WO2022052232A1 - 偏光片的定位切割系统及提高偏光片贴合精度的方法 - Google Patents

偏光片的定位切割系统及提高偏光片贴合精度的方法 Download PDF

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WO2022052232A1
WO2022052232A1 PCT/CN2020/124090 CN2020124090W WO2022052232A1 WO 2022052232 A1 WO2022052232 A1 WO 2022052232A1 CN 2020124090 W CN2020124090 W CN 2020124090W WO 2022052232 A1 WO2022052232 A1 WO 2022052232A1
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Prior art keywords
cutting
oca
film
laser
polarizer
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PCT/CN2020/124090
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English (en)
French (fr)
Inventor
唐浩成
寇振
陈高峰
朱宇杰
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太仓展新胶粘材料股份有限公司
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Publication of WO2022052232A1 publication Critical patent/WO2022052232A1/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms

Definitions

  • the invention relates to the technical field of bonding and processing of polarizers, in particular to a positioning and cutting system for polarizers and a method for improving the bonding accuracy of polarizers.
  • ultra-narrow bezel will further narrow the traditional display frame, further expand the area of the effective display area (ActiveArea, AA), and then achieve a higher-level visual experience and product design aesthetics under the limited total product size.
  • the polarizer is still limited to the bonding accuracy of ⁇ 0.1mm in the current bonding process of the polarizer and the OCA film.
  • the accuracy is about to be unsatisfactory. Require. Therefore, it is urgent to develop a new lamination process to break through the current lamination accuracy bottleneck.
  • the purpose of the present invention is to provide a positioning and cutting system for polarizers and a method for improving the lamination precision of polarizers.
  • the present invention adopts first lamination and then cutting.
  • the advanced technology improves the bonding accuracy of OCA film and polarizer in the product.
  • the first object of the present invention is to provide a positioning and cutting system for a polarizer.
  • One side surface of the polarizer is sequentially connected with an OCA film and a re-release film.
  • the positioning and cutting system includes:
  • OCA die-cutting processing unit which is used to cut the OCA film and the re-release film according to the preset shape and form a plurality of laser positioning marks on the re-release film;
  • OCA and polarizer bonding processing unit which is used for bonding OCA film and polarizer
  • laser cutting machine which is used for laser target grabbing cutting, OCA and polarizer lamination processing unit works before laser cutting machine
  • laser cutting machine includes laser cutting part and controller
  • laser cutting part includes vision target grabbing assembly and laser cutting Component
  • the visual target grasping component is used to identify the laser positioning mark and transmit the identified signal to the controller
  • the controller is used to send the cutting signal to the laser cutting part.
  • the release film is laser cut.
  • the OCA die-cutting processing unit is a die cutting device or a laser cutting device.
  • the OCA and polarizer laminating processing unit includes a roll-to-roll laminating machine or a film-to-film laminating machine.
  • the laser cutting machine is Han's/P5060 automatic laser cutting machine.
  • a polarizer release film is provided on the side surface of the polarizer away from the OCA film, which can protect against scratches, oil stains, and dust.
  • the second object of the present invention is to provide a method for improving the bonding accuracy of polarizers, using the above-mentioned positioning and cutting system of the present invention, comprising the following steps:
  • OCA die-cutting process provide OCA film and re-release film that are attached to each other, cut the OCA film and re-release film according to the preset shape, and form multiple laser positioning marks on the re-release film; After cutting, the OCA film covers a part of the surface of the re-release film; the laser positioning mark is located on the position of the re-release film that is not covered by the OCA film;
  • (2) OCA and polarizer lamination processing attach a polarizer to the surface of the OCA film away from the re-release film.
  • the polarizer includes a central area and an edge area set around the central area. The central area is attached to the OCA film and The shape matches, and the area of the edge area is larger than the area of the target edge area after laser cutting;
  • the laser cutting machine grasps and aligns the laser positioning marks and laser cutting, and cuts the polarizer, OCA film and re-release film into the target shape. During laser cutting, including laser cutting in the edge area The step of the target edge area, the target edge area is arranged around the central area.
  • step (1) the step of forming a plurality of laser positioning marks includes:
  • the edges of at least two corners of the re-release film are directly used as laser positioning marks.
  • the laser positioning mark cut out is in a cross shape or an L shape.
  • the laser positioning marks are in the shape of a cross.
  • the laser positioning marks provide positioning for the laser cutting in step (3).
  • the number of laser positioning marks is at least two, preferably two or four.
  • the number of laser positioning marks is two, they can be located at the two corners of the same side of the re-release film or at the opposite corners of the re-release film.
