KR102326935B1 - Processing apparatus for PCB board with jig device - Google Patents

Abstract

In a PCB substrate processing device, the present invention is provide with a first transfer roller part each formed with transfer rollers having the same vertical axis at an upper end and a lower end at one end, and a second transfer roller part wherein the transfer rollers having the same vertical axis at the upper end and the lower end are each formed at the other end corresponding to thereof; and a belt transfer drive is formed by mounting an upper belt and a lower belt on each of the upper end and the lower end of the first transfer roller part and the second transfer roller part. Therefore, the present invention is capable of having an effect of providing a stable and constant drive.

Description

PCB substrate processing apparatus that does not require a jig device {Processing apparatus for PCB board with jig device}

The present invention is a PCB substrate processing apparatus that does not require a jig device, and more specifically, the present invention develops, etches, peels, and washes and drys the PCB substrate while transferring it by clamping the upper and lower surfaces of the PCB substrate to the belt. It relates to a PCB substrate processing device that sequentially processes and provides a stable driving device without the need for a separate complicated jig device.

There are several operations for processing substrates and several systems that perform this operation. The substrate is a typical printed circuit board used in various electronic products.

Printed circuit boards are in a trend of becoming ultra-thin and large-sized with the development of technology.

Operations for processing the substrate include operations such as plating, etching, developing, peeling, and pretreatment.

Among them, the phenomenon is a part of photolithography technology, and the complexity and difficulty are increasing along with the technological development in the field. During the processing process of the printed circuit board, the uncured part that has not been changed to polymer in the pattern exposure is peeled off using chemicals to reproduce the image required on the copper foil of the printed circuit board first.

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The development operation consists of detailed operations such as input, washing, drying, chemical treatment, washing and drying (or liquid removal) several times, pickling and drying (or liquid removal), heat drying, and discharge of the product that has undergone the exposure process. Sodium carbonate is generally used as the developer, and industrial water or electrolyzed water can be used as the washing solution depending on the product used.

As a conventional patent, No. 10-2172662 and No. 10-2172665 protect the surface of a product by performing various operations such as etching, peeling, or pretreatment while vertically moving a substrate such as a printed circuit board with a frame-type jig. It relates to a non-contact vertical processing system for substrates that can do this and obtain high quality, which is caused by the problem of a complex jig device consisting of many components. This is a necessary situation.

Republic of Korea Patent Publication No. 10-2172662 Republic of Korea Patent Publication No. 10-2172665

The present invention has been devised to solve the above problems, and an object of the present invention is to improve the PCB substrate processing system by adopting a stable and constant driving device without the need for an existing complicated jig device, to increase the working efficiency, to install and This is to build a more economical system in operation.

It will be described below and will be learned by way of example of the present invention. Further, the objects and advantages of the present invention may be realized by means and combinations indicated in the claims.

The present invention is a means for solving the above problems, in a PCB substrate processing apparatus, a first transfer roller unit having transfer rollers having the same vertical axis at the upper end and the lower end, respectively, and the upper end and the lower end at the other end corresponding thereto The same vertical axis is provided with a second conveying roller unit each having conveying rollers formed thereon; by mounting an upper belt and a lower belt on the upper and lower ends of the first transfer roller and the second transfer roller, respectively, to form a belt transfer drive; attaching a plurality of clamps to the lower edge surface of the upper belt and the upper edge surface of the lower belt at regular intervals in the transport direction, respectively; After aligning the PCB substrate in the correct position between the upper belt and the lower belt by the attachment robot unit having a vacuum suction unit, directly clamping by the clamp without a separate jig device, and processing the chemical solution while transferring, The washing process and the drying process are sequentially processed, the clamp is released, the PCB substrate is vacuum-attached by a detachable robot unit having a vacuum suction unit installed at the other end, and detached from between the upper belt and the lower belt; The chemical treatment is a developing process, an etching process, and a peeling process sequentially, and each solution supplied from each treatment solution unit is sprayed from each nozzle unit To provide a PCB substrate processing apparatus that does not require a jig device will be.

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As described above, the present invention has an effect of providing a stable and constant drive by adopting a belt to the conveying roller, clamping the upper and lower ends of the PCB board and transferring the material.

In addition, due to the adoption of the transfer roller, in transferring the PCB substrate, it provides a synchronous drive, so that there is a stable transfer effect.

