TW202243557A - Film stripping, degumming and copper melting three-in-one process capable of preventing degumming pollution - Google Patents
Film stripping, degumming and copper melting three-in-one process capable of preventing degumming pollution Download PDFInfo
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- TW202243557A TW202243557A TW111117227A TW111117227A TW202243557A TW 202243557 A TW202243557 A TW 202243557A TW 111117227 A TW111117227 A TW 111117227A TW 111117227 A TW111117227 A TW 111117227A TW 202243557 A TW202243557 A TW 202243557A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Paints Or Removers (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
本發明涉及印刷電路板製造技術領域,特別涉及一種除膠、化銅二合一系統。The invention relates to the technical field of printed circuit board manufacturing, in particular to a two-in-one system for deglue removal and copper melting.
隨著科技進步,社會的不斷發展,印刷電路板(Printed Circuit Board,PCB)製造業面臨著人力與物料成本不斷增加所帶來的巨大壓力,在保證品質的前提下節約物料,降低生產成本輸出,簡化整合生產工藝流程已成為當前印刷電路板製造業急需解決的問題,在目前生產過程中,高密度互連技術(High Density Interconnect,HDI)板經過雷射鑽孔後板面有棕化膜或粗化膜,如果直接經過除膠、微蝕勢必會污染槽液,故需要在除膠前做退膜製程後,再經過除膠、微蝕才不會污染槽液,目前業界所採用的方式均為雷射鑽孔後,先經過去棕化膜或粗化膜的生產線,再出至除膠的生產線,此種作業方式增加了人員搬運次數,產生了更多的刮傷風險,且需要耗費人力物力。With the advancement of science and technology and the continuous development of society, the printed circuit board (Printed Circuit Board, PCB) manufacturing industry is facing tremendous pressure brought about by the continuous increase in labor and material costs. It is necessary to save materials and reduce production costs on the premise of ensuring quality. Simplifying and integrating the production process has become an urgent problem to be solved in the current printed circuit board manufacturing industry. In the current production process, the High Density Interconnect (HDI) board has a brown film on the board after laser drilling Or roughened film, if it is directly degummed and micro-etched, it will inevitably pollute the bath solution. Therefore, it is necessary to perform a film-removing process before degumming, and then go through degumming and micro-etching so as not to pollute the bath solution. Currently, the industry adopts The methods are all after laser drilling, first go through the production line of de-browning film or roughening film, and then go out to the production line of glue removal. This operation method increases the number of personnel handling and creates more risk of scratches. It takes manpower and material resources.
如圖1A所示,提供一印刷電路板10,該印刷電路板10的表面具有一銅層11,該銅層11的表面形成一棕化膜或粗化膜12,且該印刷電路板10經由雷射鑽孔而產生至少一孔13與多餘一膠渣14;如圖1B及圖2A所示,該印刷電路板10呈水平先經過一第一生產線20進行自動放板21、退膜製程22、吹乾23、烘乾24至自動收板25,亦退該棕化膜或粗化膜12;如圖1C及圖2B所示,該印刷電路板10呈水平又經過一第二生產線30進行自動放板31、除膠製程32、吹乾33、烘乾34至自動收板35,亦去該膠渣14;如圖1D及圖2C所示,該印刷電路板10呈水平再經過一第三生產線40進行自動放板41、化銅製程42、吹乾43、烘乾44至自動收板45,亦該孔13沉積一化學銅131。As shown in Figure 1A, a printed
承上,該第一生產線20、該第二生產線30及該第三生產線40為三條單一水平生產線,而該印刷電路板10呈水平經過該第一生產線20、該第二生產線30及該第三生產線40才能完成退膜、除膠及化銅,不僅造成該印刷電路板10生產效率低及經濟效益差之問題,也造成三條單一水平生產線之間頻繁轉運該印刷電路板10導致刮傷風險及該第一生產線20、該第二生產線30及該第三生產線40之間停留時間(holding time)超時之問題,且水平生產線容易產生藥水槽間的偶發性串水之問題,也使該印刷電路板10的表面接觸到輸送結構而不利於製程,因此,有必要開發一種低成本的印刷電路板製造方法及其系統來解決以上問題。As above, the
本發明之主要目的,係在於提供一種除膠、化銅二合一系統,其除膠製程、化銅製程在同一條生產線,用以解決先前技術印刷電路板的生產效率低、經濟效益差、刮傷風險及停留時間超時之問題點,進而提升生產效率、經濟效益、產品良率及產線可靠度之功效增進。The main purpose of the present invention is to provide a two-in-one system for degumming and copper melting. The degumming process and copper melting process are in the same production line to solve the problems of low production efficiency, poor economic benefits, and problems of the prior art printed circuit boards. The risk of scratches and the problems of overtime dwell time can improve the production efficiency, economic benefits, product yield and production line reliability.
