WO2022011889A1

WO2022011889A1 - Continuous production line using msap process

Info

Publication number: WO2022011889A1
Application number: PCT/CN2020/125806
Authority: WO
Inventors: 李齐良
Original assignee: 柏承科技(昆山)股份有限公司
Priority date: 2020-07-13
Filing date: 2020-11-02
Publication date: 2022-01-20

Abstract

A continuous production line using an mSAP process, the production line comprising a flying target (4) for vertically conveying a circuit board and a continuous wire provided along the conveying direction of the flying target (4). The continuous wire comprises a developing wire (1) and a VCP copper-plated wire (2) or a developing wire (1), a VCP copper-plated wire (2), and a film stripping wire (3), which are arranged in sequence. Each rack on the flying target (4) comprises a clamping assembly (41) and a lifting device (42) for driving the clamping assembly (41) to lift. The described production line can continuously complete a plurality of processes, processing is directly connected, the transport time is reduced, the risk of contamination during transport is reduced, and high productivity can be implemented at low costs.

Description

Continuous production line for mSAP process

technical field

The invention relates to the technical field of circuit board manufacturing, in particular to a continuous production line for an mSAP manufacturing process.

Background technique

Applications such as 5G communication and the Internet of Things require ultra-high-speed and high-integrity signal transmission, which poses new challenges to the existing Printed Circuit Board (PCB) manufacturing technology, prompting communication PCBs to move towards low-circuit lines. Roughness, high-density interconnection and high signal integrity. At present, through the development of new materials for PCB manufacturing, improvement of manufacturing process and structural design, etc., to improve the high-frequency and high-speed performance of PCBs is a research hotspot in the industry. High-frequency and high-speed PCB manufacturing technology based on research materials and mSAP technology will become the future trend. The three dimensions of new kinetic energy, automotive electronics, and 5G high frequency will be the focus of future PCB investment.

The mSAP process is generally produced in three lines, namely developing line, electroplating line and film stripping line. The steps of the three lines are:

Development line: tearing film - feeding - developing - pickling - washing - drying - discharging;

Electroplating line: feeding - cleaning - hot water washing - water washing - pickling - copper plating - blanking;

Stripping line: feeding - stripping - hot water washing - washing - anti-oxidation - washing - drying - discharging.

The collocation of the mSAP process of the existing board factories known by the investigation is as follows:

Therefore, the mSAP equipment connection process technology is currently in the vacuum period. Although the industry uses the mSAP process to upgrade products, it generally adopts different transmission forms for segmented production. The overall management and control of the incoming quality parameters cannot exclude the uncontrollable factors of personnel operations.

Therefore, it is necessary to provide a pipeline with a new structure to solve the above problems.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a continuous production line for the mSAP process, which not only effectively integrates the automation of operation management and control, but also saves investment in manpower and equipment.

The present invention achieves the above object through the following technical solutions: a continuous production line for the mSAP process, comprising a flying target for vertically transporting circuit boards and a continuous line arranged along the conveying direction of the flying target, and the continuous line includes sequentially arranged The developing line and VCP copper plated wire or the developing line, the VCP copper plated wire and the film stripping wire, each hanger on the flying target includes a clamping assembly and a lifting device that drives the clamping assembly to rise and fall.

Specifically, the developing line includes a developing tank, a water washing tank, a drying tank and a cooling tank which are arranged in sequence.

Specifically, the VCP copper-plated wire includes a pickling tank and a plurality of copper plating tanks arranged in sequence.

Specifically, the film stripping line includes a water washing tank, a film stripping tank, a hot water washing tank, a water washing tank and a drying tank which are arranged in sequence.

Further, the clamping assembly includes a hollow frame, a plurality of upper clamping claws are arranged under the upper frame of the frame, a plurality of lower clamping claws are arranged above the lower frame of the frame, and a lower part of the lower frame of the frame is arranged with The guide rod is provided with a guide sleeve matched with the guide rod in each groove of the developing line, the VCP copper-plated wire and the film stripping line in the assembly line.

Specifically, the inlet of the developing line is provided with an automatic feeding device and a front buffer device.

Specifically, the outlet of the stripping wire is provided with a rear buffer device and an automatic unloading device.

The beneficial effects of adopting the above technical scheme are:

This assembly line can simultaneously complete the three processes of development, vertical electroplating, and film stripping. The processes are directly connected, reducing the handling time, reducing the risk of handling pollution, and achieving high productivity at low cost.

Description of drawings

Fig. 1 is the floor plan of the continuous production line of mSAP process;

Figure 2 is a front view of a single pylon on a flying target.

The numbers in the figure represent:

1-Development line, 11-Development tank, 12-Water washing tank, 13-Drying tank, 14-Cooling tank;

2-VCP copper-plated wire, 21-pickling tank, 22-copper plating tank;

3-film stripping line, 31-water washing tank, 32-film stripping tank, 33-hot water washing tank, 34-water washing tank, 35-drying tank,

4-Flying target, 41-Clamping assembly, 411-Frame, 412-Upper clamping jaw, 413-Lower clamping jaw, 414-Guiding rod, 42-Lifting device;

51-automatic feeding device, 52-front buffer device;

61-rear buffer device, 62-automatic unloading device.

detailed description

The present invention will be further described in detail below in conjunction with specific embodiments.

