WO2022024350A1 - Procédé de montage et dispositif de montage - Google Patents

Procédé de montage et dispositif de montage Download PDF

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Publication number
WO2022024350A1
WO2022024350A1 PCT/JP2020/029455 JP2020029455W WO2022024350A1 WO 2022024350 A1 WO2022024350 A1 WO 2022024350A1 JP 2020029455 W JP2020029455 W JP 2020029455W WO 2022024350 A1 WO2022024350 A1 WO 2022024350A1
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WO
WIPO (PCT)
Prior art keywords
component
mounting
substrate
detection
mounting position
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Application number
PCT/JP2020/029455
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English (en)
Japanese (ja)
Inventor
英俊 川合
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2020/029455 priority Critical patent/WO2022024350A1/fr
Priority to DE112020007469.2T priority patent/DE112020007469T5/de
Priority to CN202080102357.4A priority patent/CN115769691A/zh
Priority to JP2022539947A priority patent/JPWO2022024350A1/ja
Publication of WO2022024350A1 publication Critical patent/WO2022024350A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops

Definitions

  • This disclosure relates to a mounting method and a mounting device for adsorbing components and mounting them on a substrate.
  • Patent Document 1 describes a mounting device for mounting a component on a substrate by lowering a suction nozzle holding the component by driving a motor.
  • the board region is divided into a first region, which is a region near the clamp and a region near the backup, and the remaining second region other than the first region, and the load at the time of mounting is acquired and acquired.
  • the descending speed of the suction nozzle is determined based on the load.
  • the descent speed of the suction nozzle is determined for the purpose of preventing damage to parts during mounting, and shortening of the mounting time is not considered.
  • the present disclosure provides a mounting method and a mounting device capable of further shortening the mounting time.
  • the mounting method of the present disclosure is a mounting method in which a component is mounted on a substrate by using a suction member capable of moving up and down by driving a drive source to suck the component, and the component is sucked.
  • a detection step for detecting that the suction member descends to the mounting position of the component on the board and touches the board via the component, and a detection section for detecting by the detection step are set for each mounting position of the component on the board. It has a configurable setting step.
  • the detection section for detecting that the suction member to which the component is attracted comes into contact with the substrate via the component can be set for each mounting position of the component on the board, that is, the component is mounted. Since the length of the detection section can be changed according to the condition of the board at the position, it is possible to further shorten the mounting time.
  • FIG. 1 It is a perspective view which shows the appearance of the mounting apparatus which concerns on one Embodiment of this disclosure. It is sectional drawing of the mounting head included in the mounting apparatus of FIG. It is a block diagram which showed the control system of the mounting apparatus of FIG. 1 simply. It is a flowchart which shows the procedure of the mounting process executed by the CPU in FIG. It is a flowchart which shows the continuation procedure of the mounting process of FIG. It is a figure which shows an example of the setting of the touchdown detection section for each mounting position. It is a figure which shows the schematic structure of another example of a mounting head.
  • FIG. 1 shows an outline of the configuration of the mounting device 10.
  • the left-right direction is the X-axis direction
  • the front-back direction is the Y-axis direction
  • the up-down direction is the Z-axis direction.
  • the mounting device 10 is a device that performs a mounting process for mounting the component P on the substrate S, and includes a base 11, a housing 12 supported by the base 11, a board transport unit 20, a backup unit 30, and a component. It includes a supply unit 40, a mounting head 50, an XY robot 60, and a control device 90 (see FIG. 3).
  • the substrate transport unit 20 includes a pair of side frames 22 arranged at predetermined intervals in the Y-axis direction, and a conveyor belt 24 provided on each of the pair of side frames 22. , The substrate S is conveyed by orbiting the conveyor belt 24. Further, the substrate transfer unit 20 is provided with a clamper (not shown) that can be raised and lowered, and by raising the clamper and pushing up the substrate S while the substrate S is mounted on the conveyor belt 24, the substrate S is pushed up. The substrate S is pressed against the holding portion 26 at the upper end of the side frame 22. As a result, the substrate S is sandwiched and clamped between the clamper and the holding portion 26.
  • the backup unit 30 includes a backup plate 32 that can be raised and lowered by an elevating device (not shown), and a plurality of backup pins 34 that are erected on the backup plate 32.
  • the backup unit 30 backs up the substrate S from the back surface side by the backup pin 34 by raising the backup plate 32 in a state where the substrate S conveyed by the substrate transport unit 20 is clamped.
  • the parts supply unit 40 includes a feeder unit 42 and a tray unit 44.
