WO2022017029A1 - 有机发光显示面板及其制作方法、显示装置 - Google Patents

有机发光显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2022017029A1
WO2022017029A1 PCT/CN2021/098960 CN2021098960W WO2022017029A1 WO 2022017029 A1 WO2022017029 A1 WO 2022017029A1 CN 2021098960 W CN2021098960 W CN 2021098960W WO 2022017029 A1 WO2022017029 A1 WO 2022017029A1
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WIPO (PCT)
Prior art keywords
mask
substrate
pixel
organic light
layer
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PCT/CN2021/098960
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English (en)
French (fr)
Inventor
彭利满
刘亮亮
白妮妮
唐亮
郭强
吴岩
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/922,482 priority Critical patent/US20230180529A1/en
Publication of WO2022017029A1 publication Critical patent/WO2022017029A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Definitions

  • the present application relates to the field of display technology, and in particular, to an organic light-emitting display panel, a manufacturing method thereof, and a display device.
  • An organic light-emitting display panel is a display panel made of organic light-emitting diodes, which has the advantages of self-luminescence, high contrast, thin thickness, wide viewing angle, fast response speed, and can be used for flexible panels.
  • the organic light emitting diode includes an anode, an organic light emitting layer and a cathode which are stacked in sequence. After the organic light emitting diode is energized, the organic light emitting diode can emit light.
  • the edge of the anode is lifted, the lifted part can easily penetrate the organic light-emitting layer and directly contact the cathode and cause a short circuit, resulting in poor dark spots.
  • the edge of the anode is missing, the pixel display brightness will be insufficient , thereby affecting the display quality of the organic light-emitting display panel, and the above-mentioned process steps are many, the production cycle is long, and the production capacity is affected.
  • the present application seeks to alleviate or solve at least one of the above-mentioned problems to at least some extent.
  • the present application proposes a method of fabricating an organic light emitting display panel.
  • the method includes: forming an anode material layer on a substrate, forming a mask on a side of the anode material layer away from the substrate, and patterning the anode material layer based on the mask to form a plurality of anodes forming a pixel-defining layer covering the mask and the substrate, the pixel-defining layer having grooves between a plurality of the anodes, and performing a patterning process on the pixel-defining layer and the mask simultaneously, forming a plurality of pixel-defining structures, the pixel-defining structures cover the part of the substrate located between two adjacent anodes and cover part of the surface of the anodes, wherein the material constituting the mask and the The material of the pixel definition layer is the same, the pixel definition structure includes a first part formed by the mask, and a second part formed by the pixel definition layer, and the groove is located in the second part.
  • the process of peeling off the mask and the process of high-pressure water rinsing in the process of peeling off the mask can be omitted, the defects of missing or raised anode edges can be alleviated, the display quality of the organic light emitting display panel can be improved, and the production cycle can be shortened and improved. productivity and cost reduction.
  • forming the anode includes: forming a mask material layer on a side of the anode material layer away from the substrate, and exposing and developing the mask material layer to form the mask; The mask is used to etch the anode material layer to form the anode.
  • forming the pixel-defining structure includes: exposing and developing the pixel-defining layer and the mask to form the pixel-defining structure. Therefore, the existing production line and equipment for fabricating the pixel defining structure can be used for fabrication, the process is simple, and the synchronous patterning of the mask and the pixel defining layer can be realized.
  • the thickness of the mask is Therefore, the mask has a suitable thickness, and when high-pressure water rinse is performed before the subsequent formation of the pixel definition layer, the mask with the above-mentioned thickness can protect the anode well, so as to alleviate the occurrence of the edge of the anode during the high-pressure water rinse process. If it is missing or lifted, the mask with the above thickness will not significantly increase the thickness of the entire organic light emitting display panel because the mask and the remaining part of the pixel defining layer after patterning together constitute the pixel defining structure.
  • the substrate includes a substrate and a pixel circuit layer disposed on the substrate, and the anode material layer is disposed on a side of the pixel circuit layer away from the substrate.
  • the pixel circuit layer can be used to control the light emission of the subsequently formed organic light emitting diode and perform brightness compensation for the organic light emitting diode.
  • the present application proposes an organic light emitting display panel.
  • the organic light emitting display panel includes: a substrate; a plurality of anodes, the anodes are arranged on the substrate; a pixel defining structure, the pixel defining structure includes a first part and a second part, the first part covers the Part of the surface of the anode, the second part covers the first part and the part of the substrate located between two adjacent anodes, the material constituting the first part and the material constituting the second part same.
  • the process of peeling off the mask and the process of high-pressure water rinsing in the process of peeling off the mask can be omitted, the production cycle can be shortened, the production capacity can be improved, and the cost can be reduced, and at the same time, a flat and complete process can be obtained.
  • the anode of the organic light-emitting display panel is used to improve the dark spots or insufficient brightness of the organic light-emitting display panel, and improve the display quality of the organic light-emitting display panel.
  • the thickness of the first part is That is, in the process of fabricating the organic light-emitting display panel, the thickness of the mask is Therefore, when high-pressure water rinsing is performed before forming the pixel definition layer, the mask with the above thickness can protect the anode well, alleviate the edge loss or warping of the anode, and improve the display quality of the organic light emitting display panel.
