WO2021255966A1 - Élément de conduction de chaleur - Google Patents

Élément de conduction de chaleur Download PDF

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Publication number
WO2021255966A1
WO2021255966A1 PCT/JP2020/047797 JP2020047797W WO2021255966A1 WO 2021255966 A1 WO2021255966 A1 WO 2021255966A1 JP 2020047797 W JP2020047797 W JP 2020047797W WO 2021255966 A1 WO2021255966 A1 WO 2021255966A1
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WIPO (PCT)
Prior art keywords
layer
metal plate
heat conductive
conductive member
bonding layer
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PCT/JP2020/047797
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English (en)
Japanese (ja)
Inventor
淳一 石田
雅昭 花野
Original Assignee
日本電産株式会社
超▲しゅう▼科技股▲ふん▼有限公司
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Application filed by 日本電産株式会社, 超▲しゅう▼科技股▲ふん▼有限公司 filed Critical 日本電産株式会社
Publication of WO2021255966A1 publication Critical patent/WO2021255966A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to heat conductive members.
  • a conventional flat heat pipe has a container in which a cavity is formed in the center by two opposing plates and a working fluid enclosed in the cavity, and a wick structure is formed in the cavity. It is considered to be a provided configuration.
  • the flat heat pipe at least one of the plate-shaped bodies is a composite member in which two or more kinds of metal members are laminated and integrated.
  • the outer peripheral portion of the cavity portion has a structure in which three or more layers of members are laminated and is sealed by laser welding (see, for example, Patent Document 1).
  • the exemplary heat conductive member of the present disclosure includes a housing having a space inside, a wick structure arranged in the space, and a working fluid accommodated in the space.
  • the housing has one or more metal plates and a joint that joins the metal plates together.
  • the joint portion includes a first layer and a second layer composed of a part of the metal plate, a joint layer arranged between the first layer and the second layer, and the first layer and the above. It has a first boundary portion with the bonding layer and a second boundary portion between the second layer and the bonding layer.
  • the first boundary portion has a first region composed of at least one first crystal grain existing across the first layer and the bonding layer.
  • the second boundary portion has a second region composed of at least one second crystal grain existing across the second layer and the bonding layer.
  • a heat conductive member having a joint portion for connecting metal plates can be manufactured easily and at low cost.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of a heat conductive member according to an embodiment of the present disclosure.
  • FIG. 2 is an enlarged cross-sectional view of the joint and its periphery.
  • FIG. 3 is a schematic view showing a part of the joint portion in an enlarged manner.
  • FIG. 4 is a plan view of the first boundary portion shown in FIG. 3 as viewed from the Z-axis direction.
  • FIG. 5 is a schematic diagram for explaining the state of the joint portion.
  • FIG. 6 is another schematic diagram for explaining the state of the joint.
  • FIG. 7 is a diagram for explaining a heat conductive member of a modified example.
  • the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate.
  • the Z-axis direction indicates a vertical direction (that is, a vertical direction)
  • the + Z direction is the upper side
  • the ⁇ Z direction is the lower side.
  • the X-axis direction refers to a direction orthogonal to the Z-axis direction, and one direction and the opposite direction thereof are the + X direction and the ⁇ X direction, respectively.
  • the Y-axis direction refers to a direction orthogonal to both the Z-axis direction and the X-axis direction, and one direction and the opposite direction thereof are the + Y direction and the ⁇ Y direction, respectively.
  • the X-axis direction and the Y-axis direction are parallel to the horizontal plane. However, these directions are names used only for explanation, and there is no intention of limiting the actual positional relationship and direction. It was
  • FIG. 1 is a cross-sectional view showing a schematic configuration of the heat conductive member 1 according to the embodiment of the present disclosure. Note that FIG. 1 shows a heating element H in addition to the heat conductive member 1 for ease of understanding.
  • the heat conductive member 1 is a vapor chamber.
  • the heating element H is, for example, an electronic component that emits heat, or a substrate on which the electronic component is mounted.
  • the heating element H includes, for example, a CPU and the like.
