WO2022054421A1 - Unité de pointe d'appareil de chauffage - Google Patents

Unité de pointe d'appareil de chauffage Download PDF

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Publication number
WO2022054421A1
WO2022054421A1 PCT/JP2021/027196 JP2021027196W WO2022054421A1 WO 2022054421 A1 WO2022054421 A1 WO 2022054421A1 JP 2021027196 W JP2021027196 W JP 2021027196W WO 2022054421 A1 WO2022054421 A1 WO 2022054421A1
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WIPO (PCT)
Prior art keywords
iron
temperature measuring
heater chip
heater
tip
Prior art date
Application number
PCT/JP2021/027196
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English (en)
Japanese (ja)
Inventor
伸一郎 須賀
Original Assignee
株式会社アポロ技研
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アポロ技研 filed Critical 株式会社アポロ技研
Priority to MYPI2022004865A priority Critical patent/MY196583A/en
Priority to CN202180027313.4A priority patent/CN115461180A/zh
Priority to KR1020227030266A priority patent/KR20220130802A/ko
Publication of WO2022054421A1 publication Critical patent/WO2022054421A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

Definitions

  • the present invention relates to a heater chip unit for thermocompression bonding a terminal lead wire to a terminal member.
  • a heater chip unit for thermocompression bonding is used in the work of thermocompression bonding the terminal lead wire to the terminal member, for example, in the work of thermocompression bonding the lead wire to the terminal portion of the core in the manufacture of electronic parts such as chip inductors.
  • a thermocouple is attached as a temperature sensor to the heater chip whose temperature rises in the iron portion to form a heater chip unit, and this heater chip unit is attached to the tool holder of the thermocompression bonding device. Then, the thermocompression bonding device is operated, the terminal conductor wire placed on the terminal member is rapidly heated while being pressurized by the iron portion of the heater chip, and the terminal conductor wire is thermocompression bonded to the terminal member (see, for example, Patent Document 1). ..
  • the wire of the thermocouple is passed through the through hole of the heater chip, and arc welding is performed in this state to perform temperature measurement contact (temperature measurement unit of the temperature sensor). ) Is formed and the temperature measuring contact is attached (joined) to the heater chip at the same time.
  • the temperature measuring contact may not be formed and only the wire may be joined to the heater tip, resulting in poor yield. Therefore, it is preferable to form a temperature measuring contact in advance before fastening to the heater chip, sufficiently contact the temperature measuring contact (temperature measuring unit) with the heater chip, and perform fastening in this state. ..
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heater chip unit capable of sufficiently contacting a temperature measuring unit of a temperature sensor with a fastening point of a heater chip. Is.
  • the present invention has been proposed to achieve the above object, and the one according to claim 1 has a temperature sensor attached to a plate-shaped heater chip for thermocompression bonding a terminal lead wire to a terminal member. It ’s a heater chip unit.
  • the heater chip is A trowel portion having a trowel tip portion in contact with the terminal lead wire in the trowel body, and a trowel portion.
  • a pair of connecting arms extending upward from the left and right ends of the iron body so as to be separated from each other and allowing a current from a power source to flow through the iron body to raise the temperature of the iron body.
  • a temperature measuring stop portion provided on the iron portion and to which the temperature measuring portion of the temperature sensor is fastened is provided.
  • the temperature measuring stop portion is provided with a pair of stop contact surfaces that the temperature measurement section contacts, and is set to a state in which the separation distance between the stop contact surfaces gradually expands from the iron portion side to the upper side. It is a characteristic heater chip unit.
  • the heater chip unit according to claim 1 is characterized in that the fastening contact surface is formed of a flat surface and the temperature measuring portion is formed of a spherical body.
  • the conductor of the temperature sensor is stored in the conductor storage vacant portion by using the gap between the connecting arms as the conductor storage vacant portion.
  • the fourth aspect of the present invention is the first to the third aspect of the present invention, wherein the heater chip has an oxidation-resistant coating layer formed on at least the surfaces of the iron portion and the temperature measuring anchoring portion.
  • the heater chip unit according to any one.
  • the heater chip unit according to claim 6 is the heater chip unit according to claim 4 or 5, wherein the oxidation-resistant coating layer is a nickel coating.
  • the temperature measuring anchoring portion includes a pair of fastening contact surfaces with which the temperature measuring portion contacts, and the separation distance between the fastening contact surfaces increases from the iron portion side upward. Since the temperature is set to gradually expand as the temperature is increased, the temperature measuring part of the temperature sensor can be sufficiently brought into contact with the temperature measuring stop. Therefore, it is possible to construct a heater chip unit capable of good adhesion of the temperature measuring unit to the heater chip and, by extension, good temperature measurement.
