WO2022025256A1 - Élément de conduction thermique - Google Patents

Élément de conduction thermique Download PDF

Info

Publication number
WO2022025256A1
WO2022025256A1 PCT/JP2021/028351 JP2021028351W WO2022025256A1 WO 2022025256 A1 WO2022025256 A1 WO 2022025256A1 JP 2021028351 W JP2021028351 W JP 2021028351W WO 2022025256 A1 WO2022025256 A1 WO 2022025256A1
Authority
WO
WIPO (PCT)
Prior art keywords
wick structure
metal plate
conductive member
heat conductive
porous
Prior art date
Application number
PCT/JP2021/028351
Other languages
English (en)
Japanese (ja)
Inventor
征志 高尾
仕▲ゆ▼ 楊
敏彦 小関
雅昭 花野
淳一 石田
Original Assignee
日本電産株式会社
尼得科超▲しゅう▼科技股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021088004A external-priority patent/JP2023127013A/ja
Application filed by 日本電産株式会社, 尼得科超▲しゅう▼科技股▲ふん▼有限公司 filed Critical 日本電産株式会社
Publication of WO2022025256A1 publication Critical patent/WO2022025256A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat conductive member.
  • the conventional heat conductive member has a flat plate-shaped closed container, a porous sheet, and a working fluid.
  • the porous sheet is arranged on the inner surface of the flat plate-shaped closed container.
  • the working fluid is housed inside a flat plate-shaped closed container. It was
  • the flat plate-shaped closed container is arranged in contact with the heating element.
  • Porous sheets are arranged on the inner surface of the flat plate-shaped closed container on the heating element side and the inner surface of the flat plate-shaped closed container on the heat radiation surface side opposite to the heating element side.
  • the working fluid is heated by the heating element and vaporized from the porous sheet on the heat generating side.
  • the vaporized working fluid condenses on the porous sheet on the heat dissipation surface side. As a result, heat is transported from the heating element side to the heat radiating surface side (see, for example, Patent Document 1).
  • the heat conductive member as described above has a problem that the condensation of the working fluid is biased to a predetermined position on the porous sheet on the heat dissipation surface side, and the heat transport efficiency is low. It was
  • An object of the present invention is to provide a heat conductive member capable of improving heat transport efficiency.
  • An exemplary heat conductive member of the present invention includes a housing having an internal space, a first wick structure, a second wick structure, and an actuating medium.
  • the housing has a first metal plate, a second metal plate, and a pillar portion arranged in an internal space.
  • the second metal plate is arranged so as to face the first metal plate, and a heating element is arranged on the outer surface.
  • the working medium, the first wick structure, and the second wick structure are housed in the internal space.
  • the first wick structure is arranged on the inner surface of the first metal plate.
  • the second wick structure is arranged on the inner surface of the second metal plate.
  • the first wick structure has recesses recessed in the facing direction from the inner surface in at least a part of the first region overlapping the heating element in the facing direction of the first metal plate and the second metal plate.
  • FIG. 1 is a perspective view of a heat conductive member according to the present embodiment.
  • FIG. 2 is a schematic side sectional view of the heat conductive member according to the present embodiment.
  • FIG. 3 is a schematic side sectional view of the heat conductive member according to the modified example of the present embodiment.
  • the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate.
  • the Z-axis direction indicates a vertical direction (that is, a vertical direction)
  • the + Z direction is the upper side (opposite the gravity direction)
  • the ⁇ Z direction is the lower side (gravity direction).
  • the Z-axis direction is also the opposite direction between the first metal plate 11 and the second metal plate 12, which will be described later.
  • the X-axis direction refers to a direction orthogonal to the Z-axis direction, and one direction and the opposite direction thereof are the + X direction and the ⁇ X direction, respectively.
  • the Y-axis direction refers to a direction orthogonal to both the Z-axis direction and the X-axis direction, and one direction and the opposite direction thereof are the + Y direction and the ⁇ Y direction, respectively.
  • this defines the direction only for convenience of explanation, and does not limit the direction at the time of manufacturing and the time of use of the heat conductive member 1 according to the present invention.
  • "parallel” does not mean only the case of being mathematically strictly parallel, but includes, for example, the case of being parallel to the extent that the effect in the present disclosure is exhibited.
  • sining refers to a technique of heating a metal powder or a metal powder to a temperature lower than the melting point of the metal to bake and harden the metal particles.
  • sintered body refers to an object obtained by sintering. It was
  • FIG. 1 is a perspective view of a heat conductive member 1 according to an exemplary embodiment of the present invention
  • FIG. 2 is a schematic side sectional view of the heat conductive member 1.
  • FIG. 2 is a cross-sectional view taken along the alternate long and short dash line AA of FIG.
  • the heat conductive member 1 is also called a vapor chamber and transports the heat of the heating element H.
  • the heating element H include a power transistor of an inverter provided in a traction motor for driving a wheel of a vehicle.
  • the power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor).
  • the heat conductive member 1 is mounted on the traction motor.
  • the calorific value of the IGBT is generally 100 W or more.
  • a heating element H is arranged in contact with the lower surface of the heat conductive member 1.
  • the heat generated by the heating element H is dissipated from the upper surface of the heat conductive member 1.
