CN116567934B - PCB board pre-baking device - Google Patents

Abstract

The invention belongs to the technical field of PCB production, in particular to a PCB pre-baking device, which comprises a baking oven, a baking rack, a cooling rack, a stacking mechanism arranged in the baking rack, a plate bending prevention mechanism arranged in the cooling rack and a transferring mechanism for transferring a PCB between the baking rack and the cooling rack; the PCB is prevented from being bent by arranging the pressing plates on the cooling frame, the downward movement amplitude of each pressing plate can be independently and automatically adjusted, the PCB with different thicknesses is suitable for being placed by arranging two rows of linkage object placing plates, the function that the plurality of PCB can be sequentially stacked on each group of object placing plates after being moved downwards is realized, the operation steps and related structures of transverse pushing are omitted, the structure is simple, the efficiency is higher, the PCB is transported by arranging the lifting transfer plate on the bottom plate, the U-shaped baking frame and the two rows of object placing plates are matched, the PCB is lifted upwards and transported again, and the smooth transportation work is ensured.

Description

PCB board pre-baking device

Technical Field

The invention belongs to the field of PCB production, and particularly relates to a PCB pre-baking device.

Background

Before SMT (surface mounting) is performed on a PCB (printed circuit board), the PCB needs to be baked and cooled in advance in order to eliminate the internal stress of the PCB, remove the moisture in the circuit board and improve the subsequent welding effect, and then the PCB is fed to an upper plate machine to start an SMT process.

One patent application with publication number of CN110972400B discloses a PCB baking device, comprising a conveying device and a sectional baking device, wherein, a preheating zone and a baking zone are sequentially arranged in front and back of a baking box body, an air suction component is used for absorbing waste gas generated by baking, a cooling exhaust device is used for cooling a PCB coming out of the baking zone, high-temperature waste gas generated during the drying of the PCB is used for drying the PCB in the preheating zone, and a preheating, drying and cooling integrated drying device taking hot flow waste gas as a guide is formed.

The above technical solution has some problems, in baking, for relatively thin or relatively large-sized PCBs, a flat stacking type placement is generally adopted, and after baking, a bending-preventing jig is required to be pressed during cooling to reduce or avoid bending deformation caused by stress release during cooling of the PCBs, and after cooling, the whole stack of PCBs is transported away by the device, so how to quickly prevent bending during cooling of the stacked PCBs is a matter of attention during baking of the PCBs, and the above technical solution does not effectively solve the problem

Therefore, the invention provides a PCB pre-baking device.

Disclosure of Invention

In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved.

The technical scheme adopted for solving the technical problems is as follows: the invention relates to a PCB pre-baking device, which comprises a baking oven, a baking rack and a cooling rack, and further comprises:

the material stacking mechanism is arranged in the baking rack and comprises a plurality of groups of longitudinally arranged articles;

the plate bending prevention mechanism is arranged in the cooling frame and comprises a plurality of pressing plates which are longitudinally arranged; and

transfer mechanism with the PCB board changes the baking rack with transfer between the cooling frame, transfer mechanism includes the transfer piece of multiunit longitudinal arrangement, transfer piece quantity with put article looks adaptation, transfer piece activity grafting is in the inside of cooling frame, every the below of clamp plate all is provided with a set of transfer piece.

Specifically, in the initial state, the pressing plate is positioned above the transfer piece, and a gap between the pressing plate and the transfer piece is larger than the thickness of the PCB; the air pump is arranged in the baking oven, before the PCBs are baked, the PCBs are transversely placed on the groups of objects in sequence, so that the PCBs are transversely stacked together, a gap is reserved between the upper adjacent PCB and the lower adjacent PCB, the upper end and the lower end of the PCBs can be baked, and then the baking rack is moved into the baking oven for baking; the air pump is started, and air flow generated by the air pump flows between two adjacent PCBs, so that water vapor generated during baking can be accelerated to be sent away, and the baking effect is improved;

After baking, the baking frame is moved out of the baking oven, so that the baking frame and the cooling frame are mutually closed, at the moment, each transfer piece is respectively positioned below each PCB, the transfer piece is moved out of the cooling frame until the transfer piece moves to the lower side of the PCB, so that the PCB contacts with the transfer piece, then the transfer piece is moved back into the cooling frame, the transfer piece transfers the PCB from the baking frame into the cooling frame, the transfer operation of the PCB is completed, and at the moment, the pressing plate is positioned above the PCB;

the pressing plate is started to move downwards, the pressing plate is covered above the PCB, and the two sides of the PCB are simultaneously extruded through the transfer piece and the pressing plate, so that the effect of preventing the PCB from bending during cooling is achieved, the problem that the PCB is easy to bend and deform due to stress release during cooling is solved, and the cooling effect of the PCB after baking is improved.

Preferably, the baking rack is in a U shape, a through channel is formed between two side walls of the baking rack, the object placing device comprises two mutually separated object placing plates, and the same group of two object placing plates are respectively arranged on the two side walls of the baking rack.

Specifically, by arranging two object placing plates to be supported on two sides of the bottom end of a single PCB, the middle part of the bottom end of the PCB is not shielded, the area of the PCB which can be contacted with hot air flow in the baking box is wider, and the baking speed of the PCB is further improved; meanwhile, the transfer plate passes through the two storage plates in the same group, so that the transfer plate supports away the PCB positioned on the storage plates, and the transfer operation of the PCB is facilitated.

Preferably, the object placing plate is rotatably installed on the baking rack, the object placing plate is in a T shape, and the material stacking mechanism further comprises;

the limiting frame is fixedly connected to the upper end of the tail of the storage plate;

the connecting rod is rotatably arranged at the lower end of the tail part of the storage plate, and the bottom end of the connecting rod is inserted into the limiting frame positioned on the lower storage plate; and

the limiting plate is fixedly connected to the baking rack and used for limiting the object placing plate;

the heads of the two bottommost object placing plates extend into the channel of the baking rack, and the heads of the rest object placing plates shrink into the side wall of the baking rack.

