WO2022001839A1 - 一种光笼子组件及光通信设备 - Google Patents

一种光笼子组件及光通信设备 Download PDF

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Publication number
WO2022001839A1
WO2022001839A1 PCT/CN2021/102212 CN2021102212W WO2022001839A1 WO 2022001839 A1 WO2022001839 A1 WO 2022001839A1 CN 2021102212 W CN2021102212 W CN 2021102212W WO 2022001839 A1 WO2022001839 A1 WO 2022001839A1
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WO
WIPO (PCT)
Prior art keywords
support frame
base
optical
optical cage
cage assembly
Prior art date
Application number
PCT/CN2021/102212
Other languages
English (en)
French (fr)
Inventor
王丁丁
王建阳
李朝兴
袁昌发
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to JP2022580870A priority Critical patent/JP7540643B2/ja
Priority to EP21832357.4A priority patent/EP4171180A4/en
Priority to KR1020237002428A priority patent/KR20230028459A/ko
Publication of WO2022001839A1 publication Critical patent/WO2022001839A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Definitions

  • the present application relates to the technical field of optical communication, and in particular, to an optical cage assembly and an optical communication device.
  • Optical modules are widely used in optical communication equipment such as routers and switches as an important module for realizing the conversion of electrical signals and optical signals.
  • the optical cage is fixed on the circuit board of the optical communication device, and the optical module is pluggable and matched in the slot of the optical cage.
  • some devices are usually arranged between the circuit board and the optical cage, for example, power-related devices that supply power to the optical module.
  • the device and the optical cage need to be soldered to the circuit board at the same time, and the device under the optical cage is blocked by the optical cage and cannot be optically detected.
  • SMT surface mount technology
  • the present application provides an optical cage assembly and an optical communication device, so as to facilitate the detection of devices between the optical cage and the circuit board when the optical cage is assembled.
  • an optical cage assembly comprising: an optical cage and a base, wherein the optical cage has a mounting surface, and the base is used for connecting with the mounting surface;
  • the device and the base can be fixed on the surface of the circuit board by SMT technology first, and the optical cage can be fixed on the base after the optical inspection of the device and the base.
  • the above process ensures the optical cage and the circuit board.
  • the devices between the two can be optically detected, which is conducive to ensuring the mounting quality of the devices; and the orthographic projection area of the base on the reference surface is smaller than the area of the mounting surface, wherein the reference surface is where the mounting surface is located. It can avoid that the area of the circuit board occupied by the base is smaller than the area of the components installed on the circuit board blocked by the optical cage, and effectively ensure the area utilization rate of the circuit board surface.
  • the form of the base can be various, and in a specific embodiment, the base can be a frame structure.
  • the mounting surface includes a first side edge and a second side edge arranged oppositely, and a third side edge and a fourth side edge arranged oppositely, wherein the third side edge is connected to the One end of the first side edge and one end of the second side edge, the fourth side edge connects the other end of the first side edge and the other end of the second side edge;
  • the first support frame extending along the first side edge and the second support frame for extending along the second side edge provide a substantially stable support for the optical cage while occupying less area on the surface of the circuit board.
  • the base may further include a third support frame, wherein the third support frame is connected to the first support frame and the second support frame. to improve the stability of the base.
  • the third support frame may extend along the third side edge; or, the third support frame is connected to the middle part of the first support frame and the middle part of the second support frame .
  • the base may further include a fourth support frame, wherein the fourth support frame is connected to the first support frame and the second support frame, so as to further improve the stability of the base.
  • the fourth support frame can be connected to the middle part of the first support frame and the middle part of the second support frame, so as to improve the stability of the base and reduce the suspended distance of the light cage; or , the fourth support frame extends along the fourth side edge, so that the base forms a stable quadrilateral structure.
  • the base may further include a fifth support frame, wherein the fifth support frame is connected with the middle part of the third support frame and the middle part of the fourth support frame, so as to further improve the base stability.
  • the base may also include a plurality of supporting columns distributed at intervals.
  • the plurality of supporting columns are evenly distributed on the mounting surface to provide uniform support to the optical cage.
  • the mounting surface may further be provided with a plurality of crimping feet, and each crimping foot is plug-fitted with the base.
  • the base has a plurality of crimping holes corresponding to the plurality of crimping feet one-to-one.
  • a accommodating cavity corresponding to each crimping hole is formed; each crimping foot includes a first connecting segment and a blocking part, one end of each first connecting segment is connected with the mounting surface, and the other end is connected with the corresponding blocking part
  • the blocking portion of each crimping pin is used for inserting into the corresponding accommodating cavity through the corresponding crimping hole, and for preventing the corresponding crimping pin from slipping out of the corresponding crimping hole.
  • each of the blocking parts has a guide structure, so as to facilitate entering the blocking parts into the crimping holes.
  • the position of the crimping hole can be various, in a specific embodiment, the base has a first surface for facing away from the circuit board and a second surface for facing the circuit board, and connecting the first surface a connecting surface between the surface and the second surface; each crimping hole extends from the accommodating cavity to the first surface; each first connecting segment extends in a direction perpendicular to the mounting surface.
  • the base has a first surface facing away from the circuit board and a second surface facing the circuit board, and a connecting surface connecting the first surface and the second surface each of the crimping holes extends from the accommodating cavity to one of the connection surfaces; a second connection segment is also provided between each first connection segment and the corresponding blocking part, and the extension of the second connection segment
  • the included angle between the direction and the mounting surface is an acute angle.
  • each crimping foot has one or more hanging holes, and the opening direction of the hanging holes is parallel to the mounting surface; the connecting surface of the base is provided with the one or more hanging holes.
  • the hanging holes correspond to a plurality of raised portions, and each raised portion is used to be inserted into the corresponding hanging hole.
  • each raised portion facing away from the circuit board forms a guide surface to guide the crimping pin.
  • an optical communication device comprising:
  • the base is fixed on the surface of the circuit board, and the mounting surface of the optical cage is connected to the base.
  • the device and the base can be fixed on the surface of the circuit board by SMT technology first, and after the optical detection of the device and the base, the optical cage can be fixed on the base. The above process ensures the optical cage.
  • the device between the circuit board and the circuit board can be optically detected, which is conducive to ensuring the mounting quality of the device and improving the stability of the optical communication device.
