WO2022025249A1 - Élément de conduction thermique - Google Patents

Élément de conduction thermique Download PDF

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Publication number
WO2022025249A1
WO2022025249A1 PCT/JP2021/028344 JP2021028344W WO2022025249A1 WO 2022025249 A1 WO2022025249 A1 WO 2022025249A1 JP 2021028344 W JP2021028344 W JP 2021028344W WO 2022025249 A1 WO2022025249 A1 WO 2022025249A1
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WO
WIPO (PCT)
Prior art keywords
wick structure
metal plate
porous
conductive member
heat conductive
Prior art date
Application number
PCT/JP2021/028344
Other languages
English (en)
Japanese (ja)
Inventor
征志 高尾
仕▲ゆ▼ 楊
敏彦 小関
雅昭 花野
淳一 石田
Original Assignee
日本電産株式会社
尼得科超▲しゅう▼科技股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021087998A external-priority patent/JP2023123890A/ja
Application filed by 日本電産株式会社, 尼得科超▲しゅう▼科技股▲ふん▼有限公司 filed Critical 日本電産株式会社
Publication of WO2022025249A1 publication Critical patent/WO2022025249A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure

Definitions

  • the present invention relates to a heat conductive member.
  • the conventional heat conductive member includes a container, a wick structure, and a working fluid.
  • the container has an internal space inside.
  • the wick structure is placed on the inner surface of the container.
  • the working fluid is housed in the interior space. It was
  • the container is placed in contact with the heating element.
  • the working fluid is heated by the heating element and vaporized from the wick structure.
  • the vaporized working fluid moves inside the container to the heat dissipation side.
  • the working fluid is cooled and condensed by the heat dissipation.
  • the condensed working fluid moves toward the heating element in the wick structure by capillarity. As a result, heat is transported from the heating element side to the heat radiating side (see, for example, Patent Document 1).
  • the heat conductive member as described above has a problem that the vaporized working fluid is difficult to condense and the heat transport efficiency is low. It was
  • An object of the present invention is to provide a heat conductive member capable of improving heat transport efficiency.
  • An exemplary heat conductive member of the present invention includes a housing having an internal space, a first wick structure, a second wick structure, and an actuating medium.
  • the housing has a first metal plate and a second metal plate arranged so as to face each other, and a pillar portion.
  • the pillar portion is arranged in the internal space and has a solid pillar portion that supports the first metal plate and the second metal plate.
  • the working medium, the first wick structure, and the second wick structure are housed in the internal space.
  • the first wick structure is arranged on the inner surface of the first metal plate.
  • the second wick structure is arranged on the inner surface of the second metal plate.
  • FIG. 1 is a perspective view of a heat conductive member according to an embodiment of the present invention.
  • FIG. 2 is a schematic side sectional view of the heat conductive member according to the embodiment of the present invention.
  • FIG. 3 is a schematic side sectional view of a heat conductive member according to a modified example of the embodiment of the present invention.
  • the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate.
  • the Z-axis direction indicates a vertical direction (that is, a vertical direction)
  • the + Z direction is the upper side (opposite the gravity direction)
  • the ⁇ Z direction is the lower side (gravity direction).
  • the Z-axis direction is also the opposite direction between the first metal plate 11 and the second metal plate 12, which will be described later.
  • the X-axis direction refers to a direction orthogonal to the Z-axis direction, and one direction and the opposite direction thereof are the + X direction and the ⁇ X direction, respectively.
  • the Y-axis direction refers to a direction orthogonal to both the Z-axis direction and the X-axis direction, and one direction and the opposite direction thereof are the + Y direction and the ⁇ Y direction, respectively.
  • this defines the direction only for convenience of explanation, and does not limit the direction at the time of manufacturing and the time of use of the heat conductive member 1 according to the present invention.
  • the expression "parallel” does not mean only the case of being mathematically strictly parallel, but includes, for example, the case of being parallel to the extent that the effect in the present disclosure is exhibited. It was
  • sining refers to a technique of heating a metal powder or a paste containing a metal powder to a temperature lower than the melting point of the metal to bake and harden the metal particles.
