WO2022019181A1 - セラミック焼結体、及びその製造方法 - Google Patents

セラミック焼結体、及びその製造方法 Download PDF

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Publication number
WO2022019181A1
WO2022019181A1 PCT/JP2021/026339 JP2021026339W WO2022019181A1 WO 2022019181 A1 WO2022019181 A1 WO 2022019181A1 JP 2021026339 W JP2021026339 W JP 2021026339W WO 2022019181 A1 WO2022019181 A1 WO 2022019181A1
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Prior art keywords
sintered body
green sheet
ceramic green
ceramic
ceramic sintered
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PCT/JP2021/026339
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English (en)
French (fr)
Japanese (ja)
Inventor
利貴 山縣
裕二 松尾
龍平 渡邊
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デンカ株式会社
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Priority to JP2022537202A priority Critical patent/JPWO2022019181A1/ja
Publication of WO2022019181A1 publication Critical patent/WO2022019181A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00—Producing shaped prefabricated articles from the material
    • B28B1/30—Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/12—Apparatus or processes for treating or working the shaped or preshaped articles for removing parts of the articles by cutting
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products

Definitions

  • This disclosure relates to a ceramic sintered body and a method for manufacturing the same.
  • Patent Document 1 discloses a technique in which a vacuum suction hole is provided on the lower surface of a punch, and a work sucked and punched by a vacuum suction device is sucked and maintained on the lower surface of the punch.
  • the present disclosure provides a ceramic sintered body capable of improving quality variation and yield by reducing the generation of chips when punching a ceramic green sheet.
  • the present disclosure also provides a manufacturing method capable of improving the variation in quality and the yield of the ceramic sintered body by reducing the generation of chips when punching the ceramic green sheet.
  • the present disclosure is a flat plate-shaped ceramic sintered body having a pair of main surfaces, the maximum height roughness measured along the center line of at least one side surface parallel to the pair of main surfaces.
  • a ceramic sintered body having Rz) of 10 ⁇ m or less is provided. In such a ceramic sintered body, large irregularities are reduced on the side surface, so that the residual chips generated during punching are sufficiently reduced. Therefore, it is possible to suppress the variation in quality and the decrease in yield due to the remaining chips.
  • the side surface has a shear section and a fracture surface adjacent to each other along a direction orthogonal to the pair of main surfaces, and the center line of the side surface may be located on the shear section.
  • the area ratio of the area occupied by the shear section on the above side surface may be 70% or more. This makes it possible to further reduce the chips generated during punching. Therefore, it is possible to further suppress the variation in quality and the decrease in yield due to the remaining chips.
  • the maximum height roughness (Rz) may be 0.5 ⁇ m or more. This facilitates the production of the ceramic sintered body and can further improve the yield.
  • the present disclosure comprises a step of punching a ceramic green sheet substrate using a cutting device equipped with a die and a punch to obtain a ceramic green sheet, and a step of firing the ceramic green sheet to obtain a ceramic sintered body.
  • a cutting device uses a ceramic green sheet base material while urging a surface portion opposite to the surface portion pressed by the punch of the ceramic green sheet base material toward the punch.
  • a method for producing a ceramic sintered body by punching is provided.
  • This manufacturing method uses a cutting device that punches out the ceramic green sheet base material while urging the surface portion on the opposite side of the surface portion on the punch side of the ceramic green sheet base material toward the punch. Therefore, it is possible to reduce the fracture surface generated during punching and sufficiently reduce the generation of chips. As described above, since the generation of chips is sufficiently reduced, it is possible to suppress the variation in quality and the decrease in yield of the ceramic sintered body obtained by firing the ceramic green sheet.
  • the ceramic sintered body manufactured by the above manufacturing method has a flat plate shape having a pair of main surfaces, and has a maximum height roughness measured along the center line of at least one side surface parallel to the pair of main surfaces.
  • the (Rz) may be 10 ⁇ m or less. Since such a ceramic sintered body has reduced large irregularities on the side surface, it is possible to sufficiently reduce chips generated during punching.
  • the side surface of the ceramic sintered body has a shear section and a fracture surface adjacent to each other along a direction orthogonal to the pair of main surfaces, and the area ratio of the region occupied by the shear section on the side surface is 70% or more. good.