  • the heating element H is cooled by the heat transfer by the heat conductive member 1.
  • the heat conductive member 1 is mounted on an electronic device having a heating element H, such as a smartphone or a notebook personal computer. It was
  • the heat conductive member 1 has a heated portion 101 and a heat radiating portion 102.
  • the heated portion 101 is arranged in contact with the heating element H, for example, and is heated by the heat generated by the heating element H. That is, the heated portion 101 is a portion to which the heat dissipated from the heating element H is transferred.
  • the heat radiating unit 102 releases the heat of the hydraulic fluid 4, which will be described later, heated by the heated unit 101 to the outside. It was
  • the heat conductive member 1 has a housing 2, a wick structure 3, and a working fluid 4. It was
  • the housing 2 has a space 2a inside.
  • Space 2a is, in detail, a closed space. It is preferable that the space 2a is maintained in a decompressed state in which the atmospheric pressure is lower than the atmospheric pressure.
  • the thickness of the housing 2 in the Z-axis direction is preferably 100 ⁇ m or more and 1000 ⁇ m or less, for example.
  • the housing 2 has a rectangular parallelepiped shape. However, the housing 2 may have another shape such as a columnar shape. A part of the housing 2 is included in the heated portion 101. The other part of the housing 2 is included in the heat dissipation unit 102. It was
  • the housing 2 has one or more metal plates 20 and a joint portion 21 for connecting the metal plates 20.
  • the metal plate 20 is a plate-shaped member containing metal as a main component.
  • the metal plate 20 is made of, for example, copper, iron, aluminum, zinc, silver, gold, magnesium, manganese, titanium, an alloy containing these metals, or the like.
  • the joint portion 21 included in the housing 2 refers to a joint structure in which a part of one metal plate 20 and another part, or a plurality of metal plates 20 are connected to each other. The details of the joint portion 21 will be described later. It was
  • the metal plate 20 is composed of a first metal plate 201 and a second metal plate 202. That is, the housing 2 has two metal plates 20 of a first metal plate 201 and a second metal plate 202.
  • the joint portion 21 connects the first metal plate 201 and the second metal plate 202 together.
  • the second metal plate 202 is arranged so as to face the first metal plate 201.
  • the first metal plate 201 and the second metal plate 202 are arranged so as to face each other in the Z-axis direction. It was
  • the housing 2 may have only one metal plate 20.
  • one metal plate 20 may be bent and the ends of the one metal plate 20 may be joined to form a joint portion 21. It was
  • the first metal plate 201 supports the wick structure 3 from the ⁇ Z direction side.
  • the first metal plate 201 is preferably made of copper or stainless steel.
  • the first metal plate 201 has a concave shape recessed in the ⁇ Z direction.
  • the first metal plate 201 has a rectangular shape in a plan view from the Z-axis direction, and its recess is also rectangular.
  • the first metal plate 201 may be a flat plate.
  • the first metal plate 201 and its recess may have a shape other than a rectangular shape. It was
  • the second metal plate 202 is arranged on the + Z direction side with respect to the first metal plate 201 and covers the wick structure 3 on the first metal plate 201.
  • the second metal plate 202 is preferably made of the same metal material as the first metal plate 201. That is, when the first metal plate 201 is made of copper, it is preferable that the second metal plate 202 is also made of copper. When the first metal plate 201 is made of stainless steel, it is preferable that the second metal plate 202 is also made of stainless steel. It was
  • the second metal plate 202 has a concave shape recessed in the + Z direction.
  • the second metal plate 202 has a rectangular shape in a plan view from the Z-axis direction, and its recess is also rectangular.
  • the second metal plate 202 and its recesses may have a shape other than a rectangular shape.
  • the second metal plate 202 has a plurality of ribs 202a.
  • the rib 202a extends in the ⁇ Z direction from the surface of the second metal plate 202 on the ⁇ Z direction side and comes into contact with the wick structure 3.
  • the rib 202a may be, for example, a columnar column, a prismatic column, or the like.
