WO2021256513A1 - Dispositif électronique et procédé de fabrication de dispositif électronique - Google Patents

Dispositif électronique et procédé de fabrication de dispositif électronique Download PDF

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Publication number
WO2021256513A1
WO2021256513A1 PCT/JP2021/022887 JP2021022887W WO2021256513A1 WO 2021256513 A1 WO2021256513 A1 WO 2021256513A1 JP 2021022887 W JP2021022887 W JP 2021022887W WO 2021256513 A1 WO2021256513 A1 WO 2021256513A1
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WIPO (PCT)
Prior art keywords
electronic device
electrode
surface resistivity
housing
cover
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PCT/JP2021/022887
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English (en)
Japanese (ja)
Inventor
頼興 松本
亘弘 松本
晋一 山口
隆一 竹内
Original Assignee
株式会社松本技研
シシド静電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社松本技研, シシド静電気株式会社 filed Critical 株式会社松本技研
Priority to KR1020227045191A priority Critical patent/KR20230024912A/ko
Priority to US18/010,629 priority patent/US20230345608A1/en
Priority to CN202180042879.4A priority patent/CN115836590A/zh
Publication of WO2021256513A1 publication Critical patent/WO2021256513A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F1/00—Preventing the formation of electrostatic charges
    • H05F1/02—Preventing the formation of electrostatic charges by surface treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/04—Carrying-off electrostatic charges by means of spark gaps or other discharge devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T19/00—Devices providing for corona discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T19/00—Devices providing for corona discharge
    • H01T19/04—Devices providing for corona discharge having pointed electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T23/00—Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/02—Carrying-off electrostatic charges by means of earthing connections

Definitions

  • the present invention relates to an electronic device and a method for manufacturing the electronic device.
  • Patent Document 1 describes an ionizer including a discharge needle that generates an ion by generating a corona discharge (claim 1 and the like of Patent Document 1).
  • the present inventor has further investigated and found that, for an electronic device provided with an electronic component and a housing and driven by a high-voltage power supply, the surface resistivity of the cover portion and / or the housing covering the electric component is appropriately controlled to obtain electrons.
  • the induced charging phenomenon generated in the static elimination target existing in the vicinity thereof can be alleviated when the device is used, and have completed the present invention.
  • An electronic device used in the vicinity of an object to be statically eliminated With electrical components A wiring unit that transmits power from a high-voltage power supply to the electrical components, The electric component and the housing for accommodating the wiring portion are provided. Wherein is intended to cover at least a portion of the electrical component, the cover portion surface resistivity is 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less, and a surface resistivity of 10 4 ⁇ / ⁇ or more 10 11 Omega / ⁇ An electronic device having at least one of the following housings is provided.
  • a method for manufacturing an electronic device including an electric component, a wiring unit for transmitting high-voltage power to the electric component, and a housing for accommodating the electric component and the wiring unit, and used in the vicinity of an object to be statically eliminated.
  • the surface resistivity is 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less
  • the cover portion that covers at least a part of the electric component
  • the surface resistivity is 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less.
  • a method of manufacturing an electronic device comprising an assembly step, in which the electronic device is obtained by assembling components of the electronic device using at least one of the housings.
  • an electronic device excellent in alleviating the induced charging phenomenon and a method for manufacturing the electronic device.
  • FIG. 10 It is a figure which shows typically the connection diagram of the measuring device in the measuring system 10. It is an equivalent circuit diagram which shows the relationship of the capacitance of each part in the measurement system 10 of FIG. It is a figure for demonstrating the measuring method of an induced voltage. It is sectional drawing which shows typically the structure of an ionizer (static elimination apparatus). It is a figure which shows the enlarged view of the ⁇ region of FIG. It is a figure which shows typically the structure of other ionizers. It is a figure which shows typically the structure of other ionizers.
  • the electronic device of this embodiment will be outlined.
  • the electronic device of the present embodiment includes an electric component, a wiring section for transmitting high-voltage power to the electrical component, and a housing for accommodating the electrical component and the wiring section, and covers at least a part of the electrical component.
  • the cover part surface resistivity is 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less, and, at least one of the surface resistivity of 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less is the housing Have.
  • Such an electronic device is used in the vicinity of an object to be statically eliminated such as an electronic component or an electronic device.
  • ESD Electrostatic Discharge
  • the static eliminator can suppress the generation of ESD by neutralizing the electric charge in the electronic component / device.
  • the reasons why the static eliminator is adopted are that it is relatively safe, there are few restrictions on the installation location, and it is easy to handle.
  • the surface resistivity of the housing of the static eliminator and / or the surface resistivity of the cover portion covering the electric component is appropriately controlled so as to be equal to or less than the above upper limit value and above the above lower limit value. It has been found that when the static eliminator is used, the induced charging phenomenon generated in the static elimination target existing in the vicinity thereof can be alleviated.
  • the surface resistivity By setting the surface resistivity to the above upper limit or less , the charge transfer becomes smoother as compared with the insulating material having a surface resistivity of more than 10 11 ⁇ / ⁇ , and the induction generated in the static elimination object W at the time of static elimination The voltage can be reduced.
  • the surface resistivity by the above-described lower limit compared to 10 4 ⁇ / ⁇ less conductive material, since an increase in the attraction of ions generated from the electrode 130 can be suppressed, charge removal of the ionizer 100 It is possible to suppress the deterioration of performance.
  • an electronic device such as a static eliminator in the vicinity of the static eliminator, the induced voltage generated in the static eliminator by electrostatic induction can be reduced, that is, the induced charging phenomenon can be alleviated. It will be possible. As a result, it can be expected that the yield will be improved and the quality variation will be reduced in the manufacturing process of electronic parts / devices. Further, according to one embodiment of the present embodiment, an electronic device such as a static eliminator capable of suppressing the generation of ESD is provided even when the static electricity management voltage of several volts (V) to ten and several volts (V) is relatively low. can.
  • a corona discharge type static eliminator ionizer
  • a light irradiation type static eliminator or the like
  • the corona discharge type static eliminator is provided with a discharge needle (electrode) for generating corona discharge, and includes a voltage application method and a self-discharge method.
  • the light irradiation type static eliminator has an ultraviolet ray method, a soft X-ray method, and an ⁇ ray method depending on the type of radiation.