本發明之另一目的,係在於提供一種除膠、化銅二合一系統,其印刷電路板垂直輸送於除膠製程至化銅製程之連續化製程,用以解決先前技術水平生產線容易產生藥水槽間的偶發性串水之問題,進而避免降低藥劑的濃度之功效增進。Another object of the present invention is to provide a two-in-one system for degumming and copperizing, in which the printed circuit board is vertically transported from the degumming process to the continuous process of the copperizing process, so as to solve the problem that the production line of the previous technical level is easy to produce drugs. The problem of occasional water stringing between sinks, thereby avoiding the improvement of the effect of reducing the concentration of chemicals.
本發明之再一目的,係在於提供一種除膠、化銅二合一系統,其印刷電路板的表面以非接觸輸送於除膠製程至化銅製程之連續化製程,用以解決先前技術印刷電路板之表面接觸到輸送結構而不利於製程之問題,進而提升製程效率之功效增進。Yet another object of the present invention is to provide a two-in-one system for degumming and copperizing, in which the surface of the printed circuit board is conveyed in a continuous process from the degumming process to the copperizing process in a non-contact manner, so as to solve the printing problem of the prior art. The surface of the circuit board is in contact with the conveying structure, which is not conducive to the process, thereby improving the efficiency of the process.
為達上述目的,本發明採用之技術手段,其包含: 複數槽,各該槽依序整合一除膠製程及一化銅製程;藉此,提供一印刷電路板,該印刷電路板經由雷射鑽孔而產生至少一孔與多餘一膠渣,令該印刷電路板經過該除膠製程而去除該膠渣,再接續經過該化銅製程而對該孔沉積一層薄薄之化學銅;以及一輸送線,該輸送線包括一傳動帶、傳動輪、馬達及夾具,該輸送線以該夾具夾掛該印刷電路板,使該印刷電路板呈垂直輸送至各複數槽,依序進行連續化製程之該除膠製程、及該化銅製程,且該輸送線能夠讓該印刷電路板始終呈垂直狀態,使該印刷電路板的表面以非接觸輸送。In order to achieve the above-mentioned purpose, the technical means adopted by the present invention includes: a plurality of grooves, each of which integrates a glue removal process and a copper chemical process in sequence; thereby, a printed circuit board is provided, and the printed circuit board is laser-treated. Drilling to produce at least one hole and excess smear, making the printed circuit board go through the deglue process to remove the smear, and then go through the copper chemical process to deposit a thin layer of chemical copper on the hole; and a Conveying line, the conveying line includes a transmission belt, transmission wheel, motor and fixture, the conveying line uses the fixture to clamp the printed circuit board, so that the printed circuit board is vertically transported to each plurality of slots, and the continuous process is carried out in sequence The glue removal process, the copper chemical process, and the conveying line can keep the printed circuit board in a vertical state all the time, so that the surface of the printed circuit board can be conveyed non-contact.
藉助上揭技術手段,本發明在該除膠製程、該化銅製程在同一條生產線,再將該印刷電路板垂直輸送於該除膠製程至該化銅製程之連續化製程,並以該印刷電路板的表面以非接觸輸送於該除膠製程至該化銅製程之連續化製程,進而避免除膠槽的藥劑被污染、提升生產效率、經濟效益、產品良率及產線可靠度、避免降低藥劑的濃度、提升製程效率之功效增進。With the help of the above-mentioned technical means, in the present invention, the degumming process and the copper chemical process are in the same production line, and then the printed circuit board is vertically transported from the degumming process to the continuous process of the copper chemical process, and the printing The surface of the circuit board is conveyed in a continuous process from the deglue process to the copper chemical process in a non-contact manner, thereby avoiding the contamination of the chemical in the deglue tank, improving production efficiency, economic benefits, product yield and production line reliability, and avoiding Reduce the concentration of chemicals and improve the efficiency of the process.