  • the ribs 202a are regularly arranged side by side in the XY plane, for example. When the rib 202a comes into contact with the wick structure 3 in the Z-axis direction, the thickness of the housing 2 is kept constant.
  • the second metal plate 202 and the rib 202a may be a single member or may be a separate member. Further, the rib 202a is not essential and may not be provided. It was
  • the wick structure 3 is arranged in the space 2a. As described above, in this embodiment, the wick structure 3 is supported by the first metal plate 201.
  • the wick structure 3 may be a member having a capillary structure.
  • the capillary structure refers to a structure in which the hydraulic fluid 4 can be moved by the capillary pressure. Examples of the capillary structure include a porous structure, a fiber structure, a groove structure, and a mesh structure.
  • the thickness of the wick structure 3 in the Z-axis direction may be, for example, 5 ⁇ m or more and 200 ⁇ m or less. In a plan view from the Z-axis direction, the wick structure 3 preferably has an area comparable to that of the space 2a. It was
  • Examples of the wick structure 3 include wires, meshes, and porous bodies.
  • the porous body is, for example, a sintered body.
  • the wick structure 3 is made of, for example, copper, aluminum, nickel, iron, titanium, alloys thereof, carbon fibers, ceramics and the like.
  • the wick structure 3 is preferably made of copper, for example.
  • the wick structure 3 may be provided on the first metal plate 201 itself, for example.
  • the wick structure 3 may be, for example, a groove or an uneven structure formed on the surface of the first metal plate 201 on the + Z direction side. It was
  • the hydraulic fluid 4 is housed in the space 2a. Specifically, the hydraulic fluid 4 is sealed in the space 2a. When the space 2a is in a decompressed state, the working liquid 4 enclosed in the space 2a is likely to evaporate.
  • the working liquid 4 may be any liquid that evaporates and condenses in the usage environment of the heat conductive member 1.
  • the working fluid 4 may be, for example, water, alcohol, ethylene glycol, or the like.
  • the hydraulic fluid 4 is preferably water. It was
  • the heated portion 101 is heated by the heat generated by the heating element H.
  • the working liquid 4 housed in the space 2a inside the housing 2 evaporates.
  • the heated portion 101 is cooled by absorbing the latent heat of vaporization.
  • the vapor generated by the evaporation of the working liquid 4 moves in the space 2a toward the heat radiating portion 102 side.
  • steam is condensed by heat radiating.
  • the heat radiating unit 102 is heated by releasing the latent heat of vaporization. It is preferable that the heat radiating unit 102 is provided with heat radiating fins in order to improve the heat radiating efficiency.
  • the condensed working liquid 4 moves in the wick structure 3 toward the heated portion 101 due to the capillary phenomenon.
  • the flow of vapor generated by evaporation of the hydraulic fluid 4 is indicated by a black arrow
  • the flow of the condensed hydraulic fluid 4 is indicated by a white arrow.
  • the hydraulic fluid 4 moves while changing its state, so that heat is continuously transported from the heated portion 101 side to the heat radiating portion 102 side. It was
  • FIG. 2 is an enlarged cross-sectional view showing the joint portion 21 and its surroundings.
  • a joining member 22 is used for joining the metal plate 20. That is, the joint portion 21 is configured by using the joint member 22.
  • the joining member 22 is arranged between the first metal plate 201 and the second metal plate 202 in the Z-axis direction, and the first metal plate 201 and the second metal plate 202 are connected to each other via the joining member 22. It is joined.
  • FIG. 3 is a schematic view showing a part of the joint portion 21 in an enlarged manner.
  • FIG. 3 is a schematic view showing an enlarged portion of the portion surrounded by the broken line in FIG.
  • the joining portion 21 has a first layer 21a and a second layer 21b, a joining layer 21c, a first boundary portion 21d, and a second boundary portion 21e. It was
  • the first layer 21a and the second layer 21b are composed of a part of the metal plate 20.
  • the first layer 21a is a part of the first metal plate 201.
  • the second layer 21b is a part of the second metal plate 202.
  • the first layer 21a is located at the outer edge portion of the first metal plate 201 on the + Z direction side.