  • the solid content of the ceramic green sheet base material when punched by the cutting device may be 65 to 85% by mass.
  • the present disclosure can provide a ceramic sintered body capable of improving quality variation and yield by reducing the generation of chips when punching a ceramic green sheet. Further, the present disclosure can provide a manufacturing method capable of improving the variation in quality and the yield of the ceramic sintered body by reducing the generation of chips when punching the ceramic green sheet.
  • FIG. 1 is a perspective view of a ceramic sintered body according to an embodiment.
  • FIG. 2 is a side view of the ceramic sintered body according to the embodiment.
  • FIG. 3 is an electron micrograph showing an example of chips remaining on the surface of the ceramic sintered body.
  • FIG. 4 is a perspective view showing an example of a ceramic green sheet base material.
  • FIG. 5 is a cross-sectional view of a ceramic green sheet base material and a cutting device showing a state before punching out the ceramic green sheet base material.
  • FIG. 6 is a plan view of the cutting device.
  • FIG. 7 is a cross-sectional view of a ceramic green sheet base material and a cutting device showing a state after punching out the ceramic green sheet base material.
  • FIG. 1 is a perspective view of a ceramic sintered body according to an embodiment.
  • FIG. 2 is a side view of the ceramic sintered body according to the embodiment.
  • FIG. 3 is an electron micrograph showing an example of chips remaining on the surface of the ceramic sintered body
  • FIG. 8 is an optical micrograph showing the side surface of the ceramic green sheet of Example 1 magnified 200 times.
  • FIG. 9A is a photograph of a 3D image showing the side surface of the ceramic sintered body of Example 1.
  • FIG. 9B is a graph showing the uneven shape measured along the center line that bisects the side surface along the Y direction.
  • FIG. 9C is a graph showing the uneven shape of the side surface measured along the Z direction.
  • FIG. 10 is a cross-sectional view of the cutting device used for punching the ceramic green sheet base material in Comparative Example 1.
  • FIG. 11 is an optical micrograph showing the side surface of the ceramic green sheet of Comparative Example 1 magnified 200 times.
  • FIG. 12A is a photograph of a 3D image showing the side surface of the ceramic sintered body of Comparative Example 1.
  • FIG. 12B is a graph showing the uneven shape measured along the center line that divides the side surface in the Y direction.
  • FIG. 12C is a graph showing the uneven shape of the side surface measured
  • FIG. 1 is a perspective view of the ceramic sintered body 100.
  • the ceramic sintered body 100 having a flat plate shape (rectangular parallelepiped shape) has a pair of main surfaces 12 parallel to each other, a pair of side surfaces 14 parallel to each other, and a pair of side surfaces 16 parallel to each other.
  • the side surface 14 and the side surface 16 are orthogonal to each other.
  • the center lines L1 and L2 (virtual lines) of the side surfaces 14 and 16 are both parallel to the main surface 12, and the side surfaces 14 and 16 are oriented in the thickness direction of the ceramic sintered body 100 (direction orthogonal to the main surface 12), respectively. It is divided into two.
  • the central lines L1 and L2 are virtual lines, and the maximum height roughness (Rz) measured along the central lines L1 and L2 is 10 ⁇ m or less.
  • the maximum height roughness (Rz) measured along the center lines L1 and L2 may be 6 ⁇ m or less, and may be 4 ⁇ m or less.
  • the arithmetic mean roughness (Ra) measured along the center lines L1 and L2 may be 10 ⁇ m or less, and may be 2 ⁇ m or less.
  • the maximum height roughness (Rz) and the arithmetic mean roughness (Ra) in the present disclosure are values measured in accordance with JIS B 0601: 2013, respectively.
  • the maximum height roughness (Rz) measured along the center lines L1 and L2 may be 0.5 ⁇ m or more and 1 ⁇ m from the viewpoint of facilitating manufacturing and suppressing slipping when gripped. It may be the above. From the same viewpoint, the arithmetic mean roughness (Ra) measured along the center lines L1 and L2 may be 0.5 ⁇ m or more, or 1.0 ⁇ m or more. An example of the maximum height roughness (Rz) is 0.1 to 10 ⁇ m. An example of arithmetic mean roughness (Ra) is 0.5-10 ⁇ m.