  • the number of laser positioning marks is four, the laser positioning marks are respectively Located at the four corners of the heavy release film. Most preferably, the number of laser positioning marks is four, so that the subsequent laser cutting precision can be higher.
  • step (1) a first light release film is provided on the side surface of the OCA film away from the heavy release film, and the first light release film is removed before the OCA die-cutting process.
  • a layer of release film that is lighter than the first release film is attached to the surface of the side of the OCA film away from the heavy release film. The second light release film with less force is removed when step (2) is required, or the second light release film is retained until the laser cutting is completed.
  • the laser positioning mark in step (1) is exposed outside the edge region in step (2).
  • a die cutting device can be used for die cutting or a laser cutting device can be used for laser cutting.
  • Preset shapes are processed for OCA film and re-release film.
  • a polarizer release film is provided on the side surface of the polarizer away from the OCA film, which can protect against scratches and the like.
  • a roll-to-roll laminating machine can be used for roll-to-roll lamination or a film-to-film laminating machine can be used for sheet-to-sheet lamination.
  • the so-called roll-to-roll lamination means that when the OCA film is cut into a roll, before the OCA film is finally cut into sheets, the rolled polarizer material is directly attached to it when it is still connected into a roll;
  • the lamination method belongs to online continuous lamination, which is characterized by high efficiency, and the length of the polarizer material is equivalent to that of the OCA material.
  • the so-called sheet-to-sheet lamination that is, after the OCA film is cut into separate sheets, or the OCA film itself is processed from the sheet, and then the polarizer is attached to it; the lamination method is online or offline.
  • the characteristics of the intermittent bonding are that the bonding timing and the size of the polarizer to be bonded are flexible and flexible, but the efficiency is low, and it is suitable for small batch production.
  • Step (2) does not require high lamination accuracy, just ensure that the area of the edge area of the polarizer after lamination is larger than the area of the target edge area after laser cutting; at the same time, the edge of the polarizer after lamination must not block the resemblance The laser positioning mark on the mold film, so as not to affect the subsequent marking alignment.
  • the width of the edge region is greater than 1 mm greater than the width of the target edge region, and the cut waste is easier to remove at this time.
  • step (3) the method for catching the mark and aligning comprises the following steps:
  • the corresponding position is lasered on the bottom plate of the laser cutting machine, and the physical positioning is made according to the unlearned laser positioning mark located on the diagonal line, and the two-point cutting method is used for laser cutting.
  • the laser power of the laser cutting is 2-3kW.
  • the laser power is adjusted according to the cutting conditions of the product, and it should meet the minimum power under the premise of ensuring the cutting, and reduce the focal edge phenomenon caused by the reflection of the bottom plate of the laser cutting.
  • the present invention has at least the following advantages:
  • the invention provides a positioning and cutting system for polarizers, and based on the system, provides a method for improving the bonding accuracy of polarizers.
  • the process of first bonding and then cutting is adopted to improve the two parts after bonding of the OCA film and the polarizer.
  • the dimensional accuracy of the positional relationship can reach ⁇ 0.05mm, which is greatly improved compared to the ⁇ 0.1mm accuracy of the traditional lamination process.
  • Fig. 1 is the process flow diagram of OCA film and polarizer bonding
  • Example 2 is a side cross-sectional view of the OCA film and the re-release film before die cutting in step (1) of Example 2;
  • Example 3 is a side cross-sectional view of the OCA film and the re-release film after die-cutting in step (1) of Example 2;
  • Example 4 is a side cross-sectional view of the OCA film and the polarizer after bonding in step (2) of Example 2;
  • Example 5 is a side cross-sectional view of the OCA film and the polarizer after laser cutting in step (3) of Example 2;
  • Fig. 6 is the structural representation of polarizer in the number a in Fig. 1;
  • Fig. 7 is the structural representation of polarizer in the number b in Fig. 1;
  • Fig. 8 is the dimension drawing after the OCA film and the polarizer are attached and laser cut;
  • 1-Re-release film 2-OCA film; 3-Light release film; 4-Polarizer; 5-Polarizer release film; 6-Laser positioning mark; 40-Central area; 41-Edge area; 42- target edge area.
  • a polarizer positioning and cutting system one side surface of the polarizer 4 is sequentially connected with an OCA film 2 and a re-release film 1, and the side surface of the polarizer 4 away from the OCA film 2 is provided with a polarizer release film 5, which can Protects against scratches.
  • Positioning cutting systems include:
  • the OCA die-cutting processing unit is used to cut the OCA film 2 and the re-release film 1 according to the preset shape and cut out a plurality of laser positioning marks 6 on the re-release film 1; the OCA die-cutting processing unit is a knife Die cutting device or laser cutting device.
