TW202243557A - Film stripping, degumming and copper melting three-in-one process capable of preventing degumming pollution - Google Patents

Abstract

The invention belongs to the technical field of printed circuit board manufacturing, and relates to a film stripping, degumming and copper melting three-in-one process capable of preventing degumming pollution, which comprises the following steps of: laser processing: roughening the surface of a PCB with a copper layer on the surface, and then performing laser drilling on the PCB; micro-etching: immersing the drilled PCB into a micro-etching solution added with a film stripping agent, and stripping a brownification film or a coarsening film while micro-etching; and copper plating pretreatment: continuously completing glue removal and copper melting processes on the PCB. According to the method, the film stripping agent is added into the micro-etching liquid, so that the brownification film and the coarsening film are removed at the same time in the micro-etching process so as to prevent the brownification film and the coarsening film from polluting a degumming tank agent, the step after drilling can be completed in the same assembly line, the production efficiency is improved, and the scratch risk caused by carrying between different assembly lines is also avoided.

Description

Two-in-one system for removing glue and copper

The invention relates to the technical field of printed circuit board manufacturing, in particular to a two-in-one system for deglue removal and copper melting.

With the advancement of science and technology and the continuous development of society, the printed circuit board (Printed Circuit Board, PCB) manufacturing industry is facing tremendous pressure brought about by the continuous increase in labor and material costs. It is necessary to save materials and reduce production costs on the premise of ensuring quality. Simplifying and integrating the production process has become an urgent problem to be solved in the current printed circuit board manufacturing industry. In the current production process, the High Density Interconnect (HDI) board has a brown film on the board after laser drilling Or roughened film, if it is directly degummed and micro-etched, it will inevitably pollute the bath solution. Therefore, it is necessary to perform a film-removing process before degumming, and then go through degumming and micro-etching so as not to pollute the bath solution. Currently, the industry adopts The methods are all after laser drilling, first go through the production line of de-browning film or roughening film, and then go out to the production line of glue removal. This operation method increases the number of personnel handling and creates more risk of scratches. It takes manpower and material resources.

As shown in Figure 1A, a printed circuit board 10 is provided, the surface of the printed circuit board 10 has a copper layer 11, the surface of the copper layer 11 forms a browning film or a roughened film 12, and the printed circuit board 10 is passed through Laser drilling produces at least one hole 13 and an excess glue slag 14; as shown in Figure 1B and Figure 2A, the printed circuit board 10 is horizontal and first passes through a first production line 20 for automatic board placement 21 and film removal process 22 , drying 23, drying 24 to the automatic closing board 25, and also returning the browning film or roughening film 12; as shown in Figure 1C and Figure 2B, the printed circuit board 10 is horizontal and carried out through a second production line 30 Automatic board release 31, glue removal process 32, blow drying 33, drying 34 to automatic board receiving 35, and also remove the glue residue 14; as shown in Figure 1D and Figure 2C, the printed circuit board 10 is horizontal and then passes through a first The third production line 40 performs automatic plate placement 41 , chemical copper process 42 , blow-drying 43 , drying 44 to automatic plate receiving 45 , and a chemical copper 131 is deposited in the hole 13 .

As above, the first production line 20, the second production line 30 and the third production line 40 are three single horizontal production lines, and the printed circuit board 10 passes through the first production line 20, the second production line 30 and the third production line horizontally. Only the production line 40 can complete film removal, glue removal and copper melting, which not only causes the problems of low production efficiency and poor economic benefits of the printed circuit board 10, but also causes the frequent transfer of the printed circuit board 10 among the three single-level production lines, resulting in the risk of scratches and The problem that the holding time between the first production line 20, the second production line 30, and the third production line 40 is overtime, and the horizontal production line is prone to the occasional problem of water crossing between the liquid medicine tanks, also makes the printing The surface of the circuit board 10 is in contact with the conveying structure, which is not conducive to the manufacturing process. Therefore, it is necessary to develop a low-cost printed circuit board manufacturing method and its system to solve the above problems.

The main purpose of the present invention is to provide a two-in-one system for degumming and copper melting. The degumming process and copper melting process are in the same production line to solve the problems of low production efficiency, poor economic benefits, and problems of the prior art printed circuit boards. The risk of scratches and the problems of overtime dwell time can improve the production efficiency, economic benefits, product yield and production line reliability.

Another object of the present invention is to provide a two-in-one system for degumming and copperizing, in which the printed circuit board is vertically transported from the degumming process to the continuous process of the copperizing process, so as to solve the problem that the production line of the previous technical level is easy to produce drugs. The problem of occasional water stringing between sinks, thereby avoiding the improvement of the effect of reducing the concentration of chemicals.

