WO2022025258A1 - Élément de conduction thermique - Google Patents

Élément de conduction thermique Download PDF

Info

Publication number
WO2022025258A1
WO2022025258A1 PCT/JP2021/028353 JP2021028353W WO2022025258A1 WO 2022025258 A1 WO2022025258 A1 WO 2022025258A1 JP 2021028353 W JP2021028353 W JP 2021028353W WO 2022025258 A1 WO2022025258 A1 WO 2022025258A1
Authority
WO
WIPO (PCT)
Prior art keywords
wick structure
metal plate
pillar
conductive member
heat conductive
Prior art date
Application number
PCT/JP2021/028353
Other languages
English (en)
Japanese (ja)
Inventor
征志 高尾
仕▲ゆ▼ 楊
敏彦 小関
雅昭 花野
淳一 石田
Original Assignee
日本電産株式会社
尼得科超▲しゅう▼科技股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020182978A external-priority patent/JP2023127006A/ja
Application filed by 日本電産株式会社, 尼得科超▲しゅう▼科技股▲ふん▼有限公司 filed Critical 日本電産株式会社
Publication of WO2022025258A1 publication Critical patent/WO2022025258A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat conductive member.
  • a heat conductive member in which a working medium and a wick structure are housed in an internal space of a plate-shaped housing is known.
  • a sintered block is arranged between the bottom wall side and the sealing plate side of the housing, and the condensed working medium is placed on the bottom wall side and the sealing plate side.
  • a flat plate heat pipe that moves between.
  • a support column for supporting the bottom wall portion and the sealing plate from the inside is arranged one by one near the four corners of the rectangular bottom wall portion (see, for example, Japanese Patent Application Laid-Open No. 2001-91172). ).
  • the number of columns is small, the bottom wall portion and the sealing plate cannot be sufficiently supported, and the housing may be deformed when a load is applied.
  • An exemplary thermal conductive member of the present invention comprises a housing with an internal space and a working medium.
  • the housing further includes a first housing portion, a second housing portion, a connection portion, and a pillar portion.
  • the first housing portion has a first metal plate and a first wick structure.
  • the second housing portion has a second metal plate arranged so as to face the first metal plate.
  • the connecting portion the outer peripheral edge portion of the first metal plate is connected to the second metal plate directly or via an intermediate member when viewed from the opposite direction in which the first metal plate faces the second metal plate.
  • the pillar portion is arranged in the internal space.
  • the first wick structure is arranged on the inner surface of the first metal plate on the side of the second metal plate.
  • the internal space is arranged between the first metal plate and the second metal plate to accommodate the first wick structure and the working medium.
  • the pillar has at least one solid first pillar and at least one porous second pillar.
  • One end of each of the first pillars is connected to one of the first metal plate and the second metal plate.
  • the other end of each of the first pillars is in contact with one housing.
  • the one housing portion is a housing portion having the other metal plate of the first metal plate and the second metal plate of the first housing portion and the second housing portion. ..
  • Each of the second pillar portions is in contact with the first housing portion and the second housing portion.
  • the total of the first contact areas where the first pillar portion is in contact with the one housing portion when viewed from the facing direction is the total of the second contact areas where the second pillar portion is in contact with the first housing portion.
  • the second pillar portion is wider than the total of the third contact areas in contact with the second housing portion.
  • FIG. 1 is a perspective view of a heat conductive member according to the present embodiment.
  • FIG. 2 is a top view of the heat conductive member.
  • FIG. 3 is a schematic side sectional view of the heat conductive member.
  • FIG. 4A is a cross-sectional view showing an example of a cross section of the first pillar portion 151.
  • FIG. 4B is a cross-sectional view showing another example of the cross section of the first pillar portion 151.
  • FIG. 5A is a cross-sectional view showing a first modification of the first pillar portion.
  • FIG. 5B is a cross-sectional view showing a second modification of the first pillar portion.
  • FIG. 5C is a cross-sectional view showing a third modification example of the first pillar portion.
  • FIG. 1 is a perspective view of a heat conductive member according to the present embodiment.
  • FIG. 2 is a top view of the heat conductive member.
  • FIG. 3 is a schematic side sectional view of the heat
  • FIG. 5D is a cross-sectional view showing a fourth modified example of the first pillar portion.
  • FIG. 6A is a cross-sectional view showing a first modification of the second pillar portion.
  • FIG. 6B is a cross-sectional view showing a second modification of the second pillar portion.
  • FIG. 6C is a cross-sectional view showing a third modification of the second pillar portion.
  • FIG. 6D is a cross-sectional view showing a fourth modification of the second pillar portion.
  • FIG. 6E is a cross-sectional view showing a fifth modified example of the second pillar portion.
  • FIG. 7 is a cross-sectional view showing a modified example of the second wick structure.
  • the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate.
  • the Z-axis direction is parallel to the opposite direction in which the first metal plate 11 described later faces the second metal plate 12.
  • the direction from the first metal plate 11 to the second metal plate 12 is the + Z direction
  • the direction from the second metal plate 12 to the first metal plate 11 is the ⁇ Z direction.
  • the surface facing the + Z direction is referred to as "upper surface”
  • the surface facing the ⁇ Z direction is referred to as “lower surface”.
  • the end portion in the + Z direction is referred to as an "upper end portion”
  • the end portion in the ⁇ Z direction is referred to as a “lower end portion”.
  • the width of the component in the Z-axis direction is called "thickness". It was
  • the X-axis direction is a direction orthogonal to the Z-axis direction. Of the X-axis directions, one direction is the + X direction and the other direction is the ⁇ X direction. It was
  • the Y-axis direction is a direction orthogonal to both the Z-axis direction and the X-axis direction. Of the Y-axis directions, one direction is the + Y direction and the other direction is the ⁇ Y direction. It was
  • parallel means not only a state in which they do not intersect at all no matter how long they extend, but also a state in which they are substantially parallel.