  • the OCA and polarizer lamination processing unit is used for laminating the OCA film 2 and the polarizer 4; the OCA and polarizer lamination processing unit is a roll-to-roll laminating machine or a film-to-film laminating machine.
  • the OCA and polarizer lamination processing unit works before the laser cutting machine.
  • the laser cutting machine includes a laser cutting part and a controller.
  • the laser cutting part includes a visual target grasping component and a laser cutting component.
  • the visual target grasping component is used to identify the laser positioning mark 6 and transmit the identified signal to the controller.
  • the laser cutting component sends a cutting signal, and the laser cutting component performs laser cutting on the polarizer 4 , the OCA film 2 and the re-release film 1 according to the received cutting signal.
  • a method for improving the bonding accuracy of the OCA film 2 and the polarizer 4 is carried out by using the positioning and cutting system in Embodiment 1, and the steps are as follows:
  • (1) OCA die-cutting process Provide the OCA film 2 and the re-release film 1 which are attached to each other.
  • the surface of the OCA film 2 away from the re-release film 1 is provided with a light release film 3 (Fig. 2).
  • a plurality of laser positioning marks 6 are cut out on the re-release film 1 , preferably one laser positioning mark 6 is cut out at each of the four corners of the re-release film 1 .
  • the shape of the laser positioning mark 6 is a cross shape or an L shape, preferably a cross shape.
  • a layer of the release force of the light release film 3 is attached to the surface of the OCA film 2 away from the heavy release film 1 before the die cutting. Smaller yet another light release liner.
  • the cutting process of the OCA film 2 and the re-release film 1 if there is no part to be cut again in the subsequent process, it is directly cut according to the shape required by the final product. If the re-cutting part is involved in the subsequent process, for example, the polarizer 4, OCA film 2, and re-release film 1 need to be flush on one side of the product, it needs to be cut according to a larger shape than the final product.
  • the OCA film 2 covers a part of the surface of the re-release film 1, that is, the area of the OCA film 2 after cutting is smaller than the area of the re-release film 1, and the laser positioning mark 6 is located on the re-release film 1. The position covered by OCA film 2.
  • the polarizer 4 is bonded on the surface of the OCA film 2 away from the re-release film 1, and the polarizer 4 is provided with a polarizer release film 5 on the side surface of the polarizer 4 away from the OCA film 2 ( Figure 4), can play a protective role such as anti-scratch.
  • the polarizer 4 After lamination, the polarizer 4 includes a central area 40 and an edge area 41 arranged around the central area 40 , and the central area 40 is attached to the OCA film 2 and has a matching shape.
  • the area of the edge region 41 is larger than the area of the target edge region 42 after laser cutting.
  • the width of the edge region 41 is greater than 1 mm greater than the width of the target edge region 42, and the cut waste edges are easier to remove.
  • a roll-to-roll laminating machine is used for roll-to-roll lamination or a film-to-film laminating machine is used for sheet-to-sheet lamination.
  • the so-called roll-to-roll lamination that is, when the OCA film 2 is cut into a roll, before the OCA film 2 is finally cut into sheets, the rolled polarizer 4 material is directly attached to it when it is still connected into a roll. superior.
  • the so-called sheet-to-sheet bonding means that after the OCA film 2 is cut into separate sheets, or the OCA film 2 itself is processed from the sheet, the polarizer 4 is then bonded thereon.
  • the laser cutting machine grasps and aligns the laser positioning marks 6 on the film of the re-release film 1 and laser cutting, so as to cut the laminated product of the polarizer 4 and the OCA film into the external dimensions of the final product , the laser positioning marks 6 on the re-release film 1 are cut off or retained according to the final product requirements ( Figure 5).
  • the method of grabbing the target alignment is as follows:
  • the CCD function of the laser cutting machine is turned on, move the lens to the first laser positioning mark 6 of the re-release film 1, adjust the focus mode to make the target clear, learn the shape of the target, and capture and save the coordinates of the first point in the CCD module, select the drawing To locate the corresponding target of the drawing, make the drawing target consistent with the learned target coordinates, and use the same operation method to learn the third laser positioning mark 6 at the diagonal of the first laser positioning mark 6.
  • the corresponding position is lasered on the bottom plate of the laser machine, and the physical positioning is performed according to the second and fourth laser positioning marks 6 that are not studied and located on the diagonal.
  • the CCD two-point cutting method is selected, and the machine is started for cutting.
  • the cutting drawing is moved relative to the target, so that the cutting precision is higher.
  • the laser power is adjusted according to the cutting conditions of the product, and it should meet the minimum power under the premise of ensuring the cutting, and reduce the focal edge phenomenon caused by the reflection of the bottom plate of the laser cutting.