  • the temperature measuring portion since the anchoring contact surface is formed of a flat surface and the temperature measuring portion is formed of a spherical body, the temperature measuring portion easily makes point contact with the anchoring contact surface. Further, if the temperature measuring portion is pressed against the fastening contact surface, stress is easily concentrated and the temperature measuring portion is less likely to float from the fastening contact surface. As a result, the temperature measuring unit can be more satisfactorily fixed to the heater chip, and by extension, the temperature of the heater chip can be measured more satisfactorily.
  • the lead wire of the temperature sensor is stored in the lead wire storage empty portion by using the gap between the connecting arms as the lead wire storage empty portion, and the fastening contact surface is the end portion of the lead wire storage empty portion. If the temperature sensor is inserted into the lead wire storage vacant part with the temperature measuring part at the head, the temperature measuring part can be easily brought into contact with the fastening contact surface. Therefore, it is possible to smoothly prepare for the temperature measuring portion of the temperature sensor to be fastened to the temperature measuring anchoring portion.
  • oxidation of the surface can be suppressed even if the temperature is raised and cooled repeatedly, and the durability can be improved.
  • thermocouple It is a perspective view of a heater chip unit. It is explanatory drawing of the heater chip, (a) is a plan view, (b) is a front view, (c) is a bottom view, (d) is a side view. It is explanatory drawing of the temperature measuring stop part of a heater chip, (a) is a front view, (b) is a sectional view. It is explanatory drawing of the procedure of attaching a thermocouple to a heater chip, (a) is a state before inserting a thermocouple into a heater chip, (b) is a state after inserting a thermocouple into a heater chip, (c).
  • the heater chip unit 1 includes a plate-shaped heater chip 2 for thermocompression bonding the terminal lead wire A to the terminal member B (see FIG. 2D), and a heater as a temperature sensor. It is configured to include a thermocouple 3 attached to the chip 2.
  • the heater chip 2 is a chip formed by processing a plate material of a conductive material (tungsten, molybdenum, cemented carbide, etc.) by wire electric discharge machining, and as shown in FIG. 2, the lower portion (work) of the heater chip 2 is formed.
  • a trowel portion 6 (a tip portion located on the terminal lead wire A and a terminal member B) side) and a pair of left and right connecting arm portions 7 as an upper portion (base portion). Then, when the iron portion 6 is energized via the connecting arm portion 7, the iron portion 6 can generate heat by electric resistance, and the temperature of the iron portion 6 can be measured by the thermocouple 3.
  • the iron portion 6 includes a horizontally long iron main body 11 that connects the lower portions of the connecting arm portions 7, and the width of the iron main body 11 (dimensions along the lateral direction in which the pair of connecting arm portions 7 are lined up) is set to the heater tip 2. It is set to gradually narrow toward the bottom. Further, a box-shaped iron tip portion 13 is projected downward from the bottom of the iron body 11 slightly protruding downward, and the bottom surface (tip surface) of the iron tip portion 13 is used as the iron tip surface 13a for terminals. It is possible to contact the conductor A.
  • thermocouple 3a is formed in the upper portion (connecting arm 7 side) of the iron body 11 opposite to the iron tip 13, and the temperature measuring contact of the thermocouple 3 is formed in the iron recess 15. (Temperature measuring unit) 3a is fixed. The configuration in which the temperature measuring contact 3a is fixed will be described in detail later.
  • the connecting arm portion 7 is a vertically long structural portion extending upward from the left and right ends of the iron body 11, and is provided with the connecting arm portions 7 separated from each other. Further, in the upper portion (extended end portion) of the connecting arm portion 7, a mounting hole 17 for mounting on the chip holder (not shown) of the thermocompression bonding device is penetrated in the plate thickness direction of the heater chip 2 and this mounting is performed. By screwing a mounting bolt (not shown) passed through the hole 17 into the tip holder, the heater tip unit 1 is mounted on the tip holder with the iron tip portion 13 facing downward.
  • one connecting arm 7 is electrically connected to one end of the heater power supply (not shown) of the thermocompression bonding device, and the other connecting arm 7 is connected. It is electrically connected to the other end of the heater power supply. Then, when a current is passed from the power supply (power supply for the heater) to the heater tip 2, the current flows into the iron body 11 via the connecting arm portion 7, and the iron body 11 generates heat due to the electric resistance in the iron body 11, and this The iron tip portion 13 is configured to raise the temperature by heat.
