WO2022025252A1 - Heat conduction member - Google Patents

Heat conduction member Download PDF

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Publication number
WO2022025252A1
WO2022025252A1 PCT/JP2021/028347 JP2021028347W WO2022025252A1 WO 2022025252 A1 WO2022025252 A1 WO 2022025252A1 JP 2021028347 W JP2021028347 W JP 2021028347W WO 2022025252 A1 WO2022025252 A1 WO 2022025252A1
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WO
WIPO (PCT)
Prior art keywords
wick structure
metal plate
conductive member
heat conductive
pillar portion
Prior art date
Application number
PCT/JP2021/028347
Other languages
French (fr)
Japanese (ja)
Inventor
征志 高尾
仕▲ゆ▼ 楊
敏彦 小関
雅昭 花野
淳一 石田
Original Assignee
日本電産株式会社
尼得科超▲しゅう▼科技股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020192030A external-priority patent/JP2023127008A/en
Application filed by 日本電産株式会社, 尼得科超▲しゅう▼科技股▲ふん▼有限公司 filed Critical 日本電産株式会社
Publication of WO2022025252A1 publication Critical patent/WO2022025252A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to heat conductive members.
  • the conventional heat conductive member includes a container, a wick structure, and a working fluid.
  • the container has an internal space inside.
  • the wick structure is placed on the inner surface of the container.
  • the working fluid is housed in the interior space. It was
  • the container is placed in contact with the heating element.
  • the working fluid is heated by the heating element and vaporized from the wick structure.
  • the vaporized working fluid moves inside the container to the heat dissipation side.
  • the working fluid is cooled and condensed by the heat dissipation.
  • the condensed working fluid moves toward the heating element in the wick structure by capillarity. As a result, heat is transported from the heating element side to the heat radiating side (see, for example, Patent Document 1).
  • the heat conductive member as described above cannot hold and transport the condensed working fluid, and has a problem that the heat transport efficiency is low. It was
  • the exemplary heat conductive member of the present disclosure includes a housing having an internal space, a first wick structure, a second wick structure, an actuating medium, and a pillar portion.
  • the housing has a first metal plate and a second metal plate which is arranged so as to face the first metal plate and in which a heating element is arranged on an outer surface.
  • the pillar portion is arranged in the internal space and is arranged between the first metal plate and the second metal plate.
  • the working medium, the first wick structure, and the second wick structure are housed in the internal space.
  • the first wick structure is arranged on the inner surface of the first metal plate.
  • the second wick structure is arranged on the inner surface of the second metal plate. The thickness of the first wick structure is larger than the thickness of the second wick structure.
  • FIG. 1 is a perspective view of a heat conductive member according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic side sectional view of the heat conductive member according to the embodiment of the present disclosure.
  • FIG. 3 is a schematic side sectional view of the heat conductive member according to the modified example of the embodiment of the present disclosure.
  • the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate.
  • the Z-axis direction indicates a vertical direction (that is, a vertical direction)
  • the + Z direction is the upper side (opposite the gravity direction)
  • the ⁇ Z direction is the lower side (gravity direction).
  • the Z-axis direction is also the opposite direction between the first metal plate 11 and the second metal plate 12, which will be described later.
  • the X-axis direction refers to a direction orthogonal to the Z-axis direction, and one direction and the opposite direction thereof are the + X direction and the ⁇ X direction, respectively.
  • the Y-axis direction refers to a direction orthogonal to both the Z-axis direction and the X-axis direction, and one direction and the opposite direction thereof are the + Y direction and the ⁇ Y direction, respectively.
  • this is for convenience of explanation only, and does not limit the orientation of the heat conductive member 1 according to the present disclosure at the time of manufacture and use.
  • the expression "parallel” does not mean only the case of being mathematically strictly parallel, but includes, for example, the case of being parallel to the extent that the effect in the present disclosure is obtained. It was
  • sining refers to a technique of heating a metal powder or a paste containing a metal powder to a temperature lower than the melting point of the metal to bake and harden the metal particles.
  • sintered body refers to an object obtained by sintering. It was
  • FIG. 1 is a perspective view of a heat conductive member 1 according to an exemplary embodiment of the present disclosure (hereinafter referred to as the present embodiment), and FIG. 2 is a schematic side sectional view of the heat conductive member 1.
  • FIG. 2 is a cross-sectional view taken along the alternate long and short dash line AA of FIG.
  • the heat conductive member 1 is also called a vapor chamber and transports the heat of the heating element H.
  • the heating element H include a power transistor of an inverter provided in a traction motor for driving a wheel of a vehicle.
  • the power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor).
  • the heat conductive member 1 is mounted on the traction motor.
  • the calorific value of the IGBT is generally 100 W or more.
  • the heat conductive member 1 includes a heated portion 101 and a heat radiating portion 102 (see FIG. 2).
  • the heated portion 101 is arranged in contact with the heating element H, for example, and is heated by the heat generated by the heating element H.
  • the heat radiating unit 102 releases the heat of the operating medium 20, which will be described later, heated by the heated unit 101 to the outside.
  • heat exchange means such as heat dissipation fins and heat sinks may be thermally connected to the heat dissipation unit 102. In that case, the cooling medium is passed through the heat exchange means.
  • the cooling medium may be, for example, water, oil, or air. It was
  • the heat conductive member 1 includes a housing 10, an actuating medium 20, a pillar portion 15, a first wick structure 31, and a second wick structure 32.
  • the heated portion 101 is formed by a part of the housing 10.
  • the heat radiating portion 102 is formed by another part of the housing 10.
  • the thickness of the heat conductive member 1 in the Z direction is, for example, 5 mm or more. It was
  • the housing 10 has an internal space 10a.
  • the pillar portion 15, the working medium 20, the first wick structure 31, and the second wick structure 32 are arranged in the internal space 10a.
  • the housing 10 has a first metal plate 11 and a second metal plate 12 which is arranged so as to face the first metal plate 11 and in which a heating element H is arranged on an outer surface.
  • the pillar portion 15 is arranged between the first metal plate 11 and the second metal plate 12.
  • the pillar portion 15 is arranged in the internal space 10a and supports the first metal plate 11 and the second metal plate 12.
  • a metal having high thermal conductivity such as copper is used. Further, it may be formed by plating the surface of a metal other than copper with copper.
  • the metal other than copper for example, stainless steel can be considered.
  • the first metal plate 11 and the second metal plate 12 have a rectangular plate shape that extends in the horizontal direction when viewed from above.
  • the heating element H comes into contact with the lower surface of the second metal plate 12.
  • the first metal plate 11 covers the upper surface of the second metal plate 12.
  • the first metal plate 11 and the second metal plate 12 of the present embodiment are rectangular in top view, but the present invention is not limited to this. For example, it may be a polygon or a circle having a plurality of corners in a top view. It was
  • the first metal plate 11 has a first side wall portion 13a extending downward from the peripheral edge.
  • the second metal plate 12 has a second side wall portion 13b extending upward from the peripheral edge.
  • the lower surface of the first side wall portion 13a and the upper surface of the second side wall portion 13b are joined at the joint portion 14.
  • the lower surface of the first side wall portion 13a and the upper surface of the second metal plate 12 may be joined by omitting the second side wall portion 13b.
  • the upper surface of the second side wall portion 13b and the lower surface of the first metal plate 11 may be joined by omitting the first side wall portion 13a.
  • the internal space 10a is formed by being surrounded by the first metal plate 11 and the second metal plate 12.
  • the internal space 10a is a closed space, and is maintained in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure, for example.
  • the working medium 20 housed in the internal space 10a is likely to evaporate.
  • the working medium 20 is, for example, water, but may be another liquid such as alcohol. It was
  • the joint portion 14 is located around the first wick structure 31 and the second wick structure 32 in the upward view.
  • the method of joining the first side wall portion 13a and the second side wall portion 13b is not particularly limited.
  • any joining method such as a method of joining by applying heat and pressure, a diffusion joining, or a joining using a brazing material may be used. It was
  • the joint portion 14 may include a sealing portion.
  • the sealing portion is, for example, a portion where an injection port for injecting the working medium 20 into the housing 10 is sealed by welding in the manufacturing process of the heat conductive member 1. It was
  • the pillar portion 15 is a separate member from the first metal plate 11 and the second metal plate 12, and is arranged between the first metal plate 11 and the second metal plate 12 in the internal space 10a. It is a member that supports the first metal plate 11 and the second metal plate 12.
  • the pillar portion 15 has, for example, a circular cylindrical shape when viewed upward.
  • the pillar portions 15 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the pillar portion 15 has a first pillar portion 16 which is a solid member.
  • the first pillar portion 16 is arranged between the first metal plate 11 and the second metal plate 12 in the internal space 10a, and supports the first metal plate 11 and the second metal plate 12.
  • the "solid” member means a so-called solid member, and refers to a member whose contents are tightly packed and which is composed of a non-porous object.
  • the "solid” member may be a member that does not have a cavity inside, or may be a member that has one or more macroscopic cavities inside.
  • a metal having high thermal conductivity such as copper is used. It was
  • the pillar portion 15 has a second pillar portion 33 which is a porous sintered body.
  • the second pillar portion 33 is the third wick structure 33.
  • the third wick structure 33 is arranged between the first wick structure 31 and the second wick structure 32 in the internal space 10a, and supports the first wick structure 31 and the second wick structure 32.
  • the third wick structure 33 supports the first metal plate 11 and the second metal plate 12 via the first wick structure 31 and the second wick structure 32.
  • the pillar portion 15 has a first pillar portion 16 which is a solid member and a second pillar portion 33 which is a porous sintered body.
  • the second pillar portion 33 is the third wick structure 33.
  • the second pillar portion 33 will be described as the third wick structure 33.
  • the third wick structure 33 is preferably arranged in the middle of the adjacent first pillar portions 16. It was
  • the first pillar 16 which is a solid member, extends in the Z-axis direction, and the upper and lower ends of the first pillar 16 are the lower surface of the first metal plate 11 and the second metal plate.
  • Each of the upper surfaces of 12 is joined using a brazing material.
  • the first pillar portion 16 may be joined to the first metal plate 11 and the second metal plate 12 by welding or the like, in addition to joining with a brazing material.
  • the first pillar portion 16 may be integrated with one of the first metal plate 11 and the second metal plate 12. At this time, the first pillar portion 16 can be formed by etching or cutting the first metal plate 11 or the second metal plate 12. It was
  • the first wick structure 31, the second wick structure 32, and the third wick structure 33 are porous and have a gap portion (not shown) forming a flow path of the working medium 20.
  • the first wick structure 31 is arranged on the inner surface of the first metal plate 11 and faces the internal space 10a.
  • the second wick structure 32 is arranged on the inner surface of the second metal plate 12 and faces the internal space 10a.
  • “facing" the interior space 10a means “facing" the interior space 10a.
  • first wick structure 31, the second wick structure 32, and the third wick structure 33 are porous sintered bodies, respectively, and are integrated with each other.
  • first wick structure 31, the second wick structure 32, and the third wick structure 33 as porous sintered bodies, it is possible to manufacture the first wick structure 31, the second wick structure 32, and the third wick structure 33 more easily than the mesh material, and the manufacturing cost of the heat conductive member 1 is high. Can be lowered.
  • the third wick structure 33 the flow path of the operating medium 20 from the first wick structure 31 to the second wick structure 32 can be increased. It was