  • vertical and orthogonal include not only a state in which they intersect each other at 90 degrees, but also a state in which they are substantially vertical and a state in which they are substantially orthogonal to each other. That is, “parallel”, “vertical”, and “orthogonal” each include a state in which the positional relationship between the two has an angular deviation to the extent that the gist of the present invention is not deviated. It was
  • sining refers to a technique of heating a metal powder or a paste containing a metal powder to a temperature lower than the melting point of the metal to bake and harden the metal particles.
  • sintered body refers to an object obtained by sintering. It was
  • the "solid” member means a member composed of a so-called solid object, and is a member composed of a densely packed and non-porous object. Point to.
  • a “solid” member may be a member that does not have a cavity inside, or a member that has one or more macroscopic cavities inside. It was
  • FIG. 1 is a perspective view of the heat conductive member 1 according to the present embodiment.
  • FIG. 2 is a top view of the heat conductive member 1.
  • FIG. 3 is a schematic side sectional view of the heat conductive member 1. Note that FIG. 3 is a cross-sectional view taken along the alternate long and short dash line AA of FIG.
  • the heat conductive member 1 is also called a vapor chamber and transports the heat of the heating element H.
  • the thickness of the heat conductive member 1 according to the present embodiment in the Z-axis direction is, for example, 5 mm or more.
  • Examples of the heating element H include a power transistor of an inverter provided in a traction motor for driving a wheel of a vehicle.
  • the power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor).
  • the heat conductive member 1 is mounted on the traction motor.
  • the calorific value of the IGBT is generally 100 W or more.
  • the use of the heat conductive member 1 is not limited to this example.
  • the heat conductive member 1 includes a heated portion 101 and a heat radiating portion 102 (see FIG. 3).
  • the heated portion 101 is arranged in contact with the heating element H, for example, and is heated by the heat generated by the heating element H.
  • the heat radiating unit 102 releases the heat of the operating medium 20, which will be described later, heated by the heated unit 101 to the outside.
  • heat exchange means such as heat dissipation fins and heat sinks may be thermally connected to the heat dissipation unit 102.
  • a cooling device having heat radiation fins such as stacked fins and pin fins may be arranged in the heat radiation unit 102. In that case, a cooling medium is passed between the heat radiation fins.
  • an antifreeze liquid such as ethylene glycol or propylene glycol, or a liquid such as pure water can be adopted.
  • a gas such as air may be adopted.
  • the heat conductive member 1 includes a housing 10 having an internal space 10a and a working medium 20.
  • the working medium 20 is pure water in this embodiment, but may be a medium other than water.
  • the working medium 20 is any one of an alcohol compound such as methanol and ethanol, an alternative CFC such as hydrofluorocarbon, a hydrocarbon compound such as propane and isobutane, a fluorinated hydrocarbon compound such as difluoromethane, and ethylene glycol. May be good.
  • the working medium 20 can be appropriately adopted depending on the usage environment of the heat conductive member 1. It was
  • the housing 10 further includes a first housing portion 10b, a second housing portion 10c, a joint portion 14, and a pillar portion 15.
  • the first housing portion 10b has a first metal plate 11 and a first wick structure 31.
  • the second housing portion 10c has a second metal plate 12 arranged to face the first metal plate 11.
  • the second housing portion 10c further has a second wick structure 32.
  • the housing 10 has a first metal plate 11, a second metal plate 12, a first wick structure 31, and a second wick structure 32.
  • the heat conductive member 1 includes a first metal plate 11, a second metal plate 12, a first wick structure 31, a second wick structure 32, a joint portion 14, and a pillar portion 15. ..
  • the first metal plate 11 and the second metal plate 12 are made of a metal having high thermal conductivity, and are made of copper in this embodiment. Further, the first metal plate 11 and the second metal plate 12 may be formed by plating the surface of a metal other than copper with copper.
  • Metals other than copper include, for example, any metal such as iron, aluminum, zinc, silver, gold, magnesium, manganese, and titanium, or alloys containing at least one of the above metals (brass, geralmin, stainless steel). (Steel, etc.) can be used. It was
  • the first metal plate 11 and the second metal plate 12 are rectangular plates extending in the X-axis direction and the Y-axis direction, respectively. As shown in FIG. 3, the heating element H comes into contact with the lower surface of the first metal plate 11. That is, the heated portion 101 of the heat conductive member 1 is a portion of the first metal plate 11 that the heating element H comes into contact with.
  • the second metal plate 12 covers the upper surface of the first metal plate 11.
  • the first metal plate 11 and the second metal plate 12 of the present embodiment are quadrangular when viewed from the Z-axis direction, but are not limited to this example.
  • the first metal plate 11 and the second metal plate 12 may be polygonal or circular having a plurality of corners when viewed from the Z-axis direction. It was
  • the first metal plate 11 has a first side wall portion 13a extending in the + Z direction from the peripheral edge.
  • the second metal plate 12 has a second side wall portion 13b extending from the peripheral edge in the ⁇ Z direction.
  • the upper surface of the first side wall portion 13a and the lower surface of the second side wall portion 13b are joined at the joint portion 14.
  • the second side wall portion 13b may be omitted, and for example, the upper surface of the first side wall portion 13a and the lower surface of the second metal plate 12 may be joined.
  • the first side wall portion 13a may be omitted, and for example, the lower surface of the second side wall portion 13b and the upper surface of the first metal plate 11 may be joined. It was
  • the first wick structure 31 and the second wick structure 32 are porous in this embodiment, and have a gap portion (not shown) forming a flow path of the working medium 20.
  • the first wick structure 31 is arranged on the inner surface of the first metal plate 11 on the second metal plate 12 side and faces the internal space 10a.
  • the second wick structure 32 is arranged on the inner surface of the second metal plate 12 on the first metal plate 11 side and faces the internal space 10a.