  • heat dissipation fins such as stacked fins and pin fins may be provided on the upper surface of the heat conductive member 1.
  • a cooling medium is passed between the heat radiation fins.
  • the cooling medium may be, for example, water, oil, or air. It was
  • one heating element H is arranged at the center of the lower surface of the rectangular heat conductive member 1.
  • the heating element H may be arranged on the lower surface edge portion of the heat conductive member 1.
  • a plurality of heating elements H may be arranged on the lower surface of the heat conductive member 1.
  • the heat conductive member 1 includes a housing 10, an actuating medium 20, a first wick structure 31, and a second wick structure 32.
  • the thickness of the heat conductive member 1 in the Z direction is, for example, 5 mm or more. It was
  • the housing 10 has an internal space 10a.
  • the working medium 20, the first wick structure 31, and the second wick structure 32 are housed in the internal space 10a.
  • the housing 10 has a first metal plate 11 and a second metal plate 12 arranged to face each other, and at least one pillar portion 15.
  • the pillar portion 15 is arranged in the internal space 10a.
  • the first metal plate 11 and the second metal plate 12 are made of a metal having high thermal conductivity such as copper. Further, it may be formed by plating the surface of a metal other than copper with copper. As the metal other than copper, for example, stainless steel can be considered. It was
  • the first metal plate 11 and the second metal plate 12 have a rectangular plate shape that extends in the horizontal direction when viewed from above.
  • the heating element H is arranged in contact with the outer surface of the second metal plate 12.
  • the first metal plate 11 covers the upper surface of the second metal plate 12.
  • the first metal plate 11 and the second metal plate 12 of the present embodiment are rectangular in top view, but the present invention is not limited to this. For example, it may be a polygon or a circle having a plurality of corners in a top view. It was
  • the first metal plate 11 has a first side wall portion 13a extending downward from the peripheral edge.
  • the second metal plate 12 has a second side wall portion 13b extending upward from the peripheral edge.
  • the lower surface of the first side wall portion 13a and the upper surface of the second side wall portion 13b are joined at the joint portion 14.
  • the lower surface of the first side wall portion 13a and the upper surface of the second metal plate 12 may be joined by omitting the second side wall portion 13b.
  • the upper surface of the second side wall portion 13b and the lower surface of the first metal plate 11 may be joined by omitting the first side wall portion 13a.
  • the internal space 10a is formed by being surrounded by the first metal plate 11 and the second metal plate 12.
  • the internal space 10a is a closed space, and is maintained in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure, for example.
  • the working medium 20 housed in the internal space 10a is likely to evaporate.
  • the working medium 20 is, for example, water, but may be another liquid such as alcohol. It was
  • the joint portion 14 is located around the first wick structure 31 and the second wick structure 32 in the upward view.
  • the method of joining the first side wall portion 13a and the second side wall portion 13b is not particularly limited.
  • any joining method such as a method of joining by applying heat and pressure, a diffusion joining, or a joining using a brazing material may be used. It was
  • the joint portion 14 may include a sealing portion.
  • the sealing portion is, for example, a portion where an injection port for injecting the working medium 20 into the housing 10 is sealed by welding in the manufacturing process of the heat conductive member 1. It was
  • the pillar portion 15 has at least one solid solid pillar portion 151 and at least one porous porous pillar portion 152.
  • the solid pillar portion 151 is a separate member from the first metal plate 11 and the second metal plate 12, and is a solid member. It is a solid member.
  • the "solid” member means a so-called solid member, and refers to a member whose contents are tightly packed and which is composed of a non-porous object.
  • a "solid” member may have a cavity inside, which may be an internal member, or may be a member having one or more macroscopic cavities inside. It was
  • the solid pillar portion 151 is made of a metal having high thermal conductivity such as copper.
  • the solid pillar portion 151 extends in the Z-axis direction, and the upper end portion and the lower end portion of the solid pillar portion 151 are joined to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12, respectively, using a brazing material.
  • the solid column portion 151 may be joined to the first metal plate 11 and the second metal plate 12 by welding or the like, in addition to joining with a brazing material.
  • the solid pillar portion 151 may be integrated with one of the first metal plate 11 and the second metal plate 12. At this time, the solid pillar portion 151 can be formed by etching or cutting the first metal plate 11 or the second metal plate 12. It was
  • the solid pillar portion 151 is composed of, for example, a circular cylinder in an upward view.
  • the solid pillar portions 151 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the porous column portion 152 is a porous column.
  • the porous column portion 152 has a void portion (not shown) that forms a flow path of the working medium 20.
  • the porous column portion 152 extends in the Z-axis direction and is composed of, for example, a circular cylinder when viewed upward. Further, the porous column portions 152 are two-dimensionally and regularly arranged side by side in the XY plane.
  • the porous column portion 152 is preferably arranged in the middle of the adjacent solid column portions 151. It was
  • the first wick structure 31 and the second wick structure 32 are porous and have a gap portion (not shown) forming a flow path of the working medium 20.