  • the electronic device may be a general electronic device other than the static elimination device as long as it is used in the vicinity of the static elimination target in the electronic parts / devices and the manufacturing process thereof.
  • the term may mean that the static eliminator is at a distance between the static eliminator and the static eliminator, but it may be in the same room, on the same workbench, and on the production line. ..
  • the static eliminator may be an installation type or a handy type.
  • a bar type for example, a bar type, an overhead console type, a desktop type (blower type / fan type), a nozzle type (spot type), a gun type, a pen type, a box type and the like are used.
  • Examples of the applied voltage method of the static eliminator include a DC (direct current) method, a pulse DC method, an SSDC method, an AC (alternating current) method, a high frequency AC method, a pulse AC method, and an HDC-AC method.
  • the voltage of the high voltage power supply may be, for example, 100 V or more, preferably 1 kV or more, or 2 kV or more.
  • the upper limit of the voltage of the high voltage power supply is not particularly limited.
  • the high-voltage power supply may have various known conversion circuits, if necessary.
  • the output voltage applied to the electrode which is one of the electric components, may be preferably 1 kV or more, more preferably 2 kV or more.
  • the frequency of the high-voltage power supply for example, a commercial frequency type such as 50 Hz or 60 Hz, a low frequency type of several Hz to 30 Hz, a high frequency type of about 20 kHz to 80 kHz, or the like may be used.
  • the high voltage power supply may be an internal power supply or an external power supply.
  • the built-in power supply is installed, for example, inside a housing that houses electronic components.
  • As the external power source for example, a power source installed in a facility where an electronic device is used, a battery, or the like is used.
  • FIG. 4 is a cross-sectional view schematically showing the structure of the ionizer 100.
  • FIG. 5 is a diagram showing an enlarged view of the ⁇ region in FIG.
  • the ionizer 100 of FIG. 5 includes one or more electrodes 130 (electrical components), a wiring unit 170 that transmits power of a high-voltage power supply 120 to the electrodes 130, and a housing 110 that houses the electrodes 130 and the wiring unit 170.
  • the accommodation means a state in which a part or the whole of the accommodation is included in the internal space of the housing 110.
  • the electrode 130 uses either an electrode that generates a corona discharge or an electrode that generates a glow discharge, and is composed of a needle-shaped metal rod whose tip is gradually reduced in diameter, that is, a discharge needle.
  • tungsten, stainless steel, silicon, glass and the like are used as the constituent material of the electrode 130.
  • Metallic discharge needles made of tungsten, stainless steel, etc., and non-metal discharge needles made of silicon (polysilicon) can be configured to contain each constituent material with high purity, but other materials may be used as needed. Allows a small amount to be included.
  • As the discharge needle made of glass one having a silicon coating on the surface can be used.
  • the number of electrodes 130, the pitch interval of the electrodes 130, the length of the line where the plurality of electrodes 130 are installed can be set in consideration of the installation location, static elimination ability, and the like.
  • ions 140 are emitted from the electrode 130.
  • the emitted ions 140 can neutralize the charge on the surface of the static elimination object W (static elimination treatment).
  • the voltage application method of the ionizer 100 can be selected from the above-mentioned methods, and is not particularly limited.
  • an alternating current method such as an AC (alternating current) method, a high frequency AC method, a pulse AC method, or an HDC-AC method may be used.
  • an AC high-voltage power supply 120 may be used, or a DC high-voltage power supply 120 combined with an AC generation circuit may be used.
  • the high-voltage power supply 120 included in the ionizer 100 of FIG. 4 is a built-in power supply housed in the housing 110, but the present invention is not limited to this mode. According to this embodiment, even when the high voltage power supply 120 is built in the housing 110, the induced charging phenomenon generated in the static elimination object can be alleviated.
  • the ionizer 100 of FIG. 4 includes a cover portion (nozzle portion 150, guard portion 160) that covers at least a part of the electrode 130.
  • the cover portion may be composed of a cylindrical nozzle portion 150 and / or a guard portion 160.
  • An example of the tubular nozzle portion 150 is provided in the housing 110 and may be configured to cover the periphery of the electrode 130.
  • An example of the guard portion 160 is detachably attached to the cylindrical nozzle portion 150, and may be configured to cover at least the tip 132 of the electrode 130.
  • FIG. 5 is an enlarged view of the ⁇ region of FIG. 4, and is a diagram schematically showing the electrode 130 installed in the cover portion.
  • 5 (a) is a view of the axial direction of the electrode 130 from the tip 132 side
  • FIG. 5 (b) is a view taken along the line AA of FIG. 5 (a)
  • FIG. 5 (c) is a view. It is a figure in the cross-sectional view of BB of FIG. 5 (b).
  • the cover portion covers the periphery of the tip 132 of the electrode 130, and has a first cover structure (nozzle portion 150) having a surface resistivity of 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less. ), and is intended to cover the forward tip 132 of the electrode 130 has a surface resistivity of 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less is the second cover structure (guard part 160).
  • the ionizer 100 provided with the electrode 130 may have only the first cover structure, but an embodiment having both a first cover structure and a second cover structure is preferable.
  • the nozzle portion 150 has a socket structure that supports a part of the rear part of the electrode 130, and is detachably mounted in the mounting hole of the housing 110. When the electrode 130 is worn out, it can be replaced with a nozzle portion 150 having a new electrode 130, which facilitates maintenance.
  • a known method such as mechanical coupling can be used.
  • the nozzle portion 150 and the housing 110 may be composed of separate members, but may be composed of an integrated member in which both members are integrated.
  • the nozzle portion 150 may have one or more holes 190 in the wall portion that covers the periphery of the electrode 130 in the axial center direction. Air can be supplied through the hole 190, and the static elimination characteristics of the electrode 130 can be adjusted. The air may be configured to be supplied from the compressor in the housing 110.
  • the nozzle portion 150 has a cover structure that covers at least a part of the surface of the electrode 130 in the circumferential direction with respect to the axis direction, and further has a circumferential surface from the portion of the electrode 130 protruding from the socket structure to its tip 132. It may have a tubular first cover structure that covers the whole.
  • the guard portion 160 has a second cover structure that covers the opening 134 of the nozzle portion 150 existing in front of the tip 132 of the electrode 130.
