WO2022037523A1 - 半导体加工设备的开锁机构、半导体加工设备 - Google Patents

半导体加工设备的开锁机构、半导体加工设备 Download PDF

Info

Publication number
WO2022037523A1
WO2022037523A1 PCT/CN2021/112751 CN2021112751W WO2022037523A1 WO 2022037523 A1 WO2022037523 A1 WO 2022037523A1 CN 2021112751 W CN2021112751 W CN 2021112751W WO 2022037523 A1 WO2022037523 A1 WO 2022037523A1
Authority
WO
WIPO (PCT)
Prior art keywords
key
preset position
rotate
link
unlocking mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/112751
Other languages
English (en)
French (fr)
Inventor
孙晋博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Priority to JP2023507602A priority Critical patent/JP7402379B2/ja
Priority to KR1020227046460A priority patent/KR102571465B1/ko
Publication of WO2022037523A1 publication Critical patent/WO2022037523A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B47/00—Operating or controlling locks or other fastening devices by electric or magnetic means
    • E05B47/0001—Operating or controlling locks or other fastening devices by electric or magnetic means with electric actuators; Constructional features thereof
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B51/00—Operating or controlling locks or other fastening devices by other non-mechanical means
    • E05B51/02—Operating or controlling locks or other fastening devices by other non-mechanical means by pneumatic or hydraulic means
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B65/00—Locks or fastenings for special use
    • E05B65/006—Locks or fastenings for special use for covers or panels
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B65/00—Locks or fastenings for special use
    • E05B65/52—Other locks for chests, boxes, trunks, baskets, travelling bags, or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2999/00—Subject-matter not otherwise provided for in this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the technical field of semiconductor processing equipment, and in particular, to an unlocking mechanism of semiconductor processing equipment and semiconductor processing equipment.
  • wafer storage boxes are generally used to store and transport wafers in a semiconductor production process workshop.
  • the existing film storage box includes a box body with an opening on one side and a box cover for closing the opening, the box cover can be movably connected with the box body, and the box cover also has a lock body structure. The movement of the mechanism controls the locking or unlocking of the sealing door by the lock body structure, so as to be able to control the switching of the box cover between the closed state and the openable state.
  • the key of the unlocking structure is usually inserted into the key slot of the lock body structure, and the box cover is switched between the closed state and the open state by rotating the key.
  • the key needs to be taken out from the key slot, The contact between the key and the keyway will cause friction, and the particles generated by the friction may contaminate the wafer, thereby affecting the production yield of the wafer.
  • the present application discloses a semiconductor processing equipment, which can solve the problem that the particles generated during the unlocking process easily contaminate the wafer.
  • the embodiment of the present application discloses an unlocking mechanism for semiconductor processing equipment, the unlocking mechanism is used to open or close a lock body structure on a sealed door of a film storage box, the unlocking mechanism includes a key and a driving device, and the key can be moved into Or remove the key slot of the lock body structure, and the key is inserted and matched with the key slot;
  • the driving device is connected with the key, and is used for driving the key to rotate from an initial position to a first preset position that can make the sealing door open when the sealing door is in a closed state;
  • driving the key to rotate from the first preset position to a second preset position capable of making the airtight door in the closed state;
  • the drive device is further configured to drive the key to rotate from the second preset position to the second preset position after the drive device drives the key to rotate from the first preset position to the second preset position.
  • the initial position, the key and the key slot are not in contact with the key slot in the initial position.
  • an embodiment of the present application further discloses a semiconductor processing equipment, including a sealing door of a storage box and an unlocking mechanism, wherein a lock body structure is provided on the sealing door, and the unlocking mechanism is used to open or When closing the lock body structure, it is characterized in that the unlocking mechanism adopts the aforementioned unlocking mechanism disclosed in the embodiments of the present application.
  • the driving device is connected to the key, and is used to drive the key to rotate from the initial position to the first preset position that can make the sealing door open when the sealing door is in the closed state.
  • the drive key is rotated from the first preset position to the second preset position that can make the sealing door in the closed state, so that the sealing door can be opened and closed. switch between.
  • the above-mentioned driving device is also used for driving the key to rotate from the above-mentioned second predetermined position to the initial position after the driving device drives the key to rotate from the first predetermined position to the second predetermined position, and the key and the key slot are in the initial position No contact, that is to say, the above-mentioned driving device first drives the key to rotate to the second preset position to ensure that the sealing door is closed, and then drives the key to rotate from the second preset position to the original position.
  • the key slots are not in contact.
  • the semiconductor processing equipment disclosed in the present application by using the above-mentioned unlocking mechanism disclosed in the embodiment of the present application, can reduce the generation of particulate matter, reduce the pollution of the wafer by the particulate matter, thereby improve the production yield of the wafer, and finally solve the problem of easy contamination during the unlocking process. Wafer problem.
  • FIG. 1 is a schematic structural diagram of a semiconductor processing apparatus disclosed in an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a film storage box disclosed in an embodiment of the application.
  • FIG. 3 is a schematic structural diagram of a lock body structure disclosed in an embodiment of the application in a locked state
  • Fig. 4 is the positional relationship diagram of the key and the key slot
  • FIG. 5 is a schematic structural diagram of the lock body structure disclosed in an embodiment of the application in an unlocked state
  • FIG. 6 is a partial structural schematic diagram of the unlocking mechanism disclosed in the embodiment of the present application from a viewing angle
  • FIG. 7 is a partial structural schematic diagram of the unlocking mechanism disclosed in the embodiment of the application from another perspective
  • Fig. 8 is the partial enlarged schematic diagram of Fig. 3;
  • Fig. 9 is the partial enlarged schematic diagram of Fig. 5;
  • FIG. 10A is a motion process diagram of the driving device disclosed in the embodiment of the application in the first stroke
  • FIG. 10B is a motion process diagram of the driving device disclosed in the embodiment of the application in the second stroke
  • 200-storage box 210-box body, 220-sealed door, 230-lock body structure, 231-key slot, 232-turntable, 232a-arc slot, 233-lock lever, 233a-slider;
  • 300-unlocking mechanism 310-key, 311-connecting part, 320-driving device, 321-telescopic mechanism, 322-first link, 323-second link, 330-linkage mechanism, 340-limiting part, 341 -Limit block, 342-stop block.
  • first”, “second” and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that data so used may be interchanged under appropriate circumstances so that embodiments of the application can be practiced in sequences other than those illustrated or described herein.
  • the objects distinguished by “first”, “second”, etc. are usually one type, and the number of objects is not limited.
  • the first object may be one or more than one.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the associated objects are in an "or” relationship.
  • an embodiment of the present application discloses a semiconductor processing equipment.
  • the disclosed semiconductor processing equipment includes a chamber part 100 and an unlocking mechanism 300 .
  • the chamber part 100 may include a transfer chamber, a process chamber, etc.
  • the storage box 200 used by the semiconductor processing equipment is located outside the chamber part 100.
  • the door 220 is provided with a lock body structure 230 for locking or unlocking the sealing door 220 so that it can be in a closed state or an openable state.
  • the so-called closed state means that the sealing door 220 is in a closed position with the box body 210,
  • the so-called openable state refers to the state where the sealing door 220 is in a closed position with the box body 210 , but the sealing door 220 can be opened.
  • the unlocking mechanism 300 is used to open or close the above-mentioned lock body structure 230 to realize the locking or unlocking of the sealing door 220 by the lock body structure 230 .
  • the wafers are initially placed in the cassette 200, and the cassette 200 is transferred by the corresponding manipulator to the carrier set on the front side of the unlocking mechanism 300 (as shown in FIG. The position of the film box 200), and then, the lock body structure 230 is unlocked by the unlocking mechanism 300, so that the lock body structure 230 unlocks the sealing door 220, so that the sealing door 220 can be opened.
  • the robot in 100 transfers the wafers in the storage box 200 to the wafer boat in the chamber part 100, and then the wafer is sent into the chamber part 100 for processing by the wafer boat. After the wafer processing is completed, it passes through the chamber part.
  • the robot in 100 puts the wafer back into the storage box 200, then closes the sealing door 220, and then closes the lock body structure 230 through the unlocking mechanism 300, so that the lock body structure 230 locks the sealing door 220, and the process is completed. .
  • the lock body structure 230 is provided with a key slot 231
  • the unlocking mechanism 300 includes a key 310 and a driving device 320
  • the key 310 can be moved into or out of the key slot 231 ;