首先,請參閱圖3A~圖5B所示,其揭露一種退膜、除膠、化銅三合一方法,亦能防除膠污染,其步驟包含:(a).提供一印刷電路板50,該印刷電路板50的表面具有一銅層51,該銅層51的表面進行粗糙化處理形成一膜52,且該印刷電路板50經由雷射鑽孔而產生至少一孔53與多餘一膠渣54,在本實施例中,該粗糙化處理採用棕化劑,使該膜52為棕化膜,或採用粗糙化劑,使該膜52為粗化膜,其目的在於讓該印刷電路板50的表面更利於雷射能量匯集,提高鑽孔效率,節省雷射能量,降低該孔53為盲孔的孔型不良及增加該孔53為盲孔的孔型真圓度,如圖3A、圖3C所示。First, please refer to Fig. 3A ~ Fig. 5B, which discloses a three-in-one method of film removal, glue removal, and copper removal, which can also prevent glue pollution. The steps include: (a). Provide a printed
(b).依序整合一退膜製程62、一除膠製程63及一化銅製程64,且該退膜製程62提供一具有膜剝除劑之微蝕液,令該印刷電路板50先經過該退膜製程62進行微蝕而同時剝除該膜52,又接續經過該除膠製程63而去除該膠渣54,再接續經過該化銅製程64而對該孔53沉積一層薄薄之化學銅531,同時完成該銅層51的減薄與該膜52的除去,以免其污染除膠槽的藥劑,如圖3B、圖3C所示。(b). Integrate a
除了前述揭露的退膜、除膠、化銅三合一方法,本發明進一步提供一種除膠、化銅二合一方法,其與前揭實施例相同的方法及結構,以相同圖號表示,其步驟包含:(a).提供一印刷電路板50,該印刷電路板50經由雷射鑽孔而產生至少一孔53與多餘一膠渣54;以及(b).依序整合一除膠製程63及一化銅製程64,經過該除膠製程63而去除該膠渣54,再接續經過該化銅製程64而對該孔沉積一層薄薄之化學銅531。是以,本發明之除膠、化銅二合一方法,與前述三合一方法,其差異僅在於退膜製程62,但其連續化製程系統的運用手段為相同。In addition to the three-in-one method of film removal, glue removal, and copper melting disclosed above, the present invention further provides a two-in-one method of glue removal and copper plating, which has the same method and structure as the previous disclosed embodiment, and is represented by the same figure number. The steps include: (a). Provide a printed
是以,如圖4A、圖4B及圖4C所示,其同時揭露了包含:退膜、除膠、化銅三合一系統,也包含:除膠、化銅二合一系統;本實施例中,其複數槽N,各該槽N依序整合一退膜製程62、一除膠製程63及一化銅製程64,或一除膠製程63及一化銅製程64之連續化製程,形成一個系統,在本實施例中,該退膜製程62依序包括第一次微蝕、第一次水洗,而對應各該槽N依序為第一微蝕槽、第一水洗槽;該除膠製程63依序包括膨鬆、第二次水洗、除膠、第三次水洗、中和、第四次水洗、第二次微蝕、第五次水洗,而對應各該槽N依序為膨鬆槽、第二水洗槽、除膠槽、第三水洗槽、中和槽、第四水洗槽、第二微蝕槽、第五水洗槽;該化銅製程64依序包括整孔、第六次水洗、第三次微蝕、第七次水洗、預浸、活化、第八次水洗、速化、第九次水洗、化銅、熱水洗、第十次水洗,而對應各該槽N依序為整孔槽、第六水洗槽、第三微蝕槽、第七水洗槽、預浸槽、活化槽、第八水洗槽、速化槽、第九水洗槽、化銅槽、熱水洗槽、第十水洗槽,如此一來,該退膜製程62至少包括第一次微蝕與該除膠製程63至少包括膨鬆,而該第一次微蝕對應其中一個槽N為第一微蝕槽與該膨鬆對應其中另一個槽N為膨鬆槽,使該膨鬆槽前可新增該第一微蝕槽,但不限定於此。Therefore, as shown in Fig. 4A, Fig. 4B and Fig. 4C, it also discloses a three-in-one system including film removal, degumming, and copper plating, and also includes: a two-in-one system for degumming and copper plating; this embodiment Among them, a plurality of slots N, each of the slots N is sequentially integrated with a