Yet another object of the present invention is to provide a two-in-one system for degumming and copperizing, in which the surface of the printed circuit board is conveyed in a continuous process from the degumming process to the copperizing process in a non-contact manner, so as to solve the printing problem of the prior art. The surface of the circuit board is in contact with the conveying structure, which is not conducive to the process, thereby improving the efficiency of the process.

In order to achieve the above-mentioned purpose, the technical means adopted by the present invention includes: a plurality of grooves, each of which integrates a glue removal process and a copper chemical process in sequence; thereby, a printed circuit board is provided, and the printed circuit board is laser-treated. Drilling to produce at least one hole and excess smear, making the printed circuit board go through the deglue process to remove the smear, and then go through the copper chemical process to deposit a thin layer of chemical copper on the hole; and a Conveying line, the conveying line includes a transmission belt, transmission wheel, motor and fixture, the conveying line uses the fixture to clamp the printed circuit board, so that the printed circuit board is vertically transported to each plurality of slots, and the continuous process is carried out in sequence The glue removal process, the copper chemical process, and the conveying line can keep the printed circuit board in a vertical state all the time, so that the surface of the printed circuit board can be conveyed non-contact.

With the help of the above-mentioned technical means, in the present invention, the degumming process and the copper chemical process are in the same production line, and then the printed circuit board is vertically transported from the degumming process to the continuous process of the copper chemical process, and the printing The surface of the circuit board is conveyed in a continuous process from the deglue process to the copper chemical process in a non-contact manner, thereby avoiding the contamination of the chemical in the deglue tank, improving production efficiency, economic benefits, product yield and production line reliability, and avoiding Reduce the concentration of chemicals and improve the efficiency of the process.

First, please refer to Fig. 3A ~ Fig. 5B, which discloses a three-in-one method of film removal, glue removal, and copper removal, which can also prevent glue pollution. The steps include: (a). Provide a printed circuit board 50, the The surface of the printed circuit board 50 has a copper layer 51, the surface of the copper layer 51 is roughened to form a film 52, and the printed circuit board 50 is drilled by laser to produce at least one hole 53 and an excess glue slag 54 , in this embodiment, the roughening treatment uses a browning agent to make the film 52 a browned film, or uses a roughening agent to make the film 52 a roughened film, the purpose of which is to make the printed circuit board 50 The surface is more conducive to the collection of laser energy, improves drilling efficiency, saves laser energy, reduces the poor shape of the hole 53 that is a blind hole, and increases the roundness of the hole 53 that is a blind hole, as shown in Figure 3A and Figure 3C shown.

(b). Integrate a film removal process 62, a glue removal process 63 and a copper chemical process 64 in sequence, and the film removal process 62 provides a microetching solution with a film stripping agent, so that the printed circuit board 50 is first After the film stripping process 62, the film 52 is peeled off by micro-etching, and then the glue residue 54 is removed through the degumming process 63, and then a thin layer of copper is deposited on the hole 53 through the copper plating process 64. Electroless copper 531, complete the thinning of the copper layer 51 and the removal of the film 52 at the same time, so as to prevent it from contaminating the chemical in the glue removal tank, as shown in Fig. 3B and Fig. 3C.

In addition to the three-in-one method of film removal, glue removal, and copper melting disclosed above, the present invention further provides a two-in-one method of glue removal and copper plating, which has the same method and structure as the previous disclosed embodiment, and is represented by the same figure number. The steps include: (a). Provide a printed circuit board 50, the printed circuit board 50 produces at least one hole 53 and an excess glue residue 54 through laser drilling; and (b). Integrate a deglue process in sequence 63 and a copper chemical process 64, the glue residue 54 is removed through the degumming process 63, and then a thin layer of chemical copper 531 is deposited on the hole through the copper chemical process 64. Therefore, the two-in-one method of removing glue and copper of the present invention is different from the above-mentioned three-in-one method only in the defilming process 62, but the means of using the continuous process system are the same.

Therefore, as shown in Fig. 4A, Fig. 4B and Fig. 4C, it also discloses a three-in-one system including film removal, degumming, and copper plating, and also includes: a two-in-one system for degumming and copper plating; this embodiment Among them, a plurality of slots N, each of the slots N is sequentially integrated with a film stripping process 62, a glue removal process 63, and a copper chemical process 64, or a continuous process of a glue removal process 63 and a copper chemical process 64, forming A system, in this embodiment, the defilming process 62 includes the first microetching and the first water washing in sequence, and corresponding to each of the tanks N is the first microetching tank and the first water washing tank in sequence; The glue process 63 includes bulking, the second water washing, degumming, the third water washing, neutralization, the fourth water washing, the second micro-etching, and the fifth water washing in sequence, and the corresponding grooves N are sequentially The bulking tank, the second washing tank, the glue removing tank, the third washing tank, the neutralization tank, the fourth washing tank, the second micro-etching tank, and the fifth washing tank; the copper chemical process 64 includes the whole hole, the first Six washings, third microetching, seventh washing, pre-soaking, activation, eighth washing, quickening, ninth washing, copper, hot water washing, tenth washing, corresponding to each tank N The order is the whole hole tank, the sixth washing tank, the third micro-etching tank, the seventh washing tank, the pre-soaking tank, the activation tank, the eighth washing tank, the acceleration tank, the ninth washing tank, the copper bath, and the hot water washing tank, the tenth washing tank, so that the defilming process 62 includes at least the first microetching and the degumming process 63 at least includes bulking, and the first microetching corresponds to one of the tanks N as the first microetching The etching tank corresponds to the bulking, and the other tank N is a bulking tank, so that the first micro-etching tank can be added before the bulking tank, but it is not limited thereto.