  • the thickness W1 of the first wick structure 31 is larger in the Z direction than the thickness W2 of the second wick structure 32.
  • the second wick structure 32 arranged on the heating element H side is arranged, and the liquid working medium 20 contained in the second wick structure 32 is vaporized.
  • the vaporized working medium 20 moves the internal space 10a toward the heat radiating portion 102.
  • a part of the vaporized working medium 20 comes into contact with the first wick structure 31 to be cooled and condensed. Therefore, by making the thickness W1 of the first wick structure 32 larger in the Z direction than the thickness W2 of the second wick structure 32, the holding property of the working medium 20 of the first wick structure 31 is increased by the second wick.
  • the first wick structure 31 has a larger surface area and higher cooling efficiency than the second one. Therefore, by providing the first wick structure 31, the cooling efficiency of the vaporized working medium 20 is improved and condensation is promoted. It was
  • the thickness W1 of the first wick structure 31 the thickness W2 of the second wick structure 32, and the first wick structure 31. It is preferable that the length W3 of the gap between the second wick structure 32 and the second wick structure 32 satisfies the equation (1). It was
  • the working medium 20 vaporized from the second wick structure 32 is XY in the internal space 10a. It becomes easy to diffuse in the plane. This promotes the condensation of the working medium 20 in the first wick structure 31. It was
  • the thickness W1 of the first wick structure 31 the thickness W2 of the second wick structure 32, and the first wick structure 31. It is more preferable that the length W3 of the gap between the metal and the second wick structure 32 satisfies the formulas (2) to (4). It was
  • the thickness W1 of the first wick structure 32 is set to be twice or more and four times or less the thickness W2 of the second wick structure 32, and the length of the gap between the first wick structure 31 and the second wick structure 32 is W3. Is preferably 5 times or more and 7 times or less the thickness W2 of the second wick structure 32.
  • the first wick structure 31 arranged on the heat radiating surface side opposite to the heating element H promotes the condensation of the vaporized working medium 20 as compared with the second wick structure 32. Therefore, it is preferable that the first wick structure 31 has a higher cooling efficiency of the working medium 20 than the second wick structure 32. It was
  • the second wick structure 32 has a higher porosity than the first wick structure 31. As a result, the capillary force of the second wick structure 32 becomes larger than the capillary force of the first wick structure 31. It was
  • the ratio of the volume of the space to the total product of the first wick structure 31 and the second wick structure 32 is referred to as a porosity.
  • the unit of porosity is%.
  • the porosity is determined by the following method. For example, the porosity can be obtained by measuring the area of the space from the cross-sectional photograph of the wick structure and calculating the ratio of the area of the space to the whole.
  • a scanning electron microscope having a deep depth of field. The method of observing the cross section is not particularly limited as long as it can easily distinguish between the metal portion and the space. It was
  • the first wick structure 31 and the second wick structure 32 are made of a porous sintered body, but the first wick structure 31 or the second wick structure 32 is a plurality of pieces. It may be a mesh member in which a metal linear member is woven.
  • the capillary force of the second wick structure 32 can be reduced to that of the first wick structure 31. It is larger than the capillary force and can be easily formed. It was
  • first wick structure 31 or the second wick structure 32 may be composed of a plurality of grooves formed on the inner surface of the first metal plate 11 and the inner surface of the second metal plate 12.
  • the first wick structure 31 or the second wick structure 32 can be formed thinner than in the case of being composed of the mesh material and the sintered body. Therefore, the internal space 10a can be expanded in the Z-axis direction. Further, the housing 10 can be made thinner in the Z-axis direction without narrowing the internal space 10a. Further, by forming one of the first wick structure 31 and the second wick structure 32 with a groove portion, the thickness of the first wick structure 31 or the second wick structure 32 in the Z-axis direction without narrowing the internal space 10a. Can be increased. It was
  • the first wick structure 31, the second wick structure 32, and the third wick structure 33 are formed, for example, as follows. First, a metal powder containing micro copper particles, a copper body and a resin is sprayed and applied to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12 before joining. Next, the first metal plate 11 and the second metal plate 12 are joined by sandwiching the metal powder formed into a columnar shape. After that, the housing 10 is heated to fire the metal powder. As a result, the first wick structure 31, the second wick structure 32, and the third wick structure 33 can be easily integrally formed in the internal space 10a of the housing 10. As a result, the manufacturing cost of the heat conductive member 1 can be suppressed. The first metal plate 11 and the second metal plate 12 may be joined after the first wick structure 31, the second wick structure 32, and the third wick structure 33 are separately fired. It was
  • coating means adhering metal powder to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12.
  • the metal powder may be directly applied. It was
  • Micro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the micro copper particles is 1 ⁇ m or more and less than 1 mm.
  • the micro copper particles are, for example, porous. It was
  • the copper body is a copper melt obtained by melting and solidifying sub-micro copper particles smaller than the micro copper particles by sintering.
  • Submicro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the sub-micro copper particles before melting is 0.1 ⁇ m or more and less than 1 ⁇ m. It was
  • the resin is a volatile resin that volatilizes at a temperature below the melting point of the copper constituting the micro copper particles and the copper body.
  • a volatile resin for example, a cellulose resin such as methyl cellulose or ethyl cellulose, an acrylic resin, a butyral resin, an alkyd resin, an epoxy resin, a phenol resin or the like can be used.
  • an acrylic resin having high thermal decomposability. It was
  • the heated portion 101 is heated by the heat generated by the heating element H.
  • the liquid working medium 20 contained in the second wick structure 32 is vaporized. It was
  • the vaporized working medium 20 moves the internal space 10a toward the heat radiating portion 102. At this time, a part of the vaporized working medium 20 comes into contact with the first wick structure 31 to be cooled and condensed.
  • the first wick structure 31 has a larger surface area and higher cooling efficiency than the lower surface of the first metal plate 11. Therefore, by providing the first wick structure 31, the cooling efficiency of the vaporized working medium 20 is improved and condensation is promoted. It was
  • a part of the working medium 20 condensed in the first wick structure 31 is dropped and absorbed in the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves in the first wick structure 31 and the third wick structure 33 and is absorbed by the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves along the outer surface of the first pillar portion 16 and is absorbed by the second wick structure 32. It was
  • the vaporized working medium 20 that has moved to the heat radiating unit 102 is cooled by the heat radiating unit 102 and condensed.
  • the condensed working medium 20 moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. Further, the working medium 20 absorbed from the first wick structure 31 to the second wick structure 32 also moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. It was
  • the heating element H is arranged on the working medium 20 condensed through the second wick structure 32. It can be moved faster by the heated portion 101. Therefore, the heat transport efficiency by the working medium 20 is improved. It was
  • the thickness W1 of the first wick structure 31 is made larger in the Z direction than the thickness W2 of the second wick structure 32, and the transport efficiency of the working medium 20 is improved in the region overlapping the heating element H in the Z direction. ..
  • the liquid working medium 20 can be continuously and smoothly moved toward the heated portion 101 in the first wick structure 31. Therefore, it is possible to suppress a decrease in the heat transport efficiency of the working medium 20. It was
  • the steam space S is a space excluding the space occupied by the first pillar portion 16 and the third wick structure 33 from the gap space between the first wick structure 31 and the second wick structure 32. That is, the steam space S is a space other than the first wick structure 31, the second wick structure 32, the third wick structure 33, and the first pillar portion 16 in the internal space 10a.
  • V1 the volume of the steam space S
  • V2 the total volume
  • the total volume is the total volume of each of the first wick structure 31, the second wick structure 32, and the third wick structure 33. That is, in the present embodiment, the total volume further includes the volume of the third wick structure 33 in the total volume of the first wick structure 31 and the second wick structure 32. It was
  • the third wick structure 33 is provided, but when the third wick structure 33 is not provided, the total volume is the first wick structure 31 and the second wick structure 32. It is calculated by summing up each volume of. It was
  • the arrangement of the first pillar portion 16 causes the steam space S to become narrower, and even when such a first pillar portion 16 is provided, the above equation ( By satisfying 5), the diffusion of vapor can be promoted. It was
  • the volume of the steam space S is larger than the sum of the volumes of the first wick structure 31, the second wick structure 32, and the third wick structure 33. Can promote diffusion. It was
  • the first pillar portion 16 and the third wick structure 33 preferably have the following configurations.
  • the total joint area where the upper surface of the first pillar portion 16 and the lower surface of the first metal plate 11 are joined is the joint area where the upper surface of the third wick structure 33 and the lower surface of the first wick structure 31 are joined. Is larger than the sum of. Further, the total joint area where the lower surface of the first pillar portion 16 and the upper surface of the second metal plate 12 are joined is such that the lower surface of the third wick structure 33 and the upper surface of the second wick structure 32 are joined. It is larger than the total joint area.
  • the total joint area is the total number of joint areas of one first pillar portion 16 or the third wick structure 33.
  • the third wick structure 33 penetrates the first wick structure 31 and is joined to the first metal plate 11 and also penetrates the second wick structure 32. It may be joined to the second metal plate 12.
  • the total joint area where the upper surface of the first pillar portion 16 and the lower surface of the first metal plate 11 are joined is the upper surface of the third wick structure 33 and the lower surface of the first metal plate 11. Is larger than the total joint area to which is joined.
  • the total joint area where the lower surface of the first pillar portion 16 and the upper surface of the second metal plate 12 are joined is the joint where the lower surface of the third wick structure 33 and the upper surface of the second metal plate 12 are joined. It is larger than the total area. It was
  • the total contact area of the one-sided end of the first pillar 16 in contact with the first metal plate 11 is such that the one-sided end of the third wick structure 33 is the first wick structure 31 or the first metal plate 11.
  • the total contact area that is wider than the total contact area in contact with the second metal plate 12 and that the other side end portion of the first pillar portion 16 is in contact with the second metal plate 12 is such that the other side end portion of the third wick structure 33 is second. It is wider than the total contact area in contact with the wick structure 32 or the second metal plate 12. It was
  • the strength of the solid first pillar portion 16 is higher than the strength of the third wick structure 33. Therefore, due to the magnitude relationship of the contact area as described above, the strength of the housing 10 can be sufficiently secured by the first pillar portion 16 even in the configuration using the third wick structure 33. It was
  • the first wick structure 31 may be made of a mesh material, and the second wick structure 32 may be made of a porous sintered body.
  • the third wick structure 33 may not be provided. It was
  • the pillar portion 15 is a mixture of the first pillar portion 16 and the third wick structure 33, but the pillar portion 15 may be all the first pillar portion 16 and all may be the third wick structure 33. But it may be. It was
  • Heat conductive member 10 Housing 10a Internal space 11 1st metal plate 12 2nd metal plate 13a 1st side wall 13b 2nd side wall 14 Joining part 15 Pillar part 16 1st pillar part 20 32, 2nd wick structure, 33, 2nd pillar, 3rd wick structure, H, heating element,