  • the current in the iron body 11 flows from one connecting arm portion 7 side to the other connecting arm portion 7 side, but in the path through which the current flows, the constricted portion located at the corner portion of the iron recess 15 is cut off. Since the area is smaller than the cross-sectional area of other parts, the current density is highest at this constricted part, and Joule heat due to electric resistance is likely to be generated around this part.
  • the heater chip 2 is provided in the left-right direction (one connecting arm) in a range extending from the lower portion of the connecting arm portion 7 to the iron body 11 on both the front and back surfaces of the heater chip 2.
  • Grooves 20 are extended as gouged portions in the present invention along the direction from the portion 7 to the other connecting arm portion 7, and the extending grooves 20 on the front and back sides form a thin-walled portion 21 to form a trowel tip portion. 13 is configured to project below the thin wall portion 21.
  • the thin-walled portion 21 is configured to be formed at a position away from the iron tip portion 13 (specifically, on the connecting arm portion 7 side of the iron tip portion 13).
  • the depth dimension of the groove 20 on the front and back is set to be the same, and the connecting arm portion 7 and the iron body 11 (thin wall portion 21) are set to be the same.
  • the center of each thickness direction of the iron tip portion 13 is configured to be located on the same plane, and the plate thickness of the iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7.
  • the surface of the thin wall portion 21 which is the bottom of the groove 20 is the side surface (front and back surface) of the iron body 11, and the plate thickness of the iron body 11 (plate thickness of the thin wall portion 21) is thinner than the plate thickness of the connecting arm portion 7.
  • the cross-sectional area of the iron body 11 (in other words, the cross-sectional area as a flow path through which a current flows) is set to be smaller than the cross-sectional area of the connecting arm portion 7.
  • the thickness t1 of the side surface of the iron body 11 is the thickness of the connecting arm portion 7 (specifically, the thickness of the connecting arm portion 7 excluding the thin-walled portion 21 (the portion of the connecting arm portion 7 that is separated from the thin-walled portion 21). (Thickness)) It is formed thinner than t2 (see FIGS. 1 and 2 (d)).
  • thermocouple 3 attached to the heater chip 2 and the configuration on the heater chip 2 for attaching the thermocouple 3 will be described.
  • the thermocouple 3 is a element having electrical insulation property by welding the tips of two types of strands 25 to each other to form a spherical temperature measuring contact (temperature measuring portion) 3a.
  • Each of the strands 25 is covered with the wire covering material 26, and further bundled into one by the covering of the outer covering material 27 to form the conducting wire 3b.
  • the conductor wire 3b includes the strand 25.
  • the diameter of the temperature measuring contact 3a and the diameter of the conducting wire 3b are set smaller than the plate thickness of the heater chip 2, respectively.
  • the storage portion of the conducting wire 3b is provided in the gap between the connecting arm portions 7, and the fastening portion of the temperature measuring contact 3a is provided in the iron portion 6.
  • the upper end portion opens a gap between the connecting arm portions 7 extending along the longitudinal direction of the connecting arm portions 7.
  • the conductor storage space 30 is set to a size (thickness, width) slightly larger than the wire diameter of the conductor 3b, and the conductor 3b (specifically, the temperature measuring contact 3a of the conductor 3b is closer to the temperature measuring contact 3a) in the conductor storage space 30.
  • the portion located in) is stored in a state where the conductor 3b does not protrude outward from each of the front and back surfaces of the heater chip 2. Then, the conductor 3b extends from the opening 30a at the upper end of the conductor storage vacant portion 30, and the lower end of the conductor storage vacant portion 30 is widened to communicate with the iron recess 15 (see FIG. 1).
  • each connecting arm portion 7 is formed with a part of the side surface facing the conductor storage vacant portion 30 cut out so as to communicate with the conductor storage vacant portion 30, and each stop recess 31 and the conductor storage vacant portion 30 are formed.
  • a part of the vacant portion 30 (a portion located between the fixing recesses 31) is provided with a conducting wire fixing portion 32 which is cured (solidified) after injecting a resin such as an ultraviolet curable resin or a thermosetting resin.
  • the conductor 32 prevents the conductor 3b from shifting from the conductor accommodating empty portion 30 and protruding from the heater chip 2.
  • the temperature measuring contact 3a of the thermocouple 3 is fastened to the portion facing the end (lower end) of the conducting wire accommodating empty portion 30.
  • the 35 is provided in a state of protruding toward the upper connecting arm portion 7.
  • the temperature measuring fastening portion 35 is a protrusion portion that protrudes from the iron tip portion 13 on the opposite side of the iron body 11 and is formed to be slightly smaller than the iron tip portion 13.
  • the portion facing the conductor storage vacant portion 30 (the upper portion of the temperature measuring vacant portion 35) is provided with a pair of fastening contact surfaces 35a to which the temperature measuring contact 3a contacts, and the end of the conducting wire accommodating vacant portion 30.