  • the first wick structure 31 is a plate-shaped member arranged on the inner surface of the first metal plate 11, and is arranged on the cooling side opposite to the heating element H side.
  • the second wick structure 32 is a plate-shaped member arranged on the inner surface of the second metal plate 12, and is arranged on the heating element H side.
  • the first wick structure 31 and the second wick structure 32 are arranged so as to face each other.
  • a vapor space S is formed between the first wick structure 31 and the second wick structure 32.
  • the steam space S is a space for diffusing the steam of the working medium 20. It was
  • the porous column portion 152 supports the first metal plate 11 and the second metal plate 12 via the first wick structure 31 and the second wick structure 32. As a result, the porous pillar portion 152 can reinforce the solid pillar portion 151 and further suppress the deformation of the housing 10 in the Z-axis direction. It was
  • first wick structure 31, the second wick structure 32, and the porous column portion 152 are porous sintered bodies, respectively, and are integrated with each other.
  • first wick structure 31, the second wick structure 32, and the porous column portion 152 are porous sintered bodies, respectively, and are integrated with each other.
  • the first wick structure 31 arranged on the heat radiation surface side opposite to the heating element H promotes the condensation of the vaporized working medium 20 as compared with the second wick structure 32. Therefore, it is preferable that the first wick structure 31 has a higher cooling efficiency of the working medium 20 than the second wick structure 32. It was
  • the first wick structure 31 has a recess 31a in at least a part of the first region U1 that overlaps the heating element H in the Z direction (the direction opposite to the first metal plate 11 and the second metal plate 12).
  • the recess 31a is recessed in the Z direction from the inner surface of the first wick structure 31. It was
  • the thickness W1a of the first wick structure 31 in the recess 31a is formed to be smaller than the thickness W1b of the first wick structure 31 in the region other than the recess 31a.
  • the cooling efficiency is lowered.
  • the cooling efficiency in the region other than the recess 31a is higher than the cooling efficiency in the recess 31a.
  • the condensation of the working medium 20 is most promoted in the first region U1 facing the heating element H in the Z direction.
  • the condensation of the working medium 20 in the first region U1 can be suppressed.
  • the vaporized working medium 20 diffuses into the second region U2, and the condensation of the working medium 20 in the second region U2 can be promoted. Therefore, the working medium 20 is condensed in the entire first wick structure 31, and the heat generated by the condensation of the working medium 20 can be efficiently dissipated to the heat radiating surface side in the entire first metal plate 11. Thereby, the heat transfer efficiency by the working medium 20 can be improved. It was
  • the recess 31a is formed so that the inner surface of the first wick structure 31 is recessed in the Z direction, but the recess 31a may be formed so as to penetrate the first wick structure 31 in the Z direction. Further, although the upper surface of the recess 31a is formed on a surface parallel to the first metal plate 11, it may be formed in a valley shape. That is, the thickness W1a of the first wick structure 31 in the recess 31a is gradually formed to be smaller toward a predetermined position in the first region U1. As a result, it is possible to prevent the condensation from being biased to a predetermined position in the first region U1. It was
  • the thickness W1a of the first wick structure 31 in the recess 31a is preferably 10% or more smaller than the thickness W2 of the second wick structure 32. This makes it possible to further suppress the condensation of the working medium 20 in the recess 31a. It was
  • the entire recess 31a does not have to overlap with the first region U1 in the Z direction.
  • the end portion of the recess 31a may overlap with the second region U2 in the Z direction. It was
  • the thickness W2 of the second wick structure 32 in the first region U1 is larger in the Z direction than the thickness W1a of the first wick structure 31.
  • the second wick structure 32 arranged on the heating element H side promotes the vaporization of the liquid working medium 20 as compared with the first wick structure 31. Therefore, by increasing the thickness W2 of the second wick structure 32 in the Z direction with respect to the thickness W1a of the first wick structure 31, the holding property of the working medium 20 of the second wick structure 32 is improved by the first wick. It can be higher than the retention of the working medium 20 of the structure 31. It was
  • the liquid working medium 20 held by the second wick structure 32 in the first region U1 overlapping the heating element H in the Z direction. can suppress the occurrence of so-called dryout, which is completely vaporized. It was
  • the working medium 20 vaporized from the second wick structure 32 is XY in the internal space 10a. It becomes easy to diffuse in the plane. This promotes the condensation of the working medium 20 in the first wick structure 31.
  • the same effect can be obtained by applying the thickness W1b of the first wick structure 31 in the second region U2 to the equation (1) instead of the thickness W1a of the first wick structure 31 in the first region U1. It was
  • the thickness W1a of the first wick structure 31 in the Z direction (opposite direction of the first metal plate 11 and the second metal plate 12), the thickness W2 of the second wick structure 32, and the first It is more preferable that the length W3 of the gap between the 1-wick structure 31 and the 2nd wick structure 32 satisfies the equations (2) to (4). It was
  • the thickness W2 of the second wick structure 32 is set to be twice or more and four times or less the thickness W1a of the first wick structure 31 in the first region U1, and the first wick structure 31 and the second wick structure 32 are combined.