  • the first layer 21a is a rectangular ring in a plan view from the Z-axis direction.
  • the second layer 21b is located at the outer edge portion of the second metal plate 202 on the ⁇ Z direction side.
  • the second layer 21b is a rectangular ring in a plan view from the Z-axis direction.
  • the first layer 21a and the second layer 21b are arranged so as to face each other in the Z-axis direction. It was
  • the wick structure 3 and the hydraulic fluid 4 are arranged inside. It is possible to facilitate the manufacture of the housing 2 to be manufactured. That is, the production of the heat conductive member 1 can be simplified. It was
  • the metal plate 20 having the first layer 21a and the second layer 21b is more preferably made of stainless steel.
  • the heat conductive member 1 can be made lighter than the case where the metal plate 20 is made of copper.
  • strength can be ensured even when the housing 2 is made thinner than, for example, when the metal plate 20 is made of copper. It was
  • the bonding layer 21c is arranged between the first layer 21a and the second layer 21b. Specifically, the bonding layer 21c is arranged between the first layer 21a and the second layer 21b facing each other in the Z-axis direction. In the present embodiment, the bonding layer 21c is a rectangular ring in a plan view from the Z-axis direction.
  • the joining layer 21c is composed of the above-mentioned joining member 22.
  • the bonding layer 21c may be a single layer or may be a structure in which a plurality of layers are laminated. In the case of a configuration in which a plurality of layers are laminated, each layer is joined. It was
  • the bonding layer 21c is preferably a metal layer.
  • the bonding layer 21c is composed of, for example, copper, iron, aluminum, zinc, silver, gold, magnesium, manganese, titanium, or an alloy containing these metals.
  • the first layer 21a, the second layer 21b, and the bonding layer 21c may be made of the same material. With such a configuration, the difference between the bonding state between the first layer 21a and the bonding layer 21c and the bonding state between the second layer 21b and the bonding layer 21c can be reduced by the bonding process under the same conditions. .. That is, it is possible to avoid the joining process from becoming complicated, and it is possible to improve the efficiency of the joining process. It was
  • the bonding layer 21c may have a structure having higher elasticity than the first layer 21a and the second layer 21b. With such a configuration, it is possible to absorb variations in the thickness in the Z-axis direction in the bonding layer 21c when the metal plates 20 are bonded.
  • the first layer 21a and the second layer 21b may be made of the same material or may be made of different materials. It was
  • the first boundary portion 21d is a boundary portion between the first layer 21a and the bonding layer 21c.
  • the first boundary portion 21d has a first region A1 composed of first crystal grain CP1 existing across the first layer 21a and the bonding layer 21c.
  • the first crystal grain CP1 is produced by reconstructing the crystal structure between the first layer 21a and the bonding layer 21c. Specifically, the first crystal grain CP1 is produced by reconstructing the metal structure.
  • the interface between the first layer 21a and the bonding layer 21c disappears, and both layers are unified. That is, by forming the first region A1, the first layer 21a and the bonding layer 21c can be bonded. It was
  • the second boundary portion 21e is a boundary portion between the second layer 21b and the bonding layer 21c.
  • the second boundary portion 21e has a second region A2 composed of second crystal grains CP2 existing across the second layer 21b and the bonding layer 21c.
  • the second crystal grain CP2 is produced by reconstructing the crystal structure between the second layer 21b and the bonding layer 21c. Specifically, the second crystal grain CP2 is produced by reconstructing the metal structure.
  • the interface between the second layer 21b and the bonding layer 21c disappears, and both layers are unified. That is, by forming the second region A2, the second layer 21b and the bonding layer 21c can be bonded. It was
  • the metal plates 20 can be joined by the joint portion 21.
  • the bonding between the first layer 21a and the bonding layer 21c and the bonding between the second layer 21b and the bonding layer 21c are formed by performing a heat-pressurizing treatment with the bonding member 22 sandwiched between the metal plates 20. can. That is, according to the configuration of the present embodiment, the metal plates 20 can be joined by a method different from the laser joining, and the metal plates 20 can be joined easily and at low cost.