Specifically, one end of the object placing plate, which is close to the baking rack channel, is a head part, and the other end is a tail part; the lowest object placing plate is a first object placing plate, the second object placing plate is arranged above the first object placing plate, and so on; when stacking the PCB on the baking rack, placing the PCB in the channel from top to bottom; through the design of the gravity center of the opposite object plates, when no external force is applied, the object plates are in a state that the tail parts of the object plates face downwards and the head parts face upwards, in an initial state, only the head part of the first object plate stretches into the channel, and the rest object plates above the first object plate shrink in the side wall of the baking frame so as to avoid interference influence on the downward movement of the PCB;

After the PCB moves downwards in the channel and is parked on the first storage plate, the first storage plate is pressurized by the gravity of the PCB to generate deflection, and the rotation amplitude of the storage plate is limited by arranging the limiting plate, so that the storage plate is extruded by the PCB and then rotates to be in a horizontal state; the first thing board after the rotation drives the connecting rod of its top through spacing frame and swings to drive the second and put thing board and deflect, make the head of second and put the thing board stretch into inside the passageway, then, the next PCB board that continues to move down in the passageway can park on the second puts the thing board, extrude the second and rotate to the horizontality with putting the thing board, the second puts the thing board and drives the third of its top and put the thing board and rotate again, so reciprocating, can realize stacking a plurality of PCB boards on each group of thing boards in proper order, this scheme is when implementing, only need adjust the range of moving down of PCB board can, in traditional stacking method, the plywood in the baking frame is fixed mechanism, need match elevating gear and horizontal thrust unit to work, elevating gear is after transporting the PCB board to different layer heights in the baking frame outside, horizontal thrust unit is with the PCB board again on the plywood of corresponding height, compared with traditional stacking method, this scheme has saved horizontal operation step and related structure of propelling movement, simple structure, and efficiency is higher.

Preferably, the pressing plate is slidably mounted inside the cooling rack, and the plate bending prevention mechanism further comprises:

the two hanging hook pieces are in a L shape with central symmetry, and two adjacent pressing plates are connected with each other through the hanging hook pieces; and

and the lifting assembly is arranged on the cooling frame and used for pushing the pressing plate at the top end.

Specifically, the pressing plate slides up and down in the cooling frame, a guide column for guiding the pressing plate is arranged in the cooling frame, and the lifting assembly is preferably but not limited to a jack structure; the pressing plates are driven to move upwards by the hook pieces, and the heights of gaps between the pressing plates and the transfer pieces are at the maximum value, so that the PCBs with different thicknesses can smoothly move to the positions below the pressing plates; when the PCB is extruded and prevented from being bent, the lifting assembly is started to move downwards, so that each pressing plate moves downwards, after the lifting assembly moves to the lowest position and is separated from the pressing plate at the topmost end up and down, all the pressing plates are stopped on the corresponding PCB and can be suitable for the PCB with different thicknesses, and therefore the function of automatically adjusting the extrusion stroke of each pressing plate is achieved, and the adaptability to the PCB with different thicknesses is better.

Preferably, the transfer member includes:

a bottom plate movably inserted in the cooling frame,

the transfer plate is movably inserted above the bottom plate; and

the locating piece, the locating piece includes telescopic link and supporting spring, and supporting spring is used for promoting the telescopic link and extends, and the telescopic link is the slope form, and the both ends of telescopic link respectively with the bottom plate with the transfer board activity articulates.

Specifically, the bottom plate can slide left and right in the cooling frame, the transfer plate can slide up and down on the bottom plate, and the telescopic rod keeps a stable inclined state under the pushing of the supporting spring, so that the transfer plate can keep stable positions after moving down or rising up;

in the initial state, the transfer plate is positioned at the bottom end and below the same-layer PCB in the baking rack in the height direction, so that the transfer plate can smoothly move to the lower part of the PCB, then the transfer plate is started to move upwards, the transfer plate lifts the PCB on the same-layer object placing plate upwards, the PCB is separated from the object placing plate, and then the transfer plate can lift the PCB to move back into the cooling rack; through setting up the transfer board that can reciprocate with the PCB board from putting the thing board and lifting, improved the PCB board probably because of with put the thing board between the lateral friction great and be difficult for by the problem that directly changes the transportation away, guaranteed that the PCB board transports going on smoothly of work.

Preferably, the top of bottom plate is provided with the strengthening rib, the height of strengthening rib with the high looks adaptation of setting element.

Specifically, in an initial state and when the PCB is extruded and prevented from bending, the transfer plate is positioned at the bottom end of the sliding range of the PCB and is stopped on the reinforcing rib; through setting up the strengthening rib and supporting the transfer board, fill the blank region that exists in the height between bottom plate and the transfer board because of the existence of setting element, both avoided the condition that the weight of clamp plate and PCB board all concentrate on the telescopic link in the cooling process, reduced the work load of telescopic link, simultaneously, clamp the upper and lower both sides at PCB simultaneously with the transfer board of fixed position, better to the centre gripping effect of PCB board to the curved effect of preventing of PCB board has been ensured.

Preferably, the transfer mechanism further comprises:

the correcting plates are rotatably arranged on the bottom plate and distributed on the periphery of the bottom plate; and

the rack plates are fixedly connected to the bottom ends of the transfer plates, the rack plates are meshed with the correction plates for transmission, and the top ends of the correction plates are driven to rotate inwards after the rack plates move.

Specifically, a gear is arranged at the rotating shaft of the correction plate, and the rack plate is in meshed connection with the gear; the parking position of the PCB on the storage plate can deviate, the transfer plate is started to move downwards after lifting the PCB to the inside of the cooling frame, the plurality of rack plates move downwards and drive the correction plates to rotate, and the plurality of correction plates push the PCB after rotating, so that the relative position of the PCB on the transfer plate is corrected, the PCB can be vertically aligned with the pressing plate above the transfer plate, and the alignment extrusion of the pressing plate to the PCB is ensured.