  • the feeder unit 42 sends out the carrier tape by the feeder from the reel around which the carrier tape containing a plurality of parts is wound, and supplies the parts to the supply position.
  • the carrier tape is composed of a bottom tape made of paper or the like in which component accommodating portions are formed at predetermined intervals, and a top film that covers the surface of the bottom tape and is peeled off before the supply position.
  • the tray unit 44 supplies the parts to the supply position by arranging and placing a plurality of parts on the tray made of resin or the like.
  • the XY robot 60 is bridged between a pair of left and right Y-axis guide rails 63 provided along the front-rear direction (Y-axis direction) in the upper part of the housing 12 and a pair of left and right Y-axis guide rails 63, and is Y-axis.
  • a Y-axis slider 64 that can move along the guide rail 63, a pair of upper and lower X-axis guide rails 61 provided on the side surface of the Y-axis slider 64 along the left-right direction (X-axis direction), and an X-axis guide rail. It includes an X-axis slider 62 that can move along 61.
  • the X-axis slider 62 is movable by driving the X-axis motor 66 (see FIG. 3), and the Y-axis slider 64 is movable by driving the Y-axis motor 68 (see FIG. 3).
  • a mounting head 50 is attached to the X-axis slider 62, and the control device 90 drives and controls the XY robot 60 (X-axis motor 66 and Y-axis motor 68) to drive and control the mounting head at an arbitrary position on the XY plane. 50 can be moved.
  • suction nozzles 59 can be attached to and detached from the lower surface of the mounting head 50, and the types corresponding to the component types are mounted.
  • the suction nozzle 59 is a suction member that sucks parts by using pressure.
  • the mounting head 50 raises and lowers the suction nozzle 59 in the Z direction by an elevating device 70 (see FIG. 2) driven by a Z-axis motor 55.
  • the mounting head 50 rotates (rotates) the suction nozzle 59 by the R-axis (rotation axis) motor 51, and the angle of the component sucked by the suction nozzle 59 can be adjusted.
  • the mounting head 50 includes a cover 500, a pair of front and rear elevating devices 70, a revolution portion 54, and a rotation portion 55.
  • the cover 500 constitutes the outer shell of the mounting head 50.
  • the pair of front and rear elevating devices 70 are arranged so as to face each other by 180 ° with respect to the revolution axis (the revolution axis of the eight suction nozzles 59) Q.
  • the elevating device 70 includes a Z-axis (upper and lower axis) motor 71 and a ball screw portion 72. Further, the elevating device 70 includes a Z-axis position sensor 74 (see FIG. 3).
  • the ball screw portion 72 includes a shaft portion (fixed portion) 72a and a nut portion (movable portion) 72b.
  • the Z-axis motor 71 is attached to the cover 500.
  • the shaft portion 72a is connected to the rotating shaft of the Z-axis motor 71.
  • the shaft portion 72a extends in the vertical direction.
  • the nut portion 72b is annularly mounted on the shaft portion 72a via a large number of balls (not shown).
  • a recess (power transmission portion) 72b1 is
  • the revolution portion 54 includes a Q-axis (revolution shaft) motor 52, a first gear 541 for revolution, a second gear 542 for revolution, a shaft 543 for revolution, a rotary plate 544, and eight collars 545.
  • the Q-axis motor 52 is attached to the cover 500 via a bracket (not shown).
  • the first gear 541 for public use is connected to the rotating shaft of the Q-axis motor 52.
  • the public diversion second gear 542 meshes with the public diversion first gear 541.
  • the rotary plate 544 is arranged below the second gear 542 for public rotation, separated by a predetermined interval.
  • the public rotation shaft 543 connects the public rotation second gear 542 and the rotary plate 544.
  • the eight collars 545 are arranged at intervals of 45 ° about the revolution axis Q.
  • the collar 545 has a short-axis tubular shape extending in the vertical direction.
  • the collar 545 is embedded in the rotating plate 544.
  • the rotation portion 55 includes an R-axis motor 51, a rotation first gear 551, a rotation second gear 552, and a rotation third gear 553.
  • the R-axis motor 51 is attached to the cover 500 via a bracket (not shown).
  • the rotation first gear 551 is connected to the rotating shaft of the R-axis motor 350.
  • the rotation second gear 552 meshes with the rotation first gear 551.
  • the second gear 552 for rotation has an annular shape.
  • the rotation third gear 553 is connected to the lower side of the rotation second gear 552.
  • the third gear 553 for rotation has a cylindrical shape.
  • the public rotation shaft 543 penetrates the rotation second gear 552 and the rotation third gear 553 in the vertical direction.
