WO2022181631A1 - Élément thermoconducteur et dispositif d'échange de chaleur - Google Patents

Élément thermoconducteur et dispositif d'échange de chaleur Download PDF

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Publication number
WO2022181631A1
WO2022181631A1 PCT/JP2022/007360 JP2022007360W WO2022181631A1 WO 2022181631 A1 WO2022181631 A1 WO 2022181631A1 JP 2022007360 W JP2022007360 W JP 2022007360W WO 2022181631 A1 WO2022181631 A1 WO 2022181631A1
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WO
WIPO (PCT)
Prior art keywords
plate portion
heat
joint
facing
member according
Prior art date
Application number
PCT/JP2022/007360
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English (en)
Japanese (ja)
Inventor
雅昭 花野
Original Assignee
日本電産株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日本電産株式会社 filed Critical 日本電産株式会社
Priority to CN202280007829.7A priority Critical patent/CN116745572A/zh
Publication of WO2022181631A1 publication Critical patent/WO2022181631A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

Definitions

  • the present disclosure relates to heat conduction members and heat exchange devices.
  • a vapor chamber is known as a heat-conducting member that dissipates heat from a heat source such as a heating element.
  • a heat source such as a heating element.
  • a hollow portion in which the working fluid is sealed is formed by stacking two opposing plate-like bodies.
  • the heating element is thermally connected to the vapor chamber, the working fluid undergoes a phase change to vapor phase.
  • the gas-phase working fluid moves to the heat-dissipating portion, dissipates latent heat, and undergoes a phase change to a liquid phase.
  • the purpose of the present disclosure is to reduce the thermal resistance at the heat source contact portion.
  • An exemplary heat transfer member of the present disclosure includes a housing and a working medium.
  • the housing has a first plate portion, a second plate portion, and an internal space.
  • the first plate portion and the second plate portion are arranged to face each other in a first direction.
  • the internal space accommodates the working medium.
  • the first plate portion has a first plate portion and a side portion.
  • the first plate extends in a second direction perpendicular to the first direction.
  • the side portion extends from the end of the first plate portion in the second direction toward the second plate portion.
  • the second plate portion has a second plate portion and a heat source contact portion. The second plate portion spreads in the second direction and is arranged on one side of the first direction relative to the first plate portion.
  • the heat source contact portion is arranged on an end surface of the second plate portion facing in the first direction.
  • the internal space is the space between the first plate portion and the second plate portion in the first direction.
  • the thickness of the second plate portion in the first direction is thinner than the thickness of the first plate portion in the first direction.
  • An exemplary heat exchange device of the present disclosure includes the heat transfer member described above and a cooling device that cools the heat transfer member.
  • the heat conducting member further includes a heat sink disposed on an end surface of the first plate portion facing the other of the first directions.
  • the cooling device has a box.
  • the box body is arranged on the end surface of the second plate portion facing one of the first directions, and covers the heat sink.
  • the box has an inlet through which a coolant flows and an outlet through which the coolant flows out.
  • thermal resistance at the heat source contact portion can be reduced.
  • FIG. 1 is a cross-sectional view of the heat exchange device viewed from the Y direction.
  • FIG. 2 is a cross-sectional view of the heat exchange device viewed from the X direction.
  • FIG. 3 is a plan view of the heat-conducting member viewed from the Z direction.
  • FIG. 4 is an enlarged cross-sectional view of the vicinity of the joint portion of the heat-conducting member.
  • the direction in which the first plate portion 11 and the second plate portion 12 of the heat conducting member 100 face each other is referred to as the "Z direction” and denoted by Z in the drawings.
  • Z direction the direction from the first plate portion 11 to the second plate portion 12
  • Z direction other Zb the direction from the second plate portion 12 to the first plate portion 11
  • Z direction one direction perpendicular to the Z direction
  • X direction the direction perpendicular to the Z direction
  • the direction perpendicular to both the Z direction and the X direction is called the "Y direction” and denoted by the symbol Y in the drawings. That is, the Z, X and Y directions are perpendicular to each other.
  • parallel means not only a state in which they do not intersect at all no matter how far they are extended, but also a state in which they are substantially parallel. contains a state.