  • the gap length W3 is preferably 5 times or more and 7 times or less the thickness W1a of the first wick structure 31 in the first region U1. This makes it possible to further promote the condensation of the working medium 20 in the first wick structure 31 while ensuring the retention of the working medium 20 in the second wick structure 32.
  • the same effect can be obtained by applying the thickness W1b of the first wick structure 31 in the second region U2 to the equations (2) to (4) instead of the thickness W1a of the first wick structure 31 in the first region U1. Is obtained. It was
  • the second wick structure 32 has a higher porosity than the first wick structure 31. As a result, the capillary force of the second wick structure 32 becomes larger than the capillary force of the first wick structure 31. It was
  • the ratio of the volume of the space to the total product of the first wick structure 31 and the second wick structure 32 is referred to as a porosity.
  • the unit of porosity is%.
  • the porosity is determined by the following method. For example, the porosity can be obtained by measuring the area of the space from the cross-sectional photograph of the wick structure and calculating the ratio of the area of the space to the whole.
  • a scanning electron microscope having a deep depth of field. The method of observing the cross section is not particularly limited as long as it can easily distinguish between the metal portion and the space. It was
  • the first wick structure 31 and the second wick structure 32 are made of a porous sintered body, but the first wick structure 31 or the second wick structure 32 is a plurality of pieces. It may be a mesh member in which a metal linear member is woven.
  • the capillary force of the second wick structure 32 can be reduced to that of the first wick structure 31. It is larger than the capillary force and can be easily formed. It was
  • first wick structure 31 or the second wick structure 32 may be composed of a plurality of grooves formed on the inner surface of the first metal plate 11 and the inner surface of the second metal plate 12.
  • the first wick structure 31 or the second wick structure 32 can be formed thinner than in the case of being composed of the mesh material and the sintered body. Therefore, the internal space 10a can be expanded in the Z-axis direction. Further, the housing 10 can be made thinner in the Z-axis direction without narrowing the internal space 10a. Further, by forming one of the first wick structure 31 and the second wick structure 32 with a groove portion, the thickness of the first wick structure 31 or the second wick structure 32 in the Z-axis direction without narrowing the internal space 10a. Can be increased. It was
  • the first wick structure 31, the second wick structure 32, and the porous column portion 152 are formed, for example, as follows. First, a mixed powder containing micro copper particles, a copper body and a resin is sprayed and applied to the lower surface of the first metal plate 11 and the upper surface of the second metal plate 12 before joining. Next, the first metal plate 11 and the second metal plate 12 are joined by sandwiching the mixed powder formed in a columnar shape. After that, the housing 10 is heated to bake the mixed powder. As a result, the first wick structure 31, the second wick structure 32, and the porous pillar portion 152 can be easily integrally formed in the internal space 10a of the housing 10. As a result, the manufacturing cost of the heat conductive member 1 can be suppressed. The first metal plate 11 and the second metal plate 12 may be joined after the first wick structure 31, the second wick structure 32, and the porous column portion 152 are fired separately. It was
  • coating means adhering mixed powder to the lower surface of the 1st metal plate 11 and the upper surface of the 2nd metal plate 12.
  • a paste containing a mixed powder may be applied. It was
  • Micro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the micro copper particles is 1 ⁇ m or more and less than 1 mm.
  • the micro copper particles are, for example, porous. It was
  • the copper body is a copper melt obtained by melting and solidifying sub-micro copper particles smaller than the micro copper particles by sintering.
  • Submicro copper particles are particles in which a plurality of copper atoms are aggregated or bonded.
  • the particle size of the sub-micro copper particles before melting is 0.1 ⁇ m or more and less than 1 ⁇ m. It was
  • the resin is a volatile resin that volatilizes at a temperature below the melting point of the copper constituting the micro copper particles and the copper body.
  • a volatile resin for example, a cellulose resin such as methyl cellulose or ethyl cellulose, an acrylic resin, a butyral resin, an alkyd resin, an epoxy resin, a phenol resin or the like can be used.
  • an acrylic resin having high thermal decomposability. It was
  • the working medium 20 that has been vaporized into steam diffuses in the steam space S.
  • the steam space S is a space excluding the space occupied by the solid pillar portion 151 and the porous pillar portion 152 from the gap space between the first wick structure 31 and the second wick structure 32. It was
  • the first wick structure 31 has a larger surface area and higher cooling efficiency than the lower surface of the first metal plate 11. Therefore, by providing the first wick structure 31, the cooling efficiency of the vaporized working medium 20 is improved and condensation is promoted. It was
  • a part of the working medium 20 condensed in the first wick structure 31 is dropped and absorbed in the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves in the first wick structure 31 and in the porous column portion 152 and is absorbed by the second wick structure 32. Further, a part of the working medium 20 condensed in the first wick structure 31 moves along the outer surface of the solid pillar portion 151 and is absorbed by the second wick structure 32. It was