  • the holder 58 includes a clad portion 580 and a core portion 581.
  • the clad portion 580 can move in the vertical direction with respect to the collar 545.
  • the clad portion 580 includes an outer cylinder member 580a, a convex portion (power transmission portion) 580c, and a holder gear 580d.
  • the convex portion 580c is arranged on the outer peripheral surface of the outer cylinder member 580a.
  • the convex portion 580c can be engaged with the concave portion 72b1 in the vertical direction.
  • the holder gear 580d is arranged on the outer peripheral surface of the outer cylinder member 580a.
  • the holder gear 580d meshes with the third gear 553 for rotation.
  • the clad portion 580 can move up and down with respect to the core portion 581 by a predetermined pushing stroke.
  • the core unit 581 includes a detection unit 581a.
  • the detected portion 581a projects upward from the outer cylinder member 580a.
  • a suction unit 591 is arranged at the lower end of the suction nozzle 59.
  • the suction unit 591 can suck and release the component P by the air pressure supplied through a gas passage (not shown).
  • a photoelectric sensor 73 is arranged on the nut portion 72b.
  • the photoelectric sensor 73 can move in the vertical direction together with the nut portion 72b.
  • the photoelectric sensor 73 includes a floodlight and a light receiver (not shown).
  • the floodlight can flood the detected portion 581a.
  • the light receiver can receive the reflected light from the detected portion 581a.
  • a detection area A is set next to the photoelectric sensor 73 in the horizontal direction (on the side of the detected portion 581a).
  • the grounding (touchdown) detection method includes a reference value setting process and a grounding determination process.
  • a non-grounded state (specifically, like the holder 58 and the suction nozzle 59 on the rear side of FIG. 2, the horizontal transfer of the component P by the XY robot 31 is completed, and the holder 58 and the suction nozzle 59 are completed. Is executed in the state before the descent.
  • the control device 90 detects the light receiving rate from the light receiver of the photoelectric sensor 73.
  • the control device 90 detects the light receiving rate of the light receiver in the non-grounded state and sets the reference level a1. For example, when the light receiving rate of the light receiver in the non-grounded state is 10% with the initial state as 0% and the final state as 100%, the control device 90 sets the 10% to the reference level a1. Further, the control device 90 sets the reference level a1 as 100% and, for example, 110% as the threshold value a2.
  • the grounding determination process is executed when the non-grounded state is switched to the grounded state. That is, it is executed when the holder 58 and the suction nozzle 59 are lowered.
  • the control device 90 drives the Z-axis motor 71 and lowers the holder 58 and the suction nozzle 59 with respect to the mounting head 50 shown in FIG.
  • the control device 90 continuously detects the light reception rate from the light receiver of the photoelectric sensor 73.
  • the suction nozzle 59 and the core portion 581 immediately stop descending.
  • the clad portion 580 continues to descend together with the nut portion 72b and the photoelectric sensor 73. Therefore, the suction nozzle 59 and the core portion 581 are relatively elevated with respect to the clad portion 580.
  • the detected portion 581a relatively rises in the detection region A. Therefore, the light receiving rate of the light receiver of the photoelectric sensor 73 increases.
  • the control device 90 determines that the component P is grounded with respect to the substrate S.
  • the control device 90 stops the Z-axis motor 71, and stops the lowering of the holder 58 and the suction nozzle 59.
  • the control device 90 releases the grounded component P from the suction nozzle 59, drives the Z-axis motor 71, and raises the holder 58 and the suction nozzle 59.
  • control device 90 sets the next holder 58 and the suction nozzle 59 (part P sucked) directly above the next mounting coordinates. After that, the control device 90 executes the reference value setting step and the grounding determination step. In this way, the control device 90 repeatedly executes the above-mentioned grounding detection method for the number of components P held by the mounting head 50.
  • the control device 90 is configured as a microprocessor centered on the CPU 91, and includes a ROM 92, an HDD 93, a RAM 94, an input / output interface 95, and the like in addition to the CPU 91. These are connected via a bus 96.
  • the control device 90 includes an image signal from the parts camera 80, an image signal from the mark camera, a detection signal from the X-axis position sensor 67 that detects the position of the X-axis slider 62 in the X-axis direction, and Y of the Y-axis slider 64.
  • a detection signal or the like from the photoelectric sensor 73 to be detected is input via the input / output interface 95.
  • the control device 90 a control signal to the board transfer unit 20, a control signal to the component supply unit 40, a drive signal to the XY robot 60 (X-axis motor 66 and Y-axis motor 68), and a mounting head 50 (R).