  • the key 310 can be driven to rotate by the driving device 320 to drive the key slot 231 to rotate accordingly.
  • the size of the key slot 231 is slightly larger than that of the key 310, that is, there is a gap between the key 310 and the key slot 231, which makes the rotation angle of the key 310 and the key slot 231 different.
  • the driving device 320 is used to rotate the driving key 310 from the initial position to the first preset position that can make the sealing door 220 open when the sealing door 220 is in the closed state; when the sealing door 220 is in the openable state In the state, the driving key 310 is rotated from the first preset position to the second preset position which can keep the sealing door 220 in the closed state.
  • the above-mentioned first preset position satisfies: ensuring that the sealing door 220 is in an openable state, that is, can be normally opened; the above-mentioned second preset position satisfies: ensuring that the sealing door 220 is in a closed state, that is, can be normally closed .
  • the airtight door 220 When the key slot 231 is in a vertical state, the airtight door 220 is in a closed state; when the key slot 231 is in a horizontal state, the airtight door 220 is in an openable state, and when the airtight door 220 needs to be switched from the closed state to the openable state, Insert the key 310 into the key slot 231, at this time the key 310 is in a vertical state, and the position corresponding to this state is the initial position; then, the key 310 is driven by the driving device 320 to rotate clockwise from the vertical state ( ⁇ + ⁇ ) angle, the key 310 is in the first preset position, and the key slot 231 can rotate with the key 310 by an angle ⁇ , that is, reach a horizontal state, so that the sealed door 220 can be switched to an openable state.
  • the key 310 is driven by the driving device 320 to rotate counterclockwise from the first preset position by an angle ( ⁇ +2 ⁇ ), and the key 310 is in the above-mentioned first preset position.
  • the key slot 231 can be rotated with the key 310 by an angle ⁇ , that is, the vertical state is reached, so that the sealing door 220 can be switched to the closed state. Thereby, it can be ensured that the sealing door 220 can be normally opened or closed.
  • the drive device 320 is further configured to rotate the drive key 310 from the second preset position to the initial position after the drive device 320 drives the key 310 to rotate from the first preset position to the second preset position, The key 310 is not in contact with the key slot 231 in the above-described initial position.
  • the key 310 when the key 310 is in the above-mentioned second preset position, there is an included angle (ie, the difference ⁇ ) between the key 310 and the key slot 231 in the vertical state, causing the key 310 and the key slot 231 to contact each other (eg, 4), at this time, if the key 310 is taken out from the key slot 231, the key 310 will rub against the key slot 231 to generate particulate matter, which may cause the particulate matter to contaminate the wafer.
  • the difference ⁇ the included angle
  • the key 310 can be brought into a vertical state, so that the key 310 does not contact the key slot 231, and is taken out from the key slot 231 at this time.
  • friction is not easily generated between the key 310 and the key slot 231, thereby reducing the generation of particulate matter, reducing the particle contamination of the wafer, thereby improving the production yield of the wafer, and finally solving the problem of easily contaminating the wafer during the unlocking process. .
  • the key 310 is moved into the key slot 231, so that the key 310 is inserted and matched with the key slot 231, and then the driving device 320 starts to work to drive the key 310 to rotate to the above-mentioned first preset position, so as to ensure
  • the sealing door 220 can be opened normally.
  • the wafers in the storage box 200 are transferred to the chamber part 100 by the robot for processing.
  • the wafers are put back by the robot. into the storage box 200.
  • the key 310 is driven by the driving device 320 to rotate from the first preset position to the second preset position to ensure that the sealing door 220 can be closed normally, and then the key is driven by the driving device 320.
  • 310 is rotated from the second preset position to the above-mentioned initial position, so that the key 310 does not contact the key slot 231, and then the key 310 is taken out from the key slot 231 to complete the process.
  • the unlocking mechanism 300 disclosed in the present application can not only ensure that the sealing door 220 can be normally opened or closed, but also can reduce the generation of particulate matter, reduce the pollution of the wafer by the particulate matter, thereby improving the production yield of the wafer, and finally solve the problem of unlocking It is easy to contaminate the wafer during the process.
  • the above-mentioned driving device 320 includes a telescopic mechanism 321 and a link mechanism, wherein the telescopic mechanism 321 is used to drive the above-mentioned link mechanism to move according to a preset first stroke and a second stroke, and the link mechanism is connected with the key 310.
  • the telescopic mechanism 321 is used to drive the above-mentioned link mechanism to move according to a preset first stroke and a second stroke, and the link mechanism is connected with the key 310.
  • the telescopic mechanism 321 always drives the above-mentioned link mechanism to move along the first linear direction (ie, the direction A in FIG. 10A ), so that the link structure can drive the key 310 from the initial position along the first Rotate in one direction (ie, counterclockwise in FIG. 10A ) to the above-mentioned second preset position (not shown in the figure), and then from the second preset position in a second direction opposite to the first direction (ie, , the clockwise direction in FIG. 10A ) is rotated to the above-mentioned first preset position (that is, the position of (3) in FIG.
  • the key slot 231 can reach the horizontal state, thereby realizing the self-closing state of the sealing door 220 Switch to open state.
  • a horizontal state ie, the position of (2) in FIG. 10A
  • the sealing door 220 cannot be opened normally, and when the key 310 continues to rotate from the horizontal state to the above-mentioned first preset position, the key slot 231 is rotated to the horizontal state.
  • the door 220 can be opened normally.
  • the telescopic mechanism 321 is always along the second linear direction opposite to the first linear direction (that is, as shown in FIG. 10B ).
  • the direction B in 10A drives the link mechanism to move, so that the link structure can drive the key 310 from the above-mentioned first preset position (ie, the position shown in (3) in FIG. 10A ) along the first direction (ie , counterclockwise in FIG. 10B ) to the above-mentioned second preset position (ie, the position of (2) in FIG. 10B ), and then from the second preset position along the second direction (ie, in FIG.
  • Table 1 is the correspondence table between the rotation direction, position and angle of the key and the state of the airtight door in the first process and the second process.
  • the telescopic mechanism 321 always drives the above-mentioned link mechanism to move in the first linear direction, and the key 310 is driven by the link mechanism to rotate counterclockwise first, and then rotate clockwise. That is, the direction of rotation has changed; in the above-mentioned second stroke, the telescopic mechanism 321 always drives the above-mentioned link mechanism to move in the second linear direction, and the key 310 is driven by the link mechanism to rotate counterclockwise first and then clockwise.
  • the rotation direction has also changed, and in the second stroke, this change in the rotation direction can realize the rotation of the key 310 from the second preset position to the initial position, so that the key 310 and the key slot 231 are not in contact with the above-mentioned initial position
  • the telescopic mechanism 321 since the telescopic mechanism 321 can keep the same direction unchanged, the telescopic mechanism 321 does not need to be turned in the middle, does not need to extend and retract multiple times, and does not need multi-point positioning, which not only simplifies the movement of the telescopic mechanism 321, but also facilitates Under the control of the staff, the telescopic mechanism 321 is not easily damaged, and either a linear motor or an air cylinder can be selected as the telescopic mechanism 321, so that the selection range of the telescopic mechanism 321 can be expanded.
  • the first stroke may be the retraction stroke of the telescopic mechanism 321
  • the second stroke may be the extension stroke of the telescopic mechanism 321 .
  • the link mechanism includes a first link 322 and a second link 323 , wherein the first link of the first link 322 is the first link 322 .
  • the end is hinged with the telescopic rod of the telescopic mechanism 321
  • the second end of the first link 322 is hinged with the first end of the second link 323
  • the key 310 is connected with the second end of the second link 323 .
  • the first link 322 can drive the first end of the second link 323 to rotate around the second end of the second link 323 in the first direction or the second direction.
  • the rod 323 can drive the key 310 to rotate concentrically, that is, the rotation center of the second link 323 coincides with the rotation center of the key 310 .
  • the telescopic mechanism 321 drives the first link 322 to move, so that the first link 322 drives the second link 323 to rotate in the first direction or the second direction, thereby driving the key 310 Rotate in the first direction or the second direction.
  • the structure and size of the first link 322 and the second link 323 can be designed according to specific needs, so that the key 310 can achieve the rotation direction, position and angle in the first and second processes.
  • the airtight door 220 is usually provided with at least two lock body structures 230, and the at least two lock body structures 230 can make the airtight door 220 more stable when the airtight door 220 is in a closed state It is connected to the box body 210.
  • the key slot 231, the key 310 and the second link 323 can be at least two , the second link 323 is connected with the keys 310 in one-to-one correspondence, and each key 310 can be moved into or out of its corresponding key slot; as shown in FIG. 6 and FIG.