  • the heat-pressurizing treatment refers to a treatment in which the pressurizing treatment is performed while heating. It was
  • the joining member 22 is different from the brazing material.
  • the member arranged between the first metal plate 201 and the second metal plate 202 is a brazing material, the above-mentioned crystal grains CP1 and CP2 generated by the reconstruction of the crystal structure do not occur.
  • the brazing material since the brazing material is liquefied during the joining process, it is necessary to devise a method to prevent the brazing material from leaking out.
  • at least one of the first metal plate 201 and the second metal plate 202 is provided with a groove for accommodating the brazing material.
  • the joining member 22 since the joining member 22 does not liquefy during the joining process, the formation of such a groove is not always necessary. That is, according to the configuration of the present embodiment, the metal plates 20 can be connected easily and at low cost. It was
  • the first boundary portion 21d further has a third region A3 formed by the interface S1 between the first layer 21a and the bonding layer 21c.
  • the crystal structures of the first layer 21a and the bonding layer 21c are displaced from each other. That is, in the third region A3, the metallographic structure has not been reconstructed between the first layer 21a and the bonding layer 21c, and the first layer 21a and the bonding layer 21c have not been unified.
  • the first layer 21a and the bonding layer 21c are not completely separated and are bonded with a weak bond.
  • the fluid is the working liquid 4 and the vapor of the working liquid 4.
  • the term fluid may be used with the same meaning below. It was
  • the second boundary portion 21e further has a fourth region A4 formed by the interface S2 between the second layer 21b and the bonding layer 21c.
  • the crystal structures of the second layer 21b and the bonding layer 21c are displaced from each other. That is, in the fourth region A4, the metallographic structure has not been reconstructed between the second layer 21b and the bonding layer 21c, and the second layer 21b and the bonding layer 21c have not been unified.
  • the fourth region A4 it is preferable that the second layer 21b and the bonding layer 21c are not completely separated and are bonded with a weak bond. As a result, it is possible to prevent the fluid from leaking to the outside of the housing 2 through the second boundary portion 21e even though the fourth region A4 exists. It was
  • the joint portion 21 of the present embodiment is either a condition in which the first layer 21a and the joint layer 21c are totally indistinguishable from each other, or a condition in which the second layer 21b and the joint layer 21c are totally indistinguishable. It can be formed by heat and pressure treatment under looser conditions than in the case of. Therefore, according to the configuration of the present embodiment, the metal plates 20 can be connected easily and at low cost. It was
  • the condition that the first layer 21a and the bonding layer 21c are totally indistinguishable is a condition that the first layer 21a and the bonding layer 21c are so-called diffusion bonded.
  • the condition that the second layer 21b and the bonding layer 21c are totally indistinguishable is a condition in which the second layer 21b and the bonding layer 21c are so-called diffusion bonded. It was
  • the set values set in the heat and pressurization treatment include temperature, pressure, and treatment time.
  • the joint portion 21 is a joint different from the diffusion joint by adjusting these set values to appropriate values. It was
  • the first boundary portion 21d When a 1 mm range of the first boundary portion 21d was observed in cross section at 10 locations randomly selected from the joint portion 21, all the first boundary portions 21d were found in the first region A1 as shown in FIG. And the third region A3 are preferably present alternately. Further, when a cross-sectional observation of a 1 mm range of the second boundary portion 21e was performed at 10 locations randomly selected from the joint portion 21, all the second boundary portions 21e were found to be the second boundary portion 21e as shown in FIG. It is preferable that the regions A2 and the fourth region A4 are present alternately. By coexisting the first region A1 and the third region A3, and the second region A2 and the fourth region A4 at the micro level in this way, the airtightness of the housing 2 can be improved. It was
  • FIG. 4 is a plan view of the first boundary portion 21d shown in FIG. 3 as viewed from the Z-axis direction. As shown in FIG. 4, in the first boundary portion 21d, it is preferable that a plurality of first regions A1 existing as discontinuous phases are irregularly scattered in the third region A3 existing as continuous phases. .. With such a configuration, the airtightness of the housing 2 can be further improved. This will be described below. It was
  • the first layer 21a and the bonding layer 21c are unified. Therefore, the fluid cannot pass through the first region A1.