  • each of the fastening contact surfaces 35a is formed on a flat surface, a V-shaped recess 36 is formed in the upper portion of the temperature measuring fastening portion 35 (the upper portion on the side of the lead wire storage vacant portion 30), and the inside of the recess 36 is formed.
  • the temperature measuring contact 3a is received and brought into contact with the fastening contact surface 35a, and the temperature measuring contact 3a is fastened to the iron portion 6 (temperature measuring fastening portion 35) by welding or the like in this state.
  • thermocouple 3 a procedure for manufacturing the heater chip unit 1, particularly a procedure for attaching the thermocouple 3 to the heater chip 2
  • the heater chip 2 and the thermocouple 3 separately prepared in advance are arranged so that the opening 30a of the conductor storage space 30 and the temperature measuring contact 3a face each other.
  • the attitudes of the heater chip 2 and the thermocouple 3 are set, and the temperature measuring stop 35, the lead wire storage empty section 30, the temperature measuring contact 3a, and the conducting wire 3b are arranged in this order on the same straight line.
  • the thermocouple 3 is inserted into the opening 30a of the lead wire storage space 30 of the heater chip 2 with the temperature measuring contact 3a at the head.
  • the side surface of the connecting arm portion 7 serves as a guide to guide the thermocouple 3 to the iron portion 6 side.
  • the temperature measuring contact 3a enters the iron recess 15 after passing through the conductor accommodating empty portion 30.
  • the iron portion 6 is provided with a temperature measuring fastening portion 35 at a position facing the lower end portion (open end portion on the iron portion 6 side) of the conductor storage empty portion 30. Since the V-shaped fastening contact surface 35a faces the end of the conductor accommodating empty portion 30, the temperature measuring contact 3a that has entered the iron recess 15 reaches the temperature measuring fastening portion 35 and makes a fastening contact. Contact (contact) with the surface 35a. In this way, the temperature measuring contact 3a can be easily and surely brought into contact with the fastening contact surface 35a (temperature measuring fastening portion 35). Therefore, it is possible to smoothly prepare for anchoring the temperature measuring contact 3a to the temperature measuring anchoring portion 35.
  • the conducting wire 3b is pressed toward the temperature measuring anchoring portion 35 to maintain the contact of the temperature measuring anchoring portion 35 with the fastening contact surface 35a, and in this state, the temperature measuring anchoring portion 35 and the fastening contact surface 35a are maintained.
  • the fastening contact surface 35a is heated by irradiating it with a laser, and the temperature measuring contact 3a is melted by this heat to be fastened (welded).
  • the temperature measuring anchoring portion 35 is set so that the separation distance between the anchoring contact surfaces 35a gradually expands from the iron portion 6 side toward the upper side. , The temperature measuring contact 3a can be sufficiently brought into contact with the temperature measuring anchoring portion 35.
  • the heater chip unit 1 capable of good adhesion of the temperature measuring contact 3a to the heater chip 2 and thus good temperature measurement.
  • the fastening contact surface 35a is formed of a flat surface and the temperature measuring contact 3a is formed of a spherical body, the temperature measuring contact 3a easily makes point contact with the fastening contact surface 35a. Further, by pressing the temperature measuring contact 3a against the fastening contact surface 35a, stress is easily concentrated and the temperature measuring contact 3a is difficult to float from the fastening contact surface 35a. As a result, the temperature measuring contact 3a can be more satisfactorily attached to the heater chip 2, and thus the temperature of the heater chip 2 can be measured more satisfactorily.
  • a part of the lead wire storage empty portion 30 (a portion located between the stopping recesses 31) and each stop.
  • a resin such as an ultraviolet curable resin or a thermosetting resin is injected into the concave portion 31 in a state before curing (flow state) to fill the recesses, and then a resin curing treatment such as ultraviolet irradiation or heating is performed to cure the resin and stop the wire. It is referred to as a part 32.
  • the lead wire 3b of the thermocouple 3 is housed in the lead wire storage empty portion 30, the lead wire 3b of the thermocouple 3 is the heater chip. It is possible to avoid protruding from the range of the plate thickness of 2. Therefore, when handling the heater chip unit 1 such as mounting work on a thermocompression bonding device, or when entering the work area of the heater chip unit 1, the inconvenience of inadvertently hooking the lead wire 3b, and eventually the thermocouple from the heater chip 2. It is unlikely that the inconvenience of 3 falling off will occur.
  • the heater chip units 1 when a plurality of heater chip units 1 are to be put together at the time of transportation (shipment) or storage, the heater chip units 1 can be stably stacked without any trouble, and the transportation work and the storage work can be performed without delay. be able to.