  • the unlocking mechanism 300 may also include a linkage mechanism 330, At least two of the second links 323 are connected through the linkage mechanism 330 , the second end of the first link 322 is hinged with the first end of one of the second links 323 , and driven by the telescopic mechanism 321 , the first link The 322 can drive the at least two second connecting rods 323 to rotate synchronously through the linkage mechanism 330 , thereby driving the at least two keys 310 to rotate synchronously, thereby realizing the simultaneous unlocking of the at least two lock body structures 230 .
  • the unlocking mechanism 300 has at least two keys 310, and the at least two keys 310 can rotate synchronously, so that the at least two lock body structures 230 on the sealing door 220 can be unlocked or closed synchronously. , thereby improving the unlocking efficiency.
  • the setting of the linkage mechanism 330 can realize that a single driving device 320 simultaneously drives at least two keys 310 to rotate synchronously, thereby not only reducing the structural complexity of the unlocking mechanism 300, but also reducing the cost of the unlocking mechanism 300.
  • the second link 323 may include a body and a connecting portion 311 , the second end of the first link 322 is hinged with the body, and the linkage mechanism 330 is connected with the connecting portion 311 of each second link 323 .
  • the key 310 rotates concentrically with the body, and the connecting portion 311 can provide a connection position for the linkage mechanism 330 and the second link 323, which is convenient for the linkage mechanism 330 to be connected with the second link 323, so as to facilitate the installation of the unlocking mechanism 300 by the staff and reduce the designer's Design difficulty.
  • the driving device 320 can synchronously drive the at least two second links 323 to rotate through the linkage mechanism 330 .
  • the linkage mechanism 330 can include a connecting rod, and each connecting portion 311 is hinged with the connecting rod. When one of the connecting parts 311 rotates, the connecting rod is driven to move, thereby driving the other connecting parts 311 to rotate.
  • the linkage mechanism 330 has a simple structure, is easy to set up, has a low cost, and has a better transmission effect of the connecting rod.
  • the connecting rod can be a telescopic rod, which is convenient for the staff to adjust the rotation angle of the key 310, so that the key 310 can be completely unlocked or locked.
  • the unlocking mechanism 300 may further include a limiting portion 340, and the limiting portion 340 may be used to limit the telescopic rod of the telescopic mechanism 321 according to the above-mentioned section.
  • the distance moved by one stroke or the second stroke that is, the displacement of the telescopic mechanism 321 along the first linear direction or the second linear direction, so as to avoid excessive rotation of the key 310, so that the key 310 can be rotated to a predetermined position more accurately,
  • the accuracy of unlocking or locking of the key 310 is improved.
  • the limiter 340 may include a limit block 341 and a stop block 342, the limit block 341 may be fixedly arranged, and the stop block 342 may be provided on the telescopic rod, and can be used when the telescopic rod presses the above-mentioned first stroke or During the movement of the second stroke, it is in contact with the limit block 341 to prevent the telescopic rod from continuing to move.
  • the limit process is simple and the limit is reliable.
  • the stopper block 342 can be an elastic block or an elastic piece is provided on the stopper block 342 to achieve elastic limit and avoid hard contact.
  • the telescopic mechanism 321 can be of various types, such as a hydraulic telescopic rod.
  • the telescopic mechanism 321 can be a linear motor or an air cylinder. The driving of the linear motor and the cylinder is reliable and the technology is mature, which is beneficial to improve the stability of the unlocking mechanism 300 .
  • the lock body structure 230 may include a key slot 231 , a turntable 232 and a lock lever 233 , wherein the lock lever 233 is movably connected with the sealing door 220 and can be moved to make the sealing door 220 The locked position in the closed state (ie, the position of the lock lever 233 in FIG. 3 ), or the unlocked position in which the sealing door 220 is openable (ie, the position of the lock lever 233 in FIG. 5 ).
  • the lock lever 233 is movably connected with the sealing door 220 and can be moved to make the sealing door 220 The locked position in the closed state (ie, the position of the lock lever 233 in FIG. 3 ), or the unlocked position in which the sealing door 220 is openable (ie, the position of the lock lever 233 in FIG. 5 ).
  • one end of the locking rod 233 protrudes to the outside of the side relative to the side of the sealing door 220 so as to be able to extend into the corresponding fixing groove in the box body 210 , so as to realize the locking of the sealing door 220 lock.
  • one end of the locking rod 233 is retracted to the inner side of the side edge of the sealing door 220 so as to be able to move out from the corresponding fixing groove in the box body 210 , thereby realizing the unlocking of the sealing door 220 .
  • the turntable 232 is movably connected with the lock lever 233, and the turntable 232 is fixedly connected with a connecting piece, and the connecting piece is provided with the above-mentioned key slot 310; when the above-mentioned driving device 320 drives the key 310 in the key slot 310 to rotate, the key 310 passes through the It cooperates with the key slot 310 to drive the turntable 232 to rotate, so that the turntable 232 synchronously drives the lock rod 233 to move to the locking position or the unlocking position.
  • the structure of the lock body structure 230 of this structure is simple and reliable, and is convenient to set up, so that the structural complexity of the unlocking mechanism 300 can be reduced, and the design difficulty of the designer can be reduced.
  • the turntable 232 is movably connected to the locking rod 233.
  • the turntable 232 is provided with an arc-shaped groove 232a; It is movably connected with the turntable 232 and can rotate along the arc-shaped groove 232 a , and the other end of the sliding piece 233 a is fixedly connected with the locking rod 233 .
  • the sliding member 233a is, for example, a protrusion disposed on the locking rod 233 and protruding relative to the rod body of the locking rod 233. The protrusion penetrates the arc-shaped groove 232a and can rotate along the arc-shaped groove 232a.
  • a plurality of lock bars 233 there are a plurality of lock bars 233 and are arranged in pairs, and the pair of two lock bars 233 are arranged at intervals in the vertical direction in FIGS. 3 and 5 , and a turntable 232 is arranged at the interval between them.
  • the pair of two lock bars 233 are arranged at intervals in the vertical direction in FIGS. 3 and 5
  • a turntable 232 is arranged at the interval between them.
  • the above-mentioned arc grooves 232a are two, and are arranged symmetrically with respect to the rotation center of the turntable 232, and there are two sliding members 233a, and one end of the two is respectively connected with the pair of two locking bars 233.
  • the other ends of the two are movably connected with the turntable 232 and can rotate along the two arc-shaped grooves 232a respectively.
  • the sliding member 233a is located at one end of the arc-shaped slot 232a.
  • the turntable 232 rotates clockwise accordingly.
  • the sliding member 233a slides along the arc-shaped groove 232a to drive the locking rod 233 to move.
  • the paired two locking rods 233 move toward each other until the sliding member 233a slides to the position of the arc-shaped groove 232a.
  • the turntable 232 drives the locking rod 233 to move through the sliding cooperation of the sliding member 233a and the arc groove 232a, which can further reduce the structural complexity of the unlocking mechanism 300 and the design difficulty of designers.
  • the turntable 232 can also use any other structure to drive the lock rod 233 to move.
  • the turntable 232 can be provided with a gear
  • the lock rod 233 can be provided with a rack
  • the turntable 232 can be driven by the meshing of the gear and the rack.
  • the lock lever 233 moves.
  • the turntable 232 and the locking rod 233 may also use a cam mechanism, a crank-slider structure, a screw transmission mechanism, and the like.
  • the embodiment of the present application also discloses a semiconductor processing equipment.
  • the disclosed semiconductor processing equipment includes a chamber part 100 and an unlocking mechanism 300.
  • the chamber part 100 may include a transfer chamber, a process chamber, etc.
  • the storage box 200 used by the semiconductor processing equipment is located outside the chamber part 100 .
  • the storage box 200 includes a box body 210 With the sealing door 220 movably connected with the box body 210, the sealing door 220 is provided with a lock body structure 230 for locking or unlocking the sealing door 220 so that it can be in a closed state or an openable state.
  • the unlocking mechanism 300 is used to open or close the lock body structure 230 to achieve locking or unlocking of the sealing door 220 by the lock body structure 230 , and the unlocking mechanism adopts the unlocking mechanism disclosed in the embodiments of the present application.
  • the driving device is connected with the key, and is used to drive the key to rotate from the initial position to the sealing position when the sealing door is in the closed state.
  • the door is in the first preset position of the openable state; when the sealed door is in the openable state, the drive key is rotated from the first preset position to the second preset position that can make the sealed door in the closed state, thereby sealing can be achieved.
  • the door is switched between the open state and the closed state.
  • the above-mentioned driving device is also used for driving the key to rotate from the above-mentioned second predetermined position to the initial position after the driving device drives the key to rotate from the first predetermined position to the second predetermined position, and the key and the key slot are in the initial position No contact, that is to say, the above-mentioned driving device first drives the key to rotate to the second preset position to ensure that the sealing door is closed, and then drives the key to rotate from the second preset position to the original position.
  • the key slots are not in contact.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lock And Its Accessories (AREA)