  • the first layer 21a and the bonding layer 21c are connected by a weak bond, but are not in a unified state. For this reason, the fluid may pass through the third region A3. It was
  • F is a fluid
  • the arrow indicates the moving direction of the fluid F.
  • the fluid F reaches the outside from the space 2a inside the housing 2 in the shortest distance when traveling straight in the ⁇ X direction.
  • the fluid F tries to go straight in the ⁇ X direction as much as possible.
  • the fluid F cannot go straight through the first region A1 scattered in the first boundary portion 21d, the fluid F moves in the third region A3 while avoiding the first region A1.
  • the fluid F moves on the first boundary portion 21d while bending, and is forced to move a long distance as if it were moving in the maze. Thereby, the possibility that the fluid F reaches from the inside to the outside of the housing 2 can be reduced. It was
  • the airtightness of the housing 2 can be further improved as in the case of the first boundary portion 21d. It was
  • At least one first crystal grain CP1 may be configured to be separated from the second crystal grain CP2.
  • at least one first crystal grain CP1 may be configured as a particle different from the second crystal grain CP2.
  • the joint portion 21 can be formed by heat and pressure treatment under loose conditions, and for example, the manufacturing time can be shortened.
  • all the first crystal grains CP1 in the figure are separated from the second crystal grain CP2.
  • All the first crystal grains CP1 existing in the joint portion 21 may be configured to be separated from the second crystal grain CP2. It was
  • At least one first crystal grain CP1 may be configured to be connected to the second crystal grain CP2.
  • at least one first crystal grain CP1 may constitute a single particle with the second crystal grain CP2.
  • FIG. 5 is a schematic diagram for explaining the state of the joint portion 21.
  • FIG. 5 is a cross-sectional view showing a state different from the state shown in FIG. In FIG. 5, all the first crystal grains CP1 in the figure are connected to the second crystal grain CP2. All the first crystal grains CP1 existing in the joint portion 21 may be connected to the second crystal grain CP2. It was
  • FIG. 6 is another schematic diagram for explaining the state of the joint portion 21.
  • FIG. 6 is a cross-sectional view showing a state different from the state shown in FIGS. 3 and 5.
  • a part of the first crystal grain CP1 in the figure is connected to the second crystal grain CP2, and the remaining part of the first crystal grain CP1 is separated from the second crystal grain CP2.
  • a part of the first crystal grain CP1 may be connected to the second crystal grain CP2, and the remaining part of the first crystal grain CP1 may be separated from the second crystal grain CP2. .
  • the method for manufacturing the heat conductive member 1 includes, for example, an arrangement step, a joining step, and an injection step.
  • the method for manufacturing the heat conductive member 1 proceeds in the order of, for example, an arrangement step, a joining step, and an injection step.
  • the first metal plate 201 supporting the wick structure 3 is prepared.
  • the second metal plate 202 is arranged to face the first metal plate 201 so as to cover the wick structure 3.
  • the joining member 22 is arranged between the opposite directions of the first metal plate 201 and the second metal plate 202.
  • a temporary housing in which the wick structure 3 is arranged is formed in the internal space 2a.
  • the temporary housing is different from the housing 2 provided in the heat conductive member 1 according to the present embodiment in that it does not have the joint portion 21. It was
  • the joining portion 21 is formed by heat-pressing the first metal plate 201 and the second metal plate 202 forming the temporary housing and the joining member 22.
  • the temperature, pressure, and treatment time set during the heat-pressurization treatment are set under the conditions under which the above-mentioned first region A1, second region A2, third region A3, and fourth region A4 are formed. Will be done.
  • the set value can be determined, for example, by an experiment.
  • an injection port for injecting the working liquid 4 is left at at least one place in the temporary housing. It was
  • the working liquid 4 such as water is injected into the space 2a from the injection port left in the joining step.
  • the injection port is closed by welding, for example.