  • the condensed working medium 20 moves in the second wick structure 32 toward the first region U1 due to the capillary phenomenon. Further, the working medium 20 absorbed from the first wick structure 31 to the second wick structure 32 also moves in the second wick structure 32 toward the first region U1 due to the capillary phenomenon. It was
  • the heating element H is arranged on the working medium 20 condensed through the second wick structure 32. It can be moved to a position faster. Therefore, the heat transport efficiency by the working medium 20 is improved. It was
  • the thickness W2 of the second wick structure 32 is made larger in the Z direction than the thickness W1a or W1b of the first wick structure 31, and the occurrence of dryout is suppressed in the region facing the heating element H in the Z direction. do.
  • the liquid working medium 20 can be continuously and smoothly moved toward the first region U1 in the second wick structure 32. Therefore, it is possible to suppress a decrease in the heat transport efficiency of the working medium 20 due to the occurrence of dryout. It was
  • the working medium 20 moves while changing its state, so that heat is continuously transferred from the heating element H side to the cooling side. It was
  • the steam space S is a space excluding the space occupied by the solid pillar portion 151 and the porous pillar portion 152 from the gap space between the first wick structure 31 and the second wick structure 32. Is. That is, the steam space S is a space other than the first wick structure 31, the second wick structure 32, the porous pillar portion 152, and the solid pillar portion 151 in the internal space 10a.
  • V1 the volume of the steam space S
  • V2 the total volume
  • the total volume is the total volume of each of the first wick structure 31, the second wick structure 32, and the porous column portion 152. That is, in the present embodiment, the total volume further includes the volume of the porous column portion 152 in the total volume of the first wick structure 31 and the second wick structure 32. It was
  • the porous pillar portion 152 is provided, but when the porous pillar portion 152 is not provided, the total volume is each of the first wick structure 31 and the second wick structure 32. Calculated by summing up the volumes. Further, when the solid pillar portion 151 is not provided, the steam space S is a space other than the first wick structure 31, the second wick structure 32, and the porous pillar portion 152 in the internal space 10a. It was
  • the solid pillar portion 151 can secure the strength of the housing 10, arranging the solid pillar portion 151 causes a factor that the steam space S becomes narrow, and even when such a solid pillar portion 151 is provided, the above equation ( By satisfying 5), the diffusion of vapor can be promoted.
  • the volume of the steam space S is larger than the sum of the volumes of the first wick structure 31, the second wick structure 32, and the porous column portion 152. It was
  • Pillar part 15 preferably has the following configuration.
  • the total joint area where the upper surface of the solid column portion 151 and the lower surface of the first metal plate 11 are joined is the joint area where the upper surface of the porous column portion 152 and the lower surface of the first wick structure 31 are joined. Greater than the sum.
  • the total joint area where the lower surface of the solid column portion 151 and the upper surface of the second metal plate 12 are joined is the joint where the lower surface of the porous column portion 152 and the upper surface of the second wick structure 32 are joined. It is larger than the total area.
  • the total joint area is the total number of joint areas of one solid column portion 151 or the porous column portion 152. It was
  • the porous column portion 152 penetrates the first wick structure 31 and is joined to the first metal plate 11 and also penetrates the second wick structure 32 to form a second. 2 It may be joined to the metal plate 12.
  • the total joint area where the upper surface of the solid pillar portion 151 and the lower surface of the first metal plate 11 are joined is such that the upper surface of the porous pillar portion 152 and the lower surface of the first metal plate 11 are joined together. It is larger than the total joint area to be joined.
  • the total joint area where the lower surface of the solid pillar portion 151 and the upper surface of the second metal plate 12 are joined is the joint area where the lower surface of the porous pillar portion 152 and the upper surface of the second metal plate 12 are joined. Is larger than the sum of. It was
  • the total contact area of the solid pillar portion 151 where one side end is in contact with the first metal plate 11 is such that the one side end of the porous pillar portion 152 is the first wick structure 31 or the first metal plate 11.
  • the total contact area is wider than the total contact area and the other end of the solid column 151 is in contact with the second metal plate 12, and the other end of the porous column 152 has a second wick structure. It is wider than the total contact area in contact with the body 32 or the second metal plate 12.
  • the strength of the solid solid pillar portion 151 is higher than the strength of the porous pillar portion 152. Therefore, due to the size relationship of the contact area as described above, the strength of the housing 10 can be sufficiently secured by the solid pillar portion 151 even in the configuration using the porous pillar portion 152. It was
  • the first wick structure 31 may be made of a mesh material
  • the second wick structure 32 may be made of a porous sintered body.
  • at least one of the solid pillar portion 151 and the porous pillar portion 152 may not be provided. It was
  • the present invention can be used for cooling various heating elements.
  • heat conductive member 10 housing 10a internal space 11 1st metal plate 12 2nd metal plate 13a 1st side wall 13b 2nd side wall 14 joint 15 pillar part 151 solid pillar part 152 1st wick structure 31a recess 32 2nd wick structure H heating element S steam space U1 1st area U2 2nd area