Abstract

本申请公开一种半导体加工设备的开锁机构、半导体加工设备，该开锁机构用于打开或关闭储片盒的密封门上的锁体结构，开锁机构包括钥匙和驱动装置，钥匙能够移入或移出锁体结构的钥匙槽，且钥匙与钥匙槽插接配合；驱动装置与钥匙连接，用于在密封门处于关闭状态时，驱动钥匙自初始位置旋转至能够使密封门处于可开状态的第一预设位置；在密封门处于可开状态时，驱动钥匙自第一预设位置旋转至能够使密封门处于关闭状态的第二预设位置；驱动装置还用于在驱动装置驱动钥匙自第一预设位置旋转至第二预设位置之后，驱动钥匙自第二预设位置旋转至初始位置，钥匙与钥匙槽在初始位置不相接触。上述方案能够解决在开锁过程中容易污染晶圆的问题。

Description

半导体加工设备的开锁机构、半导体加工设备 技术领域
本申请涉及半导体加工设备技术领域，尤其涉及一种半导体加工设备的开锁机构、半导体加工设备。
背景技术
在半导体加工设备中，对成膜均匀性、成膜质量、金属离子污染控制和颗粒污染控制等核心工艺参数都有非常高的要求。在晶圆的制造过程中，微粒子的污染是影响晶圆的生产良率的主要原因之一，因此需要严格地控制颗粒对晶圆的污染。
目前，为了控制颗粒对晶圆的污染，在半导体生产工艺车间内，一般采用储片盒(或者称为晶圆盒)存放和传送晶圆。现有的储片盒包括一侧具有开口的盒体和用于封闭该开口的盒盖，该盒盖可以与盒体活动连接，并且该盒盖还具有锁体结构，通常情况下，通过开锁机构的移动来控制该锁体结构对密封门的锁定或解锁，以能够控制盒盖在关闭状态和可开状态之间切换。
具体地，通常将开锁结构的钥匙插入至锁体结构的钥匙槽中，并通过旋转钥匙来实现盒盖在关闭状态和可开状态之间切换，但是，当需要从钥匙槽中取出钥匙时，钥匙与钥匙槽之间因接触会产生摩擦，摩擦产生的颗粒可能会污染晶圆，进而影响晶圆的生产良率。
发明内容
本申请公开一种半导体加工设备，能够解决在开锁过程中产生颗粒容易污染晶圆的问题。
为了解决上述问题，本申请采用下述技术方案：
本申请实施例公开一种半导体加工设备的开锁机构，所述开锁机构用于打开或关闭储片盒的密封门上的锁体结构，所述开锁机构包括钥匙和驱动装置，所述钥匙能够移入或移出所述锁体结构的钥匙槽，且所述钥匙与所述钥匙槽插接配合；
所述驱动装置与所述钥匙连接，用于在所述密封门处于关闭状态时，驱动所述钥匙自初始位置旋转至能够使所述密封门处于可开状态的第一预设位置；在所述密封门处于所述可开状态时，驱动所述钥匙自所述第一预设位置旋转至能够使所述密封门处于所述关闭状态的第二预设位置；
所述驱动装置还用于在所述驱动装置驱动所述钥匙自所述第一预设位置旋转至所述第二预设位置之后，驱动所述钥匙自所述第二预设位置旋转至所述初始位置，所述钥匙与所述钥匙槽在所述初始位置不相接触。
作为另一个技术方案，本申请实施例还公开一种半导体加工设备，包括储片盒的密封门和开锁机构，其中，所述密封门上设置有锁体结构，所述开锁机构用于打开或关闭所述锁体结构，其特征在于，所述开锁机构采用本申请实施例公开的上述开锁机构。
本申请采用的技术方案能够达到以下有益效果：
本申请公开的半导体加工设备的开锁机构的技术方案中，驱动装置与钥匙连接，用于在密封门处于关闭状态时，驱动钥匙自初始位置旋转至能够使密封门处于可开状态的第一预设位置；在密封门处于可开状态时，驱动钥匙自第一预设位置旋转至能够使密封门处于关闭状态的第二预设位置，由此可以实现密封门在可开状态与关闭状态之间的切换。同时，上述驱动装置还用于在驱动装置驱动钥匙自第一预设位置旋转至第二预设位置之后，驱动钥匙自上述第二预设位置旋转至初始位置，钥匙与钥匙槽在该初始位置不相接触，也就是说，上述驱动装置先驱动钥匙旋转至第二预设位置，以确保密封门关闭，后驱动钥匙自该第二预设位置旋转至初始位置，由于在该初始位置 钥匙与钥匙槽不相接触，此时从钥匙槽中取出钥匙时，钥匙与钥匙槽之间不易产生摩擦，从而可以减少颗粒物的产生，减少颗粒物污染晶圆，进而提高晶圆的生产良率，最终解决在开锁过程中容易污染晶圆的问题。
本申请公开的半导体加工设备，其通过采用本申请实施例公开的上述开锁机构，可以减少颗粒物的产生，减少颗粒物污染晶圆，进而提高晶圆的生产良率，最终解决在开锁过程中容易污染晶圆的问题。
附图说明
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1为本申请实施例公开的半导体加工设备的结构示意图；
图2为本申请实施例公开的储片盒的结构示意图；
图3为本申请实施例公开的锁体结构在处于锁定状态下的结构示意图；
图4为钥匙和钥匙槽的位置关系图；
图5为本申请实施例公开的锁体结构在处于解锁状态下的结构示意图；
图6为本申请实施例公开的开锁机构在一视角下的部分结构示意图；
图7为本申请实施例公开的开锁机构在另一视角下的部分结构示意图；
图8为图3的局部放大示意图；
图9为图5的局部放大示意图；
图10A为本申请实施例公开的驱动装置在第一行程中的运动过程图；
图10B为本申请实施例公开的驱动装置在第二行程中的运动过程图；
附图标记说明：
100-腔室部；
200-储片盒、210-盒体、220-密封门、230-锁体结构、231-钥匙槽、232- 转盘、232a-弧形槽、233-锁杆、233a-滑动件；
300-开锁机构、310-钥匙、311-连接部、320-驱动装置、321-伸缩机构、322-第一连杆、323-第二连杆、330-联动机构、340-限位部、341-限位块、342-止动块。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请各个实施例公开的技术方案进行详细地说明。
请参考图1，本申请实施例公开一种半导体加工设备，所公开的半导体加工设备包括腔室部100和开锁机构300，一般来说，腔室部100可以包括传输腔室、工艺腔室等，该半导体加工设备使用的储片盒200位于腔室部100之外，如图2和图3所示，储片盒200包括盒体210和与该盒体210活动连接的密封门220，密封门220上设置有锁体结构230，用以锁定或解锁密封 门220，以使其能够处于关闭状态或者可开状态，所谓关闭状态，是指密封门220位于与盒体210闭合的位置，且密封门220在锁体结构230的锁定下无法被开启的状态；所谓可开状态，是指密封门220位于与盒体210闭合的位置，但密封门220可以被开启的状态。开锁机构300用于开启或关闭上述锁体结构230，以实现锁体结构230对密封门220的锁定或解锁。
在具体的工作过程中，晶圆最初是放置在储片盒200内的，由相应的机械手，将储片盒200传输到设置在开锁机构300前端一侧的载台上(如图1中储片盒200所在位置处)，然后，通过开锁机构300开启锁体结构230，以使锁体结构230解除对密封门220的锁定，从而能够打开密封门220，此种状态下，通过腔室部100中的机械手将储片盒200内的晶圆传送至腔室部100中的晶舟上，再由晶舟送入腔室部100内进行加工，在晶圆加工完成后，通过腔室部100中的机械手将晶圆重新放回至储片盒200内，然后关闭密封门220，再通过开锁机构300关闭锁体结构230，以使锁体结构230对密封门220进行锁定，完成工艺过程。
具体地，如图3、图6以及图7所示，锁体结构230开设有钥匙槽231，开锁机构300包括钥匙310和驱动装置320，钥匙310能够移入或移出钥匙槽231；驱动装置与所述钥匙连接，在钥匙310移入钥匙槽231之后，可以通过驱动装置320驱动钥匙310旋转，来带动钥匙槽231随之旋转。为了方便钥匙310的移入或移出，钥匙槽231的尺寸会稍大于钥匙310的尺寸，即钥匙310和钥匙槽231之间会有间隙，这使得钥匙310和钥匙槽231的旋转角度会存在差异。例如，如图4所示，当钥匙310从水平状态沿逆时针方向旋转θ角度(即，90°)时，钥匙310处于竖直状态，而钥匙槽231因二者之间间隙的存在而只能随钥匙310旋转至(θ-α)角度，此时钥匙310和钥匙槽231的旋转角度存在差值α，该差值α的大小由上述间隙决定。同理，当钥匙310从竖直状态沿顺时针方向旋转θ角度(即，90°)时，钥匙310 和钥匙槽231的旋转角度同样存在差值α。由于差值α的存在，会导致锁体结构230因钥匙槽231未旋转到位而无法正常锁定或解锁，从而造成密封门220无法正常打开或关闭。