  • the maximum height roughness (Rz) and arithmetic mean roughness (Ra) measured along the center lines L1 and L2 on the pair of side surfaces 14 and the pair of side surfaces 16, that is, all of the four sides, are in the above range. It may be there. However, in some modifications, only one side surface (only side surface 14 or only side surface 16) may satisfy the above-mentioned maximum height roughness (Rz) and arithmetic mean roughness (Ra). Further, in some other modifications, only one pair of sides (only one pair of sides 14 or only one pair of sides 16) satisfies the above-mentioned maximum height roughness (Rz) and arithmetic mean roughness (Ra). It's okay.
  • the thickness of the ceramic sintered body 100 may be 1.5 mm or less. As the thickness of the ceramic sintered body 100 becomes smaller, the areas of the side surfaces 14 and 16 also become smaller. Even if the areas of the side surfaces 14 and 16 are small, the quality will be affected if chips are generated during punching.
  • the thickness of the ceramic sintered body 100 may be 0.3 mm or more.
  • the ceramic sintered body 100 contains ceramic particles as a main component and oxide particles dispersed in the main component as subcomponents and different from the ceramic particles.
  • the ceramic particles as the main component may contain at least one selected from the group consisting of nitrides, carbides, borides, oxides and silices.
  • Examples of the oxide include aluminum oxide (Al 2 O 3 ) and the like.
  • the ceramic particles may be made of a ceramic having aluminum as a constituent element from the viewpoint of achieving both excellent electrical insulation and high thermal conductivity, and may be, for example, aluminum nitride particles.
  • the oxide particles dispersed in the above-mentioned main component contain an oxide different from the ceramic contained in the ceramic particles.
  • the oxide particles may contain, for example, an oxide having at least one selected from the group consisting of rare earth elements, transition elements different from rare earth elements, alkaline earth metal elements, and aluminum elements as constituent elements. Such oxides have the effect of promoting the sintering of ceramic particles when used as a sintering aid.
  • the oxide particles may contain an oxide derived from the sintering aid.
  • the oxide contained in the oxide particles may be a composite oxide.
  • the ceramic sintered body may contain aluminum nitride particles as a main component and oxide particles (composite oxide particles) having yttrium and aluminum as constituent elements as subcomponents. Such a ceramic sintered body is excellent not only in electrical insulation but also in thermal conductivity.
  • the composite oxide contained in the sintered ceramic body 100 as a secondary component for example, 3Y 2 O 3 ⁇ 5Al 2 O 3 and Y 2 O 3 ⁇ Al 2 O 3.
  • the main component in the present disclosure means the component having the highest content among the components contained in the ceramic sintered body.
  • the sub-component in the present disclosure refers to a component contained in the ceramic sintered body 100 having a content smaller than that of the main component.
  • the sub-component is a component different from the main component and is dispersed in the main component. For example, it may be contained in the grain boundaries of a plurality of ceramic particles which are the main components.
  • the content of the main component in the ceramic sintered body 100 may be 90% by mass or more, 93% by mass or more, and 95% by mass or more from the viewpoint of fully exhibiting the characteristics of the main component. You may.
  • the content of the secondary component (oxide particles different from the ceramic particles) in the ceramic sintered body may be 0.5% by mass or more from the viewpoint of promoting sintering and sufficiently increasing the density, and 1 mass by mass. % Or more, and may be 2% by mass or more.
  • FIG. 2 is a side view of the ceramic sintered body 100 of FIG.
  • the side surface 14 is composed of a shear section 30 and a fracture surface 32 adjacent to each other along a direction orthogonal to the main surface 12A and the main surface 12B.
  • the shear section 30 and the fracture surface 32 are partitioned by a boundary line B.
  • the shear section 30 is formed on the main surface 12A side, and the fracture surface 32 is formed on the main surface 12B side.
  • the region 30A occupied by the shear cross section 30 is larger than the region 32A occupied by the fracture surface 32. That is, the area of the shear section 30 is larger than the area of the fracture surface 32.
  • the center line L1 drawn so as to divide the side surface 14 of the ceramic sintered body 100 in the thickness direction is located on the shear cross section 30. Since the side surface 14 has a large area ratio of the sheared cross section 30, the chips remaining on the surface of the ceramic sintered body 100 can be sufficiently reduced.