  • Drive signals to the shaft motor 51, the Q-axis motor 52, and the Z-axis motor 71) are output via the input / output interface 95.
  • FIGS. 4 and 5 are flowcharts showing an example of the mounting process. This process is executed by the control device 90 in a state where the substrate S carried in by the substrate transfer unit 20 is clamped and backed up by the backup unit 30.
  • the step is referred to as "S".
  • the CPU 91 of the control device 90 first sets the touchdown detection section for each mounting position to the initial value (S10).
  • the touch-down detection section means that the holder 58 and the suction nozzle 59 are lowered when the component P is detected to touch down on the substrate S, that is, when the grounding is determined in the grounding determination step. This is the section where the speed is reduced.
  • the mounting time of the component P can be shortened by increasing the speed at which the holder 58 and the suction nozzle 59 are lowered.
  • the speed at which the holder 58 and the suction nozzle 59 are lowered is reduced so that the touchdown can be detected successfully.
  • FIG. 6A shows an example of a touchdown detection section for each mounting position of the substrate S0 in which the surface of the substrate S is an ideal flat surface.
  • the horizontal direction indicates the mounting position and the vertical direction indicates the height.
  • the mounting positions P1 to P5 in the horizontal direction indicate different mounting positions.
  • the height H0 in the vertical direction indicates a target value for grounding the component P on the substrate S.
  • the height H1 indicates the start point of the touchdown detection section for each mounting position. That is, on the board S0, the same section H1-H0 is set as the initial value for the touchdown detection section for each mounting position for any of the mounting positions P1 to P5. This is because the target height H0 at each mounting position P1 to P5 and the grounding height on the substrate S0 are the same.
  • FIG. 6B shows an example of a touchdown detection section for each mounting position of the substrate S1 having a warp on the surface of the substrate S.
  • the height H0 indicates a target value for grounding the component P on the substrate S.
  • the substrate S1 has a warp of a height H2 higher than the target height H0 at the mounting position P2, and a warp of a height H3 lower than the target height H0 at the mounting position P4. Therefore, in order to provide a touchdown detection section having the same length as or longer than the substrate S0 in FIG. 5A for any of the mounting positions P1 to P5, only the sections H1-H0 are added to the height H2.
  • the height H4 is set as the starting point of the touchdown detection section for each mounting position. Therefore, on the substrate S1, the same section H4-H0 is set as the initial value for the touchdown detection section for each mounting position for any of the mounting positions P1 to P5.
  • the CPU 91 lowers the suction nozzle 59 and controls the mounting head 50 so as to suck the component P supplied to the supply position by the component supply unit 40 (S12).
  • the XY robot 60 moves the mounting head 50 onto the substrate S, lowers the suction nozzle 59, and places the component P at the mounting position of the substrate S.
  • the mounting head 50 is controlled so as to be mounted (S14).
  • the CPU 91 detects the touchdown height, associates the detected touchdown height with the current mounting position, and stores it in, for example, the RAM 94 (S16). Specifically, the touchdown height is detected when the light receiving rate of the light receiver of the photoelectric sensor 73 reaches the threshold value a2, that is, the control device 90 (CPU 91) grounds the component P to the substrate S. Is determined by detecting the detection signal from the Z-axis position sensor 74.
  • the CPU 91 determines whether or not the mounting of all the components is completed (S18). In this determination, if it is determined that there are still components to be mounted (S18: NO), the CPU 91 selects the component to be mounted next, and then returns the process to S12. On the other hand, when it is determined in this determination that the mounting of all the components is completed (S18: YES), the CPU 91 advances the process to S20.
  • the CPU 91 determines whether or not the mounting of a predetermined number of boards has been completed. In this determination, if it is determined that the mounting of the predetermined number of boards has not been completed (S20: NO), the CPU 91 proceeds to the process of S40 in FIG. On the other hand, if it is determined in this determination that the mounting of a predetermined number of boards has been completed (S20: YES), the CPU 91 advances the process to S22.
  • the "predetermined number of boards" is the number of some boards among all the boards scheduled to be mounted. In the present embodiment, for example, three sheets (boards S1 to S3 in FIG. 6C) are given as an example of the predetermined number of sheets, but the number is not limited to this.
  • the CPU 91 determines whether or not the mounting of all the boards is completed. In this determination, if it is determined that the mounting of all the boards has not been completed (S40: NO), the CPU 91 waits until the board to be mounted next is backed up by the backup unit 30, and then performs the processing. Return to S12 of 4. On the other hand, if it is determined in this determination that the mounting of all the boards has been completed (S40: YES), the CPU 91 ends the mounting process.