为了解决上述问题，驱动装置320用于在密封门220处于关闭状态时，驱动钥匙310自初始位置旋转至能够使密封门220处于可开状态的第一预设位置；在密封门220处于可开状态时，驱动钥匙310自第一预设位置旋转至能够使密封门220处于关闭状态的第二预设位置。具体来说，上述第一预设位置满足：确保密封门220处于可开状态，即，能够被正常打开；上述第二预设位置满足：确保密封门220处于关闭状态，即，能够被正常关闭。
钥匙槽231在处于竖直状态时，密封门220处于关闭状态；钥匙槽231在处于水平状态时，密封门220处于可开状态，当需要将密封门220由关闭状态切换至可开状态时，将钥匙310插入钥匙槽231中，此时钥匙310处于竖直状态，该状态对应的位置即为初始位置；然后，通过驱动装置320驱动钥匙310从竖直状态沿顺时针方向旋转(θ+α)角度时，此时钥匙310即处于上述第一预设位置，钥匙槽231可以随钥匙310旋转θ角度，即到达水平状态，从而实现密封门220切换至可开状态。当需要将密封门220由可开状态切换至关闭状态时，通过驱动装置320驱动钥匙310从上述第一预设位置沿逆时针方向旋转(θ+2α)角度时，此时钥匙310即处于上述第二预设位置，钥匙槽231可以随钥匙310旋转θ角度，即到达竖直状态，从而实现密封门220切换至关闭状态。由此，可以确保密封门220能够被正常打开或关闭。
在此基础上，驱动装置320还用于在驱动装置320驱动钥匙310自上述第一预设位置旋转至上述第二预设位置之后，驱动钥匙310自该第二预设位置旋转至初始位置，钥匙310与钥匙槽231在上述初始位置不相接触。具体来说，当钥匙310处于上述第二预设位置时，其与处于竖直状态的钥匙槽231 之间存在夹角(即，差值α)，导致钥匙310与钥匙槽231相互接触(如图4所示)，此时若从钥匙槽231中取出钥匙310，钥匙310会与钥匙槽231摩擦，产生颗粒物，从而可能造成颗粒物污染晶圆。为此，通过驱动装置320驱动钥匙310自第二预设位置旋转至初始位置，可以使钥匙310到达竖直状态，从而使钥匙310与钥匙槽231不相接触，此时从钥匙槽231中取出钥匙310时，钥匙310与钥匙槽231之间不易产生摩擦，从而可以减少颗粒物的产生，减少颗粒物污染晶圆，进而提高晶圆的生产良率，最终解决在开锁过程中容易污染晶圆的问题。
在具体的工作过程中，将钥匙310移入钥匙槽231，以使钥匙310与钥匙槽231插接配合，接下来驱动装置320开始工作，以驱动钥匙310旋转至上述第一预设位置，从而确保能够正常打开密封门220，在密封门220打开之后，通过机械手将储片盒200内的晶圆传送至腔室部100内进行加工，在晶圆加工完成后，通过机械手将晶圆重新放回至储片盒200内，此时，通过驱动装置320驱动钥匙310自上述第一预设位置旋转至上述第二预设位置，以确保能够正常关闭密封门220，之后再通过驱动装置320驱动钥匙310自第二预设位置旋转至上述初始位置，以使钥匙310与钥匙槽231不相接触，接下来将钥匙310从钥匙槽231中取出，完成工艺过程。
由此，本申请公开的开锁机构300，既可以确保密封门220能够被正常打开或关闭，又可以减少颗粒物的产生，减少颗粒物污染晶圆，进而提高晶圆的生产良率，最终解决在开锁过程中容易污染晶圆的问题。
可选地，上述驱动装置320包括伸缩机构321和连杆机构，其中，伸缩机构321用于按预设的第一行程和第二行程驱动上述连杆机构运动，该连杆机构与钥匙310连接。假设钥匙槽231在处于竖直状态时，密封门220处于关闭状态；钥匙槽231在处于水平状态时，密封门220处于可开状态，如图10A所示，当需要将密封门220由关闭状态切换至可开状态时，将钥匙310 插入钥匙槽231中，此时钥匙310处于竖直状态，该状态对应的位置即为初始位置(即，图10A中的(1)图所在位置)。
在上述第一行程中，伸缩机构321始终沿第一直线方向(即，图10A中的方向A)驱动上述连杆机构运动，以使该连杆结构能够带动钥匙310先自初始位置沿第一方向(即，图10A中的逆时针方向)转动至上述第二预设位置(图中未示出)，后自该第二预设位置沿与该第一方向相反的第二方向(即，图10A中的顺时针方向)转动至上述第一预设位置(即，图10A中的(3)图所在位置)，此时钥匙槽231可以到达水平状态，从而实现密封门220自关闭状态切换至可开状态。需要说明的是，如图10A所示，在钥匙310自初始位置旋转至上述第一预设位置的过程中，当钥匙310转动至水平状态(即，图10A中的(2)图所在位置)时，钥匙槽231并未转动至水平状态，此时密封门220无法正常打开，而当钥匙310自水平状态继续旋转至上述第一预设位置时，钥匙槽231转动至水平状态，此时密封门220可以正常打开。
当需要密封门220自可开状态切换至关闭状态时，如图10B所示，在上述第二行程中，伸缩机构321始终沿与上述第一直线方向相反的第二直线方向(即，图10A中的方向B)驱动连杆机构运动，以使该连杆结构能够带动钥匙310先自上述第一预设位置(即，图10A中的(3)图所在位置)沿第一方向(即，图10B中的逆时针方向)转动至上述第二预设位置(即，图10B中的(2)图所在位置)，后自该第二预设位置沿第二方向(即，图10B中的顺时针方向)返回上述初始位置，从而实现密封门220自可开状态切换至关闭状态。需要说明的是，如图10B所示，在钥匙310自第一预设位置旋转至上述第二预设位置的过程中，当钥匙310转动至竖直状态(即，图10B中的(1)图所在位置)时，钥匙槽231并未转动至竖直状态，此时密封门220无法正常关闭，而当钥匙310自竖直状态继续旋转至上述第二预设位置时，钥匙槽231转动至竖直状态，此时密封门220可以正常关闭。
表1为钥匙在上述第一进程和第二进程中的旋转方向、位置和角度与密封门状态的对应关系表。
钥匙方向 钥匙位置 钥匙角度 密封门状态
- 初始位置 0° 正常闭合状态
逆时针 第二预设位置 -5° 正常闭合状态
顺时针 水平位置 90° 非正常可开状态
顺时针 第一预设位置 95° 正常可开状态
逆时针 初始位置 0° 非正常闭合状态
逆时针 第二预设位置 -5° 正常闭合状态
顺时针 初始位置 0° 正常闭合状态
由上述表1可知，在上述第一行程中，伸缩机构321始终沿第一直线方向驱动上述连杆机构运动，而钥匙310在连杆机构的带动下先逆时针转动，后顺时针转动，即，旋转方向发生了改变；在上述第二行程中，伸缩机构321始终沿第二直线方向驱动上述连杆机构运动，而钥匙310在连杆机构的带动下先逆时针转动，后顺时针转动，旋转方向也发生了改变，而在第二行程中，这种旋转方向的改变可以实现钥匙310自第二预设位置旋转至初始位置，达到钥匙310与钥匙槽231在上述初始位置不相接触的目的，同时由于伸缩机构321可以保持同一方向不变，这使得伸缩机构321无需中途转向，无需多次伸出和缩回，也无需多点定位，从而不仅可以简化伸缩机构321的运动，方便工作人员控制，伸缩机构321也不容易损坏，而且既可以选用直线电机，也可以选用气缸作为伸缩机构321，从而可以扩大伸缩机构321的选择范围。在实际应用中，上述第一行程可以为伸缩机构321的缩回行程，第二行程可以为伸缩机构321的伸出行程。
实现上述方案的连杆机构可以有多种，例如，如图6和图7所示，该连 杆机构包括第一连杆322和第二连杆323，其中，第一连杆322的第一端与伸缩机构321的伸缩杆铰接，第一连杆322的第二端与第二连杆323的第一端铰接，钥匙310与第二连杆323的第二端相连。在伸缩机构321的驱动下，第一连杆322能够带动第二连杆323的第一端围绕第二连杆323的第二端沿上述第一方向或者上述第二方向转动，同时第二连杆323能够带动钥匙310同心转动，也就是说，第二连杆323的转动中心与钥匙310的转动中心重合。
在上述第一行程或者第二行程中，伸缩机构321驱动上述第一连杆322运动，使该第一连杆322带动第二连杆323沿第一方向或第二方向转动，从而带动钥匙310沿第一方向或第二方向转动。在实际应用中，可以根据具体需要设计第一连杆322和第二连杆323的结构和尺寸，以实现钥匙310能够达到在上述第一进程和第二进程中的旋转方向、位置和角度。