Preferably, the top end of the correction plate is not higher than the top surface of the transfer plate after the correction plate is moved upwards, and the transfer plate is provided with a groove for the correction plate to move.

Specifically, after the transfer plate moves upwards, the correction plate is not higher than the transfer plate so as to avoid interference to the action of lifting the PCB by the transfer plate, and after the transfer plate moves downwards and drives the correction plate to rotate, the top end of the correction plate extends to the upper part of the transfer plate and deflects inwards, so that the PCB is pushed and corrected in position.

Preferably, the transfer mechanism further comprises:

the pushing-up piece is fixedly connected to the baking rack and is used for pushing the transfer plate moving to the interior of the baking rack to move upwards; and

and a pushing member slidably mounted on the cooling frame for pushing the transfer plate positioned inside the cooling frame downward.

Specifically, a slope is arranged on the side wall of the push-up piece, the bottom end of the slope is inserted between the bottom plate and the transfer plate, after the baking rack and the cooling rack are mutually close, the transfer piece is started to be inserted into a channel of the baking rack, and when the transfer plate moves to the lower part of the PCB, the transfer plate is contacted with the push-up piece, and the push-up piece pushes the transfer plate to move upwards, so that the transfer plate supports the PCB; after the transfer piece is started to move back to the inside of the cooling frame, the moving back transfer plate is contacted with the lower pressing piece, and the lower pressing piece presses the transfer plate to move downwards for resetting so as to perform subsequent PCB position correction and plate bending prevention work by pressing the pressing plate.

Preferably, the device further comprises a control mechanism, and the control mechanism further comprises:

a plurality of driving shafts rotatably installed in the cooling rack, wherein the driving shafts are in meshed transmission with the bottom plate;

the handle is fixedly connected to the driving shaft; and

and the chain belts are used for transmitting among the driving shafts.

Specifically, the handle is rotated, and the handle drives the driving shafts to rotate, and synchronous rotation is realized among the driving shafts through the chain belts, so that the plurality of groups of transfer components can be driven to move simultaneously.

Preferably, the transfer mechanism further comprises a lifting piece arranged on the pressing plate, and the pressing plate is driven to move upwards by the lifting piece after moving upwards, wherein the transferring plate is positioned in the cooling frame.

Specifically, after the PCB is baked and cooled, the cooled PCB is required to be stacked in another device and transferred to an SMT station, so that the PCB in the cooling frame is required to be transferred away;

the baking rack and the cooling rack are both positioned on the outer side of the baking box, after cooling is finished, the pressing plate moves upwards, the transfer plate is driven to move upwards through the lifting piece, then the transfer piece is started to move into the empty baking box, the transfer plate lifts the PCB to move into the channel, the lifted PCB is positioned above the storage plate, then the PCB on the transfer plate can be transferred into the storage plate, finally, the stacked and cooled baking rack is moved to the SMT station, and the transfer work of the cooled PCB is completed.

Preferably, the pressing piece includes:

the support rod is fixedly connected to the side wall of the cooling frame;

the sliding plate is sleeved on the supporting rod in a sliding way, and a slope is arranged on the side wall of the sliding plate; and a return spring for urging the slide plate to move over the transfer plate.

The pull member includes:

the rotating plate is rotatably arranged at the bottom of the pressing plate and is of a unidirectional rotating structure, and the rotating plate is L-shaped; and

the wedge block is fixedly connected to the rotating plate and is used for pushing the sliding plate to be staggered with the transferring plate.

Specifically, a reset torsion spring is arranged in a rotating shaft of the rotating plate, a vertical side plate in the rotating plate is positioned at the outer side of the transferring plate, a transverse bottom plate of the rotating plate is used for pushing the transferring plate to move upwards, and the moving direction of the sliding plate is perpendicular to the moving direction of the bottom plate; the ascending transfer plate moves back to the inside of the cooling frame and then contacts with the sliding plate, and the sliding plate extrudes the transfer plate to move downwards; when the pressing plate moves downwards, the rotating plate rotates after contacting with the transfer plate, so that the rotating plate and the wedge blocks can move downwards below the transfer plate, and then the rotating plate rotates for resetting; after cooling, the pressing plate moves upwards to reset, the upward wedge block contacts with the sliding plate and presses the sliding plate to move, so that the sliding plate is staggered with the transfer plate, and then the upward rotating plate contacts with the transfer plate and pushes the transfer plate to move upwards; then, the rotating handle can drive the transfer plate to lift the cooled PCB outwards with the ascending gesture, so that the PCB is conveniently stacked on other equipment, in addition, the height difference between the ascending transfer plate and the storage plate on the same layer is increased, the transfer plate can convey more PCBs to the storage plate on the same layer, so that the function of stacking a plurality of PCBs on a group of storage plates is achieved, and the lifting piece simultaneously has the functions of pushing the pressing piece and lifting the transfer plate, so that the lifting device is simple and compact in structure and convenient to use.

The beneficial effects of the invention are as follows:

1. according to the PCB pre-baking device, the plurality of pressing plates are arranged on the cooling frame to extrude the PCB to prevent the plate from bending, the plurality of pressing plates are connected through the hook pieces in a hanging mode, the downward movement amplitude of each pressing plate can be adjusted independently, and the PCB pre-baking device is suitable for PCB with different thicknesses and has a wider application range.

2. According to the PCB pre-baking device, the PCB is placed by arranging the two rows of the object placing plates, the plurality of groups of object placing plates in the same row are linked with each other, the object placing plate at the bottom drives the object placing plate above to rotate sequentially after receiving the PCB, and the function that the plurality of PCB can be stacked on each group of object placing plates sequentially after moving downwards is achieved.

3. According to the PCB pre-baking device, the lifting transfer plate is arranged on the bottom plate to transfer the PCB, the U-shaped baking frame and the two rows of object placing plates are matched, the transfer plate is inserted below the PCB, then the PCB is lifted upwards, then the PCB is transferred into the cooling frame, smooth transfer work is ensured, the stacked PCB can be directly transferred into the cooling frame and matched with the pressing plate, rapid bending prevention operation on the stacked PCB is realized, the working efficiency is high, lifting action of the transfer plate is automatic, the structure is simple and compact, and the use is convenient.