  • the CPU 91 calculates the average value of the touchdown height for each mounting position.
  • the average value is calculated by taking the average value of the touchdown height stored in association with each mounting position over a predetermined number of substrates.
  • the CPU 91 calculates the variation from the average value of the touchdown height for each mounting position (S24).
  • the touchdown height is stored for a predetermined number of boards.
  • one average value of the touchdown height is calculated for one fixed mounting position. Therefore, in S24, the difference from the average value of the touchdown heights is calculated for each of the touchdown heights of a predetermined number of substrates, and the variation is set for one fixed mounting position. Then, this variation is calculated for all mounting positions.
  • the variation from the average value of the touchdown height for each mounting position calculated in S22 and the average value of the touchdown height for each mounting position calculated in S24 are temporarily stored in the RAM 94, for example. I will do it.
  • the mounting position counter is a software counter that counts to indicate the mounting position, that is, in the present embodiment, any of the mounting positions P1 to P5. Therefore, in the present embodiment, the mounting position counter counts any of 1 to 5, and the initialization means that the mounting position counter is set to "1".
  • the CPU 91 determines whether or not the variation in the mounting position indicated by the mounting position counter exceeds a predetermined range (S28 in FIG. 5). Since the variation is calculated as a difference from the average value of the touchdown height as described above in the present embodiment, the CPU 91 determines whether or not the variation exceeds a predetermined range among the calculated differences. Judgment is made based on whether or not the maximum value of is exceeded the predetermined range.
  • the CPU 91 sets a predetermined margin in the average value of the touchdown heights. After adding and storing in the RAM 94 (S32) in association with the mounting position, the process proceeds to S34.
  • the CPU 91 determines whether or not the mounting position counter is counting the last mounting position. In this determination, when it is determined that the mounting position counter does not count the last mounting position (S34: NO), the CPU 91 increments the mounting position counter by "1" (S36), and then performs processing in the above S28. Return to. On the other hand, in this determination, when it is determined that the mounting position counter is counting the last mounting position (S34: YES), the CPU 91 advances the process to S38.
  • the CPU 91 updates the touchdown detection section for each mounting position with a stored value. After that, the CPU 91 advances the process to S40. Since the processing of S40 has been described above, the description thereof will be omitted.
  • the CPU 91 then holds the holder 58 and the holder 58 based on the updated touchdown detection section for each mounting position until the mounting of all the boards is completed.
  • the speed at which the suction nozzle 59 is lowered is determined. That is, the CPU 91 speeds up the lowering of the holder 58 and the suction nozzle 59 at a position higher than the touchdown detection section for each mounting position, and slows down within the touchdown detection section for each mounting position.
  • FIG. 6C shows an example of the touchdown detection section for each mounting position updated by the process of S38.
  • the substrate S1 shows the board first mounted by the mounting process
  • the board S2 shows the board second mounted by the mounting process
  • the board S3 is the third board mounted by the mounting process. The second mounted board is shown.
  • the mounting position P2 although there is a warp in any of the boards S1 to S3, there is little variation.
  • the average value of the touchdown height is the height of the mounting position P2 on the board S2 and the maximum value of the variation is within a predetermined range
  • the touchdown detection section for each mounting position at the mounting position P2 is ,
  • the initial value H4-H0 is updated to the value H5-H0.
  • the height H5 is a value obtained by adding a "predetermined margin", that is, the values H1-H0 to the height of the mounting position P2 on the substrate S2, and H5> H4.
  • the mounting position P4 there is a warp in any of the boards S1 to S3, and there is a lot of variation.
  • the touchdown for each mounting position at the mounting position P4 The detection section is updated from the initial value H4-H0 to the value H6-H0.
  • the height H6 is obtained by adding the maximum value of variation to the height H0 of the mounting position P2 on the board S3, that is, the difference between the height of the mounting position P2 on the board S2 and the height H0 of the mounting position P2 on the board S3.
  • the touchdown detection section for each mounting position after the update is longer than the initial value at the mounting positions P2 and P4, but shorter than the initial value at the mounting positions P1, P3 and P5. It is shorter than the initial value of the touchdown detection section for each mounting position. This makes it possible to shorten the mounting time.
  • the touchdown detection section for each mounting position is a value obtained by adding a predetermined margin to the average value of the touchdown height, that is, mounting.
  • the center value of the touchdown detection section for each position is updated to the section shifted to the average value of the touchdown height.