  • a part of the second part covering the first part forms a groove with a part of the second part covering the substrate, and the groove has a depth greater than
  • the mask is not peeled off, and the mask and the subsequent pixel-defining layer are patterned synchronously to form a pixel-defining structure, so that the pixel-defining structure consists of two parts, and the first part is composed of two parts. is thicker, so that the second part forms a groove.
  • the substrate includes a substrate and a pixel circuit layer disposed on the substrate, and the anode is disposed on a side of the pixel circuit layer away from the substrate.
  • the pixel circuit layer can be used to control the light emission of the organic light emitting diode and perform luminance compensation for the organic light emitting diode.
  • the present application provides a display device.
  • the display device includes the aforementioned organic light-emitting display panel. Therefore, the display device has all the features and advantages of the organic light-emitting display panel described above, which will not be repeated here. In general, the display device has the advantages of high display quality, short production cycle, high productivity, and low cost.
  • FIG. 1 shows a schematic flowchart of a method for fabricating an organic light-emitting display panel according to an embodiment of the present application
  • FIG. 2 shows a schematic flowchart of a conventional method for fabricating an organic light-emitting display panel
  • FIG. 3 shows a schematic flowchart of a method for fabricating an organic light emitting display panel according to an embodiment of the present application
  • FIG. 4 shows a schematic structural diagram of an organic light emitting display panel according to an embodiment of the present application.
  • 100 substrate; 200: anode; 210: anode material layer; 300: photoresist mask; 400: pixel defining structure; 410: pixel defining layer; 500: mask; 10: first part; 20: second part ;30: Groove.
  • the current method of fabricating an organic light emitting display panel is as follows: Referring to FIG. 2 , first, an anode material layer 210 is formed on the substrate 100 (refer to (a) in FIG. 2 ). Subsequently, a photoresist mask 300 is formed on the side of the anode material layer 210 away from the substrate 100 , and a plurality of photoresist masks 300 are arranged at intervals (refer to (b) in FIG. 2 ).
  • the anode material layer 210 is etched based on the photoresist mask 300, the part of the anode material layer 210 not covered by the photoresist mask 300 is removed, the photoresist mask 300 is peeled off, and high-pressure water rinse is performed to An anode 200 is obtained (refer to (c) in FIG. 2 ). Subsequently, high-pressure water rinsing is continued, and a pixel-defining structure 400 is formed on the substrate 100. The pixel-defining structure 400 is located between two adjacent anodes 200 and covers a part of the anodes 200 (refer to (d) in FIG. 2 ). Subsequently, an organic light-emitting layer and a cathode (not shown in the figure) are sequentially formed on the side of the anode 200 away from the substrate 100 .
  • the anode 200 will be exposed continuously. After the exposed anode 200 is rinsed with high pressure water, the edge position is likely to be missing or lifted (refer to (c) in FIG. 2). Before setting the pixel defining structure 400, continuing to perform high-pressure water rinsing will further cause the edge of the anode 200 to be missing or lifted. After the organic light-emitting layer and the cathode are subsequently arranged on the anode, the lifted portion of the edge of the anode will penetrate the organic light-emitting layer.
  • the short circuit with the cathode leads to bad dark spots and the missing edge of the anode, which will cause insufficient pixel display brightness and affect the display quality of the organic light-emitting display panel.
  • the above process requires the stripping of the photoresist mask, and multiple times High-pressure water flushing has many processes and a long cycle, which affects production capacity.
  • the present application proposes a method for fabricating an organic light emitting display panel.
  • the present application optimizes the manufacturing process of the organic light emitting display panel.
  • the anode is fabricated by setting the mask of the same material as the pixel definition layer. Since the material of the mask and the material of the pixel definition layer The same, therefore, after the anode is formed, the mask on the anode can be retained, and after the subsequent formation of the pixel defining layer, the mask and the pixel defining layer can be patterned synchronously to obtain the pixel defining structure, that is, the mask and the pixel defining layer.
  • the remaining parts after patterning together constitute the pixel-defining structure, and the part used to form the pixel-defining structure is removed by the mask, which can be removed by synchronous patterning with the pixel-defining layer.
  • the present application does not need to peel off the mask, so that the process of mask peeling and the process of high-pressure water rinsing in the process of mask peeling can be omitted, thereby alleviating the loss of anode edge or Lift up, improve the dark spots or insufficient brightness of the organic light-emitting display panel, improve the display quality of the organic light-emitting display panel, reduce the production process, shorten the production cycle, and significantly increase the production capacity.
  • the mask on the anode can protect the anode before forming the pixel definition layer, even if high-pressure water is performed, further alleviate the loss or lift of the edge of the anode, and further improve the organic Display quality of light-emitting display panels.
  • the method includes:
  • a plurality of anodes are formed on the substrate.
  • the anode material layer 210 is formed on the substrate 100 (refer to (a) in FIG. 3 ).
  • a mask 500 is formed on the side of the anode material layer 210 away from the substrate 100 (refer to (b) in FIG. 3 ).
  • the anode material layer 210 is patterned based on the mask 500 to form a plurality of anodes 200 (refer to (c) in FIG. 3 ).
  • the material of the mask 500 is the same as the material of the pixel defining layer formed subsequently.
  • the mask on the anode can be retained, and the mask on the anode can be patterned synchronously with the pixel defining layer after the subsequent formation of the pixel defining layer to form a pixel defining structure, that is, the mask and the pixel defining layer
  • the remaining parts after layer patterning together form the pixel defining structure, so that the method can save the process of peeling off the mask and the process of high-pressure water rinsing in the process of peeling off the mask, so as to alleviate the loss or lift of the edge of the anode, and improve the organic light emitting display.