承上,經整合該退膜製程62、該除膠製程63及該化銅製程64三合一或該除膠製程63及該化銅製程64二合一之連續化製程,可配合自動放板61、吹乾65、烘乾66及自動收板67形成一生產線60,使該退膜製程62、該除膠製程63、該化銅製程64或該除膠製程63、該化銅製程64工藝連續化,不僅提高了生產效率,還避免了該印刷電路板50在不同生產線之間搬運而導致的刮傷風險。Continuing from the above, after integrating the three-in-one continuous process of the
進一步,更可包括一輸送線70,該輸送線70可夾掛該印刷電路板50,使該印刷電路板50呈垂直,並將該印刷電路板50垂直輸送於該退膜製程62、該除膠製程63至該化銅製程64或該除膠製程63至該化銅製程64之連續化製程,使得該印刷電路板50的盲孔與通孔的非導體表面沉積一層可導電的化學銅,而後經過電解銅離子的方式給孔內與表面鍍上客戶需求規格的銅厚,實現不同層別的線路導通,且該輸送線70能夠讓該印刷電路板50始終呈垂直狀態,而該印刷電路板50的表面以非接觸輸送,因此,該表面基本不會受到阻擋而影響處理效果,也方便沖洗,在本實施例中,該輸送線70包括傳動帶71、傳動輪72、馬達73及夾具74,亦可升降輸送、水平輸送,主要在於輸送該印刷電路板50至各該槽N進行連續化製程,且該輸送線70可為鏈條輸送線、氣動輸送線、液壓輸送線、電動輸送線、油壓輸送線、導軌輸送線或其他可實現升降輸送、水平輸送之輸送線,但不限定於此。Further, a conveying
進一步,該微蝕液中包括3~8wt%硫酸、3~12wt%雙氧水、3~8wt%膜剝除劑及小於45g/L的銅離子含量,或該微蝕液中包括5±2wt%硫酸、4±1wt%雙氧水、4±1wt%膜剝除劑及小於40g/L的銅離子含量,按照經驗,該微蝕液以這樣的配方能讓該印刷電路板50的處理效果比較理想。該第一次微蝕中的咬蝕量控制在10~50u"或10~15u",而u"單位意思為micro-inch。這個咬蝕量可以確保棕化膜或粗化膜被完全剝除,又防止銅厚太薄而導致斷路問題。如圖5A所示,在未使用該微蝕液而該膜52未退時,直接進入該除膠製程63與該化銅製程64的藥水槽,使該膜52與藥水反應後,亦造成該印刷電路板50之表面的部分區域硬化,而無法去除,接著,該印刷電路板50經過電鍍製程、曝光製程至蝕刻製程後,而在該印刷電路板50之表面呈現複數線路55,但在硬化區域出現抗蝕刻,形成一異常點56,反之,如圖5B所示,在使用該微蝕液而該膜52退時,直接進入該除膠製程63與該化銅製程64的藥水槽,而該印刷電路板50之表面無殘留硬化物,接著,該印刷電路板50經過電鍍製程、曝光製程至蝕刻製程後,而在該印刷電路板50之表面呈現複數線路55,未見有抗蝕刻的異常現象。Further, the microetching solution includes 3~8wt% sulfuric acid, 3~12wt% hydrogen peroxide, 3~8wt% film stripping agent and a copper ion content less than 45g/L, or the microetching solution includes 5±2wt% sulfuric acid , 4±1wt% hydrogen peroxide, 4±1wt% film stripping agent and copper ion content less than 40g/L, according to experience, the microetching solution can make the treatment effect of the printed
基於如此構成,本發明整合該退膜製程62、該除膠製程63及該化銅製程64三合一之連續化製程後,節省人力、物料及設備之成本,而提升經濟效益,如下表所述:
以上所述的僅是本發明的一些實施方式。對於本領域的普通技術人員來說,在不脫離本發明創造構思的前提下,還可以做出若干變形和改進,這些都屬於本發明的保護範圍。What have been described above are only some embodiments of the present invention. For those skilled in the art, without departing from the inventive concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention.