  • the area ratio of the region 30A occupied by the shear cross section 30 may be 70% or more, 75% or more, or 80% or more.
  • the side surfaces other than the side surface 14 may have the same area ratio.
  • the area ratio of the region 32A occupied by the fracture surface 32 may be 30% or less, 25% or less, or 20% or less.
  • the side surfaces other than the side surface 14 may have the same area ratio. Each area ratio is obtained based on the area when the ceramic sintered body 100 is viewed from the side.
  • the side surface 14 may be composed of only the shear section 30 and the fracture surface 32.
  • the area ratio of the area 30A occupied by the shear cross section 30 and the area 32A occupied by the fracture surface 32 can be adjusted, for example, by changing the clearance between the die and the punch of the cutting device described later. When the clearance is reduced, the area ratio of the region 30A occupied by the shear cross section 30 tends to increase.
  • FIG. 3 is an electron micrograph showing the chips 114 remaining on the surface 112 of the ceramic sintered body. As described above, if the chips 114 remain, it may not be possible to commercialize the product due to poor appearance, poor properties, or the like. Therefore, the yield of the ceramic sintered body is lowered. Since the remaining chips 114 are sufficiently reduced, the ceramic sintered body 100 of the present embodiment has a good appearance and can reduce variations in properties. As a result, the yield of commercialization can be increased.
  • the manufacturing method of the present embodiment includes a manufacturing step of manufacturing a ceramic green sheet base material and a punching step of punching the ceramic green sheet base material using a cutting device including a die and a punch to obtain a ceramic green sheet. , A firing step of firing a ceramic green sheet to obtain a ceramic sintered body.
  • raw materials for example, ceramic powder, sintering aid, and, if necessary, additives are used.
  • the additive include a binder, a plasticizer, a dispersion medium, a mold release agent and the like.
  • binder include a methylcellulose-based binder having a plasticity or a surface-active effect, and an acrylic acid ester-based binder having an excellent thermal decomposition property.
  • plasticizer include glycerin.
  • dispersion medium include ion-exchanged water and ethanol.
  • the ceramic powder for example, aluminum nitride powder, silicon nitride powder, aluminum oxide powder, or the like can be used.
  • the average particle size (median diameter) of the ceramic powder may be 0.1 to 6 ⁇ m, or may be 0.5 to 4 ⁇ m.
  • an oxide having at least one selected from the group consisting of rare earth elements, transition elements different from rare earth elements, alkaline earth metal elements, and aluminum elements can be used.
  • aluminum oxide, yttrium oxide, cerium oxide and the like can be mentioned. At least two of these oxides may form a composite oxide to form a liquid phase and promote sintering.
  • the ceramic sintered body can be sufficiently densified.
  • the composition of the oxide particles in the ceramic sintered body may be adjusted by changing the blending ratio of each oxide.
  • the average particle size (median diameter) of the sintering aid may be 0.05 to 5 ⁇ m, or 0.1 to 3 ⁇ m.
  • Ceramic powder, sintering aid, binder and additives added as needed are mixed and mixed to obtain a molding raw material.
  • the molding raw material is applied to a release film to a predetermined thickness by a doctor blade method, a calendar method, an extrusion method, or the like, dried, and molded to obtain a ceramic green sheet base material.
  • the release film may be a polyester film such as PET. After that, the release film is removed from the ceramic green sheet base material, and a punching step is performed in which the ceramic green sheet base material is punched out using a die equipped with a die and a punch.
  • the ceramic green sheet base material 50 of FIG. 4 has a rectangular parallelepiped shape.
  • the central portion of the ceramic green sheet base material 50 is punched out in the direction from one main surface 50B side to the main surface 50A side of the ceramic green sheet base material 50 to obtain a ceramic green sheet 53. That is, the ceramic green sheet 53 corresponds to a portion punched by the die.
  • the ceramic sintered body 100 is obtained by firing the ceramic green sheet 53 obtained by punching with a die.
  • the side surfaces 54 and 56 of the ceramic green sheet 53 are the side surfaces of the ceramic sintered body 100.
  • the solid content of the ceramic green sheet base material 50 when punched with a die may be 65 to 85% by mass, or may be 75 to 85% by mass.
  • the solid content is preferably adjusted by performing a drying step of drying the ceramic green sheet base material 50 before punching with a die.
