KR20100112345A

KR20100112345A - Non contact wet handling conveyance method of printed circuit board

Info

Publication number: KR20100112345A
Application number: KR1020090030810A
Authority: KR
Inventors: 박용순
Original assignee: 주식회사 티케이씨
Priority date: 2009-04-09
Filing date: 2009-04-09
Publication date: 2010-10-19

Abstract

PURPOSE: A contactless wet processing turnaround method is provided to prevent the damage of a PCB during a wet processing process by continuously returning a PCB with vertically supporting it through a contactless method. CONSTITUTION: A printed circuit board(1) is loaded in a product transfer cassette(2). A jig(4) continuously moves along a guide rail(3). A clamp(5) is installed in the jig. The clamp loads and unloads the printed circuit board in a vertical direction. A water rinsing bath(6) washes the printed circuit board passing a main processor with a dipping and spray shower method.

Description

Non contact wet handling conveyance method of printed circuit board

The present invention prevents damage, damage, scratches, etc. of the circuit of the circuit board surface, DFR (Dry Film Raminator), SR (Solder Register) during wet processing of a printed circuit board (PCB). A non-contact wet processing method for a printed circuit board capable of transfer processing.

In general, the wet processing method of a printed circuit board refers to a method of collectively processing pre-processing, post-processing, developing, etching, peeling, plating, etc. of a printed circuit board, and a conventional printed circuit board applied to the wet processing of such a printed circuit board. As shown in FIG. 1 (A), the continuous conveying method of the multi-point roll contacting method in which a plurality of conveyor rolls 102 are brought into contact with the front and rear surfaces of the substrate 101 to convey the substrate 101 in the direction of the arrow. As shown in FIG. 1 (B), three-point roll contacting methods for conveying the substrate 201 by contacting the three-point conveyor support rollers 202 on the front and rear surfaces of the substrate 201 are representatively proposed and applied. have.

Conventionally, the multi-point roll method or the three-point roll method as described above are all chemicals or cleaning in the respective processing steps, that is, pre / post-treatment, developing, etching, peeling, plating, while conveying the substrate by directly contacting the rolls with the substrate. A contact wet processing conveying method in which water is sprayed through the nozzles 103 and 203 or the conveyor rolls, which are dipping into the plating liquid, is brought into direct contact with the substrate and is conveyed, has been applied to a printed circuit board.

However, with the recent miniaturization and thinning of printed circuit boards, as circuits become finer and thinner, handling becomes more difficult in the wet processing method of the printed circuit boards. Problems of damage or damage have been raised.

Accordingly, the present invention has been invented to solve the above-mentioned conventional problems, and when the printed circuit board is conveyed for wet processing of the printed circuit board, the printed circuit board is continuously conveyed in a non-contact manner, thereby printing during the wet processing process. It is an object of the present invention to provide a method for conveying a non-contact wet process of a printed circuit board, which prevents circuit damage, breakage, and damage of the circuit board to obtain a high quality plating product.

The present invention for achieving the above object is a pre-treatment step, development and etching step, recovery and recovery while maintaining the vertical suspension support state that the upper or upper end of the printed circuit board is clamped to the clamp of the jig continuously moving along the rail A water washing step and a drying step are sequentially transported and characterized in that they are processed.

The non-contact wet processing conveying method of a printed circuit board according to the present invention as described above occurs when conveying a printed circuit board by a roll contact method as it is vertically supported by a non-contact method in a wet process for plating a printed circuit board. It can prevent the problem that causes the plating failure, and can be effectively applied to light and short and small sized printed circuit board having a fine circuit and layout reduction of equipment according to the continuous transfer.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 2 is a perspective view schematically illustrating the construction of a wet processing apparatus to which a non-contact wet processing conveying method of a printed circuit board according to the present invention is applied, FIG. 3 is a cross-sectional view taken along line II of FIG. 2, and FIG. A) Front view.

Prior to the description of the present invention, the terms are defined and explained.

First, the wet processing of a printed circuit board refers to a method of collectively processing post-processing, developing, etching, peeling, plating, and the like when plating the printed circuit board.

The present invention is a vertical suspension supporting state in which the printed circuit board (1) is loaded from the product transfer cassette (2) and is clamped to both the upper and lower ends by the clamp (5) of the jig (4) continuously moving along the guide rails (3). Pretreatment step (C), development and etching step (D), recovery and washing step (E), air knife step (F), and drying step (G) are sequentially transferred and wetted while maintaining have.

Here, in the development and etching step (D), the development proceeds to a developing tank → a washing tank → a drying step, and the etching proceeds to a pickling tank → an etching tank → a washing tank → a neutralization tank → a washing tank → a drying step.

On the other hand, the product transfer cassette 2 shown in Fig. 2 is a jig for carrying the printed circuit board 1, the upper and lower clamps 5 of the jig 4 is provided, the upper and lower clamps (5) The substrate 1 can be loaded and unloaded in the vertical direction.

In the present invention, a printed circuit board has been selected and described as an example of a product, but it can be applied to a flexible or epoxy board having a metallic circuit such as a silicon wafer as well as the printed circuit board.

The product transfer cassette 2 may adopt a chain drive method, a slider drive method, or the like as known in the art, and in the development and etching step (D) of the main processing unit, are suspended and supported by the clamp 5 by a plating or chemical treatment process. The printed circuit board 7 may be processed by dipping or spraying through the nozzle 9, and the water washing tank 6 may prevent water from washing or discoloring of the printed circuit board 1 through the main processing unit. Pickling is processed by dipping and spraying.

In the drawings, reference numeral 7 denotes a medicine supply unit, and 8 denotes various cover.

In the non-contact wet processing conveying method of the printed circuit board according to the present invention using the wet processing apparatus as described above, only the upper and lower portions of the printed circuit board 1 loaded from the product transfer cassette 2 are supported by the upper and lower clamps 5. The pretreatment step (C), the development and etching step (D), the recovery and washing step (E), and the air knife (Air Knife) by the jig (4) continuously moving along the guide rail (3) in a vertical position. As the step (F) and the drying step (E) are sequentially conveyed and processed, the conveyor rolls directly contact the printed circuit board when the conventional printed circuit board 1 is conveyed in a roller manner. It is possible to complete a high quality plating process by reducing defects while preventing damage to, damage to, or damage to the circuit board.

1 is a view illustrating a method of conveying when wet processing a conventional printed circuit board, (A) is a multi-point roll contact method, (B) is a view showing a three-point roll contact method,

2 is a schematic configuration perspective view of a wet processing apparatus of a printed circuit board applied to the present invention;

3 is a cross-sectional view taken along line II of FIG. 2;

FIG. 4 is a front view of arrow (a) in FIG. 3.

-Explanation of symbols for the main parts of the drawings-

1: printed circuit board, 2: product transfer cassette,

3: guide rail, 4: jig,

5: clamp, 6: flushing tank.

Claims

In the wet processing conveying method of the printed circuit board which conveys this printed circuit board for carrying out the wet process by continuously conveying the printed circuit board 1,

The printed circuit board 1 maintains a vertical suspension support state in which the upper or upper and lower ends of the printed circuit board 1 are loaded by the product transfer cassette 2 and clamped to the clamp 5 of the jig 4 continuously moving along the guide rails 3. While the pre-treatment step (C), the development and etching step (D), the recovery and washing step (E), the air knife step (F), and the drying step (G) in succession are sequentially transferred to wet printing Non-contact wet processing conveyance method of a circuit board.