WO2022025249A1 - Heat conduction member - Google Patents

Heat conduction member Download PDF

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Publication number
WO2022025249A1
WO2022025249A1 PCT/JP2021/028344 JP2021028344W WO2022025249A1 WO 2022025249 A1 WO2022025249 A1 WO 2022025249A1 JP 2021028344 W JP2021028344 W JP 2021028344W WO 2022025249 A1 WO2022025249 A1 WO 2022025249A1
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WO
WIPO (PCT)
Prior art keywords
wick structure
metal plate
porous
conductive member
heat conductive
Prior art date
Application number
PCT/JP2021/028344
Other languages
French (fr)
Japanese (ja)
Inventor
征志 高尾
仕▲ゆ▼ 楊
敏彦 小関
雅昭 花野
淳一 石田
Original Assignee
日本電産株式会社
尼得科超▲しゅう▼科技股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021087998A external-priority patent/JP2023123890A/en
Application filed by 日本電産株式会社, 尼得科超▲しゅう▼科技股▲ふん▼有限公司 filed Critical 日本電産株式会社
Publication of WO2022025249A1 publication Critical patent/WO2022025249A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure

Definitions

  • the present invention relates to a heat conductive member.
  • the conventional heat conductive member includes a container, a wick structure, and a working fluid.
  • the container has an internal space inside.
  • the wick structure is placed on the inner surface of the container.
  • the working fluid is housed in the interior space. It was
  • the container is placed in contact with the heating element.
  • the working fluid is heated by the heating element and vaporized from the wick structure.
  • the vaporized working fluid moves inside the container to the heat dissipation side.
  • the working fluid is cooled and condensed by the heat dissipation.
  • the condensed working fluid moves toward the heating element in the wick structure by capillarity. As a result, heat is transported from the heating element side to the heat radiating side (see, for example, Patent Document 1).
  • the heat conductive member as described above has a problem that the vaporized working fluid is difficult to condense and the heat transport efficiency is low. It was
  • An object of the present invention is to provide a heat conductive member capable of improving heat transport efficiency.
  • An exemplary heat conductive member of the present invention includes a housing having an internal space, a first wick structure, a second wick structure, and an actuating medium.
  • the housing has a first metal plate and a second metal plate arranged so as to face each other, and a pillar portion.
  • the pillar portion is arranged in the internal space and has a solid pillar portion that supports the first metal plate and the second metal plate.
  • the working medium, the first wick structure, and the second wick structure are housed in the internal space.
  • the first wick structure is arranged on the inner surface of the first metal plate.
  • the second wick structure is arranged on the inner surface of the second metal plate.
  • FIG. 1 is a perspective view of a heat conductive member according to an embodiment of the present invention.
  • FIG. 2 is a schematic side sectional view of the heat conductive member according to the embodiment of the present invention.
  • FIG. 3 is a schematic side sectional view of a heat conductive member according to a modified example of the embodiment of the present invention.
  • the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate.
  • the Z-axis direction indicates a vertical direction (that is, a vertical direction)
  • the + Z direction is the upper side (opposite the gravity direction)
  • the ⁇ Z direction is the lower side (gravity direction).
  • the Z-axis direction is also the opposite direction between the first metal plate 11 and the second metal plate 12, which will be described later.
  • the X-axis direction refers to a direction orthogonal to the Z-axis direction, and one direction and the opposite direction thereof are the + X direction and the ⁇ X direction, respectively.
  • the Y-axis direction refers to a direction orthogonal to both the Z-axis direction and the X-axis direction, and one direction and the opposite direction thereof are the + Y direction and the ⁇ Y direction, respectively.
  • this defines the direction only for convenience of explanation, and does not limit the direction at the time of manufacturing and the time of use of the heat conductive member 1 according to the present invention.
  • the expression "parallel” does not mean only the case of being mathematically strictly parallel, but includes, for example, the case of being parallel to the extent that the effect in the present disclosure is exhibited. It was
  • sining refers to a technique of heating a metal powder or a paste containing a metal powder to a temperature lower than the melting point of the metal to bake and harden the metal particles.
  • sintered body refers to an object obtained by sintering. It was
  • FIG. 1 is a perspective view of a heat conductive member 1 according to an exemplary embodiment of the present invention
  • FIG. 2 is a schematic side sectional view of the heat conductive member 1.
  • FIG. 2 is a cross-sectional view taken along the alternate long and short dash line AA of FIG.
  • the heat conductive member 1 is also called a vapor chamber and transports the heat of the heating element H.
  • the heating element H include a power transistor of an inverter provided in a traction motor for driving a wheel of a vehicle.
  • the power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor).
  • the heat conductive member 1 is mounted on the traction motor.
  • the calorific value of the IGBT is generally 100 W or more.
  • the heat conductive member 1 includes a heated portion 101 and a heat radiating portion 102 (see FIG. 2).
  • the heated portion 101 is arranged in contact with the heating element H, for example, and is heated by the heat generated by the heating element H.
  • the heat radiating unit 102 releases the heat of the operating medium 20, which will be described later, heated by the heated unit 101 to the outside.
  • heat exchange means such as heat dissipation fins and heat sinks may be thermally connected to the heat dissipation unit 102. In that case, the cooling medium is passed through the heat exchange means.
  • the cooling medium may be, for example, water, oil, or air. It was
  • the heat conductive member 1 includes a housing 10, an actuating medium 20, a first wick structure 31, and a second wick structure 32.
  • the heated portion 101 is formed by a part of the housing 10.
  • the heat radiating portion 102 is formed by another part of the housing 10.
  • the thickness of the heat conductive member 1 in the Z direction is, for example, 5 mm or more. It was
  • the housing 10 has an internal space 10a.
  • the working medium 20, the first wick structure 31, and the second wick structure 32 are housed in the internal space 10a.
  • the housing 10 has a first metal plate 11 and a second metal plate 12 arranged so as to face each other, and a pillar portion 15.
  • the first metal plate 11 and the second metal plate 12 have a rectangular plate shape that extends in the horizontal direction when viewed from above.
  • the heating element H comes into contact with the lower surface of the second metal plate 12.
  • the first metal plate 11 covers the upper surface of the second metal plate 12.
  • the first metal plate 11 and the second metal plate 12 of the present embodiment are rectangular in top view, but the present invention is not limited to this. For example, it may be a polygon or a circle having a plurality of corners in a top view. It was
  • the first metal plate 11 has a first side wall portion 13a extending downward from the peripheral edge.
  • the second metal plate 12 has a second side wall portion 13b extending upward from the peripheral edge.
  • the lower surface of the first side wall portion 13a and the upper surface of the second side wall portion 13b are joined at the joint portion 14.
  • the lower surface of the first side wall portion 13a and the upper surface of the second metal plate 12 may be joined by omitting the second side wall portion 13b.
  • the upper surface of the second side wall portion 13b and the lower surface of the first metal plate 11 may be joined by omitting the first side wall portion 13a.
  • the internal space 10a is formed by being surrounded by the first metal plate 11 and the second metal plate 12.
  • the internal space 10a is a closed space, and is maintained in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure, for example.
  • the working medium 20 housed in the internal space 10a is likely to evaporate.
  • the working medium 20 is, for example, water, but may be another liquid such as alcohol. It was
  • the joint portion 14 is located around the first wick structure 31 and the second wick structure 32 in the upward view.
  • the method of joining the first side wall portion 13a and the second side wall portion 13b is not particularly limited.
  • any joining method such as a method of joining by applying heat and pressure, a diffusion joining, or a joining using a brazing material may be used. It was
  • the joint portion 14 may include a sealing portion.
  • the sealing portion is, for example, a portion where an injection port for injecting the working medium 20 into the housing 10 is sealed by welding in the manufacturing process of the heat conductive member 1. It was
  • the pillar portion 15 has at least one solid solid pillar portion 151 and at least one porous porous pillar portion 152.
  • the solid pillar portion 151 is arranged in the internal space 10a and supports the first metal plate 11 and the second metal plate 12.
  • the first metal plate 11 and the second metal plate 12 are made of a metal having high thermal conductivity such as copper. Further, it may be formed by plating the surface of a metal other than copper with copper. As the metal other than copper, for example, stainless steel can be considered. It was
  • the solid pillar portion 151 is a member separate from the first metal plate 11 and the second metal plate 12, and is a solid member.
  • the "solid” member means a so-called solid member, and refers to a member whose contents are tightly packed and which is composed of a non-porous object.
  • a "solid” member may have a cavity inside, which may be an internal member, or may be a member having one or more macroscopic cavities inside. It was
  • the solid pillar portion 151 is made of a metal having high thermal conductivity such as copper.
  • the solid pillar portion 151 extends in the Z-axis direction, and the upper end portion and the lower end portion of the solid pillar portion 151 are joined to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12, respectively, using a brazing material.
  • the solid column portion 151 may be joined to the first metal plate 11 and the second metal plate 12 by welding or the like, in addition to joining with a brazing material.
  • the solid pillar portion 151 may be integrated with one of the first metal plate 11 and the second metal plate 12. At this time, the solid pillar portion 151 can be formed by etching or cutting the first metal plate 11 or the second metal plate 12. It was
  • the solid pillar portion 151 is composed of, for example, a circular cylinder in an upward view.
  • the solid pillar portions 151 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the porous column portion 152 extends in the Z-axis direction and is composed of, for example, a circular cylinder when viewed upward.
  • the porous pillar portion 152 is a porous sintered body. Further, the porous column portions 152 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the porous column portion 152 is preferably arranged in the middle of the adjacent solid column portions 151.
  • the housing 10 has at least one solid solid pillar portion 151 and at least one porous porous pillar portion 152. It was
  • the number of the solid pillar portion 151 and the number of the porous pillar portion 152 may be the same or different. In order to increase the rigidity of the housing 10, the number of solid pillar portions 151 may be larger than the number of porous pillar portions 152. It was
  • the first wick structure 31 and the second wick structure 32 are porous and have a gap portion (not shown) forming a flow path of the working medium 20.
  • the first wick structure 31 is arranged on the inner surface of the first metal plate 11 and faces the internal space 10a.
  • the second wick structure 32 is arranged on the inner surface of the second metal plate 12 and faces the internal space 10a.
  • “facing" the interior space 10a means “facing" the interior space 10a.
  • the porous column portion 152 is columnar and is arranged in the internal space 10a to support the first wick structure 31 and the second wick structure 32.
  • the porous column portion 152 extends in the Z-axis direction and is composed of, for example, a circular cylinder when viewed upward. Further, the porous column portions 152 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the porous column portion 152 is preferably arranged in the middle of the adjacent solid column portions 151. It was
  • the porous column portion 152 supports the first metal plate 11 and the second metal plate 12 via the first wick structure 31 and the second wick structure 32. As a result, the porous pillar portion 152 can reinforce the solid pillar portion 151 and further suppress the deformation of the housing 10 in the Z-axis direction. It was
  • first wick structure 31, the second wick structure 32, and the porous column portion 152 are porous sintered bodies, respectively, and are integrated with each other.
  • first wick structure 31, the second wick structure 32, and the porous column portion 152 are porous sintered bodies, respectively, and are integrated with each other.