再者,基於上揭構成;本發明也可整合一種除膠、化銅二合一系統,其包含:複數槽N,各該槽N依序整合一除膠製程63及一化銅製程64;藉此,提供一印刷電路板50依序進行連續化製程,該印刷電路板50經由雷射鑽孔而產生至少一孔與多餘一膠渣54,令該印刷電路板50經過該除膠製程63而去除該膠渣54,再接續經過該化銅製程63而對該孔沉積一層薄薄之化學銅531;以及一輸送線70,該輸送線70包括一傳動帶71、傳動輪72、馬達73及夾具74;該輸送線70以該夾具74夾掛該印刷電路板50,使該印刷電路板50呈垂直輸送至各該複數槽N,依序進行連續化製程之該除膠製程63、及該化銅製程64,且該輸送線70能夠讓該印刷電路板50始終呈垂直狀態,使該印刷電路板50的表面以非接觸輸送。Furthermore, based on the structure disclosed above; the present invention can also integrate a two-in-one system for removing glue and removing copper, which includes: a plurality of tanks N, each of which is sequentially integrated with a
藉助上揭技術手段,本發明在該除膠製程63、該化銅製程64在同一條生產線,再將該印刷電路板50垂直輸送於該除膠製程63至該化銅製程64之連續化製程,並以該印刷電路板50的表面以非接觸輸送於該除膠製程63至該化銅製程64之連續化製程,進而避免除膠槽的藥劑被污染、提升生產效率、經濟效益、產品良率及產線可靠度、避免降低藥劑的濃度、提升製程效率之功效增進。With the help of the above-mentioned technical means, the present invention puts the
50:印刷電路板 51:銅層 52:膜 53:孔 531:化學銅 54:膠渣 55:線路 56:異常點 60:生產線 61:自動放板 62:退膜製程 63:除膠製程 64:化銅製程 65:吹乾 66:烘乾 67:自動收板 70:輸送線 71:傳動帶 72:傳動輪 73:馬達 74:夾具 N:槽 a~b:步驟 50: Printed circuit board 51: copper layer 52: Membrane 53: hole 531: chemical copper 54: glue residue 55: line 56: Outliers 60: Production line 61: Automatic board placement 62: Removal process 63: Degumming process 64: copper process 65: blow dry 66: drying 67: Automatic closing board 70: Conveyor line 71: drive belt 72: drive wheel 73: motor 74: fixture N: Slot a~b: steps
圖1A係習用印刷電路板的雷射鑽孔之示意圖。 圖1B係習用印刷電路板的退膜製程之示意圖。 圖1C係習用印刷電路板的除膠製程之示意圖。 圖1D係習用印刷電路板的化銅製程之示意圖。 圖2A係習用第一生產線之示意圖。 圖2B係習用第二生產線示意圖。 圖2C係習用第三生產線之示意圖。 圖3A係本發明印刷電路板的雷射鑽孔之示意圖。 圖3B係本發明印刷電路板在同一條生產線完成退膜、除膠、化銅之示意圖。 圖3C係本發明印刷電路板進行雷射鑽孔、退膜、除膠及化銅之流程圖。 圖4A係本發明整合退膜製程、除膠製程、化銅製程之示意圖。 圖4B係本發明印刷電路板垂直輸送於退膜製程至除膠製程之示意圖。 圖4C係本發明印刷電路板垂直輸送於除膠製程至化銅製程之示意圖。 圖5A係本發明印刷電路板未退膜而經過電鍍製程、曝光製程及蝕刻製程後之金相圖。 圖5B係本發明印刷電路板退膜而經由電鍍製程、曝光製程及蝕刻製程後之金相圖。 FIG. 1A is a schematic diagram of conventional laser drilling of a printed circuit board. FIG. 1B is a schematic diagram of a film-removing process of a conventional printed circuit board. FIG. 1C is a schematic diagram of a conventional deglue process for printed circuit boards. FIG. 1D is a schematic diagram of a conventional copper plating process for printed circuit boards. Fig. 2A is a schematic diagram of a conventional first production line. FIG. 2B is a schematic diagram of a conventional second production line. Fig. 2C is a schematic diagram of a conventional third production line. FIG. 3A is a schematic diagram of laser drilling of a printed circuit board according to the present invention. Fig. 3B is a schematic diagram of the printed circuit board of the present invention completing defilming, glue removal, and copperization in the same production line. FIG. 3C is a flow chart of laser drilling, film removal, glue removal and copperization of the printed circuit board of the present invention. FIG. 4A is a schematic diagram of the integration of film stripping process, glue removal process and copper chemical process in the present invention. FIG. 4B is a schematic diagram of the vertical conveyance of the printed circuit board of the present invention from the film-removing process to the glue-removing process. FIG. 4C is a schematic diagram of the vertical transportation of the printed circuit board of the present invention from the glue removal process to the copper chemical process. FIG. 5A is a metallographic diagram of the printed circuit board of the present invention after electroplating process, exposure process and etching process without film removal. FIG. 5B is a metallographic diagram of the printed circuit board of the present invention after film removal and electroplating process, exposure process and etching process.