  • “facing" the interior space 10a means “facing" the interior space 10a. Details of the first wick structure 31 and the second wick structure 32 will be described later. It was
  • the internal space 10a is arranged between the first metal plate 11 and the second metal plate 12 and accommodates the working medium 20 and the first wick structure 31. Further, the internal space 10a further accommodates the second wick structure 32.
  • the internal space 10a is formed by being surrounded by the first metal plate 11 and the second metal plate 12.
  • the internal space 10a is a closed space, and is maintained in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure, for example. When the internal space 10a is in a decompressed state, the working medium 20 housed in the internal space 10a is likely to evaporate. It was
  • the outer peripheral edge portion of the first metal plate 11 is connected to the second metal plate 12 directly or via an intermediate member when viewed from the opposite direction in which the first metal plate 11 faces the second metal plate 12.
  • the facing direction is parallel to the Z-axis direction.
  • the joint portion 14 is located around the first wick structure 31 and the second wick structure 32 when viewed from the Z-axis direction.
  • the method of joining the first side wall portion 13a and the second side wall portion 13b is not particularly limited. For example, any joining method such as a method of joining by applying heat and pressure, a diffusion joining, or a joining using a brazing material may be used.
  • first metal plate 11 may be directly bonded to the second metal plate 12, or may be bonded to the second metal plate 12 via an intermediate member such as a copper plating layer.
  • the intermediate member is arranged, for example, in a region overlapping the outer peripheral edge portion of the upper surface of the first metal plate 11 when viewed from the Z-axis direction.
  • the joint portion 14 may include a sealing portion.
  • the sealing portion is, for example, a portion where an injection port for injecting the working medium 20 into the housing 10 is sealed by welding in the manufacturing process of the heat conductive member 1. It was
  • the pillar portion 15 is arranged in the internal space 10a, and is composed of, for example, a circular cylinder when viewed from the Z-axis direction.
  • the pillar portion 15 supports the first housing portion 10b and the second housing portion 10c in the Z-axis direction.
  • the thickness of the housing 10 is kept constant. Therefore, it is possible to prevent the internal space 10a from becoming narrow due to the deformation of the housing 10 in the Z-axis direction. It was
  • the pillar portion 15 has at least one solid first pillar portion 151 and at least one porous second pillar portion 152.
  • the number of the first pillar portion 151 and the number of the second pillar portion 152 are six.
  • the present invention is not limited to this example, and the number of the first pillar portion 151 and the number of the second pillar portion 152 may be singular or plural other than 6. It was
  • each first pillar portion 151 is connected to one of the first metal plate 11 and the second metal plate 12. The other end of each first pillar portion 151 is in contact with one housing portion.
  • one housing portion is a housing portion having the other metal plate of the first metal plate 11 and the second metal plate 12 of the first housing portion 10b and the second housing portion 10c. be.
  • each of the second pillar portions 152 is in contact with the first housing portion 10b and the second housing portion 10c.
  • the total sum S1 of the first contact area ⁇ S1 in which the first pillar portion 151 is in contact with the one housing portion is the second contact area ⁇ S2 in which the second pillar portion 152 is in contact with the first housing portion 10b.
  • the total sum S2 and the second pillar portion 152 are wider than the total sum S3 of the third contact area ⁇ S3 in contact with the second housing portion 10c.
  • the mechanical strength of the solid first pillar portion 151 is higher than the mechanical strength of the porous second pillar portion 152. Therefore, by setting S1> S2 and S1> S3, sufficient strength of the housing 10 can be ensured even if a part of the pillars 15 is porous. It was
  • the porous second pillar portion 152 is in contact with the first housing portion 10b and the second housing portion 10c, the working medium 20 is from one of the first housing portion 10b and the second housing portion 10c to the other. It becomes easy to move to. That is, the circulation efficiency of the working medium 20 is improved. Therefore, the heat transfer coefficient from the heated portion 101 of the heat conductive member 1 to the heat radiating portion 102 can be increased. Further, since the volume of the porous body through which the liquid working medium 20 permeates increases due to the porous second pillar portion 152, the holding amount of the liquid working medium 20 in the heat conductive member 1 can be increased. Therefore, for example, even if a large amount of heat is transferred to the heated portion 101, the working medium 20 can be sufficiently supplied to the heated portion 101. Therefore, the circulation cycle of the working medium 20 can be sufficiently maintained. It was
  • At least one first pillar portion 151 is arranged closer to the joint portion 14 than the second pillar portion 152.
  • the first pillar portion 151 arranged at the position closest to the joint portion 14 among the plurality of first pillar portions 151 is a plurality of second pillar portions 152. It is arranged closer to the joint portion 14 than the second pillar portion 152 which is arranged at the position closest to the joint portion 14.
  • the distance Lx1 in the X direction between the portion of the joint portion 14 on the + X direction side and the first pillar portion 151 arranged at the position closest to this portion is the + X direction side of the joint portion 14.
  • the distance Ly1 in the Y direction between the portion of the joint portion 14 on the + Y direction side and the first pillar portion 151 arranged at the position closest to this portion is the portion of the joint portion 14 on the + Y direction side and this portion. It is narrower than the distance Ly2 in the Y direction between the second pillar portion 152 and the second pillar portion 152 arranged at the position closest to the. By doing so, the strength at the joint portion 14 of the housing 10 can be improved.
  • the joint portion 14 is deformed. Can be suppressed or prevented. Further, in the joint portion 14, it is possible to prevent or prevent the first metal plate 11 from separating from the second metal plate 12. It was