  • a mask material layer is formed on the side of the anode material layer away from the substrate, and then the mask material layer is exposed and developed to form a plurality of masks, Finally, the anode material layer is etched based on the above-mentioned mask to form a plurality of anodes.
  • the anode material layer is etched, the part of the anode material layer not covered by the mask is etched away, and the part of the anode material layer covered by the mask is the obtained anode.
  • the formation method of the mask material layer is not particularly limited, for example, a mask material layer may be coated on the side of the anode material layer away from the substrate.
  • the thickness of the mask may be like Therefore, the mask has a suitable thickness, and the mask with the above thickness can protect the anode well when the high-pressure water rinse is performed before the subsequent formation of the pixel definition layer, so as to alleviate the loss of the edge of the anode during the high-pressure water rinse process. Or tilted up, since the mask and the remaining part of the pixel defining layer after patterning together constitute the pixel defining structure, the mask with the above-mentioned thickness will not significantly increase the thickness of the entire organic light emitting display panel.
  • the specific material constituting the mask is not particularly limited, and those skilled in the art can design according to common materials of the pixel defining layer.
  • the substrate includes a substrate and a pixel circuit layer disposed on the substrate, the anode material layer is disposed on a side of the pixel circuit layer away from the substrate, and the pixel circuit layer is used to control the organic light-emitting diodes to emit light and to control the organic light-emitting diodes.
  • Light-emitting diodes perform brightness compensation.
  • the specific structure and formation method of the pixel circuit layer are not particularly limited, and those skilled in the art can design according to the pixel circuit structure commonly used in organic light emitting display panels.
  • the pixel defining layer and the mask are synchronously patterned to form a plurality of pixel defining structures.
  • the pixel defining layer 410 covering the mask 500 and the substrate 100 is formed (refer to (d) in FIG. 3 ). Since the anode is covered with the mask 500 , the pixel defining layer 410 is formed between the plurality of anodes 200 . grooves are formed between.
  • patterning is performed on the pixel defining layer 410 and the mask 500 synchronously to form a plurality of pixel defining structures 400 .
  • the pixel defining structures 400 cover the portion of the substrate 100 located between two adjacent anodes 200 and cover the portion of the anode 200 surface (refer to (e) in FIG. 3 ). Therefore, the mask formed in S100 can be patterned synchronously with the pixel definition layer in this step, and the mask and the remaining part of the pixel definition layer after patterning together form a pixel definition structure, and the pixel definition structure includes the mask formed by the mask.
  • the first portion formed, and the second portion formed by the pixel defining layer, the grooves described above are located in the second portion.
  • the remaining parts of the mask and the pixel defining layer are cured to form the pixel defining structure.
  • the pixel-defining structure can prevent cross-color between two adjacent organic light emitting diodes.
  • the edge of the anode can be effectively relieved from missing or lifted during the high-pressure water washing process. Defects, obtain a flat and complete anode, improve the organic light-emitting display panel dark spots or insufficient brightness and other defects, and improve the display quality of the organic light-emitting display panel. It should be noted that, with regard to the specific water pressure in the high-pressure water flushing process, the water pressure in the high-pressure water flushing process in the traditional organic light-emitting display panel manufacturing process can be used.
  • the patterning process on the mask and the pixel defining layer may be exposing and developing the mask and the pixel defining layer to obtain the pixel defining structure. Therefore, the existing production line and equipment for fabricating the pixel defining structure can be used for fabrication, the process is simple, and the synchronous patterning of the mask and the pixel defining layer can be realized.
  • a pixel definition structure is formed together. Since the thickness of the part of the pixel definition layer covering the mask is the same as that of the part covering the substrate, and the thickness of the mask is relatively thick, therefore, The part of the patterned pixel defining layer covering the mask and the part covering the substrate will form a deep groove (refer to (e) in FIG. 3 ), and the depth of the groove (refer to (e) in FIG.
  • the traditional pixel-defining structure is directly covered on the anode, and the thickness of the anode is relatively thin, generally in the range of several hundred
  • the part of the pixel-defining structure covering the anode and the part covering the substrate form inconspicuous grooves, in other words, the grooves are shallow in depth.
  • the method further includes: sequentially forming an organic light-emitting layer and a cathode on a side of the anode away from the substrate, thereby forming an organic light-emitting diode.
  • the specific fabrication process of the organic light-emitting layer and the cathode is not particularly limited, and those skilled in the art can design according to the conventional processes of the organic light-emitting layer and the cathode.
  • the method further includes: forming a support structure on a side of the pixel defining structure away from the substrate, and the support structure can support other substrates disposed subsequently to avoid other substrates being squeezed and affecting the performance of the organic light emitting diode.
  • the specific manufacturing process of the support structure is not particularly limited, and those skilled in the art can design the support structure according to conventional processes. For example, the support layer is first formed on the side of the pixel defining structure away from the substrate, then the support layer is patterned, and the remaining part after the patterning is cured to obtain the support structure.
  • the present application proposes an organic light emitting display panel.
  • the organic light emitting display panel may be an organic light emitting display panel fabricated by the method described above, and thus, the organic light emitting display panel has the same features as the organic light emitting display panel fabricated by the method described above and The advantages will not be repeated here.