50:印刷電路板 50: Printed circuit board
62:退膜製程 62: Removal process
63:除膠製程 63: Degumming process
64:化銅製程 64: copper process
70:輸送線 70: Conveyor line
71:傳動帶 71: drive belt
72:傳動輪 72: drive wheel
73:馬達 73: motor
74:夾具 74: fixture
N:槽 N: Slot
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CN202110042252.0A CN112911804A (en) | 2021-01-13 | 2021-01-13 | Film-stripping, glue-removing and copper-melting three-in-one process capable of preventing and removing glue pollution |
CN2021100422520 | 2021-01-13 |
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TW110109192A TWI800804B (en) | 2021-01-13 | 2021-03-15 | Three-in-one method and system for film removal, glue removal, and copper plating |
TW110202765U TWM619792U (en) | 2021-01-13 | 2021-03-15 | Three-in-one system for film stripping, desmearing, and copper depositing or two-in-one system for desmearing and copper depositing |
TW111117227A TW202243557A (en) | 2021-01-13 | 2021-03-15 | Film stripping, degumming and copper melting three-in-one process capable of preventing degumming pollution |
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TW110202765U TWM619792U (en) | 2021-01-13 | 2021-03-15 | Three-in-one system for film stripping, desmearing, and copper depositing or two-in-one system for desmearing and copper depositing |
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CN116634675A (en) * | 2023-05-25 | 2023-08-22 | 江苏博敏电子有限公司 | Method for eliminating laser hole adhesive residue of core plate layer of any layer of interconnection printed circuit board |
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CN112911804A (en) * | 2021-01-13 | 2021-06-04 | 柏承科技(昆山)股份有限公司 | Film-stripping, glue-removing and copper-melting three-in-one process capable of preventing and removing glue pollution |
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CN104349588A (en) * | 2013-08-02 | 2015-02-11 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacture method thereof |
CN107371338B (en) * | 2016-05-13 | 2019-08-20 | 苏州卫鹏机电科技有限公司 | A kind of preparation method of the printed wiring board of ultra-thin metal layer |
JP7449921B2 (en) * | 2019-03-27 | 2024-03-14 | 三井金属鉱業株式会社 | Metal foil for printed wiring boards, metal foil with carrier, metal-clad laminate, and method for manufacturing printed wiring boards using the same |
CN111263527A (en) * | 2020-01-21 | 2020-06-09 | 柏承科技(昆山)股份有限公司 | Method for manufacturing high-density printed circuit board |
CN112911804A (en) * | 2021-01-13 | 2021-06-04 | 柏承科技(昆山)股份有限公司 | Film-stripping, glue-removing and copper-melting three-in-one process capable of preventing and removing glue pollution |
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CN116634675A (en) * | 2023-05-25 | 2023-08-22 | 江苏博敏电子有限公司 | Method for eliminating laser hole adhesive residue of core plate layer of any layer of interconnection printed circuit board |
CN116634675B (en) * | 2023-05-25 | 2023-11-21 | 江苏博敏电子有限公司 | Method for eliminating laser hole adhesive residue of core plate layer of any layer of interconnection printed circuit board |
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KR20220128919A (en) | 2022-09-22 |
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CN112911804A (en) | 2021-06-04 |
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