WO2022039221A1 - Composition de brasure - Google Patents

Composition de brasure Download PDF

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Publication number
WO2022039221A1
WO2022039221A1 PCT/JP2021/030365 JP2021030365W WO2022039221A1 WO 2022039221 A1 WO2022039221 A1 WO 2022039221A1 JP 2021030365 W JP2021030365 W JP 2021030365W WO 2022039221 A1 WO2022039221 A1 WO 2022039221A1
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WO
WIPO (PCT)
Prior art keywords
solder
solder composition
mass
epoxy resin
acid
Prior art date
Application number
PCT/JP2021/030365
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English (en)
Japanese (ja)
Inventor
繁 山津
敦史 山口
翔平 眞田
貴徳 續
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2022543989A priority Critical patent/JPWO2022039221A1/ja
Publication of WO2022039221A1 publication Critical patent/WO2022039221A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth

Definitions

  • the present disclosure relates generally to solder compositions, and more particularly to solder compositions containing solder powder and flux.
  • Patent Document 1 describes a solder paste.
  • This solder paste is composed of solder powder and flux.
  • the flux includes an epoxy resin, a curing agent, a rubber-modified epoxy resin, and an organic acid.
  • the rubber-modified epoxy resin is contained in a ratio of 3% by weight to 35% by weight based on the total weight of the flux.
  • an imidazole-based curing agent is contained to cure the epoxy resin.
  • the amount of the curing agent is excessive during heating, heat generation causes foaming of the resin. Therefore, in the solder paste of Patent Document 1, bubbles are likely to be generated inside the resin that wets and spreads to the outside of the molten solder powder during reflow, and it becomes difficult for the molten solder powder to get wet and spread in the portion. That is, when the component is mounted on the substrate, the molten solder powder does not sufficiently spread between the component and the substrate, so that the pad and the electrode are not sufficiently wetted, and an insufficiently wet portion is likely to occur.
  • this insufficiently wet portion is composed of air bubbles and a cured product of the resin, the thermal conductivity is lower than that in the case where the molten solder powder is sufficiently spread, and the heat dissipation of the component tends to be deteriorated.
  • the component is a QFN component (Quad Flat Non-readed package)
  • an electrode may be provided on the lower side of the component. If there is an insufficiently wet portion between the electrode and the substrate, the heat dissipation of the QFN component deteriorates, so that the characteristics of the component may not be fully exhibited.
  • the solder composition according to one aspect of the present disclosure contains solder powder and flux.
  • the flux contains an epoxy resin, a phenol resin, a curing accelerator, and an activator.
  • the equivalent ratio of the phenol resin to the epoxy resin is 0.1 or more and 1.0 or less.
  • the solder composition according to the present embodiment is used, for example, for fixing a component to a substrate by a surface mounting method.
  • the component is, for example, a QFN component (Quad Flat Non-led package).
  • the solder composition becomes a joint portion for joining the component and the substrate, for example, after reflow.
  • the joint portion has a solder joint portion and a reinforcing portion.
  • the solder joint is a part that electrically joins the component and the substrate.
  • the reinforcing portion has electrical insulation and is a portion that reinforces the periphery of the solder joint portion.
  • the solder composition is, for example, in the form of a paste.
  • the solder composition contains a solder powder and a flux.
  • the flux contains an epoxy resin (A), a phenol resin (B), a curing accelerator (C), and an activator (D).
  • the equivalent ratio of the phenol resin (B) to the epoxy resin (A) is 0.1 or more and 1.0 or less.
  • an imidazole compound is often used as the curing accelerator (C). Since this imidazole compound desorbs formaldehyde during heating, if the solder composition contains a large amount of the imidazole compound as a curing accelerator, gas is likely to be generated during reflow. In reflow, first, the resin component in the solder composition wets and spreads to the outside of the molten solder powder. At this time, when gas is generated inside the resin that has spread to the outside of the molten solder powder, that portion becomes bubbles, and the wet spreading of the melted solder powder is likely to be hindered.