  • FIG. 1 shows a schematic diagram of a scene in which the optical cage assembly provided by the embodiment of the present application can be applied;
  • Figure 2 shows a bottom view of the optical cage 20 in Figure 1;
  • FIG. 3 shows a schematic diagram when the base 10 in FIG. 1 is mounted on the circuit board 30;
  • FIG. 4 shows a top view of the optical cage assembly 01 in FIG. 1;
  • Fig. 5 shows the partial schematic diagram of the cross-sectional view along the A-A direction in Fig. 1;
  • FIG. 6 shows a schematic view of the optical cage 20 in FIG. 5 before the second support frame 12 is assembled
  • FIG. 7 shows a schematic partial structure diagram of another way of cooperation between the optical cage and the base in the optical cage assembly provided by the embodiment of the present application;
  • FIG. 8 shows a schematic view of the optical cage 20 in FIG. 7 before the second support frame 12 is assembled
  • Fig. 9 shows the top view of the optical cage and the base when the fixing method shown in Fig. 7 is adopted;
  • FIG. 10 shows a schematic partial structure diagram of another way of cooperation between the optical cage and the base in the optical cage assembly provided by the embodiment of the present application;
  • Figure 11 shows a side view of the optical cage assembly shown in Figure 10;
  • FIG. 12 shows a schematic view of the optical cage assembly shown in FIG. 10 before the optical cage 20 is assembled on the base 10;
  • Figure 13 shows a top view of the optical cage and the base when the fixing method shown in Figure 10 is used;
  • FIG. 14 shows a top view of another optical cage assembly provided by an embodiment of the present application.
  • FIG. 15 shows a top view of another optical cage assembly provided by an embodiment of the present application.
  • FIG. 16 shows a top view of another optical cage assembly provided by an embodiment of the present application.
  • FIG. 17 shows a top view of another optical cage assembly provided by an embodiment of the present application.
  • FIG. 18 shows a top view of another optical cage assembly provided by an embodiment of the present application.
  • FIG. 1 shows a schematic diagram of a scene in which the optical cage assembly provided by the embodiment of the present application can be applied, and specifically only shows the circuit board 30 and the optical cage assembly 01 in the optical communication device.
  • a shell can be used.
  • a body (not shown in the figure) encapsulates the above-mentioned circuit board 30 and the optical cage assembly 01 .
  • the optical cage assembly 01 includes a base 10 and an optical cage 20 , and the optical cage 20 is fixed on the circuit board 30 through the base 10 .
  • FIG. 2 shows a bottom view (z-axis front view) of the optical cage 20 of FIG. 1 .
  • the optical cage 20 includes a top wall 21 and a bottom wall 22 (for the wall disposed close to the circuit board 30 ) oppositely arranged, and a plurality of The side walls 23 are distributed at intervals to divide the top wall 21 and the bottom wall 22 into a plurality of side-by-side slots for inserting optical modules, and the surface of the bottom wall 22 away from the top wall 21 is called the mounting surface ( That is, the surface used for installation with the base 10 is denoted as S2); the top wall 21, bottom wall 22 and side wall 23 of the optical cage 20 can be made of materials such as steel or copper with good heat dissipation and certain elasticity.
  • the mounting surface S2 has a first side a, a second side b, a third side c and a fourth side d, wherein the first side a and the second side b are opposite and parallel to each other, and the third side c and the fourth side d are opposite and parallel to each other, the third side c is connected to one end of the first side a in the positive direction of the y-axis and the end of the second side b in the positive direction of the y-axis, and the fourth side d is connected to One end of the first side a in the negative y-axis direction and one end of the second side b in the negative y-axis direction.
  • the inner side of the second side b, and the inner side of the third side c are respectively provided with a plurality of crimping feet 24 distributed at intervals.
  • FIG. 3 shows a schematic diagram when the base 10 in FIG. 1 is mounted on the circuit board 30 .
  • the base 10 includes a first support frame 11, a second support frame 12 and a third support frame 13, and the three are all strip-shaped structures and have a square cross-section (only for example). , not limited to a square, but also a regular hexagon, etc., as long as it can play a supporting role), wherein, the first support frame 11 and the second support frame 12 are opposite and parallel arranged, such as extending along the y-axis direction , and the third support frame 13 is connected to one end of the first support frame 11 in the positive y-axis direction and one end of the second support frame 12 in the positive direction of the y-axis.
  • the structure of each part of the base 10 can be made of materials with certain supporting strength, such as steel and copper.
  • FIG. 4 shows a top view of the optical cage assembly 01 in FIG. 1 .
  • the outline of the optical cage 20 is represented by a dotted line. 4
  • the first support frame 11 extends along the first side a of the installation surface S2
  • the second support frame 12 extends along the second side b
  • the third side wall 13 extends along the third side c.
  • FIG. 5 shows a partial schematic view of the cross-sectional view in the direction AA in FIG. 1 , and specifically shows a schematic view of the optical cage 20 and the second support frame 12 .
  • the second support frame 12 has oppositely disposed first surfaces m1 (for the side facing away from the circuit board 30 ) and the second surface m2 (for the side facing the circuit board 30 ), and connection surfaces m3 and m4 connecting the first and second surfaces m1 and m2 .
  • the interior of the second support frame 12 is hollow to form an accommodating cavity K1, the accommodating cavity K1 communicates with the first surface m1 through a plurality of crimping holes h1, and the outer diameter of the crimping holes h1 is smaller than the dimension of the accommodating cavity K1 along the x-axis.
  • the crimping foot 24 includes a first connecting section 24a and a blocking portion 24b. One end of the first connecting section 24a is fixedly connected to the mounting surface S2, and the other end is connected to the blocking section 24b, and the outer diameter of the blocking section 24b is larger than that of the first connecting section 24a. the outer diameter.
  • the cross-sectional area of the blocking portion 24b gradually increases, forming a circular truncated structure.
  • the outer diameter of the crimping hole h1 is between the maximum outer diameter and the minimum outer diameter of the blocking portion 24b.
  • the material of the crimping pin 24 can be selected from a material with certain elasticity, such as steel or copper.
  • FIG. 6 shows a schematic view of the optical cage 20 in FIG. 5 before the second support frame 12 is assembled. 5, when assembling the crimping feet 24 to the second support frame 12, align the crimping feet 24 with the corresponding crimping holes h1, and move the optical cage 20 along the negative direction of the z-axis, Because the outer diameter of the end of the blocking portion 24b close to the second support frame 12 is small, it can be inserted into the crimping hole h1 first, and then continue to press down on the cage 20.
  • the blocking The crimping portion 24b opens the crimping hole h1 into the accommodating cavity K1, the base 10 and the optical cage 20 are detachably connected, and the inclined surface of the circular truncated structure of the blocking portion 24b forms a guiding structure.
  • the blocking portion 24b close to the first connecting section 24a is larger than the crimping hole h1, the blocking portion 24b is firmly fixed in the accommodating cavity K1, and the optical cage 20 is not easily separated from the base 10.
