WO2021259220A1 - 位置检测判断装置、校准装置及方法 - Google Patents

位置检测判断装置、校准装置及方法 Download PDF

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Publication number
WO2021259220A1
WO2021259220A1 PCT/CN2021/101377 CN2021101377W WO2021259220A1 WO 2021259220 A1 WO2021259220 A1 WO 2021259220A1 CN 2021101377 W CN2021101377 W CN 2021101377W WO 2021259220 A1 WO2021259220 A1 WO 2021259220A1
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WO
WIPO (PCT)
Prior art keywords
positioning pin
position information
real
standard
silicon wafer
Prior art date
Application number
PCT/CN2021/101377
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English (en)
French (fr)
Inventor
刘锦坤
Original Assignee
长鑫存储技术有限公司
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Publication date
Application filed by 长鑫存储技术有限公司 filed Critical 长鑫存储技术有限公司
Priority to US17/598,801 priority Critical patent/US20220415722A1/en
Publication of WO2021259220A1 publication Critical patent/WO2021259220A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/042—Calibration or calibration artifacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Definitions

  • the present invention relates to semiconductor equipment, in particular to a position detection and judgment device, a calibration device and a method.
  • FOUP Front Opening Unified Pod
  • the first aspect of the present application provides a position detection and judgment device, including:
  • the standard positioning pin position limiting component is used to define the standard position information of the positioning pin of the load port of the silicon wafer carrying box;
  • the positioning pin position detection component is used to detect the real-time position information of the positioning pin of the load port of the silicon wafer carrying box;
  • the judgment module is used to obtain the standard position information and the real-time position information, and judge whether the position of the positioning pin of the load port of the silicon wafer carrier box is accurate according to the standard position information and the real-time position information.
  • the second aspect of the present application provides a position calibration device, including:
  • the calibration component is used to move and change the position of the positioning pin of the load port of the silicon wafer carrying box according to the obtained standard position information and the real-time position information, so that the difference between the standard position information and the real-time position information Less than or equal to the preset accuracy threshold.
  • the third aspect of the present application provides a position judgment and calibration method, including the following steps:
  • the calibration component is controlled to move and change the position of the load port of the silicon wafer carrier Position such that the difference between the standard position information and the real-time position information is less than or equal to a preset accuracy threshold.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a position detection and judgment device provided in an embodiment of this application.
  • Fig. 2 is a schematic diagram of a left side view of the position detection and judgment device shown in Fig. 1.
  • FIG. 3 is a schematic structural diagram of a positioning pin position detection component provided in an embodiment of the application.
  • Figure 4 is a schematic structural diagram of a positioning pin position detection component provided in an embodiment of the application.
  • FIG. 5a is a schematic diagram of a three-dimensional structure of a position detection and judgment device provided in an embodiment of this application.
  • Fig. 5b is a schematic diagram of the working interface of the display screen shown in Fig. 5a.
  • FIG. 6a is a schematic structural diagram of a position calibration device provided in an embodiment of this application.
  • Fig. 6b is a schematic structural diagram of a position calibration device provided in another embodiment of the application.
  • FIG. 7 is a schematic flowchart of a method for position detection and judgment provided in an embodiment of this application.
  • FIG. 8 is a schematic flowchart of a position calibration method provided in an embodiment of this application.
  • FIG. 9 is a schematic flowchart of a position calibration method provided in an embodiment of this application.
  • FIG. 10 is a schematic flowchart of a position calibration method provided in an embodiment of this application.
  • FIG. 11 is a schematic structural diagram of a position calibration system provided in an embodiment of this application.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction relationship between two components.
  • installed can be a fixed connection or a detachable connection , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction relationship between two components.
  • remote end refers to the end far away from the user
  • proximal end refers to the end closer to the user
  • the limiting component 10 is used to limit the standard position information of the positioning pin of the load port of the silicon wafer carrier; the positioning pin position detection component 20 is used to detect the real-time position information of the positioning pin of the load port of the silicon wafer carrier; the judgment module 30 is used to obtain the standard Position information and the real-time position information, and determine whether the position of the positioning pin of the load port of the silicon wafer carrier box is accurate according to the standard position information and the real-time position information.
  • the standard positioning pin position limiting component 10 is provided to limit the standard position information of the positioning pin of the load port of the silicon wafer carrier, and the positioning pin position detection component 20 is provided to detect silicon.
  • the real-time position information of the positioning pin of the load port of the film carrier box, and the standard position information of the positioning pin of the load port of the carrier box defined by the standard positioning pin position limiting component 10 is used as the reference standard information of the real-time position information of the positioning pin, so that the judgment module 30 can be based on
  • the standard position information and the real-time position information determine whether the position of the positioning pin of the load port of the silicon wafer carrier box is accurate, so as to adjust the position of the positioning pin of the load port of the carrier box, and avoid the inaccurate position of the silicon wafer carrier box. Interference of the equipment or abnormal operation occurs.
  • the standard positioning pin position limiting component 10 includes a bearing assembly 11 and a positioning pin matching structure 12, and the positioning pin matching structure 12 is provided on the bearing assembly 11.
  • the positioning pin matching structure 12 may be provided on the surface of the bearing assembly 11 to define the standard position of each positioning pin.
  • a handle 13 can also be provided on the surface of the carrier assembly 11 to facilitate the transportation or movement of the carrier assembly 11 and drive the standard positioning pin position limiting component 10 to move to accurately define the standard position of each positioning pin.
  • the standard position of each of the positioning pins is defined by setting the positioning pin matching structure 12, so that the calibration component can obtain the calibration target position information, and it is convenient for the calibration component to realize the calibration of the silicon wafer. Calibration of the positioning pin position of the load port of the carrying box.
  • the number and position distribution of the positioning pin matching structure on the carrier assembly 11 can be set to correspond to the number and position distribution of the positioning pins of the load port of the silicon wafer carrier box, it is convenient to make the positioning pin matching structure on the carrier assembly 11 through the carrier assembly 11 12 Respectively contact and cover the positioning pins of the load port of the silicon wafer carrier box, and at the same time define the standard position of each positioning pin of the load port of the silicon wafer carrier box, which facilitates the calibration operation and improves the accuracy of the positioning pin position distribution after calibration Therefore, the accuracy of the positioning of the silicon wafer carrier box is effectively improved.
  • the positioning pin position detection component 20 includes a movable body 21 and a piezoelectric sensor 22.
  • the movable body 21 is cylindrical, including a proximal end 20a and a distal end 20a.
  • the piezoelectric sensor 22 is arranged at the distal end 20b of the movable body for detecting real-time position information of the positioning pin; wherein the movable body 21 is set to move in a preset direction to drive the piezoelectric sensor 22 contacts the positioning pin (not shown) of the load port of the silicon wafer carrying box, so that the piezoelectric sensor detects the real-time position information of the positioning pin.
  • the movable body 21 moves in a preset direction to drive the piezoelectric sensor 22 to contact the positioning pin, so as to detect the real-time position of the positioning pin based on the piezoelectric sensor.
  • Information it is convenient to move the positioning pin toward the direction close to the standard position, so as to realize the accurate calibration of the positioning pin position and effectively improve the efficiency of the calibration.
  • the positioning pin position detection component 20 further includes a positioning rail 23, the positioning rail 23 is used to limit the moving position and direction of the movable body 21; wherein, the movable The body 21 is arranged to move along the positioning rail 23 to drive the piezoelectric sensor 22 to contact and cover the upper surface of the positioning pin, so that the piezoelectric sensor 22 detects the image information on the upper surface of the positioning pin.
  • the standard position information of the positioning pin defined by the standard positioning pin position limiting component is relatively determined, thereby facilitating the approach of the positioning pin Move in the direction of the standard position to achieve accurate calibration of the positioning pin position and effectively improve the efficiency of calibration.
  • the position detection and judgment device further includes a display screen 40, which is connected to the judgment module 30, and the display screen 40 is used to display the standard position information. 41. At least one of the real-time position information 42 or the real-time error information 43 to improve the visibility of the calibration process.
  • the positioning pin matching structure 12 can be provided with a hollow sleeve 121 for covering the load port of the silicon wafer carrier box.
  • the positioning pin to limit the standard position of the positioning pin.
  • the positioning pin position detection component 20 it is possible to set the positioning pin position detection component 20 to be cylindrical, and the piezoelectric sensor 22 is arranged at the distal end 20b of the cylindrical movable body for detecting the real-time position information of the positioning pin; a slide is provided on the inner wall of the hollow sleeve 121 Slot (not shown); a positioning rail 23 is provided on the side wall of the cylindrical movable body 21, the shape and size of the positioning rail 23 can match the shape and size of the chute, so that the cylindrical movable body 21 can Move along the position and direction defined by the chute, and drive the piezoelectric sensor 22 to contact the positioning pin to detect the real-time position information of the positioning pin; the standard position information 41 defined by the sleeve 121 and the detection by the piezoelectric sensor 22 can be obtained
  • the real-time position information 42 is used to display the standard position information 41 and the real-time position information 42 on the display screen 40 in real time.
  • the real-time position image detected by the piezoelectric sensor 22 and the standard position image defined by the sleeve 121 can be displayed on the display screen 40, and the judgment device 30 can compare the real-time position image and the standard position image to obtain the deviation of the real-time position image.
  • the error of the standard position image, and the real-time position image, the standard position image and the error are displayed on the display screen 40.
  • the judging device 30 may be configured to obtain the real-time error information 43 of the positioning pin position by obtaining the distance value between the center point of the real-time position image and the center point of the standard position image.
  • a position calibration device including:
  • the calibration component is used to move and change the position of the positioning pin of the load port of the silicon wafer carrying box according to the obtained standard position information and the real-time position information, so that the difference between the standard position information and the real-time position information Less than or equal to the preset accuracy threshold.
  • the position calibration device includes a standard positioning pin position limiting component 10, a positioning pin position detecting component 20, and a calibration component 50.
  • the standard positioning pin position limiting component 10 It is used to define the standard position information of the positioning pin of the load port of the silicon wafer carrier; the positioning pin position detection component 20 is used to detect the real-time position information of the positioning pin of the load port of the silicon wafer carrier; the calibration component 50 is used to obtain the standard position The information and the real-time position information move and change the position of the positioning pin of the load port of the silicon wafer carrying box, so that the difference between the standard position information and the real-time position information is less than or equal to a preset accuracy threshold.
  • the standard positioning pin position limiting component 10 is set to limit the standard position information of the positioning pin of the load port 200 of the wafer carrier box, and the positioning pin position detecting component 20 is set to detect the real-time position of the positioning pin.
  • the standard position information of the positioning pin defined by the standard positioning pin position limiting component 10 is used as the reference standard information of the real-time position information of the positioning pin, so that the calibration component 50 can compare the standard position information with the real-time position information As a result, the position of the positioning pin is moved and changed so that the difference between the standard position information and the real-time position information is gradually reduced, when the difference between the standard position information and the real-time position information is less than or equal to a preset value When the accuracy threshold is reached, stop the calibration of the positioning pin position of the load port of the silicon wafer carrier box.
  • the calibration accuracy of the position calibration device can be set to comply with the SEMI-57/62 specification standard, which is used to detect and adjust different types of silicon wafer carrier box port positioning pins.
  • FIG. 7 includes the following steps:
  • S202 Provide a standard positioning pin position limiting component to limit the standard position information of the positioning pin of the load port of the silicon wafer carrying box;
  • S204 Use the positioning pin position detection component to detect the real-time position information of the positioning pin of the load port of the silicon wafer carrying box;
  • S206 Obtain the standard position information and the real-time position information, and judge whether the position of the positioning pin of the load port of the silicon wafer carrier box is accurate according to the standard position information and the real-time position information.
  • the standard position information of the load port positioning pin of the carrier box defined by the standard positioning pin position limiting component is used as the reference standard information of the real-time position information of the positioning pin, so that the judgment The module can judge whether the position of the positioning pin of the load port of the silicon wafer carrying box is accurate according to the standard position information and the real-time position information, so as to adjust the position of the positioning pin of the load port of the carrying box to avoid the position of the silicon wafer carrying box.
  • the occurrence of equipment interference or abnormal operation caused by accuracy is used as the reference standard information of the real-time position information of the positioning pin.
  • FIG. 8 includes the following steps:
  • S302 Provide a standard positioning pin position limiting component to limit the standard position information of the positioning pin of the load port of the silicon wafer carrying box;
  • S304 Use the positioning pin position detection component to detect the real-time position information of the positioning pin of the load port of the silicon wafer carrying box;
  • S306 According to the acquired standard position information and the real-time position information, control the calibration component to move and change the position of the positioning pin of the load port of the silicon wafer carrier box so that the difference between the standard position information and the real-time position information The value is less than or equal to the preset accuracy threshold.
  • the position of the positioning pin of the load port of the silicon wafer carrier box is continuously moved to the standard position until the real-time position of the positioning pin of the load port of the silicon wafer carrier box is compared with the preset position.
  • the difference between the standard positions reaches the preset accuracy range, realizing the calibration of the positioning pin position of the load port of the silicon wafer carrying box, and avoiding equipment interference or abnormal operation caused by the inaccurate position of the silicon wafer carrying box.
  • the position judgment and calibration method further includes judging whether the position of the positioning pin of the load port of the silicon wafer carrier box is accurate according to the standard position information and the real-time position information before performing the calibration.
  • the calibration component is controlled to move and change the position of the positioning pin of the load port of the silicon wafer carrier box, so that the difference between the standard position information and the real-time position information is less than or equal to a preset accuracy threshold.
  • step S306 includes:
  • S3062 Acquire a standard position image defined by the standard positioning pin position limiting component
  • S3066 Control the calibration component to move and change the position of the positioning pin according to the standard position image and the real-time position image, so that the real-time position image is located in a preset area of the standard position image.
  • the real-time position image is located in the preset area of the standard position image, which is convenient for the While the position of the positioning pin is calibrated, the accuracy of the calibration is improved.
  • step S306 further includes:
  • S3067 Control the calibration component to move and change the position of the positioning pin so that the distance between the center point of the standard position image and the center point of the real-time position image is less than or equal to a preset accuracy threshold.
  • the calibration component is controlled to move in a direction to make the distance between the two center points smaller, until the center point of the standard position image and the real-time position
  • the distance between the center points of the image is less than or equal to the preset accuracy threshold, which effectively improves the accuracy of the calibration while improving the efficiency of the calibration.
  • a position calibration system including a memory, a processor, and a computer program stored in the memory and running on the processor.
  • the processor implements any task when the computer program is executed. A step of the method described in the embodiment of this application.
  • a computer-readable storage medium is provided, and a computer program is stored thereon, and when the computer program is executed by a processor, it implements the steps of any method described in the embodiment of the present application.
  • Each module in the above-mentioned position detection and judgment device or position calibration device can be implemented in whole or in part by software, hardware, and a combination thereof.
  • the above-mentioned modules may be embedded in the form of hardware or independent of the processor in the position calibration system, or may be stored in the memory of the position calibration system in the form of software, so that the processor can call and execute the operations corresponding to the above modules.
  • a position calibration system is provided.
  • the position calibration system may be a terminal, and its internal structure diagram may be as shown in FIG. 11.
  • the position calibration system includes a processor, a memory, a network interface, a display screen and an input device connected through a system bus. Among them, the processor of the position calibration system is used to provide calculation and control capabilities.
  • the memory of the position calibration system includes a non-volatile storage medium and an internal memory.
  • the non-volatile storage medium stores an operating system and a computer program.
  • the internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium.
  • the network interface of the position calibration system is used to communicate with an external terminal through a network connection.
  • the computer program is executed by the processor to realize a position detection and judgment method or a position calibration method.
  • the display screen of the position calibration system can be a liquid crystal display or an electronic ink display.
  • the input device of the position calibration system can be a touch layer covered on the display screen, or a button, trackball or trackball set on the housing of the position calibration system.
  • the touchpad can also be an external keyboard, touchpad, or mouse.
  • FIG. 11 is only a block diagram of part of the structure related to the solution of the present application, and does not constitute a limitation on the position calibration system to which the solution of the present application is applied.
  • the specific position calibration The system may include more or fewer components than shown in the figures, or combine certain components, or have a different component arrangement.
  • a position calibration system including a memory, a processor, and a computer program stored on the memory and running on the processor, and the processor implements the following steps when the computer program is executed:
  • the processor further implements the following steps when executing the computer program:
  • control the calibration component to move and change the position of the positioning pin of the load port of the silicon wafer carrier box so that the difference between the standard position information and the real-time position information is less than Or equal to the preset accuracy threshold.
  • the processor further implements the following steps when executing the computer program:
  • the calibration component is controlled to move and change the position of the positioning pin so that the real-time position image is located in the middle of the standard position image.
  • the processor further implements the following steps when executing the computer program:
  • control the calibration component to move and change the position of the positioning pin so that the distance between the center point of the standard position image and the center point of the real-time position image is less than Or equal to the preset accuracy threshold.

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Abstract

一种位置检测判断装置、校准装置及方法，位置检测判断装置包括：标准定位销位置限定部件（10），用于限定硅片承载盒负载端口定位销的标准位置信息；定位销位置检测部件（20），用于检测硅片承载盒负载端口定位销的实时位置信息；判断模块（30），用于获取标准位置信息及实时位置信息，并根据标准位置信息及实时位置信息判断硅片承载盒负载端口定位销的位置是否准确。

Description

位置检测判断装置、校准装置及方法
本申请要求于2020年6月23日提交的申请号为202010581245.3、名称为“位置检测判断装置、校准装置、方法及系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及半导体设备，特别是涉及一种位置检测判断装置、校准装置及方法。
背景技术
随着半导体技术的日益发展及市场对半导体产品需求量的增加，半导体生产线的自动化程度越来越高，这对半导体自动化生产线中各部件的稳定性与配合程度提出了更高的要求。
尤其在半导体自动化制造生产线中，设备的故障或停机不仅直接降低生产效率，还会造成较高的经济损失。例如，若前开式硅片储存盒放置不当，当入口托盘升起托送前开式硅片储存盒时，机台设备在端口处可能产生干涉，引起机台故障或导致前开式硅片储存盒的损坏。
然而，传统的正面开口标准箱(Front Opening Unified Pod，FOUP)硅片盒负载端口的调整和定位皆以FOUP为调整对象进行调整，或依赖各硅片盒负载端口制造商提供的位置调整工具调整，缺乏检测治具来判断硅片盒负载端口位置调整的精准度，更没有统一的工具来适应各种硅片盒负载端口的调整及检测，导致半导体自动化制造生产线中经常出现开关门异常或干涉损坏的情况，延长了设备的当机时间，降低了半导体自动化制造生产线的生产效率，导致不必要的经济损失。
发明内容
本申请的第一方面提供一种位置检测判断装置，包括：
标准定位销位置限定部件，用于限定硅片承载盒负载端口定位销的标准位置信息；
定位销位置检测部件，用于检测硅片承载盒负载端口定位销的实时位置信息；
判断模块，用于获取所述标准位置信息及所述实时位置信息，并根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确。
本申请的第二方面提供一种位置校准装置，包括：
如以上所述的位置检测判断装置；以及
校准部件，用于根据获取的所述标准位置信息及所述实时位置信息移动并改变所述硅片承载盒负载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
本申请的第三方面提供一种位置判断及校准方法，包括如下步骤：
提供标准定位销位置限定部件，以限定硅片承载盒负载端口定位销的标准位置信息；
利用定位销位置检测部件检测硅片承载盒负载端口定位销的实时位置信息；
根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确，若不准确，则控制校准部件移动并改变所述硅片承载盒负载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
本发明的一个或多个实施例的细节在下面的附图和描述中提出。本发明的其它 特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，用于描述附图的附加细节或示例不应当被认为是对本申请的发明创造、目前所描述的实施例或优选方式中任何一者的范围的限制。
图1为本申请一个实施例中提供的一种位置检测判断装置的立体结构示意图。
图2为图1中所示位置检测判断装置的左视图示意图。
图3为本申请一个实施例中提供的一种定位销位置检测部件的结构示意图。
图4为本申请一个实施例中提供的一种定位销位置检测部件的结构示意图。
图5a为本申请一个实施例中提供的一种位置检测判断装置的立体结构示意图。
图5b为图5a中示意的显示屏的工作界面示意图。
图6a为本申请一个实施例中提供的一种位置校准装置的结构示意图。
图6b为本申请另一个实施例中提供的一种位置校准装置的结构示意图。
图7为本申请一个实施例中提供的一种位置检测判断方法的流程图示意图。
图8为本申请一个实施例中提供的一种位置校准方法的流程图示意图。
图9为本申请一个实施例中提供的一种位置校准方法的流程图示意图。
图10为本申请一个实施例中提供的一种位置校准方法的流程图示意图。
图11为本申请一个实施例中提供的一种位置校准系统的架构示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并 不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在限制本发明。
在使用本文中描述的“包括”、“具有”、和“包含”的情况下，除非使用了明确的限定用语，例如“仅”、“由……组成”等，否则还可以添加另一部件。除非相反地提及，否则单数形式的术语可以包括复数形式，并不能理解为其数量为一个。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
在本申请实施例中，术语“远端”指远离用户的一端，术语“近端”指靠近用户的一端。
在本申请的一个实施例中提供的一种位置检测判断装置中，请参考图1-图2，包括标准定位销位置限定部件10、定位销位置检测部件20及判断模块30，标准定位销位置限定部件10用于限定硅片承载盒负载端口定位销的标准位置信息；定位销位置检测部件20用于检测硅片承载盒负载端口定位销的实时位置信息；判断模块30用于获取所述标准位置信息及所述实时位置信息，并根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确。
具体地，于上述实施例中的位置检测判断装置中，通过设置标准定位销位置限定部件10来限定硅片承载盒负载端口定位销的标准位置信息，并设置定位销位置检测部件20来检测硅片承载盒负载端口定位销的实时位置信息，将标准定位销位置限定部件10限定的承载盒负载端口定位销的标准位置信息作为定位销的实时位置信息的参考标准信息，使得判断模块30能够根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确，以便于调整承载盒负载端口定位销的位置，避免因硅片承载盒位置不准确而导致的设备干涉或工作异常的情况发生。
进一步地，请继续参考图1-图2，在本申请的一个实施例中，标准定位销位置限定部件10包括承载组件11及定位销匹配结构12，定位销匹配结构12设置于承载组件11，例如可以将定位销匹配结构12设置于承载组件11的表面，用于限定各所述定位销的标准位置。在本实施例中，还可以在承载组件11表面设置手柄13，便于搬运或移动承载组件11，并带动标准定位销位置限定部件10移动，以准确限定各定位销的标准位置。
具体地，于上述实施例中的位置检测判断装置中，通过设置定位销匹配结构12限定各所述定位销的标准位置，以便于校准部件获取校准目标位置信息，方便了校准部件实现对硅片承载盒负载端口定位销位置的校准。由于可以设置承载组件11上定位销匹配结构的数量与位置分布与硅片承载盒负载端口的定位销的数量与位置分布一一对应，便于通过承载组件11使得承载组件11上的定位销匹配结构12分别接触并覆盖硅片承载盒负载端口的各定位销，同时限定出硅片承载盒负载端口各定位销的标准位置，方便校准操作的同时，提高了校准后的各定位销位置分布的精准性，从而有效提高了硅片承载盒定位的准确性。
进一步地，请参考图1-图3，在本申请的一个实施例中，定位销位置检测部件 20包括可移动本体21及压电传感器22，可移动本体21为柱状，包括近端20a和远端20b，压电传感器22设置于所述可移动本体的远端20b，用于检测定位销的实时位置信息；其中，可移动本体21被设置为沿预设的方向移动，以带动压电传感器22接触硅片承载盒负载端口定位销(未图示)，使得所述压电传感器检测到所述定位销的实时位置信息。
具体地，于上述实施例中的位置检测判断装置中，可移动本体21沿预设的方向移动带动压电传感器22接触所述定位销，以基于压电传感器检测到所述定位销的实时位置信息，方便将定位销朝着靠近标准位置的方向移动，以实现对定位销位置的精确校准，并有效提高校准的效率。
进一步地，在本申请的一个实施例中，请参考图4，定位销位置检测部件20还包括定位导轨23，定位导轨23用于限定可移动本体21的移动位置和移动方向；其中，可移动本体21被设置为沿定位导轨23移动，以带动压电传感器22接触并覆盖所述定位销的上表面，使得压电传感器22检测到所述定位销上表面的图像信息。
具体地，于上述实施例中的位置检测判断装置中，由于定位导轨23的相对位置确定，使得标准定位销位置限定部件限定的定位销的标准位置信息相对确定，从而便于将定位销朝着靠近标准位置的方向移动，以实现对定位销位置的精确校准，并有效提高校准的效率。
进一步地，在本申请的一个实施例中，请参考图5a和图5b，所述的位置检测判断装置还包括显示屏40，与判断模块30连接，显示屏40用于显示所述标准位置信息41、所述实时位置信息42或实时误差信息43中的至少一种，以提高校准过程的可视性。
作为示例，在本申请的一个实施例中，请继续参考图1-图4、图5a和图5b，可以设置定位销匹配结构12包括中空的套管121，用于覆盖硅片承载盒负载端口的定 位销，以限定所述定位销的标准位置。可以设置定位销位置检测部件20为圆柱状，压电传感器22设置于圆柱状可移动本体的远端20b，用于检测定位销的实时位置信息；在中空的套管121的内壁上设置有滑槽(未图示)；在圆柱状可移动本体21的侧壁上设置有定位导轨23，定位导轨23的形状及大小可以与滑槽的形状及大小相匹配，使得圆柱状可移动本体21可以沿着滑槽限定的位置与方向移动，并带动压电传感器22接触定位销，以检测出定位销的实时位置信息；可以获取到套管121限定的标准位置信息41及压电传感器22检测的实时位置信息42，以在显示屏40中实时显示标准位置信息41及实时位置信息42。例如，可以设置在显示屏40中显示压电传感器22检测出的实时位置图像及套管121限定的标准位置图像，判断装置30可以通过对比该实时位置图像及标准位置图像，得到实时位置图像偏离标准位置图像的误差，并在显示屏40中显示实时位置图像、标准位置图像及误差。在本申请实施例中，可以设置判断装置30通过获取实时位置图像的中心点与标准位置图像的中心点的距离值来获取定位销位置的实时误差信息43。
在本申请的一个实施例中，提供了一种位置校准装置，包括：
如任一本申请实施例中所述的位置检测判断装置；以及
校准部件，用于根据获取的所述标准位置信息及所述实时位置信息移动并改变所述硅片承载盒负载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
作为示例，请参考图6a，在本申请的一个实施例中，所述的位置校准装置包括标准定位销位置限定部件10、定位销位置检测部件20及校准部件50，标准定位销位置限定部件10用于限定硅片承载盒负载端口定位销的标准位置信息；定位销位置检测部件20用于检测硅片承载盒负载端口定位销的实时位置信息；校准部件50用于根据获取的所述标准位置信息及所述实时位置信息移动并改变所述硅片承载盒负 载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
具体地，请参考图6b，通过设置标准定位销位置限定部件10来限定硅片承载盒负载端口200的定位销的标准位置信息，并设置定位销位置检测部件20来检测该定位销的实时位置信息，将标准定位销位置限定部件10限定的定位销的标准位置信息，作为定位销的实时位置信息的参考标准信息，使得校准部件50能够根据所述标准位置信息及所述实时位置信息的比较结果，移动并改变定位销的位置，以使得所述标准位置信息与所述实时位置信息的差值逐渐减小，当所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值时，停止对硅片承载盒负载端口定位销位置的校准。通过不断地将硅片承载盒负载端口定位销的位置向标准位置移动，直至硅片承载盒负载端口定位销的实时位置与预设的标准位置之间的差值达到预设的精度范围，实现对硅片承载盒负载端口的定位销位置的校准，避免因硅片承载盒位置不准确而导致的设备干涉或工作异常的情况发生。从而有效地提高了半导体自动化制造生产线的生产效率，缩减设备的当机时间，避免产生不必要的经济损失。
在本申请的一个实施例中，可以设置位置校准装置的校准精度符合SEMI-57/62规格标准，用于检测及调整不同型号的硅片承载盒端口定位销。
在本申请的一个实施例中，提供了一种位置检测判断方法，请参考图7，包括如下步骤：
S202：提供标准定位销位置限定部件，以限定硅片承载盒负载端口定位销的标准位置信息；
S204：利用定位销位置检测部件检测硅片承载盒负载端口定位销的实时位置信息；
S206：获取所述标准位置信息及所述实时位置信息，并根据所述标准位置信息 及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确。
具体地，于上述实施例中的位置检测判断方法中，通过将标准定位销位置限定部件限定的承载盒负载端口定位销的标准位置信息，作为定位销的实时位置信息的参考标准信息，使得判断模块能够根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确，以便于调整承载盒负载端口定位销的位置，避免因硅片承载盒位置不准确而导致的设备干涉或工作异常的情况发生。
在本申请的一个实施例中，提供了一种位置判断和校准方法，请参考图8，包括如下步骤：
S302：提供标准定位销位置限定部件，以限定硅片承载盒负载端口定位销的标准位置信息；
S304：利用定位销位置检测部件检测硅片承载盒负载端口定位销的实时位置信息；
S306：根据获取的所述标准位置信息及所述实时位置信息，控制校准部件移动并改变所述硅片承载盒负载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
具体地，于上述实施例中的位置判断和校准方法中，通过不断地将硅片承载盒负载端口定位销的位置向标准位置移动，直至硅片承载盒负载端口定位销的实时位置与预设的标准位置之间的差值达到预设的精度范围，实现对硅片承载盒负载端口定位销位置的校准，避免因硅片承载盒位置不准确而导致的设备干涉或工作异常的情况发生。从而有效地提高了半导体自动化制造生产线的生产效率，缩减设备的当机时间，避免产生不必要的经济损失。
在一些实施例中，位置判断和校准方法在进行校准前还包括根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确。当 位置不正确时，则控制校准部件移动并改变所述硅片承载盒负载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
进一步地，在本申请的一个实施例中，提供了一种位置校准方法，请参考图9，与图8中所示实施例的区别在于，步骤S306包括：
S3062：获取所述标准定位销位置限定部件限定的标准位置图像；
S3064：获取所述定位销位置检测部件检测的定位销的实时位置图像；
S3066：根据所述标准位置图像及所述实时位置图像，控制校准部件移动并改变所述定位销的位置，使得所述实时位置图像位于所述标准位置图像的预设区域。
具体地，于上述实施例中的位置校准方法中，通过控制校准部件移动并改变所述定位销的位置，使得所述实时位置图像位于所述标准位置图像的预设区域，在方便对所述定位销的位置进行校准的同时，提高了校准的精确度。
进一步地，在本申请的一个实施例中，提供了一种位置校准方法，请参考图10，与图9中所示实施例的区别在于，步骤S306还包括：
S3063：获取所述标准位置图像的中心点的位置信息；
S3065：获取所述实时位置图像的中心点的位置信息；
S3067：控制校准部件移动并改变所述定位销的位置，使得所述标准位置图像的中心点与所述实时位置图像的中心点之间的距离值小于或等于预设的精度阈值。
具体地，于上述实施例中的位置校准方法中，通过控制校准部件朝着使所述的两个中心点的距离更小的方向移动，直至所述标准位置图像的中心点与所述实时位置图像的中心点之间的距离值小于或等于预设的精度阈值，在提高校准的效率的同时有效地提高了校准的精确度。
在本申请的一个实施例中，提供了一种位置校准系统，包括存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，所述处理器执行所述计算机程 序时实现任一本申请实施例中所述方法的步骤。
在本申请的一个实施例中，提供了一种计算机可读存储介质，其上存储有计算机程序，所述计算机程序被处理器执行时实现任一本申请实施例中所述方法的步骤。
应该理解的是，虽然图7-10的流程图中的各个步骤按照箭头的指示依次显示，但是这些步骤并不是必然按照箭头指示的顺序依次执行。除非本文中有明确的说明，这些步骤的执行并没有严格的顺序限制，这些步骤可以以其它的顺序执行。而且，图7-10中的至少一部分步骤可以包括多个子步骤或者多个阶段，这些子步骤或者阶段并不必然是在同一时刻执行完成，而是可以在不同的时刻执行，这些子步骤或者阶段的执行顺序也不必然是依次进行，而是可以与其它步骤或者其它步骤的子步骤或者阶段的至少一部分轮流或者交替地执行。
关于位置检测判断方法或位置校准方法的具体限定可以参见上文中对于位置检测判断装置或位置校准装置的限定，在此不再赘述。
上述位置检测判断装置或位置校准装置中的各个模块可全部或部分通过软件、硬件及其组合来实现。上述各模块可以硬件形式内嵌于或独立于位置校准系统中的处理器中，也可以以软件形式存储于位置校准系统中的存储器中，以便于处理器调用执行以上各个模块对应的操作。
在本申请的一个实施例中，提供了一种位置校准系统，该位置校准系统可以是终端，其内部结构图可以如图11所示。该位置校准系统包括通过系统总线连接的处理器、存储器、网络接口、显示屏和输入装置。其中，该位置校准系统的处理器用于提供计算和控制能力。该位置校准系统的存储器包括非易失性存储介质、内存储器。该非易失性存储介质存储有操作系统和计算机程序。该内存储器为非易失性存储介质中的操作系统和计算机程序的运行提供环境。该位置校准系统的网络接口用于与外部的终端通过网络连接通信。该计算机程序被处理器执行时以实现一种位置 检测判断方法或位置校准方法。该位置校准系统的显示屏可以是液晶显示屏或者电子墨水显示屏，该位置校准系统的输入装置可以是显示屏上覆盖的触摸层，也可以是位置校准系统外壳上设置的按键、轨迹球或触控板，还可以是外接的键盘、触控板或鼠标等。
本领域技术人员可以理解，图11中示出的结构，仅仅是与本申请方案相关的部分结构的框图，并不构成对本申请方案所应用于其上的位置校准系统的限定，具体的位置校准系统可以包括比图中所示更多或更少的部件，或者组合某些部件，或者具有不同的部件布置。
在本申请的一个实施例中，提供了一种位置校准系统，包括存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，处理器执行计算机程序时实现以下步骤：
提供标准定位销位置限定部件，以限定硅片承载盒负载端口定位销的标准位置信息；
利用定位销位置检测部件检测硅片承载盒负载端口定位销的实时位置信息；
获取所述标准位置信息及所述实时位置信息，并根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确。
在本申请的一个实施例中，处理器执行计算机程序时还实现以下步骤：
提供标准定位销位置限定部件，以限定硅片承载盒负载端口定位销的标准位置信息；
利用定位销位置检测部件检测硅片承载盒负载端口定位销的实时位置信息；
根据获取的所述标准位置信息及所述实时位置信息，控制校准部件移动并改变所述硅片承载盒负载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
在本申请的一个实施例中，处理器执行计算机程序时还实现以下步骤：
提供标准定位销位置限定部件，以限定硅片承载盒负载端口定位销的标准位置信息；
利用定位销位置检测部件检测硅片承载盒负载端口定位销的实时位置信息；
获取所述标准定位销位置限定部件限定的标准位置图像；
获取所述定位销位置检测部件检测的定位销的实时位置图像；
根据所述标准位置图像及所述实时位置图像，控制校准部件移动并改变所述定位销的位置，使得所述实时位置图像位于所述标准位置图像的中部。
在本申请的一个实施例中，处理器执行计算机程序时还实现以下步骤：
提供标准定位销位置限定部件，以限定硅片承载盒负载端口定位销的标准位置信息；
利用定位销位置检测部件检测硅片承载盒负载端口定位销的实时位置信息；
获取所述标准定位销位置限定部件限定的标准位置图像；
获取所述标准位置图像的中心点的位置信息；
获取所述定位销位置检测部件检测的定位销的实时位置图像；
获取所述实时位置图像的中心点的位置信息；
根据所述标准位置图像及所述实时位置图像，控制校准部件移动并改变所述定位销的位置，使得所述标准位置图像的中心点与所述实时位置图像的中心点之间的距离值小于或等于预设的精度阈值。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但 并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (9)

  1. 一种位置检测判断装置，包括：
    标准定位销位置限定部件，用于限定硅片承载盒负载端口定位销的标准位置信息；
    定位销位置检测部件，用于检测硅片承载盒负载端口定位销的实时位置信息；
    判断模块，用于获取所述标准位置信息及所述实时位置信息，并根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确。
  2. 根据权利要求1所述的位置检测判断装置，其中，所述标准定位销位置限定部件包括：
    承载组件；
    定位销匹配结构，设置于所述承载组件，用于限定各所述定位销的标准位置。
  3. 根据权利要求2所述的位置检测判断装置，其中，所述定位销位置检测部件包括：
    可移动本体，为柱状；
    压电传感器，设置于所述可移动本体的远端，用于检测定位销的实时位置信息；
    其中，所述可移动本体被设置为沿预设的方向移动，以带动所述压电传感器接触所述定位销，使得所述压电传感器检测到所述定位销的实时位置信息。
  4. 根据权利要求3所述的位置检测判断装置，其中，所述定位销位置检测部件还包括：
    定位导轨，用于限定所述可移动本体的移动位置和移动方向；
    其中，所述可移动本体被设置为沿所述定位导轨移动，以带动所述压电传感器 接触并覆盖所述定位销的上表面，使得所述压电传感器检测到所述定位销上表面的图像信息。
  5. 根据权利要求1所述的位置检测判断装置，其中，还包括：
    显示屏，与所述判断模块连接，用于显示所述标准位置信息、所述实时位置信息或实时误差信息中的至少一种。
  6. 一种位置校准装置，包括：
    如权利要求1所述的位置检测判断装置；以及
    校准部件，用于根据获取的所述标准位置信息及所述实时位置信息移动并改变所述硅片承载盒负载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
  7. 一种位置判断及校准方法，包括如下步骤：
    提供标准定位销位置限定部件，以限定硅片承载盒负载端口定位销的标准位置信息；
    利用定位销位置检测部件检测硅片承载盒负载端口定位销的实时位置信息；
    根据所述标准位置信息及所述实时位置信息判断所述硅片承载盒负载端口定位销的位置是否准确,如果不准确，则控制校准部件移动并改变所述硅片承载盒负载端口定位销的位置，使得所述标准位置信息与所述实时位置信息的差值小于或等于预设的精度阈值。
  8. 根据权利要求7所述的位置判断及校准方法，其中，所述根据获取的所述标准位置信息及所述实时位置信息，控制校准部件移动并改变所述硅片承载盒负载端口定位销的位置包括：
    获取所述标准定位销位置限定部件限定的标准位置图像；
    获取所述定位销位置检测部件检测的定位销的实时位置图像；
    根据所述标准位置图像及所述实时位置图像，控制校准部件移动并改变所述定位销的位置，使得所述实时位置图像位于所述标准位置图像的预设区域。
  9. 根据权利要求8所述的位置判断及校准方法，其中，所述根据获取的所述标准位置信息及所述实时位置信息，控制校准部件移动并改变所述硅片承载盒负载端口定位销的位置还包括：
    获取所述标准位置图像的中心点的位置信息；
    获取所述实时位置图像的中心点的位置信息；
    控制校准部件移动并改变所述定位销的位置，使得所述标准位置图像的中心点与所述实时位置图像的中心点之间的距离值小于或等于预设的精度阈值。
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