  • C curing accelerator
  • the molten solder powder does not spread sufficiently under the parts mounted on the substrate by reflow, and a poorly wetted portion tends to exist.
  • the component is, for example, a QFN component
  • an electrode may be provided under the QFN component, and if there is an insufficiently wet portion in this portion, the heat dissipation property deteriorates. If the heat dissipation property deteriorates, the characteristics of the QFN component may not be fully exhibited. For this reason, in the joint between the component and the substrate after reflow, the molten solder powder is sufficiently spread over the entire lower surface of the QFN component, a solder joint with few insufficient wetting portions is formed, and the outside is formed around the QFN component. It is preferable that the reinforcing portion made of the resin spread to the surface is formed.
  • the solder composition contains a small amount of the imidazole compound as the curing accelerator (C), but in this case, there is a concern that the resin may not be sufficiently cured after reflow. If the resin is insufficiently cured, the electrical insulating property of the reinforcing portion mainly formed of the resin tends to deteriorate, so that it is preferable that the resin has good curability.
  • the solder composition according to the present embodiment contains the epoxy resin (A) and the phenol resin (B) in the flux, the resin tends to have good curability. Therefore, the content of the curing accelerator (C) in the solder composition can be reduced. Further, when the solder composition contains the phenol resin (B), the curing of the epoxy resin (A) and the foaming of the resin due to heat generation can be suppressed. This action is easily realized by setting the equivalent ratio of the phenol resin (B) to the epoxy resin (A) to be 0.1 or more and 1.0 or less. That is, in the solder composition according to the present embodiment, bubbles are less likely to be generated in the resin during reflow, and the molten solder powder is easily sufficiently wetted and spread. Therefore, when the component is mounted on the substrate, it is between the component and the substrate. In addition, it is easy to form a solder joint with few insufficient wet parts.
  • solder composition according to this embodiment is preferably in the form of a paste.
  • the solder composition contains a solder powder and a flux.
  • solder powder is not particularly limited.
  • the chemical composition of the solder powder includes lead-free solder and lead-containing solder.
  • the chemical composition of the solder powder is preferably lead-free solder from the viewpoint of environmental protection.
  • the lead-free solder is not particularly limited, but includes, for example, Sn, and one or more elements selected from the group consisting of Bi, Sb, Cu, Ag, Zn, In, Ni, P, Ga, and Ge. including. That is, as the lead-free solder, for example, Sn-Bi-based solder, Sn-Sb-based solder, Sn-Cu-based solder, Sn-Ag-based solder, Sn-Zn-based solder, Sn-In-based solder, Sn-Ag- Cu-based solder, Sn-Cu-Ni-based solder, Sn-Zn-Bi-based solder, Sn-Ag-Cu-In-based solder, Sn-Bi-Cu-In-based solder, Sn-Ag-Bi-Cu-based solder, Sn-In-Ag-Bi solder, Sn-Cu-Ag-P-Ga solder, Sn-Cu-Ni-P-Ga solder, Sn
  • the melting point of the solder powder is preferably 80 ° C. or higher. This makes it possible to use a wide variety of solder powders.
  • the upper limit of the melting point of the solder powder is not particularly limited, but is, for example, the heat resistant temperature of the component (surface mount component). Specifically, the upper limit of the melting point of the solder powder is, for example, 300 ° C.
  • the range of the particle size distribution of the solder powder is preferably within the range of 10 ⁇ m or more and 40 ⁇ m or less.
  • the particle size of the solder powder is 10 ⁇ m or more, an increase in the viscosity of the solder composition is suppressed, and printability can be ensured.
  • the particle size of the solder powder is 40 ⁇ m or less, it is possible to supply the solder composition to such lands or the like even if the lands or pads of the substrate have a fine pitch.
  • the content of the solder powder is preferably 75% by mass or more and 90% by mass or less with respect to the total solid content of the solder composition.
  • the content of the solder powder is 75% by mass or more, the conductivity of the solder joint portion can be improved.