  • the heat conductive member 1 is completed.
  • the method of closing the injection port may be other than welding, and for example, the joint portion 21 may be formed at the position of the injection port by heat and pressure treatment. Further, when closing the injection port, it is preferable that a part of the air in the space 2a is expelled to the outside by heating so that the space 2a of the housing 2 is in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure. It was
  • FIG. 7 is a diagram for explaining the heat conductive member 1A of the modified example.
  • FIG. 7 shows a part of a cross-sectional view of the heat conductive member 1A.
  • a contact portion 23 in which the metal plates 20 are in contact with each other is provided on at least one side of the space 2a side and the opposite side of the space 2a side with respect to the joint portion 21.
  • the outer side of the housing 2 corresponds to the opposite side of the space 2a side.
  • the space 2a side with respect to the joint portion 21 is inward when viewed from the joint portion 21, and the opposite side of the space 2a side with respect to the joint portion 21 is outward when viewed from the joint portion 21.
  • a contact portion 23 in which the first metal plate 201 and the second metal plate 202 come into contact with each other is provided on the opposite side of the space 2a side with respect to the joint portion 21.
  • the first metal plate 201 and the second metal plate 202 may or may not be joined. It was
  • the joining member 22 is sandwiched between the first metal plate 201 and the second metal plate 202.
  • a protrusion 202b protruding from the second boundary portion 21e in the ⁇ Z direction is provided on the outer edge of the second metal plate 202 to form the contact portion 23.
  • the joining member 22 is preferably a member having higher elasticity than the first metal plate 201 and the second metal plate 202. Further, the rib 202a described above may not be provided. It was
  • the contact portion 23 is provided with, for example, a protrusion on the outer edge of the first metal plate 201 that protrudes in the + Z direction from the first boundary portion 21d. May be formed. Further, the contact portion 23 may be formed by providing protrusions on the outer edges of the first metal plate 201 and the second metal plate 202, for example. It was
  • the heat conductive member of the present disclosure can be used, for example, as a member for heat dissipation of a substrate or an electronic component mounted on an electronic device.

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Cet élément de conduction de chaleur présente : un boîtier présentant un espace interne; une structure de mèche disposée dans l'espace; et un fluide hydraulique reçu dans l'espace. Le boîtier présente : une ou plusieurs feuilles métalliques; et une partie joint destinée à joindre les feuilles métalliques. La partie joint comprend : une première couche et une seconde couche qui sont composées de parties des feuilles métalliques; une couche de joint disposée entre la première couche et la seconde couche; une première section de limite entre la première couche et la couche de joint; et une seconde section de limite entre la seconde couche et la couche de joint. La première section de limite présente une première région composée d'au moins un premier grain cristallin s'étendant de la première couche à la partie joint. La seconde section de limite présente une seconde région composée d'au moins un second grain cristallin s'étendant de la seconde couche à la partie joint.
PCT/JP2020/047797 2020-06-15 2020-12-22 Élément de conduction de chaleur WO2021255966A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897485A (ja) * 1981-12-04 1983-06-09 Hitachi Ltd 金属の接合方法
WO2014184890A1 (fr) * 2013-05-15 2014-11-20 日新製鋼株式会社 Procédé permettant de produire un produit soudé par diffusion en acier inoxydable
JP2016188734A (ja) * 2015-03-30 2016-11-04 株式会社フジクラ ベーパーチャンバー
JP2017003160A (ja) * 2015-06-08 2017-01-05 株式会社フジクラ 薄板ヒートパイプ型熱拡散板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897485A (ja) * 1981-12-04 1983-06-09 Hitachi Ltd 金属の接合方法
WO2014184890A1 (fr) * 2013-05-15 2014-11-20 日新製鋼株式会社 Procédé permettant de produire un produit soudé par diffusion en acier inoxydable
JP2016188734A (ja) * 2015-03-30 2016-11-04 株式会社フジクラ ベーパーチャンバー
JP2017003160A (ja) * 2015-06-08 2017-01-05 株式会社フジクラ 薄板ヒートパイプ型熱拡散板

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