  • the first support frame 11 and the third support frame 13 have the same structure as the second support frame 12 , and the names of each part (such as the first surface, the second support frame surface, connecting surface, receiving groove and crimping hole) have the same name and express the same meaning.
  • the above-mentioned first surface, second surface and connecting surface are also referred to as the first surface, second surface and connecting surface of the base 10 respectively, that is, the base 10 has a first surface and a second surface disposed opposite to each other, and the connection The connecting surface of the first surface and the second surface.
  • the plurality of crimping feet 24 on the mounting surface S2 of the optical cage 20 are respectively connected to the crimping holes of the first surface of the base 10 (the first surfaces of the first support frame 11 , the second support frame 13 and the third support frame 13 )
  • One-to-one matching, and the matching method refers to the matching method between the crimping feet 24 and the second support frame 12 in FIGS. 5 and 6 .
  • solder paste is printed on the surface of the pre-installed base 10 of the circuit board 30; secondly, referring to FIG. 3, Dispensing glue, attaching the base 10 and the device to be soldered to a predetermined position on the surface of the circuit board 30 by using the printed solder paste, and curing, in FIG.
  • the device to be welded can be specifically mounted within the shielding area S1 and the area outside the base 10; then, the device to be welded and the base 10 are welded to the surface of the circuit board 30 by a welding process such as reflow soldering; then, automatic optical detection is used.
  • the (automated optical inspection, AOI) technology detects the devices on the surface of the base 10 and the circuit board 30. Since the devices in the range of the blocking area S1 are temporarily blocked by the optical cage 20, optical detection can be performed on the devices in this area; Next, the crimping pins 24 of the optical cage 20 are detachably matched with the crimping holes h1 of the base 10 . Refer to the description of FIG. 5 and FIG. 6 for the matching method.
  • the projection of the optical cage 20 on the circuit board 30 is covered and blocked. area S1.
  • the automatic optical detection of the devices in the shielding area S1 has been completed, at this time, shielding the shielding area S1 by the optical cage 20 has no effect on the detection of the devices.
  • the orthographic projection area of the base 10 on the reference surface is smaller than the area of the installation surface S2, and the installation surface S2 is substantially parallel or completely parallel to the surface of the circuit board 30.
  • the base 10 is installed on the circuit board 30 in advance, the area occupied by the base 10 is larger than the area on the circuit board 30 that cannot be detected due to the occlusion of the optical cage 20 , thereby ensuring that after the base 10 is installed, the circuit board 30 can be effectively improved.
  • Device placement area utilization on the surface is possible to avoid because the base 10 is installed on the circuit board 30 in advance.
  • FIG. 7 is a schematic diagram showing a partial structure of another mode of cooperation between the optical cage and the base in the optical cage assembly provided by the embodiment of the present application. Please refer to FIG. 7 .
  • the difference from the embodiments corresponding to FIGS. 5 and 6 is that the pressure
  • the pin 24 includes a first connection segment 24a, a second connection segment 24c and a blocking portion 24b, wherein one end of the first connection segment 24a is connected to the mounting surface S2, and the other end is connected to the second connection segment 24c.
  • the second connection segment 24c One end away from the first connecting segment 24a is connected to the blocking portion 24b, wherein, for example, the first connecting segment 24a extends in a direction perpendicular to the mounting surface S2, and the second connecting segment 24b extends in a direction inclined to the mounting surface S2, Specifically, the extending direction of the second connecting segment 24b may form an acute angle with the mounting surface S2, for example, the acute angle may be between 45° and 75°.
  • FIG. 8 shows a schematic view of the optical cage 20 in FIG. 7 before the second support frame 12 is assembled.
  • the process of cooperating the crimping feet 24 with the second support frame 12 will be described below.
  • the second connecting section 24c forms an acute angle with the mounting surface S2 in the natural uncompressed state, the second connecting section 24c is squeezed on the connecting surface m3.
  • the size of the blocking portion 24b in the x-axis direction is smaller than the size in the z-axis direction.
  • the blocking portion 24b When the bottom surface t1 of the blocking portion 24b slides down to the crimping hole h2 of the connecting surface m3, the blocking portion 24b One end of the bottom surface t1 of the bottom surface t1 is pryed into the crimping hole h2 under the extrusion of the second connecting section 24c, and the cage 20 continues to be pressed down.
  • the bottom surface t1 of the blocking portion 24b is in contact with the side wall of the crimping hole h2, and the blocking portion 24b wraps around the crimping hole h2.
  • the y-axis rotates so that the bottom surface t1 of the blocking portion 24b faces the connecting surface m4, and the blocking portion 24b can slide into the crimping hole h2 after being rotated.
  • the blocking portion 24b slides into the accommodating cavity K1, the blocking portion 24b returns to the bottom surface t1 and faces the second surface m2, and the extension direction of the second connecting section 24c is still at an acute angle with the mounting surface S2.
  • the blocking portion The dimension of 24b in the z-axis direction is larger than the inner diameter of the crimping hole h2, and the blocking portion 24b can be stuck on the inner surface of the corresponding side wall of the connecting surface m3 of the second support frame 12 to prevent the crimping foot 24 as a whole from the crimping hole h2. slide out.
  • FIG. 9 shows a top view of the optical cage and the base when the fixing method shown in FIG. 7 is adopted, wherein only the outline of the optical cage 20 is shown by a dotted frame to illustrate its position.
  • crimping feet 24 are provided on the first side a, the second side b, and the fourth side d of the mounting surface S2 of the optical cage 20 , and each crimping pin 24 on the first side a
  • the pins 24 are all disposed opposite to a crimping foot 24 on the second side b, and the crimping holes on the first support frame 11 and the crimping holes on the second support frame 12 are oppositely disposed. Therefore, when the optical cage 20 is moved downward, the crimping feet 24 disposed opposite to each other on both sides receive a balanced force.
  • FIG. 10 shows a schematic partial structure diagram of another way of cooperation between the optical cage and the base in the optical cage assembly provided in the embodiment of the present application
  • FIG. 11 shows the side view (view in the negative direction of the x-axis) of the optical cage assembly shown in FIG. 10 . . 10 and 11, the difference between the optical cage assembly shown in FIG. 10 and the optical cage assembly shown in FIG. 5 is that in FIG.
  • the crimping feet 24 may be along the second side b of the mounting surface S2
  • the plate-like structure extending and perpendicular to the mounting surface S2 has hanging holes h3 extending through the crimping pins 24 along the thickness direction of the crimping pins 24 , and the opening direction of the hanging holes h3 is parallel to the mounting surface S2 .