  • sintered body refers to an object obtained by sintering. It was
  • FIG. 1 is a perspective view of a heat conductive member 1 according to an exemplary embodiment of the present invention
  • FIG. 2 is a schematic side sectional view of the heat conductive member 1.
  • FIG. 2 is a cross-sectional view taken along the alternate long and short dash line AA of FIG.
  • the heat conductive member 1 is also called a vapor chamber and transports the heat of the heating element H.
  • the heating element H include a power transistor of an inverter provided in a traction motor for driving a wheel of a vehicle.
  • the power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor).
  • the heat conductive member 1 is mounted on the traction motor.
  • the calorific value of the IGBT is generally 100 W or more.
  • the heat conductive member 1 includes a heated portion 101 and a heat radiating portion 102 (see FIG. 2).
  • the heated portion 101 is arranged in contact with the heating element H, for example, and is heated by the heat generated by the heating element H.
  • the heat radiating unit 102 releases the heat of the operating medium 20, which will be described later, heated by the heated unit 101 to the outside.
  • heat exchange means such as heat dissipation fins and heat sinks may be thermally connected to the heat dissipation unit 102. In that case, the cooling medium is passed through the heat exchange means.
  • the cooling medium may be, for example, water, oil, or air. It was
  • the heat conductive member 1 includes a housing 10, an actuating medium 20, a first wick structure 31, and a second wick structure 32.
  • the heated portion 101 is formed by a part of the housing 10.
  • the heat radiating portion 102 is formed by another part of the housing 10.
  • the thickness of the heat conductive member 1 in the Z direction is, for example, 5 mm or more. It was
  • the housing 10 has an internal space 10a.
  • the working medium 20, the first wick structure 31, and the second wick structure 32 are housed in the internal space 10a.
  • the housing 10 has a first metal plate 11 and a second metal plate 12 arranged so as to face each other, and a pillar portion 15.
  • the first metal plate 11 and the second metal plate 12 have a rectangular plate shape that extends in the horizontal direction when viewed from above.
  • the heating element H comes into contact with the lower surface of the second metal plate 12.
  • the first metal plate 11 covers the upper surface of the second metal plate 12.
  • the first metal plate 11 and the second metal plate 12 of the present embodiment are rectangular in top view, but the present invention is not limited to this. For example, it may be a polygon or a circle having a plurality of corners in a top view. It was
  • the first metal plate 11 has a first side wall portion 13a extending downward from the peripheral edge.
  • the second metal plate 12 has a second side wall portion 13b extending upward from the peripheral edge.
  • the lower surface of the first side wall portion 13a and the upper surface of the second side wall portion 13b are joined at the joint portion 14.
  • the lower surface of the first side wall portion 13a and the upper surface of the second metal plate 12 may be joined by omitting the second side wall portion 13b.
  • the upper surface of the second side wall portion 13b and the lower surface of the first metal plate 11 may be joined by omitting the first side wall portion 13a.
  • the internal space 10a is formed by being surrounded by the first metal plate 11 and the second metal plate 12.
  • the internal space 10a is a closed space, and is maintained in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure, for example.
  • the working medium 20 housed in the internal space 10a is likely to evaporate.
  • the working medium 20 is, for example, water, but may be another liquid such as alcohol. It was
  • the joint portion 14 is located around the first wick structure 31 and the second wick structure 32 in the upward view.
  • the method of joining the first side wall portion 13a and the second side wall portion 13b is not particularly limited.
  • any joining method such as a method of joining by applying heat and pressure, a diffusion joining, or a joining using a brazing material may be used. It was
  • the joint portion 14 may include a sealing portion.
  • the sealing portion is, for example, a portion where an injection port for injecting the working medium 20 into the housing 10 is sealed by welding in the manufacturing process of the heat conductive member 1. It was
  • the pillar portion 15 has at least one solid solid pillar portion 151 and at least one porous porous pillar portion 152.