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention comprises a housing having an interior space, a first wick structure, a second wick structure, a working medium, and a pillar section. The housing has a first metal plate, and a second metal plate that is arranged facing the first metal plate and that has a heating element arranged on the outer surface thereof. The pillar section is arranged in the interior space, and is arranged between the first metal plate and the second metal plate. The working medium, the first wick structure, and the second wick structure are accommodated in the interior space. The first wick structure is arranged on the inner surface of the first metal plate. The second wick structure is arranged on the inner surface of the second metal plate. The thickness of the first wick structure is greater than the thickness of the second wick structure.

Description

熱伝導部材Heat conduction member
本開示は、熱伝導部材に関する。 The present disclosure relates to heat conductive members.
従来の熱伝導部材は、コンテナと、ウィック構造体と、作動流体と、を有する。コンテナは、内部に内部空間を有する。ウィック構造体は、コンテナの内面に配置される。作動流体は、内部空間に収容される。　 The conventional heat conductive member includes a container, a wick structure, and a working fluid. The container has an internal space inside. The wick structure is placed on the inner surface of the container. The working fluid is housed in the interior space. It was
コンテナは、発熱体と接触して配置される。作動流体は、発熱体によって加熱されてウィック構造体から気化する。気化した作動流体は、コンテナの内部を放熱側に移動する。放熱側では、放熱によって作動流体が冷却され、凝縮する。凝縮した作動流体は、毛細管現象によってウィック構造体中を発熱体側に移動する。これにより、発熱体側から放熱側に熱が輸送される（例えば、特許文献１参照）。 The container is placed in contact with the heating element. The working fluid is heated by the heating element and vaporized from the wick structure. The vaporized working fluid moves inside the container to the heat dissipation side. On the heat dissipation side, the working fluid is cooled and condensed by the heat dissipation. The condensed working fluid moves toward the heating element in the wick structure by capillarity. As a result, heat is transported from the heating element side to the heat radiating side (see, for example, Patent Document 1).
日本国公開公報：特開２０１９－８２２６４号公報Japanese Publication: Japanese Patent Application Laid-Open No. 2019-82264
しかしながら、上記のような熱伝導部材は、凝縮した作動流体を保持し輸送することができず、熱輸送効率が低いという問題があった。　 However, the heat conductive member as described above cannot hold and transport the condensed working fluid, and has a problem that the heat transport efficiency is low. It was
本開示は、熱輸送効率を向上できる熱伝導部材を提供することを目的とする。 It is an object of the present disclosure to provide a heat conductive member capable of improving heat transport efficiency.
本開示の例示的な熱伝導部材は、内部空間を有する筐体と、第１ウィック構造体と、第２ウィック構造体と、作動媒体と、柱部と、を備える。筐体は、第１金属板と、第１金属板に対向して配置されるとともに外面に発熱体が配置される第２金属板と、を有する。柱部は、内部空間に配置され、前記第１金属板及び前記第２金属板の間に配置される。作動媒体と、第１ウィック構造体と、第２ウィック構造体とは、内部空間に収容される。第１ウィック構造体は、第１金属板の内面に配置される。第２ウィック構造体は、前記第２金属板の内面に配置される。第１ウィック構造体の厚みは、第２ウィック構造体の厚みよりも大きい。 The exemplary heat conductive member of the present disclosure includes a housing having an internal space, a first wick structure, a second wick structure, an actuating medium, and a pillar portion. The housing has a first metal plate and a second metal plate which is arranged so as to face the first metal plate and in which a heating element is arranged on an outer surface. The pillar portion is arranged in the internal space and is arranged between the first metal plate and the second metal plate. The working medium, the first wick structure, and the second wick structure are housed in the internal space. The first wick structure is arranged on the inner surface of the first metal plate. The second wick structure is arranged on the inner surface of the second metal plate. The thickness of the first wick structure is larger than the thickness of the second wick structure.
本開示によると、熱輸送効率を向上できる熱伝導部材を提供することができる。 According to the present disclosure, it is possible to provide a heat conductive member capable of improving heat transport efficiency.
図１は、本開示の実施形態に係る熱伝導部材の斜視図である。FIG. 1 is a perspective view of a heat conductive member according to an embodiment of the present disclosure. 図２は、本開示の実施形態に係る熱伝導部材の模式的な側面断面図である。FIG. 2 is a schematic side sectional view of the heat conductive member according to the embodiment of the present disclosure. 図３は、本開示の実施形態の変形例に係る熱伝導部材の模式的な側面断面図である。FIG. 3 is a schematic side sectional view of the heat conductive member according to the modified example of the embodiment of the present disclosure.
以下、本開示の例示的な実施形態について、図面を参照しつつ説明する。なお、図面においては、適宜、３次元直交座標系としてＸＹＺ座標系を示す。ＸＹＺ座標系において、Ｚ軸方向は、鉛直方向（すなわち上下方向）を示し、＋Ｚ方向が上側（重力方向の反対側）であり、－Ｚ方向が下側（重力方向）である。Ｚ軸方向は、後述する第１金属板１１と第２金属板１２との対向方向でもある。Ｘ軸方向は、Ｚ軸方向と直交する方向を指し、その一方向および逆方向を、それぞれ＋Ｘ方向および－Ｘ方向とする。Ｙ軸方向は、Ｚ軸方向およびＸ軸方向の両方向と直交する方向を指し、その一方向および逆方向を、それぞれ＋Ｙ方向および－Ｙ方向とする。ただし、これは、あくまで説明の便宜のために方向を定義したものであって、本開示に係る熱伝導部材１の製造時および使用時の向きを限定するものではない。また、平行、と表現する場合、数学的に厳密に平行である場合のみを指すものではなく、例えば本開示における効果を奏する程度に平行である場合を含む。　 Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate. In the XYZ coordinate system, the Z-axis direction indicates a vertical direction (that is, a vertical direction), the + Z direction is the upper side (opposite the gravity direction), and the −Z direction is the lower side (gravity direction). The Z-axis direction is also the opposite direction between the first metal plate 11 and the second metal plate 12, which will be described later. The X-axis direction refers to a direction orthogonal to the Z-axis direction, and one direction and the opposite direction thereof are the + X direction and the −X direction, respectively. The Y-axis direction refers to a direction orthogonal to both the Z-axis direction and the X-axis direction, and one direction and the opposite direction thereof are the + Y direction and the −Y direction, respectively. However, this is for convenience of explanation only, and does not limit the orientation of the heat conductive member 1 according to the present disclosure at the time of manufacture and use. In addition, the expression "parallel" does not mean only the case of being mathematically strictly parallel, but includes, for example, the case of being parallel to the extent that the effect in the present disclosure is obtained. It was
また、本明細書において、「焼結」とは、金属の粉末または金属の粉体を含むペーストを、金属の融点よりも低い温度まで加熱して、金属の粒子を焼き固める技術を指す。また、「焼結体」とは、焼結によって得られる物体を指す。　 Further, in the present specification, "sintering" refers to a technique of heating a metal powder or a paste containing a metal powder to a temperature lower than the melting point of the metal to bake and harden the metal particles. Further, the "sintered body" refers to an object obtained by sintering. It was
＜１．熱伝導部材の構成＞



図１は、本開示の例示的な実施形態（以下、本実施形態という）に係る熱伝導部材１の斜視図であり、図２は、熱伝導部材１の模式的な側面断面図である。なお、図２は、図１の一点鎖線Ａ－Ａに沿う断面図である。熱伝導部材１は、ベーパーチャンバーとも呼ばれ、発熱体Ｈの熱を輸送する。発熱体Ｈとしては、例えば、車両の車輪を駆動するためのトラクションモータに備えられるインバータのパワートランジスタが挙げられる。当該パワートランジスタは、例えばＩＧＢＴ（Insulated Gate Bipolar Transistor）である。この場合、熱伝導部材１は、トラクションモータに搭載される。ＩＧＢＴの発熱量は、一般的に１００Ｗ以上である。　 <1. Structure of heat conductive member>



FIG. 1 is a perspective view of a heat conductive member 1 according to an exemplary embodiment of the present disclosure (hereinafter referred to as the present embodiment), and FIG. 2 is a schematic side sectional view of the heat conductive member 1. Note that FIG. 2 is a cross-sectional view taken along the alternate long and short dash line AA of FIG. The heat conductive member 1 is also called a vapor chamber and transports the heat of the heating element H. Examples of the heating element H include a power transistor of an inverter provided in a traction motor for driving a wheel of a vehicle. The power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor). In this case, the heat conductive member 1 is mounted on the traction motor. The calorific value of the IGBT is generally 100 W or more.
熱伝導部材１は、被加熱部１０１と、放熱部１０２と、を備える（図２参照）。被加熱部１０１は、例えば発熱体Ｈと接して配置され、発熱体Ｈが発する熱によって加熱される。放熱部１０２は、被加熱部１０１で加熱された後述の作動媒体２０が有する熱を外部に放出する。また、放熱部１０２には放熱性を向上させるために、放熱フィンやヒートシンク等の熱交換手段（図示せず）が熱的に接続してもよい。その場合、熱交換手段に冷却媒体を流す。冷却媒体は、例えば水や油であってもよいし、空気でもよい。　 The heat conductive member 1 includes a heated portion 101 and a heat radiating portion 102 (see FIG. 2). The heated portion 101 is arranged in contact with the heating element H, for example, and is heated by the heat generated by the heating element H. The heat radiating unit 102 releases the heat of the operating medium 20, which will be described later, heated by the heated unit 101 to the outside. Further, in order to improve heat dissipation, heat exchange means (not shown) such as heat dissipation fins and heat sinks may be thermally connected to the heat dissipation unit 102. In that case, the cooling medium is passed through the heat exchange means. The cooling medium may be, for example, water, oil, or air. It was
熱伝導部材１は、筐体１０と、作動媒体２０と、柱部１５と、第１ウィック構造体３１と、第２ウィック構造体３２と、を備える。被加熱部１０１は、筐体１０の一部により形成される。放熱部１０２は、筐体１０の他の一部により形成される。熱伝導部材１のＺ方向の厚みは、例えば５ｍｍ以上である。　 The heat conductive member 1 includes a housing 10, an actuating medium 20, a pillar portion 15, a first wick structure 31, and a second wick structure 32. The heated portion 101 is formed by a part of the housing 10. The heat radiating portion 102 is formed by another part of the housing 10. The thickness of the heat conductive member 1 in the Z direction is, for example, 5 mm or more. It was
＜１－１．筐体の構成＞