  • the shape of the ceramic green sheet base material is not limited to the shape shown in FIG.
  • a strip-shaped ceramic green sheet base material may be unwound from a roll body in which the ceramic green sheet base material is wound into a roll shape and punched into a predetermined shape.
  • the release film may be removed from the ceramic green sheet base material before punching with the cutting device, or the ceramic green sheet may be punched out using the cutting device with the release film attached to the ceramic green sheet base material. .. After that, the release film may be removed from the ceramic green sheet obtained by punching with a cutting device.
  • a pushback type cutting device may be used.
  • FIGS. 5, 6 and 7 show an example of a cutting device for punching the ceramic green sheet 53 from the ceramic green sheet base material 50 shown in FIG.
  • FIG. 5 is a cross-sectional view of a cutting device 200 showing a state before punching out the ceramic green sheet base material 50.
  • FIG. 6 is a plan view of the cutting device 200.
  • FIG. 7 is a cross-sectional view of a cutting device 200 showing a state after punching out the ceramic green sheet base material 50.
  • FIG. 5 shows a ceramic green sheet base material 50 before being punched by a cutting device 200 provided with a die 24 and a punch 22 as a die 20.
  • the ceramic green sheet base material 50 is placed, the mounting plate 65 having a hole 65h through which the punch 22 is inserted, and the main surface of the ceramic green sheet base material 50.
  • a ceramic green sheet base material is provided via a pressing plate 67 that is in contact with the central portion of 50A, a die 24 that is arranged so as to face the mounting plate 65 and is in contact with the periphery of the central portion of the main surface 50A, and a pressing plate 67.
  • An elastic member 63 for urging the central portion of the main surface 50A of the 50 toward the punch 22 is provided. Further, the cutting device 200 is arranged below the mounting plate 65, and has an elastic member 61 that urges the end portion of the main surface 50A of the ceramic green sheet base material 50 toward the punch 22 via the mounting plate 65. Be prepared.
  • the elastic members 61 and 63 may be, for example, springs.
  • the die 24 shown in FIG. 5 is restricted from moving in the vertical direction, whereas the punch 22, the holding plate 67, and the elastic member 63 are configured to be movable in the vertical direction.
  • the punching step of the ceramic green sheet base material 50 using the cutting device 200 can be performed, for example, by the following procedure. As shown in FIG. 5, the upper surface of the mounting plate 65 and the upper surface of the punch 22 are aligned at the same height. Further, the lower surface of the holding plate 67 and the lower surface of the die 24 are aligned at the same height.
  • the upper surface of the mounting plate 65 and the lower surface of the die 24 are arranged so as to face each other at a predetermined interval, and the upper surface of the punch 22 and the lower surface of the pressing plate 67 are arranged so as to face each other at a predetermined interval.
  • the predetermined interval at this time may be larger than the thickness of the ceramic green sheet base material 50.
  • the ceramic green sheet base material 50 is placed on the upper surfaces of the mounting plate 65 and the punch 22. Then, as shown in FIG. 5, the punch 22 and the mounting plate 65 are raised together until the main surface 50A of the ceramic green sheet base material 50 comes into contact with the lower surface of the pressing plate 67 and the lower surface of the die 24. The die 24 is restricted from moving in the vertical direction.
  • an elastic member 63 is provided on the upper side of the pressing plate 67, and the pressing plate 67 is configured to be urged downward by the elastic member 63 when it moves upward.
  • the end portion 51a of the ceramic green sheet base material 50 moves upward by the die 24. Is regulated.
  • the end portion 51a of the ceramic green sheet base material 50 is sandwiched between the die 24 and the mounting plate 65, and is urged toward the die 24 by the elastic member 61 via the mounting plate 65.
  • the holding plate 67 moves upward as the punch 22 moves upward, and enters the through hole 25 composed of the die 24. As a result, the central portion 53a of the ceramic green sheet base material 50 is punched out.
  • FIG. 7 is a diagram showing a state in which the central portion 53a of the ceramic green sheet base material 50 is punched out to obtain the ceramic green sheet 53 by moving the punch 22 upward (in the direction of arrow P1 in FIG. 7). ..
  • the holding plate 67 moves upward while being urged downward by the elastic member 63.