  • the content of the solder powder is 90% by mass or less, the reinforcing effect of the solder joint portion by the reinforcing portion can be improved.
  • the flux contains an epoxy resin (A), a phenol resin (B), a curing accelerator (C), and an activator (D).
  • the equivalent ratio of the phenol resin (B) to the epoxy resin (A) is preferably 0.1 or more and 1.0 or less.
  • the epoxy resin (A) can impart thermosetting property to the solder composition.
  • the epoxy resin (A) becomes a cured product and forms a reinforcing portion around the solder joint portion.
  • the epoxy resin (A) is not particularly limited, and examples thereof include a bisphenol F type epoxy resin.
  • the epoxy resin (A) is liquid at room temperature. This makes it easier to make the solder composition into a paste at room temperature.
  • the content of the epoxy resin (A) is preferably 20% by mass or more and 94% by mass or less with respect to the total mass of the solid content in the flux.
  • the reinforcing portion has good electrical insulation, and the reinforcing effect of the solder joint portion by the reinforcing portion can be improved.
  • the content of the epoxy resin (A) is 94% by mass or less, the phenol resin (B), the curing accelerator (C), and the activator (D) can be contained in the flux.
  • the phenol resin (B) is a compound having a phenolic hydroxyl group. Since this phenolic hydroxyl group reacts with the epoxy group of the epoxy resin (A), the phenolic resin (B) and the epoxy resin (A) are polymerized to form a cured product. That is, since the epoxy resin (A) has good curability by containing the phenol resin (B) in the solder composition, the proportion of the curing accelerator (C) can be reduced. Further, when the solder composition contains the phenol resin (B), the curing of the epoxy resin (A) and the desorption of formaldehyde by the imidazole compound tend to be slow.
  • the curing accelerator (C) contains an imidazole compound, the generation of gas during reflow can be reduced, and the wet spread of the molten solder powder is less likely to be hindered. That is, when mounting a component on a substrate using a solder composition, it is possible to obtain a solder joint portion having few insufficiently wetted portions.
  • the phenol resin (B) is not particularly limited, and examples thereof include polyfunctional phenols such as bisphenol A, phenol novolac, and cresol novolak.
  • the phenolic resin (B) can contain one or more of these components.
  • the phenolic resin (A) is liquid at room temperature. This makes it easier to make the solder composition into a paste at room temperature.
  • the content of the phenol resin (B) is preferably 0.1 or more and 1.0 or less in terms of the equivalent ratio with respect to the epoxy resin (A).
  • the content of the phenol resin (B) is 0.1 or more in the equivalent ratio with respect to the epoxy resin (A)
  • the epoxy resin (A) has good curability
  • the epoxy resin (A) has good curability. Curing and desorption of formaldehyde by the imidazole compound tend to be slow.
  • the content of the phenol resin (B) is 1.0 or less in an equivalent ratio to the epoxy resin (A)
  • unreacted phenol can be suppressed and deterioration of the insulating property due to moisture absorption is prevented. Can be done.
  • the content of the phenol resin (B) is more preferably 0.3 or more and 0.7 or less.
  • the curing accelerator (C) accelerates the curing of the epoxy resin (A).
  • the curing accelerator (C) contains at least one component selected from the group consisting of, for example, an imidazole compound, a tertiary amine compound, an organic phosphine compound, a metal soap and the like.
  • the curing accelerator (C) preferably contains an imidazole compound. When the curing accelerator (C) contains an imidazole compound, it becomes easy to control the reactivity of the resin.
  • the imidazole compound is not particularly limited, and is, for example, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s.
  • -Triazine isocyanuric acid adduct and 2-phenyl-4,5-dihydroxymethylimidazole can be mentioned.
  • the organic phosphine compound is not particularly limited, and examples thereof include tetraphenylphosphonium tetraphenylborate.
  • solder composition contains the phenol resin (B), it is possible to reduce the content of the imidazole compound.