  • A represents the width of the OCA film
  • B represents the width of the polarizer
  • C represents the distance between the edge of the OCA film and the edge of the polarizer along the length of the OCA film
  • D represents the length of the OCA film
  • E represents the polarizer The length of the sheet
  • F represents the distance between the edge of the OCA film and the edge of the polarizer in the width direction of the OCA film.
  • Ca represents the accuracy of the process, which reflects the positional relationship (central tendency).
  • the average value in Table 1 is X;
  • the center value of the standard value in Table 1 is U, as in Table 1, the standard value corresponding to letter A is 76.57 ⁇ 0.05, so the U value corresponding to letter A is 76.57;
  • T represents Specification tolerance, that is, the value obtained by subtracting the lower limit from the upper limit in Table 1.
  • Cp represents the precision of the process, which reflects the dispersion relationship (discrete trend).
  • Cpk stands for Process Capability Index, which is a quantitative reflection of the level of a certain project or process, and is also a type of index for engineering evaluation.
  • the two dimension standards C and F can be well controlled within the tolerance of ⁇ 0.05mm.
  • the conventional process post-lamination process
  • the current limit can only meet the tolerance of ⁇ 0.1mm.
  • a method for improving the bonding accuracy of the OCA film 2 and the polarizer 4 is carried out by using the positioning and cutting system in the embodiment 1, and the steps are the same as those in the embodiment 2, and the differences are:
  • Step (2) When the polarizer 4 is attached to the surface of the side of the OCA film 2 away from the re-release film 1, a film-to-film laminating machine is used to perform sheet-to-sheet lamination. Before step (2), in order to protect the adhesive surface of the OCA film 2, a layer of light release film 3 is attached to the surface of the side of the OCA film 2 away from the heavy release film 1. When step (2) is required, The light release film 3 is then removed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