  • the number of the first pillar portions 151 arranged at the position closest to the joint portion 14 of the plurality of first pillar portions 151 is the largest in the joint portion 14 of the plurality of second pillar portions 152. It is larger than the number of second pillar portions 152 arranged at close positions (see FIG. 2). By doing so, the strength at the joint portion 14 of the housing 10 can be improved. In particular, when the first pillar portion 151 is connected to both the first housing portion 10b and the second housing portion 10c, even if the internal pressure of the housing 10 becomes higher, the deformation of the joint portion 14 is suppressed or prevented. can. Further, in the joint portion 14, it is possible to prevent or prevent the first metal plate 11 from separating from the second metal plate 12. It was
  • FIG. 4A is a cross-sectional view showing an example of a cross section of the first pillar portion 151.
  • FIG. 4B is a cross-sectional view showing another example of the cross section of the first pillar portion 151.
  • 5A to 5D are cross-sectional views showing first to fourth modified examples of the first pillar portion 151. Note that FIGS. 4A and 4B show cross sections when the first pillar portion 151 is cut in a virtual plane parallel to the X-axis direction and the Y-axis direction. 5A to 5D show the cross-sectional structure corresponding to the portion B surrounded by the broken line in FIG.
  • the first pillar portion 151 is a so-called solid pillar, and is made of a metal having high thermal conductivity such as copper. As shown in FIG. 4A, the first pillar portion 151 is a columnar member having no internal cavity in the present embodiment. However, the present invention is not limited to this example, and the first pillar portion 151 may be a member having a macroscopic cavity inside to the extent that mechanical strength can be ensured.
  • the first pillar portion 151 may be a non-porous tubular member as shown in FIG. 4B. At this time, preferably, the first pillar portion 151 has a thick tubular shape.
  • the internal macroscopic cavity 151a may be singular or plural as long as the mechanical strength of the first pillar portion 151 can be secured. It was
  • the upper end portion of the first pillar portion 151 is connected to the second metal plate 12.
  • the first pillar portion 151 projects from the lower surface of the second metal plate 12 in the ⁇ Z direction.
  • the first pillar portion 151 and the second metal plate 12 are different parts of a single member.
  • the first pillar portion 151 can be formed by etching or cutting the second metal plate 12.
  • the present invention is not limited to this example, and the first pillar portion 151 may be a member different from the second metal plate 12.
  • the upper end portion of the first pillar portion 151 may be joined to the upper surface of the second metal plate 12 by a joining means such as brazing using a brazing material or ultrasonic welding. It was
  • the lower end of the first pillar portion 151 is in contact with the first housing portion 10b, and in detail, is in contact with the first metal plate 11.
  • one end of at least one first pillar portion 151 is connected to the first housing portion 10b.
  • the lower end portion of each first pillar portion 151 is fixed to the first metal plate 11.
  • the first contact area ⁇ S1 is the area where the first pillar portion 151 is in contact with the first metal plate 11 when viewed from the opposite direction.
  • the deformation of the housing 10 can be suppressed or prevented.
  • bending, expansion, etc. of the heat conductive member 1 can be effectively suppressed or prevented. It should be noted that the above example does not exclude a configuration in which the lower end portion of at least one first pillar portion 151 is in contact with the first housing portion 10b but is not fixed. It was
  • the form of the first pillar portion 151 is not limited to the example of FIG. As shown in FIG. 5A, in at least one first pillar portion 151, the lower end portion of the first pillar portion 151 protruding from the second metal plate 12 may be in contact with the upper surface of the first wick structure 31.
  • the first contact area ⁇ S1 is the area where the first pillar portion 151 is in contact with the first wick structure 31 when viewed from the opposite direction.
  • the lower end portion of the first pillar portion 151 is fixed to the upper surface of the first wick structure 31 by means such as brazing and ultrasonic welding. Even in this way, deformation of the housing 10 due to the action of an external force, an increase in internal pressure, or the like can be suppressed or prevented.
  • At least one first pillar portion 151 may protrude from the upper surface of the first metal plate 11 in the + Z direction.
  • the first pillar portion 151 and the first metal plate 11 may be different parts of a single member, or may be different members from the first metal plate 11.
  • the first pillar portion 151 can be formed by etching or cutting the first metal plate 11.
  • the lower end portion of the first pillar portion 151 can be joined to the upper surface of the first metal plate 11 by joining means such as brazing using a brazing material and ultrasonic welding. It was
  • the upper end portion of at least one first pillar portion 151 may be in contact with the second housing portion 10c.
  • the upper end portion of the first pillar portion 151 may be in contact with the lower surface of the second metal plate 12 as shown in FIG. 5B.
  • the first contact area ⁇ S1 is the area where the first pillar portion 151 is in contact with the second metal plate 12 when viewed from the opposite direction.
  • the upper end portion of the first pillar portion 151 is fixed to the lower surface of the second metal plate 12 by means such as brazing and ultrasonic welding. It should be noted that this example does not exclude a configuration in which the upper end portion of at least one of the first pillar portions 151 protruding from the first metal plate 11 is in contact with the second metal plate 12 but is not fixed. It was
  • the upper end portion of at least one first pillar portion 151 may be in contact with the lower surface of the second wick structure 32 as shown in FIG. 5C.
  • the first contact area ⁇ S1 is the area where the first pillar portion 151 is in contact with the second wick structure 32 when viewed from the opposite direction.
  • the upper end portion of the first pillar portion 151 is fixed to the lower surface of the second wick structure 32 by means such as brazing and ultrasonic welding. It should be noted that this example does not exclude a configuration in which the upper end portion of at least one of the first pillar portions 151 protruding from the first metal plate 11 is in contact with the second wick structure 32 but is not fixed. It was
  • At least one first pillar portion 151 may be a separate member from the first metal plate 11 and the second metal plate 12, as shown in FIG. 5D.