  • the connecting surface m4 of the second support frame of the base 10 is provided with a protruding portion 12t protruding from the connecting surface m4, and the protruding portion 12t is used to form an inclined guide surface G1 on the surface facing away from the circuit board.
  • FIG. 12 shows a schematic view of the optical cage assembly shown in FIG. 10 before the optical cage 20 is assembled to the base 10 .
  • the process of assembling the optical cage 20 to the base 10 is described: first, make the crimping feet 24 Roughly align with the protrusion 12t, move the optical cage 20 downward (in the negative direction of the z-axis), the bottom end of the crimping pin 24 is in contact with the guide surface G1 of the protrusion 12t, continue to move the optical cage downward, and the crimping pin 24
  • the guide surface G1 is stretched in the positive direction of the x-axis.
  • the raised portion 12t When the hanging hole h3 is aligned with the raised portion 12t, the raised portion 12t extends into the hanging hole h3, and the inner wall of the hanging hole h3 clamps the raised portion 12t, so that the raised portion 12t is stuck.
  • the raised portion 12t is relatively fixed with the crimping pin 24 to realize detachable connection.
  • the existence of the guide surface G1 enables the crimping pin 24 to move down smoothly even if the side surface of the crimping pin 24 in the x-direction is not aligned with the surface of the convex portion 12t facing away from the connecting surface m3, and finally the convex
  • the raised portion 12t is matched with the hanging hole h3.
  • FIG. 13 shows a top view of the optical cage and the base when the fixing method shown in FIG. 10 is adopted, in which only the outline of the optical cage 20 is shown by a dotted frame to illustrate its position.
  • crimping feet 24 are provided on the first side a, the second side b, and the fourth side d of the mounting surface S2 of the optical cage 20 , and each crimping pin 24 on the first side a Both the pins 24 are disposed opposite to a crimping pin 24 on the second side b, and the crimping pin 24 on the first side a is located on the surface of the first support frame 11 away from the second support frame 12, and the second The crimping feet 24 at the side b are located on the side of the second support frame 12 away from the first support frame 11, and the crimping holes on the first support frame 11 and the crimping holes on the second support frame Exemplarily, it can also be set relative). Therefore, when the optical cage 20 is moved downward, the crimping feet 24
  • the form of the base 10 used in the above embodiments corresponding to FIGS. 4 , 9 and 13 is only an example.
  • the base 10 only needs to be a frame structure.
  • the so-called “frame structure” refers to the use of a strip structure on the same plane. spliced structure.
  • Using the frame structure as the base can reduce the area of the circuit board 30 ( FIG. 1 ) occupied by the base 10 as much as possible while providing stable support for the optical cage 20 .
  • Other possible frame structure forms of the base 10 will be described below with examples of drawings.
  • FIG. 14 shows a top view of another optical cage assembly provided by an embodiment of the present application, in which only the outline of the optical cage 20 is represented by a dashed frame (the same below, and details are not repeated).
  • the difference between FIG. 14 and FIG. 4 is that the elimination of the third support frame 13 can also provide a substantially stable support for the optical cage 20 , and can free up more area on the circuit board 30 for mounting devices.
  • FIG. 15 shows a top view of another optical cage assembly provided by the embodiment of the present application.
  • the base 10 further includes a fourth support frame 14 , wherein the fourth support frame 14 is connected to the second support frame The end of the frame 12 away from the third support frame 13 and the end of the first support frame 11 away from the third support frame 13, that is, the fourth support frame 14 extends along the fourth side d, so that the base 10 is connected into a stable structure. quadrilateral structure.
  • FIG. 16 shows a top view of another optical cage assembly provided by an embodiment of the present application.
  • the difference between FIG. 16 and FIG. 15 is that the fourth support frame 14 is connected to the middle part of the second support frame 12 and the middle part of the first support frame 11 15 , the hanging distance of the mounting surface S2 of the optical cage 20 in the y-axis direction is shortened, the middle part is effectively supported, and no additional structure is added on the basis of FIG. 15 .
  • the fourth support frame 14 can also be connected to other positions of the second support frame 12 and the first support frame 11 , as long as the two are connected.
  • FIG. 17 shows a top view of another optical cage assembly provided by an embodiment of the present application.
  • the base 10 further includes a fifth support frame 15
  • the fifth support frame 15 is connected to the third support frame 13 and the middle of the fourth support frame 14 to further increase the stability of the base 10 .
  • the third support frame 13 can be moved so that one end of the first support frame 11 is connected to the middle, and the other end is connected to the middle of the second support frame 12 to form an "H"-shaped structure;
  • one end of the third support frame 13 is connected to one end of the first support frame 11 in the positive y-axis direction and one end of the second support frame 12 in the negative y-axis direction.
  • the base can also take the following forms:
  • FIG. 18 shows a top view of another optical cage assembly provided by the embodiment of the present application.
  • the base 10 includes a plurality of supporting columns K, and these supporting columns K are evenly distributed under the installation surface S2 to form the optical cage 20 Provides more even support. But this is only an example, and the distribution manner of the support columns K may also be distributed according to the structural strength of the optical cage 20 .
  • an embodiment of the present application also provides an optical communication device, the optical communication device comprising:
  • the base is fixed on the surface of the circuit board, and the mounting surface of the optical cage is detachably connected to the base.
  • the base 10 and the device are first mounted on the surface of the circuit board 30 by SMT, AOI optical detection is performed on the device in the blocking area S1 , and then the optical cage 20 is fixed on the base 10 .
  • AOI optical inspection can be performed on the devices that may be blocked by the optical cage 20 before installation, which is beneficial to ensure the mounting stability of the devices and improve the performance of optical communication equipment.

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  • Mounting Components In General For Electric Apparatus (AREA)
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Abstract

本申请提供了一种光笼子组件及光通信设备，该光笼子组件包括：光笼子和底座，其中，光笼子具有安装面，底座用于与安装面连接；在将该光笼子组装于电路板上时，可以先将器件和底座采用SMT技术固定于电路板表面，对器件和底座进行光学检测后，再将光笼子固定于底座上，以上过程保证了光笼子与电路板之间的器件能够进行光学检测，有利于保证器件的贴装质量；且底座在参考面上的正投影面积小于安装面的面积，其中，参考面为安装面的所在平面，可避免底座所占用电路板上的面积小于被光笼子遮挡的电路板上安装器件的面积，有效保证电路板表面的面积利用率。

Description

一种光笼子组件及光通信设备
相关申请的交叉引用
本申请要求在2020年06月28日提交中国专利局、申请号为202010601065.7、申请名称为“一种光笼子组件及光通信设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到光通信技术领域，尤其涉及到一种光笼子组件及光通信设备。
背景技术
光模块作为实现电信号和光信号转换的重要模块，在路由器和交换机等光通信设备中被广泛应用。光通信设备的电路板上固定有光笼子，光模块可插拔的配合于光笼子的插槽中。
为了增加电路板的面积利用率，通常还会在电路板与光笼子之间布置一些器件，例如，给光模块供电的电源相关器件。
当采用表面贴装技术(surface mount technology，SMT)将装配光笼子时，器件和光笼子需要同时焊接到电路板上，光笼子下面的器件被光笼子遮挡，无法进行光学检测。
发明内容
本申请提供了一种光笼子组件及光通信设备，以在装配光笼子时，方便检测光笼子与电路板之间的器件。
第一方面，提供了一种光笼子组件，该光笼子组件包括：光笼子和底座，其中，所述光笼子具有安装面，所述底座用于与所述安装面连接；在将该光笼子组装于电路板上时，可以先将器件和底座采用SMT技术固定于电路板表面，对器件和底座进行光学检测后，再将光笼子固定于底座上，以上过程保证了光笼子与电路板之间的器件能够进行光学检测，有利于保证器件的贴装质量；且所述底座在参考面上的正投影面积小于所述安装面的面积，其中，所述参考面为所述安装面的所在平面，可避免底座所占用电路板上的面积小于被光笼子遮挡的电路板上安装器件的面积，有效保证电路板表面的面积利用率。
所述底座的形式可以有多种，在一个具体的实施方式中，所述底座可为框架结构。
在一个具体的可实施方式中，所述安装面包括相对设置的第一侧边和第二侧边，以及相对设置第三侧边和第四侧边，其中，所述第三侧边连接所述第一侧边的一端和所述第二侧边的一端，所述第四侧边连接所述第一侧边的另一端和所述第二侧边的另一端；所述底座包括用于沿所述第一侧边延伸的第一支撑架，以及用于沿所述第二侧边延伸的第二支撑架，以为光笼子提供基本稳定的支撑，同时少占用电路板表面的面积。
在一个具体的实施方式中，所述底座还可包括第三支撑架，其中，所述第三支撑架连接所述第一支撑架和所述第二支撑架。以提高底座的稳定性。
在一个具体的实施方式中，所述第三支撑架可沿所述第三侧边延伸；或者，所述第三 支撑架连接所述第一支撑架的中部和所述第二支撑架的中部。
在一个具体的实施方式中，所述底座还可包括第四支撑架，其中，所述第四支撑架连接所述第一支撑架和所述第二支撑架，以进一步提高底座的稳定性。
在一个具体的实施方式中，所述第四支撑架可连接所述第一支撑架的中部和所述第二支撑架的中部，以提高底座稳定性的同时，降低光笼子的悬空距离；或者，所述第四支撑架沿所述第四侧边延伸，以使底座形成稳定的四边形结构。
在一个具体的实施方式中，所述底座还可包括第五支撑架，其中，所述第五支撑架连接所述第三支撑架的中部和所述第四支撑架的中部，以进一步提高底座的稳定性。
底座除了采用框架结构外，在一个具体的实施方式中，还可以是所述底座包括间隔分布的多个支撑柱。
在一个具体的实施方式中，所述多个支撑柱均匀分布于所述安装面，以对光笼子提供均匀的支撑。
在一个具体的实施方式中，所述安装面还可设有多个压接脚，每个压接脚与所述底座插接配合。
压接脚与底座插接的形式可以有多种，在一个具体的实施方式中，所述底座具有与所述多个压接脚一一对应的多个压接孔，其中，所述底座内形成有与每个压接孔对应的容纳腔；每个压接脚包括第一连接段和阻挡部，每个所述第一连接段的一端与所述安装面连接、另一端与对应的阻挡部连接；每个所述压接脚的阻挡部用于通过对应的压接孔插接至对应的容纳腔中、并用于防止对应的压接脚从对应的压接孔中滑出。
在一个具体的实施方式中，每个所述阻挡部具有导向结构，以方便将阻挡部进入压接孔。
压接孔的位置可以是多种情况，在一个具体的实施方式中，所述底座具有用于背离电路板的第一表面和用于朝向电路板的第二表面，以及，连接所述第一表面和所述第二表面的连接面；每个压接孔由所述容纳腔延伸至所述第一表面；每个第一连接段沿垂直于所述安装面的方向延伸。
在另一个具体的实施方式中，所述底座具有用于背离电路板的第一表面和用于朝向电路板的第二表面，以及，连接所述第一表面和所述第二表面的连接面；每个所述压接孔由所述容纳腔延伸至一个所述连接面；每个第一连接段与对应的阻挡部之间还设有第二连接段，所述第二连接段的延伸方向与所述安装面的夹角为锐角。
在一个具体的实施方式中，每个压接脚具有一个或多个挂孔，所述挂孔的开口方向平行于所述安装面；所述底座的连接面设有与所述一个或多个挂孔一一对应的多个凸起部，每个凸起部用于插接于对应的挂孔中。
在一个具体的实施方式中，每个凸起部的用于背离电路板的面形成导向面，以对压接脚导向。
第二方面，提供一种光通信设备，该光通信设备包括：
电路板和上述任一技术方案提供的光笼子组件，所述底座固定于所述电路板表面，所述光笼子的安装面与所述底座连接。在将光笼子组装于电路板上时，可以先将器件和底座采用SMT技术固定于电路板表面，对器件和底座进行光学检测后，再将光笼子固定于底座上，以上过程保证了光笼子与电路板之间的器件能够进行光学检测，有利于保证器件的贴装质量，提高光通信设备的稳定性。
附图说明
图1表示出了本申请实施例提供的光笼子组件可以应用的场景示意图；
图2表示出图1中光笼子20的仰视图；
图3表示出了图1中的底座10安装于电路板30上时的示意图；
图4表示出图1中光笼子组件01的俯视图；
图5表示出了图1中A-A方向的剖视图的局部示意图；
图6表示出图5中光笼子20与第二支撑架12装配之前的示意图；
图7表示出了本申请实施例提供的光笼子组件中光笼子与底座另一种配合方式的局部结构示意图；
图8表示出图7中光笼子20与第二支撑架12装配之前的示意图；
图9表示出了光笼子与底座采用图7所示的固定方式时的俯视图；
图10表示出了本申请实施例提供的光笼子组件中光笼子与底座另一种配合方式的局部结构示意图；
图11表示出图10所示光笼子组件的侧视图；
图12表示出了图10所示的光笼子组件中光笼子20装配于底座10之前的示意图；
图13表示出了光笼子与底座采用图10所示的固定方式时的俯视图；
图14表示出了本申请实施例提供的另一种光笼子组件的俯视图；
图15表示出了本申请实施例提供的另一种光笼子组件的俯视图；
图16表示出了本申请实施例提供的另一种光笼子组件的俯视图；
图17表示出了本申请实施例提供的另一种光笼子组件的俯视图；
图18表示出了本申请实施例提供的另一种光笼子组件的俯视图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的光笼子组件，首先说明一下其应用的场景，该光笼子组件可以应用于数据通信系统中的路由器和交换机中等光通信设备。示例性地，图1表示出了本申请实施例提供的光笼子组件可以应用的场景示意图，具体仅表示出了光通信设备中的电路板30和光笼子组件01，在具体产品中，可以采用壳体(图中未示出)将上述电路板30和光笼子组件01封装起来。其中，光笼子组件01包括底座10和光笼子20，光笼子20通过底座10固定于电路板30的上。
图2表示出图1中光笼子20的仰视图(z轴正方视图)。示例性地，结合图1和图2，光笼子20包括相对设置的顶壁21和底壁22(用于靠近电路板30设置的壁)，顶壁21和底壁22之间设有多个间隔分布的侧壁23，以将顶壁21和底壁22之间分割为多个并排设置的、用于插置光模块的插槽，底壁22背离顶壁21的面称为安装面(即用于与底座10安装的面，记为S2)；光笼子20的顶壁21、底壁22和侧壁23可以采用钢或者铜等散热好、且具有一定弹性的材质制备。安装面S2具有第一侧边a、第二侧边b、第三侧边c和第四侧边d，其中，第一侧边a和第二侧边b相对且平行设置，第三侧边c和第四侧边d相对且平行设置，第三侧边c连接第一侧边a的y轴正方向上的一端和第二侧边b的y轴 正方向上的一端，第四侧边d连接第一侧边a的y轴负方向上的一端和第二侧边b的y轴负方向上的一端。沿着第一侧边a的内侧、第二侧边b的内侧，以及，第三侧边c的内侧均分别设有多个间隔分布的压接脚24。
图3表示出了图1中的底座10安装于电路板30上时的示意图。示例性地，请参考图3，底座10包括第一支撑架11、第二支撑架12和第三支撑架13，且三者均呈条状结构，且横截面呈方形(仅是示例性地，并不限于方形，也可以是正六边形等，只要能够起到支撑作用即可)，其中，第一支撑架11和第二支撑架12相对且平行设置，如均沿着y轴方向延伸，而第三支撑架13连接第一支撑架11的y轴正方向上的一端和第二支撑架12的y轴正方向上的一端。底座10的各部分结构可以采用钢和铜等具有一定支撑强度的材料。
图4表示出图1中光笼子组件01的俯视图，为表达清楚光笼子20和底座10的相对位置关系，以虚线表示光笼子20的轮廓。参考图4，第一支撑架11沿着安装面S2的第一侧边a延伸，第二支撑架12沿着第二侧边b延伸，第三侧壁13沿着第三侧边c延伸。
图5表示出了图1中A-A方向的剖视图的局部示意图，具体表示出了光笼子20与第二支撑架12配合的示意图，请参考图5，第二支撑架12具有相对设置的第一表面m1(用于背离电路板30的面)和第二表面m2(用于朝向电路板30的面)，以及，连接第一表面m1和第二表面m2的连接面m3和连接面m4。第二支撑架12内部中空，形成容纳腔K1，容纳腔K1通过多个压接孔h1连通至第一表面m1，且压接孔h1的外径小于容纳腔K1沿x轴的尺寸。压接脚24包括第一连接段24a和阻挡部24b，第一连接段24a的一端与安装面S2固定连接、另一端与阻挡部24b连接，且阻挡部24b的外径大于第一连接段24a的外径。自第二表面m2至第一表面m1的方向(即z轴正方向)，在阻挡部24b的横截面积逐渐增加，形成一个圆台结构。压接孔h1的外径介于阻挡部24b的最大外径和最小外径之间。压接脚24的材质可以选择钢或铜等具有一定弹性的材质。
图6表示出图5中光笼子20与第二支撑架12装配之前的示意图。示例性地，请参考图5，在将压接脚24向第二支撑架12装配时，使压接脚24与对应的压接孔h1对准，并沿z轴负方向移动光笼子20，由于阻挡部24b靠近第二支撑架12的一端外径较小，可以先插入到压接孔h1内，继续向下压光笼子20，由于阻挡部24b和第二支撑架12的材料弹性，阻挡部24b将压接孔h1撑开，进入到容纳腔K1内，底座10与光笼子20实现可拆卸连接，上述阻挡部24b的圆台结构倾斜面形成导向结构，所谓“导向结构”即能够与压接孔h1的内壁滑动接触、并引导阻挡部24b进入压接孔h1内的结构。但是，由于阻挡部24b靠近第一连接段24a的一端尺寸比压接孔h1大，阻挡部24b被牢牢固定于容纳腔K1内，光笼子20不易与底座10分离。
结合图1至图3，与第二支撑架12类似地，第一支撑架11和第三支撑架13具有与第二支撑架12相同的结构，并且各部分名称(如第一表面、第二表面、连接面、容纳槽和压接孔)采用相同的名称，表达相同的含义。为此，上述第一表面、第二表面和连接面也分别称为底座10的第一表面、第二表面和连接面，即底座10具有相对设置的第一表面和第二表面，以及，连接第一表面和第二表面的连接面。光笼子20的安装面S2上的多个压接脚24分别与底座10的第一表面(第一支撑架11、第二支撑架13和第三支撑架13的第一表面)的压接孔一一对应配合，且配合方式参考图5和图6中压接脚24与第二支撑架12的配合方式。
下面结合图1至图3示例性地说明采用SMT技术在电路板30表面焊接器件和光笼子 组件01的过程：首先，在电路板30预安装底座10的表面印刷锡膏；其次，参考图3，点胶，将底座10和待焊接器件利用印刷好的锡膏贴装在电路板30的表面的预定位置，并固化，在图3中，底座10在电路板30的表面围成遮挡区域S1，待焊接器件具体可贴装于遮挡区域S1范围内、以及底座10以外的区域；然后，利用回流焊等焊接工艺将待焊接器件和底座10焊接于电路板30的表面；接着，利用自动光学检测(automated optical inspection，AOI)技术对底座10和电路板30表面的器件进行检测，由于遮挡区域S1范围内的器件暂未被光笼子20遮挡，因此，可以对该区域内的器件做光学检测；接着，利用光笼子20的压接脚24与底座10的压接孔h1可拆卸配合，配合方式参考前述图5和图6的描述，此时，光笼子20在电路板30上的投影覆盖遮挡区域S1。并且，由于已经完成了对遮挡区域S1中的器件进行自动光学检测，此时将光笼子20再对遮挡区域S1进行遮挡已经对器件的检测没有影响。其中，以安装面S2的所在平面为参考面，底座10在该参考面上的正投影面积小于安装面S2的面积，安装面S2基本平行或者完全平行于电路板30的表面，如此，可避免因提前在电路板30安装底座10，而导致的底座10占用的面积大于电路板30上因光笼子20遮挡而无法检测器件的面积，从而，确保在设置了底座10之后，有效提高电路板30表面的器件布置面积利用率。
除了采用图5和图6对应实施例提供的压接脚24与底座10配合的方式外，还可以采用其它方式，只要压接脚与底座插接配合即可，下面举例进行说明。
图7表示出了本申请实施例提供的光笼子组件中光笼子与底座另一种配合方式的局部结构示意图，请参考图7，与图5和图6所对应的实施例的区别在于，压接脚24包括第一连接段24a、第二连接段24c和阻挡部24b，其中，第一连接段24a的一端与安装面S2连接、另一端与第二连接段24c连接，第二连接段24c远离第一连接段24a的一端与阻挡部24b连接，其中，示例性地，第一连接段24a沿垂直于安装面S2的方向延伸，第二连接段24b沿与安装面S2倾斜的方向延伸，具体第二连接段24b的延伸方向可以与安装面S2之间呈锐角，例如，该锐角可以介于45°至75°之间。
图8表示出图7中光笼子20与第二支撑架12装配之前的示意图，下面参考图8，对压接脚24与第二支撑架12配合的过程进行说明。使阻挡部24b贴近连接面m3，并向下推动光笼子20，由于第二连接段24c在自然未挤压状态下与安装面S2之间呈锐角，第二连接段24c在连接面m3的挤压下发生弹性变形，而此时，阻挡部24b的x轴方向上的尺寸小于z轴方向上的尺寸，当阻挡部24b的底面t1下滑到连接面m3的压接孔h2时，阻挡部24b的底面t1一端在第二连接段24c的挤压下向压接孔h2内撬动，继续下压光笼子20，阻挡部24b的底面t1与压接孔h2的侧壁接触，阻挡部24b绕y轴旋转，使阻挡部24b的底面t1朝向连接面m4，阻挡部24b旋转后可以滑动进压接孔h2内。再参考图7，阻挡部24b滑动进容纳腔K1内，阻挡部24b又回复至底面t1朝向第二表面m2，第二连接段24c的延伸方向仍然与安装面S2呈锐角，此时，阻挡部24b的z轴方向上的尺寸大于压接孔h2的内径，阻挡部24b可以卡在第二支撑架12的连接面m3的对应的侧壁内面上，避免压接脚24整体从压接孔h2中滑出。
图9表示出了光笼子与底座采用图7所示的固定方式时的俯视图，其中，仅以虚线框表示出光笼子20的轮廓，以说明其位置。请参考图9，在光笼子20的安装面S2的第一侧边a、第二侧边b、第四侧边d均有设置压接脚24，且第一侧边a上的每个压接脚24都和第二侧边b上的一个压接脚24都相对设置，第一支撑架11上的压接孔和第二支撑架12 上的压接孔相对设置。从而，有利于向下移动光笼子20时，两侧相对设置的压接脚24受力平衡。
图10表示出了本申请实施例提供的光笼子组件中光笼子与底座另一种配合方式的局部结构示意图，图11表示出图10所示光笼子组件的侧视图(x轴负方向视图)。请结合图10和图11，图10所示的光笼子组件与图5所示的光笼子组件的区别在于，在图10中，压接脚24可以是沿安装面S2的第二侧边b延伸且垂直于安装面S2的板状结构，沿着压接脚24的厚度方向开设有贯穿压接脚24的挂孔h3，挂孔h3的开口方向平行于安装面S2。底座10的第二支撑架的连接面m4设有凸出于连接面m4的凸起部12t，凸起部12t用于背离电路板的面形成一个倾斜的导向面G1。
图12表示出了图10所示的光笼子组件中光笼子20装配于底座10之前的示意图，结合图10至图12说明，光笼子20装配于底座10的过程：首先，使压接脚24大致对准凸起部12t，向下(z轴负方向)移动光笼子20，压接脚24的底端与凸起部12t的导向面G1接触，继续向下移动光笼子，压接脚24被导向面G1向x轴正方向撑开，待挂孔h3与凸起部12t对齐时，凸起部12t伸入挂孔h3内，挂孔h3的内壁将凸起部12t卡住，使凸起部12t与压接脚24相对固定，实现可拆卸连接。其中，导向面G1的存在使得即便压接脚24的x方向上的侧面没有与凸起部12t的背离连接面m3的面对齐，也能使压接脚24顺利下移，并最终使凸起部12t与挂孔h3配合。
图13表示出了光笼子与底座采用图10所示的固定方式时的俯视图，其中，仅以虚线框表示出光笼子20的轮廓，以说明其位置。请参考图13，在光笼子20的安装面S2的第一侧边a、第二侧边b、第四侧边d均有设置压接脚24，且第一侧边a上的每个压接脚24都和第二侧边b上的一个压接脚24都相对设置，且第一侧边a处的压接脚24位于第一支撑架11背离第二支撑架12的面，第二侧边b处的压接脚24位于第二支撑架12背离第一支撑架11的面，第一支撑架11上的压接孔和第二支撑架12上的压接孔相背离(仅是示例性的，也可以相对)设置。从而，有利于向下移动光笼子20时，两侧相对设置的压接脚24受力平衡。
以上图4、图9和图13对应的实施例所采用的底座10的形式仅仅是示例性地，该底座10只要是框架结构即可，所谓“框架结构”是指采用条状结构在同一平面上拼接而成的结构。采用框架结构作为底座，在为光笼子20提供稳定支撑的同时，可以尽可能减少底座10占用电路板30(图1)的面积。下面以附图示例说明底座10其他可能的框架结构形式。
图14表示出了本申请实施例提供的另一种光笼子组件的俯视图，其中，仅以虚线框表示光笼子20的轮廓(下同，不再赘述)。图14与图4的区别在于，取消第三支撑架13，也能够为光笼子20提供基本稳定的支撑，并且能够在电路板30上空出更多面积以供安装器件。
图15表示出了本申请实施例提供的另一种光笼子组件的俯视图，图15与图4的区别在于，底座10还包括第四支撑架14，其中，第四支撑架14连接第二支撑架12的远离第三支撑架13的一端和第一支撑架11远离第三支撑架13的一端，也就是第四支撑架14沿着第四侧边d延伸，以使底座10连成一个稳固的四边形结构。
图16表示出了本申请实施例提供的另一种光笼子组件的俯视图，图16与图15的区别在于，第四支撑架14连接第二支撑架12的中部和第一支撑架11的中部，与图15的形 式相比，光笼子20的安装面S2在y轴方向上悬空的距离缩短，中部得到有效支撑，并且没有在图15的基础上额外增加结构。此外，第四支撑架14还可以连接第二支撑架12和第一支撑架11的其他位置，只要将两者相连即可。
图17表示出了本申请实施例提供的另一种光笼子组件的俯视图，图17与图15的区别在于，底座10还包括第五支撑架15，第五支撑架15连接第三支撑架13的中部和第四支撑架14的中部，以进一步增加底座10的稳定性。
此外，还可以在图4的基础上，将第三支撑架13挪移，使其一端第一支撑架11中部连接、另一端与第二支撑架12的中部连接，以形成“H”形结构；或者，使第三支撑架13的一端与第一支撑架11的y轴正方向上的一端和第二支撑架12的y轴负方向上的一端连接。
底座除了采用框架结构为，还可以采用以下形式：
图18表示出了本申请实施例提供的另一种光笼子组件的俯视图，在图18中，底座10包括多个支撑柱K，这些支撑柱K均匀分布于安装面S2下，以为光笼子20提供较为均匀的支撑。但这仅是示例性地，支撑柱K的分布方式也可以根据光笼子20的各处结构强度进行分布。
以上图14至图18的底座10的形式不仅限于采用图5中的光笼子20与底座10的固定方式，还可以采用图7中的形式、图10中的形式或者其他形式连接。
基于相同的技术构思，本申请实施例还提供了一种光通信设备，该光通信设备包括：
电路板和上述任一实施例提供的光笼子组件，底座固定于电路板表面，光笼子的安装面与底座可拆卸连接。
以图1至图6为例，底座10和器件先通过SMT方式贴装于电路板30的表面，对遮挡区域S1处的器件进行AOI光学检测，再将光笼子20固定于底座10上。以上过程可以在采用SMT技术贴装器件的前提下在安装光笼子20以前可能被其遮挡的器件先进行AOI光学检测，有利于保障器件的贴装稳定性，提升光通信设备的性能。
另外，本申请实施例的各附图中的部件均只为了表示光笼子组件和光通信设备的工作原理，并不真实反映各部件的实际尺寸关系。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (18)

  1. 一种光笼子组件，其特征在于，包括：
    光笼子，所述光笼子具有安装面；
    底座，用于与所述安装面连接；
    且所述底座在参考面上的正投影面积小于所述安装面的面积，其中，所述参考面为所述安装面的所在平面。
  2. 根据权利要求1所述的光笼子组件，其特征在于，所述底座为框架结构。
  3. 根据权利要求2所述的光笼子组件，其特征在于，所述安装面包括相对设置的第一侧边和第二侧边，以及相对设置的第三侧边和第四侧边，其中，所述第三侧边连接所述第一侧边的一端和所述第二侧边的一端，所述第四侧边连接所述第一侧边的另一端和所述第二侧边的另一端；
    所述底座包括用于沿所述第一侧边延伸的第一支撑架，以及用于沿所述第二侧边延伸的第二支撑架。
  4. 根据权利要求3所述的光笼子组件，其特征在于，所述底座还包括第三支撑架，其中，所述第三支撑架连接所述第一支撑架和所述第二支撑架。
  5. 根据权利要求4所述的光笼子组件，其特征在于，所述第三支撑架沿所述第三侧边延伸；或者，
    所述第三支撑架连接所述第一支撑架的中部和所述第二支撑架的中部。
  6. 根据权利要求3所述的光笼子组件，其特征在于，所述底座还包括第四支撑架，其中，所述第四支撑架连接所述第一支撑架和所述第二支撑架。
  7. 根据权利要求6所述的光笼子组件，其特征在于，所述第四支撑架连接所述第一支撑架的中部和所述第二支撑架的中部；或者，
    所述第四支撑架沿所述第四侧边延伸。
  8. 根据权利要求6所述的光笼子组件，其特征在于，所述底座还包括第五支撑架，其中，所述第五支撑架连接所述第三支撑架的中部和所述第四支撑架的中部。
  9. 根据权利要求1所述的光笼子组件，其特征在于，所述底座包括间隔分布的多个支撑柱。
  10. 根据权利要求9所述的光笼子组件，其特征在于，所述多个支撑柱均匀分布于所述安装面。
  11. 根据权利要求1至10任一项所述的光笼子组件，其特征在于，所述安装面设有多个压接脚，每个压接脚与所述底座插接配合。
  12. 根据权利要求11所述的光笼子组件，其特征在于，所述底座具有与所述多个压接脚一一对应的多个压接孔，其中，所述底座内形成有与每个压接孔对应的容纳腔；
    每个压接脚包括第一连接段和阻挡部，每个所述第一连接段的一端与所述安装面连接、另一端与对应的阻挡部连接；
    每个所述压接脚的阻挡部用于通过对应的压接孔插接至对应的容纳腔中、并用于防止对应的压接脚从对应的压接孔中滑出。
  13. 根据权利要求12所述的光笼子组件，其特征在于，每个所述阻挡部具有导向结构。
  14. 根据权利要求12或13所述的光笼子组件，其特征在于，所述底座具有用于背离电 路板的第一表面和用于朝向电路板的第二表面，以及，连接所述第一表面和所述第二表面的连接面；
    每个压接孔由所述容纳腔延伸至所述第一表面；
    每个第一连接段沿垂直于所述安装面的方向延伸。
  15. 根据权利要求12或13所述的光笼子组件，其特征在于，所述底座具有用于背离电路板的第一表面和用于朝向电路板的第二表面，以及，连接所述第一表面和所述第二表面的连接面；
    每个所述压接孔由所述容纳腔延伸至一个所述连接面；
    每个第一连接段与对应的阻挡部之间还设有第二连接段，所述第二连接段的延伸方向与所述安装面的夹角为锐角。
  16. 根据权利要求11所述的光笼子组件，其特征在于，每个压接脚具有一个或多个挂孔，所述挂孔的开口方向平行于所述安装面；
    所述底座的连接面设有与所述一个或多个挂孔一一对应的多个凸起部，每个凸起部用于插接于对应的挂孔中。
  17. 根据权利要求16所述的光笼子组件，其特征在于，每个凸起部中背离电路板的面形成导向面。
  18. 一种光通信设备，其特征在于，包括：
    电路板；
    权利要求1至17任一项所述的光笼子组件，所述底座固定于所述电路板表面，所述光笼子的安装面与所述底座连接。
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