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Abstract

一种偏光片(4)的定位切割系统及提高偏光片(4)贴合精度的方法,提高偏光片(4)贴合精度的方法包括以下步骤:OCA模切加工:按照预设的形状裁切OCA膜(2)和重离型膜(1)并在重离型膜(1)上裁切出多个激光定位记号(6);裁切后,OCA膜(2)覆盖一部分重离型膜(1)的表面;激光定位记号(6)位于重离型膜(1)上未被OCA膜(2)覆盖的位置;OCA膜(2)与偏光片(4)贴合加工:在OCA膜(2)远离重离型膜(1)的一侧表面贴合偏光片(4);激光切割:激光切割机对激光定位记号(6)进行抓标对位并激光切割,将偏光片(4)、OCA膜(2)和重离型膜(1)切割成目标形状。采用先贴合后切割的工艺提高产品中的OCA膜(2)和偏光片(4)的贴合精度。

Description

偏光片的定位切割系统及提高偏光片贴合精度的方法 技术领域
本发明涉及偏光片的贴合加工技术领域,尤其涉及一种偏光片的定位切割系统及提高偏光片贴合精度的方法。
背景技术
近年来由于人们对中小尺寸显示屏的屏占比的极致追求,除了折叠屏技术以外,主流的屏幕厂商纷纷推出超窄边框的显示产品。顾名思义,超窄边框即将传统的显示屏边框进一步缩窄,进一步的扩大有效显示区域(ActiveArea,AA)的面积,进而在有限的产品总尺寸下,达到更高阶的视觉体验和产品设计美感。
为满足超窄边框显示屏边框宽度越来越小的设计要求,对于显示屏各组成部件的产品尺寸精度和贴合精度都提出的更高的要求。偏光片作为显示屏的重要组成部分之一,目前的偏光片与OCA膜的贴合工艺还局限于±0.1mm级别的贴合精度,对于日益缩窄的屏幕边框而言,其精度即将无法满足要求。由此亟需开发新的贴合工艺来突破目前的贴合精度瓶颈。
发明内容
为解决现有的后贴合工艺的贴合精度低的技术问题,本发明的目的是提供一种偏光片的定位切割系统及提高偏光片贴合精度的方法,本发明采用先贴合后切割的工艺提高产品中的OCA膜和偏光片的贴合精度。
本发明的第一个目的是提供一种偏光片的定位切割系统,偏光片的一侧表面依次连接有OCA膜和重离型膜,定位切割系统包括:
OCA模切加工单元,其用于按照预设的形状裁切OCA膜和重离型膜并在重离型膜上形成多个激光定位记号;
OCA与偏光片贴合加工单元,其用于将OCA膜和偏光片进行贴合;
以及激光切割机,其用于激光抓靶切割,OCA与偏光片贴合加工单元先于激光切割机工作,激光切割机包括激光切割部件和控制器,激光切割部件包括视觉抓靶组件和激光切割组件,视觉抓靶组件用于识别激光定位记号并将识别出的信号传输至控制器,控制器用于向激光切割部件发送切割信号,激光切割组件按照接收的切割信号对偏光片、OCA膜和重离型膜进行激光切割。
进一步地,OCA模切加工单元为刀模裁切装置或激光裁切装置。
进一步地,OCA与偏光片贴合加工单元包括卷对卷贴合机或膜对膜贴合机。
进一步地,激光切割机为大族/P5060自动激光切割机。
进一步地,偏光片远离OCA膜的一侧表面设有偏光片离型膜,可以起到防刮伤、防油污、防灰尘等保护作用。
本发明的第二个目的是提供一种提高偏光片贴合精度的方法,采用本发明的上述定位切割系统,包括以下步骤:
(1)OCA模切加工:提供相互贴合的OCA膜和重离型膜,按照预设的形状裁切OCA膜和重离型膜并在重离型膜上形成多个激光定位记号;裁切后,OCA膜覆盖一部分重离型膜的表面;激光定位记号位于重离型膜上未被OCA膜覆盖的位置;
(2)OCA与偏光片贴合加工:在OCA膜远离重离型膜的一侧表面贴合偏光片,偏光片包括中央区和围绕中央区设置的边缘区,中央区与OCA膜贴合且形状相匹配,边缘区的面积大于激光切割后目标边缘区的面积;
(3)激光切割:激光切割机对激光定位记号进行抓标对位并激光切割,将偏光片、OCA膜和重离型膜切割成目标形状,激光切割时,包括在边缘区中激光切割出目标边缘区的步骤,目标边缘区围绕中央区设置。
进一步地,在步骤(1)中,形成多个激光定位记号的步骤包括:
利用OCA模切加工单元在重离型膜上裁切出多个激光定位记号;或者
在裁切OCA膜和重离型膜后直接以重离型膜的至少两个边角的边缘作为激光定位记号。
进一步地,在步骤(1)中,裁切出的激光定位记号呈十字形或L字型。优选地,激光定位记号呈十字形。激光定位记号为步骤(3)的激光切割提供定位。
进一步地,在步骤(1)中,激光定位记号的个数至少为两个,优选为两个或四个。当激光定位记号个数为两个时,其可以位于重离型膜的同一侧的两角处或重离型膜的对角处,当激光定位记号个数为四个时,激光定位记号分别位于重离型膜的四角处。最优选地,激光定位记号的个数为四个,这样可使得后续的激光切割精度更高。