  • a guard portion 160 functions as a finger guard because it can prevent the tip 132 of the electrode 130 in the opening 134 shown in FIG. 5A from accidentally touching the operator.
  • the guard portion 160 is detachably attached to the nozzle portion 150. Only the guard portion 160 can be replaced. As the attachment / detachment method, a known method such as mechanical coupling can be used.
  • the guard portion 160 and the nozzle portion 150 may be composed of separate members, but may be composed of an integral member.
  • the ionizer 100 of the present embodiment the configuration A: electrode 130 are those covering at least a portion of the (electric component), the surface resistivity of the cover portion is 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less is the cover portion (nozzle part 150, and / or the guard portion 160), and a configuration B: surface resistivity at least one of 10 4 Omega / ⁇ or more 10 11 Omega / ⁇ housing 110 or less, preferably both.
  • the surface resistivityes of the configurations A and B may be the same or different from each other.
  • the ionizer 100 may have only configuration A or only configuration B, but preferably has both configuration A and configuration B.
  • the surface resistance of the cover is 1.0 ⁇ 10 4 ⁇ / ⁇ or more and 1.0 ⁇ 10 11 ⁇ / ⁇ or less, preferably 1.0 ⁇ 10 4 ⁇ / ⁇ or more and 1.0 ⁇ 10 10. ⁇ / ⁇ or less, more preferably 1.0 ⁇ 10 4 ⁇ / ⁇ or more 1.0 ⁇ 10 9 ⁇ / ⁇ or less, still more preferably 1.0 ⁇ 10 5 ⁇ / ⁇ or more 1.0 ⁇ 10 9 ⁇ / ⁇ Below.
  • the surface resistance of the housing 110 may be the same or different, and is 1.0 ⁇ 10 4 ⁇ / ⁇ or more and 1.0 ⁇ 10 11 ⁇ / ⁇ or less, preferably 1.0 ⁇ 10 4 ⁇ . / ⁇ or more 1.0 ⁇ 10 10 ⁇ / ⁇ or less, more preferably 1.0 ⁇ 10 4 ⁇ / ⁇ or more 1.0 ⁇ 10 9 ⁇ / ⁇ or less, still more preferably 1.0 ⁇ 10 5 ⁇ / ⁇ It is 1.0 ⁇ 10 9 ⁇ / ⁇ or less.
  • the surface resistivity is defined by the IEC 61340 5-1, 5-2 standard in an environment of, for example, temperature: 22.5 ° C. ⁇ 10%, humidity: 50% RH ⁇ 5 ° C.
  • a surface resistivity meter (adapted to ESD Association standards) can be used, and the value ( ⁇ / ⁇ ) measured using a CR probe or a 2P probe can be adopted.
  • the induced charging phenomenon caused by the electric field generated from the ionizer 100 on the static elimination object W can be alleviated.
  • the above-mentioned cover portion and housing having surface resistivity make the charge transfer smoother than that of the insulating material, while the charge transfer is smoother than that of the conductive material, but from the electrode 130 as compared with the conductive material. It is considered that since the increase in the amount of attracted ions generated can be suppressed, the induced voltage generated in the static elimination target W at the time of static elimination can be suppressed, while the deterioration of the static elimination performance of the ionizer 100 can be suppressed.
  • the surface resistivity of the housing 110 is A, when the surface resistivity of the cover portion and the B, A and B, for example, 10 3/10 12 ⁇ A / B ⁇ 1, preferably 10 4/10 11 ⁇ a / B ⁇ 1, the ionizer 100 to be more preferably satisfy 10 4/10 9 ⁇ a / B ⁇ 1 may be configured. As a result, it is possible to smoothly transfer the electric charge from the cover portion to the housing 110 while suppressing the deterioration of the static elimination ability due to the cover portion. As another embodiment, A and B, for example, 1 ⁇ ionizer 100 may be configured to satisfy A / B ⁇ 10 3/10 12.
  • At least one of the housing 110 and the cover portion is formed on an insulating layer or a conductive layer and at least a part of the surface of the layer, which is a surface resistivity. It may be configured to have an electrostatic diffusible layer 180 having a ratio of 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less.
  • Such a laminated structure includes a nozzle portion 150 that covers the periphery of the electrode 130 in the axial direction, a guard portion 160 that exists between the tip 132 of the electrode 130 and the static elimination object W, and a housing 110 that installs the electrode 130.
  • a laminated structure is formed on the guard portion 160 installed at a position that hinders the traveling direction of the ions generated from the electrode 130. Thereby, the induced voltage can be further reduced.
  • a laminated structure is more preferably formed on the guard portion 160 and the nozzle portion 150, and more preferably on the nozzle portion 150, the guard portion 160 and the housing 110.
  • the induced voltage generated in the static elimination object W can be further reduced.
  • the detailed mechanism is not clear, it is considered that the induced voltage generated in the static elimination target W at the time of static elimination can be reduced because the movement of the ions generated from the electrode 130 is smoothly performed via the guard portion 160.
  • the surface resistivity of the electrostatic diffusible layer 180 in the laminated structure is measured not by itself but in a state of being laminated on the insulating layer or the conductive layer which is the base layer. For example, by using the underlying layer of the conductive layer, the value of the surface resistivity can be adjusted to be smaller than that of the case of a single layer.
  • the insulating layer in the first laminated structure includes, for example, ABS, PC, PE, PP, PMMA, PS, PVC, POM, other elastomer resins and empra resins, polymer alloy resins containing two or more of these resins, and the like.
  • the thermoplastic resin of can be used.
  • the thermoplastic resin is lighter in weight than the metal material, has excellent moldability, and can obtain a desired member shape.
  • a steel material such as an alloy steel such as SUS, SPCC, or SOOC, or a metal material such as an alloy material such as an Al alloy or a Cu alloy may be used. It is possible to use a conductive resin obtained by kneading a conductive material such as carbon or Ag into a resin such as the above-mentioned thermosetting resin.
  • the electric charge moves through the electrostatic diffusible layer formed on the surface of the base, whereas in the second laminated structure, only in the electrostatic diffusible layer.
  • the electric charge transferred from the electrostatic diffusive layer to the underlying conductive layer can also move in the conductive layer, so that the induced charging phenomenon can be mitigated more efficiently.
  • Examples of the method of forming the electrostatic diffusive layer on the insulating layer or the conductive layer include a method of forming a coating film using a paint, a method of laminating a thin film, and a method of molding using a molding material. And so on.
  • the electrostatic diffusive layer may be formed independently, but it is also possible to simultaneously form the underlying layer of the insulating layer or the conductive layer and the electrostatic diffusible layer by using a method such as two-color molding.
  • Each of the housing 110, the nozzle portion 150, and the guard portion 160 may be composed of the electrostatic diffusible material alone, but the conductive material, the electrostatic diffusible material, and the insulation are provided so as to have the above-mentioned laminated structure. It may be composed of a combination of a sex material and an electrostatic diffusible material. In the housing 110, the nozzle portion 150, and the guard portion 160, the same or different electrostatic diffusible material, conductive material, and insulating material may be used.
  • a coated product in which a coating film of an electrostatic diffusible material is formed on at least one of the outer surface and / or the inner surface of the housing 110 made of an insulating resin, and a housing made of an insulating resin.
  • examples thereof include a two-color molded product in which a film of an electrostatic diffusible material is formed on at least one of the outer surface and / or the inner surface of the body 110.
  • the cover portion in the ionizer 100 has a cover structure (nozzle portion 150) that covers the periphery of the electrode 130 and / or a cover structure (guard portion 160) that covers the front of the tip 132 of the electrode 130.
  • surface resistivity at structure 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ may be configured to become less.
  • the front means the front when viewed in the direction from the tip 132 of the electrode 130 to the static elimination object W.
  • the numerical range of the surface resistivity of the nozzle portion 150 and the guard portion 160 is not only when they are composed of the electrostatic diffusible material alone, but also when they are configured to have the above-mentioned laminated structure. Apply.
  • an electrostatic diffusible layer 180 is formed on the surface 162.
  • the electrostatic diffusible layer 180 may cover at least a part of the surface 162, or may cover the entire surface. That is, an example of the guard portion 160 may be composed of an internal structure of an insulating material or a conductive material and a coating layer of an electrostatic diffusible material formed on the surface of the internal structure. This configuration can also be applied to the nozzle portion 150 and the housing 110.
  • the electrostatic diffusible layer 180 is composed of, for example, a film (coating film) made of an electrostatic diffusible paint. By applying and drying the electrostatic diffusible paint on the surface 162 of the guard portion 160, a dry film of the electrostatic diffusible paint, that is, the electrostatic diffusible layer 180 is formed. By using the paint, the electrostatic diffusible layer 180 can be formed relatively uniformly and stably on the surface 162 of the guard portion 160 having various shapes.
  • the grit shape of the guard portion 160 is not particularly limited as long as it covers the tip 132 of the electrode 130, and is, for example, radial, lattice-shaped, slit-shaped, cross-shaped, concentric, plain weave, twill weave, and twisted yarn. Examples include woven fabrics such as weave and cedar twill weave. As a result, the induced charging phenomenon from the discharge electrode can be alleviated.
  • the ionizer 100 and the cover portion may be configured to be electrically connected. Thereby, the induced charging phenomenon can be alleviated more efficiently.
  • the ionizer 100 when the ionizer 100 includes a plurality of electrodes 130, the ionizer 100 includes a first electrode, a second electrode, a first cover portion covering the first electrode, and a second electrode.
  • a second cover portion that covers the electrodes is provided at least, and the first cover portion and the second cover portion may be configured to be electrically connected to each other.
  • the housing 110 may be in a grounded state, or the cover portion (nozzle portion 150 and / or guard portion 160) may be electrically connected to the grounded housing 110. Thereby, the induced charging phenomenon can be alleviated more efficiently.
  • the static eliminator of this embodiment can be applied not only to the bar type ionizer 100 but also to other ionizers.
  • 6 and 7 are diagrams schematically showing the structures of other ionizers.
  • FIG. 6A shows a box-type ionizer 200.
  • the ionizer 200 includes an electrode 230, a wiring portion 270 that supplies electric power from a high-voltage power supply 220 to the electrode 230, a housing 210 that houses the electrode 230 and the wiring portion 270, and a nozzle member 260 that covers at least a part of the electrode 230. And.
  • FIG. 6 (b) shows a hand gun type ionizer 300.
  • the ionizer 300 includes an electrode 330, a wiring portion 370 that supplies electric power from the high-voltage power supply 320 to the electrode 330, a housing 310 that houses the electrode 330 and the wiring portion 370, and a nozzle member 360 that covers at least a part of the electrode 330. And a grip portion 312 that serves as a handle for the operator.
  • FIG. 6 (c) shows a pen-shaped ionizer 400.
  • the ionizer 400 includes an electrode 430, a wiring portion 470 that supplies power from a high-voltage power supply 420 to the electrode 430, a housing 410 that houses the electrode 430 and the wiring portion 470, and a nozzle member 460 that covers at least a part of the electrode 430. And a switch unit 412 that serves as a trigger for emitting ions from the electrode 430.
  • FIG. 6D shows a nozzle-type ionizer 500.
  • the ionizer 500 includes an electrode 530, a wiring portion 570 that supplies electric power from a high-voltage power supply 520 to the electrode 530, a housing 510 that houses the electrode 530 and the wiring portion 570, and a nozzle member 560 that covers at least a part of the electrode 530. And a deformable tube portion 512.
  • FIG. 7 shows a blower (blower) type ionizer 600.
  • the ionizer 600 includes a plurality of electrodes 630, a support portion 632 that supports the electrodes 630, a wiring portion 670 that supplies power from the high-voltage power supply 520 to the electrodes 630, and a housing 610 that houses the electrodes 630 and the wiring portions 670.
  • a looper portion 660 that covers at least a part in front of the electrode 630, and a fan portion 680 that is arranged behind the electrode 630 and sends air from the electrode 630 toward the looper portion 660 are provided.
  • the ionizers 200, 300, 400, 500, and 600 each include a nozzle member 260, a nozzle portion 360, a nozzle portion 460, a nozzle portion 560, and a looper portion 660 as cover portions. These cover portions and housings may adopt the same configuration as the cover portions and housings of the ionizer 100. In such an ionizer as well, the induced charging phenomenon can be alleviated as in the ionizer 100.
  • the electronic device of this embodiment can be used in the field in the manufacturing / assembling process of static elimination objects such as electronic parts and electronic devices.
  • the electronic device of the present embodiment can be suitably used in the vicinity or inside of the device used in the pretreatment step and the posttreatment step in the semiconductor manufacturing process.
  • Devices used in the semiconductor manufacturing process include, for example, semiconductor-related devices such as wire bonding devices, chip bonding devices, CVD, PVD, transfer devices (silicon wafers), IC testers, burn-in devices, dicing devices, grinder devices, and SMT devices.
  • Examples include LCD-related devices such as LCD board cutting devices and transfer devices (LCD boards).
  • One of the methods for manufacturing an electronic device of the present embodiment includes an electric component, a wiring section for transmitting high-voltage power to the electrical component, and a housing for accommodating the electrical component and the wiring section, and is an object of static elimination.
  • a method of manufacturing an electronic device to be used in the vicinity of, and a surface resistivity of 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less, the cover portion covering at least a portion of an electrical component, and the surface resistivity Includes an assembly step in which an electronic device is obtained by assembling components of the electronic device using at least one of the housings of 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less.
  • the method of manufacturing an electronic device of the present embodiment in at least one of the housing and the cover portion, insulating, or on the surface of the conductive resin layer, a surface resistivity of 10 4 ⁇ / ⁇ or more 10 11 Omega / ⁇
  • a film forming step of forming a film made of the following electrostatic diffusible paint may be included. As a result, the induced voltage generated in the static elimination target W at the time of static elimination can be reduced.
  • One method of assembling the static eliminator of this embodiment is formed in the cover portion and a nozzle portion and a guard portion, a surface resistivity on the surface 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less of static-dissipative layer
  • this assembly step may further include a step of removing the cover portion from the static elimination device.
  • each part can be replaced.
  • a method for forming the electrostatic diffusible layer the above-mentioned method can be adopted, but a method of applying using an electrostatic diffusible paint may also be used. As a result, workability and ease of maintenance can be improved.
  • Cover unit according to the present embodiment (the nozzle unit, the guard portion, looper unit, etc.), neutralization apparatus, specifically be those used in the ionizer, the surface resistivity at the surface of 10 4 ⁇ / ⁇ or more 10 11 Omega / ⁇ It is configured as follows.
  • This cover portion may have a laminated structure as described above.
  • the electrostatic diffusible material of the present embodiment since the surface resistivity of the electronic component / component of the electronic device can be appropriately controlled, it is possible to provide the electronic component / electronic device having excellent inductive charge resistance. Among these, it is possible to alleviate the dielectric charging phenomenon that occurs during static elimination using an ionizer. Therefore, the electrostatic diffusible material can be applied to electronic parts / devices and manufacturing / assembling processes thereof, which require an even higher level of induced voltage.
  • the surface resistivity exceeds 10 11 ⁇ / ⁇ , it is insulating, when it is 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less, it is electrostatically diffusible, and when it is less than 10 4 ⁇ / ⁇ , it is conductive. Defined as sex.
  • the electrostatic diffusible material may be a molding material for molding a constituent member of an electronic component / electronic device, or may be a paint or a film material for coating the surface of the constituent member of the electronic component / electronic device.
  • a molded product that is a part or the whole of a component can be molded by using a usual molding method such as injection molding, press molding, insert molding, and two-color molding. That is, the molded product may be composed of the electrostatic diffusible material alone, and has at least a laminated structure in which the electrostatic diffusible molded layer made of the electrostatic diffusible material is laminated on the surface above the insulating layer or the conductive layer. It may be configured as follows.
  • the paint can form an electrostatic diffusible coating film on the surface of the insulating member or the conductive member in the component by a method such as applying the paint on the surface of the component.
  • the film material can form an electrostatic diffusible film on the surface of the insulating member or the conductive member in the component by a method of chemically and / or physically adhering to the surface in the component.
  • the surface resistance of the electrostatic diffusible molded layer, the electrostatic diffusible coating film, the electrostatic diffusible film, etc. in the laminated structure is, for example, 10 4 to 10 11 ⁇ / ⁇ , preferably 10 4 to 10 10. Omega / ⁇ , more preferably such that 10 5 ⁇ 10 9 ⁇ / ⁇ , static dissipative material is formed.
  • the value of the surface resistivity of the electrostatic diffusible layer can be changed according to the resistance value of the insulating layer or the conductive layer as the underlying layer.
  • An ABS resin layer is used as an example of the insulating layer, and a SUS plate is used as an example of the conductive layer.
  • the surface resistivity of the electrostatic diffusible layer in the laminated structure can be within a desired range.
  • the electrostatic diffusible material contains a conductive component.
  • the conductive component include a conductive resin and the like.
  • the conductive resin a material containing a conductive additive as a material for imparting a function to the polymer material, or a conductive polymer in which the resin itself has conductivity can be used.
  • the resistance value of this conductive resin is preferably 10 4 to 10 10 ⁇ , more preferably 10 5 to 10 9 ⁇ .
  • the electrostatic diffusible material When used as a molding material, a paint, a film material, etc., the electrostatic diffusible material may further contain components normally used, if necessary.
  • the electrostatic diffusible molding material may contain a conductive component and a resin component such as a thermoplastic resin and / or a thermosetting resin.
  • a resin component such as a thermoplastic resin and / or a thermosetting resin.
  • An example of a method for producing a electrostatically diffusible molding material is obtained by mixing a conductive component in a resin component by using a method such as kneading.
  • the electrostatic diffusible paint may contain a conductive component and a binder component. Further, this paint can contain various additives and solvents in addition to the above-mentioned components.
  • the resistance value of the electrostatic diffusible paint after film formation is preferably 10 4 to 10 10 ⁇ , more preferably 10 5 to 10 9 ⁇ .
  • a binder resin can be used, and specifically, for example, urethane resin, polyester resin, (meth) acrylic resin, vinyl acetate resin, epoxy resin, fluororesin, phenol resin, silicone resin, amino.
  • urethane resin polyurethane resin
  • vinyl acetate resin polyvinyl acetate resin
  • epoxy resin polymethyl methacrylate resin
  • fluororesin phenol resin
  • silicone resin amino.
  • synthetic resins such as alkyd resins, other synthetic resins and natural resins. These may be used alone or in combination of two or more.
  • the binder component can bond the coating film and the base. Further, as the binder component, one having physical properties suitable for the usage environment may be selected, or one in which the additive can be dispersed may be selected.
  • the binder resin is a polymer conductive material having conductivity by itself. It is considered that the coating film using the polymer conductive material is composed of the conductive region relatively uniformly mixed in the insulating region from the micro viewpoint as compared with the coating film using the binder resin which is an insulator. Therefore, the adhesiveness can be improved, the variation in conductivity in the coating film can be suppressed, and a stable electrostatic diffusion layer can be formed. Further, by using the polymer conductive material, the content ratio of the additive can be adjusted to be low as needed.
  • additive one that controls the state of the paint or one that has a role of imparting characteristics after film formation can be used.
  • additives include conductive additives, silicone-based additives, silica powder, and the like, but the materials that can be added are not limited to these materials. These may be used alone or in combination of two or more.
  • the conductive additive can adjust the conductivity of the coating film.
  • the conductive additive include carbon-based, metal-based, metal oxide-based, metal oxide film-based powdery or fibrous materials, as well as ionic conductivity-imparting materials and antistatic agents. .. These may be used alone or in combination of a plurality, and the composition and materials thereof are not limited.
  • Silicone-based additives can improve leveling and wettability. Silica powder can impart thickening and matting.
  • solvent a solvent containing a component capable of dissolving or dispersing a binder component or an additive can be used.
  • the solvent water or ethanol is preferable from the viewpoint of environmental performance. Since many organic solvents have a relatively high dissolving ability of the binder component and a relatively wide selection range of the binder component, they may be used. Further, from the viewpoint of coating film performance, the type of organic solvent that can enhance the adhesiveness to the substrate may be selected.
  • the electrostatic diffusible paint may be configured so as to be substantially free of carbon black. As a result, the generation of particles can be suppressed, so that the electronic device of the present embodiment can be used in a clean room or a semiconductor manufacturing process.
  • the surface of the cover portion may be coated with carbon black with a coating film made of an electrostatic diffusible paint. By configuring the coating film in the vicinity of the discharge electrode where the corona discharge occurs so as not to contain carbon black, it is possible to further suppress the generation of particles and dust.
  • the coating film on the surface of the housing may be configured so as not to contain conductive particles such as carbon black. In the electrostatic diffusible paint which does not substantially contain conductive particles, it is possible to use a polymer conductive material as the conductive component.
  • the electrostatic diffusible paint may contain pigments and / or dyes, if necessary.
  • the region having electrostatic diffusivity can be colored, so that the visibility by the operator can be improved. Therefore, the handleability of the electronic device can be improved.
  • the coloring color for example, a color different from the color of the binder component such as an insulating binder resin can be adopted. Among these, black may be adopted because it has a relatively high common recognition that it has conductivity, but it is not limited to this.
  • an antistatic agent may be used as the electrostatic diffusible paint.
  • the antistatic agent By applying the antistatic agent to the surface of the component, the antistatic ability can be easily imparted and the surface resistivity on the surface can be appropriately controlled.
  • Antistatic agents generally have a weak adhesive force to the substrate and may be peeled off by a solvent such as rubbing or water, but they can be applied each time to provide antistatic performance, which facilitates maintenance. Further, when used in an environment where rubbing is unlikely to occur and is not in contact with a solvent, the antistatic agent can maintain antistatic performance for a relatively long period of time.
  • the method for applying the electrostatic diffusible paint is not limited as long as the coating film is formed, and can be selected from known methods according to the type and shape of the base material. Examples of this coating method include brush coating, dipping (immersion), spraying, gravure method and the like.
  • a cover portion that covers at least a part of the electric component is provided, and the surface resistivity of the cover portion is 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less, and the surface resistivity of the housing is 10 4.
  • An electronic device having at least one of the configurations of ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less. 2. 2. 1. 1. The electronic device described in At least one of the housing and the cover portion With an insulating or conductive layer, At least a portion formed on the surface resistivity has a 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less of static-dissipative layer, the electronic device of the surface of said layer. 3. 3. 2. 2.
  • the electronic apparatus When the surface resistivity of the housing is A and the surface resistivity of the cover portion is B, A and B satisfies the 10 3/10 12 ⁇ A / B ⁇ 1, the electronic apparatus. 8. 1. 1. ⁇ 7. The electronic device described in any one of the above. An electronic device in which the electrical component includes an electrode that generates a corona discharge or an electrode that generates a glow discharge. 9. 8. The electronic device described in Said cover portion, cover structure covers the periphery of the electrode, and / or has a cover structure for covering the front of the tip of the electrode, the surface resistivity in the cover structure 10 4 Omega / ⁇ or more 10 11 Omega / ⁇ or less, electronic device. 10. 9.
  • the electronic device described in It includes at least the first electrode, the second electrode, the first cover portion that covers the first electrode, and the second cover portion that covers the second electrode.
  • 11. 8. ⁇ 10. The electronic device described in any one of the above.
  • a cylindrical nozzle portion provided in the housing and configured to cover the periphery of the electrode, and a cylindrical nozzle portion. It is detachably attached to the cylindrical nozzle portion, and is provided with a guard portion configured to cover at least the tip of the electrode.
  • An electronic device in which the cover portion is composed of the cylindrical nozzle portion and the guard portion.
  • 12. 11 The electronic device described in An electronic device configured to electrically connect the housing and the cover portion. 13. 1. 1. ⁇ 12.
  • An electronic device in which the static elimination target is an electronic component / device and is used in the field in the manufacturing / assembling process of the static elimination target.
  • a method for manufacturing an electronic device including an electric component, a wiring unit for transmitting high-voltage power to the electric component, and a housing for accommodating the electric component and the wiring unit, and used in the vicinity of an object to be statically eliminated.
  • the surface resistivity is 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less, the cover portion that covers at least a part of the electric component, and the surface resistivity is 10 4 ⁇ / ⁇ or more and 10 11 ⁇ / ⁇ or less.
  • a method of manufacturing an electronic device comprising an assembly step, in which the electronic device is obtained by assembling components of the electronic device using at least one of the housings. 16. 15. The method for manufacturing an electronic device according to the above.
  • a film surface resistivity is from 10 4 ⁇ / ⁇ or more 10 11 ⁇ / ⁇ or less of static dissipative coating formed
  • the obtained electrostatic diffusible paint A was applied to a plate member made of ABS resin as an object using an air spray gun, and a coating film was formed on the surface thereof so that the thickness after drying was 10 ⁇ m.
  • the coating film was dried in an oven at 60 ° C. for 1 hour to obtain an electrostatic diffusible layer A.
  • the value measured using a CR probe or a 2P probe using a surface resistivity meter (adapted to ESD Association standards) defined in the IEC 61340 5-1, 5-2 standard is used.
  • the surface resistivity ( ⁇ / ⁇ ) was used.
  • the obtained electrostatic diffusible paint B was applied to a plate member made of ABS resin as an object using an air spray gun, and a coating film was formed on the surface thereof so that the thickness after drying was 10 ⁇ m.
  • the coating film was dried in an oven at 60 ° C. for 2 hours to obtain an electrostatic diffusible layer B.
  • the surface resistivity of the electrostatic diffusion layer B was measured in the same manner as the electrostatic diffusion layer A under an environment where the temperature was controlled to 22.5 ° C ⁇ 10% and the humidity was controlled to 50% RH ⁇ 5 ° C. The value of 0 ⁇ 10 6 ( ⁇ / ⁇ ) is shown.
  • FIG. 1 schematically shows a connection diagram of a measuring device in the measuring system 10.
  • FIG. 2 shows an equivalent circuit diagram showing the relationship between the capacitances of each part in the measurement system 10.
  • Such a measurement system 10 in FIG. 1 can measure the induced voltage caused by the ionizer 100 on the static elimination target W by static elimination.
  • the specific procedure (1) to (3) for measuring the induced voltage is as follows. (1) Preparation of the measurement system 10 shown in FIG. 1 ⁇ Using each of the 150 mm metal plates 22, 24, and 26, a three-stage structure was formed in an insulated state, and a capacitive voltage dividing type charging plate 20 was prepared. Each of the metal plates 24 and 26 of the capacitive voltage dividing type charging plate 20 was connected to the electrometer 40 (KEITHLEY, 6517A) via a triple coaxial cable 30 (237-ALG-2, TEKTRONIX). The analog OUT terminal of the electrometer 40 was connected to the monitor 50 (Oscilloscope TDS503B manufactured by TEKTRONIX) via a cable.
  • the monitor 50 Oscilloscope TDS503B manufactured by TEKTRONIX
  • the ionizer 100 was used as one of the static elimination devices having the high voltage power source E.
  • the ionizer 100 was placed at an upper portion separated from the metal plate 22 at the uppermost portion of the capacitive voltage dividing type charging plate 20 by a measurement distance D.
  • G represents grounding.
  • the capacitance in FIG. 2, which shows the equivalent circuit diagram of the measurement system 10 of FIG. 1, was measured using a capacitance meter.
  • FIG. 3 is a diagram for explaining a method of measuring an induced voltage.
  • the voltage source E, the same capacitive voltage dividing charging plate 20 as in (1) above, and the electrometer 40 were electrically connected to prepare the measurement system 12 shown in FIG. In FIG. 3, G represents grounding.
  • a DC voltage source E calibrated to E 0 (V) was connected to the metal plate 22, and the metal plate 24 was connected to the electrometer 40.
  • the capacitance between the metal plates 22 and 24 is C1
  • the capacitance between the metal plates 24 and 26 is C2
  • the output voltage measured by the electrometer 40 is V out .
  • FIG. 4 shows an outline of the structure of the ionizer 100 used in the measurement system 12 of FIG.
  • FIG. 4 is a cross-sectional view schematically showing the structure of the ionizer 100 used.
  • the ionizer (AC corona discharge method) used in Experimental Example 1 includes a high-voltage power supply 120 (AC high-voltage power supply, output voltage: 10 kV 0-p ) housed in an ABS resin housing 110 and 10 electrodes 130. (Tangs discharge needle, electrode length: 600 mm, pitch between electrodes: 250 mm,).
  • FIG. 5 shows an enlarged view of the ⁇ region of FIG.
  • the electrode 130 is arranged inside the cylinder of the ABS resin nozzle portion 150, and the ABS resin guard portion 160 (nozzle guard) is attached to the tip of the nozzle portion 150 as a cover portion.
  • Induced voltage V ei of Example 1 was 294V p-p.
  • the surface resistivity of the ABS resin housing 110, the nozzle portion 150, and the guard portion 160 was 10 16 ⁇ / ⁇ .
  • Example 2 The electrostatic diffusible paint A is applied to the entire surface of the surface 112 of the housing 110 in FIG. 4 and the surface 152 of the nozzle portion 150 in FIG. 5 using an air spray gun, and the thickness of the surface after drying is increased.
  • the induced voltage V ei was applied in the same manner as in Experimental Example 1 except that an ionizer having a coating film formed to be 10 ⁇ m and dried in an oven at 60 ° C. for 1 hour to form an electrostatic diffusible layer A was used. I asked.
  • the induced voltage V ei of Experimental Example 1 was 162 V pp .
  • Example 3 The electrostatic diffusible paint A is applied to the entire surface of the surface 112 of the housing 110 in FIG. 4 and the surface 152 of the nozzle portion 150 in FIG. 5 using an air spray gun, and the thickness of the surface after drying is increased.
  • a coating film was formed to a size of 10 ⁇ m and dried in an oven at 60 ° C. for 1 hour to form the electrostatic diffusible layer A.
  • the electrostatic diffusible paint was formed on the entire surface 162 of the guard portion 160 in FIG. B was applied using an air spray gun, a coating film was formed on the surface thereof so that the thickness after drying was 10 ⁇ m, and the mixture was dried in an oven at 60 ° C. for 2 hours to form an electrostatic diffusible layer B.
  • Example 4 The induced voltage V ei was obtained in the same manner as in Experimental Example 3 except that the measurement distance D was set to 300 mm.
  • the induced voltage V ei of Experimental Example 1 was 22 V pp .
  • the surface resistivity of the guard portion 160 is set to 10 4 ⁇ / ⁇ , 10 5 ⁇ / ⁇ , 10 7 ⁇ / ⁇ , 10 8 ⁇ / ⁇ , and 10 9 ⁇ / ⁇ .
  • the induced voltage generated in the static elimination target can be reduced by the electrostatic induction of the ionizer as compared with Experimental Example 1.
  • the electrostatic diffusion layer B is provided on the surface of the nozzle.
  • the electrostatic diffusible layer B is not formed on the nozzle surface. It was found that the ionizer having the electrostatic diffusible layer B can reduce the induced voltage generated in the static electricity elimination target by the electrostatic induction of the ionizer as compared with the one in which the electrostatic diffusible layer B is not formed on the surface of the nozzle.
  • an electrostatic diffusible layer B is formed on the surface of the front looper in a blower type ionizer including a built-in static eliminator electrode, an ABS resin front looper provided in front of the static eliminator electrode, and a fan provided behind the static eliminator electrode.
  • An example was prepared in which the electrostatic diffusible layer B was not formed on the surface of the front looper. It was found that the blower type ionizer having the electrostatic diffusible layer can reduce the induced voltage generated in the static elimination object by the electrostatic induction of the ionizer as compared with the one which does not form the electrostatic diffusible layer B on the surface of the front looper. ..
  • the static elimination device such as the ionizer of the embodiment alleviates the dielectric charge phenomenon that occurs during static elimination in electronic parts, electronic devices, etc. that are static elimination objects existing in the vicinity of the static elimination device during the manufacturing process or assembly process of the static elimination object. Is possible.
  • Measurement system 12 Measurement system 20 Capacitive voltage division charging plate 22, 24, 26 Metal plate 30 Triple coaxial cable 40 Electrometer 50 Monitor 100 Ionizer (static eliminator) 110 Housing 112 Surface 120 High voltage power supply 130 Electrode 132 Tip 134 Opening 140 Ion 150 Nozzle part 152 Surface 160 Guard part 162 Surface 170 Wiring part 180 Electrostatic diffusible layer 190 Hole part 200 Ionizer 210 Housing 220 High voltage power supply 230 Electrode 260 Nozzle member 270 Wiring part 300 Ionizer 310 Housing 312 Grip part 320 High voltage power supply 330 Electron 360 Nozzle part 370 Wiring part 400 Ionizer 410 Housing 412 Switch part 420 High voltage power supply 430 Electrode 460 Nozzle part 470 Wiring part 500 Ionizer 510 Housing 512 Tube part 520 High-voltage power supply 530 Electrode 560 Nozzle 570 Wiring part 600 Ionizer 610 Housing 620 High-voltage power supply 630 Electrode 632 Support part 660 Looper part 670 Wiring part 680 Fan part E Voltage source

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Elimination Of Static Electricity (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)

Abstract

Un dispositif électronique de la présente invention, qui est utilisé autour d'un objet devant être neutralisé, comprend : un composant électrique ; une partie de câblage qui transmet une puissance d'une alimentation électrique à haute tension au composant électrique ; et un boîtier qui reçoit le composant électrique et la partie de câblage, le dispositif électronique présentant au moins une partie parmi une partie de couvercle recouvrant au moins une partie du composant électrique et présentant une résistivité de surface de 104-1011 Ω/□ et le boîtier présentant une résistivité de surface de 104-1011 Ω/□.
PCT/JP2021/022887 2020-06-17 2021-06-16 Dispositif électronique et procédé de fabrication de dispositif électronique WO2021256513A1 (fr)

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KR1020227045191A KR20230024912A (ko) 2020-06-17 2021-06-16 전자 장치 및 전자 장치의 제조 방법
US18/010,629 US20230345608A1 (en) 2020-06-17 2021-06-16 Electronic device and manufacturing method of electronic device
CN202180042879.4A CN115836590A (zh) 2020-06-17 2021-06-16 电子装置以及电子装置的制造方法

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JP2020104857A JP7202575B2 (ja) 2020-06-17 2020-06-17 電子装置、及び電子装置の製造方法

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JPH06208898A (ja) * 1992-08-25 1994-07-26 Takasago Thermal Eng Co Ltd 帯電物品の中和装置
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JP2013054983A (ja) * 2011-09-06 2013-03-21 Panasonic Corp 放電電極とこれを用いた活性種発生ユニットおよび活性種発生装置
JP2018088189A (ja) * 2016-11-29 2018-06-07 パナソニックＩｐマネジメント株式会社 除電装置、認証システム、ｉｃカード、カードリーダ
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JPH06231897A (ja) * 1993-02-05 1994-08-19 Seiko Epson Corp 静電気の除去方法およびその装置
JP2007234437A (ja) * 2006-03-02 2007-09-13 Trinc:Kk プラズマ放電式除電器
JP6469988B2 (ja) * 2014-07-30 2019-02-13 三菱航空機株式会社 航空機のアンテナカバーおよび航空機
GB2585921A (en) * 2019-07-24 2021-01-27 Linx Printing Tech Continuous Ink Jet printer and print head assembly therefor

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JPH05226092A (ja) * 1992-02-07 1993-09-03 Matsushita Electric Ind Co Ltd 静電気拡散性樹脂複合物
JPH06208898A (ja) * 1992-08-25 1994-07-26 Takasago Thermal Eng Co Ltd 帯電物品の中和装置
JP2001203094A (ja) * 2000-01-17 2001-07-27 Sharp Corp イオナイザ
JP2005142131A (ja) * 2003-11-10 2005-06-02 Fuji Photo Film Co Ltd 除電器
JP2013054983A (ja) * 2011-09-06 2013-03-21 Panasonic Corp 放電電極とこれを用いた活性種発生ユニットおよび活性種発生装置
JP2018088189A (ja) * 2016-11-29 2018-06-07 パナソニックＩｐマネジメント株式会社 除電装置、認証システム、ｉｃカード、カードリーダ
JP2019075349A (ja) * 2017-10-19 2019-05-16 Smc株式会社 イオナイザ

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JP7202575B2 (ja) 2023-01-12
CN115836590A (zh) 2023-03-21
JP2021197318A (ja) 2021-12-27
TW202220319A (zh) 2022-05-16
JP2023030053A (ja) 2023-03-07
KR20230024912A (ko) 2023-02-21

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