  • the solid pillar portion 151 is arranged in the internal space 10a and supports the first metal plate 11 and the second metal plate 12.
  • the first metal plate 11 and the second metal plate 12 are made of a metal having high thermal conductivity such as copper. Further, it may be formed by plating the surface of a metal other than copper with copper. As the metal other than copper, for example, stainless steel can be considered. It was
  • the solid pillar portion 151 is a member separate from the first metal plate 11 and the second metal plate 12, and is a solid member.
  • the "solid” member means a so-called solid member, and refers to a member whose contents are tightly packed and which is composed of a non-porous object.
  • a "solid” member may have a cavity inside, which may be an internal member, or may be a member having one or more macroscopic cavities inside. It was
  • the solid pillar portion 151 is made of a metal having high thermal conductivity such as copper.
  • the solid pillar portion 151 extends in the Z-axis direction, and the upper end portion and the lower end portion of the solid pillar portion 151 are joined to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12, respectively, using a brazing material.
  • the solid column portion 151 may be joined to the first metal plate 11 and the second metal plate 12 by welding or the like, in addition to joining with a brazing material.
  • the solid pillar portion 151 may be integrated with one of the first metal plate 11 and the second metal plate 12. At this time, the solid pillar portion 151 can be formed by etching or cutting the first metal plate 11 or the second metal plate 12. It was
  • the solid pillar portion 151 is composed of, for example, a circular cylinder in an upward view.
  • the solid pillar portions 151 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the porous column portion 152 extends in the Z-axis direction and is composed of, for example, a circular cylinder when viewed upward.
  • the porous pillar portion 152 is a porous sintered body. Further, the porous column portions 152 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the porous column portion 152 is preferably arranged in the middle of the adjacent solid column portions 151.
  • the housing 10 has at least one solid solid pillar portion 151 and at least one porous porous pillar portion 152. It was
  • the number of the solid pillar portion 151 and the number of the porous pillar portion 152 may be the same or different. In order to increase the rigidity of the housing 10, the number of solid pillar portions 151 may be larger than the number of porous pillar portions 152. It was
  • the first wick structure 31 and the second wick structure 32 are porous and have a gap portion (not shown) forming a flow path of the working medium 20.
  • the first wick structure 31 is arranged on the inner surface of the first metal plate 11 and faces the internal space 10a.
  • the second wick structure 32 is arranged on the inner surface of the second metal plate 12 and faces the internal space 10a.
  • “facing" the interior space 10a means “facing" the interior space 10a.
  • the porous column portion 152 is columnar and is arranged in the internal space 10a to support the first wick structure 31 and the second wick structure 32.
  • the porous column portion 152 extends in the Z-axis direction and is composed of, for example, a circular cylinder when viewed upward. Further, the porous column portions 152 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the porous column portion 152 is preferably arranged in the middle of the adjacent solid column portions 151. It was
  • the porous column portion 152 supports the first metal plate 11 and the second metal plate 12 via the first wick structure 31 and the second wick structure 32. As a result, the porous pillar portion 152 can reinforce the solid pillar portion 151 and further suppress the deformation of the housing 10 in the Z-axis direction. It was
  • first wick structure 31, the second wick structure 32, and the porous column portion 152 are porous sintered bodies, respectively, and are integrated with each other.
  • first wick structure 31, the second wick structure 32, and the porous column portion 152 are porous sintered bodies, respectively, and are integrated with each other.
  • the thickness W2 of the second wick structure 32 is larger in the Z direction than the thickness W1 of the first wick structure 31.