4. According to the PCB pre-baking device, the lifting piece is arranged on the pressing plate and is matched with the lifting action of the upper transfer plate, so that the function of automatically supporting the cooled PCB is realized, the PCB is transferred to other equipment for stacking, the cooling frame is matched with the transfer mechanism, the PCB in the baking frame is transferred to the cooling frame for cooling, and the cooled PCB is transferred out, wherein the lifting piece simultaneously has the functions of pushing the pressing piece and lifting the transfer plate, and the PCB pre-baking device is simple and compact in structure and convenient to use.

Drawings

The invention is further described below with reference to the accompanying drawings.

FIG. 1 is a perspective view of a first embodiment of the present invention;

FIG. 2 is a frying view of the grill and stacking mechanism;

FIG. 3 is a schematic view of an initial state of the storage plate;

fig. 4 is a schematic view of a stacked state of PCB boards on a placement board;

FIG. 5 is a exploded view of the cooling rack and the anti-roll-over mechanism;

FIG. 6 is a bottom plate, transfer plate and platen exploded view;

FIG. 7 is a perspective view showing a combined state of a single set of bottom plates and transfer plates;

FIG. 8 is an enlarged view of a portion of FIG. 7 at A;

FIG. 9 is an enlarged view of a portion of FIG. 7 at B;

FIG. 10 is a perspective view of a cooling rack and a single set of transfer members;

FIG. 11 is an enlarged view of a portion of FIG. 10 at C;

FIG. 12 is a bottom press exploded view;

FIG. 13 is a perspective view of a steering mechanism in a second embodiment of the invention;

fig. 14 is a front view of a third embodiment of the present invention.

Detailed Description

The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.

Example 1

As shown in fig. 1 to 5, the pre-baking device for PCB board according to the embodiment of the present invention includes a baking oven 1, a baking rack 2, a cooling rack 3, and further includes:

the stacking mechanism 4 is arranged in the baking frame 2, and the stacking mechanism 4 comprises a plurality of groups of longitudinally arranged articles;

a plate bending prevention mechanism 5 provided in the cooling rack 3, the plate bending prevention mechanism 5 including a plurality of pressing plates 51 arranged longitudinally; and

transfer mechanism 6 that changes the PCB board between toasting frame 2 with cooling frame 3 is transported, transfer mechanism 6 includes the transfer piece 61 of multiunit longitudinal arrangement, the quantity of transfer piece 61 with put the article looks adaptation, transfer piece 61 activity grafting is in cooling frame 3's inside, every clamp plate 51's below all is provided with a set of transfer piece 61.

Specifically, in the initial state, the pressing plate 51 is located above the transferring member 61, and a gap between the pressing plate 51 and the transferring member 61 is greater than the thickness of the PCB; the air pump is arranged in the baking oven 1, before the PCBs are baked, the PCBs are transversely placed on the groups of objects in sequence, so that the PCBs are transversely stacked together, a gap is reserved between the upper adjacent PCB and the lower adjacent PCB, the upper end and the lower end of the PCBs can be baked, and the baking rack 2 is moved into the baking oven 1 for baking; the air pump is started, and air flow generated by the air pump flows between two adjacent PCBs, so that water vapor generated during baking can be accelerated to be sent away, and the baking effect is improved;

After baking, the baking rack 2 is moved out of the baking oven 1, so that the baking rack 2 and the cooling rack 3 are close to each other (the baking rack 2 and the cooling rack 3 can be slidably arranged in the guide rail 100 by arranging the guide rail 100 on the outer side of the baking oven 1, the travel of the baking rack 2 or the cooling rack 3 is limited, or distance blocks are arranged on the baking machine and the cooling rack 3 to meet the requirement that the fixed relative distance between the baking rack 2 and the cooling rack 3 is kept after the baking rack 2 and the cooling rack 3 are close to each other), at this time, each transfer piece 61 is respectively positioned below each PCB, the transfer piece 61 is moved out of the cooling rack 3 until the transfer piece 61 moves to the lower side of the PCB, so that the PCB contacts with the transfer piece 61, then the transfer piece 61 moves back into the cooling rack 3, the transfer piece 61 transfers the PCB from the baking rack 2 into the cooling rack 3, and the transfer operation of the PCB is completed, and at this time, the pressing plate 51 is positioned above the PCB;

the clamp plate 51 is started to move downwards for the clamp plate 51 covers the top at the PCB board, utilizes the weight of clamp plate 51 to extrude transfer piece 61, and transfer piece 61 and clamp plate 51 extrude the both sides of PCB board simultaneously, thereby play the crooked effect when preventing the PCB board cooling, improved the PCB board because stress release and the easy problem of crooked deformation during cooling, improved the cooling effect after the PCB toasts, and transfer piece 61 and the supporting setting of PCB board can realize carrying out quick bending prevention operation to the PCB board of piling up, work efficiency is high.

As shown in fig. 2-3, the baking frame 2 is U-shaped, a through channel is formed between two side walls of the baking frame 2, the group of articles includes two article placing plates 41, and the same group of two article placing plates 41 are respectively arranged at aligned positions on two inner side walls of the baking frame 2.

Specifically, by arranging two object placing plates 41 to be supported on two sides of the bottom end of a single PCB, the middle part of the bottom end of the PCB is not shielded, the area of the PCB which can be contacted with hot air flow in the baking box 1 is wider, and the baking speed of the PCB is further improved; meanwhile, the transfer piece 61 passes through the space between the two storage boards 41 in the same group, so that the transfer piece 61 supports away the PCB positioned on the storage boards 41, and the transfer operation of the PCB is facilitated.