  • the organic light emitting display panel includes: a substrate 100 , a plurality of anodes 200 and a pixel-defining structure 400 , wherein the anodes 200 are disposed on the substrate 100 , and the pixel-defining structure 400 includes the first part 10 and the second part 20, the first part 10 covers part of the surface of the anode 200, the second part 20 covers the first part 10 and the part of the substrate 100 located between two adjacent anodes 200, and the material constituting the first part 10 is the same as The materials constituting the second portion 20 are the same.
  • the process of mask peeling and the process of high-pressure water rinsing in the process of mask peeling can be omitted, the production cycle can be shortened, the production capacity can be improved, and the cost can be reduced, and at the same time, a flat and complete process can be obtained.
  • the anode of the organic light-emitting display panel is used to improve the dark spots or insufficient brightness of the organic light-emitting display panel, and improve the display quality of the organic light-emitting display panel.
  • a mask is formed on the side of the anode material layer away from the substrate, and the anode material layer is etched based on the above mask to form a plurality of anodes, And keep the mask on the anode, and then form a pixel definition layer covering the mask and the substrate, and finally pattern the mask and the pixel definition layer synchronously.
  • the first part is formed, and the pixel definition layer is The second part is formed after the patterning process, and the first part and the second part constitute the pixel defining structure, that is, the remaining parts of the mask and the pixel defining layer after the patterning process together constitute the pixel defining structure.
  • the thickness of the first part 10 may be That is to say, in the process of manufacturing the organic light emitting display panel, the thickness of the mask is Therefore, when high-pressure water rinsing is performed before forming the pixel definition layer, the mask with the above thickness can protect the anode well, alleviate the edge loss or warping of the anode, and improve the display quality of the organic light emitting display panel.
  • the thickness of the first part 10 is relatively thick, the part of the second part 20 covering the first part 10 and the part of the second part 20 covering the substrate 100 form the groove 30 , and the groove The depth of 30 (H as shown in Figure 4) is greater than
  • the mask is not peeled off, and the mask and the subsequent pixel-defining layer are patterned synchronously to form a pixel-defining structure, so that the pixel-defining structure consists of two parts, and the first part is composed of two parts.