筐体１０は、内部空間１０ａを有する。柱部１５と、作動媒体２０と、第１ウィック構造体３１と、第２ウィック構造体３２と、は内部空間１０ａに配置される。筐体１０は、第１金属板１１と、第１金属板１１に対向して配置されるとともに外面に発熱体Ｈが配置される第２金属板１２とを有する。柱部１５は第１金属板１１と第２金属板１２の間に配置される。柱部１５は、内部空間１０ａに配置され、第１金属板１１及び第２金属板１２を支持する。第１金属板１１及び第２金属板１２として、例えば、銅等の熱伝導性の高い金属を用いている。また、銅以外の金属の表面に銅メッキを施して形成されてもよい。銅以外の金属としては、例えばステンレス鋼が考えられる。　 <1-1. Housing configuration>



The housing 10 has an internal space 10a. The pillar portion 15, the working medium 20, the first wick structure 31, and the second wick structure 32 are arranged in the internal space 10a. The housing 10 has a first metal plate 11 and a second metal plate 12 which is arranged so as to face the first metal plate 11 and in which a heating element H is arranged on an outer surface. The pillar portion 15 is arranged between the first metal plate 11 and the second metal plate 12. The pillar portion 15 is arranged in the internal space 10a and supports the first metal plate 11 and the second metal plate 12. As the first metal plate 11 and the second metal plate 12, for example, a metal having high thermal conductivity such as copper is used. Further, it may be formed by plating the surface of a metal other than copper with copper. As the metal other than copper, for example, stainless steel can be considered.
第１金属板１１及び第２金属板１２は、上面視において水平方向に拡がる矩形の板状である。第２金属板１２の下面には発熱体Ｈが接触する。第１金属板１１は、第２金属板１２の上面を覆う。なお、本実施形態の第１金属板１１及び第２金属板１２は、上面視において四角形であるがこの限りではない。例えば、上面視において複数の角を有する多角形、または円形であってもよい。　 The first metal plate 11 and the second metal plate 12 have a rectangular plate shape that extends in the horizontal direction when viewed from above. The heating element H comes into contact with the lower surface of the second metal plate 12. The first metal plate 11 covers the upper surface of the second metal plate 12. The first metal plate 11 and the second metal plate 12 of the present embodiment are rectangular in top view, but the present invention is not limited to this. For example, it may be a polygon or a circle having a plurality of corners in a top view. It was
第１金属板１１は、周縁から下方に延びる第１側壁部１３ａを有する。第２金属板１２は、周縁から上方に延びる第２側壁部１３ｂを有する。第１側壁部１３ａの下面と第２側壁部１３ｂの上面とが接合部１４で接合される。なお、第２側壁部１３ｂを省いて、第１側壁部１３ａの下面と第２金属板１２の上面とを接合してもよい。または、第１側壁部１３ａを省いて、第２側壁部１３ｂの上面と第１金属板１１の下面とを接合してもよい。　 The first metal plate 11 has a first side wall portion 13a extending downward from the peripheral edge. The second metal plate 12 has a second side wall portion 13b extending upward from the peripheral edge. The lower surface of the first side wall portion 13a and the upper surface of the second side wall portion 13b are joined at the joint portion 14. The lower surface of the first side wall portion 13a and the upper surface of the second metal plate 12 may be joined by omitting the second side wall portion 13b. Alternatively, the upper surface of the second side wall portion 13b and the lower surface of the first metal plate 11 may be joined by omitting the first side wall portion 13a. It was
内部空間１０ａは、第１金属板１１及び第２金属板１２で囲まれて形成される。内部空間１０ａは、密閉空間であり、例えば大気圧よりも気圧が低い減圧状態に維持される。内部空間１０ａが減圧状態であることにより、内部空間１０ａに収容される作動媒体２０が蒸発しやすくなる。作動媒体２０は、例えば水であるが、アルコールなどの他の液体であってもよい。　 The internal space 10a is formed by being surrounded by the first metal plate 11 and the second metal plate 12. The internal space 10a is a closed space, and is maintained in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure, for example. When the internal space 10a is in a decompressed state, the working medium 20 housed in the internal space 10a is likely to evaporate. The working medium 20 is, for example, water, but may be another liquid such as alcohol. It was
接合部１４は、上方視において、第１ウィック構造体３１及び第２ウィック構造体３２の周囲に位置する。第１側壁部１３ａと第２側壁部１３ｂとの接合方法は、特に限定されない。例えば、熱と圧力を加えて接合する方法、拡散接合、ろう材を用いた接合、などのいずれの接合方法であってもよい。　 The joint portion 14 is located around the first wick structure 31 and the second wick structure 32 in the upward view. The method of joining the first side wall portion 13a and the second side wall portion 13b is not particularly limited. For example, any joining method such as a method of joining by applying heat and pressure, a diffusion joining, or a joining using a brazing material may be used. It was
なお、接合部１４は、封止部を含んでいてもよい。封止部は、例えば、熱伝導部材１の製造過程において、作動媒体２０を筐体１０内に注入するための注入口を溶接によって封止した箇所である。　 The joint portion 14 may include a sealing portion. The sealing portion is, for example, a portion where an injection port for injecting the working medium 20 into the housing 10 is sealed by welding in the manufacturing process of the heat conductive member 1. It was
本実施形態において、柱部１５は、第１金属板１１及び第２金属板１２とは別部材であり、内部空間１０ａにおいて、第１金属板１１および第２金属板１２の間に配置され、第１金属板１１及び第２金属板１２を支持する部材である。柱部１５は、例えば、上方視において円形の円柱形状を有する。柱部１５は、ＸＹ面内において２次元的に、かつ、規則的に並んで位置する。Ｚ軸方向において柱部１５が、直接または間接的に第１金属板１１及び第２金属板１２を支持することにより、筐体１０のＺ軸方向の厚みが一定に保たれる。これにより、筐体１０のＺ軸方向の変形によって内部空間１０ａが、狭くなることを抑制できる。　 In the present embodiment, the pillar portion 15 is a separate member from the first metal plate 11 and the second metal plate 12, and is arranged between the first metal plate 11 and the second metal plate 12 in the internal space 10a. It is a member that supports the first metal plate 11 and the second metal plate 12. The pillar portion 15 has, for example, a circular cylindrical shape when viewed upward. The pillar portions 15 are two-dimensionally and regularly arranged side by side in the XY plane. By the pillar portion 15 directly or indirectly supporting the first metal plate 11 and the second metal plate 12 in the Z-axis direction, the thickness of the housing 10 in the Z-axis direction is kept constant. As a result, it is possible to prevent the internal space 10a from becoming narrow due to the deformation of the housing 10 in the Z-axis direction. It was
本実施形態において、柱部１５の少なくとも一部に、中実な部材である第１柱部１６を有する。第１柱部１６は、内部空間１０ａにおいて、第１金属板１１および第２金属板１２の間に配置され、第１金属板１１及び第２金属板１２を支持する。これにより、筐体１０のＺ軸方向の変形が抑制され、内部空間１０ａが狭くなることを抑制できる。なお、「中実」な部材は、いわゆるソリッドな部材であることを意味し、中身が密に詰まっており、且つ多孔質でない物体で構成された部材を指す。例えば、「中実」な部材は、内部に空洞がない部材で合ってもよいし、単数又は複数の巨視的な空洞を内部に有する部材であってもよい。なお中実な部材として、例えば、銅等の熱伝導性の高い金属が用いられている。　 In the present embodiment, at least a part of the pillar portion 15 has a first pillar portion 16 which is a solid member. The first pillar portion 16 is arranged between the first metal plate 11 and the second metal plate 12 in the internal space 10a, and supports the first metal plate 11 and the second metal plate 12. As a result, deformation of the housing 10 in the Z-axis direction can be suppressed, and the internal space 10a can be suppressed from becoming narrow. The "solid" member means a so-called solid member, and refers to a member whose contents are tightly packed and which is composed of a non-porous object. For example, the "solid" member may be a member that does not have a cavity inside, or may be a member that has one or more macroscopic cavities inside. As a solid member, for example, a metal having high thermal conductivity such as copper is used. It was
本実施形態において、柱部１５の少なくとも一部に多孔質の焼結体である第２柱部３３を有する。ここで第２柱部３３は第３ウィック構造体３３である。第３ウィック構造体３３は内部空間１０ａにおいて、第１ウィック構造体３１及び第２ウィック構造体３２の間に配置され、第１ウィック構造体３１及び第２ウィック構造体３２を支持する。第３ウィック構造体３３は、第１ウィック構造体３１及び第２ウィック構造体３２を介して第１金属板１１及び第２金属板１２を支持する。これにより筐体１０のＺ軸方向の変形をより抑制でき、内部空間１０ａが狭くなることを抑制できる。　 In the present embodiment, at least a part of the pillar portion 15 has a second pillar portion 33 which is a porous sintered body. Here, the second pillar portion 33 is the third wick structure 33. The third wick structure 33 is arranged between the first wick structure 31 and the second wick structure 32 in the internal space 10a, and supports the first wick structure 31 and the second wick structure 32. The third wick structure 33 supports the first metal plate 11 and the second metal plate 12 via the first wick structure 31 and the second wick structure 32. As a result, deformation of the housing 10 in the Z-axis direction can be further suppressed, and narrowing of the internal space 10a can be suppressed. It was
すなわち、本実施形態において、柱部１５は中実な部材である第１柱部１６と、多孔質の焼結体である第２柱部３３とをそれぞれ有する。前述の通り第２柱部３３とは、第３ウィック構造体３３である。以後、第２柱部３３は第３ウィック構造体３３として説明する。第３ウィック構造体３３は、隣り合う第１柱部１６の中間に配置されることが好ましい。　 That is, in the present embodiment, the pillar portion 15 has a first pillar portion 16 which is a solid member and a second pillar portion 33 which is a porous sintered body. As described above, the second pillar portion 33 is the third wick structure 33. Hereinafter, the second pillar portion 33 will be described as the third wick structure 33. The third wick structure 33 is preferably arranged in the middle of the adjacent first pillar portions 16. It was
柱部１５のうち、中実な部材である第１柱部１６は、Ｚ軸方向に延び、第１柱部１６の上端部及び下端部は、第１金属板１１の下面及び第２金属板１２の上面にそれぞれろう材を用いて接合される。なお、第１柱部１６は、ろう材による接合以外に溶接などにより第１金属板１１及び第２金属板１２と接合されてもよい。なお、第１柱部１６は、第１金属板１１及び第２金属板１２の一方と一体であってもよい。このとき、第１柱部１６は、第１金属板１１又は第２金属板１２をエッチング又は切削して形成することができる。　 Of the pillars 15, the first pillar 16, which is a solid member, extends in the Z-axis direction, and the upper and lower ends of the first pillar 16 are the lower surface of the first metal plate 11 and the second metal plate. Each of the upper surfaces of 12 is joined using a brazing material. The first pillar portion 16 may be joined to the first metal plate 11 and the second metal plate 12 by welding or the like, in addition to joining with a brazing material. The first pillar portion 16 may be integrated with one of the first metal plate 11 and the second metal plate 12. At this time, the first pillar portion 16 can be formed by etching or cutting the first metal plate 11 or the second metal plate 12. It was
＜１－２．第１ウィック構造体、第２ウィック構造体、第３ウィック構造体の構成＞