进一步地,在步骤(1)中,OCA膜远离重离型膜的一侧表面设有第一轻离型膜,在OCA模切加工之前,去除第一轻离型膜。为保护OCA膜的胶面,在完成步骤(1)之后且进行步骤(2)之前,在OCA膜远离重离型膜的一侧表面再贴合一层较第一轻离型膜的离型力更小的第二轻离型膜,待到需进行步骤(2)时,再将第二轻离型膜去除,或保留第二轻离型膜直至完成激光切割。
进一步地,步骤(1)中的激光定位记号暴露于步骤(2)中的边缘区外。
在步骤(1)中,可采用刀模裁切装置进行刀模裁切或采用激光裁切装置进行激光裁切。对OCA膜及重离型膜加工出预设的形状。
进一步地,在步骤(2)中,偏光片远离OCA膜的一侧表面设有偏光片离型膜,可以起到防刮伤等保护作用。
在步骤(2)中,可采用卷对卷贴合机进行卷对卷贴合或采用膜对膜贴合机进行片对片贴合。
所谓卷对卷贴合,即在OCA膜成卷裁切时,在OCA膜最终被裁切成片材前,在其还连成一卷时直接将成卷的偏光片材料贴合于其上;其贴合方式属于在线连续贴合,其特点在于效率很高,偏光片材料用量长度与OCA材料的使用长度相当。
所谓片对片贴合,即在OCA膜裁切成单独的片材后,或OCA膜本身由片材加工出来的,再将偏光片贴合于其上;其贴合方式属于在线或非在线的断续贴合,其特点是,贴合时机、贴合的偏光片尺寸灵活机动,但效率低下,适合小批量制作。
步骤(2)对贴合精度要求不高,只需保证贴合后的偏光片边缘区的面积大于激光切割后目标边缘区的面积即可;同时贴合后偏光片的边缘不得遮挡住重离型膜上的激光定位记号,以免影响后续的抓标对位。优选地,边缘区的宽度大于目标边缘区的宽度的1mm以上,此时切割完的废边更容易去除。
进一步地,在步骤(3)中,抓标对位的方法包括以下步骤:
开启激光切割机CCD功能,抓取重离型膜的一个激光定位记号,学习靶标形状,并在CCD模块中捕捉并保存第一点坐标,选中图纸的相应靶标,做图纸靶标定位,使图纸靶标与学习的靶标坐标一致,然后学习以上激光定位记号对角上的另一激光定位记号:
抓取激光定位记号对角上的另一激光定位记号,学习靶标形状,并在CCD模块中捕捉并保存坐标,选中图纸的相应靶标,做图纸靶标定位,使图纸靶标与学习的靶标坐标一致;
在激光切割机底板上镭射出相应位置,根据未学习的位于对角线的激光定位记号做物理定位,采用两点切割方式进行激光切割。
进一步地,在步骤(3)中,激光切割的激光功率为2-3kW。激光功率根据产品切割状况调整,应满足在保证切断的前提下功率最小,降低激光切割到底板反光导致的焦边现象。
借由上述方案,本发明至少具有以下优点:
本发明提供了一种偏光片的定位切割系统,并基于该系统提供了一种提高偏光片贴合精度的方法,采用先贴合后切割的工艺,提高OCA膜与偏光片贴合后二者位置关系的尺寸精 度,其精度可达±0.05mm,相比于传统贴合工艺±0.1mm的精度有很大提升。
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,并可依照说明书的内容予以实施,以下以本发明的较佳实施例并配合详细附图说明如后。
附图说明
图1是OCA膜与偏光片贴合的工艺流程图;
图2是实施例2步骤(1)中,模切前OCA膜和重离型膜的侧面剖视图;
图3是实施例2步骤(1)中,模切后OCA膜和重离型膜的侧面剖视图;
图4是实施例2步骤(2)中,OCA膜和贴合偏光片后的侧面剖视图;
图5是实施例2步骤(3)中,激光切割后OCA膜和偏光片的侧面剖视图;
图6是图1中编号a图中偏光片的结构示意图;
图7是图1中编号b图中偏光片的结构示意图;
图8是OCA膜与偏光片贴合并激光切割后的尺寸标注图;
附图标记说明:
1-重离型膜;2-OCA膜;3-轻离型膜;4-偏光片;5-偏光片离型膜;6-激光定位记号;40-中央区;41-边缘区;42-目标边缘区。
具体实施方式
下面结合实施例,对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明,但不用来限制本发明的范围。
实施例1
一种偏光片的定位切割系统,偏光片4的一侧表面依次连接有OCA膜2和重离型膜1,偏光片4远离OCA膜2的一侧表面设有偏光片离型膜5,可以起到防刮伤等保护作用。
定位切割系统包括:
OCA模切加工单元,其用于按照预设的形状裁切OCA膜2和重离型膜1并在重离型膜1上裁切出多个激光定位记号6;OCA模切加工单元为刀模裁切装置或激光裁切装置。
OCA与偏光片贴合加工单元,其用于将OCA膜2和偏光片4进行贴合;OCA与偏光片贴合加工单元为卷对卷贴合机或膜对膜贴合机。