  • the thickness of the second part is relatively thick, and the thickness of each part of the second part is consistent, so that the part of the second part covering the first part and the part covering the substrate form a groove.
  • the substrate 100 includes a substrate and a pixel circuit layer (not shown in the figure) disposed on the substrate, and the anode 200 is disposed on a side of the pixel circuit layer away from the substrate.
  • the pixel circuit layer can be used to control the light emission of the organic light emitting diode and perform luminance compensation for the organic light emitting diode.
  • the specific structure of the pixel circuit layer is not particularly limited, and those skilled in the art can design it according to the actual situation.
  • the present application provides a display device.
  • the display device includes the organic light emitting display panel described above. Therefore, the display device has all the features and advantages of the organic light emitting display panel described above, which will not be repeated here. In general, the display device has the advantages of high display quality, short production cycle, high productivity, and low cost.

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Abstract

本申请提出了一种有机发光显示面板及制作方法、显示装置。方法包括：在基板上形成阳极材料层，在阳极材料层远离基板的一侧形成掩膜，基于掩膜对阳极材料层进行图案化处理，形成多个阳极；形成覆盖掩膜和基板的像素界定层，像素界定层在多个阳极之间具有凹槽，对像素界定层和掩膜同步进行图案化处理，形成多个像素界定结构，像素界定结构覆盖基板位于相邻两个阳极之间的部分，并覆盖阳极的部分表面，构成掩膜的材料与构成像素界定层的材料相同，像素界定结构包括由掩膜构成的第一部，和由像素界定层构成的第二部，凹槽位于第二部中。

Description

有机发光显示面板及其制作方法、显示装置
优先权信息
本申请请求2020年07月21日向中国国家知识产权局提交的、专利申请号为202010702752.8的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及显示技术领域，具体地，涉及有机发光显示面板及其制作方法、显示装置。
背景技术
有机发光显示面板(OLED)是利用有机发光二极管制成的显示面板，具有自发光、对比度高、厚度薄、视角广、反应速度快、可用于挠曲性面板等优点。其中，有机发光二极管包括依次层叠设置的阳极、有机发光层和阴极，在给有机发光二极管通电后，可使有机发光二极管发光。
然而，目前的有机发光显示面板及其制作方法、显示装置仍有待改进。
发明内容
本申请是基于发明人对于以下事实和问题的发现和认识作出的：
发明人发现，目前的有机发光显示面板存在显示质量差以及生产周期长的问题。这主要是由于目前制作有机发光显示面板的方法存在缺陷导致的。具体的，目前在制作有机发光显示面板的过程中，对阳极材料层进行刻蚀之后，需要剥离阳极材料层上的光刻胶掩膜，以获得阳极，然而，在剥离光刻胶掩膜的过程中阳极会裸露出来，且会用到高压水冲洗，容易引起阳极边缘位置的缺失或者阳极边缘被吹起而出现卷曲，并且在剥离光刻胶掩膜后，设置像素界定层之前，还会进行高压水冲洗，此时，阳极的边缘更容易出现翘起或缺失。由于有机发光层的厚度较薄，阳极边缘翘起后，翘起的部分很容易穿透有机发光层与阴极直接接触而发生短路，引起暗点不良，阳极边缘缺失后，会造成像素显示亮度不够，从而影响有机发光显示面板的显示质量，且上述过程工序较多，生产周期较长，影响产能。
本申请旨在至少一定程度上缓解或解决上述提及问题中至少一个。
在本申请的一个方面，本申请提出了一种制作有机发光显示面板的方法。所述方法包括：在基板上形成阳极材料层，在所述阳极材料层远离所述基板的一侧形成掩膜，基于所述掩膜对所述阳极材料层进行图案化处理，形成多个阳极；形成覆盖所述掩膜和所述基板的像素界定层，所述像素界定层在多个所述阳极之间具有凹槽，对所述像素界定层和所述掩膜同步进行图案化处理，形成多个像素界定结构，所述像素界定结构覆盖所述基板位于相邻两个所述阳极之间的部分，并覆盖所述阳极的部分表面，其中，构成所述掩膜的材料与构成所述像素界定层的材料相同，所述像素界定结构包括由所述掩膜构 成的第一部，以及由所述像素界定层构成的第二部，所述凹槽位于所述第二部中。由此，可省去剥离掩膜的工序以及省去剥离掩膜过程中高压水冲洗的工序，缓解阳极边缘缺失或翘起的缺陷，提升有机发光显示面板的显示质量，并且缩短生产周期，提升产能，降低成本。