As shown in fig. 2-4, the storage plate 41 is rotatably mounted on the inner side wall of the baking rack 2, the storage plate 41 is T-shaped, and the stacking mechanism 4 further includes;

the limiting frame 42 is fixedly connected to the upper end of the tail of the storage plate 41;

the connecting rod 43 is rotatably arranged at the lower end of the tail part of the object placing plate 41, and the bottom end of the connecting rod 43 is inserted into the limiting frame 42 positioned on the object placing plate 41 below; and

the limiting plate 44 is fixedly connected to the baking rack 2 and used for limiting the object placing plate 41;

The heads of the two bottom-most storage plates 41 extend into the channel of the baking frame 2, and the heads of the rest storage plates 41 are contracted inside the side wall of the baking frame 2.

Specifically, one end of the storage plate 41, which is close to the channel of the baking rack 2, is a head part, and the other end is a tail part; the lowest object placing plate 41 is a first object placing plate 41, the second object placing plate 41 is arranged above the first object placing plate 41, and so on; when stacking the PCB on the baking frame 2, placing the PCB in the channel from top to bottom; through the design of the gravity center of the opposite object plates 41, when no external force is applied, the object plates 41 are in a state that the tail parts of the object plates are downward and the head parts are upward, in an initial state, only the head part of the first object plate 41 stretches into the channel, and the rest object plates 41 above the first object plate stretch into the side wall of the baking frame 2 so as to avoid interference influence on the downward movement of the PCB;

after the PCB moves downwards in the channel and is parked on the first storage plate 41, the first storage plate 41 is pressurized by the gravity of the PCB to generate deflection, and the rotation amplitude of the storage plate 41 is limited by arranging the limiting plate 44, so that the storage plate 41 is extruded by the PCB and then rotates to be in a horizontal state; the tail of the rotated first storage plate 41 presses the connecting rod 43 above the second storage plate 41 upwards, so that the second storage plate 41 is driven to deflect, the head of the second storage plate 41 stretches into a channel, then the next PCB which continues to move downwards in the channel can be parked on the second storage plate 41, the second storage plate 41 is pressed and rotated to be in a horizontal state, the second storage plate 41 drives the third storage plate 41 above the second storage plate to rotate, and the second storage plate drives the third storage plate 41 to reciprocate.

As shown in fig. 5 to 6, the pressing plate 51 is slidably mounted inside the cooling rack 3, and the bending prevention mechanism 5 further includes:

the two hook pieces 52 are symmetrically L-shaped, and the two adjacent pressing plates 51 are connected with each other through the hook pieces 52; and

and a lifting assembly 53 provided on the cooling frame 3 for driving the pressing plate 51 at the top.

Specifically, the pressing plate 51 slides up and down inside the cooling rack 3, and a guide column for guiding the pressing plate 51 is provided in the cooling rack 3, and the lifting assembly 53 is preferably but not limited to a jack structure; the pressing plates 51 form a structure with adjustable height of each layer through the hook piece 52, in an initial state, the lifting component 53 pulls the top pressing plate 51 to move upwards, the pressing plates 51 drive the rest pressing plates 51 below to move upwards through the hook piece 52, and the gap heights between the pressing plates 51 and the transferring piece 61 of each group are all at the maximum value, so that the PCBs with different thicknesses can smoothly move below the pressing plates 51; when the PCB is extruded and prevented from being bent, the lifting component 53 is started to move downwards, so that all the pressing plates 51 move downwards until all the pressing plates 51 are respectively stopped on the PCB below the pressing plates, the weight of the pressing plates 51 is utilized to extrude and prevent the transferring piece 61 from being bent, after cooling is finished, the pressing plates 51 at the topmost end are pushed to move upwards by the lifting component 53, the pressing plates 51 at the topmost end sequentially drive the rest pressing plates 51 below to move upwards by the hook piece 52 until all the pressing plates 51 are separated from the PCB, and the PCB can adapt to the PCB with different thickness, so that the function of automatically adjusting the extrusion stroke of each pressing plate 51 is realized, and the adaptability to the PCB with different thickness is better.

As shown in fig. 6 to 8, the transfer member 61 includes:

a bottom plate 611 movably inserted in the cooling rack 3,

a transfer plate 612, wherein the transfer plate 612 is movably inserted above the bottom plate 611; and

the positioning piece 613, the positioning piece 613 includes a telescopic rod and a supporting spring, the supporting spring is used for pushing the telescopic rod to stretch, the telescopic rod is inclined, and two ends of the telescopic rod are respectively movably hinged with the bottom plate 611 and the transfer plate 612.

Specifically, the bottom plate 611 can slide left and right in the cooling rack 3, the transfer plate 612 can slide up and down on the bottom plate 611, the transfer plate 612 needs to keep stable in position after moving up, so that the PCB board can be stably supported and removed from the object placing plate 41, for this purpose, a positioning piece 613 is provided to achieve the purpose, in fig. 8, when the transfer plate 612 is located at the bottom end of the moving range of the transfer plate 612, the positioning piece 613 takes a tilting posture with high left and low right, after the transfer plate 612 moves up on the bottom plate 611, the positioning piece 613 is driven to deflect, the right end of the positioning piece 613 deflects upwards, and the deflected telescopic rod keeps stable tilting state under the pushing of the supporting spring, so that the transfer plate 612 can keep stable in position after rising up;

In the initial state, the transfer plate 612 is located at the bottom end of the moving range of the transfer plate 612, and in the height direction, the transfer plate 612 is located below the same-layer PCB in the baking rack 2, so that the transfer plate 612 can smoothly move below the PCB, then the transfer plate 612 is started to move upwards, the transfer plate 612 lifts the PCB on the same-layer placement plate 41 upwards, so that the PCB is separated from the placement plate 41, and then the transfer plate 612 can lift the PCB to move back into the cooling rack 3; by arranging the transfer plate 612 capable of moving up and down to lift the PCB from the storage plate 41, the problem that the PCB is difficult to be directly transported away due to large transverse friction between the PCB and the storage plate 41 is solved, and smooth operation of the PCB transportation is ensured.