  • the second wick structure 32 arranged on the heating element H side promotes the vaporization of the liquid working medium 20 as compared with the first wick structure 31. Therefore, by making the thickness W2 of the second wick structure 32 larger in the Z direction than the thickness W1 of the first wick structure 31, the holding property of the working medium 20 of the second wick structure 32 is improved by the first wick. It can be higher than the retention of the working medium 20 of the structure 31. It was
  • the liquid working medium 20 held by the second wick structure 32 is completely in the region overlapping with the heating element H in the Z direction. It is possible to suppress the occurrence of so-called dryout, which is vaporization. It was
  • the thickness W1 of the first wick structure 31 the thickness W2 of the second wick structure 32, and the first wick structure 31. It is preferable that the length W3 of the gap between the second wick structure 32 and the second wick structure 32 satisfies the equation (1). It was
  • the working medium 20 vaporized from the second wick structure 32 is XY in the internal space 10a. It becomes easy to diffuse in the plane. This promotes the condensation of the working medium 20 in the first wick structure 31. It was
  • the thickness W1 of the first wick structure 31 the thickness W2 of the second wick structure 32, and the first wick structure 31. It is more preferable that the length W3 of the gap between the metal and the second wick structure 32 satisfies the formulas (2) to (4). It was
  • the thickness W2 of the second wick structure 32 is set to be twice or more and four times or less the thickness W1 of the first wick structure 31, and the length of the gap between the first wick structure 31 and the second wick structure 32 is W3. Is preferably 5 times or more and 7 times or less the thickness W1 of the first wick structure 31. This makes it possible to further promote the condensation of the working medium 20 in the first wick structure 31 while ensuring the retention of the working medium 20 in the second wick structure 32. It was
  • the first wick structure 31 arranged on the heat radiating surface side opposite to the heating element H promotes the condensation of the vaporized working medium 20 as compared with the second wick structure 32. Therefore, it is preferable that the first wick structure 31 has a higher cooling efficiency of the working medium 20 than the second wick structure 32. It was
  • the second wick structure 32 has a higher porosity than the first wick structure 31. As a result, the capillary force of the second wick structure 32 becomes larger than the capillary force of the first wick structure 31. It was
  • the ratio of the volume of the space to the total product of the first wick structure 31 and the second wick structure 32 is referred to as a porosity.
  • the unit of porosity is%.
  • the porosity is determined by the following method. For example, the porosity can be obtained by measuring the area of the space from the cross-sectional photograph of the wick structure and calculating the ratio of the area of the space to the whole.
  • a scanning electron microscope having a deep depth of field. The method of observing the cross section is not particularly limited as long as it can easily distinguish between the metal portion and the space. It was
  • the first wick structure 31 and the second wick structure 32 are made of a porous sintered body, but the first wick structure 31 or the second wick structure 32 is a plurality of pieces. It may be a mesh member in which a metal linear member is woven.
  • the capillary force of the second wick structure 32 can be reduced to that of the first wick structure 31. It is larger than the capillary force and can be easily formed. It was
  • first wick structure 31 or the second wick structure 32 may be composed of a plurality of grooves formed on the inner surface of the first metal plate 11 and the inner surface of the second metal plate 12.
  • the first wick structure 31 or the second wick structure 32 can be formed thinner than in the case of being composed of the mesh material and the sintered body. Therefore, the internal space 10a can be expanded in the Z-axis direction. Further, the housing 10 can be made thinner in the Z-axis direction without narrowing the internal space 10a. Further, by forming one of the first wick structure 31 and the second wick structure 32 with a groove portion, the thickness of the first wick structure 31 or the second wick structure 32 in the Z-axis direction without narrowing the internal space 10a. Can be increased. It was
  • the first wick structure 31, the second wick structure 32, and the porous column portion 152 are formed, for example, as follows. First, a metal powder containing micro copper particles, a copper body and a resin is sprayed and applied to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12 before joining. Next, the first metal plate 11 and the second metal plate 12 are joined by sandwiching the metal powder formed into a columnar shape. After that, the housing 10 is heated to fire the metal powder. As a result, the first wick structure 31, the second wick structure 32, and the porous pillar portion 152 can be easily integrally formed in the internal space 10a of the housing 10. As a result, the manufacturing cost of the heat conductive member 1 can be suppressed. The first metal plate 11 and the second metal plate 12 may be joined after the first wick structure 31, the second wick structure 32, and the porous column portion 152 are fired separately. It was
  • coating means adhering metal powder to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12.