  • the conductor storage vacant portion 30 is provided with the conductor stopper portion 32, it is possible to prevent the inconvenience that the stored conductor wire 3b comes off from the conductor storage vacant portion 30. Further, since the resin injected into the conductor storage space 30 and cured is used as the conductor stopper 32, it is easy to insert the resin into the gap between the connecting arm 7 and the conductor 3b as the conductor stopper 32, and the conductor 3b is sufficiently inserted. Can be stopped at.
  • the conductor retaining portion 31 is provided with the retaining recess 31 communicating with the conducting wire accommodating vacant portion 30, and the resin which is the conducting wire retaining portion 32 is injected into the conducting wire accommodating vacant portion 30 and the retaining recess 31 to be cured, the conducting wire retaining portion 32 accommodates the conducting wire. It becomes difficult to fall off from the vacant portion 30, and it is possible to suppress the inconvenience that the conductor 3b is detached from the conductor storage vacant portion 30 together with the conductor stop portion 32.
  • thermocompression-bonding the terminal lead wire A to the terminal member B using the heater chip unit 1 first, the heater chip unit 1 is placed on the chip holder of the thermocompression bonding device with the iron tip portion 13 on the lower side. Attached, the lead wire 3b of the thermocouple 3 is connected to the thermocouple connection terminal (not shown) of the thermocompression bonding device. After that, the terminal member B and the terminal lead wire A are set in a work area (none of which is shown) provided below the chip holder, and the terminal lead wire A is placed on the upper surface of the terminal member B.
  • the heater tip unit 1 When the terminal member B and the terminal lead wire A are set, the heater tip unit 1 is lowered together with the tip holder to press the iron tip portion 13 against the terminal lead wire A, and further, the iron main body is energized by energizing the heater tip 2. 11 is heated, and the terminal lead wire A is thermocompression bonded to the terminal member B. Further, the temperature of the iron portion 6 is measured by the thermocouple 3, and the control unit (not shown) of the thermocompression bonding device controls the energization of the heater chip 2 based on this measured value, and further controls the temperature of the iron tip portion 13. I do.
  • the plate thickness of the iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7, and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7. Therefore, even if the plate thickness of the heater chip 2 is increased, it is possible to suppress the inconvenience that the current density in the iron body 11 decreases and the heat generation becomes insufficient. Therefore, it is easy to realize good heat generation efficiency regardless of the increase or decrease in the plate thickness of the heater tip 2. Further, it is possible to avoid an increase in the volume of the iron body 11 and an increase in the heat capacity, and it is easy to quickly cool the iron body 11 and the iron tip portion 13.
  • the groove 20 extends from the lower part of the connecting arm portion 7 to the iron body 11 to form the thin-walled portion 21, the surface of the thin-walled portion 21 which is the bottom of the groove 20 is the side surface of the iron body 11. , The structure of the heater tip 2 in which the plate thickness of the iron body 11 is thinner than the plate thickness of the connecting arm portion 7 can be easily realized.
  • the iron tip portion 13 is projected below the thin-walled portion 21, if foreign matter (insulation coating of the terminal lead wire A, etc.) adheres to the iron tip portion 13 due to thermocompression bonding work, the iron tip portion 13 It is easy to remove foreign matter by polishing the tip. Further, it is possible to sufficiently secure a polishing allowance for the tip of the iron tip portion 13, and it is possible to prolong the replacement cycle (use life) of the heater tip unit. Then, the thin-walled portion 21 was formed on the connecting arm portion 7 side of the iron tip portion 13, and the thickness of the side surface of the iron body 11 was formed to be thinner than the thickness of the connecting arm portion 7 excluding the thin-walled portion 21.
  • the thin-walled portion 21 is formed at a position separated from the iron tip portion 13 and the plate thickness of the iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7, the plate thickness of the iron tip portion 13 is set to the connecting arm. It is not necessary to increase or decrease the thickness with respect to the plate thickness of the portion 7, and the heater tip 2 can be easily manufactured.
  • thermocouple 3 is attached to the iron portion 6 of the heater chip 2 as a temperature sensor, it is possible to acquire the temperature information of the iron portion 6 and utilize it for controlling the heat generation of the heater chip 2.
  • the temperature sensor can be realized with a simple configuration.
  • the iron body 11 is configured by extending the grooves 20 on both the front and back surfaces of the heater tip 2 to form the thin-walled portion 21, but the present invention is not limited to this.
  • the plate thickness of the iron body 11 is thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7, any mode of iron is used.
  • the main body 11 may be provided on the heater chip 2.
  • the iron body 11 may be formed by extending the groove on either the front surface or the back surface of the heater tip 2 to form the thin-walled portion 21.