  • the elastic member 63 pressurizes the surface portion 53A with a predetermined pressure via the pressing plate 67.
  • the elastic member 61 pressurizes the surface portion 51B of the end portion 51 (sheet in which the punched hole is formed) with a predetermined pressure via the mounting plate 65.
  • the cutting device 200 urges the surface portion 53A on the side opposite to the surface portion 53B abutting on the punch 22 of the ceramic green sheet base material 50 toward the punch 22 with the elastic member 63, while urging the ceramic green.
  • the sheet base material 50 is punched out.
  • the central portion 53a of the ceramic green sheet base material 50 that is punched out while being urged toward the punch 22 becomes the ceramic green sheet 53.
  • the maximum height roughness (Rz) of the side surface of the ceramic green sheet 53 is reduced.
  • the maximum height roughness (Rz) of the side surface of the ceramic sintered body can be reduced.
  • the lower side (surface portion 53B side) of the side surface 54 (56) of the ceramic green sheet 53 is a shear section, and the upper side (surface portion 53A side) is a fracture surface.
  • the elastic member 63 and the holding plate 67 may be removed to collect the ceramic green sheet 53. As shown in FIG. 7, the ceramic green sheet 53 can be efficiently recovered by punching the ceramic green sheet 53 upward.
  • the maximum height roughness (Rz) of the side surface of the ceramic green sheet 53 obtained in this way is sufficiently small.
  • the fracture surface generated by punching can be sufficiently reduced. Therefore, the chips of the ceramic green sheet generated when the ceramic green sheet base material 50 is punched can be sufficiently reduced. Chips generated by punching adhere not only to the ceramic green sheet 53 but also to the die 20, the mounting plate 65, the holding plate 67, and the like. Since the die 20, the mounting plate 65, and the holding plate 67 are used repeatedly, the chips adhering to them will adhere to the ceramic green sheet to be punched out later. According to the manufacturing method of the present embodiment, since the generation of such chips is sufficiently reduced, the quality variation and yield of the ceramic sintered body 100 obtained by firing the ceramic green sheet 53 in the firing step are varied. Can be suppressed.
  • the ceramic green sheet 53 may be degreased before firing the ceramic green sheet 53 in the firing step.
  • the degreasing method is not particularly limited, and for example, the ceramic green sheet 53 may be heated to 300 to 700 ° C. in the air or in a non-oxidizing atmosphere such as nitrogen.
  • the heating time may be, for example, 1 to 10 hours.
  • the ceramic sintered body 100 can be obtained by firing the ceramic green sheet 53.
  • the temperature is raised to, for example, 1760 to 1840 ° C. in an inert gas atmosphere.
  • the holding time in the temperature range of 1760 to 1840 ° C. is, for example, 1 to 10 hours. Baking may be carried out under atmospheric pressure.
  • the sintering conditions are set so that the densification of the sintered body proceeds sufficiently. It may be set appropriately.
  • the ceramic sintered body 100 and the ceramic green sheet 53 are not limited to those having a rectangular main surface, and the main surface may have a polygonal shape other than a rectangular shape, or may be circular.
  • the cutting device 200 shown in FIGS. 5, 6 and 7 is configured such that the punch 22 moves upward, but the punch 22 is not limited to this.
  • the punch 22 may be configured to punch out the ceramic green sheet base material 50 by moving downward.
  • the ceramic green sheet base material 50 may be punched out by using a cutting device such as the cutting device 200 shown in FIGS. 5 and 7 turned upside down.
  • Example 1 Aluminum nitride powder (average particle size (median diameter): 1.2 ⁇ m), yttrium oxide powder (average particle size (median diameter): 0.6 ⁇ m), and aluminum oxide powder (average particle size (median diameter): 0. 25 ⁇ m) was blended in a mass ratio of 97: 1.5: 1.5 and mixed using a ball mill to obtain a mixed powder. 6 parts by mass of cellulose ether binder (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: Metrose), 5 parts by mass of glycerin (manufactured by Kao Corporation, trade name: Exepearl), and ion exchange with respect to 100 parts by mass of the mixed powder. 10 parts by mass of water was added and mixed for 1 minute using a Henchel mixer to obtain a molding raw material. This molding raw material was molded by an extrusion molding method to prepare a ceramic green sheet base material (thickness: 1.2 mm).