  • perpendicular and perpendicular respectively include not only the state in which the two intersect each other at 90 degrees, but also the state in which they are substantially perpendicular and the state in which they are substantially orthogonal. That is, “parallel”, “perpendicular” and “perpendicular” each include a state in which there is an angular deviation in the positional relationship between the two without departing from the gist of the present disclosure.
  • FIG. 1 is a cross-sectional view of the heat exchange device 500 viewed from the Y direction.
  • FIG. 2 is a cross-sectional view of the heat exchange device 500 viewed from the X direction.
  • FIG. 3 is a plan view of the heat conducting member 100 viewed from the Z direction.
  • FIG. 4 is an enlarged sectional view of the vicinity of the joint portion 13 of the heat conducting member 100.
  • FIG. 1 shows a cross-sectional structure of the heat exchange device 500 taken along an imaginary plane P1 parallel to both the X direction and the Z direction in FIG.
  • FIG. 1 shows a cross-sectional structure of the heat exchange device 500 taken along an imaginary plane P2 parallel to both the Y direction and the Z direction in FIG.
  • FIG. 4 is an enlarged view of a portion P surrounded by a dashed line in FIG.
  • the heat exchange device 500 includes a heat transfer member 100 and a cooling device 200 that cools the heat transfer member 100 .
  • the heat exchange device 500 is attached to a heat source 300 such as a heating element, and exchanges heat between the heat conducting member 100 to which heat is transferred from the heat source 300 and the fluid f as a coolant flowing inside the cooling device 200 . That is, the heat source 300 is cooled by dissipating heat to the heat conducting member 100 .
  • the heat conducting member 100 also called a vapor chamber, is attached to the heat source 300 and dissipates heat to the cooling device 200 .
  • the heat conducting member 100 can dissipate heat to the surrounding atmosphere at the portion that does not contact the cooling device 200 and the heat source 300 .
  • the heat source 300 is in contact with the end face of the heat conducting member 100 facing one Z direction Za, and the cooling device 200 is in contact with the end face of the heat conducting member 100 facing the other Z direction Zb. More specifically, the heat source 300 is disposed on the end surface of the heat conducting member 100 facing one Za in the Z direction via the heat conducting sheet 301 so that heat can be transferred.
  • the thermally conductive sheet 301 has high thermal conductivity and high heat resistance.
  • a thermally conductive sheet 301 for example, a graphite sheet, a composite resin sheet containing a thermally conductive material, or the like can be used.
  • heat dissipation grease containing a heat conductive material instead of the heat conductive sheet 301, heat dissipation grease containing a heat conductive material may be used.
  • the heat source 300 may directly come into contact with the end surface of the heat conducting member 100 facing the Z-direction one Za.
  • Heat source 300 is, for example, a power transistor of an inverter provided in a traction motor for driving wheels of a vehicle. This power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor).
  • the amount of heat generated by an IGBT is generally 100 W or more.
  • the heat conducting member 100 is mounted on the traction motor.
  • the thickness of the heat conducting member 100 in the Z direction is, for example, 5 mm or more.
  • the application and size of the heat conducting member 100 are not limited to the above examples.
  • the thermally conductive member 100 has a heat source contact portion 101 and a heat radiating portion (reference numerals omitted).
  • the heat source contact portion 101 is, for example, a portion of the heat conducting member 100 that can come into contact with the heat source 300 and receives heat transfer from the heat source 300 .
  • the heat radiation part radiates the heat transferred to the heat source contact part 101 to the outside.
  • the end surface of the thermally conductive member 100 facing the other Zb in the Z direction serves as a heat radiating portion.
  • the cooling device 200 is attached to the heat radiating portion of the heat conducting member 100 .
  • the heat-conducting member 100 includes a housing 1, a working medium 2, a wick structure 3, and a heat sink 4.
  • the working medium 2 is pure water in this embodiment, it may be a medium other than water.
  • the working medium 2 is any one of alcohol compounds such as methanol and ethanol, alternative fluorocarbons such as hydrofluorocarbons, hydrocarbon compounds such as propane and isobutane, fluorohydrocarbon compounds such as difluoromethane, ethylene glycol, and the like. good too.
  • the working medium 2 can be used appropriately according to the usage environment of the heat conducting member 100 .