  • the iron main body 11 is located unevenly on either the front or the back of the heater tip 2, which causes a bending moment in the heater tip 2 during thermocompression bonding work. Therefore, the connecting arm portion 7 and the iron main body 11. It is preferable to adopt a configuration in which the center of each thickness direction of the iron tip portion 13 is located on the same plane, that is, the configuration of the above embodiment.
  • the iron body 11 may be configured to include a portion having the highest electric resistance value (a portion serving as a heat generating portion). Therefore, the region for thinning by the groove or the like may extend to the inside of the connecting arm portion 7, and may not necessarily be the entire area of the iron body 11.
  • the plate thickness of the iron tip portion 13 and the plate thickness of the connecting arm portion 7 are set to the same dimensions, but the present invention is not limited to this.
  • the plate thickness of the iron tip portion 13 is cut to be thinner than the plate thickness of the connecting arm portion 7, the degree of freedom in the plate thickness dimension of the iron tip portion 13 can be increased, and the work to be subjected to thermocompression bonding treatment ( It is easy to design the heater chip 2 corresponding to the size of the terminal member B and the terminal lead wire A).
  • the temperature measuring fastening portion 35 is configured to be slightly smaller than the iron tip portion 13, but the present invention is not limited to this.
  • the volume of the iron tip portion 13 and the volume of the temperature measuring anchoring portion 35 are aligned so as to avoid an extremely different difference between the heat capacity of the iron tip portion 13 and the heat capacity of the temperature measuring anchoring portion 35. Then, it is possible to synchronize the temperature change in the temperature measuring stop 35 with the temperature change in the iron tip 13, and the iron tip 13 is based on the temperature measurement of the temperature measuring stop 35. Easy to carry out temperature control.
  • the fastening contact surface 35a of the temperature measuring fastening portion 35 is configured by a flat surface, but the present invention is not limited to this.
  • the fastening contact surface 35a may be formed of a curved surface as long as the separation distance between the fastening contact surfaces 35a is set to gradually expand from the iron portion 6 side toward the upper side. If the temperature measuring contact (temperature measuring unit) 3a can be sufficiently contacted with the fastening contact surface 35a, the temperature measuring contact 3a is not limited to being formed into a spherical shape, and is formed in any shape. You may. Further, the temperature measuring contact 3a of the thermocouple 3 and the temperature measuring fastening portion 35 are welded and fastened, but the present invention is not limited to this.
  • the fastening mode between the temperature measuring contact 3a and the temperature measuring fastening portion 35 does not matter.
  • the temperature measuring contact 3a and the temperature measuring fastening portion 35 may be fastened using a fastener (adhesive) having good heat conduction.
  • the conductor storage empty portion 30 is provided so as to extend linearly along the longitudinal direction of the connecting arm portion 7, but the present invention is not limited to this.
  • any form of the conductor storage vacant portion 30 may be applied as long as the configuration is such that the conductor 3b of the thermocouple 3 can be stored.
  • a conductor storage vacant portion 30 extending in a curved line shape or a curved line shape may be applied.
  • a resin such as an ultraviolet curable resin or a thermosetting resin is exemplified as the lead wire stopper 32 in the present invention, the present invention is not limited to this.
  • the mode of the conductor stop portion 32 does not matter.
  • a cap that can be fitted to the conductor storage vacant portion 30 may be adopted as the conductor stopper, or a protrusion that is integrally molded with the connecting arm portion 7 and protrudes toward the conductor storage vacant portion 30 may be used as the conductor stopper. May be adopted as.
  • the retaining recess 31 communicating with the conductor storage vacant portion 30 is configured by a shallow notch on the side surface of the conductor storage vacant portion 30, but the present invention is not limited to this.
  • any embodiment of the configuration of the fixing recess 31 may be adopted.
  • groove-shaped retaining recesses are formed on both the front and back surfaces of the connecting arm portion 7, and the end portion of the retaining recess is communicated with the conducting wire storage empty portion 30 so that the resin (conductor retaining portion 32) is transmitted from the conducting wire storage empty portion 30. It may be configured to be injected over the retaining recess.
  • thermocouple 3 is exemplified as the temperature sensor of the present invention, and the temperature measuring contact 3a of the thermocouple 3 is exemplified as the temperature measuring unit of the present invention, but the present invention is not limited thereto.
  • the temperature sensor is capable of measuring the temperature of the iron portion 6 and is configured to have the temperature measuring portion at the end of the conducting wire 3b, any form of the temperature sensor is adopted for the heater tip 2. It may be attached.