  • the touchdown detection section for each mounting position is obtained by adding the average value of the touchdown height to the maximum value of the variation and further determining. It is updated to the value with the margin added. In this way, the touchdown detection section for each mounting position is set to the optimum section according to the state of the touchdown height on each board S, so that the touchdown can be accurately detected on any board S. Is possible.
  • FIG. 7 shows a mounting head 140 having a configuration different from that of the mounting head 50 of FIG.
  • the mounting head 140 includes a head body 142 in which a plurality of nozzle holders 165 (only two are shown in FIG. 7) are arranged at predetermined angular intervals (for example, 30 degree intervals) in a circumferential direction coaxial with the rotation axis, and each nozzle holder. It is provided with a suction nozzle 160 that is detachably attached to the lower end of the 165.
  • the mounting head 140 includes an R-axis motor (not shown) that rotates (revolves) a plurality of nozzle holders 165 by rotating the head body 142, and a Q-axis motor 146 that rotates (rotates) a plurality of nozzle holders 165. And an elevating device (not shown) for elevating and lowering the nozzle holder 165. Further, the mounting head 140 includes a negative pressure supply device 170 that supplies a negative pressure to the suction unit 161 and a positive pressure supply device 180 that supplies a positive pressure to the nozzle holder 165.
  • a plurality of head main bodies 142 are formed into a frame 141 attached to the X-axis slider 62 (see FIG. 1), a shaft portion 142a rotatably supported by the frame 141, and a cylindrical shape having a diameter larger than that of the shaft portion 142a. It is provided with a holder holding portion 142b for holding the nozzle holder 165 of the above so as to be movable in the Z-axis direction.
  • the shaft portion 142a and the holder holding portion 142b rotate, whereby the plurality of nozzle holders 165 rotate (revolve).
  • the head main body 142 has a gear 143 coaxially with the shaft portion 142a and rotatably supported relative to the shaft portion 142a, and a gear 147 that rotates with the rotation of the gear 143.
  • the gear 143 meshes with the gear 145 attached to the rotating shaft of the Q-axis motor 146, and the gear 147 meshes with the gear 165b attached to each nozzle holder 165.
  • each nozzle holder 165 and the suction nozzle 160 mounted on each nozzle holder 165 rotate (rotate) by the same rotation amount (rotation angle) in the same rotation direction.
  • a spring 165a is arranged between the lower surface of the gear 165b and the upper surface of the holder holding portion 142b. The spring 165a urges the nozzle holder 165 upward in the Z-axis direction.
  • the nozzle holder 165 is configured as a cylindrical member extending in the Z-axis direction, and a first gas passage 166a and a second gas passage 167a are formed inside the nozzle holder 165. Further, the nozzle holder 165 is formed with a horizontal portion 165c extending in the radial direction at the upper end portion thereof.
  • the negative pressure supply device 170 is a device that independently supplies negative pressure from the same negative pressure source 171 to a plurality of suction nozzles 160 mounted on each of the plurality of nozzle holders 165.
  • the negative pressure supply device 170 includes a negative pressure source 171 such as a vacuum pump, a frame passage 172, a head passage 173, a negative pressure introduction passage 174, an atmosphere introduction passage 175, a spool hole 177, a spool 178, and a spool. It is equipped with a drive mechanism (not shown).
  • the frame passage 172 is formed in the frame 141 of the mounting head 140 and is connected to the negative pressure source 171.
  • the head passage 173 communicates with the frame passage 172 and is formed so as to extend along the central axis of the mounting head 140.
  • a plurality of negative pressure introduction passages 174 are formed so as to communicate with the head passage 173 and extend radially from the central axis of the holder holding portion 142b.
  • a plurality of atmosphere introduction passages 175 are formed in correspondence with the negative pressure introduction passage 174 so as to communicate with the positive pressure source (here, the atmosphere).
  • the spool 178 is a switching valve for selectively communicating either the corresponding negative pressure introduction passage 174 or the atmosphere introduction passage 175 to the first gas passage 166a provided in each of the plurality of nozzle holders 165. Is.
  • the first gas passage 166a communicates with the suction port at the tip of the suction portion 161 of the suction nozzle 160.
  • the spool 178 is a tubular member that is inserted into each of the spool holes 177 formed in the holder holding portion 142b corresponding to each of the plurality of nozzle holders 165.
  • the spool 178 has a substantially central portion reduced in diameter, and the circumference of the reduced diameter portion of the space in the spool hole 177 serves as a path for negative pressure from the negative pressure source 171.