In addition, there is no need for a complicated jig device for transporting the PCB substrate, and there is no need to drive the return unit at all, so the transport device has a simple effect.

In addition, since the upper and lower ends of the PCB board are supported by the transfer belt, even if the air pressure of the nozzle and the drying device of the chemical is increased, it is not shaken and stable transfer and supply are possible.

In addition, there is an effect of controlling the driving part of the attachment robot and the transfer roller for attaching the PCB board at a synchronous speed.

In addition, since there is no need for a separate jig device, there is an effect that there is no generation of friction particles during transport.

1 is a schematic diagram showing a PCB substrate processing apparatus that does not require a jig device according to the present invention.
Figure 2 is a schematic diagram showing the clamping of the PCB substrate processing apparatus without the need for a jig device according to the present invention.
Figure 3 is a schematic diagram showing the process processing of the PCB substrate processing apparatus without the need for a jig device according to the present invention.

Before describing various embodiments of the present invention in detail, it is to be understood that the application is not limited to the details of the construction and arrangement of components described in the following detailed description or shown in the drawings. The invention is capable of being embodied and practiced in other embodiments and of being carried out in various ways. Also, device or element orientation (eg "front", "back", "up", "down", "top", "bottom") The expressions and predicates used herein with respect to terms such as ", "left", "right", "lateral", etc. are used merely to simplify the description of the invention, and the associated apparatus Or it will be appreciated that it does not simply indicate or imply that an element must have a particular orientation. Also, terms such as “first” and “second” are used in this application and the appended claims for the purpose of description and are not intended to indicate or imply relative importance or spirit.

In order to achieve the above object, the present invention has the following features.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in the present specification and claims should not be construed as being limited to conventional or dictionary meanings, and the inventor should properly understand the concept of the term in order to best describe his invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept consistent with the technical idea of the present invention.

Therefore, the configuration shown in the embodiments and drawings described in the present specification is only the most preferred embodiment of the present invention and does not represent all of the technical spirit of the present invention, so at the time of the present application, various It should be understood that there may be equivalents and variations.

Looking at an embodiment according to the present invention,
the present invention

In the PCB substrate processing apparatus,
The first conveying roller part 10 in which the conveying rollers 10a and 10b each having the same vertical axis at the top and the bottom are formed at one end, and the conveying rollers 20a and 20b having the same vertical axis at the top and the bottom at the other end corresponding thereto. providing each formed second transfer roller unit 20;
by mounting an upper belt 30a and a lower belt 30b on the upper ends and lower ends of the first transfer roller unit 10 and the second transfer roller unit 20, respectively, to form a belt transfer drive;
attaching a plurality of clamps 40 to the lower edge surface of the upper belt 30a and the upper edge surface of the lower belt 30b at regular intervals in the transport direction, respectively;
The PCB substrate 100 is aligned in the correct position between the upper belt 30a and the lower belt 30b by the attachment robot part 90 having a vacuum suction part, and without a separate jig device, the clamp 40 Directly clamping and conveying by
After treating the chemical treatment, the water washing process 60 and the drying process 70 are sequentially processed,
The clamp 40 is released, the PCB substrate 100 is vacuum-attached by a detachable robot unit 91 having a vacuum suction unit installed at the other end, and detached from between the upper belt 30a and the lower belt 30b. make;
The chemical treatment consists of a developing process 50a, an etching process 50b, and a peeling process 50c sequentially, and a jig device configured to spray each solution supplied from each treatment solution unit from each nozzle unit It relates to an unnecessary PCB substrate processing device.
Hereinafter, a PCB substrate processing apparatus without a jig apparatus according to a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 .

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The present invention does not require a conventional complicated jig device, and adopts a stable and constant driving device to improve the PCB substrate processing system to increase work efficiency and to build a more economical system in terms of installation and operation.

As shown in Figures 1 and 2,

The technical feature of the present invention is that the first transfer roller unit 10 having the upper and lower transfer rollers 10a and 10b respectively formed at one end and the transfer rollers 20a and 20b respectively formed at the upper end and the lower end at the other end corresponding thereto. It is to provide the second transfer roller unit (20).

Here, by mounting an upper belt 30a and a lower belt 30b at the upper ends and lower ends of the first transfer roller unit 10 and the second transfer roller unit 20, respectively, the first transfer roller unit 10 ) or the second conveying roller 20, when the driving motor is connected and operated, the upper belt 30a and the lower belt 30b are continuously circulated and are uniformly and stably driven by the belt.