根据本申请的实施例，形成所述阳极包括：在所述阳极材料层远离所述基板的一侧形成掩膜材料层，对所述掩膜材料层进行曝光显影形成所述掩膜；基于所述掩膜对所述阳极材料层进行刻蚀，形成所述阳极。由此，可采用现有的产线和设备制作掩膜，无需增加新的产线和设备，且可以省去剥离掩膜的工序以及省去剥离掩膜过程中高压水冲洗的工序，缩短生产周期，降低成本。
根据本申请的实施例，形成所述像素界定结构包括：对所述像素界定层和所述掩膜进行曝光显影，以形成所述像素界定结构。由此，可利用现有制作像素界定结构的产线和设备进行制作，工艺简单且能实现对掩膜和像素界定层的同步图案化。
根据本申请的实施例，所述掩膜的厚度为
Figure PCTCN2021098960-appb-000001
由此，掩膜具有合适的厚度，在后续形成像素界定层之前进行高压水冲洗时，具有上述厚度的掩膜可以对阳极起到良好的保护作用，以缓解阳极边缘在高压水冲洗过程中发生缺失或者翘起，由于掩膜和像素界定层图案化之后剩余的部分共同构成像素界定结构，具有上述厚度的掩膜不会显著增加整个有机发光显示面板的厚度。
根据本申请的实施例，所述基板包括衬底以及设置在衬底上的像素电路层，所述阳极材料层设置在所述像素电路层远离所述衬底的一侧。由此，像素电路层可用于控制后续形成的有机发光二极管发光以及对有机发光二极管进行亮度补偿。
在本申请的另一方面，本申请提出了一种有机发光显示面板。所述有机发光显示面板包括：基板；多个阳极，所述阳极设置在所述基板上；像素界定结构，所述像素界定结构包括第一部和第二部，所述第一部覆盖所述阳极的部分表面，所述第二部覆盖所述第一部以及所述基板位于相邻两个所述阳极之间的部分，构成所述第一部的材料和构成所述第二部的材料相同。由此，在制作有机发光显示面板的过程中，可省去剥离掩膜的工序以及省去剥离掩膜过程中高压水冲洗的工序，缩短生产周期，提升产能，降低成本，同时获得平整且完整的阳极，以改善有机发光显示面板出现暗点或者亮度不够等不良，提升有机发光显示面板的显示质量。
根据本申请的实施例，所述第一部的厚度为
Figure PCTCN2021098960-appb-000002
即在制作有机发光显示面板的过程中，掩膜的厚度为
Figure PCTCN2021098960-appb-000003
由此，在形成像素界定层之前进行高压水冲洗时，具有上述厚度的掩膜可对阳极起到良好的保护作用，缓解阳极边缘缺失或者翘起，提高有机发光显示面板的显示质量。
根据本申请的实施例，所述第二部覆盖所述第一部的部分，与所述第二部覆盖所述基板的部分构成凹槽，所述凹槽的深度大于
Figure PCTCN2021098960-appb-000004
由于在制作有机发光显示面板的过程中，未剥离掩膜，且该掩膜与后续的像素界定层同步图案化后共同构成像素界定结构，从而使得像素界定结构由两部分构成，且第一部的厚度较厚，使得第二部形成凹槽。
根据本申请的实施例，所述基板包括衬底以及设置在衬底上的像素电路层，所述阳极设置在所述像素电路层远离所述衬底的一侧。由此，像素电路层可用于控制有机发光二极管发光以及对有机发光二极管进行亮度补偿。
在本申请的另一方面，本申请提出了一种显示装置。所述显示装置包括前面所述的有机发光显示面板。由此，该显示装置具有前面所述的有机发光显示面板的全部特征以及优点，在此不再赘述。总的来说，该显示装置具有显示质量高、生产周期短、产能高、成本低等优点。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1显示了根据本申请一个实施例的制作有机发光显示面板的方法的流程示意图；
图2显示了传统制作有机发光显示面板的方法的流程示意图；
图3显示了根据本申请一个实施例的制作有机发光显示面板的方法的流程示意图；
图4显示了根据本申请一个实施例的有机发光显示面板的结构示意图。
附图标记：
100：基板；200：阳极；210：阳极材料层；300：光刻胶掩膜；400：像素界定结构；410：像素界定层；500：掩膜；10：第一部；20：第二部；30：凹槽。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
本申请是基于发明人的以下发现而完成的：
目前制作有机发光显示面板的方法如下：参考图2，首先，在基板100上形成阳极材料层210(参考图2中的(a))。随后，在阳极材料层210远离基板100的一侧形成光刻胶掩膜300，多个光刻胶掩膜300间隔设置(参考图2中的(b))。随后，基于光刻胶掩膜300对阳极材料层210进行刻蚀，去掉阳极材料层210未被光刻胶掩膜300覆盖的部分，剥离光刻胶掩膜300，并进行高压水冲洗，以获得阳极200(参考图2中的(c))。随后，继续进行高压水冲洗，然后在基板100上形成像素界定结构400，像素界定结构400位于相邻两个阳极200之间，并覆盖阳极200的一部分(参考图2中的(d))。随后，在阳极200远离基板100的一侧依次形成有机发光层和阴极(图中未示出)。
在剥离光刻胶掩膜300的过程中，阳极200会不断裸露出来，裸露出来的阳极200经高压水冲洗后，边缘位置容易出现缺失或者翘起(参考图2中的(c))，在设置像 素界定结构400之前，继续进行高压水冲洗，会进一步引起阳极200边缘的缺失或者翘起，后续在该阳极上设置有机发光层和阴极后，阳极边缘翘起的部分会穿透有机发光层而与阴极发生短路，导致出现暗点不良，阳极边缘缺失，会引起像素显示亮度不够，影响有机发光显示面板的显示质量，且上述过程需要进行光刻胶掩膜的剥离，以及需要进行多次高压水冲洗，工序较多、周期较长，影响产能。
鉴于此，在本申请的一个方面，本申请提出了一种制作有机发光显示面板的方法。
根据本申请的实施例，本申请对有机发光显示面板的制作工艺进行优化，具体的，通过设置与像素界定层材料相同的掩膜进行阳极的制作，由于掩膜的材料与像素界定层的材料相同，因此，在形成阳极后，可以保留阳极上的掩膜，后续形成像素界定层之后，可对掩膜和像素界定层同步进行图案化处理，获得像素界定结构，即掩膜和像素界定层图案化之后剩余的部分共同构成像素界定结构，且掩膜除去用于形成像素界定结构的部分，可通过与像素界定层同步图案化而去除。由此，本申请在制作有机发光显示面板的过程中，不需要剥离掩膜，从而可省去掩膜剥离的工序以及省去掩膜剥离过程中高压水冲洗的工序，从而缓解阳极边缘缺失或者翘起，改善有机发光显示面板出现暗点或者亮度不够等不良，提升有机发光显示面板的显示质量，且减少制作工序，缩短生产周期，显著提升产能。此外，由于不剥离掩膜，因此，后续在形成像素界定层之前，即便进行高压水冲洗，阳极上的掩膜可对阳极起到保护作用，进一步缓解阳极边缘的缺失或者翘起，进一步提升有机发光显示面板的显示质量。
