WO2022042082A1 - 触控基板和触控装置 - Google Patents
触控基板和触控装置 Download PDFInfo
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- WO2022042082A1 WO2022042082A1 PCT/CN2021/105713 CN2021105713W WO2022042082A1 WO 2022042082 A1 WO2022042082 A1 WO 2022042082A1 CN 2021105713 W CN2021105713 W CN 2021105713W WO 2022042082 A1 WO2022042082 A1 WO 2022042082A1
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- layer
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- metal layer
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Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
Definitions
- the present disclosure relates to the technical field of touch control, and in particular, to a touch control substrate and a touch control device.
- the capacitive touch screen includes a touch area and a binding area.
- the touch area is provided with a plurality of driving electrodes and a plurality of sensing electrodes.
- the plurality of driving electrodes and the plurality of sensing electrodes intersect with each other, and a capacitor is formed adjacent to the two electrodes.
- Each drive electrode loads a drive signal in a scanning form, and a corresponding sensing signal is generated on the sensing electrode.
- the sensing signal of the sensing electrode at the touch position changes, so that the touch position is determined according to the change of the sensing signal.
- the bonding area is provided with a plurality of bonding pads, the driving chip provides driving signals to the driving electrodes through the bonding pads, and receives the sensing signals of the sensing electrodes through the bonding pads.
- the present disclosure aims to at least solve one of the technical problems existing in the prior art, and proposes a touch control substrate and a touch control device.
- a touch substrate including:
- the substrate includes a touch area and a binding area on one side of the touch area;
- the pad includes: a first metal layer, a second metal layer and a first organic layer, the first metal layer is disposed between the second metal layer and the substrate, the first organic layer A layer is arranged between the first metal layer and the second metal layer, a first through hole is arranged on the first metal layer, a second through hole is arranged on the first organic layer, and the first through hole is arranged on the first organic layer.
- the orthographic projection of a through hole on the substrate does not overlap with the orthographic projection of the second through hole on the substrate, and a part of the first organic layer is located in the first through hole, so A part of the second metal layer is in contact with the first metal layer through the second through hole.
- the surface of the second metal layer remote from the substrate includes a first region and a second region
- the touch substrate further includes: a cover layer, the cover layer is located on the side of the pad away from the substrate, and the cover layer covers the first region of the second metal layer and the pad between the pads. spacer regions therebetween and exposing the second region of the second metal layer.
- the first region surrounds the second region.
- the distance between the boundary of the second region and the boundary of the second metal layer is 0.1 ⁇ 0.25 times the width of the pad.
- the capping layer is a second organic layer.
- the cover layer includes: a buffer layer and a second organic layer arranged in layers, the second organic layer is arranged on a side of the buffer layer away from the substrate, and the buffer layer is on the side of the buffer layer.
- the orthographic projection on the substrate overlaps the orthographic projection of the second organic layer on the substrate.
- the numbers of the first through holes and the second through holes are multiple.
- the diameter of the first through hole and the diameter of the second through hole are both between 20 ⁇ m and 200 ⁇ m.
- the orthographic projection of the second metal layer on the substrate overlaps and exceeds the orthographic projection of the first metal layer on the substrate.
- the touch substrate further includes a light shielding layer disposed in the binding area, and the pad is disposed on a side of the light shielding layer away from the substrate.
- Embodiments of the present disclosure further provide a touch device, including the touch substrate in the above embodiments.
- FIG. 1 is a schematic diagram of a pad structure of a touch substrate provided in an example.
- FIG. 2 is a plan view of a touch substrate provided in some embodiments of the present disclosure.
- FIG. 3 is a partial schematic diagram of region I in FIG. 2 provided in some embodiments of the present disclosure.
- Fig. 4 is a cross-sectional view taken along line A-A' in Fig. 3 .
- Fig. 5 is a cross-sectional view taken along line B-B' in Fig. 3 .
- FIG. 6 is a schematic diagram of vias on the first metal layer and the second metal layer provided in some embodiments of the present disclosure.
- FIG. 7 is another cross-sectional view of a pad provided in some embodiments of the present disclosure.
- FIG. 8 is a cross-sectional view taken along line CC' in FIG. 2 .
- FIG. 9 is a partial schematic diagram of region I in FIG. 2 provided for other embodiments of the present disclosure.
- FIG. 10 is a cross-sectional view taken along line DD' in FIG. 9 .
- FIG. 11 is a cross-sectional view taken along line EE' in FIG. 9 .