Continuing from the above, after integrating the three-in-one continuous process of the stripping process 62, the degumming process 63 and the copper chemical process 64 or the two-in-one continuous process of the degumming process 63 and the copper chemical process 64, it can cooperate with automatic board placement 61. Blow drying 65, drying 66 and automatic board closing 67 to form a production line 60, so that the film removal process 62, the degumming process 63, the copper chemical process 64 or the degumming process 63, the copper chemical process 64 process The serialization not only improves the production efficiency, but also avoids the risk of scratches caused by the transfer of the printed circuit board 50 between different production lines.

Further, a conveying line 70 may be further included, and the conveying line 70 can clamp and hang the printed circuit board 50 so that the printed circuit board 50 is vertical, and the printed circuit board 50 is vertically conveyed in the film-removing process 62, the removing The continuous process from the glue process 63 to the copper process 64 or from the glue removal process 63 to the copper process 64 enables the non-conductive surface of the blind holes and through holes of the printed circuit board 50 to deposit a layer of conductive chemical copper, Then, the hole and the surface are plated with the copper thickness required by the customer through electrolytic copper ions, so as to realize the conduction of different layers of lines, and the transmission line 70 can keep the printed circuit board 50 in a vertical state all the time, and the printed circuit board 50 can always be in a vertical state. The surface of the plate 50 is conveyed in a non-contact manner, therefore, the surface will not be blocked substantially to affect the treatment effect, and it is also convenient for washing. In this embodiment, the conveying line 70 includes a transmission belt 71, a transmission wheel 72, a motor 73 and a clamp 74 , can also be lifted and conveyed, and horizontally conveyed, mainly to convey the printed circuit board 50 to each of the tanks N for continuous process, and the conveying line 70 can be a chain conveying line, a pneumatic conveying line, a hydraulic conveying line, an electric conveying line, Hydraulic conveying lines, guide rail conveying lines or other conveying lines that can realize lifting conveying and horizontal conveying, but not limited thereto.

Further, the microetching solution includes 3~8wt% sulfuric acid, 3~12wt% hydrogen peroxide, 3~8wt% film stripping agent and a copper ion content less than 45g/L, or the microetching solution includes 5±2wt% sulfuric acid , 4±1wt% hydrogen peroxide, 4±1wt% film stripping agent and copper ion content less than 40g/L, according to experience, the microetching solution can make the treatment effect of the printed circuit board 50 ideal with such a formula. The bite amount in the first micro-etching is controlled at 10~50u" or 10~15u", and the unit of u" means micro-inch. This bite amount can ensure that the browning film or roughening film is completely removed , prevent again that the copper thickness is too thin and cause open circuit problem.As shown in Figure 5A, when not using this microetching solution and this film 52 did not move back, directly enter the liquid medicine tank of this deglue process 63 and this copper chemical process 64, After the film 52 is reacted with the liquid medicine, some areas on the surface of the printed circuit board 50 are also hardened and cannot be removed. Then, after the printed circuit board 50 undergoes an electroplating process, an exposure process, and an etching process, the printed circuit board 50 The surface of the plate 50 presents a plurality of lines 55, but there is an anti-etching in the hardened area, forming an abnormal point 56. On the contrary, as shown in FIG. 5B, when the microetching solution is used and the film 52 is retreated, the adhesive removal process is directly entered. 63 and the chemical tank of the copper chemical process 64, and the surface of the printed circuit board 50 has no residual hardened matter, and then, the printed circuit board 50 undergoes the electroplating process, the exposure process and the etching process, and on the printed circuit board 50 There are multiple circuits 55 on the surface, and there is no abnormal phenomenon of anti-etching.