Example:

As shown in FIG. 1 and FIG. 2 , the present invention is a continuous production line for the mSAP process, including a flying target 4 for vertically transporting the circuit board and a continuous line arranged along the conveying direction of the flying target 4. The continuous line includes The developing line 1, the VCP copper-coated wire 2 and the stripping wire 3 arranged in sequence, the developing line 1, the VCP copper-coated wire 2 and the stripping wire 3 are all vertically transported by the flying target 4 to the circuit board. Each hanger includes a clamping assembly 51 and a lifting device 42 that drives the clamping assembly 41 to ascend and descend. Because the VCP copper plated wire 2 adopts vertical feeding, in order to reduce the trouble of changing the direction of the circuit board, the developing wire 1 and the film stripping wire 3 also adopt the vertical feeding method, and use the flying target 4 to transfer. The circuit board is fixed on the clamping component 41 of the flying target 4, and then immersed in the tank body by the lifting device 42. After one operation is completed, the lifting device 42 lifts the clamping component 41, and then transports it to the top of the next tank body, and then do Immerse and lift once until the peeling process is complete. The anti-oxidation function of the original stripped wire will be achieved in the subsequent etching. This assembly line can simultaneously complete the three processes of developing, vertical electroplating and film stripping, and the processes are directly connected to reduce the handling time. The whole process also does not require workers to participate, avoiding the risk of contaminating the board with sweat on the hands. Certain cleaning steps can also be saved due to the reduced risk of contamination, enabling high productivity at low cost. This production line can also only have the developing line 1 and the VCP copper plating line 2, which saves the turnover process between the two processes, and also helps to improve the productivity compared with the discontinuous line.

As shown in FIG. 1 , the developing line 1 includes a developing tank 11 , a water washing tank 12 , a drying tank 13 and a cooling tank 14 arranged in sequence, and the VCP copper plating line 2 includes a pickling tank 21 and a plurality of copper plating tanks 22 arranged in sequence. The film stripping line 3 includes a water washing tank 31 , a film stripping tank 32 , a hot water washing tank 33 , a water washing tank 34 and a drying tank 35 , which are arranged in sequence. The above structure includes all the units required for the entire section of the mSAP process, which is independently controlled by the software system, manpower, environmental protection and safety, document unification, product batch control, and quality control, all of which can realize automatic screening and intelligent management. The production process can be completed automatically without manual operation, and the production only needs to be inspected and managed by personnel.

The following is the situation comparison table of this mSAP process continuous line embodiment and discontinuous line:

As can be seen from the above table, the new continuous production line can significantly save manpower and reduce auxiliary equipment, which can save a lot of money every month.

As shown in FIG. 2 , the clamping assembly 41 includes a hollow frame 411 , a plurality of upper clamping claws 412 are arranged under the upper frame of the frame 411 , a plurality of lower clamping claws 413 are arranged above the lower frame of the frame 411 , and the lower part of the lower frame of the frame 411 There are two positive guide rods 414 , and each groove of the developing line 1 , the VCP copper plated wire 2 and the film stripping line 3 in the assembly line is provided with a positive guide sleeve (not shown) matching the positive guide rod 414 . The clamping assembly 41 can use the upper clamping jaw 412 and the lower clamping jaw 413 to clamp and fix the upper and lower sides of the circuit board at the same time, and the guide rod 414 can be used to fix the position of the frame 411 from below to avoid the circuit board from shaking. Anti-stick, scratches and other issues.

As shown in FIG. 1 , the inlet of the developing line 1 is provided with an automatic feeding device 51 and a front buffer device 52 . The automatic feeding device 51 can uniformly feed the circuit boards by means of the carrier plate jig, thereby reducing the manual feeding. The front buffer device 52 can make the circuit board in place first, and when the front circuit board enters the next tank body, the rear circuit board is immediately fed in, so as to ensure the continuity of feeding.

As shown in FIG. 1 , the outlet of the stripping wire 3 is provided with a rear buffer device 61 and an automatic unloading device 62 . The rear buffer device 61 temporarily stores the circuit boards that have passed through the film stripping line 3, and waits for the automatic unloading device 62 to unload them, which effectively reduces the waiting time of workers.

The foregoing are merely some of the embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention.

Claims

A continuous production line for mSAP manufacturing process is characterized in that: it comprises a flying target used for vertical transportation of circuit boards and a continuous line arranged along the conveying direction of the flying target, the continuous line comprising a developing line and a VCP plating line arranged in sequence Copper wire or developing wire, VCP copper plated wire and film stripping wire, each hanger on the flying target includes a clamping assembly and a lifting device that drives the clamping assembly to rise and fall.
The continuous production line for the mSAP process according to claim 1, wherein the developing line comprises a developing tank, a water washing tank, a drying tank and a cooling tank which are arranged in sequence.
The continuous production line for the mSAP process according to claim 1, wherein the VCP copper plating line comprises a pickling tank and a plurality of copper plating tanks arranged in sequence.
The continuous production line for the mSAP process according to claim 1, wherein the film stripping line comprises a water washing tank, a film stripping tank, a hot water washing tank, a water washing tank and a drying tank which are arranged in sequence.
The continuous production line for mSAP process according to any one of claims 1 to 4, wherein the clamping assembly comprises a hollow frame, a plurality of upper clamping jaws are arranged under the upper frame of the frame, and the lower part of the frame There are several lower jaws above the frame, two guide rods are arranged below the lower frame of the frame, and each groove of the developing line, the VCP copper plating wire and the film stripping line in the assembly line is equipped with a matching guide. The guide sleeve for the rod.
The continuous production line for the mSAP process according to claim 1, wherein the entrance of the developing line is provided with an automatic feeding device and a front buffer device.
The continuous production line for the mSAP process according to claim 1, wherein the outlet of the stripping line is provided with a rear buffer device and an automatic unloading device.