在所述偏心从动轮344转动的每一圈内,当所述移料盘346到达所述出料口331处时,所述柱塞345到达其极限位置之一,移料盘346的移料筒347内形成负压,吸取磨料;当移料盘346到达所述移料出口349处时,所述柱塞345到达另一极限位置,磨料因正压从所述喷料口37中喷出。通过上述负压吸料和正压输送,在限料部7的作用下,每次获得定量磨料,约0.01mm 3,以约0.04秒的时间间隔从所述喷料口37喷出。同时,所述砂轮基体6以约0.408r/min的速度缓慢逆时针(俯视)转动,约18.4s后所述砂轮基体6以180r/min的速度逆时针(俯视)运动0.04s,使所述喷料口37到达下一段圆弧的起点处,再18.4s后,所述砂轮基体6以180r/min的速度逆时针(俯视)运动0.04s,如此重复2遍,完成第一圈磨料的排布。所述工作台2以约6.12mm/s的速度向所述限位杆54的轴向平移0.04s,使所述喷料口37对准第二圈的起点处,所述砂轮基体6以约0.407r/min的速度缓慢逆时针(俯视)转动,约18.5s后,基体36以180r/min的速度逆时针(俯视)运动0.04s,使所述喷料口37到达下一段圆弧的起点处,如此再重复3遍,完成第二圈磨粒的排布。以此类推,各运动参数可由式(9)、(10)、(11)、(12)计算得到。
S40烧结,在磨粒有序排布的同时,所述激光烧结装置4发出的激光束通过偏振器后作水平面方向的扫描,对排布的磨料进行实时烧结。待第一层磨粒烧结完毕,可进行的二层的烧结或将工作台3移至所述激光烧结装置4的右侧,可取下砂轮,完成制备。
实施例3:
S10以基体内径30mm,外径100mm,砂轮粒度100(即磨粒圆周间距为0.255mm,磨粒径向间距为0.255mm),磨粒呈螺旋线排布的杯状砂轮为具体实例,如图11所示。在所述储料仓33内加入SiC磨粒和青铜结合剂充分混合的磨料。
当磨料呈螺旋线排布,
所有运动均为连续运动,无速度的突变。
由运动规律得排布的螺旋线的极坐标方程为:
Figure PCTCN2021079483-appb-000013
为实现磨粒间的间隔大致相等,则偏心轴需做加速旋转,设在T时刻与T+Δt两个时刻,计算这两个磨料堆之间的距离,由于Δt很小,则将这一距离看成是以T时刻的相径为半径的一段圆弧,则,
a=ω 1(T+Δt-T)·(R 2+vT),    (14)
Figure PCTCN2021079483-appb-000014
Figure PCTCN2021079483-appb-000015
将(16)、(3)带入(14)并设ω 3为已知参数,解得:
Figure PCTCN2021079483-appb-000016
其中T为开始加工的时间。
综上,当磨料呈螺旋线排布时基体转速:
Figure PCTCN2021079483-appb-000017
偏心轴按式(17)的规律做加速旋转。
S20将工作台2移至激光烧结装置4的右侧,安放所述砂轮基体6。开启电源,所述第二传动机构带动所述丝杆35运动,从而使工作台2移动置于所述激光烧结装置4的下方,所述砂轮基体6内圆柱面边缘移动至所述喷料口37的正下方。
S30喷磨料,当所述砂轮基体6到位后,此时磨料因重力已聚集于所述出料口331附近,所述工作台2以0.1mm/s的速度向X正向运动,则所述砂轮基体6以23.53r/min的速度匀速逆时针(俯视)旋转。所述第一传动机构带动偏心传动轮344以1821.4r/min的初速度顺时针(右视)旋转,并以式(17)所确定的函数关系:ω 2=58·T+1821.4(r/min)(T(min))运转,在所述偏心从动轮344转动的每一圈内,当所述移料盘346到达所述出料口331处时,所述柱塞345到达其极限位置之一,移料盘346的移料筒347内形成负压,吸取磨料;当移料盘346到达所述移料出口349处时,所述柱塞345到达另一极限位置,磨料因正压从所述喷料口37中喷出。通过上述负压吸料和正压输送,在所述限料部7的作用下,每次获得定量磨料,约 0.01mm 3,以式(3)所确定的时间间隔从所述出料口331处喷出。装置按如上所述的运动规律运转,直至磨粒排布结束。
S40烧结,在磨粒有序排布的同时,所述激光烧结装置4发出的激光束通过偏振器后作X轴与Y轴方向的扫描,对排布的磨料进行实时烧结。待第一层磨粒烧结完毕,可进行的二层的烧结或将所述工作台2移至所述激光烧结装置4右侧,可取下砂轮,完成制备。
以上所述仅为本发明的示例性实施例,并非因此限制本发明专利保护范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种磨粒有序排布的杯状砂轮的制备装置,其特征在于,包括:
    机架;
    工作台,设置在所述机架上,所述工作台通过工作台位置调整机构调整在所述机架上的位置,砂轮基体放置在所述工作台上进行加工;
    磨料散布装置,设置在所述机架上,所述磨料散布装置用于将磨料喷射在所述砂轮基体上;以及
    激光烧结装置,设置在所述机架上,用于对散布在所述砂轮基体上的磨料进行实时烧结。
  2. 根据权利要求1所述的磨粒有序排布的杯状砂轮的制备装置,其特征在于,所述磨料散布装置包括:
    第一机壳,通过第一底座设置在所述机架上,所述第一机壳与所述第一底座形成了储料仓;
    侧盖,设置在所述第一机壳上;
    吸喷料机构,包括第一传动机构、偏心从动轮、柱塞以及移料盘,所述第一传动机构输出至所述偏心从动轮;所述偏心从动轮与所述柱塞通过销轴连接;所述移料盘通过轴承设置在所述第一机壳上,所述第一机壳与所述第一底座形成了所述储料仓,所述侧盖与所述第一壳体围成了移料仓,所述移料仓下部为圆弧形的滑轨,所述移料盘上设有滑槽可沿所述滑轨滑动;所述储料仓的出料口穿过所述储料仓与所述移料仓之间的隔板设置在所述第一机壳上;所述移料盘内设有移料筒,所述柱塞伸入所述移料筒的一端,所述移料筒的另一端设置有临时储料仓;所述第一机壳上设置移料出口;以及
    所述喷料口,通过喷料通道与所述移料出口连接,所述喷料通道与所述喷料口设于所述第一机壳上。
  3. 根据权利要求2所述的磨粒有序排布的杯状砂轮的制备装置,其特征在于,所述第一传动机构包括:
    第一电机,所述第一电机设置所述第一机壳上;
    第一主动轮,所述第一电机输出至所述第一主动轮;
    第一从动轮,通过皮带与所述第一主动轮连接,所述偏心从动轮与所述第一从动轮位于所述第一机壳的主侧壁的两侧,所述第一从动轮通过轴承输出至所述偏心从动轮。
  4. 根据权利要求2所述的磨粒有序排布的杯状砂轮的制备装置,其特征在于,所述侧盖与所述第一机壳连接处设置密封垫,所述柱塞与所述移料筒接触部位设置密封环。
  5. 根据权利要求1所述的磨粒有序排布的杯状砂轮的制备装置,其特征在于,所述工作台位置调节机构包括:
    第二传动机构,包括第二电机、第二主动轮以及第二从动轮,所述第二电机输出至所述第二主动轮,所述第二主动轮通过皮带与所述第二从动轮连接;
    丝杆,一端穿过所述机架与所述第二从动轮连接,另一端穿过所述工作台可转动设置在所述机架上,所述工作台可在所述丝杆的转动的过程中沿所述丝杆移动;以及
    限位杆,穿过所述工作台设置在所述机架上,所述工作台可沿所述限位杆滑动。
  6. 根据权利要求5所述的磨粒有序排布的杯状砂轮的制备装置,其特征在于,所述工作台包括:
    第二底座,所述丝杆以及所述限位杆穿过所述第二底座设置在所述机架上,所述第二底座上设置容置槽;
    旋转电机,设置在所述容置槽内,所述旋转电机输出至所述砂轮旋转座;以及
    砂轮旋转座,设有旋转部,所述旋转部设置在所述容置槽内,所述旋转部位于所述旋转电机的上方通过转轴与所述旋转电机相连,所述砂轮基体设置在所述砂轮旋转座的砂轮容置槽内。
  7. 根据权利要求1~6任意一项所述的磨粒有序排布的杯状砂轮的制备装置制备杯状砂轮的制备方法,其特征在于,包括如下步骤:
    S10装磨料,将磨料放置在所述磨料散布装置内;
    S20放置砂轮基体,将砂轮基体放置在所述工作台上,后将所述工作台置于所述激光烧结装置的下方;
    S30喷磨料,启动所述磨料散布装置向所述砂轮基体上喷磨料;以及
    S40烧结,启动所述激光烧结装置对所述砂轮基体上的所述磨料进行实时烧结。
  8. 根据权利要求7所述的磨粒有序排布的杯状砂轮的制备方法,其特征在于,所述偏心从动轮的转速为1000~2000r/min;所述砂轮旋转座的旋转速度为0.1~5r/min;所述工作台的移动速度为5~15mm/s。
  9. 根据权利要求7所述的磨粒有序排布的杯状砂轮的制备方法,其特征在于,所述磨料包括磨粒以及金属结合剂,所述磨粒的粒度为60~200目。
  10. 根据权利要求7所述的磨粒有序排布的杯状砂轮的制备方法,其特征在于,所述激光烧结装置的激光脉冲频率为0.3~1kHz,功率为30~100W,相对扫描速度1~5mm/s。
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CN111993298A (zh) * 2020-09-15 2020-11-27 南通大学 一种磨粒有序排布的杯状砂轮的制备装置及制备方法

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