  • the groove 20 is exemplified as the gouged portion in the present invention, but the present invention is not limited to this.
  • the heater chip 2'of the second embodiment shown in FIGS. 5 and 6 is basically the same as the above embodiment (first embodiment), but only on both the front and back sides of the heater chip 2'. The difference is that the lower half of the heater tip 2'is bifurcated by forming a gouge in the middle part of the heater tip 2'in the plate thickness direction, which has two iron bodies. ..
  • the heater chip 2' is located in the middle portion in the plate thickness direction of the iron portion 6'located below the heater chip 2'in the left-right direction (from one connecting arm 7 to the other connecting arm).
  • the iron space portion 40 extending along the portion 7) is formed as a hollow portion, and the iron space portion 40 is opened downward.
  • the iron main body 11 and the iron tip portion 13 are provided on both the front and back sides of the heater tip 2'with the iron space portion 40 interposed therebetween.
  • the iron portion 6'of the heater tip 2'in includes two iron main bodies 11 that are separated from each other and two iron tip portions 13 that are separated from each other.
  • each iron body 11 is provided with a trowel recess 15 in which a groove 20 is formed on the outer surface, a groove 20'is also formed on the inner surface, and the temperature measuring fixing portion 35 is projected.
  • the temperature measuring contact (temperature measuring part) 3a of the thermocouple 3 can be fixed to each temperature measuring fixing part 35, and in each iron tip part 13, the plate thickness of the iron tip part 13 is connected to the connecting arm part 7. It is set thinner than the plate thickness.
  • the two trowel tip portions 13 can simultaneously perform thermocompression bonding at two locations, thereby improving the efficiency of the thermocompression bonding work. can. Further, by setting the dimensions of the iron space portion 40 in the plate thickness direction, the separation distance (pitch) between the two iron tip portions 13 and the size of the iron tip surface 13a of each iron tip portion 13 can be adjusted according to the work. Can be done.
  • an oxidation-resistant coating layer may be formed on the surface of the heater chip to enhance the oxidation resistance.
  • the oxidation resistant coating layer will be described.
  • the surface is easily oxidized, and the oxidation is particularly remarkable in the vicinity of the iron portion 6 (heating portion) and the portion where the thermocouple 3 is welded. ..
  • the oxidized part near the heat generating part is peeled off and the strength is lowered, which causes a problem of damage during pressurization.
  • the welded part of the thermocouple is corroded and the strength is lowered, and finally the thermoelectric is generated. Inconveniences such as the pair being separated and unable to be used occur.
  • an oxidation-resistant coating layer is formed on the surface of the heater chip to improve the oxidation resistance.
  • the manufacturing process will be specifically described.
  • the metal plate used as the material (base material) specifically, it is superior in abrasion resistance to the conventionally generally used tungsten (hardness HV430) and tungsten alloy (hardness HV200-400). It is desirable to use so-called cemented carbide (hardness HV900-2400) (official name; cemented carbide, alloy obtained by sintering hard metal carbide powder), and this cemented carbide plate is made into a predetermined shape by wire cutting. break the ice.
  • the cut pieces are subjected to pre-plating treatment, and then immersed in a melting tank and energized to form an oxidation-resistant coating layer made of nickel on the surface of the cut pieces, that is, nickel plating is performed. After that, it is withdrawn from the melting tank and subjected to post-treatment such as washing. Then, in the same manner as in the above-described embodiment, the temperature measuring contact 3a of the thermocouple 3 is laser-welded to the temperature measuring fastening portion 35. In this welding, since the coating of the nickel layer is formed on the surface of the temperature measurement fixing portion 35 (the fixing contact surface 35a), the wettability is enhanced, thereby improving the certainty of welding and the welding strength.
  • the output of the laser can be suppressed more than before, and the damage to the base metal can be suppressed, so that the quality can be improved and the energy consumption can be saved.
  • the heater chip unit 1 equipped with the thermocouple 3 is immersed in the electrolytic solution, and the entire surface including the temperature measuring contact 3a of the thermocouple 3 is covered. Apply nickel plating.
  • the oxidation resistance is improved, so that it is possible to suppress peeling and strength decrease due to oxidation of the iron portion 6 and the attachment portion of the thermocouple 3.
  • Durability can be improved.
  • nickel plating is applied to the base material using a cemented carbide, the wettability is improved, the weldability can be improved, and the durability can be surely improved.
  • the main component of the thermocouple is nickel, nickel plating has a good affinity.
  • the oxidation resistant film is not limited to nickel plating, and may be, for example, gold plating.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Resistance Heating (AREA)