As shown in fig. 5-6, a reinforcing rib 6111 is arranged on the top of the bottom plate 611, and the height of the reinforcing rib 6111 is matched with the height of the positioning piece 613.

Specifically, in an initial state and when the PCB is pressed to prevent bending, the transfer plate 612 is located at the bottom end of the sliding range, and the bottom end of the transfer plate 612 contacts the reinforcing rib 6111; through setting up strengthening rib 6111 and supporting transfer board 612, fill the blank area that exists in the height between bottom plate 611 and the transfer board 612 because of the existence of setting element 613, both avoided the condition that clamp plate 51 and PCB board's weight all concentrate on the telescopic link in the cooling process, reduced the work load of telescopic link, simultaneously, clamp the upper and lower both sides of PCB simultaneously with the transfer board 612 that is supported by strengthening rib 6111, the centre gripping effect to the PCB board is better to the anti-bending effect to the PCB board has been ensured.

As shown in fig. 6-9, the transfer mechanism 6 further includes:

a plurality of correction plates 62 rotatably mounted on the bottom plate 611, the correction plates 62 being distributed on the circumferential side of the bottom plate 611; and

the rack plates 63 are fixedly connected to the bottom ends of the transfer plates 612, the rack plates 63 are meshed with the correction plates 62 for transmission, and the rack plates 63 move to drive the top ends of the correction plates 62 to rotate inwards.

Specifically, a gear is arranged at the rotating shaft of the correction plate 62, and the rack plate 63 is in meshed connection with the gear; the parking position of the PCB board on the storage board 41 may deviate, after the transfer board 612 lifts the PCB to the inside of the cooling rack 3, the transfer board 612 is started to move downwards, the plurality of rack boards 63 move downwards and drive the correction boards 62 to rotate, and the plurality of correction boards 62 push the PCB board after rotating, so that the relative position of the PCB board on the transfer board 612 is corrected, the PCB board can be aligned up and down with the pressing board 51 above the transfer board 612, and the alignment extrusion of the pressing board 51 to the PCB board is ensured.

As shown in fig. 6-9, the top end of the correction plate 62 is not higher than the top surface of the transfer plate 612 after being moved up, and the transfer plate 612 is provided with a groove for the correction plate 62 to move.

Specifically, after the transfer plate 612 moves up, the correction plate 62 is not higher than the transfer plate 612, so as not to interfere with the action of lifting the PCB by the transfer plate 612, and after the transfer plate 612 moves down and drives the correction plate 62 to rotate, the top end of the correction plate 62 extends above the transfer plate 612 and deflects inward, thereby pushing and correcting the position of the PCB.

As shown in fig. 2 to 14, the transfer mechanism 6 further includes:

the pushing-up part 64 is fixedly connected to the baking rack 2, and the pushing-up part 64 is used for pushing the transfer plate 612 moving to the interior of the baking rack 2 to move upwards; and

a hold-down member 65 slidably mounted on the cooling rack 3, the hold-down member 65 being adapted to press the transfer plate 612 located inside the cooling rack 3 downward.

Specifically, the side wall of the push-up member 64 is provided with a slope, the bottom end of the slope is inserted between the bottom plate 611 and the transfer plate 612, after the baking rack 2 and the cooling rack 3 are close to each other, the transfer member 61 is started to be inserted into the channel of the baking rack 2, when the transfer plate 612 moves below the PCB and contacts with the push-up member 64, the push-up member 64 pushes the transfer plate 612 to move upwards, so that the transfer plate 612 supports the PCB; after the transfer member 61 is started to move back to the inside of the cooling rack 3, the moving back transfer plate 612 contacts with the pressing member 65, and the pressing member 65 presses the transfer plate 612 to move down for resetting so as to perform the subsequent PCB position correction and the pressing plate 51 presses the plate bending prevention work.

Example two

As shown in fig. 13, a comparative example one, in which another embodiment of the present invention is:

further comprises a handling mechanism 7, said handling mechanism 7 further comprising:

A plurality of driving shafts 71 rotatably installed in the cooling rack 3, wherein the driving shafts 71 are meshed with the bottom plate 611 for transmission;

a handle 72 fixedly connected to the drive shaft 71; and

a chain belt 73, wherein a plurality of the driving shafts 71 are transmitted through the chain belt 73.

Specifically, the bottom end of the bottom plate 611 is provided with a straight tooth section, the driving shaft 71 is provided with a straight gear meshed with the straight tooth section, the handle 72 is rotated, the handle 72 drives the driving shaft 71 to rotate, and synchronous rotation is realized between the driving shafts 71 through the chain belt 73, so that multiple groups of transfer pieces 61 can be driven to move transversely at the same time, multiple groups of transfer pieces 61 move to the lower part of each layer of PCB boards in the baking frame 2 at the same time, then, the transfer boards 612 in each group of transfer pieces 61 are respectively contacted with the push-up pieces 64 at the corresponding layer heights, and each push-up piece 64 respectively pushes each transfer board 612 to move upwards, so that the functions of simultaneously moving up the multiple transfer boards 612 and supporting the corresponding PCB boards can be realized.

Example III

As shown in fig. 2-14, comparative example two, wherein another embodiment of the present invention is:

the transfer mechanism 6 further comprises a lifting piece 66 arranged on the pressing plate 51, and the pressing plate 51 is driven to move upwards by the lifting piece 66, so that the transfer plate 612 positioned inside the cooling rack 3 is driven to move upwards.

Specifically, after the PCB board is baked and cooled, the cooled PCB board needs to be stacked in another device and transferred to the SMT station, so that the PCB in the cooling rack 3 needs to be transferred away;

the baking rack 2 and the cooling rack 3 are both positioned at the outer side of the baking oven 1, after cooling is finished, the pressing plate 51 moves upwards, the transfer plate 612 is driven to move upwards through the lifting piece 66, then the transfer piece 61 is started to move into the empty baking oven 1, the transfer plate 612 lifts the PCB to move into the channel, the lifted PCB is positioned above the placing plate 41, then the PCB on the transfer plate 612 can be transferred into the placing plate 41, finally, the baking rack 2 stacked with cooling is moved to the SMT station, and the transfer work of the cooled PCB is completed.