  • the upper end portion of the first pillar portion 151 is joined to the lower surface of the second metal plate 12 by means such as brazing and ultrasonic welding, and the lower end portion of the first pillar portion 151 is the upper surface of the first metal plate 11. Is joined to.
  • the contact areas ⁇ Sa and ⁇ Sb in FIG. 5D correspond to the first contact area ⁇ S1.
  • the contact area ⁇ Sa is an area where the lower end portion of the first pillar portion 151 is in contact with the first metal plate 11 when viewed from the Z-axis direction.
  • the contact area ⁇ Sb is an area where the upper end portion of the first pillar portion 151 is in contact with the second metal plate 12 when viewed from the Z-axis direction. That is, when viewed from the Z-axis direction, at least one of the total sum Sa of the contact area ⁇ Sa and the total Sb of the contact area ⁇ Sb is the second contact area ⁇ S2 in which the second pillar portion 152 is in contact with the first housing portion 10b, respectively.
  • the total sum S2 and the second pillar portion 152 are wider than the total sum S3 of the third contact area ⁇ S3 in contact with the second housing portion 10c. More preferably, Sa> S2, Sa> S3, Sb> S2, and Sb> S3 are all satisfied. It was
  • FIGS. 3 and 6A to 6E are cross-sectional views showing first to fifth modified examples of the second pillar portion 152.
  • 6A to 6E show a cross-sectional structure corresponding to the portion C surrounded by the broken line in FIG.
  • the second pillar portion 152 is a porous sintered body, and is formed by sintering particles of a metal having high thermal conductivity such as copper. By making the second pillar portion 152 a porous sintered body, the second pillar portion 152 can be used as a flow path of the working medium 20 between the first wick structure 31 and the second wick structure 32. It was
  • each first pillar portion 151 is in contact with the second housing portion 10c, and the lower end portion is in contact with the first housing portion 10b.
  • one end of the first pillar portion 151 is in contact with the first wick structure 31, and the other end of the first pillar portion 151 is in contact with the second wick structure 32. Since the porous second pillar portion 152 is in contact with the first wick structure 31 and the second wick structure 32, the working medium 20 can be smoothly moved from one of the first wick structure 31 and the second wick structure 32 to the other. Can be moved. It was
  • the lower end portion of the second pillar portion 152 is connected to the first wick structure 31.
  • the upper end of the second pillar portion 152 is connected to the second wick structure 32.
  • the second pillar portion 152 supports the first metal plate 11 and the second metal plate 12 via the first wick structure 31 and the second wick structure 32.
  • the present invention is not limited to this, and in at least one second pillar portion 152, the second pillar portion 152 is connected to one of the first wick structure 31 and the second wick structure 32, but the other. It does not have to be connected to.
  • the second pillar portion 152 may be connected to at least one of the first wick structure 31 and the second wick structure 32.
  • the movement of the working medium 20 between the first wick structure 31 and the second wick structure 32 can be made smoother.
  • at least one second pillar portion 152 is connected to both the first housing portion 10b having the first wick structure 31 and the second housing portion 10c having the second wick structure 32.
  • the strength of the housing 10 can be further improved. For example, it is possible to improve the effect of suppressing or preventing bending, expansion, etc. of the heat conductive member 1 due to an increase in internal pressure. It was
  • the second pillar portion 152, the first wick structure 31, and the second wick structure 32 are different parts of a single member.
  • the present invention is not limited to this, and as shown in FIGS. 6A and 6B, in at least one second pillar portion 152, the second pillar portion 152 and the first wick structure 31 are different members of a single member.
  • the second pillar portion 152 and the second wick structure 32 may be separate members.
  • the second pillar 152 and the second wick structure 32 are different parts of a single member, while the second pillar 152 and the first wick structure are different.
  • 31 may be a separate member.
  • At least one second pillar portion 152 and at least one of the first wick structure 31 and the second wick structure 32 may be different parts of a single member. By doing so, the movement of the working medium 20 between at least one second pillar portion 152 and the first wick structure 31 and / or the second wick structure 32 can be further smoothed. Further, since the number of parts of the heat conductive member 1 can be reduced, the productivity of the heat conductive member 1 can be improved. However, the above example does not exclude a configuration in which at least one second pillar portion 152 is a separate member from both the first wick structure 31 and the second wick structure 32 (see FIG. 6C). It was
  • At least one second pillar portion 152 is at least one of the first metal plate 11 and the second metal plate 12 as shown in FIGS. 6B and 6D to 6E. You may come in contact with. It was
  • the upper end portion of at least one second pillar portion 152 is the lower surface of the second metal plate 12 through the through hole 32a arranged in the second wick structure 32 as shown in FIGS. 6B and 6D to 6E. In contact with.
  • the upper end portion of the second pillar portion 152 is connected to the second metal plate 12 or the second wick structure 32 by means such as brazing and ultrasonic welding.
  • the upper end portion of the second pillar portion 152 may be fixed in contact with the second metal plate 12 by being press-fitted into the through hole 32a.
  • the side surface of the upper end portion of the second pillar portion 152 is in contact with the inner surface surface of the through hole 32a.
  • the lower end portion of at least one second pillar portion 152 is in contact with the upper surface of the first metal plate 11 through the through hole 31a arranged in the first wick structure 31.
  • the lower end portion of the second pillar portion 152 is connected to the first metal plate 11 or the first wick structure 31 by means such as brazing and ultrasonic welding.
  • the lower end portion of the second pillar portion 152 may be fixed in contact with the first metal plate 11 by being press-fitted into the through hole 31a.
  • the side surface of the lower end portion of the second pillar portion 152 is in contact with the inner surface surface of the through hole 31a.
  • first wick structure 31 and the second wick structure 32 are porous sintered bodies, respectively.