下面根据本申请的具体实施例，对该方法的各个步骤进行详细说明：
根据本申请的实施例，参考图1，该方法包括：
S100：在基板上形成多个阳极
根据本申请的实施例，在该步骤中，在基板上形成多个阳极。具体的，首先，在基板100上形成阳极材料层210(参考图3中的(a))。随后，在阳极材料层210远离基板100的一侧形成掩膜500(参考图3中的(b))。随后，基于掩膜500对阳极材料层210进行图案化处理，形成多个阳极200(参考图3中的(c))。其中，掩膜500的材料与后续形成的像素界定层的材料相同。由此，在该步骤中，可以保留阳极上的掩膜，且阳极上的掩膜可以在后续形成像素界定层之后，与像素界定层同步图案化，形成像素界定结构，即掩膜和像素界定层图案化之后剩余的部分共同构成像素界定结构，从而该方法可省去剥离掩膜的工序以及省去剥离掩膜过程中高压水冲洗的工序，缓解阳极边缘缺失或翘起，提升有机发光显示面板的显示质量，以及缩短生产周期，提升产能。
根据本申请的实施例，在形成阳极的过程中，首先，在阳极材料层远离基板的一侧形成一层掩膜材料层，随后对掩膜材料层进行曝光显影，以形成多个掩膜，最后基于上述掩膜对阳极材料层进行刻蚀，以形成多个阳极。本领域技术人员能够理解的是，在对阳极材料层进行刻蚀时，刻蚀掉阳极材料层未被掩膜覆盖的部分，阳极材料层被掩膜覆盖的部分即为获得的阳极。由此，可采用现有的产线和设备制作掩膜，无需增加新的产线和设备，且可以省去掩膜剥离的工序以及省去掩膜剥离过程中高压水冲洗的工序，显 著降低成本，缩短生产周期。关于掩膜材料层的形成方法不受特别限制，例如，可以在阳极材料层远离基板的一侧涂覆一层掩膜材料层。
根据本申请的实施例，掩膜的厚度可以为
Figure PCTCN2021098960-appb-000005
如
Figure PCTCN2021098960-appb-000006
Figure PCTCN2021098960-appb-000007
由此，掩膜具有合适的厚度，在后续形成像素界定层之前进行高压水冲洗时，具有上述厚度的掩膜可以对阳极起到良好的保护作用，以缓解高压水冲洗过程中阳极边缘发生缺失或者翘起，由于掩膜和像素界定层图案化之后剩余的部分共同构成像素界定结构，具有上述厚度的掩膜不会显著增加整个有机发光显示面板的厚度。
关于构成掩膜的具体材料不受特别限制，本领域技术人员可以根据像素界定层的常用材料进行设计。
根据本申请的实施例，基板包括衬底和设置在衬底上的像素电路层，阳极材料层设置在像素电路层远离衬底的一侧，像素电路层用于控制有机发光二极管发光以及对有机发光二极管进行亮度补偿。关于像素电路层的具体结构以及形成方法不受特别限制，本领域技术人员可以根据有机发光显示面板中常用的像素电路结构进行设计。
S200：对像素界定层和掩膜同步进行图案化处理，形成多个像素界定结构
根据本申请的实施例，在该步骤中，对像素界定层和掩膜同步进行图案化处理，形成多个像素界定结构。具体的，首先，形成覆盖掩膜500和基板100的像素界定层410(参考图3中的(d))，由于阳极上覆盖有掩膜500，因此，像素界定层410在多个阳极200之间形成凹槽。随后，对像素界定层410和掩膜500同步进行图案化处理，形成多个像素界定结构400，像素界定结构400覆盖基板100位于相邻两个阳极200之间的部分，并覆盖阳极200的部分表面(参考图3中的(e))。由此，S100中形成的掩膜，可在该步骤中，与像素界定层同步图案化，掩膜和像素界定层图案化之后剩余的部分共同构成像素界定结构，该像素界定结构包括由掩膜形成的第一部，以及由像素界定层形成的第二部，前面描述的凹槽位于第二部中。
根据本申请的实施例，在对掩膜和像素界定层进行曝光显影后，对掩膜和像素界定层剩余的部分进行固化，以形成像素界定结构。像素界定结构可防止相邻两个有机发光二极管之间发生串色。
根据本申请的实施例，在形成像素界定层之前，继续进行高压水冲洗，此时，由于阳极上有掩膜覆盖，因此，可有效缓解阳极边缘在高压水冲洗过程中发生缺失或者翘起等缺陷，获得平整且完整的阳极，改善有机发光显示面板出现暗点或者亮度不够等不良，提升有机发光显示面板的显示质量。需要说明的是，关于高压水冲洗过程中的具体水压，可采用传统有机发光显示面板制作过程中高压水冲洗过程中的水压。
根据本申请的实施例，对掩膜和像素界定层进行图案化处理可以是对掩膜和像素界定层进行曝光显影，以获得像素界定结构。由此，可利用现有制作像素界定结构的产线和设备进行制作，工艺简单且能实现对掩膜和像素界定层的同步图案化。
根据本申请的实施例，掩膜和像素界定层图案化之后共同构成像素界定结构，由于像素界定层覆盖掩膜的部分，和覆盖基板的部分厚度一致，且掩膜的厚度较厚，因此， 图案化后的像素界定层覆盖掩膜的部分，和覆盖基板的部分会构成深度较深的凹槽(参考图3中的(e))，且凹槽的深度(如图3中的(e)中所示出的H)大于
Figure PCTCN2021098960-appb-000008
而传统的像素界定结构直接覆盖在阳极上，且阳极的厚度较薄，一般在几百
Figure PCTCN2021098960-appb-000009
像素界定结构覆盖阳极的部分，和覆盖基板的部分构成的凹槽不明显，换句话说，凹槽深度较浅。
根据本申请的实施例，该方法还包括：在阳极远离基板的一侧依次形成有机发光层和阴极，由此，形成有机发光二极管。关于有机发光层和阴极的具体制作过程不受特别限制，本领域技术人员可以根据有机发光层和阴极的常规工艺进行设计。
根据本申请的实施例，该方法还包括：在像素界定结构远离基板的一侧形成支撑结构，支撑结构可支撑后续设置的其他基板，以避免其他基板受挤压而影响有机发光二极管的性能。关于支撑结构的具体制作过程不受特别限制，本领域技术人员可以根据支撑结构的常规工艺进行设计。例如，首先在像素界定结构远离基板的一侧形成支撑层，然后对支撑层进行图案化处理，以及对图案化之后剩余的部分进行固化，以获得支撑结构。