  • the metal powder may be directly applied. It was
  • Micro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the micro copper particles is 1 ⁇ m or more and less than 1 mm.
  • the micro copper particles are, for example, porous. It was
  • the copper body is a copper melt obtained by melting and solidifying sub-micro copper particles smaller than the micro copper particles by sintering.
  • Submicro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the sub-micro copper particles before melting is 0.1 ⁇ m or more and less than 1 ⁇ m. It was
  • the resin is a volatile resin that volatilizes at a temperature below the melting point of the copper constituting the micro copper particles and the copper body.
  • a volatile resin for example, a cellulose resin such as methyl cellulose or ethyl cellulose, an acrylic resin, a butyral resin, an alkyd resin, an epoxy resin, a phenol resin or the like can be used.
  • an acrylic resin having high thermal decomposability. It was
  • the heated portion 101 is heated by the heat generated by the heating element H.
  • the liquid working medium 20 contained in the second wick structure 32 is vaporized. It was
  • the vaporized working medium 20 moves the internal space 10a toward the heat radiating portion 102. At this time, a part of the vaporized working medium 20 comes into contact with the first wick structure 31 to be cooled and condensed.
  • the first wick structure 31 has a larger surface area and higher cooling efficiency than the lower surface of the first metal plate 11. Therefore, by providing the first wick structure 31, the cooling efficiency of the vaporized working medium 20 is improved and condensation is promoted. It was
  • a part of the working medium 20 condensed in the first wick structure 31 is dropped and absorbed in the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves in the first wick structure 31 and in the porous column portion 152 and is absorbed by the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves along the outer surface of the solid pillar portion 151 and is absorbed by the second wick structure 32. It was
  • the vaporized working medium 20 that has moved to the heat radiating unit 102 is cooled by the heat radiating unit 102 and condensed.
  • the condensed working medium 20 moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. Further, the working medium 20 absorbed from the first wick structure 31 to the second wick structure 32 also moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. It was
  • the heating element H is arranged on the working medium 20 condensed through the second wick structure 32. It can be moved faster by the heated portion 101. Therefore, the heat transport efficiency by the working medium 20 is improved. It was
  • the thickness W2 of the second wick structure 32 is made larger in the Z direction than the thickness W1 of the first wick structure 31, and the occurrence of dryout is suppressed in the region overlapping the heating element H in the Z direction.
  • the liquid working medium 20 can be continuously and smoothly moved toward the heated portion 101 in the second wick structure 32. Therefore, it is possible to suppress a decrease in the heat transport efficiency of the working medium 20 due to the occurrence of dryout.
  • the steam space S is a space excluding the space occupied by the solid pillar portion 151 and the porous pillar portion 152 from the gap space between the first wick structure 31 and the second wick structure 32. That is, the steam space S is a space other than the first wick structure 31, the second wick structure 32, the porous pillar portion 152, and the solid pillar portion 151 in the internal space 10a.
  • V1 the volume of the steam space S
  • V2 the total volume
  • the total volume is the total volume of each of the first wick structure 31, the second wick structure 32, and the porous column portion 152. That is, in the present embodiment, the total volume further includes the volume of the porous column portion 152 in the total volume of the first wick structure 31 and the second wick structure 32. It was
  • the porous pillar portion 152 is provided, but when the porous pillar portion 152 is not provided, the total volume is each of the first wick structure 31 and the second wick structure 32. Calculated by summing up the volumes. Further, the steam space S is a space other than the first wick structure 31, the second wick structure 32, and the solid pillar portion 151 in the internal space 10a. It was
  • the solid pillar portion 151 can secure the strength of the housing 10, arranging the solid pillar portion 151 causes a factor that the steam space S becomes narrow, and even when such a solid pillar portion 151 is provided, the above equation ( By satisfying 5), the diffusion of vapor can be promoted.
  • the volume of the steam space S is larger than the sum of the volumes of the first wick structure 31, the second wick structure 32, and the porous column portion 152. It was
  • the solid pillar portion 151 and the porous pillar portion 152 are preferably configured as follows.