第１ウィック構造体３１、第２ウィック構造体３２及び第３ウィック構造体３３は、多孔質であり、作動媒体２０の流路を形成する空隙部（不図示）を有する。第１ウィック構造体３１は、第１金属板１１の内面に配置されて内部空間１０ａに臨む。第２ウィック構造体３２は、第２金属板１２の内面に配置されて内部空間１０ａに臨む。なお、本明細書において、内部空間１０ａに「臨む」とは、内部空間１０ａと「向かい合う」ことを指す。　 <1-2. Configuration of 1st wick structure, 2nd wick structure, 3rd wick structure>



The first wick structure 31, the second wick structure 32, and the third wick structure 33 are porous and have a gap portion (not shown) forming a flow path of the working medium 20. The first wick structure 31 is arranged on the inner surface of the first metal plate 11 and faces the internal space 10a. The second wick structure 32 is arranged on the inner surface of the second metal plate 12 and faces the internal space 10a. In addition, in this specification, "facing" the interior space 10a means "facing" the interior space 10a.
また、第１ウィック構造体３１と、第２ウィック構造体３２と、第３ウィック構造体３３とは、それぞれ多孔質の焼結体であり、一体である。第１ウィック構造体３１、第２ウィック構造体３２及び第３ウィック構造体３３を多孔質の焼結体とすることにより、メッシュ材よりも容易に製造可能であり、熱伝導部材１の製造コストを下げることができる。また、第３ウィック構造体３３を設けることにより、第１ウィック構造体３１から第２ウィック構造体３２への作動媒体２０の流路を増やすことができる。　 Further, the first wick structure 31, the second wick structure 32, and the third wick structure 33 are porous sintered bodies, respectively, and are integrated with each other. By using the first wick structure 31, the second wick structure 32, and the third wick structure 33 as porous sintered bodies, it is possible to manufacture the first wick structure 31, the second wick structure 32, and the third wick structure 33 more easily than the mesh material, and the manufacturing cost of the heat conductive member 1 is high. Can be lowered. Further, by providing the third wick structure 33, the flow path of the operating medium 20 from the first wick structure 31 to the second wick structure 32 can be increased. It was
第１ウィック構造体３１の厚みＷ１は、第２ウィック構造体３２の厚みＷ２よりもＺ方向に大きい。被加熱部１０１において、発熱体Ｈ側に配置される第２ウィック構造体３２が配置され、第２ウィック構造体３２に含まれる液状の作動媒体２０が気化する。気化した作動媒体２０は、内部空間１０ａを放熱部１０２側に移動する。このとき、気化した作動媒体２０の一部は、第１ウィック構造体３１に接触して冷却され、凝縮する。このため、第１ウィック構造体３２の厚みＷ１を、第２ウィック構造体３２の厚みＷ２よりもＺ方向に大きくすることにより、第１ウィック構造体３１の作動媒体２０の保持性を第２ウィック構造体３２の作動媒体２０の保持性よりも高くできる。したがって、作動媒体２０が循環しやすくなり、熱輸送効率を向上させることができる。第１ウィック構造体３１は、第２よりも表面積が大きく冷却効率が高い。このため、第１ウィック構造体３１を設けることにより、気化した作動媒体２０の冷却効率が向上して凝縮が促進される。　 The thickness W1 of the first wick structure 31 is larger in the Z direction than the thickness W2 of the second wick structure 32. In the heated portion 101, the second wick structure 32 arranged on the heating element H side is arranged, and the liquid working medium 20 contained in the second wick structure 32 is vaporized. The vaporized working medium 20 moves the internal space 10a toward the heat radiating portion 102. At this time, a part of the vaporized working medium 20 comes into contact with the first wick structure 31 to be cooled and condensed. Therefore, by making the thickness W1 of the first wick structure 32 larger in the Z direction than the thickness W2 of the second wick structure 32, the holding property of the working medium 20 of the first wick structure 31 is increased by the second wick. It can be higher than the retention of the working medium 20 of the structure 32. Therefore, the working medium 20 can be easily circulated, and the heat transport efficiency can be improved. The first wick structure 31 has a larger surface area and higher cooling efficiency than the second one. Therefore, by providing the first wick structure 31, the cooling efficiency of the vaporized working medium 20 is improved and condensation is promoted. It was
さらに、Ｚ方向（第１金属板１１及び第２金属板１２の対向方向）において、第１ウィック構造体３１の厚みＷ１と、第２ウィック構造体３２の厚みＷ２と、第１ウィック構造体３１と第２ウィック構造体３２との隙間の長さＷ３とは、式（１）を満たすことが好ましい。　 Further, in the Z direction (opposite direction of the first metal plate 11 and the second metal plate 12), the thickness W1 of the first wick structure 31, the thickness W2 of the second wick structure 32, and the first wick structure 31. It is preferable that the length W3 of the gap between the second wick structure 32 and the second wick structure 32 satisfies the equation (1). It was
Ｗ３＞Ｗ２＋Ｗ１　・・・（１）　 W3> W2 + W1 ... (1)
内部空間１０ａにおいて、第１ウィック構造体３１と第２ウィック構造体３２とのＺ方向の隙間を大きく設けることにより、第２ウィック構造体３２から気化した作動媒体２０が、内部空間１０ａ内でＸＹ面内に拡散し易くなる。これにより、第１ウィック構造体３１における作動媒体２０の凝縮が促進される。　 By providing a large gap in the Z direction between the first wick structure 31 and the second wick structure 32 in the internal space 10a, the working medium 20 vaporized from the second wick structure 32 is XY in the internal space 10a. It becomes easy to diffuse in the plane. This promotes the condensation of the working medium 20 in the first wick structure 31. It was
さらに、Ｚ方向（第１金属板１１及び第２金属板１２の対向方向）において、第１ウィック構造体３１の厚みＷ１と、第２ウィック構造体３２の厚みＷ２と、第１ウィック構造体３１と第２ウィック構造体３２との隙間の長さＷ３とは、式（２）～式（４）を満たすことがより好ましい。　 Further, in the Z direction (opposite direction of the first metal plate 11 and the second metal plate 12), the thickness W1 of the first wick structure 31, the thickness W2 of the second wick structure 32, and the first wick structure 31. It is more preferable that the length W3 of the gap between the metal and the second wick structure 32 satisfies the formulas (2) to (4). It was
４Ｗ２≧Ｗ１≧２Ｗ２　・・・（２）



７Ｗ２≧Ｗ３≧５Ｗ２　・・・（３）



Ｗ３＋Ｗ１＝９Ｗ２　・・・（４）


4W2 ≧ W1 ≧ 2W2 ・ ・ ・ (2)



7W2 ≧ W3 ≧ 5 W2 ・ ・ ・ (3)