  • the thickness W2 of the second wick structure 32 is larger in the Z direction than the thickness W1 of the first wick structure 31.
  • the second wick structure 32 arranged on the heating element H side promotes the vaporization of the liquid working medium 20 as compared with the first wick structure 31. Therefore, by making the thickness W2 of the second wick structure 32 larger in the Z direction than the thickness W1 of the first wick structure 31, the holding property of the working medium 20 of the second wick structure 32 is improved by the first wick. It can be higher than the retention of the working medium 20 of the structure 31. It was
  • the liquid working medium 20 held by the second wick structure 32 is completely in the region overlapping with the heating element H in the Z direction. It is possible to suppress the occurrence of so-called dryout, which is vaporization. It was
  • the thickness W1 of the first wick structure 31 the thickness W2 of the second wick structure 32, and the first wick structure 31. It is preferable that the length W3 of the gap between the second wick structure 32 and the second wick structure 32 satisfies the equation (1). It was
  • the working medium 20 vaporized from the second wick structure 32 is XY in the internal space 10a. It becomes easy to diffuse in the plane. This promotes the condensation of the working medium 20 in the first wick structure 31. It was
  • the thickness W1 of the first wick structure 31 the thickness W2 of the second wick structure 32, and the first wick structure 31. It is more preferable that the length W3 of the gap between the metal and the second wick structure 32 satisfies the formulas (2) to (4). It was
  • the thickness W2 of the second wick structure 32 is set to be twice or more and four times or less the thickness W1 of the first wick structure 31, and the length of the gap between the first wick structure 31 and the second wick structure 32 is W3. Is preferably 5 times or more and 7 times or less the thickness W1 of the first wick structure 31. This makes it possible to further promote the condensation of the working medium 20 in the first wick structure 31 while ensuring the retention of the working medium 20 in the second wick structure 32. It was
  • the first wick structure 31 arranged on the heat radiating surface side opposite to the heating element H promotes the condensation of the vaporized working medium 20 as compared with the second wick structure 32. Therefore, it is preferable that the first wick structure 31 has a higher cooling efficiency of the working medium 20 than the second wick structure 32. It was
  • the second wick structure 32 has a higher porosity than the first wick structure 31. As a result, the capillary force of the second wick structure 32 becomes larger than the capillary force of the first wick structure 31. It was
  • the ratio of the volume of the space to the total product of the first wick structure 31 and the second wick structure 32 is referred to as a porosity.
  • the unit of porosity is%.
  • the porosity is determined by the following method. For example, the porosity can be obtained by measuring the area of the space from the cross-sectional photograph of the wick structure and calculating the ratio of the area of the space to the whole.
  • a scanning electron microscope having a deep depth of field. The method of observing the cross section is not particularly limited as long as it can easily distinguish between the metal portion and the space. It was
  • the first wick structure 31 and the second wick structure 32 are made of a porous sintered body, but the first wick structure 31 or the second wick structure 32 is a plurality of pieces. It may be a mesh member in which a metal linear member is woven.
  • the capillary force of the second wick structure 32 can be reduced to that of the first wick structure 31. It is larger than the capillary force and can be easily formed. It was
  • first wick structure 31 or the second wick structure 32 may be composed of a plurality of grooves formed on the inner surface of the first metal plate 11 and the inner surface of the second metal plate 12.
  • the first wick structure 31 or the second wick structure 32 can be formed thinner than in the case of being composed of the mesh material and the sintered body. Therefore, the internal space 10a can be expanded in the Z-axis direction. Further, the housing 10 can be made thinner in the Z-axis direction without narrowing the internal space 10a. Further, by forming one of the first wick structure 31 and the second wick structure 32 with a groove portion, the thickness of the first wick structure 31 or the second wick structure 32 in the Z-axis direction without narrowing the internal space 10a. Can be increased. It was
  • the first wick structure 31, the second wick structure 32, and the porous column portion 152 are formed, for example, as follows. First, a metal powder containing micro copper particles, a copper body and a resin is sprayed and applied to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12 before joining. Next, the first metal plate 11 and the second metal plate 12 are joined by sandwiching the metal powder formed into a columnar shape. After that, the housing 10 is heated to fire the metal powder. As a result, the first wick structure 31, the second wick structure 32, and the porous pillar portion 152 can be easily integrally formed in the internal space 10a of the housing 10. As a result, the manufacturing cost of the heat conductive member 1 can be suppressed. The first metal plate 11 and the second metal plate 12 may be joined after the first wick structure 31, the second wick structure 32, and the porous column portion 152 are fired separately. It was
  • coating means adhering metal powder to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12.
  • the metal powder may be directly applied. It was
  • Micro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the micro copper particles is 1 ⁇ m or more and less than 1 mm.
  • the micro copper particles are, for example, porous. It was
  • the copper body is a copper melt obtained by melting and solidifying sub-micro copper particles smaller than the micro copper particles by sintering.
  • Submicro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the sub-micro copper particles before melting is 0.1 ⁇ m or more and less than 1 ⁇ m. It was
  • the resin is a volatile resin that volatilizes at a temperature below the melting point of the copper constituting the micro copper particles and the copper body.
  • a volatile resin for example, a cellulose resin such as methyl cellulose or ethyl cellulose, an acrylic resin, a butyral resin, an alkyd resin, an epoxy resin, a phenol resin or the like can be used.
  • an acrylic resin having high thermal decomposability. It was
  • the heated portion 101 is heated by the heat generated by the heating element H.
  • the liquid working medium 20 contained in the second wick structure 32 is vaporized. It was
  • the vaporized working medium 20 moves the internal space 10a toward the heat radiating portion 102. At this time, a part of the vaporized working medium 20 comes into contact with the first wick structure 31 to be cooled and condensed.
  • the first wick structure 31 has a larger surface area and higher cooling efficiency than the lower surface of the first metal plate 11. Therefore, by providing the first wick structure 31, the cooling efficiency of the vaporized working medium 20 is improved and condensation is promoted. It was
  • a part of the working medium 20 condensed in the first wick structure 31 is dropped and absorbed in the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves in the first wick structure 31 and in the porous column portion 152 and is absorbed by the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves along the outer surface of the solid pillar portion 151 and is absorbed by the second wick structure 32. It was
  • the vaporized working medium 20 that has moved to the heat radiating unit 102 is cooled by the heat radiating unit 102 and condensed.
  • the condensed working medium 20 moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. Further, the working medium 20 absorbed from the first wick structure 31 to the second wick structure 32 also moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. It was
  • the heating element H is arranged on the working medium 20 condensed through the second wick structure 32. It can be moved faster by the heated portion 101. Therefore, the heat transport efficiency by the working medium 20 is improved. It was
  • the thickness W2 of the second wick structure 32 is made larger in the Z direction than the thickness W1 of the first wick structure 31, and the occurrence of dryout is suppressed in the region overlapping the heating element H in the Z direction.
  • the liquid working medium 20 can be continuously and smoothly moved toward the heated portion 101 in the second wick structure 32. Therefore, it is possible to suppress a decrease in the heat transport efficiency of the working medium 20 due to the occurrence of dryout.
  • the steam space S is a space excluding the space occupied by the solid pillar portion 151 and the porous pillar portion 152 from the gap space between the first wick structure 31 and the second wick structure 32. That is, the steam space S is a space other than the first wick structure 31, the second wick structure 32, the porous pillar portion 152, and the solid pillar portion 151 in the internal space 10a.
  • V1 the volume of the steam space S
  • V2 the total volume
  • the total volume is the total volume of each of the first wick structure 31, the second wick structure 32, and the porous column portion 152. That is, in the present embodiment, the total volume further includes the volume of the porous column portion 152 in the total volume of the first wick structure 31 and the second wick structure 32. It was
  • the porous pillar portion 152 is provided, but when the porous pillar portion 152 is not provided, the total volume is each of the first wick structure 31 and the second wick structure 32. Calculated by summing up the volumes. Further, the steam space S is a space other than the first wick structure 31, the second wick structure 32, and the solid pillar portion 151 in the internal space 10a. It was
  • the solid pillar portion 151 can secure the strength of the housing 10, arranging the solid pillar portion 151 causes a factor that the steam space S becomes narrow, and even when such a solid pillar portion 151 is provided, the above equation ( By satisfying 5), the diffusion of vapor can be promoted.
  • the volume of the steam space S is larger than the sum of the volumes of the first wick structure 31, the second wick structure 32, and the porous column portion 152. It was
  • the solid pillar portion 151 and the porous pillar portion 152 are preferably configured as follows.
  • the total joint area where the upper surface of the solid column portion 151 and the lower surface of the first metal plate 11 are joined is the joint area where the upper surface of the porous column portion 152 and the lower surface of the first wick structure 31 are joined. Greater than the sum.
  • the total joint area where the lower surface of the solid column portion 151 and the upper surface of the second metal plate 12 are joined is the joint where the lower surface of the porous column portion 152 and the upper surface of the second wick structure 32 are joined. It is larger than the total area.
  • the total joint area is the total number of joint areas of one solid column portion 151 or the porous column portion 152. It was
  • the porous column portion 152 penetrates the first wick structure 31 and is joined to the first metal plate 11 and also penetrates the second wick structure 32 to form a second. 2 It may be joined to the metal plate 12.
  • the total joint area where the upper surface of the solid pillar portion 151 and the lower surface of the first metal plate 11 are joined is such that the upper surface of the porous pillar portion 152 and the lower surface of the first metal plate 11 are joined together. It is larger than the total joint area to be joined.
  • the total joint area where the lower surface of the solid pillar portion 151 and the upper surface of the second metal plate 12 are joined is the joint area where the lower surface of the porous pillar portion 152 and the upper surface of the second metal plate 12 are joined. Is larger than the sum of. It was
  • the total contact area of the solid pillar portion 151 where one side end is in contact with the first metal plate 11 is such that the one side end of the porous pillar portion 152 is the first wick structure 31 or the first metal plate 11.
  • the total contact area is wider than the total contact area and the other end of the solid column 151 is in contact with the second metal plate 12, and the other end of the porous column 152 has a second wick structure. It is wider than the total contact area in contact with the body 32 or the second metal plate 12.
  • the strength of the solid solid pillar portion 151 is higher than the strength of the porous pillar portion 152. Therefore, due to the size relationship of the contact area as described above, the strength of the housing 10 can be sufficiently secured by the solid pillar portion 151 even in the configuration using the porous pillar portion 152. It was
  • the first wick structure 31 may be made of a mesh material
  • the second wick structure 32 may be made of a porous sintered body.
  • the porous column portion 152 may not be provided. It was
  • Heat conductive member 10 Housing 10a Internal space 11 1st metal plate 12 2nd metal plate 13a 1st side wall 13b 2nd side wall 14 Joint 15 Pillar part 20 Working medium 31 2nd structure 1st wick Body 33, 3rd wick structure, H, heating element