通常情况下，为了提高密封门220的稳定性，密封门220上通常设置有至少两个锁体结构230，至少两个锁体结构230能够在密封门220处于关闭状态时使得密封门220较为稳定地与盒体210连接，为了方便开锁机构300同时对至少两个锁体结构230进行开锁，提高开锁效率，可选地，钥匙槽231、钥匙310和第二连杆323均可以为至少两个，第二连杆323与钥匙310一一对应地相连，每个钥匙310能够移入或移出与之相对应的钥匙槽；如图6和图7所示，开锁机构300还可以包括联动机构330，其中至少两个第二连杆323通过联动机构330相连，第一连杆322的第二端与其中一个第二连杆323的第一端铰接，在伸缩机构321的驱动下，第一连杆322能够通过联动机构330带动至少两个第二连杆323同步转动，从而带动至少两个钥匙310同步转动，进而实现同时对至少两个锁体结构230进行开锁。
由上述结构及工作过程可知，该开锁机构300具有至少两个钥匙310，且至少两个钥匙310能够同步转动，从而能够对密封门220上的至少两个锁体结构230实现同步开锁或关锁，进而提高开锁效率。与此同时，联动机构 330的设置可以实现单个驱动装置320同时驱动至少两个钥匙310同步转动，从而既可以降低开锁机构300的结构复杂性，又可以降低开锁机构300的成本。
可选地，第二连杆323可以包括本体和连接部311，第一连杆322的第二端与该本体铰接，联动机构330与每个第二连杆323的连接部311相连。钥匙310与本体同心转动，连接部311能够为联动机构330与第二连杆323提供连接位置，方便联动机构330与第二连杆323连接，从而方便工作人员安装开锁机构300，降低设计人员的设计难度。
如上文所述，驱动装置320可以通过联动机构330同步驱动至少两个第二连杆323转动，可选地，联动机构330可以包括连接杆，每个连接部311均与连接杆铰接。在其中一个连接部311转动时，带动连接杆运动，从而带动其余的连接部311转动。此种联动机构330的结构简单，便于设置，成本较低，且连接杆的传动效果较好。进一步地，连接杆可以为伸缩杆，方便工作人员调解钥匙310的转动角度，以使钥匙310能够完全开锁或关锁。
为了提高钥匙310开锁或关锁的精准性，避免钥匙310过度转动，可选地，开锁机构300还可以包括限位部340，限位部340可以用于限制伸缩机构321的伸缩杆按上述第一行程或第二行程移动的距离，即，伸缩机构321沿第一直线方向或第二直线方向的位移量，以避免钥匙310过度转动，从而使钥匙310较精准地转动至规定的位置，进而提高钥匙310开锁或关锁的精准性。
可选地，限位部340可以包括限位块341和止动块342，限位块341可以固定设置，止动块342可以设置在伸缩杆上，且能够在伸缩杆按上述第一行程或第二行程移动的过程中与限位块341相接触，以阻止伸缩杆继续移动。此种限位过程简单，且限位可靠。进一步地，止动块342可以为弹性块或者在止动块342上设置弹性件，以实现弹性限位，避免硬接触。
在本申请实施例中，伸缩机构321的种类可以有多种，例如液压伸缩杆，可选地，伸缩机构321可以为直线电机或气缸。直线电机和气缸的驱动可靠，技术成熟，有利于提高开锁机构300的稳定性。
可选地，如图3和图5所示，锁体结构230可以包括钥匙槽231、转盘232和锁杆233，其中，锁杆233与密封门220活动连接，且能够移动至使密封门220处于关闭状态的锁定位置(即，图3中锁杆233所在位置)，或者使密封门220处于可开状态的解锁位置(即，图5中锁杆233所在位置)。具体地，如图3所示，锁杆233的一端相对于密封门220的侧边伸出至该侧边外侧，以能够伸入盒体210中相应的固定槽中，从而实现对密封门220的锁定。如图5所示，锁杆233的一端回缩至密封门220的侧边内侧，以能够自盒体210中相应的固定槽移出，从而实现对密封门220的解锁。
转盘232与锁杆233活动连接，且转盘232于一连接件固定连接，该连接件上设置有上述钥匙槽310；在上述驱动装置320驱动位于钥匙槽310中的钥匙310旋转时，钥匙310通过与钥匙槽310相配合，来带动转盘232转动，以使转盘232同步带动锁杆233移动至上述锁定位置或者所述解锁位置。此种结构的锁体结构230的结构简单可靠，方便设置，从而可以降低开锁机构300的结构复杂性，降低设计人员的设计难度。
转盘232与锁杆233活动连接的方式可以有多种，例如，如图8和图9所示，转盘232上开设有弧形槽232a；开锁机构300还包括滑动件233a，滑动件233a的一端与转盘232活动连接，且能够沿弧形槽232a转动，滑动件233a的另一端与锁杆233固定连接。上述滑动件233a例如为设置在锁杆233上，且相对于该锁杆233的杆体凸出的凸起，该凸起穿设于上述弧形槽232a中，且能够沿弧形槽232a转动。
可选地，锁杆233为多个，且成对设置，成对的两个锁杆233在图3和图5中的竖直方向上间隔设置，且在二者的间隔处设置有转盘232，例如， 图3和图5中设置有两对锁杆233，则对应地转盘232为两个。对应于每个转盘232，上述弧形槽232a为两个，且相对于转盘232的转动中心对称设置，并且滑动件233a为两个，二者的一端分别与成对的两个锁杆233连接，二者的另一端与转盘232活动连接，能够分别沿两个弧形槽232a转动。
如图8所示，当钥匙槽231处于竖直状态时，滑动件233a位于弧形槽232a的一端，当钥匙槽231在钥匙310的带动下顺时针转动时，转盘232随之顺时针转动，同时滑动件233a沿弧形槽232a滑动，以带动锁杆233移动，如图9所示，成对的两个锁杆233朝彼此靠近的方向移动，直至滑动件233a滑动至弧形槽232a的另一端，转盘232通过滑动件233a与弧形槽232a的滑动配合驱动锁杆233移动，可以进一步降低开锁机构300的结构复杂性，降低设计人员的设计难度。
当然，在实际应用中，转盘232还可以采用其他任意结构驱动锁杆233移动，例如，转盘232上可以设置有齿轮，锁杆233可以设置有齿条，转盘232通过齿轮与齿条的啮合驱动锁杆233移动。又如，转盘232和锁杆233还可以通过凸轮机构、曲柄滑块结构和螺旋传动机构等。
作为另一个技术方案，本申请实施例还公开一种半导体加工设备，以图1所示的半导体就设备为例，所公开的半导体加工设备包括腔室部100和开锁机构300，一般来说，腔室部100可以包括传输腔室、工艺腔室等，该半导体加工设备使用的储片盒200位于腔室部100之外，如图2和图3所示，储片盒200包括盒体210和与该盒体210活动连接的密封门220，密封门220上设置有锁体结构230，用以锁定或解锁密封门220，以使其能够处于关闭状态或者可开状态。开锁机构300用于开启或关闭上述锁体结构230，以实现锁体结构230对密封门220的锁定或解锁，开锁机构采用本申请实施例公开的上述开锁机构。
综上所述，本申请公开的半导体加工设备的开锁机构、半导体加工设备 的技术方案中，驱动装置与钥匙连接，用于在密封门处于关闭状态时，驱动钥匙自初始位置旋转至能够使密封门处于可开状态的第一预设位置；在密封门处于可开状态时，驱动钥匙自第一预设位置旋转至能够使密封门处于关闭状态的第二预设位置，由此可以实现密封门在可开状态与关闭状态之间的切换。同时，上述驱动装置还用于在驱动装置驱动钥匙自第一预设位置旋转至第二预设位置之后，驱动钥匙自上述第二预设位置旋转至初始位置，钥匙与钥匙槽在该初始位置不相接触，也就是说，上述驱动装置先驱动钥匙旋转至第二预设位置，以确保密封门关闭，后驱动钥匙自该第二预设位置旋转至初始位置，由于在该初始位置钥匙与钥匙槽不相接触，此时从钥匙槽中取出钥匙时，钥匙与钥匙槽之间不易产生摩擦，从而可以减少颗粒物的产生，减少颗粒物污染晶圆，进而提高晶圆的生产良率，最终解决在开锁过程中容易污染晶圆的问题。
本申请上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (12)

