TW202211744A - 加熱嘴單元 - Google Patents

加熱嘴單元 Download PDF

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Publication number
TW202211744A
TW202211744A TW110133049A TW110133049A TW202211744A TW 202211744 A TW202211744 A TW 202211744A TW 110133049 A TW110133049 A TW 110133049A TW 110133049 A TW110133049 A TW 110133049A TW 202211744 A TW202211744 A TW 202211744A
Authority
TW
Taiwan
Prior art keywords
soldering iron
temperature
lead wire
fixing
heater
Prior art date
Application number
TW110133049A
Other languages
English (en)
Chinese (zh)
Inventor
須賀伸一郎
Original Assignee
日商阿波羅技研股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商阿波羅技研股份有限公司 filed Critical 日商阿波羅技研股份有限公司
Publication of TW202211744A publication Critical patent/TW202211744A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
TW110133049A 2020-09-09 2021-09-06 加熱嘴單元 TW202211744A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-151045 2020-09-09
JP2020151045A JP7137237B2 (ja) 2020-09-09 2020-09-09 ヒーターチップユニット

Publications (1)

Publication Number Publication Date
TW202211744A true TW202211744A (zh) 2022-03-16

Family

ID=80632533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110133049A TW202211744A (zh) 2020-09-09 2021-09-06 加熱嘴單元

Country Status (6)

Country Link
JP (1) JP7137237B2 (fr)
KR (1) KR20220130802A (fr)
CN (1) CN115461180A (fr)
MY (1) MY196583A (fr)
TW (1) TW202211744A (fr)
WO (1) WO2022054421A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115889928B (zh) * 2022-12-15 2023-09-05 东莞顺为半导体有限公司 一种焊头结构及焊头温度补偿方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424930A (en) * 1981-06-29 1984-01-10 Cooper Industries, Inc. Carbon-based soldering and de-soldering tip and method of manufacturing same
US5297716A (en) * 1993-04-12 1994-03-29 Honeywell Inc. Soldering tool with attached thermocouple
JP3968205B2 (ja) 2000-03-30 2007-08-29 太陽誘電株式会社 熱圧着用ヒーターチップ及びその製造方法
JP4224050B2 (ja) * 2005-10-31 2009-02-12 日本アビオニクス株式会社 ヒーターチップの熱電対取付構造および熱電対取付方法
KR20120004484A (ko) * 2009-03-27 2012-01-12 에이티에스 오토메이션 툴링 시스템즈 인코포레이티드 열극, 이를 위한 클램핑 배치, 및 제조 방법
JP2010253503A (ja) * 2009-04-23 2010-11-11 Miyachi Technos Corp ヒータチップ及び接合装置
JP5457107B2 (ja) * 2009-05-19 2014-04-02 ミヤチテクノス株式会社 ヒータチップ及び接合装置
JP2012183552A (ja) * 2011-03-04 2012-09-27 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法
US10799977B2 (en) * 2015-08-28 2020-10-13 Kobo Pda Co., Ltd. Heater chip, joining apparatus and joining method
JP6677406B2 (ja) * 2015-09-25 2020-04-08 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
JP6851610B2 (ja) * 2016-07-19 2021-03-31 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法

Also Published As

Publication number Publication date
MY196583A (en) 2023-04-19
JP7137237B2 (ja) 2022-09-14
WO2022054421A1 (fr) 2022-03-17
CN115461180A (zh) 2022-12-09
KR20220130802A (ko) 2022-09-27
JP2022045444A (ja) 2022-03-22

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