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention comprises a housing having an internal space, a first wick structure, a second wick structure, and a working medium. The housing has a first metal plate and a second metal plate arranged so as to face each other, and a pillar portion disposed in the internal space. The pillar portion has a solid pillar portion that supports the first metal plate and the second metal plate. The working medium, the first wick structure, and the second wick structure are housed in the internal space. The first wick structure is disposed on the inner surface of the first metal plate. The second wick structure is disposed on the inner surface of the second metal plate.

Description

熱伝導部材Heat conduction member
本発明は、熱伝導部材に関する。 The present invention relates to a heat conductive member.
従来の熱伝導部材は、コンテナと、ウィック構造体と、作動流体と、を有する。コンテナは、内部に内部空間を有する。ウィック構造体は、コンテナの内面に配置される。作動流体は、内部空間に収容される。　 The conventional heat conductive member includes a container, a wick structure, and a working fluid. The container has an internal space inside. The wick structure is placed on the inner surface of the container. The working fluid is housed in the interior space. It was
コンテナは、発熱体と接触して配置される。作動流体は、発熱体によって加熱されてウィック構造体から気化する。気化した作動流体は、コンテナの内部を放熱側に移動する。放熱側では、放熱によって作動流体が冷却され、凝縮する。凝縮した作動流体は、毛細管現象によってウィック構造体中を発熱体側に移動する。これにより、発熱体側から放熱側に熱が輸送される（例えば、特許文献１参照）。 The container is placed in contact with the heating element. The working fluid is heated by the heating element and vaporized from the wick structure. The vaporized working fluid moves inside the container to the heat dissipation side. On the heat dissipation side, the working fluid is cooled and condensed by the heat dissipation. The condensed working fluid moves toward the heating element in the wick structure by capillarity. As a result, heat is transported from the heating element side to the heat radiating side (see, for example, Patent Document 1).
日本国公開公報：特開２０１９－８２２６４号公報Japanese Publication: Japanese Patent Application Laid-Open No. 2019-82264
しかしながら、上記のような熱伝導部材は、気化した作動流体が凝縮し難く、熱輸送効率が低い問題があった。　 However, the heat conductive member as described above has a problem that the vaporized working fluid is difficult to condense and the heat transport efficiency is low. It was
本発明は、熱輸送効率を向上できる熱伝導部材を提供することを目的とする。 An object of the present invention is to provide a heat conductive member capable of improving heat transport efficiency.
本発明の例示的な熱伝導部材は、内部空間を有する筐体と、第１ウィック構造体と、第２ウィック構造体と、作動媒体と、を備える。筐体は、対向して配置される第１金属板及び第２金属板と、柱部と、を有する。柱部は、内部空間に配置され、第１金属板及び第２金属板を支持する中実柱部を有する。作動媒体と、第１ウィック構造体と、第２ウィック構造体と、は、内部空間に収容される。第１ウィック構造体は、第１金属板の内面に配置される。第２ウィック構造体は、前記第２金属板の内面に配置される。 An exemplary heat conductive member of the present invention includes a housing having an internal space, a first wick structure, a second wick structure, and an actuating medium. The housing has a first metal plate and a second metal plate arranged so as to face each other, and a pillar portion. The pillar portion is arranged in the internal space and has a solid pillar portion that supports the first metal plate and the second metal plate. The working medium, the first wick structure, and the second wick structure are housed in the internal space. The first wick structure is arranged on the inner surface of the first metal plate. The second wick structure is arranged on the inner surface of the second metal plate.
本発明によると、熱輸送効率を向上できる熱伝導部材を提供することができる。 According to the present invention, it is possible to provide a heat conductive member capable of improving heat transport efficiency.
図１は、本発明の実施形態に係る熱伝導部材の斜視図である。FIG. 1 is a perspective view of a heat conductive member according to an embodiment of the present invention. 図２は、本発明の実施形態に係る熱伝導部材の模式的な側面断面図である。FIG. 2 is a schematic side sectional view of the heat conductive member according to the embodiment of the present invention. 図３は、本発明の実施形態の変形例に係る熱伝導部材の模式的な側面断面図である。FIG. 3 is a schematic side sectional view of a heat conductive member according to a modified example of the embodiment of the present invention.
以下、本発明の例示的な実施形態について、図面を参照しつつ説明する。なお、図面においては、適宜、３次元直交座標系としてＸＹＺ座標系を示す。ＸＹＺ座標系において、Ｚ軸方向は、鉛直方向（すなわち上下方向）を示し、＋Ｚ方向が上側（重力方向の反対側）であり、－Ｚ方向が下側（重力方向）である。Ｚ軸方向は、後述する第１金属板１１と第２金属板１２との対向方向でもある。Ｘ軸方向は、Ｚ軸方向と直交する方向を指し、その一方向及び逆方向を、それぞれ＋Ｘ方向及び－Ｘ方向とする。Ｙ軸方向は、Ｚ軸方向及びＸ軸方向の両方向と直交する方向を指し、その一方向及び逆方向を、それぞれ＋Ｙ方向及び－Ｙ方向とする。ただし、これは、あくまで説明の便宜のために方向を定義したものであって、本発明に係る熱伝導部材１の製造時及び使用時の向きを限定するものではない。また、平行、と表現する場合、数学的に厳密に平行である場合のみを指すものではなく、例えば本開示における効果を奏する程度に平行である場合を含む。　 Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings. In the drawings, the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate. In the XYZ coordinate system, the Z-axis direction indicates a vertical direction (that is, a vertical direction), the + Z direction is the upper side (opposite the gravity direction), and the −Z direction is the lower side (gravity direction). The Z-axis direction is also the opposite direction between the first metal plate 11 and the second metal plate 12, which will be described later. The X-axis direction refers to a direction orthogonal to the Z-axis direction, and one direction and the opposite direction thereof are the + X direction and the −X direction, respectively. The Y-axis direction refers to a direction orthogonal to both the Z-axis direction and the X-axis direction, and one direction and the opposite direction thereof are the + Y direction and the −Y direction, respectively. However, this defines the direction only for convenience of explanation, and does not limit the direction at the time of manufacturing and the time of use of the heat conductive member 1 according to the present invention. In addition, the expression "parallel" does not mean only the case of being mathematically strictly parallel, but includes, for example, the case of being parallel to the extent that the effect in the present disclosure is exhibited. It was
また、本明細書において、「焼結」とは、金属の粉末又は金属の粉体を含むペーストを、金属の融点よりも低い温度まで加熱して、金属の粒子を焼き固める技術を指す。また、「焼結体」とは、焼結によって得られる物体を指す。　 Further, in the present specification, "sintering" refers to a technique of heating a metal powder or a paste containing a metal powder to a temperature lower than the melting point of the metal to bake and harden the metal particles. Further, the "sintered body" refers to an object obtained by sintering. It was
＜１．熱伝導部材の構成＞



図１は、本発明の例示的な実施形態に係る熱伝導部材１の斜視図であり、図２は、熱伝導部材１の模式的な側面断面図である。なお、図２は、図１の一点鎖線Ａ－Ａに沿う断面図である。熱伝導部材１は、ベーパーチャンバーとも呼ばれ、発熱体Ｈの熱を輸送する。発熱体Ｈとしては、例えば、車両の車輪を駆動するためのトラクションモータに備えられるインバータのパワートランジスタが挙げられる。当該パワートランジスタは、例えばＩＧＢＴ（Insulated Gate Bipolar Transistor）である。この場合、熱伝導部材１は、トラクションモータに搭載される。ＩＧＢＴの発熱量は、一般的に１００Ｗ以上である。　 <1. Structure of heat conductive member>



FIG. 1 is a perspective view of a heat conductive member 1 according to an exemplary embodiment of the present invention, and FIG. 2 is a schematic side sectional view of the heat conductive member 1. Note that FIG. 2 is a cross-sectional view taken along the alternate long and short dash line AA of FIG. The heat conductive member 1 is also called a vapor chamber and transports the heat of the heating element H. Examples of the heating element H include a power transistor of an inverter provided in a traction motor for driving a wheel of a vehicle. The power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor). In this case, the heat conductive member 1 is mounted on the traction motor. The calorific value of the IGBT is generally 100 W or more.
熱伝導部材１は、被加熱部１０１と、放熱部１０２と、を備える（図２参照）。被加熱部１０１は、例えば発熱体Ｈと接して配置され、発熱体Ｈが発する熱によって加熱される。放熱部１０２は、被加熱部１０１で加熱された後述の作動媒体２０が有する熱を外部に放出する。また、放熱部１０２には放熱性を向上させるために、放熱フィンやヒートシンク等の熱交換手段（図示せず）が熱的に接続してもよい。その場合、熱交換手段に冷却媒体を流す。冷却媒体は、例えば水や油であってもよいし、空気でもよい。　 The heat conductive member 1 includes a heated portion 101 and a heat radiating portion 102 (see FIG. 2). The heated portion 101 is arranged in contact with the heating element H, for example, and is heated by the heat generated by the heating element H. The heat radiating unit 102 releases the heat of the operating medium 20, which will be described later, heated by the heated unit 101 to the outside. Further, in order to improve heat dissipation, heat exchange means (not shown) such as heat dissipation fins and heat sinks may be thermally connected to the heat dissipation unit 102. In that case, the cooling medium is passed through the heat exchange means. The cooling medium may be, for example, water, oil, or air. It was
熱伝導部材１は、筐体１０と、作動媒体２０と、第１ウィック構造体３１と、第２ウィック構造体３２と、を備える。被加熱部１０１は、筐体１０の一部により形成される。放熱部１０２は、筐体１０の他の一部により形成される。熱伝導部材１のＺ方向の厚みは、例えば５ｍｍ以上である。　 The heat conductive member 1 includes a housing 10, an actuating medium 20, a first wick structure 31, and a second wick structure 32. The heated portion 101 is formed by a part of the housing 10. The heat radiating portion 102 is formed by another part of the housing 10. The thickness of the heat conductive member 1 in the Z direction is, for example, 5 mm or more. It was
＜１－１．筐体の構成＞