Based on such a structure, after the present invention integrates the three-in-one continuous process of the stripping process 62, the deglue process 63 and the copper chemical process 64, it saves the cost of manpower, materials and equipment, and improves economic benefits, as shown in the following table Said: project Before integration after integration difference Manpower (2 people in day shift and 2 people in night shift for each production line) 12 people 4 people 8 people Materials (Water consumption in film removal process) 19.8T(ton) 6.6T(ton) 13.2T(ton) Equipment (retractable trigger) 6 units 2 units 4 units

What have been described above are only some embodiments of the present invention. For those skilled in the art, without departing from the inventive concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention.

Furthermore, based on the structure disclosed above; the present invention can also integrate a two-in-one system for removing glue and removing copper, which includes: a plurality of tanks N, each of which is sequentially integrated with a glue removing process 63 and a copper chemical process 64; Thereby, a printed circuit board 50 is provided to carry out the continuous process sequentially. The printed circuit board 50 is drilled by laser to produce at least one hole and an excess glue residue 54, so that the printed circuit board 50 is subjected to the glue removal process 63 And remove this slag 54, continue through this copper chemical process 63 and deposit a thin layer of chemical copper 531 to the hole; Fixture 74; the conveying line 70 hangs the printed circuit board 50 with the fixture 74, so that the printed circuit board 50 is vertically transported to each of the plurality of slots N, and the deglue process 63 and the continuous process are carried out in sequence. The copper plating process 64, and the conveying line 70 can keep the printed circuit board 50 in a vertical state all the time, so that the surface of the printed circuit board 50 can be transported in a non-contact manner.

With the help of the above-mentioned technical means, the present invention puts the glue removal process 63 and the copper plating process 64 on the same production line, and then vertically transports the printed circuit board 50 to the continuous process from the glue removal process 63 to the copper plating process 64 , and use the surface of the printed circuit board 50 to transport the continuous process from the degumming process 63 to the copper process 64 in a non-contact manner, thereby avoiding the contamination of the chemical in the degumming tank, improving production efficiency, economic benefits, and product quality The efficiency and reliability of the production line, avoiding the reduction of the concentration of the chemical agent, and improving the efficiency of the process are improved.

50: Printed circuit board 51: copper layer 52: Membrane 53: hole 531: chemical copper 54: glue residue 55: line 56: Outliers 60: Production line 61: Automatic board placement 62: Removal process 63: Degumming process 64: copper process 65: blow dry 66: drying 67: Automatic closing board 70: Conveyor line 71: drive belt 72: drive wheel 73: motor 74: fixture N: Slot a~b: steps

FIG. 1A is a schematic diagram of conventional laser drilling of a printed circuit board. FIG. 1B is a schematic diagram of a film-removing process of a conventional printed circuit board. FIG. 1C is a schematic diagram of a conventional deglue process for printed circuit boards. FIG. 1D is a schematic diagram of a conventional copper plating process for printed circuit boards. Fig. 2A is a schematic diagram of a conventional first production line. FIG. 2B is a schematic diagram of a conventional second production line. Fig. 2C is a schematic diagram of a conventional third production line. FIG. 3A is a schematic diagram of laser drilling of a printed circuit board according to the present invention. Fig. 3B is a schematic diagram of the printed circuit board of the present invention completing defilming, glue removal, and copperization in the same production line. FIG. 3C is a flow chart of laser drilling, film removal, glue removal and copperization of the printed circuit board of the present invention. FIG. 4A is a schematic diagram of the integration of film stripping process, glue removal process and copper chemical process in the present invention. FIG. 4B is a schematic diagram of the vertical conveyance of the printed circuit board of the present invention from the film-removing process to the glue-removing process. FIG. 4C is a schematic diagram of the vertical transportation of the printed circuit board of the present invention from the glue removal process to the copper chemical process. FIG. 5A is a metallographic diagram of the printed circuit board of the present invention after electroplating process, exposure process and etching process without film removal. FIG. 5B is a metallographic diagram of the printed circuit board of the present invention after film removal and electroplating process, exposure process and etching process.

50: Printed circuit board

62: Removal process

63: Degumming process

64: copper process

70: Conveyor line

71: drive belt

72: drive wheel

73: motor

74: fixture

N: Slot

Claims (1)

A two-in-one system for removing glue and copper, including: A plurality of slots, each of which is sequentially integrated with a deglue process and a copper removal process; thereby, a printed circuit board is provided for a continuous process in sequence, and the printed circuit board is drilled by laser to produce at least one hole and redundant A smear, the printed circuit board is subjected to the deglue process to remove the smear, and then goes through the copper plating process to deposit a thin layer of chemical copper on the hole; and A conveying line, which includes a transmission belt, a transmission wheel, a motor, and a fixture; the conveying line uses the fixture to clamp the printed circuit board, so that the printed circuit board is vertically transported to each of the plurality of slots, and continuous in sequence The glue removal process and the copper chemical process of the manufacturing process, and the conveying line can keep the printed circuit board in a vertical state all the time, so that the surface of the printed circuit board can be conveyed non-contact.

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