  • the solid content of the ceramic green sheet base material at the time of punching was 75% by mass.
  • a spring was used as the elastic members 61 and 63 for urging the central portion and the end portion of the ceramic green sheet base material toward the punch 22 and the die 24, respectively.
  • FIG. 8 is an optical micrograph showing the side surface of the ceramic green sheet magnified 200 times.
  • the upper part of the side surface shown in FIG. 8 is a shear section, and the lower part is a fracture surface.
  • Such a ceramic green sheet was degreased by heating in air at 570 ° C. for 5 hours.
  • the degreased ceramic green sheet was placed in a heating furnace and heated to 1800 ° C. in a nitrogen gas atmosphere (atmospheric pressure).
  • FIG. 9A is a photograph of a 3D image showing the side surface of the ceramic sintered body of Example 1.
  • FIG. 9B is a graph showing the uneven shape measured along the center line that divides the side surface in the Y direction.
  • FIG. 9C is a graph showing the uneven shape of the side surface measured along the Z direction.
  • the maximum height roughness (Rz) obtained from the uneven shape shown in FIG. 9B was 2.5 ⁇ m.
  • the arithmetic mean roughness (Ra) was in the range of 0.5 to 2 ⁇ m.
  • FIG. 9C it was found that a part on the left side is a fracture surface and a part on the right side is a shear section. From this ratio, it was confirmed that about 80% of the entire side surface was a sheared cross section.
  • the region ratios of Rz, Ra and shear sections on the other three sides of the ceramic sintered body were also similar to those shown in FIG. 9 (A).
  • a total of 100 ceramic green sheets were prepared by repeatedly using the cutting device 200 in the same procedure, and fired in the same manner to produce a ceramic sintered body.
  • the surface of the ceramic sintered body was visually inspected to check for the presence or absence of chips.
  • the number of ceramic sintered bodies to which chips were attached was 3% of the total number.
  • Example 1 A ceramic sintered body was produced in the same manner as in Example 1 except that the cutting device 250 shown in FIG. 10 was used instead of the cutting device 200.
  • the central portion of the ceramic green sheet base material 151 placed on the die 120 was punched by moving the punch 130 downward (in the direction of arrow P2 in FIG. 10).
  • the ceramic green sheet 153 punched by the punch 130 was not urged toward the punch 130 and freely fell into the collection container installed below the punch 130.
  • FIG. 11 is an optical micrograph showing the side surface of the ceramic green sheet 153 obtained by punching out at a magnification of 200 times. Most of the side surfaces shown in FIG. 11 had a fracture surface. From the comparison between FIGS. 8 and 11, the side surface of the ceramic green sheet of Comparative Example 1 had larger unevenness than the side surface of the ceramic green sheet of Example 1. This ceramic green sheet was fired under the same conditions as in Example 1 to obtain a ceramic sintered body.
  • FIG. 12A is a photograph of a 3D image showing the side surface of the ceramic sintered body of Comparative Example 1.
  • FIG. 12B is a graph showing the uneven shape measured along the center line that divides the side surface in the Y direction.
  • FIG. 12C is a graph showing the uneven shape of the side surface measured along the Z direction.
  • the maximum height roughness (Rz) obtained from the uneven shape shown in FIG. 12B was about 20 ⁇ m. Further, according to the uneven shape shown in FIG. 12 (C), it was found that the boundary between the shear cross section and the fracture surface was not clear, and most of them were fracture surfaces. The distribution of Rz and fracture surface on the other three sides of the ceramic sintered body was also similar to that of the side shown in FIG. 12 (A).
  • a total of 100 ceramic green sheets were prepared by repeatedly using the cutting device 250 in the same procedure, and fired in the same manner to produce a ceramic sintered body. The surface of the ceramic sintered body was visually inspected to check for the presence or absence of chips. As a result, the number of ceramic sintered bodies to which chips were attached was 5% of the total number.
  • Example 1 From the comparison between Example 1 and Comparative Example 1, it was confirmed that the adhesion of chips can be reduced in Example 1 in which the maximum height roughness (Rz) of the side surface of the ceramic sintered body is small.
  • Example 2 A ceramic green sheet was produced in the same manner as in Example 1 except that the clearance between the die 24 and the punch 22 in the cutting device was slightly wider than that in Example 1, to obtain a ceramic sintered body.