筐体１０は、内部空間１０ａを有する。作動媒体２０と、第１ウィック構造体３１と、第２ウィック構造体３２と、は内部空間１０ａに収容される。筐体１０は対向して配置される第１金属板１１及び第２金属板１２と、柱部１５と、を有する。　 <1-1. Housing configuration>



The housing 10 has an internal space 10a. The working medium 20, the first wick structure 31, and the second wick structure 32 are housed in the internal space 10a. The housing 10 has a first metal plate 11 and a second metal plate 12 arranged so as to face each other, and a pillar portion 15.
第１金属板１１及び第２金属板１２は、上面視において水平方向に拡がる矩形の板状である。第２金属板１２の下面には発熱体Ｈが接触する。第１金属板１１は、第２金属板１２の上面を覆う。なお、本実施形態の第１金属板１１及び第２金属板１２は、上面視において四角形であるがこの限りではない。例えば、上面視において複数の角を有する多角形、又は円形であってもよい。　 The first metal plate 11 and the second metal plate 12 have a rectangular plate shape that extends in the horizontal direction when viewed from above. The heating element H comes into contact with the lower surface of the second metal plate 12. The first metal plate 11 covers the upper surface of the second metal plate 12. The first metal plate 11 and the second metal plate 12 of the present embodiment are rectangular in top view, but the present invention is not limited to this. For example, it may be a polygon or a circle having a plurality of corners in a top view. It was
第１金属板１１は、周縁から下方に延びる第１側壁部１３ａを有する。第２金属板１２は、周縁から上方に延びる第２側壁部１３ｂを有する。第１側壁部１３ａの下面と第２側壁部１３ｂの上面とが接合部１４で接合される。なお、第２側壁部１３ｂを省いて、第１側壁部１３ａの下面と第２金属板１２の上面とを接合してもよい。又は、第１側壁部１３ａを省いて、第２側壁部１３ｂの上面と第１金属板１１の下面とを接合してもよい。　 The first metal plate 11 has a first side wall portion 13a extending downward from the peripheral edge. The second metal plate 12 has a second side wall portion 13b extending upward from the peripheral edge. The lower surface of the first side wall portion 13a and the upper surface of the second side wall portion 13b are joined at the joint portion 14. The lower surface of the first side wall portion 13a and the upper surface of the second metal plate 12 may be joined by omitting the second side wall portion 13b. Alternatively, the upper surface of the second side wall portion 13b and the lower surface of the first metal plate 11 may be joined by omitting the first side wall portion 13a. It was
内部空間１０ａは、第１金属板１１及び第２金属板１２で囲まれて形成される。内部空間１０ａは、密閉空間であり、例えば大気圧よりも気圧が低い減圧状態に維持される。内部空間１０ａが減圧状態であることにより、内部空間１０ａに収容される作動媒体２０が蒸発しやすくなる。作動媒体２０は、例えば水であるが、アルコールなどの他の液体であってもよい。　 The internal space 10a is formed by being surrounded by the first metal plate 11 and the second metal plate 12. The internal space 10a is a closed space, and is maintained in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure, for example. When the internal space 10a is in a decompressed state, the working medium 20 housed in the internal space 10a is likely to evaporate. The working medium 20 is, for example, water, but may be another liquid such as alcohol. It was
接合部１４は、上方視において、第１ウィック構造体３１及び第２ウィック構造体３２の周囲に位置する。第１側壁部１３ａと第２側壁部１３ｂとの接合方法は、特に限定されない。例えば、熱と圧力を加えて接合する方法、拡散接合、ろう材を用いた接合、などのいずれの接合方法であってもよい。　 The joint portion 14 is located around the first wick structure 31 and the second wick structure 32 in the upward view. The method of joining the first side wall portion 13a and the second side wall portion 13b is not particularly limited. For example, any joining method such as a method of joining by applying heat and pressure, a diffusion joining, or a joining using a brazing material may be used. It was
なお、接合部１４は、封止部を含んでいてもよい。封止部は、例えば、熱伝導部材１の製造過程において、作動媒体２０を筐体１０内に注入するための注入口を溶接によって封止した箇所である。　 The joint portion 14 may include a sealing portion. The sealing portion is, for example, a portion where an injection port for injecting the working medium 20 into the housing 10 is sealed by welding in the manufacturing process of the heat conductive member 1. It was
柱部１５は、少なくとも１つの中実な中実柱部１５１と、少なくとも１つの多孔質の多孔質柱部１５２と、を有する。中実柱部１５１は、内部空間１０ａに配置され、第１金属板１１及び第２金属板１２を支持する。第１金属板１１及び第２金属板１２は、例えば、銅等の熱伝導性の高い金属から成る。また、銅以外の金属の表面に銅メッキを施して形成されてもよい。銅以外の金属としては、例えばステンレス鋼が考えられる。　 The pillar portion 15 has at least one solid solid pillar portion 151 and at least one porous porous pillar portion 152. The solid pillar portion 151 is arranged in the internal space 10a and supports the first metal plate 11 and the second metal plate 12. The first metal plate 11 and the second metal plate 12 are made of a metal having high thermal conductivity such as copper. Further, it may be formed by plating the surface of a metal other than copper with copper. As the metal other than copper, for example, stainless steel can be considered. It was
本実施形態において、中実柱部１５１は、第１金属板１１及び第２金属板１２とは別部材であり、中実な部材である。なお、「中実」な部材は、いわゆるソリッドな部材であることを意味し、中身が密に詰まっており、且つ多孔質でない物体で構成された部材を指す。例えば、「中実」な部材は、内部に空洞が内部材で合ってもよいし、単数又は複数の巨視的な空洞を内部に有する部材であってもよい。　 In the present embodiment, the solid pillar portion 151 is a member separate from the first metal plate 11 and the second metal plate 12, and is a solid member. The "solid" member means a so-called solid member, and refers to a member whose contents are tightly packed and which is composed of a non-porous object. For example, a "solid" member may have a cavity inside, which may be an internal member, or may be a member having one or more macroscopic cavities inside. It was
中実柱部１５１は、銅等の熱伝導性の高い金属から成る。中実柱部１５１は、Ｚ軸方向に延び、中実柱部１５１の上端部及び下端部は、第１金属板１１の下面及び第２金属板１２の上面にそれぞれろう材を用いて接合される。なお、中実柱部１５１は、ろう材による接合以外に溶接などにより第１金属板１１及び第２金属板１２と接合されてもよい。なお、中実柱部１５１は、第１金属板１１及び第２金属板１２の一方と一体であってもよい。このとき、中実柱部１５１は、第１金属板１１又は第２金属板１２をエッチング又は切削して形成することができる。　 The solid pillar portion 151 is made of a metal having high thermal conductivity such as copper. The solid pillar portion 151 extends in the Z-axis direction, and the upper end portion and the lower end portion of the solid pillar portion 151 are joined to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12, respectively, using a brazing material. To. The solid column portion 151 may be joined to the first metal plate 11 and the second metal plate 12 by welding or the like, in addition to joining with a brazing material. The solid pillar portion 151 may be integrated with one of the first metal plate 11 and the second metal plate 12. At this time, the solid pillar portion 151 can be formed by etching or cutting the first metal plate 11 or the second metal plate 12. It was
中実柱部１５１は、例えば、上方視において円形の円柱で構成される。中実柱部１５１は、ＸＹ面内において２次元的に、かつ、規則的に並んで位置する。Ｚ軸方向において中実柱部１５１が、第１金属板１１及び第２金属板１２を支持することにより、筐体１０のＺ軸方向の厚みが一定に保たれる。これにより、筐体１０のＺ軸方向の変形によって内部空間１０ａが、狭くなることを抑制できる。　 The solid pillar portion 151 is composed of, for example, a circular cylinder in an upward view. The solid pillar portions 151 are two-dimensionally and regularly arranged side by side in the XY plane. By supporting the first metal plate 11 and the second metal plate 12 by the solid pillar portion 151 in the Z-axis direction, the thickness of the housing 10 in the Z-axis direction is kept constant. As a result, it is possible to prevent the internal space 10a from becoming narrow due to the deformation of the housing 10 in the Z-axis direction. It was
多孔質柱部１５２は、Ｚ軸方向に延び、例えば、上方視において円形の円柱で構成される。多孔質柱部１５２は、多孔質の焼結体である。また、多孔質柱部１５２は、ＸＹ面内において２次元的に、かつ、規則的に並んで位置する。多孔質柱部１５２は、隣り合う中実柱部１５１の中間に配置されることが好ましい。なお、筐体１０は、少なくとも１つの中実な中実柱部１５１と、少なくとも１つの多孔質の多孔質柱部１５２と、を有する。　 The porous column portion 152 extends in the Z-axis direction and is composed of, for example, a circular cylinder when viewed upward. The porous pillar portion 152 is a porous sintered body. Further, the porous column portions 152 are two-dimensionally and regularly arranged side by side in the XY plane. The porous column portion 152 is preferably arranged in the middle of the adjacent solid column portions 151. The housing 10 has at least one solid solid pillar portion 151 and at least one porous porous pillar portion 152. It was
なお、中実柱部１５１と多孔質柱部１５２とは、同数であってもよいし、異なる数であってもよい。筐体１０の剛性を高めるため、中実柱部１５１の数が、多孔質柱部１５２の数よりも多くてもよい。　 The number of the solid pillar portion 151 and the number of the porous pillar portion 152 may be the same or different. In order to increase the rigidity of the housing 10, the number of solid pillar portions 151 may be larger than the number of porous pillar portions 152. It was
＜１－２．第１ウィック構造体及び第２ウィック構造体及び多孔質柱部の構成＞



第１ウィック構造体３１及び第２ウィック構造体３２は、多孔質であり、作動媒体２０の流路を形成する空隙部（不図示）を有する。第１ウィック構造体３１は、第１金属板１１の内面に配置されて内部空間１０ａに臨む。第２ウィック構造体３２は、第２金属板１２の内面に配置されて内部空間１０ａに臨む。なお、本明細書において、内部空間１０ａに「臨む」とは、内部空間１０ａと「向かい合う」ことを指す。　 <1-2. Structure of 1st wick structure, 2nd wick structure and porous column part>



The first wick structure 31 and the second wick structure 32 are porous and have a gap portion (not shown) forming a flow path of the working medium 20. The first wick structure 31 is arranged on the inner surface of the first metal plate 11 and faces the internal space 10a. The second wick structure 32 is arranged on the inner surface of the second metal plate 12 and faces the internal space 10a. In addition, in this specification, "facing" the interior space 10a means "facing" the interior space 10a.
多孔質柱部１５２は、柱状であり、内部空間１０ａ内に配置され、第１ウィック構造体３１及び第２ウィック構造体３２を支持する。多孔質柱部１５２は、Ｚ軸方向に延び、例えば、上方視において円形の円柱で構成される。また、多孔質柱部１５２は、ＸＹ面内において２次元的に、かつ、規則的に並んで位置する。多孔質柱部１５２は、隣り合う中実柱部１５１の中間に配置されることが好ましい。　 The porous column portion 152 is columnar and is arranged in the internal space 10a to support the first wick structure 31 and the second wick structure 32. The porous column portion 152 extends in the Z-axis direction and is composed of, for example, a circular cylinder when viewed upward. Further, the porous column portions 152 are two-dimensionally and regularly arranged side by side in the XY plane. The porous column portion 152 is preferably arranged in the middle of the adjacent solid column portions 151. It was
多孔質柱部１５２は、第１ウィック構造体３１及び第２ウィック構造体３２を介して第１金属板１１及び第２金属板１２を支持する。これにより、多孔質柱部１５２が、中実柱部１５１を補強して筐体１０のＺ軸方向の変形をより抑制できる。　 The porous column portion 152 supports the first metal plate 11 and the second metal plate 12 via the first wick structure 31 and the second wick structure 32. As a result, the porous pillar portion 152 can reinforce the solid pillar portion 151 and further suppress the deformation of the housing 10 in the Z-axis direction. It was
また、第１ウィック構造体３１と、第２ウィック構造体３２と、多孔質柱部１５２と、は、それぞれ多孔質の焼結体であり、一体である。第１ウィック構造体３１、第２ウィック構造体３２及び多孔質柱部１５２を多孔質の焼結体とすることにより、メッシュ材よりも容易に製造可能であり、熱伝導部材１の製造コストを下げることができる。また、多孔質柱部１５２を設けることにより、第１ウィック構造体３１から第２ウィック構造体３２への作動媒体２０の流路を増やすことができる。　 Further, the first wick structure 31, the second wick structure 32, and the porous column portion 152 are porous sintered bodies, respectively, and are integrated with each other. By making the first wick structure 31, the second wick structure 32, and the porous column portion 152 into a porous sintered body, it can be manufactured more easily than the mesh material, and the manufacturing cost of the heat conductive member 1 can be reduced. Can be lowered. Further, by providing the porous pillar portion 152, the flow path of the working medium 20 from the first wick structure 31 to the second wick structure 32 can be increased. It was
第２ウィック構造体３２の厚みＷ２は、第１ウィック構造体３１の厚みＷ１よりもＺ方向に大きい。被加熱部１０１において、発熱体Ｈ側に配置される第２ウィック構造体３２は、第１ウィック構造体３１よりも液状の作動媒体２０の気化が、促進される。このため、第２ウィック構造体３２の厚みＷ２を、第１ウィック構造体３１の厚みＷ１よりもＺ方向に大きくすることにより、第２ウィック構造体３２の作動媒体２０の保持性を第１ウィック構造体３１の作動媒体２０の保持性よりも高くできる。　 The thickness W2 of the second wick structure 32 is larger in the Z direction than the thickness W1 of the first wick structure 31. In the heated portion 101, the second wick structure 32 arranged on the heating element H side promotes the vaporization of the liquid working medium 20 as compared with the first wick structure 31. Therefore, by making the thickness W2 of the second wick structure 32 larger in the Z direction than the thickness W1 of the first wick structure 31, the holding property of the working medium 20 of the second wick structure 32 is improved by the first wick. It can be higher than the retention of the working medium 20 of the structure 31. It was
また、第２ウィック構造体３２の作動媒体２０の保持性が、向上することにより、発熱体ＨとＺ方向に重なる領域において、第２ウィック構造体３２の保持する液状の作動媒体２０が完全に気化する、いわゆるドライアウトの発生を抑制できる。　 Further, by improving the holding property of the working medium 20 of the second wick structure 32, the liquid working medium 20 held by the second wick structure 32 is completely in the region overlapping with the heating element H in the Z direction. It is possible to suppress the occurrence of so-called dryout, which is vaporization. It was
さらに、Ｚ方向（第１金属板１１及び第２金属板１２の対向方向）において、第１ウィック構造体３１の厚みＷ１と、第２ウィック構造体３２の厚みＷ２と、第１ウィック構造体３１と第２ウィック構造体３２との隙間の長さＷ３とは、式（１）を満たすことが好ましい。　 Further, in the Z direction (opposite direction of the first metal plate 11 and the second metal plate 12), the thickness W1 of the first wick structure 31, the thickness W2 of the second wick structure 32, and the first wick structure 31. It is preferable that the length W3 of the gap between the second wick structure 32 and the second wick structure 32 satisfies the equation (1). It was
Ｗ３＞Ｗ２＋Ｗ１　・・・（１）　 W3> W2 + W1 ... (1)
内部空間１０ａにおいて、第１ウィック構造体３１と第２ウィック構造体３２とのＺ方向の隙間を大きく設けることにより、第２ウィック構造体３２から気化した作動媒体２０が、内部空間１０ａ内でＸＹ面内に拡散し易くなる。これにより、第１ウィック構造体３１における作動媒体２０の凝縮が促進される。　 By providing a large gap in the Z direction between the first wick structure 31 and the second wick structure 32 in the internal space 10a, the working medium 20 vaporized from the second wick structure 32 is XY in the internal space 10a. It becomes easy to diffuse in the plane. This promotes the condensation of the working medium 20 in the first wick structure 31. It was
さらに、Ｚ方向（第１金属板１１及び第２金属板１２の対向方向）において、第１ウィック構造体３１の厚みＷ１と、第２ウィック構造体３２の厚みＷ２と、第１ウィック構造体３１と第２ウィック構造体３２との隙間の長さＷ３とは、式（２）～式（４）を満たすことがより好ましい。　 Further, in the Z direction (opposite direction of the first metal plate 11 and the second metal plate 12), the thickness W1 of the first wick structure 31, the thickness W2 of the second wick structure 32, and the first wick structure 31. It is more preferable that the length W3 of the gap between the metal and the second wick structure 32 satisfies the formulas (2) to (4). It was
４Ｗ１≧Ｗ２≧２Ｗ１　・・・（２）



７Ｗ１≧Ｗ３≧５Ｗ１　・・・（３）



Ｗ３＋Ｗ２＝９Ｗ１　・・・（４）　 4W1 ≧ W2 ≧ 2 W1 ・ ・ ・ (2)



7W1 ≧ W3 ≧ 5 W1 ・ ・ ・ (3)



W3 + W2 = 9W1 ... (4)
すなわち、第２ウィック構造体３２の厚みＷ２を第１ウィック構造体３１の厚みＷ１の２倍以上４倍以下とし、第１ウィック構造体３１と第２ウィック構造体３２との隙間の長さＷ３を第１ウィック構造体３１の厚みＷ１の５倍以上７倍以下とすることが好ましい。これにより、第２ウィック構造体３２の作動媒体２０の保持性を確保しながら、第１ウィック構造体３１における作動媒体２０の凝縮をより促進することができる。　 That is, the thickness W2 of the second wick structure 32 is set to be twice or more and four times or less the thickness W1 of the first wick structure 31, and the length of the gap between the first wick structure 31 and the second wick structure 32 is W3. Is preferably 5 times or more and 7 times or less the thickness W1 of the first wick structure 31. This makes it possible to further promote the condensation of the working medium 20 in the first wick structure 31 while ensuring the retention of the working medium 20 in the second wick structure 32. It was
一方、発熱体Ｈとは反対側の放熱面側に配置される第１ウィック構造体３１は、第２ウィック構造体３２よりも気化した作動媒体２０の凝縮が、促進される。このため、第１ウィック構造体３１は、第２ウィック構造体３２と比べて作動媒体２０の冷却効率が高いことが好ましい。　 On the other hand, the first wick structure 31 arranged on the heat radiating surface side opposite to the heating element H promotes the condensation of the vaporized working medium 20 as compared with the second wick structure 32. Therefore, it is preferable that the first wick structure 31 has a higher cooling efficiency of the working medium 20 than the second wick structure 32. It was
また、第２ウィック構造体３２は、第１ウィック構造体３１よりも空隙率が高い。これにより、第２ウィック構造体３２の毛細管力が、第１ウィック構造体３１の毛細管力よりも大きくなる。　 Further, the second wick structure 32 has a higher porosity than the first wick structure 31. As a result, the capillary force of the second wick structure 32 becomes larger than the capillary force of the first wick structure 31. It was
ここで、第１ウィック構造体３１及び第２ウィック構造体３２の全体積に対する空間の体積の割合を、空隙率と呼ぶ。空隙率の単位は％である。空隙率は以下の方法によって求められる。例えば、ウィック構造体の断面写真から、空間の面積を測定し、空間の面積が全体に占める割合を算出することにより、空隙率を求めることができる。第１ウィック構造体３１及び第２ウィック構造体３２の断面の観察においては、被写界深度の深い走査型電子顕微鏡を用いることが好ましい。なお、断面の観察の方法は、金属部分と空間とを容易に判別できる方法であればよく、特に限定されない。　 Here, the ratio of the volume of the space to the total product of the first wick structure 31 and the second wick structure 32 is referred to as a porosity. The unit of porosity is%. The porosity is determined by the following method. For example, the porosity can be obtained by measuring the area of the space from the cross-sectional photograph of the wick structure and calculating the ratio of the area of the space to the whole. When observing the cross sections of the first wick structure 31 and the second wick structure 32, it is preferable to use a scanning electron microscope having a deep depth of field. The method of observing the cross section is not particularly limited as long as it can easily distinguish between the metal portion and the space. It was
なお、本実施形態では、第１ウィック構造体３１及び第２ウィック構造体３２を多孔質の焼結体で構成しているが、第１ウィック構造体３１又は第２ウィック構造体３２を複数の金属線状部材が編み込まれたメッシュ部材であってもよい。第２ウィック構造体３２をメッシュ材で構成し、第１ウィック構造体３１を多孔質の焼結体で構成することにより、第２ウィック構造体３２の毛細管力を、第１ウィック構造体３１の毛細管力よりも大きく容易に形成することができる。　 In the present embodiment, the first wick structure 31 and the second wick structure 32 are made of a porous sintered body, but the first wick structure 31 or the second wick structure 32 is a plurality of pieces. It may be a mesh member in which a metal linear member is woven. By constructing the second wick structure 32 with a mesh material and the first wick structure 31 with a porous sintered body, the capillary force of the second wick structure 32 can be reduced to that of the first wick structure 31. It is larger than the capillary force and can be easily formed. It was
また、第１ウィック構造体３１又は第２ウィック構造体３２を第１金属板１１の内面及び第２金属板１２の内面に形成された複数の溝部により構成してもよい。これにより、メッシュ材及び焼結体で構成する場合と比べて第１ウィック構造体３１又は第２ウィック構造体３２を薄く形成できる。従って、内部空間１０ａをＺ軸方向に広げることができる。また、内部空間１０ａを狭めずに筐体１０をＺ軸方向に薄型化できる。また、第１ウィック構造体３１又は第２ウィック構造体３２の一方を溝部で構成ことにより、内部空間１０ａを狭めずに第１ウィック構造体３１又は第２ウィック構造体３２のＺ軸方向の厚みを大きくできる。　 Further, the first wick structure 31 or the second wick structure 32 may be composed of a plurality of grooves formed on the inner surface of the first metal plate 11 and the inner surface of the second metal plate 12. As a result, the first wick structure 31 or the second wick structure 32 can be formed thinner than in the case of being composed of the mesh material and the sintered body. Therefore, the internal space 10a can be expanded in the Z-axis direction. Further, the housing 10 can be made thinner in the Z-axis direction without narrowing the internal space 10a. Further, by forming one of the first wick structure 31 and the second wick structure 32 with a groove portion, the thickness of the first wick structure 31 or the second wick structure 32 in the Z-axis direction without narrowing the internal space 10a. Can be increased. It was
第１ウィック構造体３１、第２ウィック構造体３２及び多孔質柱部１５２は、例えば、以下のように形成される。まず、マイクロ銅粒子、銅体及び樹脂を含む金属粉体を接合前の第１金属板１１の下面及び第２金属板１２の上面に吹き付け塗布する。次に、柱状に成形した金属粉体を挟んで第１金属板１１及び第２金属板１２を接合する。その後、筐体１０を加熱して金属粉体を焼成する。これにより、筐体１０の内部空間１０ａに、第１ウィック構造体３１と、第２ウィック構造体３２と、多孔質柱部１５２と、を、容易に一体に形成できる。これにより、熱伝導部材１の製造コストを抑制することができる。なお、第１ウィック構造体３１、第２ウィック構造体３２及び多孔質柱部１５２を別々に焼成した後に、第１金属板１１及び第２金属板１２を接合してもよい。　 The first wick structure 31, the second wick structure 32, and the porous column portion 152 are formed, for example, as follows. First, a metal powder containing micro copper particles, a copper body and a resin is sprayed and applied to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12 before joining. Next, the first metal plate 11 and the second metal plate 12 are joined by sandwiching the metal powder formed into a columnar shape. After that, the housing 10 is heated to fire the metal powder. As a result, the first wick structure 31, the second wick structure 32, and the porous pillar portion 152 can be easily integrally formed in the internal space 10a of the housing 10. As a result, the manufacturing cost of the heat conductive member 1 can be suppressed. The first metal plate 11 and the second metal plate 12 may be joined after the first wick structure 31, the second wick structure 32, and the porous column portion 152 are fired separately. It was
なお、本明細書において、「塗布」とは、第１金属板１１の下面及び第２金属板１２の上面に金属粉体を付着させることを指す。吹き付け塗布する方法以外に、金属粉体を直接塗布してもよい。　 In addition, in this specification, "coating" means adhering metal powder to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12. In addition to the spray coating method, the metal powder may be directly applied. It was
マイクロ銅粒子は、複数の銅原子が凝集又は結合した粒子である。マイクロ銅粒子の粒径は、１μｍ以上１ｍｍ未満である。マイクロ銅粒子は、例えば多孔質である。　 Micro copper particles are particles in which a plurality of copper atoms are aggregated or bonded. The particle size of the micro copper particles is 1 μm or more and less than 1 mm. The micro copper particles are, for example, porous. It was
銅体は、マイクロ銅粒子よりも小さいサブマイクロ銅粒子が焼結により溶融して固まった銅溶融体である。サブマイクロ銅粒子は、複数の銅原子が凝集又は結合した粒子である。溶融前のサブマイクロ銅粒子の粒径は、０．１μｍ以上１μｍ未満である。　 The copper body is a copper melt obtained by melting and solidifying sub-micro copper particles smaller than the micro copper particles by sintering. Submicro copper particles are particles in which a plurality of copper atoms are aggregated or bonded. The particle size of the sub-micro copper particles before melting is 0.1 μm or more and less than 1 μm. It was
樹脂は、マイクロ銅粒子及び銅体を構成する銅の融点以下の温度で揮発する揮発性の樹脂である。このような揮発性の樹脂としては、例えば、メチルセルロース、エチルセルロースなどのセルロース樹脂、アクリル樹脂、ブチラール樹脂、アルキド樹脂、エポキシ樹脂、フェノール樹脂などを用いることができる。これらの中では、熱分解性の高いアクリル樹脂を用いることが好ましい。　 The resin is a volatile resin that volatilizes at a temperature below the melting point of the copper constituting the micro copper particles and the copper body. As such a volatile resin, for example, a cellulose resin such as methyl cellulose or ethyl cellulose, an acrylic resin, a butyral resin, an alkyd resin, an epoxy resin, a phenol resin or the like can be used. Among these, it is preferable to use an acrylic resin having high thermal decomposability. It was
（２．熱伝導部材の動作）



図２において、作動媒体２０が気化して生成される蒸気の流れを熱伝導部材１内の黒矢印で示し、液状の作動媒体２０の流れを熱伝導部材１内の白抜き矢印で示す。　 (2. Operation of heat conductive member)



In FIG. 2, the flow of steam generated by vaporizing the working medium 20 is indicated by a black arrow in the heat conductive member 1, and the flow of the liquid working medium 20 is indicated by a white arrow in the heat conductive member 1.
上記の構成の熱伝導部材では、発熱体Ｈで発生した熱により、被加熱部１０１が加熱される。被加熱部１０１の温度が上昇すると、第２ウィック構造体３２に含まれた液状の作動媒体２０が、気化する。　 In the heat conductive member having the above configuration, the heated portion 101 is heated by the heat generated by the heating element H. When the temperature of the heated portion 101 rises, the liquid working medium 20 contained in the second wick structure 32 is vaporized. It was
気化した作動媒体２０は、内部空間１０ａを放熱部１０２側に移動する。このとき、気化した作動媒体２０の一部は、第１ウィック構造体３１に接触して冷却され、凝縮する。第１ウィック構造体３１は、第１金属板１１の下面よりも表面積が大きく冷却効率が高い。このため、第１ウィック構造体３１を設けることにより、気化した作動媒体２０の冷却効率が向上して凝縮が促進される。　 The vaporized working medium 20 moves the internal space 10a toward the heat radiating portion 102. At this time, a part of the vaporized working medium 20 comes into contact with the first wick structure 31 to be cooled and condensed. The first wick structure 31 has a larger surface area and higher cooling efficiency than the lower surface of the first metal plate 11. Therefore, by providing the first wick structure 31, the cooling efficiency of the vaporized working medium 20 is improved and condensation is promoted. It was
第１ウィック構造体３１で凝縮した作動媒体２０の一部は、滴下して第２ウィック構造体３２に吸収される。また、第１ウィック構造体３１で凝縮した作動媒体２０の一部は、第１ウィック構造体３１中及び多孔質柱部１５２中を移動して第２ウィック構造体３２に吸収される。また、第１ウィック構造体３１で凝縮した作動媒体２０の一部は、中実柱部１５１の外面に沿って移動して第２ウィック構造体３２に吸収される。　 A part of the working medium 20 condensed in the first wick structure 31 is dropped and absorbed in the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves in the first wick structure 31 and in the porous column portion 152 and is absorbed by the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves along the outer surface of the solid pillar portion 151 and is absorbed by the second wick structure 32. It was
放熱部１０２に移動した気化した作動媒体２０は、放熱部１０２で冷却されて凝縮する。凝縮した作動媒体２０は、毛細管現象によって第２ウィック構造体３２中を被加熱部１０１に向かって移動する。また、第１ウィック構造体３１から第２ウィック構造体３２に吸収された作動媒体２０も、毛細管現象によって第２ウィック構造体３２中を被加熱部１０１に向かって移動する。　 The vaporized working medium 20 that has moved to the heat radiating unit 102 is cooled by the heat radiating unit 102 and condensed. The condensed working medium 20 moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. Further, the working medium 20 absorbed from the first wick structure 31 to the second wick structure 32 also moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. It was
このとき、第２ウィック構造体３２の毛細管力は、第１ウィック構造体３１の毛細管力よりも高いため、第２ウィック構造体３２を介して凝縮した作動媒体２０を発熱体Ｈが配置される被加熱部１０１により早く移動させることができる。従って、作動媒体２０による熱輸送効率が向上する。　 At this time, since the capillary force of the second wick structure 32 is higher than the capillary force of the first wick structure 31, the heating element H is arranged on the working medium 20 condensed through the second wick structure 32. It can be moved faster by the heated portion 101. Therefore, the heat transport efficiency by the working medium 20 is improved. It was
また、第２ウィック構造体３２の厚みＷ２を、第１ウィック構造体３１の厚みＷ１よりもＺ方向に大きくし、発熱体ＨとＺ方向に重なる領域において、ドライアウトの発生を抑制する。これにより、第２ウィック構造体３２中において、被加熱部１０１に向かって液状の作動媒体２０を連続して円滑に移動させることができる。従って、ドライアウトの発生による、作動媒体２０の熱輸送効率の低下を抑制できる。　 Further, the thickness W2 of the second wick structure 32 is made larger in the Z direction than the thickness W1 of the first wick structure 31, and the occurrence of dryout is suppressed in the region overlapping the heating element H in the Z direction. As a result, the liquid working medium 20 can be continuously and smoothly moved toward the heated portion 101 in the second wick structure 32. Therefore, it is possible to suppress a decrease in the heat transport efficiency of the working medium 20 due to the occurrence of dryout. It was
上記のように作動媒体２０が状態変化を伴いながら移動することにより、被加熱部１０１側から放熱部１０２側への熱輸送が連続的に行われる。　 As the working medium 20 moves while changing its state as described above, heat is continuously transferred from the heated portion 101 side to the heat radiating portion 102 side. It was
＜３．蒸気空間について＞



蒸気空間Ｓは、第１ウィック構造体３１と第２ウィック構造体３２との間の隙間空間から中実柱部１５１及び多孔質柱部１５２により占有される空間を除いた空間である。すなわち、蒸気空間Ｓは、内部空間１０ａにおける第１ウィック構造体３１、第２ウィック構造体３２、多孔質柱部１５２及び中実柱部１５１以外の空間である。　 <3. About steam space ＞



The steam space S is a space excluding the space occupied by the solid pillar portion 151 and the porous pillar portion 152 from the gap space between the first wick structure 31 and the second wick structure 32. That is, the steam space S is a space other than the first wick structure 31, the second wick structure 32, the porous pillar portion 152, and the solid pillar portion 151 in the internal space 10a.
そして、本実施形態では、下記式（５）が満たされる。



Ｖ１＞Ｖ２　・・・（５）



ただし、Ｖ１：蒸気空間Ｓの体積、Ｖ２：合計体積　 Then, in this embodiment, the following equation (5) is satisfied.



V1> V2 ... (5)



However, V1: the volume of the steam space S, V2: the total volume
このとき、合計体積は、第１ウィック構造体３１、第２ウィック構造体３２及び多孔質柱部１５２の各体積を合計した体積である。すなわち、本実施形態において、合計体積は、第１ウィック構造体３１及び第２ウィック構造体３２の合計体積に多孔質柱部１５２の体積をさらに含む。　 At this time, the total volume is the total volume of each of the first wick structure 31, the second wick structure 32, and the porous column portion 152. That is, in the present embodiment, the total volume further includes the volume of the porous column portion 152 in the total volume of the first wick structure 31 and the second wick structure 32. It was
なお、本実施形態では、多孔質柱部１５２が設けられているが、多孔質柱部１５２が設けられていない場合、合計体積は、第１ウィック構造体３１及び第２ウィック構造体３２の各体積を合計して算出される。また、蒸気空間Ｓは、内部空間１０ａにおける第１ウィック構造体３１、第２ウィック構造体３２及び中実柱部１５１以外の空間である。　 In this embodiment, the porous pillar portion 152 is provided, but when the porous pillar portion 152 is not provided, the total volume is each of the first wick structure 31 and the second wick structure 32. Calculated by summing up the volumes. Further, the steam space S is a space other than the first wick structure 31, the second wick structure 32, and the solid pillar portion 151 in the internal space 10a. It was
このようにすることで、蒸気空間Ｓの体積を確保し、作動媒体２０の蒸気の拡散を促進することができる。従って、熱伝導部材１の熱輸送効率を向上させることができる。　 By doing so, it is possible to secure the volume of the steam space S and promote the diffusion of the steam of the working medium 20. Therefore, the heat transport efficiency of the heat conductive member 1 can be improved. It was
また、中実柱部１５１は、筐体１０の強度を確保することができるが、配置することにより蒸気空間Ｓが狭くなる要因となり、そのような中実柱部１５１を設ける場合でも上記式（５）を満たすことで蒸気の拡散を促進できる。 Further, although the solid pillar portion 151 can secure the strength of the housing 10, arranging the solid pillar portion 151 causes a factor that the steam space S becomes narrow, and even when such a solid pillar portion 151 is provided, the above equation ( By satisfying 5), the diffusion of vapor can be promoted.
また、上記式（５）より、蒸気空間Ｓの体積は、第１ウィック構造体３１と第２ウィック構造体３２と多孔質柱部１５２との各体積の総和よりも大きくなる。　 Further, from the above formula (5), the volume of the steam space S is larger than the sum of the volumes of the first wick structure 31, the second wick structure 32, and the porous column portion 152. It was
＜４．中実柱部と多孔質柱部＞



本実施形態では、中実柱部１５１と多孔質柱部１５２は、次のような構成であることが好ましい。　 <4. Solid columns and porous columns>



In the present embodiment, the solid pillar portion 151 and the porous pillar portion 152 are preferably configured as follows.
中実柱部１５１の上面と第１金属板１１の下面とが接合される接合面積の総和は、多孔質柱部１５２の上面と第１ウィック構造体３１の下面とが接合される接合面積の総和よりも大きい。かつ、中実柱部１５１の下面と第２金属板１２の上面とが接合される接合面積の総和は、多孔質柱部１５２の下面と第２ウィック構造体３２の上面とが接合される接合面積の総和よりも大きい。なお、接合面積の総和とは、１本の中実柱部１５１又は多孔質柱部１５２についての接合面積のすべての本数分の総和のことである。　 The total joint area where the upper surface of the solid column portion 151 and the lower surface of the first metal plate 11 are joined is the joint area where the upper surface of the porous column portion 152 and the lower surface of the first wick structure 31 are joined. Greater than the sum. The total joint area where the lower surface of the solid column portion 151 and the upper surface of the second metal plate 12 are joined is the joint where the lower surface of the porous column portion 152 and the upper surface of the second wick structure 32 are joined. It is larger than the total area. The total joint area is the total number of joint areas of one solid column portion 151 or the porous column portion 152. It was
ただし、図３に変形例を示すように、多孔質柱部１５２が第１ウィック構造体３１を貫通して第１金属板１１に接合されるとともに、第２ウィック構造体３２を貫通して第２金属板１２に接合されてもよい。このような場合には、中実柱部１５１の上面と第１金属板１１の下面とが接合される接合面積の総和は、多孔質柱部１５２の上面と第１金属板１１の下面とが接合される接合面積の総和よりも大きい。かつ、中実柱部１５１の下面と第２金属板１２の上面とが接合される接合面積の総和は、多孔質柱部１５２の下面と第２金属板１２の上面とが接合される接合面積の総和よりも大きい。　 However, as shown in the modified example in FIG. 3, the porous column portion 152 penetrates the first wick structure 31 and is joined to the first metal plate 11 and also penetrates the second wick structure 32 to form a second. 2 It may be joined to the metal plate 12. In such a case, the total joint area where the upper surface of the solid pillar portion 151 and the lower surface of the first metal plate 11 are joined is such that the upper surface of the porous pillar portion 152 and the lower surface of the first metal plate 11 are joined together. It is larger than the total joint area to be joined. The total joint area where the lower surface of the solid pillar portion 151 and the upper surface of the second metal plate 12 are joined is the joint area where the lower surface of the porous pillar portion 152 and the upper surface of the second metal plate 12 are joined. Is larger than the sum of. It was
すなわち、中実柱部１５１の一方側端部が第１金属板１１と接する接触面積の総和は、多孔質柱部１５２の一方側端部が第１ウィック構造体３１又は第１金属板１１と接する接触面積の総和よりも広く、かつ、中実柱部１５１の他方側端部が第２金属板１２と接する接触面積の総和は、多孔質柱部１５２の他方側端部が第２ウィック構造体３２又は第２金属板１２と接する接触面積の総和よりも広い。　 That is, the total contact area of the solid pillar portion 151 where one side end is in contact with the first metal plate 11 is such that the one side end of the porous pillar portion 152 is the first wick structure 31 or the first metal plate 11. The total contact area is wider than the total contact area and the other end of the solid column 151 is in contact with the second metal plate 12, and the other end of the porous column 152 has a second wick structure. It is wider than the total contact area in contact with the body 32 or the second metal plate 12. It was
中実な中実柱部１５１の強度は、多孔質柱部１５２の強度よりも高い。従って、上記のような接触面積の大小関係により、多孔質柱部１５２を用いる構成であっても、中実柱部１５１によって筐体１０の強度を十分に確保することができる。　 The strength of the solid solid pillar portion 151 is higher than the strength of the porous pillar portion 152. Therefore, due to the size relationship of the contact area as described above, the strength of the housing 10 can be sufficiently secured by the solid pillar portion 151 even in the configuration using the porous pillar portion 152. It was
＜５．その他＞



以上、本発明の実施形態を説明した。なお、本発明の範囲は上述の実施形態に限定されない。本発明は、発明の主旨を逸脱しない範囲で上述の実施形態に種々の変更を加えて実施することができる。また、上述の実施形態で説明した事項は、矛盾を生じない範囲で適宜任意に組み合わせることができる。 <5. Others>



The embodiment of the present invention has been described above. The scope of the present invention is not limited to the above-described embodiment. The present invention can be implemented by making various modifications to the above-described embodiments without departing from the gist of the invention. In addition, the items described in the above-described embodiments can be arbitrarily combined as long as they do not cause a contradiction.
例えば、第１ウィック構造体３１をメッシュ材で構成し、第２ウィック構造体３２を多孔質の焼結体で構成してもよい。または、多孔質柱部１５２を設けないようにしてもよい。　 For example, the first wick structure 31 may be made of a mesh material, and the second wick structure 32 may be made of a porous sintered body. Alternatively, the porous column portion 152 may not be provided. It was
各種発熱体の冷却に利用することができる。 It can be used for cooling various heating elements.
１　　　熱伝導部材　　１０　　　筐体　　１０ａ　　内部空間　　１１　　　第１金属板　　１２　　　第２金属板　　１３ａ　　第１側壁部　　１３ｂ　　第２側壁部　　１４　　　接合部　　１５　　　柱部　　２０　　　作動媒体　　３１　　　第１ウィック構造体　　３２　　　第２ウィック構造体　　３３　　　第３ウィック構造体　　　Ｈ　　　発熱体 1 Heat conductive member 10 Housing 10a Internal space 11 1st metal plate 12 2nd metal plate 13a 1st side wall 13b 2nd side wall 14 Joint 15 Pillar part 20 Working medium 31 2nd structure 1st wick Body 33, 3rd wick structure, H, heating element

Claims (14)

  1. 内部空間を有する筐体と



    第１ウィック構造体と、



    第２ウィック構造体と、



    作動媒体と、を備え、



    前記筐体は、



    対向して配置される第１金属板及び第２金属板と、



    前記内部空間に配置される柱部と、を有し、



    前記柱部は、前記第１金属板及び前記第２金属板を支持する少なくとも１つの中実な中実柱部を有し、



    前記作動媒体と、前記第１ウィック構造体と、前記第２ウィック構造体と、は、前記内部空間に収容され、



    前記第１ウィック構造体は、前記第１金属板の内面に配置され、



    前記第２ウィック構造体は、前記第２金属板の内面に配置される、熱伝導部材。     With a housing that has an internal space



    The first wick structure and



    The second wick structure and



    With a working medium,



    The housing is



    The first metal plate and the second metal plate arranged to face each other,



    It has a pillar portion arranged in the internal space, and has.



    The pillar portion has at least one solid solid pillar portion that supports the first metal plate and the second metal plate.



    The working medium, the first wick structure, and the second wick structure are housed in the internal space.



    The first wick structure is arranged on the inner surface of the first metal plate.



    The second wick structure is a heat conductive member arranged on the inner surface of the second metal plate.
  2. 前記第１ウィック構造体は、多孔質の焼結体である、請求項１に記載の熱伝導部材。 The heat conductive member according to claim 1, wherein the first wick structure is a porous sintered body.
  3. 前記第２ウィック構造体は、複数の金属線状部材が編み込まれたメッシュ部材である、請求項１又は請求項２に記載の熱伝導部材。 The heat conductive member according to claim 1 or 2, wherein the second wick structure is a mesh member in which a plurality of metal linear members are woven.
  4. 前記第２ウィック構造体は、多孔質の焼結体である、請求項２に記載の熱伝導部材。 The heat conductive member according to claim 2, wherein the second wick structure is a porous sintered body.
  5. 前記柱部は、少なくとも１つの多孔質の多孔質柱部を有する請求項１～請求項４のいずれかに記載の熱伝導部材。 The heat conductive member according to any one of claims 1 to 4, wherein the pillar portion has at least one porous porous pillar portion.
  6. 前記筐体は、少なくとも１つの多孔質の多孔質柱部を有し、



    前記第１ウィック構造体と、前記第２ウィック構造体と、前記多孔質柱部と、が、一体である、請求項４に記載の熱伝導部材。     The housing has at least one porous porous column portion.



    The heat conductive member according to claim 4, wherein the first wick structure, the second wick structure, and the porous column portion are integrated.
  7. 前記第２ウィック構造体の厚みは、前記第１ウィック構造体の厚みよりも大きい、請求項４又は請求項６に記載の熱伝導部材。 The heat conductive member according to claim 4 or 6, wherein the thickness of the second wick structure is larger than the thickness of the first wick structure.
  8. 前記第１金属板及び前記第２金属板の対向方向において、前記第１ウィック構造体と前記第２ウィック構造体との隙間の長さと、前記第２ウィック構造体の厚みと、前記第１ウィック構造体の厚みとは、下記式（１）を満たす、請求項１～請求項７に記載の熱伝導部材。



    Ｗ３＞Ｗ２＋Ｗ１　・・・（１）



    Ｗ１：第１ウィック構造体の厚み



    Ｗ２：第２ウィック構造体の厚み



    Ｗ３：前記第１ウィック構造体と前記第２ウィック構造体との隙間の長さ     The length of the gap between the first wick structure and the second wick structure, the thickness of the second wick structure, and the first wick in the opposite directions of the first metal plate and the second metal plate. The heat conductive member according to claim 1 to 7, wherein the thickness of the structure satisfies the following formula (1).



    W3> W2 + W1 ... (1)



    W1: Thickness of the first wick structure



    W2: Thickness of the second wick structure



    W3: Length of the gap between the first wick structure and the second wick structure
  9. 前記第１金属板及び前記第２金属板の対向方向において、前記第１ウィック構造体と前記第２ウィック構造体との隙間の長さと、前記第２ウィック構造体の厚みと、前記第１ウィック構造体の厚みとは、下記式（２）～式（４）を満たす、請求項１～請求項８に記載の熱伝導部材。



    ４Ｗ１≧Ｗ２≧２Ｗ１　・・・（２）



    ７Ｗ１≧Ｗ３≧５Ｗ１　・・・（３）



    Ｗ３＋Ｗ２＝９Ｗ１　・・・（４）     The length of the gap between the first wick structure and the second wick structure, the thickness of the second wick structure, and the first wick in the opposite directions of the first metal plate and the second metal plate. The heat conductive member according to claim 1 to claim 8, wherein the thickness of the structure satisfies the following formulas (2) to (4).



    4W1 ≧ W2 ≧ 2 W1 ・ ・ ・ (2)



    7W1 ≧ W3 ≧ 5 W1 ・ ・ ・ (3)



    W3 + W2 = 9W1 ... (4)
  10. 前記内部空間における前記第１ウィック構造体、前記第２ウィック構造体及び前記中実柱部以外の空間に含まれ、前記作動媒体の蒸気が存在しうる蒸気空間の体積と、前記第１ウィック構造体及び前記第２ウィック構造体の合計体積とは、下記式（５）を満たす、請求項１～請求項４のいずれかに記載の熱伝導部材。



    Ｖ１＞Ｖ２　・・・（５）



    Ｖ１：前記内部空間における前記第１ウィック構造体、前記第２ウィック構造体及び前記柱部以外の空間に含まれ、前記作動媒体の蒸気が存在しうる蒸気空間の体積



    Ｖ２：前記第１ウィック構造体及び前記第２ウィック構造体の合計体積     The volume of the steam space contained in the space other than the first wick structure, the second wick structure, and the solid pillar portion in the internal space and in which the steam of the working medium can exist, and the first wick structure. The heat conductive member according to any one of claims 1 to 4, wherein the total volume of the body and the second wick structure satisfies the following formula (5).



    V1> V2 ... (5)



    V1: The volume of the steam space included in the space other than the first wick structure, the second wick structure, and the pillar portion in the internal space, and in which the steam of the working medium can exist.



    V2: Total volume of the first wick structure and the second wick structure
  11. 前記筐体は、前記内部空間内に配置され、前記第１ウィック構造体及び前記第２ウィック構造体を連結し、少なくとも１つの多孔質の多孔質柱部を有し、



    前記蒸気空間は、前記内部空間における前記第１ウィック構造体、前記第２ウィック構造体、前記中実柱部及び前記多孔質柱部以外の空間であり、



    前記合計体積は、前記多孔質柱部の体積をさらに含む、請求項１０に記載の熱伝導部材。     The housing is arranged in the interior space, connects the first wick structure and the second wick structure, and has at least one porous porous column portion.



    The steam space is a space other than the first wick structure, the second wick structure, the solid pillar portion, and the porous pillar portion in the internal space.



    The heat conductive member according to claim 10, wherein the total volume further includes the volume of the porous column portion.
  12. 前記筐体は、前記内部空間内に配置され、前記第１ウィック構造体及び前記第２ウィック構造体を連結し、少なくとも１つの多孔質の多孔質柱部を有し、



    前記中実柱部の一方側端部が前記第１金属板と接する接触面積の総和は、前記多孔質柱部の一方側端部が前記第１ウィック構造体又は前記第１金属板と接する接触面積の総和よりも広く、かつ、前記中実柱部の他方側端部が前記第２金属板と接する接触面積の総和は、前記多孔質柱部の他方側端部が前記第２ウィック構造体又は前記第２金属板と接する接触面積の総和よりも広い、請求項１～請求項４のいずれかに記載の熱伝導部材。     The housing is arranged in the interior space, connects the first wick structure and the second wick structure, and has at least one porous porous column portion.



    The total contact area of the one-sided end of the solid pillar in contact with the first metal plate is the contact in which one end of the porous pillar is in contact with the first wick structure or the first metal plate. The total area is wider than the total area, and the total contact area where the other end of the solid column is in contact with the second metal plate is such that the other end of the porous column is the second wick structure. The heat conductive member according to any one of claims 1 to 4, which is wider than the total contact area in contact with the second metal plate.
  13. 前記第２ウィック構造体は、前記第１ウィック構造体よりも空隙率が高い、請求項４～請求項９のいずれかに記載の熱伝導部材。 The heat conductive member according to any one of claims 4 to 9, wherein the second wick structure has a higher porosity than the first wick structure.
  14. 前記第２ウィック構造体の毛細管力は、前記第１ウィック構造体の毛細管力よりも高い、請求項１～請求項１３のいずれかに記載の熱伝導部材。 The heat conductive member according to any one of claims 1 to 13, wherein the capillary force of the second wick structure is higher than the capillary force of the first wick structure.
PCT/JP2021/028344 2020-07-31 2021-07-30 Heat conduction member WO2022025249A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091172A (en) * 1999-09-21 2001-04-06 Fujikura Ltd Planar heat pipe
US20080174963A1 (en) * 2007-01-24 2008-07-24 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber defined therein

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091172A (en) * 1999-09-21 2001-04-06 Fujikura Ltd Planar heat pipe
US20080174963A1 (en) * 2007-01-24 2008-07-24 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber defined therein

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