W3 + W1 = 9W2 ... (4)
すなわち、第１ウィック構造体３２の厚みＷ１を第２ウィック構造体３２の厚みＷ２の２倍以上４倍以下とし、第１ウィック構造体３１と第２ウィック構造体３２との隙間の長さＷ３を第２ウィック構造体３２の厚みＷ２の５倍以上７倍以下とすることが好ましい。これにより、第１ウィック構造体３１を第２ウィック構造体３２よりも厚くすることで、第１ウィック構造体３１における作動媒体２０の凝縮をより促進することができる。　 That is, the thickness W1 of the first wick structure 32 is set to be twice or more and four times or less the thickness W2 of the second wick structure 32, and the length of the gap between the first wick structure 31 and the second wick structure 32 is W3. Is preferably 5 times or more and 7 times or less the thickness W2 of the second wick structure 32. Thereby, by making the first wick structure 31 thicker than the second wick structure 32, the condensation of the working medium 20 in the first wick structure 31 can be further promoted. It was
一方、発熱体Ｈと反対側の放熱面側に配置される第１ウィック構造体３１は、第２ウィック構造体３２よりも気化した作動媒体２０の凝縮が、促進される。このため、第１ウィック構造体３１は、第２ウィック構造体３２と比べて作動媒体２０の冷却効率が高いことが好ましい。　 On the other hand, the first wick structure 31 arranged on the heat radiating surface side opposite to the heating element H promotes the condensation of the vaporized working medium 20 as compared with the second wick structure 32. Therefore, it is preferable that the first wick structure 31 has a higher cooling efficiency of the working medium 20 than the second wick structure 32. It was
また、第２ウィック構造体３２は、第１ウィック構造体３１よりも空隙率が高い。これにより、第２ウィック構造体３２の毛細管力が、第１ウィック構造体３１の毛細管力よりも大きくなる。　 Further, the second wick structure 32 has a higher porosity than the first wick structure 31. As a result, the capillary force of the second wick structure 32 becomes larger than the capillary force of the first wick structure 31. It was
ここで、第１ウィック構造体３１及び第２ウィック構造体３２の全体積に対する空間の体積の割合を、空隙率と呼ぶ。空隙率の単位は％である。空隙率は以下の方法によって求められる。例えば、ウィック構造体の断面写真から、空間の面積を測定し、空間の面積が全体に占める割合を算出することにより、空隙率を求めることができる。第１ウィック構造体３１及び第２ウィック構造体３２の断面の観察においては、被写界深度の深い走査型電子顕微鏡を用いることが好ましい。なお、断面の観察の方法は、金属部分と空間とを容易に判別できる方法であればよく、特に限定されない。　 Here, the ratio of the volume of the space to the total product of the first wick structure 31 and the second wick structure 32 is referred to as a porosity. The unit of porosity is%. The porosity is determined by the following method. For example, the porosity can be obtained by measuring the area of the space from the cross-sectional photograph of the wick structure and calculating the ratio of the area of the space to the whole. When observing the cross sections of the first wick structure 31 and the second wick structure 32, it is preferable to use a scanning electron microscope having a deep depth of field. The method of observing the cross section is not particularly limited as long as it can easily distinguish between the metal portion and the space. It was
なお、本実施形態では、第１ウィック構造体３１及び第２ウィック構造体３２を多孔質の焼結体で構成しているが、第１ウィック構造体３１又は第２ウィック構造体３２を複数の金属線状部材が編み込まれたメッシュ部材であってもよい。第２ウィック構造体３２をメッシュ材で構成し、第１ウィック構造体３１を多孔質の焼結体で構成することにより、第２ウィック構造体３２の毛細管力を、第１ウィック構造体３１の毛細管力よりも大きく容易に形成することができる。　 In the present embodiment, the first wick structure 31 and the second wick structure 32 are made of a porous sintered body, but the first wick structure 31 or the second wick structure 32 is a plurality of pieces. It may be a mesh member in which a metal linear member is woven. By constructing the second wick structure 32 with a mesh material and the first wick structure 31 with a porous sintered body, the capillary force of the second wick structure 32 can be reduced to that of the first wick structure 31. It is larger than the capillary force and can be easily formed. It was
また、第１ウィック構造体３１又は第２ウィック構造体３２を第１金属板１１の内面及び第２金属板１２の内面に形成された複数の溝部により構成してもよい。これにより、メッシュ材及び焼結体で構成する場合と比べて第１ウィック構造体３１又は第２ウィック構造体３２を薄く形成できる。従って、内部空間１０ａをＺ軸方向に広げることができる。また、内部空間１０ａを狭めずに筐体１０をＺ軸方向に薄型化できる。また、第１ウィック構造体３１又は第２ウィック構造体３２の一方を溝部で構成ことにより、内部空間１０ａを狭めずに第１ウィック構造体３１又は第２ウィック構造体３２のＺ軸方向の厚みを大きくできる。　 Further, the first wick structure 31 or the second wick structure 32 may be composed of a plurality of grooves formed on the inner surface of the first metal plate 11 and the inner surface of the second metal plate 12. As a result, the first wick structure 31 or the second wick structure 32 can be formed thinner than in the case of being composed of the mesh material and the sintered body. Therefore, the internal space 10a can be expanded in the Z-axis direction. Further, the housing 10 can be made thinner in the Z-axis direction without narrowing the internal space 10a. Further, by forming one of the first wick structure 31 and the second wick structure 32 with a groove portion, the thickness of the first wick structure 31 or the second wick structure 32 in the Z-axis direction without narrowing the internal space 10a. Can be increased. It was
第１ウィック構造体３１、第２ウィック構造体３２及び第３ウィック構造体３３は、例えば、以下のように形成される。まず、マイクロ銅粒子、銅体及び樹脂を含む金属粉体を接合前の第１金属板１１の下面及び第２金属板１２の上面に吹き付け塗布する。次に、柱状に成形した金属粉体を挟んで第１金属板１１及び第２金属板１２を接合する。その後、筐体１０を加熱して金属粉体を焼成する。これにより、筐体１０の内部空間１０ａに、第１ウィック構造体３１と、第２ウィック構造体３２と、第３ウィック構造体３３と、を、容易に一体に形成できる。これにより、熱伝導部材１の製造コストを抑制することができる。なお、第１ウィック構造体３１、第２ウィック構造体３２及び第３ウィック構造体３３を別々に焼成した後に、第１金属板１１及び第２金属板１２を接合してもよい。　 The first wick structure 31, the second wick structure 32, and the third wick structure 33 are formed, for example, as follows. First, a metal powder containing micro copper particles, a copper body and a resin is sprayed and applied to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12 before joining. Next, the first metal plate 11 and the second metal plate 12 are joined by sandwiching the metal powder formed into a columnar shape. After that, the housing 10 is heated to fire the metal powder. As a result, the first wick structure 31, the second wick structure 32, and the third wick structure 33 can be easily integrally formed in the internal space 10a of the housing 10. As a result, the manufacturing cost of the heat conductive member 1 can be suppressed. The first metal plate 11 and the second metal plate 12 may be joined after the first wick structure 31, the second wick structure 32, and the third wick structure 33 are separately fired. It was
なお、本明細書において、「塗布」とは、第１金属板１１の下面及び第２金属板１２の上面に金属粉体を付着させることを指す。吹き付け塗布する方法以外に、金属粉体を直接塗布してもよい。　 In addition, in this specification, "coating" means adhering metal powder to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12. In addition to the spray coating method, the metal powder may be directly applied. It was
マイクロ銅粒子は、複数の銅原子が凝集または結合した粒子である。マイクロ銅粒子の粒径は、１μｍ以上１ｍｍ未満である。マイクロ銅粒子は、例えば多孔質である。　 Micro copper particles are particles in which a plurality of copper atoms are aggregated or bonded. The particle size of the micro copper particles is 1 μm or more and less than 1 mm. The micro copper particles are, for example, porous. It was
銅体は、マイクロ銅粒子よりも小さいサブマイクロ銅粒子が焼結により溶融して固まった銅溶融体である。サブマイクロ銅粒子は、複数の銅原子が凝集または結合した粒子である。溶融前のサブマイクロ銅粒子の粒径は、０．１μｍ以上１μｍ未満である。　 The copper body is a copper melt obtained by melting and solidifying sub-micro copper particles smaller than the micro copper particles by sintering. Submicro copper particles are particles in which a plurality of copper atoms are aggregated or bonded. The particle size of the sub-micro copper particles before melting is 0.1 μm or more and less than 1 μm. It was
樹脂は、マイクロ銅粒子および銅体を構成する銅の融点以下の温度で揮発する揮発性の樹脂である。このような揮発性の樹脂としては、例えば、メチルセルロース、エチルセルロースなどのセルロース樹脂、アクリル樹脂、ブチラール樹脂、アルキド樹脂、エポキシ樹脂、フェノール樹脂などを用いることができる。これらの中では、熱分解性の高いアクリル樹脂を用いることが好ましい。　 The resin is a volatile resin that volatilizes at a temperature below the melting point of the copper constituting the micro copper particles and the copper body. As such a volatile resin, for example, a cellulose resin such as methyl cellulose or ethyl cellulose, an acrylic resin, a butyral resin, an alkyd resin, an epoxy resin, a phenol resin or the like can be used. Among these, it is preferable to use an acrylic resin having high thermal decomposability. It was
＜２．熱伝導部材の動作＞



図２において、作動媒体２０が気化して生成される蒸気の流れを熱伝導部材１内の黒矢印で示し、液状の作動媒体２０の流れを熱伝導部材１内の白抜き矢印で示す。　 <2. Operation of heat conductive member>



In FIG. 2, the flow of steam generated by vaporizing the working medium 20 is indicated by a black arrow in the heat conductive member 1, and the flow of the liquid working medium 20 is indicated by a white arrow in the heat conductive member 1.
上記の構成の熱伝導部材では、発熱体Ｈで発生した熱により、被加熱部１０１が加熱される。被加熱部１０１の温度が上昇すると、第２ウィック構造体３２に含まれた液状の作動媒体２０が、気化する。　 In the heat conductive member having the above configuration, the heated portion 101 is heated by the heat generated by the heating element H. When the temperature of the heated portion 101 rises, the liquid working medium 20 contained in the second wick structure 32 is vaporized. It was
気化した作動媒体２０は、内部空間１０ａを放熱部１０２側に移動する。このとき、気化した作動媒体２０の一部は、第１ウィック構造体３１に接触して冷却され、凝縮する。第１ウィック構造体３１は、第１金属板１１の下面よりも表面積が大きく冷却効率が高い。このため、第１ウィック構造体３１を設けることにより、気化した作動媒体２０の冷却効率が向上して凝縮が促進される。　 The vaporized working medium 20 moves the internal space 10a toward the heat radiating portion 102. At this time, a part of the vaporized working medium 20 comes into contact with the first wick structure 31 to be cooled and condensed. The first wick structure 31 has a larger surface area and higher cooling efficiency than the lower surface of the first metal plate 11. Therefore, by providing the first wick structure 31, the cooling efficiency of the vaporized working medium 20 is improved and condensation is promoted. It was
第１ウィック構造体３１で凝縮した作動媒体２０の一部は、滴下して第２ウィック構造体３２に吸収される。また、第１ウィック構造体３１で凝縮した作動媒体２０の一部は、第１ウィック構造体３１中及び第３ウィック構造体３３中を移動して第２ウィック構造体３２に吸収される。また、第１ウィック構造体３１で凝縮した作動媒体２０の一部は、第１柱部１６の外面に沿って移動して第２ウィック構造体３２に吸収される。　 A part of the working medium 20 condensed in the first wick structure 31 is dropped and absorbed in the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves in the first wick structure 31 and the third wick structure 33 and is absorbed by the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves along the outer surface of the first pillar portion 16 and is absorbed by the second wick structure 32. It was
放熱部１０２に移動した気化した作動媒体２０は、放熱部１０２で冷却されて凝縮する。凝縮した作動媒体２０は、毛細管現象によって第２ウィック構造体３２中を被加熱部１０１に向かって移動する。また、第１ウィック構造体３１から第２ウィック構造体３２に吸収された作動媒体２０も、毛細管現象によって第２ウィック構造体３２中を被加熱部１０１に向かって移動する。　 The vaporized working medium 20 that has moved to the heat radiating unit 102 is cooled by the heat radiating unit 102 and condensed. The condensed working medium 20 moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. Further, the working medium 20 absorbed from the first wick structure 31 to the second wick structure 32 also moves in the second wick structure 32 toward the heated portion 101 due to the capillary phenomenon. It was
このとき、第２ウィック構造体３２の毛細管力は、第１ウィック構造体３１の毛細管力よりも高いため、第２ウィック構造体３２を介して凝縮した作動媒体２０を発熱体Ｈが配置される被加熱部１０１により早く移動させることができる。従って、作動媒体２０による熱輸送効率が向上する。　 At this time, since the capillary force of the second wick structure 32 is higher than the capillary force of the first wick structure 31, the heating element H is arranged on the working medium 20 condensed through the second wick structure 32. It can be moved faster by the heated portion 101. Therefore, the heat transport efficiency by the working medium 20 is improved. It was
また、第１ウィック構造体３１の厚みＷ１を、第２ウィック構造体３２の厚みＷ２よりもＺ方向に大きくし、発熱体ＨとＺ方向に重なる領域において、作動媒体２０の輸送効率を向上させる。これにより、第１ウィック構造体３１中において、被加熱部１０１に向かって液状の作動媒体２０を連続して円滑に移動させることができる。従って、作動媒体２０の熱輸送効率の低下を抑制できる。　 Further, the thickness W1 of the first wick structure 31 is made larger in the Z direction than the thickness W2 of the second wick structure 32, and the transport efficiency of the working medium 20 is improved in the region overlapping the heating element H in the Z direction. .. As a result, the liquid working medium 20 can be continuously and smoothly moved toward the heated portion 101 in the first wick structure 31. Therefore, it is possible to suppress a decrease in the heat transport efficiency of the working medium 20. It was
上記のように作動媒体２０が状態変化を伴いながら移動することにより、被加熱部１０１側から放熱部１０２側への熱輸送が連続的に行われる。　 As the working medium 20 moves while changing its state as described above, heat is continuously transferred from the heated portion 101 side to the heat radiating portion 102 side. It was
＜３．蒸気空間について＞