  1. 一种半导体加工设备的开锁机构，所述开锁机构用于打开或关闭储片盒的密封门上的锁体结构，其特征在于，所述开锁机构包括钥匙和驱动装置，所述钥匙能够移入或移出所述锁体结构的钥匙槽，且所述钥匙与所述钥匙槽插接配合；
    所述驱动装置用于在所述密封门处于关闭状态时，驱动所述钥匙自初始位置旋转至能够使所述密封门处于可开状态的第一预设位置；在所述密封门处于所述可开状态时，驱动所述钥匙自所述第一预设位置旋转至能够使所述密封门处于所述关闭状态的第二预设位置；
    所述驱动装置还用于在所述驱动装置驱动所述钥匙自所述第一预设位置旋转至所述第二预设位置之后，驱动所述钥匙自所述第二预设位置旋转至所述初始位置，所述钥匙与所述钥匙槽在所述初始位置不相接触。
  2. 根据权利要求1所述的开锁机构，其特征在于，所述驱动装置包括伸缩机构和连杆机构，其中，
    所述伸缩机构用于按预设的第一行程和第二行程驱动所述连杆机构运动，所述连杆机构与所述钥匙连接；
    在所述第一行程中，所述伸缩机构始终沿第一直线方向驱动所述连杆机构运动，以使所述连杆结构能够带动所述钥匙先自所述初始位置沿第一方向转动至所述第二预设位置，后自所述第二预设位置沿与所述第一方向相反的第二方向转动至所述第一预设位置，以使所述密封门自所述关闭状态切换至所述可开状态；
    在所述第二行程中，所述伸缩机构始终沿与所述第一直线方向相反的第二直线方向驱动所述连杆机构运动，以使所述连杆结构能够带动所述钥匙先自所述第一预设位置沿所述第一方向转动至所述第二预设位置，后自所述第二预设位置沿所述第二方向返回所述初始位置，以使所述密封门自所述可开 状态切换至所述关闭状态。
  3. 根据权利要求2所述的开锁机构，其特征在于，所述连杆机构包括第一连杆和第二连杆，所述第一连杆的第一端与所述伸缩机构的伸缩杆铰接，所述第一连杆的第二端与所述第二连杆的第一端铰接，所述钥匙与所述第二连杆的第二端相连；
    在所述伸缩机构的驱动下，所述第一连杆能够带动所述第二连杆的第一端围绕所述第二连杆的第二端沿所述第一方向或者所述第二方向转动，同时所述第二连杆能够带动所述钥匙同心转动。
  4. 根据权利要求3所述的开锁机构，其特征在于，所述钥匙槽、所述钥匙和所述第二连杆均为至少两个，所述第二连杆与所述钥匙一一对应地相连，每个所述钥匙能够移入或移出与之相对应的所述钥匙槽；所述开锁机构还包括联动机构，其中至少两个所述第二连杆通过所述联动机构相连，所述第一连杆的第二端与其中一个所述第二连杆的第一端铰接，在所述伸缩机构的驱动下，所述第一连杆能够通过所述联动机构带动至少两个所述第二连杆同步转动。
  5. 根据权利要求4所述的开锁机构，其特征在于，每个所述第二连杆均包括本体和连接部，所述第一连杆的第二端与所述本体铰接，所述联动机构与每个所述第二连杆的所述连接部相连。
  6. 根据权利要求5所述的开锁机构，其特征在于，所述联动机构包括连接杆，每个所述连接部均与所述连接杆铰接。
  7. 根据权利要求2至6中任一项所述的开锁机构，其特征在于，所述开锁机构还包括限位部，所述限位部用于限制所述伸缩机构的伸缩杆按所述 第一行程或所述第二行程移动的距离。
  8. 根据权利要求7所述的开锁机构，其特征在于，所述限位部包括限位块和止动块，所述限位块固定设置，所述止动块设置在所述伸缩杆上，且能够在所述伸缩杆按所述第一行程或所述第二行程移动的过程中与所述限位块相接触，以阻止所述伸缩杆继续移动。
  9. 根据权利要求2至6中任一项所述的开锁机构，其特征在于，所述伸缩机构为直线电机或气缸。
  10. 根据权利要求1至6中任一项所述的开锁机构，其特征在于，所述锁体结构包括转盘和锁杆，其中，所述锁杆与所述密封门活动连接，且能够移动至使所述密封门处于所述关闭状态的锁定位置，或者使所述密封门处于所述可开状态的解锁位置；
    所述转盘与所述锁杆活动连接，且所述转盘与连接件固定连接，所述连接件上设置有所述钥匙槽；在所述驱动装置驱动位于所述钥匙槽中的所述钥匙旋转时，所述钥匙带动所述转盘转动，以使所述转盘同步带动所述锁杆移动至所述锁定位置或者所述解锁位置。
  11. 根据权利要求10所述的开锁机构，其特征在于，所述转盘上开设有弧形槽；所述开锁机构还包括滑动件，所述滑动件的一端与所述转盘活动连接，且能够沿所述弧形槽转动，所述滑动件的另一端与所述锁杆固定连接。
  12. 一种半导体加工设备，包括储片盒的密封门和开锁机构，其中，所述密封门上设置有锁体结构，所述开锁机构用于打开或关闭所述锁体结构，其特征在于，所述开锁机构采用权利要求1-12任意一项所述的开锁机构。
PCT/CN2021/112751 2020-08-21 2021-08-16 半导体加工设备的开锁机构、半导体加工设备 Ceased WO2022037523A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023507602A JP7402379B2 (ja) 2020-08-21 2021-08-16 半導体加工装置のアンロック機構、半導体加工装置
KR1020227046460A KR102571465B1 (ko) 2020-08-21 2021-08-16 반도체 가공 디바이스의 언로킹 메커니즘, 반도체 가공 디바이스