  • the spool 178 communicates with the first gas passage 166a and the negative pressure introduction passage 174 and also communicates with the first gas passage 166a and the atmosphere introduction passage 175 when the spool 178 is moving upward (the state shown in FIG. 7). To shut off. On the other hand, when the spool 178 is moving downward, the spool 178 blocks the communication between the first gas passage 166a and the negative pressure introduction passage 174 and communicates with the first gas passage 166a and the atmosphere introduction passage 175.
  • the spool drive mechanism outputs a driving force to move the spool 178 up and down, so that the spool 178 switches between the negative pressure introduction passage 174 and the atmosphere introduction passage 175 to communicate with the first gas passage 166a.
  • the positive pressure supply device 180 is a device that supplies positive pressure to the second gas passage 167a provided in each of the plurality of nozzle holders 165.
  • the positive pressure supply device 180 includes a positive pressure source 181 such as a compressor, a flow rate sensor 181a, a frame passage 182, a head passage 183, and a positive pressure introduction passage 184.
  • the flow rate sensor 181a is connected to the positive pressure source 181 and detects the flow rate of the gas (here, air) supplied from the positive pressure source 181 and flowing through the second gas passage 167a.
  • the frame passage 182 is formed at a position different from the frame passage 172 in the frame 141 of the mounting head 140, and is connected to the flow rate sensor 181a and the positive pressure source 181.
  • the head passage 183 communicates with the frame passage 182 and is formed so as to extend along the central axis direction of the mounting head 140.
  • the head passage 183 has a ring-shaped shape centered on the head passage 173 in a top view, and extends in the vertical direction so as to surround the head passage 173 while being separated from the head passage 173.
  • a plurality of positive pressure introduction passages 184 are formed so as to communicate with the head passage 183 and extend from the central axis side of the holder holding portion 142b toward the outside of the holder holding portion 142b.
  • Each of the plurality of positive pressure introduction passages 184 is formed corresponding to each of the plurality of nozzle holders 165 and communicates with the second gas passage 167a of the corresponding nozzle holder 165.
  • the plurality of positive pressure introduction passages 184 are all formed so as to avoid the negative pressure introduction passage 174 and the spool hole 177.
  • the frame passage 182, the head passage 183, the positive pressure introduction passage 184 and the second gas passage 167a are all frame passage 172, head passage 173, negative pressure introduction passage 174, atmosphere introduction passage 175, spool hole 177, and It does not communicate with any of the first gas passages 166a. That is, the negative pressure path and the positive pressure (atmosphere) path of the negative pressure supply device 170 and the positive pressure path of the positive pressure supply device 180 are independent of each other.
  • the CPU 91 When the component P is mounted on the board S by the mounting head 140, the CPU 91 starts the lowering of the target nozzle by the elevating device. Then, the CPU 91 waits until the flow rate detected by the flow rate sensor 181a exceeds a predetermined threshold value, that is, until the pushing amount reaches a predetermined amount. When it is determined that the pushing amount has reached a predetermined amount, the CPU 91 switches the spool 178 corresponding to the target nozzle by the spool drive mechanism and applies a positive pressure (atmosphere) to the suction portion 161 to release the negative pressure and move up and down. The suction unit 161 is raised by the device. In this way, when the CPU 91 determines that the pushing amount has reached a predetermined amount based on the flow rate detected by the flow rate sensor 181a, the CPU 91 releases and increases the negative pressure of the suction unit 161.
  • the mounting head 50 of FIG. 2 detects the touchdown based on the light receiving rate of the light detected by the light receiver of the photoelectric sensor 73, whereas the mounting head 140 of FIG. 7 detects the touchdown. Is different in that the flow rate sensor 181a is used based on the flow rate detected. However, even if the process of setting the touchdown detection section for each mounting position, that is, the processing other than the processing of S12 and S14 during the mounting processing of FIGS. 4 and 5, the mounting head 50 is changed to the mounting head 140. Since there is no difference, the explanation is omitted.
  • the mounting method of the present embodiment is a mounting method in which the component P is mounted on the substrate S by using the mounting head 50 capable of moving up and down by driving the Z-axis motor 71 to attract the component P.
  • the Z-axis motor 71 is an example of a “drive source”.
  • the mounting heads 50 and 140 are examples of "suction members".
  • the detection section for detecting that the mounting heads 50, 140 to which the component P is attracted comes into contact with the substrate S via the component P is set as the detection section of the component P on the substrate S. Since it can be set for each mounting position, that is, the length of the detection section can be changed according to the situation of the board S at the position where the component P is mounted, the mounting time can be further shortened.