蒸気空間Ｓは、第１ウィック構造体３１と第２ウィック構造体３２との間の隙間空間から第１柱部１６および第３ウィック構造体３３により占有される空間を除いた空間である。すなわち、蒸気空間Ｓは、内部空間１０ａにおける第１ウィック構造体３１、第２ウィック構造体３２、第３ウィック構造体３３及び第１柱部１６以外の空間である。　 <3. About steam space ＞



The steam space S is a space excluding the space occupied by the first pillar portion 16 and the third wick structure 33 from the gap space between the first wick structure 31 and the second wick structure 32. That is, the steam space S is a space other than the first wick structure 31, the second wick structure 32, the third wick structure 33, and the first pillar portion 16 in the internal space 10a.
そして、本実施形態では、下記式（５）が満たされる。



Ｖ１＞Ｖ２　・・・（５）



ただし、Ｖ１：蒸気空間Ｓの体積、Ｖ２：合計体積　 Then, in this embodiment, the following equation (5) is satisfied.



V1> V2 ... (5)



However, V1: the volume of the steam space S, V2: the total volume
このとき、合計体積は、第１ウィック構造体３１、第２ウィック構造体３２及び第３ウィック構造体３３の各体積を合計した体積である。すなわち、本実施形態において、合計体積は、第１ウィック構造体３１及び第２ウィック構造体３２の合計体積に第３ウィック構造体３３の体積をさらに含む。　 At this time, the total volume is the total volume of each of the first wick structure 31, the second wick structure 32, and the third wick structure 33. That is, in the present embodiment, the total volume further includes the volume of the third wick structure 33 in the total volume of the first wick structure 31 and the second wick structure 32. It was
なお、本実施形態では、第３ウィック構造体３３が設けられているが、第３ウィック構造体３３が設けられていない場合、合計体積は、第１ウィック構造体３１及び第２ウィック構造体３２の各体積を合計して算出される。　 In this embodiment, the third wick structure 33 is provided, but when the third wick structure 33 is not provided, the total volume is the first wick structure 31 and the second wick structure 32. It is calculated by summing up each volume of. It was
このようにすることで、蒸気空間Ｓの体積を確保し、作動媒体２０の蒸気の拡散を促進することができる。従って、熱伝導部材１の熱輸送効率を向上させることができる。　 By doing so, it is possible to secure the volume of the steam space S and promote the diffusion of the steam of the working medium 20. Therefore, the heat transport efficiency of the heat conductive member 1 can be improved. It was
また、第１柱部１６は、筐体１０の強度を確保することができるが、配置することにより蒸気空間Ｓが狭くなる要因となり、そのような第１柱部１６を設ける場合でも上記式（５）を満たすことで蒸気の拡散を促進できる。　 Further, although the strength of the housing 10 can be ensured by the first pillar portion 16, the arrangement of the first pillar portion 16 causes the steam space S to become narrower, and even when such a first pillar portion 16 is provided, the above equation ( By satisfying 5), the diffusion of vapor can be promoted. It was
また、上記式（５）より、蒸気空間Ｓの体積は、第１ウィック構造体３１と第２ウィック構造体３２と第３ウィック構造体３３との各体積の総和よりも大きくなるので、蒸気の拡散を促進できる。　 Further, from the above equation (5), the volume of the steam space S is larger than the sum of the volumes of the first wick structure 31, the second wick structure 32, and the third wick structure 33. Can promote diffusion. It was
＜４．第１柱部と第３ウィック構造体＞



本実施形態では、第１柱部１６と第３ウィック構造体３３は、次のような構成であることが好ましい。　 <4. 1st pillar and 3rd wick structure>



In the present embodiment, the first pillar portion 16 and the third wick structure 33 preferably have the following configurations.
第１柱部１６の上面と第１金属板１１の下面とが接合される接合面積の総和は、第３ウィック構造体３３の上面と第１ウィック構造体３１の下面とが接合される接合面積の総和よりも大きい。かつ、第１柱部１６の下面と第２金属板１２の上面とが接合される接合面積の総和は、第３ウィック構造体３３の下面と第２ウィック構造体３２の上面とが接合される接合面積の総和よりも大きい。なお、接合面積の総和とは、１本の第１柱部１６または第３ウィック構造体３３についての接合面積のすべての本数分の総和のことである。 The total joint area where the upper surface of the first pillar portion 16 and the lower surface of the first metal plate 11 are joined is the joint area where the upper surface of the third wick structure 33 and the lower surface of the first wick structure 31 are joined. Is larger than the sum of. Further, the total joint area where the lower surface of the first pillar portion 16 and the upper surface of the second metal plate 12 are joined is such that the lower surface of the third wick structure 33 and the upper surface of the second wick structure 32 are joined. It is larger than the total joint area. The total joint area is the total number of joint areas of one first pillar portion 16 or the third wick structure 33.
ただし、図３に変形例を示すように、第３ウィック構造体３３が第１ウィック構造体３１を貫通して第１金属板１１に接合されるとともに、第２ウィック構造体３２を貫通して第２金属板１２に接合されてもよい。このような場合には、第１柱部１６の上面と第１金属板１１の下面とが接合される接合面積の総和は、第３ウィック構造体３３の上面と第１金属板１１の下面とが接合される接合面積の総和よりも大きい。かつ、第１柱部１６の下面と第２金属板１２の上面とが接合される接合面積の総和は、第３ウィック構造体３３の下面と第２金属板１２の上面とが接合される接合面積の総和よりも大きい。　 However, as shown in the modified example in FIG. 3, the third wick structure 33 penetrates the first wick structure 31 and is joined to the first metal plate 11 and also penetrates the second wick structure 32. It may be joined to the second metal plate 12. In such a case, the total joint area where the upper surface of the first pillar portion 16 and the lower surface of the first metal plate 11 are joined is the upper surface of the third wick structure 33 and the lower surface of the first metal plate 11. Is larger than the total joint area to which is joined. The total joint area where the lower surface of the first pillar portion 16 and the upper surface of the second metal plate 12 are joined is the joint where the lower surface of the third wick structure 33 and the upper surface of the second metal plate 12 are joined. It is larger than the total area. It was
すなわち、第１柱部１６の一方側端部が第１金属板１１と接する接触面積の総和は、第３ウィック構造体３３の一方側端部が第１ウィック構造体３１または第１金属板１１と接する接触面積の総和よりも広く、かつ、第１柱部１６の他方側端部が第２金属板１２と接する接触面積の総和は、第３ウィック構造体３３の他方側端部が第２ウィック構造体３２または第２金属板１２と接する接触面積の総和よりも広い。　 That is, the total contact area of the one-sided end of the first pillar 16 in contact with the first metal plate 11 is such that the one-sided end of the third wick structure 33 is the first wick structure 31 or the first metal plate 11. The total contact area that is wider than the total contact area in contact with the second metal plate 12 and that the other side end portion of the first pillar portion 16 is in contact with the second metal plate 12 is such that the other side end portion of the third wick structure 33 is second. It is wider than the total contact area in contact with the wick structure 32 or the second metal plate 12. It was
中実な第１柱部１６の強度は、第３ウィック構造体３３の強度よりも高い。従って、上記のような接触面積の大小関係により、第３ウィック構造体３３を用いる構成であっても、第１柱部１６によって筐体１０の強度を十分に確保することができる。　 The strength of the solid first pillar portion 16 is higher than the strength of the third wick structure 33. Therefore, due to the magnitude relationship of the contact area as described above, the strength of the housing 10 can be sufficiently secured by the first pillar portion 16 even in the configuration using the third wick structure 33. It was
＜５．その他＞



以上、本開示の実施形態を説明した。なお、本開示の範囲は上述の実施形態に限定されない。本開示は、発明の主旨を逸脱しない範囲で上述の実施形態に種々の変更を加えて実施することができる。また、上述の実施形態で説明した事項は、矛盾を生じない範囲で適宜任意に組み合わせることができる。 <5. Others>



The embodiments of the present disclosure have been described above. The scope of the present disclosure is not limited to the above-described embodiment. The present disclosure can be carried out by making various modifications to the above-described embodiments without departing from the gist of the invention. In addition, the items described in the above-described embodiments can be arbitrarily combined as long as they do not cause a contradiction.
例えば、第１ウィック構造体３１をメッシュ材で構成し、第２ウィック構造体３２を多孔質の焼結体で構成してもよい。または、第３ウィック構造体３３を設けないようにしてもよい。　 For example, the first wick structure 31 may be made of a mesh material, and the second wick structure 32 may be made of a porous sintered body. Alternatively, the third wick structure 33 may not be provided. It was
本開示の実施形態では柱部１５は第１柱部１６と第３ウィック構造体３３が混在するとしたが、柱部１５はすべてが第１柱部１６でもよく、すべてが第３ウィック構造体３３でもよい。　 In the embodiment of the present disclosure, the pillar portion 15 is a mixture of the first pillar portion 16 and the third wick structure 33, but the pillar portion 15 may be all the first pillar portion 16 and all may be the third wick structure 33. But it may be. It was
各種発熱体の冷却に利用することができる。 It can be used for cooling various heating elements.
１　　　熱伝導部材　　１０　　　筐体　　１０ａ　　内部空間　　１１　　　第１金属板　　１２　　　第２金属板　　１３ａ　　第１側壁部　　１３ｂ　　第２側壁部　　１４　　　接合部　　１５　　　柱部　　１６　　　第１柱部　　２０　　　作動媒体　　３１　　　第１ウィック構造体　　３２　　　第２ウィック構造体　　３３　　　第２柱部、第３ウィック構造体　　　Ｈ　　　発熱体   1 Heat conductive member 10 Housing 10a Internal space 11 1st metal plate 12 2nd metal plate 13a 1st side wall 13b 2nd side wall 14 Joining part 15 Pillar part 16 1st pillar part 20 32, 2nd wick structure, 33, 2nd pillar, 3rd wick structure, H, heating element,