The conventional jig device has a problem in that a separate return device is added to transfer and return in one direction, but the present invention does not require the return device and has the effect of continuously circulating.

In addition, as shown in FIG. 3, the present invention attaches a plurality of clamps 40 to the lower edge surface of the upper belt 30a and the upper edge surface of the lower belt 30b at regular intervals in the transport direction, respectively. , characterized in that the PCB substrate 100 is attached to the clamp 40 .

Here, the PCB substrate 100 is aligned in the correct position between the upper belt 30a and the lower belt 30b by the attachment robot part 90 having a vacuum suction part, and clamped by the clamp 40 will be.

The attachment robot part 90 adopts a multi-joint type robot including a vacuum suction part on the front side, and attaches the PCB substrate 100 by the vacuum suction part, and the upper belt 30a and the lower belt 30b. to align in the exact position between

When the PCB substrate 100 is arranged in the correct position, it is clamped by the operation of the clamp 40 .

The clamp 40 is formed in various shapes, and as an embodiment, it is possible in the shape of a normal clothespin, and by spreading the tongs, the PCB substrate 100 is mounted, and at a predetermined position, by spreading the tongs again, the PCB substrate ( 100) can be detached, but the device for detaching and attaching the PCB board is not related to the technical characteristics of the PCB board transfer device of the present invention, so it will be omitted.

It is clamped by the clamp 40 to transport the PCB substrate 100, and while transporting,

After the chemical treatment is treated, the water washing process 60 and the drying process 70 are sequentially processed.

In addition, the chemical treatment of the present invention sequentially comprises a developing process 50a, an etching process 50b, and a peeling process 50c, so that each solution supplied from each treatment solution unit is sprayed from each nozzle unit. it has been done

The chemical treatment is to be sprayed by a certain nozzle unit formed to correspond to the height forming the upper and lower ends of the PCB substrate 100 , and to supply each necessary chemical to the PCB substrate 100 .

After the PCB substrate 100 that has undergone the chemical treatment is washed with water by the nozzle of the water washing process 60 , air is supplied to the nozzle in the drying process 70 to be dried.

In the last step, the clamp 40 is released, the PCB substrate 100 is vacuum-attached by the detachable robot 91 having a vacuum suction part installed at the other end, and the upper belt 30a and the lower belt 30b) to detach from between; it has been done

Although described by, the present invention is not limited thereto, and various modifications and modifications within the scope of equivalents of the claims to be described below and the technical spirit of the present invention by those skilled in the art to which the present invention belongs Of course, changes are possible.

10: first transfer roller unit
10a, 10b, 20a, 20b: feed roller
20: second transfer roller unit
30a: upper belt
30b: lower belt
40: clamp
50a: developing process
50b: etching process
50c: peeling process
60: washing process
70: drying process
90: attachment robot unit
91: detachable robot unit
100: PCB substrate

Claims (2)

In the PCB substrate processing apparatus,
The first conveying roller part 10 in which the conveying rollers 10a and 10b each having the same vertical axis at the top and the bottom are formed at one end, and the conveying rollers 20a and 20b having the same vertical axis at the top and the bottom at the other end corresponding thereto. providing each formed second transfer roller unit 20;
by mounting an upper belt 30a and a lower belt 30b on the upper ends and lower ends of the first transfer roller unit 10 and the second transfer roller unit 20, respectively, to form a belt transfer drive;
attaching a plurality of clamps 40 to the lower edge surface of the upper belt 30a and the upper edge surface of the lower belt 30b at regular intervals in the transport direction, respectively;
The PCB substrate 100 is aligned in the correct position between the upper belt 30a and the lower belt 30b by the attachment robot part 90 having a vacuum suction part, and without a separate jig device, the clamp 40 directly clamping and conveying by
After treating the chemical treatment, the water washing process 60 and the drying process 70 are sequentially processed,
The clamp 40 is released, the PCB substrate 100 is vacuum-attached by a detachable robot unit 91 having a vacuum suction unit installed at the other end, and detached from between the upper belt 30a and the lower belt 30b. make;
The chemical treatment consists of a developing process (50a), an etching process (50b), and a peeling process (50c) sequentially, and each solution supplied from each treatment solution part is sprayed from each nozzle part, characterized in that A PCB substrate processing device that does not require a jig device.

















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