Abstract

La présente invention concerne une unité de pointe d'appareil de chauffage dans laquelle une section de mesure de température d'un capteur de température peut être amenée à entrer en contact de manière satisfaisante avec un emplacement au niveau duquel une pointe d'appareil de chauffage est fixée. En particulier, la présente invention concerne une unité de pointe d'appareil de chauffage (1) dans laquelle un thermocouple (3) est fixé à une pointe d'appareil de chauffage en forme de plaque (2) pour une liaison par thermocompression d'un fil conducteur de borne à un élément de borne, dans laquelle : la pointe d'appareil de chauffage (2) est dotée d'une section de fer (6) dans laquelle un corps de fer (11) est doté d'une section de pointe de fer (13) qui vient en butée contre le fil conducteur de borne, une paire de bras de raccordement (7) qui s'étendent, à partir de sections d'extrémité gauche et droite du corps de fer (11), vers le haut et à l'opposé l'un de l'autre et qui chauffent la section de fer (6) par le passage d'un courant d'une source d'alimentation au corps de fer (11), et une section de fixation de mesure de température (35) qui est disposée sur la section de fer (6) et sur laquelle des contacts de mesure de température (3a) du thermocouple sont fixés ; la section de fixation de mesure de température (35) est dotée d'une paire de surfaces de contact de fixation (35a) qui entrent en contact avec les contacts de mesure de température (3a) ; et la distance séparant les surfaces de contact de fixation (35a) est définie de manière à augmenter progressivement vers le haut à partir du côté de section de fer (6).
PCT/JP2021/027196 2020-09-09 2021-07-20 Unité de pointe d'appareil de chauffage WO2022054421A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
MYPI2022004865A MY196583A (en) 2020-09-09 2021-07-20 Heater Chip Unit
CN202180027313.4A CN115461180A (zh) 2020-09-09 2021-07-20 加热嘴单元
KR1020227030266A KR20220130802A (ko) 2020-09-09 2021-07-20 히터 칩 유닛

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020151045A JP7137237B2 (ja) 2020-09-09 2020-09-09 ヒーターチップユニット
JP2020-151045 2020-09-09

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WO2022054421A1 true WO2022054421A1 (fr) 2022-03-17

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KR (1) KR20220130802A (fr)
CN (1) CN115461180A (fr)
MY (1) MY196583A (fr)
TW (1) TW202211744A (fr)
WO (1) WO2022054421A1 (fr)

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CN115889928B (zh) * 2022-12-15 2023-09-05 东莞顺为半导体有限公司 一种焊头结构及焊头温度补偿方法

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JPS586773A (ja) * 1981-06-29 1983-01-14 ク−パ−・インダストリ−ズ・インコ−ポレイテツド ハンダ付け及びハンダ除去用こて先き、及びその製造方法
JP2018012200A (ja) * 2016-07-19 2018-01-25 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法

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JP3968205B2 (ja) 2000-03-30 2007-08-29 太陽誘電株式会社 熱圧着用ヒーターチップ及びその製造方法
JP4224050B2 (ja) * 2005-10-31 2009-02-12 日本アビオニクス株式会社 ヒーターチップの熱電対取付構造および熱電対取付方法
KR20120004484A (ko) * 2009-03-27 2012-01-12 에이티에스 오토메이션 툴링 시스템즈 인코포레이티드 열극, 이를 위한 클램핑 배치, 및 제조 방법
JP2010253503A (ja) * 2009-04-23 2010-11-11 Miyachi Technos Corp ヒータチップ及び接合装置
JP5457107B2 (ja) * 2009-05-19 2014-04-02 ミヤチテクノス株式会社 ヒータチップ及び接合装置
JP2012183552A (ja) * 2011-03-04 2012-09-27 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法
WO2017038282A1 (fr) * 2015-08-28 2017-03-09 株式会社工房Pda Puce d'élément chauffant, dispositif de liaison, et procédé de liaison
JP6677406B2 (ja) * 2015-09-25 2020-04-08 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法

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JPS586773A (ja) * 1981-06-29 1983-01-14 ク−パ−・インダストリ−ズ・インコ−ポレイテツド ハンダ付け及びハンダ除去用こて先き、及びその製造方法
JP2018012200A (ja) * 2016-07-19 2018-01-25 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法

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JP7137237B2 (ja) 2022-09-14
MY196583A (en) 2023-04-19
JP2022045444A (ja) 2022-03-22
CN115461180A (zh) 2022-12-09
TW202211744A (zh) 2022-03-16

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