- Words like “include” or “include” mean that the elements or items appearing before “including” or “including” cover the elements or items listed after “including” or “including” and their equivalents, and do not exclude other component or object.
- Words like “connected” or “connected” are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Up”, “Down”, “Left”, “Right”, etc. are only used to indicate the relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
- FIG. 1 is a schematic diagram of the pad structure of the touch substrate provided in a comparison example.
- the touch substrate adopts an integrated touch (One glass solution, OGS) technology.
- OGS One glass solution
- 1 is fabricated on a glass substrate 2.
- the pad 1 includes a first metal layer 11 and a second metal layer 12.
- the first metal layer 11 is connected to the driving electrodes of the touch area through signal lines
- the second metal layer 12 is connected to the sensing electrodes of the touch area through signal lines. connect.
- the adhesion between the film layers is likely to be poor.
- the first metal layer 11 when the pattern of the first metal layer 11 is formed, When the patterning process, cleaning and heat treatment are performed, after the patterning process, cleaning and heat treatment, the first metal layer 11 will generate hydrogen bonds, and the lattice will become larger, so that when the second metal layer 12 is subsequently formed, the first metal layer 12 will be formed.
- the lattices of the layer 11 and the second metal layer 12 do not match, thereby resulting in poor adhesion between the first metal layer 11 and the second metal layer 12 .
- FIG. 2 is a top view of a touch substrate provided in some embodiments of the present disclosure
- FIG. 3 is a partial schematic diagram of region I in FIG. 2
- the touch substrate includes: a substrate 2 , which is disposed on the substrate A plurality of pads 1 on 2 , a plurality of drive electrodes TX and a plurality of sensing electrodes RX arranged on the substrate 2 .
- the substrate 2 includes: a touch area TX and a binding area BA located on one side of the touch area TX.
- the touch substrate in the embodiment of the present disclosure may be used in a touch display device.
- the touch area TX may correspond to the display area of the display panel.
- the substrate 2 may further include a wiring area LA, and the wiring area LA is connected to the binding area BA to form a frame area WA surrounding the touch area TA.
- the substrate 2 may be made of glass, or a flexible material such as polyimide (PI).
- a plurality of driving electrodes TX and a plurality of sensing electrodes RX are arranged in the touch area TX, and the driving electrodes TX and the sensing electrodes RX are arranged at an insulating interval.
- the pad 1 is arranged in the bonding area BA, and the pad 1 is used for bonding (bonding) connection with a flexible printed circuit board (Flexible Print Circuit Board, FPCB).
- the flexible printed circuit board is electrically connected with the external driving chip, and is configured to transmit signals or power from the external driving chip.
- the pad 1 transmits the driving signal of the driving chip to the driving electrode TX through the signal line, and transmits the signal induced by the sensing electrode RX to the driving chip.
- the number and arrangement of the pads 1 are not specifically limited here, and can be set according to actual needs.
- FIG. 4 is a cross-sectional view along the line AA' in FIG. 3, and FIG. 5 is a cross-sectional view along the line BB' in FIG. 3.
- the pad 1 includes: a first metal layer 11, The second metal layer 12 and the first organic layer 31, the first metal layer 11 is arranged between the second metal layer 12 and the substrate 2, and the first organic layer 31 is arranged between the first metal layer 11 and the second metal layer 12 between.
- the materials of both the first metal layer 11 and the second metal layer 12 may include any one or an alloy of any one of copper, aluminum, silver, and molybdenum.
- the first organic layer 31 may be provided in the same layer as the insulating spacer layer between the driving electrode TX and the sensing electrode RX.
- the first organic layer 31 and the insulating spacer layer are both made of transparent organic materials.
- the transparent organic material may be photoresist.
- one of the first metal layer 11 and the second metal layer 12 is connected to the driving electrode TX through the signal line TL, and the other of the first metal layer 11 and the second metal layer 12 is connected to the driving electrode TX through the signal line TL.
- the sensing electrode RX is connected.
- a first through hole V1 is formed on the first metal layer 11, and a second through hole V2 is formed on the first organic layer 31.
- FIG. 6 is provided on the first metal layer and the second metal layer in some embodiments of the present disclosure. 4 to 6 , the orthographic projection of the first through hole V1 on the substrate 2 does not overlap with the orthographic projection of the second through hole V2 on the substrate 2 .
- a part of the first organic layer 31 is located in the first through hole V1 so as to be in contact with the substrate 2 or other film layers under the pad 1.
- a portion of the second metal layer 12 is in contact with the first metal layer 11 through the second via V2.
- the second metal layer 12 passes through the second through hole V2 on the first organic layer 31 It is in direct contact with the first metal layer 11 , and at other positions of the first organic layer 31 , the second metal layer 12 is attached to the first organic layer 31 , and a part of the first organic layer 31 is directly attached to the first metal layer 11 .
- the other part is located in the first through hole V1 of the first metal layer 11 , so as to be attached to the sidewall of the first through hole V1 and the film layer below the pad 1 .
- the adhesion is greater than the adhesion between the first metal layer 11 and the second metal layer 12, and the first through holes V1 and the second through holes V2 are staggered, so that the first metal layer 11 and the second through hole V2 are staggered
- the layer 11, the second metal layer 12 and the first organic layer 31 form a "bite" structure. From an overall point of view, the total contact area between the first organic layer 31, the first metal layer 11 and the second metal layer 12 increases, Thus, the adhesion between the film layers is increased, and the reliability of the pad 1 is improved.
- the touch substrate further includes a light shielding layer 5 disposed in the binding area BA, and the pad 1 is disposed on the side of the light shielding layer 5 away from the substrate 2 .
- the light shielding layer 5 can cover the entire frame area, so as to shield the traces in the frame area.
- a part of the first organic layer 31 is in contact with the light shielding layer 5 through the first through hole V1.
- the light shielding layer 5 can be made of polyimide, polyphthalimide, polyphthalamide, acrylic resin, benzocyclobutene or phenolic Resin and other organic insulating materials.
- the adhesion between the first organic layer 31 and the light shielding layer 5 is larger, thereby increasing the overall adhesion of the pad 1 on the substrate 2 .
- the number of the first via V1 and the second via V2 is multiple, so as to further improve the relationship between the first organic layer 31 and the first metal The adhesion between the layers 11 , between the first organic layer 31 and the second metal layer 12 , and between the entire pad 1 and the light shielding layer 5 .
- first through holes V1 and the second through holes V2 are cylindrical through holes, or are triangular prisms, quadrangular prisms shaped through hole.
- the edge of the orthographic projection of the first metal layer 11 on the substrate 2 is a rectangle, and the edge of the first organic layer 31 coincides with the edge of the first metal layer 11 .
- the diameter of the first through hole V1 and the diameter of the second through hole V2 are both between 20 ⁇ m and 200 ⁇ m, so as to ensure the electrical connection effect between the second metal layer 12 and the first metal layer 11 , as well as the first organic layer 31 and the light shielding layer. The connection effect between 5, and at the same time prevent the resistance of the pad 1 from being too large due to the large through hole.
- the diameters of the first through holes V1 and the second through holes V2 should not exceed the width of the first metal layer 11 .
- the width of the first metal layer 11 is 120 ⁇ m, and the diameter of the first through hole V1 and the diameter of the second through hole V2 are both 40 ⁇ m.
- the orthographic projection of the second metal layer 12 on the substrate 2 overlaps and exceeds the orthographic projection of the first metal layer 11 on the substrate 2 , so that the second metal layer 12 can wrap the first metal layer 11 and the side surface of the first organic layer 31, thereby making the connection between the film layers of the pad 1 more closely.
- FIG. 7 is another cross-sectional view along the line AA' in FIG. 3 provided in some embodiments of the present disclosure.
- the surface of the second metal layer 12 away from the substrate 2 includes a first region and a second area.
- the touch substrate further includes: a cover layer 4, the cover layer 4 is located on the side of the pad 1 away from the substrate 2, the cover layer 4 covers the first area of the second metal layer 12 and the spaced area between the pad 1, and exposes The second area of the second metal layer 12 is obtained, and the second area is the area of the second metal layer 12 to be bound with the flexible printed circuit board.
- the cover layer 4 the bonding pad 1 can be pressed on the substrate 2 as a whole, thereby further improving the firmness of the bonding pad 1 .
- the first area is an annular area surrounding the second area, that is, the four sides of the second metal layer 12 are all covered by the cover layer 4, so as to improve the adhesion effect of the cover layer 4 on the pad 1, and improve the The firmness of pad 1.
- the distance d between the boundary of the second region and the boundary of the second metal layer 12 is 0.1 to 0.25 times the width w of the pad 1 , so as to ensure that the cover layer 4 has good adhesion to the pad 1 At the same time, it is ensured that the surface of the pad 1 has enough area to be bound to the flexible circuit board.
- the cover layer 4 includes: a buffer layer 41 and a second organic layer 42, the second organic layer 42 is disposed on the side of the buffer layer 41 away from the substrate 2, and the orthographic projection of the buffer layer 41 on the substrate 2 is the same as the first organic layer 42.
- the orthographic projections of the two organic layers 42 on the substrate 2 overlap.
- the buffer layer 41 may be an inorganic material layer such as silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be formed as a multilayer or a single layer.
- the buffer layer 41 is a silicon oxynitride layer.
- the second organic layer 42 can be made of the same material as the first organic layer 31 .
- the cover layer 4 can extend to the touch area, so that the above-mentioned buffer layer 41 and the second organic layer 42 are also formed in the touch area.
- the buffer layer 41 can prevent the electrostatic charge in the production process from causing the electrodes of the touch substrate. damage, and help to improve the appearance color of the touch area.
- cover layer 4 can also omit the buffer layer 41 in FIG. 7 and only include the second organic layer 42 .
- the driving electrode TX includes: a plurality of driving electrode units TX1 arranged along the first direction, and two driving electrode units TX1 connected to each adjacent one the bridge between TX2.
- the sensing electrode RX includes: a plurality of sensing electrode units RX1 arranged along the second direction, and a connection part RX2 connected between every two adjacent sensing electrode units RX1.
- the first direction intersects with the second direction, the driving electrode unit TX1 and the sensing electrode RX are located between the insulating spacer layer TLD and the substrate 2 and are arranged in the same layer, and the bridge portion TX2 is located at the part of the insulating spacer layer TLD away from the substrate 2 side.
- the first direction is the left-right direction in FIG. 2
- the second direction is the up-down direction in FIG. 2 .
- the touch driving electrodes TX and the touch sensing electrodes RX shown in FIG. 2 and FIG. 8 are only illustrative, and do not limit the present disclosure.
- the connecting portion RX2 may also be located on the side of the insulating spacer layer TLD away from the substrate 2 , and the bridging portion TX2 may be located on the side of the insulating spacer layer TLD close to the substrate 2 .
- the adjacent driving electrode units TX1 are connected through the connection parts RX2 provided in different layers, and the adjacent sensing electrode units RX1 are connected through the bridge parts TX2 in the same layer.
- the driving electrode unit TX1 and the sensing electrode unit RX1 are both transparent electrodes, or both the driving electrode unit TX1 and the sensing electrode unit RX1 are metal mesh electrodes.
- the bridge portion TX2 is made of the same material as the driving electrode unit TX1, and the connection portion RX2 can be made of a metal material.
- the driving electrode unit TX1 , the sensing electrode unit RX1 and the connecting part RX2 are all made of the same metal material as the first metal layer 11 , and the bridging part TX2 is made of the same metal material as the second metal layer 12 , so that During the fabrication of the touch substrate, the driving electrode unit TX1 , the sensing electrode unit RX1 , the connecting portion RX2 and the first metal layer 11 can be fabricated simultaneously, and the bridging portion TX2 and the second metal layer 12 can be fabricated simultaneously, thereby simplifying the fabrication process.
- the first organic layer 31 of the bonding area BA and the insulating spacer layer TLD of the touch area TX may be disposed in the same layer, and the cover layer 4 may extend to the touch area TX and cover the driving electrodes TX and the sensing electrodes RX, so as to provide The driving electrode TX and the sensing electrode RX are protected.
- a light-shielding material layer is formed on the cleaned substrate 2 , and the light-shielding material is exposed and developed to obtain the light-shielding layer 5 .
- each of the first metal layers 11 has a plurality of first through holes V1.
- a first organic material layer is formed, and the first organic material layer is exposed and developed to obtain the above-mentioned first organic layer 31 , and the first organic layer 31 has a plurality of second through holes V2 .
- a second metal material layer is formed, and a photolithography patterning process is performed on the second metal material layer to form a pattern of the second metal layer 12 including a plurality of pads 1 .
- a second organic material layer is formed, and the second organic material layer is exposed and developed to obtain the above-mentioned second organic layer 42 .
- the second organic layer 42 exposes the second region of the second metal layer 12 .
- FIG. 9 is a partial schematic diagram of the area I in FIG. 2 provided by other embodiments of the present disclosure.
- the touch substrate also includes: a substrate 2 , a plurality of spaced pads 1 , Multiple driving electrodes TX and multiple sensing electrodes RX.
- the touch substrate further includes a cover layer 4 .
- the pad 1 , the driving electrode TX and the sensing electrode RX are all arranged on the substrate 2 .
- the pad 1 is arranged in the binding area BA, and the driving electrodes TX and the sensing electrodes RX are arranged in the touch area TX.
- the driving electrodes TX and the sensing electrodes RX refer to the descriptions in the above embodiments.
- FIG. 10 is a cross-sectional view along the line DD' in FIG. 9, and FIG. 11 is a cross-sectional view along the line EE' in FIG. 9.
- the pad 1 includes: a first metal layer 11 and a second metal layer Layer 12, the first metal layer 11 is disposed between the second metal layer 12 and the substrate 2, and the surface of the second metal layer 12 away from the substrate 2 includes a first region and a second region.
- the orthographic projection of the second metal layer 12 on the substrate 2 covers and exceeds the orthographic projection of the first metal layer 11 on the substrate 2 .
- the cover layer 4 is located on the side of the pad 1 away from the substrate 2 , and the cover layer 4 covers the first area of the second metal layer 12 and the spaced area between the pad 1 and exposes the first area of the second metal layer 12 . Second area.
- the pad 1 only includes the first metal layer 11 and the second metal layer 12 , while the first metal layer 11 and the second metal layer The first organic layer 31 is no longer disposed between 12 .
- the entirety of the pad 1 can be pressed onto the substrate 2 , thereby improving the firmness of the pad 1 .
- the first area of the second metal layer 12 is an annular area surrounding the second area.
- the distance d between the boundary of the second region and the boundary of the second metal layer 12 is 0.1 to 0.25 times the width w of the pad 1 .
- the structure of the capping layer 4 in FIG. 10 may be the same as that in FIG. 7 , including the buffer layer 41 and the second organic layer 42 .
- the materials of the buffer layer 41 and the second organic layer 42 may refer to the above description.
- the touch substrate shown in FIGS. 10 and 11 further includes a light shielding layer 5 , and the pads 1 are disposed on the side of the light shielding layer 5 away from the substrate.
- An embodiment of the present disclosure further provides a touch device including the touch substrate provided in any of the above embodiments.
- the touch device may be a touch display device, which further includes a display panel.
- the touch substrate is disposed on the light-emitting side of the display panel.
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Abstract
Description
Claims (11)
- 一种触控基板,包括:衬底,所述衬底包括触控区和位于所述触控区一侧的绑定区;设置在所述衬底上的多个焊盘,多个所述焊盘间隔设置在所述绑定区;其中,所述焊盘包括:第一金属层、第二金属层和第一有机层,所述第一金属层设置在所述第二金属层与所述衬底之间,所述第一有机层设置在所述第一金属层与所述第二金属层之间,所述第一金属层上设置有第一通孔,所述第一有机层上设置有第二通孔,所述第一通孔在所述衬底上的正投影与所述第二通孔在所述衬底上的正投影无交叠,所述第一有机层的一部分位于所述第一通孔中,所述第二金属层的一部分通过所述第二通孔与所述第一金属层接触。
- 根据权利要求1所述的触控基板,其中,所述第二金属层远离所述衬底的表面包括第一区域和第二区域,所述触控基板还包括:覆盖层,所述覆盖层位于所述焊盘远离所述衬底的一侧,所述覆盖层覆盖所述第二金属层的第一区域和所述焊盘之间的间隔区域,并暴露出所述第二金属层的第二区域。
- 根据权利要求2所述的触控基板,其中,所述第一区域环绕所述第二区域。
- 根据权利要求3所述的触控基板,其中,所述第二区域的边界与所述第二金属层的边界之间的距离为所述焊盘的宽度的0.1~0.25倍。
- 根据权利要求2所述的触控基板,其中,所述覆盖层为第二有机层。
- 根据权利要求2所述的触控基板,其中,所述覆盖层包括:层叠设置的缓冲层和第二有机层,所述第二有机层设置在所述缓冲层远离所述衬底的一侧,所述缓冲层在所述衬底上的正投影与所述第二有机层在所述衬底上的正投影重叠。
- 根据权利要求1至4中任意一项所述的触控基板,其中,在每个所述焊盘中,所述第一通孔和所述第二通孔的数量均为多个。
- 根据权利要求1至4中任意一项所述的触控基板,其中,所述第一通孔的孔径和第二通孔的孔径均在20μm~200μm之间。
- 根据权利要求1至4中任意一项所述的触控基板,其中,所述第二金属层在所述衬底上的正投影覆盖并超出所述第一金属层在所述衬底上的正投影。
- 根据权利要求1至4中任意一项所述的触控基板,其中,所述触控基板还包括设置在所述绑定区的遮光层,所述焊盘设置在所述遮光层远离所述衬底的一侧。
- 一种触控装置,包括权利要求1至10中任意一项所述的触控基板。
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