  • the content of the curing accelerator (C) is preferably more than 0% by mass and 10% by mass or less with respect to the total mass of the epoxy resin (A) and the phenol resin (B). That is, when the curing accelerator (C) contains an imidazole compound, the content of the imidazole compound is more than 0% by mass and 10% by mass or less with respect to the total mass of the epoxy resin (A) and the phenol resin (B). It is preferable to have.
  • the epoxy resin (A) and the phenol resin (B) are good because the content of the imidazole compound is more than 0% by mass with respect to the total mass of the epoxy resin (A) and the phenol resin (B). It has curability and makes it easy to control the reactivity of the resin.
  • the content of the imidazole compound is 10% by mass or less with respect to the total mass of the epoxy resin (A) and the phenol resin (B), it is possible to reduce the generation of gas in the solder composition during reflow. Therefore, the wet spread of the molten solder powder is less likely to be hindered, and when the component is mounted on the substrate using the solder composition, a solder joint portion with few insufficient wetting portions can be obtained.
  • the content of the imidazole compound is more preferably 1% by mass or more and 8% by mass or less with respect to the total mass of the epoxy resin (A) and the phenol resin (B), and is 2% by mass or more and 6% by mass or less. It is particularly preferable to have.
  • the activator (D) contains an organic acid and an amine.
  • Organic acid has a flux action.
  • the flux action include a cleaning action, an antioxidant action, and a surface tension lowering action.
  • the cleaning action is an action of removing the oxide film of the solder powder and removing foreign substances on the surface such as the land of the substrate.
  • the solder composition is printed on the lands of the substrate.
  • Antioxidant action is an action to prevent oxidation of the solder joint.
  • the surface tension lowering action is an action of suppressing the molten solder powder from being rounded. By reducing the surface tension of the solder, the wettability of the solder is improved.
  • the organic acid is not particularly limited, but is not particularly limited, for example, glutaric acid, formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, lauric acid, myristic acid, pentadecic acid, palmitic acid and margarine.
  • Acid stearic acid, tubercrostearic acid, arachidic acid, behenic acid, lignoseric acid, glycolic acid, oxalic acid, malonic acid, succinic acid, adipic acid, pimelli acid, suberic acid, azelaic acid, sebasic acid, fumaric acid, malein
  • acids tartaric acid, diglycolic acid, dimer acid, levulinic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, anisic acid, citric acid, and picolinic acid.
  • the organic acid is a powder, it preferably passes through 120 mesh (opening 125 ⁇ m), more preferably 150 mesh (opening 100 ⁇ m). As a result, even if the lands of the substrate or the like have a fine pitch, it is possible to suppress the amount of printing of the solder composition on such lands or the like from varying. In addition, the reduction of the flux action of the organic acid can be suppressed.
  • the content of the organic acid is preferably 4.0% by mass or more and 39.0% by mass or less with respect to the total solid content of the flux.
  • the content of the organic acid is 4.0% by mass or more, the flux action of the organic acid can be improved.
  • the content of the organic acid is 39.0% by mass or less, aggregation of the solder powder is suppressed during storage of the solder composition. Further, when the solder composition is used for joining a component and a substrate, corrosion of a metal such as a solder joint is suppressed.
  • Amine has the effect of activating organic acids. That is, the amine has an action of activating the flux action of the organic acid. This makes it possible to reduce the content of organic acids in the solder composition. Since the organic acid does not react with the epoxy resin (A) and the phenol resin (B), the smaller the amount, the more preferable. Even if the content of organic acid is low, the flux action is ensured by the coexistence of amine during reflow.
  • amines can also function as a curing accelerator for epoxy resins.
  • Amines include primary amines, secondary amines, and tertiary amines.
  • the amine preferably contains a tertiary amine. Since the tertiary amine has lower reactivity with the epoxy resin than the primary amine and the secondary amine, it is possible to suppress an increase in the viscosity of the solder composition.
  • the amine more preferably contains a tertiary amine having a hydroxy group. When the amine has a hydroxy group, the cohesive force between the molten solder powders is improved, and when the component is mounted on the substrate using the solder composition, the solder spreads sufficiently easily and the electrode or pad is sufficiently wetted. It becomes easier to obtain a solder joint.