  • the RAM 94 is an example of a "memory”.
  • the detection section is determined based on the history of the height of the mounting head 50 actually mounted in the past, so that an appropriate detection section can be set.
  • the range of the detection section is determined according to the degree of variation in the height of the mounting head 50 included in the history information.
  • the detection section is determined by shifting the center value of the detection section to the average value of the heights.
  • the length of the detection section is shifted as it is, so that it is possible to suppress the lengthening of the detection section.
  • the mounting head 50 projects light onto the detection region A in which the detection portion 581a relatively moves in conjunction with the contact between the suction portion 591 that attracts the component P and the component P with respect to the substrate S, and the detection region.
  • a photoelectric sensor 73 that receives light from A is provided, and the detection step (S16) detects that the component P has come into contact with the mounting position on the substrate S based on the output signal from the photoelectric sensor 73.
  • the suction portion 591 is an example of the "nozzle portion”.
  • the mounting head 140 includes a suction unit 161 for sucking the component P, and a frame passage 182 in which the flow rate or pressure of the flowing gas fluctuates according to the pushing amount of the suction unit 161.
  • the contact of the component P with the mounting position on the substrate S is detected by detecting at least one of the flow rate and the pressure of the gas flowing through the frame passage 182.
  • the suction portion 161 is an example of a “nozzle portion”.
  • the frame passage 182 is an example of a “gas passage”.
  • the number of suction nozzles 59 in the mounting head 50 of FIG. 2 is eight, and the number of suction nozzles 160 in the mounting head 140 of FIG. 7 is twelve. Not limited to these.
  • the same "predetermined margin" is added in any of the processes of S30 and S32 in FIG. 5, but the present invention is not limited to this, and the process of S30 and the process of S32 are not limited to this.
  • the value of the margin to be added may be different. Further, the value of the margin may be set to "0" or a value close to "0". In this case, the mounting time can be further shortened.

Abstract

L'invention concerne un procédé de montage destiné à monter des pièces sur un substrat au moyen d'un organe d'aspiration qui peut aspirer des pièces d'aspiration et qui est élevé et abaissé suite à un entraînement par une source d'entraînement, ledit procédé consistant : en une étape de détection selon laquelle l'organe d'aspiration qui a aspiré une pièce descend vers la position de montage pour la pièce sur le substrat, et le contact de l'organe d'aspiration sur le substrat avec la pièce entre eux est détecté; et en une étape de pose selon laquelle un intervalle de détection pour la détection effectuée lors de l'étape de détection peut être défini pour chaque position de montage de pièce sur le substrat.
PCT/JP2020/029455 2020-07-31 2020-07-31 Procédé de montage et dispositif de montage WO2022024350A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2020/029455 WO2022024350A1 (fr) 2020-07-31 2020-07-31 Procédé de montage et dispositif de montage
DE112020007469.2T DE112020007469T5 (de) 2020-07-31 2020-07-31 Montageverfahren und Montagevorrichtung
CN202080102357.4A CN115769691A (zh) 2020-07-31 2020-07-31 安装方法及安装装置
JP2022539947A JPWO2022024350A1 (fr) 2020-07-31 2020-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/029455 WO2022024350A1 (fr) 2020-07-31 2020-07-31 Procédé de montage et dispositif de montage

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WO2022024350A1 true WO2022024350A1 (fr) 2022-02-03

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JP (1) JPWO2022024350A1 (fr)
CN (1) CN115769691A (fr)
DE (1) DE112020007469T5 (fr)
WO (1) WO2022024350A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018061146A1 (fr) * 2016-09-29 2018-04-05 富士機械製造株式会社 Dispositif de montage et procédé de montage
WO2018179317A1 (fr) * 2017-03-31 2018-10-04 株式会社Ｆｕｊｉ Dispositif de montage de composant et tête de montage
WO2019171481A1 (fr) * 2018-03-07 2019-09-12 株式会社Ｆｕｊｉ Système de montage de composant

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018061146A1 (fr) * 2016-09-29 2018-04-05 富士機械製造株式会社 Dispositif de montage et procédé de montage
WO2018179317A1 (fr) * 2017-03-31 2018-10-04 株式会社Ｆｕｊｉ Dispositif de montage de composant et tête de montage
WO2019171481A1 (fr) * 2018-03-07 2019-09-12 株式会社Ｆｕｊｉ Système de montage de composant

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CN115769691A (zh) 2023-03-07
DE112020007469T5 (de) 2023-05-11
JPWO2022024350A1 (fr) 2022-02-03

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