  • the housing 1 has an internal space 10 in which the working medium 2 is accommodated, and a first plate portion 11 and a second plate portion 12 that are arranged facing each other in the Z direction. is an example of the "first direction" of . Further, the housing 1 further has a joint portion 13 of the first plate portion 11 and the second plate portion 12 and a column portion 14 .
  • the internal space 10 is a closed space surrounded by the first plate portion 11 and the second plate portion 12, and is maintained in a reduced pressure state, for example, at a pressure lower than the atmospheric pressure. Since the internal space 10 is in a decompressed state, the working medium 2 is easily vaporized within the internal space 10 . In addition, the internal space 10 further accommodates the wick structure 3, the column portion 14, and the like.
  • the first plate portion 11 is arranged on the other side Zb in the Z direction than the second plate portion 12 .
  • the first plate portion 11 covers the end surface of the second plate portion 12 facing the other Zb in the Z direction and is joined to this end surface.
  • metal with high thermal conductivity such as copper is used.
  • a metal plating layer may be formed on the surface.
  • Metals other than copper include, for example, any metal such as iron, aluminum, zinc, silver, gold, magnesium, manganese, and titanium, or alloys containing at least any of the above metals including copper (brass, duralumin, stainless steel, etc.) can be used.
  • the first plate portion 11 and the second plate portion 12 of this embodiment are rectangular when viewed from the Z direction (see FIG. 3, for example).
  • the shapes of the first plate portion 11 and the second plate portion 12 are not limited to this example.
  • each of the first plate portion 11 and the second plate portion 12 may have a polygonal shape with multiple corners or a circular shape when viewed from the Z direction.
  • the first plate portion 11 has a first plate portion 111 and side portions 112 .
  • the first plate portion 111 extends in a direction perpendicular to the Z direction.
  • the "direction perpendicular to the Z direction" is an example of the "second direction” in the present invention, and includes the X direction and the Y direction in this embodiment.
  • the side surface portion 112 extends from the end of the first plate portion 111 in the direction perpendicular to the Z direction toward the second plate portion 12 .
  • the second plate portion 12 has a second plate portion 121 and a heat source contact portion 101 .
  • the second plate portion 121 spreads in a direction perpendicular to the Z direction and is arranged on one side Za in the Z direction from the first plate portion 111 .
  • the heat source contact portion 101 is arranged on the end surface of the second plate portion 121 facing one Za in the Z direction. In other words, the heat source contact portion 101 and at least a part of the end surface of the second plate portion 121 facing one Za in the Z direction are contactable with the heat source 300 .
  • the internal space 10 is the space between the first plate portion 111 and the second plate portion 121 in the Z direction.
  • the thickness W2 of the second plate portion 121 in the Z direction is thinner than the thickness W1 of the first plate portion 111 in the Z direction.
  • the thickness W1 of the first plate portion 111 in the Z direction is thicker than the thicknesses d1 and d2 of the first joint portion 113 and the second joint portion 122 in the Z direction, respectively.
  • the first plate portion 111 is less likely to deform even when the internal pressure of the housing 1 increases. Therefore, expansion of the housing 1 can be suppressed.
  • the width of the first plate portion 111 in the direction perpendicular to the Z direction is narrower than the width of the second plate portion 121 in the direction perpendicular to the Z direction. More specifically, the width in the direction perpendicular to the Z direction of the end surface of the first plate portion 111 facing the internal space 10 and facing one Z direction Za is It is narrower than the width in the direction perpendicular to the Z direction of the end face facing the other Z direction Zb. For example, as shown in FIGS. 1 and 3, the width Lx1 of the first plate portion 111 in the X direction is narrower than the width Lx2 of the second plate portion 121 in the X direction. 2 and 3, the width Ly1 of the first plate portion 111 in the Y direction is narrower than the width Ly2 of the second plate portion 121 in the Y direction.
  • the area of the end surface of the first plate portion 111 facing the one Z direction Za is the area of the end surface of the second plate portion 121 facing the other Z direction Zb (for example, Sc smaller than the area of the part surrounded by In this way, even if the internal pressure of the housing 1 increases due to vaporization of the working medium 2 , the first plate portion 111 is less likely to deform than the second plate portion 121 .
  • the heat sink 4 is arranged on the end surface of the first plate portion 111 facing the other Zb in the Z direction.
  • the heat conducting member 100 includes the heat sink 4 (see FIGS. 1 and 2).