It should be noted that another stacking and transferring device 200 may be provided, where the stacking and transferring device 200 has the same structure as the baking rack 2, so as to realize a function that the transferring work of the cooled PCB board and the baking work of the baking rack 2 in the baking box 1 do not affect each other.

As shown in fig. 11 to 12, the hold-down member 65 includes:

the supporting rods 651 are fixedly connected to the side walls of the cooling frames 3;

a sliding plate 652 slidably sleeved on the supporting rod 651, wherein a slope is arranged on the side wall of the sliding plate 652; and

A return spring 653 for urging the slide plate 652 to move above the transfer plate 612.

The pull member 66 includes:

a rotating plate 661 rotatably mounted at the bottom of the pressing plate 51, wherein the rotating plate 661 has a unidirectional rotating structure, and the rotating plate 661 has an L shape; and

a wedge 662 fixedly connected to the rotating plate 661, wherein the wedge 662 is used for pushing the sliding plate 652 to be staggered with the transferring plate 612.

Specifically, a reset torsion spring is arranged in the rotating shaft of the rotating plate 661, a vertical side plate in the rotating plate 661 is positioned at the outer side of the transferring plate 612, a transverse bottom plate of the rotating plate 661 is used for pushing the transferring plate 612 to move upwards, and the moving direction of the sliding plate 652 is perpendicular to the moving direction of the bottom plate 611; the transfer plate 612 after rising moves back to the inside of the cooling rack 3 and then contacts with the slide plate 652, and the slide plate 652 presses the transfer plate 612 to move downward; when the pressing plate 51 moves downwards, the rotating plate 661 rotates after contacting with the transferring plate 612, so that the rotating plate 661 and the wedge 662 can move downwards below the transferring plate 612, and then the rotating plate 661 rotates for resetting; after cooling is finished, the pressing plate 51 moves upwards to reset, the upward wedge 662 firstly contacts with the sliding plate 652 and presses the sliding plate 652 to move, so that the sliding plate 652 is staggered with the transfer plate 612, and then the upward rotating plate 661 contacts with the transfer plate 612 and pushes the transfer plate 612 to move upwards; then, the handle 72 is rotated to drive the transfer board 612 to move out with the cooled PCB board lifted by the rising gesture, so that the PCB boards are conveniently stacked on other devices, in addition, the height difference between the rising transfer board 612 and the same-layer placement board 41 is increased, the transfer board 612 can convey more PCB boards to the same-layer placement board 41, so that the function of stacking a plurality of PCB boards on a group of placement boards 41 is achieved, and the lifting piece 66 simultaneously has the functions of pushing the pushing piece 65 and lifting the transfer board 612, and has a simple and compact structure and convenient use.

Working principle: the lowest object placing plate 41 in the baking rack 2 is a first object placing plate 41, the second object placing plate 41 is arranged above the first object placing plate 41, and so on; sequentially placing a plurality of PCB boards into a channel from top to bottom, after the PCB boards move downwards in the channel and are parked on the first storage board 41, the first storage board 41 is deflected by gravity pressurization of the PCB boards, and the rotation amplitude of the storage board 41 is limited by arranging the limiting board 44, so that the storage board 41 is rotated to be in a horizontal state after being extruded by the PCB boards; the rotated first storage plate 41 drives the connecting rod 43 above the first storage plate 41 to swing through the limiting frame 42, so that the second storage plate 41 is driven to deflect, the head of the second storage plate 41 extends into the channel, then the next PCB which continues to move downwards in the channel can be parked on the second storage plate 41, the second storage plate 41 is extruded and rotated to be in a horizontal state, the second storage plate 41 drives the third storage plate 41 above the second storage plate to rotate, and a plurality of PCBs are sequentially stacked on each group of storage plates 41 in a reciprocating manner;

sending the baking frame 2 stacked with the PCB into the baking oven 1 for baking;

after the baking is finished, the baking frame 2 is moved out of the baking box 1 and aligned with the cooling frame 3, the handle 72 is rotated, the handle 72 drives the driving shafts 71 to synchronously rotate, the driving shafts 71 drive the bottom plate 611 and the transfer plate 612 to move outwards, when the transfer plate 612 moves below the PCB, the transfer plate 612 contacts with the push-up piece 64, and the push-up piece 64 pushes the transfer plate 612 to move upwards, so that the transfer plate 612 supports the PCB;

After the handle 72 is reversely rotated and the handle 72 drives the transfer piece 61 to move back into the cooling frame 3, the transfer plate 612 is contacted with the lower pressing piece 65, the lower pressing piece 65 presses the transfer plate 612 to move downwards for resetting, and the reinforced rib 6111 on the bottom plate 611 supports the transfer plate 612 after the downward movement; starting the lifting assembly 53 to move downwards so that each pressing plate 51 moves downwards, and after the lifting assembly 53 moves to the lowest position and is separated from the topmost pressing plate 51 up and down, all the pressing plates 51 rest on the corresponding PCB, and the pressing plates 51 and the transfer plates 612 are clamped on the upper side and the lower side of the PCB at the same time, so that the effect of preventing the PCB from bending when being cooled is achieved;

after cooling, the lifting assembly 53 is started to move upwards, the lifting assembly 53 drives the pressing plate 51 to move upwards to be separated from the PCB, in the upward movement and resetting process of the pressing plate 51, the upward-moving wedge 662 is firstly contacted with the sliding plate 652 and presses the sliding plate 652 to move, so that the sliding plate 652 is staggered with the transfer plate 612, and then the upward-moving rotating plate 661 is contacted with the transfer plate 612 and pushes the transfer plate 612 to move upwards; then, the handle 72 is rotated to drive the transfer board 612 to move out with the cooled PCB board lifted in the ascending posture, so that the PCB board is conveniently stacked on the stacking and transferring device 200, and finally, the stacking and transferring device 200 stacked with the cooled PCB board is moved to the SMT station to complete the transferring work of the cooled PCB board.