  • the total joint area where the upper surface of the solid column portion 151 and the lower surface of the first metal plate 11 are joined is the joint area where the upper surface of the porous column portion 152 and the lower surface of the first wick structure 31 are joined. Greater than the sum.
  • the total joint area where the lower surface of the solid column portion 151 and the upper surface of the second metal plate 12 are joined is the joint where the lower surface of the porous column portion 152 and the upper surface of the second wick structure 32 are joined. It is larger than the total area.
  • the total joint area is the total number of joint areas of one solid column portion 151 or the porous column portion 152. It was
  • the porous column portion 152 penetrates the first wick structure 31 and is joined to the first metal plate 11 and also penetrates the second wick structure 32 to form a second. 2 It may be joined to the metal plate 12.
  • the total joint area where the upper surface of the solid pillar portion 151 and the lower surface of the first metal plate 11 are joined is such that the upper surface of the porous pillar portion 152 and the lower surface of the first metal plate 11 are joined together. It is larger than the total joint area to be joined.
  • the total joint area where the lower surface of the solid pillar portion 151 and the upper surface of the second metal plate 12 are joined is the joint area where the lower surface of the porous pillar portion 152 and the upper surface of the second metal plate 12 are joined. Is larger than the sum of. It was
  • the total contact area of the solid pillar portion 151 where one side end is in contact with the first metal plate 11 is such that the one side end of the porous pillar portion 152 is the first wick structure 31 or the first metal plate 11.
  • the total contact area is wider than the total contact area and the other end of the solid column 151 is in contact with the second metal plate 12, and the other end of the porous column 152 has a second wick structure. It is wider than the total contact area in contact with the body 32 or the second metal plate 12.
  • the strength of the solid solid pillar portion 151 is higher than the strength of the porous pillar portion 152. Therefore, due to the size relationship of the contact area as described above, the strength of the housing 10 can be sufficiently secured by the solid pillar portion 151 even in the configuration using the porous pillar portion 152. It was
  • the first wick structure 31 may be made of a mesh material
  • the second wick structure 32 may be made of a porous sintered body.
  • the porous column portion 152 may not be provided. It was
  • Heat conductive member 10 Housing 10a Internal space 11 1st metal plate 12 2nd metal plate 13a 1st side wall 13b 2nd side wall 14 Joint 15 Pillar part 20 Working medium 31 2nd structure 1st wick Body 33, 3rd wick structure, H, heating element

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention comprend un boîtier présentant un espace interne, une première structure de réseau capillaire, une seconde structure de réseau capillaire, et un milieu de travail. Le boîtier comporte une première plaque métallique et une seconde plaque métallique disposées de manière à se faire face, et une partie pilier disposée dans l'espace interne. La partie de pilier comporte une partie de pilier solide qui supporte la première plaque métallique et la seconde plaque métallique. Le milieu de travail, la première structure de réseau capillaire, et la seconde structure de réseau capillaire sont logés dans l'espace interne. La première structure à réseau capillaire est disposée sur la surface intérieure de la première plaque métallique. La seconde structure de réseau capillaire est disposée sur la surface interne de la seconde plaque métallique.
PCT/JP2021/028344 2020-07-31 2021-07-30 Élément de conduction thermique WO2022025249A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020131230 2020-07-31
JP2020-131230 2020-07-31
JP2020-183305 2020-10-30
JP2020183305 2020-10-30
JP2021-087998 2021-05-25
JP2021087998A JP2023123890A (ja) 2020-07-31 2021-05-25 熱伝導部材

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WO2022025249A1 true WO2022025249A1 (fr) 2022-02-03

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091172A (ja) * 1999-09-21 2001-04-06 Fujikura Ltd 平板状ヒートパイプ
US20080174963A1 (en) * 2007-01-24 2008-07-24 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber defined therein

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091172A (ja) * 1999-09-21 2001-04-06 Fujikura Ltd 平板状ヒートパイプ
US20080174963A1 (en) * 2007-01-24 2008-07-24 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber defined therein

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