  • the arrangement of the heat sink 4 increases the heat dissipation area for the heat transferred from the vaporized working medium 2 to the first plate portion 111 . Therefore, the cooling efficiency of the heat conducting member 100 can be improved.
  • the side surface portion 112 inclines more outward than the internal space 10 in the direction perpendicular to the Z direction toward one Z direction Za. For example, when viewed from the Y direction, the side surface portion 112 inclines further outward than the internal space 10 in the X direction toward one Z direction Za. In addition, when viewed from the X direction, the side surface portion 112 inclines further outward than the internal space 10 in the Y direction toward one Za in the Z direction.
  • the end portion on the Z direction one Za side of the outer surface of the side surface portion 112 (see Sb in FIG. 3 and FIG. 3 Sa and FIG. 4A).
  • the outer surface of the side surface portion 112 is a surface of the side surface portion 112 that faces the outside of the housing 1 .
  • the outside in the direction perpendicular to the Z direction is the outside in the direction perpendicular to the Z direction, and means the direction from the inside to the outside of the internal space 10 in the direction perpendicular to the Z direction.
  • this illustration does not exclude a configuration in which the end B on the one Z-direction Za side of the outer surface of the side surface portion 112 is not arranged outside the end A on the other Z-direction Zb side in the direction perpendicular to the Z direction. .
  • the end portion on the Z direction one Za side of the inner surface of the side surface portion 112 (see Sc in FIG. 3 and C in FIG. 4) is the Z direction on the outer surface of the side surface portion 112 On the other hand, it is arranged inside the end on the Zb side (see Sa in FIG. 3 and A in FIG. 4).
  • the inner surface of the side surface portion 112 is the surface of the side surface portion 112 that faces the inside of the housing 1 .
  • the inner side in the direction perpendicular to the Z direction is the inner side in the direction perpendicular to the Z direction, and means the direction from the outside to the inside of the internal space 10 in the direction perpendicular to the Z direction.
  • the side surface portion 112 receives a force directed from the inside to the outside of the housing 1 .
  • the end C of the inner surface of the side surface 112 is arranged inside the end A of the outer surface of the side surface 112 in the direction perpendicular to the Z direction.
  • the first plate portion 11 is less likely to separate from the second plate portion 12 as compared with the configuration in which C is not arranged inside the end portion A.
  • the force component directed in the other Z direction Zb can be made smaller.
  • the housing 1 becomes difficult to deform, and for example, the hermeticity of the internal space 10 that encloses the working medium 2 can be stably maintained.
  • the end C on the Z direction one Za side of the inner surface of the side surface 112 is inside the end A on the Z direction other Zb side of the outer surface of the side surface 112.
  • first plate portion 11 further has a first joint portion 113 .
  • the first joint portion 113 extends outward from the housing 1 in a direction perpendicular to the Z direction from the end portion of the side portion 112 on one Za side in the Z direction.
  • the second plate portion 12 further has a second joint portion 122 .
  • the second joint portion 122 extends outward from the end of the second plate portion 121 in a direction perpendicular to the Z direction.
  • the first joint 113 is joined to the second joint 122 at the joint portion 13 .
  • the end portion of the first joint portion 113 on the one Za side in the Z direction is connected to the end portion of the second joint portion 122 on the other Zb side in the Z direction.
  • both are directly joined in this embodiment, they are not limited to this example, and may be indirectly joined via an intermediate member such as a metal plate or a plated layer.
  • the thickness d1 in the Z direction of the first joint 113 is thicker than the thickness d2 in the Z direction of the second joint 122 (see FIG. 1). Due to d1>d2, the rigidity of the first joint portion 113 is improved. Therefore, when the internal pressure of the housing 1 increases due to the vaporization of the working medium 2 , it is possible to prevent the first joint portion 113 from deforming and separating from the second joint portion 122 . Therefore, the joint strength between the first joint portion 113 and the second joint portion 122 can be improved.
  • the joint portion 13 has an annular shape when viewed from the Z direction.
  • the housing 1 has a joint portion 13 .
  • the outer edge of the first plate portion 11 is joined to the second plate portion 12 at the joining portion 13 .
  • the connecting portion 13 By forming the connecting portion 13 into a continuous annular shape, the internal space 10 can be formed inside the annular connecting portion 13 when viewed from the Z direction.
  • the internal space 10 can be reliably sealed, compared to a configuration in which the joint portions of the first joint portion 113 and the second joint portion 122 are not connected to each other in an annular shape.
  • the joining means of the first joining portion 113 and the second joining portion 122 are not particularly limited.
  • the joining means may be a method of joining by applying heat and pressure, diffusion joining, joining using brazing material, or the like.
  • the joint portion 13 may include a sealing portion.
  • the sealed portion is, for example, a portion where an injection port for injecting the working medium 2 into the housing 1 is sealed by welding or the like in the manufacturing process of the heat conducting member 100 .
  • the pillar portion 14 is arranged in the internal space 10 .
  • the housing 1 has the pillars 14 .
  • the post 14 extends from one of the first plate portion 11 and the second plate portion 12 .
  • the strength of the housing 1 in the Z direction can be improved.
  • the column portion 14 extends in the Z direction from the end surface of the first plate portion 111 facing the one Z direction Za.
  • the tip of the pillar 14 (here, the end on one Za side in the Z direction) is in contact with the wick structure 3 .
  • the column portion 14 is not limited to the example of the present embodiment.
  • the column portion 14 may extend from the end surface of the second plate portion 121 facing the other Zb in the Z direction.
  • the direction in which the columnar portion 14 extends may be inclined from the Z direction.
  • the tip of the column portion 14 extending from the first plate portion 111 may be in contact with the second plate portion 121 and may be connected to the end surface of the second plate portion 121 facing the other Z direction Zb.
  • the tip of the column portion 14 extending from the second plate portion 121 may be in contact with the first plate portion 111, and may be connected to the end surface of the first plate portion 111 facing the Z-direction one side Za.
  • the column portion 14 may be a solid member or a porous body.
  • the solid member may be a metal column, and the porous body may be a sintered body of metal powder.
  • a "solid” member means a so-called solid member, which is densely packed and not porous.
  • a "solid” member may be a member having no internal cavities or a member having one or more macroscopic cavities therein. No gaseous or liquid working medium 2 enters the interior of the solid member.
  • the heat-conducting member 100 further includes the wick structure 3 housed in the internal space 10 .
  • the wick structure 3 has a capillary structure.
  • the interior of the wick structure 3 is permeable to the liquefied working medium 2 .
  • the wick structure 3 is a porous body such as a sintered body of metal powder in this embodiment. However, it is not limited to this illustration, and the wick structure 3 may be mesh-shaped, for example.
  • the wick structure 3 may be a portion of the housing 1, and may include, for example, a plurality of grooves arranged on the end surface of the second plate portion 121 facing the other Zb in the Z direction. good.
  • the material of the wick structure 3 is copper in this embodiment. However, it is not limited to this illustration, and other metals or alloys, carbon fibers, and ceramics may be employed.
  • the wick structure 3 is arranged on the end surface of the second plate portion 121 facing the other Zb in the Z direction, and extends in a direction perpendicular to the Z direction.
  • the working medium 2 in liquid state penetrates the wick structure 3 by capillary action. Therefore, the working medium 2 can be moved faster within the wick structure 3 .
  • the working medium 2 can be moved more quickly from the end surface of the wick structure 3 facing the one Z direction Zb toward the end surface of the second plate portion 121 facing the one Z direction Za.
  • the working medium 2 can be moved faster in the direction perpendicular to the Z direction.
  • the wick structure 3 is not limited to the example of this embodiment.
  • the wick structure 3 can be arranged on at least one of the end face of the first plate portion 111 facing one Z direction Za and the end face of the second plate portion 121 facing the other Z direction Zb.
  • Heat sink 4 is attached to the end surface of the first plate portion 111 facing the other Zb in the Z direction.
  • Heat sink 4 is made of a metal material such as Al or Cu. The heat sink 4 dissipates the heat transferred from the heat conducting member 100 to the fluid f flowing inside the cooling device 200 .
  • the outer edge portion of the end portion of the heat sink 4 on one side Za in the Z direction is arranged outside the outer edge of the facing end face (see Sd in FIG. 3 and D in FIG. 4).
  • the heat conduction efficiency of the heat conduction member 100 can be improved.
  • At least a part of the outer edge of the end of the heat sink 4 on the other Za side in the Z direction is the first It may be arranged inside the outer edge portion (see Sd in FIG. 3 and D in FIG. 4) of the end surface of the plate portion 111 facing one Za in the Z direction.
  • at least a part of the outer edge portion of the end portion of the heat sink 4 on the other Z direction Za side is located on the one Z direction Za side of the first plate portion 111 when viewed from the Z direction. may overlap with the outer edge of the end face (see Sd in FIG. 3 and D in FIG. 4) facing the . In this way, the size of the heat sink 4 in the direction perpendicular to the Z direction can be made smaller. Therefore, the heat conducting member 100 having the heat sink 4 can be made more compact.
  • the heat sink 4 includes a base 41 and fins 42 .
  • the base 41 has a plate-like shape extending in a direction perpendicular to the Z direction, and is rectangular when viewed from the Z direction in this embodiment.
  • the base 41 is arranged at the end of the heat conducting member 100 on the other Zb side in the Z direction.
  • the end face of the base 41 facing the one Z direction Za is in contact with the end face of the first plate portion 111 facing the other Z direction Zb.
  • the substrate 41 may be in direct contact, or may be in indirect contact via a member having high thermal conductivity. In the latter, for example, the substrate 41 may be in indirect contact via a heat conductive sheet, heat dissipation grease, or the like, as in the case of the heat source 300 .
  • the fin 42 protrudes from the base 41 in the other Z direction Zb.
  • the fins 42 are plate-shaped and extend in the longitudinal direction (for example, the X direction) of the housing 1 when viewed from the Z direction, and a plurality of fins 42 are arranged in the short direction (for example, the Y direction).
  • heat sink 4 is not limited to the above examples.
  • heat sink 4 may be a component of cooling device 200 . That is, the cooling device 200 may have the heat sink 4 .
  • the fins 42 may be columnar and may be arranged two-dimensionally in a direction perpendicular to the Z direction.
  • the columnar fins 42 may be arranged both in the X direction and in the Y direction.
  • the number of fins 42 may be singular.
  • the fins 42 may protrude from the heat conducting member 100 . That is, the base 41 may be omitted.
  • the fin 42 may be a member separate from the heat conducting member 100 (especially the second plate portion 121) and fixed to the end face of the heat conducting member 100 facing the other Zb in the Z direction.
  • the fins 42 may be part of the heat conducting member 100 , and may be different parts of the same member as the first plate portion 111 , for example.
  • the fin 42 may be a cut-and-raised portion obtained by cutting and raising a part of the end portion of the first plate portion 111 in the one Z direction Zb.
  • the cooling device 200 has a box 220 and a fluid flow path Pf (see FIGS. 1 and 2).
  • the box 220 has a lidded tubular shape and is open in one direction Za in the Z direction.
  • the box 220 has therein a fluid channel Pf through which the fluid f flows.
  • the fluid f flows in the X direction in the fluid flow path Pf.
  • the box 220 is arranged on the end surface of the first plate portion 111 facing the other side Zb in the Z direction, and covers the heat sink 4 . That is, the heat sink 4 is arranged inside the fluid flow path Pf.
  • the end portion of the box 220 on one Za side in the Z direction is fixed to the base 41 by a means such as screwing with a sealing member (not shown) such as an O-ring interposed therebetween.
  • the means for fixing the box 220 is not limited to this example, and may be welding, adhesion, or the like. As described above, when the base 41 is omitted, the end of the box 220 on one side Za in the Z direction is similarly fixed to the end face of the heat conducting member 100 facing the other side Zb in the Z direction.
  • the box 220 has an inlet 221 through which the fluid f flows and an outlet 222 through which the fluid f flows out (see FIG. 1).
  • the fluid f is an example of the "refrigerant" of this invention.
  • the inlet 221 is arranged on one side of the box 220 in the X direction.
  • the outflow port 222 is arranged on the other side of the box 220 in the X direction.
  • the inflow port 221 and the outflow port 222 are connected to a pump (not shown) for circulating the fluid f, a radiator (not shown) for cooling the fluid f, and the like.
  • Driving the pump causes the fluid f to circulate through the fluid flow path Pf, the radiator, and the pump.
  • the fluid f can flow into the fluid channel Pf from the inlet 221 of the box 220 . Inside the fluid flow path Pf, the fluid f contacts the fins 42 of the heat sink 4 . The fluid f can flow out of the fluid channel Pf from the outlet 222 of the box 220 .
  • the heat sink 4 can radiate heat to the fluid f, so the heat radiation efficiency of the heat sink 4 can be improved. Further, the fluid f heat-transferred from the heat sink 4 is caused to flow out of the box 220 through the outlet 222, and a new fluid f is caused to flow into the box 220 through the inlet 221, whereby the heat is transferred. It is possible to continue to supply the fluid f in the vicinity of the heat sink 4 . Therefore, the heat radiation efficiency of the heat sink 4 can be further improved.
  • the fluid f is a coolant, which is water in this embodiment.
  • the fluid f is not limited to this example, and may be a liquid such as an antifreeze liquid such as ethylene glycol or propylene glycol.
  • the fluid f may be gas such as air. Therefore, heat exchange device 500 can be used as a cold plate for cooling heat source 300 .
  • the heat transferred from the heat source 300 to the heat sink 4 by the heat conducting member 100 is radiated from the heat sink 4 to the fluid f, particularly from the fins 42 .
  • the heat-transferred fluid f flows out from the outlet 222, is cooled by the radiator, and then returns to the fluid flow path Pf. That is, the cooled fluid f flows from the inlet 221 into the fluid flow path Pf.
  • Such heat transfer and fluid circulation cycles allow the heat exchange device 500 to cool the heat source 300 .
  • the cooling device 200 may have a member for attaching the box 220 to an object other than the heat conducting member 100, a member for increasing the area of the outer surface of the box 220, and the like.
  • the end portion of the box 200 on one side Za in the Z direction may be fixed to the end surface of the first side wall portion 112 facing the other side Zb in the Z direction, or the first joint It may be fixed to the end surface of the portion 113 facing the other Zb in the Z direction.
  • the end portion of the box 200 on one Za side in the Z direction may be fixed to the outer surface of at least one of the first joint portion 113 and the second joint portion 122 in the direction perpendicular to the Z direction. This makes it possible to widen the fluid flow path Pf and increase the area where the heat conducting member 100 is in contact with the fluid f. Therefore, the cooling efficiency of the heat transfer member 100 by the cooling device 200 can be further improved.
  • the present disclosure can be used for cooling heat sources.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
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  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Une première plaque et une seconde plaque du présent élément thermoconducteur sont positionnées l'une en face de l'autre dans une première direction. Une première section de panneau de la première plaque s'étend dans une seconde direction orthogonale à la première direction. Une seconde section de panneau de la seconde plaque s'étend dans la seconde direction, et est positionnée davantage vers un côté dans la première direction que la première section de panneau. Une partie de contact de source de chaleur est positionnée sur une surface de la seconde section de panneau, ladite surface faisant face à un côté dans la première direction. L'espace entre la première section de panneau et la seconde section de panneau est un espace interne dans lequel un fluide de travail est reçu. L'épaisseur de la seconde section de panneau est inférieure à celle de la première section de panneau dans la première direction.
PCT/JP2022/007360 2021-02-25 2022-02-22 Élément thermoconducteur et dispositif d'échange de chaleur WO2022181631A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002022378A (ja) * 2000-07-06 2002-01-23 Showa Denko Kk ヒートパイプ
US20100139894A1 (en) * 2008-12-08 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with vapor chamber
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
US20190033006A1 (en) * 2017-07-28 2019-01-31 Dana Canada Corporation Ultra Thin Heat Exchangers For Thermal Management
KR20200107543A (ko) * 2019-03-08 2020-09-16 엘지전자 주식회사 방열판 모듈
JP2020193715A (ja) * 2017-08-04 2020-12-03 株式会社村田製作所 ベーパーチャンバー

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002022378A (ja) * 2000-07-06 2002-01-23 Showa Denko Kk ヒートパイプ
US20100139894A1 (en) * 2008-12-08 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with vapor chamber
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
US20190033006A1 (en) * 2017-07-28 2019-01-31 Dana Canada Corporation Ultra Thin Heat Exchangers For Thermal Management
JP2020193715A (ja) * 2017-08-04 2020-12-03 株式会社村田製作所 ベーパーチャンバー
KR20200107543A (ko) * 2019-03-08 2020-09-16 엘지전자 주식회사 방열판 모듈

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