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention est pourvue d'une première structure de mèche, d'une deuxième structure de mèche, d'un milieu de travail et d'un boîtier ayant un espace interne. Le boîtier comprend une première plaque métallique, une deuxième plaque métallique et une partie colonne positionnée dans l'espace interne. La deuxième plaque métallique est positionnée de manière à faire face à la première plaque métallique, et un corps chauffant est positionné sur la surface extérieure de la deuxième plaque métallique. Le milieu de travail, la première structure de mèche et la deuxième structure de mèche sont logés dans l'espace interne. La première structure de mèche est disposée sur la surface intérieure de la première plaque métallique. La deuxième structure de mèche est disposée sur la surface intérieure de la deuxième plaque métallique. La première structure de mèche comprend, dans au moins une partie d'une première région chevauchant le corps chauffant dans la direction opposée dans laquelle la première plaque métallique et la deuxième plaque métallique se font face, un renfoncement dans la direction opposée à la surface intérieure.
PCT/JP2021/028351 2020-07-31 2021-07-30 Élément de conduction thermique WO2022025256A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020-131230 2020-07-31
JP2020131230 2020-07-31
JP2020183308 2020-10-30
JP2020-183308 2020-10-30
JP2021088004A JP2023127013A (ja) 2020-10-30 2021-05-25 熱伝導部材
JP2021-088004 2021-05-25