  • the area ratio of the region occupied by the sheared cross section with respect to the entire side surface of the ceramic sintered body, the maximum height roughness (Rz), and the arithmetic mean roughness (Ra) were determined.
  • the area ratio of the region occupied by the sheared surface was about 65%
  • the maximum height roughness (Rz) was 3.0 ⁇ m.
  • the arithmetic mean roughness (Ra) was in the range of 0.5 to 2 ⁇ m.
  • a total of 100 ceramic sintered bodies were produced, and the presence or absence of chips was examined. As a result, the ratio of the ceramic sintered body to which the chips were attached was 4% of the total number.
  • Example 3 The inner wall surface 24A of the die 24 in the cutting device of Example 1 was smoothed by using a grinding machine.
  • a ceramic green sheet was produced in the same manner as in Example 1 except that this cutting device was used, and a ceramic sintered body was obtained.
  • the area ratio of the region occupied by the sheared cross section with respect to the entire side surface of the ceramic sintered body, the maximum height roughness (Rz), and the arithmetic mean roughness (Ra) were determined. As a result, the area ratio of the region occupied by the sheared surface was about 80%, and the maximum height roughness (Rz) was 2.0 ⁇ m.
  • the arithmetic mean roughness (Ra) was in the range of 0.5 to 2 ⁇ m.
  • a total of 100 ceramic sintered bodies were produced, and the presence or absence of chips was examined.
  • the ratio of the ceramic sintered body to which the chips were attached was 2% of the total number.
  • a cutting blade capable of suppressing the generation of chips and a cutting device provided with the cutting blade are provided. Further, a manufacturing method capable of improving the quality and yield of the ceramic green sheet and the ceramic sintered body is provided. Further, a cutting method capable of improving the quality and yield of the workpiece to be cut is provided.

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PCT/JP2021/026339 2020-07-22 2021-07-13 セラミック焼結体、及びその製造方法 WO2022019181A1 (ja)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55171507U (enrdf_load_stackoverflow) * 1979-05-30 1980-12-09
JPS5712530U (enrdf_load_stackoverflow) * 1980-06-26 1982-01-22
JPS59153206U (ja) * 1983-03-31 1984-10-15 鳴海製陶株式会社 セラミツク生シ−ト打抜き用金型
JPS63115705A (ja) * 1986-11-05 1988-05-20 株式会社村田製作所 セラミツクグリ−ンシ−トの加工方法
JPH04282203A (ja) * 1991-03-12 1992-10-07 Toshiba Corp セラミックス基板およびその製造方法
JPH0663894A (ja) * 1992-08-21 1994-03-08 Matsushita Electric Works Ltd 無機質板材の打ち抜き方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013611Y2 (ja) * 1981-01-29 1985-05-01 日立化成工業株式会社 セラミツクグリ−ンシ−トの打抜き装置
JP3305221B2 (ja) * 1995-12-25 2002-07-22 日本碍子株式会社 シート材の順送り加工装置
JP4494546B2 (ja) * 1999-03-02 2010-06-30 株式会社リコー 打抜加工用基板、打抜基板及び該打抜基板の製造方法
JP2008055587A (ja) * 2006-09-04 2008-03-13 Ohmi High Tech Kk 板状基材のプレス打ち抜き加工方法およびプレス打ち抜き加工用金型
JP4949783B2 (ja) * 2006-09-08 2012-06-13 アイダエンジニアリング株式会社 精密打ち抜き型

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55171507U (enrdf_load_stackoverflow) * 1979-05-30 1980-12-09
JPS5712530U (enrdf_load_stackoverflow) * 1980-06-26 1982-01-22
JPS59153206U (ja) * 1983-03-31 1984-10-15 鳴海製陶株式会社 セラミツク生シ−ト打抜き用金型
JPS63115705A (ja) * 1986-11-05 1988-05-20 株式会社村田製作所 セラミツクグリ−ンシ−トの加工方法
JPH04282203A (ja) * 1991-03-12 1992-10-07 Toshiba Corp セラミックス基板およびその製造方法
JPH0663894A (ja) * 1992-08-21 1994-03-08 Matsushita Electric Works Ltd 無機質板材の打ち抜き方法

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