  • the thickness W1 of the first wick structure 31 is thicker than the thickness W2 of the second wick structure 32.
  • the first wick structure 31 arranged on the heating element H side promotes evaporation of the liquid working medium 20 as compared with the second wick structure 32. Therefore, by setting W1> W2 in the Z-axis direction, the holding property of the working medium 20 in the first wick structure 31 can be made higher than the holding property of the working medium 20 in the second wick structure 32.
  • By increasing the holding amount of the working medium 20 in the first wick structure 31 it is possible to suppress or prevent the occurrence of so-called dryout even if the amount of heat transferred from the heating element H is large.
  • this example does not exclude the configuration in which the thickness W1 of the first wick structure 31 is equal to or less than the thickness W2 of the second wick structure 32. It was
  • the dryout is a phenomenon in which the working medium 20 in the first wick structure 31 is substantially evaporated and dried in the vicinity of the heated portion 101. If a dryout occurs, the gas-liquid circulation cycle of the working medium 20 is interrupted, so that heat cannot be transferred from the heated portion 101 to the heat radiating portion 102 via the working medium 20, and the heat conductive member 1 Heat transfer performance is significantly reduced. It was
  • the second wick structure 32 arranged on the heat radiation surface side opposite to the heating element H, the condensation of the evaporated working medium 20 is promoted more than in the first wick structure 31. Therefore, it is preferable that the second wick structure 32 has a higher cooling efficiency of the working medium 20 than the first wick structure 31. It was
  • the heat conductive member 1 satisfies the following in the facing direction.
  • the space in which the steam of the working medium 20 can move can be made wider between the first wick structure 31 and the second wick structure 32. Therefore, the working medium 20 evaporated from the portion of the first wick structure 31 near the heated portion 101 is more likely to diffuse in the above space, so that the heated portion 101 to the heat radiating portion 102 via the working medium 20 can be easily diffused. Heat transport efficiency is improved. Therefore, the heat transfer efficiency of the heat conductive member 1 can be improved. It was
  • both the space where the steam of the working medium 20 can move and the holding property of the working medium 20 in the first wick structure 31 can be secured in a well-balanced manner. Therefore, it is possible to improve the heat transfer efficiency from the heated portion 101 to the heat radiating portion 102 via the working medium 20 while suppressing the occurrence of dryout.
  • the heat conductive member 1 satisfies the following.
  • the volume V1 of the steam space can be made wider. Therefore, the working medium 20 evaporated from the portion of the first wick structure 31 near the heated portion 101 is more likely to diffuse in the steam space, so that the heat from the heated portion 101 to the heat radiating portion 102 via the working medium 20 is easily generated. Transportation efficiency is improved. Therefore, the heat transfer efficiency of the heat conductive member 1 can be improved. It was
  • the above-mentioned steam space is a space other than the first wick structure 31, the second wick structure 32, and the pillar portion 15 in the internal space 10a.
  • first wick structure 31 has a higher porosity than the second wick structure 32.
  • the capillary force of the first wick structure 31 becomes larger than the capillary force of the second wick structure 32.
  • the ratio of the volume of the space to the total product of the first wick structure 31 and the second wick structure 32 is referred to as a porosity.
  • the unit of porosity is%.
  • the porosity is determined by the following method. For example, the porosity can be obtained by measuring the area of the space from the cross-sectional photograph of the wick structure 3 and calculating the ratio of the area of the space to the whole.
  • a scanning electron microscope having a deep depth of field. The method of observing the cross section is not particularly limited as long as it can easily distinguish between the metal portion and the space. It was
  • the thickness of the second wick structure 32 is uniform in the direction perpendicular to the Z-axis direction.
  • the present invention is not limited to this example, and even if the thickness of a part of the second wick structure 32 is thinner than the thickness of the remaining part of the second wick structure 32 in the direction perpendicular to the Z-axis direction. good.
  • FIG. 7 is a cross-sectional view showing a modified example of the second wick structure 32. Note that FIG. 7 shows a cross-sectional structure corresponding to the portion D surrounded by the broken line in FIG. As shown in FIG. 7, the second wick structure 32 has a recess 32b.
  • the recess 32b is arranged on the lower surface of the second wick structure 32 and is recessed in the + Z direction. Seen from the Z-axis direction, the recess 32b overlaps with the heating element H, preferably all of the heating element H. In other words, preferably, the outer peripheral edge portion of the recess 32b is arranged outside the heating element H when viewed from the Z-axis direction. It was
  • the working medium 20 tends to condense in the portion of the second wick structure 32 that overlaps with the heating element H when viewed from the Z-axis direction.
  • the condensation efficiency of the working medium 20 in this portion may decrease. That is, there is a risk that the heat transport efficiency of the working medium 20 will decrease. Therefore, by reducing the thickness of this portion and reducing the number of working media 20 that can be held in this portion, it is possible to suppress a decrease in the condensation efficiency in this portion. Therefore, it is possible to suppress a decrease in the heat transport efficiency of the working medium 20. It was
  • the thickness of the portion of the second wick structure 32 in which the recess 32b is arranged is uniform in the X-axis direction and / or the Y-axis direction.
  • the thickness is not limited to this example, and the above thickness does not have to be uniform.
  • the bottom surface of the recess 32b may be recessed in a conical shape in the + Z direction.
  • the thickness of the portion of the second wick structure 32 where the recess 32b is arranged may become thinner toward the center of this portion, for example.
  • the first wick structure 31 and the second wick structure 32 are made of a porous sintered body.
  • the present invention is not limited to this example, and the first wick structure 31 may be a mesh member in which a plurality of metal linear members are woven.