以及激光切割机,其用于激光抓靶切割,激光切割机大族/P5060自动激光切割机。OCA与偏光片贴合加工单元先于激光切割机工作。激光切割机包括激光切割部件和控制器,激光切割部件包括视觉抓靶组件和激光切割组件,视觉抓靶组件用于识别激光定位记号6并将识 别出的信号传输至控制器,控制器用于向激光切割部件发送切割信号,激光切割组件按照接收的切割信号对偏光片4、OCA膜2和重离型膜1进行激光切割。
实施例2
一种提高OCA膜2与偏光片4贴合精度的方法,采用实施例1中的定位切割系统进行,步骤如下:
(1)OCA模切加工:提供相互贴合的OCA膜2和重离型膜1,OCA膜2远离重离型膜1的一侧表面设有轻离型膜3(图2),在模切前,去除轻离型膜3,然后采用刀模裁切或激光裁切的形式,按照预设的形状裁切OCA膜2和重离型膜1,以加工出需要的形状(图3)。同时在重离型膜1上裁切出多个激光定位记号6,优选在重离型膜1的4个角各裁切出1个激光定位记号6。激光定位记号6的形状为十字形或L字型,优选十字形。为保护OCA膜2的胶面,在完成OCA模切加工之后,在OCA膜2远离重离型膜1的一侧表面再贴合一层较模切前的轻离型膜3的离型力更小的另一轻离型膜。
其中,在OCA膜2和重离型膜1的裁切过程中,若是在后道工艺中不涉及到再次裁切的部分,直接按照最终产品需求的形状裁切。若在后道工艺中涉及到再次裁切的部分,比如产品某一边需要偏光片4、OCA膜2、重离型膜1平齐,则需要按照比最终产品更大的形状进行裁切。
裁切后,OCA膜2覆盖于一部分重离型膜1的表面,即裁切后的OCA膜2的面积小于重离型膜1的面积,且激光定位记号6位于重离型膜1上未被OCA膜2覆盖的位置。
(2)OCA与偏光片贴合加工:在OCA膜2远离重离型膜1的一侧表面贴合偏光片4,偏光片4远离OCA膜2的一侧表面设有偏光片离型膜5(图4),可以起到防刮伤等保护作用。
贴合后,偏光片4包括中央区40和围绕中央区40设置的边缘区41,中央区40与OCA膜2贴合且形状相匹配。边缘区41的面积大于激光切割后目标边缘区42的面积,优选地,边缘区41的宽度大于目标边缘区42的宽度的1mm以上,此时切割完的废边更容易去除。
OCA膜2远离重离型膜1的一侧表面贴合偏光片4时,具体采用卷对卷贴合机进行卷对卷贴合或采用膜对膜贴合机进行片对片贴合。所谓卷对卷贴合,即在OCA膜2成卷裁切时,在OCA膜2最终被裁切成片材前,在其还连成一卷时直接将成卷的偏光片4材料贴合于其上。所谓片对片贴合,即在OCA膜2裁切成单独的片材后,或OCA膜2本身由片材加工出来的,再将偏光片4贴合于其上。
(3)激光切割:激光切割机对重离型膜1膜上的激光定位记号6进行抓标对位并激光 切割,以将偏光片4与OCA膜的贴合品切割成最终产品的外形尺寸,重离型膜1膜上的激光定位记号6部分根据最终产品需求进行切除或保留(图5)。
其抓标对位的方法是:
激光切割机CCD功能开启,移动镜头至重离型膜1第一个激光定位记号6,调至焦点模式使靶标清晰,学习靶标形状,并在CCD模块中捕捉并保存第一点坐标,选中图纸的相应靶标,做图纸靶标定位,使图纸靶标与学习的靶标坐标一致,采用同样的操作方式学习第一个激光定位记号6对角线处的第三个激光定位记号6。
在激光机底板上镭射出相应位置,根据未进行学习的且位于对角线的第二个、第四个激光定位记号6做物理定位,同时选中CCD两点切割方式,启动机台进行切割。根据切割出来的产品量测数据进行切割图纸相对靶标移动,使切割精度更高。
激光功率根据产品切割状况调整,应满足在保证切断的前提下功率最小,降低激光切割到底板反光导致的焦边现象。
按照上述方法进行33组OCA膜与偏光片的贴合及激光切割后,按表1中的标准进行实验设计,并按照图8中的尺寸标记计算精度,结果如表2所示。图8中,A代表OCA膜的宽度;B代表偏光片宽度;C代表沿OCA膜长度方向上,OCA膜的边缘与偏光片的边缘之间的间距;D代表OCA膜的长度;E代表偏光片的长度;F代表沿OCA膜宽度方向上,OCA膜的边缘与偏光片的边缘之间的间距。
其中,表1-2中的字母A-F分别对应图8中的字母A-F的含义。Ca代表制程准确度,反映的是位置关系(集中趋势),计算方法:Ca=(X-U)/(T/2)。表1中的平均值即为X;表1中标准值的中心值即为U,如表1中,字母A对应的标准值为76.57±0.05,因此字母A对应的U值为76.57;T代表规格公差,即表1中上限值减去下限值得到的数值。Cp代表制程精密度,反映的是散布关系(离散趋势),计算方法:Cp=T/6Sigma,Sigma为表2中同一字母所对应的不同数值计算出的标准偏差。Cpk代表制程能力指数,是某个工程或制程水准的量化反映,也是工程评估的一类指标,计算方法:Cpk=Cp×(1-|Ca|)。
表1 贴合标准
Figure PCTCN2020124090-appb-000001
Figure PCTCN2020124090-appb-000002
表2 本发明方法的实验结果
Figure PCTCN2020124090-appb-000003
Figure PCTCN2020124090-appb-000004
