CN213028733U

CN213028733U - mSAP process continuous production line

Info

Publication number: CN213028733U
Application number: CN202021362242.2U
Authority: CN
Inventors: 李齐良
Original assignee: Plotech Technology Kunshan Co ltd
Current assignee: Plotech Technology Kunshan Co ltd
Priority date: 2020-07-13
Filing date: 2020-07-13
Publication date: 2021-04-20
Anticipated expiration: 2030-07-13

Abstract

The utility model belongs to the technical field of the circuit board is made, a mSAP processing procedure continuity production line is related to, including being used for carrying out the skeet that transports perpendicularly and the continuous line that sets up along skeet direction of delivery to the circuit board, the continuous line is including developing line and VCP coppered line or developing line, VCP coppered line and the film stripping line that set up according to the preface, every stores pylon on the skeet includes the elevating gear that centre gripping subassembly and drive centre gripping subassembly go up and down. The assembly line can continuously complete a plurality of processes, the processes are directly connected, the carrying time is shortened, the carrying pollution risk is reduced, and high productivity can be realized under the condition of low cost.

Description

mSAP process continuous production line

Technical Field

The utility model relates to a circuit board manufacturing technical field, in particular to mSAP processing procedure serialization production line.

Background

The signal transmission requirements of ultrahigh speed and high integrity in the application fields of 5G communication, internet of things and the like provide new challenges for the existing Printed Circuit Board (PCB) manufacturing technology, and the communication PCBs are promoted to develop towards low-roughness, high-density interconnection, high-signal integrity and the like of lines. At present, the realization of improving the high-frequency and high-speed performance of the PCB through the development of new PCB manufacturing materials, improvement of manufacturing processes, structural design and other ways is an industrial research hotspot. The high-frequency high-speed PCB manufacturing technology based on research materials and the mSAP technology becomes a future trend, and new kinetic energy, automobile electronics and 5G high frequency are important in PCB investment in the future.

The mSAP process is typically produced in three lines, a development line, a plating line, and a stripping line. The three line steps are respectively:

developing lines: tearing, feeding, developing, pickling, washing, drying and discharging;

electroplating wires: loading, cleaning, hot water washing, acid washing, copper plating and unloading;

stripping the film line: feeding, stripping a film, washing with hot water, washing with water, resisting oxidation, washing with water, drying and discharging.

The matching of the known mSAP process in the existing plate works is investigated as follows:

therefore, the mSAP equipment connection process technology belongs to the vacuum period at present, although the mSAP process is applied to product upgrading in the industry, different transmission form collocation modes are generally adopted for segmented production, the process flow cannot be effectively integrated, the quality parameter integral control brought by product precision production and integrated operation cannot be achieved, and the uncontrollable factors of personnel operation cannot be eliminated.

Therefore, it is necessary to provide a pipeline with a new structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a mSAP processing procedure serialization production line not only effectively integrates in the aspect of the automation of operation management and control, and can practice thrift the input in the aspect of manpower, equipment.

The utility model discloses a following technical scheme realizes above-mentioned purpose: the utility model provides a mSAP processing procedure continuous production line, is including being used for carrying out the skeet that transports perpendicularly to the circuit board and the continuous line that sets up along skeet direction of delivery, the continuous line is including developing line and VCP coppered line or developing line, VCP coppered line and the line of peeling off the membrane that sets up according to the preface, every stores pylon on the skeet includes the elevating gear that centre gripping subassembly and drive centre gripping subassembly go up and down.

Specifically, the developing line comprises a developing tank, a rinsing tank, a drying tank and a cooling tank which are arranged in sequence.

Specifically, the VCP copper-plated wire comprises an acid washing tank and a plurality of copper-plated tanks which are arranged in sequence.

Specifically, the film stripping line comprises a rinsing bath, a film stripping bath, a hot rinsing bath, a rinsing bath and a blow-drying bath which are arranged in sequence.

Further, the centre gripping subassembly includes hollow frame, the upper ledge below of frame is equipped with a plurality of upper jaws, the lower ledge top of frame is equipped with a plurality of lower jaws, the below of frame lower ledge is equipped with leads positive pole, each inslot of developing line, VCP coppered line and film stripping line all is equipped with the cooperation and leads positive cover of positive pole.

Specifically, an inlet of the developing line is provided with an automatic feeding device and a front buffering device.

Specifically, the outlet of the stripping line is provided with a rear buffer device and an automatic blanking device.

Adopt above-mentioned technical scheme beneficial effect to be:

the production line can complete three processes of developing, vertical electroplating and stripping simultaneously, the processes are directly connected, the carrying time is shortened, the carrying pollution risk is reduced, and high productivity can be realized under the condition of low cost.

Drawings

FIG. 1 is a floor plan of a mSAP process line;

fig. 2 is a front view of a single pylon on a flying target.

The figures in the drawings represent:

1-developing line, 11-developing tank, 12-rinsing tank, 13-drying tank and 14-cooling tank;

2-VCP copper plating wire, 21-pickling bath, 22-copper plating bath;

3-stripping the membrane, 31-rinsing bath, 32-stripping bath, 33-hot rinsing bath, 34-rinsing bath, 35-drying bath,

4-flying target, 41-clamping component, 411-frame, 412-upper clamping jaw, 413-lower clamping jaw, 414-guide rod and 42-lifting device;

51-automatic feeding device, 52-front buffer device;

61-rear buffer device, 62-automatic blanking device.

Detailed Description

The present invention will be described in further detail with reference to specific examples.