  • the second wick structure 32 may be a mesh member in which a plurality of metal linear members are woven.
  • the capillary force of the first wick structure 31 can be reduced to the second wick structure. It is larger than the capillary force of 32 and can be easily formed. It was
  • the first wick structure 31 may be composed of a plurality of grooves formed on the inner surface of the first metal plate 11 on the second metal plate 12 side.
  • the second wick structure 32 may be composed of a plurality of grooves formed on the inner surface of the second metal plate 12 on the side of the first metal plate 11.
  • the first wick structure 31, the second wick structure 32, and the second pillar portion 152 are all sintered bodies, and are formed as follows, for example. First, a mixed powder containing micro copper particles, a copper body and a resin is sprayed and applied to the upper surface of the first metal plate 11 and the lower surface of the second metal plate 12 before joining. Next, the first metal plate 11 and the second metal plate 12 are joined by sandwiching the mixed powder formed in a columnar shape. After that, the housing 10 is heated to bake the mixed powder. As a result, the first wick structure 31, the second wick structure 32, and the second pillar portion 152 can be easily integrally formed in the internal space 10a of the housing 10. As a result, the manufacturing cost of the heat conductive member 1 can be suppressed. The first metal plate 11 and the second metal plate 12 may be joined after the first wick structure 31, the second wick structure 32, and the second pillar portion 152 are fired separately.
  • coating means adhering mixed powder to the upper surface of the first metal plate 11 and the lower surface of the second metal plate 12.
  • the mixed powder paste may be applied directly. It was
  • Micro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the microcopper particles are porous and have a particle size of 1 ⁇ m or more and less than 1 mm. It was
  • the copper body is a copper melt obtained by melting and solidifying sub-micro copper particles smaller than the micro copper particles by sintering.
  • Submicro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the sub-micro copper particles before melting is, for example, 0.1 ⁇ m or more and less than 1 ⁇ m. It was
  • the resin is a volatile resin that volatilizes at a temperature below the melting point of the copper constituting the micro copper particles and the copper body.
  • a volatile resin for example, a cellulose resin such as methyl cellulose or ethyl cellulose, an acrylic resin, a butyral resin, an alkyd resin, an epoxy resin, a phenol resin or the like can be used.
  • an acrylic resin having high thermal decomposability. It was
  • the heated portion 101 is heated by the heat generated by the heating element H.
  • the liquid working medium 20 contained in the first wick structure 31 evaporates. It was
  • the evaporated working medium 20 moves the internal space 10a toward the heat radiating portion 102.
  • the evaporated working medium 20 may move to the second wick structure 32, or may move from the heated portion 101 of the heat conductive member 1 to a portion separated in the X-axis direction and / or the Y-axis direction. do. It was
  • the second wick structure 32 has a larger surface area and higher cooling efficiency than the lower surface of the second metal plate 12. Therefore, by providing the second wick structure 32, the cooling efficiency of the evaporated working medium 20 is improved and condensation is promoted. It was
  • a part of the working medium 20 condensed by the second wick structure 32 is dropped and absorbed by the first wick structure 31. Further, the other part of the working medium 20 condensed in the second wick structure 32 moves inside the second wick structure 32 and the second pillar portion 152 and is absorbed by the first wick structure 31. .. Further, the other part of the working medium 20 condensed by the second wick structure 32 is along the side surface of the first pillar portion 151 and / or the inner surface of the first side wall portion 13a and the inner surface of the second side wall portion 13b. And is absorbed by the first wick structure 31. It was
  • the other part of the evaporated working medium 20 is cooled and condensed at a portion of the first wick structure 31 that is separated from the heated portion 101 in the X-axis direction and / or the Y-axis direction.
  • the condensed working medium 20 moves in the first wick structure 31 toward the heated portion 101 due to the capillary phenomenon.
  • the working medium 20 that has moved from the second wick structure 32 to the first wick structure 31 also moves in the first wick structure 31 toward the heated portion 101 due to the capillary phenomenon.
  • the capillary force of the first wick structure 31 is higher than the capillary force of the second wick structure 32. Therefore, the working medium 20 condensed via the first wick structure 31 can be moved faster by the heated portion 101 in which the heating element H is arranged. Therefore, the heat transport efficiency by the working medium 20 is improved. It was
  • the second wick structure 32 arranged on the lower surface of the second metal plate 12 may be omitted. It was
  • the present invention can be used for cooling various heating elements.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un élément de conduction thermique dont un boîtier comprend une première partie de boîtier ayant une première plaque métallique et une première structure de mèche, et une seconde partie de boîtier ayant une seconde plaque métallique disposée à l'opposé de la première plaque métallique. Des parties de colonne comprennent au moins une première partie de colonne solide et au moins une seconde partie de colonne poreuse. La première partie de colonne a une extrémité reliée à l'une des plaques métalliques, et une autre extrémité en contact avec l'une des parties de boîtier qui a l'autre plaque métallique. La seconde partie de colonne est en contact avec la première partie de boîtier et la seconde partie de boîtier. Vu depuis la direction opposée, une somme de premières zones de contact dans lesquelles la première partie de colonne vient en contact avec une partie de boîtier est supérieure à une somme de deuxièmes zones de contact dans lesquelles la seconde partie de colonne entre en contact avec la première partie de boîtier et une somme de troisièmes zones de contact dans lesquelles la seconde partie de colonne vient en contact avec la seconde partie de boîtier.
PCT/JP2021/028353 2020-07-31 2021-07-30 Élément de conduction thermique WO2022025258A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020131230 2020-07-31
JP2020-131230 2020-07-31
JP2020182978A JP2023127006A (ja) 2020-10-30 2020-10-30 熱伝導部材
JP2020-182978 2020-10-30