  • the amine content is preferably 1.0% by mass or more and 10.0% by mass or less with respect to the total solid content of the flux.
  • the amine content is 1.0% by mass or more, the flux action of the organic acid can be sufficiently brought out.
  • the amine content is 10.0% by mass or less, the reaction of the solder composition with the thermosetting resin during storage is suppressed.
  • the content of the activator (D) is preferably 5.0% by mass or more and 50% by mass or less with respect to the total solid content of the flux.
  • the content of the activator (D) is more preferably 5.0% by mass or more and 40.0% by mass or less with respect to the total solid content of the flux, and 10.0% by mass or more and 30.0% by mass or less. The following is particularly preferable.
  • the solder composition may further contain the tixogenicity-imparting agent (E).
  • the tix property-imparting agent (E) imparts tix property to the solder composition. Thereby, the printability of the solder composition can be improved.
  • the thixophilic imparting agent (E) is not particularly limited, and examples thereof include cured castor oil, polyamides, bisamides, dibenzylideneacetone sorbitol, kaolin, colloidal silica, organic bentonite, and glass frit.
  • An amide wax is preferable, a hydroxy fatty acid amide is more preferable, and N-hydroxyethyl-12-hydroxystearyl amide is more preferable.
  • the content of the thixo property-imparting agent (E) is preferably in the range of 1.5% by mass or more and 3.0% by mass or less with respect to the total mass of the solid content of the flux. As a result, it is possible to suppress sagging during printing while obtaining good printability.
  • the solder composition may contain a component (F) other than the epoxy resin (A), the phenol resin (B), the curing accelerator (C), the activator (D), and the thixotropic agent (E). ..
  • the component (F) can contain, for example, a component modifier such as rosin, an amine inactivating agent, a filler, a solvent and the like.
  • solder composition according to this embodiment can be prepared, for example, as follows. In the following, the thixo-imparting agent (E) is used, but the thixo-imparting agent (E) may not be used.
  • the epoxy resin (A), the phenol resin (B), and the thixotropic agent (E) are mixed and heated, and the thixotropic agent (E) is dissolved to obtain a first mixture.
  • the temperature at this time may be the temperature at which the thixophilic imparting agent (E) dissolves.
  • the flux is obtained by kneading the first mixture, the curing accelerator (C) and the activator (D) with a kneader.
  • solder powder is added to this flux and further kneaded to obtain a solder composition.
  • the kneading machine is not particularly limited, and examples thereof include a planetary mixer.
  • the solder composition according to this embodiment is used, for example, for fixing a component to a substrate by a surface mounting method.
  • the surface mount process includes a printing process, a component mounting process, and a reflow soldering process.
  • the solder composition is printed on the land of the board such as the printed wiring board by screen printing or the like.
  • parts are mounted on the printed board. Place the electrode of the component on the land of the board.
  • solder composition In the reflow soldering process, the board on which the parts are mounted is placed in a furnace and heated. As a result, the component and the substrate are joined by the joint portion having the solder joint portion and the reinforcing portion.
  • solder composition according to the present embodiment there are few bubbles generated inside the solder composition during reflow, and the molten solder powder easily wets and spreads well. Therefore, it is easy to obtain a solder joint portion with few insufficiently wetted portions.
  • the solder composition can also be used as a thermal interface material (TIM).
  • TIM thermal interface material
  • composition of the solder composition is as shown in Tables 1 to 5, and the details of the materials shown in Tables 1 to 5 are as follows.