Publications (1)

Publication Number Publication Date
WO2022025256A1 true WO2022025256A1 (fr) 2022-02-03

Family

ID=80035788

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/028351 WO2022025256A1 (fr) 2020-07-31 2021-07-30 Élément de conduction thermique

Country Status (1)

Country Link
WO (1) WO2022025256A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005525529A (ja) * 2002-05-15 2005-08-25 リー， シェ−ウィン マルチウィック構造をもつ蒸気増強ヒートシンク
US20090025910A1 (en) * 2007-07-27 2009-01-29 Paul Hoffman Vapor chamber structure with improved wick and method for manufacturing the same
CN104896983A (zh) * 2014-03-07 2015-09-09 江苏格业新材料科技有限公司 一种超薄泡沫银为吸液芯的均热板制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005525529A (ja) * 2002-05-15 2005-08-25 リー， シェ−ウィン マルチウィック構造をもつ蒸気増強ヒートシンク
US20090025910A1 (en) * 2007-07-27 2009-01-29 Paul Hoffman Vapor chamber structure with improved wick and method for manufacturing the same
CN104896983A (zh) * 2014-03-07 2015-09-09 江苏格业新材料科技有限公司 一种超薄泡沫银为吸液芯的均热板制造方法

Similar Documents

Publication Publication Date Title
WO2018198354A1 (fr) Chambre à vapeur
US20200240718A1 (en) Vapor chamber
US10495387B2 (en) Multi-layer wick structures with surface enhancement and fabrication methods
JP7097308B2 (ja) ウィック構造体及びウィック構造体を収容したヒートパイプ
US11740029B2 (en) Vapor chamber
CN112033197A (zh) 均温板及其制造方法
CN112747619B (zh) 均温板
WO2022025256A1 (fr) Élément de conduction thermique
WO2022025255A1 (fr) Élément de conduction thermique
WO2022025253A1 (fr) Élément thermoconducteur
WO2022025254A1 (fr) Élément de conduction thermique
WO2018198350A1 (fr) Chambre à vapeur
WO2022025249A1 (fr) Élément de conduction thermique
WO2022025257A1 (fr) Élément conducteur de chaleur
WO2022025252A1 (fr) Élément de conduction thermique
WO2022025251A1 (fr) Élément de conduction thermique
JP2023127011A (ja) 熱伝導部材
WO2022025258A1 (fr) Élément de conduction thermique
JP2023127013A (ja) 熱伝導部材
JP2023127009A (ja) 熱伝導部材
JP2023127010A (ja) 熱伝導部材
WO2022025259A1 (fr) Élément thermoconducteur
JP2023127008A (ja) 熱伝導部材
JP2023123890A (ja) 熱伝導部材
WO2022025261A1 (fr) Élément de conduction thermique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21848680

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21848680

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP