WO2022004169A1 - アンテナモジュール、接続部材、およびそれを搭載した通信装置 - Google Patents
アンテナモジュール、接続部材、およびそれを搭載した通信装置 Download PDFInfo
- Publication number
- WO2022004169A1 WO2022004169A1 PCT/JP2021/018983 JP2021018983W WO2022004169A1 WO 2022004169 A1 WO2022004169 A1 WO 2022004169A1 JP 2021018983 W JP2021018983 W JP 2021018983W WO 2022004169 A1 WO2022004169 A1 WO 2022004169A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- antenna module
- connecting member
- feeding
- circuit
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0025—Modular arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/24—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/006—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using switches for selecting the desired band
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0064—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with separate antennas for the more than one band
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B1/0458—Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/18—Input circuits, e.g. for coupling to an antenna or a transmission line
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/44—Transmit/receive switching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
Definitions
- the present disclosure relates to an antenna module, a connecting member, and a communication device on which the antenna module is mounted, and more specifically, to a technique for improving the degree of freedom in arranging the antenna module in the communication device.
- Antenna modules for transmitting and receiving radio waves are generally used in mobile communication devices such as mobile phones and smartphones.
- mobile communication devices such as mobile phones and smartphones.
- devices mounted inside devices such as antenna modules are also required to be further miniaturized and reduced in height. ..
- the position where the radiation element (feeding element) can be arranged in the communication equipment may be greatly restricted.
- Patent Document 1 discloses a mobile wireless communication device including an antenna array connected via a flexible interconnect from a wireless device arranged on a printed circuit board.
- the antenna array can be mounted away from the circuit board by the flexible flexible interconnect, so that the device in the housing of the wireless device can be mounted. It is possible to improve the degree of freedom in the arrangement of.
- the radio includes an individual RF front end corresponding to each of a plurality of antenna arrays. That is, the same number of RF front ends as the antenna array mounted on the radio is required. In this case, as the number of antenna arrays increases, so does the number of RF front ends that should be placed on the circuit board. Therefore, a large mounting area is required for the circuit board, and as a result, it may be a factor that hinders the miniaturization of the wireless device.
- This disclosure was made to solve the above problems, and the purpose is to reduce the size of the antenna module.
- An antenna module includes a first substrate and a second substrate in which a radiation element is arranged, a third substrate, and a switching circuit, respectively.
- a power feeding circuit for supplying a high frequency signal to the first board and the second board is arranged.
- the switching circuit is configured to switch the connection between the feeding circuit and the radiating element on the first substrate and the connection between the feeding circuit and the radiating element on the second substrate.
- the connecting member is a member for connecting the first substrate and the second substrate and the third substrate, and includes a dielectric substrate and a switching circuit arranged on the dielectric substrate. .. Radiating elements are arranged on each of the first substrate and the second substrate. A power feeding circuit for supplying a high frequency signal to the first board and the second board is arranged on the third board.
- the dielectric substrate is internally formed with a feeding wiring for transmitting a high frequency signal between the feeding circuit and each radiating element.
- the switching circuit is configured to switch the connection between the feeding circuit and the radiating element on the first substrate and the connection between the feeding circuit and the radiating element on the second substrate.
- a power feeding circuit common to the two boards (first board and second board) on which the radiating element is arranged is provided on the third board. Then, the high frequency signal from the feeding circuit is switched by the switching circuit and supplied to the radiating element of the first substrate or the radiating element of the second substrate. That is, since one feeding circuit is shared for a plurality of antenna devices (radiating element + substrate), the number of feeding circuits can be reduced with respect to the number of antenna devices. Therefore, the antenna module can be miniaturized.
- FIG. 3 is a block diagram of a communication device to which the antenna module according to the first embodiment is applied. It is a side view of the antenna module which concerns on Embodiment 1. FIG. It is a side view of the antenna module which concerns on modification 1. FIG. It is a perspective view of the antenna module of FIG. It is a block diagram of the communication apparatus to which the antenna module which concerns on Embodiment 2 is applied. It is a figure which shows the detail of the front-end module in FIG. It is a side view of the antenna module which concerns on Embodiment 2. FIG. It is a figure which shows an example of the internal structure of a connecting member. It is a side view of the antenna module which concerns on modification 2. FIG. It is a side view of the antenna module which concerns on modification 3.
- FIG. It is a side view of the antenna module which concerns on modification 4. It is a top view of the antenna module which concerns on modification 5.
- FIG. It is a figure which shows the arrangement example of the antenna device in a communication device. It is a figure which shows the 1st modification of a connection terminal. It is a figure which shows an example of the connection terminal in FIG. It is a figure which shows the 2nd modification of a connection terminal.
- FIG. 3 is a block diagram of a communication device to which the antenna module according to the third embodiment is applied. It is a figure which shows the modification of the front-end module. It is a side view of the antenna module which concerns on Embodiment 3.
- FIG. It is a partial cross-sectional view of an antenna device.
- FIG. 3 is a block diagram of a communication device to which the antenna module according to the fourth embodiment is applied. It is a figure for demonstrating the detail of the front-end module in FIG. 26. It is a side view of the antenna module which concerns on Embodiment 4.
- FIG. 3 is a block diagram of a communication device to which the antenna module according to the fourth embodiment is applied. It is a figure for demonstrating the detail of the front-end module in FIG. 26. It is a side view of the antenna module which concerns on Embodiment 4.
- FIG. 1 is an example of a block diagram of a communication device 10 to which the antenna module 100 according to the first embodiment is applied.
- the communication device 10 is, for example, a mobile phone, a mobile terminal such as a smartphone or a tablet, a personal computer having a communication function, a base station, or the like.
- An example of the frequency band of the radio wave used for the antenna module 100 according to the present embodiment is a radio wave in the millimeter wave band having a center frequency of, for example, 28 GHz, 39 GHz, 60 GHz, etc., but radio waves in frequency bands other than the above are also available. Applicable.
- the communication device 10 includes an antenna module 100 and a BBIC 200 constituting a baseband signal processing circuit.
- the antenna module 100 includes an RFIC 110 which is an example of a feeding circuit, antenna devices 120A and 120B, and a switching circuit 130.
- the communication device 10 up-converts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120, and down-converts the high-frequency signal received by the antenna device 120 to process the signal in the BBIC 200. do.
- each of the antenna devices 120A and 120B includes four feeding elements (radiating elements). Is shown. Specifically, the antenna device 120A includes the feeding elements 121A1 to 121A4, and the antenna device 120B includes the feeding elements 121B1 to 121B4.
- the feeding elements 121A1 to 121A4 are also collectively referred to as “feeding element 121A”. Further, 121B1 to 121B4 are collectively referred to as “feeding element 121B”. Further, the feeding elements 121A and 121B are also collectively referred to as “feeding element 121".
- the antenna device 120 is a one-dimensional antenna array in which four feeding elements 121 are arranged in a row.
- the number of feeding elements 121 does not necessarily have to be plurality, and the antenna device 120 may be formed by one feeding element 121. Further, it may be an array antenna in which a plurality of feeding elements 121 are arranged two-dimensionally.
- each feeding element 121 is a patch antenna having a substantially square flat plate shape.
- the RFIC 110 includes switches 111A to 111D, 113A to 113D, 117, power amplifiers 112AT to 112DT, low noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, and signal synthesizers / demultiplexers. It includes an 116, a mixer 118, and an amplifier circuit 119.
- the switches 111A to 111D and 113A to 113D are switched to the power amplifiers 112AT to 112DT side, and the switch 117 is connected to the transmitting side amplifier of the amplifier circuit 119.
- the switches 111A to 111D and 113A to 113D are switched to the low noise amplifiers 112AR to 112DR side, and the switch 117 is connected to the receiving side amplifier of the amplifier circuit 119.
- the changeover circuit 130 includes switches 130A to 130D, which are single-pole multiple throw switches.
- the switches 130A to 130D are connected to the switches 111A to 111D in the RFIC 110, respectively.
- the switching circuit 130 is controlled by, for example, an RFIC 110 and is configured to switch between the RFIC 110 and the feeding element 121A of the antenna device 120A and the connection between the RFIC 110 and the feeding element 121B of the antenna device 120B. ..
- the switch 130A includes a first terminal T1A, a second terminal T2A, and a third terminal T3A.
- the first terminal T1A is connected to the common terminal of the switch 111A.
- the second terminal T2A is connected to the feeding element 121A1 of the antenna device 120A.
- the third terminal T3A is connected to the feeding element 121B1 of the antenna device 120B.
- the first terminal T1B is connected to the common terminal of the switch 111B
- the second terminal T2B is connected to the feeding element 121A2 of the antenna device 120A
- the third terminal T3B is connected to the feeding element 121B2 of the antenna device 120B.
- the first terminal T1C is connected to the common terminal of the switch 111C
- the second terminal T2C is connected to the feeding element 121A3 of the antenna device 120A
- the third terminal T3C is connected to the feeding element 121B3 of the antenna device 120B.
- the first terminal T1D is connected to the common terminal of the switch 111D
- the second terminal T2D is connected to the feeding element 121A4 of the antenna device 120A
- the third terminal T3D is connected to the feeding element 121B4 of the antenna device 120B.
- each of the switches 130A to 130D is switched to the second terminals T2A to T2D, respectively.
- each of the switches 130A to 130D is switched to the third terminals T3A to T3D, respectively.
- the signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and up-converted by the mixer 118.
- the transmitted signal which is an up-converted high-frequency signal, is demultiplexed by the signal synthesizer / demultiplexer 116, passes through the four signal paths, and is fed to different feeding elements 121.
- the directivity of the antenna device 120 can be adjusted by individually adjusting the phase shift degrees of the phase shifters 115A to 115D arranged in each signal path.
- the received signal which is a high-frequency signal received by each feeding element 121, passes through four different signal paths and is combined by the signal synthesizer / demultiplexer 116.
- the combined received signal is down-converted by the mixer 118, amplified by the amplifier circuit 119, and transmitted to the BBIC 200.
- FIG. 2 is a side view of the antenna module 100 according to the first embodiment.
- the antenna module 100 includes an RFIC 110, an antenna device 120A in which a feeding element 121A is formed on a dielectric substrate 122A, an antenna device 120B in which a feeding element 121B is formed on a dielectric substrate 122B, and a switching circuit 130.
- the dielectric substrate 122A and the dielectric substrate 122B are also collectively referred to as a "dielectric substrate 122".
- the RFIC 110 and the switching circuit 130 are arranged on the motherboard 250.
- the RFIC 110 is electrically connected to the BBIC 200, which is also arranged on the motherboard 250, by the connection wiring 260. Further, the RFIC 110 is connected to the switching circuit 130 by the connection wiring 170.
- the normal direction of the motherboard 250 is the Z-axis direction
- the direction orthogonal to the normal direction is the X-axis and Y-axis directions.
- the antenna device 120A is connected to the motherboard 250 by the connection terminal 150A. Further, the antenna device 120B is connected to the motherboard 250 by the connection terminal 150B.
- the connection terminals 150A and 150B are, for example, detachable and configured connectors.
- the connection terminals 150A and 150B may be formed of solder bumps.
- the dielectric substrate 122 on which the feeding element 121 is formed in the antenna device 120 has, for example, a plurality of resin layers composed of a low temperature co-fired ceramics (LTCC: Low Temperature Co-fired Ceramics) multilayer substrate, a resin such as epoxy, and a polyimide. It is composed of a multilayer resin substrate formed by laminating, a multilayer resin substrate formed by laminating a plurality of resin layers composed of a liquid crystal polymer (LCP) having a lower dielectric constant, and a fluororesin. It is a multilayer resin substrate formed by laminating a plurality of resin layers, or a ceramic multilayer substrate other than LTCC.
- the dielectric substrate 122 does not necessarily have to have a multi-layer structure, and may be a single-layer substrate.
- the power feeding element 121 is made of a conductor such as copper or aluminum, which has a flat plate shape.
- the shape of the feeding element 121 is not limited to the rectangle as shown in FIG. 1, and may be a polygon, a circle, an ellipse, or a cross shape.
- the feeding element 121 is formed on the surface or an inner layer of the dielectric substrate 122.
- an array antenna in which four feeding elements 121 are arranged in one direction is shown, but the feeding element 121 may be formed independently, or a plurality of feeding elements may be one-dimensional or two. It may be a configuration arranged in a dimension.
- a ground electrode is arranged so as to face the feeding element 121.
- the switching circuit 130 is connected to the antenna device 120A by the power feeding wiring 160A via the connection terminal 150A. Further, the switching circuit 130 is connected to the antenna device 120B by the power feeding wiring 160B via the connection terminal 150B.
- the high frequency signal from the RFIC 110 is switched by the switching circuit 130 and supplied to the feeding element 121A of the antenna device 120A or the feeding element 121B of the antenna device 120B.
- the radio wave is radiated from the feeding element 121A, and the radio wave is not radiated from the feeding element 121B.
- the radio wave is radiated from the feeding element 121B, and the radio wave is not radiated from the feeding element 121A.
- RFICs are individually arranged for each antenna device.
- the substrate on which the RFICs are arranged (for example, the motherboard) requires a mounting area for arranging all the RFICs.
- communication devices such as mobile terminals
- a configuration is being adopted in which a plurality of antenna devices are provided to enable radiation and reception of radio waves in different directions. If the substrate area increases due to the increase in the number of antenna devices, it may become a factor that hinders the miniaturization of the antenna module and the wireless device.
- the number of RFICs is reduced with respect to the number of antenna devices by sharing the RFIC for a plurality of antenna devices and switching the antenna devices by a switching circuit. Therefore, it is possible to reduce factors that hinder the miniaturization of the wireless device. Further, since the RFIC is a relatively expensive component compared to other components, it is possible to contribute to the cost reduction by reducing the RFIC.
- dielectric substrate 122A corresponds to the "first substrate”, the "second substrate” and the “third substrate” in the present disclosure, respectively.
- FIG. 3 is a side view of the antenna module 100X according to the first modification.
- FIG. 4 is a perspective view of the antenna module 100X. In the description of FIGS. 3 and 4, the description of the elements overlapping with the antenna module 100 of the first embodiment will not be repeated.
- the antenna device 120A is connected to the motherboard 250 by the connection terminal 150A, similarly to the antenna module 100 of the first embodiment.
- the antenna device 120B is connected to the antenna device 120A by a bent connecting member 123.
- the antenna devices 120A and 120B and the connecting member 123 have a substantially L-shape when viewed in a plan view from the Y-axis direction. Radio waves are radiated in the Z-axis direction from the feeding element 121A of the antenna device 120A. Further, radio waves are radiated from the feeding element 121B of the antenna device 120B in the X-axis direction.
- the antenna devices 120A and 120B extend in the Y-axis direction.
- the feeding elements 121A of the antenna device 120A are arranged in the Y-axis direction on the dielectric substrate 122A.
- the feeding elements 121B of the antenna device 120B are arranged in the Y-axis direction on the dielectric substrate 122B.
- the power feeding wiring 160B reaches the dielectric substrate 122B from the connection terminal 150A through the dielectric substrate 122A and the connecting member 123, and transmits a high frequency signal to the feeding element 121B on the dielectric substrate 122B.
- the polarization direction radiated from each feeding element is inclined by ⁇ with respect to the arrangement direction of the feeding elements (that is, the Y-axis direction).
- the feeding element is arranged.
- the RFIC 110 is shared with the plurality of antenna devices by the switching circuit 130. By switching the antenna device for use, it is possible to reduce factors that hinder the miniaturization of the wireless device.
- FIG. 3 shows a configuration in which the dielectric substrate 122A in the antenna device 120A and the dielectric substrate 122B in the antenna device 120B are formed as separate substrates and are connected by the connecting member 123.
- the 122A, 122B and the connecting member 123 may be integrally formed as one substrate and may be configured to bend at a portion of the connecting member 123.
- the place where the antenna device can be placed in the communication device may be greatly limited, and the antenna device is placed close to the motherboard. It may not be possible to place it.
- connection member is arranged between the motherboard and the antenna device, and the signal transmission path from the motherboard to the antenna device is extended to increase the degree of freedom in the layout of the antenna device in the communication device. Adopt a configuration to improve. Further, in the second embodiment, an amplifier circuit is further arranged on the connecting member to suppress a decrease in loss due to signal attenuation due to the extension of the signal transmission path.
- FIG. 5 is a block diagram of a communication device 10A to which the antenna module 100A according to the second embodiment is applied.
- front end modules hereinafter, also referred to as “FEM (Front End Module)
- FEM Front End Module
- the FEM180A is arranged in the signal transmission path between the switching circuit 130 and the antenna device 120A
- the FEM180B is arranged in the signal transmission path between the switching circuit 130 and the antenna device 120B. Have been placed.
- FEM180A includes FEM180A1 to FEM180A4.
- the FEM180A1 is connected between the second terminal T2A of the switch 130A and the feeding element 121A1.
- the FEM180A2 is connected between the second terminal T2B of the switch 130B and the feeding element 121A2.
- the FEM180A3 is connected between the second terminal T2C of the switch 130C and the feeding element 121A3.
- the FEM180A4 is connected between the second terminal T2D of the switch 130D and the feeding element 121A4.
- FEM180B includes FEM180B1 to FEM180B4.
- the FEM180B1 is connected between the third terminal T3A of the switch 130A and the feeding element 121B1.
- the FEM180B2 is connected between the third terminal T3B of the switch 130B and the feeding element 121B2.
- the FEM180B3 is connected between the third terminal T3C of the switch 130C and the feeding element 121B3.
- the FEM180B4 is connected between the third terminal T3D of the switch 130D and the feeding element 121B4.
- FEM180A and 180B (and FEM contained therein) are also collectively referred to as "FEM180".
- the FEM 180 includes switches 181, 182, a power amplifier 183, and a low noise amplifier 184.
- the switches 181 and 182 are the power amplifiers 183 when transmitting high frequency signals.
- the switches 181, 182 are switched to the low noise amplifier 184 side.
- the FEM 180 is an amplifier circuit that amplifies the high frequency signal transmitted between the RFIC 110 and the antenna device 120 to compensate for the attenuation that occurs between the RFIC 110 and the antenna device 120. In particular, it is effective when the length of the signal transmission path from the RFIC 110 to each antenna device is relatively long and the amplification factor is insufficient in the power amplifier and the low noise amplifier in the RFIC 110.
- the FEM 180 may include at least one of the power amplifier 183 and the low noise amplifier 184, and the power amplifier 183 or the low noise amplifier 183 or the low noise amplifier 184 may be included.
- the configuration may include any one of the amplifiers 184.
- FEM180A and FM180B correspond to the “first amplifier circuit” and the “second amplifier circuit” in the present disclosure, respectively.
- FIG. 7 is a side view of the antenna module 100A according to the second embodiment.
- the antenna module 100A includes an RFIC 110 and a switching circuit 130 arranged on the motherboard 250 as in the first embodiment, and antenna devices 120A and 120B, as well as a connecting member 140 and FEM180A and 180B.
- the description of the elements overlapping with the antenna module 100 will not be repeated.
- connection member 140 is a member for transmitting a high frequency signal from the RFIC 110 arranged on the motherboard 250 to the antenna devices 120A and 120B, and as will be described later in FIG. 8, a plurality of members thereof are inside thereof. Power supply wiring is formed.
- the connecting member 140 is used in the communication device 10 as a signal transmission path when the antenna devices 120A and 120B are arranged at positions away from the motherboard 250.
- the connecting member 140 has a dielectric substrate 143 (FIG. 8) formed of ceramics such as LTCC or a resin, similarly to the dielectric substrate 122 forming the antenna device.
- the dielectric substrate 143 has a multilayer structure in which a plurality of dielectric layers are laminated.
- the connecting member 140 may be made of a rigid material that does not deform, or may be made of a flexible material as described later in FIGS. 11 and 12.
- the connecting member 140 is connected to the antenna devices 120A and 120B by the connecting terminals 150A and 150B on the surface 141 of the connecting member 140, respectively. Further, the connecting member 140 is connected to the motherboard 250 by the connecting terminal 155 on the back surface 142 of the connecting member 140.
- the connection terminals 150A, 150B, and 155 are formed of removable and configured connectors or solder bumps.
- the FEM 180A is arranged at a position in the connection member 140 between the connection point with the dielectric substrate 122A of the antenna device 120A (that is, the connection terminal 150A) and the connection point with the motherboard 250 (that is, the connection terminal 155). ing. Further, the FEM 180B is located at a position between the connection point of the antenna device 120B with the dielectric substrate 122B (that is, the connection terminal 150B) and the connection point with the motherboard 250 (that is, the connection terminal 155) in the connection member 140. Have been placed.
- the FEM 180 is arranged on the back surface 142 of the connecting member 140.
- the FEM 180 is an amplifier circuit including a power amplifier 183 and / or a low noise amplifier 184, heat generation may occur during signal amplification.
- the antenna device 120 is housed in the housing 50 of the communication device 10A, and as shown in FIG. 7, the antenna device 120 is arranged on the surface 141 side of the connecting member 140 facing the housing 50. Therefore, when the FEM 180 is arranged on the surface 141 side of the connecting member 140, the FEM 180 and the housing 50 may be close to each other, and the temperature of the housing 50 may be partially increased by the heat from the FEM 180.
- the FEM 180 By arranging the FEM 180 on the back surface 142 of the connecting member 140 to secure a separation distance between the FEM 180 and the housing 50, heat transfer to the housing 50 can be suppressed.
- the FEM180 may be arranged so that at least a part thereof is in contact with the motherboard 250.
- the heat generated by the FEM 180 can be directly transferred to the motherboard 250, so that the heat dissipation efficiency can be further improved.
- the housing of the FEM 180 may be brought into direct contact with the motherboard 250, or a member having high heat transfer efficiency (for example, a metal such as copper) may be placed between the FEM 180 and the motherboard 250 to bring them into contact with each other.
- the FEM 180 is used. It may be arranged on the surface 141 of the connecting member 140.
- the FEM 180 may be directly connected to the connecting member 140 using a solder bump or a connector, or may be connected via an intermediate board such as an interposer. Further, in order to reduce the height, the thickness of the portion where the FEM 180 is arranged may be thinner than the other portions in the connecting member 140.
- the high frequency signal from the RFIC 110 is supplied to the antenna device 120A by the feeding wiring 160A via the switching circuit 130. Further, the high frequency signal from the RFIC 110 is supplied to the antenna device 120B by the feeding wiring 160B via the switching circuit 130.
- FIG. 8 is a diagram showing an example of the internal structure of the connecting member 140.
- the FEM180A1 is arranged on the front surface 141 of the connecting member 140
- the FEM180A2 is arranged on the back surface 142 of the connecting member 140.
- the feeding wirings 161, 162 and the ground electrode GND are formed in the connecting member 140.
- the feeding wiring 161 transmits a high frequency signal to the feeding element 121A of the antenna device 120A via the FEM180A1.
- the feeding wiring 162 transmits a high frequency signal to another feeding element 121A via the FEM180A2.
- the configuration in which the FEM and the feeding wiring corresponding to different radiating elements in the same antenna device are separately arranged on the front and back of the connecting member has been described, but the FEM and the feeding wiring corresponding to the different antenna devices have been described. May be configured to be separately arranged on the front and back of the connecting member.
- the FEM and the feeding wiring corresponding to the first antenna device may be arranged on the front surface of the connecting member, and the FEM and the feeding wiring corresponding to the second antenna device may be arranged on the front and back surfaces of the connecting member.
- the FEM and the feeding wiring corresponding to some of the radiating elements of the first antenna device and the second antenna device are arranged on the front surface of the connecting member, and the FEM and the feeding wiring corresponding to the remaining radiating elements are placed on the back surface of the connecting member. It may be arranged.
- the power supply wiring 161 and the power supply wiring 162 are formed in different layers on the dielectric substrate 143.
- the ground electrode GND is formed between the layer on which the feeding wiring 161 is formed and the layer on which the feeding wiring 162 is formed, and the reference potential formed on the motherboard 250 via the connection terminal 155 (shown in the figure). Is connected to. Further, the ground electrode GND is connected to the ground electrode (not shown) formed on the dielectric substrate 122A of the antenna device 120A via the connection terminal 150A.
- power supply wiring 161" and the “power supply wiring 162” correspond to the “first wiring” and the “second wiring” of the present disclosure, respectively.
- the same configuration can be adopted for the signal transmission path to the antenna device 120B. Further, in FIG. 8, the configuration in which the feeding wiring is formed in two different layers has been described, but the feeding wiring may be formed in three or more different layers. Even in this case, it is preferable to arrange the ground electrode between the dielectric layers in which the feeding wiring is formed.
- Modification 2 In the antenna module 100A of the second embodiment of FIG. 7, the configuration in which the switching circuit is arranged on the motherboard has been described. In the second modification, a configuration in which the switching circuit is arranged on the connecting member will be described.
- FIG. 9 is a side view of the antenna module 100B according to the modified example 2.
- the position of the switching circuit in the antenna module 100A shown in FIG. 7 is changed on the connecting member 140.
- the description of the elements overlapping with the antenna module 100A will not be repeated.
- the connecting member 140 is connected to the motherboard 250 via the connecting terminal 155.
- the antenna devices 120A and 120B are connected to the connection member 140 via the connection terminals 150A and 150B, respectively.
- the switching circuit 130X is arranged on the surface 141 of the connecting member 140, and is connected to the RFIC 110 by the connecting wiring 171 via the connecting terminal 155. Although not shown in FIG. 9, the switching circuit 130X supplies a high frequency signal from the RFIC 110 to the antenna device 120 via the FEM 180 by the feeding wiring formed inside the connecting member 140. Further, the switching circuit 130X may be arranged on the back surface 142 of the connecting member 140.
- the switching circuit By arranging the switching circuit on the connecting member in this way, the number of parts arranged on the motherboard can be reduced and the size of the motherboard can be reduced. In particular, when a large number of antenna devices are arranged in the communication device, the number of switching circuits also increases, so that the effect on miniaturization becomes more remarkable.
- FIG. 10 is a side view of the antenna module 100C according to the modified example 3.
- the connecting members 140A and 140B are used instead of the connecting member 140 in the antenna module 100A shown in FIG. 7.
- the description of the elements overlapping with the antenna module 100A will not be repeated.
- the connecting member 140A is connected to the motherboard 250 by the connecting terminal 155A, and is connected to the antenna device 120A by the connecting terminal 150A.
- FEM180A is arranged on the connecting member 140A.
- the high frequency signal from the switching circuit 130 arranged on the motherboard 250 is supplied to the feeding element 121A of the antenna device 120A through the connecting member 140A by the feeding wiring 160A.
- connection member 140B is connected to the motherboard 250 by the connection terminal 155B, and is connected to the antenna device 120B by the connection terminal 150B.
- FEM180B is arranged on the connecting member 140B.
- the high frequency signal from the switching circuit 130 arranged on the motherboard 250 is supplied to the feeding element 121B of the antenna device 120B through the connecting member 140B by the feeding wiring 160B.
- FEM180A is arranged on the back surface 142A of the connecting member 140A in FIG. 10, it may be arranged on the front surface 141A of the connecting member 140A. Further, the FEM 180B may also be arranged on the front surface 141B of the connecting member 140B instead of the back surface 142B of the connecting member 140B.
- connection member 140A and the “connecting member 140B” correspond to the “first connecting member” and the “second connecting member” in the present disclosure, respectively.
- FEM180A and “FEM180B” correspond to the "first amplifier circuit” and the “second amplifier circuit” in the present disclosure, respectively.
- the connecting members for the plurality of antenna devices, the total size of the connecting members can be reduced as compared with the case where a common connecting member is used. This makes it possible to easily mount the antenna device on the communication device.
- FIG. 11 is a side view of the antenna module 100D according to the modified example 4.
- the connecting member 140 of the antenna module 100A shown in FIG. 7 is replaced with the connecting member 140C.
- the description of the elements overlapping with the antenna module 100A will not be repeated.
- the connecting member 140C is a flexible substrate made of a flexible material, and is configured to be bendable in the thickness direction.
- the connecting member 140C has a configuration in which the first portion 145 and the second portion 146 are branched. The second portion 146 bends after branching from the first portion 145 and extends in the direction opposite to the first portion 145.
- connection member 140C is connected to the motherboard 250 by the connection terminal 155 in the first portion 145.
- the antenna device 120A is connected to the first portion 145 of the connecting member 140C by the connecting terminal 150A. Further, the antenna device 120B is connected to the second portion 146 of the connecting member 140C by the connecting terminal 150B.
- FEM180A and 180B are arranged in the first portion 145 and the second portion 146, respectively.
- the switching circuit 130X is arranged at a position closer to the connection terminal 155 than the branch of the second portion 146. Similar to the antenna module 100B shown in FIG. 9, the switching circuit 130X is connected to the RFIC 110 arranged on the motherboard 250 by the connection wiring 171. The high frequency signal from the RFIC 110 is supplied to the antenna device 120A or the antenna device 120B by the switching circuit 130X.
- FIG. 11 a configuration in which a connecting member shared by a plurality of antenna devices is formed of a flexible material and a part of the connecting member is branched and bent has been described, but the connecting member is branched in the middle. It does not have to be a configuration to be used. Further, in a configuration in which individual connecting members are provided for the antenna device as shown in the modified example 3 of FIG. 10, a part or all of the connecting members may be formed of a flexible material.
- Modification 5 In the modified example 4 of FIG. 11, an example of a configuration in which the connecting member is bent in the thickness direction and branched has been described. In the fifth modification, a configuration in which the connecting member is bent in the in-plane direction of the main surface and branched will be described.
- FIG. 12 is a plan view of the antenna module 100E according to the modified example 5.
- the connecting member 140 of the antenna module 100A shown in FIG. 7 is replaced with the connecting member 140D.
- the description of the elements overlapping with the antenna module 100A will not be repeated.
- the connecting member 140D is a flexible substrate made of a flexible material and can be bent in the in-plane direction (that is, in the XY plane) of the main surface of the connecting member 140D. It is configured in.
- the connecting member 140D includes a first portion 145A and a second portion 146A.
- the first portion 145A extends in the X-axis direction from the connection portion with the motherboard 250 and is connected to the antenna device 120A.
- the second portion 146A bends and branches in the Y-axis direction from the first portion 145A, and further bends in the X-axis direction and is connected to the antenna device 120B.
- each of the first portion 145A and the second portion 146A of the connecting member 140D may be configured to be bendable in the thickness direction as in the modified example 4. Further, the connecting member 140D may be configured to be able to bend in a twisting direction around an axis in the extending direction.
- the FEM 130 is arranged on the front surface and / or the back surface of the connecting member 140D.
- FIG. 13 An example of arranging the antenna device in the communication device when the antenna module shown in each of the above-described embodiments is applied will be described.
- the housing 50 of the communication device 10 has a substantially rectangular shape, and has main surfaces 51 and 52 having the Z-axis direction as the normal direction, side surfaces 55 and 56 having the X-axis direction as the normal direction, and Y. Includes sides 57, 58 with the axial direction as the normal direction.
- the antenna device 120A is arranged on the side surface 55, and the antenna device 120B is arranged on the side surface 57.
- radio waves can be radiated in the negative direction of the X-axis and the positive direction of the Y-axis.
- the antenna device 120A is arranged on the main surface 51, and the antenna device 120B is arranged on the side surface 57.
- radio waves can be emitted in the positive direction of the Y-axis and the positive direction of the Z-axis.
- the antenna device 120A is arranged on the side surface 55, and the antenna device 120B is arranged on the side surface 56.
- radio waves can be emitted in the positive and negative directions of the X-axis.
- the antenna device 120A is arranged on the side surface 55
- the antenna device 120B is arranged on the side surface 57
- the antenna device 120C is arranged on the main surface 51.
- radio waves can be radiated in three directions: the negative direction of the X-axis, the positive direction of the Y-axis, and the positive direction of the Z-axis.
- the arrangement shown in FIG. 13 is an example, and the surface on which the antenna device is arranged may be a combination other than that shown in FIG.
- a plurality of antenna devices may be arranged apart from each other on the same side surface.
- the antenna device is arranged at the end, but the antenna device may be arranged near the center of each surface.
- the number of antenna devices arranged in the communication device may be 4 or more.
- the communication device When radiating radio waves from the communication device in all directions of the X-axis, Y-axis and Z-axis, at least 6 antenna devices are required. In such a case, if RFICs are arranged for each antenna device, a space for arranging six RFICs is required on the motherboard. By sharing the RFIC with a plurality of antenna devices using the switching circuit as in the present embodiment described above, the number of RFICs to be arranged on the motherboard can be reduced, so that the motherboard and the communication device can be miniaturized. It becomes possible to do.
- connection terminals 150A and 150B used for connecting the connecting member or the motherboard and the antenna device, and the connection terminals 155 and 155A and 155B used for connecting the motherboard and the connecting member should be connected.
- An example formed between the facing surfaces of the members has been described.
- these connection terminals may be in other connection modes.
- connection terminal 150X may be configured to connect the front surfaces (or back surfaces) of the motherboard 250 and the antenna device 120A.
- the connection terminal 150X may be a combination of a plurality of connectors 150X1 and 150X2, each of which has a conductor pin and / or a socket.
- a terminal portion is formed at the end of the antenna device 120A, and the antenna device 120A is fitted and connected to the connection terminal 150Y mounted on the surface of the motherboard 250. There may be.
- connection modes of FIGS. 14 to 16 can also be applied to the connection between the antenna device 120B and the motherboard 250. Further, the connection mode can be applied to the connection between the antenna device and the connecting member as well as the connection between the motherboard and the connecting member.
- FIG. 17 is a block diagram of a communication device 10F to which the antenna module 100F according to the third embodiment is applied.
- the communication device 10F includes an antenna module 100F and a BBIC 200.
- the antenna module 100F includes an RFIC 110F, antenna devices 120F and 120G, a switching circuit 130, FEM180A and 180B, and filter devices 190, 195A and 195B.
- the antenna devices 120F and 120G are dual band type antenna devices as described above, and each radiating element arranged in each of the antenna devices 120F and 120G includes two feeding elements.
- the antenna device 120F includes feeding elements 121F and 125F
- the antenna device 120G includes feeding elements 121G and 125G.
- a high frequency signal is individually supplied from the RFIC 110F to each feeding element.
- the "feeding element 121F” and the “feeding element 121G” in the third embodiment correspond to the "first element” in the present disclosure.
- the "feeding element 125F” and the “feeding element 125G” in the third embodiment correspond to the "second element” in the present disclosure.
- the RFIC 110F includes switches 111A to 111H, 113A to 113H, 117A, 117B, power amplifiers 112AT to 112HT, low noise amplifiers 112AR to 112HR, attenuators 114A to 114H, phase shifters 115A to 115H, and signal synthesis / minute. It includes a wave device 116A, 116B, a mixer 118A, 118B, and an amplifier circuit 119A, 119B.
- the configuration of the amplifier circuit 119A is a circuit for the feeding elements 121F and 121G on the high frequency side.
- the configuration of the amplifier circuit 119B is a circuit for the feeding elements 125F and 125G on the low frequency side.
- the switches 111A to 111H and 113A to 113H are switched to the power amplifiers 112AT to 112HT, and the switches 117A and 117B are connected to the transmitting side amplifiers of the amplifier circuits 119A and 119B.
- the switches 111A to 111H and 113A to 113H are switched to the low noise amplifiers 112AR to 112HR, and the switches 117A and 117B are connected to the receiving side amplifiers of the amplifier circuits 119A and 119B.
- the filter device 190 includes diplexers 190A to 190D. Further, the filter device 195A includes diplexers 195A1 to 195A4. The filter device 195B includes diplexers 195B1 to 195B4. Each diplexer has a high-pass filter (first filter) that passes a high-frequency signal in a high frequency band (first frequency band) and a low-pass filter (second filter) that passes a high-frequency signal in a low frequency band (second frequency band). )including.
- the "filter device 190" in the third embodiment corresponds to the "first filter device” in the present disclosure. Further, the "filter device 195A" and the “filter device 195B” in the third embodiment correspond to the "second filter device” in the present disclosure.
- the high-pass filters in the diplexers 190A to 190D are connected to the switches 111A to 111D in the RFIC110F, respectively. Further, the low-pass filters in the diplexers 190A to 190D are connected to the switches 111E to 111H in the RFIC 110F, respectively.
- the common terminals of the diplexers 190A to 190D are connected to the first terminals T1A to T1D of the switches 130A to 130D of the switching circuit 130, respectively.
- the second terminal T2A of the switch 130A is connected to the diplexer 195A1 of the filter device 195A via the FEM180A1.
- the third terminal T3A of the switch 130A is connected to the diplexer 195B1 of the filter device 195B via the FEM180B1.
- the second terminal T2B of the switch 130B is connected to the diplexer 195A2 of the filter device 195A via the FEM180A2.
- the third terminal T3B of the switch 130B is connected to the diplexer 195B2 of the filter device 195B via the FEM180B2.
- the second terminal T2C of the switch 130C is connected to the diplexer 195A3 of the filter device 195A via the FEM180A3.
- the third terminal T3C of the switch 130C is connected to the diplexer 195B3 of the filter device 195B via the FEM180B3.
- the second terminal T2D of the switch 130D is connected to the diplexer 195A4 of the filter device 195A via the FEM180A4.
- the third terminal T3D of the switch 130D is connected to the diplexer 195B4 of the filter device 195B via the FEM180B4.
- the high-pass filters in the diplexers 195A1 to 195A4 are connected to the feeding elements 121F1 to 121F4 in the antenna device 120F, respectively.
- the low-pass filters in the diplexers 195A1 to 195A4 are connected to the feeding elements 125F1 to 125F4 in the antenna device 120F, respectively.
- the high-pass filters in the diplexers 195B1 to 195B4 are connected to the feeding elements 121G1 to 121G4 in the antenna device 120G, respectively.
- the low-pass filters in the diplexers 195B1 to 195B4 are connected to the feeding elements 125G1 to 125G4 in the antenna device 120G, respectively.
- the path for transmitting the high frequency signal to each radiating element is common between the filter device 190 and the filter device 195A or the filter device 195B.
- each FEM included in the FEMs 180A and 180B can have the same configuration as in FIG. 6, for example.
- a power amplifier 183X1 and a low noise amplifier 184X1 corresponding to the circuit on the high frequency side, and a power amplifier 183X2 and a low noise amplifier 184X2 corresponding to the circuit on the low frequency side are separately provided. It may be configured as such.
- a power amplifier and a low noise amplifier suitable for each frequency it is possible to appropriately adjust the antenna characteristics.
- FIG. 19 is a side view of the antenna module 100F.
- FIG. 20 is a partial cross-sectional view of the antenna device 120F.
- FIG. 21 is a diagram for explaining an example of the configuration of the diplexer.
- the antenna device 120A in the antenna module 100C described with reference to FIG. 10 is replaced with the antenna device 120F, and the antenna device 120B is replaced with the antenna device 120G. Further, the RFIC 110 has been replaced with the RFIC 110F.
- a filter device 190 is newly provided on the motherboard 250, and filter devices 195A and 195B are newly provided on the antenna devices 120F and 120G, respectively.
- the description of the elements overlapping with FIG. 10 is not repeated.
- the BBIC 200 is mounted on the motherboard 250 in FIG. 19, the BBIC 200 may be formed on another substrate (not shown).
- each of the antenna devices 120F and 120G is configured to enable radio waves in two different frequency bands as described above.
- the antenna device 120F includes a feeding element 121F and a feeding element 125F formed on the dielectric substrate 122F.
- the feeding element 121F and the feeding element 125F are arranged so as to overlap each other when the dielectric substrate 122F is viewed in a plan view from the normal direction, and the feeding element 125F is arranged between the feeding element 121F and the ground electrode GND. ..
- the size of the feeding element 121F is smaller than the size of the feeding element 125F. Therefore, the power feeding element 121F radiates radio waves in a frequency band higher than that of the feeding element 125F.
- a high frequency signal from the RFIC 110F is individually supplied to each of the feeding element 121F and the feeding element 125F. More specifically, as shown in FIG.
- a high frequency signal (for example, 39 GHz band) on the high frequency side is supplied to the power supply element 121F by the power supply wiring 191, and a low frequency side is supplied to the power supply element 121F by the power supply wiring 192.
- High frequency signal (for example, 28 GHz band) is supplied.
- the feeding wiring 191 penetrates the feeding element 125F and is connected to the feeding point SP1 of the feeding element 121F.
- the feeding wiring 192 is connected to the feeding point SP2 of the feeding element 125F.
- the antenna device 120G includes a feeding element 121G and a feeding element 125G formed on the dielectric substrate 122G.
- the configuration of the antenna device 120G is the same as that of the antenna device 120F.
- Each of the filter devices 190, 195A, and 195B includes a flat plate-shaped electrode and a via as shown in FIG. 21. More specifically, each of the filter devices 190, 195A, and 195B has a terminal T1 to which a common power supply wiring is connected, a terminal T2 to which a low frequency side power supply wiring is connected, and a high frequency side power supply wiring. Includes terminal T3 to which is connected.
- a low-pass filter 210 is formed between the terminal T1 and the terminal T2, and a high-pass filter 220 is formed between the terminal T1 and the terminal T3.
- the low-pass filter 210 includes a linear flat plate electrode 211 connected to the terminal T1 and the terminal T2, and flat plate electrodes 212 and 213 branched from the flat plate electrode 211 and arranged to face each other at a predetermined interval.
- the flat plate electrode 212 and the flat plate electrode 213 are arranged line-symmetrically when viewed in a plan view from the normal direction of the substrate, and are electromagnetically coupled to each other.
- the ends of the flat plate electrode 212 and the flat plate electrode 213 are connected to the ground electrode GND by vias V1 and V2, respectively.
- the low-pass filter 210 has a series inductor (plate electrode 211) formed between the terminal T1 and the terminal T2 and two shunt stubs (plate electrodes 212, 213 + vias V1, V2) branched from the inductor. It constitutes an LC series resonant circuit of a so-called ⁇ -type circuit including the above.
- the high-pass filter 220 includes a linear plate electrode 221 having one end connected to the terminal T1, a plate electrode 222,223, and a capacitor electrode C1.
- the plate electrode 222 is branched from the plate electrode 221 and its end is connected to the ground electrode GND by a via V3.
- the other end of the flat plate electrode 221 faces the capacitor electrodes C1 arranged in different layers.
- a capacitor is formed by the flat plate electrode 221 and the capacitor electrode C1.
- One end of the flat plate electrode 223 is connected to the ground electrode GND via the via V4, and the other end is connected to the capacitor electrode C1 via the via V5.
- the flat plate electrode 223 is also connected to the terminal T2.
- the high-pass filter 220 includes a series capacitor (plate electrode 221 and capacitor electrode C1) formed between the terminal T1 and the terminal T3, and two shunt stubs (plate electrode 2222) branched from both ends of the capacitor. It constitutes an LC series resonant circuit of a so-called ⁇ -type circuit including 223 + vias V3 and V5).
- the low-pass filter 210 and the high-pass filter 220 may be arranged in the same layer as shown in FIG. 21, or partially overlap each other when viewed in a plan view from the normal direction of the substrate on which the filter device is formed. May be arranged in different layers.
- a ground electrode GND is arranged in the layer between the low-pass filter 210 and the high-pass filter 220 in order to prevent mutual coupling.
- the filter device 190 is formed inside the motherboard 250.
- the filter device 195A is formed inside the dielectric substrate 122F of the antenna device 120F.
- the filter device 195B is formed inside the dielectric substrate 122G of the antenna device 120G.
- Two high frequency signals having different frequency bands individually output from the RFIC 110F are transmitted to the common power feeding wiring by passing through the filter device 190.
- This common feeding wiring is switched to either the signal transmission path to the antenna device 120F or the signal transmission path to the antenna device 120G by the switching circuit 130.
- the power supply wiring from the switching circuit 130 extends to the antenna devices 120F and 120G via the connection terminals 155, the connection member 140, and the connection terminal 150.
- the common power supply wiring that reaches each antenna device is branched into a high frequency side path and a low frequency side path by the filter devices 195A and 195B formed in the antenna devices 120F and 120G.
- the high frequency side path is connected to the feeding elements 121F and 121G, and the low frequency side path is connected to the feeding elements 125F and 125G.
- a dual band type antenna module that feeds individually to each feeding element
- the same number of feeding wiring as the number of feeding elements is required from the RFIC to the feeding element.
- a feeding wiring twice the number of feeding elements is required. For example, as shown in FIGS. 17 and 19, when four feeding elements are provided for each frequency band (the total number of feeding elements is 8), in the case of a dual polarization type antenna device, for each antenna device. 16 power supply wires are required.
- connection terminals 150A, 150B, 155A, and 155B also require the same number of terminals as the power supply wiring arranged on the connection member, so that the connector size increases and the area of the connector arrangement on the motherboard and the antenna device increases. It gets bigger.
- the feeding wiring is partially shared by arranging the filter devices (diplexers) 190, 195A and 195B on the motherboard 250 and the antenna devices 120F and 120G, respectively.
- the total number of power feeding wirings arranged in the connecting members 140A and 140B can be reduced.
- the size (width, thickness) of the connecting members 140A and 140B can be reduced, and the mounting area of the motherboard 250 and the antenna devices 120F and 120G can be reduced.
- the number of FEM terminals arranged on the connecting member can be reduced.
- FIG. 22 is a diagram showing an arrangement example of the filter device 190 on the motherboard 250.
- FIG. 23 is a diagram showing an arrangement example of the filter device 195A in the antenna device 120F.
- the filter device 195B of the antenna device 120G can be arranged in the same manner as the filter device 195A in FIG. 23.
- each diplexer included in the filter device 190 is connected to the RFIC 110F and the switching circuit 130, so that the filter device 190 can be referred to as the RFIC 110F when the motherboard 250 is viewed in a plan view. , Arranged between the switching circuit 130 (FIG. 22 (a)).
- the RFIC 110 and the switching circuit 130 are mounted on the outer surface of the motherboard 250, and the filter device 190 is formed inside the motherboard 250. Therefore, the filter device 190 may be arranged at a position where it partially overlaps with the RFIC 110F and / or the switching circuit 130 when the motherboard 250 is viewed in a plan view as shown in FIG. 22 (b). Further, when the filter device 190 is formed as a chip component, the filter device 190 may be arranged on the outer surface of the motherboard 250.
- each diplexer included in the filter device 195A is arranged in the path connecting the connection terminal 150A and each feeding element in the antenna device 120F.
- the filter device 195A is arranged in the space between the end portion of the dielectric substrate 122F on the side to which the connecting member 140A is connected and the radiating element closest to the end portion. This is an example.
- the diplexers are arranged in two rows so that the longitudinal direction of the outer shape of each diplexer faces in the direction orthogonal to the arrangement direction of the radiating elements.
- the diplexers are arranged so that the longitudinal direction of the outer shape of each diplexer faces the arrangement direction of the radiating elements.
- the size of the dielectric substrate 122F in the arrangement direction of the radiating elements becomes slightly large, but the size does not increase in the thickness direction as in the example of FIG. 23D described later, so that the height is low. It is suitable for the case of conversion.
- FIG. 23 (c) is an arrangement example in which each diplexer is arranged side by side in a direction orthogonal to the arrangement direction of the radiating elements with respect to the corresponding radiating elements.
- the design of the wiring layout in the dielectric substrate 122F becomes easy. Further, since power can be supplied to the vicinity of each radiation element with a common power supply wiring, the number of power supply wirings in the antenna device 120F can be reduced. Further, also in this case, when the dielectric substrate 122F is viewed in a plan view, the radiating element and the diplexer do not overlap, so that it is suitable for lowering the height.
- the diplexer is arranged in the vicinity of each radiating element as in FIG. 23 (c), but when the dielectric substrate 122F is viewed in a plan view, a part of the diplexer is present. It is arranged so as to overlap with the corresponding radiating element. That is, the diplexer is arranged on the dielectric substrate 122F under the radiation element. In the case of such an arrangement, the dimension in the thickness direction of the dielectric substrate 122F may increase, but the dimension W1 in the width direction of the dielectric substrate 122F (the direction orthogonal to the arrangement direction of the radiating elements) can be reduced. , Suitable for miniaturizing the antenna device 120F.
- the dual band type antenna module capable of radiating radio waves of two different frequency bands
- the number of feeding wiring arranged in the connecting member can be reduced. Can be done. As a result, it is possible to suppress an increase in size of the antenna module due to an increase in the number of wirings.
- a dual polarization type antenna module capable of radiating radio waves in two different polarization directions can also be used by using the filter device as described above. It is possible to reduce the number of power feeding wires arranged on the connecting member.
- the feeding element 121F and the feeding element 125F are arranged so as to overlap each other and the feeding element 125F when viewed in a plan view from the normal direction of the dielectric substrate has been described.
- the element 121F and the feeding element 125F may be arranged at positions where they do not overlap each other.
- FIG. 24 is a block diagram of the communication device 10H to which the antenna module 100H according to the modification 6 is applied.
- the communication device 10H includes an antenna module 100H and a BBIC 200.
- the antenna module 100H includes an RFIC 110H, antenna devices 120H and 120J, a switching circuit 130, FEM180A and 180B, and a filter device 190. Similar to the antenna module 100F of the third embodiment, the FEM 180A and 180B are arranged on the connecting member 140, and the filter device 190 is arranged on the motherboard 250. Since the configuration of the RFIC 110H is the same as the configuration of the RFIC 110F of the third embodiment, the detailed description will not be repeated.
- the antenna device 120H is a dual band type antenna device similar to the antenna device 120F, but includes a feeding element 121H (121H1 to 121H4) and a non-feeding element 126H (126H1 to 126H4) as each radiating element. As shown in the partial cross-sectional view of the antenna device 120H of FIG. 25, the non-feeding element 126H is arranged between the feeding element 121H and the ground electrode GND in the antenna device 120H.
- the "feeding element 121H” and “feeding element 121J” in the modification 6 correspond to the "first element” in the present disclosure. Further, the "non-feeding element 126H” and the “non-feeding element 126J” in the third embodiment correspond to the "second element” in the present disclosure.
- the feeding wiring 191 penetrates the non-feeding element 126H and is connected to the feeding point SP1 of the feeding element 121H.
- a high frequency signal for example, 39 GHz band
- radio waves are radiated from the power supply element 121H.
- a high frequency signal for example, 28 GHz band
- the feeding wiring 191 and the non-feeding element 126H are connected to each other in the penetrating portion of the feeding wiring 191.
- the high frequency signal is transmitted to the non-feeding element 126H in a non-contact manner by electromagnetic field coupling. As a result, radio waves are radiated from the non-feeding element 126H.
- the antenna device 120J includes a feeding element 121J (121J1 to 121H4) and a non-feeding element 126J (126J1 to 126J4) as each radiating element. Since the configuration of the antenna device 120J is the same as that of the antenna device 120H, the detailed description will not be repeated.
- the high frequency signal of each frequency band is output individually from the RFIC110H, so that these signals are individually output using the feeding wiring.
- the filter device 190 including the diplexer is provided on the motherboard 250, and the feeding wiring for transmitting the high frequency signal on the high frequency side and the feeding wiring for transmitting the high frequency signal on the low frequency side are provided.
- the configuration in which the filter device including the diplexer is used for the dual band type antenna module has been described, but the antenna module capable of radiating radio waves in three or more different frequency bands. Also, by using a filter device including a triplexer or a multiplexer, the number of power feeding wirings arranged in the connecting member can be reduced.
- FIG. 26 is a block diagram of a communication device 10Y to which the antenna module 100Y according to the fourth embodiment is applied.
- the communication device 10Y includes an antenna module 100Y and a BBIC 200.
- the antenna module 100Y includes an RFIC 110Y, antenna devices 120F and 120G, a switching circuit 130Y, and a FEM180Y.
- the antenna devices 120F and 120G are the same as those in the third embodiment, and each radiating element arranged in each of the antenna devices 120F and 120G includes two feeding elements.
- the antenna device 120F includes feeding elements 121F and 125F
- the antenna device 120G includes feeding elements 121G and 125G.
- a high frequency signal is individually supplied from the RFIC 110Y to each feeding element.
- the RFIC110Y has a configuration in which the switches 111A to 111H, the power amplifiers 112AT to 112HT, and the low noise amplifiers 112AR to 112HR in the RFIC110F shown in FIG. 17 are removed.
- the RFIC110Y includes switches 113A to 113H, 117A, 117B, attenuators 114A to 114H, phase shifters 115A to 115H, signal synthesis / demultiplexers 116A, 116B, mixers 118A, 118B, and an amplifier circuit. It is equipped with 119A and 119B.
- the switches 113A to 113D, 117A, the attenuators 114A to 114D, the phase shifters 115A to 115D, the signal synthesizer / demultiplexer 116A, the mixer 118A, and the amplifier circuit 119A are configured as the feeding element 121F on the high frequency side. It is a circuit for 121G.
- the configurations of the switches 113E to 113H, 117B, the attenuators 114E to 114H, the phase shifters 115E to 115H, the signal synthesizer / demultiplexer 116B, the mixer 118B, and the amplifier circuit 119B are the feeding elements 125F, 125G on the low frequency side. Is a circuit for.
- FEM180Y includes FEM180YA to FEM180YD.
- the switch 113A and the switch 113E are connected to the FEM180YA, and the switch 113B and the switch 113F are connected to the FEM180YB.
- the switch 113C and the switch 113G are connected to the FEM180YC, and the switch 113D and the switch 113H are connected to the FEM180YD.
- the switching circuit 130Y includes the switch 130YA to the switch 130YD.
- the switch 130YA includes the switches 130YA1 and 130YA2, and the switch 130YB includes the switches 130YB1 and 130YB2.
- the switch 130YC includes switches 130YC1, 130YC2, and the switch 130YD includes switches 130YD1, 130YD2.
- FIG. 27 is a diagram for explaining the details of FEM180Y in FIG. 26. Note that, in FIG. 27, for the sake of simplicity, one configuration of the switch 130YA to 130YD and one configuration of the FEM180YA to FEM180YD are typically shown.
- the FEM180Y includes a power amplifier 183Y1 and a low noise amplifier 184Y1 corresponding to the circuit on the high frequency side, a power amplifier 183Y2 and a low noise amplifier 184Y2 corresponding to the circuit on the low frequency side, and a switch 182Y.
- the switch 182Y includes two switch circuits. One switch circuit of the switch 182Y is connected to the power amplifier 183Y1 and the low noise amplifier 184Y1 on the high frequency side, and one of the power amplifier 183Y1 and the low noise amplifier 184Y1 is connected to the input terminal of the switch 130Y1 of the switching circuit 130Y. do.
- the other switch circuit of the switch 182Y is connected to the power amplifier 183Y2 and the low noise amplifier 184Y2 on the low frequency side, and one of the power amplifier 183Y2 and the low noise amplifier 184Y2 is connected to the input terminal of the switch 130Y2 of the switching circuit 130Y. do.
- the switch 182Y is a switch for switching between transmission and reception of radio waves, and when radio waves are radiated from the antenna devices 120F and 120G, the switch circuit of the switch 182Y is connected to the power amplifiers 183Y1 and 183Y2. On the other hand, when the antenna devices 120F and 120G receive radio waves, the switch circuit of the switch 182Y is connected to the low noise amplifiers 184Y1 and 184Y2.
- the switching circuit 130Y is a circuit for switching between the antenna device 120F and the antenna device 120G.
- Each of the switches 130Y1 and 130Y2 included in the switching circuit 130Y has two output terminals.
- One output terminal of the switch 130Y1 is connected to the feeding element 121F in the antenna device 120F.
- the other output terminal of the switch 130Y1 is connected to the feeding element 121G in the antenna device 120G.
- one output terminal of the switch 130Y2 is connected to the feeding element 125F in the antenna device 120F.
- the other output terminal of the switch 130Y2 is connected to the feeding element 125G in the antenna device 120G.
- the switch 130YA1 in the switch 130YA is connected to the feeding element 121F1 and the feeding element 121G1.
- the switch 130YA2 in the switch 130YA is connected to the feeding element 125F1 and the feeding element 125G1.
- the switch 130YB1 in the switch 130YB is connected to the feeding element 121F2 and the feeding element 121G2.
- the switch 130YB2 in the switch 130YB is connected to the feeding element 125F2 and the feeding element 125G2.
- the switch 130YC1 in the switch 130YC is connected to the feeding element 121F3 and the feeding element 121G3.
- the switch 130YC2 in the switch 130YC is connected to the feeding element 125F3 and the feeding element 125G3.
- the switch 130YD1 in the switch 130YD is connected to the feeding element 121F4 and the feeding element 121G4.
- the switch 130YD2 in the switch 130YD is connected to the feeding element 125F4 and the feeding element 125G4.
- FIG. 28 is a side view of the antenna module 100Y in FIG. 26. Similar to the antenna module 100A of the second embodiment shown in FIG. 7, the antenna module 100Y has a configuration in which the antenna device 120F and the antenna device 120G are arranged on a common connection member 140Y. Further, a switching circuit 130Y and a FEM180Y are arranged on the surface 141Y of the connecting member 140Y.
- the switching circuit 130 on the motherboard 250 is excluded, and the signal from the RFIC 110Y is transmitted to the FEM 180Y through the connection terminal 155 by the connection wiring 170.
- the signal from the FEM180Y is branched by the switching circuit 130Y and transmitted to the antenna device 120F or the antenna device 120G.
- radio waves on the high frequency side and radio waves on the low frequency side are radiated from the antenna devices 120F and 120G without using the diplexers 190, 195A, 195B as in the third embodiment.
- it can be received.
- the FEM180Y with a power amplifier and a low noise amplifier on the high frequency side and the low frequency side, the antenna characteristics at each frequency can be appropriately adjusted, and the configuration of the RFIC110Y can be simplified.
- the power amplifier and the low noise amplifier are arranged in the FEM180Y, and the RFIC110Y is not provided with the power amplifier and the low noise amplifier.
- the power amplifier and the low noise amplifier are both the FEM and the RFIC. It may be the configuration provided in. In this case, the load of the power amplifier and the low noise amplifier can be shared by the FEM and the RFIC. Therefore, although the size of the RFIC is slightly larger than that of the antenna module 100Y, the size of the FEM arranged on the flexible substrate (connecting member 140Y) can be reduced.
- 10,10A, 10F, 10H, 10Y communication device 50 housing, 51, 52 main surface, 55-58 side surface, 100, 100A-100F, 100H, 100X, 100Y antenna module, 110, 110F, 110H, 110Y RFIC, 111A-111H, 113A-113H, 117,117A, 117B, 130A-130D, 130Y1,130Y2,130YA-130YD,181,181X,182,182X,182Y switch, 112AR-112HR, 184,184X1,184X2,184Y1,184Y2 Low noise amplifier, 112AT-112HT, 183,183X1,183X2, 183Y1,183Y2 power amplifier, 114A-114H attenuator, 115A-115H phase shifter, 116,116A, 116B signal synthesizer / demultiplexer, 118, 118A, 118B mixer , 119, 119A, 119B Amplifier circuit, 120, 120A to 120C, 120
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
Description
(通信装置の基本構成)
図1は、本実施の形態1に係るアンテナモジュール100が適用される通信装置10のブロック図の一例である。通信装置10は、たとえば、携帯電話、スマートフォンあるいはタブレットなどの携帯端末、通信機能を備えたパーソナルコンピュータ、または基地局などである。本実施の形態に係るアンテナモジュール100に用いられる電波の周波数帯域の一例は、たとえば28GHz、39GHzおよび60GHzなどを中心周波数とするミリ波帯の電波であるが、上記以外の周波数帯域の電波についても適用可能である。
図2は、実施の形態1に係るアンテナモジュール100の側面図である。アンテナモジュール100は、RFIC110と、誘電体基板122Aに給電素子121Aが形成されたアンテナ装置120Aと、誘電体基板122Bに給電素子121Bが形成されたアンテナ装置120Bと、切換回路130とを含む。なお、誘電体基板122Aおよび誘電体基板122Bを包括して「誘電体基板122」とも称する。
実施の形態1においては、アンテナ装置120Aおよびアンテナ装置120Bが、マザーボード250に個別に接続された構成について説明した。変形例1においては、アンテナ装置120Aおよびアンテナ装置120Bが、互いに接続された構成について説明する。図3は、変形例1に係るアンテナモジュール100Xの側面図である。また、図4はアンテナモジュール100Xの斜視図である。なお、図3および図4の説明において、実施の形態1のアンテナモジュール100と重複する要素の説明は繰り返さない。
実施の形態1においては、複数のアンテナ装置がマザーボードに直接接続される構成の例について説明した。
図5は、実施の形態2に係るアンテナモジュール100Aが適用される通信装置10Aのブロック図である。アンテナモジュール100Aにおいては、図1で示した実施の形態1のアンテナモジュール100に、フロントエンドモジュール(以下、「FEM(Front End Module)」とも称する。)180A,180Bが追加された構成となっている。図5のアンテナモジュール100Aにおいて、図1のアンテナモジュール100と重複する要素の説明は繰り返さない。
図7は、実施の形態2に係るアンテナモジュール100Aの側面図である。アンテナモジュール100Aは、実施の形態1と同様にマザーボード250に配置されたRFIC110および切換回路130、ならびにアンテナ装置120A、120Bに加えて、接続部材140と、FEM180A、180Bとを備える。なお、アンテナモジュール100Aにおいて、アンテナモジュール100と重複する要素の説明は繰り返さない。
図7の実施の形態2のアンテナモジュール100Aにおいては、切換回路がマザーボードに配置される構成について説明した。変形例2においては、切換回路が接続部材上に配置される構成について説明する。
図7の実施の形態2のアンテナモジュール100Aにおいては、複数のアンテナ装置が共通の接続部材に接続される構成について説明した。しかしながら、たとえば2つのアンテナ装置が互いに遠く離れて配置される場合に、共通の接続部材を用いると、接続部材の長さが長くなってしまい、通信装置へのアンテナ装置の実装が困難となる可能性がある。
変形例4および後述する変形例5においては、可撓性を有する接続部材を用いる場合について説明する。
図11の変形例4においては、接続部材を厚み方向に屈曲させて分岐させた構成の例について説明した。変形例5においては、接続部材を主面の面内方向に屈曲させて分岐させた構成について説明する。
図13において、上述の各実施の形態で示したアンテナモジュールを適用した場合の、通信装置におけるアンテナ装置の配置例について説明する。
上述の実施の形態において、接続部材あるいはマザーボードとアンテナ装置との接続に用いられる接続端子150A,150B、および、マザーボードと接続部材との接続に用いられる接続端子155,155A,155Bは、接続すべき部材の互いに対向する面の間に形成される例について説明した。しかしながら、これらの接続端子は他の接続態様としてもよい。
(通信装置の構成)
実施の形態3においては、アンテナ装置から異なる2つの周波数帯域の電波を放射することが可能な、いわゆるデュアルバンドタイプのアンテナモジュールの場合の例について説明する。
次に、図19~図21を用いて、実施の形態3に係るアンテナモジュール100Fの詳細な構成について説明する。図19は、アンテナモジュール100Fの側面図である。図20は、アンテナ装置120Fの部分断面図である。また、図21は、ダイプレクサの構成の例を説明するための図である。
実施の形態3においては、デュアルバンドタイプのアンテナモジュールにおいて放射素子へ個別給電を行なう構成について、ダイプレクサを用いる場合の例について説明した。
(通信装置の構成)
実施の形態4においては、実施の形態3と同様のデュアルバンドタイプのアンテナモジュールにおいて、ダイプレクサを用いない構成の例について説明する。
Claims (22)
- 各々に放射素子が配置された第1基板および第2基板と、
前記第1基板および前記第2基板に高周波信号を供給するための給電回路が配置された第3基板と、
前記給電回路と前記第1基板上の放射素子との間の接続、および、前記給電回路と前記第2基板上の放射素子との間の接続を切換えるように構成された切換回路とを備える、アンテナモジュール。 - 前記第1基板、前記第2基板および前記第3基板に接続され、前記給電回路と前記第1基板に配置された放射素子との間、および、前記給電回路と前記第2基板に配置された放射素子との間で高周波信号を伝達する接続部材をさらに備える、請求項1に記載のアンテナモジュール。
- 前記接続部材に配置され、前記第1基板に配置された放射素子と前記給電回路との間で伝達される高周波信号を増幅するように構成された第1増幅回路と、
前記接続部材に配置され、前記第2基板に配置された放射素子と前記給電回路との間で伝達される高周波信号を増幅するように構成された第2増幅回路とをさらに備える、請求項2に記載のアンテナモジュール。 - 前記第1増幅回路および前記第2増幅回路の少なくとも一方は、前記第3基板に接している、請求項3に記載のアンテナモジュール。
- 前記切換回路は、前記第3基板に配置される、請求項2~4のいずれか1項に記載のアンテナモジュール。
- 前記切換回路は、前記接続部材に配置される、請求項2~5のいずれか1項に記載のアンテナモジュール。
- 前記接続部材は可撓性を有する、請求項2~6のいずれか1項に記載のアンテナモジュール。
- 前記接続部材は、複数の誘電体層が積層された多層構造を有しており、互いに異なる層に形成された第1配線および第2配線を含む、請求項5~7のいずれか1項に記載のアンテナモジュール。
- 前記第1基板と前記第3基板との間に接続され、前記給電回路と前記第1基板に配置された放射素子との間で高周波信号を伝達する第1接続部材と、
前記第2基板と前記第3基板との間に接続され、前記給電回路と前記第2基板に配置された放射素子との間で高周波信号を伝達する第2接続部材とをさらに備える、請求項1に記載のアンテナモジュール。 - 前記第1接続部材に配置され、前記第1基板に配置された放射素子と前記給電回路との間で伝達される高周波信号を増幅するように構成された第1増幅回路と、
前記第2接続部材に配置され、前記第2基板に配置された放射素子と前記給電回路との間で伝達される高周波信号を増幅するように構成された第2増幅回路とをさらに備える、請求項9に記載のアンテナモジュール。 - 前記第1増幅回路および前記第2増幅回路の少なくとも一方は、前記第3基板に接している、請求項10に記載のアンテナモジュール。
- 前記第1接続部材および前記第2接続部材の少なくとも一方は、複数の誘電体層が積層された多層構造を有しており、互いに異なる層に形成された第1配線および第2配線を含む、請求項9~11のいずれか1項に記載のアンテナモジュール。
- 前記切換回路は、前記第3基板に配置される、請求項9~12のいずれか1項に記載のアンテナモジュール。
- 前記第1増幅回路および前記第2増幅回路の各々は、前記給電回路からの送信信号を増幅するためのパワーアンプ、および、前記放射素子で受信した受信信号を増幅するためのローノイズアンプの少なくとも一方を含む、請求項3または10に記載のアンテナモジュール。
- 前記放射素子は、第1周波数帯域の電波を放射可能な第1素子と、前記第1周波数帯域とは異なる第2周波数帯域の電波を放射可能な第2素子とを含み、
前記アンテナモジュールは、前記第1周波数帯域の信号を通過可能な第1フィルタと、前記第2周波数帯域の信号を通過可能な第2フィルタとを含む第1フィルタ装置をさらに備え、
前記第1フィルタ装置は、前記第3基板において、前記給電回路と前記切換回路との間の信号伝達経路に配置される、請求項1~14のいずれか1項に記載のアンテナモジュール。 - 前記アンテナモジュールは、前記第1フィルタおよび前記第2フィルタを含む第2フィルタ装置をさらに備え、
前記第2フィルタ装置は、前記第1基板および前記第2基板において、前記放射素子と前記接続部材との間の信号伝達経路に配置される、請求項15に記載のアンテナモジュール。 - 前記給電回路をさらに備える、請求項1~16のいずれか1項に記載のアンテナモジュール。
- 請求項1~17のいずれか1項に記載のアンテナモジュールを搭載した、通信装置。
- 請求項3または10に記載のアンテナモジュールと、
前記アンテナモジュールを収納するための筐体とを備え、
前記第1増幅回路および前記第2増幅回路は、前記筐体から離間して配置される、通信装置。 - 前記第1増幅回路および前記第2増幅回路の少なくとも一方と前記筐体との間に配置された断熱部材をさらに備える、請求項19に記載の通信装置。
- 各々に放射素子が配置された第1基板および第2基板と、前記第1基板および前記第2基板に高周波信号を供給するための給電回路が配置された第3基板とを接続するための接続部材であって、
前記給電回路と各放射素子との間で高周波信号を伝達するための給電配線が内部に形成された誘電体基板と、
前記誘電体基板に配置され、前記給電回路と前記第1基板上の放射素子との間の接続、および、前記給電回路と前記第2基板上の放射素子との間の接続を切換えるように構成された切換回路とを備える、接続部材。 - 前記誘電体基板に配置され、前記第1基板に配置された放射素子と前記給電回路との間で伝達される高周波信号を増幅するように構成された第1増幅回路と、
前記誘電体基板に配置され、前記第2基板に配置された放射素子と前記給電回路との間で伝達される高周波信号を増幅するように構成された第2増幅回路とをさらに備える、請求項21に記載の接続部材。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022533725A JP7384290B2 (ja) | 2020-07-02 | 2021-05-19 | アンテナモジュール、接続部材、およびそれを搭載した通信装置 |