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010853833.8 2020-08-21
CN202010853833.8A CN111968934B (zh) 2020-08-21 2020-08-21 半导体加工设备

Publications (1)

Publication Number Publication Date
WO2022037523A1 true WO2022037523A1 (zh) 2022-02-24

Family

ID=73391154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/112751 Ceased WO2022037523A1 (zh) 2020-08-21 2021-08-16 半导体加工设备的开锁机构、半导体加工设备

Country Status (5)

Country Link
JP (1) JP7402379B2 (zh)
KR (1) KR102571465B1 (zh)
CN (1) CN111968934B (zh)
TW (1) TWI771154B (zh)
WO (1) WO2022037523A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118280898A (zh) * 2024-03-18 2024-07-02 芯钛科半导体设备(上海)有限公司 一种晶圆料盒操作装置
CN120331624A (zh) * 2025-04-30 2025-07-18 步阳集团有限公司 隐形防火门
CN120716125A (zh) * 2025-08-26 2025-09-30 台州市黄岩星泰塑料模具有限公司 一种防止进水口碎屑残留的汽车零部件生产注塑模具结构

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111968934B (zh) * 2020-08-21 2024-05-17 北京北方华创微电子装备有限公司 半导体加工设备
CN113823588A (zh) * 2021-10-07 2021-12-21 上海赛瑾精密科技有限公司 前开式晶圆传送盒的门板开关机构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1478046A (zh) * 2000-11-28 2004-02-25 没有对准销的fims接口
US20040040884A1 (en) * 2002-09-04 2004-03-04 Wei-Ming Pai Latching mechanism for locking/unlocking the door of a wafer container
CN202788238U (zh) * 2012-10-11 2013-03-13 中芯国际集成电路制造(北京)有限公司 晶圆盒开锁工具
CN109969593A (zh) * 2017-12-28 2019-07-05 沈阳新松机器人自动化股份有限公司 一种foup盒自动解锁装置及foup盒
CN109979866A (zh) * 2017-12-28 2019-07-05 沈阳新松机器人自动化股份有限公司 一种foup装置
CN111968934A (zh) * 2020-08-21 2020-11-20 北京北方华创微电子装备有限公司 半导体加工设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3559213B2 (ja) * 2000-03-03 2004-08-25 株式会社半導体先端テクノロジーズ ロードポート及びそれを用いた生産方式
JP4691281B2 (ja) * 2001-09-03 2011-06-01 ローツェ株式会社 シリンダ及びそれを用いたロードポート並びに生産方式
KR20020061132A (ko) * 2001-01-16 2002-07-23 주식회사 신성이엔지 웨이퍼이송용기 오프너의 래치키 및 그 제어방법
JP4620854B2 (ja) * 2000-10-30 2011-01-26 平田機工株式会社 Ｆｏｕｐオープナのラッチ開閉装置
JP4188550B2 (ja) * 2000-11-24 2008-11-26 株式会社日立国際電気 基板処理装置および基板の処理方法
JP4447184B2 (ja) * 2001-05-30 2010-04-07 東京エレクトロン株式会社 ウェハキャリア用蓋体の着脱装置
JP4049551B2 (ja) * 2001-06-07 2008-02-20 信越ポリマー株式会社 収納容器の蓋体
JP3896263B2 (ja) * 2001-07-05 2007-03-22 東京エレクトロン株式会社 基板収容カセット開閉装置及び基板収容カセット開閉方法
KR100506122B1 (ko) * 2003-02-21 2005-08-04 주식회사 신성이엔지 후프오프너의 후프도어 개폐장치
JP2004327751A (ja) * 2003-04-25 2004-11-18 Hitachi Industries Co Ltd 密閉容器の蓋着脱装置
KR100779730B1 (ko) * 2006-04-08 2007-11-26 주식회사 싸이맥스 후프오프너 포트 도어 진퇴기구
KR100909712B1 (ko) * 2007-06-29 2009-07-29 (주) 예스티 반도체 자재 수납용기 개폐장치
CN201845745U (zh) * 2010-10-16 2011-05-25 武汉新芯集成电路制造有限公司 开关系统
JP6544128B2 (ja) * 2015-08-07 2019-07-17 シンフォニアテクノロジー株式会社 収納容器の蓋体及び収納容器
CN110473819B (zh) * 2018-05-11 2020-12-08 北京北方华创微电子装备有限公司 一种开门装置、传输腔室和半导体处理设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1478046A (zh) * 2000-11-28 2004-02-25 没有对准销的fims接口
US20040040884A1 (en) * 2002-09-04 2004-03-04 Wei-Ming Pai Latching mechanism for locking/unlocking the door of a wafer container
CN202788238U (zh) * 2012-10-11 2013-03-13 中芯国际集成电路制造(北京)有限公司 晶圆盒开锁工具
CN109969593A (zh) * 2017-12-28 2019-07-05 沈阳新松机器人自动化股份有限公司 一种foup盒自动解锁装置及foup盒
CN109979866A (zh) * 2017-12-28 2019-07-05 沈阳新松机器人自动化股份有限公司 一种foup装置
CN111968934A (zh) * 2020-08-21 2020-11-20 北京北方华创微电子装备有限公司 半导体加工设备

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118280898A (zh) * 2024-03-18 2024-07-02 芯钛科半导体设备(上海)有限公司 一种晶圆料盒操作装置
CN120331624A (zh) * 2025-04-30 2025-07-18 步阳集团有限公司 隐形防火门
CN120331624B (zh) * 2025-04-30 2025-11-14 步阳集团有限公司 隐形防火门
CN120716125A (zh) * 2025-08-26 2025-09-30 台州市黄岩星泰塑料模具有限公司 一种防止进水口碎屑残留的汽车零部件生产注塑模具结构
CN120716125B (zh) * 2025-08-26 2025-11-18 浙江星泰模塑科技股份有限公司 一种防止进水口碎屑残留的汽车零部件生产注塑模具结构

Also Published As

Publication number Publication date
TWI771154B (zh) 2022-07-11
JP7402379B2 (ja) 2023-12-20
JP2023537342A (ja) 2023-08-31
CN111968934B (zh) 2024-05-17
CN111968934A (zh) 2020-11-20
KR102571465B1 (ko) 2023-08-28
TW202208738A (zh) 2022-03-01
KR20230011437A (ko) 2023-01-20

Similar Documents

Publication Publication Date Title
WO2022037523A1 (zh) 半导体加工设备的开锁机构、半导体加工设备
US8870516B2 (en) Port door positioning apparatus and associated methods
US3874525A (en) Method and apparatus for handling workpieces
KR960011989B1 (ko) 회전판을 이용한 자동 팰리트 교환장치(apc)
CN105473278B (zh) 机床
JPH04228978A (ja) スリット・バルブ装置と方法
US6642533B2 (en) Substrate detecting method and device
TWI394695B (zh) 一種具有橢圓門閂結構之前開式晶圓盒
CN107599358B (zh) 一种开合模模架
CN107206602B (zh) 具有两个不同的闭合位置的容纳外壳
US20020033606A1 (en) Cylinder, load port using it, and production system
JP2025060236A (ja) ウェーハ収納容器洗浄装置
US9275885B2 (en) Horizontal displacement mechanism for cleanroom material transfer systems
CN105527087A (zh) 回转式锁芯互开率检测平台
TWI518235B (zh) 自鎖式真空艙門啟閉裝置
JP2002134602A (ja) Ｆｏｕｐオープナのラッチ開閉装置
CN222986294U (zh) 一种用于气动执行器的导块专用组合夹具
CN206357255U (zh) 一种机械手工具快速切换装置
CN223218274U (zh) 一种smif pod开闭装置
JPH0262481A (ja) ゲートバルブ
CN116354096A (zh) 夹爪装置
CN211892019U (zh) 软管热板焊接机
JPS61159343A (ja) 自動芯出し把握装置
CN115674226A (zh) 一种适应狭小空间自动装箱机械手
TW202325637A (zh) 夾爪裝置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21857618

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20227046460

Country of ref document: KR

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2023507602

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21857618

Country of ref document: EP

Kind code of ref document: A1