Example (b):

as shown in FIG. 1 and FIG. 2, the utility model relates to a mSAP process serialization production line, including the skeet 4 that is used for carrying out perpendicular transport to the circuit board and the continuous line that sets up along skeet 4 direction of delivery, the continuous line is including developing line 1, VCP coppered line 2 and the line of peeling off the membrane 3 that sets up according to the preface, and developing line 1, VCP copperd line 2 and the line of peeling off the membrane 3 all carry out perpendicular transport to the circuit board through skeet 4, and every stores pylon on the skeet 4 includes centre gripping subassembly 51 and the elevating gear 42 that drives centre gripping subassembly 41 and go up and down. Because the VCP copper-plated wire 2 adopts vertical feeding, in order to reduce the trouble of direction switching of the circuit board, the developing wire 1 and the stripping wire 3 also adopt a vertical feeding method and are transferred by using a flying target 4. The circuit board is fixed on the clamping component 41 of the flying target 4, and then is immersed into the tank body by the lifting device 42, after one operation is completed, the lifting device 42 enables the clamping component 41 to be lifted, then the circuit board is conveyed to the upper part of the next tank body, and the next immersion and lifting action is performed until the film stripping process is completed. The oxidation resistance of the original stripping line is achieved in the subsequent etching. The production line can complete three processes of development, vertical electroplating and film stripping at the same time, the processes are directly connected, and the carrying time is reduced. The whole process does not need workers to participate, and the risk that sweat on hands pollutes the board is avoided. Because of the reduced risk of contamination, certain cleaning procedures can also be saved, enabling high production rates at low cost. The production line can only have the developing line 1 and the VCP coppered line 2, thereby saving the turnover process between the two working procedures and being beneficial to improving the production rate compared with a discontinuous line.

As shown in fig. 1, the developing line 1 includes a developing tank 11, a rinsing tank 12, a drying tank 13 and a cooling tank 14 which are sequentially arranged, the VCP copper-plated wire 2 includes a pickling tank 21 and a plurality of copper-plated tanks 22 which are sequentially arranged, and the film peeling line 3 includes a rinsing tank 31, a film peeling tank 32, a hot rinsing tank 33, a rinsing tank 34 and a drying tank 35 which are sequentially arranged. The structure covers all units required by the whole working section of the mSAP manufacturing process, and the software system controls independent operation and control, so that the automatic screening and intelligent management can be realized by manpower, environmental protection, safety, document unification, product batch control and quality control. The production process can be automatically finished without manual operation, and production only requires inspection and management personnel.

The following is a table comparing the conditions of the continuous line embodiment and the discontinuous line of the present mSAP process:

as can be seen from the above table, the new continuous production line can obviously save manpower, also reduces the auxiliary equipment, and can save a great deal of expenses every month.

As shown in fig. 2, the holding assembly 41 includes a hollow frame 411, a plurality of upper holding jaws 412 are disposed below the upper frame of the frame 411, a plurality of lower holding jaws 413 are disposed above the lower frame of the frame 411, two guiding rods 414 are disposed below the lower frame of the frame 411, and guiding sleeves (not shown) matched with the guiding rods 414 are disposed in each of the grooves of the developing line 1, the VCP copper-plated line 2 and the stripping line 3. The clamping assembly 41 can utilize the upper clamping jaw 412 and the lower clamping jaw 413 to clamp and fix the upper and lower sides of the circuit board at the same time, and the guiding rod 414 can be used for fixing the position of the frame 411 from below, so as to avoid the problems of reverse adhesion, scratch and the like caused by the swinging and swinging of the circuit board.

As shown in fig. 1, the inlet of the developing line 1 is provided with an automatic feeding device 51 and a front buffer device 52. The automatic feeding device 51 can uniformly feed the circuit boards by means of the carrying disc jig, and the feeding labor is reduced. The front buffer device 52 can make the circuit board in place first, wait until the circuit board in front enters the next groove body, and then the circuit board in back is sent in, thus ensuring the continuity of feeding.

As shown in fig. 1, the outlet of the peeling line 3 is provided with a rear buffer 61 and an automatic blanking device 62. The circuit board that back buffer 61 will pass through stripping line 3 keeps in, waits automatic unloader 62 with its unloading, has effectively reduced workman's latency.

What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.

Claims

1. A mSAP process continuous production line is characterized in that: including being used for carrying out the skeet that transports perpendicularly and the continuous line that sets up along skeet direction of delivery to the circuit board, the continuous line is including developing line and VCP coppered line or developing line, VCP coppered line and the line of peeling off the membrane that sets up according to the preface, every stores pylon on the skeet includes the elevating gear that centre gripping subassembly and drive centre gripping subassembly go up and down.

2. The mSAP process continuous production line of claim 1, wherein: the developing line comprises a developing tank, a rinsing tank, a drying tank and a cooling tank which are arranged in sequence.

3. The mSAP process continuous production line of claim 1, wherein: the VCP copper-plated wire comprises a pickling tank and a plurality of copper-plated tanks which are arranged in sequence.

4. The mSAP process continuous production line of claim 1, wherein: the film stripping line comprises a rinsing bath, a film stripping bath, a hot rinsing bath, a rinsing bath and a blow-drying bath which are sequentially arranged.

5. The mSAP process continuous production line of any one of claims 1 to 4, wherein: the centre gripping subassembly includes hollow frame, the upper ledge below of frame is equipped with a plurality of upper clamping jaws, the lower ledge top of frame is equipped with a plurality of lower clamping jaws, the below of frame lower ledge is equipped with two and leads positive pole, each inslot of developing line, VCP coppered line and film stripping line all is equipped with the cooperation and leads positive cover of pole.

6. The mSAP process continuous production line of claim 1, wherein: and an automatic feeding device and a front buffer device are arranged at the inlet of the developing line.

7. The mSAP process continuous production line of claim 1, wherein: and a rear buffer device and an automatic blanking device are arranged at the outlet of the film stripping line.