DE112021002604.6T DE112021002604T5 (de) | 2020-07-02 | 2021-05-19 | Antennenmodul, Verbindungsbauglied und Kommunikationsvorrichtung, die dieselben umfasst |
KR1020237000071A KR20230019489A (ko) | 2020-07-02 | 2021-05-19 | 안테나 모듈, 접속 부재 및 그것을 탑재한 통신 장치 |
CN202180047212.3A CN115803964A (zh) | 2020-07-02 | 2021-05-19 | 天线模块、连接构件以及搭载有天线模块的通信装置 |
US18/090,524 US20230145095A1 (en) | 2020-07-02 | 2022-12-29 | Antenna module, connection member, and communication device including the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-114822 | 2020-07-02 | ||
JP2020114822 | 2020-07-02 | ||
JP2020173344 | 2020-10-14 | ||
JP2020-173344 | 2020-10-14 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US18/090,524 Continuation US20230145095A1 (en) | 2020-07-02 | 2022-12-29 | Antenna module, connection member, and communication device including the same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022004169A1 true WO2022004169A1 (ja) | 2022-01-06 |
Family
ID=79315906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2021/018983 WO2022004169A1 (ja) | 2020-07-02 | 2021-05-19 | アンテナモジュール、接続部材、およびそれを搭載した通信装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230145095A1 (ja) |
JP (1) | JP7384290B2 (ja) |
KR (1) | KR20230019489A (ja) |
CN (1) | CN115803964A (ja) |
DE (1) | DE112021002604T5 (ja) |
WO (1) | WO2022004169A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023153458A1 (ja) * | 2022-02-10 | 2023-08-17 | 株式会社村田製作所 | トラッカモジュール、電力増幅モジュール及び高周波モジュール |
WO2023218719A1 (ja) * | 2022-05-11 | 2023-11-16 | 日本メクトロン株式会社 | 接合プリント配線板および接合プリント配線板の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020142362A (ja) * | 2019-02-28 | 2020-09-10 | キヤノン株式会社 | ロボット装置、ロボット装置の制御方法、ロボット装置を用いた物品の製造方法、通信装置、通信方法、制御プログラム及び記録媒体 |
CN117082730B (zh) * | 2023-09-20 | 2024-02-09 | 成都华兴大地科技有限公司 | 一种可气密多层陶瓷结构 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000221536A (ja) * | 1999-02-02 | 2000-08-11 | Nec Corp | 液晶表示装置およびその製造方法 |
JP2004095995A (ja) * | 2002-09-03 | 2004-03-25 | Seiko Epson Corp | 電子部品の実装基板、電子部品の実装基板の製造方法、電気光学装置、電気光学装置の製造方法及び電子機器 |
JP2006340367A (ja) * | 2005-06-02 | 2006-12-14 | Behavior Tech Computer Corp | 内蔵式アンテナ及びコネクタを備える無線送信装置 |
JP2012238903A (ja) * | 2012-08-10 | 2012-12-06 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
US20160028153A1 (en) * | 2014-07-25 | 2016-01-28 | VivaLnk Limited (Cayman Islands) | Stretchable Wireless Device |
US20160099738A1 (en) * | 2014-10-02 | 2016-04-07 | Sony Corporation | Wireless communication terminal |
WO2018008573A1 (ja) * | 2016-07-06 | 2018-01-11 | 株式会社村田製作所 | 電子機器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2195879B1 (en) | 2007-08-27 | 2017-01-25 | Lattice Semiconductor Corporation | Antenna array with flexible interconnect for a mobile wireless device |
-
2021
- 2021-05-19 DE DE112021002604.6T patent/DE112021002604T5/de active Pending
- 2021-05-19 JP JP2022533725A patent/JP7384290B2/ja active Active
- 2021-05-19 CN CN202180047212.3A patent/CN115803964A/zh active Pending
- 2021-05-19 WO PCT/JP2021/018983 patent/WO2022004169A1/ja active Application Filing
- 2021-05-19 KR KR1020237000071A patent/KR20230019489A/ko not_active Application Discontinuation
-
2022
- 2022-12-29 US US18/090,524 patent/US20230145095A1/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000221536A (ja) * | 1999-02-02 | 2000-08-11 | Nec Corp | 液晶表示装置およびその製造方法 |
JP2004095995A (ja) * | 2002-09-03 | 2004-03-25 | Seiko Epson Corp | 電子部品の実装基板、電子部品の実装基板の製造方法、電気光学装置、電気光学装置の製造方法及び電子機器 |
JP2006340367A (ja) * | 2005-06-02 | 2006-12-14 | Behavior Tech Computer Corp | 内蔵式アンテナ及びコネクタを備える無線送信装置 |
JP2012238903A (ja) * | 2012-08-10 | 2012-12-06 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
US20160028153A1 (en) * | 2014-07-25 | 2016-01-28 | VivaLnk Limited (Cayman Islands) | Stretchable Wireless Device |
US20160099738A1 (en) * | 2014-10-02 | 2016-04-07 | Sony Corporation | Wireless communication terminal |
WO2018008573A1 (ja) * | 2016-07-06 | 2018-01-11 | 株式会社村田製作所 | 電子機器 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023153458A1 (ja) * | 2022-02-10 | 2023-08-17 | 株式会社村田製作所 | トラッカモジュール、電力増幅モジュール及び高周波モジュール |
WO2023218719A1 (ja) * | 2022-05-11 | 2023-11-16 | 日本メクトロン株式会社 | 接合プリント配線板および接合プリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7384290B2 (ja) | 2023-11-21 |
US20230145095A1 (en) | 2023-05-11 |
KR20230019489A (ko) | 2023-02-08 |
JPWO2022004169A1 (ja) | 2022-01-06 |
CN115803964A (zh) | 2023-03-14 |
DE112021002604T5 (de) | 2023-05-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2022004169A1 (ja) | アンテナモジュール、接続部材、およびそれを搭載した通信装置 | |
WO2022004080A1 (ja) | アンテナモジュール、接続部材、およびそれを搭載した通信装置 | |
KR102153867B1 (ko) | 안테나 모듈, 및 안테나 모듈의 제조 방법 | |
CN112640209B (zh) | 天线模块以及搭载有该天线模块的通信装置 | |
JP2016116209A (ja) | 切替え可能送受信フェーズド・アレイ・アンテナ | |
US20220181766A1 (en) | Antenna module and communication device equipped with the same | |
US20210242569A1 (en) | Wiring substrate, antenna module, and communication device | |
WO2022185917A1 (ja) | アンテナモジュールおよびそれを搭載した通信装置 | |
JPWO2022004169A5 (ja) | ||
WO2022038879A1 (ja) | アンテナモジュール、およびそれを搭載した通信装置 | |
US11063340B2 (en) | Antenna module and communication device | |
JP6798656B1 (ja) | アンテナモジュールおよびそれを搭載した通信装置 | |
US11916312B2 (en) | Antenna module, communication device mounting the same, and circuit board | |
US20220094074A1 (en) | Antenna module, communication apparatus including the same, and circuit substrate | |
WO2020217971A1 (ja) | アンテナモジュールおよびそれを搭載した通信装置 | |
US20220085521A1 (en) | Antenna module and communication device equipped with the same | |
WO2022004111A1 (ja) | アンテナモジュールおよびそれを搭載した通信装置 | |
WO2023157450A1 (ja) | アンテナモジュールおよびそれを搭載した通信装置 | |
WO2022185874A1 (ja) | アンテナモジュールおよびそれを搭載した通信装置 | |
WO2024075334A1 (ja) | アンテナモジュールおよびそれを搭載した通信装置 | |
WO2024106004A1 (ja) | アンテナモジュールおよびそれを搭載した通信装置 | |
WO2020184205A1 (ja) | フィルタ装置、ならびに、それを備えたアンテナモジュールおよび通信装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21832077 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2022533725 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20237000071 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21832077 Country of ref document: EP Kind code of ref document: A1 |