The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (10)

1. The utility model provides a PCB board pre-baking device, includes oven (1), baking rack (2) and cooling frame (3), its characterized in that: further comprises:

the material stacking mechanism (4) is arranged in the baking frame (2), and the material stacking mechanism (4) comprises a plurality of groups of longitudinally arranged articles;

the plate bending prevention mechanism (5) is arranged in the cooling frame (3), and the plate bending prevention mechanism (5) comprises a plurality of pressing plates (51) which are longitudinally arranged; and

the PCB is rotated between the baking frame (2) and the cooling frame (3) to be transported, the transporting mechanism (6) comprises a plurality of groups of longitudinally arranged transporting pieces (61), the number of the transporting pieces (61) is matched with that of the articles, the transporting pieces (61) are movably inserted into the cooling frame (3), and a group of transporting pieces (61) are arranged below each pressing plate (51);

The baking frame (2) is U-shaped, a through channel is formed between two side walls of the baking frame (2), one group of object placing objects comprises two object placing plates (41), and the same group of two object placing plates (41) are respectively arranged at aligned positions on two inner side walls of the baking frame (2);

the storage plate (41) is rotatably arranged on the inner side wall of the baking frame (2), the storage plate (41) is in a T shape, and the stacking mechanism (4) further comprises;

the limiting frame (42) is fixedly connected to the upper end of the tail part of the object placing plate (41);

a connecting rod (43) arranged at the lower end of the tail part of the object placing plate (41) in a rotating way, and the bottom end of the connecting rod (43) is inserted into the limiting frame (42) positioned on the object placing plate (41) below; and

a limiting plate (44) fixedly connected to the baking frame (2) for limiting the object placing plate (41);

the heads of the two bottommost object placing plates (41) extend into the channel of the baking frame (2), and the heads of the rest object placing plates (41) are contracted into the side wall of the baking frame (2).

2. The PCB pre-baking apparatus according to claim 1, wherein: the clamp plate (51) slidable mounting is in the inside of cooling frame (3), prevent board curved mechanism (5) still include:

The hook pieces (52) are fixedly connected to the upper side and the lower side of the pressing plate (51) respectively, the two hook pieces (52) are in a central symmetrical L shape, and the two pressing plates (51) adjacent to each other at the upper side and the lower side are connected through the hook pieces (52); and

and a lifting assembly (53) arranged on the cooling frame (3) and used for driving the pressing plate (51) at the top end.

3. The PCB pre-baking apparatus of claim 2, wherein: the transfer member (61) includes:

a bottom plate (611) movably inserted in the cooling frame (3),

a transfer plate (612), wherein the transfer plate (612) is movably inserted above the bottom plate (611); and

the locating piece (613), locating piece (613) are including telescopic link and supporting spring, and supporting spring is used for promoting the telescopic link and extends, and the telescopic link is the slope form, and the both ends of telescopic link respectively with bottom plate (611) with transfer board (612) activity articulates.

4. A PCB pre-baking apparatus according to claim 3, wherein: the top of the bottom plate (611) is provided with a reinforcing rib (6111), and the height of the reinforcing rib (6111) is matched with the height of the positioning piece (613).

5. The PCB pre-baking apparatus according to claim 4, wherein: the transport mechanism (6) further comprises:

a plurality of correction plates (62) rotatably mounted on the bottom plate (611), the correction plates (62) being distributed on the peripheral side of the bottom plate (611); and

the rack plates (63) are fixedly connected to the bottom ends of the transfer plates (612), the rack plates (63) are in meshed transmission with the correction plates (62), and the rack plates (63) move and then drive the top ends of the correction plates (62) to rotate inwards.

6. The PCB pre-baking apparatus according to claim 5, wherein: the top end of the correction plate (62) is not higher than the top surface of the transfer plate (612) after the correction plate (62) is moved upwards, and a groove for the correction plate (62) to move is formed in the transfer plate (612).

7. The PCB pre-baking apparatus of claim 6, wherein: the transport mechanism (6) further comprises:

the pushing-up piece (64) is fixedly connected to the baking frame (2), and the pushing-up piece (64) is used for pushing the transfer plate (612) moving to the interior of the baking frame (2) to move upwards; and

-a hold-down element (65) slidably mounted on the cooling rack (3), said hold-down element (65) being adapted to press the transfer plate (612) inside the cooling rack (3) down.

8. The PCB pre-baking apparatus of claim 7, wherein: further comprises a control mechanism (7), the control mechanism (7) further comprises:

a plurality of driving shafts (71) rotatably installed in the cooling rack (3), wherein the driving shafts (71) are in meshed transmission with the bottom plate (611);

a handle (72) fixedly connected to the driving shaft (71); and

and a chain belt (73), wherein a plurality of driving shafts (71) are transmitted through the chain belt (73).

9. The PCB pre-baking apparatus of claim 8, wherein: the transfer mechanism (6) further comprises a lifting piece (66) arranged on the pressing plate (51), and the pressing plate (51) is driven to move upwards through the lifting piece (66) after moving upwards, so that the transfer plate (612) positioned in the cooling frame (3) is driven to move upwards.

10. The PCB pre-baking apparatus of claim 9, wherein: the hold-down (65) includes:

a supporting rod (651) fixedly connected to the side wall of the cooling frame (3);

a sliding plate (652) which is sleeved on the supporting rod (651) in a sliding manner, wherein a slope is arranged on the side wall of the sliding plate (652); and

a return spring (653) for urging the slide plate (652) to move above the transfer plate (612);

The pull-up member (66) includes:

a rotating plate (661) rotatably mounted at the bottom of the pressing plate (51), wherein the rotating plate (661) is of a unidirectional rotating structure, and the rotating plate (661) is L-shaped; and

and a wedge block (662) fixedly connected to the rotating plate (661), wherein the wedge block (662) is used for pushing the sliding plate (652) to be staggered with the transferring plate (612).