从表2中可以看出,C、F两个尺寸标准(特别是尺寸C)可以很好的被控制在±0.05mm的公差内。而常规工艺(后道贴合工艺),目前极限能只做到满足±0.1mm的公差。
实施例3
一种提高OCA膜2与偏光片4贴合精度的方法,采用实施例1中的定位切割系统进行,步骤与实施例2相同,不同之处在于:
步骤(2)在OCA膜2远离重离型膜1的一侧表面贴合偏光片4时,采用膜对膜贴合机进行片对片贴合。在步骤(2)之前,为保护OCA膜2的胶面,在OCA膜2远离重离型膜1的一侧表面贴合一层轻离型膜3,待到需进行步骤(2)时,再将轻离型膜3去除。
以上仅是本发明的优选实施方式,并不用于限制本发明,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和变型,这些改进和变型也应视为本发明的保护范围。

Claims (10)

  1. 一种偏光片的定位切割系统,所述偏光片的一侧表面依次连接有OCA膜和重离型膜,其特征在于:所述定位切割系统包括:
    OCA模切加工单元,其用于按照预设的形状裁切所述OCA膜和重离型膜并在所述重离型膜上形成多个激光定位记号;
    OCA与偏光片贴合加工单元,其用于将所述OCA膜和偏光片进行贴合;
    以及激光切割机,其用于激光抓靶切割,所述OCA与偏光片贴合加工单元先于所述激光切割机工作,所述激光切割机包括激光切割部件和控制器,所述激光切割部件包括视觉抓靶组件和激光切割组件,所述视觉抓靶组件用于识别所述激光定位记号并将识别出的信号传输至控制器,所述控制器用于向所述激光切割部件发送切割信号,所述激光切割组件按照接收的切割信号对所述偏光片、OCA膜和重离型膜进行激光切割。
  2. 根据权利要求1所述的定位切割系统,其特征在于:所述OCA模切加工单元为刀模裁切装置或激光裁切装置。
  3. 根据权利要求1所述的定位切割系统,其特征在于:所述OCA与偏光片贴合加工单元包括卷对卷贴合机或膜对膜贴合机。
  4. 一种提高偏光片贴合精度的方法,其特征在于,采用权利要求1-3中任一项所述的定位切割系统,包括以下步骤:
    (1)OCA模切加工:按照预设的形状裁切所述OCA膜和重离型膜并在所述重离型膜上形成多个激光定位记号;裁切后,OCA膜覆盖一部分重离型膜的表面;所述激光定位记号位于重离型膜上未被OCA膜覆盖的位置;
    (2)OCA与偏光片贴合加工:在所述OCA膜远离所述重离型膜的一侧表面贴合偏光片,所述偏光片包括中央区和围绕所述中央区设置的边缘区,所述中央区与所述OCA膜贴合且形状相匹配,所述边缘区的面积大于激光切割后目标边缘区的面积;
    (3)激光切割:所述激光切割机对所述激光定位记号进行抓标对位并激光切割,将所述偏光片、OCA膜和重离型膜切割成目标形状,激光切割时,包括在所述边缘区中激光切割出目标边缘区的步骤,所述目标边缘区围绕所述中央区设置。
  5. 根据权利要求4所述的方法,其特征在于:在步骤(1)中,形成多个激光定位记号的步骤包括:
    利用所述OCA模切加工单元在所述重离型膜上裁切出多个激光定位记号;或者
    在裁切所述OCA膜和重离型膜后直接以所述重离型膜的至少两个边角的边缘作为激光定位记号。
  6. 根据权利要求4所述的方法,其特征在于:在步骤(1)中,所述激光定位记号的个数至少为两个。
  7. 根据权利要求4所述的方法,其特征在于:在步骤(1)中,所述OCA膜远离所述重离型膜的一侧表面设有轻离型膜,在OCA模切加工之前,去除所述轻离型膜。
  8. 根据权利要求4所述的方法,其特征在于:步骤(1)中的所述激光定位记号暴露于步骤(2)中的所述边缘区外。
  9. 根据权利要求4所述的方法,其特征在于:在步骤(2)中,所述偏光片远离所述OCA膜的一侧表面设有偏光片离型膜。
  10. 根据权利要求4所述的方法,其特征在于,在步骤(3)中,抓标对位的方法包括以下步骤:
    开启激光切割机CCD功能,抓取重离型膜的一个激光定位记号,学习靶标形状,并在CCD模块中捕捉并保存第一点坐标,选中图纸的相应靶标,做图纸靶标定位,使图纸靶标与学习的靶标坐标一致,然后学习以上激光定位记号对角上的另一激光定位记号:
    抓取激光定位记号对角上的另一激光定位记号,学习靶标形状,并在CCD模块中捕捉并保存坐标,选中图纸的相应靶标,做图纸靶标定位,使图纸靶标与学习的靶标坐标一致;
    在激光切割机底板上镭射出相应位置,根据未学习的位于对角线的激光定位记号做物理定位,采用两点切割方式进行激光切割。
PCT/CN2020/124090 2020-09-09 2020-10-27 偏光片的定位切割系统及提高偏光片贴合精度的方法 WO2022052232A1 (zh)

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