  • solder powder Sn-Bi-based solder (Sn42Bi58, melting point 139 ° C., Type4 particle size distribution 20-38 ⁇ m) (flux) ⁇ Epoxy resin>
  • Epoxy resin 1 Bisphenol F type epoxy resin, EXA-835LV (manufactured by DIC Corporation, epoxy equivalent 160-170 g / eq, liquid at room temperature)
  • Epoxy resin 2 Biphenyl aralkyl type epoxy resin, NC-3000L (manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 261 to 282 g / eq, pale yellow marble at room temperature)
  • Epoxy resin 3 Trisphenol methane type epoxy resin, HP-7250 (manufactured by DIC Corporation, epoxy equivalent 162 g / eq, semi-solid)
  • Epoxy resin 4 Naphthalene type epoxy resin, HP-6000L (manufactured by DIC Corporation, epoxy equivalent 215 g / eq, solid at
  • Viscosity The viscosity (Pa ⁇ s) of the resin compositions of Examples 1 to 22 and Comparative Examples 1 to 4 at 25 ° C. and 5 rpm was measured.
  • An E-type viscometer manufactured by Toki Sangyo Co., Ltd., model number: RE-215U was used for measuring the viscosity. The results are shown in Tables 1-5.
  • Printability is such that the resin compositions of Examples 1 to 22 and Comparative Examples 1 to 4 are printed on a substrate having a Ni—Au pad (conductor) of ⁇ 250 ⁇ m and 0.5 mmP (manufactured by Panasonic, model number). : SP80) was printed via a metal mask, and the printed state was observed with a microscope to determine the state. A: No printing defects. C: There is a lack of printing.
  • the obtained image was binarized, and the ratio (%) of the area of the insufficiently wet portion to the whole was obtained. Further, based on this ratio (%), it was evaluated by the solder spread determination whether the molten solder powder was sufficiently spread. The evaluation was performed according to the following criteria.
  • C The ratio (%) of the area of the insufficiently wet part to the whole is 25% or more.
  • Curability of resin The curability of the reinforcing portion obtained in (4) above was determined according to the following criteria, and used as a criterion for determining the curability.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Cette composition de brasure contient une poudre de brasure et un flux. Le flux contient une résine époxy (A), une résine phénolique (B), un accélérateur de durcissement (C) et un activateur (D). Le rapport d'équivalence de la résine phénolique (B) par rapport à la résine époxy (A) est de 0,1 à 1,0.
PCT/JP2021/030365 2020-08-21 2021-08-19 Composition de brasure WO2022039221A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63278695A (ja) * 1986-11-04 1988-11-16 Harima Chem Inc クリ−ム半田
WO2010052871A1 (fr) * 2008-11-06 2010-05-14 住友ベークライト株式会社 Procédé de fabrication d’un dispositif électronique et dispositif électronique
JP2020075995A (ja) * 2018-11-07 2020-05-21 パナソニックＩｐマネジメント株式会社 硬化樹脂組成物および実装構造体
JP2020089897A (ja) * 2018-12-03 2020-06-11 パナソニックＩｐマネジメント株式会社 はんだペーストおよび実装構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63278695A (ja) * 1986-11-04 1988-11-16 Harima Chem Inc クリ−ム半田
WO2010052871A1 (fr) * 2008-11-06 2010-05-14 住友ベークライト株式会社 Procédé de fabrication d’un dispositif électronique et dispositif électronique
JP2020075995A (ja) * 2018-11-07 2020-05-21 パナソニックＩｐマネジメント株式会社 硬化樹脂組成物および実装構造体
JP2020089897A (ja) * 2018-12-03 2020-06-11 パナソニックＩｐマネジメント株式会社 はんだペーストおよび実装構造体

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Epoxy unit product information", MITSUBISHI CHEMICAL CORPORATION, 1 January 2021 (2021-01-01), XP055901056, Retrieved from the Internet <URL:http://www.mcc-epoxy.jp/catalog/pdf/catalog.pdf> *
ANONYMOUS: "Other hardeners for epoxy resin", 1 January 2021 (2021-01-01), XP055901052, Retrieved from the Internet <URL:https://www.meiwakasei.co.jp/product/product05.html> *
ANONYMOUS: "Solvent-free room temperature liquid type", 1 January 2021 (2021-01-01), XP055901050, Retrieved from the Internet <URL:https://www.meiwakasei.co.jp/product/product02.html> *

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