Claims (14)

  1. 内部空間を有する筐体と、



    第１ウィック構造体と、



    第２ウィック構造体と、



    作動媒体と、



    柱部と、を備え、



    前記筐体は、



    第１金属板と、前記第１金属板に対向して配置されるとともに外面に発熱体が配置される第２金属板と、を有し、



    前記柱部は、



    前記第１金属板及び前記第２金属板の間に配置され、



    前記作動媒体と、前記第１ウィック構造体と、前記第２ウィック構造体とは、前記内部空間に収容され、



    前記第１ウィック構造体は、前記第１金属板の内面に配置され、



    前記第２ウィック構造体は、前記第２金属板の内面に配置され、



    前記第１ウィック構造体の厚みは、前記第２ウィック構造体の厚みよりも大きい、熱伝導部材。     A housing with an internal space and



    The first wick structure and



    The second wick structure and



    The working medium and



    With pillars,



    The housing is



    It has a first metal plate and a second metal plate which is arranged so as to face the first metal plate and in which a heating element is arranged on an outer surface.



    The pillar is



    Arranged between the first metal plate and the second metal plate,



    The working medium, the first wick structure, and the second wick structure are housed in the internal space.



    The first wick structure is arranged on the inner surface of the first metal plate.



    The second wick structure is arranged on the inner surface of the second metal plate.



    A heat conductive member having a thickness of the first wick structure larger than the thickness of the second wick structure.
  2. 前記第１ウィック構造体は、多孔質の焼結体である、請求項１に記載の熱伝導部材。 The heat conductive member according to claim 1, wherein the first wick structure is a porous sintered body.
  3. 前記第２ウィック構造体は、複数の金属線状部材が編み込まれたメッシュ部材である、請求項１又は請求項２に記載の熱伝導部材。 The heat conductive member according to claim 1 or 2, wherein the second wick structure is a mesh member in which a plurality of metal linear members are woven.
  4. 前記第２ウィック構造体は、多孔質の焼結体である、請求項１または請求項２に記載の熱伝導部材。 The heat conductive member according to claim 1 or 2, wherein the second wick structure is a porous sintered body.
  5. 前記柱部は、少なくとも一部に多孔質の焼結体である第３ウィック構造体を有し、前記第３ウィック構造体は、前記第１金属板と前記第２金属板の間に配置される、請求項１から請求項４のいずれかに記載の熱伝導部材。 The pillar portion has a third wick structure which is a porous sintered body at least in a part thereof, and the third wick structure is arranged between the first metal plate and the second metal plate. The heat conductive member according to any one of claims 1 to 4.
  6. 前記第１ウィック構造体と、前記第２ウィック構造体と、前記第３ウィック構造体とが、一体である、請求項５に記載の熱伝導部材。 The heat conductive member according to claim 5, wherein the first wick structure, the second wick structure, and the third wick structure are integrated.
  7. 前記柱部は、第１柱部と、第２柱部とを有し、



    前記第１柱部は、中実な部材であり、



    前記第２柱部は、多孔質の焼結体である前記第３ウィック構造体である、請求項１から請求項６のいずれかに記載の熱伝導部材。     The pillar portion has a first pillar portion and a second pillar portion.



    The first pillar portion is a solid member and is a solid member.



    The heat conductive member according to any one of claims 1 to 6, wherein the second pillar portion is the third wick structure which is a porous sintered body.
  8. 前記第１金属板及び前記第２金属板の鉛直方向において、前記第１ウィック構造体と前記第２ウィック構造体との隙間の長さと、前記第２ウィック構造体の厚みと、前記第１ウィック構造体の厚みとは、下記式（１）を満たす、請求項１から請求項７のいずれかに記載の熱伝導部材。



    Ｗ３＞Ｗ２＋Ｗ１　・・・（１）



    Ｗ１：第１ウィック構造体の厚み



    Ｗ２：第２ウィック構造体の厚み



    Ｗ３：前記第１ウィック構造体と前記第２ウィック構造体との隙間の長さ     The length of the gap between the first wick structure and the second wick structure, the thickness of the second wick structure, and the first wick in the vertical direction of the first metal plate and the second metal plate. The heat conductive member according to any one of claims 1 to 7, wherein the thickness of the structure satisfies the following formula (1).



    W3> W2 + W1 ... (1)



    W1: Thickness of the first wick structure



    W2: Thickness of the second wick structure



    W3: Length of the gap between the first wick structure and the second wick structure
  9. 前記第１金属板及び前記第２金属板の前記鉛直方向において、前記第１ウィック構造体と前記第２ウィック構造体との隙間の長さと、前記第２ウィック構造体の厚みと、前記第１ウィック構造体の厚みとは、下記式（２）から式（４）を満たす、請求項１から請求項８のいずれかに記載の熱伝導部材。



    ４Ｗ２≧Ｗ１≧２Ｗ２　・・・（２）



    ７Ｗ２≧Ｗ３≧５Ｗ２　・・・（３）



    Ｗ３＋Ｗ１＝９Ｗ２　・・・（４）     The length of the gap between the first wick structure and the second wick structure in the vertical direction of the first metal plate and the second metal plate, the thickness of the second wick structure, and the first. The heat conductive member according to any one of claims 1 to 8, wherein the thickness of the wick structure satisfies the following formulas (2) to (4).



    4W2 ≧ W1 ≧ 2W2 ・ ・ ・ (2)



    7W2 ≧ W3 ≧ 5 W2 ・ ・ ・ (3)



    W3 + W1 = 9W2 ... (4)
  10. 前記内部空間における前記第１ウィック構造体、前記第２ウィック構造体、前記第１柱部及び第２柱部以外の空間に含まれ、前記作動媒体の蒸気が存在しうる蒸気空間の体積と、前記第１ウィック構造体及び前記第２ウィック構造体の合計体積とは、下記式（５）を満たす、請求項１から請求項９のいずれかに記載の熱伝導部材。



    Ｖ１＞Ｖ２　・・・（５）



    Ｖ１：前記内部空間における前記第１ウィック構造体、前記第２ウィック構造体、前記第１柱部及び第２柱部以外の空間に含まれ、前記作動媒体の蒸気が存在しうる蒸気空間の体積



    Ｖ２：前記第１ウィック構造体及び前記第２ウィック構造体の合計体積     The volume of the steam space included in the space other than the first wick structure, the second wick structure, the first pillar portion and the second pillar portion in the internal space, and in which the steam of the working medium can exist, and the volume of the steam space. The heat conductive member according to any one of claims 1 to 9, wherein the total volume of the first wick structure and the second wick structure satisfies the following formula (5).



    V1> V2 ... (5)



    V1: Volume of the steam space included in the space other than the first wick structure, the second wick structure, the first pillar portion and the second pillar portion in the internal space, and in which the steam of the working medium can exist.



    V2: Total volume of the first wick structure and the second wick structure
  11. 前記合計体積は、前記第２柱部の体積をさらに含む、請求項１０に記載の熱伝導部材。 The heat conductive member according to claim 10, wherein the total volume further includes the volume of the second pillar portion.
  12. 前記内部空間内に配置され、前記第１ウィック構造体と、前記第２ウィック構造体と、



    少なくとも１つの前記第２柱部を有し、



    前記第１柱部の一方側端部が前記第１金属板と接する接触面積の総和は、前記第２柱部の一方側端部が前記第１ウィック構造体または前記第１金属板と接する接触面積の総和よりも広く、かつ、前記第１柱部の他方側端部が前記第２金属板と接する接触面積の総和は、前記第第２柱部の他方側端部が前記第２ウィック構造体または前記第２金属板と接する接触面積の総和よりも広い、請求項１から請求項７のいずれかに記載の熱伝導部材。     The first wick structure, the second wick structure, and the like, which are arranged in the internal space,



    It has at least one said second pillar portion and has at least one said second pillar portion.



    The total contact area of the one-sided end of the first pillar in contact with the first metal plate is the contact in which one end of the second pillar is in contact with the first wick structure or the first metal plate. The total area is wider than the total area, and the total contact area where the other end of the first pillar is in contact with the second metal plate is such that the other end of the second pillar has the second wick structure. The heat conductive member according to any one of claims 1 to 7, which is wider than the total contact area in contact with the body or the second metal plate.
  13. 前記第２ウィック構造体は、前記第１ウィック構造体よりも空隙率が高い、請求項４から請求項１２のいずれかに記載の熱伝導部材。 The heat conductive member according to any one of claims 4 to 12, wherein the second wick structure has a higher porosity than the first wick structure.
  14. 前記第２ウィック構造体の毛細管力は、前記第１ウィック構造体の毛細管力よりも高い、請求項１から請求項１３のいずれかに記載の熱伝導部材。  The heat conductive member according to any one of claims 1 to 13, wherein the capillary force of the second wick structure is higher than the capillary force of the first wick structure. The
PCT/JP2021/028347 2020-07-31 2021-07-30 Heat conduction member WO2022025252A1 (en)

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JP2020131230 2020-07-31
JP2020-131230 2020-07-31
JP2020-192030 2020-11-18
JP2020192030A JP2023127008A (en) 2020-11-18 2020-11-18 Heat conductive member

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170065U (en) * 2011-06-20 2011-09-01 奇▲こう▼科技股▲ふん▼有限公司 Structure of plate heat pipe
WO2019230385A1 (en) * 2018-05-29 2019-12-05 古河電気工業株式会社 Vapor chamber

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170065U (en) * 2011-06-20 2011-09-01 奇▲こう▼科技股▲ふん▼有限公司 Structure of plate heat pipe
WO2019230385A1 (en) * 2018-05-29 2019-12-05 古河電気工業株式会社 Vapor chamber

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