在本申请的另一方面，本申请提出了一种有机发光显示面板。根据本申请的实施例，该有机发光显示面板可以是利用前面描述的方法制作的有机发光显示面板，由此，该有机发光显示面板具有与前面描述的方法制作的有机发光显示面板相同的特征以及优点，在此不再赘述。
根据本申请的实施例，参考图4，该有机发光显示面板包括：基板100、多个阳极200和像素界定结构400，其中，阳极200设置在基板100上，像素界定结构400包括第一部10和第二部20，第一部10覆盖阳极200的部分表面，第二部20覆盖第一部10以及基板100位于相邻两个阳极200之间的部分，且构成第一部10的材料与构成第二部20的材料相同。由此，在制作有机发光显示面板的过程中，可省去掩膜剥离的工序以及省去掩膜剥离过程中高压水冲洗的工序，缩短生产周期，提升产能，降低成本，同时获得平整且完整的阳极，以改善有机发光显示面板出现暗点或者亮度不够等不良，提升有机发光显示面板的显示质量。
需要说明的是，如前所述，在制作有机发光显示面板的过程中，在阳极材料层远离基板的一侧形成掩膜，基于上述掩膜对阳极材料层进行刻蚀，形成多个阳极，并保留阳极上的掩膜，后续形成覆盖掩膜和基板的像素界定层，最后对掩膜和像素界定层同步进行图案化处理，掩膜经图案化处理后形成第一部，像素界定层经图案化处理后形成第二部，第一部和第二部构成像素界定结构，即掩膜和像素界定层经图案化处理后剩余的部分共同构成像素界定结构。
根据本申请的实施例，第一部10的厚度可以为
Figure PCTCN2021098960-appb-000010
也即是说，在制作有机发光显示面板的过程中，掩膜的厚度为
Figure PCTCN2021098960-appb-000011
由此，在形成像素界定层之前进行高压水冲洗时，具有上述厚度的掩膜可对阳极起到良好的保护作用，缓解阳极边缘缺失或者翘起，提高有机发光显示面板的显示质量。
根据本申请的实施例，由于第一部10的厚度相对较厚，因此，第二部20覆盖第一 部10的部分，与第二部20覆盖基板100的部分构成凹槽30，且凹槽30的深度(如图4中所示出的H)大于
Figure PCTCN2021098960-appb-000012
由于在制作有机发光显示面板的过程中，未剥离掩膜，且该掩膜与后续的像素界定层同步图案化后共同构成像素界定结构，从而使得像素界定结构由两部分构成，且第一部的厚度较厚，第二部各个部分的厚度一致，从而使得第二部覆盖第一部的部分和覆盖基板的部分构成凹槽。
根据本申请的实施例，基板100包括衬底以及设置在衬底上的像素电路层(图中未示出)，阳极200设置在像素电路层远离衬底的一侧。由此，像素电路层可用于控制有机发光二极管发光以及对有机发光二极管进行亮度补偿。关于像素电路层的具体结构不受特别限制，本领域技术人员可以根据实际情况进行设计。
在本申请的另一方面，本申请提出了一种显示装置。根据本申请的实施例，该显示装置包括前面描述的有机发光显示面板，由此，该显示装置具有前面描述的有机发光显示面板的全部特征以及优点，在此不再赘述。总的来说，该显示装置具有显示质量高、生产周期短、产能高、成本低等优点。
在本申请的描述中，术语“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请而不是要求本申请必须以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本说明书的描述中，参考术语“一个实施例”、“另一个实施例”等的描述意指结合该实施例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。另外，需要说明的是，本说明书中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (10)

  1. 一种制作有机发光显示面板的方法，包括：
    在基板上形成阳极材料层，在所述阳极材料层远离所述基板的一侧形成掩膜，基于所述掩膜对所述阳极材料层进行图案化处理，形成多个阳极；
    形成覆盖所述掩膜和所述基板的像素界定层，所述像素界定层在多个所述阳极之间具有凹槽，对所述像素界定层和所述掩膜同步进行图案化处理，形成多个像素界定结构，所述像素界定结构覆盖所述基板位于相邻两个所述阳极之间的部分，并覆盖所述阳极的部分表面，
    其中，构成所述掩膜的材料与构成所述像素界定层的材料相同，所述像素界定结构包括由所述掩膜构成的第一部，以及由所述像素界定层构成的第二部，所述凹槽位于所述第二部中。
  2. 根据权利要求1所述的方法，形成所述阳极包括：
    在所述阳极材料层远离所述基板的一侧形成掩膜材料层，对所述掩膜材料层进行曝光显影形成所述掩膜；
    基于所述掩膜对所述阳极材料层进行刻蚀，形成所述阳极。
  3. 根据权利要求1或2所述的方法，形成所述像素界定结构包括：
    对所述像素界定层和所述掩膜进行曝光显影，以形成所述像素界定结构。
  4. 根据权利要求1-3任一项所述的方法，所述掩膜的厚度为
    Figure PCTCN2021098960-appb-100001
  5. 根据权利要求1-4任一项所述的方法，所述基板包括衬底以及设置在衬底上的像素电路层，所述阳极材料层设置在所述像素电路层远离所述衬底的一侧。
  6. 一种有机发光显示面板，包括：
    基板；
    多个阳极，所述阳极设置在所述基板上；
    像素界定结构，所述像素界定结构包括第一部和第二部，所述第一部覆盖所述阳极的部分表面，所述第二部覆盖所述第一部以及所述基板位于相邻两个所述阳极之间的部分，构成所述第一部的材料和构成所述第二部的材料相同。
  7. 根据权利要求6所述的有机发光显示面板，所述第一部的厚度为
    Figure PCTCN2021098960-appb-100002
  8. 根据权利要求7所述的有机发光显示面板，所述第二部覆盖所述第一部的部分，与所述第二部覆盖所述基板的部分构成凹槽，所述凹槽的深度大于
    Figure PCTCN2021098960-appb-100003
  9. 根据权利要求6-8任一项所述的有机发光显示面板，所述基板包括衬底以及设置在衬底上的像素电路层，所述阳极设置在所述像素电路层远离所述衬底的一侧。
  10. 一种显示装置，包括权利要求6-9任一项所述的有机发光显示面板。
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