Publications (1)

Publication Number Publication Date
WO2022025258A1 true WO2022025258A1 (fr) 2022-02-03

Family

ID=80035823

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/028353 WO2022025258A1 (fr) 2020-07-31 2021-07-30 Élément de conduction thermique

Country Status (1)

Country Link
WO (1) WO2022025258A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091172A (ja) * 1999-09-21 2001-04-06 Fujikura Ltd 平板状ヒートパイプ
JP2002062072A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板状ヒートパイプおよびその製造方法
JP2002062067A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
JP2004238672A (ja) * 2003-02-05 2004-08-26 Fujikura Ltd 平板型ヒートパイプの製造方法
JP2007205701A (ja) * 2006-02-06 2007-08-16 Fujikura Ltd 平板型ヒートパイプおよびその製造方法
US20120168435A1 (en) * 2011-01-04 2012-07-05 Cooler Master Co., Ltd. Folding vapor chamber

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091172A (ja) * 1999-09-21 2001-04-06 Fujikura Ltd 平板状ヒートパイプ
JP2002062072A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板状ヒートパイプおよびその製造方法
JP2002062067A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
JP2004238672A (ja) * 2003-02-05 2004-08-26 Fujikura Ltd 平板型ヒートパイプの製造方法
JP2007205701A (ja) * 2006-02-06 2007-08-16 Fujikura Ltd 平板型ヒートパイプおよびその製造方法
US20120168435A1 (en) * 2011-01-04 2012-07-05 Cooler Master Co., Ltd. Folding vapor chamber

Similar Documents

Publication Publication Date Title
WO2018198354A1 (fr) Chambre à vapeur
US11359869B2 (en) Vapor chamber
US11421942B2 (en) Vapor chamber
TW201530075A (zh) 熱管
US11740029B2 (en) Vapor chamber
WO2022025258A1 (fr) Élément de conduction thermique
WO2018198350A1 (fr) Chambre à vapeur
WO2022025259A1 (fr) Élément thermoconducteur
JP2023127006A (ja) 熱伝導部材
WO2022025249A1 (fr) Élément de conduction thermique
WO2022025253A1 (fr) Élément thermoconducteur
WO2022025256A1 (fr) Élément de conduction thermique
WO2022025251A1 (fr) Élément de conduction thermique
JP2023127007A (ja) 熱伝導部材
WO2022025254A1 (fr) Élément de conduction thermique
WO2022025255A1 (fr) Élément de conduction thermique
WO2022025252A1 (fr) Élément de conduction thermique
WO2022025257A1 (fr) Élément conducteur de chaleur
WO2022025261A1 (fr) Élément de conduction thermique
WO2022181631A1 (fr) Élément thermoconducteur et dispositif d'échange de chaleur
JP2023127011A (ja) 熱伝導部材
JP2023127010A (ja) 熱伝導部材
JP2023127013A (ja) 熱伝導部材
JP2023123890A (ja) 熱伝導部材
JP2023127009A (ja) 熱伝導部材

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21849968

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21849968

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP